US20200319682A1 - Electronic device including display - Google Patents

Electronic device including display Download PDF

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Publication number
US20200319682A1
US20200319682A1 US16/804,278 US202016804278A US2020319682A1 US 20200319682 A1 US20200319682 A1 US 20200319682A1 US 202016804278 A US202016804278 A US 202016804278A US 2020319682 A1 US2020319682 A1 US 2020319682A1
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US
United States
Prior art keywords
area
electronic device
disposed
front plate
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/804,278
Other languages
English (en)
Inventor
Chanyoung MOON
Hokeun KWAK
Jungpa SEO
Yongkoo HER
Donghyun Yeom
Jonghoon WON
Kihuk LEE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Lee, Kihuk, HER, YONGKOO, KWAK, Hokeun, MOON, CHANYOUNG, SEO, Jungpa, WON, Jonghoon, YEOM, DONGHYUN
Publication of US20200319682A1 publication Critical patent/US20200319682A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
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    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
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    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1628—Carrying enclosures containing additional elements, e.g. case for a laptop and a printer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
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    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • G—PHYSICS
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    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G—PHYSICS
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    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
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    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1635—Stackable modules
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0465—Improved aperture ratio, e.g. by size reduction of the pixel circuit, e.g. for improving the pixel density or the maximum displayable luminance or brightness
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light

Definitions

  • the disclosure relates to an electronic device including a display. More particularly, the disclosure relates to a device having multiple coaxial areas around the center of a lens each having varied wire density and pixel density to control the amount of light traveling into the lens.
  • Electronic devices for example, mobile electronic devices have been used in various fields closely connected with our life with technological development. Such electronic devices are manufactured in various sizes in accordance with the functions and preferences of users and may include a large-screen touch display for securing wide visibility and convenient operation. Electronic devices have been developed in the direction of relatively expanding the display area more than other electronic devices even if they have the same size.
  • An electronic device may include a display that can be seen from the outside through at least a portion of a front plate (e.g., a window or a front cover).
  • a front plate e.g., a window or a front cover.
  • the areas of displays are being increased so that the displays can be exposed through the entire area of front plates.
  • the arrangement structure of various electronic parts disposed to be able to detect the external environment through a front plate for example, at least one camera device or various sensors (e.g., an illumination sensor, an iris sensor, an ultrasonic sensor, or an infrared sensor) is also unavoidably changed. This is because if the electronic parts are disposed in a black matrix (BM) area outside the display area of a front plate, there is a limit in expanding the display area.
  • BM black matrix
  • a display may have an opening (e.g., a punch hole or a bored hole) at a position corresponding to the electronic part (e.g., a camera module).
  • the electronic part can be disposed close to the rear side of a front plate at least partially through the opening of the display and can perform its function.
  • the front plate may have a printed area surrounding a camera exposure area to hide a stacked structure, a machined portion, or an internal structure such as wires around the opening of the display that may be seen through the camera exposure area from the outside.
  • a printed area may not only increase the portion that a camera disposition area occupies, but also deteriorate the external design together with the camera exposure area in a large-screen display.
  • an aspect of the disclosure is to provide an electronic device including a display.
  • Another aspect of the disclosure is to provide an electronic device that may be disposed such that a camera module can operate through a display even though an opening is not formed at a display panel.
  • Another aspect of the disclosure is to provide an electronic device including a display in which a camera exposure area can be reduced by omitting a printed area.
  • an electronic device in accordance with an aspect of the disclosure, includes a front plate, a display panel disposed in an internal space of the electronic device visible through at least a portion of the front plate, and a camera module disposed in the internal space and including an image sensor disposed close to the display panel, in which the display panel has a first area having at least one of a first wire density or a first pixel density, a second area surrounded by the first area and having at least one of a second wire density lower than the first wire density or a second pixel density lower than the first pixel density, and a third area surrounded by the second area and at least partially overlapping a center of the image sensor when viewing the front plate from above.
  • FIG. 1 is a front perspective view of a mobile electronic device according to an embodiment of the disclosure
  • FIG. 2 is a perspective view showing the rear side of the electronic device of FIG. 1 according to an embodiment of the disclosure
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to an embodiment of the disclosure
  • FIG. 4 is a separate perspective view showing a stacked structure of a display according to an embodiment of the disclosure.
  • FIG. 5 is a partial cross-sectional view of the electronic device taken along line A-A′ of FIG. 1 according to an embodiment of the disclosure
  • FIG. 6 is a view showing a disposition configuration of a display according to an embodiment of the disclosure.
  • FIGS. 7A and 7B are views showing a wire disposition configuration in a second area of a display panel according to various embodiments of the disclosure.
  • FIG. 8 is a view showing a state in which a portion of a second area of a display panel is disposed in a light path of a lens according to an embodiment of the disclosure
  • FIG. 9 is a graph showing transmittance for each field of a lens according to a surrounding light quantity according to an embodiment of the disclosure.
  • FIGS. 10A and 10B are views illustrating a wire density and a pixel density in a second area of a display panel according to a lens designed in accordance with a surrounding light quantity according to various embodiments of the disclosure.
