US20200145015A1 - Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit - Google Patents
Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit Download PDFInfo
- Publication number
- US20200145015A1 US20200145015A1 US16/434,660 US201916434660A US2020145015A1 US 20200145015 A1 US20200145015 A1 US 20200145015A1 US 201916434660 A US201916434660 A US 201916434660A US 2020145015 A1 US2020145015 A1 US 2020145015A1
- Authority
- US
- United States
- Prior art keywords
- signal
- clock signal
- phase
- delay
- clock
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 164
- 239000004065 semiconductor Substances 0.000 title description 45
- 230000003111 delayed effect Effects 0.000 claims description 9
- 230000000630 rising effect Effects 0.000 description 26
- 230000001360 synchronised effect Effects 0.000 description 10
- 238000013500 data storage Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 230000001934 delay Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/081—Details of the phase-locked loop provided with an additional controlled phase shifter
- H03L7/0812—Details of the phase-locked loop provided with an additional controlled phase shifter and where no voltage or current controlled oscillator is used
- H03L7/0814—Details of the phase-locked loop provided with an additional controlled phase shifter and where no voltage or current controlled oscillator is used the phase shifting device being digitally controlled
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/16—Indirect frequency synthesis, i.e. generating a desired one of a number of predetermined frequencies using a frequency- or phase-locked loop
- H03L7/18—Indirect frequency synthesis, i.e. generating a desired one of a number of predetermined frequencies using a frequency- or phase-locked loop using a frequency divider or counter in the loop
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/04—Generating or distributing clock signals or signals derived directly therefrom
- G06F1/10—Distribution of clock signals, e.g. skew
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/13—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals
- H03K5/133—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals using a chain of active delay devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/085—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/085—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
- H03L7/089—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal the phase or frequency detector generating up-down pulses
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/085—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
- H03L7/095—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using a lock detector
Definitions
- Various embodiments generally relate to an integrated circuit technology, and more particularly, to a phase detection circuit for detecting the phase of a clock signal, and a semiconductor apparatus including the phase detection circuit.
- An electronic device may include many electronic components.
- a computer system may include a large number of semiconductor apparatuses composed of semiconductors.
- the semiconductor apparatuses constituting the computer system may communicate with one another while transferring and receiving a clock signal and data.
- the semiconductor apparatuses may operate in synchronization with the clock signal.
- the semiconductor apparatuses may receive a system clock signal transferred through a clock bus, and generate an internal clock signal which can be used for an internal operation.
- the semiconductor apparatuses may include a clock generation circuit such as a delay locked loop (DLL) circuit and/or a phase locked loop (PLL) circuit, in order to synchronize the phases of the system clock signal and the internal clock signal.
- the clock generation circuits include a phase detection circuit, and the phase detection circuit detects whether the phase of the clock signal leads or lags, such that the phase of the clock signal can be adjusted.
- a phase detection circuit may include a clock divider, a unit delay, a first phase detector, a second phase detector, and an initialization signal generator.
- the clock divider may be configured to generate a divided clock signal by dividing the frequency of a reference clock signal, and is initialized based on an initialization signal.
- the first phase detector may be configured to generate a first detection signal by comparing the phase of an input clock signal, after being delayed by a unit delay time, with the phase of the divided clock signal.
- the second phase detector may be configured to generate a second detection signal by comparing the phase of the input clock signal to the phase of the divided clock signal.
- the initialization signal generator may be configured to generate the initialization signal based on the first detection signal.
- a clock generation circuit may include a phase detection circuit.
- the phase detection circuit may be configured to generate an output clock signal by delaying a reference clock signal, and to generate a phase detection signal by detecting the phases of the reference clock signal and a feedback clock signal generated from the output clock signal in order to change a delay amount of the output clock signal.
- the phase detection circuit may include a clock divider, a unit delay, a first phase detector, a second phase detector, and an output selector.
- the clock divider may be configured to generate a divided clock signal by dividing the reference clock signal.
- the unit delay may be configured to delay the feedback clock signal by a unit delay time.
- the first phase detector may be configured to generate a first detection signal by comparing the phase of an output of the unit delay to the phase of the divided clock signal during a first delay locking operation.
- the second phase detector may be configured to generate a second detection signal by comparing the phase of the feedback clock signal to the phase of the divided clock signal during a second delay locking operation.
- the output selector may be configured to output one of the first and second detection signals as the phase detection signal based on a locking signal.
- a phase detection circuit may include a clock divider, a select signal generator, and a phase detector.
- the clock divider may be configured to generate a first divided clock signal, a second divided clock signal and a third divided clock signal by dividing a reference clock signal.
- the select signal generator may be configured to generate a select signal by comparing the second divided clock signal and an input clock signal based on a locking signal.
- the phase detector may be configured to generate a phase detection signal by comparing the phase of the first divided clock signal to the phase of the input clock signal when the select signal is at a first level, and generate the phase detection signal by comparing the phase of the third divided clock signal to the phase of the input clock signal when the select signal is at a second level.
- a clock generation circuit may include a phase detection circuit.
- the phase detection circuit may be configured to generate an output clock signal by delaying a reference clock signal, and generate a phase detection signal by detecting the phase of the reference clock signal to the phase of a feedback clock signal generated from the output clock signal in order to change a delay amount of the output clock signal.
- the phase detection circuit may include a clock divider, a select signal generator, and a phase detector.
- the clock divider may be configured to generate a first divided clock signal, a second divided clock signal and a third divided clock signal by dividing the reference clock signal.
- the select signal generator may be configured to generate a select signal by comparing the phase of the second divided clock signal to the phase of a feedback clock signal based on a locking signal.
- the phase detector may be configured to generate a phase detection signal by comparing the phase of one of the first and third divided clock signals to the phase of the feedback clock signal based on the select signal.
- a phase detection circuit may include a clock divider configured to generate a divided clock signal by dividing the frequency of a reference clock signal during a first delay locking operation.
- the phase detection circuit may include a first phase detector configured to compare the phase of an input clock signal, which has been delayed by a unit delay time, to the phase of the divided clock signal during the first delay locking operation.
- the phase detection circuit may include a second phase detector configured to compare the phase of the divided clock signal to the phase of the input clock signal during a second delay locking operation.
- the clock divider may be initialized after completion of the first delay locking operation.
- FIG. 1 illustrates a configuration of a clock generation circuit in accordance with an embodiment.
- FIG. 2 illustrates a configuration of a phase detection circuit in accordance with an embodiment.
- FIG. 3 illustrates a configuration of an initialization signal generator illustrated in FIG. 2 .
- FIGS. 4A and 4B are timing diagrams illustrating operations of the phase detection circuit and the clock generation circuit in accordance with an embodiment.
- FIG. 5 illustrates a configuration of a phase detection circuit in accordance with an embodiment.
- FIGS. 6A and 6B are timing diagrams illustrating operations of the phase detection circuit and the clock generation circuit in accordance with an embodiment.
- FIG. 7 illustrates a configuration of a semiconductor system in accordance with an embodiment.
- FIG. 1 illustrates a configuration of a clock generation circuit 100 in accordance with an embodiment.
- the clock generation circuit 100 may receive a system clock signal CLK and generate an output clock signal CLKOUT.
- the system clock signal CLK may be an external clock signal transferred from an external device of a semiconductor apparatus including the clock generation circuit 100 .
- the clock generation circuit 100 may generate the output clock signal CLKOUT by delaying a reference clock signal REFCLK generated from the system clock signal CLK.
- the clock generation circuit 100 may be a delay locked loop (DLL) circuit that can change a delay amount of the output clock signal CLKOUT, and maintain the changed delay amount.
- the clock generation circuit 100 may include a phase detection circuit 110 to change the phase of the output clock signal CLKOUT.
- the phase detection circuit 110 may generate a phase detection signal PDOUT by comparing the phase of the reference clock signal REFCLK to the phase of a feedback clock signal FBCLK generated by delaying the output clock signal CLKOUT.
- DLL delay locked loop
- the clock generation circuit 100 may include a delay line 120 , a clock dividing circuit 130 , a replica 140 and a delay line controller 150 .
- the delay line 120 may generate the output clock signal CLKOUT by delaying the reference clock signal REFCLK.
- the delay line 120 may receive a delay control signal DC, and have a delay amount which is changed based on the delay control signal DC.
- the delay line 120 may generate the output clock signal CLKOUT by delaying the reference clock signal REFCLK by a delay amount which is set based on the delay control signal DC.
- the clock dividing circuit 130 may receive the output clock signal CLKOUT.
- the clock dividing circuit 130 may generate a divided clock signal by dividing the output clock signal CLKOUT.
- the clock dividing circuit 130 may divide the frequency of the output clock signal CLKOUT.
- the clock dividing circuit 130 may generate a clock signal having a half frequency of the output clock signal CLKOUT.
- the replica 140 may receive an output of the clock dividing circuit 130 .
- the replica 140 may delay the output of the clock dividing circuit 130 by a preset delay amount.
- the replica 140 may generate the feedback clock signal by delaying the output of the clock dividing circuit 130 .
- the delay amount of the replica 140 may be arbitrarily set.
- the delay amount of the replica 140 may correspond to a delay time required until the semiconductor apparatus including the clock generation circuit 100 receives the system clock signal CLK and generates the reference clock signal REFCLK.
- the word “preset” as used herein with respect to a parameter means that a value for the parameter is determined prior to the parameter being used in a process or algorithm.
- the value for the parameter is determined before the process or algorithm begins. In other embodiments, the value for the parameter is determined during the process or algorithm but before the parameter is used in the process or algorithm.
- the phase detection circuit 110 may receive the reference clock signal REFCLK and the feedback clock signal FBCLK.
- the phase detection circuit 110 may generate a divided clock signal by dividing the reference clock signal REFCLK.
- the phase detection circuit 110 may generate a divided clock signal having a half frequency of the reference clock signal REFCLK by dividing the frequency of the reference clock signal REFCLK.
- the phase detection circuit 110 may generate a plurality of divided clock signals having different phases by dividing the reference clock signal REFCLK.
- the phase detection circuit 110 may generate the phase detection signal PDOUT by comparing the phase of the divided clock signal to the phase of the feedback clock signal FBCLK.
- the delay line controller 150 may receive the phase detection signal PDOUT.
- the delay line controller 150 may generate the delay control signal DC based on the phase detection signal PDOUT.
- the delay control signal DC may be a code signal having a plurality of bits.
- the delay line 120 may include a plurality of unit delays. The plurality of unit delays may be controlled based on the respective bits of the delay control signal DC.
- the delay line controller 150 may increase the delay amount of the delay line 120 by increasing the code value of the delay control signal DC and increasing the number of turned-on unit delays.
- the delay line controller 150 may decrease the delay amount of the delay line 120 by decreasing the code value of the delay control signal DC and decreasing the number of turned-on unit delays.
- the phase detection circuit 110 may generate the phase detection signal PDOUT having a first level when the phase of the reference clock signal RFFCLK lags behind the phase of the feedback clock signal FBCLK.
- the first level may be a logic low level.
- the phase detection circuit 110 may generate the phase detection signal PDOUT having a second level when the phase of the reference clock signal RFFCLK leads the phase of the feedback clock signal FBCLK.
- the second level may be a logic high level.
- the delay line controller 150 may decrease the delay amount of the delay line 120 by decreasing the code value of the delay control signal DC.
- the delay line controller 150 may increase the delay amount of the delay line 120 by increasing the code value of the delay control signal DC.
- a high level and a low level refer to logic levels of the signals.
- a signal having a low level distinguishes from the signal when it has a high level.
- the high level may correspond to the signal having a first voltage
- the low level may correspond to the signal having a second voltage.
- the first voltage is greater than the second voltage.
- different characteristics of a signal such as frequency or amplitude, determine whether the signal has a high level or a low level.
- the high and low levels of a signal represent logical binary states.
- the delay line controller 150 may generate a locking signal LOCK based on the phase detection signal PDOUT.
- the delay line controller 150 may enable the locking signal LOCK when the phase detection signals PDOUT having different levels are successively generated from the phase detection circuit 110 .
