US20180270947A1 - Attenuation reduction structure for flexible circuit board - Google Patents
Attenuation reduction structure for flexible circuit board Download PDFInfo
- Publication number
- US20180270947A1 US20180270947A1 US15/920,915 US201815920915A US2018270947A1 US 20180270947 A1 US20180270947 A1 US 20180270947A1 US 201815920915 A US201815920915 A US 201815920915A US 2018270947 A1 US2018270947 A1 US 2018270947A1
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- United States
- Prior art keywords
- coating zone
- conductive paste
- paste coating
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
Definitions
- the present invention relates to a signal attenuation shielding structure of a flexible circuit board, and in particular to a signal attenuation reduction structure that is formed by arranging a conductive paste coating zone in a flexible circuit board to correspond to at least one high-frequency signal line and an anisotropic conductive film arranged to provide electrical connection in a vertical direction between the conductive paste coating zone and a shielding layer.
- a high frequency signal transmission technique is achieved with two high frequency signal lines that are grouped as a signal pair to respectively transmit signals having identical amplitude, but at opposite phases so that the signal transmission lines are provided with an improved effect of suppressing electromagnetic interference.
- an objective of the present invention is to provide a high-frequency signal attenuation reduction structure that is formed by combining a conductive paste coating zone, anisotropic conductive film, and a shielding layer together.
- the technical solution that the present invention adopts to achieve the above objective is that at least one conductive paste coating zone is formed on a surface of high-frequency signal lines and an insulation layer that are formed on a dielectric layer of a flexible circuit board such that the conductive paste coating zone corresponds to at least one high-frequency signal line or covers a plurality of signal lines.
- An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction by means of the anisotropic conductive film.
- the conductive paste coating zone is formed of a conductive paste selected from one of silver paste, copper paste, and aluminum paste.
- the shielding layer is formed of a material selected from one of silver, copper, aluminum, and gold.
- the dielectric layer comprises at least one grounding line formed thereon and the grounding line is electrically connected through a conductive path to the shielding layer
- the anisotropic conductive film is pressed at a predetermined temperature and a predetermined pressure to bond between the conductive paste coating zone and the shielding layer.
- the plurality of pairs of high-frequency signal lines comprise at least one pair of differential-mode signal lines.
- the conductive paste coating zone is coated in an area that covers a plurality of pairs of high-frequency signal lines.
- the efficacy of the present invention is that, as compared to the structure of the prior art copper- or aluminum-based shielding layer, the present invention offers advantages including having a smaller thickness and better flexibility and, as compared to the prior art shielding layer that is formed by coating a layer of silver paste, the present invention offers advantages of low material cost and simplified manufacturing process.
- FIG. 1 is a cross-sectional diagram showing a first embodiment of the present invention
- FIG. 2 is an enlarged view of a circle portion “A” of FIG. 1 ;
- FIG. 3 is a cross-sectional diagram showing a second embodiment of the present invention.
- FIG. 4 is an enlarged view of a circle portion “B” of FIG. 3 ;
- FIG. 5 is a cross-sectional diagram showing a third embodiment of the present invention.
- FIG. 6 is an enlarged view of a circle portion “C” of FIG. 5 ;
- FIG. 7 is a cross-sectional diagram showing a fourth embodiment of the present invention.
- FIG. 8 is an enlarged view of a circle portion “D” of FIG. 7 .
- FIG. 1 is a cross-sectional diagram showing a first embodiment of the present invention and FIG. 2 is an enlarged view of a circle portion “A” of FIG. 1 .
- a flexible circuit board 100 comprises a dielectric layer 1 on which a plurality of pairs of high-frequency signal lines 2 a , 2 b that are adjacent to and insulated from each other are formed.
- An insulation layer 3 is formed on the plurality of pairs of the high-frequency signal lines 2 a , 2 b and a top surface of the dielectric layer 1 .
