US20190273124A1 - Flexible display panel - Google Patents
Flexible display panel Download PDFInfo
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- US20190273124A1 US20190273124A1 US15/992,372 US201815992372A US2019273124A1 US 20190273124 A1 US20190273124 A1 US 20190273124A1 US 201815992372 A US201815992372 A US 201815992372A US 2019273124 A1 US2019273124 A1 US 2019273124A1
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- layer
- wiring layers
- display panel
- touch
- flexible substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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- H01L27/3279—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- H01L27/323—
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- H01L51/0097—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/341—Short-circuit prevention
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present disclosure relates to the technical field of display technologies, and particularly, relates to a flexible display panel.
- the present disclosure provides a flexible display panel, which can reduce risk of the metal wiring being broken.
- the present disclosure provides a flexible display panel.
- the flexible display panel has a display area, a non-display area, and a bending area arranged between the display area and the non-display area.
- the flexible display panel includes a flexible substrate, and a thin film transistor layer arranged on the flexible substrate.
- the thin film transistor layer includes a semi-conductor layer, a gate electrode insulation layer, a gate electrode layer, an insulation interlayer and a source-drain electrode metal layer sequentially stacked in a direction away from the flexible substrate.
- the flexible display panel further includes a touch layer arranged on one side of the thin film transistor layer away from the flexible substrate.
- the touch layer includes a first touch metal layer and a second touch metal layer.
- the flexible display panel further includes signal transmission lines including at least two parallel wiring layers in the bending area.
- Each of the at least two parallel wiring layers is fabricated in a same layer with at least two of the source-drain electrode metal layer, the first touch metal layer, and the second touch metal layer.
- the present disclosure provides a flexible display device.
- the flexible display device includes the above-mentioned flexible display panel.
- FIG. 1 illustrates a schematic diagram of a flexible display panel according to an embodiment of the present disclosure
- FIG. 2 illustrates a cross-sectional view a flexible display panel according to an embodiment of the present disclosure
- FIG. 3 illustrates a schematic diagram of a connection manner of two conductive layers according to an embodiment of the present disclosure
- FIG. 4 illustrates a schematic diagram of another connection manner of the two conductive layers according to an embodiment of the present disclosure
- FIG. 5 illustrates a schematic diagram of a wiring layer according to an embodiment of the present disclosure
- FIG. 6 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 7 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 8 illustrates a schematic diagram of hollow areas in a wiring layer according to an embodiment of the present disclosure
- FIG. 9 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.
- FIG. 10 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 11 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 12 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 13 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure
- FIG. 14 illustrates a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure
- FIG. 15 illustrates a schematic diagram of a flexible display device according to an embodiment of the present disclosure.
- FIG. 1 is a schematic diagram of a flexible display panel according to an embodiment of the present disclosure.
- the present disclosure provides a flexible display panel 100 , and the flexible display panel 100 includes a display area 2 , a non-display area 4 and a bending area 6 arranged between the display area 2 and the non-display area 4 .
- the flexible display panel 100 can be bent in the bending area 6 .
- the bending area 6 can be a non-display area that is not used to display images.
- the bending area 6 can be arranged in an IC (integrated circuit) area or a FPC (Flexible Printed Circuit, flexible circuit board) area and the like.
- the bending area 6 can also be a display area that used for example, to display time, date, and the like.
- FIG. 2 shows a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure.
- the flexible display panel 100 includes a flexible substrate 10 as well as a thin film transistor layer 12 and a touch layer 14 arranged on the flexible substrate 10 .
- the touch layer 14 is arranged on one side of the thin film transistor layer 12 away from the flexible substrate 10 .
- the flexible substrate 10 can include various suitable flexible or bendable organic materials.
- the flexible substrate 10 can include polymer resins, such as polyethersulfone (PES), polypropylene resin (PP), polyetherimide (PEI), poly (ethylene naphthalate) (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl compounds, polyimide (PI), polycarbonate (PC) and/or cellulose acetate propionate (CAP).
- PES polyethersulfone
- PP polypropylene resin
- PEI polyetherimide
- PEN poly (ethylene naphthalate)
- PET polyethylene terephthalate
- PPS polyphenylene sulfide
- PI polyimide
- PC polycarbonate
- CAP cellulose acetate propionate
- the thin film transistor layer 12 includes a semi-conductor layer 122 , a gate electrode insulation layer 123 , a gate electrode layer 124 , an insulation interlayer 125 and a source-drain electrode metal layer 126 sequentially stacked along a direction away from the flexible substrate 10 .
- the gate electrode layer 124 includes a gate electrode 124 a .
- the source-drain electrode metal layer 126 includes a source electrode 126 a and a drain electrode 126 b , and both the source electrode 126 a and the drain electrode 126 b are connected to the semi-conductor layer 122 (also referred to as active layer).
- the source electrode 126 a , the drain electrode 126 b , the gate electrode and the semi-conductor layer 122 constitute a thin film transistor.
- the thin film transistor is used to form a pixel driving circuit for driving a light-emitting element to emit light.
- the touch layer 14 can be used to realize touch function of the flexible display panel 100 .
- the touch layer 14 can include a first touch metal layer and a second touch metal layer.
- a touch electrode and a sensing electrode are arranged in the first touch metal layer and the second touch metal layer, respectively, so as to form a mutual-capacitive or self-capacitive mode.
- the flexible display panel 100 further includes signal transmission lines 20 .
- signal transmission lines 20 include at least two parallel wiring layers in the bending area 6 . That is, two, three or more wiring layers can be provided, and the wiring layers are parallel and used as signal transmission lines. By this configuration, even if crack or breaking occurs in one wiring layer, the crack will not spread to the other wiring layer, so that some wiring layers in the bending area 6 are available for signal transmission, thereby ensuring normal input and output of signals.
- each of the parallel wiring layers used as signal transmission lines 20 can be fabricated in a same layer with at least two of the source-drain electrode metal layer 126 , the first touch metal layer, and the second touch metal layer.
- the fabricating methods can include but not limited to physical deposition, vacuum evaporation and the like.
- the signal transmission lines 20 include two parallel wiring layers. That is, the two wiring layers are parallel arranged and used as signal transmission lines 20 .
- One of the wiring layers can be fabricated in a same layer with the source-drain electrode metal layer 126 , while the other wiring layer can be fabricated in a same layer with the first touch metal layer or the second touch metal layer.
- All of the source-drain electrode metal layer 126 , the first touch metal layer and the second touch metal layer have a three-layered structure of T i A l T i . Since an intermediate metal layer A l is a relatively soft material that has higher flexibility, the source-drain electrode metal layer 126 , the first touch metal layer or the second touch metal layer have better bending-resistance property, thus lowering the risk of breaking of the wiring layers.
- FIG. 3 is a schematic diagram of a connection manner of the wiring layers.
- FIG. 3 illustrates signal transmission lines 20 including two parallel wiring layers 202 , but it is not limited to two layers.
- the two wiring layers 202 are connected through a through-hole in the bending area 6 , and the through-hole can be configured to be a hole having a diameter of 2 ⁇ m ⁇ 8 ⁇ m.
- the insulation layer 120 between the two wiring layers 202 is discontinuous in the bending area 6 due to the through-hole. It is unfavorable to an electrical connection of the two wiring layers, if the through-hole is too small. If the through-hole is too large, it is necessary to widen the wires at the through-hole, which is unfavorable to a wiring design of high-solution Moreover, this would also reduce the distance between adjacent wiring layers, thereby causing short-circuit of the adjacent wiring layers, which is disadvantageous to signal transmission.
- the wiring layers 202 can be connected at the through-hole in the bending area 6 .
- the number of the through-hole can be chosen according to the area of the bending area 6 .
- the number of the through-hole can be one or more. In this way, in the bending area 6 that frequently bent and has highest risk of wire breaking, even if one of the wiring layers 202 is broken at a certain part (for example, section A), other parts of the wiring layers 202 (for example, section B) can still form a parallel structure with the other wiring layer 202 , thus reducing the influence of partially broken parts on the whole wiring layers 202 .
- the two wiring layers 202 are separated by the medium layer 120 .
- the medium layer 120 is an insulation layer.
- a portion of the medium layer 120 can be photo-etched through exposure and the like, so as to form the through-hole in the medium layer 120 for connecting the two wiring layers 202 .
- the medium layer 120 can be an inorganic layer or an organic layer.
- the photo-etched medium layer 120 can form a smaller angle, for example smaller than 50°, at the through-hole. Smaller angle allows more convenient arrangement of the upper wiring layer 202 , so that a reliable bridge connection between the upper wiring layer 202 and lower wiring layer 202 can be achieved at the through-hole.
- the through-hole in the medium layer can be configured to have a slanted side wall.
- the slanted side wall has a protrusion (not shown) facing away the flexible substrate 10 such that the wiring layer 202 arranged on one side of the medium layer away from the flexible substrate 10 can be readily electrically connected to the other wiring layer 202 , avoiding a failure of electrical connection at the through-hole due to the broken circuit caused by a relatively large slope.
- the organic medium layer can be prepared thicker than the inorganic medium layer due to the better bending performance of the organic medium layer. In this way, signal interference will not occur when the adjacent wiring overlap, thus improving the reliability of signal transmission.
- FIG. 4 shows a schematic diagram of another connection manner of parallel wiring layers.
- the signal transmission lines 20 include two parallel wiring layers 202 , but not limited to two wiring layers.
- each wiring layer 202 Both ends of each wiring layer 202 are arranged outside the bending area 6 , the portion between the both ends is located in the bending area 6 .
- the two wiring layers 202 are parallel connected through through-holes at the ends, i.e., outside the bending area 6 .
- the through-holes are arranged in the non-bending area, while the medium layer 120 between the two wiring layers 202 forms a continuous connection in the bending area 6 .
- the medium layer 120 can be an organic medium layer or an inorganic medium layer, and used as an insulation layer between the two wiring layers 202 .
- the medium layer 120 In the case where the medium layer 120 is configured to be an organic medium layer, it can play a role in buffering the stress in the wiring layers 202 . Therefore, the medium layer 120 continuously distributed in the bending area 6 can exert more remarkable protective effect on the wiring layers 202 .
- the medium layer 120 is continuous, thereby simplifying manufacturing process and reducing manufacturing costs.
- the two wiring layers 202 are not bent in the non-bending area, so that the risk of wiring layers 202 being broken in the non-bending area is extremely low. Therefore, it is unnecessary to consider whether the two wiring layers 202 can form a parallel connection after being broken. According to the above analysis, the number of through-holes in the bending area can be reduced accordingly, so that the manufacturing process can be further simplified and the costs can be reduced.
- the through-holes can be arranged in the medium layer 120 in the bending area 6 such that the two wiring layers are electrically connected in the bending area, and a person skilled in the art can design as needed.
- the shape of the wiring layers 202 can be configured according to the force when being bent. According to an embodiment, referring to FIG. 5 , the wiring layers 202 include a plurality of hollow areas 202 a . In an embodiment, the hollow areas 202 a can have a shape of quadrilateral.
- the hollow areas 202 a form a grid-like structure of the wiring layers 202 .
- Each grid is surrounded by one curve line or by several bending lines, and the adjacent grids are connected through the bending lines or curve.
- each wiring layer 202 having hollow areas 202 a has two branches 202 b in parallel connection. In this case, in one hand, even if one of the branches 202 b has cracks or is broken, the signal can still be transmitted by the other branch 202 b .
- the wiring layer 202 having grid-like structure can further dodge other wirings in the same layer as this wiring layer 202 , thus improving the flexibility of wiring of the wiring layers 202 and the utilization of space.
- the wiring layers 202 including the hollow areas 202 a can also reduce bending stress of the wiring layers 202 in the bending area 6 , enhancing the bending resistance performance of the wiring layers 202 .
- the hollow areas 202 a are arranged in bending area 6 .
- the wiring layer 202 includes only one hollow area 202 a . That is, the hollow areas 202 a are sequentially arranged only in a direction perpendicular to the bending axis (direction Y in FIG. 5 ). This configuration can reduce the space occupied by each wiring layer 202 , achieving a more impact arrangement of the wiring layers 202 .
- FIG. 6 is a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.
- the two wiring layers 202 shown in FIG. 6 have a same shape, i.e., both of them include hollow areas 202 a . It should be understood that the shape of each wiring layer 202 can be different, which is not limited in the present disclosure.
- orthographic projections of the hollow areas 202 a of one wiring layer 202 on the flexible substrate 10 overlap orthographic projections of the hollow areas 202 a of the other wiring layer 202 on the flexible substrate 10 . That is, the projections of the two wiring layers 202 are not completely overlapped, but are arranged in a staggering manner in direction Y, the two wiring layers 202 are indicated by solid lines and dashed lines, respectively.
- the staggered two wiring layers 202 have different bending positions.
- positions of the angles ⁇ of one wiring layer 202 are staggered with respect to positions of the angles ⁇ of the other wiring layer 202 . Since the positions of the sharp angles are points of stress concentration, the two wiring layers 202 are subjected to different bending stresses. Thus, stress accumulation on upper and lower wiring layers 202 can be distributed, reducing the risk of the wiring layers 202 being broken.
- the two wiring layers are parallel connected, so that electric resistance of the wiring layers is effectively reduced, thereby reducing power consumption.
- FIG. 7 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.
- Orthographic projections of hollow area 202 a of one wiring layer 202 on the flexible substrate 10 do not overlap orthographic projections of hollow area 202 a of the other wiring layer 202 on the flexible substrate 10 . That is, the projections of the two wiring layers 202 are sequentially arranged in direction X, and are staggered in direction Y. The two wiring layers 202 are showed in solid lines and dashed lines, respectively.
- the staggered distributed two wiring layers 202 have different bending positions.
- the wiring layers 202 have a shape of quadrilateral, positions of the sharp angles of one wiring layer 202 are staggered with respect to positions of the sharp angles of the other wiring layer 202 . Since the positions of the sharp angles are points of stress concentration, the two wiring layers 202 are subjected to different bending stresses. Thus, the stress accumulation in the upper and lower wiring layers 202 can be distributed, thereby reducing the risk of the wiring layers 202 being broken.
- the projections of the two wiring layers 202 are sequentially arranged in the X direction, so that only one wiring layer is bent in the thickness direction, and the stress when being bent can be further distributed, thereby further improving the bendability.
- the two wiring layers are arranged in an upper-and-lower manner such that the adjacent signal transmission lines are not short-circuited when being bent, thereby improving the reliability of signal transmission.
- each of the two wiring layers 202 is configured to be one strand. In some other embodiments, each of the two wiring layers 202 can be configured to be multiple strands, the multiple strands of each wiring layers are connected in one-to-one correspondence.
- the number of through-holes for realizing bridge connections between different wiring layers 202 is not limited.
- the number of the through-holes can be chosen according to the actual structure and size of each wiring layers 202 .
- each hollow area 202 a is a quadrilateral.
- the hollow areas 202 a can also have a shape of ellipse, circle or any polygon.
- FIG. 8 illustrates a schematic diagram of hollow areas having a shape of ellipse.
- FIG. 10 is a schematic diagram of another arrangement of two wiring layer according to an embodiment of the present disclosure.
- the signal transmission line 20 in the bending area, includes two parallel wiring layers.
- the two parallel wiring layers are electrically connected through a plurality of through-holes in the extension direction of the wiring layers.
- FIG. 10 is a schematic diagram of an arrangement of double wiring layers according to another embodiment of the present disclosure.
- S l . . . S n represent the signal transmission lines 20
- one end of each signal transmission line 20 is connected to an AA area
- the other end of each signal transmission line 20 is electrically connected to a driving chip (IC) terminal. Projections of two adjacent signal transmission lines 20 in a direction perpendicular to the flexible substrate 10 are non-overlapped.
- Each signal transmission line 20 includes a first wiring portion 20 a and a second wiring portion 20 b .
- the first wiring portion 20 a is arranged in the bending area 6
- the second wiring portion 20 b is arranged in the non-bending area.
- the first wiring portion 20 a includes two parallel wiring layers 202 and 202 ′. Both of the two wiring layers 202 and 202 ′ are of a bending structure.
- the two different layers where the first wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where the second wiring portion 20 b is located.
- the first wiring portion 20 a includes two parallel wiring layers 202 and 202 ′.
- the two parallel wiring layers are electrically connected through a plurality of through-holes along the extension direction of the wiring layers, so that electric resistance of the wiring layers is effectively reduced, thereby reducing power consumption.
- the signal can still be transmitted by other portions, thereby improving reliability of signal transmission.
- the two different layers where the first wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where the second wiring portion 20 b is located. That is, in the thickness direction, when being bent, only one wiring layer is bent, so that the bending stress is effectively reduced, thereby improving the bending performance of the wiring layers.
- FIG. 11 is a schematic diagram of an arrangement of two wiring layers according to another embodiment of the present disclosure.
- Each signal transmission line 20 includes a first wiring portion 20 a and a second wiring portion 20 b .
- the first wiring portion 20 a is arranged in the bending area 6
- the second wiring portion 20 b is arranged in the non-bending area.
- the first wiring portion 20 a includes two parallel wiring layers 202 and 202 ′.
- Each wiring layer 202 or 202 ′ is of a bending structure, and the two different layers where the first wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where the second wiring portion 20 b is located.
- the projections of the wiring layers 202 and 202 ′ on the flexible substrate are located on both sides of the straight line.
- the requirements on graphic accuracy for arranging the wiring layers 202 and 202 ′ can be lowered, thereby reducing the manufacturing difficulty.
- FIG. 12 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure.
- a variant embodiment illustrated in FIG. 12 is obtained.
- positions of the through-holes 204 and positions of the angles of the wiring layers 202 and 202 ′ can be arrange in a staggered manner.
- projection of one wiring layer 202 on the flexible substrate 10 partially overlaps projection of the other wiring layer 202 ′ on the flexible substrate 10 .
- an undulation in the direction perpendicular to the flexible substrate 10 occurs on the wiring layers 202 and 202 ′, and the undulant structure can relieve the unequal bending stress in the wiring layers 202 and 202 ′ when being bent. Accordingly, risk of the wiring layers 202 and 202 ′ being broken is reduced. Besides, since the two wiring layers at the overlapping positions are arranged in different layers, interference between adjacent signals is reduced. Moreover, distance between adjacent wirings can be effectively shortened such that more signal transmission lines can be arranged in same area, which is favorable to high solution wiring designs. Furthermore, since the two wiring layers at the overlapping positions are arranged in different layers, the adjacent signal transmission lines are not short-circuited when being bent, thereby improving the reliability of signal transmission.
- FIG. 13 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure.
- positions of the through-holes 204 and positions of the angles of the wiring layers 202 and 202 ′ can be arranged in a staggered manner. Meanwhile, the positions of angles of the wiring layer 202 and the positions of angles of the wiring layer 202 ′ are arranged in the staggered manner. Based on the above embodiment, the staggered arrangement of the angles of the wiring layers 202 and 202 ′ can further alleviate the stress concentration when being bent, and the risk of the wiring layers 202 and 202 ′ being broken is further reduced.
- the two wiring layers of the first wiring portion 20 a are connected through a plurality of through-holes 204 .
- the plurality of through-holes is sequentially arranged along a symmetry axis of the two wiring layers of the first wiring portions 20 a .
- the plurality of through-holes results in that the two wiring layers of the first wiring portion 20 a form a plurality of connection positions o in an interval.
- first wiring portion 20 a is broken at one section (for example, section A),other sections (for example, section B or section C and so on) of the first wiring portion 20 a can be used as signal transmission line 20 to transmit signals due to the presence of the through-holes 204 , thereby improving the bending resistance performance of the signal transmission lines 20 and the reliability of signal transmission.
- the first wiring portions 20 a in the case where the first wiring portions 20 a are configured to have a same length, the first wiring portions 20 a having a bending structure can occupy smaller space, allowing optimization of the arrangement of the wiring layers 202 .
- projections of the two wiring layers 202 and 202 ′ in the direction perpendicular to the flexible substrate 10 form a shape of quadrilateral, circle or ellipse.
- the number of through-holes 204 are not limited to the cases shown above.
- the number of the through-holes 204 can be reduced, and those skilled in the art adjust according to their needs.
- the through-holes can not only be arranged in the bending area 6 , but also can be arranged in the non-bending area at the same time.
- one of the two wiring layers 202 and 202 ′ is connected to other parts of the signal transmission line 20 through the through-hole 204 .
- the quadrilateral projection of two wiring layers can be configured to be symmetric with respect to a first straight line, and an extension direction of the first straight line is a direction perpendicular to the bending axis (direction Y shown in FIG. 10 ).
- the quadrilateral projection of two wiring layers can also be arranged in a staggered manner in a first direction (direction Y shown in FIG. 10 ), and the first direction is a direction perpendicular to the bending axis.
- the quadrilaterals arranged in staggered manner are more beneficial to alleviating the bending stress. The reason is in that, the sharp angles of the quadrilaterals tends to form stress concentration points when being bent, while the sharp angles of the quadrilaterals are staggered to one another and thus the stress concentration points are staggered to one another by arranging the quadrilaterals in the staggered manner in the first direction.
- the plurality of signal transmission lines S l . . . S n can also include at least one of a data signal transmission line, a touch signal transmission line and a power signal line. That is, all of the data signal transmission line, the touch signal transmission line and the power signal line can include a structure of a plurality of parallel wiring layers, in order to lower the risk of each signal transmission line 20 being broken.
- the parallel wiring layers included in the data signal transmission line can also have hollow areas, and the hollow areas can have a shape of quadrilateral, circle or ellipse.
- the touch signal transmission line and the power signal line can be arranged according to the data signal transmission line, which will not be described herein.
- the power signal line can include a plurality of (more than two) parallel wiring layers, which can further reduce the electrical resistance of the power signal line.
- projections of the parallel wiring layers used as a power signal line on the flexible substrate 10 can be arranged in a non-overlapping manner as shown in FIG. 7 , and the technical effects are substantially same as those of the technical solution, which will not be described herein.
- FIG. 14 shows a cross-sectional view of a flexible display panel.
- the flexible display panel 100 provided in the present disclosure can be an inorganic light-emitting display panel. Further, an organic light-emitting element layer 16 can be included between the thin film transistor layer 12 and the touch layer 14 , and the organic light-emitting element layer 16 is used as a light source which can emit lights of different colors.
- a thin film encapsulation layer 18 can be included on one side of the organic light-emitting element layer 16 away from the flexible substrate 10 .
- the thin film encapsulation layer 18 covers the display area of the flexible display panel 100 .
- the thin film encapsulation layer 18 can encapsulate the thin film transistor layer 12 , the organic light-emitting element layer 16 and the like, so as to prevent them from water and oxygen.
- the thin film encapsulation layer 18 can include an organic encapsulation layer and an inorganic encapsulation layer.
- the number of the organic encapsulation layer or the inorganic encapsulation layer is not limited.
- the thin film encapsulation layer 18 includes an inorganic encapsulation layer 180 , an organic encapsulation layer 182 and an inorganic encapsulation layer 184 arranged in a stacked manner.
- the organic encapsulation layer 182 is arranged between the inorganic encapsulation layer 180 and the inorganic encapsulation layer 184 .
- the touch layer 14 can be arranged on one side of the thin film encapsulation layer 18 away from the flexible substrate 10 .
- At least one of the first touch metal layer and the second touch metal layer is arranged in the thin film encapsulation layer 18 .
- the first touch metal layer or the second touch metal layer can be integrated into the thin film encapsulation layer 18 without a separate touch panel, which is advantageous to make a thinner and lighter flexible display panel 100 .
- FIG. 15 shows a schematic diagram of a flexible display device 200 according to an embodiment of the present disclosure, and the flexible display device 200 includes the flexible display panel 100 described in any of the above embodiments. It should be noted that the flexible display device 200 can be mobile phone, tablet computer or wearable device, and the like.
Abstract
Description
- The present application claims priority to Chinese Patent Application No. 201810173252.2, filed on Mar. 1, 2018, the content of which is incorporated herein by reference in its entirety.
- The present disclosure relates to the technical field of display technologies, and particularly, relates to a flexible display panel.
- With the development of science and technology, portable devices have emerged as a new trend in modern society and are changing human life gradually, bringing significant changes in science and technology. Especially, flexible display panels become more and more popular among users due to its advantages of bendability, portability and wide applicability. In addition, flexible display panels bring a brand-new visual experience.
- In the related technologies, it is common that the metal wires break in the bending area of the flexible display panels, resulting in display defects.
- The present disclosure provides a flexible display panel, which can reduce risk of the metal wiring being broken.
- In a first aspect, the present disclosure provides a flexible display panel. The flexible display panel has a display area, a non-display area, and a bending area arranged between the display area and the non-display area. The flexible display panel includes a flexible substrate, and a thin film transistor layer arranged on the flexible substrate. The thin film transistor layer includes a semi-conductor layer, a gate electrode insulation layer, a gate electrode layer, an insulation interlayer and a source-drain electrode metal layer sequentially stacked in a direction away from the flexible substrate. The flexible display panel further includes a touch layer arranged on one side of the thin film transistor layer away from the flexible substrate. The touch layer includes a first touch metal layer and a second touch metal layer. The flexible display panel further includes signal transmission lines including at least two parallel wiring layers in the bending area. Each of the at least two parallel wiring layers is fabricated in a same layer with at least two of the source-drain electrode metal layer, the first touch metal layer, and the second touch metal layer.
- In a second aspect, the present disclosure provides a flexible display device. The flexible display device includes the above-mentioned flexible display panel.
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FIG. 1 illustrates a schematic diagram of a flexible display panel according to an embodiment of the present disclosure; -
FIG. 2 illustrates a cross-sectional view a flexible display panel according to an embodiment of the present disclosure; -
FIG. 3 illustrates a schematic diagram of a connection manner of two conductive layers according to an embodiment of the present disclosure; -
FIG. 4 illustrates a schematic diagram of another connection manner of the two conductive layers according to an embodiment of the present disclosure; -
FIG. 5 illustrates a schematic diagram of a wiring layer according to an embodiment of the present disclosure; -
FIG. 6 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 7 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 8 illustrates a schematic diagram of hollow areas in a wiring layer according to an embodiment of the present disclosure; -
FIG. 9 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 10 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 11 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 12 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 13 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; -
FIG. 14 illustrates a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure; -
FIG. 15 illustrates a schematic diagram of a flexible display device according to an embodiment of the present disclosure. - The accompanying drawings herein are incorporated into the description as a part of the present disclosure. The accompanying drawings illustrate the embodiments according to the present disclosure and are used to explain the principle of the present disclosure together with the description.
- The embodiments of the present disclosure are further described in details with reference to the drawings.
- It should be noted that, the expressions such as “upper”, “lower”, “left”, “right” and the like mentioned in embodiments of the present disclosure are described with reference to the placement status in the accompanying drawings, and should not be construed as limiting embodiments of the present disclosure. In addition, it should also be understood that, in the context, while referring to an element being formed “above” or “below” another element, it is possible that the element is directly formed “above” or “below” the other element, or it is also possible that the element is formed “above” or “below” the other element via an intermediate element.
-
FIG. 1 is a schematic diagram of a flexible display panel according to an embodiment of the present disclosure. - The present disclosure provides a
flexible display panel 100, and theflexible display panel 100 includes adisplay area 2, anon-display area 4 and abending area 6 arranged between thedisplay area 2 and thenon-display area 4. Theflexible display panel 100 can be bent in thebending area 6. - In an embodiment, the
bending area 6 can be a non-display area that is not used to display images. For example, thebending area 6 can be arranged in an IC (integrated circuit) area or a FPC (Flexible Printed Circuit, flexible circuit board) area and the like. Of course, in other embodiments, thebending area 6 can also be a display area that used for example, to display time, date, and the like. -
FIG. 2 shows a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure. - The
flexible display panel 100 includes aflexible substrate 10 as well as a thinfilm transistor layer 12 and atouch layer 14 arranged on theflexible substrate 10. Thetouch layer 14 is arranged on one side of the thinfilm transistor layer 12 away from theflexible substrate 10. - In the embodiments of the present disclosure, the
flexible substrate 10 can include various suitable flexible or bendable organic materials. For example, theflexible substrate 10 can include polymer resins, such as polyethersulfone (PES), polypropylene resin (PP), polyetherimide (PEI), poly (ethylene naphthalate) (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl compounds, polyimide (PI), polycarbonate (PC) and/or cellulose acetate propionate (CAP). - The thin
film transistor layer 12 includes asemi-conductor layer 122, a gateelectrode insulation layer 123, agate electrode layer 124, aninsulation interlayer 125 and a source-drain electrode metal layer 126 sequentially stacked along a direction away from theflexible substrate 10. Thegate electrode layer 124 includes agate electrode 124 a. The source-drain electrode metal layer 126 includes asource electrode 126 a and adrain electrode 126 b, and both thesource electrode 126 a and thedrain electrode 126 b are connected to the semi-conductor layer 122 (also referred to as active layer). In theflexible display panel 100, thesource electrode 126 a, thedrain electrode 126 b, the gate electrode and thesemi-conductor layer 122 constitute a thin film transistor. The thin film transistor is used to form a pixel driving circuit for driving a light-emitting element to emit light. - The
touch layer 14 can be used to realize touch function of theflexible display panel 100. Thetouch layer 14 can include a first touch metal layer and a second touch metal layer. A touch electrode and a sensing electrode are arranged in the first touch metal layer and the second touch metal layer, respectively, so as to form a mutual-capacitive or self-capacitive mode. - Referring to FIG.1, the
flexible display panel 100 further includessignal transmission lines 20. With respect to theflexible display panel 100, since thesignal transmission lines 20 are bent repeatedly, there is a high risk of line breaking in thebending area 6. For this purpose, it is proposed in the present disclosure thatsignal transmission lines 20 include at least two parallel wiring layers in thebending area 6. That is, two, three or more wiring layers can be provided, and the wiring layers are parallel and used as signal transmission lines. By this configuration, even if crack or breaking occurs in one wiring layer, the crack will not spread to the other wiring layer, so that some wiring layers in thebending area 6 are available for signal transmission, thereby ensuring normal input and output of signals. - In the
flexible display panel 100, each of the parallel wiring layers used assignal transmission lines 20 can be fabricated in a same layer with at least two of the source-drain electrode metal layer 126, the first touch metal layer, and the second touch metal layer. The fabricating methods can include but not limited to physical deposition, vacuum evaporation and the like. - In an optional embodiment, the
signal transmission lines 20 include two parallel wiring layers. That is, the two wiring layers are parallel arranged and used assignal transmission lines 20. One of the wiring layers can be fabricated in a same layer with the source-drain electrode metal layer 126, while the other wiring layer can be fabricated in a same layer with the first touch metal layer or the second touch metal layer. - All of the source-drain electrode metal layer 126, the first touch metal layer and the second touch metal layer have a three-layered structure of TiAlTi. Since an intermediate metal layer Al is a relatively soft material that has higher flexibility, the source-drain electrode metal layer 126, the first touch metal layer or the second touch metal layer have better bending-resistance property, thus lowering the risk of breaking of the wiring layers.
-
FIG. 3 is a schematic diagram of a connection manner of the wiring layers.FIG. 3 illustratessignal transmission lines 20 including two parallel wiring layers 202, but it is not limited to two layers. - The two
wiring layers 202 are connected through a through-hole in thebending area 6, and the through-hole can be configured to be a hole having a diameter of 2 μm˜8 μm. Theinsulation layer 120 between the twowiring layers 202 is discontinuous in thebending area 6 due to the through-hole. It is unfavorable to an electrical connection of the two wiring layers, if the through-hole is too small. If the through-hole is too large, it is necessary to widen the wires at the through-hole, which is unfavorable to a wiring design of high-solution Moreover, this would also reduce the distance between adjacent wiring layers, thereby causing short-circuit of the adjacent wiring layers, which is disadvantageous to signal transmission. - In the embodiment as illustrated in
FIG. 3 , due to the through-hole arranged in thebending area 6, the wiring layers 202 can be connected at the through-hole in thebending area 6. The number of the through-hole can be chosen according to the area of thebending area 6. For example, the number of the through-hole can be one or more. In this way, in thebending area 6 that frequently bent and has highest risk of wire breaking, even if one of the wiring layers 202 is broken at a certain part (for example, section A), other parts of the wiring layers 202 (for example, section B) can still form a parallel structure with theother wiring layer 202, thus reducing the influence of partially broken parts on the whole wiring layers 202. - The two
wiring layers 202 are separated by themedium layer 120. Themedium layer 120 is an insulation layer. In the manufacturing process of theflexible display panel 100, a portion of themedium layer 120 can be photo-etched through exposure and the like, so as to form the through-hole in themedium layer 120 for connecting the two wiring layers 202. - In an embodiment, the
medium layer 120 can be an inorganic layer or an organic layer. In the case where an organic film layer is used as themedium layer 120, the photo-etchedmedium layer 120 can form a smaller angle, for example smaller than 50°, at the through-hole. Smaller angle allows more convenient arrangement of theupper wiring layer 202, so that a reliable bridge connection between theupper wiring layer 202 andlower wiring layer 202 can be achieved at the through-hole. In an embodiment, the through-hole in the medium layer can be configured to have a slanted side wall. The slanted side wall has a protrusion (not shown) facing away theflexible substrate 10 such that thewiring layer 202 arranged on one side of the medium layer away from theflexible substrate 10 can be readily electrically connected to theother wiring layer 202, avoiding a failure of electrical connection at the through-hole due to the broken circuit caused by a relatively large slope. In addition, when an organic film is used as the medium layer, the organic medium layer can be prepared thicker than the inorganic medium layer due to the better bending performance of the organic medium layer. In this way, signal interference will not occur when the adjacent wiring overlap, thus improving the reliability of signal transmission. -
FIG. 4 shows a schematic diagram of another connection manner of parallel wiring layers. In the example shown inFIG. 4 , thesignal transmission lines 20 include two parallel wiring layers 202, but not limited to two wiring layers. - Both ends of each
wiring layer 202 are arranged outside the bendingarea 6, the portion between the both ends is located in thebending area 6. The twowiring layers 202 are parallel connected through through-holes at the ends, i.e., outside the bendingarea 6. In this technical solution, the through-holes are arranged in the non-bending area, while themedium layer 120 between the twowiring layers 202 forms a continuous connection in thebending area 6. - The
medium layer 120 can be an organic medium layer or an inorganic medium layer, and used as an insulation layer between the two wiring layers 202. In the case where themedium layer 120 is configured to be an organic medium layer, it can play a role in buffering the stress in the wiring layers 202. Therefore, themedium layer 120 continuously distributed in thebending area 6 can exert more remarkable protective effect on the wiring layers 202. - In another aspect, in the embodiment as illustrated in
FIG. 4 , since there is no need to provide a through-hole in themedium layer 120 in thebending area 6, themedium layer 120 is continuous, thereby simplifying manufacturing process and reducing manufacturing costs. In addition, the twowiring layers 202 are not bent in the non-bending area, so that the risk ofwiring layers 202 being broken in the non-bending area is extremely low. Therefore, it is unnecessary to consider whether the twowiring layers 202 can form a parallel connection after being broken. According to the above analysis, the number of through-holes in the bending area can be reduced accordingly, so that the manufacturing process can be further simplified and the costs can be reduced. In other embodiments, the through-holes can be arranged in themedium layer 120 in thebending area 6 such that the two wiring layers are electrically connected in the bending area, and a person skilled in the art can design as needed. - The shape of the wiring layers 202 can be configured according to the force when being bent. According to an embodiment, referring to
FIG. 5 , the wiring layers 202 include a plurality ofhollow areas 202 a. In an embodiment, thehollow areas 202 a can have a shape of quadrilateral. - The
hollow areas 202 a form a grid-like structure of the wiring layers 202. Each grid is surrounded by one curve line or by several bending lines, and the adjacent grids are connected through the bending lines or curve. It can be seen in FIG.5 that eachwiring layer 202 havinghollow areas 202 a has twobranches 202 b in parallel connection. In this case, in one hand, even if one of thebranches 202 b has cracks or is broken, the signal can still be transmitted by theother branch 202 b. In the other hand, thewiring layer 202 having grid-like structure can further dodge other wirings in the same layer as thiswiring layer 202, thus improving the flexibility of wiring of the wiring layers 202 and the utilization of space. Besides, the wiring layers 202 including thehollow areas 202 a can also reduce bending stress of the wiring layers 202 in thebending area 6, enhancing the bending resistance performance of the wiring layers 202. - In the embodiment as illustrated in
FIG. 5 , thehollow areas 202 a are arranged in bendingarea 6. In a direction parallel to a bending axis (direction X inFIG. 5 ), thewiring layer 202 includes only onehollow area 202 a. That is, thehollow areas 202 a are sequentially arranged only in a direction perpendicular to the bending axis (direction Y inFIG. 5 ). This configuration can reduce the space occupied by eachwiring layer 202, achieving a more impact arrangement of the wiring layers 202. -
FIG. 6 is a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure. - The two
wiring layers 202 shown inFIG. 6 have a same shape, i.e., both of them includehollow areas 202 a. It should be understood that the shape of eachwiring layer 202 can be different, which is not limited in the present disclosure. - In the embodiment illustrated in
FIG. 6 , orthographic projections of thehollow areas 202 a of onewiring layer 202 on theflexible substrate 10 overlap orthographic projections of thehollow areas 202 a of theother wiring layer 202 on theflexible substrate 10. That is, the projections of the twowiring layers 202 are not completely overlapped, but are arranged in a staggering manner in direction Y, the twowiring layers 202 are indicated by solid lines and dashed lines, respectively. - When the
flexible display panel 100 is bent, the staggered twowiring layers 202 have different bending positions. When the hollow areas of the wiring layers 202 have a shape of quadrilateral, positions of the angles α of onewiring layer 202 are staggered with respect to positions of the angles α of theother wiring layer 202. Since the positions of the sharp angles are points of stress concentration, the twowiring layers 202 are subjected to different bending stresses. Thus, stress accumulation on upper andlower wiring layers 202 can be distributed, reducing the risk of the wiring layers 202 being broken. Besides, in the present embodiment, the two wiring layers are parallel connected, so that electric resistance of the wiring layers is effectively reduced, thereby reducing power consumption. - FIG.7 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.
- Orthographic projections of
hollow area 202 a of onewiring layer 202 on theflexible substrate 10 do not overlap orthographic projections ofhollow area 202 a of theother wiring layer 202 on theflexible substrate 10. That is, the projections of the twowiring layers 202 are sequentially arranged in direction X, and are staggered in direction Y. The twowiring layers 202 are showed in solid lines and dashed lines, respectively. - When the
flexible display panel 100 is bent, the staggered distributed twowiring layers 202 have different bending positions. When the wiring layers 202 have a shape of quadrilateral, positions of the sharp angles of onewiring layer 202 are staggered with respect to positions of the sharp angles of theother wiring layer 202. Since the positions of the sharp angles are points of stress concentration, the twowiring layers 202 are subjected to different bending stresses. Thus, the stress accumulation in the upper andlower wiring layers 202 can be distributed, thereby reducing the risk of the wiring layers 202 being broken. Moreover, the projections of the twowiring layers 202 are sequentially arranged in the X direction, so that only one wiring layer is bent in the thickness direction, and the stress when being bent can be further distributed, thereby further improving the bendability. In addition, since the two wiring layers are arranged in an upper-and-lower manner such that the adjacent signal transmission lines are not short-circuited when being bent, thereby improving the reliability of signal transmission. - In the embodiment illustrated in
FIG. 7 , each of the twowiring layers 202 is configured to be one strand. In some other embodiments, each of the twowiring layers 202 can be configured to be multiple strands, the multiple strands of each wiring layers are connected in one-to-one correspondence. - In addition, in the above embodiments, the number of through-holes for realizing bridge connections between
different wiring layers 202 is not limited. The number of the through-holes can be chosen according to the actual structure and size of each wiring layers 202. - In the embodiments illustrated in
FIGS. 5 to 7 , the shape of eachhollow area 202 a is a quadrilateral. However, it should be understood that thehollow areas 202 a can also have a shape of ellipse, circle or any polygon. FIG.8 illustrates a schematic diagram of hollow areas having a shape of ellipse. - In order to distribute the stress accumulation, the
hollow areas 202 a having a shape of ellipse can be arranged in the staggered manner shown inFIG. 6 or inFIG. 7 , which refers toFIG. 9 and will not be described in details herein.FIG. 10 is a schematic diagram of another arrangement of two wiring layer according to an embodiment of the present disclosure. - In an embodiment, in the bending area, the
signal transmission line 20 includes two parallel wiring layers. The two parallel wiring layers are electrically connected through a plurality of through-holes in the extension direction of the wiring layers. -
FIG. 10 is a schematic diagram of an arrangement of double wiring layers according to another embodiment of the present disclosure. InFIG. 10 , Sl . . . Sn represent thesignal transmission lines 20, one end of eachsignal transmission line 20 is connected to an AA area, and the other end of eachsignal transmission line 20 is electrically connected to a driving chip (IC) terminal. Projections of two adjacentsignal transmission lines 20 in a direction perpendicular to theflexible substrate 10 are non-overlapped. - Each
signal transmission line 20 includes afirst wiring portion 20 a and asecond wiring portion 20 b. Thefirst wiring portion 20 a is arranged in thebending area 6, and thesecond wiring portion 20 b is arranged in the non-bending area. Thefirst wiring portion 20 a includes two parallel wiring layers 202 and 202′. Both of the twowiring layers first wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where thesecond wiring portion 20 b is located. The projection of onewiring layer 202 on the flexible substrate is located on the left side of the straight line, and the projection of theother wiring layer 202′ on the flexible substrate is located on the right side of the straight line. In the embodiment of the present disclosure, thefirst wiring portion 20 a includes two parallel wiring layers 202 and 202′. The two parallel wiring layers are electrically connected through a plurality of through-holes along the extension direction of the wiring layers, so that electric resistance of the wiring layers is effectively reduced, thereby reducing power consumption. Moreover, when short circuit occurs at a certain portion of the wiring layer, the signal can still be transmitted by other portions, thereby improving reliability of signal transmission. In the other hand, the two different layers where thefirst wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where thesecond wiring portion 20 b is located. That is, in the thickness direction, when being bent, only one wiring layer is bent, so that the bending stress is effectively reduced, thereby improving the bending performance of the wiring layers. -
FIG. 11 is a schematic diagram of an arrangement of two wiring layers according to another embodiment of the present disclosure. Eachsignal transmission line 20 includes afirst wiring portion 20 a and asecond wiring portion 20 b. Thefirst wiring portion 20 a is arranged in thebending area 6, and thesecond wiring portion 20 b is arranged in the non-bending area. Thefirst wiring portion 20 a includes two parallel wiring layers 202 and 202′. Eachwiring layer first wiring portion 20 a is distributed have symmetric projections on the flexible substrate with respect to a straight line where thesecond wiring portion 20 b is located. The projections of the wiring layers 202 and 202′ on the flexible substrate are located on both sides of the straight line. In the arrangement of the present embodiment, the requirements on graphic accuracy for arranging the wiring layers 202 and 202′ can be lowered, thereby reducing the manufacturing difficulty. -
FIG. 12 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure. By moving up the signal transmission lines in even-numbered rows of Sl . . . Sn shown inFIG. 10 orFIG. 11 , a variant embodiment illustrated inFIG. 12 is obtained. In the embodiment illustrated inFIG. 12 , positions of the through-holes 204 and positions of the angles of the wiring layers 202 and 202′ can be arrange in a staggered manner. In addition, projection of onewiring layer 202 on theflexible substrate 10 partially overlaps projection of theother wiring layer 202′ on theflexible substrate 10. At the overlapping position, an undulation in the direction perpendicular to theflexible substrate 10 occurs on the wiring layers 202 and 202′, and the undulant structure can relieve the unequal bending stress in the wiring layers 202 and 202′ when being bent. Accordingly, risk of the wiring layers 202 and 202′ being broken is reduced. Besides, since the two wiring layers at the overlapping positions are arranged in different layers, interference between adjacent signals is reduced. Moreover, distance between adjacent wirings can be effectively shortened such that more signal transmission lines can be arranged in same area, which is favorable to high solution wiring designs. Furthermore, since the two wiring layers at the overlapping positions are arranged in different layers, the adjacent signal transmission lines are not short-circuited when being bent, thereby improving the reliability of signal transmission. -
FIG. 13 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure. - By moving up the signal transmission lines in even-numbered row of Sl . . . Sn in FIG.12, a variant embodiment illustrated in FIG.13 is obtained. In the embodiment illustrated in FIG.13, positions of the through-
holes 204 and positions of the angles of the wiring layers 202 and 202′ can be arranged in a staggered manner. Meanwhile, the positions of angles of thewiring layer 202 and the positions of angles of thewiring layer 202′ are arranged in the staggered manner. Based on the above embodiment, the staggered arrangement of the angles of the wiring layers 202 and 202′ can further alleviate the stress concentration when being bent, and the risk of the wiring layers 202 and 202′ being broken is further reduced. - In the embodiments illustrated in
FIGS. 10 to 13 , the two wiring layers of thefirst wiring portion 20 a are connected through a plurality of through-holes 204. The plurality of through-holes is sequentially arranged along a symmetry axis of the two wiring layers of thefirst wiring portions 20 a. The plurality of through-holes results in that the two wiring layers of thefirst wiring portion 20 a form a plurality of connection positions o in an interval. By such arrangement, even if thefirst wiring portion 20 a is broken at one section (for example, section A),other sections (for example, section B or section C and so on) of thefirst wiring portion 20 a can be used assignal transmission line 20 to transmit signals due to the presence of the through-holes 204, thereby improving the bending resistance performance of thesignal transmission lines 20 and the reliability of signal transmission. - In another aspect, in the embodiments as described above, in the case where the
first wiring portions 20 a are configured to have a same length, thefirst wiring portions 20 a having a bending structure can occupy smaller space, allowing optimization of the arrangement of the wiring layers 202. - In the embodiments illustrated in FIGS.10 to 13, projections of the two
wiring layers flexible substrate 10 form a shape of quadrilateral, circle or ellipse. - It should be noted that, in the embodiments shown in
FIGS. 10 to 13 , the number of through-holes 204 are not limited to the cases shown above. For example, the number of the through-holes 204 can be reduced, and those skilled in the art adjust according to their needs. - It also should be noted that in the embodiments as described in
FIGS. 10 to 13 , the through-holes can not only be arranged in thebending area 6, but also can be arranged in the non-bending area at the same time. In the non-bending area, one of the twowiring layers signal transmission line 20 through the through-hole 204. - In an optional embodiment, the quadrilateral projection of two wiring layers can be configured to be symmetric with respect to a first straight line, and an extension direction of the first straight line is a direction perpendicular to the bending axis (direction Y shown in FIG.10).
- In another optional embodiment, the quadrilateral projection of two wiring layers can also be arranged in a staggered manner in a first direction (direction Y shown in FIG.10), and the first direction is a direction perpendicular to the bending axis. The quadrilaterals arranged in staggered manner are more beneficial to alleviating the bending stress. The reason is in that, the sharp angles of the quadrilaterals tends to form stress concentration points when being bent, while the sharp angles of the quadrilaterals are staggered to one another and thus the stress concentration points are staggered to one another by arranging the quadrilaterals in the staggered manner in the first direction.
- The plurality of signal transmission lines Sl . . . Sn can also include at least one of a data signal transmission line, a touch signal transmission line and a power signal line. That is, all of the data signal transmission line, the touch signal transmission line and the power signal line can include a structure of a plurality of parallel wiring layers, in order to lower the risk of each
signal transmission line 20 being broken. - Besides, the parallel wiring layers included in the data signal transmission line can also have hollow areas, and the hollow areas can have a shape of quadrilateral, circle or ellipse.
- The touch signal transmission line and the power signal line can be arranged according to the data signal transmission line, which will not be described herein.
- It should be noted that, the power signal line can include a plurality of (more than two) parallel wiring layers, which can further reduce the electrical resistance of the power signal line.
- In an embodiment, projections of the parallel wiring layers used as a power signal line on the
flexible substrate 10 can be arranged in a non-overlapping manner as shown in FIG.7, and the technical effects are substantially same as those of the technical solution, which will not be described herein. - FIG.14 shows a cross-sectional view of a flexible display panel.
- The
flexible display panel 100 provided in the present disclosure can be an inorganic light-emitting display panel. Further, an organic light-emittingelement layer 16 can be included between the thinfilm transistor layer 12 and thetouch layer 14, and the organic light-emittingelement layer 16 is used as a light source which can emit lights of different colors. - Further, a thin
film encapsulation layer 18 can be included on one side of the organic light-emittingelement layer 16 away from theflexible substrate 10. The thinfilm encapsulation layer 18 covers the display area of theflexible display panel 100. The thinfilm encapsulation layer 18 can encapsulate the thinfilm transistor layer 12, the organic light-emittingelement layer 16 and the like, so as to prevent them from water and oxygen. - The thin
film encapsulation layer 18 can include an organic encapsulation layer and an inorganic encapsulation layer. The number of the organic encapsulation layer or the inorganic encapsulation layer is not limited. - In an optional embodiment, the thin
film encapsulation layer 18 includes aninorganic encapsulation layer 180, anorganic encapsulation layer 182 and aninorganic encapsulation layer 184 arranged in a stacked manner. Theorganic encapsulation layer 182 is arranged between theinorganic encapsulation layer 180 and theinorganic encapsulation layer 184. - With respect to the
touch layer 14, in an embodiment, thetouch layer 14 can be arranged on one side of the thinfilm encapsulation layer 18 away from theflexible substrate 10. - In another embodiment, at least one of the first touch metal layer and the second touch metal layer is arranged in the thin
film encapsulation layer 18. In this embodiment, the first touch metal layer or the second touch metal layer can be integrated into the thinfilm encapsulation layer 18 without a separate touch panel, which is advantageous to make a thinner and lighterflexible display panel 100. - The present disclosure further provides a
flexible display device 200.FIG. 15 shows a schematic diagram of aflexible display device 200 according to an embodiment of the present disclosure, and theflexible display device 200 includes theflexible display panel 100 described in any of the above embodiments. It should be noted that theflexible display device 200 can be mobile phone, tablet computer or wearable device, and the like. - The above are merely preferred embodiments of the present disclosure, which are not used to limit the present disclosure. Those skilled in the art can make any modification or variation. Within the principles of the present disclosure, any modification, equivalent substitution, improvement shall fall into the protection scope of the present disclosure.
Claims (22)
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CN201810173252.2A CN108389869B (en) | 2018-03-01 | 2018-03-01 | Flexible display panel |
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Also Published As
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CN108389869B (en) | 2020-09-22 |
CN108389869A (en) | 2018-08-10 |
US10418437B1 (en) | 2019-09-17 |
DE102018006123A1 (en) | 2019-09-05 |
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