- the locking signal LOCK may indicate that a delay locking operation is completed. For example, when the phase detection signal PDOUT having a high level is generated from the phase detection circuit 110 after the phase detection signal PDOUT having a low level is generated or the phase detection signal PDOUT having a low level is generated from the phase detection circuit 110 after the phase detection signal PDOUT having a high level is generated, the delay line controller 150 may enable the locking signal LOCK.
- a high level and a low level refer to logic levels of the signals.
- a signal having a low level distinguishes from the signal when it has a high level.
- the high level may correspond to the signal having a first voltage
- the low level may correspond to the signal having a second voltage.
- the first voltage is greater than the second voltage.
- different characteristics of a signal such as frequency or amplitude, determine whether the signal has a high level or a low level.
- the high and low levels of a signal represent logical binary states.
- the clock generation circuit 100 may further include a clock buffer 160 and a duty correction circuit (DCC) 170 .
- the clock buffer 160 may receive the system clock signal CLK and generate the reference clock signal REFCLK.
- the system clock signal CLK may be inputted as a single ended signal, or inputted as a differential signal with a complementary signal CLKB.
- the clock buffer 160 may generate the reference clock signal REFCLK by differentially amplifying the system clock signal CLK and a reference voltage VREF.
- the reference voltage VREF may have a level corresponding to the middle of the swing of the system clock signal CLK.
- the clock buffer 160 may generate the reference clock signal REFCLK by differentially amplifying the system clock signal CLK and the complementary signal CLKB.
- the DCC 170 may be coupled to the delay line 120 .
- the DCC 170 may correct the duty ratio of the output clock signal CLKOUT.
- the DCC 170 may correct the duty ratio of the output clock signal CLKOUT such that the output clock signal CLKOUT may have a duty ratio of 50:50.
- the word “coupled,” as used herein for some embodiments, means that two components are directly connected with one another.
- a first component coupled to a second component means the first component is contacting the second component.
- coupled components have one or more intervening components.
- a first component is coupled to a second component when the first and second components are both in contact with a common third component even though the first component is not directly contacting the second component.
- the clock generation circuit 100 may perform a first delay locking operation and a second delay locking operation.
- the first delay locking operation may be a coarse delay locking operation
- the second delay locking operation may be a fine delay locking operation.
- the unit delay amount of the delay line 120 in the first delay locking operation may be changed by a larger amount than the unit delay amount of the delay line 120 in the second delay locking operation.
- the delay amount of the delay line 120 may be changed by a first unit delay time
- the delay amount of the delay line 120 may be changed by a second unit delay time.
- the first unit delay time may be longer than the second unit delay time.
- the clock generation circuit 100 may generate the output clock signal CLKOUT by performing the first delay locking operation.
- the clock generation circuit 100 may generate the output clock signal CLKOUT by performing the second delay locking operation.
- the locking signal LOCK may be enabled by the delay line controller 150 .
- FIG. 2 illustrates a configuration of a phase detection circuit 200 in accordance with an embodiment.
- the phase detection circuit 200 may be applied as the phase detection circuit 110 illustrated in FIG. 1 .
- the phase detection circuit 200 may generate a first detection signal CPD by comparing the phase of an input clock signal FBCLK to the phase of a divided clock signal ICLK generated by dividing the reference clock signal REFCLK during the first delay locking operation.
- the phase detection circuit 200 may generate a second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the input clock signal FBCLK during the second delay locking operation.
- the phase detection circuit 200 may output the first detection signal CPD as a phase detection signal PDOUT during the first delay locking operation, and output the second detection signal FPD as the phase detection signal PDOUT during the second delay locking operation.
- the phase detection circuit 200 may include a clock divider 210 , a unit delay 220 , a first phase detector 230 and a second phase detector 240 .
- the clock divider 210 may receive the reference clock signal REFCLK.
- the clock divider 210 may generate the divided clock signal ICLK by dividing the frequency of the reference clock signal REFCLK.
- the divided clock signal ICLK may have the same phase as the reference clock signal REFCLK.
- the unit delay 220 may receive the input clock signal FBCLK.
- the input clock signal FBCLK may be a clock signal which is to be compared to the reference clock signal REFCLK.
- the input clock signal FBCLK may be a clock signal corresponding to the feedback clock signal FBCLK in FIG. 1 .
- the input clock signal and the feedback clock signal may indicate the same clock signal.
- the unit delay 220 may delay the input clock signal FBCLK by a unit delay time, and output the delayed signal.
- the unit delay time may correspond to the first unit delay time corresponding to the unit delay amount of the delay line 120 when the clock generation circuit 100 of FIG. 1 performs the first delay locking operation.
- the first phase detector 230 may receive the divided clock signal ICLK and the output of the unit delay 220 .
- the first phase detector 230 may function as a phase detector that detects the phases of the reference clock signal REFCLK and the feedback clock signal FBCLK, when the first delay locking operation is performed.
- the first phase detector 230 may detect whether a phase difference between the divided clock signal ICLK and the input clock signal FBCLK falls within the first unit delay time.
- the first phase detector 230 may generate the first detection signal CPD by comparing the phase of the divided clock signal ICLK to the phase of the output of the unit delay 220 .
- the second phase detector 240 may receive the divided clock signal ICLK and the input clock signal FBCLK.
- the second phase detector 240 may function as a phase detector that detects the phases of the divided clock signal ICLK and the feedback clock signal FBCLK, when the second delay locking operation is performed.
- the second phase detector 240 may detect whether a phase difference between the divided clock signal ICLK and the input clock signal FBCLK falls within the second unit delay time.
- the second phase detector 240 may generate the second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the input clock signal FBCLK.
- the phase detection circuit 200 may further include an initialization signal generator 250 .
- the initialization signal generator 250 may generate an initialization signal INTB based on the phase detection signal PDOUT and the input clock signal FBCLK.
- the initialization signal generator 250 may receive the locking signal LOCK, the input clock signal FBCLK and the reference clock signal REFCLK, and generate the initialization signal INTB.
- the locking signal LOCK may be generated based on the phase detection signal PDOUT during the first delay locking operation.
- the locking signal LOCK may be generated based on the first detection signal CPD which is outputted as the phase detection signal PDOUT during the first delay locking operation.
- the locking signal LOCK may be a locked signal which is enabled when the first delay locking operation is completed.
- the initialization signal generator 250 may enable the initialization signal INTB in synchronization with the input clock signal FBCLK, when the locking signal LOCK is enabled.
- the initialization signal generator 250 may disable the initialization signal INTB in synchronization with the reference clock signal REFCLK.
- the clock divider 210 may receive the initialization signal INTB.
- the clock divider 210 may be initialized based on the initialization signal INTB. When initialized by the initialization signal INTB, the clock divider 210 may newly generate the divided clock signal ICLK synchronized with the phase of the reference clock signal REFCLK.
- the phase detection circuit 200 may further include an output selector 260 .
- the output selector 260 may receive the locking signal LOCK, the first detection signal CPD and the second detection signal FPD.
- the output selector 260 may output one of the first and second detection signals CPD and FPD as the phase detection signal PDOUT based on the locking signal LOCK. For example, when the locking signal LOCK is disabled, the output selector 260 may output the first detection signal CPD as the phase detection signal PDOUT.
- the output selector 260 may output the second detection signal FPD as the phase detection signal PDOUT.
- the phase detection circuit 200 may further include a modeling delay 270 .
- the modeling delay 270 may have a delay amount obtained by modeling a delay amount which occurs in the clock divider 210 .
- the modeling delay 270 may have a delay amount corresponding to the time required until the clock divider 210 receives the reference clock signal REFCLK and generates the divided clock signal ICLK.
- the modeling delay 270 may receive the input clock signal FBCLK, and delay the input clock signal FBCLK by the modeled delay amount. By delaying the input clock signal FBCLK by the delay amount of the clock divider 210 , the modeling delay 270 may adjust the point of time when the divided clock signal ICLK and the input clock signal FBCLK are inputted to the first phase detector 230 and/or the second phase detector 240 .
- FIG. 3 illustrates a configuration of the initialization signal generator 250 illustrated in FIG. 2 .
- the initialization signal generator 250 may receive the locking signal LOCK, the input clock signal FBCLK and the reference clock signal REFCLK.
- the initialization signal generator 250 might not enable the initialization signal INTB, when the locking signal LOCK is disabled.
- the initialization signal generator 250 may enable the initialization signal INTB in synchronization with the input clock signal FBCLK, when the locking signal LOCK is enabled.
- the initialization signal generator 250 may disable the initialization signal INTB in synchronization with the reference clock signal REFCLK.
- the initialization signal generator 250 may maintain the enabled state of the initialization signal INTB during an arbitrary cycle of the reference clock signal REFCLK, based on the reference clock signal REFCLK.
- the initialization signal generator 250 may include a first flip-flop 310 , a second flip-flop 320 , a third flip-flop 330 , a fourth flip-flop 340 and a pulse generator 350 .
- the first flip-flop 310 may receive the locking signal LOCK through an input terminal thereof, and receive the input clock signal FBCLK through a clock terminal thereof.
- the first flip-flop 310 may output the locking signal LOCK to an output terminal thereof in synchronization with the input clock signal FBCLK.
- the second flip-flop 320 may have an input terminal coupled to the output terminal of the first flip-flop 310 and a clock terminal configured to receive the reference clock signal REFCLK.
- the second flip-flop 320 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK.
- the third flip-flop 330 may have an input terminal coupled to the output terminal of the second flip-flop 320 and a clock terminal configured to receive the reference clock signal REFCLK.
- the third flip-flop 330 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK.
- the fourth flip-flop 340 may have an input terminal coupled to the output terminal of the third flip-flop 330 and a clock terminal configured to receive the reference clock signal REFCLK.
- the fourth flip-flop 340 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK.
- the pulse generator 350 may receive the signal outputted from the output terminal of the first flip-flop 310 and the signal outputted from the output terminal of the fourth flip-flop 340 , and generate the initialization signal INTB.
- the pulse generator 350 may enable the initialization signal INTB based on the signal outputted from the output terminal of the first flip-flop 310 , and disable the initialization signal INTB based on the signal outputted from the output terminal of the fourth flip-flop 340 .
- the initialization signal generator 250 may be modified in various manners to include various numbers of flip-flops.
- the initialization signal generator 250 may include second to fourth flip-flops 320 , 330 and 340 to generate the initialization signal INTB having a pulse width within three cycles of the reference clock signal REFCLK.
- the number of flip-flops included in the initialization signal generator 250 may be changed to make the initialization signal INTB have a pulse width within two cycles of the reference clock signal REFCLK or a pulse width within four cycles of the reference clock signal REFCLK.
- the pulse generator 350 may be configured to perform inversion and OR operations and may include, for example but not limited to, an inverter 351 , a first NOR gate 352 and a second NOR gate 353 .
- the inverter 351 may receive a signal outputted from the output terminal of the first flip-flop 310 , and invert the received signal.
- the first NOR gate 352 may receive the output of the inverter 351 and a signal outputted from the fourth flip-flop 340 , and perform a NOR operation on the received signals.
- the second NOR gate 353 may receive an output of the first NOR gate 352 and a reset signal RST, and output the initialization signal INTB.
- the second NOR gate 353 may generate the initialization signal INTB by inverting the output of the first NOR gate 352 .
- the reset signal RST may be received to reset the initialization signal generator 250 .
- the second NOR gate 353 may operate as an inverter.
- FIGS. 4A and 4B are timing diagrams illustrating the operations of the phase detection circuit 200 and the clock generation circuit 100 in accordance with an embodiment.
- the clock generation circuit 100 may receive the system clock signal CLK and perform the first delay locking operation.
- the clock divider 210 may generate the divided clock signal ICLK by dividing the frequency of the reference clock signal REFCLK.
- the first phase detector 230 may generate the first detection signal CPD by comparing the phase of the feedback clock signal FBCLK delayed by the unit delay 220 to the phase of the divided clock signal ICLK.
- the locking signal LOCK may be disabled, and the output selector 260 may output the first detection signal CPD as the phase detection signal PDOUT.