- the insulation layer 3 of the flexible circuit board 100 has a surface on which a plurality of conductive paste coating zones 4 are formed through coating and each of the conductive paste coating zones 4 has a coating area that corresponds to one of the pairs of high-frequency signal lines 2 a , 2 b .
- the conductive paste coating zones 4 are formed of a conductive paste selected from one of silver paste, copper paste, and aluminum paste.
- An anisotropic conductive film 5 is formed on the surfaces of the insulation layer 3 and the conductive paste coating zones 4 of the flexible circuit board 100 .
- the anisotropic conductive film 5 is made of an insulation rein material 51 containing a plurality of conductive particles 52 therein.
- a shielding layer 6 is formed on the anisotropic conductive film 5 , so that the shielding layer 6 is set to cover, via the anisotropic conductive film 5 , the surface of the insulation layer 3 and the surface of the conductive paste coating zones 4 of the flexible circuit board 100 .
- the shielding layer 6 is formed of one of silver, copper, aluminum, and gold.
- the anisotropic conductive film 5 is pressed, at a predetermined temperature and a predetermined pressure, to bond between the conductive paste coating zones 4 and the shielding layer 6 .
- the conductive paste coating zones 4 and the shielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of the conductive particles 52 of the anisotropic conductive film 5 .
- the dielectric layer 1 comprises at least one grounding line 7 formed thereon and the grounding line 7 is electrically connected, via a conductive path 61 , to the shielding layer 6 .
- the dielectric layer 1 has an underside on which a conductive layer 8 is formed thereon, and then an insulation layer 9 is further formed on the conductive layer 8 .
- the plurality of pairs of the high-frequency signal lines 2 a , 2 b comprise at least one pair of differential-mode signal lines for transmission of differential-mode signals and may also comprise a common-mode signal lines for transmission of common-mode signals.
- FIG. 3 is a cross-sectional diagram showing a second embodiment of the present invention.
- FIG. 4 is an enlarged view of a circle portion “B” of FIG. 3 .
- the instant embodiment comprises components/parts that are generally similar to those of the first embodiment and similar components/parts are designated with the same reference numerals for consistency.
- the flexible circuit board 100 a similarly comprises a dielectric layer 1 , a plurality of pairs of high-frequency signal lines 2 a , 2 b that are adjacent to and insulated from each other, an insulation layer 3 , an anisotropic conductive film 5 , a shielding layer 6 , a grounding line 7 , a conductive layer 8 , and an insulation layer 9 .
- a top surface of the insulation layer 3 is coated and thus formed with an extended conductive paste coating zone 4 a , and the extended conductive paste coating zone 4 a has an extended coating area that correspondingly covers the plurality of pairs of the high-frequency signal lines 2 a , 2 b .
- the extended conductive paste coating zone 4 a is formed of conductive paste that comprises one of silver paste, copper paste, and aluminum paste.
- the shielding layer 6 is set to cover, via the anisotropic conductive film 5 , the surface of the insulation layer 3 and the extended conductive paste coating zone 4 a of the flexible circuit board 100 .
- the anisotropic conductive film 5 is pressed, at a predetermined temperature and a predetermined pressure, to bond between the extended conductive paste coating zone 4 a and the shielding layer 6 .
- the extended conductive paste coating zone 4 a and the shielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of conductive particles 52 of the anisotropic conductive film 5 .
- FIG. 5 is a cross-sectional diagram showing a third embodiment of the present invention.
- FIG. 6 is an enlarged view of a circle portion “C” of FIG. 5 .
- the flexible circuit board 100 b comprises a dielectric layer 1 and at least one signal line 2 formed on the top surface of the dielectric layer 1 .
- the signal line 2 is disposed for high-frequency applications.
- the signal line 2 may be used as a radio frequency signal transmission line for antenna.
- At least one conductive paste coating zone 4 is formed on the insulation layer 3 and corresponding to the signal line 2 .