  • FIGS. 11A, 11B, and 11C are views showing stacked structures of a display according to various embodiments of the disclosure.
  • FIGS. 1 to 11C discussed below, and the various embodiments used to describe the principles of the disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the disclosure may be implemented in any suitably arranged system or device.
  • FIG. 1 illustrates a perspective view showing a front surface of a mobile electronic device according to an embodiment of the disclosure
  • FIG. 2 illustrates a perspective view showing a rear surface of the mobile electronic device shown in FIG. 1 according to an embodiment of the disclosure.
  • a mobile electronic device 100 may include a housing 110 that includes a first surface (or front surface) 110 A, a second surface (or rear surface) 110 B, and a lateral surface 110 C that surrounds a space between the first surface 110 A and the second surface 110 B.
  • the housing 110 may refer to a structure that forms a part of the first surface 110 A, the second surface 110 B, and the lateral surface 110 C.
  • the first surface 110 A may be formed of a front plate 102 (e.g., a glass plate or polymer plate coated with a variety of coating layers) at least a part of which is substantially transparent.
  • the second surface 110 B may be formed of a rear plate 111 which is substantially opaque.
  • the rear plate 111 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof.
  • the lateral surface 110 C may be formed of a lateral bezel structure (or “lateral member”) 118 which is combined with the front plate 102 and the rear plate 111 and includes a metal and/or polymer.
  • the rear plate 111 and the lateral bezel structure 118 may be integrally formed and may be of the same material (e.g., a metallic material such as aluminum).
  • the front plate 102 may include two first regions 110 D disposed at long edges thereof, respectively, and bent and extended seamlessly from the first surface 110 A toward the rear plate 111 .
  • the rear plate 111 may include two second regions 110 E disposed at long edges thereof, respectively, and bent and extended seamlessly from the second surface 110 B toward the front plate 102 .
  • the front plate 102 (or the rear plate 111 ) may include only one of the first regions 110 D (or of the second regions 110 E).
  • the first regions 110 D or the second regions 110 E may be omitted in part.
  • the lateral bezel structure 118 may have a first thickness (or width) on a lateral side where the first region 110 D or the second region 110 E is not included, and may have a second thickness, being less than the first thickness, on another lateral side where the first region 110 D or the second region 110 E is included.
  • the mobile electronic device 100 may include at least one of a display 101 , audio modules 103 , 107 and 114 , sensor modules 104 and 119 , camera modules 105 , 112 and 113 , a key input device 117 , a light emitting device, and connector holes 108 and 109 .
  • the mobile electronic device 100 may omit at least one (e.g., the key input device 117 or the light emitting device) of the above components, or may further include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. At least a part of the display 101 may be exposed through the front plate 102 that forms the first surface 110 A and the first region 110 D of the lateral surface 110 C. Outlines (i.e., edges and corners) of the display 101 may have substantially the same form as those of the front plate 102 . The spacing between the outline of the display 101 and the outline of the front plate 102 may be substantially unchanged in order to enlarge the exposed area of the display 101 .
  • a recess or opening may be formed in a portion of a display area of the display 101 to accommodate at least one of the audio module 114 , the sensor module 104 , the camera module 105 , and the light emitting device. At least one of the audio module 114 , the sensor module 104 , the camera module 105 , a fingerprint sensor (not shown), and the light emitting element may be disposed on the back of the display area of the display 101 .
  • the display 101 may be combined with, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the touch strength (pressure), and/or a digitizer for detecting a stylus pen. At least a part of the sensor modules 104 and 119 and/or at least a part of the key input device 117 may be disposed in the first region 110 D and/or the second region 110 E.
  • the audio modules 103 , 107 and 114 may correspond to a microphone hole 103 and speaker holes 107 and 114 , respectively.
  • the microphone hole 103 may contain a microphone disposed therein for acquiring external sounds and, in a case, contain a plurality of microphones to sense a sound direction.
  • the speaker holes 107 and 114 may be classified into an external speaker hole 107 and a call receiver hole 114 .
  • the microphone hole 103 and the speaker holes 107 and 114 may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be provided without the speaker holes 107 and 114 .
  • the sensor modules 104 and 119 may generate electrical signals or data corresponding to an internal operating state of the mobile electronic device 100 or to an external environmental condition.
  • the sensor modules 104 and 119 may include a first sensor module 104 (e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 110 A of the housing 110 , and/or a third sensor module 119 (e.g., a heart rate monitor (HRM) sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface 110 B of the housing 110 .
  • HRM heart rate monitor
  • the fingerprint sensor may be disposed on the second surface 110 B as well as the first surface 110 A (e.g., the display 101 ) of the housing 110 .
  • the electronic device 100 may further include at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the camera modules 105 , 112 and 113 may include a first camera device 105 disposed on the first surface 110 A of the electronic device 100 , and a second camera device 112 and/or a flash 113 disposed on the second surface 110 B.
  • the camera module 105 or the camera module 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .
  • the key input device 117 may be disposed on the lateral surface 110 C of the housing 110 .
