Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K13/00—Etching, surface-brightening or pickling compositions
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09G—POLISHING COMPOSITIONS; SKI WAXES
  • C09G1/00—Polishing compositions
  • C09G1/02—Polishing compositions containing abrasives or grinding agents
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K13/00—Etching, surface-brightening or pickling compositions
  • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/14—Anti-slip materials; Abrasives
  • C09K3/1436—Composite particles, e.g. coated particles
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/14—Anti-slip materials; Abrasives
  • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3105—After-treatment
  • H01L21/31051—Planarisation of the insulating layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3105—After-treatment
  • H01L21/31051—Planarisation of the insulating layers
  • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/32115—Planarisation
  • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Definitions

• This invention relates to the chemical mechanical planarization (CMP) for polishing oxide and doped oxide films.
• polishing especially surfaces for chemical-mechanical polishing for the purpose of recovering a selected material and/or planarizing the structure.
• a SiN layer is deposited under a SiO 2 layer to serve as a polish stop.
• the role of such polish stop is particularly important in Shallow Trench Isolation (STI) structures.
• Selectivity is characteristically expressed as the ratio of the oxide polish rate to the nitride polish rate.
• An example is an increased polishing selectivity rate of silicon dioxide (SiO 2 ) as compared to silicon nitride (SiN).
• reducing oxide trench dishing is a key factor to be considered.
• the lower trench oxide loss will prevent electrical current leaking between adjacent transistors.
• Non-uniform trench oxide loss across die (within Die) will affect transistor performance and device fabrication yields.
• Severe trench oxide loss (high oxide trench dishing) will cause poor isolation of transistor resulting in device failure. Therefore, it is important to reduce trench oxide loss by reducing oxide trench dishing in CMP polishing compositions.
• U.S. Pat. No. 5,876,490 discloses the polishing compositions containing abrasive particles and exhibiting normal stress effects.
• the slurry further contains non-polishing particles resulting in reduced polishing rate at recesses, while the abrasive particles maintain high polish rates at elevations. This leads to improved planarization.
• the slurry comprises cerium oxide particles and polymeric electrolyte, and can be used for Shallow Trench Isolation (STI) polishing applications.
• STI Shallow Trench Isolation
• U.S. Pat. No. 6,964,923 teaches the polishing compositions containing cerium oxide particles and polymeric electrolyte for Shallow Trench Isolation (STI) polishing applications.
• Polymeric electrolyte being used includes the salts of polyacrylic acid, similar as those in U.S. Pat. No. 5,876,490.
• Ceria, alumina, silica & zirconia are used as abrasives.
• Molecular weight for such listed polyelectrolyte is from 300 to 20,000, but in overall, ⁇ 100,000.
• U.S. Pat. No. 6,616,514 discloses a chemical mechanical polishing slurry for use in removing a first substance from a surface of an article in preference to silicon nitride by chemical mechanical polishing.
• the chemical mechanical polishing slurry according to the invention includes an abrasive, an aqueous medium, and an organic polyol that does not dissociate protons, said organic polyol including a compound having at least three hydroxyl groups that are not dissociable in the aqueous medium, or a polymer formed from at least one monomer having at least three hydroxyl groups that are not dissociable in the aqueous medium.
• compositions, methods and systems of chemical mechanical polishing that can afford the reduced oxide trench dishing and improved over polishing window stability in a chemical and mechanical polishing (CMP) process, in addition to high removal rate of silicon dioxide as well as high selectivity for silicon dioxide to silicon nitride.
• the present invention provides Chemical mechanical polishing (CMP) polishing compositions, methods and systems for a reduced oxide trench dishing and thus improved over polishing window stability by introducing chemical additives as oxide trench dishing reducing additives compositions at wide pH range including acidic, neutral and alkaline pH conditions.
• CMP Chemical mechanical polishing
• the present invention also provides the benefits of achieving high oxide film removal rates, low SiN film removal rates, high and tunable Oxide: SiN selectivity, lower total defect counts post-polishing, and excellent mean particle size (nm) stability.
• a CMP polishing composition comprises:
• abrasive particles selected from the group consisting of ceria-coated inorganic metal oxide particles, ceria-coated organic polymer particles, and combinations thereof; chemical additive as oxide trenching dishing reducer, a solvent; and optionally biocide; and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
• the ceria-coated inorganic metal oxide particles include, but are not limited to, ceria-coated colloidal silica, ceria-coated high purity colloidal silica, ceria-coated alumina, ceria-coated titania, ceria-coated zirconia, or any other ceria-coated inorganic metal oxide particles.
• the ceria-coated organic polymer particles include, but are not limited to, ceria-coated polystyrene particles, ceria-coated polyurethane particle, ceria-coated polyacrylate particles, or any other ceria-coated organic polymer particles.
• the solvent includes but is not limited to deionized (DI) water, distilled water, and alcoholic organic solvents.
• the chemical additives as oxide trenching dishing reducers contain at least two or more, preferably four or more, more preferably six or more hydroxyl functional groups in their molecular structures.
• the chemical additive has a general molecular structure as shown below:
• n is selected from 2 to 5,000, from 3 to 12, preferably from 4 to 7.
• R1, R2, and R3 can be the same or different atoms or functional groups.
• Each of Rs in the group of R1 to R3 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof; wherein, at least two or more, preferably four of them are hydrogen atoms.
• R1, R2, and R3 are the same and are hydrogen atoms, the chemical additive bears multi hydroxyl functional groups.
• the chemical additive has a structure shown below:
• one —CHO functional group is located at one end of the molecule as the terminal functional group; n is selected from 2 to 5,000, from 3 to 12, preferably from 4 to 7.
• Each of R1 and R2 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof.
• the chemical additive is D-mannose or L-mannose.
• the chemical additive has a molecular structure selected from the group comprising of at least one (f), at least one (g), at least one (h) and combinations thereof;
• R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, and R14 can be the same or different atoms or functional groups.
• They can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof; wherein, at least two or more, preferably four or more of them are hydrogen atoms.
• R1, R2, R3 R4, R5, R6, R7 R8, R9, R10, R11, R12, R13, and R14 are all hydrogen atoms which provide the chemical additives bearing multi hydroxyl functional groups.
• the chemical additives contain at least one six-member ring structure motif ether bonded with at least one polyol molecular unit containing multiple hydroxyl functional groups in the molecular unit structures or at least one polyol molecular unit containing multiple hydroxyl functional groups in the molecular unit structures and at least one six-member ring polyol.
• a polyol is an organic compound containing hydroxyl groups.
• the chemical additives as oxide trenching dishing reducers contain at least two, at least four, or at least six hydroxyl functional groups in their molecular structures.
• At least one R in the group of R1 to R5 in the general molecular structure is a polyol molecular unit having a structure shown in (b):
• n and m can be the same or different.
• m or n is independently selected from 1 to 5, preferably from 1 to 4, more preferably from 1 to 3, and most preferably from 1 to 2;
• R6 to R9 can be the same or different atoms or functional groups; and the rest of Rs in the group of R1 to R5 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof.
• At least one R in the group of R1 to R5 in the general molecular structure is a polyol molecular unit having a structure shown in (b); at least one R in the group of R1 to R5 in the general molecular structure is a six-member ring polyol as shown in (c):
• each of R10, R11, R12, R13 and R14 is independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof; and the rest of Rs in the group of R1 to R5 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof.
• At least two, preferably four, more preferably six of the Rs in the group of R1 to R9 are hydrogen atoms.
• R2 is a six-member ring polyol
• all rest of Rs in the group of R1 to R14 are all hydrogen atoms
• the chemical additive comprises maltitol, lactitol, maltotritol, ribitol, D-sorbitol, mannitol, dulcitol, iditol, D-( ⁇ )-Fructose, sorbitan, sucrose, ribose, Inositol, glucose, D-arabinose, L-arabinose, D-mannose, L-mannose, meso-erythritol, beta-lactose, arabinose, and combinations thereof.
• the preferred chemical additives are maltitol, lactitol, maltotritol, D-sorbitol, mannitol, dulcitol, iditol, D-( ⁇ )-Fructose, sucrose, ribose, Inositol, glucose. D-(+)-mannose, beta-lactose, and combinations thereof.
• the more preferred chemical additives are maltitol, lactitol, maltotritol, D-sorbitol, mannitol, dulcitol, D-( ⁇ )-Fructose, beta-lactose, and combinations thereof.
• the CMP polishing compositions can be made into two or more parts and mixed at the point of use.
• CMP chemical mechanical polishing
• CMP chemical mechanical polishing
• the substrate disclosed above can further comprises a silicon nitride (SiN) surface.
• SiN silicon nitride
• the removal selectivity of SiO 2 : SiN is greater than 10, preferably greater than 20, and more preferably greater than 30.
