US20210246527A1 - Method for the Removal and Recovery of Metals and Precious Metals from Substrates - Google Patents
Method for the Removal and Recovery of Metals and Precious Metals from Substrates Download PDFInfo
- Publication number
- US20210246527A1 US20210246527A1 US17/025,417 US202017025417A US2021246527A1 US 20210246527 A1 US20210246527 A1 US 20210246527A1 US 202017025417 A US202017025417 A US 202017025417A US 2021246527 A1 US2021246527 A1 US 2021246527A1
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- US
- United States
- Prior art keywords
- component
- hydrochloride
- group
- gold
- acid
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 239000010970 precious metal Substances 0.000 title claims abstract description 31
- 238000011084 recovery Methods 0.000 title claims description 10
- 150000002739 metals Chemical class 0.000 title abstract description 25
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 238000000151 deposition Methods 0.000 claims abstract description 21
- 230000008021 deposition Effects 0.000 claims abstract description 21
- 240000004808 Saccharomyces cerevisiae Species 0.000 claims abstract description 17
- -1 organo amine Chemical class 0.000 claims abstract description 15
- 150000001412 amines Chemical class 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 238000011065 in-situ storage Methods 0.000 claims abstract description 9
- URAZVWXGWMBUGJ-UHFFFAOYSA-N di(propan-2-yl)azanium;chloride Chemical compound [Cl-].CC(C)[NH2+]C(C)C URAZVWXGWMBUGJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 4
- 241001474374 Blennius Species 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims description 67
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 28
- 229910052697 platinum Inorganic materials 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 22
- 229910017604 nitric acid Inorganic materials 0.000 claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- 229910052763 palladium Inorganic materials 0.000 claims description 20
- 229910052738 indium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- 235000014680 Saccharomyces cerevisiae Nutrition 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000010936 titanium Substances 0.000 claims description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 13
- 229910052719 titanium Inorganic materials 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical group Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 9
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- BSHBXSSYUNZEKK-UHFFFAOYSA-N n-ethylcyclohexanamine;hydrochloride Chemical compound Cl.CCNC1CCCCC1 BSHBXSSYUNZEKK-UHFFFAOYSA-N 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 5
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 230000000536 complexating effect Effects 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
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- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
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- IVLXQGJVBGMLRR-UHFFFAOYSA-N 2-aminoacetic acid;hydron;chloride Chemical compound Cl.NCC(O)=O IVLXQGJVBGMLRR-UHFFFAOYSA-N 0.000 claims description 3
- 239000001763 2-hydroxyethyl(trimethyl)azanium Substances 0.000 claims description 3
- 235000019743 Choline chloride Nutrition 0.000 claims description 3
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 3
- SGMZJAMFUVOLNK-UHFFFAOYSA-M choline chloride Chemical compound [Cl-].C[N+](C)(C)CCO SGMZJAMFUVOLNK-UHFFFAOYSA-M 0.000 claims description 3
- 229960003178 choline chloride Drugs 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 150000003951 lactams Chemical class 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- LLWRXQXPJMPHLR-UHFFFAOYSA-N methylazanium;iodide Chemical compound [I-].[NH3+]C LLWRXQXPJMPHLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- JXXCENBLGFBQJM-UHFFFAOYSA-N (3-carboxy-2-hydroxypropyl)-trimethylazanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC(O)CC(O)=O JXXCENBLGFBQJM-UHFFFAOYSA-N 0.000 claims description 2
- HAAZMOAXEMIBAJ-UHFFFAOYSA-N 4-chloro-2-methylquinazoline Chemical compound C1=CC=CC2=NC(C)=NC(Cl)=C21 HAAZMOAXEMIBAJ-UHFFFAOYSA-N 0.000 claims description 2
- 240000002900 Arthrospira platensis Species 0.000 claims description 2
- 235000016425 Arthrospira platensis Nutrition 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 240000007049 Juglans regia Species 0.000 claims description 2
- 235000009496 Juglans regia Nutrition 0.000 claims description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 2
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- 240000008042 Zea mays Species 0.000 claims description 2
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- 239000003082 abrasive agent Substances 0.000 claims description 2
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- KNGAVTDYYJIGHA-UHFFFAOYSA-N cyclohexyl(methyl)azanium;chloride Chemical compound [Cl-].C[NH2+]C1CCCCC1 KNGAVTDYYJIGHA-UHFFFAOYSA-N 0.000 claims description 2
- MNNMTFSPSVOWSF-UHFFFAOYSA-N dicyclohexylazanium;chloride Chemical compound Cl.C1CCCCC1NC1CCCCC1 MNNMTFSPSVOWSF-UHFFFAOYSA-N 0.000 claims description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
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- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
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- 238000010924 continuous production Methods 0.000 description 2
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- MUMZUERVLWJKNR-UHFFFAOYSA-N oxoplatinum Chemical compound [Pt]=O MUMZUERVLWJKNR-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229910003446 platinum oxide Inorganic materials 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
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- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- FVRDYQYEVDDKCR-DBRKOABJSA-N tiazofurine Chemical compound NC(=O)C1=CSC([C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)=N1 FVRDYQYEVDDKCR-DBRKOABJSA-N 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- PHIQHXFUZVPYII-ZCFIWIBFSA-N (R)-carnitine Chemical compound C[N+](C)(C)C[C@H](O)CC([O-])=O PHIQHXFUZVPYII-ZCFIWIBFSA-N 0.000 description 1
- MZJNLFJJQLRMAJ-UHFFFAOYSA-N 6-methyl-1,2,3,4-tetrahydropyridine Chemical compound CC1=CCCCN1 MZJNLFJJQLRMAJ-UHFFFAOYSA-N 0.000 description 1
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 1
- 229910003638 H2SiF6 Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 241000235070 Saccharomyces Species 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229940000489 arsenate Drugs 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000008275 binding mechanism Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
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- 239000012459 cleaning agent Substances 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- KBXRGBYSPXRSOZ-UHFFFAOYSA-N cyclohexyl(dimethyl)azanium;chloride Chemical compound Cl.CN(C)C1CCCCC1 KBXRGBYSPXRSOZ-UHFFFAOYSA-N 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
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- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- AGVKXDPPPSLISR-UHFFFAOYSA-N n-ethylcyclohexanamine Chemical compound CCNC1CCCCC1 AGVKXDPPPSLISR-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
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- 239000010944 silver (metal) Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- ZEFWRWWINDLIIV-UHFFFAOYSA-N tetrafluorosilane;dihydrofluoride Chemical compound F.F.F[Si](F)(F)F ZEFWRWWINDLIIV-UHFFFAOYSA-N 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/16—Extraction of metal compounds from ores or concentrates by wet processes by leaching in organic solutions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/22—Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means, or by thermal decomposition
- C22B3/24—Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means, or by thermal decomposition by adsorption on solid substances, e.g. by extraction with solid resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
A method for removing metal and/or precious metal-containing depositions from substrates, wherein said substrate is subjected to treatment with an organo amine protectant component P and an inorganic active component A. Component P may be formed in situ by reaction with component R. Component P is an organic amine and/or organic amine hydrohalide and/or organic ammonium halide (preferably diisopropylamine hydrochloride), component A is an inorganic compound (preferably inorganic acid or a mixture thereof) and component R is an organic compound that can be split along the C—N bond by the component A into an organic amine (preferably dimethylformamide or N-methyl pyrrolidone). The metals in the form of organo-metallic complexes and/or metalorganic compounds are isolated and/or separated by means of different chemical reactions (preferably reduction reactions) and/or biosorption (preferably with seaweed or yeast). The isolated and/or separated organo-metallic complexes and/or metalorganic compounds are subjected to refinement process to form pure metals and/or pure precious metals. The substrates remain intact after the treatment.
Description
- This application claims priority to Provisional Application No. 61/575,976, filed Sep. 1, 2011 and application Ser. No. 14/241,105 filed Feb. 26, 2014, now U.S. Pat. No. 10,781,503, all of which are hereby incorporated herein by reference.
- Traditionally it has been a challenge to remove thick and or multiple layers of depositions of metals and precious metals from various types of substrates. Current methods typically involve manually or mechanically removing depositions, including precious metal layers, which can damage substrates. Other methods can include the use of aggressive or poisonous chemicals to remove the precious metals that can also damage or destroy the substrate or that may not remove the entire deposition from the substrate. Therefore, it was desirable to develop a chemical method to remove layers of depositions, including precious metals, form various types of substrates.
- Traditionally, separating different precious metals and metals has been a challenging if not impossible task. This has led to the loss of precious metals due to the lack of a viable method to separate then once they have been chemically changed from a metal to a compound in solution. Therefore, it was desirable to develop a chemical method to selectively remove metals and precious metals from a solution. Selective biomass sorption of metals and precious metals has been studied in the prior art. Hydrometallurgy 2010, 103, 180-189. Nilanjana, D.; Recovery of Precious Metals Through Biosorption, deals with biosorption in recovery of precious metals from aqueous solutions. The metal binding mechanism, as well as the parameters influencing the uptake of precious metals and isotherm modeling, is presented. Biotechnology Advances 2007, 25, 264-271, Mack, C.: Wilhelmi, B. Duncan, J. R., Burgess, J. E.; Biosorption of Precious Metals, reviews recent research regarding the biosorption of some precious metals, with emphasis on the effects of the biosorption environment and the biosorption mechanism identified. Biotechnology Advances 2006, 24, 427-451. Wang, J., Chen, C.; Biosorption of Heavy Metals by Saccharomyces cerevisae: A Review, elucidates the mechanism of metal uptake. Various mechanism assumptions of metal uptake by S. cerevisiae are summarized. Kvasinky, Bachelor's thesis, Marketa Novakova, 2010, deals with Saccharomyces cerevisiae, and summarizes cell biological study, and its genome, reproduction, growth conditions, and metabolism.
- This invention concerns use of organo amines, to protect a substrate from damage during the removal of a deposition consisting of one or more layers of metal and/or precious metals adhered to the substrate. Once in solution, it is disclosed in this invention to use certain types of reduction methods and/or biomass materials to extract and separate the different types of metals and/or precious metals. The use of inorganic nitrogen compounds is also contemplated for use with the present invention.
- The invention provides a method to remove depositions, including metals and precious metals such as gold and/or platinum and/or silver and/or palladium and/or indium, from a substrate without damaging the substrate and/or efficiently extract it from different substrates.
- The invention would be a suitable replacement for aqua regia, a known powerful acid traditionally used to recovery gold and platinum. Additionally, the invention provides a method for the removal/extraction/separation of metals and precious metals from different abrasive blasting media and from solutions of mixtures of metals and precious metals, from ores, and from other sources.
- The invention will allow for the recovery of gold, platinum, silver, palladium, indium and other metals and precious metals utilizing a chemical method of stripping, separation, and purification from different substrates that results in high yields and purity while preserving the substrates. The invention may be used either in a batch process for treatment of discrete materials with coatings or in a continuous process for materials in long rolls. The invention has the potential to offer “green technology” by allowing the recovery and recycling of substrates, especially polymeric substrates that are normally destroyed when recovering precious metals and by avoiding the use of poisonous chemicals (cyanides for instance) while extracting gold and platinum from ores.
- The invention consists of two chemical constituents: a PROTECTANT “P” and an ACTIVE chemical “A” that function to remove a layer and/or multiple layers of depositions, including metals and/or precious metals, from various types of substrates while not damaging the substrate. PROTECTANT agent “P” functions in the reaction as a surface protectant for the substrate. Additionally, PROTECTANT agent “P” can function as a COMPLEXING agent “C” with metals that are oxidized and/or form other metal compounds. The PROTECTANT agent “P” may be added to the reaction directly or created in situ by the chemical reaction between REAGENT “R” and the ACTIVE chemical “A”. Since the PROTECTANT agent “P” protects the surface of the substrate, it allows the ACTIVE chemical “A” to be a chemical or mixture of chemicals (such as aqua regia) that would otherwise damage the substrate while dissolving or separating the precious metals from the substrate.
- It has turned out that the protectant function according to the invention is best performed by mono-, di-, tri-substituted amines and/or their hydrohalides and/or tetra-substituted ammonium halides, wherein each substituent is independently an alkyl, a cycloalkyl or a substituted alkyl. The term “alkyl” as used herein means an aliphatic linear or branched group having 1 to 18 carbon atoms. The term “cycloalkyl” herein means a cyclic aliphatic group having 3 to 8 carbon atoms. The term “substituted alkyl” as used herein means an aliphatic linear or branched group having 1 to 18 carbon atoms substituted by different functional groups, such as hydroxy-group and/or carboxy-group and/or hydroxy and carboxy group,
- Examples of surface PROTECTANT “P”/COMPLEXING agent “C” chemical include the organo-amines such as trimethylamine hydrochloride ((CH3)3N.HCl), dimethylamine hydrochloride ((CH3)2NH.HCl), methylamine hydrochloride (CH3NH2.HCl), triethylamine hydrochloride ((CH3CH2)3N.HCl), dimethylamine hydrochloride ((CH3CH2)2NH.HCl), methylamine hydrochloride (CH3CH2NH2.HCl), cyclohexylamine hydrochloride (C6H11NH2.HCl), dicyclohexylamine hydrochloride ((C6H11)2NH.HCl), N,N-dimethylcyclohexylamine hydrochloride (C6H11N(CH3)2.HCl), diisopropylamine hydrochloride ((CH3)2CHNHCH(CH3)2.HCl), N-ethylcyclohexylamine hydrochloride (C6H11NC2H5.HCl), N-methylcyclohexylamine hydrochloride (C6H11NCH3.HCl), glycine betaine hydrochloride (CH3)3N+CH2COOH.Cl−, choline chloride [(CH3)3NCH2CH2OH]Cl, carnitine hydrochloride (CH3)3N(Cl)CH2CH(OH)CH2COOH, tetraethylammonium bromide [(CH3CH2)4N]Br, tetra-n-butylammonium fluoride (CH3CH2CH2CH2)4NF, methylamine hydroiodide (CH3NH2.HI), etc.
- Examples of REACTIVE “R” surface protectant/COMPLEXING “C” agents that can form amines in situ include dimethylformamide (DMF)-C3H7NO) and N-methyl pyrrolidone (NMP)-C5H9NO, and other organic compounds (such as amides and/or lactams) that can be split along the C—N bond into an amine and other organic compound (such as dimethylamine and formic acid in case of DMF).
- Examples of ACTIVE chemical “A” include inorganic acids and mixtures thereof from the group consisting of nitric acid (HNO3) and/or hydrofluoric acid (HF), and/or hydrochloric acid (HCl) and/or phosphoric acid (H3PO4), and/or fluorosilicic acid (H2SiF6), and/or ammonium peroxydisulfate ((NH4)2S2O8), and/or sulfuric acid (H2SO4), and other inorganic compounds that can cause splitting organic compounds (such as amides and/or lactams) along the C—N bond into organic amine(s) and other organic compounds and/or can dissociate any amine hydrochloride into the PROTECTANT “P” and COMPLEXING agent “C” to allow its dual action (protecting and complexing).
- Examples of substrates include aluminum, copper, steel, stainless steel, glass, titanium, their alloys, graphite, carbon fibre, ceramic, fused silica, quartz, blasting media (such as corundum, sand, corn cob, plastic abrasives, silicon carbide, pumice, steel grit, steel shot, walnut shells, soda, and glass beads), polymers (such as PEEK, PET, polyimide, polyether, etc.) and ores.
- The following equations illustrate the two chemical reaction mechanisms:
- [Deposition on Substrate]+P/C+A→Deposition (in solution) or Deposition-C (in solution)+Substrate-P+Solution
[Deposition on Substrate]+R/C+A→Deposition (in solution) or Deposition-C (in solution)+Substrate-P+Solution
where Deposition=one or more selected from Be, Mg, Ca, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, B, Al, Ga, In, Tl, C, Si, Sn, N, P, As, S, Se, Te, and their mixtures, and/or their chemical compounds. - Once the depositions have been separated from the substrate and dissolved and/or extracted into solution, separating the different precious metals has traditionally been a challenging if not impossible task. One method to remove metals from solution is the use of biomass materials to selectively biosorb reaction products that were originated in situ by chemical reactions between the deposition and/or “P” and/or “R” and/or “A”. The use of biomass materials allows one to reclaim metals and/or precious metals that would have otherwise been difficult and/or unsafe to separate. Specifically, certain types of biomass materials are able to bind and concentrate metals from aqueous solutions. A biosorption-based process offers a number of advantages including low cost, selective metal reclamation, high efficiency in metal complexation and high purity of the final metal.
- This invention consists of using selected biosorbants to recover metals and/or precious metals and/or their chemical compounds. Examples of selective biosorbants include seaweed (ie Spirulina platensis) and yeast (i.e. Saccharomyces cerevisiae).
- The following equations illustrate the selective chemical reaction mechanisms:
- [Mixture of M's (X,Y,Z)] (in solution)+Bioadsorbant (I)→[M (X)+Bioadsorbant]+[Mixture of M's (Y,Z)] (in solution
[Mixture of M (X,Y,Z)] (in solution)+Bioadsorbant (II)→[M (Y)+Bioadsorbant]+[Mixture of M's (X,Z)] (in solution)
where M=Metals and/or Precious Metals and/or their chemical compounds
X,Y,Z=Mixture of Metals and/or Precious Metals and/or their chemical compounds -
FIG. 1 depicts an apparatus for recovering gold from a PET substrate. The PET substrate is provided in spooled rolls. -
FIGS. 2 and 3 , the gold-hued PET is fed from the roll to a first station where it is soaked in a cleaning solution that was made in accordance with the teachings of the present invention. -
FIG. 4 , the substrate is passed from the first station to a second station that is filled with water. By passing the substrate through the second station, the majority of the solution from the first station is removed. -
FIG. 5 , the substrate is passed through a series of rollers to remove the rest of the cleaning solution and subsequently passed through a water mist. The liquids from all stations are subjected to a gold recovery process including reduction. -
FIG. 6 , the illustrated rolls are 425 meters long and two such rolls can be processed in approximately 90 minutes in the illustrated continuous process. -
FIG. 7 , approximately 187 g of gold are recovered for every 100 kg of the PET substrate. -
FIG. 8 illustrates a batch process for cleaning a substrate and recovering the gold plating. Gold-plated substrates are soaked in a cleaning solution that was made in accordance with the teachings of the present invention. Before submersions, the sheets have a metallic hue. -
FIG. 9 , after briefly soaking the substrate, the metallic hue is gone and the substrate is white. -
FIG. 10 provides a depiction of one submerged substrate (white) and one pre-treated substrate (metallic). -
FIG. 11 , after soaking, the residual cleaning solution is removed from the substrate by rising with water. -
FIG. 12 depicts the cleaned, white substrate. The gold layer was removed without damaging the substrate, including notes that were written on the substrate. -
FIG. 13 provides another depiction of the metallic substrate prior to treatment. -
FIG. 14 depicts an aqua regia solution dissolving a copper substrate. The copper wire gets dissolved within 40 minutes. -
FIGS. 15 and 16 illustrates the addition of DMF to the aqua regia solution and the subsequent inability of the DMF solution to rapidly dissolve the copper wire (FIG. 16 ). The copper wire stays intact long enough until the aqua regia dissolves a possible deposition. -
FIG. 17 depicts a copper part plated with gold, platinum and titanium. After two days of soaking in the inventive cleaning solution followed by brush cleaning, the majority of the metal layer was removed without damaging the copper. -
FIGS. 18 and 19 , the copper part is intact, i.e. the aqua regia selectively etched the deposition only, while DMF served as surface protectant. -
FIG. 20 depicts an aluminum part plated with SiOx deposits. In order to etch the SiOx the aluminum part was treated with DMF and a mixture of phosphoric acid and hydrofluoric acid (where the organo-amine is formed in-situ). -
FIG. 21 , a layer of black material was visible on the surface of the aluminum which was rinsed away with water. -
FIG. 22 depicts the aluminum part undamaged from this treatment method. Without wishing to be bound to any particular theory, applicant believes this black material is a protective layer that prevents damage to the aluminum part. -
FIGS. 23-27 depict that a multilayer deposition of gold, platinum, titanium, and aluminum has been dissolved and removed from a stainless steel substrate using an organo-amine and nitric acid.FIG. 23 depicts parts feeding into the reaction mixture (etching solution). The ratio of chemicals stays the same every time a fresh solution is prepared. All 4 of the metals were successfully dissolved/removed from the stainless steel substrate without damage to the substrate (FIG. 27 ). - FIG, subsequently, the gold was separated from the platinum, titanium, and aluminum using gold reduction methods; addition of the reducing agent;
-
FIG. 29 shows filtration of the solution with gold powder; -
FIG. 30-31 shows cleaning the melted gold's surface from residues), and purified to 99.99% minimum purity; -
FIGS. 31-34 show the platinum was separated from the titanium/aluminum solution using a biosorption method (for example, using yeast,FIGS. 32 through 34 ). - A sample of nitric acid (50%) and hydrochloric acid (31%) was prepared (1:1 volume ratio). Several pieces of copper wire were added to this solution. The copper wire completely dissolved within 40 minutes.
- A 20 mL sample of nitric acid (50%) and 20 mL hydrochloric acid (31%) was prepared in 200 mL N,N-dimethylformamide (DMF). Several pieces of copper wire were added to this solution. The copper wire showed no signs of dissolving within 40 minutes.
- A sample of 100 mL nitric acid (50%) and 300 mL hydrochloric acid (31%) was prepared in 4 L N,N-dimethylformamide (DMF). A solid piece of copper was coated with an alloy of gold, platinum and titanium. The copper was soaked in the sample solution for fourteen days at room temperature. The copper was removed from the solution and rinsed and manually washed to remove residual protective coating. The resulting copper appeared free of gold, platinum and titanium. There was no visible damage to the copper.
- A sample of phosphoric acid (50%) and hydrofluoric acid (50%) was prepared. A piece of aluminum foil was added to this solution. The aluminum completely dissolved within 20 minutes.
- A sample of 25 mL phosphoric acid (50%) and 25 mL hydrofluoric acid (50%) was prepared in 400 mL N,N-dimethylformamide (DMF). A piece of aluminum foil was added to this solution. The aluminum showed no signs of dissolving within 20 minutes.
- A sample of 30 L phosphoric acid (50%) and 30 L hydrofluoric acid (50%) was prepared in 200 L N,N-dimethylformamide (DMF). A sheet of aluminum was coated with a SiOx deposition. The aluminum was soaked in the sample solution for ten days at room temperature. The aluminum was removed from the solution and rinsed and manually washed to remove residual protective coating. The resulting aluminum appeared free of the SiOx deposits. There was no visible damage to the aluminum.
- A gold-coated polyethylene terephthalate (PET) substrate (57.6 kg) was provided as a rolled thin-film. The film was sequentially rolled through the solution 50 L of nitric acid (50% diluted) and 3.5 kg of trimethylamine hydrochloride at a rate of about 9 meters per minute. The film was rinsed under a stream of water to remove trace acid. After processing, the gold-color was no longer visible on the film and the cleaning agents were gold-colored. There was no visible damage to the PET substrate.
- A provided stainless steel substrate coated with gold, platinum, titanium and aluminum (44 parts of different weights and sizes) was submerged into an etching mixture of 240 L of nitric acid (50%) and 16 kg of trimethylamine hydrochloride. All layers of gold, platinum, titanium, and aluminum dissolved in the etching mixture within 3 hours to 30 days depending on the thickness of the layers. There was no visible damage to the stainless steel parts. The solution was subsequently subjected to a reduction and refinement process that separated the gold from the other metals and refined the gold to 99.99% minimum purity. To the remaining solution containing platinum, titanium, and aluminum yeast (Saccharomyces cerevisiae) was added in the ratio of 1 kg of yeast per 200 liters of the solution. The organo-platinum complex and/or metalorganic compound of platinum was left to selectively bioadsorb onto the yeast for one day to successfully separate the platinum from the other metals. Then yeast/organo-platinum adsorbate mix was then filtered off and burned at 1500° C. The remaining platinum oxide was isolated, pressed into pellets, and vacuum melted into platinum metal.
- The gold containing solutions of example 7 and 8 were subjected to a reduction and refinement protocol to provide 99.99% minimum purity gold—107.75 g of gold (187 g Au per 100 kg of the PET strip). The following describes the reduction and refinement protocol.
- Three pieces of gold of similar shape, each 30 grams, were submerged into three etching mixtures. Each mixture consisted of 15 liters of nitric acid (50%) and (1) 1 kg of trimethylamine hydrochloride, (2) 1 kg of dimethylamine hydrochloride, (3) 1 kg of methylamine hydrochloride. The speed of gold dissolutions were measured over the period of two weeks and compared. The experiments suggested that the amine hydrochloride ability to dissolve and/or etch gold decreases in the trimethylamine hydrochloride>dimethylamine hydrochloride>methylamine hydrochloride order. The speeds were: 0.81 g>0.65 g>0.52 g of gold weight loss per day (room temperature, no stirring).
- Five pieces of gold of similar shape, each 30 grams, were submerged into five etching mixtures. Each mixture consisted of 15 liters of nitric acid (50%) and (1) 1 kg of triethylamine hydrochloride, (2) 1 kg of diisopropylamine hydrochloride, (3) 1 kg of N-ethylcyclohexylamine hydrochloride, (4) 1 kg of dibutylamine hydrochloride and (5) 1 kg of trimethylamine hydrochloride. The speed of gold dissolutions were measured over the period of two weeks and compared. The experiments suggested that the amine hydrochloride ability to dissolve and/or etch gold decreases in the diisopropylamine hydrochloride>dibutylamine hydrochloride>triethylamine hydrochloride>N-ethylcyclohexylamine hydrochloride>trimethylamine hydrochloride order. The speeds were: 2.03 g>1.78 g>1.53 g>1.51 g>0.81 g of gold weight loss per day (room temperature, no stirring).
- Two pieces of gold of similar shape, each 30 grams, were submerged into two etching mixtures. Each mixture consisted of 15 liters of nitric acid (50%) and (1) 1 kg of N-ethylcyclohexylamine hydrochloride, purchased commercially, and (2) 1 kg of N-ethylcyclohexylamine hydrochloride, prepared in situ by mixing appropriate amounts of N-ethylcyclohexylamine and hydrochloric acid, followed by adding the nitric acid. The speed of gold dissolutions were measured over the period of two weeks and compared. The speeds were: 1.51 g/1.50 g per day (room temperature, no stirring). The experiments suggested that there is no difference in ability to dissolve and/or etch gold between the commercial and in situ prepared chemical.
- A gold-, silver-, indium-coated ethylene vinyl acetate (EVA) substrate (30 kg) was provided as a rolled thin-film. The film was sequentially rolled through the solution 25 L of nitric acid (50% diluted) and 1.5 kg of carnitine chloride at a rate of about 6 meters per minute. The film was rinsed under a stream of water to remove trace acid. After processing, there was no visible damage to the EVA substrate. The dark-color was no longer visible on the EVA film and the etching agents were yellow-colored and there was a visible precipitate of a silver salt. The silver salt was removed from the solution, rinsed, washed and subjected to refinement process to deliver silver in 99.9 minimum purity. The remaining solution containing indium and gold was subsequently subjected to a reduction and refinement process that separated the gold from indium and refined the gold to 99.99% minimum purity. The remaining solution containing indium was subsequently subjected to a treatment with sodium hydroxide (NaOH) and formic acid (HCOOH). The precipitate of an indium complex and/or metalorganic compound of indium was subsequently subjected to refinement process to obtain the indium in 99.9% minimum purity. The yields of silver, gold and indium were quantitative.
- A provided stainless steel substrate coated with gold, platinum, palladium, nickel, copper, and zinc was submerged into an etching mixture 6 L of nitric acid (50% diluted) and 0.5 kg of glycine betaine hydrochloride. All layers of gold, platinum, palladium, nickel, copper, and zinc dissolved in the etching mixture within 3 hours. There was no visible damage to the stainless steel substrate. The solution was subsequently subjected to a reduction and refinement process that separated the gold from platinum and palladium and from nickel, copper, and zinc, and refined the gold to 99.99% minimum purity. To the remaining solution containing platinum, palladium, nickel, copper, and zinc yeast (Saccharomyces cerevisiae) was added in the ratio of 0.05 kg of yeast per 10 liters of the solution. The organo-platinum complex and/or metalorganic compound of platinum was left to selectively bioadsorb onto the yeast for one day to successfully separate the platinum from the other metals. The yeast/organo-platinum adsorbate was then filtered off and burned at 1500° C. The remaining platinum oxide was isolated, pressed into pellets, and vacuum melted into platinum metal. The remaining solution containing palladium, nickel, copper, and zinc was subsequently subjected to a treatment with sodium hydroxide (NaOH) and acetic acid (CH3COOH). The precipitate of a palladium complex and/or metalorganic compound of palladium was subsequently subjected to refinement process to obtain the palladium in 99.9% minimum purity. The yields of gold, platinum and palladium were quantitative.
- A provided ceramic substrate coated with indium, iron, arsenate vanadium, magnesium, calcium, chromium, yttrium, thallium and manganese, was submerged into an etching mixture 6 L of nitric acid (50% diluted) and 0.5 kg of tetraethylammonium bromide. All layers of indium, iron, arsenate, vanadium, magnesium, calcium, chromium, yttrium, thallium and manganese, dissolved in the etching mixture within 3 hours. There was no visible damage to the ceramic substrate. The solution containing indium, iron, arsenate vanadium, magnesium, calcium, chromium, yttrium, thallium and manganese was subsequently subjected to a treatment with sodium hydroxide (NaOH) and formic acid (HCOOH). The precipitate of an indium complex and/or metalorganic compound of indium was subsequently subjected to refinement process to obtain the indium in 99.9% minimum purity. The yield of indium was quantitative.
- A provided glass substrate coated with palladium, beryllium, zirconium, niobium, tantalum and molybdenum was submerged into an etching mixture 6 L of nitric acid (50% diluted) and 0.5 kg of methylamine hydroiodide. All layers of palladium, beryllium, zirconium, niobium, tantalum and molybdenum dissolved in the etching mixture within 3 hours. There was no visible damage to the glass substrate. The solution containing palladium, beryllium, zirconium, niobium, tantalum and molybdenum was subsequently subjected to a treatment with sodium hydroxide (NaOH) and acetic acid (CH3COOH). The precipitate of a palladium complex and/or metalorganic compound of palladium was subsequently subjected to refinement process to obtain the palladium in 99.9% minimum purity. The yield of palladium was quantitative.
- A provided blasting sand with gold, carbide, yttrium, tungsten, gallium, sulfate and selenium was submerged into an etching mixture 6 L of nitric acid (50% diluted) and 0.5 kg of tetra-n-butylammonium fluoride. Gold, carbide, yttrium, tungsten, gallium, sulfate and selenium dissolved in the etching mixture within 3 hours. The solution was subsequently subjected to a reduction and refinement process that separated the gold from the other metals and refined the gold to 99.99% minimum purity. The yield of gold was quantitative.
- A provided carbon fiber precision parts coated with silver, cadmium, borate, silicon, tin, nitride, phosphate and tellurium was submerged into an etching mixture 6 L of nitric acid (50% diluted) and 0.5 kg of choline chloride. All layers of silver, cadmium, borate, silicon, tin, nitride, phosphate and tellurium dissolved in the etching mixture within 3 hours. There was no visible damage to the carbon fibre precision parts. A precipitate of a silver salt was visible in the solution after the etching. The silver salt was removed from the solution, rinsed, washed and subjected to refinement process to deliver silver in 99.9 minimum purity.
- Reduction and Refinement of Gold Recovered from a Substrate
- Once the gold has been removed from a substrate and is in solution as a complex and/or metalorganic compound, it must then be reduced through chemical treatment to form elemental gold.