  • the mobile electronic device 100 may not include some or all of the key input device 117 described above, and the key input device 117 which is not included may be implemented in another form such as a soft key on the display 101 .
  • the key input device 117 may include the sensor module disposed on the second surface 110 B of the housing 110 .
  • the light emitting device may be disposed on the first surface 110 A of the housing 110 .
  • the light emitting device may provide status information of the electronic device 100 in an optical form.
  • the light emitting device may provide a light source associated with the operation of the camera module 105 .
  • the light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp.
  • the connector holes 108 and 109 may include a first connector hole 108 adapted for a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole 109 adapted for a connector (e.g., an earphone jack) for transmitting and receiving an audio signal to and from an external electronic device.
  • a connector e.g., a universal serial bus (USB) connector
  • USB universal serial bus
  • Some sensor modules 105 of camera modules 105 and 212 , some sensor modules 104 of sensor modules 104 and 119 , or an indicator may be arranged to be exposed through a display 101 .
  • the camera module 105 , the sensor module 104 , or the indicator may be arranged in the internal space of an electronic device 100 so as to be brought into contact with an external environment through an opening of the display 101 , which is perforated up to a front plate 102 .
  • some sensor modules 104 may be arranged to perform their functions without being visually exposed through the front plate 102 in the internal space of the electronic device. For example, in this case, an area of the display 101 facing the sensor module may not require a perforated opening.
  • FIG. 3 illustrates an exploded perspective view showing a mobile electronic device shown in FIG. 1 according to an embodiment of the disclosure.
  • a mobile electronic device 300 may include a lateral bezel structure 310 , a first support member 311 (e.g., a bracket), a front plate 320 , a display 400 , an electromagnetic induction panel (not shown), a printed circuit board (PCB) 340 , a battery 350 , a second support member 360 (e.g., a rear case), an antenna 370 , and a rear plate 380 .
  • the mobile electronic device 300 may omit at least one (e.g., the first support member 311 or the second support member 360 ) of the above components or may further include another component.
  • Some components of the electronic device 300 may be the same as or similar to those of the mobile electronic device 100 shown in FIG. 1 or FIG. 2 , thus, descriptions thereof are omitted below.
  • the first support member 311 is disposed inside the mobile electronic device 300 and may be connected to, or integrated with, the lateral bezel structure 310 .
  • the first support member 311 may be formed of, for example, a metallic material and/or a non-metal (e.g., polymer) material.
  • the first support member 311 may be combined with the display 400 at one side thereof and also combined with the printed circuit board (PCB) 340 at the other side thereof.
  • PCB 340 On the PCB 340 , a processor, a memory, and/or an interface may be mounted.
  • the processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP).
  • CPU central processing unit
  • AP application processor
  • GPU graphics processing unit
  • ISP image signal processor
  • sensor hub processor or a communications processor (CP).
  • CP communications processor
  • the memory may include, for example, one or more of a volatile memory and a non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB USB interface
  • SD secure digital
  • audio audio interface
  • the interface may electrically or physically connect the mobile electronic device 300 with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.
  • MMC multimedia card
  • the battery 350 is a device for supplying power to at least one component of the mobile electronic device 300 , and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery 350 may be disposed on substantially the same plane as the PCB 340 .
  • the battery 350 may be integrally disposed within the mobile electronic device 300 , and may be detachably disposed from the mobile electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may perform short-range communication with an external device, or transmit and receive power required for charging wirelessly.
  • An antenna structure may be formed by a part or combination of the lateral bezel structure 310 and/or the first support member 311 .
  • FIG. 4 is a separate perspective view showing a stacked structure of a display according to an embodiment of the disclosure.
  • a display 400 of FIG. 4 may be at least partially similar to the display 101 of FIG. 1 or the display 400 of FIG. 3 , or may further include other embodiments of a display.
  • the display 400 may include a polarizer (POL) 420 , a display panel 430 , and/or a subsidiary material layer 440 disposed through an adhesive layer 410 on a front plate 320 (e.g., the front plate 102 of FIG. 1 ).
  • the front plate 320 may have a camera exposure area 3211 disposed at a position corresponding to a camera module (e.g., a camera module 500 of FIG. 5 ).
  • a printed area may be omitted in the camera exposure area 3211 .
  • the camera exposure area 3211 may substantially include a second area (e.g., the second area DA 2 in FIG. 6 ) of the display panel 430 to be described below.
  • the adhesive layer 410 may have an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermally reactive adhesive, a normal adhesive, or a double-sided tape.
  • OCA optical clear adhesive
  • PSA pressure sensitive adhesive
  • the POL 420 can selectively pass light that is generated from a light source of the display panel 430 and vibrates in a predetermined direction.
  • the display panel 430 and the POL 420 may be integrally formed.
  • the display 400 may include a touch panel. Though not shown, the display panel 430 may include a control circuit.
  • control circuit may include a display driver IC (DDI) and/or a touch display driver IC (TDDI) that is disposed in a chip-on-panel (COP) or chip-on-film (COF) type.
  • display 400 may include a fingerprint sensor disposed around the control circuit.
  • the fingerprint sensor may include an ultra or optical fingerprint sensor that can sense the fingerprint of a finger that touches or comes close to the outer surface of the front plate 320 through holes at least partially formed at some of the components of the display 400 .
  • the subsidiary material layer 440 may include one or more polymer members 441 and 442 and/or one or more functional members 443 and 444 .
  • the polymer members 441 and 442 may include an embossed layer 441 that removes bubbles, which may be produced between the display panel 430 and the attachments thereunder, and/or a cushion layer 442 disposed to attenuate shock.
  • the one or more functional members 443 and 444 may include a graphite sheet 443 for heat dissipation and/or a conductive member 444 for dissipating heat and/or blocking noise.
  • the conductive member 444 may include Copper (CU), Aluminum (Al), Stainless Steel (SUS), or clad material (CLAD) (e.g., a stacked member in which SUS and Al are alternately disposed).
  • at least one functional member may include an added display, a force touch flexible printed circuit board (FPCB), a fingerprint sensor FPCB, a communication antenna emitter, a heat dissipation sheet, a conductive/nonconductive tape, or an open cell sponge.
  • the display 400 may further include a detector for detecting input by an electromagnetic induction type writer. According to an embodiment, the detector may include a digitizer.
  • the electronic device may include a camera module (the camera module 500 of FIG. 5 ) disposed under the display 400 when viewing the front plate 320 from above.
  • the POL 420 may have an opening 4201 overlapping at least the camera module (e.g., the camera module 500 of FIG. 5 ) when viewing the front plate 320 from above.
  • the subsidiary material layer 440 may also have openings 4411 , 4421 , and 4441 overlapping at least the camera module (e.g., the camera module 500 of FIG. 5 ) when viewing the front plate 320 from above.
  • the display panel 430 may not have any opening when viewing the front plate 320 from above.
  • any wire structure and/or pixel structure may not be disposed in at least some area of the display panel 430 , unlike the surrounding display area.
  • at least some area of the display panel 430 may have a wire density and/or a pixel density that is different from that of the surrounding display area.
  • at least some area of the display panel 430 may be formed to have a wire density and/or a pixel density that is lower than that of the surrounding display area.
  • the area of the display panel 430 that has a relatively low wire density and/or pixel density can perform a display function and can be used as at least some area in which the angle of view of a camera module disposed thereunder.
  • the area of the display panel 430 that has a relatively low wire density and/or pixel density can perform a shield function that hides the stacked structure, the machined portion, or the internal structure such as wires of the display 400 . Accordingly, a specific printed area may not be formed on the rear side of the front plate 320 , whereby the camera exposure area of the front plate 320 may be reduced.
  • FIG. 5 is a partial cross-sectional view of the electronic device taken along line A-A′ of FIG. 1 according to an embodiment of the disclosure.
  • the electronic device 300 may include a front plate 320 (e.g., a first plate or a front window) facing a first direction (direction ⁇ circle around ( 1 ) ⁇ ), a rear plate 380 (e.g., a second plate or a rear window) facing an opposite direction to front plate 320 , and a side member 310 surrounding a space 3001 between the front plate 320 and the rear plate 380 .
  • the electronic device 300 may include a first waterproof member 3201 disposed between the subsidiary material layer 440 of the display 400 and the side member 310 .
  • the electronic device 300 may include a second waterproof member 3801 disposed between the side member 310 and the rear plate 380 . The first waterproof member 3201 and the second waterproof member 3801 can prevent external dirt or water from entering an internal space 3001 of the electronic device 300 .
  • the side member 310 may further include a support member 311 extending at least partially into the internal space 3001 of the electronic device 300 .
  • the support member 311 may be formed by structural combination with the side member 310 .
  • the support member 311 can support the camera module 500 such that the camera module 500 is disposed through the openings 4411 , 4421 , and 4441 of the subsidiary layer 440 of the display 400 and positioned close to the rear side of the display panel 430 .
  • the camera module 500 may include a camera housing 510 , a barrel 520 at least partially protruding from the camera housing 510 , and one or more lenses 530 disposed with predetermined gaps inside the barrel 520 and/or at least one image sensor 540 disposed to be aligned with the one or more lenses 530 in the internal space of the camera housing 510 .
  • the electronic device 300 may include an adhesive layer 410 , a POL 420 , a display panel 430 , and/or a subsidiary material layer 440 disposed between the rear side of the front plate 320 and the side member 310 .
  • the POL 420 when viewing the front plate 320 from above, the POL 420 may have an opening 4201 formed in an area overlapping the one or more lenses 530 to improve optical transmittance of the camera module 500 .
  • the adhesive layer 410 disposed over the POL 420 may also be partially omitted.
  • the subsidiary material layer 440 may have openings 4411 , 4421 , and 4441 formed in an area overlapping at least the barrel 520 .
  • an angle of view is secured by disposing the one or more lenses 530 of the camera module 500 close to the display panel 430 through the openings 4411 , 4421 , and 4441 , whereby it is possible to greatly contribute to reducing a transparent area (e.g., a third area DA 3 of FIG. 6 ) of the display panel 430 that overlaps the lenses 530 .
  • a transparent area e.g., a third area DA 3 of FIG. 6
  • the display panel 430 may not have any opening even in any area overlapping the camera module 500 when viewing the front plate 320 from above.
  • the display panel 430 may be configured to at least partially have different wire densities and/or pixel densities.
  • the display panel 430 may have an area (a second area DA 2 of FIG. 6 ) that has a wire density and/or pixel density substantially lower than that of the display area, and this area may be replaced with a printed area that may be defined on the rear side of the front plate 320 .
  • FIG. 6 is a view showing a disposition configuration of a display according to an embodiment of the disclosure.
  • the display 400 may include the POL 420 , the display panel 430 , and/or the subsidiary material layer 440 disposed through the adhesive layer 410 on the rear side of the front plate 320 .
  • the display 400 may have openings 4201 , 4411 , 4421 , and 4441 formed at the POL 420 and the subsidiary material layer 440 except for the display panel 430 .
  • the display panel 430 having an area overlapping the one or more lenses 530 may be divided into various areas.
  • the various areas may be coaxial areas DA 1 , DA 2 , and DA 3 around the center C of the lenses 530 .
  • the distance of a virtual straight line ‘1’ from the center C (e.g., OF) of the lenses 530 (e.g., the center of the image sensor) to a diagonal corner of the image sensor 540 e.g., 1F
  • 1 F field
  • the display panel 430 when viewing the front plate 320 from above, may have a first area DA 1 coaxially defined around the center C of the lenses 530 (or the center of the image sensor 540 ), a second area DA 2 surrounded by the first area DA 1 , and a third area DA 3 surrounded by the second area DA 2 and including the lens center C.
  • the second area DA 2 and the third area DA 3 may be defined at positions overlapping at least the openings 4201 , 4411 , 4421 , and 4441 when viewing the front plate 320 from above.
  • the first area DA 1 may include a substantial display area disposed outside a circle having 1 F from the lens center C as a radius.
  • the first area DA 1 may have a first wire density and a first pixel density.
  • the second area DA 2 may have the area of a circle having the range of 0.5 F to 1 F as a radius.
  • the second area DA 2 may extend from the first area DA 1 .
  • the second area DA 2 may have a second wire density and/or a second pixel density lower than that of the first area DA 1 .
  • the second wire density and/or the second pixel density of the second area DA may be determined in accordance with lens design values considering a surrounding light amount.
  • the third area DA 3 which is a transparent area (e.g., a camera exposure area) where the angle of view of a lens is substantially formed, may have a circular area having the range of 0 F to 0.5 F as a radius.
  • the third area DA 3 may extend from the second area DA 2 .
  • the third area DA 3 may not have any wire disposition structure or pixel disposition structure.
  • the third area DA 3 may have a third wire density and/or a third pixel density lower than that of the second area DA 2 .
  • the stacked structure, machined portion, or the internal structure such as wires of the display 400 that may be seen through a camera exposure area can be visually blocked by the second area DA 2 of the display panel 430 .
  • the second area DA 2 of the display panel 430 may be seen as a display area extending from a surrounding display area (e.g., the first area DA 1 ) by the wire structure and the pixel structure.
  • FIGS. 7A and 7B are views showing a wire disposition configuration in a second area of a display panel according to various embodiments of the disclosure.
  • the second area DA 2 of the display panel 430 may have the area of a circle having the range of 0.5 F to 1 F as a radius.
  • the wire density of the second area DA 2 may be lower than the wire density of the first area DA 1 .
  • the second area DA 2 surrounded by the first area DA 1 may have a camera exposure area that can be visually seen from a front plate (e.g., the front plate 320 of FIG. 6 ).
  • the second area DA 2 of the display panel 430 may have the area of a circle having the range of 0.7 F to 1 F as a radius.
  • the wire density of the second area DA 2 may be lower than the wire density of the first area DA 1 .
  • the second area DA 2 surrounded by the first area DA 1 may have a camera exposure area that can be visually seen from a front plate (e.g., the front plate 320 of FIG. 6 ).
  • the third area DA 3 has an area larger than the third area DA 3 of FIG. 7A , which may be advantageous in defining the angle of view of a lens (e.g., the lens 530 of FIG. 5 ).
  • wires and pixels may be disposed in the second area DA 2 with a wire density and a pixel density lower than those of the first area DA 1 .
  • the pixel density of the second area DA 2 may be the same wire density with the same proportion or may be a low pixel density with a different proportion in comparison to the first area DA 1 .
  • FIG. 8 is a view showing a state in which a portion of a second area of a display panel is disposed in a light path of a lens according to an embodiment of the disclosure.
  • FIG. 9 is a graph showing transmittance for each field of a lens according to a surrounding light quantity according to an embodiment of the disclosure.
  • the display panel 430 may have a first area DA 1 substantially including a display area, a second area DA 2 surrounded by the first area DA 1 and having a wire density and/or a pixel density lower than that of the first area DA 1 , and a third area DA 3 surrounded by the second area DA 2 and being a transparent area including the light path of the lens 530 .
  • the second area DA 2 may be disposed to invading the light path of the lens 530 . This is because the smaller the second area DA 2 , the smaller the camera exposure area, which can be visually seen from the outside of a front plate (e.g., the front plate 320 of FIG. 6 ), can be.
  • the amount of light traveling into the lens 530 may decrease, but optical transmittance can be compensated under a predetermined light amount by correcting a surrounding light amount using software (S/W) of an electronic device.
  • S/W software
  • FIGS. 10A and 10B are views illustrating a wire density and a pixel density in a second area of a display panel according to a lens designed in accordance with a surrounding light quantity according to various embodiments.
  • the wire density and/or pixel density of the second area DA 2 of the display panel 430 may be determined in accordance with lens design values according to a surrounding light amount.
  • the wire density and/or pixel density of the second area DA 2 may be about 66% of the wire density and/or pixel density of the second area DA 2 of the first area DA 1 when the minimum available optical transmittance (e.g., the minimum transmittance that can be compensated for by correction using S/W) is about 10%.
  • the wire density and/or pixel density of the second area DA 2 may be about 83% of the wire density and/or pixel density of the first area DA 1 when the minimum available optical transmittance is about 10%.
  • the wire density and/or the pixel density of the second area DA 2 may be defined with a proportion smaller than 1-( 0 . 1 /surrounding light amount).
  • FIGS. 11A to 11C are views showing stacked structures of a display according to various embodiments.
  • the display 400 disposed on the rear side of a front plate 1110 through the first adhesive layer 410 may include the POL 420 , a second adhesive layer 411 , and/or the display panel 430 .
  • the display 400 may further include a subsidiary material layer (e.g., the subsidiary material layer 440 of FIG. 5 ) additionally stacked on the display panel 430 .
  • the POL 420 when viewing the front plate 1110 from above, the POL 420 may have the opening 4201 formed at a position overlapping the camera module 500 to prevent a decrease of transmittance.
  • the opening 4201 since the opening 4201 is formed by removing a portion of the POL 420 , the removed area may be seen due to reflection of the display panel 430 , so the opening 4201 may be filled with an index matching material 450 .
  • the index matching material 450 filling the opening 4201 can suppress a decrease of optical transmittance due to reflection of the display panel 430 .
  • the front plate 1110 may have a first surface 1101 facing the outside and a second surface 1102 (e.g., a rear side) facing the first surface 1101 .
  • the front plate 1110 when viewing the front plate 1110 from above, may have one or more curved portions 1121 and 1122 protruding outward in the area overlapping the camera module 500 .
  • the centers of the one or more curved portions 1121 and 1122 may be positioned to overlap the center of the lens (e.g., the lens 530 of FIG. 5 ) of the camera module 500 when viewing the front plate 1110 from above.
  • the one or more curved portions 1121 and 1122 may have a first curved portion 1121 protruding outward from the first surface 1101 and a second curved portion 1122 protruding from the second surface 1102 .
  • the focus of the lens (e.g., the lens 530 of FIG. 5 ) of the camera module 500 may be formed through the first curved portion 1121 and the second curved portion 1122 of the front plate 1110 .
  • the translucent coating material 451 may be disposed at a position overlapping the second area DA 2 and the third area DA 3 overlapping the camera module 500 , on the first adhesive layer 410 and/or the second adhesive layer 411 .
  • the transmittance of the display panel may be determined by the translucent coating material.
  • a camera module is disposed under a display, an opening is not formed in the corresponding area, so it may be advantageous in terms of manufacturing a display. Further, a printed area that is defined on a front plate is removed by adjusting the wire density and/or pixel density in some area of the display, so a camera exposure area can be reduced.
  • an electronic device e.g., the electronic device 300 of FIG. 3
  • a front plate e.g., the front plate 320 of FIG. 3
  • a display panel e.g., the display panel 430
  • an internal space e.g., the internal space 3001 of FIG. 3
  • a camera module e.g., the camera module 500 of FIG. 3
  • the display panel may have a first area (e.g., the first area DA 1 of FIG.
  • a first wire density and/or a first pixel density having a first wire density and/or a first pixel density, a second area (e.g., the second area DA 2 of FIG. 6 ) surrounded by the first area and having a second wire density lower than the first wire density and/or a second pixel density lower than the first pixel density, and a third area (e.g., the third area DA 3 of FIG. 6 ) surrounded by the second area DA 2 and at least partially overlapping the center of the image sensor when viewing the front plate from above.
  • the second area may include a circular area having the range of 0.5 F to 1 F as a radius.
  • the wire density and/or the pixel density of the second area may be determined in accordance with a lens design value of the camera module considering a surrounding light amount.
  • the wire density and/or the pixel density of the second area DA 2 may be determined with a proportion smaller than 1-(0.1/surrounding light amount).
  • the electronic device may further include a polarizer (POL) (e.g., the POL 420 of FIG. 3 ) disposed between the front plate and the display panel and the POL may have a first opening (e.g., the opening 4201 of FIG. 3 ) formed at a position overlapping at least the camera module when viewing the front plate from above.
  • POL polarizer
  • the first opening when viewing the front sheet from above, may be disposed at a position overlapping the second area and the third area when viewing the front plate from above.
  • the first opening may be disposed at a position partially overlapping at least a portion of the first area.
  • the first opening may be filled with an index matching material (e.g., the index matching material 450 of FIG. 11A ) to improve visibility of a removed portion of the display panel according to reflection.
  • an index matching material e.g., the index matching material 450 of FIG. 11A
  • the front plate when viewing the front plate from above, may have a curved portion (e.g., the curved portions 1121 and 1122 of FIG. 11A ) protruding outward in the area overlapping the opening.
  • a curved portion e.g., the curved portions 1121 and 1122 of FIG. 11A
  • the electronic device may include a first adhesive layer (e.g., the first adhesive layer 410 of FIG. 11B ) disposed between the front plate and the POL and a second adhesive layer (e.g., the second adhesive plate 411 of FIG. 11B ) disposed between the POL and the display panel.
  • a first adhesive layer e.g., the first adhesive layer 410 of FIG. 11B
  • a second adhesive layer e.g., the second adhesive plate 411 of FIG. 11B
  • the first adhesive layer and/or the second adhesive layer may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermally reactive adhesive, a normal adhesive, or a double-sided tape.
  • OCA optical clear adhesive
  • PSA pressure sensitive adhesive
  • thermally reactive adhesive thermally reactive adhesive
  • normal adhesive normal adhesive
  • double-sided tape a double-sided tape
  • the first adhesive layer and/or the second adhesive layer may further include a translucent coating material (e.g., the translucent coating material 451 of FIG. 11A ) at least partially disposed to improve visibility of a removed area of the display panel.
  • a translucent coating material e.g., the translucent coating material 451 of FIG. 11A
  • the translucent coating material overlaps the second area and the third area when viewing the front plate from above.
  • the electronic device further includes at least one subsidiary material layer disposed on the rear side of the display panel and the subsidiary material layer may have a second opening overlapping at least the camera module when viewing the front plate from above.
  • the camera module may be disposed to be close to or to be in contact with the display panel through the second opening.
  • the subsidiary material layer may include at least one polymer (e.g., the polymer members 441 and 442 of FIG. 3 ) disposed on the rear side of the display panel and at least one functional member (e.g., the functional members 443 and 444 of FIG. 3 ) disposed on the rear side of the polymer member.
  • at least one polymer e.g., the polymer members 441 and 442 of FIG. 3
  • at least one functional member e.g., the functional members 443 and 444 of FIG. 3
  • the at least one polymer member may include an embossed layer and/or a cushion layer.
  • At least one functional member may include at least one of a graphite sheet, a conductive plate, an added display, a force touch FPCB, a fingerprint sensor FPCB, a communication antenna emitter, a heat dissipation sheet, a conductive/nonconductive tape, or an open cell sponge.
  • the second opening may be disposed at a position overlapping the second area and the third area when viewing the front plate from above.
  • the second opening may be disposed at a position partially overlapping at least a portion of the first area when viewing the front sheet from above.

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD914633S1 (en) * 2018-02-01 2021-03-30 Beijing Xiaomi Mobile Software Co., Ltd. Mobile phone
US10984212B1 (en) * 2019-09-27 2021-04-20 Superc-Touch Corporation Fingerprint detection device
USD922997S1 (en) * 2018-04-09 2021-06-22 Palm Ventures Group, Inc. Personal computing device
USD927522S1 (en) 2018-04-09 2021-08-10 Palm Ventures Group, Inc. Display screen or portion thereof with a graphical user interface for an application launcher
USD931887S1 (en) 2018-04-09 2021-09-28 Palm Ventures Group, Inc. Display screen or portion thereof with a graphical user interface for handling swipe gesture
US11172110B2 (en) * 2019-01-08 2021-11-09 Apple Inc. Portable electronic device
US20220309990A1 (en) * 2020-09-29 2022-09-29 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel, method for driving pixel circuit of display panel, and display device
US11521410B2 (en) * 2016-12-12 2022-12-06 Samsung Electronics Co., Ltd. Electronic device having a biometric sensor
US11616896B2 (en) 2019-01-08 2023-03-28 Apple Inc. Portable electronic device
US11706532B2 (en) 2021-08-18 2023-07-18 Samsung Electronics Co., Ltd. Method for providing image and electronic device supporting the same
US20240046867A1 (en) * 2022-08-03 2024-02-08 GM Global Technology Operations LLC Bezel free microled display for smart glass applications

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102566357B1 (ko) 2021-02-09 2023-08-11 (주)유티아이 항균 및 항바이러스 기판의 제조방법 및 이에 의해 제조된 항균 및 항바이러스 기판
KR20220126924A (ko) * 2021-03-10 2022-09-19 삼성전자주식회사 디스플레이를 포함하는 전자 장치
KR20220144214A (ko) * 2021-04-19 2022-10-26 삼성전자주식회사 난반사 구조의 디스플레이를 포함하는 전자 장치
KR20230023247A (ko) * 2021-08-10 2023-02-17 삼성전자주식회사 디스플레이를 포함하는 전자 장치
KR20230024102A (ko) * 2021-08-11 2023-02-20 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치
KR20230069522A (ko) * 2021-11-12 2023-05-19 삼성전자주식회사 Udc를 포함하는 전자 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170096565A (ko) * 2016-02-16 2017-08-24 삼성전자주식회사 전자 장치
US20190146251A1 (en) * 2016-02-25 2019-05-16 Japan Display Inc. Display device and method for manufacturing display device
US20200324713A1 (en) * 2016-09-22 2020-10-15 Lg Electronics Inc. Vehicular camera apparatus and method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7495638B2 (en) * 2003-05-13 2009-02-24 Research Triangle Institute Visual display with increased field of view
US9392219B2 (en) * 2013-07-31 2016-07-12 Howlett-Packard Development Company, L.P. Display-camera system
KR102390760B1 (ko) * 2015-02-13 2022-04-26 삼성전자주식회사 카메라 장치 및 이를 구비한 전자 장치
DE102015217499A1 (de) * 2015-09-14 2017-03-16 Conti Temic Microelectronic Gmbh Anschlussvorrichtung für ein Kameramodul, Kameramodul sowie Verfahren zum Kontaktieren eines Kameramoduls
US9823694B2 (en) * 2015-10-30 2017-11-21 Essential Products, Inc. Camera integrated into a display
US10108222B2 (en) * 2015-12-04 2018-10-23 Apple Inc. Electronic device displays with holes to accommodate components
KR102419624B1 (ko) * 2016-01-21 2022-07-11 삼성전자 주식회사 전자 장치의 센서 배치 구조
KR20170111827A (ko) * 2016-03-29 2017-10-12 삼성전자주식회사 디스플레이 및 카메라를 포함하는 전자 장치
CN106843389B (zh) * 2017-01-09 2022-08-05 Oppo广东移动通信有限公司 电子装置
KR102308940B1 (ko) * 2017-04-21 2021-10-05 삼성전자주식회사 방수 구조를 포함하는 전자 장치
KR102410542B1 (ko) * 2017-05-29 2022-06-20 삼성전자주식회사 함몰 영역이 형성된 레이어에 실장된 모듈을 포함하는 전자 장치
CN107395928A (zh) * 2017-08-01 2017-11-24 维沃移动通信有限公司 一种光学组件及移动终端
WO2019062213A1 (fr) * 2017-09-30 2019-04-04 云谷（固安）科技有限公司 Terminal électronique et écran d'affichage
WO2019199131A1 (fr) * 2018-04-13 2019-10-17 Samsung Electronics Co., Ltd. Dispositif d'affichage ayant un élément opaque disposé dans une zone entourée par des pixels et appareil électronique doté de celui-ci
CN108900659B (zh) * 2018-05-28 2020-09-18 Oppo广东移动通信有限公司 电子装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170096565A (ko) * 2016-02-16 2017-08-24 삼성전자주식회사 전자 장치
US20190146251A1 (en) * 2016-02-25 2019-05-16 Japan Display Inc. Display device and method for manufacturing display device
US20200324713A1 (en) * 2016-09-22 2020-10-15 Lg Electronics Inc. Vehicular camera apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Sun, Haiyan, Basic Optical Engineering for Engineers and Scientists, 2 January, 2019, SPIE, pp. 1-58 (Year: 2019) *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11521410B2 (en) * 2016-12-12 2022-12-06 Samsung Electronics Co., Ltd. Electronic device having a biometric sensor
USD914633S1 (en) * 2018-02-01 2021-03-30 Beijing Xiaomi Mobile Software Co., Ltd. Mobile phone
USD922997S1 (en) * 2018-04-09 2021-06-22 Palm Ventures Group, Inc. Personal computing device
USD927522S1 (en) 2018-04-09 2021-08-10 Palm Ventures Group, Inc. Display screen or portion thereof with a graphical user interface for an application launcher
USD931887S1 (en) 2018-04-09 2021-09-28 Palm Ventures Group, Inc. Display screen or portion thereof with a graphical user interface for handling swipe gesture
US11616896B2 (en) 2019-01-08 2023-03-28 Apple Inc. Portable electronic device
US11172110B2 (en) * 2019-01-08 2021-11-09 Apple Inc. Portable electronic device
US10984212B1 (en) * 2019-09-27 2021-04-20 Superc-Touch Corporation Fingerprint detection device
US20220309990A1 (en) * 2020-09-29 2022-09-29 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel, method for driving pixel circuit of display panel, and display device
US11798456B2 (en) * 2020-09-29 2023-10-24 Chengdu Boe Optoelectronics Technology Co., Ltd. Display panel, method for driving pixel circuit of display panel, and display device
US11978380B2 (en) 2020-09-29 2024-05-07 Chengdu Boe Optoelectronics Technology Co., Ltd. Pixel driving circuit, driving method thereof, display substrate and display device
US11706532B2 (en) 2021-08-18 2023-07-18 Samsung Electronics Co., Ltd. Method for providing image and electronic device supporting the same
US20240046867A1 (en) * 2022-08-03 2024-02-08 GM Global Technology Operations LLC Bezel free microled display for smart glass applications

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