US20210235814A1

US20210235814A1 - Sole assembly and a high heel footwear having the same

Info

Publication number: US20210235814A1
Application number: US16/781,242
Authority: US
Inventors: YiXiu YE; Ulrich Johannes Schraudolph; Siddartha Butalia
Original assignee: Hera Pte Ltd
Current assignee: Hera Pte Ltd
Priority date: 2020-02-04
Filing date: 2020-02-04
Publication date: 2021-08-05

Abstract

A sole assembly and a high heel footwear having the same and methods for manufacturing the sole assembly and the high heel footwear are disclosed. The sole assembly includes an insole board comprising a forefoot portion, a heel portion, and a raised outer edge, wherein the heel portion is elevated with respect to the forefoot portion forming an arch therebetween; and an insole platform positioned above the insole board, the insole platform comprising a plurality of contours on an upper surface and a plurality of holes at a lower surface.

Description

FIELD OF INVENTION

The present disclosure relates to a sole assembly, a high heel footwear having such a sole assembly, and methods of manufacturing these.

BACKGROUND

The typical high heel shoe or a stiletto (for a slim heel), has not changed in structural construction since it was introduced into modern fashion in the 1950's. The typical construction of a high heel shoe includes a toe-puff (or toe-box), an upper, a stiffener, a sock, an inner sole, a metal shank, a bottom filling, an outsole, a heel and a heel tip.
Several problems are associated with the current construction of the high heel shoe. Examples of such problems include little to no shock absorbency on the insole, midsole and outsole. When a wearer exerts her weight onto a small area, the impact is directed to the balls of the feet that are bound within a rigid and contained toe-box. The rigid toe-box has a confined, limited space that does not allow for expansion of the wearer's feet if she is standing or sitting for prolonged periods of time. Further, the insole board is typically rigid and has little to no flex mechanism, which results in constricting natural movement of the feet. The upper may be too stiff which may result in blisters and/or skin chaffing at the heel. The insole paddings for current high heel shoes, which are typically between 2 millimetres to 4 millimetres, are inadequate and may cause discomfort to the wearer.
Other problems include the last, which is the foot-shaped mould around which the shoe is constructed, may be improperly sized such that the toe-box is too small and the foot-bed is too wide or too narrow. The incline of the shoe, which is the slope between the heel and ball area, is also not ergonomic in current high heel shoes as it has a steep gradient that keeps the foot in an extended position, where the foot's arch exceeds the natural resting arch position of the foot and causes discomfort to the wearer.
The above shortcomings of a typical high heel shoe result in health problems to the wearer such as bunions, Morton's neuroma, hammer toes, metatarsalgia, calf, knee and even back pain. Apart from the clinical problems, high heel shoes frequently and commonly cause discomfort to the wearer. For example, in a 2014 survey by the American Podiatric Medical Association (APMA), 71% of high heel wearers complain that high heel shoes hurt their feet.
Even though several solutions had been proposed to alleviate the above problems, the changes are marginal and do not fully address the above problems. Examples include providing soft foam cushioning in the interior cushioning of the shoe (US Patent Application US 2016/0360825 A1 and US 2015/0107031 A1) and replacement of the shank with an overmolded insole board (U.S. Pat. No. 9,781,973 B2). However, the amount of soft foam cushioning for comfort is still limited and the insole board, which provides structure and support for the foot, takes up space, causes discomfort and does not provide adequate shock-absorbency in the shoe. At the same time, there is also the challenge of space constraints when making improvements due to the limited amount of space in a high heel shoe as it needs to maintain a sleek appearance.
A need therefore exists to provide a sole assembly for a high heel footwear and a method of manufacturing the same that seeks to address at least some of the above problems.

SUMMARY

According to a first aspect of the present invention, there is provided an insole board for a high heel footwear, the insole board comprising a forefoot portion, a heel portion, and a raised outer edge, wherein the heel portion is elevated with respect to the forefoot portion forming an arch therebetween.
The forefoot portion may comprise a hole extending from a first end of the forefoot portion to a second end of the forefoot portion, the second end of the forefoot portion being adjacent to the arch.
The insole board may be made of a composite material.
The composite material may comprise carbon fibre and/or glass fibre.
According to a second aspect of the present invention, there is provided a sole assembly for a high heel footwear, the sole assembly comprising: the insole board according to the first aspect; and an insole platform positioned above the insole board, the insole platform may comprise a plurality of contours on an upper surface and a plurality of holes at a lower surface.
The insole platform may be made of one or more shock-absorbent materials.
According to a third aspect of the present invention, there is provided a high heel footwear comprising: the sole assembly according to the second aspect; an outsole configured to be secured to a lower surface of the insole board; a footwear upper comprising a border of material along an outer edge of the footwear upper to securely mount the footwear upper to the sole assembly; a heel secured to the insole board at the heel portion; and an insole cushion attached on the insole platform.
The border of material may be affixed to at least one of the upper and lower surfaces of the insole board.
According to a fourth aspect of the present invention, there is provided a method of manufacturing a sole assembly, the method comprising the steps of: forming an insole board comprising a forefoot portion and a heel portion such that the heel portion is elevated with respect to the forefoot portion forming an arch therebetween, and such that the insole board comprises a raised outer edge and a hole extending from a first end of the forefoot portion to a second end of the forefoot portion, the second end of the forefoot portion being adjacent to the arch; and mounting an insole platform above the insole board.
Forming the insole board may comprise forming the insole board from a composite material.
According to a fifth aspect of the present invention, there is provided a method for manufacturing a high heel footwear, the method comprising the steps of: providing the sole assembly according to the fourth aspect; mounting a footwear upper comprising a border of material along an outer edge of the footwear upper such that the border of material is received by the sole assembly; securing a heel to the insole board at the heel portion; securing an outsole to a lower surface of the insole board; and attaching an insole cushion on the insole platform.
Mounting the footwear upper to the sole assembly may comprise affixing the border of material of the footwear upper to at least one of the upper and lower surfaces of the insole board.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying Figures, where like reference numerals refer to identical or functionally similar elements throughout the separate views and which together with the detailed description below are incorporated in and form part of the specification, serve to illustrate various embodiments and to explain various principles and advantages in accordance with a present embodiment, by way of non-limiting example only.

Embodiments of the invention are described hereinafter with reference to the following drawings, in which:

FIG. 1 shows a plan and perspective view of an insole board according to an example embodiment.

FIG. 2 shows a plan and perspective view of an insole platform according to an example embodiment.

FIG. 3A shows an exploded perspective view of the components of a sole assembly having the insole board of FIG. 1 and the insole platform of FIG. 2 according to an example embodiment.

FIG. 3B shows a perspective view of the sole assembly of FIG. 3A with the components assembled according to an example embodiment.

FIG. 4 shows an exploded perspective view of a high heel footwear having the assembled sole assembly of FIG. 3B according to an example embodiment.

FIG. 5A shows a plan perspective view of the high heel footwear of FIG. 4 according to an example embodiment.

FIG. 5B shows a cross sectional view of the high heel footwear of FIG. 4 according to an example embodiment.

FIG. 5C shows an end perspective view of the high heel footwear of FIG. 4 according to an example embodiment.

FIG. 5D shows a bottom perspective view of the high heel footwear of FIG. 4 according to an example embodiment.

FIG. 6 shows a flowchart illustrating a method for manufacturing the sole assembly of FIG. 3A according to an example embodiment.

FIG. 7 shows a flowchart illustrating a method for manufacturing the high heel footwear of FIG. 4 according to an example embodiment.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and is not intended to limit the invention or the application and uses of the invention. Furthermore, there is no intention to be bound by any theory presented in the preceding background of the invention or the following detailed description. Herein, a sole assembly and a high heel footwear and a method of manufacturing the same are presented in accordance with example embodiments having the advantages of comfort, flexibility and rigidity.
In the following description, a high heel footwear may refer to a footwear where a heel portion of the footwear is elevated with respect to a forefoot portion of the footwear. The elevation of the heel portion may range from 3 centimeters (cm) to 13 cm.
FIG. 1 shows a plan and perspective view of an insole board 100 according to an example embodiment. The insole board 100 includes a forefoot portion 102, a heel portion 104 and a raised outer edge 106. The heel portion 104 is elevated with respect to the forefoot portion 102 forming an arch 114 therebetween. The forefoot portion 102 may include a hole 108 extending from a first end 110 of the forefoot portion 102 to a second end 112 of the forefoot portion 102, the second end 112 of the forefoot portion 102 being adjacent to the arch 114 of the insole board 100. The hole 108 may be ovoid in shape and may be approximately 35 mm to 70 mm wide and 60 mm to 90 mm long in one implementation. The hole 108 may allow the provision of an uninterrupted and thickened shock absorbent structure to be attached between the floor and the foot. The hole 108 may also provide flexibility in the ball of the foot, such that it allows the wearer to flex the ball area of their foot slightly and can enable the wearer to maintain a natural walking motion.
In an alternative embodiment, the insole board 100 may only include the heel portion 104, the arch 114 and the second end 112 of the forefoot portion 102. It can be appreciated that the hole 108 as shown in FIG. 1 is not present in such an embodiment. The insole board 100 may be ergonomic in shape such that any contours that are formed may cause the insole board 100 to have a smooth gradient from the heel portion 104 to the forefoot portion 102. The arch 114 may have a slight elevation at a medial longitudinal arch and a lateral longitudinal arch area (not shown). The raised outer edge 106 may have a height up to 10 mm. The raised outer edge 106 may maintain the rigidity of the insole board 100 to hold the wearer's foot securely in place. This can prevent a lateral (twisting) motion of the wearer's feet which can be dangerous to the wearer.
The insole board 100 may be made of a composite material such as carbon fibre and/or glass fibre. For example, the composite material may be overmolded, or overmolded with carbon fibre pellets which may provide reinforcement to the insole board 100. The features of the insole board 100 as described above may allow the insole board 100 to withstand a high load (e.g. at least 80 kg) and still be able to provide the flexibility and rigidity as described above. The use of composite material such as carbon fibre may provide a high strength-to-mass ratio as well as flexibility to the insole board 100. Thus, less material and space is taken up by the insole board 100. Further, the insole board 100 can eliminate the need for a metal shank present in typical high heel shoes. Advantageously, the saved space can be further utilized to improve shock absorbency or cushioning while maintaining an overall sleek appearance.
FIG. 2 shows a plan and perspective view of an insole platform according to an example embodiment. The insole platform 200 includes a forefoot portion 202 and a heel portion 204. The insole platform 200 may be made of a shock-absorbing material instead of the typical rigid, hard platform piece and may provide abundant cushioning at the ball and heel area of a wearer's feet. The insole platform 200 may have an ergonomic configuration at the ball, heel and arches of foot areas and may be 2 mm to 20 mm in height in one implementation. Further, the insole platform may comprise two or more layers of shock- absorbent materials 206, 208 of varying densities to provide graduated shock absorbency. The two or more layers of shock- absorbent materials 206, 208 may be molded as a single piece or may be attached to each other separately. As the insole platform 200 is not rigid, it may take the shape of a corresponding component when secured with it. For example, the insole platform 200 may be positioned above the insole board 100 such that the forefoot portion 202 is elevated with respect to the heel portion 204, thereby forming an arch therebetween. The insole platform 200 may include a heel cup 212 at the heel portion 204. The heel cup 212 may be integrally formed with the insole platform 200 which may hold the user's heel securely in place with the high heel footwear.
As shown in the Figure, the forefoot portion 202 may have a higher thickness that the heel portion 204 to provide additional cushioning to the forefoot of the wearer. The forefoot portion 202 may also include a protrusion at a lower surface such that the protrusion is shaped to fit the hole 108 of the insole board 100 for securing the insole platform 200 to the insole board 100. Alternatively, the lower surface of the forefoot portion 202 may be flat and a filler material may be used to fit the hole 108 of the insole board 100. The height of the insole platform 200 may be between 2 mm to 20 mm in one implementation. The insole platform 200 may also include impact softening features at the heel, foot strike and arches. For example, a footbed 214 may be positioned at the forefoot portion 202 of the insole platform 200. The footbed 214 may include reinforced cushioning to provide shock absorbency at the footstrike of the user. The insole platform 200 may reduce the effective gradient of the arch 114 such that the wearer's foot is in a more natural slope than if it were the full height of a shoe heel without the said platform. This may be achieved by providing a plurality of contours on an upper surface to have a smooth gradient from the heel portion 204 to the forefoot portion 202. Contour guidelines 216 may be provided between the footbed 214 and the heel cup 212. The insole platform 200 may also include a plurality of holes 210 (as shown in FIG. 3A, FIG. 3B and FIG. 4) at the lower surface, which may increase shock absorbency and may reduce the weight of the insole platform 200. The plurality of holes 210 may be in the form of nestled cells of circular, hexagonal or other geometric or organic shape.
FIG. 3A shows an exploded perspective view of the components of a sole assembly having the insole board of FIG. 1 and the insole platform of FIG. 2 while FIG. 3B shows a perspective view of the sole assembly of FIG. 3A with the components assembled according to an example embodiment. The sole assembly 300 includes the insole board 100 and the insole platform 200 such that the insole platform 200 is positioned above the insole board 100. In the Figures, the lower surface of the insole platform 200 is flat and filler material (shown as 502 in FIG. 5B) is used to fit the hole 108 of the insole board 100. The filler material may include layers of foam, gel, or other cushioning material, either pasted or interlocked, that provides immediate comfort to the wearer. The filler material may also be made of shock-absorbent material that may absorb or dampen shock impulses so as to provide protection to the wearer's foot. The insole platform 200 may be secured to the insole board 100 by conventional methods such as adhesive bonding and/or the use of fasteners (e.g. rivets, screws etc.).
FIG. 4 shows an exploded perspective view of a high heel footwear having the assembled sole assembly of FIG. 3B according to an example embodiment. The high heel footwear 400 includes the insole assembly 300 and a heel 402. The heel 402 may be secured to the insole board 100 by fastening means such as nails, screws, rivets etc. In an alternative embodiment, the heel 402 and the insole board 100 may be a single component, i.e. the heel 402 and the insole board 100 may be molded as a single piece. This may advantageously add strength to the sole assembly and dispense the need for nails or screws to attach the heel 402 to the insole board 100.
FIGS. 5A, 5B, 5C and 5D show a plan perspective view, a cross-sectional view, an end perspective view and a bottom perspective view of the high heel footwear of FIG. 4 according to an example embodiment. In the Figures, the heel 402 is secured to the heel portion 104 of the insole board 100. The high heel footwear 400 may also include an outsole 508 that extends from a forefoot portion to the heel portion. The outsole 508 may be configured to be secured to a lower surface of the insole board 100. The outsole 508 may be marked and textured at the forefoot portion to provide grip while walking and may also include an opening 506 located below the arch 114 of the insole board 100. As shown in FIG. 5B, the filler material 502 is positioned in the hole 108 of the insole board 100 to protect and provide comfort to the forefoot of the wearer.
The high heel footwear 400 may also include a footwear upper (not shown) and an insole cushion (not shown). The footwear upper is positioned above the sole assembly 300 via a shoe last (not shown) while the insole cushion (or padding) may be attached onto the insole platform 200. The insole cushion may provide minor adjustments for better fit for the wearer because a human's left and right foot may typically have slight variations in size and the insole padding may accommodate such a difference to provide comfort to the wearer. Additional insole cushions can be added as the structure of the insole board 100 minimizes the space used. This can result in additional comfort and space to accommodate a wider range of foot sizes and provide better fit, for example, swelling of the foot after prolonged standing.
In an embodiment, the footwear upper may be attached to the insole board 100 and subsequently, the insole board 100 together with the footwear upper, are secured to the insole platform 200. The footwear upper may include a border of material along an outer edge of the footwear upper such that the border of material is received by the insole board 100 and/or the sole assembly 300. More specifically, the border of material of the footwear upper may be affixed to at least one of the upper and lower surfaces of the insole board 100 to securely mount the footwear upper to the insole board 100. Alternatively, the border of material may also be received by the insole platform 200. In addition, a plurality of slits (not shown in the Figures) can also be included in the footwear upper in order to attach and remove accessories or adornments on the high heel footwear 400. The plurality of slits of the footwear upper can be functional (e.g. ankle strap, strap over the foot like a Mary Jane), or ornamental (e.g. tassels, brooches and other ornamental add-ons).
The shoe last may be a simplified mold that mimics the shape of a foot of a wearer. It may be an internal template onto which the footwear upper and the sole assembly 300 are assembled. In an embodiment, the shoe last of the high heel footwear 400 may be enlarged from typical shoe lasts by approximately 1 millimetre (mm) to 10 millimetres (mm) at the areas of a ball of the foot, a heel of the foot and at a top of the foot to accommodate the insole cushion. It can be appreciated that the high heel footwear 400 of the present embodiments removes the need of a shank, which is generally found in current high heel shoes and is typically a rigid metal bar that takes up space and causes discomfort to the wearer.
FIG. 6 shows a flowchart illustrating a method for manufacturing the sole assembly of FIG. 3A according to an example embodiment. At step 602, the method includes forming an insole board comprising a forefoot portion and a heel portion such that the heel portion is elevated with respect to the forefoot portion forming an arch therebetween, and such that the insole board comprises a raised outer edge and a hole extending from a first end of the forefoot portion to a second end of the forefoot portion, the second end of the forefoot portion being adjacent to the heel portion of the insole board. At step 604, the method includes mounting an insole platform above the insole board.
FIG. 7 shows a flowchart illustrating a method for manufacturing the high heel footwear of FIG. 4 according to an example embodiment. At step 702, the method includes providing the sole assembly as described. At step 704, the method includes mounting a footwear upper comprising a border of material along an outer edge of the footwear upper such that the border of material is received by the sole assembly. Alternatively, the footwear upper may also be mounted onto the insole platform such that the border of material is received by the insole platform. At step 706, the method includes securing a heel to the insole board at the heel portion. At step 708, the method includes securing an outsole to a lower surface of the insole board. At step 710, the method includes attaching an insole cushion on the insole platform.
The high heel shoe assembly and the method of manufacturing the high heel shoe assembly as described herein may result in having an insole board that is thinner and a lighter than a traditional cardboard-and-shank insole board. Such a reduction in thickness creates additional space that can be used to accommodate shock absorbent material. The reduction in weight may also reduce wearer fatigue and provide comfort to the wearer. It may also be rigid from the ball to the heel of the foot to provide support for the foot, flexible at the toe box area and shock-absorbent throughout to provide comfort to the wearer. The high heel shoe assembly may also be applied to any shoe that has heel elevation, that requires a rigid structure from the elevated heel to the mid-foot, which includes any women's shoe that has a heel (e.g. closed or open-toe pumps, sandals, boots etc.), men's shoes that have heel elevation (e.g. dress shoes), dancing shoes that have heel elevation (for women, men, and children) and/or girl's high heel shoes.
In addition, a unique appearance can be achieved in the example embodiments. For example, the footwear in FIG. 5D may have a distinguishing physical look which may include a visible side profile 504 of the insole board 100 that may be exposed or coloured and and/or having an opening 506 at the outsole 508. The colouring can be achieved by wrapping, spray painting or dyeing. The opening 506 may create an exposed area, as shown in FIG. 5D, and may be ornamental as a distinguishing mark of the present invention.
It will be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.

Claims

1. An insole board for a high heel footwear, the insole board comprising a forefoot portion, a heel portion, and a raised outer edge, wherein the heel portion is elevated with respect to the forefoot portion forming an arch therebetween.

2. The insole board as claimed in claim 1, wherein the forefoot portion comprises a hole extending from a first end of the forefoot portion to a second end of the forefoot portion, the second end of the forefoot portion being adjacent to the arch.

3. The insole board as claimed in claim 2, wherein the insole board is made of a composite material.

4. The insole board as claimed in claim 3, wherein the composite material comprises carbon fibre and/or glass fibre.

5. A sole assembly for a high heel footwear, the sole assembly comprising:

the insole board as claimed in claim 1; and

an insole platform positioned above the insole board, the insole platform comprising a plurality of contours on an upper surface and a plurality of holes at a lower surface.

6. The sole assembly as claimed in claim 5, wherein the insole platform is made of one or more shock-absorbent materials.

7. A high heel footwear comprising:

the sole assembly as claimed in claim 5;

an outsole configured to be secured to a lower surface of the insole board;

a footwear upper comprising a border of material along an outer edge of the footwear upper to securely mount the footwear upper to the sole assembly;

a heel secured to the insole board at the heel portion; and

an insole cushion attached on the insole platform.

8. The high heel footwear as claimed in claim 7, wherein the border of material is affixed to at least one of the upper and lower surfaces of the insole board.

9. A method of manufacturing a sole assembly, the method comprising the steps of:

forming an insole board comprising a forefoot portion and a heel portion such that the heel portion is elevated with respect to the forefoot portion forming an arch therebetween, and such that the insole board comprises a raised outer edge and a hole extending from a first end of the forefoot portion to a second end of the forefoot portion, the second end of the forefoot portion being adjacent to the arch; and

mounting an insole platform above the insole board.

10. The method as claimed in claim 9, wherein forming the insole board comprises forming the insole board from a composite material.

11. The method as claimed in claim 10, wherein the composite material comprises carbon fibre and/or glass fibre.

12. The method as claimed in claim 9, wherein the insole platform is made of one or more shock-absorbent materials.

13. The method as claimed in claim 9, wherein the insole platform comprises a plurality of contours at an upper surface and a plurality of holes at a lower surface.

14. A method for manufacturing a high heel footwear, the method comprising the steps of:

providing the sole assembly as claimed in claim 9;

mounting a footwear upper comprising a border of material along an outer edge of the footwear upper such that the border of material is received by the sole assembly;

securing a heel to the insole board at the heel portion;

securing an outsole to a lower surface of the insole board; and

attaching an insole cushion on the insole platform.

15. The method as claimed in claim 14, wherein mounting the footwear upper to the sole assembly comprises affixing the border of material of the footwear upper to at least one of the upper and lower surfaces of the insole board.