- An anisotropic conductive film 5 is formed on the insulation layer 3 and the conductive paste coating zone 4 , made of different material composition from the conductive paste coating zone 4 and including an insulation resin material 51 containing a plurality of conductive particles 52 therein, as shown in FIG. 6 .
- a shielding layer 6 is formed on the anisotropic conductive film 5 and electrically connects to a grounding line 7 via a conductive path 61 .
- the conductive paste coating zones 4 and the shielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of the conductive particles 52 of the anisotropic conductive film 5 .
- FIG. 7 is a cross-sectional diagram showing a fourth embodiment of the present invention.
- FIG. 8 is an enlarged view of a circle portion “D” of FIG. 7 .
- the flexible circuit board 100 c comprises a dielectric layer 1 and a plurality of signal lines 2 formed on the top surface of the dielectric layer 1 . At least one of the signal lines 2 is disposed for high-frequency applications. For example, the at least one signal line 2 may be used as a radio frequency signal transmission line for antenna.
- An extended conductive paste coating zone 4 a is formed on the insulation layer 3 and has an extended coating area that correspondingly covers the plurality of signal lines 2 .
- An anisotropic conductive film 5 is formed on the insulation layer 3 and the extended conductive paste coating zone 4 a , made of different material composition from the extended conductive paste coating zone 4 a and including an insulation resin material 51 containing a plurality of conductive particles 52 therein, as shown in FIG. 8 .
- a shielding layer 6 is formed on the anisotropic conductive film 5 and electrically connects to a grounding line 7 via a conductive path 61 .
- the extended conductive paste coating zones 4 a and the shielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of the conductive particles 52 of the anisotropic conductive film 5 .
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
- This application is a continuation-in-part of U.S. patent application Ser. No. 15/664,031, filed on Jul. 31, 2017 and currently pending, entitled “ATTENUATION REDUCTION STRUCTURE FOR FLEXIBLE CIRCUIT BOARD.” This application also claims foreign priority to Taiwanese Patent Application No. 106109226, filed on Mar. 17, 2017, a certified copy of which was previously filed with application Ser. No. 15/664,031.
- The present invention relates to a signal attenuation shielding structure of a flexible circuit board, and in particular to a signal attenuation reduction structure that is formed by arranging a conductive paste coating zone in a flexible circuit board to correspond to at least one high-frequency signal line and an anisotropic conductive film arranged to provide electrical connection in a vertical direction between the conductive paste coating zone and a shielding layer.
- For all sorts of electronic devices that are contemporarily available, the amount of data transmitting through signal lines is getting larger and larger and thus, the number of signal transmission lines required is increased and frequencies at which signals are transmitting are also getting higher and higher.
- A high frequency signal transmission technique is achieved with two high frequency signal lines that are grouped as a signal pair to respectively transmit signals having identical amplitude, but at opposite phases so that the signal transmission lines are provided with an improved effect of suppressing electromagnetic interference.
- Although such a high frequency transmission technique greatly improves potential problems that might occur in the transmission of signals, yet poor designs may often cause problems, such as signal reflection, dispersion of electromagnetic wave, loss of signal in transmission and receipt, and signal waveform distortion, in actual applications.
- To suppress problems concerning interference of electromagnetic wave radiation and impedance match occurring in a high frequency signal line of a flexible circuit board, it is common to adopt a structure including a copper- or aluminum-based shielding layer; however, the thickness involved is relatively large and flexibility is poor. It is also common heretofore to form such a shielding layer by coating a silver paste layer; however, material cost is high and manufacturing processes are complicated.
- In view of the drawbacks of the prior art, an objective of the present invention is to provide a high-frequency signal attenuation reduction structure that is formed by combining a conductive paste coating zone, anisotropic conductive film, and a shielding layer together.
- The technical solution that the present invention adopts to achieve the above objective is that at least one conductive paste coating zone is formed on a surface of high-frequency signal lines and an insulation layer that are formed on a dielectric layer of a flexible circuit board such that the conductive paste coating zone corresponds to at least one high-frequency signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction by means of the anisotropic conductive film.
- In the above solution, the conductive paste coating zone is formed of a conductive paste selected from one of silver paste, copper paste, and aluminum paste.
- In the above solution, the shielding layer is formed of a material selected from one of silver, copper, aluminum, and gold.
- In the above solution, the dielectric layer comprises at least one grounding line formed thereon and the grounding line is electrically connected through a conductive path to the shielding layer
- In the above solution, the anisotropic conductive film is pressed at a predetermined temperature and a predetermined pressure to bond between the conductive paste coating zone and the shielding layer.
- In the above solution, the plurality of pairs of high-frequency signal lines comprise at least one pair of differential-mode signal lines.
- In another embodiment of the present invention, the conductive paste coating zone is coated in an area that covers a plurality of pairs of high-frequency signal lines.
- The efficacy of the present invention is that, as compared to the structure of the prior art copper- or aluminum-based shielding layer, the present invention offers advantages including having a smaller thickness and better flexibility and, as compared to the prior art shielding layer that is formed by coating a layer of silver paste, the present invention offers advantages of low material cost and simplified manufacturing process.
- The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments of the present invention, with reference to the attached drawings, in which:
-
FIG. 1 is a cross-sectional diagram showing a first embodiment of the present invention; -
FIG. 2 is an enlarged view of a circle portion “A” ofFIG. 1 ; -
FIG. 3 is a cross-sectional diagram showing a second embodiment of the present invention; -
FIG. 4 is an enlarged view of a circle portion “B” ofFIG. 3 ; -
FIG. 5 is a cross-sectional diagram showing a third embodiment of the present invention; -
FIG. 6 is an enlarged view of a circle portion “C” ofFIG. 5 ; -
FIG. 7 is a cross-sectional diagram showing a fourth embodiment of the present invention; and -
FIG. 8 is an enlarged view of a circle portion “D” ofFIG. 7 . - Referring collectively to
FIGS. 1 and 2 ,FIG. 1 is a cross-sectional diagram showing a first embodiment of the present invention andFIG. 2 is an enlarged view of a circle portion “A” ofFIG. 1 . As shown in the drawings, aflexible circuit board 100 comprises adielectric layer 1 on which a plurality of pairs of high-frequency signal lines insulation layer 3 is formed on the plurality of pairs of the high-frequency signal lines dielectric layer 1. - The
insulation layer 3 of theflexible circuit board 100 has a surface on which a plurality of conductivepaste coating zones 4 are formed through coating and each of the conductivepaste coating zones 4 has a coating area that corresponds to one of the pairs of high-frequency signal lines paste coating zones 4 are formed of a conductive paste selected from one of silver paste, copper paste, and aluminum paste. - An anisotropic
conductive film 5 is formed on the surfaces of theinsulation layer 3 and the conductivepaste coating zones 4 of theflexible circuit board 100. The anisotropicconductive film 5 is made of an insulationrein material 51 containing a plurality ofconductive particles 52 therein. - A
shielding layer 6 is formed on the anisotropicconductive film 5, so that theshielding layer 6 is set to cover, via the anisotropicconductive film 5, the surface of theinsulation layer 3 and the surface of the conductivepaste coating zones 4 of theflexible circuit board 100. Theshielding layer 6 is formed of one of silver, copper, aluminum, and gold. The anisotropicconductive film 5 is pressed, at a predetermined temperature and a predetermined pressure, to bond between the conductivepaste coating zones 4 and theshielding layer 6. The conductivepaste coating zones 4 and theshielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of theconductive particles 52 of the anisotropicconductive film 5. - The
dielectric layer 1 comprises at least onegrounding line 7 formed thereon and thegrounding line 7 is electrically connected, via aconductive path 61, to theshielding layer 6. Thedielectric layer 1 has an underside on which aconductive layer 8 is formed thereon, and then aninsulation layer 9 is further formed on theconductive layer 8. - The plurality of pairs of the high-
frequency signal lines -
FIG. 3 is a cross-sectional diagram showing a second embodiment of the present invention.FIG. 4 is an enlarged view of a circle portion “B” ofFIG. 3 . The instant embodiment comprises components/parts that are generally similar to those of the first embodiment and similar components/parts are designated with the same reference numerals for consistency. In the instant embodiment, theflexible circuit board 100 a similarly comprises adielectric layer 1, a plurality of pairs of high-frequency signal lines insulation layer 3, an anisotropicconductive film 5, ashielding layer 6, agrounding line 7, aconductive layer 8, and aninsulation layer 9. - In the instant embodiment, a top surface of the
insulation layer 3 is coated and thus formed with an extended conductivepaste coating zone 4 a, and the extended conductivepaste coating zone 4 a has an extended coating area that correspondingly covers the plurality of pairs of the high-frequency signal lines paste coating zone 4 a is formed of conductive paste that comprises one of silver paste, copper paste, and aluminum paste. - The
shielding layer 6 is set to cover, via the anisotropicconductive film 5, the surface of theinsulation layer 3 and the extended conductivepaste coating zone 4 a of theflexible circuit board 100. The anisotropicconductive film 5 is pressed, at a predetermined temperature and a predetermined pressure, to bond between the extended conductivepaste coating zone 4 a and theshielding layer 6. The extended conductivepaste coating zone 4 a and theshielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means ofconductive particles 52 of the anisotropicconductive film 5. -
FIG. 5 is a cross-sectional diagram showing a third embodiment of the present invention.FIG. 6 is an enlarged view of a circle portion “C” ofFIG. 5 . In the instant embodiment, theflexible circuit board 100 b comprises adielectric layer 1 and at least onesignal line 2 formed on the top surface of thedielectric layer 1. Thesignal line 2 is disposed for high-frequency applications. For example, thesignal line 2 may be used as a radio frequency signal transmission line for antenna. - At least one conductive
paste coating zone 4 is formed on theinsulation layer 3 and corresponding to thesignal line 2. An anisotropicconductive film 5 is formed on theinsulation layer 3 and the conductivepaste coating zone 4, made of different material composition from the conductivepaste coating zone 4 and including aninsulation resin material 51 containing a plurality ofconductive particles 52 therein, as shown inFIG. 6 . - A
shielding layer 6 is formed on the anisotropicconductive film 5 and electrically connects to agrounding line 7 via aconductive path 61. The conductivepaste coating zones 4 and theshielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of theconductive particles 52 of the anisotropicconductive film 5. -
FIG. 7 is a cross-sectional diagram showing a fourth embodiment of the present invention.FIG. 8 is an enlarged view of a circle portion “D” ofFIG. 7 . In the instant embodiment, theflexible circuit board 100 c comprises adielectric layer 1 and a plurality ofsignal lines 2 formed on the top surface of thedielectric layer 1. At least one of thesignal lines 2 is disposed for high-frequency applications. For example, the at least onesignal line 2 may be used as a radio frequency signal transmission line for antenna. - An extended conductive
paste coating zone 4 a is formed on theinsulation layer 3 and has an extended coating area that correspondingly covers the plurality ofsignal lines 2. An anisotropicconductive film 5 is formed on theinsulation layer 3 and the extended conductivepaste coating zone 4 a, made of different material composition from the extended conductivepaste coating zone 4 a and including aninsulation resin material 51 containing a plurality ofconductive particles 52 therein, as shown inFIG. 8 . - A
shielding layer 6 is formed on the anisotropicconductive film 5 and electrically connects to agrounding line 7 via aconductive path 61. The extended conductivepaste coating zones 4 a and theshielding layer 6 achieve an electrical connection therebetween in the vertical direction V (namely Z-axis direction) by means of theconductive particles 52 of the anisotropicconductive film 5. - Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US15/920,915 US10080277B1 (en) | 2017-03-17 | 2018-03-14 | Attenuation reduction structure for flexible circuit board |
US16/044,962 US10159143B1 (en) | 2017-07-31 | 2018-07-25 | Attenuation reduction structure for flexible circuit board |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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TW106109226A | 2017-03-17 | ||
TW106109226 | 2017-03-17 | ||
TW106109226A TWI658753B (en) | 2017-03-17 | 2017-03-17 | Signal anti-attenuation shielding structure of flexible circuit board |
US15/664,031 US9942984B1 (en) | 2017-03-17 | 2017-07-31 | Attenuation reduction structure for flexible circuit board |
US15/920,915 US10080277B1 (en) | 2017-03-17 | 2018-03-14 | Attenuation reduction structure for flexible circuit board |
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US15/664,031 Continuation-In-Part US9942984B1 (en) | 2017-03-17 | 2017-07-31 | Attenuation reduction structure for flexible circuit board |
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US16/044,962 Continuation-In-Part US10159143B1 (en) | 2017-07-31 | 2018-07-25 | Attenuation reduction structure for flexible circuit board |
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US20180270947A1 true US20180270947A1 (en) | 2018-09-20 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111540993A (en) * | 2019-12-16 | 2020-08-14 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
WO2020209644A1 (en) * | 2019-04-09 | 2020-10-15 | Samsung Electronics Co., Ltd. | Flexible printed circuit board and electronic device including the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2817704B2 (en) * | 1996-04-25 | 1998-10-30 | 日本電気株式会社 | Tape carrier package and connection method |
US20030080826A1 (en) * | 2001-10-30 | 2003-05-01 | Walker Chen | Method of shortening a microwave circuit and the printed circuit board made by using said method |
JP4575189B2 (en) * | 2005-02-21 | 2010-11-04 | タツタ電線株式会社 | Shield film for shielded flexible printed circuit board and shielded flexible printed circuit board using the same |
JP2006313834A (en) * | 2005-05-09 | 2006-11-16 | Nitto Denko Corp | Method of manufacturing wiring circuit board |
JP4319167B2 (en) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method |
US8130005B2 (en) * | 2006-12-14 | 2012-03-06 | Formfactor, Inc. | Electrical guard structures for protecting a signal trace from electrical interference |
JP2009177010A (en) * | 2008-01-25 | 2009-08-06 | Toshiba Corp | Flexible printed circuit board and electronic apparatus |
JP4934166B2 (en) * | 2009-05-25 | 2012-05-16 | 住友電気工業株式会社 | Electrode adhesive connection structure, electronic device and assembly method thereof |
WO2013077108A1 (en) * | 2011-11-24 | 2013-05-30 | タツタ電線株式会社 | Shield film, shielded printed wiring board, and method for manufacturing shield film |
JP6240376B2 (en) * | 2012-07-13 | 2017-11-29 | タツタ電線株式会社 | Shield film and shield printed wiring board |
TWI578857B (en) * | 2013-06-19 | 2017-04-11 | Adv Flexible Circuits Co Ltd | Flexible circuit board differential mode signal transmission line anti - attenuation grounding structure |
JP2015015304A (en) * | 2013-07-03 | 2015-01-22 | 信越ポリマー株式会社 | Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, electronic equipment, and method for manufacturing the same |
-
2018
- 2018-03-14 US US15/920,915 patent/US10080277B1/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020209644A1 (en) * | 2019-04-09 | 2020-10-15 | Samsung Electronics Co., Ltd. | Flexible printed circuit board and electronic device including the same |
US11363712B2 (en) | 2019-04-09 | 2022-06-14 | Samsung Electronics Co., Ltd. | Flexible printed circuit board and electronic device including the same |
CN111540993A (en) * | 2019-12-16 | 2020-08-14 | 瑞声科技(新加坡)有限公司 | Transmission line and terminal device |
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