US20220069202A1 - Apparatus and methods for magnetic memory devices with magnetic assist layer - Google Patents
Apparatus and methods for magnetic memory devices with magnetic assist layer Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
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- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
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- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
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- G—PHYSICS
- G11—INFORMATION STORAGE
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- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
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- G—PHYSICS
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- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/18—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using Hall-effect devices
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- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
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- H10N50/00—Galvanomagnetic devices
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
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- H10N52/00—Hall-effect devices
Definitions
- Semiconductor memory is widely used in various electronic devices such as mobile computing devices, mobile phones, solid-state drives, digital cameras, personal digital assistants, medical electronics, servers, and non-mobile computing devices.
- Semiconductor memory may include non-volatile memory or volatile memory.
- a non-volatile memory device allows information to be stored or retained even when the non-volatile memory device is not connected to a source of power (e.g., a battery).
- non-volatile memory examples include, but are not limited to, magnetoresistive memory (e.g., MRAM), phase change memory (e.g., PCM) ferroelectric field effect transistor (FeFET) memory, ferroelectric memory (e.g., FeRAM), and flash memory (e.g., NAND-type and NOR-type flash memory).
- MRAM magnetoresistive memory
- PCM phase change memory
- FeFET ferroelectric field effect transistor
- FeRAM ferroelectric memory
- flash memory e.g., NAND-type and NOR-type flash memory
- FIG. 1A depicts an example MRAM non-volatile memory cell.
- FIG. 1B depicts another example MRAM non-volatile memory cell.
- FIG. 2 depicts still another example MRAM non-volatile memory cell.
- FIG. 3A illustrates a technique for programming the MRAM non-volatile memory cell of FIG. 2 .
- FIG. 3B illustrates another technique for programming the MRAM non-volatile memory cell of FIG. 2 .
- FIG. 4 depicts yet another example MRAM non-volatile memory cell.
- FIG. 5A depicts an embodiment of a memory system and a host.
- FIG. 5B depicts an embodiment of memory core control circuits.
- FIG. 5C depicts further details of one embodiment of voltage generators.
- a three-terminal MRAM non-volatile memory cell that includes a spin Hall effect layer, a magnetic assist layer, and a magnetic tunnel junction that includes a free layer in a plane.
- the free layer includes a switchable magnetization direction perpendicular to the plane.
- the magnetic assist layer is coupled to the magnetic tunnel junction, and includes a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane.
- the MRAM non-volatile memory cell is programmed by applying a first voltage pulse across the spin Hall effect layer to generate a spin orbit torque to cause the magnetization direction of the magnetic assist layer to oscillate, and a second voltage pulse across the magnetic tunnel junction and the magnetic assist layer to generate a spin transfer torque to cause the magnetization direction of the free layer to deterministically switch.
- FIG. 1A is a simplified cross-sectional view of an MRAM non-volatile memory cell 100 a .
- MRAM non-volatile memory cell 100 a is a two-terminal device that includes a magnetic tunnel junction (MTJ) 102 , a non-magnetic spacer layer 104 disposed above MTJ 102 , and a magnetic assist layer 106 a disposed above non-magnetic spacer layer 104 .
- Non-magnetic spacer layer 104 may be magnesium oxide (MgO), copper (Cu) or other non-magnetic material.
- Magnetic assist layer 106 a has an in-plane magnetization direction that is fixed.
- MTJ 102 includes a reference (or pinned) layer (PL) 108 , a free layer (FL) 110 , and a tunnel barrier (TB) 112 positioned between pinned layer 108 and free layer 110 .
- Tunnel barrier 112 is an insulating layer, such as magnesium oxide (MgO) or other insulating material.
- Pinned layer 108 is a ferromagnetic layer with a fixed magnetization direction.
- Free layer 110 is a ferromagnetic layer and has a magnetization direction that can be switched.
- MRAM non-volatile memory cell 100 a has a first terminal T A coupled to magnetic assist layer 106 a , and a second terminal T B coupled to pinned layer 108 .
- Pinned layer 108 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as a single layer 108 with fixed magnetization direction.
- Pinned layer 108 and free layer 110 each have a magnetization direction perpendicular to the film plane (e.g., the x-y plane in FIG. 1A ), rather than in-plane. Such a magnetization direction will be referred to herein as a “perpendicular magnetization direction.”
- Magnetic assist layer 106 a has a magnetization direction that is perpendicular to the magnetization direction of pinned layer 108 and free layer 110 .
- the resistance of MRAM non-volatile memory cell 100 a is relatively low.
- the resistance of MRAM non-volatile memory cell 100 a is relatively high.
- MRAM non-volatile memory cell 100 a may therefore be used to store one bit of data.
- MRAM non-volatile memory cell 100 a may be programmed to either a low resistance ON state or a high resistance OFF state.
- the low resistance ON state may be used to represent a first value (e.g., “1”)
- the high resistance OFF state may be used to represent a second value (e.g., “0”).
- the data (“0” or “1”) in MRAM non-volatile memory cell 100 a may be read by measuring the resistance of MRAM non-volatile memory cell 100 a.
- the spin of an electron is an intrinsic angular momentum.
- the spins of many electrons can act together to affect the magnetic and electronic properties of a material, for example endowing it with a permanent magnetic moment as in a ferromagnet.
- electron spins are equally present in both up and down directions.
- various techniques can be used to generate a spin-polarized population of electrons, resulting in an excess of spin up or spin down electrons, to change the properties of a material. This spin-polarized population of electrons moving in a common direction through a common material is referred to as a spin current.
- STT Spin transfer torque switching may be used to change the magnetization direction of free layer 110 of MRAM non-volatile memory cell 100 ab .
- a write current is conducted from first terminal T A to second terminal T B of MRAM non-volatile memory cell 100 a , electrons in the write current become spin-polarized as they pass through magnetic assist layer 106 a .
- magnetic assist layer 106 a polarizes the electrons with a spin orientation corresponding to the magnetization direction of magnetic assist layer 106 a , and thus produces a spin-polarized current.
- the spin polarized electrons pass through non-magnetic spacer layer 104 and impart a spin transfer torque on the magnetization of free layer 110 , which helps initiate switching the magnetization direction of free layer 110 .
- the spin transfer torque helps to initiate precession of the magnetization direction of free layer 110 . That is, the magnetization direction of free layer 110 turns on itself in a continuous manner with sustained oscillations until the magnetization direction of free layer 110 switches by 180°.
- the spin polarized electrons from magnetic assist layer 106 a provide the initial spin transfer torque on the magnetization of free layer 110 to start the precession.
- the spin transfer torque provided by the spin polarized electrons from magnetic assist layer 106 a is in the opposite direction as the inherent damping of free layer 110 , and helps overcome the inherent damping of free layer 110 .
- the spin transfer torque provided by the spin polarized electrons from magnetic assist layer 106 a is in the same direction as the inherent damping of free layer 110 , and thus impairs the precession of the magnetization direction of free layer 110 .
- the spin polarized electrons from magnetic assist layer 106 a (which has a fixed magnetization direction) can only provide a spin transfer torque in the same fixed direction.
- half the time the spin transfer torque provided by the spin polarized electrons from magnetic assist layer 106 a is helping to switch the magnetization direction of free layer 110
- the other half of the time the spin transfer torque is hurting free layer 110 precession, which is a significant limitation.
- FIG. 1B is a simplified cross-sectional view of an MRAM non-volatile memory cell 100 b .
- MRAM non-volatile memory cell 100 b is a two-terminal device that includes MTJ 102 , non-magnetic spacer layer 104 disposed above MTJ 102 , and a magnetic assist layer 106 b disposed above non-magnetic spacer layer 104 .
- MRAM non-volatile memory cell 100 b is similar to MRAM non-volatile memory cell 100 a of FIG. 1A , except that magnetic assist layer 106 b has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane.
- MRAM non-volatile memory cell 100 b has a first terminal T A coupled to magnetic assist layer 106 b , and a second terminal T B coupled to pinned layer 108 .
- Spin transfer torque switching may be used to change the magnetization direction of free layer 110 of MRAM non-volatile memory cell 100 b .
- a write current is conducted from first terminal T A to second terminal T B of MRAM non-volatile memory cell 100 b , electrons in the write current become spin-polarized as they pass through magnetic assist layer 106 b .
- the spin polarized electrons pass through non-magnetic spacer layer 104 and impart a spin transfer torque on the magnetization of free layer 110 , which helps initiate precession of the magnetization direction of free layer 110 .
- Magnetic assist layer 106 b and free layer 110 are magnetically coupled.
- free layer 110 imparts a torque on the magnetization direction of magnetic assist layer 106 b .
- this torque initiates precession of the magnetization direction of magnetic assist layer 106 b , which follows the precessional rotation of the magnetization direction of free layer 110 .
- the precession of the magnetization direction of magnetic assist layer 106 b is “passive,” in the sense that precession of the magnetization direction of free layer 110 triggers the precession of the magnetization direction of magnetic assist layer 106 b.
- the rotating magnetization direction of magnetic assist layer 106 b imparts a rotating spin transfer torque on the magnetization of free layer 110 to help switch the magnetization direction of free layer 110 .
- the rotating spin transfer torque helps to overcome the inherent damping of free layer 110 throughout the entire precession cycle.
- the spin transfer torque from magnetic assist layer 106 b helps to enhance the torque on the magnetization of free layer 110 . Nevertheless, the magnetization direction of magnetic assist layer 106 b remains largely in-plane. As a result, in the later stage of free layer 110 switching, the spin transfer torque from magnetic assist layer 106 b acts to drag the magnetization direction of free layer 110 back to the in-plane direction. This hurts free layer 100 precession, which is also a significant limitation.
- FIG. 2 is a simplified cross-sectional view of an MRAM non-volatile memory cell 200 .
- MRAM non-volatile memory cell 200 is a three-terminal device that includes a MTJ 202 , a non-magnetic spacer layer 204 disposed above MTJ 202 , a magnetic assist layer 206 disposed above non-magnetic spacer layer 204 , and a spin Hall effect (SHE) layer 208 disposed above non-magnetic spacer layer 204 .
- Magnetic assist layer 206 has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane.
- Non-magnetic spacer layer 204 may be MgO, Cu or other non-magnetic material.
- magnetic assist layer 206 may include CoFeB.
- magnetic assist layer 206 may include Co, Fe, Ni magnetic layers, or magnetic layers including alloys of Co, Fe, Ni.
- the magnetic alloys can include boron, tantalum, copper or other materials.
- SHE layer 208 comprises a heavy metal with strong spin orbit coupling and large effective spin Hall angle.
- heavy metal materials include platinum, tungsten, tantalum, platinum gold (PtAu), bismuth bopper (BiCu).
- SHE layer 208 comprises a topological insulator, such as bismuth antimony (BiSb), bismuth selenide (Bi 2 Se 3 ), bismuth telluride (Bi 2 Te 3 ) or antimony telluride (Sb 2 Te 3 ).
- SHE layer 208 comprises BiSb with (012) orientation, which is a narrow gap topological insulator with both giant spin Hall effect and high electrical conductivity.
- SHE layer 208 may include a single material layer or may include a multi-layer structure.
- MTJ 202 includes a pinned layer 210 , a free layer 212 , and a tunnel barrier 214 positioned between pinned layer 210 and free layer 212 .
- Tunnel barrier 214 is an insulating layer, such as MgO or other insulating material.
- Pinned layer 210 is a ferromagnetic layer with a fixed magnetization direction.
- Free layer 212 is a ferromagnetic layer and has a magnetization direction that can be switched.
- MRAM non-volatile memory cell 200 has a first terminal T A coupled to a first end of SHE layer 208 , a second terminal T B coupled to a second end of SHE layer 208 , and a third terminal T C coupled to pinned layer 210 .
- Pinned layer 210 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as a single layer 210 with fixed magnetization direction. Pinned layer 210 and free layer 212 each have a perpendicular magnetization direction.
- a spin-polarized population of electrons moving in a common direction through a common material is referred to as a spin current.
- the spin Hall effect is a transport phenomenon that may be used to generate a spin current in a sample carrying an electric current.
- the spin current is in a direction perpendicular to the plane defined by the electrical current direction and the spin polarization direction.
- the spin polarization direction of such a SHE-generated spin current is in the in-plane direction orthogonal to the electrical current flow.
- conducting an electrical current 216 from first terminal T A to second terminal T B of SHE layer 208 results in a spin current that exerts a spin orbit torque (or “kick”) on magnetic assist layer 206 .
- the spin orbit torque causes the magnetization direction of magnetic assist layer 206 to oscillate around the axis normal to the stack film plane.
- Terminating electrical current 216 turns OFF the SHE-generated spin current, and the magnetization direction of magnetic assist layer 206 stops oscillating.
- the oscillation of the magnetization direction of magnetic assist layer 206 can be selectively controlled by selectively applying (e.g., turning ON and OFF) current 216 from first terminal T A to second terminal T B of SHE layer 208 .
- a multi-step process may be used to deterministically switch the magnetization direction of free layer 212 .
- a first voltage pulse is applied across SHE layer 208 for a first time period.
- a second voltage pulse is applied across MTJ 202 and magnetic assist layer 206 for a second time period longer than the first time period.
- the first voltage pulse is turned OFF while the second voltage pulse continues to be applied across MTJ 202 and magnetic assist layer 206 .
- the second voltage pulse is turned OFF.
- the first voltage pulse generates a spin orbit torque that causes magnetic assist layer 206 to oscillate.
- the second voltage pulse causes free layer 212 to experience a large spin transfer torque from magnetic assist layer 206 because the magnetization direction of magnetic assist layer 206 has a large angle with respect to the magnetization direction of free layer 212 when the second voltage pulse is applied.
- spin transfer torque from magnetic assist layer 206 “kicks' free layer 212 into precession. Without wanting to be bound by any particular theory, it is believed that prior to turning OFF the first voltage pulse, magnetic assist layer 206 imparts a spin transfer torque on free layer 212 that facilitates precession of magnetization direction of free layer 212 .
- the spin transfer torque from magnetic assist layer 206 is no longer facilitating precession of the magnetization direction of free layer 212 .
- pinned layer 210 imparts a spin transfer torque on free layer 212 , and facilitates the completion of switching of the magnetization direction of free layer 212 .
- FIG. 3A illustrates a technique for programming MUM non-volatile memory cell 200 of FIG. 2 .
- the top portion of FIG. 3A illustrates magnetization direction versus time for each of magnetic assist layer (AL) 206 , free layer (FL) 212 and pinned layer (PL) 210 .
- the bottom portion of FIG. 3A depicts voltage pulses applied to MUM non-volatile memory cell 200 .
- V AB is a first voltage pulse applied across first terminal T A to second terminal T B of SHE layer 208
- V CB is a second voltage pulse applied across third terminal T C to second terminal T B of MUM non-volatile memory cell 200 .
- the magnetization direction of each of magnetic assist layer 206 and free layer 212 is static (i.e., not rotating).
- magnetic assist layer 206 has a magnetization direction pointing in the +y direction
- free layer 212 has magnetization direction that is pointing in the +z direction
- pinned layer 210 has magnetization direction that is pointing in the +z direction.
- the magnetization direction of magnetic assist layer 206 and the magnetization direction of free layer 212 prior to time t 0 may be other than as shown in FIG. 3A .
- first voltage pulse V AB is applied across first terminal T A and second terminal T B of SHE layer 208 .
- first voltage pulse V AB is applied across first terminal T A and second terminal T B during a first time interval from time t 0 to time t 1 .
- Applying first voltage pulse V AB across first terminal T A and second terminal T B results in a spin current that exerts a spin orbit torque on magnetic assist layer 206 that causes the magnetization direction of magnetic assist layer 206 to oscillate.
- the magnetization direction of magnetic assist layer 206 oscillates.
- a second voltage pulse V CB is applied across third terminal T C and second terminal T B of MRAM non-volatile memory cell 200 .
- second voltage pulse V CB is applied across third terminal T C and second terminal T B during a second time interval from time t 0 to time t 2 .
- the second time interval is longer than the first time interval.
- Magnetic assist layer 206 and free layer 212 are magnetically coupled.
- second voltage pulse V CB is applied across third terminal T C and second terminal T B of MRAM non-volatile memory cell 200 , free layer 212 experiences a large spin transfer torque from magnetic assist layer 206 because the magnetization direction of magnetic assist layer 206 has a large angle with respect to the magnetization direction of free layer 212 at that instant.
- the large spin transfer torque imparted on free layer 212 initiates precession of the magnetization direction of free layer 212 .
- FIG. 3A shows that at time to the magnetization direction of free layer 212 has begun precession. Later, at time tb, the oscillation of the magnetization direction of free layer 212 becomes larger, and is almost in-plane.
- second voltage pulse V CB results in a polarized spin current from pinned layer 210 that exerts a spin transfer torque on free layer 212 , pulling the magnetization direction of free layer 212 back to the perpendicular direction. Nevertheless, during the first time interval between time t 0 and time t 1 , the spin transfer torque from pinned layer 210 is insufficient to halt precession of the magnetization direction of free layer 212 .
- first voltage pulse V AB turns OFF
- the magnetization direction of magnetic assist layer 206 stops oscillating
- magnetic assist layer 206 stops imparting a spin transfer torque on free layer 212 .
- second voltage pulse V CB continues to be applied from third terminal T C to second terminal T B of MRAM non-volatile memory cell 200 , and the spin transfer torque from pinned layer 210 pulls the magnetization direction of free layer 212 to the perpendicular direction.
- the magnetization direction of free layer 212 continues to precess in a direction opposite the initial magnetization direction of free layer 212 .
- second voltage pulse V CB turns OFF, and the precession of the magnetization direction of free layer 212 has completed.
- the magnetization direction of free layer 212 has switched 180° from the magnetization direction at time to.
- the total writing time in this embodiment is t 2 ⁇ t 0 .
- magnetic assist layer 206 of FIG. 2 is an active magnetic assist layer that may be used to provide enhanced initial torque on free layer 212 to assist the beginning stage of switching.
- torque provide by magnetic assist layer 206 may subsequently be turned OFF to prevent undesired effects from magnetic assist layer 206 at later stage of free layer 212 switching.
- FIG. 3B illustrates an alternative technique for programming MRAM non-volatile memory cell 200 of FIG. 2 .
- the technique of FIG. 3B is similar to that of FIG. 3A , except that second voltage pulse V CB is applied across third terminal T C and second terminal T B of MRAM non-volatile memory cell 200 at time t 0 ′, after first voltage pulse V AB is applied across first terminal T A and second terminal T B of SHE layer 208 at time t 0 .
- the time difference t 0 ′ ⁇ t 0 may be about 1-2 nanoseconds, or some other time difference.
- the magnetization direction of each of magnetic assist layer 206 and free layer 212 is static (i.e., not rotating).
- magnetic assist layer 206 has a magnetization direction pointing in the +y direction
- free layer 212 has magnetization direction that is pointing in the +z direction
- pinned layer 210 has magnetization direction that is pointing in the +z direction.
- the magnetization direction of magnetic assist layer 206 and the magnetization direction of free layer 212 prior to time t 0 may be other than as shown in FIG. 3B .
- first voltage pulse V AB is applied across first terminal T A and second terminal T B of SHE layer 208 .
- first voltage pulse V AB is applied across first terminal T A and second terminal T B during a first time interval from time t 0 to time t 1 .
- Applying first voltage pulse V AB across first terminal T A and second terminal T B results in a spin current that exerts a spin orbit torque on magnetic assist layer 206 that causes the magnetization direction of magnetic assist layer 206 to oscillate.
- the magnetization direction of magnetic assist layer 206 oscillates.
- the rotating magnetization direction of magnetic assist layer 208 does not impart a rotating spin transfer torque on the magnetization direction of free layer 212 .
- the magnetization direction of free layer 212 remains static (i.e., not rotating).
- second voltage pulse V CB is applied across third terminal T C and second terminal T B of MRAM non-volatile memory cell 200 .
- second voltage pulse V CB is applied across third terminal T C and second terminal T B during a second time interval from time t 0 ′ to time t 2 .
- the second time interval is longer than the first time interval.
- free layer 212 experiences a large spin transfer torque from magnetic assist layer 206 because the magnetization direction of magnetic assist layer 206 has a large angle with respect to the magnetization direction of free layer 212 at that instant.
- the large spin transfer torque imparted on free layer 212 initiates precession of the magnetization direction of free layer 212 .
- FIG. 3B shows that at time td the magnetization direction of free layer 212 has begun precession. Later, at time te, the oscillation of the magnetization direction of free layer 212 becomes larger, and is almost in-plane.
- second voltage pulse V CB results in a polarized spin current from pinned layer 210 that exerts a spin transfer torque on free layer 212 , pulling the magnetization direction of free layer 212 back to the perpendicular direction. Nevertheless, during the third time interval between time t 0 ′ and time t 1 , the spin transfer torque from pinned layer 210 is insufficient to halt precession of the magnetization direction of free layer 212 .
- first voltage pulse V AB turns OFF
- the magnetization direction of magnetic assist layer 206 stops oscillating
- magnetic assist layer 206 stops imparting a spin transfer torque on free layer 212 .
- second voltage pulse V CB continues to be applied from third terminal T C to second terminal T B of MRAM non-volatile memory cell 200 , and the spin transfer torque from pinned layer 210 pulls the magnetization direction of free layer 212 back to the perpendicular direction.
- the magnetization direction of free layer 212 continues to precess in a direction opposite the initial magnetization direction of free layer 212 .
- second voltage pulse V CB turns OFF, and the precession of the magnetization direction of free layer 212 has completed.
- the magnetization direction of free layer 212 has switched 180° from the magnetization direction at time to.
- the total writing time in this embodiment is t 2 ⁇ t 0 .
- FIG. 3B may provide energy savings compared to the embodiment of FIG. 3A .
- FIG. 3B illustrates that free layer 212 switching does not require that first voltage pulse V AB and second voltage pulse V CB both are applied synchronously at time t 0 .
- FIG. 4 is a simplified cross-sectional view of an alternative MRAM non-volatile memory cell 400 .
- MRAM non-volatile memory cell 400 has a MTJ 402 inverted with respect to the embodiment of FIG. 2 .
- MRAM non-volatile memory cell 400 is a three-terminal device that includes a SHE layer 404 , a magnetic assist layer 406 disposed above SHE layer 404 , a non-magnetic spacer layer 408 disposed above magnetic assist layer 406 , and MTJ 402 disposed above non-magnetic spacer layer 408 .
- Magnetic assist layer 406 has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane.
- Non-magnetic spacer layer 408 may be MgO, Cu or other non-magnetic material.
- magnetic assist layer 406 may include CoFeB.
- magnetic assist layer 406 may include Co, Fe, Ni magnetic layers, or magnetic layers including alloys of Co, Fe, Ni.
- the magnetic alloys can include boron, tantalum, copper or other materials.
- SHE layer 404 comprises a heavy metal with strong spin orbit coupling and large effective spin Hall angle.
- heavy metal materials include platinum, tungsten, tantalum, PtAu, and BiCu.
- SHE layer 404 comprises a topological insulator, such as BiSb, Bi 2 Se 3 , Bi 2 Te 3 or Sb 2 Te 3 .
- SHE layer 404 comprises BiSb with (012) orientation, which is a narrow gap topological insulator with both giant spin Hall effect and high electrical conductivity.
- SHE layer 404 may include a single material layer or may include a multi-layer structure.
- MTJ 402 includes a pinned layer 410 , a free layer 412 , and a tunnel barrier 414 positioned between pinned layer 410 and free layer 412 .
- Tunnel barrier 414 is an insulating layer, such as MgO or other insulating material.
- Pinned layer 410 is a ferromagnetic layer with a fixed magnetization direction.
- Free layer 412 is a ferromagnetic layer and has a magnetization direction that can be switched.
- MRAM non-volatile memory cell 400 has a first terminal T A coupled to a first end of SHE layer 404 , a second terminal T B coupled to a second end of SHE layer 404 , and a third terminal T C coupled to pinned layer 410 .
- Pinned layer 410 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as a single layer 410 with fixed magnetization direction. Pinned layer 410 and free layer 412 each have a perpendicular magnetization direction.
- Conducting an electrical current 416 from first terminal T A to second terminal T B of SHE layer 404 results in a spin current that exerts a spin orbit torque on magnetic assist layer 406 .
- the spin orbit torque causes the magnetization direction of magnetic assist layer 406 to oscillate around the axis normal to the stack film plane.
- Terminating electrical current 416 turns OFF the SHE-generated spin current, and the magnetization direction of magnetic assist layer 406 stops oscillating.
- the oscillation of the magnetization direction of magnetic assist layer 406 can be selectively controlled by selectively applying current 416 from first terminal T A to second terminal T B of SHE layer 404 .
- the spin transfer torque from magnetic assist layer 406 advantageously may be used during a first portion of a write operation to “kick” free layer 412 into precession.
- the oscillation of the magnetization direction of magnetic assist layer 406 may be halted, when the spin transfer torque from magnetic assist layer 406 would otherwise act to drag the magnetization direction of free layer 412 back to the in-plane direction.
- FIG. 5A depicts an embodiment of a memory system 500 and a host 502 .
- Memory system 500 may include a non-volatile storage system interfacing with host 502 (e.g., a mobile computing device).
- host 502 e.g., a mobile computing device
- memory system 500 may be embedded within host 502 .
- memory system 500 may include a memory card.
- memory system 500 includes a memory chip controller 504 and a memory chip 506 . Although a single memory chip 506 is depicted, memory system 500 may include more than one memory chip (e.g., four, eight or some other number of memory chips). Memory chip controller 504 may receive data and commands from host 502 and provide data to host 502 .
- Memory chip controller 504 may include one or more state machines, page registers, SRAM, decoders, sense amplifiers, and control circuitry for controlling the operation of memory chip 506 .
- the one or more state machines, page registers, SRAM, and control circuitry for controlling the operation of memory chip 506 may be referred to as managing or control circuits.
- the managing or control circuits may facilitate one or more memory operations, such as programming, reading (or sensing) and erasing operations.
- the managing or control circuits (or a portion of the managing or control circuits) that facilitate one or more memory array operations, including programming, reading, and erasing operations, may be integrated within memory chip 506 .
- the managing or control circuits may include an on-chip memory controller for determining row and column address, bit line, source line and word line addresses, memory array enable signals, and data latching signals.
- Memory chip controller 504 and memory chip 506 may be arranged on a single integrated circuit. In other embodiments, memory chip controller 504 and memory chip 506 may be arranged on different integrated circuits. In some cases, memory chip controller 504 and memory chip 506 may be integrated on a system board, logic board, or a PCB.
- Memory chip 506 includes memory core control circuits 508 and a memory core 510 .
- memory core control circuits 508 include circuits that generate row and column addresses for selecting memory blocks (or arrays) within memory core 510 , and generating voltages to bias a particular memory array into a read or a write state.
- Memory chip controller 504 controls operation of memory chip 506 .
- memory core control circuits 508 generate the appropriate bias voltages for bit lines, source lines and/or word lines within memory core 510 , and generates the appropriate memory block, row, and column addresses to perform memory operations.
- memory core 510 includes one or more arrays of non-volatile memory cells. In an embodiment, memory core 510 includes one or more arrays of MRAM non-volatile memory cells, such as any of the MRAM non-volatile memory cells described above. Memory core 510 may include one or more two-dimensional or three-dimensional arrays of MRAM non-volatile memory cells.
- memory core control circuits 508 and memory core 510 are arranged on a single integrated circuit. In other embodiments, memory core control circuits 508 (or a portion of memory core control circuits 508 ) and memory core 510 may be arranged on different integrated circuits.
- memory core 510 includes a three-dimensional memory array of MRAM non-volatile memory cells in which multiple memory levels are formed above a single substrate, such as a wafer.
- the memory structure may include MRAM non-volatile memory that is monolithically formed in one or more physical levels of arrays of non-volatile memory cells having an active area disposed above a silicon (or other type of) substrate.
- FIG. 5B depicts an embodiment of memory core control circuits 508 .
- memory core control circuits 508 include address decoders 520 , voltage generators 522 , read/write circuit 524 , and transfer data latch 526 .
- address decoders 520 generate memory block addresses, as well as row addresses and column addresses for a particular memory block.
- voltage generators (or voltage regulators) 522 generate voltages for control lines.
- Read/write circuit 524 includes circuitry for reading and writing non-volatile memory cells in memory core 510 .
- transfer data latch 526 is used for intermediate storage between memory chip controller 504 ( FIG. 5A ) and non-volatile memory cells.
- transfer data latch 526 has a size equal to a size of a page.
- memory chip controller 504 when host 502 instructs memory chip controller 504 to write data to memory chip 506 , memory chip controller 504 writes a page of host data to transfer data latch 526 .
- Read/write circuit 524 then writes data from transfer data latch 526 to a specified page of non-volatile memory cells.
- read/write circuit 524 reads from a specified page of non-volatile memory cells into transfer data latch 526 , and memory chip controller 504 transfers the read data from transfer data latch 526 to host 502 .
- the MRAM memory cell current may be sensed and compared with a reference current to determine which state the memory cell is in. For example, the magnitude of the read voltage may be compared to a reference current to delineate between the two states.
- FIG. 5C depicts further details of an embodiment of voltage generator circuits 522 , which includes voltage generators for selected control lines 522 a , voltage generators for unselected control lines 522 b , and signal generators for reference signals 522 c .
- Control lines may include bit lines, source lines and word lines, or a combination of bit lines, source lines and word lines.
- Voltage generators for selected control lines 522 a may be used to generate program and/or read voltages.
- Voltage generators for unselected control lines 522 b may be used to generate voltages for control lines that are connected to memory cells that are not selected for a program or read operation.
- Signal generators for reference signals 522 c may be used to generate reference signals (e.g., currents, voltages) to be used as a comparison signal to determine the physical state of a memory cell.
- One embodiment includes an apparatus including a magnetic tunnel junction, a magnetic assist layer coupled to the magnetic tunnel junction, a non-magnetic layer disposed between the free layer and the magnetic assist layer, and a spin Hall effect layer coupled to the magnetic assist layer.
- the magnetic tunnel junction includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane.
- the magnetic assist layer includes a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane.
- One embodiment includes a method including applying for a first time interval a first voltage pulse across a first terminal and a second terminal of a spin Hall effect layer that is coupled to a stack including a magnetic assist layer, a non-magnetic layer and a magnetic tunnel junction that includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane, the magnetic assist layer including a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane, applying for a second time interval a second voltage pulse across the second terminal and a third terminal coupled to the magnetic tunnel junction, the second time interval longer than the first time interval, and the first time interval overlapping a portion of the second time interval, and switching the magnetization direction of the free layer.
- One embodiment includes an MRAM non-volatile memory cell including a spin Hall effect layer, a magnetic tunnel junction that includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane, and a magnetic assist layer disposed between the spin Hall effect layer and the magnetic tunnel junction, the magnetic assist layer including a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane.
- the spin Hall effect layer is configured to turn ON and turn OFF torque provided by the magnetic assist layer to assist switching the magnetization direction of the free layer.
- a connection may be a direct connection or an indirect connection (e.g., via one or more other parts).
- the element when an element is referred to as being connected or coupled to another element, the element may be directly connected to the other element or indirectly connected to the other element via intervening elements.
- the element When an element is referred to as being directly connected to another element, then there are no intervening elements between the element and the other element.
- Two devices are “in communication” if they are directly or indirectly connected so that they can communicate electronic signals between them.
- set of objects may refer to a “set” of one or more of the objects.
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Abstract
Description
- The present application claims priority from U.S. Provisional Patent Application No. 63/072,397, entitled “APPARATUS AND METHODS FOR MAGNETIC MEMORY DEVICES WITH MAGNETIC ASSIST LAYER,” filed Aug. 31, 2020, incorporated by reference herein in its entirety.
- Semiconductor memory is widely used in various electronic devices such as mobile computing devices, mobile phones, solid-state drives, digital cameras, personal digital assistants, medical electronics, servers, and non-mobile computing devices. Semiconductor memory may include non-volatile memory or volatile memory. A non-volatile memory device allows information to be stored or retained even when the non-volatile memory device is not connected to a source of power (e.g., a battery).
- Examples of non-volatile memory include, but are not limited to, magnetoresistive memory (e.g., MRAM), phase change memory (e.g., PCM) ferroelectric field effect transistor (FeFET) memory, ferroelectric memory (e.g., FeRAM), and flash memory (e.g., NAND-type and NOR-type flash memory).
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FIG. 1A depicts an example MRAM non-volatile memory cell. -
FIG. 1B depicts another example MRAM non-volatile memory cell. -
FIG. 2 depicts still another example MRAM non-volatile memory cell. -
FIG. 3A illustrates a technique for programming the MRAM non-volatile memory cell ofFIG. 2 . -
FIG. 3B illustrates another technique for programming the MRAM non-volatile memory cell ofFIG. 2 . -
FIG. 4 depicts yet another example MRAM non-volatile memory cell. -
FIG. 5A depicts an embodiment of a memory system and a host. -
FIG. 5B depicts an embodiment of memory core control circuits. -
FIG. 5C depicts further details of one embodiment of voltage generators. - Technology is described for a three-terminal MRAM non-volatile memory cell that includes a spin Hall effect layer, a magnetic assist layer, and a magnetic tunnel junction that includes a free layer in a plane. The free layer includes a switchable magnetization direction perpendicular to the plane. The magnetic assist layer is coupled to the magnetic tunnel junction, and includes a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane.
- The MRAM non-volatile memory cell is programmed by applying a first voltage pulse across the spin Hall effect layer to generate a spin orbit torque to cause the magnetization direction of the magnetic assist layer to oscillate, and a second voltage pulse across the magnetic tunnel junction and the magnetic assist layer to generate a spin transfer torque to cause the magnetization direction of the free layer to deterministically switch.
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FIG. 1A is a simplified cross-sectional view of an MRAMnon-volatile memory cell 100 a. MRAMnon-volatile memory cell 100 a is a two-terminal device that includes a magnetic tunnel junction (MTJ) 102, anon-magnetic spacer layer 104 disposed above MTJ 102, and amagnetic assist layer 106 a disposed abovenon-magnetic spacer layer 104. Non-magneticspacer layer 104 may be magnesium oxide (MgO), copper (Cu) or other non-magnetic material.Magnetic assist layer 106 a has an in-plane magnetization direction that is fixed. - MTJ 102 includes a reference (or pinned) layer (PL) 108, a free layer (FL) 110, and a tunnel barrier (TB) 112 positioned between
pinned layer 108 andfree layer 110.Tunnel barrier 112 is an insulating layer, such as magnesium oxide (MgO) or other insulating material. Pinnedlayer 108 is a ferromagnetic layer with a fixed magnetization direction.Free layer 110 is a ferromagnetic layer and has a magnetization direction that can be switched. In an embodiment, MRAMnon-volatile memory cell 100 a has a first terminal TA coupled tomagnetic assist layer 106 a, and a second terminal TB coupled to pinnedlayer 108. - Pinned
layer 108 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as asingle layer 108 with fixed magnetization direction. Pinnedlayer 108 andfree layer 110 each have a magnetization direction perpendicular to the film plane (e.g., the x-y plane inFIG. 1A ), rather than in-plane. Such a magnetization direction will be referred to herein as a “perpendicular magnetization direction.”Magnetic assist layer 106 a has a magnetization direction that is perpendicular to the magnetization direction ofpinned layer 108 andfree layer 110. - When the magnetization direction of
free layer 110 is parallel to the magnetization direction ofpinned layer 108, the resistance of MRAMnon-volatile memory cell 100 a is relatively low. When the magnetization direction offree layer 110 is anti-parallel to the magnetization direction inpinned layer 108, the resistance of MRAMnon-volatile memory cell 100 a is relatively high. - Thus, the resistance of MRAM
non-volatile memory cell 100 a may therefore be used to store one bit of data. In an embodiment, MRAM non-volatilememory cell 100 a may be programmed to either a low resistance ON state or a high resistance OFF state. In an embodiment, the low resistance ON state may be used to represent a first value (e.g., “1”), and the high resistance OFF state may be used to represent a second value (e.g., “0”). The data (“0” or “1”) in MRAM non-volatilememory cell 100 a may be read by measuring the resistance of MRAMnon-volatile memory cell 100 a. - The spin of an electron is an intrinsic angular momentum. In a solid, the spins of many electrons can act together to affect the magnetic and electronic properties of a material, for example endowing it with a permanent magnetic moment as in a ferromagnet. In many materials, electron spins are equally present in both up and down directions. However, various techniques can be used to generate a spin-polarized population of electrons, resulting in an excess of spin up or spin down electrons, to change the properties of a material. This spin-polarized population of electrons moving in a common direction through a common material is referred to as a spin current.
- Spin transfer torque (STT) switching may be used to change the magnetization direction of
free layer 110 of MRAM non-volatile memory cell 100 ab. When a write current is conducted from first terminal TA to second terminal TB of MRAM non-volatilememory cell 100 a, electrons in the write current become spin-polarized as they pass throughmagnetic assist layer 106 a. In particular,magnetic assist layer 106 a polarizes the electrons with a spin orientation corresponding to the magnetization direction ofmagnetic assist layer 106 a, and thus produces a spin-polarized current. - The spin polarized electrons pass through
non-magnetic spacer layer 104 and impart a spin transfer torque on the magnetization offree layer 110, which helps initiate switching the magnetization direction offree layer 110. In particular, the spin transfer torque helps to initiate precession of the magnetization direction offree layer 110. That is, the magnetization direction offree layer 110 turns on itself in a continuous manner with sustained oscillations until the magnetization direction offree layer 110 switches by 180°. - The spin polarized electrons from
magnetic assist layer 106 a provide the initial spin transfer torque on the magnetization offree layer 110 to start the precession. In particular, in the first half of the precession the spin transfer torque provided by the spin polarized electrons frommagnetic assist layer 106 a is in the opposite direction as the inherent damping offree layer 110, and helps overcome the inherent damping offree layer 110. In the second half of the precession, however, the spin transfer torque provided by the spin polarized electrons frommagnetic assist layer 106 a is in the same direction as the inherent damping offree layer 110, and thus impairs the precession of the magnetization direction offree layer 110. - Indeed, the spin polarized electrons from
magnetic assist layer 106 a (which has a fixed magnetization direction) can only provide a spin transfer torque in the same fixed direction. Thus, half the time the spin transfer torque provided by the spin polarized electrons frommagnetic assist layer 106 a is helping to switch the magnetization direction offree layer 110, and the other half of the time the spin transfer torque is hurtingfree layer 110 precession, which is a significant limitation. -
FIG. 1B is a simplified cross-sectional view of an MRAMnon-volatile memory cell 100 b. MRAMnon-volatile memory cell 100 b is a two-terminal device that includesMTJ 102,non-magnetic spacer layer 104 disposed aboveMTJ 102, and amagnetic assist layer 106 b disposed abovenon-magnetic spacer layer 104. MRAMnon-volatile memory cell 100 b is similar to MRAMnon-volatile memory cell 100 a ofFIG. 1A , except thatmagnetic assist layer 106 b has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane. In an embodiment, MRAMnon-volatile memory cell 100 b has a first terminal TA coupled tomagnetic assist layer 106 b, and a second terminal TB coupled to pinnedlayer 108. - Spin transfer torque switching may be used to change the magnetization direction of
free layer 110 of MRAMnon-volatile memory cell 100 b. When a write current is conducted from first terminal TA to second terminal TB of MRAMnon-volatile memory cell 100 b, electrons in the write current become spin-polarized as they pass throughmagnetic assist layer 106 b. The spin polarized electrons pass throughnon-magnetic spacer layer 104 and impart a spin transfer torque on the magnetization offree layer 110, which helps initiate precession of the magnetization direction offree layer 110. -
Magnetic assist layer 106 b andfree layer 110 are magnetically coupled. In particular, as the magnetization direction offree layer 110 starts to precess,free layer 110 imparts a torque on the magnetization direction ofmagnetic assist layer 106 b. As a result, this torque initiates precession of the magnetization direction ofmagnetic assist layer 106 b, which follows the precessional rotation of the magnetization direction offree layer 110. In this regard, the precession of the magnetization direction ofmagnetic assist layer 106 b is “passive,” in the sense that precession of the magnetization direction offree layer 110 triggers the precession of the magnetization direction ofmagnetic assist layer 106 b. - The rotating magnetization direction of
magnetic assist layer 106 b imparts a rotating spin transfer torque on the magnetization offree layer 110 to help switch the magnetization direction offree layer 110. The rotating spin transfer torque helps to overcome the inherent damping offree layer 110 throughout the entire precession cycle. - At the beginning of
free layer 110 switching, the spin transfer torque frommagnetic assist layer 106 b helps to enhance the torque on the magnetization offree layer 110. Nevertheless, the magnetization direction ofmagnetic assist layer 106 b remains largely in-plane. As a result, in the later stage offree layer 110 switching, the spin transfer torque frommagnetic assist layer 106 b acts to drag the magnetization direction offree layer 110 back to the in-plane direction. This hurts free layer 100 precession, which is also a significant limitation. -
FIG. 2 is a simplified cross-sectional view of an MRAMnon-volatile memory cell 200. MRAMnon-volatile memory cell 200 is a three-terminal device that includes aMTJ 202, anon-magnetic spacer layer 204 disposed aboveMTJ 202, amagnetic assist layer 206 disposed abovenon-magnetic spacer layer 204, and a spin Hall effect (SHE)layer 208 disposed abovenon-magnetic spacer layer 204.Magnetic assist layer 206 has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane. -
Non-magnetic spacer layer 204 may be MgO, Cu or other non-magnetic material. In an embodiment,magnetic assist layer 206 may include CoFeB. In other embodiments,magnetic assist layer 206 may include Co, Fe, Ni magnetic layers, or magnetic layers including alloys of Co, Fe, Ni. In embodiments, the magnetic alloys can include boron, tantalum, copper or other materials. - In an embodiment,
SHE layer 208 comprises a heavy metal with strong spin orbit coupling and large effective spin Hall angle. Examples of heavy metal materials include platinum, tungsten, tantalum, platinum gold (PtAu), bismuth bopper (BiCu). In other embodiments,SHE layer 208 comprises a topological insulator, such as bismuth antimony (BiSb), bismuth selenide (Bi2Se3), bismuth telluride (Bi2Te3) or antimony telluride (Sb2Te3). In particular embodiments,SHE layer 208 comprises BiSb with (012) orientation, which is a narrow gap topological insulator with both giant spin Hall effect and high electrical conductivity. In embodiments,SHE layer 208 may include a single material layer or may include a multi-layer structure. -
MTJ 202 includes a pinnedlayer 210, afree layer 212, and atunnel barrier 214 positioned between pinnedlayer 210 andfree layer 212.Tunnel barrier 214 is an insulating layer, such as MgO or other insulating material. Pinnedlayer 210 is a ferromagnetic layer with a fixed magnetization direction.Free layer 212 is a ferromagnetic layer and has a magnetization direction that can be switched. In an embodiment, MRAMnon-volatile memory cell 200 has a first terminal TA coupled to a first end ofSHE layer 208, a second terminal TB coupled to a second end ofSHE layer 208, and a third terminal TC coupled to pinnedlayer 210. - Pinned
layer 210 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as asingle layer 210 with fixed magnetization direction. Pinnedlayer 210 andfree layer 212 each have a perpendicular magnetization direction. - As described above, a spin-polarized population of electrons moving in a common direction through a common material is referred to as a spin current. The spin Hall effect is a transport phenomenon that may be used to generate a spin current in a sample carrying an electric current. The spin current is in a direction perpendicular to the plane defined by the electrical current direction and the spin polarization direction. The spin polarization direction of such a SHE-generated spin current is in the in-plane direction orthogonal to the electrical current flow.
- For example, conducting an electrical current 216 from first terminal TA to second terminal TB of
SHE layer 208 results in a spin current that exerts a spin orbit torque (or “kick”) onmagnetic assist layer 206. The spin orbit torque causes the magnetization direction ofmagnetic assist layer 206 to oscillate around the axis normal to the stack film plane. Terminating electrical current 216, turns OFF the SHE-generated spin current, and the magnetization direction ofmagnetic assist layer 206 stops oscillating. Thus, the oscillation of the magnetization direction ofmagnetic assist layer 206 can be selectively controlled by selectively applying (e.g., turning ON and OFF) current 216 from first terminal TA to second terminal TB ofSHE layer 208. - As described below, a multi-step process may be used to deterministically switch the magnetization direction of
free layer 212. In a first step a first voltage pulse is applied across SHE layer 208 for a first time period. In a second step commencing at the same time or shortly after application of the first voltage pulse, a second voltage pulse is applied acrossMTJ 202 andmagnetic assist layer 206 for a second time period longer than the first time period. In a third step, the first voltage pulse is turned OFF while the second voltage pulse continues to be applied acrossMTJ 202 andmagnetic assist layer 206. In a fourth step, the second voltage pulse is turned OFF. - Without wanting to be bound by any particular theory, it is believed that the first voltage pulse generates a spin orbit torque that causes
magnetic assist layer 206 to oscillate. In addition, without wanting to be bound by any particular theory, it is believed that the second voltage pulse causesfree layer 212 to experience a large spin transfer torque frommagnetic assist layer 206 because the magnetization direction ofmagnetic assist layer 206 has a large angle with respect to the magnetization direction offree layer 212 when the second voltage pulse is applied. - Without wanting to be bound by any particular theory, it is believed that the spin transfer torque from
magnetic assist layer 206 “kicks'free layer 212 into precession. Without wanting to be bound by any particular theory, it is believed that prior to turning OFF the first voltage pulse,magnetic assist layer 206 imparts a spin transfer torque onfree layer 212 that facilitates precession of magnetization direction offree layer 212. - Without wanting to be bound by any particular theory, it is believed that when the first voltage pulse is turned OFF, the spin transfer torque from
magnetic assist layer 206 is no longer facilitating precession of the magnetization direction offree layer 212. Without wanting to be bound by any particular theory, it is believed that after the first voltage pulse is turned OFF but before the second voltage pulse is turned OFF, pinnedlayer 210 imparts a spin transfer torque onfree layer 212, and facilitates the completion of switching of the magnetization direction offree layer 212. -
FIG. 3A illustrates a technique for programming MUMnon-volatile memory cell 200 ofFIG. 2 . The top portion ofFIG. 3A illustrates magnetization direction versus time for each of magnetic assist layer (AL) 206, free layer (FL) 212 and pinned layer (PL) 210. The bottom portion ofFIG. 3A depicts voltage pulses applied to MUMnon-volatile memory cell 200. In particular, VAB is a first voltage pulse applied across first terminal TA to second terminal TB ofSHE layer 208, and VCB is a second voltage pulse applied across third terminal TC to second terminal TB of MUMnon-volatile memory cell 200. - Prior to time t0, the magnetization direction of each of
magnetic assist layer 206 andfree layer 212 is static (i.e., not rotating). In the illustrated example,magnetic assist layer 206 has a magnetization direction pointing in the +y direction,free layer 212 has magnetization direction that is pointing in the +z direction, and pinnedlayer 210 has magnetization direction that is pointing in the +z direction. Persons of ordinary skill in the art will understand that the magnetization direction ofmagnetic assist layer 206 and the magnetization direction offree layer 212 prior to time t0 may be other than as shown inFIG. 3A . - At time t0, first voltage pulse VAB is applied across first terminal TA and second terminal TB of
SHE layer 208. In an embodiment, first voltage pulse VAB is applied across first terminal TA and second terminal TB during a first time interval from time t0 to time t1. Applying first voltage pulse VAB across first terminal TA and second terminal TB results in a spin current that exerts a spin orbit torque onmagnetic assist layer 206 that causes the magnetization direction ofmagnetic assist layer 206 to oscillate. As illustrated inFIG. 3A , during a first time interval between time t0 and time t1 the magnetization direction ofmagnetic assist layer 206 oscillates. - Also at time t0, a second voltage pulse VCB is applied across third terminal TC and second terminal TB of MRAM
non-volatile memory cell 200. In an embodiment, second voltage pulse VCB is applied across third terminal TC and second terminal TB during a second time interval from time t0 to time t2. In an embodiment, the second time interval is longer than the first time interval. -
Magnetic assist layer 206 andfree layer 212 are magnetically coupled. When second voltage pulse VCB is applied across third terminal TC and second terminal TB of MRAMnon-volatile memory cell 200,free layer 212 experiences a large spin transfer torque frommagnetic assist layer 206 because the magnetization direction ofmagnetic assist layer 206 has a large angle with respect to the magnetization direction offree layer 212 at that instant. - As a result, the large spin transfer torque imparted on
free layer 212 initiates precession of the magnetization direction offree layer 212. This is illustrated inFIG. 3A , which shows that at time to the magnetization direction offree layer 212 has begun precession. Later, at time tb, the oscillation of the magnetization direction offree layer 212 becomes larger, and is almost in-plane. - In an embodiment, second voltage pulse VCB results in a polarized spin current from pinned
layer 210 that exerts a spin transfer torque onfree layer 212, pulling the magnetization direction offree layer 212 back to the perpendicular direction. Nevertheless, during the first time interval between time t0 and time t1, the spin transfer torque from pinnedlayer 210 is insufficient to halt precession of the magnetization direction offree layer 212. - At time t1 (e.g., about 3-5 ns after time t0) first voltage pulse VAB turns OFF, the magnetization direction of
magnetic assist layer 206 stops oscillating, andmagnetic assist layer 206 stops imparting a spin transfer torque onfree layer 212. Between time t1 and time t2, second voltage pulse VCB continues to be applied from third terminal TC to second terminal TB of MRAMnon-volatile memory cell 200, and the spin transfer torque from pinnedlayer 210 pulls the magnetization direction offree layer 212 to the perpendicular direction. - As depicted in
FIG. 3A , at time tc the magnetization direction offree layer 212 continues to precess in a direction opposite the initial magnetization direction offree layer 212. By time t2, second voltage pulse VCB turns OFF, and the precession of the magnetization direction offree layer 212 has completed. In particular, by time t2 the magnetization direction offree layer 212 has switched 180° from the magnetization direction at time to. The total writing time in this embodiment is t2−t0. - Without wanting to be bound by any particular theory, it is believed that the in contrast to the passive magnetic assist layers 106 a and 106 b of
FIGS. 1A and 1B , respectively,magnetic assist layer 206 ofFIG. 2 is an active magnetic assist layer that may be used to provide enhanced initial torque onfree layer 212 to assist the beginning stage of switching. In addition, without wanting to be bound by any particular theory, it is believed that the torque provide bymagnetic assist layer 206 may subsequently be turned OFF to prevent undesired effects frommagnetic assist layer 206 at later stage offree layer 212 switching. -
FIG. 3B illustrates an alternative technique for programming MRAMnon-volatile memory cell 200 ofFIG. 2 . The technique ofFIG. 3B is similar to that ofFIG. 3A , except that second voltage pulse VCB is applied across third terminal TC and second terminal TB of MRAMnon-volatile memory cell 200 at time t0′, after first voltage pulse VAB is applied across first terminal TA and second terminal TB ofSHE layer 208 at time t0. The time difference t0′−t0 may be about 1-2 nanoseconds, or some other time difference. - Prior to time t0, the magnetization direction of each of
magnetic assist layer 206 andfree layer 212 is static (i.e., not rotating). In the illustrated example,magnetic assist layer 206 has a magnetization direction pointing in the +y direction,free layer 212 has magnetization direction that is pointing in the +z direction, and pinnedlayer 210 has magnetization direction that is pointing in the +z direction. Persons of ordinary skill in the art will understand that the magnetization direction ofmagnetic assist layer 206 and the magnetization direction offree layer 212 prior to time t0 may be other than as shown inFIG. 3B . - At time t0, first voltage pulse VAB is applied across first terminal TA and second terminal TB of
SHE layer 208. In an embodiment, first voltage pulse VAB is applied across first terminal TA and second terminal TB during a first time interval from time t0 to time t1. Applying first voltage pulse VAB across first terminal TA and second terminal TB results in a spin current that exerts a spin orbit torque onmagnetic assist layer 206 that causes the magnetization direction ofmagnetic assist layer 206 to oscillate. As illustrated inFIG. 3B , during a first time interval between time t0 and time t1 the magnetization direction ofmagnetic assist layer 206 oscillates. - Until time t0 (when second voltage pulse VCB is applied across third terminal TC and second terminal TB of MRAM non-volatile memory cell 200), the rotating magnetization direction of
magnetic assist layer 208 does not impart a rotating spin transfer torque on the magnetization direction offree layer 212. Thus, as depicted inFIG. 3B , between time t0 and time t0′, the magnetization direction offree layer 212 remains static (i.e., not rotating). - At time t0′, second voltage pulse VCB is applied across third terminal TC and second terminal TB of MRAM
non-volatile memory cell 200. In an embodiment, second voltage pulse VCB is applied across third terminal TC and second terminal TB during a second time interval from time t0′ to time t2. In an embodiment, the second time interval is longer than the first time interval. - During a third time interval between time t0′ and time t1
free layer 212 experiences a large spin transfer torque frommagnetic assist layer 206 because the magnetization direction ofmagnetic assist layer 206 has a large angle with respect to the magnetization direction offree layer 212 at that instant. As a result, the large spin transfer torque imparted onfree layer 212 initiates precession of the magnetization direction offree layer 212. This is illustrated inFIG. 3B , which shows that at time td the magnetization direction offree layer 212 has begun precession. Later, at time te, the oscillation of the magnetization direction offree layer 212 becomes larger, and is almost in-plane. - In an embodiment, second voltage pulse VCB results in a polarized spin current from pinned
layer 210 that exerts a spin transfer torque onfree layer 212, pulling the magnetization direction offree layer 212 back to the perpendicular direction. Nevertheless, during the third time interval between time t0′ and time t1, the spin transfer torque from pinnedlayer 210 is insufficient to halt precession of the magnetization direction offree layer 212. - At time t1 (e.g., about 3-5 ns after time t0) first voltage pulse VAB turns OFF, the magnetization direction of
magnetic assist layer 206 stops oscillating, andmagnetic assist layer 206 stops imparting a spin transfer torque onfree layer 212. Between time t1 and time t2, second voltage pulse VCB continues to be applied from third terminal TC to second terminal TB of MRAMnon-volatile memory cell 200, and the spin transfer torque from pinnedlayer 210 pulls the magnetization direction offree layer 212 back to the perpendicular direction. - As depicted in
FIG. 3B , at time tc the magnetization direction offree layer 212 continues to precess in a direction opposite the initial magnetization direction offree layer 212. By time t2, second voltage pulse VCB turns OFF, and the precession of the magnetization direction offree layer 212 has completed. In particular, by time t2 the magnetization direction offree layer 212 has switched 180° from the magnetization direction at time to. The total writing time in this embodiment is t2−t0. - Without wanting to be bound by any particular theory, it is believed that the embodiment of
FIG. 3B may provide energy savings compared to the embodiment ofFIG. 3A . Also,FIG. 3B illustrates thatfree layer 212 switching does not require that first voltage pulse VAB and second voltage pulse VCB both are applied synchronously at time t0. -
FIG. 4 is a simplified cross-sectional view of an alternative MRAMnon-volatile memory cell 400. MRAMnon-volatile memory cell 400 has aMTJ 402 inverted with respect to the embodiment ofFIG. 2 . MRAMnon-volatile memory cell 400 is a three-terminal device that includes aSHE layer 404, amagnetic assist layer 406 disposed aboveSHE layer 404, anon-magnetic spacer layer 408 disposed abovemagnetic assist layer 406, andMTJ 402 disposed abovenon-magnetic spacer layer 408.Magnetic assist layer 406 has a magnetization direction that is in-plane, but has no preferred direction and can freely rotate in-plane. -
Non-magnetic spacer layer 408 may be MgO, Cu or other non-magnetic material. In an embodiment,magnetic assist layer 406 may include CoFeB. In other embodiments,magnetic assist layer 406 may include Co, Fe, Ni magnetic layers, or magnetic layers including alloys of Co, Fe, Ni. In embodiments, the magnetic alloys can include boron, tantalum, copper or other materials. - In an embodiment,
SHE layer 404 comprises a heavy metal with strong spin orbit coupling and large effective spin Hall angle. Examples of heavy metal materials include platinum, tungsten, tantalum, PtAu, and BiCu. In other embodiments,SHE layer 404 comprises a topological insulator, such as BiSb, Bi2Se3, Bi2Te3 or Sb2Te3. In particular embodiments,SHE layer 404 comprises BiSb with (012) orientation, which is a narrow gap topological insulator with both giant spin Hall effect and high electrical conductivity. In embodiments,SHE layer 404 may include a single material layer or may include a multi-layer structure. -
MTJ 402 includes a pinnedlayer 410, afree layer 412, and atunnel barrier 414 positioned between pinnedlayer 410 andfree layer 412.Tunnel barrier 414 is an insulating layer, such as MgO or other insulating material. Pinnedlayer 410 is a ferromagnetic layer with a fixed magnetization direction.Free layer 412 is a ferromagnetic layer and has a magnetization direction that can be switched. In an embodiment, MRAMnon-volatile memory cell 400 has a first terminal TA coupled to a first end ofSHE layer 404, a second terminal TB coupled to a second end ofSHE layer 404, and a third terminal TC coupled to pinnedlayer 410. - Pinned
layer 410 is usually a synthetic antiferromagnetic layer which includes several magnetic and non-magnetic layers, but for the purpose of this illustration is depicted as asingle layer 410 with fixed magnetization direction. Pinnedlayer 410 andfree layer 412 each have a perpendicular magnetization direction. - Conducting an electrical current 416 from first terminal TA to second terminal TB of
SHE layer 404 results in a spin current that exerts a spin orbit torque onmagnetic assist layer 406. The spin orbit torque causes the magnetization direction ofmagnetic assist layer 406 to oscillate around the axis normal to the stack film plane. Terminating electrical current 416, turns OFF the SHE-generated spin current, and the magnetization direction ofmagnetic assist layer 406 stops oscillating. As in the embodiment ofFIG. 2 , the oscillation of the magnetization direction ofmagnetic assist layer 406 can be selectively controlled by selectively applying current 416 from first terminal TA to second terminal TB ofSHE layer 404. - Without wanting to be bound by any particular theory, it is believed that by selectively controlling the oscillation of the magnetization direction of
magnetic assist layer 406, the spin transfer torque frommagnetic assist layer 406 advantageously may be used during a first portion of a write operation to “kick”free layer 412 into precession. During a subsequent second portion of the write operation, the oscillation of the magnetization direction ofmagnetic assist layer 406 may be halted, when the spin transfer torque frommagnetic assist layer 406 would otherwise act to drag the magnetization direction offree layer 412 back to the in-plane direction. - An
example memory system 500 that can implement the described technology.FIG. 5A depicts an embodiment of amemory system 500 and ahost 502.Memory system 500 may include a non-volatile storage system interfacing with host 502 (e.g., a mobile computing device). In some cases,memory system 500 may be embedded withinhost 502. In other cases,memory system 500 may include a memory card. - As depicted,
memory system 500 includes amemory chip controller 504 and amemory chip 506. Although asingle memory chip 506 is depicted,memory system 500 may include more than one memory chip (e.g., four, eight or some other number of memory chips).Memory chip controller 504 may receive data and commands fromhost 502 and provide data to host 502. -
Memory chip controller 504 may include one or more state machines, page registers, SRAM, decoders, sense amplifiers, and control circuitry for controlling the operation ofmemory chip 506. The one or more state machines, page registers, SRAM, and control circuitry for controlling the operation ofmemory chip 506 may be referred to as managing or control circuits. The managing or control circuits may facilitate one or more memory operations, such as programming, reading (or sensing) and erasing operations. - In some embodiments, the managing or control circuits (or a portion of the managing or control circuits) that facilitate one or more memory array operations, including programming, reading, and erasing operations, may be integrated within
memory chip 506. In some embodiments, the managing or control circuits may include an on-chip memory controller for determining row and column address, bit line, source line and word line addresses, memory array enable signals, and data latching signals. -
Memory chip controller 504 andmemory chip 506 may be arranged on a single integrated circuit. In other embodiments,memory chip controller 504 andmemory chip 506 may be arranged on different integrated circuits. In some cases,memory chip controller 504 andmemory chip 506 may be integrated on a system board, logic board, or a PCB. -
Memory chip 506 includes memorycore control circuits 508 and amemory core 510. In an embodiment, memorycore control circuits 508 include circuits that generate row and column addresses for selecting memory blocks (or arrays) withinmemory core 510, and generating voltages to bias a particular memory array into a read or a write state. -
Memory chip controller 504 controls operation ofmemory chip 506. In an embodiment, oncememory chip controller 504 initiates a memory operation (e.g., read, write, or multiply), memorycore control circuits 508 generate the appropriate bias voltages for bit lines, source lines and/or word lines withinmemory core 510, and generates the appropriate memory block, row, and column addresses to perform memory operations. - In an embodiment,
memory core 510 includes one or more arrays of non-volatile memory cells. In an embodiment,memory core 510 includes one or more arrays of MRAM non-volatile memory cells, such as any of the MRAM non-volatile memory cells described above.Memory core 510 may include one or more two-dimensional or three-dimensional arrays of MRAM non-volatile memory cells. - In an embodiment, memory
core control circuits 508 andmemory core 510 are arranged on a single integrated circuit. In other embodiments, memory core control circuits 508 (or a portion of memory core control circuits 508) andmemory core 510 may be arranged on different integrated circuits. - In an embodiment,
memory core 510 includes a three-dimensional memory array of MRAM non-volatile memory cells in which multiple memory levels are formed above a single substrate, such as a wafer. The memory structure may include MRAM non-volatile memory that is monolithically formed in one or more physical levels of arrays of non-volatile memory cells having an active area disposed above a silicon (or other type of) substrate. -
FIG. 5B depicts an embodiment of memorycore control circuits 508. As depicted, memorycore control circuits 508 includeaddress decoders 520,voltage generators 522, read/write circuit 524, and transfer data latch 526. In an embodiment, addressdecoders 520 generate memory block addresses, as well as row addresses and column addresses for a particular memory block. In an embodiment, voltage generators (or voltage regulators) 522 generate voltages for control lines. - Read/
write circuit 524 includes circuitry for reading and writing non-volatile memory cells inmemory core 510. In an embodiment, transfer data latch 526 is used for intermediate storage between memory chip controller 504 (FIG. 5A ) and non-volatile memory cells. In an embodiment, transfer data latch 526 has a size equal to a size of a page. - In an embodiment, when
host 502 instructsmemory chip controller 504 to write data tomemory chip 506,memory chip controller 504 writes a page of host data to transfer data latch 526. Read/write circuit 524 then writes data from transfer data latch 526 to a specified page of non-volatile memory cells. - In an embodiment, when
host 502 instructsmemory chip controller 504 to read data frommemory chip 506, read/write circuit 524 reads from a specified page of non-volatile memory cells into transfer data latch 526, andmemory chip controller 504 transfers the read data from transfer data latch 526 to host 502. - In a read operation, after a read voltage is applied the MRAM memory cell current may be sensed and compared with a reference current to determine which state the memory cell is in. For example, the magnitude of the read voltage may be compared to a reference current to delineate between the two states.
-
FIG. 5C depicts further details of an embodiment ofvoltage generator circuits 522, which includes voltage generators for selectedcontrol lines 522 a, voltage generators forunselected control lines 522 b, and signal generators forreference signals 522 c. Control lines may include bit lines, source lines and word lines, or a combination of bit lines, source lines and word lines. - Voltage generators for selected
control lines 522 a may be used to generate program and/or read voltages. Voltage generators forunselected control lines 522 b may be used to generate voltages for control lines that are connected to memory cells that are not selected for a program or read operation. Signal generators forreference signals 522 c may be used to generate reference signals (e.g., currents, voltages) to be used as a comparison signal to determine the physical state of a memory cell. - One embodiment includes an apparatus including a magnetic tunnel junction, a magnetic assist layer coupled to the magnetic tunnel junction, a non-magnetic layer disposed between the free layer and the magnetic assist layer, and a spin Hall effect layer coupled to the magnetic assist layer. The magnetic tunnel junction includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane. The magnetic assist layer includes a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane.
- One embodiment includes a method including applying for a first time interval a first voltage pulse across a first terminal and a second terminal of a spin Hall effect layer that is coupled to a stack including a magnetic assist layer, a non-magnetic layer and a magnetic tunnel junction that includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane, the magnetic assist layer including a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane, applying for a second time interval a second voltage pulse across the second terminal and a third terminal coupled to the magnetic tunnel junction, the second time interval longer than the first time interval, and the first time interval overlapping a portion of the second time interval, and switching the magnetization direction of the free layer.
- One embodiment includes an MRAM non-volatile memory cell including a spin Hall effect layer, a magnetic tunnel junction that includes a free layer in a plane, the free layer including a switchable magnetization direction perpendicular to the plane, and a magnetic assist layer disposed between the spin Hall effect layer and the magnetic tunnel junction, the magnetic assist layer including a magnetization direction parallel to the plane and free to rotate about an axis perpendicular to the plane. The spin Hall effect layer is configured to turn ON and turn OFF torque provided by the magnetic assist layer to assist switching the magnetization direction of the free layer.
- For purposes of this document, reference in the specification to “an embodiment,” “one embodiment,” “some embodiments,” or “another embodiment” may be used to describe different embodiments or the same embodiment.
- For purposes of this document, a connection may be a direct connection or an indirect connection (e.g., via one or more other parts). In some cases, when an element is referred to as being connected or coupled to another element, the element may be directly connected to the other element or indirectly connected to the other element via intervening elements. When an element is referred to as being directly connected to another element, then there are no intervening elements between the element and the other element. Two devices are “in communication” if they are directly or indirectly connected so that they can communicate electronic signals between them.
- For purposes of this document, the term “based on” may be read as “based at least in part on.”
- For purposes of this document, without additional context, use of numerical terms such as a “first” object, a “second” object, and a “third” object may not imply an ordering of objects, but may instead be used for identification purposes to identify different objects.
- For purposes of this document, the term “set” of objects may refer to a “set” of one or more of the objects.
- The foregoing detailed description has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the proposed technology and its practical application, to thereby enable others skilled in the art to best utilize it in various embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope be defined by the claims appended hereto.
Claims (20)
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