US20190296268A1 - Oled panel and its method of manufacturing, oled display - Google Patents
Oled panel and its method of manufacturing, oled display Download PDFInfo
- Publication number
- US20190296268A1 US20190296268A1 US16/102,768 US201816102768A US2019296268A1 US 20190296268 A1 US20190296268 A1 US 20190296268A1 US 201816102768 A US201816102768 A US 201816102768A US 2019296268 A1 US2019296268 A1 US 2019296268A1
- Authority
- US
- United States
- Prior art keywords
- film layer
- inorganic film
- refractive index
- layer
- inorganic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000010408 film Substances 0.000 claims abstract description 287
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 239000010409 thin film Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims description 34
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 16
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 11
- 238000004549 pulsed laser deposition Methods 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 238000007641 inkjet printing Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H01L51/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H01L51/0005—
-
- H01L51/0008—
-
- H01L51/0097—
-
- H01L51/5275—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present disclosure relates to display technologies, and in particular to an OLED (Organic Light Emitting Diode) panel and its method of manufacturing, an OLED display.
- OLED Organic Light Emitting Diode
- OLED display involves a flat panel display technology with great prospect. It has characteristics of self-illumination, simple structure, ultra-lightweight, fast response, wide viewing angle, low power consumption, flexible display and so on.
- OLED display is favored by major display manufacturers and becomes a third-generation display following CRT (Cathode Ray Tube) display and LCD (Liquid Crystal Display).
- CRT Cathode Ray Tube
- LCD Liquid Crystal Display
- the organic light emitting material used in the OLED panel is very sensitive to water and oxygen, the requirements for blocking water and oxygen are extremely strict.
- a flexible film layer will be packaged on the organic light emitting material.
- the commonly used packaging structure is an inorganic or organic film layer.
- the inorganic film layer is usually dense, and its water-oxygen proof performance is good.
- the stress of the film layer exists, which makes the inorganic film layer have poor bending properties and is prone to cracking and peeling.
- the fractured cracks are easily diffused in the inorganic film layer.
- the water-oxygen proof performance of the organic film layer is weak. However, it can effectively release the stress and avoid a further crack extension risk of the inorganic film layer.
- the OLED panel adopts a structure in which an inorganic film layer and an organic film layer overlap each other.
- the high water-oxygen proof capability of the inorganic film layer and the stress release of the organic film layer are complementary, and can be used to better meet the service life of the OLED panel.
- the inventor of the present disclosure discovered in a long-term study that the current OLED panel uses a packaging structure of inorganic film layer-organic film layer-inorganic film layer, which has poor performance in blocking external water and oxygen, and the packaging structure of the OLED panel has a great influence on the light emitting efficiency of the OLED panel.
- the technical problem solved by the present disclosure is to provide an OLED panel and its method of manufacturing, an OLED display, which can increase the light emitting efficiency of the OLED panel while effectively blocking the external water and oxygen.
- the present disclosure provides an method of manufacturing an OLED panel, including: preparing an OLED device including an organic light emitting layer; and forming a thin film packaging structure on the OLED device to cover the organic light emitting layer; wherein the forming the thin film packaging structure on the OLED device to cover the organic light emitting layer includes: forming a first inorganic film layer on the OLED device; forming a first organic film layer on a side of the first inorganic film layer far away from the OLED device: and a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; forming a second inorganic film layer on the first organic film layer; forming a third inorganic film layer on the second inorganic film layer; and forming a fourth inorganic film layer on the third inorganic film layer; 410 a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a
- an OLED panel including: an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer; the thin film packaging structure includes a first inorganic film layer formed on the OLED device; a first organic film layer formed on a side of the first inorganic film layer far away from the OLED device; a second inorganic film layer formed on the first organic film layer; a third inorganic film layer formed on the second inorganic film layer; a fourth inorganic film layer formed on the third inorganic film layer; a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a refractive index of the third inorganic film layer.
- the present disclosure provides an OLED display including an OLED display panel.
- the OLED display panel includes an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer; the thin film packaging structure includes a first inorganic film layer formed on the OLED device; a first organic film layer formed on a side of the first inorganic film layer far away from the OLED device; a second inorganic film layer formed on the first organic film layer; a third inorganic film layer formed on the second inorganic film layer; a fourth inorganic film layer formed on the third inorganic film layer; a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a refractive index of the third inorganic film layer.
- the OLED panel of the present disclosure including: an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer, wherein the thin film packaging structure includes a first inorganic film layer, a first organic film layer, a second inorganic film layer, a third inorganic film layer and a fourth inorganic film layer set in sequence.
- the refractive index of the first inorganic film layer is greater than that of the first organic film layer, and the refractive index of the second inorganic film layer and the refractive index of the fourth inorganic film layer are both smaller than that of the third inorganic film layer.
- the thin film packaging structure By setting the thin film packaging structure to include multiple inorganic film layers and matching the refractive index between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light emitting efficiency can be improved, and the loss of the light emitting efficiency caused by the thin film packaging structure can be reduced.
- FIG. 1 is a schematic structural diagram of an embodiment of an OLED panel provided by the present disclosure.
- FIG. 2 is a schematic structural diagram of another embodiment of an OLED panel provided by the present disclosure.
- FIG. 3 is a curse graph verifying a light emitting efficiency of an OLED panel provided by the present disclosure using optical simulation software.
- FIG. 4 is a curve graph of a light emitting efficiency of an OLED panel provided by the present disclosure in a practical experiment.
- FIG. 5 is a schematic structural diagram of an embodiment of an OLED display provided by the present disclosure.
- FIG. 1 is a schematic structural diagram of an embodiment of an OLED panel provided by the present disclosure.
- the OLED panel includes an OLED device 11 and a thin film packaging structure 12 .
- the OLED device 11 includes an organic light emitting layer 111 .
- the organic light emitting layer 111 includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel.
- the OLED device 11 may further include a substrate, an anode layer, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, a cathode layer, and other layers well known to those skilled in the art. We will not repeat here.
- the thin film packaging structure 12 is formed on the OLED device 11 and covers the organic light emitting layer 111 .
- the thin film packaging structure 12 includes a first inorganic film layer 121 , a first organic film layer 122 , second inorganic film layer 123 , a third inorganic film layer 124 , and a fourth inorganic film layer 125 .
- the first inorganic film layer 121 is formed OLED device 11 .
- the first organic film layer 122 is formed on a side of the first inorganic film layer 121 far away from the OLED device 11 .
- the second inorganic film layer 123 is formed on the first organic film layer 121 .
- the third inorganic film layer 124 is formed on the second inorganic film layer 123
- the fourth inorganic film layer 125 is formed on the third inorganic film layer 124 , that is, the first inorganic film layer 121 , the first organic film layer 122 , the second inorganic film layer 123 , the third inorganic film layer 124 and the fourth inorganic film layer 125 are sequentially disposed.
- the thin film packaging structure in the present embodiment includes four inorganic film layers, which can improve the water and oxygen resistance of the OLED panel.
- the refractive index of the first inorganic film layer 121 is greater than that of the first organic film layer 122
- the refractive index of the second inorganic film layer 123 and the refractive index of the fourth inorganic film layer 125 are both smaller than that of the third inorganic film layer 124 .
- first inorganic film layer 121 will pass through the first inorganic film layer 121 , the first organic film layer 122 , the second inorganic film layer 123 , the third inorganic film layer 124 , and the fourth inorganic film layer 125 in sequence.
- the first organic film layer 122 plays expansion effect on light.
- the light continues to be expanded after entering the second inorganic film layer 123 , and the second inorganic film layer 123 can cover more light paths. Then the light that has been expanded enters the third film layer 124 with a relatively high refractive index.
- the refractive index of the third inorganic film layer 124 is greater than that of the fourth inorganic film layer 125 , some light may be reflected.
- the reflected light is continuously reflected and amplified by the second inorganic film layer 123 and the first inorganic film layer 121 , generating a resonance effect, thereby improving light emitting efficiency.
- the OLED panel of the above embodiment by setting a multilayer inorganic film layer and matching the refractive index between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light output rate can be improved, and the loss of the light emitting efficiency caused by the film packaging structure can be reduced.
- the difference between the refractive index of the first inorganic film layer 121 and the refractive index of the first organic film layer 122 is 0.1-0.3, that is, the refractive index of the first inorganic film layer 121 is greater than the refractive index of the first organic film layer 122 , the difference range is 0.1-0.3.
- the first inorganic film layer 121 has a refractive index of 1.8-2.3
- the first organic film layer 122 has a refractive index of 1.6-2.0
- the second inorganic film layer 123 has a refractive index of 1.4-1.7
- the third inorganic film layer 124 has a refractive index of 1.8-2.3
- the fourth inorganic film layer 125 has a refractive index of 1.4-1.7. Therefore, the light emitting efficiency of the OLED device is improved by setting a certain refractive index of each film layer.
- the first inorganic film layer 121 has a thickness of 100-300 nm
- the first organic film layer 122 has a thickness of 3000-8000 nm
- the second inorganic film layer 123 has a thickness of 50-1000 nm
- the third inorganic film layer 124 has a thickness of 10-300 nm
- the fourth inorganic film layer 125 has a thickness of 50-1000 nm. Therefore, the light emitting efficiency of the OLED device is improved by setting a certain thickness of each film layer, when ensuring that the thin film packaging structure 12 has the minimum thickness.
- the material of the first inorganic film layer 121 and the material of the third inorganic film layer 124 are the same or different, and each of the material of the first inorganic film layer 121 and the material of the third inorganic film layer 124 is at least one of titanium dioxide, silicon nitride, silicon oxide and zirconium oxide. That is, the refractive index of the first inorganic film layer 121 and the refractive index of the third inorganic film layer 124 are controlled by choosing material of the first inorganic film layer 121 and material of the third inorganic film layer 124 .
- the material of the second inorganic film layer 123 and the material of the fourth inorganic film layer 125 are the same or different, and each of the material of the second inorganic film layer 123 and the material of the fourth inorganic film layer 125 is at least one of silicon oxynitride and aluminum oxide, that is, the refractive index of the second inorganic film layer 123 and the refractive index of the fourth inorganic film layer 125 are controlled by choosing the material of the second inorganic film layer 123 and the material of the fourth inorganic film layer 125 .
- the first inorganic film layer 121 , the second inorganic film layer 123 , the third inorganic film layer 124 and the fourth inorganic film layer 125 are prepared by plasma enhanced chemical vapor deposition (PECVD), pulsed laser deposition (PLD), or sputtering (Sputter).
- PECVD plasma enhanced chemical vapor deposition
- PLD pulsed laser deposition
- Sputter sputtering
- the first organic film layer 122 is prepared by plasma enhanced chemical vapor deposition (PECVD), inkjet printing (IJP), or coating.
- PECVD plasma enhanced chemical vapor deposition
- IJP inkjet printing
- FIG. 2 is a schematic structural diagram of another embodiment of an OLED panel provided by the present disclosure. Different from the embodiment of FIG. 1 , in the present embodiment, the OLED device 11 further includes: a cover layer 112 and a lithium fluoride layer 113 .
- the cover layer 112 is formed on the organic light emitting layer 111 , the lithium fluoride layer 113 is formed on the cover layer 112 , and the first inorganic film layer 121 is formed on the lithium fluoride layer 113 .
- the cover layer is made of an organic material.
- the thin film package structure 12 is formed on the OLED device 11 , it is possible to generate dark spots on the OLED device 11 . Therefore, the OLED device 11 can be protected by setting the OLED device 11 to include the cover layer 112 and the lithium fluoride layer 113 .
- FIG. 3 is a curve graph verifying a light emitting efficiency of an OLED panel provided by the present disclosure using optical simulation software.
- the materials of the first inorganic film layer 121 and the third inorganic film layer 124 are set to silicon nitride, and the thicknesses of the first inorganic film layer 121 and the third inorganic film layer 124 are both set to 200 nm, while the materials of the second inorganic film layer 123 and the fourth inorganic film layer 125 are set to silicon oxynitride, and the thicknesses of the second inorganic film layer 123 and the fourth inorganic film layer 125 are set to be the same.
- the OLED panel in the present disclosure shows growth curve of the light emitting efficiency of the OLED panel in this disclosure relative to which of the OLED panel (the thin film packaging structure only includes: inorganic film layer-organic film-inorganic film layer) in the prior art, with the thickness increase of the silicon oxynitride (the second inorganic film layer 123 and the fourth inorganic film layer 125 ). As shown in FIG. 3 , the OLED panel in the present disclosure can significantly improve light emitting efficiency.
- FIG. 4 is a curve graph of a light emitting efficiency of an OLED panel provided by the present disclosure in a practical experiment.
- the materials of the first inorganic film layer 121 and the third inorganic film layer 124 are set to silicon nitride
- the materials of the second inorganic film layer 123 and the fourth inorganic film layer 125 are set to silicon oxynitride
- the thicknesses of the second inorganic film layer 123 , the third inorganic film layer 124 and the fourth inorganic film layer 125 are set to 300 nm
- the thickness of the first organic film layer 122 is set to 6000 nm
- experimental data results are shown in FIG.
- the current efficiency of the OLED panel in the present disclosure is higher by about 11% (In the prior art the light flux per unit area of the OLED panel is 6 Cd/A, In the present disclosure, the light flux per unit area of the OLED panel is 6.7 Cd/A), thereby verifying that the OLED panel in the present disclosure can effectively improve the light emitting efficiency of the OLED panel.
- FIG. 5 is a schematic structural diagram of an embodiment of an OLED display provided by the present disclosure.
- the OLED display 20 includes the OLED panel 21 in any of the above embodiments.