• This invention relates to the Chemical mechanical polishing (CMP) compositions, methods and systems for polishing oxide.
• CMP Chemical mechanical polishing
• reducing oxide trench dishing is a key factor to be considered.
• the lower trench oxide loss will prevent electrical current leaking between adjacent transistors.
• Non-uniform trench oxide loss across die or/and within Die will affect transistor performance and device fabrication yields.
• Severe trench oxide loss (high oxide trench dishing) will cause poor isolation of transistor resulting in device failure. Therefore, it is important to reduce trench oxide loss by reducing oxide trench dishing in CMP polishing compositions.
• the CMP compositions comprise the unique combination of abrasive and the suitable chemical additives.
• This invention provides a reduced oxide trench dishing and thus improved over polishing window stability by introducing chemical additives as oxide trench dishing reducing additives in the Chemical mechanical polishing (CMP) compositions at wide pH range including acidic, neutral and alkaline pH conditions.
• CMP Chemical mechanical polishing
• CMP Chemical Mechanical Polishing
• the Chemical Mechanical Polishing (CMP) composition also further provides excellent mean particle size and size distribution stability for the abrasive particles which is very important in maintaining robust CMP polishing performances with minimized polishing performance variations.
• a CMP polishing composition comprises:
• abrasive particles selected from the group consisting of ceria-coated inorganic metal oxide particles, ceria-coated organic polymer particles, and combinations thereof; chemical additives as oxide trenching dishing reducers, a solvent; and optionally biocide; and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.
• the ceria-coated inorganic metal oxide particles include, but are not limited to, ceria-coated colloidal silica, ceria-coated high purity colloidal silica, ceria-coated alumina, ceria-coated titania, ceria-coated zirconia, or any other ceria-coated inorganic metal oxide particles.
• the ceria-coated organic polymer particles include, but are not limited to, ceria-coated polystyrene particles, ceria-coated polyurethane particle, ceria-coated polyacrylate particles, or any other ceria-coated organic polymer particles.
• the average mean particle sizes or mean particle sizes (MPS) of abrasive particles are ranged from 2 to 1,000 nm, 5 to 500 nm, 15 to 400 nm or 25 to 250 nm. MPS refers to diameter of the particles and is measured using dynamic light scattering (DLS) technology.
• DLS dynamic light scattering
• concentrations of abrasive particles range from 0.01 wt. % to 20 wt. %, the preferred concentrations range from 0.05 wt. % to 10 wt. %, the more preferred concentrations range from 0.1 wt. % to 5 wt. %.
• the preferred abrasive particles are ceria-coated inorganic metal oxide particles; more preferred abrasive particles are ceria-coated silica particles.
• the solvent includes but is not limited to deionized (DI) water, distilled water, and alcoholic organic solvents.
• the preferred solvent is DI water.
• the CMP slurry may contain biocide from 0.0001 wt. % to 0.05 wt. %; preferably from 0.0005 wt. % to 0.025 wt. %, and more preferably from 0.001 wt. % to 0.01 wt. %.
• the biocide includes, but is not limited to, KathonTM, KathonTM CG/ICP II, from Dupont/Dow Chemical Co. Bioban from Dupont/Dow Chemical Co. They have active ingredients of 5-chloro-2-methyl-4-isothiazolin-3-one or 2-methyl-4-isothiazolin-3-one.
• the CMP slurry may contain a pH adjusting agent.
• An acidic or basic pH adjusting agent can be used to adjust the polishing compositions to the optimized pH value.
• the pH adjusting agents include, but are not limited to nitric acid, hydrochloric acid, sulfuric acid, phosphoric acid, other inorganic or organic acids, and mixtures thereof.
• pH adjusting agents also include the basic pH adjusting agents, such as sodium hydride, potassium hydroxide, ammonium hydroxide, tetraalkyl ammonium hydroxide, organic quaternary ammonium hydroxide compounds, organic amines, and other chemical reagents that can be used to adjust pH towards the more alkaline direction.
• basic pH adjusting agents such as sodium hydride, potassium hydroxide, ammonium hydroxide, tetraalkyl ammonium hydroxide, organic quaternary ammonium hydroxide compounds, organic amines, and other chemical reagents that can be used to adjust pH towards the more alkaline direction.
• the CMP slurry contains 0 wt. % to 1 wt. %; preferably 0.01 wt. % to 0.5 wt. %; more preferably 0.1 wt. % to 0.25 wt. % pH adjusting agent.