- the delay line controller 150 may change the code value of the delay control signal DC based on the phase detection signal PDOUT, and the delay line 120 may change the phases of the output clock signal CLKOUT and the feedback clock signal FBCLK.
- the delay line controller 150 may enable the locking signal LOCK to complete the first delay locking operation.
- the initialization signal generator 250 may enable the initialization signal INTB in synchronization with the feedback clock signal FBCLK.
- the clock divider 210 might not output the divided clock signal ICLK.
- the clock generation circuit 100 may perform the second delay locking operation.
- the clock divider 210 may newly generate the divided clock signal ICLK from the reference clock signal REFCLK.
- the second phase detector 240 may generate the second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the feedback clock signal FBCLK.
- the output selector 260 may output the second detection signal FPD as the phase detection signal PDOUT based on the locking signal LOCK, and the delay line controller 150 may change the code value of the delay control signal DC based on the second detection signal FPD outputted as the phase detection signal PDOUT. Based on the delay control signal DC, the delay amount of the delay line 120 may be finely adjusted, and the second delay locking operation may be performed.
- phase detection circuit 200 may initialize the clock divider 210 to solve the problem of the harmonic locking.
- the initialization signal generator 250 may enable the initialization signal INTB in synchronization with the feedback clock signal FBCLK, but disable the initialization signal INTB in synchronization with the reference clock signal REFCLK. Therefore, because the clock divider 210 newly generates the divided clock signal ICLK based on the initialization signal INTB, the second phase detector 240 may generate the second detection signal FPD by performing a phase comparison operation on a rising edge of the feedback clock signal FBCLK and a rising edge of the divided clock signal ICLK.
- the initialization signal INTB may be enabled in synchronization of a rising edge of the feedback clock signal FBCLK, and disabled in synchronization with a rising edge of the reference clock signal REFCLK.
- the clock divider 210 may newly generate the divided clock signal ICLK based on the reference clock signal REFCLK. Therefore, during the second delay locking operation, the phases of the rising edge of the feedback clock signal FBCLK and the rising edge of the divided clock signal ICLK may be compared to each other.
- a rising edge of the feedback clock signal FBCLK may be synchronized with a falling edge of the divided clock signal ICLK during the first delay locking operation.
- the clock divider 210 when the clock divider 210 is not initialized, the phases of the rising edge of the feedback clock signal FBCLK and the falling edge of the divided clock signal ICLK may be compared to each other during the second delay locking operation. In this case, harmonic locking may occur. However, when the clock divider 210 is initialized to newly generate the divided clock signal ICLK, the phases of the rising edge of the feedback clock signal FBCLK and the rising edge of the divided clock signal ICLK may be compared to each other during the second delay locking operation.
- FIG. 5 illustrates a configuration of a phase detection circuit 500 in accordance with an embodiment.
- the phase detection circuit 500 may include a clock divider 510 , a select signal generator 520 and a phase detector 530 .
- the clock divider 510 may receive a reference clock signal REFCLK, and generate a plurality of divided clock signals ICLK, QCLK, IBCLK and QBCLK.
- the clock divider 510 may generate a first divided clock signal ICLK, a second divided clock signal QCLK, a third divided clock signal IBCLK and a fourth divided clock signal QBCLK by dividing the frequency of the reference clock signal REFCLK.
- the first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may have a half frequency of the reference clock signal REFCLK.
- the first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may sequentially have a phase difference corresponding to a unit phase.
- the first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may sequentially have a phase difference of 90 degrees.
- the second divided clock signal QCLK may have a phase corresponding to the middle between the first and third divided clock signals ICLK and IBCLK.
- the select signal generator 520 may receive the input clock signal FBCLK, the second divided clock signal QCLK and the locking signal LOCK.
- the input clock signal FBCLK may be a signal corresponding to the feedback clock signal FBCLK illustrated in FIG. 1 .
- the select signal generator 520 may generate a select signal SEL by comparing the phase of the second divided clock signal QCLK to the phase of the input clock signal FBCLK based on the locking signal LOCK. When the locking signal LOCK is disabled during the first delay locking operation, the select signal generator 520 may generate the select signal SEL having a first level regardless of the phases of the second divided clock signal QCLK and the input clock signal FBCLK.
- the select signal generator 520 may generate a level decision signal LDS by comparing the phase of the second divided clock signal QCLK to the phase of the input clock signal FBCLK.
- the select signal generator 520 may generate the level decision signal LDS having the first level, when the second divided clock signal QCLK has the first level at a rising edge of the input clock signal FBCLK.
- the select signal generator 520 may generate the level decision signal LDS having a second level, when the second divided clock signal QCLK has the second level at a rising edge of the input clock signal FBCLK.
- the select signal generator 520 may output the level decision signal LDS as the select signal SEL.
- the phase detector 530 may receive the select signal SEL, the first divided clock signal ICLK, the third divided clock signal IBCLK and the input clock signal FBCLK.
- the phase detector 530 may generate a phase detection signal PDOUT by comparing the phase of one of the first and third divided clock signals ICLK and IBCLK to the phase of the input clock signal FBCLK, based on the select signal SEL.
- the phase detector 530 may generate the phase detection signal PDOUT by comparing the phase of the first divided clock signal ICLK to the phase of the input clock signal FBCLK, when the select signal SEL is at the first level.
- the phase detector 530 may generate the phase detection signal PDOUT by comparing the phase of the third divided clock signal IBCLK to the phase of the input clock signal FBCLK, when the select signal SEL is at the second level.
- the select signal generator 520 may include an inverter 521 , a first gating unit 522 , a second gating unit 523 , a first comparator 524 and a third gating unit 525 .
- the inverter 521 may receive the locking signal LOCK and invert the locking signal LOCK.
- the first gating unit 522 may receive the second divided clock signal QCLK and the output of the inverter 521 .
- the first gating unit 522 may perform an AND operation the second divided clock signal QCLK and the output of the inverter 521 .
- the second gating unit 523 may receive the input clock signal FBCLK and the output of the inverter 521 .
- the second gating unit 523 may perform an AND operation the input clock signal FBCLK and the output of the inverter 521 .
- the first comparator 524 may receive outputs of the first and second gating units 522 and 523 , and output the level decision signal LDS.
- the first comparator 524 may generate the level decision signal LDS by comparing the phases of the outputs of the first and second gating units 522 and 523 .
- the first comparator 524 may include a flip-flop.
- the first comparator 524 may output the output of the first gating unit 522 as the level decision signal LDS in synchronization with the output of the second gating unit 523 .
- the third gating unit 525 may receive the level decision signal LDS and the locking signal LOCK, and output the select signal SEL.
- the third gating unit 525 may generate the select signal SEL by performing a NAND operation on the level decision signal LDS and the locking signal LOCK.
- the phase detector 530 may include a clock selector 531 and a second comparator 532 .
- the clock selector 531 may receive the select signal SEL, the first divided clock signal ICLK and the third divided clock signal IBCLK.
- the clock selector 531 may output one of the first and third divided clock signals ICLK and IBCLK to the second comparator 532 based on the select signal SEL.
- the clock selector 531 may be configured to perform inversion and AND operations and may include, for example but not limited to, an inverter 541 , a first NAND gate 542 , a second NAND gate 543 and a third NAND gate 544 .
- the inverter 541 may receive the select signal SEL, and invert the select signal SEL.
- the first NAND gate 542 may receive the first divided clock signal ICLK and the select signal SEL, and perform a NAND operation on the first divided clock signal ICLK and the select signal SEL.
- the second NAND gate 543 may receive the third divided clock signal IBCLK and an output of the inverter 541 , and perform a NAND operation on the third divided clock signal IBCLK and the output of the inverter 541 .
- the second comparator 532 may receive the input clock signal FBCLK and the output of the clock selector 531 , and output a phase detection signal PDOUT.
- the second comparator 532 may generate the phase detection signal PDOUT by comparing the phase of the input clock signal FBCLK to the phase of the output of the clock selector 531 .
- the second comparator 532 may include a flip-flop.
- the second comparator 532 may output the output of the clock selector 531 as the phase detection signal PDOUT in synchronization with the input clock signal FBCLK.
- the phase detector 530 may further include a dummy delay 533 .
- the dummy delay 533 may delay the input clock signal FBCLK, and output the delayed signal to the second comparator 532 .
- the dummy delay 533 may have a delay amount corresponding to a delay amount required for the clock selector 531 to select and output one of the first and third divided clock signals ICLK and IBCLK.
- the dummy delay 533 may be configured to perform an AND operation and may include, for example but not limited to, a fourth NAND gate 545 and a fifth NAND gate 546 .
- the fourth NAND gate 545 may receive the input clock signal FBCLK and a supply voltage VDD.
- the fifth NAND gate 546 may receive an output of the fourth NAND gate 545 and the supply voltage VDD. Because the supply voltage VDD is a high-level signal, the fourth and fifth NAND gates 545 and 546 may operate as inverters.
- the first and third divided clock signals ICLK and IBCLK may be outputted to the second comparator 532 through two NAND gates, respectively.
- the dummy delay 533 may delay the input clock signal FBCLK through the two NAND gates, thereby adjusting the point of time when the output of the clock selector 531 and the input clock signal FBCLK are inputted to the second comparator 532 .
- FIGS. 6A and 6B are timing diagrams illustrating the operations of the phase detection circuit 500 and the clock generation circuit 100 in accordance with an embodiment.
- the clock divider 510 of the phase detection circuit 500 may generate the first divided clock signal ICLK, the second divided clock signal QCLK and the third divided clock signal IBCLK by dividing the reference clock signal REFCLK.
- the clock generation circuit 100 may perform the first delay locking operation, and the locking signal LOCK may be disabled.
- the phase detection circuit 500 may generate the phase detection signal PDOUT by comparing the phase of the feedback clock signal FBCLK to the phase of the first divided clock signal ICLK based on the disabled locking signal LOCK.
- FIG. 6A shows that the phase detection circuit 500 detects that the first divided clock signal ICLK transitions from a low level to a high level at a rising edge of the feedback clock signal FBCLK, and performs the first delay locking operation.
- the phase detection circuit 500 may generate the phase detection signal PDOUT having a low level. Because the level of the first divided clock signal ICLK is a high level at a second rising edge of the feedback clock signal FBCLK, the phase detection circuit 500 may generate the phase detection signal PDOUT having a high level.
- the delay line controller 150 may enable the locking signal LOCK.
- the select signal generator 520 may output the level of the second divided clock signal QLCK, which lags behind the first divided clock signal ICLK by the unit phase, as the level decision signal LDS at a rising edge of the feedback clock signal FBCLK.
- the select signal generator 520 may output the level decision signal LDS having a low level.
- the select signal generator 520 may output the select signal SEL having a high level based on the level decision signal LDS.
- the clock selector 531 may output the first divided clock signal ICLK to the second comparator 532 based on the select signal SEL having a high level. Therefore, as the second comparator 532 generates the phase detection signal PDOUT by comparing the phase of the first divided clock signal ICLK to the phase of the feedback clock signal FBCLK, the second delay locking operation of the clock generation circuit 100 may be performed.
- FIG. 6B shows that the phase detection circuit 500 detects that the first divided clock signal ICLK transitions from a high level to a low level at a rising edge of the feedback clock signal FBCLK, and performs the first delay locking operation.
- harmonic locking may occur. That is, when the phase detection circuit 500 performs the second delay locking operation by comparing the phase of the first divided clock signal ICLK to the phase of the feedback clock signal FBCLK after the first delay locking operation is completed, the harmonic locking may occur while a rising edge of the feedback clock signal FBCLK is synchronized with a rising edge of the reference clock signal REFCLK in a different cycle from a normal cycle.
- the phase detection circuit 500 may generate the phase detection signal PDOUT having a high level. Because the level of the first divided clock signal ICLK is a low level at a second rising edge of the feedback clock signal FBCLK, the phase detection circuit 500 may generate the phase detection signal PDOUT having a low level. When the output of the phase detection circuit 500 changes from a high level to a low level, the delay line controller 150 may enable the locking signal LOCK.
- the select signal generator 520 may output the level of the second divided clock signal QLCK, which lags behind the first divided clock signal ICLK by the unit phase, as the level decision signal LDS at a rising edge of the feedback clock signal FBCLK. Therefore, the select signal generator 520 may output the level decision signal LDS having a high level.
