US20190097580A1 - Radio frequency power amplifier - Google Patents
Radio frequency power amplifier Download PDFInfo
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- US20190097580A1 US20190097580A1 US15/718,504 US201715718504A US2019097580A1 US 20190097580 A1 US20190097580 A1 US 20190097580A1 US 201715718504 A US201715718504 A US 201715718504A US 2019097580 A1 US2019097580 A1 US 2019097580A1
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- 230000005669 field effect Effects 0.000 claims abstract description 13
- 239000000969 carrier Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
- H03F1/0261—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers with control of the polarisation voltage or current, e.g. gliding Class A
- H03F1/0266—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers with control of the polarisation voltage or current, e.g. gliding Class A by using a signal derived from the input signal
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
- H03F1/303—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters using a switching device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/195—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
- H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/72—Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/18—Indexing scheme relating to amplifiers the bias of the gate of a FET being controlled by a control signal
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/225—Indexing scheme relating to amplifiers the input circuit of an amplifying stage comprising an LC-network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/391—Indexing scheme relating to amplifiers the output circuit of an amplifying stage comprising an LC-network
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/465—Power sensing
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
- H03F2203/72—Indexing scheme relating to gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
- H03F2203/7206—Indexing scheme relating to gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal the gated amplifier being switched on or off by a switch in the bias circuit of the amplifier controlling a bias voltage in the amplifier
Definitions
- This disclosure relates generally to Radio Frequency (RF) amplifiers and more particularly to high power RF amplifiers.
- RF Radio Frequency
- RF Radio Frequency
- MMIC Monolithic Microwave Integrated Circuit
- FIG. 1 the power amplifier includes a common source connected output Field Effect Transistor (FET) Q OUT having its gate fed by an input radio frequency signal (RF IN) to produce an output signal RF OUT at the drain of the Q OUT .
- FET Field Effect Transistor
- a bias circuit is provided to produce a reference current Iref which produces a predetermined fixed bias voltage at the gate of the output FET and establishes a predetermined drain current (called the quiescent drain current, Idq, the drain current drawn by the output FET when no RF input is applied to the FET that will result in the output FET producing optimum RF amplification performance when an RF input is applied to the FET).
- the amount of power dissipated in Q OUT is equal to the sum of the DC power applied to the output FET Q OUT (the product of the drain voltage V DD and drain current) and the amount of RF power applied to the output FET the Q OUT minus the amount of power produced at the output of the output FET Q OUT .
- the dissipated power being the product of the drain voltage V DD and quiescent drain current, Idq).
- the RF driven current (the drain current of FET Q OUT ) rises by 30% (130 mA) but the output power is 1 Watt for an input of 0.1 Watts
- the output FET temperature directly correlates to the FET dissipated power. Higher power dissipation causes a higher channel temperature. Higher channel temperatures can either shorten the lifetime of the output FET or can cause immediate failure of the device.
- the gate biasing circuit is provided to set the gate voltage at a predetermined level selected to produce a predetermined quiescent drain current, Idq, density (current per unit FET area) even in the absence of an applied RF input signal so that during application of the RF input signal the RF FET Q OUT will have a specific drain current density target.
- an amplifier comprising: a Field Effect Transistor (FET); a Radio Frequency (RF) power level detector circuit for producing a control signal in accordance with a power level of an RF input signal, such control signal indicating whether the power level of the input signal is within a predetermined range of power levels greater than zero; and a bias circuit, fed by the control signal, for producing a fixed bias voltage at a gate electrode of the FET to establish a predetermined quiescent current for the FET when the control signal indicates the power level of the RF input signal is within the predetermined range of power levels greater than zero and to reduce the bias voltage to reduce the predetermined quiescent current when the control signal indicates the power level of the RF input signal is below the predetermined range of power levels.
- FET Field Effect Transistor
- RF Radio Frequency
- the circuit detects when a relatively low power level input power is incident on an amplifier (such as in the case where there is the absence of an RF input signal applied to the amplifier) and pinches off the output FET to a lower power dissipation condition compared with that dissipated when the RF input signal is applied.
- the gate of the output FET When the proper high power level of input power is detected, the gate of the output FET is biased to its normal high efficiency RF setting. This protects the amplifier from a pure dissipation condition that can destroy the output FET.
- the circuit uses an RF power sensor to sense the level of the RF input power incident on the amplifier and produces a DC bias signal at the gate of the output FET. For high power levels, the circuit applies normal RF operational gate bias voltage to the output FET. If low power is incident on the amplifier, the control signal results in the circuit producing a large negative voltage on the output FET gate to pinch the output FET devices to an “off”, non-conduction condition.
- an amplifier having a RF power level detector circuit a control circuit fed by an input signal, for producing a control signal in accordance with a power level of an RF input signal, such control signal indicating whether the power level of the input signal is within a predetermined range of power levels
- the amplifier includes an amplifier section having: a field effect transistor having a gate for controlling a flow of carriers between a drain and a source of the field effect transistor; and a voltage source coupled to the drain; a reference potential connected to the source.
- the drain provides an output for the amplifier section.
- the input signal is fed to the gate.
- a bias circuit is fed by the control circuit for producing a fixed bias to the gate to establish a predetermined drain quiescent current (Idq) for the field effect transistor when the control signal indicates the power level of the RF input signal is within the predetermined range of power levels greater than zero and to reduce the bias voltage to reduce the predetermined quiescent current when the control signal indicates the power level of the RF input signal is below the predetermined range of power levels.
- Idq drain quiescent current
- the Field Effect Transistor (FET), the Radio Frequency (RF) power level detector circuit; and the bias circuit are formed on a single Monolithic Microwave Integrated Circuit (MMIC) chip.
- FET Field Effect Transistor
- RF Radio Frequency
- MMIC Monolithic Microwave Integrated Circuit
- FIG. 1 is a diagrammatical sketch of a high power amplifier according to the PRIOR ART
- FIG. 2 is an RF power amplifier circuit according to the disclosure.
- FIG. 3 is a graph showing the relationship between a control signal produced by an RF power level detector circuit used in the RF power amplifier circuit of FIG. 2 and RF signal input power of an RF input signal fed to the RF power amplifier of FIG. 1 .
- an amplifier circuit 10 is shown to include: an RF power level detector circuit 12 ; a control circuit 14 ; a bias circuit 16 ; and an RF amplifier 18 , arranged as shown, all formed on Monolithic Microwave Integrated Circuit (MMIC) chip 11 .
- MMIC Monolithic Microwave Integrated Circuit
- the power amplifier 18 includes an output, depletion mode transistor Field Effect Transistor (FET) Q 1 having a gate (G) for controlling a flow of carriers between a source (S) of the FET Q 1 and the drain (D) of the FET Q 1 .
- the bias circuit 16 is coupled to the gate (G) through an inductor L 1 , as shown.
- a voltage source +V DD is connected to the drain (D) though an inductor L 2 , as shown.
- the source (S) is connected to a reference potential, here ground, (sometimes referred to as a common source connected FET).
- the drain (D) provides an output RF OUT for the amplifier 18 through capacitor C 1 , as shown.
- An input signal RF IN is fed to the gate electrode through a capacitor C 2 , as shown.
- the RF power level detector circuit 12 includes a plurality of serially connected diodes Da-Dd connected between RF IN and a terminal 20 through a de blocking capacitor Ca, as shown.
- the terminal 20 is connected to: a voltage source ⁇ VEE, here, for example ⁇ 5V volts relative to reference potential, here ground, through a resistor Ra; to the reference potential through a capacitor Cb; and to an output mode, or terminal, 22 , through a resistor Rb, as shown.
- the RF power level detector circuit 12 produces a control signal at terminal 22 in accordance with a power level of an RF input signal fed to the input RF IN .
- the control signal indicates whether the power level of the input signal is within a predetermined range of power levels greater than zero.
- the control signal (voltage) at terminal 22 is ⁇ VEE in the absence of an RF signal being applied to terminal RF IN (the RF input signal power level is zero) and the control signal at terminal 22 is more positive than ⁇ VEE over the predetermined range of power levels ranging from power level P 1 (established by the number of serially connected diodes) to a greater power level P 2 where P 1 is greater than zero; that is, when the input RF is present.
- the range between P 1 and P 2 is selected to prevent the power dissipation within the FET Q 1 , even in the absence of an RF input signal, from being no higher than the power dissipated under full RF drive, where the power dissipated under full RF drive is equal to the sum of the DC power applied to the output FET Q 1 (the product of the drain voltage V DD and drain current) and the amount of RF power applied to the output FET Q 1 minus the amount of power produced at the output of the output FET Q 1 .
- the control circuit 14 ( FIG. 2 ) includes: a voltage level shifting section 14 a comprising: a depletion mode FET Q 5 configured as a current source and a depletion mode FET Q 6 configured as a switch connected between +V DD and ground, for shifting the voltages input level swing at terminal 22 from between ⁇ VEE and a voltage above ground (as discussed in connection with FIG.
- a voltage inverter section 14 b comprising: a depletion mode FET Q 7 configured as a current source; a depletion mode FET Q 8 configured as a switch and a plurality of diodes, here for example three diodes in D 1 - 3 , serially connected between V DD and ground, as shown, to invert the voltage signal at terminal 23 and produce such inverted voltage swing at terminal 24 ; and a switch section 14 c , comprising a depletion mode FET (Q 9 ) connected between V DD and the bias circuit 16 , as shown.
- the control circuit 14 When the switch 14 c is closed, as when the control signal at terminal 22 indicates the power level of the RF input at terminal RF IN is greater than the predetermined power level (that the RF input signal is present), the control circuit 14 allows the bias circuit 16 to operate normally and produce a predetermined gate bias voltage for the amplifier 18 to that a predetermined quiescent drain current, I dq , passes from +V DD to the drain (D) of FET Q 1 ; and, on the other hand, when the switch 14 c is open, as when the control signal at terminal 22 indicates the power level of the RF input at terminal RF IN is at or below the predetermined power level (the RF input signal is absent), the control circuit 14 transistor Q 9 becomes non-conducting.
- the bias circuit 16 comprises: a current mirror having: a current source I ref , and biasing circuitry (depletion mode transistors Q 2 , Q 3 , and Q 4 and diodes Dn) arranged as shown, coupled to the current source I ref , and between the potential more positive than the reference potential (+V DD ) and a potential more negative than the reference potential; coupled to a potential more negative than the reference potential ( ⁇ V SS ).
- biasing circuitry depletion mode transistors Q 2 , Q 3 , and Q 4 and diodes Dn
- the diodes Dn is a series of a plurality n of diodes GaN diodes Dn, where n is the number of diodes in the series selected in accordance with the voltages used, here for example, V DD is 24 volts and ⁇ V SS is ⁇ 8.0 volts.
- V DD is 24 volts
- ⁇ V SS is ⁇ 8.0 volts.
- the bias circuit 16 is a depletion mode current mirror circuit for quiescent bias control of the amplifier 18 where Q 2 is a Gallium Nitride (GaN) mirror FET and Q 1 is the GaN HEMT.
- the reference current source Iref fed to FET Q 2 controls the quiescent current I dq for FET Q 1 .
- the current source I ref may be a saturated resistor as described in U.S. Pat. No. 8,854,140 or a linear resistor, transistor or from an off chip reference if needed.
- RF power level detector circuit 12 produces a control signal at terminal 22 in accordance with a power level of an RF input signal applied to the power amplifier 10 .
- the control signal indicates whether the RF input signal is being applied to the power amplifier 18 is within the predetermined range of power levels or less than the predetermined power level (in absence of such RF signal being applied to the power amplifier 10 ).
- the bias circuit 16 After passing through the control circuit 14 , the bias circuit 16 produces a predetermined gate bias voltage (Vg) at a gate of the output FET to establish a predetermined constant quiescent drain current, Idq, during a period of time when the RF input signal is indicated as being present (the power level is within the predetermined range of power levels) and applies a more negative voltage at a gate of the output FET and hence removes quiescent drain current, Idq when the control signal indicates the absence of such RF signal (the power level is less than the predetermined range of power levels).
- Vg gate bias voltage
- Idq quiescent drain current
- switch 14 c FET Q 9
- FET Q 9 when the switch 14 c (FET Q 9 ) is closed, as when the control signal at terminal 22 indicates the power level of the RF input at terminal RF IN is within the predetermined power level, FET Q 9 conducts and Iref passes to FETS Q 2 and Q 3 to produce the predetermined bias voltage at the gate of FET Q 1 establishing the predetermined quiescent drain current, I dq , for FET Q 1 ; and, on the other hand, when the control signal at terminal 22 indicates the power level of the RF input at terminal RF IN is at or below the predetermined power level (the RF input signal is absent), FET Q 9 is non-conducting and the gate (G) of FET Q 1 goes to ⁇ V SS (here ⁇ 8 volts) and pinches off FET Q 1 with the result that quiescent drain current, I dq , is removed (goes to zero).
- ⁇ V SS here ⁇ 8 volts
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Abstract
Description
- This disclosure relates generally to Radio Frequency (RF) amplifiers and more particularly to high power RF amplifiers.
- As is known in the art, many radar systems use Radio Frequency (RF), Monolithic Microwave Integrated Circuit (MMIC) Power Amplifiers. One such amplifier is shown in
FIG. 1 . Here, the power amplifier includes a common source connected output Field Effect Transistor (FET) QOUT having its gate fed by an input radio frequency signal (RF IN) to produce an output signal RF OUT at the drain of the QOUT. A bias circuit is provided to produce a reference current Iref which produces a predetermined fixed bias voltage at the gate of the output FET and establishes a predetermined drain current (called the quiescent drain current, Idq, the drain current drawn by the output FET when no RF input is applied to the FET that will result in the output FET producing optimum RF amplification performance when an RF input is applied to the FET). - As is also known, the amount of power dissipated in QOUT is equal to the sum of the DC power applied to the output FET QOUT (the product of the drain voltage VDD and drain current) and the amount of RF power applied to the output FET the QOUT minus the amount of power produced at the output of the output FET QOUT. Thus, even in the absence of RF input signal, there is power dissipated by the output FET (the dissipated power being the product of the drain voltage VDD and quiescent drain current, Idq). For example, for a 1 mm MMIC output FET device biased at Idq=100 mA/mm and with a drain voltage of 20 Volts, the amplifier will dissipate: 1*(0.1)*20=2 Watts. When RF input signal is fully applied, an increase in current QOUT will take place at the same time that output power is delivered out of the circuit. In most cases, this means that there will be a decrease in dissipated power in the output FET QOUT. For example, if the RF driven current (the drain current of FET QOUT) rises by 30% (130 mA) but the output power is 1 Watt for an input of 0.1 Watts, the resulting dissipation in the amplifier will be 0.13 A*20V (DC input power)+0.1 Watt (RF Input Power)−1 Watt (Output Power)=1.7 Watts. The output FET temperature directly correlates to the FET dissipated power. Higher power dissipation causes a higher channel temperature. Higher channel temperatures can either shorten the lifetime of the output FET or can cause immediate failure of the device.
- As is also known, in MMIC FET power amplifiers, it is undesirable to turn the drain “on” (conducting) for any appreciable time before applying an RF Input signal as the efficiency of the amplifier is zero for that period of time and the dissipated power on the RF FETs is relatively high. Thus, the gate biasing circuit is provided to set the gate voltage at a predetermined level selected to produce a predetermined quiescent drain current, Idq, density (current per unit FET area) even in the absence of an applied RF input signal so that during application of the RF input signal the RF FET QOUT will have a specific drain current density target.
- In accordance with the present disclosure, an amplifier, comprising: a Field Effect Transistor (FET); a Radio Frequency (RF) power level detector circuit for producing a control signal in accordance with a power level of an RF input signal, such control signal indicating whether the power level of the input signal is within a predetermined range of power levels greater than zero; and a bias circuit, fed by the control signal, for producing a fixed bias voltage at a gate electrode of the FET to establish a predetermined quiescent current for the FET when the control signal indicates the power level of the RF input signal is within the predetermined range of power levels greater than zero and to reduce the bias voltage to reduce the predetermined quiescent current when the control signal indicates the power level of the RF input signal is below the predetermined range of power levels.
- With such an arrangement, in the absence of the RF input signal (that is, when the input signal has a power level less than the predetermined power level) the power dissipation in the output FET is zero. When RF input signal is applied to the amplifier, the gate voltage of the output FET then changes to the voltage that would produce the predetermined quiescent drain current, Idq to produce optimum RF amplification performance. More particularly, the circuit detects when a relatively low power level input power is incident on an amplifier (such as in the case where there is the absence of an RF input signal applied to the amplifier) and pinches off the output FET to a lower power dissipation condition compared with that dissipated when the RF input signal is applied. When the proper high power level of input power is detected, the gate of the output FET is biased to its normal high efficiency RF setting. This protects the amplifier from a pure dissipation condition that can destroy the output FET. The circuit uses an RF power sensor to sense the level of the RF input power incident on the amplifier and produces a DC bias signal at the gate of the output FET. For high power levels, the circuit applies normal RF operational gate bias voltage to the output FET. If low power is incident on the amplifier, the control signal results in the circuit producing a large negative voltage on the output FET gate to pinch the output FET devices to an “off”, non-conduction condition.
- In one embodiment, an amplifier is provided having a RF power level detector circuit a control circuit fed by an input signal, for producing a control signal in accordance with a power level of an RF input signal, such control signal indicating whether the power level of the input signal is within a predetermined range of power levels, The amplifier includes an amplifier section having: a field effect transistor having a gate for controlling a flow of carriers between a drain and a source of the field effect transistor; and a voltage source coupled to the drain; a reference potential connected to the source. The drain provides an output for the amplifier section. The input signal is fed to the gate. A bias circuit is fed by the control circuit for producing a fixed bias to the gate to establish a predetermined drain quiescent current (Idq) for the field effect transistor when the control signal indicates the power level of the RF input signal is within the predetermined range of power levels greater than zero and to reduce the bias voltage to reduce the predetermined quiescent current when the control signal indicates the power level of the RF input signal is below the predetermined range of power levels.
- In one embodiment, the Field Effect Transistor (FET), the Radio Frequency (RF) power level detector circuit; and the bias circuit, are formed on a single Monolithic Microwave Integrated Circuit (MMIC) chip.
- The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.
-
FIG. 1 is a diagrammatical sketch of a high power amplifier according to the PRIOR ART; -
FIG. 2 is an RF power amplifier circuit according to the disclosure; and -
FIG. 3 is a graph showing the relationship between a control signal produced by an RF power level detector circuit used in the RF power amplifier circuit ofFIG. 2 and RF signal input power of an RF input signal fed to the RF power amplifier ofFIG. 1 . - Like reference symbols in the various drawings indicate like elements.
- Referring now to
FIG. 2 , anamplifier circuit 10 is shown to include: an RF powerlevel detector circuit 12; acontrol circuit 14; abias circuit 16; and anRF amplifier 18, arranged as shown, all formed on Monolithic Microwave Integrated Circuit (MMIC)chip 11. - The
power amplifier 18 includes an output, depletion mode transistor Field Effect Transistor (FET) Q1 having a gate (G) for controlling a flow of carriers between a source (S) of the FET Q1 and the drain (D) of the FET Q1. Thebias circuit 16 is coupled to the gate (G) through an inductor L1, as shown. A voltage source +VDD is connected to the drain (D) though an inductor L2, as shown. The source (S) is connected to a reference potential, here ground, (sometimes referred to as a common source connected FET). The drain (D) provides an output RF OUT for theamplifier 18 through capacitor C1, as shown. An input signal RFIN is fed to the gate electrode through a capacitor C2, as shown. - The RF power
level detector circuit 12 includes a plurality of serially connected diodes Da-Dd connected between RFIN and aterminal 20 through a de blocking capacitor Ca, as shown. Theterminal 20 is connected to: a voltage source −VEE, here, for example −5V volts relative to reference potential, here ground, through a resistor Ra; to the reference potential through a capacitor Cb; and to an output mode, or terminal, 22, through a resistor Rb, as shown. The RF powerlevel detector circuit 12 produces a control signal atterminal 22 in accordance with a power level of an RF input signal fed to the input RFIN. The control signal indicates whether the power level of the input signal is within a predetermined range of power levels greater than zero. More particularly, as shown inFIG. 3 , the control signal (voltage) atterminal 22 is −VEE in the absence of an RF signal being applied to terminal RFIN (the RF input signal power level is zero) and the control signal atterminal 22 is more positive than −VEE over the predetermined range of power levels ranging from power level P1 (established by the number of serially connected diodes) to a greater power level P2 where P1 is greater than zero; that is, when the input RF is present. The range between P1 and P2 is selected to prevent the power dissipation within the FET Q1, even in the absence of an RF input signal, from being no higher than the power dissipated under full RF drive, where the power dissipated under full RF drive is equal to the sum of the DC power applied to the output FET Q1 (the product of the drain voltage VDD and drain current) and the amount of RF power applied to the output FET Q1 minus the amount of power produced at the output of the output FET Q1. - The control circuit 14 (
FIG. 2 ) includes: a voltagelevel shifting section 14 a comprising: a depletion mode FET Q5 configured as a current source and a depletion mode FET Q6 configured as a switch connected between +VDD and ground, for shifting the voltages input level swing atterminal 22 from between −VEE and a voltage above ground (as discussed in connection withFIG. 3 ) to an output voltage swing atterminal 23 between +VDD (in the absence of an RF input signal) and ground; and avoltage inverter section 14 b comprising: a depletion mode FET Q7 configured as a current source; a depletion mode FET Q8 configured as a switch and a plurality of diodes, here for example three diodes in D1-3, serially connected between VDD and ground, as shown, to invert the voltage signal atterminal 23 and produce such inverted voltage swing atterminal 24; and aswitch section 14 c, comprising a depletion mode FET (Q9) connected between VDD and thebias circuit 16, as shown. When theswitch 14 c is closed, as when the control signal atterminal 22 indicates the power level of the RF input at terminal RFIN is greater than the predetermined power level (that the RF input signal is present), thecontrol circuit 14 allows thebias circuit 16 to operate normally and produce a predetermined gate bias voltage for theamplifier 18 to that a predetermined quiescent drain current, Idq, passes from +VDD to the drain (D) of FET Q1; and, on the other hand, when theswitch 14 c is open, as when the control signal atterminal 22 indicates the power level of the RF input at terminal RFIN is at or below the predetermined power level (the RF input signal is absent), thecontrol circuit 14 transistor Q9 becomes non-conducting. As will be described in more detail below in connection withbias circuit 16, when FET Q9 is off (non-conducting), the gate (G) of FET Q1 goes to −VSS (here −5 volts) and pinches off FET Q1 with the result that quiescent drain current, Idq, is removed (goes to zero). - The
bias circuit 16, comprises: a current mirror having: a current source Iref, and biasing circuitry (depletion mode transistors Q2, Q3, and Q4 and diodes Dn) arranged as shown, coupled to the current source Iref, and between the potential more positive than the reference potential (+VDD) and a potential more negative than the reference potential; coupled to a potential more negative than the reference potential (−VSS). It should be noted that the diodes Dn is a series of a plurality n of diodes GaN diodes Dn, where n is the number of diodes in the series selected in accordance with the voltages used, here for example, VDD is 24 volts and −VSS is −8.0 volts. One such circuit is described in U.S. Patent Application Publication No. US 2016/0373074 A1 Published Dec. 22, 2016, inventors Bettencourt et al, assigned to the same assignee as the present patent application. Thebias circuit 16 is a depletion mode current mirror circuit for quiescent bias control of theamplifier 18 where Q2 is a Gallium Nitride (GaN) mirror FET and Q1 is the GaN HEMT. The reference current source Iref fed to FET Q2 controls the quiescent current Idq for FET Q1. The current source Iref may be a saturated resistor as described in U.S. Pat. No. 8,854,140 or a linear resistor, transistor or from an off chip reference if needed. - Thus, RF power
level detector circuit 12 produces a control signal atterminal 22 in accordance with a power level of an RF input signal applied to thepower amplifier 10. The control signal indicates whether the RF input signal is being applied to thepower amplifier 18 is within the predetermined range of power levels or less than the predetermined power level (in absence of such RF signal being applied to the power amplifier 10). After passing through thecontrol circuit 14, thebias circuit 16 produces a predetermined gate bias voltage (Vg) at a gate of the output FET to establish a predetermined constant quiescent drain current, Idq, during a period of time when the RF input signal is indicated as being present (the power level is within the predetermined range of power levels) and applies a more negative voltage at a gate of the output FET and hence removes quiescent drain current, Idq when the control signal indicates the absence of such RF signal (the power level is less than the predetermined range of power levels). More particularly, when theswitch 14 c (FET Q9) is closed, as when the control signal atterminal 22 indicates the power level of the RF input at terminal RFIN is within the predetermined power level, FET Q9 conducts and Iref passes to FETS Q2 and Q3 to produce the predetermined bias voltage at the gate of FET Q1 establishing the predetermined quiescent drain current, Idq, for FET Q1; and, on the other hand, when the control signal atterminal 22 indicates the power level of the RF input at terminal RFIN is at or below the predetermined power level (the RF input signal is absent), FET Q9 is non-conducting and the gate (G) of FET Q1 goes to −VSS (here −8 volts) and pinches off FET Q1 with the result that quiescent drain current, Idq, is removed (goes to zero). - A number of embodiments of the disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure. For example other RF power detector circuits may be used to detect the presence or absence of the RF input signal. Accordingly, other embodiments are within the scope of the following claims.
Claims (4)
Priority Applications (4)
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US15/718,504 US10263566B1 (en) | 2017-09-28 | 2017-09-28 | Radio frequency power amplifier |
EP18753521.6A EP3639366B1 (en) | 2017-09-28 | 2018-07-31 | Radio frequency power amplifier |
PCT/US2018/044516 WO2019067084A1 (en) | 2017-09-28 | 2018-07-31 | Radio frequency power amplifier |
TW107127614A TWI745608B (en) | 2017-09-28 | 2018-08-08 | Radio frequency power amplifier |
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US15/718,504 US10263566B1 (en) | 2017-09-28 | 2017-09-28 | Radio frequency power amplifier |
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US20190097580A1 true US20190097580A1 (en) | 2019-03-28 |
US10263566B1 US10263566B1 (en) | 2019-04-16 |
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EP (1) | EP3639366B1 (en) |
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CN113093614A (en) * | 2021-04-02 | 2021-07-09 | 北京航天雷特机电工程有限公司 | Microwave generating circuit and microwave generating device |
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TWI635701B (en) * | 2017-08-31 | 2018-09-11 | 絡達科技股份有限公司 | Bias circuit and power amplifier circuit |
US11509269B2 (en) * | 2020-08-17 | 2022-11-22 | Qualcomm Incorporated | Radio frequency (RF) amplifier bias circuit |
Citations (1)
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US5892400A (en) * | 1995-12-15 | 1999-04-06 | Anadigics, Inc. | Amplifier using a single polarity power supply and including depletion mode FET and negative voltage generator |
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JPH06303043A (en) | 1993-04-12 | 1994-10-28 | Mitsubishi Electric Corp | Amplifier circuit |
US7609115B2 (en) * | 2007-09-07 | 2009-10-27 | Raytheon Company | Input circuitry for transistor power amplifier and method for designing such circuitry |
WO2011002099A1 (en) * | 2009-07-03 | 2011-01-06 | 日本電気株式会社 | Power consumption control circuit, amplifying circuit, and power consumption control method |
US8089313B2 (en) * | 2009-10-19 | 2012-01-03 | Industrial Technology Research Institute | Power amplifier |
US8854140B2 (en) | 2012-12-19 | 2014-10-07 | Raytheon Company | Current mirror with saturated semiconductor resistor |
TWI509979B (en) * | 2013-01-04 | 2015-11-21 | Advanced Semiconductor Eng | Electronic system, radio frequency power amplifier and method for dynamic adjusting bias point. |
US20150236798A1 (en) * | 2013-03-14 | 2015-08-20 | Peregrine Semiconductor Corporation | Methods for Increasing RF Throughput Via Usage of Tunable Filters |
US9960740B2 (en) | 2015-06-18 | 2018-05-01 | Raytheon Company | Bias circuitry for depletion mode amplifiers |
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2017
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US5892400A (en) * | 1995-12-15 | 1999-04-06 | Anadigics, Inc. | Amplifier using a single polarity power supply and including depletion mode FET and negative voltage generator |
Cited By (1)
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CN113093614A (en) * | 2021-04-02 | 2021-07-09 | 北京航天雷特机电工程有限公司 | Microwave generating circuit and microwave generating device |
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TWI745608B (en) | 2021-11-11 |
EP3639366A1 (en) | 2020-04-22 |
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US10263566B1 (en) | 2019-04-16 |
EP3639366B1 (en) | 2021-12-08 |
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