- For a specific OLED panel 21 reference may be made to the above embodiment, and it is no longer repeated here.
- the thin film packaging structure to include multiple inorganic film layers and matching the refractive index and the thickness between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light emitting efficiency can be improved.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
- This is a continuation-application of International Application No. PCT/CN2018/087205, with an international filing date of May 17, 2018 which claims foreign priority of Chinese Patent Application No. 201810234384.1, filed on Mar. 21, 2018 in the State Intellectual Property Office of China, the contents of all of which are hereby incorporated by reference.
- The present disclosure relates to display technologies, and in particular to an OLED (Organic Light Emitting Diode) panel and its method of manufacturing, an OLED display.
- An OLED display involves a flat panel display technology with great prospect. It has characteristics of self-illumination, simple structure, ultra-lightweight, fast response, wide viewing angle, low power consumption, flexible display and so on. Currently, the OLED display is favored by major display manufacturers and becomes a third-generation display following CRT (Cathode Ray Tube) display and LCD (Liquid Crystal Display).
- Since the organic light emitting material used in the OLED panel is very sensitive to water and oxygen, the requirements for blocking water and oxygen are extremely strict. In general, a flexible film layer will be packaged on the organic light emitting material. The commonly used packaging structure is an inorganic or organic film layer. The inorganic film layer is usually dense, and its water-oxygen proof performance is good. However, during the deposition process, the stress of the film layer exists, which makes the inorganic film layer have poor bending properties and is prone to cracking and peeling. The fractured cracks are easily diffused in the inorganic film layer. The water-oxygen proof performance of the organic film layer is weak. However, it can effectively release the stress and avoid a further crack extension risk of the inorganic film layer. Therefore, at present, the OLED panel adopts a structure in which an inorganic film layer and an organic film layer overlap each other. The high water-oxygen proof capability of the inorganic film layer and the stress release of the organic film layer are complementary, and can be used to better meet the service life of the OLED panel.
- The inventor of the present disclosure discovered in a long-term study that the current OLED panel uses a packaging structure of inorganic film layer-organic film layer-inorganic film layer, which has poor performance in blocking external water and oxygen, and the packaging structure of the OLED panel has a great influence on the light emitting efficiency of the OLED panel.
- The technical problem solved by the present disclosure is to provide an OLED panel and its method of manufacturing, an OLED display, which can increase the light emitting efficiency of the OLED panel while effectively blocking the external water and oxygen.
- In order to solve the technical problem mentioned above, the present disclosure provides an method of manufacturing an OLED panel, including: preparing an OLED device including an organic light emitting layer; and forming a thin film packaging structure on the OLED device to cover the organic light emitting layer; wherein the forming the thin film packaging structure on the OLED device to cover the organic light emitting layer includes: forming a first inorganic film layer on the OLED device; forming a first organic film layer on a side of the first inorganic film layer far away from the OLED device: and a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; forming a second inorganic film layer on the first organic film layer; forming a third inorganic film layer on the second inorganic film layer; and forming a fourth inorganic film layer on the third inorganic film layer; 410 a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a refractive index of the third inorganic film layer.
- In order to solve the technical problem mentioned above, the present disclosure provides an OLED panel, including: an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer; the thin film packaging structure includes a first inorganic film layer formed on the OLED device; a first organic film layer formed on a side of the first inorganic film layer far away from the OLED device; a second inorganic film layer formed on the first organic film layer; a third inorganic film layer formed on the second inorganic film layer; a fourth inorganic film layer formed on the third inorganic film layer; a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a refractive index of the third inorganic film layer.
- In order to solve the technical problem mentioned above, the present disclosure provides an OLED display including an OLED display panel. The OLED display panel includes an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer; the thin film packaging structure includes a first inorganic film layer formed on the OLED device; a first organic film layer formed on a side of the first inorganic film layer far away from the OLED device; a second inorganic film layer formed on the first organic film layer; a third inorganic film layer formed on the second inorganic film layer; a fourth inorganic film layer formed on the third inorganic film layer; a refractive index of the first inorganic film layer is greater than a refractive index of the first organic film layer; a refractive index of the second inorganic film layer and a refractive index of the fourth inorganic film layer are both smaller than a refractive index of the third inorganic film layer.
- The benefit effects of the present disclosure are: different from the prior art, the OLED panel of the present disclosure including: an OLED device including an organic light emitting layer; a thin film packaging structure, formed on the OLED device and covering the organic light emitting layer, wherein the thin film packaging structure includes a first inorganic film layer, a first organic film layer, a second inorganic film layer, a third inorganic film layer and a fourth inorganic film layer set in sequence. The refractive index of the first inorganic film layer is greater than that of the first organic film layer, and the refractive index of the second inorganic film layer and the refractive index of the fourth inorganic film layer are both smaller than that of the third inorganic film layer. By setting the thin film packaging structure to include multiple inorganic film layers and matching the refractive index between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light emitting efficiency can be improved, and the loss of the light emitting efficiency caused by the thin film packaging structure can be reduced.
- In order to more clearly describe the technical solutions in the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings may also be obtained based on these drawings without any creative work.
-
FIG. 1 is a schematic structural diagram of an embodiment of an OLED panel provided by the present disclosure. -
FIG. 2 is a schematic structural diagram of another embodiment of an OLED panel provided by the present disclosure. -
FIG. 3 is a curse graph verifying a light emitting efficiency of an OLED panel provided by the present disclosure using optical simulation software. -
FIG. 4 is a curve graph of a light emitting efficiency of an OLED panel provided by the present disclosure in a practical experiment. -
FIG. 5 is a schematic structural diagram of an embodiment of an OLED display provided by the present disclosure. - The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. It is to be understood that the specific embodiments described herein are only used to explain the present disclosure and are not intended to limit the present disclosure. It should also be noted that for ease of description, only some but not all of the structures related to the present disclosure are shown in the drawings. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without making creative efforts shall fall within the protection scope of the present disclosure.
- Referring to
FIG. 1 ,FIG. 1 is a schematic structural diagram of an embodiment of an OLED panel provided by the present disclosure. The OLED panel includes anOLED device 11 and a thinfilm packaging structure 12. - The
OLED device 11 includes an organiclight emitting layer 111. Optionally, the organiclight emitting layer 111 includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel. - It can be understood that the
OLED device 11 may further include a substrate, an anode layer, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, a cathode layer, and other layers well known to those skilled in the art. We will not repeat here. - The thin
film packaging structure 12 is formed on theOLED device 11 and covers the organiclight emitting layer 111. The thinfilm packaging structure 12 includes a firstinorganic film layer 121, a firstorganic film layer 122, secondinorganic film layer 123, a thirdinorganic film layer 124, and a fourthinorganic film layer 125. - Specifically, the first
inorganic film layer 121 is formedOLED device 11. The firstorganic film layer 122 is formed on a side of the firstinorganic film layer 121 far away from theOLED device 11. The secondinorganic film layer 123 is formed on the firstorganic film layer 121. The thirdinorganic film layer 124 is formed on the secondinorganic film layer 123, and the fourthinorganic film layer 125 is formed on the thirdinorganic film layer 124, that is, the firstinorganic film layer 121, the firstorganic film layer 122, the secondinorganic film layer 123, the thirdinorganic film layer 124 and the fourthinorganic film layer 125 are sequentially disposed. - Compared with the thin film packaging structure in the prior art only including the inorganic film layer, the organic film layer and the inorganic film layer, the thin film packaging structure in the present embodiment includes four inorganic film layers, which can improve the water and oxygen resistance of the OLED panel.
- Meanwhile, in the present embodiment, the refractive index of the first
inorganic film layer 121 is greater than that of the firstorganic film layer 122, and the refractive index of the secondinorganic film layer 123 and the refractive index of the fourthinorganic film layer 125 are both smaller than that of the thirdinorganic film layer 124. - Specifically, light will pass through the first
inorganic film layer 121, the firstorganic film layer 122, the secondinorganic film layer 123, the thirdinorganic film layer 124, and the fourthinorganic film layer 125 in sequence. When the light passes through the firstinorganic film layer 121 and enters the firstorganic film layer 122 with a lower refractive index, the firstorganic film layer 122 plays expansion effect on light. Further, the light continues to be expanded after entering the secondinorganic film layer 123, and the secondinorganic film layer 123 can cover more light paths. Then the light that has been expanded enters thethird film layer 124 with a relatively high refractive index. Because the refractive index of the thirdinorganic film layer 124 is greater than that of the fourthinorganic film layer 125, some light may be reflected. The reflected light is continuously reflected and amplified by the secondinorganic film layer 123 and the firstinorganic film layer 121, generating a resonance effect, thereby improving light emitting efficiency. - In the OLED panel of the above embodiment, by setting a multilayer inorganic film layer and matching the refractive index between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light output rate can be improved, and the loss of the light emitting efficiency caused by the film packaging structure can be reduced.
- Optionally, in one application scene, the difference between the refractive index of the first
inorganic film layer 121 and the refractive index of the firstorganic film layer 122 is 0.1-0.3, that is, the refractive index of the firstinorganic film layer 121 is greater than the refractive index of the firstorganic film layer 122, the difference range is 0.1-0.3. - Optionally, in one application scene, the first
inorganic film layer 121 has a refractive index of 1.8-2.3, the firstorganic film layer 122 has a refractive index of 1.6-2.0, the secondinorganic film layer 123 has a refractive index of 1.4-1.7, the thirdinorganic film layer 124 has a refractive index of 1.8-2.3, and the fourthinorganic film layer 125 has a refractive index of 1.4-1.7. Therefore, the light emitting efficiency of the OLED device is improved by setting a certain refractive index of each film layer. - Optionally, in one application scene, the first
inorganic film layer 121 has a thickness of 100-300 nm, the firstorganic film layer 122 has a thickness of 3000-8000 nm, the secondinorganic film layer 123 has a thickness of 50-1000 nm, the thirdinorganic film layer 124 has a thickness of 10-300 nm, and the fourthinorganic film layer 125 has a thickness of 50-1000 nm. Therefore, the light emitting efficiency of the OLED device is improved by setting a certain thickness of each film layer, when ensuring that the thinfilm packaging structure 12 has the minimum thickness. - Optionally, in one application scene, the material of the first
inorganic film layer 121 and the material of the thirdinorganic film layer 124 are the same or different, and each of the material of the firstinorganic film layer 121 and the material of the thirdinorganic film layer 124 is at least one of titanium dioxide, silicon nitride, silicon oxide and zirconium oxide. That is, the refractive index of the firstinorganic film layer 121 and the refractive index of the thirdinorganic film layer 124 are controlled by choosing material of the firstinorganic film layer 121 and material of the thirdinorganic film layer 124. - Optionally, in one application scene, the material of the second
inorganic film layer 123 and the material of the fourthinorganic film layer 125 are the same or different, and each of the material of the secondinorganic film layer 123 and the material of the fourthinorganic film layer 125 is at least one of silicon oxynitride and aluminum oxide, that is, the refractive index of the secondinorganic film layer 123 and the refractive index of the fourthinorganic film layer 125 are controlled by choosing the material of the secondinorganic film layer 123 and the material of the fourthinorganic film layer 125. - Optionally, in an application scene, the first
inorganic film layer 121, the secondinorganic film layer 123, the thirdinorganic film layer 124 and the fourthinorganic film layer 125 are prepared by plasma enhanced chemical vapor deposition (PECVD), pulsed laser deposition (PLD), or sputtering (Sputter). - Optionally, in one application scenario, the first
organic film layer 122 is prepared by plasma enhanced chemical vapor deposition (PECVD), inkjet printing (IJP), or coating. - Referring to
FIG. 2 ,FIG. 2 is a schematic structural diagram of another embodiment of an OLED panel provided by the present disclosure. Different from the embodiment ofFIG. 1 , in the present embodiment, theOLED device 11 further includes: acover layer 112 and alithium fluoride layer 113. - The
cover layer 112 is formed on the organiclight emitting layer 111, thelithium fluoride layer 113 is formed on thecover layer 112, and the firstinorganic film layer 121 is formed on thelithium fluoride layer 113. - Optionally the cover layer is made of an organic material. When the thin
film package structure 12 is formed on theOLED device 11, it is possible to generate dark spots on theOLED device 11. Therefore, theOLED device 11 can be protected by setting theOLED device 11 to include thecover layer 112 and thelithium fluoride layer 113. - Referring to
FIG. 3 ,FIG. 3 is a curve graph verifying a light emitting efficiency of an OLED panel provided by the present disclosure using optical simulation software. - In the simulation test, the materials of the first
inorganic film layer 121 and the thirdinorganic film layer 124 are set to silicon nitride, and the thicknesses of the firstinorganic film layer 121 and the thirdinorganic film layer 124 are both set to 200 nm, while the materials of the secondinorganic film layer 123 and the fourthinorganic film layer 125 are set to silicon oxynitride, and the thicknesses of the secondinorganic film layer 123 and the fourthinorganic film layer 125 are set to be the same.FIG. 3 shows growth curve of the light emitting efficiency of the OLED panel in this disclosure relative to which of the OLED panel (the thin film packaging structure only includes: inorganic film layer-organic film-inorganic film layer) in the prior art, with the thickness increase of the silicon oxynitride (the secondinorganic film layer 123 and the fourth inorganic film layer 125). As shown inFIG. 3 , the OLED panel in the present disclosure can significantly improve light emitting efficiency. - Referring to
FIG. 4 ,FIG. 4 is a curve graph of a light emitting efficiency of an OLED panel provided by the present disclosure in a practical experiment. - In this experiment, the materials of the first
inorganic film layer 121 and the thirdinorganic film layer 124 are set to silicon nitride, and the materials of the secondinorganic film layer 123 and the fourthinorganic film layer 125 are set to silicon oxynitride, and the thicknesses of the secondinorganic film layer 123, the thirdinorganic film layer 124 and the fourthinorganic film layer 125 are set to 300 nm, the thickness of the firstorganic film layer 122 is set to 6000 nm, and experimental data results are shown inFIG. 4 , when the thickness of the firstinorganic film layer 121 is 900 nm and the brightness is 500 cd/mm2, the current efficiency of the OLED panel in the present disclosure is higher by about 11% (In the prior art the light flux per unit area of the OLED panel is 6 Cd/A, In the present disclosure, the light flux per unit area of the OLED panel is 6.7 Cd/A), thereby verifying that the OLED panel in the present disclosure can effectively improve the light emitting efficiency of the OLED panel. - Referring to
FIG. 5 ,FIG. 5 is a schematic structural diagram of an embodiment of an OLED display provided by the present disclosure. TheOLED display 20 includes theOLED panel 21 in any of the above embodiments. For aspecific OLED panel 21, reference may be made to the above embodiment, and it is no longer repeated here. - In summary, different from the prior art, by setting the thin film packaging structure to include multiple inorganic film layers and matching the refractive index and the thickness between the respective film layers, while ensuring the water and oxygen resistance of the OLED panel, the light emitting efficiency can be improved.
- The foregoing descriptions are merely implementation manners of the present disclosure, and therefore do not limit the scope of patents of the present disclosure. Any equivalent structure or equivalent process transformation using the description of the present disclosure and the accompanying drawings may be directly or indirectly applied to other related technologies. The same applies in the field of patent protection of this disclosure.
Claims (19)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810234384 | 2018-03-21 | ||
CN201810234384.1 | 2018-03-21 | ||
CN201810234384.1A CN108511614B (en) | 2018-03-21 | 2018-03-21 | OLED panel and OLED display |
PCT/CN2018/087205 WO2019178927A1 (en) | 2018-03-21 | 2018-05-17 | Oled panel and oled display |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/087205 Continuation WO2019178927A1 (en) | 2018-03-21 | 2018-05-17 | Oled panel and oled display |
Publications (2)
Publication Number | Publication Date |
---|---|
US10418598B1 US10418598B1 (en) | 2019-09-17 |
US20190296268A1 true US20190296268A1 (en) | 2019-09-26 |
Family
ID=63377689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/102,768 Active US10418598B1 (en) | 2018-03-21 | 2018-08-14 | OLED panel and its method of manufacturing, OLED display |
Country Status (3)
Country | Link |
---|---|
US (1) | US10418598B1 (en) |
CN (1) | CN108511614B (en) |
WO (1) | WO2019178927A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220085333A1 (en) * | 2019-11-14 | 2022-03-17 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Package structure, display panel and display device |
US11355730B2 (en) | 2019-05-28 | 2022-06-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Light emitting panel and display device |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112310301B (en) * | 2019-07-30 | 2022-07-29 | 江苏三月科技股份有限公司 | Organic electroluminescent device, preparation method thereof and prepared display device |
CN111063825A (en) * | 2019-12-09 | 2020-04-24 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED packaging structure, manufacturing method thereof and display device |
KR20210091866A (en) * | 2020-01-14 | 2021-07-23 | 삼성디스플레이 주식회사 | Display device |
CN111584744A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
CN111697160B (en) * | 2020-06-22 | 2022-11-29 | 云谷(固安)科技有限公司 | Display panel and display device |
CN112038501B (en) * | 2020-09-08 | 2021-08-10 | 长春海谱润斯科技股份有限公司 | Top-emitting organic electroluminescent device |
CN112581868B (en) * | 2020-12-09 | 2021-11-02 | 惠州市华星光电技术有限公司 | Flexible display panel and preparation method thereof |
KR20220082982A (en) * | 2020-12-10 | 2022-06-20 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
CN113036054B (en) * | 2021-03-02 | 2024-04-05 | 京东方科技集团股份有限公司 | OLED display substrate, manufacturing method thereof and display device |
CN113809265B (en) * | 2021-08-30 | 2024-02-06 | 武汉天马微电子有限公司 | Display panel and display device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150001483A1 (en) * | 2013-06-27 | 2015-01-01 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US20150137131A1 (en) * | 2013-11-15 | 2015-05-21 | Samsung Display Co., Ltd. | Flexible display apparatus and a manufacturing method thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007280901A (en) * | 2006-04-12 | 2007-10-25 | Hitachi Displays Ltd | Organic el display device |
KR101903054B1 (en) * | 2012-07-11 | 2018-10-02 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and the method for manufacturing the same |
KR20140033867A (en) * | 2012-09-11 | 2014-03-19 | 엘지디스플레이 주식회사 | Organic light emitting display panel |
WO2015172847A1 (en) * | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | Barrier layer stack, method for manufacturing a barrier layer stack, and ultra-high barrier layer and antireflection system |
KR20160036722A (en) * | 2014-09-25 | 2016-04-05 | 삼성디스플레이 주식회사 | organic light emitting diode display and manufacturing method thereof |
CN104900812A (en) * | 2015-04-23 | 2015-09-09 | 京东方科技集团股份有限公司 | Film packaging structure, manufacture method thereof and display device |
KR101943689B1 (en) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | Organic light emmiting diode display apparatus |
JP2017147191A (en) * | 2016-02-19 | 2017-08-24 | 株式会社ジャパンディスプレイ | Display device and method of manufacturing the same |
CN106684256A (en) * | 2016-12-23 | 2017-05-17 | 上海天马有机发光显示技术有限公司 | Display panel and fabrication method thereof |
CN106711347A (en) * | 2016-12-28 | 2017-05-24 | 武汉华星光电技术有限公司 | OLED device and substrate thereof |
-
2018
- 2018-03-21 CN CN201810234384.1A patent/CN108511614B/en active Active
- 2018-05-17 WO PCT/CN2018/087205 patent/WO2019178927A1/en active Application Filing
- 2018-08-14 US US16/102,768 patent/US10418598B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150001483A1 (en) * | 2013-06-27 | 2015-01-01 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US20150137131A1 (en) * | 2013-11-15 | 2015-05-21 | Samsung Display Co., Ltd. | Flexible display apparatus and a manufacturing method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11355730B2 (en) | 2019-05-28 | 2022-06-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Light emitting panel and display device |
US20220085333A1 (en) * | 2019-11-14 | 2022-03-17 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Package structure, display panel and display device |
Also Published As
Publication number | Publication date |
---|---|
CN108511614A (en) | 2018-09-07 |
WO2019178927A1 (en) | 2019-09-26 |
US10418598B1 (en) | 2019-09-17 |
CN108511614B (en) | 2020-02-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10418598B1 (en) | OLED panel and its method of manufacturing, OLED display | |
US10818876B2 (en) | Organic light-emitting diode (OLED) display panel and manufacturing method thereof | |
CN104037357B (en) | A kind of organic light-emitting display device and manufacture method thereof | |
US9472780B2 (en) | Organic electroluminescent display device and display apparatus | |
US8841836B2 (en) | Flat panel display device, organic light emitting display device and method of manufacturing flat panel display device | |
TWI287942B (en) | Light emitting device | |
WO2018072283A1 (en) | Oled display device and method for manufacturing same | |
US10199438B2 (en) | Top-emitting organic electroluminescent display panel, manufacturing method thereof and display device | |
WO2016033885A1 (en) | Organic light-emitting diode display panel, manufacturing method therefor, and display apparatus | |
US10361401B2 (en) | Organic electroluminescent display device and display apparatus | |
WO2019242114A1 (en) | Display panel and manufacturing method therefor | |
US9780333B1 (en) | Organic light-emitting diode element and display device | |
EP3261148B1 (en) | Bottom emitting organic light-emitting device, manufacturing method and display apparatus thereof | |
TW200535262A (en) | Method and apparatus of depositing low temperature inorganic films on plastic substrates | |
US11196021B2 (en) | Composite film layer, having alternately-stacked sub-film layers with different refractive indexes | |
WO2018113007A1 (en) | Oled encapsulation method and oled encapsulation structure | |
CN109065599A (en) | A kind of display panel and preparation method thereof and display device | |
CN108666438A (en) | Display panel and display device | |
US20190326552A1 (en) | Organic light-emitting diode package, display panel and method for manufacturing the same | |
WO2017117906A1 (en) | Optical waveguide, method for manufacturing optical waveguide, display substrate and display device | |
CN109360888A (en) | The flexible substrates and preparation method thereof of flexible OLED display panel | |
WO2015089999A1 (en) | Organic light-emitting diode and display device | |
US20210175301A1 (en) | Display panel and manufacturing method thereof | |
US20220407035A1 (en) | Encapsulation structure, encapsulation method, electroluminescent device, and display device | |
WO2022077774A1 (en) | Display panel and fabrication method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DIS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NI, JING;HSU, HSIANG-LUN;REEL/FRAME:046779/0831 Effective date: 20180615 |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |