US20190346124A1 - Systems and Methods for Lighting Fixtures - Google Patents
Systems and Methods for Lighting Fixtures Download PDFInfo
- Publication number
- US20190346124A1 US20190346124A1 US16/523,352 US201916523352A US2019346124A1 US 20190346124 A1 US20190346124 A1 US 20190346124A1 US 201916523352 A US201916523352 A US 201916523352A US 2019346124 A1 US2019346124 A1 US 2019346124A1
- Authority
- US
- United States
- Prior art keywords
- light
- light fixture
- rail
- fixture
- bars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G7/00—Botany in general
- A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
- A01G7/045—Electric or magnetic or acoustic treatment of plants for promoting growth with electric lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/107—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using hinge joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/005—Reflectors for light sources with an elongated shape to cooperate with linear light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/175—Controlling the light source by remote control
- H05B47/19—Controlling the light source by remote control via wireless transmission
- H05B47/195—Controlling the light source by remote control via wireless transmission the transmission using visible or infrared light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
Definitions
- Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing bends in metal-core PCB (MCPCB) and orthogonal braces for thermal, mechanical, and/or optical controls.
- MCPCB metal-core PCB
- orthogonal braces for thermal, mechanical, and/or optical controls.
- Vertical farming relies on light fixtures to illuminate a plant canopy.
- the light fixtures uniformly distribute radiant flux over the plant canopy, while removing heat from light sources (typically LEDs).
- the light fixtures' efficacy and cost directly impacts the operational expenses associated with vertical farming.
- LEDs light emitting diodes
- manufacturing costs are also higher.
- performance is negatively impacted with thermal rise.
- the terminal rise requires the light fixtures to dissipate heat more efficiently. This generated heat causes issues such as decreased longevity and lower fixture efficacy.
- LED fixtures are coupled to heat sinks.
- Conventional LED fixtures utilize LEDs that are positioned on a printed circuit board.
- PCB substrates may be made of different materials such as FR4, Aluminum, copper, etc.
- an insulative substrate is necessary such as FR4.
- a highly thermally conductive substrate is desired.
- thermal dissipation is paramount and therefore Aluminum substrates are often utilized.
- metal core printed circuit board is used or more commonly MCPCB.
- the linear MCPCB is then coupled to the heatsink to dissipate the heat. The process leads to inefficient thermal transfer or increased thermal resistance between the heat source (LEDs) and the heatsink.
- This process to affix the LEDs to the MCPCB and then to couple the MCPCB to the heat sink requires time and resources. This can be an arduous, time consuming, and costly task.
- Embodiments disclosed herein describe systems and methods for a light fixture that utilizes MCPCB for thermal, mechanical, and/or optical controls.
- a MCPCB sheet may be directly populated with electronic components, such as LEDS, connectors, fuses, etc.
- the board may then be coated for protection.
- the MCPCB sheet may then be cut into a single panel.
- the single panel MCPCB is bent at least one time, wherein the bend may increase the rigidity and mechanical strength of the system, be more aesthetically pleasing, and allow for thermal and optical controls.
- the bent MCPCB panel can then be assembled into a light fixture.
- the light fixture may include a plurality of bent panels that are coupled together by endcaps.
- the endcaps may be positioned on first ends and second ends of the bent panels.
- the endcaps may be configured to give the system mechanical strength in a direction that is perpendicular to the bends in the panels, while also allowing multiple bent panels to be coupled together.
- electrical components may be configured to be positioned through and/or embedded within the endcaps to reduce the footprint, sizing, etc. of the system.
- multiple endcaps on the first ends and/or second ends may be coupled together via a hinge.
- the hinge may allow for multiple sections of the system to be folded over itself while not in use, while sharing a same power supply when in use.
- FIG. 1 depicts a MCPCB LED bar system, according to an embodiment.
- FIG. 2 depicts a MCPCB fixture, according to an embodiment.
- FIG. 3 depicts a MCPCB fixture, according to an embodiment.
- FIG. 4 depicts a MCPCB fixture, according to an embodiment.
- FIG. 1 depicts a MCPCB LED bar system 100 , according to an embodiment.
- System 100 may be configured to utilize bends in a MCPCB lighting fixture for thermal, mechanical, and optical controls.
- System 100 may include MCPCB 110 , light sources 120 , and bends 130 . Utilizing bends 130 , MCPCB 110 may be substantially isothermal having somewhat uniform temperatures across MCPCB 110 .
- MCPCB 110 may be formed of any metal, including: copper, 3003 AL, 5052 AL, and/or other desired metals. In specific implementations, MCPCB 110 may be formed of a metal or substrate with a very low emissivity. However such a system would be much larger than a system with a high emissivity platform. To increase the emissivity of the MCPCB 110 , MCPCB 110 may be anodized, may have a solder mask that yields higher emissivity that anodized aluminum, and/or have a painted surface that yields higher emissivity than anodized aluminum. MCPCB 110 may be positioned in a panel having a longer longitudinal axis than a lateral axis. MCPCB 110 may have a thickness that is based on the thermal properties generated by light sources 120 . For example, MCPCB 110 may have a thickness that is around 1.6 mm.
- Light sources 120 may be light emitting diodes (LEDs) or any other device that is configured to emit light. Light sources 120 may be directly embedded or positioned on MCPCB 110 , such that additional operations to affix tape or thermal adhesives to MCPCB 110 , a heat sink, or both are not required. Light sources 120 may be positioned from a first end of MCPCB 110 to a second end of MCPCB 110 . Light sources 120 may be configured to generate heat in response to creating and emitting light. Light sources 120 may be arranged on MCPCB 110 in a plurality of rows, or in any predetermined layout to generate a desired light pattern on an area of interest positioned below system 100 .
- LEDs light emitting diodes
- the rows of light sources 120 may be symmetrically placed around and/or through the central axis of MCPCB 110 to emit an even light pattern and to generate even amounts of heat.
- the lights sources 120 may be asymmetrically positioned to generate a desired light pattern on a region of interest.
- Bends 130 may be positioned from the first end to the second end of MCPCB 110 . Bends 130 may be configured to add rigidity and/or mechanical strength to system 100 , add form for aesthetics, operate as a heat sink to guide the flow of air, and allow for optical controls. Bends 130 may be positioned at an angle that is perpendicular to MCPCB 110 or positioned at an angle that is downward and away from a central axis of MCPCB 110 . By angling bends 130 away from the central axis and towards a lower surface, thermal performance of system 100 may be increased.
- air that is heated by light sources 120 (and other electronics) under MCPCB 110 may travel towards the lower distal ends of bends 130 , around the distal ends of bends 130 , and upwards towards the central axis of system 100 positioned above MCPCB 110 .
- the heights of bends 130 may be based on the length of MCPCB 110 , wherein the heights of bends may be the vertical distance from the distal ends of bends 130 to the upper surface of MCPCB 110 . In embodiments, where the length of MCPCB 110 is longer the height of bends 130 may be taller, and where the length of MCPCB 110 is shorter the height of bends 130 may be shorter.
- bends 130 may be utilized for optical control of the light emitted from light sources 120 .
- the bends 130 may be used as a diffuse/speculator reflector for the light emitted from light sources 120 . This may enable system 100 to alter, change, and/or create a desirable light pattern on an area of interest below system 100 .
- angles, lengths, heights, and/or other geometrical properties of bends 130 may be symmetrical across the central axis such that MCPCB 110 is isothermal. Yet, in other implementations, the angles, lengths, heights, and/or other geometric properties of bends 130 may be asymmetric.
- FIG. 2 depicts a MCPCB fixture 200 , according to an embodiment. Elements depicted in FIG. 2 may be described above, and for the sake of brevity an additional description of these elements is omitted.
- fixture 200 may include a plurality of bent MCPCBs 110 .
- Each of the MCPCBs 110 may be aligned in parallel with each other.
- the outer ends of bends 130 may include a flat, planar surface 212 that extends in parallel to an upper surface 214 of MCPCBs 110 .
- Planar surface 212 may be utilized to couple the ends of MCPCB to endcaps 220 , 230 .
- Endcaps 220 , 230 may be polymer or metal (al, steel) endcaps that are configured to couple the ends of plurality of MCPCBs 110 together. Furthermore, endcaps 220 , 230 may be configured to be positioned orthogonal to the bends 130 . By positioning endcaps 220 , 230 in a direction orthogonal to bends 130 , endcaps 220 , 230 may supply mechanical rigidity and support to fixture 200 in a lateral axis of fixture 200 . Endcaps 220 , 230 may include a rail 222 , upper coupling mechanism 224 , and lower coupling mechanism 226 .
- Rail 222 may be a hollow channel, chamber, passageway that extends from a first side of rail endcap 220 , 230 to a second side of endcap 220 , 230 along the lateral axis of fixture 200 .
- Rails 222 may allow MCPCBs 110 to slide along the lateral axis of fixture 200 before being couple to endcaps 220 , 230 .
- Rail 222 may be configured to receive corresponding ends of MCPCBs 110 to couple MCPCBs to rails 222 .
- rail 222 may be configured to allow electrical components and other elements of fixture 200 to be housed within the chamber. This may eliminate the amount of exposed electrical components and other elements of fixture 200 .
- Upper coupling mechanism 224 may be systems and mechanisms configured to couple upper surface 214 of MCPCBs to endcaps 220 , 230 .
- Upper coupling mechanisms 224 may include screws, bolts, clasps, etc.
- Lower coupling mechanism 226 may be systems and mechanisms configured to couple planar surfaces 212 to endcaps 220 , 230 .
- Lower coupling mechanisms 226 may include screws, bolts, clasps, etc.
- FIG. 3 depicts a MCPCB fixture 400 , according to an embodiment. Elements depicted in FIG. 4 may be described above, and for the sake of brevity an additional description of these elements is omitted. Furthermore, elements described in fixture 400 may be combined with other fixtures, such as fixtures 100 , 200 , 300 or be used independently.
- a first set of MCPCBs 110 may be coupled together via endcaps 220 , 230
- a second set of MCPCBs 110 may be coupled together via endcaps 220 , 230
- the first set and second set of MCPCBs 110 may have the same number or different numbers of MCPCBs.
- the first and second sets of MCPCBs 110 may utilize the same power supply 420 .
- Electronic components 430 and wiring associated with power supply 420 may be run through rails 220 .
- first and second sets of MCPCBs 110 may be coupled together via hinges 410 , which may be positioned between endcaps 220 , 230 on the same sides of fixture 400 .
- Hinges 410 may allow fixture 400 to fold over itself along the longitudinal axis of fixture 400 . This may allow fixture 400 to have a smaller width during transportation and installation.
- FIG. 4 depicts an embodiment of MCPBC fixture 500 , according to an embodiment. Elements depicted in FIG. 4 may be described above, and for the sake of brevity an additional description of these elements is omitted. Furthermore, elements described in fixture 500 may be combined with other fixtures, such as fixtures 100 , 200 , 300 , 400 or be used independently.
- electrical wiring 510 may be run through rails 230 . This may reduce the physical space required to house fixture 500 .
- each block in the flowcharts or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).
- each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations may be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Forests & Forestry (AREA)
- Botany (AREA)
- Ecology (AREA)
- Biodiversity & Conservation Biology (AREA)
- Environmental Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Planar Illumination Modules (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- This application is a continuation of U.S. patent application Ser. No. 15/688,358, entitled “Systems and methods for lighting fixtures,” and filed Aug. 28, 2017, which claims priority to U.S. Provisional Application No. 62/516,412 filed on Jun. 7, 2017, each of which is fully incorporated herein by reference in their entirety.
- Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing bends in metal-core PCB (MCPCB) and orthogonal braces for thermal, mechanical, and/or optical controls.
- Controlled environment agriculture, especially vertical farming is becoming more prevalent in the US and around the world. Vertical farming relies on light fixtures to illuminate a plant canopy. The light fixtures uniformly distribute radiant flux over the plant canopy, while removing heat from light sources (typically LEDs). The light fixtures' efficacy and cost directly impacts the operational expenses associated with vertical farming. As fixture height directly influences a number of vertical layers within a growth volume, it is important to minimize a form factor or vertical height of the fixture
- Operating higher-powered lights in a vertical growth is more costly than utilizing free sunlight in greenhouses or field-grown. To overcome these costs, vertical farming must have an increased yield, shorter growth cycles, more consistent product, less water usage, farm to plate timeframe, high nutrient content, and other tangible advantages.
- Although light emitting diodes (LEDs) used in vertical farming are more efficient than traditional higher-powered lights, their manufacturing costs are also higher. Additionally, their performance is negatively impacted with thermal rise. The terminal rise requires the light fixtures to dissipate heat more efficiently. This generated heat causes issues such as decreased longevity and lower fixture efficacy. To circumvent the requirements to dissipate the heat, some manufacturers have built complex LED fixtures. This has led to conventional LED fixtures being coupled to heat sinks.
- This has led to conventional LED fixtures being coupled to heat sinks. Conventional LED fixtures utilize LEDs that are positioned on a printed circuit board. PCB substrates may be made of different materials such as FR4, Aluminum, copper, etc. In most application, an insulative substrate is necessary such as FR4. In high power applications, a highly thermally conductive substrate is desired. For LEDs, thermal dissipation is paramount and therefore Aluminum substrates are often utilized. When metal is used as the substrate, the term metal core printed circuit board is used or more commonly MCPCB. The linear MCPCB is then coupled to the heatsink to dissipate the heat. The process leads to inefficient thermal transfer or increased thermal resistance between the heat source (LEDs) and the heatsink. This process to affix the LEDs to the MCPCB and then to couple the MCPCB to the heat sink requires time and resources. This can be an arduous, time consuming, and costly task.
- Accordingly, needs exist for more effective and efficient systems and methods for light fixtures systems with supports that extend in a direction orthogonal to the bends of the heat sink.
- Embodiments disclosed herein describe systems and methods for a light fixture that utilizes MCPCB for thermal, mechanical, and/or optical controls. In embodiments, a MCPCB sheet may be directly populated with electronic components, such as LEDS, connectors, fuses, etc. The board may then be coated for protection. The MCPCB sheet may then be cut into a single panel. Next, the single panel MCPCB is bent at least one time, wherein the bend may increase the rigidity and mechanical strength of the system, be more aesthetically pleasing, and allow for thermal and optical controls. The bent MCPCB panel can then be assembled into a light fixture. The light fixture may include a plurality of bent panels that are coupled together by endcaps.
- The endcaps may be positioned on first ends and second ends of the bent panels. The endcaps may be configured to give the system mechanical strength in a direction that is perpendicular to the bends in the panels, while also allowing multiple bent panels to be coupled together. Furthermore, electrical components may be configured to be positioned through and/or embedded within the endcaps to reduce the footprint, sizing, etc. of the system.
- In embodiments, multiple endcaps on the first ends and/or second ends may be coupled together via a hinge. The hinge may allow for multiple sections of the system to be folded over itself while not in use, while sharing a same power supply when in use.
- These, and other, aspects of the invention will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. The following description, while indicating various embodiments of the invention and numerous specific details thereof, is given by way of illustration and not of limitation. Many substitutions, modifications, additions or rearrangements may be made within the scope of the invention, and the invention includes all such substitutions, modifications, additions or rearrangements.
- Non-limiting and non-exhaustive embodiments of the present invention are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.
-
FIG. 1 depicts a MCPCB LED bar system, according to an embodiment. -
FIG. 2 depicts a MCPCB fixture, according to an embodiment. -
FIG. 3 depicts a MCPCB fixture, according to an embodiment. -
FIG. 4 depicts a MCPCB fixture, according to an embodiment. - Corresponding reference characters indicate corresponding components throughout the several views of the drawings. Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of various embodiments of the present disclosure. Also, common but well-understood elements that are useful or necessary in a commercially feasible embodiment are often not depicted in order to facilitate a less obstructed view of these various embodiments of the present disclosure.
- In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present embodiments. It will be apparent, however, to one having ordinary skill in the art that the specific detail need not be employed to practice the present embodiments. In other instances, well-known materials or methods have not been described in detail in order to avoid obscuring the present embodiments.
-
FIG. 1 depicts a MCPCBLED bar system 100, according to an embodiment.System 100 may be configured to utilize bends in a MCPCB lighting fixture for thermal, mechanical, and optical controls.System 100 may includeMCPCB 110, light sources 120, and bends 130. Utilizingbends 130,MCPCB 110 may be substantially isothermal having somewhat uniform temperatures acrossMCPCB 110. -
MCPCB 110 may be formed of any metal, including: copper, 3003 AL, 5052 AL, and/or other desired metals. In specific implementations,MCPCB 110 may be formed of a metal or substrate with a very low emissivity. However such a system would be much larger than a system with a high emissivity platform. To increase the emissivity of theMCPCB 110,MCPCB 110 may be anodized, may have a solder mask that yields higher emissivity that anodized aluminum, and/or have a painted surface that yields higher emissivity than anodized aluminum.MCPCB 110 may be positioned in a panel having a longer longitudinal axis than a lateral axis.MCPCB 110 may have a thickness that is based on the thermal properties generated by light sources 120. For example,MCPCB 110 may have a thickness that is around 1.6 mm. - Light sources 120 may be light emitting diodes (LEDs) or any other device that is configured to emit light. Light sources 120 may be directly embedded or positioned on
MCPCB 110, such that additional operations to affix tape or thermal adhesives to MCPCB 110, a heat sink, or both are not required. Light sources 120 may be positioned from a first end ofMCPCB 110 to a second end ofMCPCB 110. Light sources 120 may be configured to generate heat in response to creating and emitting light. Light sources 120 may be arranged onMCPCB 110 in a plurality of rows, or in any predetermined layout to generate a desired light pattern on an area of interest positioned belowsystem 100. In embodiments, the rows of light sources 120 may be symmetrically placed around and/or through the central axis ofMCPCB 110 to emit an even light pattern and to generate even amounts of heat. However, in other embodiments, the lights sources 120 may be asymmetrically positioned to generate a desired light pattern on a region of interest. -
Bends 130 may be positioned from the first end to the second end ofMCPCB 110.Bends 130 may be configured to add rigidity and/or mechanical strength tosystem 100, add form for aesthetics, operate as a heat sink to guide the flow of air, and allow for optical controls.Bends 130 may be positioned at an angle that is perpendicular to MCPCB 110 or positioned at an angle that is downward and away from a central axis ofMCPCB 110. By anglingbends 130 away from the central axis and towards a lower surface, thermal performance ofsystem 100 may be increased. More specifically, air that is heated by light sources 120 (and other electronics) underMCPCB 110, may travel towards the lower distal ends ofbends 130, around the distal ends ofbends 130, and upwards towards the central axis ofsystem 100 positioned aboveMCPCB 110. - The heights of
bends 130 may be based on the length ofMCPCB 110, wherein the heights of bends may be the vertical distance from the distal ends ofbends 130 to the upper surface ofMCPCB 110. In embodiments, where the length ofMCPCB 110 is longer the height ofbends 130 may be taller, and where the length ofMCPCB 110 is shorter the height ofbends 130 may be shorter. - In embodiments, based on the geometric properties of