• the CMP slurry contains 0.01 wt. % to 20 wt. %, 0.025 wt. % to 10 wt. %, 0.05 wt. % to 5 wt. %, or 0.1 to 3.0 wt. % of the chemical additives as oxide trenching dishing and total defect count reducers.
• the chemical additives as oxide trenching dishing reducers contain at least two or more, preferably four or more, more preferably six or more hydroxyl functional groups in their molecular structures.
• the chemical additive has a general molecular structure as shown below:
• n is selected from 2 to 5,000, from 3 to 12, preferably from 4 to 7.
• R1, R2, and R3 can be the same or different atoms or functional groups.
• Each of Rs in the group of R1 to R3 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof; wherein, at least two or more, preferably four of them are hydrogen atoms.
• R1, R2, and R3 are the same and are hydrogen atoms, the chemical additive bears multi hydroxyl functional groups.
• the chemical additive has a structure shown below:
• one —CHO functional group is located at one end of the molecule as the terminal functional group; n is selected 2 to 5,000, from 3 to 12, preferably from 4 to 7.
• R1 and R2 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof.
• the chemical additive has a molecular structure selected from the group comprising of at least one (f), at least one (g), at least one (h) and combinations thereof:
• R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, and R14 can be the same or different atoms or functional groups.
• They can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid, substituted organic sulfonic acid salt, substituted organic carboxylic acid, substituted organic carboxylic acid salt, organic carboxylic ester, organic amine groups, and combinations thereof; wherein, at least two or more, preferably four or more of them are hydrogen atoms.
• R1, R2, R3 R4, R5, R6, R7 R8, R9, R10, R11, R12, R13, and R14 are all hydrogen atoms which provide the chemical additives bearing multi hydroxyl functional groups.
• the chemical additives contain at least one six-member ring structure motif ether bonded with at least one polyol molecular unit containing multiple hydroxyl functional groups in the molecular unit structures or at least one polyol molecular unit containing multiple hydroxyl functional groups in the molecular unit structures and at least one six-member ring polyol.
• a polyol is an organic compound containing hydroxyl groups.
• the chemical additives as oxide trenching dishing reducers contain at least two, at least four, or at least six hydroxyl functional groups in their molecular structures.
• At least one R in the group of R1 to R5 in the general molecular structure is a polyol molecular unit having a structure shown in (b):
• n and m can be the same or different.
• m or n is independently selected from 1 to 5, preferably from 1 to 4, more preferably from 1 to 3, and most preferably from 1 to 2;
• R6 to R9 can be the same or different atoms or functional groups; and the rest of Rs in the group of R1 to R5 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof.
• At least one R in the group of R1 to R5 in the general molecular structure is a polyol molecular unit having a structure shown in (b); at least one R in the group of R1 to R5 in the general molecular structure is a six-member ring polyol as shown in (c):
• each of R10, R11, R12, R13 and R14 is independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof; and the rest of Rs in the group of R1 to R5 can be independently selected from the group consisting of hydrogen, alkyl, alkoxy, organic group with one or more hydroxyl groups, substituted organic sulfonic acid or salt, substituted organic carboxylic acid or salt, organic carboxylic ester, organic amine, and combinations thereof.
• At least two, preferably four, more preferably six of the Rs in the group of R1 to R9 are hydrogen atoms.
• R2 is a six-member ring polyol
• all rest of Rs in the group of R1 to R14 are all hydrogen atoms
• the chemical additive comprises maltitol, lactitol, maltotritol, ribitol, D-sorbitol, mannitol, dulcitol, iditol, D-( ⁇ )-Fructose, sorbitan, sucrose, Inositol, glucose, D-arabinose, L-arabinose, D-mannose, L-mannose, meso-erythritol, ribose, beta-lactose, and combinations thereof.
• the preferred chemical additives are maltitol, lactitol, maltotritol, D-sorbitol, mannitol, dulcitol, iditol, D-( ⁇ )-Fructose, sucrose, ribose, Inositol, glucose. D-(+)-mannose, beta-lactose, and combinations thereof.
• the more preferred chemical additives are maltitol, lactitol, maltotritol, D-sorbitol, mannitol, dulcitol, D-( ⁇ )-Fructose, beta-lactose, and combinations thereof.
• the CMP polishing compositions can be made into two or more parts and mixed at the point of use.
• CMP chemical mechanical polishing
• the polished oxide films can be CVD oxide, PECVD oxide, High density oxide, Spin on oxide films, flowable CVD oxide film, carbon doped oxide film, or nitrogen doped oxide film.
• the polished oxide films can be Chemical vapor deposition (CVD), Plasma Enhance CVD (PECVD), High Density Deposition CVD (HDP), or spin on oxide films.
• CVD Chemical vapor deposition
• PECVD Plasma Enhance CVD
• HDP High Density Deposition CVD
• spin on oxide films can be Chemical vapor deposition (CVD), Plasma Enhance CVD (PECVD), High Density Deposition CVD (HDP), or spin on oxide films.
• the substrate disclosed above can further comprises a silicon nitride surface.
• the removal selectivity of SiO 2 : SiN is greater than 10, preferably greater than 20, and more preferably greater than 30.
• Dishing performance of the CMP compositions can also be characterized by the ratio of oxide trench dishing rate ( ⁇ /min.) vs the blanket HDP film removal rate ( ⁇ /min.).
• the CMP compositions having the ratio of 0.1, 0.08, 0.06, 0.05, 0.03, or 0.02 provide good oxide dishing performance.
• these chemical additives can have some impacts on the stability of abrasive particles in the compositions.
• these chemical additives can have some impacts on the stability of ceria-coated inorganic oxide abrasives in the CMP polishing compositions.
• the abrasive particle stability is tested by monitoring the mean particle size (MPS) (nm) and particle size distribution parameter D99 (nm) changes vs the times or at elevated temperatures.
• MPS mean particle size
• D99 particle size distribution parameter
• Particle size distribution may be quantified as a weight percentage of particles that has a size lower than a specified size.
• parameter D99 (nm) represents a particle size (diameter) where 99 wt. % of all the slurry particles would have particle diameter equal to or smaller than the D99 (nm). That is, D99 (nm) is a particle size that 99 wt. % of the particles fall on and under.
• Particle size distribution can be measured by any suitable techniques such as imaging, dynamic light scattering, hydrodynamic fluid fractionation, disc centrifuge etc.
• MPS (nm) and D99 (nm) are both measured by dynamic light scattering in this application.
• CMP compositions providing abrasive particle stability have the changes for MPS (nm) and D99 (nm) ⁇ 6.0%, 5.0%, 3.0%, 2.0%, 1.0%, 0.5%, 0.3% or 0.1% for a shelf time of at least 30 days, 40 days, 50 days, 60 days, 70 days or 100 days at a temperature ranging from 20 to 60° C., 25 to 50° C.
• Ceria-coated Silica used as abrasive having a particle size of approximately 100 nanometers (nm); such ceria-coated silica particles can have a particle size of ranged from approximately 5 nanometers (nm) to 500 nanometers (nm);
• Chemical additives such as D-sorbitol, dulcitol, fructose, maltitol, lactitol and other chemical raw materials were supplied by Sigma-Aldrich, St. Louis, Mo.
• TEOS tetraethyl orthosilicate
• Polishing Pad Polishing pad, IC1010 and other pads were used during CMP, supplied by DOW, Inc.
• ⁇ or A angstrom(s)—a unit of length
• PS platen rotational speed of polishing tool, in rpm (revolution(s) per minute)
• Wt. % weight percentage (of a listed component)
• TEOS SiN Selectivity: (removal rate of TEOS)/(removal rate of SiN)
• HDP high density plasma deposited TEOS
• TEOS or HDP Removal Rates Measured TEOS or HDP removal rate at a given down pressure.
• the down pressure of the CMP tool was 2.0, 3.0 or 4.0 psi in the examples listed above.
• SiN Removal Rates Measured SiN removal rate at a given down pressure.
• the down pressure of the CMP tool was 3.0 psi in the examples listed.
• ResMap CDE model 168, manufactured by Creative Design Engineering, Inc, 20565 Alves Dr., Cupertino, Calif., 95014.
• the ResMap tool is a four-point probe sheet resistance tool. Forty-nine-point diameter scan at 5 mm edge exclusion for film was taken.
• the CMP tool that was used is a 200 mm Mirra, or 300 mm Reflexion manufactured by Applied Materials, 3050 Boweres Avenue, Santa Clara, Calif., 95054.
• An IC1000 pad supplied by DOW, Inc, 451 Bellevue Rd., Newark, Del. 19713 was used on platen 1 for blanket and pattern wafer studies.
• the IC1010 pad or other pad was broken in by conditioning the pad for 18 mins. At 7 lbs. down force on the conditioner. To qualify the tool settings and the pad break-in two tungsten monitors and two TEOS monitors were polished with Versum® STI2305 slurry, supplied by Versum Materials Inc. at baseline conditions.
• Polishing experiments were conducted using PECVD or LECVD or HD TEOS wafers. These blanket wafers were purchased from Silicon Valley Microelectronics, 2985 Kifer Rd., Santa Clara, Calif. 95051.
• oxide blanket wafers, and SiN blanket wafers were polished at baseline conditions.
• the tool baseline conditions were: table speed; 87 rpm, head speed: 93 rpm, membrane pressure; 3.0 psi, inter-tube pressure; 3.1 psi, retaining ring pressure; 5.1 psi, slurry flow; 200 ml/min.
• the slurry was used in polishing experiments on patterned wafers (MIT860), supplied by SWK Associates, Inc. 2920 Scott Boulevard. Santa Clara, Calif. 95054). These wafers were measured on the Veeco VX300 profiler/AFM instrument. The 3 different sized pitch structures were used for oxide dishing measurement. The wafer was measured at center, middle, and edge die positions.
• TEOS SiN Selectivity: (removal rate of TEOS)/(removal rate of SiN) obtained from the CMP polishing compositions were tunable.
• a polishing composition comprising 0.2 wt. % cerium-coated silica, a biocide ranging from 0.0001 wt. % to 0.05 wt. %, and deionized water was prepared as reference (ref.).
• the polishing compositions were prepared with the reference (0.2 wt. % cerium-coated silica, a biocide ranging from 0.0001 wt. % to 0.05 wt. %, and deionized water) plus a chemical additive in 0.01 wt. % to 2.0 wt. %.
• composition had a pH at 5.35.
• pH adjusting agent used for acidic pH condition and alkaline pH condition were nitric acid and ammonium hydroxide respectively.
• the working slurries has 0.15 wt. % chemical additives added to the reference slurry.
• Example 2 0.2 wt. % ceria-coated silica abrasive based formulation without chemical additives was used as reference.
• the chemical additives were used at 0.15 wt. % (0.15 ⁇ ) concentrations respectively with 0.2 wt. % ceria-coated silica as abrasives in the working slurries.
• Table 3 listed the ratio of oxide trench dishing rate ( ⁇ /min.) vs the blanket HDP film removal rate ( ⁇ /min.),
• Table 3 listed the ratio of oxide trench dishing rate ( ⁇ /min.) vs the blanket HDP film removal rate ( ⁇ /min.),
• polishing compositions using D-sorbitol and D-mannitol provided significant oxide trench dishing reductions on both 100 ⁇ m pitch and 200 ⁇ m pitch respectively, comparing to the reference.
• the polishing composition using xylitol showed no impact on oxide trench dishing in polishing comparing to the reference.
• the polishing compositions using D-(+)-mannose or meso-erythritol had the oxide trench dishing worse than the reference.
• the polishing composition using D-sorbitol or D-mannitol afforded much lower slope values of oxide trench dishing vs over polishing amounts on 100 ⁇ m and 200 ⁇ m features while comparing to the reference.
• the CMP compositions with chemical additives afforded lower oxide trench dishing on 100 um pitch, and 200 um pitch, respectively.
• the compositions provided significant oxide trench dishing reductions comparing to the reference composition.
• Table 7 listed the ratio of oxide trench dishing rate ( ⁇ /min.) vs the blanket HDP film removal rate ( ⁇ /min.),
• Example 4 the removal rates, and TEOS: SiN selectivity were tested tests were performed with CMP polishing compositions with chemical additives having different concentrations at pH 5.35.
• Table 11 listed the ratio of Trench Dishing Rate (A)/Blanket HDP RR ( ⁇ /min.)
• D-sorbitol can be used as an effective oxide trench dishing reducer in the wide concentration range.
• Example 5 the tests were performed with CMP polishing compositions having different pH values.
• composition composed of 0.2 wt. % ceria-coated silica as abrasives and 0.1 wt. % D-sorbitol as chemical additive was tested at three different pH conditions.
• compositions showed a consistent performance by offering high TEOS and HDP film removal rates, low SiN removal rates, and high TEOS: SiN selectivity in acidic, neutral or alkaline pH conditions..
• Table 15 showed the results of the ratio of Trench Dishing Rate (A)/Blanket HDP RR ( ⁇ /min.),
• Example 6 the effects of various selected chemical additives from afore listed several types of chemical additives on the film removal rates and selectivity were observed.
• pH adjusting agent was used for acidic pH condition and alkaline pH condition were nitric acid and ammonium hydroxide respectively.
• SiN selectivity was fluctuating from slightly increased (arabinose, myo-inositol) to significantly increased (maltitol, ribose and beta-lactose).
• maltitol showed as the most efficient SiN removal rate suppressing chemical additive
• ribose and beta-lactose also showed as quite efficient SiN removal rate suppressing additives.
• the following chemical additives maltitol, D-sorbitol, lactitol, ribose, and beta-lactose were used in the polishing compositions with 0.2 wt. % ceria-coated silica abrasives at pH 5.35 to have conducted polishing tests on polishing oxide patterned wafers.
• the chemical additives were used at 0.15 wt. % in the compositions.
• oxide trench dishing vs over polishing time results showed in Table 18, all of these chemical additives, when used with ceria-coated silica abrasives in the CMP polishing compositions, afforded largely reduced oxide trench dishing vs over polishing times at 60 seconds or 120 seconds respectively on 100 ⁇ m pitch and 200 ⁇ m pitch features, and provided significant oxide trench dishing reductions comparing to the reference.
• Table 19 showed the results of the ratio of Trench Dishing Rate (A)/Blanket HDP RR ( ⁇ /min.),
• the polishing compositions were prepared with the reference (0.2 wt. % ceria-coated silica, a biocide ranging from 0.0001 wt. % to 0.05 wt. %, and deionized water) and maltitol or lactitol were used at 0.28 wt. %.
• Example compositions in Example 8 were used in this Example.
• Oxide trenching dishing for without/or with different over polishing times were tested.
• the effects of maltitol or lactitol on the oxide trenching dishing vs over polishing times were observed.
• the polishing compositions with the addition of the chemical additives, maltitol or lactitol afforded low oxide trench dishing on 100 ⁇ m pitch, and 200 ⁇ m pitch respectively when 60 second or 120 second over polishing times were applied.
• compositions provided significant oxide trench dishing reductions comparing to the reference composition which did not have the chemical additives, maltitol or lactitol.
• Table 22 showed the results of the ratio of Trench Dishing Rate (A)/Blanket HDP RR ( ⁇ /min.),
• Example 10 the trench oxide loss rates were compared for the polishing compositions using maltitol or lactitol and reference as listed in Table 24.
• compositions were prepared as shown in Table 19.
• compositions used of 0.2 wt. % ceria-coated silica as abrasives, 0.28 wt. % lactitol as chemical additive, biocide, DI water, and a pH adjusting agent to provide different pH conditions.
• lactitol containing polishing composition at different pH conditions on the oxide trenching dishing vs over polishing times were observed.
• compositions with lactitol as oxide trench dishing reducing agent provided significant oxide trench dishing reductions comparing to the reference polishing composition which did not have the chemical additive, lactitol.
• Table 27 depicted the ratio of Trench Dishing Rate (A)/Blanket HDP RR ( ⁇ /min.) at Different pH.
• lactitol and ceria-coated silica based CMP polishing compositions again showed much lower slope values at different pH conditions comparing to those slope values obtained for the ceria-coated silica abrasive based reference sample at pH 5.35.
• Example 11 the trench oxide loss rates were compared for the polishing compositions using lactitol at different pH conditions or without using lactitol at pH 5.35 and listed in Table 29.
• polishing test results obtained at different pH conditions using lactitol as oxide trench dishing reducer proved that the CMP polishing compositions can be used in wide pH range including acidic, neutral or alkaline pH conditions.
• these chemical additives can have some impacts on the stability of ceria-coated inorganic oxide abrasives in the CMP polishing compositions.
• CMP polishing compositions it is very important to have good abrasive particle stability to assure constant and desirable CMP polishing performances.
• MPS (nm) mean particle size
• D99 (nm) changes vs the times or at elevated temperatures.
• the stability of ceria-coated silica abrasive particles in the compositions having chemical additives was monitored by measuring the change of the mean particles size and the change of particle size distribution D99.
• testing samples were made using 0.2 wt. % or other wt. % ceria-coated silica abrasive; very low concentration of biocide; 0.15 wt. % maltitol, 0.15 wt. % lactitol or 0.0787 wt. % Myo-inositol as oxide trench dishing reducer; and with pH adjusted to 5.35.
• the abrasive stability tests on the polishing compositions were carried out at 50° C. for at least 10 days or more.
• 0.2 wt. % ceria-coated silica particles had MPS changes of 0.23%, 0.34% and 0.39% in the compositions having 0.15 wt. % maltitol, 0.15 wt. lactitol and 0.0787 wt. % myo-inositol respectively.
• 0.2 wt. % ceria-coated silica particles in the composition having 0.15 wt. maltitol had a mean particle size change of less than 1.9% by day 18 at 50° C.
• 0.2 wt. % ceria-coated silica particles in the composition having 0.0787 wt. % myo-inositol had a mean particle size change of less than 0.83% by day 11 at 50° C.
• 0.2 wt. % ceria-coated silica particles in the composition having 0.15 wt. % lactitol had a mean particle size change of less than 1.3% by day 32 at 50° C.
• 0.2 wt. % ceria-coated silica particles in the composition having 0.15 wt. % maltitol had a mean particle size and D99 changes of less than 8.34 ⁇ 10 ⁇ 4 and 0.63 respectively by day 62 at 50° C.
• polishing compositions comprised more concentrated ceria-coated silica abrasives (more than 0.2 wt. %) and more concentrated maltitol (more than 0.15 wt. %) as oxide trench dishing reducer.
• 1.6 wt. % of the ceria-coated silica particles had MPS and D99 changes of less than 1.2% and less than 1.6% respectively by day 42 at 50° C. in the composition having 1.2 wt. % of maltitol respectively.
• 2.4 wt. % of the ceria-coated silica particles had MPS and D99 changes of less than 0.33% and less than 0.23% respectively by day 42 at 50° C. in the composition having 1.8 wt. % of maltitol respectively.
• polishing compositions showed very good particle size stability of MPS (nm) and D99 (nm) even at elevated testing temperatures.
• polishing compositions comprised of ceria-coated colloidal silica abrasives and more concentrated maltitol as oxide trench dishing reducer all showed very good particle size stability of MPS (nm) and D99 (nm) at elevated temperatures.
• Another key benefit of using the present invented CMP polishing compositions is the reduced total defect counts through and post-polishing which is resulted in by using the ceria-coated colloidal silica composite particles as abrasives instead of using calcined ceria particle as abrasives.
• the following three polishing compositions were prepared for defects testing.
• the first sample was made using 0.5 wt. % calcined ceria abrasives, 0.05 wt. % polyacrylate salt and low concentration of biocide;
• the second sample was made using 0.2 wt. % ceria-coated silica abrasives, 0.28 wt. % maltitol and low concentration of biocide;
• the third sample was made using 0.2 wt. % ceria-coated silica abrasives, 0.28 wt. % lactitol and low concentration of biocide.
• higher concentration of calcinated ceria abrasive was used in sample 1.
• the total defect counts on polished TEOS and SiN wafers were compared by using three afore listed polishing compositions.
• the total defect count results were listed in Table 33.
• the polishing compositions using ceria-coated silica particles as abrasives and either of maltitol or lactitol as trench dishing reducing agent afforded significantly lower total defect counts on the polished TEOS and SiN wafers than the total defect counts obtained using the polishing composition comprised of calcined ceria abrasives and polyacrylate salt as chemical additive.
• polishing compositions were prepared for the defects testing.
• the first two polishing compositions used calcined ceria abrasives, 0.28 wt. % maltitol or 0.28 wt. % lactitol as oxide trenching dishing reducing agent and low concentration of biocide; the other two polishing compositions were made using ceria-coated silica abrasives, 0.28 wt. % maltitol or 0.28 wt. % lactitol as oxide trenching dishing reducing agent and low concentration of biocide. All four formulations have pH valued at 5.35.
• the polishing compositions that used ceria-coated silica as abrasives did afford much higher TEOS and HDP film removal rates than those film removal rates obtained from the polishing compositions which used calcined ceria as abrasives.
• the normalized total defect counts on polished TEOS and SiN wafers were compared by using four afore listed polishing compositions.
• the normalized total defect count results were listed in Table 35.
• the polishing compositions using ceria-coated silica particles as abrasives and either maltitol or lactitol as trench dishing reducing agent afforded significantly lower normalized total defect counts on the polished TEOS and SiN wafers than the normalized total defect counts obtained using the polishing composition comprised of calcined ceria abrasives, and either maltitol or lactitol as oxide trench dishing reducing chemical additive.

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