US20210257168A1 - Keyswitch - Google Patents
Keyswitch Download PDFInfo
- Publication number
- US20210257168A1 US20210257168A1 US17/027,037 US202017027037A US2021257168A1 US 20210257168 A1 US20210257168 A1 US 20210257168A1 US 202017027037 A US202017027037 A US 202017027037A US 2021257168 A1 US2021257168 A1 US 2021257168A1
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- US
- United States
- Prior art keywords
- keycap
- thin film
- circuit layer
- disposed
- baseplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/12—Movable parts; Contacts mounted thereon
- H01H13/14—Operating parts, e.g. push-button
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/02—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch
- H01H3/12—Push-buttons
- H01H3/122—Push-buttons with enlarged actuating area, e.g. of the elongated bar-type; Stabilising means therefor
- H01H3/125—Push-buttons with enlarged actuating area, e.g. of the elongated bar-type; Stabilising means therefor using a scissor mechanism as stabiliser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/705—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2221/00—Actuators
- H01H2221/062—Damping vibrations
Definitions
- the present disclosure relates to the technical field of input devices, particularly to a keyswitch.
- the keyswitch of conventional keyboard comprises a metal baseplate, a circuit layer, an elastic pad, a linkage component, and a keycap.
- the circuit layer is disposed on the metal baseplate.
- the elastic pad is disposed on the circuit layer.
- the keycap is disposed above the circuit layer and covers the elastic pad.
- the two ends of the linkage component are connected to the keycap and the metal baseplate.
- the embodiments of the present disclosure provide a keyswitch to solve the problem of impact noise made from the keycap hitting onto the circuit layer.
- the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, an elastic part, a thin film, a keycap, and a linkage component.
- the circuit layer is disposed on the baseplate.
- the elastic part is disposed on the circuit layer.
- the thin film is disposed on the circuit layer.
- the thin film is provided with an opening.
- the elastic part protrudes from the opening.
- the keycap is disposed on the elastic part.
- Two ends of the linkage component are respectively connected to the baseplate and the keycap.
- the linkage component drives the keycap to move up and down relative to the baseplate.
- the thin film is disposed on the movement path of the keycap.
- the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, a thin film, an elastic part, a keycap, and a linkage component.
- the circuit layer is disposed on the baseplate.
- the thin film is disposed on the circuit layer.
- the elastic part is disposed on the circuit layer.
- the elastic part is engaged with a surface of the circuit layer.
- the keycap disposed on the elastic part.
- the keycap comprises a keycap body and a sidewall connected to a periphery of the keycap body.
- the linkage component on which the two ends are respectively connected to the baseplate and the keycap.
- the orthographic projection area projected by an outer edge of the keycap facing the thin film is on the thin film.
- the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, an elastic part, at least one thin film, a keycap, a linkage component.
- the circuit layer is disposed on the baseplate.
- the elastic part is disposed on the circuit layer.
- the at least one thin film is disposed on the circuit layer.
- the thin film and the circuit layer are two independent parts.
- the keycap is disposed above the at least one thin film.
- the keycap covers the elastic part. Two ends of the linkage component are respectively connected to the baseplate and the keycap.
- the linkage component is disposed on a periphery of the elastic part.
- the keycap moves up and down relative to the baseplate.
- the at least one thin film is disposed between the keycap and the circuit layer.
- the keycap would not be directly impacting the circuit layer by disposing thin films on the circuit layer and the movement path of the keycap.
- the thin films are cushioning films with pliability, which eliminates the impacting noise and enhances the quietness of the keyswitch.
- FIG. 1 is a perspective view of a keyswitch of the first embodiment of the present disclosure:
- FIG. 2 is an exploded view of the keyswitch of the first embodiment of the present disclosure
- FIG. 3 is a cross-sectional view of the keyswitch of the first embodiment of the present disclosure
- FIG. 4 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the first embodiment of the present disclosure
- FIG. 5 is a cross-sectional view of a keyswitch of the second embodiment of the present disclosure.
- FIG. 6 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the second embodiment of the present disclosure
- FIG. 7 is a cross-sectional view of a keyswitch of the third embodiment of the present disclosure.
- FIG. 8 is a perspective view of a keyswitch of the fourth embodiment of the present disclosure.
- FIG. 9 is an exploded view of the keyswitch of the fourth embodiment of the present disclosure.
- FIG. 10 is a cross-sectional view of the keyswitch of the fourth embodiment of the present disclosure.
- FIG. 11 is a perspective view of a keyswitch of the fifth embodiment of the present disclosure.
- FIG. 12 is an exploded view of the keyswitch of the fifth embodiment of the present disclosure.
- FIG. 13 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the fifth embodiment of the present disclosure.
- the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an . . . ” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
- FIG. 1 to FIG. 3 are a perspective view, exploded view, and cross-sectional view of a keyswitch of the first embodiment of the present disclosure.
- the keyswitch 1 of this embodiment includes a baseplate 10 , a circuit layer 11 , an elastic part 12 , a thin film 13 , a keycap 14 , and a linkage component 15 .
- the circuit layer 11 is disposed on the baseplate 10 .
- a portion of the baseplate 10 is exposed from the circuit layer 11 .
- the elastic part 12 is disposed on the circuit layer 11 .
- the elastic part 12 is disposed on a surface of the circuit layer 11 away from the baseplate 10 .
- the thin film 13 is disposed on the circuit layer 11 .
- the thin film 13 of this embodiment is disposed on a surface of the circuit layer 11 away from the baseplate 10 .
- the thin film 13 has an opening 131 .
- the elastic part 12 protrudes from the opening 131 of the thin film 13 .
- the elastic part 12 is engaged with the surface of the circuit layer 11 and passes through the opening 131 of the thin film 13 . That is, the elastic part 12 is not in contact with the thin film 13 .
- the keycap 14 is disposed on the elastic part 12 and above the thin film 13 . Two ends of the linkage component 15 are respectively connected to the baseplate 10 and the keycap 14 .
- the elastic part 12 is disposed within the linkage component 15 .
- the keycap 14 could move up and down relative to the baseplate 10 with the linkage component 15 .
- the thin film 13 is disposed on the movement path of the keycap 14 .
- the keycap 14 When the keycap 14 is pressed and moves toward the baseplate 10 , it would first hit the thin film 13 to avoid directly hitting the circuit layer 11 . Because the hardness of the material of the thin film 13 is softer than that of the circuit layer 11 , the noise of the keycap 14 striking the thin film 13 is lower than that of the keycap 14 striking the circuit layer 11 . Thus, the noise of pressing the keyswitch 1 could be reduced.
- the circuit layer 11 and the thin film 13 in this embodiment are two independent parts.
- the circuit layer 11 could be implemented by a membrane circuit layer, including two or three layers of PET (polyethylene terephthalate) films, and the circuits made of conductive material are provided on and sandwiched between the respective surfaces of the opposing PET films, thereby enabling the circuit layer 11 to function as a switch corresponding to a single keycap 14 .
- the PET film with the circuit layout may induce greater hardness. Because the thin film 13 is a single-layered cushioning film with pliability, and is made of the material softer than the circuit layer 11 , the noise of the keycap 14 striking the thin film 13 is lower than that of the keycap 14 striking the circuit layer 11 .
- the material of the films used in the circuit layer 11 and the material of the thin film 13 could be identical or different.
- the material of the films used for the circuit layer 11 and the thin film 13 may both be the PET films, but could be of different hardness.
- the thin film for the circuit layer 11 is a PET film, and the thin film 13 may be other plastic or composite materials other than PET, such as TPU (thermoplastic polyurethane).
- the circuit layer 11 is, for example, thicker than the thin film 13 .
- the thin film 13 is thicker than or equal to 0.025 mm, the noise reduction mentioned above could be obtained.
- the keyswitch 1 would stay in a relatively thin or slim profile and could be near-silent.
- the material of the keycap 14 is plastic.
- the noise of the rigid keycap 14 hitting the circuit layer 11 could be reduced by the intervening thin film 13 .
- the keycap 14 comprises a keycap body 141 and a sidewall 142 connected to a periphery of the keycap body 141 .
- One side of the sidewall 142 away from the keycap body 141 is provided with an accommodating opening 143 .
- a side of the accommodating opening 143 is defined as a side of the inner surface of the sidewall 142 away from the keycap body 141 .
- the area of the opening 131 of the thin film 13 is smaller than the area of the accommodating opening 143 .
- the orthographic projection area 144 projected by an end surface of the sidewall 142 of the keycap 14 facing the thin film 13 is at least partially on the thin film 13 .
- the orthographic projection area 144 of the end surface of the sidewall 142 of the keycap 14 entirely falls within the coverage of the thin film 13 .
- the distance from the side of the opening 131 of the thin film 13 to the center C of the elastic part 12 is shorter than the distance from the inner surface of the sidewall 142 of the keycap 14 to the center C of the elastic part 12 .
- the thin film 13 would be disposed on the movement path of the keycap 14 , and the thin film 13 could be sandwiched between the sidewall 142 and the circuit layer 11 when the keycap 14 is pressed.
- the area of the opening 131 is greater than the maximum area occupied by the linkage component 15 .
- the area occupied by the linkage component 15 is, for example, a cross-sectional area of the linkage component 15 parallel to a top surface of the thin film 13 .
- the linkage component 15 can be completely accommodated in the opening 131 , and the movement of the linkage component 15 would not be obstructed by the thin film 13 . Thus, the linkage component 15 could be smoothly operated.
- engagement members 101 are provided on a surface of the baseplate 10 close to the circuit layer 11 .
- the engagement members 101 penetrate the circuit layer 11 .
- a surface of the keycap 14 close to the circuit layer 11 is provided with connecting components 145 .
- the connecting components 145 are disposed on the inner surface of the keycap body 141 .
- the engagement members 101 are, for example, extension components of the baseplate 10 formed by stamping and bending the material of the baseplate 10 .
- the connecting components 145 are, for example, engaging components integrally formed, through injection molding, on the inner surface of the keycap body 141 when the keycap 14 is fabricated.
- the engagement members 101 can be made of a material different from that of the baseplate 10 by, for example, using plastic injection-molded and directly mounted onto the baseplate 10 , so that the engagement members 101 is made of plastic.
- the linkage component 15 is a scissor-like or wing-like frame structure, including two movable parts 151 which are interlocked by a matching shaft and a shaft hole.
- the two movable parts 151 are rotatably connected by the shaft of one of the movable parts 151 being accommodated in the shaft hole of the other of the movable parts 151 .
- Each of the two movable parts 151 may have a first end 151 a and a second end 151 b .
- the two first ends 151 a of the two movable parts 151 are disposed on the same side that is close to the baseplate 10 .
- the two second ends 151 b of the two movable parts 151 are disposed on the same side that is close to the keycap 14 .
- the two first ends 151 a of the two movable parts 151 are engaged with the engagement members 101 of the baseplate 10 .
- the two second ends 151 b of the two movable parts 151 are engaged with the connecting components 145 of the keycap 14 . In this way, the two ends of the linkage component 15 are respectively connected to the baseplate 10 and the keycap 14 .
- the circuit layer 11 might have a first hollow part 112 corresponding to the linkage component 15 .
- the baseplate 10 is exposed from the first hollow part 112 .
- the engagement members 101 penetrate the first hollow part 112 and protrude from the top surface of the circuit layer 11 .
- the baseplate 10 of this embodiment might have a second hollow part 102 which could be partly overlapped by the first hollow part 112 .
- the first hollow part 112 and the second hollow part 102 provide a space for the linkage component 15 to sink when the linkage component 15 is compressed, making the linkage component 15 to be operated stably, and thus the thickness of the keyswitch 1 is reduced for further downsizing the keyswitch 1 .
- FIG. 5 is a cross-sectional view of a keyswitch of the second embodiment of the present disclosure.
- FIG. 6 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the second embodiment of the present disclosure.
- the keyswitch 1 ′ of this embodiment is different from the keyswitch 1 of the first embodiment in that a side of an opening 131 of a thin film 13 is aligned with the edge of the inner surface of a keycap 14 .
- This indicates that the area of the opening 131 of the thin film 13 is substantially identical to that of an accommodating opening 143 of the keycap 14 .
- the area of the opening 131 of the thin film 13 is the largest in this exemplary embodiment.
- An orthographic projection area 144 projected by a surface of the sidewall 142 of the keycap 14 facing the thin film 13 falls on the thin film 13 .
- a side of the orthographic projection area 144 close to the opening 131 could be substantially aligned with a side of the opening 131 .
- aligned to a single reference line aligned to a single reference line, the distance from the side of the opening 131 to the center C of the elastic part 12 is substantially equal to the distance from the inner surface of the sidewall 142 of the keycap 14 to the center C of the elastic part 12 .
- the noise reduction can also be achieved.
- FIG. 7 is a cross-sectional view of a keyswitch of the third embodiment of the present disclosure.
- the keyswitch 1 ′′ of this embodiment is different from the keyswitch 1 of the first embodiment in that a buffer bump 146 is provided on an end surface of a sidewall 142 of the keycap 14 of this embodiment.
- the buffer bump 146 is disposed between the sidewall 142 and the thin film 13 .
- the buffer bump 146 protrudes from the end surface of the sidewall 142 and faces the thin film 13 .
- the buffer bump 146 When the keycap 14 is pressed and moved toward the thin film 13 with the linkage component 15 , the buffer bump 146 contacts the thin film 13 in advance to reduce the impact between the entire sidewall 142 of the keycap 14 and the thin film 13 , bringing the keyswitch 1 an enhanced effect of noise reduction.
- the buffer bump 146 can be an annular-shaped protruding ring or arranged in multiple protruding segments separately formed on the end surface of the sidewall 142 facing the thin film 13 .
- the buffer bump 146 and the keycap 14 may be integrally formed to one piece.
- the circuit layer 11 is further provided with a retaining hole 113 corresponding to the buffer bump 146 . That is, the circuit layer 11 is not provided between the thin film 13 and the baseplate 10 below the position corresponding to the buffer bump 146 .
- the buffer bump 146 would only contact the thin film 13 without metal circuits but would not impact the circuit layer 11 to reduce the noise.
- the width of the retaining hole 113 in this embodiment is greater than the width of the buffer bump 146 , so as to ensure that there is a space below the thin film 13 corresponding to the buffer bump 146 .
- the buffer bump 146 would not directly hit the circuit layer 11 through the thin film 13 and/or the arrangement of the retaining hole 113 .
- the shape of the retaining hole 113 can be identical to or different from the shape of the buffer bump 146 .
- the retaining hole 113 can be annular, which may correspond to the annular buffer bump 146 or the buffer bump 146 in separate segments.
- the circuit layer 11 can have multiple retaining holes 113 respectively corresponding to each and every protruding segment of the buffer bump 146 .
- the baseplate 10 could include at least one hollow portion corresponding to the buffer bumps 146 in the direction parallel to the movement path.
- the orthographic projection area of the buffer bump 146 projected onto the thin film 13 is, for example, located within the hollow portion of the baseplate 10 , thereby mitigating the stress applied to the baseplate 10 and avoiding the collision between the buffer bumps 146 and the baseplate 10 when the keycap 14 is pressed down.
- FIG. 8 to FIG. 10 are perspective view, exploded view and cross-sectional view of the fourth embodiment of the present disclosure.
- the keyswitch 1 ′′′ of this embodiment is different from the keyswitch 1 of the first embodiment in that the keyswitch 1 ′′′ further comprises a backlight module 16 disposed below the baseplate 10 .
- the backlight module 16 is disposed on a surface of the baseplate 10 away from the circuit layer 11 .
- the light generated by the backlight module 16 passes through the second hollow part 102 of the baseplate 10 , the first hollow part 112 of the circuit layer 11 , and the opening 131 of the thin film 13 , finally is emitted from the transparent part on a top surface of the keycap 14 or a gap between adjacent keycaps 14 .
- a coating 17 is also provided on a surface of the thin film 13 away from the circuit layer 11 .
- the coating 17 contains a light-reflective material or a light-absorbable material, which could be printed or sprayed on a colorless or transparent film.
- the color of the coating 17 can be white, beige, black or other colors according to the color of the keycap 14 .
- the color of the coating 17 is white or other lighter colors, the light would be transmitted from the gap between the thin film 13 and the keycap 14 . That is, the light transmitted from the periphery of the keycap 14 would be projected onto the coating 17 that can then reflect the light and generate an improved halo effect, so that the keyswitch 1 ′′′ could provide a uniform backlighting attractiveness.
- the thin film 13 could be a tinted translucent film in white, black, or a color the same as the color of the keycap 14 . In this way, the same effect as the coating 17 can be achieved through the said tinted translucent film even if the coating 17 is not required.
- the backlight module 16 can be applied to the keyswitches according to the second and third embodiments, and the coating 17 or the tinted translucent thin film 13 can be optionally implemented in the second and third embodiments.
- the backlight module 16 can be selected according to requirements.
- the backlight module 16 may include a light guiding plate and a light source disposed at a light-entering side of the light guiding plate. The light guiding plate could evenly distribute the light from the light source.
- the backlight module 16 could be a plurality of light sources corresponding to the keyswitches; that is, the light source provides independent backlighting for a single keyswitch.
- FIG. 11 and FIG. 12 are perspective view and exploded view of a keyswitch of the fifth embodiment of the present disclosure.
- the keyswitch 1 ′′′′ of this embodiment comprising a baseplate 10 , a circuit layer 11 , an elastic part 12 , at least one thin film 13 ′, a keycap 14 , and a linkage component 15 .
- the circuit layer 11 is disposed on the baseplate 10 .
- the circuit layer 11 of this embodiment is disposed on a surface of the baseplate 10 comprising the engagement members 101 , and the baseplate 10 passes through the circuit layer 11 and is exposed out of the circuit layer 11 , the elastic part 12 is disposed on the circuit layer 11 .
- the elastic part 12 is disposed on a surface of the circuit layer 11 away from the baseplate 10 .
- the at least one thin film 13 ′ is disposed on the circuit layer 11 .
- Each thin film 13 ′ of this embodiment is disposed on the surface of the circuit layer 11 away from the baseplate 10 and is disposed at the periphery of the elastic part 12 .
- Each thin film 13 ′ and the circuit layer 11 are two independent parts, the keycap 14 is disposed above the at least one thin film 13 and covers the elastic part 12 .
- Two ends of the linkage component 15 are respectively connected to the baseplate 10 and the keycap 14 .
- the linkage component 15 is disposed on a periphery of the elastic part 12 .
- the keycap 14 moves up and down relative to the baseplate 10 with the linkage component 15 .
- the at least one thin film 13 ′ is disposed between the keycap 14 and the circuit layer 11 , and is disposed on the movement path of the keycap 14 .
- the keycap 14 of this embodiment comprises a keycap body 141 and four sidewalls 142 disposed on the periphery of the keycap body 141 . At least one of the four orthographic projection areas 144 projected by end surfaces of the four sidewalls 142 of the keycap 14 facing the at least one thin film 13 ′ is on the at least one thin film 13 ′.
- the number of thin films 13 ′ is two.
- the two thin films 13 ′ are oppositely disposed on opposite sides of the linkage component 15 .
- a gap exists between the two thin films 13 ′.
- the width of the gap is greater than or equal to the length of a side of the linkage component 15 parallel to a side of the thin films 13 ′. So that the linkage component 15 can be completely disposed in the gap between the two thin films 13 ′ m which would not affect the operation of the linkage component 15 or would not contact the linkage component 15 . Referring to FIG.
- FIG. 13 a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the fifth embodiment of the present disclosure, two orthographic projection area 144 projected by end surfaces of two opposite sidewalls 142 facing the thin films 13 ′ is respectively on the at least one thin film.
- a gap exists between a side of each orthographic projection area 144 on each thin film 13 ′ close to the linkage component 15 and a side of the thin films 13 ′ close to the linkage component 15 .
- the side of each orthographic projection area 144 on each thin film 13 ′ close to the linkage component 15 is aligned with the side of the thin film 13 ′ close to the linkage component 15 .
- a gap exists between the side of each orthographic projection area 144 on each thin film 13 ′ close to the linkage component 15 and a side of the thin films 13 ′ close to the linkage component 15 . That is, the distance between the side of each orthographic projection area 144 on each thin film 13 ′ close to the linkage component 15 and the center of the elastic part 12 is greater than the distance between the side of the thin films 13 ′ close to the linkage component 15 and the center of the elastic part 12 .
- Two add-on thin films 133 are provided on one side of each thin film 13 ′, and the two add-on thin films 133 extend toward the other thin films 13 ′.
- a gap exists between the two add-on thin films 133 of each thin film 13 ′.
- the width of the gap is greater than or equal to the maximum length of the side of the linkage component 15 parallel to the extending direction of the add-on thin films 133 , making the linkage component 15 to be disposed within the two add-on thin films 133 .
- the two add-on thin films 133 of each thin film 13 ′ would not affect the operation of the linkage component 15 or would not be in contact with the linkage component 15 .
- each thin film 13 ′ abut against the two add-on thin films 133 of another thin film 13 ′, so that an opening is formed between the two thin films 13 ′ as that of the embodiment 1.
- the function of the thin film 13 ′ in this embodiment is identical to the function of the thin film 13 in the foregoing embodiments, thus the details would not be described again herein.
- the baseplate 10 and the circuit layer 11 are identical to the baseplate and the circuit layer of the first embodiment.
- the circuit layer 11 comprises a first hollow part 112 .
- the baseplate 10 comprises a second hollow part 102 . At least a part of the second hollow part 102 corresponds to the first hollow part 112 .
- the keyswitch 1 ′′′′ of this embodiment further comprises a backlight module 16 disposed below the baseplate 10 . That is, the backlight module 16 is disposed on a surface of the baseplate 10 away from the circuit layer 11 .
- the light generated by the backlight module 16 passes through the second hollow part 102 of the baseplate 10 , the first hollow part 112 of the circuit layer 11 , and the gap between the two thin films 13 ′, and would be finally emitted from the periphery of the keycap 14 .
- the thin film 13 ′ of this embodiment could further be provided with a coating of the fourth embodiment or could be applied with the translucent film of the fourth embodiment to uniformize the light emitted from the periphery of the keycap 14 and/or to produce a better halo effect.
- the keyswitch 1 ′′′′ could present an effect of excellent lighting in uniformity.
- the thin film thickness range, the thin film material, and the material of the keycap of the first embodiment, the buffer bumps and the retaining holes of the circuit layer of the second embodiment could be applied to the keyswitch 1 ′′′′ of this embodiment, thus the details would not be described again herein.
- the thin films of the keyswitch are disposed between the circuit layer and the sidewall of the keycap.
- the orthographic projection area projected by the end surface of the sidewall of the keycap facing the thin film is at least partially on the thin films, which indicates that at least the orthographic projection area projected by the outer edge of the keycap facing the thin films is on the thin films. Therefore, the thin films can be disposed between the circuit layer and the keycap and can be disposed on the movement path of the keycap. When the keycap is pressed, the keycap can be in contact with the thin films to improve the noise reduction effect of the keyswitch.
- the present disclosure further provides a keyboard comprising a housing and a plurality of keyswitches disposed in the housing.
- the keyswitches here could be any of the keyswitches mentioned in the first to fifth embodiments.
- the present disclosure proposes a keyswitch, in which the keycap would not directly impact the circuit layer by disposing the thin film on the circuit layer and at a position corresponding to the movement path of the keycap.
- the thin film could function as a cushioning film with pliability, which eliminates the impacting noise of the keyswitch.
- the uniformity of the light emitted from the periphery of the keycap could be improved, thereby obtaining an advantageous halo effect and a uniformized backlighting of the keyswitch.
Abstract
Description
- This application claims the priority benefit of Chinese Patent Application Serial Number CN202010092707.5, filed on Feb. 14, 2020, the full disclosure of which is incorporated herein by reference.
- The present disclosure relates to the technical field of input devices, particularly to a keyswitch.
- The keyswitch of conventional keyboard comprises a metal baseplate, a circuit layer, an elastic pad, a linkage component, and a keycap. The circuit layer is disposed on the metal baseplate. The elastic pad is disposed on the circuit layer. The keycap is disposed above the circuit layer and covers the elastic pad. The two ends of the linkage component are connected to the keycap and the metal baseplate. When the keycap is pressed, the keycap moves up and down relative to the metal baseplate with the linkage component. When the keycap moves towards the metal baseplate, an impact noise would be made from a sidewall of the keycap hitting onto the circuit layer in which a metal circuit is disposed without any buffering spaces. The impact noise would be even louder with metal or ceramic keycaps.
- The embodiments of the present disclosure provide a keyswitch to solve the problem of impact noise made from the keycap hitting onto the circuit layer.
- In the first aspect, the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, an elastic part, a thin film, a keycap, and a linkage component. The circuit layer is disposed on the baseplate. The elastic part is disposed on the circuit layer. The thin film is disposed on the circuit layer. The thin film is provided with an opening. The elastic part protrudes from the opening. The keycap is disposed on the elastic part. Two ends of the linkage component are respectively connected to the baseplate and the keycap. The linkage component drives the keycap to move up and down relative to the baseplate. The thin film is disposed on the movement path of the keycap.
- In the second aspect, the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, a thin film, an elastic part, a keycap, and a linkage component. The circuit layer is disposed on the baseplate. The thin film is disposed on the circuit layer. The elastic part is disposed on the circuit layer. The elastic part is engaged with a surface of the circuit layer. The keycap disposed on the elastic part. The keycap comprises a keycap body and a sidewall connected to a periphery of the keycap body. The linkage component on which the two ends are respectively connected to the baseplate and the keycap. The orthographic projection area projected by an outer edge of the keycap facing the thin film is on the thin film.
- In the third aspect, the present disclosure provides a keyswitch comprising a baseplate, a circuit layer, an elastic part, at least one thin film, a keycap, a linkage component. The circuit layer is disposed on the baseplate. The elastic part is disposed on the circuit layer. The at least one thin film is disposed on the circuit layer. The thin film and the circuit layer are two independent parts. The keycap is disposed above the at least one thin film. The keycap covers the elastic part. Two ends of the linkage component are respectively connected to the baseplate and the keycap. The linkage component is disposed on a periphery of the elastic part. The keycap moves up and down relative to the baseplate. The at least one thin film is disposed between the keycap and the circuit layer.
- In the embodiments of the present disclosure, the keycap would not be directly impacting the circuit layer by disposing thin films on the circuit layer and the movement path of the keycap. The thin films are cushioning films with pliability, which eliminates the impacting noise and enhances the quietness of the keyswitch.
- It should be understood, however, that this summary may not contain all aspects and embodiments of the present disclosure, that this summary is not meant to be limiting or restrictive in any manner, and that the disclosure as disclosed herein will be understood by one of ordinary skill in the art to encompass obvious improvements and modifications thereto.
- The features of the exemplary embodiments believed to be novel and the elements and/or the steps characteristic of the exemplary embodiments are set forth with particularity in the appended claims. The Figures are for illustration purposes only and are not drawn to scale. The exemplary embodiments, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a perspective view of a keyswitch of the first embodiment of the present disclosure: -
FIG. 2 is an exploded view of the keyswitch of the first embodiment of the present disclosure; -
FIG. 3 is a cross-sectional view of the keyswitch of the first embodiment of the present disclosure; -
FIG. 4 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the first embodiment of the present disclosure; -
FIG. 5 is a cross-sectional view of a keyswitch of the second embodiment of the present disclosure; -
FIG. 6 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the second embodiment of the present disclosure; -
FIG. 7 is a cross-sectional view of a keyswitch of the third embodiment of the present disclosure; -
FIG. 8 is a perspective view of a keyswitch of the fourth embodiment of the present disclosure; -
FIG. 9 is an exploded view of the keyswitch of the fourth embodiment of the present disclosure; -
FIG. 10 is a cross-sectional view of the keyswitch of the fourth embodiment of the present disclosure; -
FIG. 11 is a perspective view of a keyswitch of the fifth embodiment of the present disclosure; -
FIG. 12 is an exploded view of the keyswitch of the fifth embodiment of the present disclosure; and -
FIG. 13 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the fifth embodiment of the present disclosure. - The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. This present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.
- Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but function. In the following description and in the claims, the terms “include/including” and “comprise/comprising” are used in an open-ended fashion, and thus should be interpreted as “including but not limited to”. “Substantial/substantially” means, within an acceptable error range, the person skilled in the art may solve the technical problem in a certain error range to achieve the basic technical effect.
- The following description is of the best-contemplated mode of carrying out the disclosure. This description is made for the purpose of illustration of the general principles of the disclosure and should not be taken in a limiting sense. The scope of the disclosure is best determined by reference to the appended claims.
- Moreover, the terms “include”, “contain”, and any variation thereof are intended to cover a non-exclusive inclusion. Therefore, a process, method, object, or device that includes a series of elements not only includes these elements, but also includes other elements not specified expressly, or may include inherent elements of the process, method, object, or device. If no more limitations are made, an element limited by “include a/an . . . ” does not exclude other same elements existing in the process, the method, the article, or the device which includes the element.
- In the following embodiment, the same reference numerals are used to refer to the same or similar elements throughout the disclosure.
-
FIG. 1 toFIG. 3 are a perspective view, exploded view, and cross-sectional view of a keyswitch of the first embodiment of the present disclosure. As shown in the figures, thekeyswitch 1 of this embodiment includes abaseplate 10, acircuit layer 11, anelastic part 12, athin film 13, akeycap 14, and alinkage component 15. Thecircuit layer 11 is disposed on thebaseplate 10. A portion of thebaseplate 10 is exposed from thecircuit layer 11. Theelastic part 12 is disposed on thecircuit layer 11. In this embodiment, theelastic part 12 is disposed on a surface of thecircuit layer 11 away from thebaseplate 10. Thethin film 13 is disposed on thecircuit layer 11. Thethin film 13 of this embodiment is disposed on a surface of thecircuit layer 11 away from thebaseplate 10. Thethin film 13 has anopening 131. Theelastic part 12 protrudes from theopening 131 of thethin film 13. For example, theelastic part 12 is engaged with the surface of thecircuit layer 11 and passes through theopening 131 of thethin film 13. That is, theelastic part 12 is not in contact with thethin film 13. Thekeycap 14 is disposed on theelastic part 12 and above thethin film 13. Two ends of thelinkage component 15 are respectively connected to thebaseplate 10 and thekeycap 14. In this embodiment, theelastic part 12 is disposed within thelinkage component 15. Thekeycap 14 could move up and down relative to thebaseplate 10 with thelinkage component 15. Thethin film 13 is disposed on the movement path of thekeycap 14. When thekeycap 14 is pressed and moves toward thebaseplate 10, it would first hit thethin film 13 to avoid directly hitting thecircuit layer 11. Because the hardness of the material of thethin film 13 is softer than that of thecircuit layer 11, the noise of thekeycap 14 striking thethin film 13 is lower than that of thekeycap 14 striking thecircuit layer 11. Thus, the noise of pressing thekeyswitch 1 could be reduced. - The
circuit layer 11 and thethin film 13 in this embodiment are two independent parts. For example, thecircuit layer 11 could be implemented by a membrane circuit layer, including two or three layers of PET (polyethylene terephthalate) films, and the circuits made of conductive material are provided on and sandwiched between the respective surfaces of the opposing PET films, thereby enabling thecircuit layer 11 to function as a switch corresponding to asingle keycap 14. However, the PET film with the circuit layout may induce greater hardness. Because thethin film 13 is a single-layered cushioning film with pliability, and is made of the material softer than thecircuit layer 11, the noise of thekeycap 14 striking thethin film 13 is lower than that of thekeycap 14 striking thecircuit layer 11. The material of the films used in thecircuit layer 11 and the material of thethin film 13 could be identical or different. In this embodiment, the material of the films used for thecircuit layer 11 and thethin film 13 may both be the PET films, but could be of different hardness. In other embodiments, the thin film for thecircuit layer 11 is a PET film, and thethin film 13 may be other plastic or composite materials other than PET, such as TPU (thermoplastic polyurethane). Thecircuit layer 11 is, for example, thicker than thethin film 13. In general, when thethin film 13 is thicker than or equal to 0.025 mm, the noise reduction mentioned above could be obtained. In another embodiment, when thethin film 13 is thicker than or equal to 0.05 mm but less than or equal to 0.15 mm, thekeyswitch 1 would stay in a relatively thin or slim profile and could be near-silent. - In this embodiment, the material of the
keycap 14 is plastic. However, when thekeycap 14 is made of metal, ceramic, or a more rigid material in other embodiments, the noise of therigid keycap 14 hitting thecircuit layer 11 could be reduced by the interveningthin film 13. - The
keycap 14 comprises akeycap body 141 and asidewall 142 connected to a periphery of thekeycap body 141. One side of thesidewall 142 away from thekeycap body 141 is provided with anaccommodating opening 143. A side of theaccommodating opening 143 is defined as a side of the inner surface of thesidewall 142 away from thekeycap body 141. The area of theopening 131 of thethin film 13 is smaller than the area of theaccommodating opening 143. Theorthographic projection area 144 projected by an end surface of thesidewall 142 of thekeycap 14 facing thethin film 13 is at least partially on thethin film 13. A gap exists between an inner side of theorthographic projection area 144 and a side of the opening 131 (seeFIG. 4 ). In this embodiment, theorthographic projection area 144 of the end surface of thesidewall 142 of thekeycap 14 entirely falls within the coverage of thethin film 13. In other words, aligned to a single reference line, the distance from the side of theopening 131 of thethin film 13 to the center C of theelastic part 12 is shorter than the distance from the inner surface of thesidewall 142 of thekeycap 14 to the center C of theelastic part 12. In this way, thethin film 13 would be disposed on the movement path of thekeycap 14, and thethin film 13 could be sandwiched between thesidewall 142 and thecircuit layer 11 when thekeycap 14 is pressed. The area of theopening 131 is greater than the maximum area occupied by thelinkage component 15. The area occupied by thelinkage component 15 is, for example, a cross-sectional area of thelinkage component 15 parallel to a top surface of thethin film 13. Thelinkage component 15 can be completely accommodated in theopening 131, and the movement of thelinkage component 15 would not be obstructed by thethin film 13. Thus, thelinkage component 15 could be smoothly operated. - In this embodiment,
engagement members 101 are provided on a surface of thebaseplate 10 close to thecircuit layer 11. Theengagement members 101 penetrate thecircuit layer 11. A surface of thekeycap 14 close to thecircuit layer 11 is provided with connectingcomponents 145. In this embodiment, the connectingcomponents 145 are disposed on the inner surface of thekeycap body 141. As shown inFIGS. 2 and 3 , theengagement members 101 are, for example, extension components of thebaseplate 10 formed by stamping and bending the material of thebaseplate 10. The connectingcomponents 145 are, for example, engaging components integrally formed, through injection molding, on the inner surface of thekeycap body 141 when thekeycap 14 is fabricated. In other embodiments, theengagement members 101 can be made of a material different from that of thebaseplate 10 by, for example, using plastic injection-molded and directly mounted onto thebaseplate 10, so that theengagement members 101 is made of plastic. Thelinkage component 15 is a scissor-like or wing-like frame structure, including twomovable parts 151 which are interlocked by a matching shaft and a shaft hole. The twomovable parts 151 are rotatably connected by the shaft of one of themovable parts 151 being accommodated in the shaft hole of the other of themovable parts 151. Each of the twomovable parts 151 may have afirst end 151 a and asecond end 151 b. The twofirst ends 151 a of the twomovable parts 151 are disposed on the same side that is close to thebaseplate 10. The twosecond ends 151 b of the twomovable parts 151 are disposed on the same side that is close to thekeycap 14. The twofirst ends 151 a of the twomovable parts 151 are engaged with theengagement members 101 of thebaseplate 10. The twosecond ends 151 b of the twomovable parts 151 are engaged with the connectingcomponents 145 of thekeycap 14. In this way, the two ends of thelinkage component 15 are respectively connected to thebaseplate 10 and thekeycap 14. - In this embodiment, the
circuit layer 11 might have a firsthollow part 112 corresponding to thelinkage component 15. Thebaseplate 10 is exposed from the firsthollow part 112. Theengagement members 101 penetrate the firsthollow part 112 and protrude from the top surface of thecircuit layer 11. Thebaseplate 10 of this embodiment might have a secondhollow part 102 which could be partly overlapped by the firsthollow part 112. The firsthollow part 112 and the secondhollow part 102 provide a space for thelinkage component 15 to sink when thelinkage component 15 is compressed, making thelinkage component 15 to be operated stably, and thus the thickness of thekeyswitch 1 is reduced for further downsizing thekeyswitch 1. -
FIG. 5 is a cross-sectional view of a keyswitch of the second embodiment of the present disclosure.FIG. 6 is a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the second embodiment of the present disclosure. As shown in the figures, thekeyswitch 1′ of this embodiment is different from thekeyswitch 1 of the first embodiment in that a side of anopening 131 of athin film 13 is aligned with the edge of the inner surface of akeycap 14. This indicates that the area of theopening 131 of thethin film 13 is substantially identical to that of anaccommodating opening 143 of thekeycap 14. The area of theopening 131 of thethin film 13 is the largest in this exemplary embodiment. Anorthographic projection area 144 projected by a surface of thesidewall 142 of thekeycap 14 facing thethin film 13 falls on thethin film 13. A side of theorthographic projection area 144 close to theopening 131 could be substantially aligned with a side of theopening 131. No gap exists between the side of theorthographic projection area 144 close to theopening 131 and the side of theopening 131. In other words, aligned to a single reference line, the distance from the side of theopening 131 to the center C of theelastic part 12 is substantially equal to the distance from the inner surface of thesidewall 142 of thekeycap 14 to the center C of theelastic part 12. As thethin film 13 is still disposed on the movement path of thekeycap 14, the noise reduction can also be achieved. -
FIG. 7 is a cross-sectional view of a keyswitch of the third embodiment of the present disclosure. As shown in the figure, thekeyswitch 1″ of this embodiment is different from thekeyswitch 1 of the first embodiment in that abuffer bump 146 is provided on an end surface of asidewall 142 of thekeycap 14 of this embodiment. Thebuffer bump 146 is disposed between thesidewall 142 and thethin film 13. In an embodiment, thebuffer bump 146 protrudes from the end surface of thesidewall 142 and faces thethin film 13. When thekeycap 14 is pressed and moved toward thethin film 13 with thelinkage component 15, thebuffer bump 146 contacts thethin film 13 in advance to reduce the impact between theentire sidewall 142 of thekeycap 14 and thethin film 13, bringing thekeyswitch 1 an enhanced effect of noise reduction. Thebuffer bump 146 can be an annular-shaped protruding ring or arranged in multiple protruding segments separately formed on the end surface of thesidewall 142 facing thethin film 13. Thebuffer bump 146 and thekeycap 14 may be integrally formed to one piece. - In this embodiment, the
circuit layer 11 is further provided with a retaininghole 113 corresponding to thebuffer bump 146. That is, thecircuit layer 11 is not provided between thethin film 13 and thebaseplate 10 below the position corresponding to thebuffer bump 146. When thekeycap 14 moves toward thethin film 13 with thelinkage component 15, thebuffer bump 146 would only contact thethin film 13 without metal circuits but would not impact thecircuit layer 11 to reduce the noise. The width of the retaininghole 113 in this embodiment is greater than the width of thebuffer bump 146, so as to ensure that there is a space below thethin film 13 corresponding to thebuffer bump 146. Thus, thebuffer bump 146 would not directly hit thecircuit layer 11 through thethin film 13 and/or the arrangement of the retaininghole 113. The shape of the retaininghole 113 can be identical to or different from the shape of thebuffer bump 146. The retaininghole 113 can be annular, which may correspond to theannular buffer bump 146 or thebuffer bump 146 in separate segments. Alternatively, thecircuit layer 11 can have multiple retainingholes 113 respectively corresponding to each and every protruding segment of thebuffer bump 146. - In another embodiment, the
baseplate 10 could include at least one hollow portion corresponding to the buffer bumps 146 in the direction parallel to the movement path. The orthographic projection area of thebuffer bump 146 projected onto thethin film 13 is, for example, located within the hollow portion of thebaseplate 10, thereby mitigating the stress applied to thebaseplate 10 and avoiding the collision between the buffer bumps 146 and thebaseplate 10 when thekeycap 14 is pressed down. -
FIG. 8 toFIG. 10 are perspective view, exploded view and cross-sectional view of the fourth embodiment of the present disclosure. As shown in the figures, thekeyswitch 1′″ of this embodiment is different from thekeyswitch 1 of the first embodiment in that thekeyswitch 1′″ further comprises abacklight module 16 disposed below thebaseplate 10. In this embodiment, thebacklight module 16 is disposed on a surface of thebaseplate 10 away from thecircuit layer 11. The light generated by thebacklight module 16 passes through the secondhollow part 102 of thebaseplate 10, the firsthollow part 112 of thecircuit layer 11, and theopening 131 of thethin film 13, finally is emitted from the transparent part on a top surface of thekeycap 14 or a gap betweenadjacent keycaps 14. - A
coating 17 is also provided on a surface of thethin film 13 away from thecircuit layer 11. In some embodiments, thecoating 17 contains a light-reflective material or a light-absorbable material, which could be printed or sprayed on a colorless or transparent film. The color of thecoating 17 can be white, beige, black or other colors according to the color of thekeycap 14. When the color of thecoating 17 is white or other lighter colors, the light would be transmitted from the gap between thethin film 13 and thekeycap 14. That is, the light transmitted from the periphery of thekeycap 14 would be projected onto thecoating 17 that can then reflect the light and generate an improved halo effect, so that thekeyswitch 1′″ could provide a uniform backlighting attractiveness. When the color of thecoating 17 is black or other darker colors, the light reflected by the metal circuit inside thecircuit layer 11 would be shielded by thedark coating 17 to uniformize the light emitted from the periphery of thekeycap 14. In another embodiment, thethin film 13 could be a tinted translucent film in white, black, or a color the same as the color of thekeycap 14. In this way, the same effect as thecoating 17 can be achieved through the said tinted translucent film even if thecoating 17 is not required. - It is noted that the
backlight module 16 can be applied to the keyswitches according to the second and third embodiments, and thecoating 17 or the tinted translucentthin film 13 can be optionally implemented in the second and third embodiments. In addition, thebacklight module 16 can be selected according to requirements. Practically, thebacklight module 16 may include a light guiding plate and a light source disposed at a light-entering side of the light guiding plate. The light guiding plate could evenly distribute the light from the light source. Alternatively, thebacklight module 16 could be a plurality of light sources corresponding to the keyswitches; that is, the light source provides independent backlighting for a single keyswitch. -
FIG. 11 andFIG. 12 are perspective view and exploded view of a keyswitch of the fifth embodiment of the present disclosure. As shown in the figures, thekeyswitch 1″″ of this embodiment comprising abaseplate 10, acircuit layer 11, anelastic part 12, at least onethin film 13′, akeycap 14, and alinkage component 15. Thecircuit layer 11 is disposed on thebaseplate 10. Thecircuit layer 11 of this embodiment is disposed on a surface of thebaseplate 10 comprising theengagement members 101, and thebaseplate 10 passes through thecircuit layer 11 and is exposed out of thecircuit layer 11, theelastic part 12 is disposed on thecircuit layer 11. In this embodiment, theelastic part 12 is disposed on a surface of thecircuit layer 11 away from thebaseplate 10. The at least onethin film 13′ is disposed on thecircuit layer 11. Eachthin film 13′ of this embodiment is disposed on the surface of thecircuit layer 11 away from thebaseplate 10 and is disposed at the periphery of theelastic part 12. Eachthin film 13′ and thecircuit layer 11 are two independent parts, thekeycap 14 is disposed above the at least onethin film 13 and covers theelastic part 12. Two ends of thelinkage component 15 are respectively connected to thebaseplate 10 and thekeycap 14. Thelinkage component 15 is disposed on a periphery of theelastic part 12. Thekeycap 14 moves up and down relative to thebaseplate 10 with thelinkage component 15. The at least onethin film 13′ is disposed between thekeycap 14 and thecircuit layer 11, and is disposed on the movement path of thekeycap 14. Thekeycap 14 of this embodiment comprises akeycap body 141 and foursidewalls 142 disposed on the periphery of thekeycap body 141. At least one of the fourorthographic projection areas 144 projected by end surfaces of the foursidewalls 142 of thekeycap 14 facing the at least onethin film 13′ is on the at least onethin film 13′. - In this embodiment, the number of
thin films 13′ is two. The twothin films 13′ are oppositely disposed on opposite sides of thelinkage component 15. A gap exists between the twothin films 13′. The width of the gap is greater than or equal to the length of a side of thelinkage component 15 parallel to a side of thethin films 13′. So that thelinkage component 15 can be completely disposed in the gap between the twothin films 13′m which would not affect the operation of thelinkage component 15 or would not contact thelinkage component 15. Referring toFIG. 13 , a schematic diagram of an orthographic projection area of a keycap projected onto a thin film of the fifth embodiment of the present disclosure, twoorthographic projection area 144 projected by end surfaces of twoopposite sidewalls 142 facing thethin films 13′ is respectively on the at least one thin film. A gap exists between a side of eachorthographic projection area 144 on eachthin film 13′ close to thelinkage component 15 and a side of thethin films 13′ close to thelinkage component 15. Alternatively, the side of eachorthographic projection area 144 on eachthin film 13′ close to thelinkage component 15 is aligned with the side of thethin film 13′ close to thelinkage component 15. In this embodiment, a gap exists between the side of eachorthographic projection area 144 on eachthin film 13′ close to thelinkage component 15 and a side of thethin films 13′ close to thelinkage component 15. That is, the distance between the side of eachorthographic projection area 144 on eachthin film 13′ close to thelinkage component 15 and the center of theelastic part 12 is greater than the distance between the side of thethin films 13′ close to thelinkage component 15 and the center of theelastic part 12. - Two add-on
thin films 133 are provided on one side of eachthin film 13′, and the two add-onthin films 133 extend toward the otherthin films 13′. A gap exists between the two add-onthin films 133 of eachthin film 13′. The width of the gap is greater than or equal to the maximum length of the side of thelinkage component 15 parallel to the extending direction of the add-onthin films 133, making thelinkage component 15 to be disposed within the two add-onthin films 133. The two add-onthin films 133 of eachthin film 13′ would not affect the operation of thelinkage component 15 or would not be in contact with thelinkage component 15. - The two add-on
thin films 133 of eachthin film 13′ abut against the two add-onthin films 133 of anotherthin film 13′, so that an opening is formed between the twothin films 13′ as that of theembodiment 1. The function of thethin film 13′ in this embodiment is identical to the function of thethin film 13 in the foregoing embodiments, thus the details would not be described again herein. - In this embodiment, the
baseplate 10 and thecircuit layer 11 are identical to the baseplate and the circuit layer of the first embodiment. Thecircuit layer 11 comprises a firsthollow part 112. Thebaseplate 10 comprises a secondhollow part 102. At least a part of the secondhollow part 102 corresponds to the firsthollow part 112. Thekeyswitch 1″″ of this embodiment further comprises abacklight module 16 disposed below thebaseplate 10. That is, thebacklight module 16 is disposed on a surface of thebaseplate 10 away from thecircuit layer 11. The light generated by thebacklight module 16 passes through the secondhollow part 102 of thebaseplate 10, the firsthollow part 112 of thecircuit layer 11, and the gap between the twothin films 13′, and would be finally emitted from the periphery of thekeycap 14. - The
thin film 13′ of this embodiment could further be provided with a coating of the fourth embodiment or could be applied with the translucent film of the fourth embodiment to uniformize the light emitted from the periphery of thekeycap 14 and/or to produce a better halo effect. In this way, thekeyswitch 1″″ could present an effect of excellent lighting in uniformity. The thin film thickness range, the thin film material, and the material of the keycap of the first embodiment, the buffer bumps and the retaining holes of the circuit layer of the second embodiment could be applied to thekeyswitch 1″″ of this embodiment, thus the details would not be described again herein. - It can be known from the above embodiments that the thin films of the keyswitch are disposed between the circuit layer and the sidewall of the keycap. The orthographic projection area projected by the end surface of the sidewall of the keycap facing the thin film is at least partially on the thin films, which indicates that at least the orthographic projection area projected by the outer edge of the keycap facing the thin films is on the thin films. Therefore, the thin films can be disposed between the circuit layer and the keycap and can be disposed on the movement path of the keycap. When the keycap is pressed, the keycap can be in contact with the thin films to improve the noise reduction effect of the keyswitch.
- The present disclosure further provides a keyboard comprising a housing and a plurality of keyswitches disposed in the housing. The keyswitches here could be any of the keyswitches mentioned in the first to fifth embodiments.
- In summary, the present disclosure proposes a keyswitch, in which the keycap would not directly impact the circuit layer by disposing the thin film on the circuit layer and at a position corresponding to the movement path of the keycap. The thin film could function as a cushioning film with pliability, which eliminates the impacting noise of the keyswitch. In addition, by disposing coating on the surface of the thin film away from the circuit layer, or applying tinted and translucent film on the circuit layer, the uniformity of the light emitted from the periphery of the keycap could be improved, thereby obtaining an advantageous halo effect and a uniformized backlighting of the keyswitch.
- It is to be understood that the term “comprises”, “comprising”, or any other variants thereof, is intended to encompass a non-exclusive inclusion, such that a process, method, article, or device of a series of elements not only include those elements but also includes other elements that are not explicitly listed, or elements that are inherent to such a process, method, article, or device. An element defined by the phrase “comprising a . . . ” does not exclude the presence of the same element in the process, method, article, or device that comprises the element.
- Although the present disclosure has been explained in relation to its preferred embodiment, it does not intend to limit the present disclosure. It will be apparent to those skilled in the art having regard to this present disclosure that other modifications of the exemplary embodiments beyond those embodiments specifically described here may be made without departing from the spirit of the disclosure. Accordingly, such modifications are considered within the scope of the disclosure as limited solely by the appended claims.
Claims (20)
Applications Claiming Priority (2)
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CN202010092707.5A CN111261442B (en) | 2020-02-14 | 2020-02-14 | Key structure |
CN202010092707.5 | 2020-02-14 |
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US20210257168A1 true US20210257168A1 (en) | 2021-08-19 |
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CN114639564A (en) * | 2022-03-31 | 2022-06-17 | 联想(北京)有限公司 | Input device |
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2020
- 2020-02-14 CN CN202010092707.5A patent/CN111261442B/en active Active
- 2020-09-21 US US17/027,037 patent/US11631552B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100108481A1 (en) * | 2008-10-30 | 2010-05-06 | Chicony Electronics Co., Ltd | Light-emitting keyboard with a membrane circuit board incorporated therein |
US20180254156A1 (en) * | 2017-03-03 | 2018-09-06 | Primax Electronics Ltd. | Luminous keyboard |
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CN111261442B (en) | 2023-11-21 |
CN111261442A (en) | 2020-06-09 |
US11631552B2 (en) | 2023-04-18 |
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