bends 130, bends 130 may be utilized for optical control of the light emitted from light sources 120. Specifically, thebends 130 may be used as a diffuse/speculator reflector for the light emitted from light sources 120. This may enablesystem 100 to alter, change, and/or create a desirable light pattern on an area of interest belowsystem 100. - In embodiments, the angles, lengths, heights, and/or other geometrical properties of
bends 130 may be symmetrical across the central axis such thatMCPCB 110 is isothermal. Yet, in other implementations, the angles, lengths, heights, and/or other geometric properties ofbends 130 may be asymmetric. -
FIG. 2 depicts aMCPCB fixture 200, according to an embodiment. Elements depicted inFIG. 2 may be described above, and for the sake of brevity an additional description of these elements is omitted. - As depicted in
FIG. 2 ,fixture 200 may include a plurality ofbent MCPCBs 110. Each of theMCPCBs 110 may be aligned in parallel with each other. The outer ends ofbends 130 may include a flat,planar surface 212 that extends in parallel to anupper surface 214 ofMCPCBs 110.Planar surface 212 may be utilized to couple the ends of MCPCB toendcaps -
Endcaps MCPCBs 110 together. Furthermore,endcaps bends 130. By positioningendcaps bends 130,endcaps fixture 200 in a lateral axis offixture 200.Endcaps rail 222,upper coupling mechanism 224, andlower coupling mechanism 226. -
Rail 222 may be a hollow channel, chamber, passageway that extends from a first side ofrail endcap endcap fixture 200.Rails 222 may allowMCPCBs 110 to slide along the lateral axis offixture 200 before being couple toendcaps Rail 222 may be configured to receive corresponding ends ofMCPCBs 110 to couple MCPCBs to rails 222. Furthermore,rail 222 may be configured to allow electrical components and other elements offixture 200 to be housed within the chamber. This may eliminate the amount of exposed electrical components and other elements offixture 200. -
Upper coupling mechanism 224 may be systems and mechanisms configured to coupleupper surface 214 of MCPCBs toendcaps Upper coupling mechanisms 224 may include screws, bolts, clasps, etc. -
Lower coupling mechanism 226 may be systems and mechanisms configured to coupleplanar surfaces 212 toendcaps Lower coupling mechanisms 226 may include screws, bolts, clasps, etc. By couplingMCPCBs 110 toendcaps MCPCBs 110 may be securely affixed toendcaps -
FIG. 3 depicts aMCPCB fixture 400, according to an embodiment. Elements depicted inFIG. 4 may be described above, and for the sake of brevity an additional description of these elements is omitted. Furthermore, elements described infixture 400 may be combined with other fixtures, such asfixtures - As depicted in
FIG. 3 , a first set ofMCPCBs 110 may be coupled together viaendcaps MCPCBs 110 may be coupled together viaendcaps MCPCBs 110 may have the same number or different numbers of MCPCBs. The first and second sets ofMCPCBs 110 may utilize thesame power supply 420.Electronic components 430 and wiring associated withpower supply 420 may be run throughrails 220. - In embodiments, the first and second sets of
MCPCBs 110 may be coupled together viahinges 410, which may be positioned betweenendcaps fixture 400.Hinges 410 may allowfixture 400 to fold over itself along the longitudinal axis offixture 400. This may allowfixture 400 to have a smaller width during transportation and installation. -
FIG. 4 depicts an embodiment ofMCPBC fixture 500, according to an embodiment. Elements depicted inFIG. 4 may be described above, and for the sake of brevity an additional description of these elements is omitted. Furthermore, elements described infixture 500 may be combined with other fixtures, such asfixtures - As depicted in
FIG. 4 ,electrical wiring 510 may be run throughrails 230. This may reduce the physical space required to housefixture 500. - Although the present technology has been described in detail for the purpose of illustration based on what is currently considered to be the most practical and preferred implementations, it is to be understood that such detail is solely for that purpose and that the technology is not limited to the disclosed implementations, but, on the contrary, is intended to cover modifications and equivalent arrangements that are within the spirit and scope of the appended claims. For example, it is to be understood that the present technology contemplates that, to the extent possible, one or more features of any implementation can be combined with one or more features of any other implementation.
- Reference throughout this specification to “one embodiment”, “an embodiment”, “one example” or “an example” means that a particular feature, structure or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present invention. Thus, appearances of the phrases “in one embodiment”, “in an embodiment”, “one example” or “an example” in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures or characteristics may be combined in any suitable combinations and/or sub-combinations in one or more embodiments or examples. In addition, it is appreciated that the figures provided herewith are for explanation purposes to persons ordinarily skilled in the art and that the drawings are not necessarily drawn to scale.
- The flowcharts and block diagrams in the flow diagrams illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowcharts or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It will also be noted that each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, may be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/523,352 US20190346124A1 (en) | 2017-06-07 | 2019-07-26 | Systems and Methods for Lighting Fixtures |
US16/586,893 US20200041110A1 (en) | 2017-06-07 | 2019-09-27 | Systems and methods for lighting fixtures |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762516412P | 2017-06-07 | 2017-06-07 | |
US15/688,358 US10415810B2 (en) | 2017-06-07 | 2017-08-28 | Systems and methods for lighting fixtures |
US16/523,352 US20190346124A1 (en) | 2017-06-07 | 2019-07-26 | Systems and Methods for Lighting Fixtures |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/688,358 Continuation US10415810B2 (en) | 2017-06-07 | 2017-08-28 | Systems and methods for lighting fixtures |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/586,893 Continuation US20200041110A1 (en) | 2017-06-07 | 2019-09-27 | Systems and methods for lighting fixtures |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190346124A1 true US20190346124A1 (en) | 2019-11-14 |
Family
ID=64562139
Family Applications (14)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/684,665 Active 2037-09-16 US10359183B2 (en) | 2017-06-07 | 2017-08-23 | Systems and methods for lighting fixtures |
US15/688,358 Active US10415810B2 (en) | 2017-06-07 | 2017-08-28 | Systems and methods for lighting fixtures |
US15/697,149 Active US10436428B2 (en) | 2017-06-07 | 2017-09-06 | Systems and methods for lighting fixtures |
US15/829,197 Active US10208920B2 (en) | 2017-06-07 | 2017-12-01 | Systems and methods for lighting fixtures |
US15/859,409 Active US10215389B2 (en) | 2017-06-07 | 2017-12-30 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/239,668 Active US10605444B2 (en) | 2017-06-07 | 2019-01-04 | Systems and methods for lighting fixtures |
US16/246,803 Active US10495292B2 (en) | 2017-06-07 | 2019-01-14 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/433,042 Active 2037-11-01 US10914462B2 (en) | 2017-06-07 | 2019-06-06 | Systems and methods for lighting fixtures |
US16/523,352 Abandoned US20190346124A1 (en) | 2017-06-07 | 2019-07-26 | Systems and Methods for Lighting Fixtures |
US16/542,442 Active US10816180B2 (en) | 2017-06-07 | 2019-08-16 | Systems and methods for lighting fixtures |
US16/571,595 Active US10782009B2 (en) | 2017-06-07 | 2019-09-16 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/586,893 Abandoned US20200041110A1 (en) | 2017-06-07 | 2019-09-27 | Systems and methods for lighting fixtures |
US16/742,991 Active US10823382B2 (en) | 2017-06-07 | 2020-01-15 | Systems and methods for lighting fixtures |
US16/920,794 Active US11320126B2 (en) | 2017-06-07 | 2020-07-06 | Systems and methods for a smart module directly embedded on a lighting fixture |
Family Applications Before (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/684,665 Active 2037-09-16 US10359183B2 (en) | 2017-06-07 | 2017-08-23 | Systems and methods for lighting fixtures |
US15/688,358 Active US10415810B2 (en) | 2017-06-07 | 2017-08-28 | Systems and methods for lighting fixtures |
US15/697,149 Active US10436428B2 (en) | 2017-06-07 | 2017-09-06 | Systems and methods for lighting fixtures |
US15/829,197 Active US10208920B2 (en) | 2017-06-07 | 2017-12-01 | Systems and methods for lighting fixtures |
US15/859,409 Active US10215389B2 (en) | 2017-06-07 | 2017-12-30 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/239,668 Active US10605444B2 (en) | 2017-06-07 | 2019-01-04 | Systems and methods for lighting fixtures |
US16/246,803 Active US10495292B2 (en) | 2017-06-07 | 2019-01-14 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/433,042 Active 2037-11-01 US10914462B2 (en) | 2017-06-07 | 2019-06-06 | Systems and methods for lighting fixtures |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/542,442 Active US10816180B2 (en) | 2017-06-07 | 2019-08-16 | Systems and methods for lighting fixtures |
US16/571,595 Active US10782009B2 (en) | 2017-06-07 | 2019-09-16 | Systems and methods for a smart module directly embedded on a lighting fixture |
US16/586,893 Abandoned US20200041110A1 (en) | 2017-06-07 | 2019-09-27 | Systems and methods for lighting fixtures |
US16/742,991 Active US10823382B2 (en) | 2017-06-07 | 2020-01-15 | Systems and methods for lighting fixtures |
US16/920,794 Active US11320126B2 (en) | 2017-06-07 | 2020-07-06 | Systems and methods for a smart module directly embedded on a lighting fixture |
Country Status (6)
Country | Link |
---|---|
US (14) | US10359183B2 (en) |
JP (2) | JP2020523788A (en) |
CN (1) | CN111033120A (en) |
CA (1) | CA3066072C (en) |
DE (1) | DE112018002932T5 (en) |
WO (1) | WO2018226431A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10359183B2 (en) * | 2017-06-07 | 2019-07-23 | Fluence Bioengineering, Inc. | Systems and methods for lighting fixtures |
US10859246B2 (en) | 2018-08-01 | 2020-12-08 | Fluence Bioengineering, Inc. | Systems and methods for collapsible lighting fixtures |
US11800835B2 (en) | 2019-01-10 | 2023-10-31 | Verdant Lighting Technology, Inc. | Optical system for facilitating plant growth having non-uniform light density distribution |
KR20200117557A (en) * | 2019-04-04 | 2020-10-14 | 에코캡 주식회사 | LED lamp having metal PCB which banding type polyhedric body and Manufacturing Method Thereof |
US11508892B2 (en) * | 2019-04-26 | 2022-11-22 | Lumileds Llc | Folded heatsink design for thermal challenging LED applications |
US11313473B2 (en) | 2020-09-04 | 2022-04-26 | Hamilton Sundstrand Corporation | Butterfly valve with vibration resistant mount |
USD976467S1 (en) * | 2021-03-30 | 2023-01-24 | Horticulture Lighting Group Corp. | Six panel grow light |
USD970783S1 (en) * | 2021-05-13 | 2022-11-22 | 3L Trading Inc. | Light fixture |
USD977173S1 (en) * | 2021-06-29 | 2023-01-31 | Huizhou Hongrui Photoelectric Technology Co., Ltd. | Telescopic plant light |
USD1005554S1 (en) * | 2021-08-16 | 2023-11-21 | Lighting Solutions Group Llc | Grow light |
SE2151443A1 (en) * | 2021-11-26 | 2023-05-27 | Wivid Ab | A printed circuit board with improved cooling properties and method for manufacture thereof |
EP4372386A1 (en) * | 2022-11-18 | 2024-05-22 | Sensirion AG | Sensor module and method for manufacturing a sensor module |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140111733A1 (en) * | 2012-10-18 | 2014-04-24 | Shenzhen China Star Optoelectronics Technology Co. | Backlight module and liquid crystal display device comprising same |
US20180087755A1 (en) * | 2016-09-29 | 2018-03-29 | Biological Innovation & Optimization Systems, LLC | Adjustable led grow light fixtures |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0511718A (en) * | 1991-07-02 | 1993-01-22 | Mitsubishi Cable Ind Ltd | Light emitting device |
US8789963B2 (en) * | 2004-03-18 | 2014-07-29 | Brasscorp Limited | Compact LED work light |
JP4760699B2 (en) * | 2006-01-18 | 2011-08-31 | 三菱電機株式会社 | Planar light source device and image display device using the same |
KR100852250B1 (en) | 2006-01-18 | 2008-08-14 | 미쓰비시덴키 가부시키가이샤 | Planar light source unit and image display apparatus using the same |
US9655217B2 (en) * | 2006-03-28 | 2017-05-16 | Michael V. Recker | Cloud connected motion sensor lighting grid |
US7665862B2 (en) * | 2006-09-12 | 2010-02-23 | Cree, Inc. | LED lighting fixture |
TW200944711A (en) | 2008-04-16 | 2009-11-01 | Harvatek Corp | LED chip package structure using a substrate as a lampshade and its manufacturing method |
US8030674B2 (en) | 2008-04-28 | 2011-10-04 | Lextar Electronics Corp. | Light-emitting diode package with roughened surface portions of the lead-frame |
US7976196B2 (en) * | 2008-07-09 | 2011-07-12 | Altair Engineering, Inc. | Method of forming LED-based light and resulting LED-based light |
US7938562B2 (en) * | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
CN101776254B (en) * | 2009-01-10 | 2012-11-21 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp and photo engine thereof |
US7932532B2 (en) * | 2009-08-04 | 2011-04-26 | Cree, Inc. | Solid state lighting device with improved heatsink |
KR101096092B1 (en) * | 2009-08-27 | 2011-12-19 | 금호전기주식회사 | Folded lighting apparatus |
US8764220B2 (en) * | 2010-04-28 | 2014-07-01 | Cooper Technologies Company | Linear LED light module |
US8147091B2 (en) * | 2009-12-22 | 2012-04-03 | Lightel Technologies Inc. | Linear solid-state lighting with shock protection switches |
JP2011216216A (en) * | 2010-03-31 | 2011-10-27 | Sanken Electric Co Ltd | Light-emitting diode lighting apparatus |
WO2011132159A1 (en) * | 2010-04-23 | 2011-10-27 | Koninklijke Philips Electronics N.V. | Led-based lighting unit |
KR101114719B1 (en) | 2010-08-09 | 2012-02-29 | 엘지이노텍 주식회사 | Light emitting device and lighing system |
US20120155095A1 (en) | 2010-12-16 | 2012-06-21 | Led Lighting, Engineering & Design, Corp. | Roll-formed heat sink for a lighting fixture |
JP5049382B2 (en) | 2010-12-21 | 2012-10-17 | パナソニック株式会社 | LIGHT EMITTING DEVICE AND LIGHTING DEVICE USING THE SAME |
US9395057B2 (en) * | 2011-02-07 | 2016-07-19 | Cree, Inc. | Lighting device with flexibly coupled heatsinks |
WO2012115091A1 (en) * | 2011-02-24 | 2012-08-30 | 富士フイルム株式会社 | Electroconductive sheet and touch panel |
US8573823B2 (en) | 2011-08-08 | 2013-11-05 | Quarkstar Llc | Solid-state luminaire |
JP6275399B2 (en) * | 2012-06-18 | 2018-02-07 | エルジー イノテック カンパニー リミテッド | Lighting device |
JP6282419B2 (en) * | 2012-07-27 | 2018-02-21 | エルジー イノテック カンパニー リミテッド | Lighting device |
US20140160740A1 (en) | 2012-12-10 | 2014-06-12 | Avago Technologies General Ip (Singapore) Pte. Ltd | Light tube with low up-light |
US9523468B2 (en) * | 2013-08-12 | 2016-12-20 | Simply Leds, Llc. | Lighting fixture having enhanced light distribution performance |
US20150219328A1 (en) * | 2014-02-06 | 2015-08-06 | Lediammond Opto Corporation | Led lighting fixture |
EP2927579B1 (en) * | 2014-04-04 | 2020-02-12 | Harman Professional Denmark ApS | Cooling module for led light fixture |
GB201407301D0 (en) * | 2014-04-25 | 2014-06-11 | Aurora Ltd | Improved led lamps and luminaires |
US9541261B2 (en) * | 2014-07-01 | 2017-01-10 | Fluence Bioengineering | Systems and methods for a dynamic light fixture |
US9310045B2 (en) * | 2014-08-01 | 2016-04-12 | Bridgelux, Inc. | Linear LED module |
JP2016081897A (en) * | 2015-03-10 | 2016-05-16 | 株式会社アブラム | Straight pipe type light emitting diode illumination lamp and case of the same |
WO2017023730A1 (en) * | 2015-07-31 | 2017-02-09 | Richpower Industries, Inc. | Lighting assembly |
DE102015219140A1 (en) | 2015-10-02 | 2017-04-06 | Osram Gmbh | Semiconductor lamp |
US10327312B2 (en) * | 2016-09-14 | 2019-06-18 | Abl Ip Holding Llc | LED luminaire assemblies with Bluetooth capability |
US10359183B2 (en) * | 2017-06-07 | 2019-07-23 | Fluence Bioengineering, Inc. | Systems and methods for lighting fixtures |
US10034358B1 (en) * | 2017-07-08 | 2018-07-24 | Xiaolai Chen | User controllable grow lighting system, method, and online light settings store |
-
2017
- 2017-08-23 US US15/684,665 patent/US10359183B2/en active Active
- 2017-08-28 US US15/688,358 patent/US10415810B2/en active Active
- 2017-09-06 US US15/697,149 patent/US10436428B2/en active Active
- 2017-12-01 US US15/829,197 patent/US10208920B2/en active Active
- 2017-12-30 US US15/859,409 patent/US10215389B2/en active Active
-
2018
- 2018-05-25 DE DE112018002932.8T patent/DE112018002932T5/en active Pending
- 2018-05-25 JP JP2019567693A patent/JP2020523788A/en active Pending
- 2018-05-25 WO PCT/US2018/034544 patent/WO2018226431A2/en active Application Filing
- 2018-05-25 CN CN201880049525.0A patent/CN111033120A/en active Pending
- 2018-05-25 CA CA3066072A patent/CA3066072C/en active Active
-
2019
- 2019-01-04 US US16/239,668 patent/US10605444B2/en active Active
- 2019-01-14 US US16/246,803 patent/US10495292B2/en active Active
- 2019-06-06 US US16/433,042 patent/US10914462B2/en active Active
- 2019-07-26 US US16/523,352 patent/US20190346124A1/en not_active Abandoned
- 2019-08-16 US US16/542,442 patent/US10816180B2/en active Active
- 2019-09-16 US US16/571,595 patent/US10782009B2/en active Active
- 2019-09-27 US US16/586,893 patent/US20200041110A1/en not_active Abandoned
-
2020
- 2020-01-15 US US16/742,991 patent/US10823382B2/en active Active
- 2020-07-06 US US16/920,794 patent/US11320126B2/en active Active
-
2022
- 2022-05-24 JP JP2022084814A patent/JP7433364B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140111733A1 (en) * | 2012-10-18 | 2014-04-24 | Shenzhen China Star Optoelectronics Technology Co. | Backlight module and liquid crystal display device comprising same |
US20180087755A1 (en) * | 2016-09-29 | 2018-03-29 | Biological Innovation & Optimization Systems, LLC | Adjustable led grow light fixtures |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10415810B2 (en) | Systems and methods for lighting fixtures | |
CN101614365B (en) | Light guide module and light-emitting diode lamp using light guide module | |
US8858028B2 (en) | LED lighting apparatus | |
US20150354794A1 (en) | Modular light fixture with adjustable light distribution pattern | |
KR100946626B1 (en) | Led lighting device | |
US11346540B2 (en) | Systems and methods for a heat sink | |
KR101118965B1 (en) | Led lighting fixture that contain a complex lens system | |
KR101079860B1 (en) | Led light fixture | |
CN101463982A (en) | LED lamp | |
KR101024529B1 (en) | Led lighting device | |
US20120314416A1 (en) | Led lamp assembly for use in a long passage | |
EP2587133B1 (en) | Lighting component with led reflector strip | |
CN101586794A (en) | Light-emitting diode lamp with radiator structure | |
CN104676358A (en) | Lamp | |
US20190368719A1 (en) | Lamp device | |
KR20180114479A (en) | Light generating assembly and lighting apparatus including the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FLUENCE BIOENGINEERING, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KLASE, NICHOLAS;JOHNSON, RANDALL;DUONG, DUNG;REEL/FRAME:049872/0818 Effective date: 20180129 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCV | Information on status: appeal procedure |
Free format text: NOTICE OF APPEAL FILED |
|
STCV | Information on status: appeal procedure |
Free format text: APPEAL BRIEF (OR SUPPLEMENTAL BRIEF) ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |