US20190064471A1 - Support frame and image capturing device - Google Patents
Support frame and image capturing device Download PDFInfo
- Publication number
- US20190064471A1 US20190064471A1 US16/114,236 US201816114236A US2019064471A1 US 20190064471 A1 US20190064471 A1 US 20190064471A1 US 201816114236 A US201816114236 A US 201816114236A US 2019064471 A1 US2019064471 A1 US 2019064471A1
- Authority
- US
- United States
- Prior art keywords
- lens
- bottom wall
- opening
- extension bottom
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000000149 penetrating effect Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/10—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
- G02B9/04—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having two components only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
Definitions
- the invention relates to a support frame and an image capturing device. More particularly, the invention relates to a support frame featuring favorable structural strength and an image capturing device having the support frame.
- a carrier carrying a lens module is constituted by a frame body and a carrying base located at a bottom portion of the frame body most of the time. Nevertheless, the frame body and the carrying base are bonded to each other through adhesive glue. When being applied by an external force, the bonded frame body and the carrying base may be easily deformed owning to insufficient stiffness. Further, alignment tolerance between the bonded frame body and the carrying base is often generated owing to the process and materials of the two, as such, it is difficult to increase the yield of the image capturing device using the carrier.
- the invention provides a support frame featuring favorable structural strength.
- the invention further provides an image capturing device having the support frame so that the image capturing device having the support frame may generate less tolerance and that yield of the image capturing device is increased.
- a support frame in an embodiment of the invention is adapted for containing a first lens and a second lens, and the support frame includes a body and a first extension bottom wall.
- the body has a first opening penetrating through the body, a second opening penetrating through the body, a first annular side wall surrounding the first opening, and a second annular side wall surrounding the second opening.
- the first lens and the second lens are respectively disposed in the first opening and the second opening.
- the first extension bottom wall integratedly extends from an inner side of the first annular side wall. When the first lens is disposed in the first opening, the first lens is located on the first extension bottom wall.
- the first extension bottom wall has a first through hole. The first lens corresponds to the first through hole.
- An image capturing device in an embodiment of the invention includes a first lens, a second lens, a support frame, a first sensor, and a second sensor.
- the support frame includes a body and a first extension bottom wall.
- the body has a first opening penetrating through the body, a second opening penetrating through the body, a first annular side wall surrounding the first opening, and a second annular side wall surrounding the second opening.
- the first lens and the second lens are respectively disposed in the first opening and the second opening.
- the first extension bottom wall integratedly extends from an inner side of the first annular side wall.
- the first extension bottom wall has a first through hole, and the first lens corresponds to the first through hole.
- the first sensor and the first lens are located at two opposite sides of the first extension bottom wall.
- the first sensor is aligned with the first through hole and an optical axis of the first lens.
- the second sensor is disposed next to the first sensor and is aligned with an optical axis of the second
- the support frame includes a second extension bottom wall integratedly extending from an inner side of the second annular side wall.
- the second sensor and the second lens are located at two opposite sides of the second extension bottom wall.
- the second extension bottom wall has a second through hole. The second sensor is aligned with the second through hole, and the second lens corresponds to the second through hole.
- the image capturing device further includes a bottom supporting member disposed at the second opening and is connected to the second annular side wall.
- the second sensor and the second lens are located at two opposite sides of the bottom supporting member.
- the bottom supporting member has a second through hole. The second sensor is aligned with the second through hole, and the second lens corresponds to the second through hole.
- a material of the body is identical to a material of the first extension bottom wall.
- a material of the body is different from a material of the first extension bottom wall.
- the image capturing device further includes a circuit board, and the first sensor and the second sensor are disposed on the circuit board.
- the image capturing device further includes two circuit boards separated from each other and located on different planes.
- the first sensor and the second sensor are respectively disposed on the two circuit boards.
- the image capturing device further includes a motor assembly located in the second opening, and the motor assembly is coupled to the second lens.
- the support frame of the image capturing device provided by the invention is constituted by the integrally-formed body and the first extension bottom wall.
- the body and the first extension bottom wall of the support frame are integrally-formed and thus are not required to be fixed through methods such as adhesive bonding. Therefore, the support frame may feature greater structural strength, favorable stiffness against bending and deformation, and less tolerance.
- FIG. 1 is a schematic view of an image capturing device according to an embodiment of the invention.
- FIG. 2 is an exploded view of the image capturing device of FIG. 1 .
- FIG. 3 is a schematic cross-sectional view of the image capturing device of FIG. 1 .
- FIG. 4 is a schematic view of the motor assembly from another view angle.
- FIG. 5 is a schematic view of the support frame from another view angle.
- FIG. 6 is a schematic cross-sectional view of an image capturing device according to another embodiment of the invention.
- FIG. 7 is a schematic view of a support frame according to another embodiment of the invention.
- FIG. 1 is a schematic view of an image capturing device according to an embodiment of the invention.
- an image capturing device 10 includes a first lens 100 , a second lens 200 , a support frame 300 , and a motor assembly 600 b .
- the first lens 100 , the second lens 200 , and the motor assembly 600 b are adapted to be disposed in openings of the support frame 300 in this embodiment.
- the motor assembly 600 b is adapted to drive the second lens 200 to a specific position.
- the image capturing device 10 is exemplified as an image capturing device with dual lenses and thereby includes two lenses.
- the first lens 100 is, for example, a fixed-focus lens
- the second lens 200 is, for example, a variable-focus lens, but the invention is not limited in this regard.
- the image capturing device may also be an image capturing device having a single lens or having three or more lenses, and a number of the openings of the support frame corresponds to a number of the lenses.
- the support frame may have one single opening or may have three or more openings. In the case of plural openings, these openings may be disposed along a same straight line, or these openings may be arranged in a matrix (e.g., two of the four openings may be arranged in parallel to the other two openings).
- the number of the lenses, the number of the openings of the support frame, and arrangement of the openings of the image capturing device may be arranged according to needs, which is not particularly limited by the invention.
- FIG. 2 is an exploded view of the image capturing device of FIG. 1 .
- FIG. 3 is a schematic cross-sectional view of the image capturing device of FIG. 1 .
- a structure of the support frame 300 is described in detail below, and the support frame 300 includes a body 310 and a first extension bottom wall 320 .
- the body 310 has a first opening 312 penetrating through the body 310 , a second opening 314 penetrating through the body 310 , a first annular side wall 316 surrounding the first opening 312 , and a second annular side wall 318 surrounding the second opening 314 .
- the first lens 100 and the second lens 200 are respectively disposed in the first opening 312 and the second opening 314 . Further, the first annular side wall 316 and the second annular side wall 318 are respectively located next to a side surface of the first lens 100 and a side surface of the second lens 200 .
- the first annular side wall 316 is depicted as a circle
- the second annular side wall 318 is depicted as a rectangle; nevertheless, shapes of the first annular side wall 316 and the second annular side wall 318 are not limited in the invention.
- the first extension bottom wall 320 integratedly extends from an inner side of the first annular side wall 316 .
- the first lens 100 is located on the first extension bottom wall 320 .
- the first extension bottom wall 320 has a first through hole 322 , and the first lens 100 corresponds to the first through hole 322 .
- a frame body and carrying bases carrying lenses are adhesively bonded, and in this way, the carrying bases are prone to be easily deformed when being applied by a force from the lenses or from an external force.
- the first extension bottom wall 320 bears a force from the first lens 100 , and since the body 310 and the first extension bottom wall 320 are integrally formed, the body 310 and the extension bottom wall 320 are less susceptible to be easily deformed when being applied by a force or are less susceptible to be separated from each other owning to insufficient adhesion provided by glue.
- the support frame 300 further includes a second extension bottom wall 330 , and the second extension bottom wall 330 integratedly extends from an inner side of the second annular side wall 318 .
- the second lens 200 is located on the second extension bottom wall 320 .
- the second extension bottom wall 320 has a second through hole 332 , and the second lens 200 corresponds to the second through hole 332 .
- the frame body and the carrying bases located at a bottom portion of the frame body respectively are, for example, the body 310 and the first extension bottom wall 320 and the second extension bottom wall 330 of the embodiment.
- the frame body and the carrying bases in the related art are adhesively bonded, the frame body and the carrying bases are prone to be easily deformed when being applied by an external force.
- the support frame 300 provided by this embodiment since the first extension bottom wall 320 , the second extension bottom wall 330 , and the body 310 are designed to be integrally formed, structural strength of the support frame 300 is effectively increased and stiffness against bending is enhanced.
- first annular side wall 316 or the second annular side wall 318 bears an external flipping force
- first extension bottom wall 320 , the second extension bottom wall 330 , and the body 310 in the support frame 300 of this embodiment are integrally formed, an overall mass of the support frame 300 is increased and the support frame 300 is less susceptible to be bent and deformed.
- first annular side wall 316 or the second annular side wall 318 is supported by the first extension bottom wall 320 and the second extension bottom wall 330 , so that the first annular side wall 316 or the second annular side wall 318 is less susceptible to be twisted and deformed when being applied by an external bending force.
- first extension bottom wall 320 , the second extension bottom wall 330 , and the body 310 in the support frame 300 an alignment tolerance of the first extension bottom wall 320 and the second extension bottom wall 330 with respect to the body 310 is decreased.
- first extension bottom wall 320 , the second extension bottom wall 330 , and the body 310 are not to be separated owning to insufficient adhesion provided by glue.
- a material of the body 310 is, for example, metal or plastic, and the material of the body 310 may be identical to a material of the first extension bottom wall 320 . Since the body 310 and the first extension bottom wall 320 are made of the same material, the manufacturing steps of the body 310 and the first extension bottom wall 320 are simplified. Certainly, in other embodiments, the material of the body 310 may be different from the material of the first extension bottom wall 320 . For instance, an insert molding process may be applied to the body 310 made of metal and the first extension bottom wall 320 made of plastic, so as to enable the body 310 and the first extension bottom wall 320 to be integrally formed.
- the body 310 , the first extension bottom wall 320 , and the second extension bottom wall 330 in the support frame 300 of this embodiment are integrally formed, an alignment error does not exist between the body 310 and the first extension bottom wall 320 nor between the body 310 and the second extension bottom wall 330 .
- the body 310 , the first extension bottom wall 320 , and the second extension bottom wall 330 are designed to be integrally formed, so that the overall mass of the support frame 300 is increased.
- the body 310 is supported by the first extension bottom wall 320 and the second extension bottom wall 330 , so the body 310 is less susceptible to be bent and deformed.
- the image capturing device 10 further includes a first sensor 400 and a second sensor 500 .
- the first sensor 400 and the second sensor 500 are, for example, complementary metal oxide semiconductor (COMS) image sensors or charge coupled devices (CCDs).
- the first sensor 400 and the first lens 100 are located at two opposite sides of the first extension bottom wall 320 .
- the first sensor 400 is aligned with the first through hole 322 and an optical axis of the first lens 100 .
- the second sensor 500 and the second lens 200 are located at two opposite sides of the second extension bottom wall 330 .
- the second extension bottom wall 330 has the second through hole 332
- the second lens 200 corresponds to the second through hole 332 .
- the second sensor 500 is aligned with the second through hole 332 and an optical axis of the second lens 200 . That is, the second sensor 500 and the second lens 200 are aligned with the second through hole 332 .
- a first filter element F 1 is disposed between the first lens 100 and the first sensor 400
- a second filter element F 2 is disposed between the second lens 200 and the second sensor 500 .
- the first filter element F 1 and the second filter element F 2 are, for example, infrared cut-off filters, polarizing plates, or other suitable optical films. After light enters the first lens 100 and the second lens 200 and respectively penetrates through the first through hole 322 and the second through hole 332 and then through the first filter element F 1 and the second filter element F 2 , the light is respectively focused on the first sensor 400 and the second sensor 500 .
- the motor assembly 600 b is coupled to the second lens 200 to drive elements in the second lens 200 to move, so as to achieve a zooming effect and capture a required imaged required for a user.
- the image capturing device 10 further includes two circuit boards 700 .
- the two circuit boards 700 are separated from each other and located on different planes, and the first sensor 400 and the second sensor 500 are respectively disposed on the two circuit boards 700 .
- the two circuit boards 700 are disposed on the support frame 300 in a separating manner.
- a height of the first annular side wall 316 may be different from a height of the second annular side wall 318 , and the height of the first annular side wall 316 and the height of the second annular side wall 318 may be freely designed according to needs.
- FIG. 4 is a schematic view of the motor assembly from another view angle.
- FIG. 5 is a schematic view of the support frame from another view angle.
- the motor assembly 600 b has two electrical pins 610 configured to be electrically connected to the circuit boards 700 .
- two vias 334 are designed to be disposed on the second extension bottom wall 330 in the support frame 300 , and the two vias 334 are configured to act as a yielding structure of the two electrical pins 610 .
- the two electrical pins 610 of the motor assembly 600 a may extend from the two vias 334 to be electrically connected to the circuit boards 700 .
- FIG. 6 is a schematic cross-sectional view of an image capturing device according to another embodiment of the invention.
- an image capturing device 10 A includes the abovementioned support frame 300 and a circuit board 700 a , and both the first sensor 400 and the second sensor 500 are disposed on the circuit board 700 a . That is, in the embodiment of FIG. 3 , the first sensor 400 and the second sensor 500 of the image capturing device 10 are separately disposed on the two separate circuit boards 700 , and such design may be referred to as a separate-board design. In this embodiment, the first sensor 400 and the second sensor 500 are together disposed on the single circuit board 700 a , and such design may be referred to as a board-sharing design. It can be seen from FIG. 3 and FIG. 6 that the integrally-formed support frame 300 can be applied not only to the separate-board design but also the board-sharing design.
- an alignment error is not generated between the first annular side wall 316 and the first extension bottom wall 320 which are designed to be integrally formed nor between the second annular side wall 318 and the second extension bottom wall 330 which are also designed to be integrally formed, so that an assembly tolerance of the overall image capturing device 10 A is further decreased.
- the support frame 300 is less susceptible to be bent and deformed.
- FIG. 7 is a schematic view of a support frame according to another embodiment of the invention.
- FIG. 7 illustrates only the support frame since the rest of the components are assembled in a manner similar to that described in FIG. 2 and FIG. 3 .
- a support frame 300 a of this embodiment has the first annular side wall 316 surrounding the first opening 312 , the second annular side wall 318 surrounding the second opening 314 , the body 310 , and the first extension bottom wall 330 integratedly extending from the inner side of the first annular side wall 316 .
- the image capturing device 10 further includes a bottom supporting member 800 disposed at the second opening 314 and is adapted to be connected to the second annular side wall 318 .
- the bottom supporting member 800 is configured to carry the second lens 200 (shown in FIG. 2 ) and the motor assembly 600 b (shown in FIG. 2 ).
- the bottom supporting member 800 may be fixed onto the second annular side wall 318 through methods such as adhesive bonding, and in this way, the second lens 200 can be subsequently assembled onto the bottom supporting member 800 .
- the method used to fix the bottom supporting member 800 to the second annular side wall 318 is not limited in this regard.
- the bottom supporting member 800 has a second through hole 810 .
- the second sensor 500 (shown in FIG. 2 ) is aligned with the second through hole 810
- the second lens 200 (shown in FIG. 2 ) corresponds to the second through hole 810 .
- the second lens 200 and the second sensor 500 are individually aligned with the second through hole 810 .
- a position where the bottom supporting member 800 is disposed and functions of the bottom supporting member 800 in this embodiment are similar to a position where the second extension bottom wall 318 is disposed and functions of the second extension bottom wall 318 in FIG. 2 .
- a difference therebetween is that the second extension bottom wall 318 integratedly extends from the second annular side wall 318 in FIG. 2 , and the bottom supporting member 800 is independent of the second annular side wall 318 and is additionally fixed onto the second annular side wall when being subsequently assembled in this embodiment.
- first annular side wall 316 and the first extension bottom wall 320 are integrally formed as well; thereby, no alignment error exists therebetween and favorable structural strength is provided between the first annular side wall 316 and the first extension bottom wall 320 .
- the bottom supporting member 800 is designed to be additionally fixed to the second annular side wall 318 , so a manufacturer is allowed to adjust a position where the bottom supporting member 800 is adhesively bonded to the second annular side wall 318 , and that flexibility is provided through such design.
- the support frame of the image capturing device is constituted by the integrally-formed body, the first extension bottom wall, and the second extension bottom wall. Since the body, the first extension bottom wall, and the second extension bottom wall are not required to be adhesively bonded to one another, the support frame features greater structural strength, and that stiffness of the support frame against bending and deformation is enhanced. Further, the alignment tolerance is lowered since the support frame is integrally-formed. Therefore, the process is simplified, the manufacturing costs are saved, and moreover, a defective rate of the image capturing device is lowered thanks to decreased assembly tolerance.
- the support frame is constituted by the integrally-formed body and the first extension bottom wall, and the bottom supporting member may be disposed at a required position required by the user before being adhesively bonded.
- the body and the first extension bottom wall of the support frame are integrally formed. Therefore, the support frame not only features sufficient stiffness against bending and deformation but also includes the bottom supporting member of which the position of the bottom supporting member can be adjusted according to needs before adhesive bonding is applied, so as to satisfy different needs from the user.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
Abstract
Description
- This application claims the priority benefit of U.S. provisional application Ser. No. 62/551,203, filed on Aug. 28, 2017. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- The invention relates to a support frame and an image capturing device. More particularly, the invention relates to a support frame featuring favorable structural strength and an image capturing device having the support frame.
- Along with technology advancement, demand for image capturing devices grows day by day. In an image capturing device, a carrier carrying a lens module is constituted by a frame body and a carrying base located at a bottom portion of the frame body most of the time. Nevertheless, the frame body and the carrying base are bonded to each other through adhesive glue. When being applied by an external force, the bonded frame body and the carrying base may be easily deformed owning to insufficient stiffness. Further, alignment tolerance between the bonded frame body and the carrying base is often generated owing to the process and materials of the two, as such, it is difficult to increase the yield of the image capturing device using the carrier.
- The invention provides a support frame featuring favorable structural strength.
- The invention further provides an image capturing device having the support frame so that the image capturing device having the support frame may generate less tolerance and that yield of the image capturing device is increased.
- A support frame in an embodiment of the invention is adapted for containing a first lens and a second lens, and the support frame includes a body and a first extension bottom wall. The body has a first opening penetrating through the body, a second opening penetrating through the body, a first annular side wall surrounding the first opening, and a second annular side wall surrounding the second opening. The first lens and the second lens are respectively disposed in the first opening and the second opening. The first extension bottom wall integratedly extends from an inner side of the first annular side wall. When the first lens is disposed in the first opening, the first lens is located on the first extension bottom wall. The first extension bottom wall has a first through hole. The first lens corresponds to the first through hole.
- An image capturing device in an embodiment of the invention includes a first lens, a second lens, a support frame, a first sensor, and a second sensor. The support frame includes a body and a first extension bottom wall. The body has a first opening penetrating through the body, a second opening penetrating through the body, a first annular side wall surrounding the first opening, and a second annular side wall surrounding the second opening. The first lens and the second lens are respectively disposed in the first opening and the second opening. The first extension bottom wall integratedly extends from an inner side of the first annular side wall. The first extension bottom wall has a first through hole, and the first lens corresponds to the first through hole. The first sensor and the first lens are located at two opposite sides of the first extension bottom wall. The first sensor is aligned with the first through hole and an optical axis of the first lens. The second sensor is disposed next to the first sensor and is aligned with an optical axis of the second lens.
- In an embodiment of the invention, the support frame includes a second extension bottom wall integratedly extending from an inner side of the second annular side wall. The second sensor and the second lens are located at two opposite sides of the second extension bottom wall. The second extension bottom wall has a second through hole. The second sensor is aligned with the second through hole, and the second lens corresponds to the second through hole.
- In an embodiment of the invention, the image capturing device further includes a bottom supporting member disposed at the second opening and is connected to the second annular side wall. The second sensor and the second lens are located at two opposite sides of the bottom supporting member. The bottom supporting member has a second through hole. The second sensor is aligned with the second through hole, and the second lens corresponds to the second through hole.
- In an embodiment of the invention, a material of the body is identical to a material of the first extension bottom wall.
- In an embodiment of the invention, a material of the body is different from a material of the first extension bottom wall.
- In an embodiment of the invention, the image capturing device further includes a circuit board, and the first sensor and the second sensor are disposed on the circuit board.
- In an embodiment of the invention, the image capturing device further includes two circuit boards separated from each other and located on different planes. The first sensor and the second sensor are respectively disposed on the two circuit boards.
- In an embodiment of the invention, the image capturing device further includes a motor assembly located in the second opening, and the motor assembly is coupled to the second lens.
- To sum up, the support frame of the image capturing device provided by the invention is constituted by the integrally-formed body and the first extension bottom wall. The body and the first extension bottom wall of the support frame are integrally-formed and thus are not required to be fixed through methods such as adhesive bonding. Therefore, the support frame may feature greater structural strength, favorable stiffness against bending and deformation, and less tolerance.
- To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows.
- The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
-
FIG. 1 is a schematic view of an image capturing device according to an embodiment of the invention. -
FIG. 2 is an exploded view of the image capturing device ofFIG. 1 . -
FIG. 3 is a schematic cross-sectional view of the image capturing device ofFIG. 1 . -
FIG. 4 is a schematic view of the motor assembly from another view angle. -
FIG. 5 is a schematic view of the support frame from another view angle. -
FIG. 6 is a schematic cross-sectional view of an image capturing device according to another embodiment of the invention. -
FIG. 7 is a schematic view of a support frame according to another embodiment of the invention. -
FIG. 1 is a schematic view of an image capturing device according to an embodiment of the invention. - With reference to
FIG. 1 , in this embodiment, an image capturingdevice 10 includes afirst lens 100, asecond lens 200, asupport frame 300, and amotor assembly 600 b. Thefirst lens 100, thesecond lens 200, and themotor assembly 600 b are adapted to be disposed in openings of thesupport frame 300 in this embodiment. Themotor assembly 600 b is adapted to drive thesecond lens 200 to a specific position. In this embodiment, theimage capturing device 10 is exemplified as an image capturing device with dual lenses and thereby includes two lenses. Thefirst lens 100 is, for example, a fixed-focus lens, and thesecond lens 200 is, for example, a variable-focus lens, but the invention is not limited in this regard. In an embodiment that is not shown, the image capturing device may also be an image capturing device having a single lens or having three or more lenses, and a number of the openings of the support frame corresponds to a number of the lenses. In other words, in other embodiments, the support frame may have one single opening or may have three or more openings. In the case of plural openings, these openings may be disposed along a same straight line, or these openings may be arranged in a matrix (e.g., two of the four openings may be arranged in parallel to the other two openings). The number of the lenses, the number of the openings of the support frame, and arrangement of the openings of the image capturing device may be arranged according to needs, which is not particularly limited by the invention. -
FIG. 2 is an exploded view of the image capturing device ofFIG. 1 .FIG. 3 is a schematic cross-sectional view of the image capturing device ofFIG. 1 . With reference toFIG. 2 toFIG. 3 , a structure of thesupport frame 300 is described in detail below, and thesupport frame 300 includes abody 310 and a first extensionbottom wall 320. Thebody 310 has afirst opening 312 penetrating through thebody 310, asecond opening 314 penetrating through thebody 310, a firstannular side wall 316 surrounding thefirst opening 312, and a secondannular side wall 318 surrounding thesecond opening 314. Thefirst lens 100 and thesecond lens 200 are respectively disposed in thefirst opening 312 and thesecond opening 314. Further, the firstannular side wall 316 and the secondannular side wall 318 are respectively located next to a side surface of thefirst lens 100 and a side surface of thesecond lens 200. In this embodiment, the firstannular side wall 316 is depicted as a circle, and the secondannular side wall 318 is depicted as a rectangle; nevertheless, shapes of the firstannular side wall 316 and the secondannular side wall 318 are not limited in the invention. - The first extension
bottom wall 320 integratedly extends from an inner side of the firstannular side wall 316. When thefirst lens 100 is disposed in thefirst opening 312, thefirst lens 100 is located on the first extensionbottom wall 320. Further, the first extensionbottom wall 320 has a first throughhole 322, and thefirst lens 100 corresponds to the first throughhole 322. In the related art, a frame body and carrying bases carrying lenses are adhesively bonded, and in this way, the carrying bases are prone to be easily deformed when being applied by a force from the lenses or from an external force. In the embodiment, the first extensionbottom wall 320 bears a force from thefirst lens 100, and since thebody 310 and the first extensionbottom wall 320 are integrally formed, thebody 310 and the extensionbottom wall 320 are less susceptible to be easily deformed when being applied by a force or are less susceptible to be separated from each other owning to insufficient adhesion provided by glue. - In this embodiment, the
support frame 300 further includes a second extensionbottom wall 330, and the second extensionbottom wall 330 integratedly extends from an inner side of the secondannular side wall 318. When thesecond lens 200 is disposed in thesecond opening 314, thesecond lens 200 is located on the second extensionbottom wall 320. Further, the second extensionbottom wall 320 has a second throughhole 332, and thesecond lens 200 corresponds to the second throughhole 332. In the design of the related art, the frame body and the carrying bases located at a bottom portion of the frame body respectively are, for example, thebody 310 and the first extensionbottom wall 320 and the second extensionbottom wall 330 of the embodiment. Since the frame body and the carrying bases in the related art are adhesively bonded, the frame body and the carrying bases are prone to be easily deformed when being applied by an external force. In thesupport frame 300 provided by this embodiment, since the first extensionbottom wall 320, the second extensionbottom wall 330, and thebody 310 are designed to be integrally formed, structural strength of thesupport frame 300 is effectively increased and stiffness against bending is enhanced. - Specifically, when the first
annular side wall 316 or the secondannular side wall 318 bears an external flipping force, since the first extensionbottom wall 320, the second extensionbottom wall 330, and thebody 310 in thesupport frame 300 of this embodiment are integrally formed, an overall mass of thesupport frame 300 is increased and thesupport frame 300 is less susceptible to be bent and deformed. Further, the firstannular side wall 316 or the secondannular side wall 318 is supported by the first extensionbottom wall 320 and the second extensionbottom wall 330, so that the firstannular side wall 316 or the secondannular side wall 318 is less susceptible to be twisted and deformed when being applied by an external bending force. Further, since an adhesive-bonding process is not required to be performed on the first extensionbottom wall 320, the second extensionbottom wall 330, and thebody 310 in thesupport frame 300, an alignment tolerance of the first extensionbottom wall 320 and the second extensionbottom wall 330 with respect to thebody 310 is decreased. In addition, the first extensionbottom wall 320, the second extensionbottom wall 330, and thebody 310 are not to be separated owning to insufficient adhesion provided by glue. - Note that a material of the
body 310 is, for example, metal or plastic, and the material of thebody 310 may be identical to a material of the first extensionbottom wall 320. Since thebody 310 and the first extensionbottom wall 320 are made of the same material, the manufacturing steps of thebody 310 and the first extensionbottom wall 320 are simplified. Certainly, in other embodiments, the material of thebody 310 may be different from the material of the first extensionbottom wall 320. For instance, an insert molding process may be applied to thebody 310 made of metal and the first extensionbottom wall 320 made of plastic, so as to enable thebody 310 and the first extensionbottom wall 320 to be integrally formed. - In short, since the
body 310, the first extensionbottom wall 320, and the second extensionbottom wall 330 in thesupport frame 300 of this embodiment are integrally formed, an alignment error does not exist between thebody 310 and the first extensionbottom wall 320 nor between thebody 310 and the second extensionbottom wall 330. Besides, since thebody 310, the first extensionbottom wall 320, and the second extensionbottom wall 330 are designed to be integrally formed, so that the overall mass of thesupport frame 300 is increased. Further, thebody 310 is supported by the first extensionbottom wall 320 and the second extensionbottom wall 330, so thebody 310 is less susceptible to be bent and deformed. - In this embodiment, the
image capturing device 10 further includes afirst sensor 400 and asecond sensor 500. Thefirst sensor 400 and thesecond sensor 500 are, for example, complementary metal oxide semiconductor (COMS) image sensors or charge coupled devices (CCDs). Thefirst sensor 400 and thefirst lens 100 are located at two opposite sides of the first extensionbottom wall 320. Thefirst sensor 400 is aligned with the first throughhole 322 and an optical axis of thefirst lens 100. - In addition, the
second sensor 500 and thesecond lens 200 are located at two opposite sides of the second extensionbottom wall 330. The second extensionbottom wall 330 has the second throughhole 332, and thesecond lens 200 corresponds to the second throughhole 332. Further, thesecond sensor 500 is aligned with the second throughhole 332 and an optical axis of thesecond lens 200. That is, thesecond sensor 500 and thesecond lens 200 are aligned with the second throughhole 332. A first filter element F1 is disposed between thefirst lens 100 and thefirst sensor 400, and a second filter element F2 is disposed between thesecond lens 200 and thesecond sensor 500. The first filter element F1 and the second filter element F2 are, for example, infrared cut-off filters, polarizing plates, or other suitable optical films. After light enters thefirst lens 100 and thesecond lens 200 and respectively penetrates through the first throughhole 322 and the second throughhole 332 and then through the first filter element F1 and the second filter element F2, the light is respectively focused on thefirst sensor 400 and thesecond sensor 500. - In addition, in this embodiment, the
motor assembly 600 b is coupled to thesecond lens 200 to drive elements in thesecond lens 200 to move, so as to achieve a zooming effect and capture a required imaged required for a user. In this embodiment, theimage capturing device 10 further includes twocircuit boards 700. The twocircuit boards 700 are separated from each other and located on different planes, and thefirst sensor 400 and thesecond sensor 500 are respectively disposed on the twocircuit boards 700. The twocircuit boards 700 are disposed on thesupport frame 300 in a separating manner. Hence, a height of the firstannular side wall 316 may be different from a height of the secondannular side wall 318, and the height of the firstannular side wall 316 and the height of the secondannular side wall 318 may be freely designed according to needs. -
FIG. 4 is a schematic view of the motor assembly from another view angle.FIG. 5 is a schematic view of the support frame from another view angle. With reference toFIG. 4 andFIG. 5 , in this embodiment, themotor assembly 600 b has twoelectrical pins 610 configured to be electrically connected to thecircuit boards 700. Hence, twovias 334 are designed to be disposed on the second extensionbottom wall 330 in thesupport frame 300, and the twovias 334 are configured to act as a yielding structure of the twoelectrical pins 610. In this way, the twoelectrical pins 610 of the motor assembly 600 a may extend from the two vias 334 to be electrically connected to thecircuit boards 700. - It should be noted that an image capturing device of other embodiments is provided below for illustration, and identical or similar reference numerals are used to represent identical or similar components, and thus descriptions of identical or similar technical contents are omitted. Please refer to the descriptions of the previous embodiment for the omitted contents, which will not be repeated hereinafter.
-
FIG. 6 is a schematic cross-sectional view of an image capturing device according to another embodiment of the invention. With reference toFIG. 6 , in this embodiment, animage capturing device 10A includes theabovementioned support frame 300 and acircuit board 700 a, and both thefirst sensor 400 and thesecond sensor 500 are disposed on thecircuit board 700 a. That is, in the embodiment ofFIG. 3 , thefirst sensor 400 and thesecond sensor 500 of theimage capturing device 10 are separately disposed on the twoseparate circuit boards 700, and such design may be referred to as a separate-board design. In this embodiment, thefirst sensor 400 and thesecond sensor 500 are together disposed on thesingle circuit board 700 a, and such design may be referred to as a board-sharing design. It can be seen fromFIG. 3 andFIG. 6 that the integrally-formedsupport frame 300 can be applied not only to the separate-board design but also the board-sharing design. - In this embodiment, an alignment error is not generated between the first
annular side wall 316 and the first extensionbottom wall 320 which are designed to be integrally formed nor between the secondannular side wall 318 and the second extensionbottom wall 330 which are also designed to be integrally formed, so that an assembly tolerance of the overallimage capturing device 10A is further decreased. In addition, since the firstannular side wall 316 and the first extensionbottom wall 320 as well as the secondannular side wall 318 and the second extensionbottom wall 330 are designed to be integrally formed, thesupport frame 300 is less susceptible to be bent and deformed. -
FIG. 7 is a schematic view of a support frame according to another embodiment of the invention.FIG. 7 illustrates only the support frame since the rest of the components are assembled in a manner similar to that described inFIG. 2 andFIG. 3 . With reference toFIG. 7 first, asupport frame 300 a of this embodiment has the firstannular side wall 316 surrounding thefirst opening 312, the secondannular side wall 318 surrounding thesecond opening 314, thebody 310, and the first extensionbottom wall 330 integratedly extending from the inner side of the firstannular side wall 316. In this embodiment, theimage capturing device 10 further includes abottom supporting member 800 disposed at thesecond opening 314 and is adapted to be connected to the secondannular side wall 318. Thebottom supporting member 800 is configured to carry the second lens 200 (shown inFIG. 2 ) and themotor assembly 600 b (shown inFIG. 2 ). In this embodiment, thebottom supporting member 800 may be fixed onto the secondannular side wall 318 through methods such as adhesive bonding, and in this way, thesecond lens 200 can be subsequently assembled onto thebottom supporting member 800. Certainly, the method used to fix thebottom supporting member 800 to the secondannular side wall 318 is not limited in this regard. Thebottom supporting member 800 has a second throughhole 810. The second sensor 500 (shown inFIG. 2 ) is aligned with the second throughhole 810, and the second lens 200 (shown inFIG. 2 ) corresponds to the second throughhole 810. In other words, thesecond lens 200 and thesecond sensor 500 are individually aligned with the second throughhole 810. - A position where the
bottom supporting member 800 is disposed and functions of thebottom supporting member 800 in this embodiment are similar to a position where the second extensionbottom wall 318 is disposed and functions of the second extensionbottom wall 318 inFIG. 2 . A difference therebetween is that the second extensionbottom wall 318 integratedly extends from the secondannular side wall 318 inFIG. 2 , and thebottom supporting member 800 is independent of the secondannular side wall 318 and is additionally fixed onto the second annular side wall when being subsequently assembled in this embodiment. - In this embodiment, the first
annular side wall 316 and the first extensionbottom wall 320 are integrally formed as well; thereby, no alignment error exists therebetween and favorable structural strength is provided between the firstannular side wall 316 and the first extensionbottom wall 320. In addition, thebottom supporting member 800 is designed to be additionally fixed to the secondannular side wall 318, so a manufacturer is allowed to adjust a position where thebottom supporting member 800 is adhesively bonded to the secondannular side wall 318, and that flexibility is provided through such design. - In view of the foregoing, in the support frame of the image capturing device provided by an embodiment of the invention, the support frame is constituted by the integrally-formed body, the first extension bottom wall, and the second extension bottom wall. Since the body, the first extension bottom wall, and the second extension bottom wall are not required to be adhesively bonded to one another, the support frame features greater structural strength, and that stiffness of the support frame against bending and deformation is enhanced. Further, the alignment tolerance is lowered since the support frame is integrally-formed. Therefore, the process is simplified, the manufacturing costs are saved, and moreover, a defective rate of the image capturing device is lowered thanks to decreased assembly tolerance. In another embodiment, the support frame is constituted by the integrally-formed body and the first extension bottom wall, and the bottom supporting member may be disposed at a required position required by the user before being adhesively bonded. The body and the first extension bottom wall of the support frame are integrally formed. Therefore, the support frame not only features sufficient stiffness against bending and deformation but also includes the bottom supporting member of which the position of the bottom supporting member can be adjusted according to needs before adhesive bonding is applied, so as to satisfy different needs from the user.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/114,236 US20190064471A1 (en) | 2017-08-28 | 2018-08-28 | Support frame and image capturing device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762551203P | 2017-08-28 | 2017-08-28 | |
US16/114,236 US20190064471A1 (en) | 2017-08-28 | 2018-08-28 | Support frame and image capturing device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190064471A1 true US20190064471A1 (en) | 2019-02-28 |
Family
ID=65434283
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/114,243 Active US10573776B2 (en) | 2017-08-28 | 2018-08-28 | Manufacturing method of image-sensing module |
US16/114,236 Abandoned US20190064471A1 (en) | 2017-08-28 | 2018-08-28 | Support frame and image capturing device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/114,243 Active US10573776B2 (en) | 2017-08-28 | 2018-08-28 | Manufacturing method of image-sensing module |
Country Status (3)
Country | Link |
---|---|
US (2) | US10573776B2 (en) |
CN (2) | CN109449216A (en) |
TW (2) | TWI696008B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI735084B (en) * | 2019-10-28 | 2021-08-01 | 新煒科技有限公司 | Composite body and manufacturing method therefor, camera module and electronic device |
US11272082B2 (en) * | 2019-09-23 | 2022-03-08 | Apple Inc. | Multi-camera mounting chassis |
US11575820B2 (en) * | 2019-01-22 | 2023-02-07 | Lg Innotek Co., Ltd. | Camera module |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
TWI774824B (en) * | 2018-08-16 | 2022-08-21 | 先進光電科技股份有限公司 | Optical imaging module |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170082823A1 (en) * | 2015-09-17 | 2017-03-23 | Samsung Electronics Co., Ltd. | Camera module including multi-lens and electronic device having the same |
US20170146766A1 (en) * | 2015-11-25 | 2017-05-25 | Hon Hai Precision Industry Co., Ltd. | Imaging device and method of assembly |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2657027Y (en) * | 2003-10-13 | 2004-11-17 | 鸿富锦精密工业(深圳)有限公司 | Digital camera module |
US20090215216A1 (en) * | 2008-02-21 | 2009-08-27 | Impac Technology Co., Ltd. | Packaging method of image sensing device |
US20090256222A1 (en) * | 2008-04-14 | 2009-10-15 | Impac Technology Co., Ltd. | Packaging method of image sensing device |
CN103855067A (en) * | 2012-11-28 | 2014-06-11 | 硕达科技股份有限公司 | Image sensing chip packaging method |
CN103855066A (en) * | 2012-11-28 | 2014-06-11 | 硕达科技股份有限公司 | Image induction chip packaging method for protecting chip |
CN103700634B (en) * | 2013-11-06 | 2016-06-22 | 南昌欧菲光电技术有限公司 | Camera module and encapsulating structure thereof and method for packing |
US9432558B2 (en) * | 2014-07-16 | 2016-08-30 | Lite-On Electronics (Guangzhou) Limited | Image capturing module having a built-in dustproof structure |
CN105430238A (en) * | 2014-09-17 | 2016-03-23 | 奇景光电股份有限公司 | Image sensing module and method of adjusting focus length of image sensing module |
US9722098B1 (en) * | 2016-10-18 | 2017-08-01 | Ase Electronics (M) Sdn Bhd | Semiconductor device package and method of manufacturing the same |
-
2018
- 2018-08-28 US US16/114,243 patent/US10573776B2/en active Active
- 2018-08-28 US US16/114,236 patent/US20190064471A1/en not_active Abandoned
- 2018-08-28 CN CN201810994675.0A patent/CN109449216A/en active Pending
- 2018-08-28 CN CN201810986490.5A patent/CN109425950A/en active Pending
- 2018-08-28 TW TW107129900A patent/TWI696008B/en active
- 2018-08-28 TW TW107129902A patent/TWI688835B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170082823A1 (en) * | 2015-09-17 | 2017-03-23 | Samsung Electronics Co., Ltd. | Camera module including multi-lens and electronic device having the same |
US20170146766A1 (en) * | 2015-11-25 | 2017-05-25 | Hon Hai Precision Industry Co., Ltd. | Imaging device and method of assembly |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11575820B2 (en) * | 2019-01-22 | 2023-02-07 | Lg Innotek Co., Ltd. | Camera module |
US11272082B2 (en) * | 2019-09-23 | 2022-03-08 | Apple Inc. | Multi-camera mounting chassis |
US11750900B2 (en) | 2019-09-23 | 2023-09-05 | Apple Inc. | Multi-camera mounting chassis |
TWI735084B (en) * | 2019-10-28 | 2021-08-01 | 新煒科技有限公司 | Composite body and manufacturing method therefor, camera module and electronic device |
Also Published As
Publication number | Publication date |
---|---|
US20190067363A1 (en) | 2019-02-28 |
TWI688835B (en) | 2020-03-21 |
TWI696008B (en) | 2020-06-11 |
US10573776B2 (en) | 2020-02-25 |
TW201913242A (en) | 2019-04-01 |
CN109449216A (en) | 2019-03-08 |
CN109425950A (en) | 2019-03-05 |
TW201913159A (en) | 2019-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20190064471A1 (en) | Support frame and image capturing device | |
US9525807B2 (en) | Three-pole tilt control system for camera module | |
US10437133B2 (en) | Camera module and optical instrument | |
JP4990716B2 (en) | Camera module assembling apparatus and assembling method thereof | |
US11659263B2 (en) | Split lens and camera module and electronic apparatus | |
KR101349524B1 (en) | Camera module | |
US9661196B2 (en) | Camera module | |
US20110063496A1 (en) | Camera module | |
KR101262597B1 (en) | Carmera module | |
CN112492150B (en) | Camera module | |
US20070278394A1 (en) | Camera module with premolded lens housing and method of manufacture | |
JP2014194585A (en) | Auto focus/zoom module using wafer level optics | |
US20150021730A1 (en) | Camera module | |
US20140049686A1 (en) | Image sensor module and camera module using same | |
KR101231517B1 (en) | Carmera module | |
CN106254731B (en) | camera module | |
US20210167105A1 (en) | Camera module and molded circuit board assembly thereof, array camera module and electronic device | |
US20200186684A1 (en) | Circuit board assembly, camera module, and electronic device including the same | |
US20190320096A1 (en) | Camera device and assembling method for same | |
JP2006227324A (en) | Solid-state imaging apparatus | |
CN104333679A (en) | Camera module | |
US20210021739A1 (en) | Lens module | |
KR20150033088A (en) | Camera module | |
KR20170025767A (en) | Sensing package and manufacturing method for the same | |
KR101892821B1 (en) | Camera module and manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LUXVISIONS INNOVATION LIMITED, HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHANG, YAO-CHUNG;REEL/FRAME:046772/0661 Effective date: 20180828 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
AS | Assignment |
Owner name: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LUXVISIONS INNOVATION LIMITED;REEL/FRAME:053064/0816 Effective date: 20200624 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |