US20210358797A1 - Floating pin for substrate transfer - Google Patents
Floating pin for substrate transfer Download PDFInfo
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- US20210358797A1 US20210358797A1 US16/875,750 US202016875750A US2021358797A1 US 20210358797 A1 US20210358797 A1 US 20210358797A1 US 202016875750 A US202016875750 A US 202016875750A US 2021358797 A1 US2021358797 A1 US 2021358797A1
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- substrate support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Definitions
- Embodiments of the present disclosure generally relate to methods and apparatuses for processing semiconductor substrates. More particularly, embodiments of the disclosure relate lift pin assemblies for positioning a substrate relative to a substrate support.
- a cluster tool can include a physical vapor deposition (PVD) configured to perform a PVD process on a substrate, an atomic layer deposition (ALD) chamber configured to perform an ALD process on a substrate, a chemical vapor deposition (CVD) chamber configured to perform a CVD process on a substrate, etc., and/or one or more other processing chambers, e.g., a preclean process chamber.
- PVD physical vapor deposition
- ALD atomic layer deposition
- CVD chemical vapor deposition
- the cluster tool can include a robot to move the substrate(s) to/from the various processing chambers, buffer chambers and/or load locks coupled to the mainframe of the cluster tool.
- Lift pins are used for transferring a substrate from a robot arm onto the substrate support.
- Such process gas leakage may impact a thermal contact resistance between a substrate and a substrate support on which the substrate is deposited, leading to improper and non-uniform chucking of the substrate to the substrate support during substrate processing.
- Existing lift pins are enabled only to transfer a substrate to a substrate support without providing any type of sealing to avoid process gas leakage.
- Embodiments described herein provide a floating pin for positioning a substrate relative to a substrate support.
- a floating pin includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
- Embodiments described herein also provide a lift pin assembly for positioning a substrate relative to a substrate support.
- a lift pin assembly includes a floating pin having a pin head and a shaft, and a lift pin configured to contact an end of the shaft opposite the pin head and move the shaft through a guide hole in the substrate support.
- the pin head includes a top surface and a flat shoulder surface disposed between the top surface and the shaft, and the flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
- a processing system includes a substrate support having a guide hole therethrough and a lift pin assembly.
- the guide hole includes a seating portion and a guide portion.
- the seating portion includes a flat shoulder surface between a front-side surface of the substrate support and the guide portion.
- a lift pin assembly includes a floating pin having a pin head configured to be seated in the seating portion and a shaft configured to move through the guide portion.
- a lift pin is configured to contact an end of the shaft opposite the pin head and move the floating pin through the guide hole in the substrate support.
- the pin head includes a top surface and a flat shoulder surface disposed between the top surface and the shaft, and the flat shoulder surface of the pin head is configured to be seated on the flat shoulder surface of the seating portion and seal the guide hole of the substrate support.
- FIG. 1 is a top plan view of a system according to one embodiment.
- FIG. 2 is a cross-sectional view of a processing system according to one embodiment.
- FIG. 3 is a schematic view of a floating pin according to one embodiment.
- FIG. 4 is a schematic view of a floating pin according to one embodiment.
- FIG. 5 is a schematic view of a floating pin according to one embodiment.
- FIG. 6 is a schematic view of a floating pin according to one embodiment.
- Embodiments of apparatus and systems for substrate processing are provided herein. Particularly, some embodiments are directed to a lift pin assembly that includes a floating pin and a lift pin that moves the floating pin through a guide hole of a substrate support.
- the floating pin described below includes a pin head having a flat shoulder that is seated on a recessed surface of the substrate support and seals the guide hole of the substrate support. This sealing prevents gas leakage through the guide hole and thus maintains the process pressure within a processing chamber.
- the pin head also has a countersunk portion above the flat shoulder surface and provides further sealing of the guide hole.
- FIG. 1 is a top plan view of a system 100 in accordance with at least some embodiments of the disclosure.
- the system 100 includes a front-end module 110 , an interface module 120 , and a pair of load locks 130 (hereinafter referred to as the load locks 130 ).
- the system also includes a buffer (or vacuum transfer) chamber 140 and a plurality (e.g., three) of multi environment chambers 150 a - 150 c including a plurality of processing chambers 160 a - 160 d (hereinafter the processing chambers 160 ), and/or enclosed areas 170 a and 170 b (hereinafter the enclosed areas 170 ).
- a buffer (or vacuum transfer) chamber 140 and a plurality (e.g., three) of multi environment chambers 150 a - 150 c including a plurality of processing chambers 160 a - 160 d (hereinafter the processing chambers 160 ), and/or enclosed areas 170 a and 170 b (hereinafter the enclosed areas 170
- FIG. 2 depicts a cross-sectional view of a processing system 200 that includes any processing chamber described above with respect to FIG. 1 .
- the processing system 200 generally comprises a chamber body 202 coupled to a gas source 204 .
- the chamber body 202 is typically a unitary machined structure fabricated from a rigid block of material such as aluminum.
- Within the chamber body 202 is a showerhead 206 and a substrate support assembly 210 .
- the showerhead 206 is coupled to the upper surface or lid of the chamber body 202 and provides a uniform flow of gas from the gas source 204 that is dispersed over a substrate 208 positioned on a substrate support assembly 210 .
- the substrate support assembly 210 generally includes a substrate support 212 and a stem 214 .
- the stem 214 positions the substrate support 212 within the chamber body 202 .
- a substrate 208 is placed upon the substrate support 212 during processing.
- the substrate support 212 may be a susceptor, a heater, an electrostatic chuck or a vacuum chuck.
- the substrate support 212 is fabricated from a material selected from ceramic, aluminum, stainless steel, and combinations thereof.
- the substrate support 212 has a plurality of guide holes 216 disposed therethrough. Each guide hole 216 , or alternatively an inner passage of a guide bushing disposed within the guide hole 216 (such as a through-hole 306 in a bush mechanism 304 shown in FIG. 3 ) accommodates a floating pin 218 of a lift pin assembly 220 .
- the lift pin assembly 220 interacts with the substrate support 212 to position the substrate 208 relative to the substrate support 212 .
- the lift pin assembly 220 includes the floating pins 218 , a lift plate 222 with a lift pin 224 disposed thereon, a stem 226 connected to the lift plate 222 , and a lifting mechanism 228 , such as an actuator, for controlling the elevation of the lift plate 222 .
- the elevation of the stem 226 is controlled by the lifting mechanism 228 .
- the lifting mechanism 228 may be a pneumatic cylinder, hydraulic cylinder, lead screw, solenoid, stepper motor, or other motion device that is typically positioned outside of the chamber body 202 and adapted to move the stem 226 .
- the lift pin 224 mounted on the lift plate 222 contacts the lower end of the floating pin 218 to move the floating pin 218 through the guide hole 216 of the substrate support 212 .
- the upper end of the floating pin 218 exits the guide hole 216 of the substrate support 212 and lift the substrate 208 into a spaced-apart relation relative to the front-side surface 212 a of the substrate support 212 .
- the floating pin 218 is typically formed of ceramic, stainless steel, aluminum, aluminum nitride, aluminum oxide, sapphire, or other suitable material.
- the floating pin 218 is formed of aluminum nitride (AlN).
- AlN aluminum nitride
- Floating pins formed of AIN improves lift pin thermal dissipation capacity due to its higher thermal conductivity.
- the floating pins 218 may be AlN containing yttrium oxide (Y 2 O 3 ) of about 2 wt % to about 5 wt % to further enhance the thermal conductivity.
- a cylindrical outer surface of the floating pin 218 may additionally be treated to reduce friction and surface wear.
- the cylindrical outer surface of the floating pin 218 may be plated, plasma flame sprayed, or electropolished to reduce friction, alter the surface hardness, improve smoothness, or improve resistance to scratching and corrosion.
- the lift pins 224 may be formed of stainless steel (SST).
- FIG. 3 illustrates a telescopic floating pin 302 that may be used as the floating pins 218 in FIG. 2 .
- a bush mechanism 304 is fitted at least partially in the guide hole 216 of the substrate support 212 and bonded to a back-side surface 212 b of the substrate support 212 .
- the bush mechanism 304 has a through-hole 306 .
- the bush mechanism 304 may be made of ceramic.
- the telescopic pin 302 has a pin head 308 and a shaft 310 .
- the pin head 308 has a rounded tip 312 , which contacts a substrate 208 when the telescopic floating pin 302 is pushed up to lift the substrate 208 .
- the pin head 308 has a larger lateral diameter than the shaft 310 .
- the shaft 310 extends through the through-hole 306 of the bush mechanism 304 .
- the telescopic floating pin 302 has a beveled surface 314 from the pin head 308 to the shaft 310
- the bush mechanism 304 has an insert portion 318 and a flange portion 320 .
- the insert portion 318 is inserted into the guide hole 216 of the substrate support 212 from the back-side surface 212 b of the substrate support 212 , and the flange portion 320 contacts (and forms a seal with) the back-side surface 212 b of the substrate support 212 .
- the bush mechanism 304 may be secured to the substrate support 212 by, for example, screws through the flange portion 320 screwed into the substrate support 212 .
- the exterior sidewall surface of the insert portion 318 can contact a sidewall surface of the guide hole 216 , although some gap therebetween may occur.
- the insert portion 318 also has a beveled surface 316 extending from the exterior sidewall surface of the insert portion 318 to an interior sidewall surface of the through-hole 306 of the bush mechanism 304 .
- the beveled surface 316 of the insert portion 318 generally corresponds with the beveled surface 314 of the telescopic floating pin 302 . In a retracted position when a substrate 208 rests on the front-side surface 212 a of the substrate support 212 , the two beveled surfaces 314 , 316 mate.
- the corresponding lift pin 224 is not providing a lifting force to the telescopic floating pin 302 and may be separated from the telescopic floating pin 302 .
- no force other than a gravitational force is acting on the telescopic floating pin 302 .
- the gravitational force causes the telescopic floating pin 302 to be retracted such that the beveled surface 314 of the telescopic floating pin 302 is seated on and mates with the beveled surface 316 of the insert portion 318 of the bush mechanism 304 . This creates a seal as described above.
- the rounded tip 312 is entirely below a surface of the substrate support 212 on which a substrate 208 can rest.
- the lifting mechanism 228 elevates the lift plate 222 on which the lift pin 224 is disposed, which causes the lift pin 224 to enter an internal cut-out 322 and move upward in direction 324 . Further upward movement of the lift pin 224 provides an upward force to the telescopic floating pin 302 such that the pin head 308 of the telescopic floating pin 302 exits the guide hole 216 of the substrate support 212 .
- Extension of the telescopic floating pin 302 above the front-side surface 212 a of the substrate support 212 causes the rounded tip 312 to contact a backside surface of the substrate 208 and lift the substrate 208 from the front-side surface 212 a of the substrate support 212 .
- the lifting mechanism 228 moves the lift plate 222 downward, which causes the lift pins 224 to move downward.
- Downward movement of the lift pin 224 removes the previously applied upward force to the telescopic floating pin 302 such that the gravitational force acting on the telescopic floating pin 302 causes the telescopic floating pin 302 to return to the retracted position, where the beveled surface of the telescopic floating pin 302 is seated on and mates with the beveled surface of the insert portion 318 of the bush mechanism 304 .
- floating pins 218 use surfaces of the guide hole 216 recessed from the front-side surface 212 a of the substrate support 212 to form a seal with the floating pin 218 .
- a bush mechanism 304 may be omitted.
- Various configurations of mating surfaces that form a seal and various configurations of a head of the floating pin 218 are described below. Any aspect of these configurations can be combined with any other aspect of another configuration.
- a person having ordinary skill in the art will readily envision modifications and combinations that can be achieved and are contemplated within the scope of other examples.
- FIG. 4 illustrates an example floating pin 402 that may be used as the floating pins 218 in FIG. 2 .
- the floating pin 402 has a countersunk pin head 408 and a shaft 410 .
- the countersunk pin head 408 has a top surface 412 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces.
- the countersunk pin head 408 contacts a substrate 208 when the floating pin 402 is pushed up to lift the substrate 208 .
- the top surface 412 of the countersunk pin head 408 has a larger lateral diameter than the shaft 410 of the floating pin 402 .
- the countersunk pin head 408 has a beveled surface 414 extending from the top surface 412 of the countersunk pin head 408 to the shaft 410 of the floating pin 402 .
- the guide hole 216 of the substrate support 212 includes a seating portion (also referred to as an opening of the substrate support 212 ) 216 a that accommodates the countersunk pin head 408 , and a guide portion 216 b that accommodates the shaft 410 .
- the seating portion 216 a has a beveled surface 416 extending from the front-side surface 212 a of the substrate support 212 to an interior sidewall surface of the guide portion 216 b of the guide hole 216 .
- the beveled surface 416 may be a result of countersinking the guide hole 216 .
- the beveled surface 416 of the seating portion 216 a generally corresponds with the beveled surface 414 of the countersunk pin head 408 .
- the two beveled surfaces 414 , 416 mate.
- the mating of the two beveled surfaces 414 , 416 creates a seal through the guide hole 216 , which reduces gas leakage and particle contamination through the substrate support 212 during processing.
- the floating pin 402 can be caused to be in a retracted position and can be caused to extend from the surface of the substrate support 212 like described above with respect to the telescopic floating pin 302 of FIG. 3 .
- FIG. 5 illustrates an example floating pin 502 that may be used as the floating pins 218 in FIG. 2 .
- the floating pin 502 has a shoulder pin head 508 and a shaft 510 .
- the shoulder pin head 508 has a top surface 512 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces.
- the shoulder pin head 508 contacts a substrate 208 when the floating pin 502 is pushed up to lift the substrate 208 .
- the shoulder pin head 508 has a larger lateral diameter than the shaft 510 of the floating pin 502 .
- the shaft 510 extends through the guide hole 216 of the substrate support 212 .
- the shoulder pin head 508 has a flat shoulder surface 514 from the exterior edges of the shoulder pin head 508 to the shaft 510 of the floating pin 502 .
- the guide hole 216 of the substrate support 212 includes a seating portion 216 a that accommodates the shoulder pin head 508 , and a guide portion 216 b that accommodates the shaft 510 .
- the seating portion 216 a has a flat shoulder surface 516 recessed below the front-side surface 212 a of the substrate support 212 . This flat shoulder surface 516 is also referred to as a recessed surface of the substrate support 212 .
- the flat shoulder surface 516 of the seating portion 216 a generally corresponds with the flat shoulder surface 514 of the shoulder pin head 508 . In a retracted position, the two flat shoulder surfaces 514 , 516 mate. The mating of the two flat shoulder surfaces 514 , 516 creates a seal through the guide hole 216 , which reduces gas leakage and particle contamination through the substrate support 212 during processing.
- the seating portion 216 a of the guide hole 216 has a diameter larger than a diameter of the shoulder pin head 508 such that the shoulder pin head 508 does not touch the interior sidewall surface of the seating portion 216 a even when the floating pin 502 moves upward and downward slightly tilted with respect to the guide hole 216 .
- the guide portion 216 b of the guide hole 216 has a diameter larger than a diameter of the shaft 510 to allow movement of the shaft 510 through the guide portion 216 b .
- a clearance between the shaft 510 and the interior sidewall surface of the guide portion 216 b is sealed by the flat shoulder surface 514 of the shoulder pin head 508 , since the flat shoulder surface 514 has a large enough diameter to cover the clearance.
- the gravitational force causes the floating pin 502 to be retracted such that the shoulder pin head 508 is positioned within the seating portion 216 a and the flat shoulder surface 514 of the shoulder pin head 508 is seated against the flat shoulder surface 516 of the seating portion 216 a of the guide hole 216 .
- a dead weight 522 is added at the lower end (i.e., on the opposite side of the shoulder pin head 508 ) of the shaft 510 .
- the dead weight 622 may be made of Stainless Steel 316 (SS 316 ) and weigh between about 13 g and about 20 g.
- the flat shoulder surface 516 of the seating portion 216 a of the guide hole 216 has a diameter of between about 10.6 mm and about 10.8 mm, such as about 10.8 mm, and the guide portion 216 b of the guide hole 216 has a diameter of between about 3.95 mm and about 4.05 mm, such as about 4 mm.
- the flat shoulder surface 514 of the shoulder pin head 518 has a diameter of between about 8.9 mm and about 9.1 mm, such as about 9 mm, and the shaft 510 of the floating pin 502 has a diameter of between about 3.225 mm and about 3.285 mm, such as about 3.25 mm, allowing a clearance to the interior sidewall surface of the guide portion 216 b of the guide hole 216 of between about 0.3 mm and about 0.4 mm, such as about 0.34 mm.
- the floating pin 502 can be caused to be in a retracted position and can be caused to extend from the surface of the substrate support 212 like described above with respect to the telescopic floating pin 302 of FIG. 3 .
- FIG. 6 illustrates an example floating pin 602 that may be used as the floating pins 218 in FIG. 2 .
- the floating pin 602 has a shouldered countersunk pin head 608 and a shaft 610 .
- the shouldered countersunk pin head 608 has a top surface 612 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces.
- the shouldered countersunk pin head 608 contacts a substrate 208 when the floating pin 602 is pushed up to lift the substrate 208 .
- the shouldered countersunk pin head 608 includes a shoulder portion 618 and a countersunk portion 620 .
- the top surface 612 of the shouldered countersunk pin head 608 has a larger lateral diameter than the shoulder portion 618 , and the shoulder portion 618 has a larger lateral diameter of the shaft 610 of the floating pin 602 .
- the shoulder portion 618 of the shouldered countersunk pin head 608 has a flat shoulder surface 614 a extending from the shaft 610 of the floating pin 602 to the exterior sidewall surface of the shoulder portion 618 of the shouldered countersunk pin head 608 .
- the countersunk portion 620 of the shouldered countersunk pin head 608 has a beveled surface 614 b extending from the exterior surface of the shoulder portion 618 to the top surface 612 of the shouldered countersunk pin head 608 .
- the guide hole 216 of the substrate support 212 includes a seating portion 216 a that accommodates the shouldered countersunk pin head 608 , and a guide portion 216 b that accommodates the shaft 610 .
- the seating portion 216 a includes a flat shoulder surface 616 a recessed below the front-side surface 212 a of the substrate support 212 . This flat shoulder surface 616 a is also referred to as a recessed surface of the substrate support 212 .
- the seating portion 216 a further includes a beveled surface 616 b between the flat shoulder surface 616 a and the front-side surface 212 a of the substrate support 212 . This beveled surface 616 b is also referred to as a beveled surface of the substrate support 212 .
- the beveled surface 616 b of the seating portion 216 a generally corresponds with the beveled surface 614 b of the countersunk portion 620 of the shouldered countersunk pin head 608 .
- the flat shoulder surface 616 a of the seating portion 216 a generally corresponds with the flat shoulder surface 614 a of the shoulder portion 618 of the shouldered countersunk pin head 608 . In a retracted position, the two beveled surfaces 614 b , 616 b and/or the two flat shoulder surfaces 614 a , 616 a mate.
- the mating of the two beveled surfaces 614 b , 616 b and/or the two flat shoulder surfaces 614 a , 616 a creates a seal through the guide hole 216 , which reduces gas leakage and particle contamination through the substrate support 212 during processing.
- the seating portion 216 a of the guide hole 216 has a diameter larger than a diameter of the shouldered countersunk pin head 608 such that the shouldered countersunk pin head 608 does not touch the interior sidewall surface of the seating portion 216 a even when the floating pin 602 moves upward and downward slightly tilted with respect to the guide hole 216 .
- the guide portion 216 b of the guide hole 216 has a diameter larger than a diameter of the shaft 610 to allow movement of the shaft 610 through the guide portion 216 b .
- a clearance between the shaft 610 and the interior sidewall surface of the guide portion 216 b is sealed by the flat shoulder surface 614 a of the shoulder portion 618 of the shouldered countersunk pin head 608 , since the flat shoulder surface 614 a has a large enough diameter to cover the clearance.
- the beveled surface 614 b of the countersunk portion 620 of the shouldered countersunk pin head 608 provides further sealing of the clearance between the shaft 610 and the interior sidewall surface of the guide portion 216 b.
- the gravitational force causes the floating pin 602 to be retracted such that the shouldered countersunk pin head 608 is positioned within the seating portion 216 a and the flat shoulder surface 614 a of the shoulder portion 618 of the shouldered countersunk pin head 608 is seated against the flat shoulder surface 616 a of the seating portion 216 a of the guide hole 216 .
- a dead weight 622 is added at the lower end (i.e., on the opposite side of the shouldered countersunk pin head 608 ) of the shaft 610 .
- the dead weight 622 may be made of Stainless Steel 316 (SS 316) and weigh between about 13 g and about 20 g.
- the seating portion 216 a of the guide hole 216 at the front-side surface 212 a of the substrate support 212 has a diameter of between about 12.6 mm and about 12.8 mm, such as about 12.7 mm.
- the flat shoulder surface 616 of the seating portion 216 a of the guide hole 216 has a diameter of between about 10.6 mm and about 10.8 mm, such as about 10.8 mm, and the guide portion 216 b of the guide hole 216 has a diameter of between about 3.95 mm and about 4.05 mm, such as about 4 mm.
- the top surface 612 of the shouldered countersunk pin head 608 has a diameter of between about 11.1 mm and about 11.2 mm, such as about 11.2 mm.
- the flat shoulder surface 614 a of the shoulder portion 618 of the shouldered countersunk pin head 608 has a diameter of between about 8.9 mm and about 9.1 mm, such as about 9 mm, and the shaft 610 of the floating pin 602 has a diameter of between about 3.225 mm and about 3.285 mm, such as about 3.25 mm, allowing a clearance to the interior sidewall surface of the guide portion 216 b of the guide hole 216 of between about 0.3 mm and about 0.4 mm, such as about 0.34 mm.
- the floating pin 602 can be caused to be in a retracted position and can be caused to extend from the surface of the substrate support 212 like described above with respect to the telescopic floating pin 302 of FIG. 3 .
- Benefits of the present disclosure include an improved floating pin for positioning a substrate relative to a substrate support in a substrate processing system.
- the floating pin has a flat shoulder surface that is seated on a recessed surface of the substrate support and seal a guide hole formed to guide the floating pin in the substrate support. This sealing prevents gas leak from the guide hole and thus maintains the pressure within the substrate processing system.
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Abstract
A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
Description
- Embodiments of the present disclosure generally relate to methods and apparatuses for processing semiconductor substrates. More particularly, embodiments of the disclosure relate lift pin assemblies for positioning a substrate relative to a substrate support.
- Conventional semiconductor substrate processing tools (e.g., a cluster tool) are configured to perform one or more processes during substrate processing. For example, a cluster tool can include a physical vapor deposition (PVD) configured to perform a PVD process on a substrate, an atomic layer deposition (ALD) chamber configured to perform an ALD process on a substrate, a chemical vapor deposition (CVD) chamber configured to perform a CVD process on a substrate, etc., and/or one or more other processing chambers, e.g., a preclean process chamber. The cluster tool can include a robot to move the substrate(s) to/from the various processing chambers, buffer chambers and/or load locks coupled to the mainframe of the cluster tool.
- While such semiconductor substrate processing tools (i.e., cluster tools) are suitable for processing a substrate or multiple substrates, a process gas leaks from a substrate support that has guide holes to accommodate lift pins. Lift pins are used for transferring a substrate from a robot arm onto the substrate support. Such process gas leakage may impact a thermal contact resistance between a substrate and a substrate support on which the substrate is deposited, leading to improper and non-uniform chucking of the substrate to the substrate support during substrate processing. Existing lift pins are enabled only to transfer a substrate to a substrate support without providing any type of sealing to avoid process gas leakage.
- Therefore, there is a need in the art for lift pins that transfer a substrate to a substrate support and provide sealing to reduce process gas leakage through the substrate support.
- Embodiments described herein provide a floating pin for positioning a substrate relative to a substrate support. A floating pin includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
- Embodiments described herein also provide a lift pin assembly for positioning a substrate relative to a substrate support. A lift pin assembly includes a floating pin having a pin head and a shaft, and a lift pin configured to contact an end of the shaft opposite the pin head and move the shaft through a guide hole in the substrate support. The pin head includes a top surface and a flat shoulder surface disposed between the top surface and the shaft, and the flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
- Embodiments described herein also provide a processing system. A processing system includes a substrate support having a guide hole therethrough and a lift pin assembly. The guide hole includes a seating portion and a guide portion. The seating portion includes a flat shoulder surface between a front-side surface of the substrate support and the guide portion. A lift pin assembly includes a floating pin having a pin head configured to be seated in the seating portion and a shaft configured to move through the guide portion. A lift pin is configured to contact an end of the shaft opposite the pin head and move the floating pin through the guide hole in the substrate support. The pin head includes a top surface and a flat shoulder surface disposed between the top surface and the shaft, and the flat shoulder surface of the pin head is configured to be seated on the flat shoulder surface of the seating portion and seal the guide hole of the substrate support.
- So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, and may admit to other equally effective embodiments.
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FIG. 1 is a top plan view of a system according to one embodiment. -
FIG. 2 is a cross-sectional view of a processing system according to one embodiment. -
FIG. 3 is a schematic view of a floating pin according to one embodiment. -
FIG. 4 is a schematic view of a floating pin according to one embodiment. -
FIG. 5 is a schematic view of a floating pin according to one embodiment. -
FIG. 6 is a schematic view of a floating pin according to one embodiment. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- Embodiments of apparatus and systems for substrate processing are provided herein. Particularly, some embodiments are directed to a lift pin assembly that includes a floating pin and a lift pin that moves the floating pin through a guide hole of a substrate support. The floating pin described below includes a pin head having a flat shoulder that is seated on a recessed surface of the substrate support and seals the guide hole of the substrate support. This sealing prevents gas leakage through the guide hole and thus maintains the process pressure within a processing chamber. In some embodiments, the pin head also has a countersunk portion above the flat shoulder surface and provides further sealing of the guide hole.
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FIG. 1 is a top plan view of asystem 100 in accordance with at least some embodiments of the disclosure. Thesystem 100 includes a front-end module 110, aninterface module 120, and a pair of load locks 130 (hereinafter referred to as the load locks 130). The system also includes a buffer (or vacuum transfer)chamber 140 and a plurality (e.g., three) of multi environment chambers 150 a-150 c including a plurality of processing chambers 160 a-160 d (hereinafter the processing chambers 160), and/or enclosedareas -
FIG. 2 depicts a cross-sectional view of aprocessing system 200 that includes any processing chamber described above with respect toFIG. 1 . Theprocessing system 200 generally comprises achamber body 202 coupled to agas source 204. Thechamber body 202 is typically a unitary machined structure fabricated from a rigid block of material such as aluminum. Within thechamber body 202 is ashowerhead 206 and asubstrate support assembly 210. Theshowerhead 206 is coupled to the upper surface or lid of thechamber body 202 and provides a uniform flow of gas from thegas source 204 that is dispersed over asubstrate 208 positioned on asubstrate support assembly 210. - The
substrate support assembly 210 generally includes asubstrate support 212 and astem 214. Thestem 214 positions thesubstrate support 212 within thechamber body 202. Asubstrate 208 is placed upon thesubstrate support 212 during processing. Thesubstrate support 212 may be a susceptor, a heater, an electrostatic chuck or a vacuum chuck. Typically, thesubstrate support 212 is fabricated from a material selected from ceramic, aluminum, stainless steel, and combinations thereof. Thesubstrate support 212 has a plurality ofguide holes 216 disposed therethrough. Eachguide hole 216, or alternatively an inner passage of a guide bushing disposed within the guide hole 216 (such as a through-hole 306 in abush mechanism 304 shown inFIG. 3 ) accommodates afloating pin 218 of alift pin assembly 220. - The
lift pin assembly 220 interacts with thesubstrate support 212 to position thesubstrate 208 relative to thesubstrate support 212. Thelift pin assembly 220 includes thefloating pins 218, alift plate 222 with alift pin 224 disposed thereon, astem 226 connected to thelift plate 222, and alifting mechanism 228, such as an actuator, for controlling the elevation of thelift plate 222. The elevation of thestem 226 is controlled by thelifting mechanism 228. Thelifting mechanism 228 may be a pneumatic cylinder, hydraulic cylinder, lead screw, solenoid, stepper motor, or other motion device that is typically positioned outside of thechamber body 202 and adapted to move thestem 226. As thestem 226 and thelift plate 222 connected to thestem 226 are moved upward towards thesubstrate support 212, thelift pin 224 mounted on thelift plate 222 contacts the lower end of thefloating pin 218 to move thefloating pin 218 through theguide hole 216 of thesubstrate support 212. The upper end of thefloating pin 218 exits theguide hole 216 of thesubstrate support 212 and lift thesubstrate 208 into a spaced-apart relation relative to the front-side surface 212 a of thesubstrate support 212. - The floating
pin 218 is typically formed of ceramic, stainless steel, aluminum, aluminum nitride, aluminum oxide, sapphire, or other suitable material. In some embodiments, the floatingpin 218 is formed of aluminum nitride (AlN). Floating pins formed of AIN improves lift pin thermal dissipation capacity due to its higher thermal conductivity. If desired, the floatingpins 218 may be AlN containing yttrium oxide (Y2O3) of about 2 wt % to about 5 wt % to further enhance the thermal conductivity. A cylindrical outer surface of the floatingpin 218 may additionally be treated to reduce friction and surface wear. For example, the cylindrical outer surface of the floatingpin 218 may be plated, plasma flame sprayed, or electropolished to reduce friction, alter the surface hardness, improve smoothness, or improve resistance to scratching and corrosion. The lift pins 224 may be formed of stainless steel (SST). -
FIG. 3 illustrates a telescopic floatingpin 302 that may be used as the floatingpins 218 inFIG. 2 . Abush mechanism 304 is fitted at least partially in theguide hole 216 of thesubstrate support 212 and bonded to a back-side surface 212 b of thesubstrate support 212. Thebush mechanism 304 has a through-hole 306. Thebush mechanism 304 may be made of ceramic. Thetelescopic pin 302 has apin head 308 and ashaft 310. Thepin head 308 has a roundedtip 312, which contacts asubstrate 208 when the telescopic floatingpin 302 is pushed up to lift thesubstrate 208. Thepin head 308 has a larger lateral diameter than theshaft 310. Theshaft 310 extends through the through-hole 306 of thebush mechanism 304. The telescopic floatingpin 302 has abeveled surface 314 from thepin head 308 to theshaft 310. - The
bush mechanism 304 has aninsert portion 318 and a flange portion 320. Theinsert portion 318 is inserted into theguide hole 216 of thesubstrate support 212 from the back-side surface 212 b of thesubstrate support 212, and the flange portion 320 contacts (and forms a seal with) the back-side surface 212 b of thesubstrate support 212. Thebush mechanism 304 may be secured to thesubstrate support 212 by, for example, screws through the flange portion 320 screwed into thesubstrate support 212. The exterior sidewall surface of theinsert portion 318 can contact a sidewall surface of theguide hole 216, although some gap therebetween may occur. - The
insert portion 318 also has abeveled surface 316 extending from the exterior sidewall surface of theinsert portion 318 to an interior sidewall surface of the through-hole 306 of thebush mechanism 304. Thebeveled surface 316 of theinsert portion 318 generally corresponds with thebeveled surface 314 of the telescopic floatingpin 302. In a retracted position when asubstrate 208 rests on the front-side surface 212 a of thesubstrate support 212, the twobeveled surfaces side surface 212 b of thesubstrate support 212 and mating of the twobeveled surfaces guide hole 216, which reduces gas leakage and particle contamination through thesubstrate support 212 and thus maintains the pressure within the processing chamber during processing. - In the retracted position, the
corresponding lift pin 224 is not providing a lifting force to the telescopic floatingpin 302 and may be separated from the telescopic floatingpin 302. In this position, no force other than a gravitational force is acting on the telescopic floatingpin 302. The gravitational force causes the telescopic floatingpin 302 to be retracted such that thebeveled surface 314 of the telescopic floatingpin 302 is seated on and mates with thebeveled surface 316 of theinsert portion 318 of thebush mechanism 304. This creates a seal as described above. In this position, therounded tip 312 is entirely below a surface of thesubstrate support 212 on which asubstrate 208 can rest. - To lift a
substrate 208 from the front-side surface 212 a of thesubstrate support 212, thelifting mechanism 228 elevates thelift plate 222 on which thelift pin 224 is disposed, which causes thelift pin 224 to enter an internal cut-out 322 and move upward in direction 324. Further upward movement of thelift pin 224 provides an upward force to the telescopic floatingpin 302 such that thepin head 308 of the telescopic floatingpin 302 exits theguide hole 216 of thesubstrate support 212. Extension of the telescopic floatingpin 302 above the front-side surface 212 a of thesubstrate support 212 causes therounded tip 312 to contact a backside surface of thesubstrate 208 and lift thesubstrate 208 from the front-side surface 212 a of thesubstrate support 212. - Thereafter, the
lifting mechanism 228 moves thelift plate 222 downward, which causes the lift pins 224 to move downward. Downward movement of thelift pin 224 removes the previously applied upward force to the telescopic floatingpin 302 such that the gravitational force acting on the telescopic floatingpin 302 causes the telescopic floatingpin 302 to return to the retracted position, where the beveled surface of the telescopic floatingpin 302 is seated on and mates with the beveled surface of theinsert portion 318 of thebush mechanism 304. - A number of other examples of floating
pins 218 are described below. Some examples use surfaces of theguide hole 216 recessed from the front-side surface 212 a of thesubstrate support 212 to form a seal with the floatingpin 218. Abush mechanism 304 may be omitted. Various configurations of mating surfaces that form a seal and various configurations of a head of the floatingpin 218 are described below. Any aspect of these configurations can be combined with any other aspect of another configuration. A person having ordinary skill in the art will readily envision modifications and combinations that can be achieved and are contemplated within the scope of other examples. -
FIG. 4 illustrates anexample floating pin 402 that may be used as the floatingpins 218 inFIG. 2 . The floatingpin 402 has a countersunkpin head 408 and ashaft 410. The countersunkpin head 408 has atop surface 412 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces. The countersunkpin head 408 contacts asubstrate 208 when the floatingpin 402 is pushed up to lift thesubstrate 208. Thetop surface 412 of the countersunkpin head 408 has a larger lateral diameter than theshaft 410 of the floatingpin 402. The countersunkpin head 408 has abeveled surface 414 extending from thetop surface 412 of the countersunkpin head 408 to theshaft 410 of the floatingpin 402. - The
guide hole 216 of thesubstrate support 212 includes a seating portion (also referred to as an opening of the substrate support 212) 216 a that accommodates the countersunkpin head 408, and aguide portion 216 b that accommodates theshaft 410. Theseating portion 216 a has abeveled surface 416 extending from the front-side surface 212 a of thesubstrate support 212 to an interior sidewall surface of theguide portion 216 b of theguide hole 216. For example, thebeveled surface 416 may be a result of countersinking theguide hole 216. Thebeveled surface 416 of theseating portion 216 a generally corresponds with thebeveled surface 414 of the countersunkpin head 408. In a retracted position, the twobeveled surfaces beveled surfaces guide hole 216, which reduces gas leakage and particle contamination through thesubstrate support 212 during processing. The floatingpin 402 can be caused to be in a retracted position and can be caused to extend from the surface of thesubstrate support 212 like described above with respect to the telescopic floatingpin 302 ofFIG. 3 . -
FIG. 5 illustrates anexample floating pin 502 that may be used as the floatingpins 218 inFIG. 2 . The floatingpin 502 has ashoulder pin head 508 and ashaft 510. Theshoulder pin head 508 has atop surface 512 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces. Theshoulder pin head 508 contacts asubstrate 208 when the floatingpin 502 is pushed up to lift thesubstrate 208. Theshoulder pin head 508 has a larger lateral diameter than theshaft 510 of the floatingpin 502. Theshaft 510 extends through theguide hole 216 of thesubstrate support 212. Theshoulder pin head 508 has aflat shoulder surface 514 from the exterior edges of theshoulder pin head 508 to theshaft 510 of the floatingpin 502. - The
guide hole 216 of thesubstrate support 212 includes aseating portion 216 a that accommodates theshoulder pin head 508, and aguide portion 216 b that accommodates theshaft 510. Theseating portion 216 a has aflat shoulder surface 516 recessed below the front-side surface 212 a of thesubstrate support 212. Thisflat shoulder surface 516 is also referred to as a recessed surface of thesubstrate support 212. Theflat shoulder surface 516 of theseating portion 216 a generally corresponds with theflat shoulder surface 514 of theshoulder pin head 508. In a retracted position, the two flat shoulder surfaces 514, 516 mate. The mating of the two flat shoulder surfaces 514, 516 creates a seal through theguide hole 216, which reduces gas leakage and particle contamination through thesubstrate support 212 during processing. - The
seating portion 216 a of theguide hole 216 has a diameter larger than a diameter of theshoulder pin head 508 such that theshoulder pin head 508 does not touch the interior sidewall surface of theseating portion 216 a even when the floatingpin 502 moves upward and downward slightly tilted with respect to theguide hole 216. Theguide portion 216 b of theguide hole 216 has a diameter larger than a diameter of theshaft 510 to allow movement of theshaft 510 through theguide portion 216 b. A clearance between theshaft 510 and the interior sidewall surface of theguide portion 216 b is sealed by theflat shoulder surface 514 of theshoulder pin head 508, since theflat shoulder surface 514 has a large enough diameter to cover the clearance. In a case where the centerline of the floatingpin 502 is misaligned (i.e., tilted) with respect to the centerline of theguide hole 216, the gravitational force causes the floatingpin 502 to be retracted such that theshoulder pin head 508 is positioned within theseating portion 216 a and theflat shoulder surface 514 of theshoulder pin head 508 is seated against theflat shoulder surface 516 of theseating portion 216 a of theguide hole 216. In some embodiments, to enhance the retraction of the floatingpin 502 that is misaligned and sealing of the clearance between theshaft 510 and the interior sidewall surface of theguide hole 216, adead weight 522 is added at the lower end (i.e., on the opposite side of the shoulder pin head 508) of theshaft 510. Thedead weight 622 may be made of Stainless Steel 316 (SS 316) and weigh between about 13 g and about 20 g. - In some embodiments, the
flat shoulder surface 516 of theseating portion 216 a of theguide hole 216 has a diameter of between about 10.6 mm and about 10.8 mm, such as about 10.8 mm, and theguide portion 216 b of theguide hole 216 has a diameter of between about 3.95 mm and about 4.05 mm, such as about 4 mm. Theflat shoulder surface 514 of the shoulder pin head 518 has a diameter of between about 8.9 mm and about 9.1 mm, such as about 9 mm, and theshaft 510 of the floatingpin 502 has a diameter of between about 3.225 mm and about 3.285 mm, such as about 3.25 mm, allowing a clearance to the interior sidewall surface of theguide portion 216 b of theguide hole 216 of between about 0.3 mm and about 0.4 mm, such as about 0.34 mm. - The floating
pin 502 can be caused to be in a retracted position and can be caused to extend from the surface of thesubstrate support 212 like described above with respect to the telescopic floatingpin 302 ofFIG. 3 . -
FIG. 6 illustrates anexample floating pin 602 that may be used as the floatingpins 218 inFIG. 2 . The floatingpin 602 has a shouldered countersunkpin head 608 and ashaft 610. The shouldered countersunkpin head 608 has atop surface 612 that includes a flat surface, a rounded surface, a conical surface, the like, or a combination of these surfaces. The shouldered countersunkpin head 608 contacts asubstrate 208 when the floatingpin 602 is pushed up to lift thesubstrate 208. The shouldered countersunkpin head 608 includes ashoulder portion 618 and a countersunkportion 620. Thetop surface 612 of the shouldered countersunkpin head 608 has a larger lateral diameter than theshoulder portion 618, and theshoulder portion 618 has a larger lateral diameter of theshaft 610 of the floatingpin 602. Theshoulder portion 618 of the shouldered countersunkpin head 608 has aflat shoulder surface 614 a extending from theshaft 610 of the floatingpin 602 to the exterior sidewall surface of theshoulder portion 618 of the shouldered countersunkpin head 608. The countersunkportion 620 of the shouldered countersunkpin head 608 has abeveled surface 614 b extending from the exterior surface of theshoulder portion 618 to thetop surface 612 of the shouldered countersunkpin head 608. - The
guide hole 216 of thesubstrate support 212 includes aseating portion 216 a that accommodates the shouldered countersunkpin head 608, and aguide portion 216 b that accommodates theshaft 610. Theseating portion 216 a includes aflat shoulder surface 616 a recessed below the front-side surface 212 a of thesubstrate support 212. Thisflat shoulder surface 616 a is also referred to as a recessed surface of thesubstrate support 212. Theseating portion 216 a further includes abeveled surface 616 b between theflat shoulder surface 616 a and the front-side surface 212 a of thesubstrate support 212. Thisbeveled surface 616 b is also referred to as a beveled surface of thesubstrate support 212. Thebeveled surface 616 b of theseating portion 216 a generally corresponds with thebeveled surface 614 b of the countersunkportion 620 of the shouldered countersunkpin head 608. Theflat shoulder surface 616 a of theseating portion 216 a generally corresponds with theflat shoulder surface 614 a of theshoulder portion 618 of the shouldered countersunkpin head 608. In a retracted position, the twobeveled surfaces beveled surfaces guide hole 216, which reduces gas leakage and particle contamination through thesubstrate support 212 during processing. - The
seating portion 216 a of theguide hole 216 has a diameter larger than a diameter of the shouldered countersunkpin head 608 such that the shouldered countersunkpin head 608 does not touch the interior sidewall surface of theseating portion 216 a even when the floatingpin 602 moves upward and downward slightly tilted with respect to theguide hole 216. Theguide portion 216 b of theguide hole 216 has a diameter larger than a diameter of theshaft 610 to allow movement of theshaft 610 through theguide portion 216 b. A clearance between theshaft 610 and the interior sidewall surface of theguide portion 216 b is sealed by theflat shoulder surface 614 a of theshoulder portion 618 of the shouldered countersunkpin head 608, since theflat shoulder surface 614 a has a large enough diameter to cover the clearance. Thebeveled surface 614 b of the countersunkportion 620 of the shouldered countersunkpin head 608 provides further sealing of the clearance between theshaft 610 and the interior sidewall surface of theguide portion 216 b. - In a case where the centerline of the floating
pin 602 is misaligned (i.e., tilted) with respect to the centerline of theguide hole 216, the gravitational force causes the floatingpin 602 to be retracted such that the shouldered countersunkpin head 608 is positioned within theseating portion 216 a and theflat shoulder surface 614 a of theshoulder portion 618 of the shouldered countersunkpin head 608 is seated against theflat shoulder surface 616 a of theseating portion 216 a of theguide hole 216. In some embodiments, to enhance the retraction of the floatingpin 602 that is misaligned and sealing of the clearance between theshaft 610 and the interior sidewall surface of theguide hole 216, adead weight 622 is added at the lower end (i.e., on the opposite side of the shouldered countersunk pin head 608) of theshaft 610. Thedead weight 622 may be made of Stainless Steel 316 (SS 316) and weigh between about 13 g and about 20 g. - In some embodiments, the
seating portion 216 a of theguide hole 216 at the front-side surface 212 a of thesubstrate support 212 has a diameter of between about 12.6 mm and about 12.8 mm, such as about 12.7 mm. The flat shoulder surface 616 of theseating portion 216 a of theguide hole 216 has a diameter of between about 10.6 mm and about 10.8 mm, such as about 10.8 mm, and theguide portion 216 b of theguide hole 216 has a diameter of between about 3.95 mm and about 4.05 mm, such as about 4 mm. Thetop surface 612 of the shouldered countersunkpin head 608 has a diameter of between about 11.1 mm and about 11.2 mm, such as about 11.2 mm. Theflat shoulder surface 614 a of theshoulder portion 618 of the shouldered countersunkpin head 608 has a diameter of between about 8.9 mm and about 9.1 mm, such as about 9 mm, and theshaft 610 of the floatingpin 602 has a diameter of between about 3.225 mm and about 3.285 mm, such as about 3.25 mm, allowing a clearance to the interior sidewall surface of theguide portion 216 b of theguide hole 216 of between about 0.3 mm and about 0.4 mm, such as about 0.34 mm. - The floating
pin 602 can be caused to be in a retracted position and can be caused to extend from the surface of thesubstrate support 212 like described above with respect to the telescopic floatingpin 302 ofFIG. 3 . - Benefits of the present disclosure include an improved floating pin for positioning a substrate relative to a substrate support in a substrate processing system. The floating pin has a flat shoulder surface that is seated on a recessed surface of the substrate support and seal a guide hole formed to guide the floating pin in the substrate support. This sealing prevents gas leak from the guide hole and thus maintains the pressure within the substrate processing system.
- While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
1. A floating pin for positioning a substrate relative to a substrate support, the floating pin comprising:
a shaft configured to move through a guide hole in a substrate support; and
a pin head comprising a top surface and a flat shoulder surface disposed between the top surface and the shaft,
wherein the flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
2. The floating pin of claim 1 , wherein:
the flat shoulder surface has a diameter of between 8.9 mm and 9.1 mm, and
the shaft has a diameter of between 3.225 mm and 3.285 mm, having a clearance to interior sidewall surface of the guide hole of between 0.3 mm and 0.4 mm.
3. The floating pin of claim 1 , wherein the pin head comprises:
a shoulder portion that includes the flat shoulder surface; and
a countersunk portion that includes the top surface having a larger diameter than the flat shoulder surface, the countersunk portion having a beveled surface extending from an exterior sidewall surface of the shoulder portion to the top surface.
4. The floating pin of claim 3 , wherein:
the flat shoulder surface has a diameter of between 8.9 mm and 9.1 mm,
the top surface has a diameter of between 11.1 mm and 11.2 mm, and
the shaft has a diameter of between 3.225 mm and 3.285 mm, having a clearance to interior sidewall surface of the guide hole of between 0.3 mm and 0.4 mm.
5. The floating pin of claim 1 , wherein the shaft comprises aluminum oxide.
6. The floating pin of claim 1 , further comprising:
a dead weight disposed at an end of the shaft opposite the pin head.
7. The floating pin of claim 6 , wherein the dead weight comprises stainless steel and weighs between 13 g and 20 g.
8. A lift pin assembly for positioning a substrate relative to a substrate support, the lift pin assembly comprising:
a floating pin having a pin head and a shaft; and
a lift pin configured to contact an end of the shaft opposite the pin head and move the shaft through a guide hole in the substrate support, wherein:
the pin head comprises a top surface and a flat shoulder surface disposed between the top surface and the shaft, and
the flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.
9. The lift pin assembly of claim 8 , wherein:
the flat shoulder surface has a diameter of between 8.9 mm and 9.1 mm, and
the shaft has a diameter of between 3.225 mm and 3.285 mm, having a clearance to interior sidewall surface of the guide hole of between 0.3 mm and 0.4 mm.
10. The lift pin assembly of claim 8 , wherein the pin head comprises:
a shoulder portion that includes the flat shoulder surface; and
a countersunk portion that includes the top surface having a larger diameter than the flat shoulder surface, the countersunk portion having a beveled surface extending from an exterior sidewall surface of the shoulder portion to the top surface.
11. The lift pin assembly of claim 10 wherein:
the flat shoulder surface has a diameter of between 8.9 mm and 9.1 mm,
the top surface has a diameter of between 11.1 mm and 11.2 mm, and
the shaft has a diameter of between 3.225 mm and 3.285 mm, having a clearance to interior sidewall surface of the guide hole of between 0.3 mm and 0.4 mm.
12. The lift pin assembly of claim 8 , wherein:
the shaft comprises aluminum oxide, and
the lift pin comprises stainless steel.
13. The lift pin assembly of claim 8 , further comprising:
a dead weight disposed at an end of the shaft opposite the pin head.
14. The lift pin assembly of claim 13 , wherein the dead weight comprises stainless steel and weighs between 13 g and 20 g.
15. A processing system, comprising:
a substrate support having a guide hole therethrough, the guide hole comprising a seating portion and a guide portion, wherein the seating portion comprises a flat shoulder surface between a front-side surface of the substrate support and the guide portion; and
a lift pin assembly comprising:
a floating pin having a pin head configured to be seated in the seating portion and a shaft configured to move through the guide portion; and
a lift pin configured to contact an end of the shaft opposite the pin head and move the floating pin through the guide hole in the substrate support, wherein:
the pin head comprises a top surface and a flat shoulder surface disposed between the top surface and the shaft, and
the flat shoulder surface of the pin head is configured to be seated on the flat shoulder surface of the seating portion and seal the guide hole of the substrate support.
16. The processing system of claim 15 , wherein:
the flat shoulder surface of the pin head has a diameter of between 8.9 mm and 9.1 mm,
the shaft has a diameter of between 3.225 mm and 3.285 mm,
the flat shoulder surface of the seating portion has a diameter of between 10.6 mm and 10.8 mm, and
the guide portion has a diameter of between about 3.95 mm and about 4.05 mm.
17. The processing system of claim 15 , wherein the pin head comprises:
a shoulder portion that includes the flat shoulder surface; and
a countersunk portion that includes the top surface having a larger diameter than the flat shoulder surface, the countersunk portion having a beveled surface extending from an exterior sidewall surface of the shoulder portion to the top surface.
18. The processing system of claim 17 , wherein:
the flat shoulder surface has a diameter of between 8.9 mm and 9.1 mm,
the top surface has a diameter of between 11.1 mm and 11.2 mm,
the shaft has a diameter of between 3.225 mm and 3.285 mm, having a clearance to interior sidewall surface of the guide hole of between 0.3 mm and 0.4 mm,
the flat shoulder surface of the seating portion has a diameter of between 12.6 mm and 12.8 mm, and
the guide portion has a diameter of between about 3.95 mm and about 4.05 mm.
19. The processing system of claim 15 , wherein:
the shaft comprises aluminum oxide, and
the lift pin comprises stainless steel.
20. The processing system of claim 15 , further comprising:
a dead weight disposed at an end of the shaft opposite the pin head, wherein the dead weight comprises stainless steel and weighs between 13 g and 20 g.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/875,750 US20210358797A1 (en) | 2020-05-15 | 2020-05-15 | Floating pin for substrate transfer |
PCT/US2021/026793 WO2021231008A1 (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
CN202180033759.8A CN115516618A (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
US17/923,908 US20230178416A1 (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
KR1020227043488A KR20230008213A (en) | 2020-05-15 | 2021-04-12 | Floating pin for board transfer |
JP2022569223A JP2023525861A (en) | 2020-05-15 | 2021-04-12 | Floating pins for board transfer |
TW110114080A TW202210656A (en) | 2020-05-15 | 2021-04-20 | Floating pin for substrate transfer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/875,750 US20210358797A1 (en) | 2020-05-15 | 2020-05-15 | Floating pin for substrate transfer |
Related Child Applications (1)
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US17/923,908 Continuation US20230178416A1 (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
Publications (1)
Publication Number | Publication Date |
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US20210358797A1 true US20210358797A1 (en) | 2021-11-18 |
Family
ID=78512947
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US16/875,750 Abandoned US20210358797A1 (en) | 2020-05-15 | 2020-05-15 | Floating pin for substrate transfer |
US17/923,908 Pending US20230178416A1 (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US17/923,908 Pending US20230178416A1 (en) | 2020-05-15 | 2021-04-12 | Floating pin for substrate transfer |
Country Status (6)
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US (2) | US20210358797A1 (en) |
JP (1) | JP2023525861A (en) |
KR (1) | KR20230008213A (en) |
CN (1) | CN115516618A (en) |
TW (1) | TW202210656A (en) |
WO (1) | WO2021231008A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP3602324B2 (en) * | 1998-02-17 | 2004-12-15 | アルプス電気株式会社 | Plasma processing equipment |
JP5148955B2 (en) * | 2007-09-11 | 2013-02-20 | 東京エレクトロン株式会社 | Substrate mounting mechanism and substrate processing apparatus |
TWI575103B (en) * | 2011-10-13 | 2017-03-21 | 愛發科股份有限公司 | Vacuum processing apparatus |
KR101432916B1 (en) * | 2013-01-04 | 2014-08-21 | 주식회사 엘지실트론 | Wafer lift apparatus |
KR20160032501A (en) * | 2014-09-16 | 2016-03-24 | 엘아이지인베니아 주식회사 | The apparatus for chucking a substrate and the substrate processing apparatus comprising that |
US10490436B2 (en) * | 2015-11-04 | 2019-11-26 | Applied Materials, Inc. | Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films |
-
2020
- 2020-05-15 US US16/875,750 patent/US20210358797A1/en not_active Abandoned
-
2021
- 2021-04-12 KR KR1020227043488A patent/KR20230008213A/en not_active Application Discontinuation
- 2021-04-12 US US17/923,908 patent/US20230178416A1/en active Pending
- 2021-04-12 CN CN202180033759.8A patent/CN115516618A/en active Pending
- 2021-04-12 WO PCT/US2021/026793 patent/WO2021231008A1/en active Application Filing
- 2021-04-12 JP JP2022569223A patent/JP2023525861A/en active Pending
- 2021-04-20 TW TW110114080A patent/TW202210656A/en unknown
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WO2021231008A1 (en) | 2021-11-18 |
KR20230008213A (en) | 2023-01-13 |
TW202210656A (en) | 2022-03-16 |
JP2023525861A (en) | 2023-06-19 |
CN115516618A (en) | 2022-12-23 |
US20230178416A1 (en) | 2023-06-08 |
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