- Reduction of the gold is accomplished as follows. Dilute the gold solution with between 60% to 80% by volume of the solution with distilled water. Then add a saturated aqueous solution of urea (H2NCONH2) to the diluted solution of gold (5 kg per 250 liters of solution) to destroy the nitric acid, HNO3. Neutralization of the solution is determined by standard methods such as pH, titration, visual, or by other methods. Once the solution has been neutralized, hydroxylamine hydrochloride, NH2OH.HCl, is added to the solution at room temperature. Addition of the hydroxylamine hydrochloride is done in 5 kg quantities until all of the gold has been precipitated from solution. Likewise, the hydroxylamine hydrochloride is added in 5 kg quantities so as to avoid any hazards in adding too much of the reducing agent too quickly. The presence of gold in the solution is tested on a small sample of solution using tin chloride, SnCl2. If gold is still present, a dark brown/black precipitate will form with the addition of tin chloride. If no gold is present, the color of the solution will stay the same and be free of precipitate. Once all of the gold has been precipitated from solution, most of the solution is decanted from the gold precipitate, the gold is then filtered through a standard filter paper, and rinsed with distilled water during filtration. The recovered gold powder and filter paper are dried at 120-130 C for 4 hours in a standard convection oven. The gold powder is weighed after it is fully dried, and all gold is removed from the filter paper, using a wire brush if necessary to get as much gold as possible from the paper. The gold powder is now transferred to a melting crucible, mixed with anhydrous sodium tetraborate (Na2B4O7), two teaspoons of borax per 200 grams of gold powder, and heated to 1180° C. for 5 to 10 minutes. The crucible is cooled in water and destroyed so as to remove the gold. The recovered gold “Roundlet” is boiled in nitric acid (12M, diluted by 50%, 2 hours minimum), rinsed with distilled water, air dried, weighed, rinsed with isopropyl alcohol, and air dried a final. The gold is now 99.99% minimum purity.
- Similar results have been obtained using other alkylamine and/or cycloalkylamine and/or substituted alkylamine hydrohalides and/or alkylammonium and/or cycloalkylammonium and/or substituted alkylammonium halides as protectant and/or complexing component.
Claims (21)
1. A method for removing metal and precious metal-containing depositions from a substrate, comprising the step of (i) treating the substrate with an organo amine protectant component (“P”) and an inorganic active component (“A”) or (ii) treating with a complexing component (“C”) and an “A”, wherein said component “P” or “C” is selected from the group consisting of mono-substituted amine hydrohalides, di-substituted amine hydrohalides, tri-substituted amine hydrohalides, and tetra-substituted ammonium halides, wherein each substituent is independently an alkyl having 1 to 18 carbon atoms or a cycloalkyl having 3 to 8 carbon atoms or an alkyl having 1 to 18 carbon atoms substituted by hydroxy-group or an alkyl having 1 to 18 carbon atoms substituted by carboxy-group or an alkyl having 1 to 18 carbon atoms substituted by hydroxy and carboxy group, and wherein said component “A” is an inorganic acid, a salt of an inorganic acid, or a mixture thereof.
2. The method of claim 1 , wherein said halide is chloride or fluoride or bromide or iodide.
3. The method of claim 1 , wherein said organo amine protectant is prepared in situ by reaction of an organic amine and hydrochloric- or hydrofluoric- or hydrobromic- or hydroiodic-acid.
4. The method of claim 1 , wherein said component “P” or “C” is selected from the group consisting of triethylamine hydrochloride, diethylamine hydrochloride, ethyl amine hydrochloride, cyclohexylamine hydrochloride, dicyclohexylamine hydrochloride, N,N dimethylcyclohexylamine hydrochloride, diisopropylamine hydrochloride, N ethylcyclohexylamine hydrochloride and N-methylcyclohexylamine hydrochloride, glycine betaine hydrochloride, choline chloride, carnitine chloride, tetra-n-butylammonium fluoride, tetraethylammonium bromide, methylamine hydroiodide.
5. The method of claim 1 , wherein said component “P” or “C” is selected from the group consisting of trimethylamine hydrohalide, dimethylamine hydrohalide and methylamine hydrohalide.
6. The method of claim 1 , wherein said component “P” or “C” is formed in situ by reaction of said component “A” with a reactive component “R”.
7. The method of claim 5 , wherein said component “R” is selected from the group consisting of organic amides and organic lactams.
8. The method of claim 6 , wherein said component “R” is dimethylformamide or N-methylpyrrolidone.
9. The method of claim 1 , wherein said component “A” is aqua regia.
10. The method of claim 1 , wherein said component “A” is selected from the group consisting of nitric acid, hydrofluoric acid, hydrochloric acid, phosphoric acid, hexafluorosilicic acid, ammonium peroxydisulfate and sulfuric acid and mixtures thereof.
11. The method of claim 1 , wherein said deposition comprises at least one material selected from the group consisting of Be, Mg, Ca, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, B, Al, Ga, In, Ti, C, Si, Sn, N, P, As, S, Se, Te, their mixtures, and their chemical compounds.
12. The method of claim 1 , wherein said substrate comprises at least one material selected from the group consisting of aluminum, copper, steel, stainless steel, glass, titanium, aluminum alloys, copper alloys, steel alloys, stainless steel alloys, titanium alloys, graphite, carbon fiber, ceramic, fused silica, quartz, polymers, ores and blasting media selected from the group consisting of: corundum, sand, corn cob, plastic abrasives, silicon carbide, pumice, steel grit, steel shot, walnut shells, soda and glass beads.
13. The method of claim 1 , wherein said metal is recovered from the solution resulting from said treatment.
14. The method of claim 13 , wherein said recovery is carried out by means of a biosorbant.
15. The method of claim 14 , wherein said biosorbant is selected from seaweed and yeast.
16. The method of claim 15 , wherein the biosorbant is Spirulina platensis.
17. The method of claim 15 , wherein the biosorbant is Saccharomyces cerevisiae.
18. The method of claim 13 , wherein said recovery is carried out by means of a reducing agent.
19. The method of claim 18 , wherein the reducing agent is hydroxylamine hydrochloride, glucose, sodium bisulfite, sulfur dioxide.
20. The method of claim 13 , wherein said recovery is carried out by means of an organic acid.
21-37. (canceled)
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ES2619568T3 (en) * | 2011-12-15 | 2017-06-26 | Entegris Inc. | Apparatus and method of extraction of welding metals during the recycling of electrical and electronic waste equipment |
US20150329934A1 (en) * | 2014-05-15 | 2015-11-19 | Rulon W. Dahl | Dahl Process |
MX2018013486A (en) | 2016-05-06 | 2019-03-28 | Goldcorp Inc | Adsorbent composition, method of making the same, and uses thereof. |
CN107541728B (en) * | 2017-08-22 | 2019-06-25 | 河南科技大学 | A kind of preparation method being used to prepare corrosive agent of carbide and preparation method thereof, carbide in steel alloy |
CN109207724B (en) * | 2018-09-12 | 2020-12-29 | 哈尔滨工业大学(威海) | Extraction solvent and extraction method for simultaneously extracting and separating vanadium and chromium from vanadium and chromium-containing solution |
CN114505053B (en) * | 2021-03-30 | 2022-12-09 | 长沙华时捷环保科技发展股份有限公司 | Platinum-absorbing modified carbon fiber containing organic chelating group and preparation method and application thereof |
CN114318353B (en) * | 2021-12-27 | 2023-12-05 | 广东红日星实业有限公司 | Ash remover and preparation method and application thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080116170A1 (en) * | 2006-11-17 | 2008-05-22 | Sian Collins | Selective metal wet etch composition and process |
KR20100107399A (en) * | 2009-03-25 | 2010-10-05 | 간토 가가꾸 가부시키가이샤 | Gold and nickel selective etching liquid |
JP2011052315A (en) * | 2009-09-04 | 2011-03-17 | Nippon Telegr & Teleph Corp <Ntt> | Metal-collecting apparatus and metal-collecting method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3957505A (en) * | 1974-08-05 | 1976-05-18 | Bayside Refining And Chemical Company | Gold reclamation process |
US4302246A (en) * | 1980-01-03 | 1981-11-24 | Enthone, Incorporated | Solution and method for selectively stripping alloys containing nickel with gold, phosphorous or chromium from stainless steel and related nickel base alloys |
US4746369A (en) * | 1982-01-11 | 1988-05-24 | Enthone, Incorporated | Peroxide selective stripping compositions and method |
JPH084Y2 (en) * | 1990-04-09 | 1996-01-10 | 紀伊産業株式会社 | Container lid opening and closing mechanism |
US5512201A (en) | 1995-02-13 | 1996-04-30 | Applied Chemical Technologies, Inc. | Solder and tin stripper composition |
JP2001140084A (en) * | 1999-08-27 | 2001-05-22 | Mec Kk | Etching solution for nickel or nickel alloy |
JP2001140081A (en) * | 1999-08-31 | 2001-05-22 | Kobe Steel Ltd | Copper or copper alloy tube with corrosion resistant film |
CN100595894C (en) * | 2005-10-28 | 2010-03-24 | 关东化学株式会社 | Palladium-selective etching solution and method for controlling etching selectivity |
WO2012031194A2 (en) * | 2010-09-03 | 2012-03-08 | Georgia Tech Research Corporation | Compositions and methods for the separation of metals |
EP2751296A1 (en) * | 2011-09-01 | 2014-07-09 | Dedek, Petr | Method for the removal and recovery of metals and precious metals from substrates |
-
2012
- 2012-08-29 EP EP12772876.4A patent/EP2751296A1/en active Pending
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-
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080116170A1 (en) * | 2006-11-17 | 2008-05-22 | Sian Collins | Selective metal wet etch composition and process |
KR20100107399A (en) * | 2009-03-25 | 2010-10-05 | 간토 가가꾸 가부시키가이샤 | Gold and nickel selective etching liquid |
JP2011052315A (en) * | 2009-09-04 | 2011-03-17 | Nippon Telegr & Teleph Corp <Ntt> | Metal-collecting apparatus and metal-collecting method |
Non-Patent Citations (4)
Title |
---|
English translation of JP-2011052315-A Description (Year: 2011) * |
English translation of KR 20100107399 A Description (Year: 2010) * |
Robinson, Richard K.. (2000). Encyclopedia of Food Microbiology, Volumes 1-3 - Saccharomyces Cerevisiae. (pp. 1918). Elsevier. Retrieved from https://app.knovel.com/hotlink/pdf/id:kt0051M641/encyclopedia-food-microbiology/saccharomyces-cerevisiae (Year: 2000) * |
Seker, A., et al. "Equilibrium, thermodynamic and kinetic studies for the biosorption of aqueous lead(II), cadmium(II) and nickel(II) ions on Spirulina platensis." Journal of Hazardous Materials 154 (2008) 973–980. (Year: 2008) * |
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