- the select signal generator 520 may output the select signal SEL having a low level based on the level decision signal LDS.
- the clock selector 531 may output the third divided clock signal IBCLK to the second comparator 532 based on the select signal SEL having a low level.
- the second comparator 532 generates the phase detection signal PDOUT by comparing the phase of the third divided clock signal IBCLK to the phase of the feedback clock signal FBCLK
- the second delay locking operation may be performed.
- a rising edge of the reference clock signal REFCLK in a normal cycle may be synchronized with a rising edge of the feedback clock signal FBCLK.
- FIG. 7 illustrates a configuration of a semiconductor system 7 in accordance with an embodiment.
- the semiconductor system 7 may include a first semiconductor apparatus 710 and a second semiconductor apparatus 720 .
- the first semiconductor apparatus 710 may provide various control signals required for operating the second semiconductor apparatus 720 .
- the first semiconductor apparatus 710 may include various types of apparatuses.
- the first semiconductor apparatus 710 may be a host device such as a central processing unit (CPU), graphic processing unit (GPU), multi-media processor (MMP), digital signal processor, application processor (AP) or memory controller.
- the second semiconductor apparatus 720 may be a memory device, for example, and the memory device may include a volatile memory and a nonvolatile memory.
- Examples of the volatile memory may include an SRAM (Static RAM), DRAM (Dynamic RAM) and SDRAM (Synchronous DRAM), and the nonvolatile memory may include a ROM (Read Only Memory), PROM (Programmable ROM), EEPROM (Electrically Erasable and Programmable ROM), EPROM (Electrically Programmable ROM), flash memory, PRAM (Phase change RAM), MRAM (Magnetic RAM), RRAM (Resistive RAM), FRAM (Ferroelectric RAM) and the like.
- SRAM Static RAM
- DRAM Dynamic RAM
- SDRAM Synchronous DRAM
- the nonvolatile memory may include a ROM (Read Only Memory), PROM (Programmable ROM), EEPROM (Electrically Erasable and Programmable ROM), EPROM (Electrically Programmable ROM), flash memory, PRAM (Phase change RAM), MRAM (Magnetic RAM), RRAM (Resistive RAM), FRAM (Ferroelectric RAM)
- the first and second semiconductor apparatuses 710 and 720 may transfer data to perform data communication.
- the first semiconductor apparatus 710 may transfer the data to the second semiconductor apparatus 720 in synchronization with a clock signal.
- the second semiconductor apparatus 720 may transfer the data to the first semiconductor apparatus 710 in synchronization with the clock signal.
- the second semiconductor apparatus 720 may be coupled to the first semiconductor apparatus 710 through a plurality of buses.
- the plurality of buses 101 may be signal transfer paths, links or channels for transferring a signal.
- the plurality of buses may include a clock bus 701 , a data bus 702 and the like.
- the clock bus 701 may be a one-way bus
- the data bus 702 may be a two-way bus.
- the second semiconductor apparatus 720 may be coupled to the first semiconductor apparatus 710 through the clock bus 701 , and receive a system clock signal CLK through the clock bus 701 .
- the system clock signal CLK may be transferred as a single ended signal, or transferred as a differential signal with a complementary signal CLKB.
- the second semiconductor apparatus 720 may be coupled to the first semiconductor apparatus 710 through the data bus 702 , and receive data DQ from the first semiconductor apparatus 710 or transfer the data DQ to the first semiconductor apparatus 710 through the data bus 702 .
- the semiconductor system 7 may further include a command address bus.
- the command address bus may be a one-way bus.
- the first semiconductor apparatus 710 may transfer a command address signal to the second semiconductor apparatus 720 through the command address bus.
- the first semiconductor apparatus 710 may include a clock generation circuit 711 and a data I/O circuit 714 .
- the clock generation circuit 711 may generate the system clock signal CLK.
- the clock generation circuit 711 may include a PLL circuit and/or a DLL circuit.
- the clock generation circuit 711 may adjust the phase of the system clock signal CLK by comparing the phase of a reference clock signal to the phase of a feedback clock signal.
- the clock generation circuit 711 may include a phase detection circuit 712 to compare the phases of the reference clock signal and the feedback clock signal.
- the clock generation circuit 100 illustrated in FIG. 1 may be applied as the clock generation circuit 711 .
- the phase detection circuits 200 and 500 illustrated in FIGS. 2 and 5 may be applied as the phase detection circuit 712 .
- the clock generation circuit 711 may be coupled to the clock bus 701 through a clock pad 715 .
- the clock generation circuit 711 may provide the system clock signal CLK to the second semiconductor apparatus 720 through the clock bus 701 .
- the clock generation circuit 711 may provide the system clock signal CLK to the data I/O circuit 714 .
- the data I/O circuit 714 may be coupled to the data bus 702 through a data pad 716 .
- the data I/O circuit 714 may synchronize internal data of the first semiconductor apparatus 710 with the system clock signal CLK, and output the synchronized data to the data bus 702 .
- the data outputted from the data I/O circuit 714 may be transferred as the data DQ to the second semiconductor apparatus 720 through the data pad 716 and the data bus 702 .
- the data I/O circuit 714 may receive the data transferred from the second semiconductor apparatus 720 through the data bus 702 , and generate the internal data of the first semiconductor apparatus 710 from the received data.
- the second semiconductor apparatus 720 may include a clock generation circuit 721 , a data storage area 723 and a data I/O circuit 724 .
- the clock generation circuit 721 may be coupled to the clock bus 701 through a clock pad 725 .
- the clock generation circuit 721 may receive the system clock signal CLK through the clock bus 701 , and generate an internal clock signal INCLK.
- the clock generation circuit 721 may include a PLL circuit and/or a DLL circuit.
- the clock generation circuit 721 may adjust the phase of the internal clock signal INCLK by comparing the phase of the reference clock signal to the phase of the feedback clock signal.
- the clock generation circuit 721 may include a phase detection circuit 722 to compare the phases of the reference clock signal and the feedback clock signal.
- the clock generation circuit 100 illustrated in FIG. 1 may be applied as the clock generation circuit 721 .
- the phase detection circuits 200 and 500 illustrated in FIGS. 2 and 5 may be applied as the phase detection circuit 722 .
- the data storage area 723 may be a memory cell array including a plurality of memory cells.
- the data storage area 723 may include a plurality of bit lines, a plurality of word lines, and a plurality of memory cells coupled to the respective intersections between the plurality of bit lines and the plurality of word lines.
- the plurality of memory cells may include one or more of a volatile memory cell and a nonvolatile memory cell.
- the data I/O circuit 724 may be coupled to the data bus 702 through a data pad 726 , and coupled to the data storage area 723 .
- the data I/O circuit 724 may receive the internal clock signal INCLK from the clock generation circuit 721 .
- the data I/O circuit 724 may synchronize data outputted from the data storage area 723 with the internal clock signal INCLK, and output the synchronized data to the data bus 702 .
- the data outputted from the data I/O circuit 724 may be transferred as the data DQ to the first semiconductor apparatus 710 .
- the data I/O circuit 724 may receive the data DQ transferred from the first semiconductor apparatus 710 through the data bus 702 .
- the data I/O circuit 724 may store the received data in the data storage area 723 .
- phase detection circuit and the clock generation circuit described herein should not be limited based on the described embodiments.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
- Manipulation Of Pulses (AREA)
Abstract
Description
- The present application claims priority under 35 U.S.C. § 119(a) to Korean application number 10-2018-0134545, filed on Nov. 5, 2018, in the Korean Intellectual Property Office, which is incorporated herein by reference in its entirety.
- Various embodiments generally relate to an integrated circuit technology, and more particularly, to a phase detection circuit for detecting the phase of a clock signal, and a semiconductor apparatus including the phase detection circuit.
- An electronic device may include many electronic components. Among the electronic components, a computer system may include a large number of semiconductor apparatuses composed of semiconductors. The semiconductor apparatuses constituting the computer system may communicate with one another while transferring and receiving a clock signal and data. The semiconductor apparatuses may operate in synchronization with the clock signal. The semiconductor apparatuses may receive a system clock signal transferred through a clock bus, and generate an internal clock signal which can be used for an internal operation. The semiconductor apparatuses may include a clock generation circuit such as a delay locked loop (DLL) circuit and/or a phase locked loop (PLL) circuit, in order to synchronize the phases of the system clock signal and the internal clock signal. The clock generation circuits include a phase detection circuit, and the phase detection circuit detects whether the phase of the clock signal leads or lags, such that the phase of the clock signal can be adjusted.
- In an embodiment, a phase detection circuit may include a clock divider, a unit delay, a first phase detector, a second phase detector, and an initialization signal generator. The clock divider may be configured to generate a divided clock signal by dividing the frequency of a reference clock signal, and is initialized based on an initialization signal. The first phase detector may be configured to generate a first detection signal by comparing the phase of an input clock signal, after being delayed by a unit delay time, with the phase of the divided clock signal. The second phase detector may be configured to generate a second detection signal by comparing the phase of the input clock signal to the phase of the divided clock signal. The initialization signal generator may be configured to generate the initialization signal based on the first detection signal.
- In an embodiment, a clock generation circuit may include a phase detection circuit. The phase detection circuit may be configured to generate an output clock signal by delaying a reference clock signal, and to generate a phase detection signal by detecting the phases of the reference clock signal and a feedback clock signal generated from the output clock signal in order to change a delay amount of the output clock signal. The phase detection circuit may include a clock divider, a unit delay, a first phase detector, a second phase detector, and an output selector. The clock divider may be configured to generate a divided clock signal by dividing the reference clock signal. The unit delay may be configured to delay the feedback clock signal by a unit delay time. The first phase detector may be configured to generate a first detection signal by comparing the phase of an output of the unit delay to the phase of the divided clock signal during a first delay locking operation. The second phase detector may be configured to generate a second detection signal by comparing the phase of the feedback clock signal to the phase of the divided clock signal during a second delay locking operation. The output selector may be configured to output one of the first and second detection signals as the phase detection signal based on a locking signal.
- In an embodiment, a phase detection circuit may include a clock divider, a select signal generator, and a phase detector. The clock divider may be configured to generate a first divided clock signal, a second divided clock signal and a third divided clock signal by dividing a reference clock signal. The select signal generator may be configured to generate a select signal by comparing the second divided clock signal and an input clock signal based on a locking signal. The phase detector may be configured to generate a phase detection signal by comparing the phase of the first divided clock signal to the phase of the input clock signal when the select signal is at a first level, and generate the phase detection signal by comparing the phase of the third divided clock signal to the phase of the input clock signal when the select signal is at a second level.
- In an embodiment, a clock generation circuit may include a phase detection circuit. The phase detection circuit may be configured to generate an output clock signal by delaying a reference clock signal, and generate a phase detection signal by detecting the phase of the reference clock signal to the phase of a feedback clock signal generated from the output clock signal in order to change a delay amount of the output clock signal. The phase detection circuit may include a clock divider, a select signal generator, and a phase detector. The clock divider may be configured to generate a first divided clock signal, a second divided clock signal and a third divided clock signal by dividing the reference clock signal. The select signal generator may be configured to generate a select signal by comparing the phase of the second divided clock signal to the phase of a feedback clock signal based on a locking signal. The phase detector may be configured to generate a phase detection signal by comparing the phase of one of the first and third divided clock signals to the phase of the feedback clock signal based on the select signal.
- In an embodiment, a phase detection circuit may include a clock divider configured to generate a divided clock signal by dividing the frequency of a reference clock signal during a first delay locking operation. The phase detection circuit may include a first phase detector configured to compare the phase of an input clock signal, which has been delayed by a unit delay time, to the phase of the divided clock signal during the first delay locking operation. The phase detection circuit may include a second phase detector configured to compare the phase of the divided clock signal to the phase of the input clock signal during a second delay locking operation. The clock divider may be initialized after completion of the first delay locking operation.
-
FIG. 1 illustrates a configuration of a clock generation circuit in accordance with an embodiment. -
FIG. 2 illustrates a configuration of a phase detection circuit in accordance with an embodiment. -
FIG. 3 illustrates a configuration of an initialization signal generator illustrated inFIG. 2 . -
FIGS. 4A and 4B are timing diagrams illustrating operations of the phase detection circuit and the clock generation circuit in accordance with an embodiment. -
FIG. 5 illustrates a configuration of a phase detection circuit in accordance with an embodiment. -
FIGS. 6A and 6B are timing diagrams illustrating operations of the phase detection circuit and the clock generation circuit in accordance with an embodiment. -
FIG. 7 illustrates a configuration of a semiconductor system in accordance with an embodiment. -
FIG. 1 illustrates a configuration of aclock generation circuit 100 in accordance with an embodiment. Theclock generation circuit 100 may receive a system clock signal CLK and generate an output clock signal CLKOUT. The system clock signal CLK may be an external clock signal transferred from an external device of a semiconductor apparatus including theclock generation circuit 100. Theclock generation circuit 100 may generate the output clock signal CLKOUT by delaying a reference clock signal REFCLK generated from the system clock signal CLK. Theclock generation circuit 100 may be a delay locked loop (DLL) circuit that can change a delay amount of the output clock signal CLKOUT, and maintain the changed delay amount. Theclock generation circuit 100 may include aphase detection circuit 110 to change the phase of the output clock signal CLKOUT. Thephase detection circuit 110 may generate a phase detection signal PDOUT by comparing the phase of the reference clock signal REFCLK to the phase of a feedback clock signal FBCLK generated by delaying the output clock signal CLKOUT. - In
FIG. 1 , theclock generation circuit 100 may include adelay line 120, a clock dividingcircuit 130, areplica 140 and adelay line controller 150. Thedelay line 120 may generate the output clock signal CLKOUT by delaying the reference clock signal REFCLK. Thedelay line 120 may receive a delay control signal DC, and have a delay amount which is changed based on the delay control signal DC. Thedelay line 120 may generate the output clock signal CLKOUT by delaying the reference clock signal REFCLK by a delay amount which is set based on the delay control signal DC. - The clock dividing
circuit 130 may receive the output clock signal CLKOUT. Theclock dividing circuit 130 may generate a divided clock signal by dividing the output clock signal CLKOUT. For example, theclock dividing circuit 130 may divide the frequency of the output clock signal CLKOUT. Theclock dividing circuit 130 may generate a clock signal having a half frequency of the output clock signal CLKOUT. Thereplica 140 may receive an output of theclock dividing circuit 130. Thereplica 140 may delay the output of theclock dividing circuit 130 by a preset delay amount. Thereplica 140 may generate the feedback clock signal by delaying the output of theclock dividing circuit 130. The delay amount of thereplica 140 may be arbitrarily set. For example, the delay amount of thereplica 140 may correspond to a delay time required until the semiconductor apparatus including theclock generation circuit 100 receives the system clock signal CLK and generates the reference clock signal REFCLK. The word “preset” as used herein with respect to a parameter, such as a preset delay amount, means that a value for the parameter is determined prior to the parameter being used in a process or algorithm. For some embodiments, the value for the parameter is determined before the process or algorithm begins. In other embodiments, the value for the parameter is determined during the process or algorithm but before the parameter is used in the process or algorithm. - The
phase detection circuit 110 may receive the reference clock signal REFCLK and the feedback clock signal FBCLK. Thephase detection circuit 110 may generate a divided clock signal by dividing the reference clock signal REFCLK. Thephase detection circuit 110 may generate a divided clock signal having a half frequency of the reference clock signal REFCLK by dividing the frequency of the reference clock signal REFCLK. In an embodiment, thephase detection circuit 110 may generate a plurality of divided clock signals having different phases by dividing the reference clock signal REFCLK. Thephase detection circuit 110 may generate the phase detection signal PDOUT by comparing the phase of the divided clock signal to the phase of the feedback clock signal FBCLK. - The
delay line controller 150 may receive the phase detection signal PDOUT. Thedelay line controller 150 may generate the delay control signal DC based on the phase detection signal PDOUT. The delay control signal DC may be a code signal having a plurality of bits. Thedelay line 120 may include a plurality of unit delays. The plurality of unit delays may be controlled based on the respective bits of the delay control signal DC. Thedelay line controller 150 may increase the delay amount of thedelay line 120 by increasing the code value of the delay control signal DC and increasing the number of turned-on unit delays. Furthermore, thedelay line controller 150 may decrease the delay amount of thedelay line 120 by decreasing the code value of the delay control signal DC and decreasing the number of turned-on unit delays. - For example, the
phase detection circuit 110 may generate the phase detection signal PDOUT having a first level when the phase of the reference clock signal RFFCLK lags behind the phase of the feedback clock signal FBCLK. The first level may be a logic low level. Thephase detection circuit 110 may generate the phase detection signal PDOUT having a second level when the phase of the reference clock signal RFFCLK leads the phase of the feedback clock signal FBCLK. The second level may be a logic high level. When the phase detection signal PDOUT is at the first level, thedelay line controller 150 may decrease the delay amount of thedelay line 120 by decreasing the code value of the delay control signal DC. When the phase detection signal PDOUT is at the second level, thedelay line controller 150 may increase the delay amount of thedelay line 120 by increasing the code value of the delay control signal DC. A high level and a low level, as used herein with respect to signals, refer to logic levels of the signals. A signal having a low level distinguishes from the signal when it has a high level. For example, the high level may correspond to the signal having a first voltage, and the low level may correspond to the signal having a second voltage. For some embodiments, the first voltage is greater than the second voltage. In other embodiments, different characteristics of a signal, such as frequency or amplitude, determine whether the signal has a high level or a low level. For some cases, the high and low levels of a signal represent logical binary states. - The
delay line controller 150 may generate a locking signal LOCK based on the phase detection signal PDOUT. Thedelay line controller 150 may enable the locking signal LOCK when the phase detection signals PDOUT having different levels are successively generated from thephase detection circuit 110. The locking signal LOCK may indicate that a delay locking operation is completed. For example, when the phase detection signal PDOUT having a high level is generated from thephase detection circuit 110 after the phase detection signal PDOUT having a low level is generated or the phase detection signal PDOUT having a low level is generated from thephase detection circuit 110 after the phase detection signal PDOUT having a high level is generated, thedelay line controller 150 may enable the locking signal LOCK. A high level and a low level, as used herein with respect to signals, refer to logic levels of the signals. A signal having a low level distinguishes from the signal when it has a high level. For example, the high level may correspond to the signal having a first voltage, and the low level may correspond to the signal having a second voltage. For some embodiments, the first voltage is greater than the second voltage. In other embodiments, different characteristics of a signal, such as frequency or amplitude, determine whether the signal has a high level or a low level. For some cases, the high and low levels of a signal represent logical binary states. - In
FIG. 1 , theclock generation circuit 100 may further include aclock buffer 160 and a duty correction circuit (DCC) 170. Theclock buffer 160 may receive the system clock signal CLK and generate the reference clock signal REFCLK. The system clock signal CLK may be inputted as a single ended signal, or inputted as a differential signal with a complementary signal CLKB. When the system clock signal CLK is inputted as a single ended signal, theclock buffer 160 may generate the reference clock signal REFCLK by differentially amplifying the system clock signal CLK and a reference voltage VREF. The reference voltage VREF may have a level corresponding to the middle of the swing of the system clock signal CLK. When the system clock signal CLK is inputted as a differential signal, theclock buffer 160 may generate the reference clock signal REFCLK by differentially amplifying the system clock signal CLK and the complementary signal CLKB. TheDCC 170 may be coupled to thedelay line 120. TheDCC 170 may correct the duty ratio of the output clock signal CLKOUT. For example, theDCC 170 may correct the duty ratio of the output clock signal CLKOUT such that the output clock signal CLKOUT may have a duty ratio of 50:50. The word “coupled,” as used herein for some embodiments, means that two components are directly connected with one another. For example, a first component coupled to a second component means the first component is contacting the second component. For other embodiments, coupled components have one or more intervening components. For example, a first component is coupled to a second component when the first and second components are both in contact with a common third component even though the first component is not directly contacting the second component. - The
clock generation circuit 100 may perform a first delay locking operation and a second delay locking operation. The first delay locking operation may be a coarse delay locking operation, and the second delay locking operation may be a fine delay locking operation. The unit delay amount of thedelay line 120 in the first delay locking operation may be changed by a larger amount than the unit delay amount of thedelay line 120 in the second delay locking operation. For example, during the first delay locking operation, the delay amount of thedelay line 120 may be changed by a first unit delay time, and during the second delay locking operation, the delay amount of thedelay line 120 may be changed by a second unit delay time. The first unit delay time may be longer than the second unit delay time. Theclock generation circuit 100 may generate the output clock signal CLKOUT by performing the first delay locking operation. When the first delay locking operation is completed, theclock generation circuit 100 may generate the output clock signal CLKOUT by performing the second delay locking operation. When the first delay locking operation is completed, the locking signal LOCK may be enabled by thedelay line controller 150. -
FIG. 2 illustrates a configuration of aphase detection circuit 200 in accordance with an embodiment. Thephase detection circuit 200 may be applied as thephase detection circuit 110 illustrated inFIG. 1 . Thephase detection circuit 200 may generate a first detection signal CPD by comparing the phase of an input clock signal FBCLK to the phase of a divided clock signal ICLK generated by dividing the reference clock signal REFCLK during the first delay locking operation. Thephase detection circuit 200 may generate a second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the input clock signal FBCLK during the second delay locking operation. Thephase detection circuit 200 may output the first detection signal CPD as a phase detection signal PDOUT during the first delay locking operation, and output the second detection signal FPD as the phase detection signal PDOUT during the second delay locking operation. Referring toFIG. 2 , thephase detection circuit 200 may include aclock divider 210, aunit delay 220, afirst phase detector 230 and asecond phase detector 240. Theclock divider 210 may receive the reference clock signal REFCLK. Theclock divider 210 may generate the divided clock signal ICLK by dividing the frequency of the reference clock signal REFCLK. The divided clock signal ICLK may have the same phase as the reference clock signal REFCLK. - The
unit delay 220 may receive the input clock signal FBCLK. The input clock signal FBCLK may be a clock signal which is to be compared to the reference clock signal REFCLK. The input clock signal FBCLK may be a clock signal corresponding to the feedback clock signal FBCLK inFIG. 1 . Hereafter, the input clock signal and the feedback clock signal may indicate the same clock signal. Theunit delay 220 may delay the input clock signal FBCLK by a unit delay time, and output the delayed signal. The unit delay time may correspond to the first unit delay time corresponding to the unit delay amount of thedelay line 120 when theclock generation circuit 100 ofFIG. 1 performs the first delay locking operation. - The
first phase detector 230 may receive the divided clock signal ICLK and the output of theunit delay 220. Thefirst phase detector 230 may function as a phase detector that detects the phases of the reference clock signal REFCLK and the feedback clock signal FBCLK, when the first delay locking operation is performed. When the first delay locking operation is performed, thefirst phase detector 230 may detect whether a phase difference between the divided clock signal ICLK and the input clock signal FBCLK falls within the first unit delay time. Thefirst phase detector 230 may generate the first detection signal CPD by comparing the phase of the divided clock signal ICLK to the phase of the output of theunit delay 220. - The
second phase detector 240 may receive the divided clock signal ICLK and the input clock signal FBCLK. Thesecond phase detector 240 may function as a phase detector that detects the phases of the divided clock signal ICLK and the feedback clock signal FBCLK, when the second delay locking operation is performed. When the second delay locking operation is performed, thesecond phase detector 240 may detect whether a phase difference between the divided clock signal ICLK and the input clock signal FBCLK falls within the second unit delay time. Thesecond phase detector 240 may generate the second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the input clock signal FBCLK. - In
FIG. 2 , thephase detection circuit 200 may further include aninitialization signal generator 250. Theinitialization signal generator 250 may generate an initialization signal INTB based on the phase detection signal PDOUT and the input clock signal FBCLK. Theinitialization signal generator 250 may receive the locking signal LOCK, the input clock signal FBCLK and the reference clock signal REFCLK, and generate the initialization signal INTB. The locking signal LOCK may be generated based on the phase detection signal PDOUT during the first delay locking operation. The locking signal LOCK may be generated based on the first detection signal CPD which is outputted as the phase detection signal PDOUT during the first delay locking operation. The locking signal LOCK may be a locked signal which is enabled when the first delay locking operation is completed. Theinitialization signal generator 250 may enable the initialization signal INTB in synchronization with the input clock signal FBCLK, when the locking signal LOCK is enabled. Theinitialization signal generator 250 may disable the initialization signal INTB in synchronization with the reference clock signal REFCLK. Theclock divider 210 may receive the initialization signal INTB. Theclock divider 210 may be initialized based on the initialization signal INTB. When initialized by the initialization signal INTB, theclock divider 210 may newly generate the divided clock signal ICLK synchronized with the phase of the reference clock signal REFCLK. - The
phase detection circuit 200 may further include anoutput selector 260. Theoutput selector 260 may receive the locking signal LOCK, the first detection signal CPD and the second detection signal FPD. Theoutput selector 260 may output one of the first and second detection signals CPD and FPD as the phase detection signal PDOUT based on the locking signal LOCK. For example, when the locking signal LOCK is disabled, theoutput selector 260 may output the first detection signal CPD as the phase detection signal PDOUT. When the locking signal LOCK is enabled, theoutput selector 260 may output the second detection signal FPD as the phase detection signal PDOUT. - The
phase detection circuit 200 may further include amodeling delay 270. Themodeling delay 270 may have a delay amount obtained by modeling a delay amount which occurs in theclock divider 210. Themodeling delay 270 may have a delay amount corresponding to the time required until theclock divider 210 receives the reference clock signal REFCLK and generates the divided clock signal ICLK. Themodeling delay 270 may receive the input clock signal FBCLK, and delay the input clock signal FBCLK by the modeled delay amount. By delaying the input clock signal FBCLK by the delay amount of theclock divider 210, themodeling delay 270 may adjust the point of time when the divided clock signal ICLK and the input clock signal FBCLK are inputted to thefirst phase detector 230 and/or thesecond phase detector 240. -
FIG. 3 illustrates a configuration of theinitialization signal generator 250 illustrated inFIG. 2 . InFIG. 3 , theinitialization signal generator 250 may receive the locking signal LOCK, the input clock signal FBCLK and the reference clock signal REFCLK. Theinitialization signal generator 250 might not enable the initialization signal INTB, when the locking signal LOCK is disabled. Theinitialization signal generator 250 may enable the initialization signal INTB in synchronization with the input clock signal FBCLK, when the locking signal LOCK is enabled. Theinitialization signal generator 250 may disable the initialization signal INTB in synchronization with the reference clock signal REFCLK. Theinitialization signal generator 250 may maintain the enabled state of the initialization signal INTB during an arbitrary cycle of the reference clock signal REFCLK, based on the reference clock signal REFCLK. - The
initialization signal generator 250 may include a first flip-flop 310, a second flip-flop 320, a third flip-flop 330, a fourth flip-flop 340 and apulse generator 350. The first flip-flop 310 may receive the locking signal LOCK through an input terminal thereof, and receive the input clock signal FBCLK through a clock terminal thereof. The first flip-flop 310 may output the locking signal LOCK to an output terminal thereof in synchronization with the input clock signal FBCLK. The second flip-flop 320 may have an input terminal coupled to the output terminal of the first flip-flop 310 and a clock terminal configured to receive the reference clock signal REFCLK. The second flip-flop 320 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK. The third flip-flop 330 may have an input terminal coupled to the output terminal of the second flip-flop 320 and a clock terminal configured to receive the reference clock signal REFCLK. The third flip-flop 330 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK. The fourth flip-flop 340 may have an input terminal coupled to the output terminal of the third flip-flop 330 and a clock terminal configured to receive the reference clock signal REFCLK. The fourth flip-flop 340 may output a signal inputted through the input terminal to an output terminal thereof in synchronization with the reference clock signal REFCLK. - The
pulse generator 350 may receive the signal outputted from the output terminal of the first flip-flop 310 and the signal outputted from the output terminal of the fourth flip-flop 340, and generate the initialization signal INTB. Thepulse generator 350 may enable the initialization signal INTB based on the signal outputted from the output terminal of the first flip-flop 310, and disable the initialization signal INTB based on the signal outputted from the output terminal of the fourth flip-flop 340. Theinitialization signal generator 250 may be modified in various manners to include various numbers of flip-flops. InFIG. 3 , theinitialization signal generator 250 may include second to fourth flip-flops initialization signal generator 250 may be changed to make the initialization signal INTB have a pulse width within two cycles of the reference clock signal REFCLK or a pulse width within four cycles of the reference clock signal REFCLK. - The
pulse generator 350 may be configured to perform inversion and OR operations and may include, for example but not limited to, aninverter 351, a first NORgate 352 and a second NORgate 353. Theinverter 351 may receive a signal outputted from the output terminal of the first flip-flop 310, and invert the received signal. The first NORgate 352 may receive the output of theinverter 351 and a signal outputted from the fourth flip-flop 340, and perform a NOR operation on the received signals. The second NORgate 353 may receive an output of the first NORgate 352 and a reset signal RST, and output the initialization signal INTB. The second NORgate 353 may generate the initialization signal INTB by inverting the output of the first NORgate 352. The reset signal RST may be received to reset theinitialization signal generator 250. When the reset signal RST is disabled, the second NORgate 353 may operate as an inverter. -
FIGS. 4A and 4B are timing diagrams illustrating the operations of thephase detection circuit 200 and theclock generation circuit 100 in accordance with an embodiment. Referring toFIGS. 1 to 4B, the operations of thephase detection circuit 200 and theclock generation circuit 100 in accordance with an embodiment will be described as follows. Theclock generation circuit 100 may receive the system clock signal CLK and perform the first delay locking operation. Theclock divider 210 may generate the divided clock signal ICLK by dividing the frequency of the reference clock signal REFCLK. Thefirst phase detector 230 may generate the first detection signal CPD by comparing the phase of the feedback clock signal FBCLK delayed by theunit delay 220 to the phase of the divided clock signal ICLK. The locking signal LOCK may be disabled, and theoutput selector 260 may output the first detection signal CPD as the phase detection signal PDOUT. Thedelay line controller 150 may change the code value of the delay control signal DC based on the phase detection signal PDOUT, and thedelay line 120 may change the phases of the output clock signal CLKOUT and the feedback clock signal FBCLK. When the phase detection signals PDOUT having different levels are successively generated from thephase detection circuit 200, thedelay line controller 150 may enable the locking signal LOCK to complete the first delay locking operation. - When the locking signal LOCK is enabled, the
initialization signal generator 250 may enable the initialization signal INTB in synchronization with the feedback clock signal FBCLK. When the initialization signal INTB is enabled, theclock divider 210 might not output the divided clock signal ICLK. When the initialization signal INTB is disabled, theclock generation circuit 100 may perform the second delay locking operation. When the initialization signal INTB is disabled, theclock divider 210 may newly generate the divided clock signal ICLK from the reference clock signal REFCLK. Thesecond phase detector 240 may generate the second detection signal FPD by comparing the phase of the divided clock signal ICLK to the phase of the feedback clock signal FBCLK. Theoutput selector 260 may output the second detection signal FPD as the phase detection signal PDOUT based on the locking signal LOCK, and thedelay line controller 150 may change the code value of the delay control signal DC based on the second detection signal FPD outputted as the phase detection signal PDOUT. Based on the delay control signal DC, the delay amount of thedelay line 120 may be finely adjusted, and the second delay locking operation may be performed. - As illustrated in
FIG. 4A , when the phase of the feedback clock signal FBCLK is adjusted to be synchronized with a rising edge of the divided clock signal ICLK during the first delay locking operation, harmonic locking might not occur during the second delay locking operation. As illustrated inFIG. 4B , however, when the phase of the feedback clock signal FBCLK is adjusted to be synchronized with a falling edge of the divided clock signal ICLK during the first delay locking operation, harmonic locking may occur during the second delay locking operation. That is, while the feedback clock signal FBCLK is not synchronized with a rising edge of the divided clock signal ICLK, the first delay locking operation may be completed. Thephase detection circuit 200 may initialize theclock divider 210 to solve the problem of the harmonic locking. Theinitialization signal generator 250 may enable the initialization signal INTB in synchronization with the feedback clock signal FBCLK, but disable the initialization signal INTB in synchronization with the reference clock signal REFCLK. Therefore, because theclock divider 210 newly generates the divided clock signal ICLK based on the initialization signal INTB, thesecond phase detector 240 may generate the second detection signal FPD by performing a phase comparison operation on a rising edge of the feedback clock signal FBCLK and a rising edge of the divided clock signal ICLK. - Referring to
FIG. 4A , the initialization signal INTB may be enabled in synchronization of a rising edge of the feedback clock signal FBCLK, and disabled in synchronization with a rising edge of the reference clock signal REFCLK. When the initialization signal INTB is disabled, theclock divider 210 may newly generate the divided clock signal ICLK based on the reference clock signal REFCLK. Therefore, during the second delay locking operation, the phases of the rising edge of the feedback clock signal FBCLK and the rising edge of the divided clock signal ICLK may be compared to each other. Referring toFIG. 4B , a rising edge of the feedback clock signal FBCLK may be synchronized with a falling edge of the divided clock signal ICLK during the first delay locking operation. At this time, when theclock divider 210 is not initialized, the phases of the rising edge of the feedback clock signal FBCLK and the falling edge of the divided clock signal ICLK may be compared to each other during the second delay locking operation. In this case, harmonic locking may occur. However, when theclock divider 210 is initialized to newly generate the divided clock signal ICLK, the phases of the rising edge of the feedback clock signal FBCLK and the rising edge of the divided clock signal ICLK may be compared to each other during the second delay locking operation. -
FIG. 5 illustrates a configuration of aphase detection circuit 500 in accordance with an embodiment. Referring toFIG. 5 , thephase detection circuit 500 may include aclock divider 510, aselect signal generator 520 and aphase detector 530. Theclock divider 510 may receive a reference clock signal REFCLK, and generate a plurality of divided clock signals ICLK, QCLK, IBCLK and QBCLK. Theclock divider 510 may generate a first divided clock signal ICLK, a second divided clock signal QCLK, a third divided clock signal IBCLK and a fourth divided clock signal QBCLK by dividing the frequency of the reference clock signal REFCLK. For example, the first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may have a half frequency of the reference clock signal REFCLK. The first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may sequentially have a phase difference corresponding to a unit phase. The first to fourth divided clock signals ICLK, QCLK, IBCLK and QBCLK may sequentially have a phase difference of 90 degrees. The second divided clock signal QCLK may have a phase corresponding to the middle between the first and third divided clock signals ICLK and IBCLK. - The
select signal generator 520 may receive the input clock signal FBCLK, the second divided clock signal QCLK and the locking signal LOCK. The input clock signal FBCLK may be a signal corresponding to the feedback clock signal FBCLK illustrated inFIG. 1 . Theselect signal generator 520 may generate a select signal SEL by comparing the phase of the second divided clock signal QCLK to the phase of the input clock signal FBCLK based on the locking signal LOCK. When the locking signal LOCK is disabled during the first delay locking operation, theselect signal generator 520 may generate the select signal SEL having a first level regardless of the phases of the second divided clock signal QCLK and the input clock signal FBCLK. Furthermore, theselect signal generator 520 may generate a level decision signal LDS by comparing the phase of the second divided clock signal QCLK to the phase of the input clock signal FBCLK. Theselect signal generator 520 may generate the level decision signal LDS having the first level, when the second divided clock signal QCLK has the first level at a rising edge of the input clock signal FBCLK. Theselect signal generator 520 may generate the level decision signal LDS having a second level, when the second divided clock signal QCLK has the second level at a rising edge of the input clock signal FBCLK. When the locking signal LOCK is enabled during the second delay locking operation, theselect signal generator 520 may output the level decision signal LDS as the select signal SEL. - The
phase detector 530 may receive the select signal SEL, the first divided clock signal ICLK, the third divided clock signal IBCLK and the input clock signal FBCLK. Thephase detector 530 may generate a phase detection signal PDOUT by comparing the phase of one of the first and third divided clock signals ICLK and IBCLK to the phase of the input clock signal FBCLK, based on the select signal SEL. Thephase detector 530 may generate the phase detection signal PDOUT by comparing the phase of the first divided clock signal ICLK to the phase of the input clock signal FBCLK, when the select signal SEL is at the first level. Thephase detector 530 may generate the phase detection signal PDOUT by comparing the phase of the third divided clock signal IBCLK to the phase of the input clock signal FBCLK, when the select signal SEL is at the second level. - The
select signal generator 520 may include aninverter 521, afirst gating unit 522, asecond gating unit 523, afirst comparator 524 and athird gating unit 525. Theinverter 521 may receive the locking signal LOCK and invert the locking signal LOCK. Thefirst gating unit 522 may receive the second divided clock signal QCLK and the output of theinverter 521. Thefirst gating unit 522 may perform an AND operation the second divided clock signal QCLK and the output of theinverter 521. Thesecond gating unit 523 may receive the input clock signal FBCLK and the output of theinverter 521. Thesecond gating unit 523 may perform an AND operation the input clock signal FBCLK and the output of theinverter 521. Thefirst comparator 524 may receive outputs of the first andsecond gating units first comparator 524 may generate the level decision signal LDS by comparing the phases of the outputs of the first andsecond gating units first comparator 524 may include a flip-flop. Thefirst comparator 524 may output the output of thefirst gating unit 522 as the level decision signal LDS in synchronization with the output of thesecond gating unit 523. Thethird gating unit 525 may receive the level decision signal LDS and the locking signal LOCK, and output the select signal SEL. Thethird gating unit 525 may generate the select signal SEL by performing a NAND operation on the level decision signal LDS and the locking signal LOCK. - The
phase detector 530 may include aclock selector 531 and asecond comparator 532. Theclock selector 531 may receive the select signal SEL, the first divided clock signal ICLK and the third divided clock signal IBCLK. Theclock selector 531 may output one of the first and third divided clock signals ICLK and IBCLK to thesecond comparator 532 based on the select signal SEL. Theclock selector 531 may be configured to perform inversion and AND operations and may include, for example but not limited to, aninverter 541, afirst NAND gate 542, asecond NAND gate 543 and athird NAND gate 544. Theinverter 541 may receive the select signal SEL, and invert the select signal SEL. Thefirst NAND gate 542 may receive the first divided clock signal ICLK and the select signal SEL, and perform a NAND operation on the first divided clock signal ICLK and the select signal SEL. Thesecond NAND gate 543 may receive the third divided clock signal IBCLK and an output of theinverter 541, and perform a NAND operation on the third divided clock signal IBCLK and the output of theinverter 541. Thesecond comparator 532 may receive the input clock signal FBCLK and the output of theclock selector 531, and output a phase detection signal PDOUT. Thesecond comparator 532 may generate the phase detection signal PDOUT by comparing the phase of the input clock signal FBCLK to the phase of the output of theclock selector 531. Thesecond comparator 532 may include a flip-flop. Thesecond comparator 532 may output the output of theclock selector 531 as the phase detection signal PDOUT in synchronization with the input clock signal FBCLK. - The
phase detector 530 may further include adummy delay 533. Thedummy delay 533 may delay the input clock signal FBCLK, and output the delayed signal to thesecond comparator 532. Thedummy delay 533 may have a delay amount corresponding to a delay amount required for theclock selector 531 to select and output one of the first and third divided clock signals ICLK and IBCLK. Thedummy delay 533 may be configured to perform an AND operation and may include, for example but not limited to, afourth NAND gate 545 and afifth NAND gate 546. Thefourth NAND gate 545 may receive the input clock signal FBCLK and a supply voltage VDD. Thefifth NAND gate 546 may receive an output of thefourth NAND gate 545 and the supply voltage VDD. Because the supply voltage VDD is a high-level signal, the fourth andfifth NAND gates clock selector 531, the first and third divided clock signals ICLK and IBCLK may be outputted to thesecond comparator 532 through two NAND gates, respectively. Thedummy delay 533 may delay the input clock signal FBCLK through the two NAND gates, thereby adjusting the point of time when the output of theclock selector 531 and the input clock signal FBCLK are inputted to thesecond comparator 532. -
FIGS. 6A and 6B are timing diagrams illustrating the operations of thephase detection circuit 500 and theclock generation circuit 100 in accordance with an embodiment. Referring toFIGS. 1 and 5 to 6B , the operations of thephase detection circuit 500 and theclock generation circuit 100 in accordance with an embodiment will be described as follows. Theclock divider 510 of thephase detection circuit 500 may generate the first divided clock signal ICLK, the second divided clock signal QCLK and the third divided clock signal IBCLK by dividing the reference clock signal REFCLK. Theclock generation circuit 100 may perform the first delay locking operation, and the locking signal LOCK may be disabled. Thephase detection circuit 500 may generate the phase detection signal PDOUT by comparing the phase of the feedback clock signal FBCLK to the phase of the first divided clock signal ICLK based on the disabled locking signal LOCK. -
FIG. 6A shows that thephase detection circuit 500 detects that the first divided clock signal ICLK transitions from a low level to a high level at a rising edge of the feedback clock signal FBCLK, and performs the first delay locking operation. When the high-level transition of the first divided clock signal ICLK is detected during the first delay locking operation, harmonic locking might not occur. Because the level of the first divided clock signal ICLK is a low level at a first rising edge of the feedback clock signal FBCLK, thephase detection circuit 500 may generate the phase detection signal PDOUT having a low level. Because the level of the first divided clock signal ICLK is a high level at a second rising edge of the feedback clock signal FBCLK, thephase detection circuit 500 may generate the phase detection signal PDOUT having a high level. When the output of thephase detection circuit 500 changes from a low level to a high level, thedelay line controller 150 may enable the locking signal LOCK. Just before the locking signal LOCK is enabled, theselect signal generator 520 may output the level of the second divided clock signal QLCK, which lags behind the first divided clock signal ICLK by the unit phase, as the level decision signal LDS at a rising edge of the feedback clock signal FBCLK. Thus, theselect signal generator 520 may output the level decision signal LDS having a low level. When the locking signal LOCK is enabled, theselect signal generator 520 may output the select signal SEL having a high level based on the level decision signal LDS. Theclock selector 531 may output the first divided clock signal ICLK to thesecond comparator 532 based on the select signal SEL having a high level. Therefore, as thesecond comparator 532 generates the phase detection signal PDOUT by comparing the phase of the first divided clock signal ICLK to the phase of the feedback clock signal FBCLK, the second delay locking operation of theclock generation circuit 100 may be performed. -
FIG. 6B shows that thephase detection circuit 500 detects that the first divided clock signal ICLK transitions from a high level to a low level at a rising edge of the feedback clock signal FBCLK, and performs the first delay locking operation. When the low-level transition of the first divided clock signal ICLK is detected during the first delay locking operation, harmonic locking may occur. That is, when thephase detection circuit 500 performs the second delay locking operation by comparing the phase of the first divided clock signal ICLK to the phase of the feedback clock signal FBCLK after the first delay locking operation is completed, the harmonic locking may occur while a rising edge of the feedback clock signal FBCLK is synchronized with a rising edge of the reference clock signal REFCLK in a different cycle from a normal cycle. Because the level of the first divided clock signal ICLK is a high level at a first rising edge of the feedback clock signal FBCLK, thephase detection circuit 500 may generate the phase detection signal PDOUT having a high level. Because the level of the first divided clock signal ICLK is a low level at a second rising edge of the feedback clock signal FBCLK, thephase detection circuit 500 may generate the phase detection signal PDOUT having a low level. When the output of thephase detection circuit 500 changes from a high level to a low level, thedelay line controller 150 may enable the locking signal LOCK. Just before the locking signal LOCK is enabled, theselect signal generator 520 may output the level of the second divided clock signal QLCK, which lags behind the first divided clock signal ICLK by the unit phase, as the level decision signal LDS at a rising edge of the feedback clock signal FBCLK. Therefore, theselect signal generator 520 may output the level decision signal LDS having a high level. When the locking signal LOCK is enabled, theselect signal generator 520 may output the select signal SEL having a low level based on the level decision signal LDS. Theclock selector 531 may output the third divided clock signal IBCLK to thesecond comparator 532 based on the select signal SEL having a low level. Therefore, as thesecond comparator 532 generates the phase detection signal PDOUT by comparing the phase of the third divided clock signal IBCLK to the phase of the feedback clock signal FBCLK, the second delay locking operation may be performed. As the phases of the third divided clock signal IBCLK and the feedback clock signal FBCLK are compared to perform the second delay locking operation, a rising edge of the reference clock signal REFCLK in a normal cycle may be synchronized with a rising edge of the feedback clock signal FBCLK. -
FIG. 7 illustrates a configuration of asemiconductor system 7 in accordance with an embodiment. InFIG. 7 , thesemiconductor system 7 may include afirst semiconductor apparatus 710 and asecond semiconductor apparatus 720. Thefirst semiconductor apparatus 710 may provide various control signals required for operating thesecond semiconductor apparatus 720. Thefirst semiconductor apparatus 710 may include various types of apparatuses. For example, thefirst semiconductor apparatus 710 may be a host device such as a central processing unit (CPU), graphic processing unit (GPU), multi-media processor (MMP), digital signal processor, application processor (AP) or memory controller. Thesecond semiconductor apparatus 720 may be a memory device, for example, and the memory device may include a volatile memory and a nonvolatile memory. Examples of the volatile memory may include an SRAM (Static RAM), DRAM (Dynamic RAM) and SDRAM (Synchronous DRAM), and the nonvolatile memory may include a ROM (Read Only Memory), PROM (Programmable ROM), EEPROM (Electrically Erasable and Programmable ROM), EPROM (Electrically Programmable ROM), flash memory, PRAM (Phase change RAM), MRAM (Magnetic RAM), RRAM (Resistive RAM), FRAM (Ferroelectric RAM) and the like. - The first and
second semiconductor apparatuses first semiconductor apparatus 710 may transfer the data to thesecond semiconductor apparatus 720 in synchronization with a clock signal. Similarly, thesecond semiconductor apparatus 720 may transfer the data to thefirst semiconductor apparatus 710 in synchronization with the clock signal. Thesecond semiconductor apparatus 720 may be coupled to thefirst semiconductor apparatus 710 through a plurality of buses. The plurality of buses 101 may be signal transfer paths, links or channels for transferring a signal. The plurality of buses may include aclock bus 701, adata bus 702 and the like. Theclock bus 701 may be a one-way bus, and thedata bus 702 may be a two-way bus. Thesecond semiconductor apparatus 720 may be coupled to thefirst semiconductor apparatus 710 through theclock bus 701, and receive a system clock signal CLK through theclock bus 701. The system clock signal CLK may be transferred as a single ended signal, or transferred as a differential signal with a complementary signal CLKB. Thesecond semiconductor apparatus 720 may be coupled to thefirst semiconductor apparatus 710 through thedata bus 702, and receive data DQ from thefirst semiconductor apparatus 710 or transfer the data DQ to thefirst semiconductor apparatus 710 through thedata bus 702. Although not illustrated, thesemiconductor system 7 may further include a command address bus. The command address bus may be a one-way bus. Thefirst semiconductor apparatus 710 may transfer a command address signal to thesecond semiconductor apparatus 720 through the command address bus. - The
first semiconductor apparatus 710 may include aclock generation circuit 711 and a data I/O circuit 714. Theclock generation circuit 711 may generate the system clock signal CLK. Theclock generation circuit 711 may include a PLL circuit and/or a DLL circuit. Theclock generation circuit 711 may adjust the phase of the system clock signal CLK by comparing the phase of a reference clock signal to the phase of a feedback clock signal. Theclock generation circuit 711 may include aphase detection circuit 712 to compare the phases of the reference clock signal and the feedback clock signal. Theclock generation circuit 100 illustrated inFIG. 1 may be applied as theclock generation circuit 711. Thephase detection circuits FIGS. 2 and 5 may be applied as thephase detection circuit 712. Theclock generation circuit 711 may be coupled to theclock bus 701 through aclock pad 715. Theclock generation circuit 711 may provide the system clock signal CLK to thesecond semiconductor apparatus 720 through theclock bus 701. Theclock generation circuit 711 may provide the system clock signal CLK to the data I/O circuit 714. - The data I/
O circuit 714 may be coupled to thedata bus 702 through adata pad 716. The data I/O circuit 714 may synchronize internal data of thefirst semiconductor apparatus 710 with the system clock signal CLK, and output the synchronized data to thedata bus 702. The data outputted from the data I/O circuit 714 may be transferred as the data DQ to thesecond semiconductor apparatus 720 through thedata pad 716 and thedata bus 702. The data I/O circuit 714 may receive the data transferred from thesecond semiconductor apparatus 720 through thedata bus 702, and generate the internal data of thefirst semiconductor apparatus 710 from the received data. - The
second semiconductor apparatus 720 may include aclock generation circuit 721, adata storage area 723 and a data I/O circuit 724. Theclock generation circuit 721 may be coupled to theclock bus 701 through aclock pad 725. Theclock generation circuit 721 may receive the system clock signal CLK through theclock bus 701, and generate an internal clock signal INCLK. Theclock generation circuit 721 may include a PLL circuit and/or a DLL circuit. Theclock generation circuit 721 may adjust the phase of the internal clock signal INCLK by comparing the phase of the reference clock signal to the phase of the feedback clock signal. Theclock generation circuit 721 may include aphase detection circuit 722 to compare the phases of the reference clock signal and the feedback clock signal. Theclock generation circuit 100 illustrated inFIG. 1 may be applied as theclock generation circuit 721. Thephase detection circuits FIGS. 2 and 5 may be applied as thephase detection circuit 722. - The
data storage area 723 may be a memory cell array including a plurality of memory cells. Thedata storage area 723 may include a plurality of bit lines, a plurality of word lines, and a plurality of memory cells coupled to the respective intersections between the plurality of bit lines and the plurality of word lines. The plurality of memory cells may include one or more of a volatile memory cell and a nonvolatile memory cell. - The data I/
O circuit 724 may be coupled to thedata bus 702 through adata pad 726, and coupled to thedata storage area 723. The data I/O circuit 724 may receive the internal clock signal INCLK from theclock generation circuit 721. The data I/O circuit 724 may synchronize data outputted from thedata storage area 723 with the internal clock signal INCLK, and output the synchronized data to thedata bus 702. The data outputted from the data I/O circuit 724 may be transferred as the data DQ to thefirst semiconductor apparatus 710. The data I/O circuit 724 may receive the data DQ transferred from thefirst semiconductor apparatus 710 through thedata bus 702. The data I/O circuit 724 may store the received data in thedata storage area 723. - While various embodiments have been described above, it will be understood to those skilled in the art that the embodiments described are examples only. Accordingly, the phase detection circuit and the clock generation circuit described herein should not be limited based on the described embodiments.
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/850,738 US10819357B2 (en) | 2018-11-05 | 2020-04-16 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
US17/036,861 US11171660B2 (en) | 2018-11-05 | 2020-09-29 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180134545A KR102534241B1 (en) | 2018-11-05 | 2018-11-05 | Phase detection circuit, clock generation circuit and semiconductor apparatus including the phase detection circuit |
KR10-2018-0134545 | 2018-11-05 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/850,738 Continuation US10819357B2 (en) | 2018-11-05 | 2020-04-16 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
US10637488B1 US10637488B1 (en) | 2020-04-28 |
US20200145015A1 true US20200145015A1 (en) | 2020-05-07 |
Family
ID=70332364
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/434,660 Active US10637488B1 (en) | 2018-11-05 | 2019-06-07 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
US16/850,738 Active US10819357B2 (en) | 2018-11-05 | 2020-04-16 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
US17/036,861 Active US11171660B2 (en) | 2018-11-05 | 2020-09-29 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/850,738 Active US10819357B2 (en) | 2018-11-05 | 2020-04-16 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
US17/036,861 Active US11171660B2 (en) | 2018-11-05 | 2020-09-29 | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit |
Country Status (4)
Country | Link |
---|---|
US (3) | US10637488B1 (en) |
KR (2) | KR102534241B1 (en) |
CN (2) | CN117394853A (en) |
TW (1) | TWI819106B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11177814B2 (en) * | 2019-07-05 | 2021-11-16 | Samsung Electronics Co., Ltd. | Delay locked loop circuit and semiconductor memory device having the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111722520B (en) * | 2019-03-21 | 2022-04-05 | 澜起科技股份有限公司 | Time-to-digital converter and phase difference detection method |
US11217298B2 (en) * | 2020-03-12 | 2022-01-04 | Micron Technology, Inc. | Delay-locked loop clock sharing |
US11555842B2 (en) * | 2020-09-11 | 2023-01-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus, system and method for phase noise measurement |
CN113258928B (en) * | 2021-06-30 | 2021-10-08 | 深圳市爱普特微电子有限公司 | Delay phase locking system and method based on digital pre-adjustment |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6289068B1 (en) * | 1998-06-22 | 2001-09-11 | Xilinx, Inc. | Delay lock loop with clock phase shifter |
JP4093826B2 (en) * | 2002-08-27 | 2008-06-04 | 富士通株式会社 | Clock generator |
CN100417024C (en) * | 2002-10-30 | 2008-09-03 | 联发科技股份有限公司 | Lock phase loop of low stable error and its correcting circuif |
US7489757B2 (en) * | 2003-05-01 | 2009-02-10 | Mitsubishi Denki Kabushiki Kaisha | Clock data recovery circuit |
US7259604B2 (en) * | 2005-08-03 | 2007-08-21 | Micron Technology, Inc. | Initialization scheme for a reduced-frequency, fifty percent duty cycle corrector |
CN100376081C (en) * | 2005-09-15 | 2008-03-19 | 威盛电子股份有限公司 | Delayed locking loop capable of sharing counter and related method |
US7583117B2 (en) * | 2006-04-20 | 2009-09-01 | Realtek Semiconductor Corp. | Delay lock clock synthesizer and method thereof |
KR100810073B1 (en) * | 2006-09-29 | 2008-03-05 | 주식회사 하이닉스반도체 | Semiconductor memory device and the method for operating the same |
KR100930404B1 (en) * | 2007-12-10 | 2009-12-08 | 주식회사 하이닉스반도체 | DLL circuit and its control method |
US7848266B2 (en) | 2008-07-25 | 2010-12-07 | Analog Devices, Inc. | Frequency synthesizers for wireless communication systems |
US7825711B2 (en) * | 2009-04-01 | 2010-11-02 | Micron Technology, Inc. | Clock jitter compensated clock circuits and methods for generating jitter compensated clock signals |
JP5256535B2 (en) * | 2009-07-13 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | Phase-locked loop circuit |
KR101103067B1 (en) * | 2010-03-29 | 2012-01-06 | 주식회사 하이닉스반도체 | Variable unit delay circuit and clock generator for semiconductor apparatus using the same |
KR20120081353A (en) * | 2011-01-11 | 2012-07-19 | 에스케이하이닉스 주식회사 | Synchronization circuit |
CN102148616B (en) | 2011-03-31 | 2013-04-03 | 山东华芯半导体有限公司 | Method and system for preventing error locking of DLL (Delay-Locked Loop) |
US20130207703A1 (en) * | 2012-02-10 | 2013-08-15 | International Business Machines Corporation | Edge selection techniques for correcting clock duty cycle |
KR101994243B1 (en) * | 2012-06-27 | 2019-06-28 | 에스케이하이닉스 주식회사 | Clock generating circuit and semiconductor apparatus including the same |
KR101950320B1 (en) * | 2012-06-29 | 2019-02-20 | 에스케이하이닉스 주식회사 | Phase detection circuit and synchronization circuit using the same |
KR20140012312A (en) * | 2012-07-19 | 2014-02-03 | 에스케이하이닉스 주식회사 | Delay locked loop circuit and method of driving the same |
KR102035112B1 (en) * | 2012-12-11 | 2019-10-23 | 에스케이하이닉스 주식회사 | Semiconductor apparatus |
KR20140112663A (en) * | 2013-03-14 | 2014-09-24 | 삼성전자주식회사 | Delay Locked Loop Circuit and Method of Control thereof |
US8907706B2 (en) * | 2013-04-29 | 2014-12-09 | Microsemi Semiconductor Ulc | Phase locked loop with simultaneous locking to low and high frequency clocks |
KR20150142766A (en) * | 2014-06-11 | 2015-12-23 | 에스케이하이닉스 주식회사 | Semiconductor apparatus and regulator thereof |
-
2018
- 2018-11-05 KR KR1020180134545A patent/KR102534241B1/en active IP Right Grant
-
2019
- 2019-06-07 US US16/434,660 patent/US10637488B1/en active Active
- 2019-09-24 CN CN202311172037.8A patent/CN117394853A/en active Pending
- 2019-09-24 CN CN201910902266.8A patent/CN111147075B/en active Active
- 2019-09-26 TW TW108134838A patent/TWI819106B/en active
-
2020
- 2020-04-16 US US16/850,738 patent/US10819357B2/en active Active
- 2020-09-29 US US17/036,861 patent/US11171660B2/en active Active
-
2021
- 2021-10-06 KR KR1020210132244A patent/KR102609446B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11177814B2 (en) * | 2019-07-05 | 2021-11-16 | Samsung Electronics Co., Ltd. | Delay locked loop circuit and semiconductor memory device having the same |
Also Published As
Publication number | Publication date |
---|---|
US11171660B2 (en) | 2021-11-09 |
KR20210124152A (en) | 2021-10-14 |
CN111147075A (en) | 2020-05-12 |
TW202018311A (en) | 2020-05-16 |
CN111147075B (en) | 2023-09-12 |
TW202403325A (en) | 2024-01-16 |
KR102609446B1 (en) | 2023-12-05 |
CN117394853A (en) | 2024-01-12 |
KR20200051891A (en) | 2020-05-14 |
US10819357B2 (en) | 2020-10-27 |
US20200244276A1 (en) | 2020-07-30 |
US10637488B1 (en) | 2020-04-28 |
US20210013894A1 (en) | 2021-01-14 |
KR102534241B1 (en) | 2023-05-22 |
TWI819106B (en) | 2023-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11171660B2 (en) | Phase detection circuit, and clock generation circuit and semiconductor apparatus including the phase detection circuit | |
US8111580B2 (en) | Multi-phase duty-cycle corrected clock signal generator and memory having same | |
US10530371B2 (en) | Delay locked loop to cancel offset and memory device including the same | |
US6803826B2 (en) | Delay-locked loop circuit and method using a ring oscillator and counter-based delay | |
KR102193681B1 (en) | Injection-Locked PLL circuit using DLL | |
US6930524B2 (en) | Dual-phase delay-locked loop circuit and method | |
US8593187B2 (en) | Delay line off-state control with power reduction | |
US7777542B2 (en) | Delay locked loop | |
US20100226188A1 (en) | First delay locking method, delay-locked loop, and semiconductor memory device including the same | |
KR20210130434A (en) | Delay locked loop circuit and semiconductor memory device having the same | |
US10698846B2 (en) | DDR SDRAM physical layer interface circuit and DDR SDRAM control device | |
US9373374B2 (en) | Semiconductor apparatus capable of self-tuning a timing margin | |
US11907009B2 (en) | Phase detection circuit, clock generation circuit and semiconductor apparatus using the phase detection circuit | |
US8081021B2 (en) | Delay locked loop | |
US10122526B2 (en) | Phase detector in a delay locked loop | |
US10998905B2 (en) | Semiconductor apparatus related to receiving clock signals having variable frequencies, and system including the semiconductor apparatus | |
KR20120109196A (en) | Delay locked loop and semiconductor device including the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SK HYNIX INC., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:IM, DA IN;SEO, YOUNG SUK;REEL/FRAME:049405/0062 Effective date: 20190531 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |