US20180220547A9 - Thermal cooling interface for electrical joints - Google Patents
Thermal cooling interface for electrical joints Download PDFInfo
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- US20180220547A9 US20180220547A9 US15/216,393 US201615216393A US2018220547A9 US 20180220547 A9 US20180220547 A9 US 20180220547A9 US 201615216393 A US201615216393 A US 201615216393A US 2018220547 A9 US2018220547 A9 US 2018220547A9
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- Prior art keywords
- thermal cooling
- conductive component
- cooling interface
- walls
- conductive
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/14—Rails or bus-bars constructed so that the counterparts can be connected thereto at any point along their length
- H01R25/145—Details, e.g. end pieces or joints
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
Definitions
- the field of the invention relates generally to electrical joints, and, more particularly, to a thermal cooling interface for electrical joints.
- elongated rectangular flat conductive busbar members may be arranged within electrical bus sections for transporting multi-phase high current electric power through industrial, commercial, and/or residential establishments. Successive elongated bus sections are electrically connected or interlocked together to provide electrical continuity between a power source and a power consuming load.
- bus joints When bus sections are electrically interconnected in a conventional installation, a self-contained bus joint is typically employed.
- the bus joint is one example of an electrical joint.
- the bus sections and the bus joint generate enough heat when transporting power that the amount of heat generated can damage or otherwise reduce the performance of the bus system. Accordingly, bus joints should satisfy UL/IEC specifications to prevent such damage.
- the connection point between the bus sections and the bus joint is generally the hottest portion of bus systems. Even with the use of thermally conductive materials throughout the bus sections and the bus joint, the generated heat may be sufficient to cause component damage. Further, similar thermal issues may be encountered in other types of electrical joints.
- an electrical joint in one aspect, includes a first conductive component, a second conductive component, and a thermal cooling interface positioned between the first and second conductive components, the thermal cooling interface including a base plate coupled to the first conductive component, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- a thermal cooling interface for electrically coupling a first conductive component to a second conductive component.
- the thermal cooling interface is positionable between the first and second conductive components and includes a base plate coupled to the first conductive component when the thermal cooling interface is positioned between the first and second conductive components, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, the plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- a method of assembling an electrical joint includes positioning first and second conductive components proximate one another, positioning a thermal cooling interface between the first and second conductive components, the thermal cooling interface including a base plate coupled to the first conductive component, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, the plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, and coupling the first conductive component to the second conductive component using at least one of a fastener and a clamp, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- an electrical joint in yet another aspect, includes a first conductive component including a first thermal cooling interface portion having a first plurality of walls, and a second conductive component including a second thermal cooling interface portion having a second plurality of walls, wherein the first plurality of walls contact the second plurality of walls to define a plurality of cooling channels that channel air therethrough to facilitate cooling said first and second conductive components, and wherein the first and second thermal cooling interface portions define a current path between the first and second conductive components.
- FIG. 1 is a perspective view an exemplary electrical joint including two conductive components electrically coupled to one another using a thermal cooling interface.
- FIG. 2 is a top perspective view of the electrical joint shown in FIG. 1 .
- FIG. 3 is a perspective view of an exemplary thermal cooling interface that may be used with the electrical joint shown in FIG. 1 .
- FIG. 4 is a perspective view of an enlarged portion of the thermal cooling interface shown in FIG. 3 .
- FIG. 5 is a diagram showing air flow though the thermal cooling interface shown in FIG. 3 .
- FIG. 6 is a perspective view of an alternative exemplary thermal cooling interface.
- FIG. 7 is a perspective view of an exemplary conductive component with an integrated thermal cooling interface portion.
- FIG. 8 is a perspective view of an exemplary electrical joint formed using two of the conductive components shown in FIG. 7 .
- an “electrical joint” refers to any joint electrically coupling two or more conductive components.
- the electrical joint may be, for example, a bus joint in a bus system.
- a “bus joint” refers to a portion of a bus system (e.g., a joint, section, fitting, etc.) that joins two or more busbars.
- the thermal cooling interface includes a plurality of walls extending from a base plate.
- the plurality of walls define a plurality of cooling channels to facilitate passive cooling between two connected conductive components.
- the thermal cooling interface may be coupled between two busbars.
- FIG. 1 is a perspective view of an exemplary electrical joint 100 .
- FIG. 2 is a top perspective view of electrical joint 100 .
- Electrical joint 100 includes two conductive components 102 electrical coupled to each other using a thermal cooling interface 104 .
- thermal cooling interface 104 is positioned between conductive components 102 .
- conductive components 102 are busbars.
- conductive components 102 may be busbars in a single-phase system or three-phase system, and may include a protective coating outer layer (not shown) to prevent arcing between busbars of different phases.
- the busbars are both approximately 0.25 inches thick and 4.0 inches wide. In other embodiments, the busbars may have any dimensions that enable electrical joint 100 to function as described herein.
- conductive components 102 may be any conductive components capable of being electrically coupled to one another using thermal cooling interface 104 .
- one or more fasteners 106 are used to couple conductive components 102 and thermal cooling interface 104 .
- Fasteners 106 include, but are not limited to, screws, bolts, and/or clamps. Further, fasteners 106 may be thermally and/or electrically conductive. In some embodiments, one or more clamps (not shown) are used to couple conductive components 102 and thermal cooling interface 104
- Thermal cooling interface 104 defines a plurality of cooling channels 108 between conductive components 102 .
- at least some known temperature control elements use heat sinks, cooling fins, etc. to radiate heat.
- thermal cooling interface 104 passively causes air to flow through cooling channels 108 , as described herein.
- cooling channels 108 are vertically oriented in the exemplary embodiment. Specifically, each cooling channel 108 has a longitudinal axis 109 that makes an angle, a, of approximately 90° with a horizontal plane 110 .
- Horizontal plane 110 may be, for example, generally parallel to the surface of the Earth (i.e., the ground).
- thermal cooling interface 104 Because of the vertical orientation, air is pulled into a bottom 112 of electrical joint and flows upwards (i.e., away from bottom 112 of electrical joint 100 towards a top 114 of electrical joint 100 ) through thermal cooling interface 104 . This flow of air from bottom 112 to top 114 facilitates substantially cooling conductive components 102 .
- conductive components 102 are busbars having a thickness of 0.5 inches and a width of 4.0 inches and are electrically coupled to one another without thermal cooling interface 104 , the temperature of electrical joint 100 increases approximately 65° Fahrenheit (F) with approximately 1425 Amps (A) of current flowing through conductive components 102 .
- thermal cooling interface 104 positioned between conductive components 102 that are busbars having a thickness of 0.5 inches and a width of 4.0 inches, the temperature of electrical joint 100 does not increase by 65° F. until approximately 1550 A of current flows through conductive components 102 .
- the angle ⁇ is less than 90°.
- the angle ⁇ may be any angle between and including approximately 45° and approximately 90°.
- cooling channels 108 are substantially horizontally oriented, and little air flow occurs through cooling channels 108 , substantially reducing the passive cooling benefits of thermal cooling interface 104 .
- FIG. 3 is a perspective view of thermal cooling interface 104 .
- FIG. 4 is an enlarged view of a portion of thermal cooling interface 104 .
- FIG. 5 is a diagram showing air flow though thermal cooling interface 104 .
- thermal cooling interface 104 includes a base plate 202 and a plurality of walls 204 extending substantially orthogonally from base plate 202 .
- base plate 202 contacts one of conductive components 102
- top surfaces 205 of walls 204 contact the other of conductive components 102 to enclose cooling channels 108 .
- each wall 204 extends from a leading edge 206 to a trailing edge 208 .
- leading and trailing edges 206 and 208 of each wall 204 have an aerodynamic profile 207 to facilitate maximum air flow through cooling channels 108 . That is, leading and trailing edges 206 and 208 are chamfered, include a lead-in angle, and/or are otherwise shaped to increase air flow through cooling channels 108 .
- thermal cooling interface 104 is symmetrical about a first symmetry axis 209 and a second symmetry axis 211 . Accordingly, thermal cooling interface 104 functions identically, whether positioned as shown in FIGS. 1 and 2 , or rotated 180° about first symmetry axis 209 .
- interfaces 220 between walls 204 and base plate 202 are substantially arcuate. Accordingly, an inlet 222 for each cooling channel 108 has a substantially U-shaped profile, further improving air flow through cooling channels 108 .
- the arcuate interfaces 220 also increase the structural strength of thermal cooling interface 104 to prevent buckling.
- the various aerodynamic features of thermal cooling interface 104 facilitate eliminating any eddy currents that would otherwise reduce efficiency.
- Walls 204 of thermal cooling interface 104 include two side walls 224 , each side wall 224 having a plurality of apertures 226 defined therethrough.
- each side wall 224 includes seven circular apertures 226 .
- each side wall 224 may include any number of apertures 226 having any shape that enables thermal cooling interface 104 to function as described herein.
- apertures 226 also facilitate improving air flow through thermal cooling interface 104 . Specifically, for each side wall 224 , during operation, cool air flows into three of apertures 226 and hot air flows out of four of apertures 226 . Cool air is entrained into the three apertures 226 by the air flow through cooling channels 108 .
- thermal cooling interface 104 includes a plurality of fastener apertures 230 defined therethrough.
- Fastener apertures 230 are sized and oriented to receive fasteners 106 (shown in FIGS. 1 and 2 ) such that fasteners 106 extend through thermal cooling interface 104 .
- Each fastener aperture is defined by a compression limiting feature 232 extending from base plate 202 .
- Compression limiting feature 232 is relatively thick to facilitate preventing damage to thermal cooling interface 104 when thermal cooling interface 104 is clamped between conductive components 102 (e.g., by tightening or clamping fasteners 106 ).
- compression limiting features 232 obstruct and modify the air flow through at least some of the plurality of cooling channels 108 .
- high pressure zones 234 are formed on either side of each compression limiting features 232 , as shown in FIG. 5 .
- at least some of walls 204 include pressure relief apertures 236 defined therethrough proximate high pressures zones 234 .
- Pressure relief apertures 236 facilitate directing air flow out of high pressures zones 234 into adjacent cooling channels 108 , as shown in FIG. 5 .
- at least some of apertures 226 are positioned proximate pressure relief apertures 236 .
- pressure relief apertures 236 are substantially U-shaped. Alternatively, pressure relief apertures 236 may have any shape that enables thermal cooling interface 104 to function as described herein.
- thermal cooling interface 104 facilitates passively cooling electrical joint 100 . That is, to realize the cooling benefits of thermal cooling interface 104 , no active devices (e.g., fans) need to be used to stimulate air flow through cooling channels 108 . Rather, the shape and orientation of thermal cooling interface 104 passively causes air to flow through cooling channels 108 . In some embodiments, a fan may be used to further enhance performance of thermal cooling interface 104 . Accordingly, the combination of various features of thermal cooling interface 104 , as described herein, provide significant cooling benefits over at least some known temperature control devices (e.g., heat sinks, cooling fins, etc.).
- temperature control devices e.g., heat sinks, cooling fins, etc.
- Thermal cooling interface 104 may be formed, for example, using machining techniques. Further, thermal cooling interface 104 has a depth, D, of approximately 0.5 inches in the exemplary embodiment. Additionally, to facilitate electrically coupling conductive components 102 to one another, thermal cooling interface 104 is formed of an electrically and thermally conductive material (e.g., copper). Accordingly, one conductive component 102 , thermal cooling interface 104 , and the other conductive component 102 are electrically coupled in series, and thermal cooling interface 104 defines a current path 250 (shown in FIG. 2 ) between conductive components 102 . That is, when current flows between conductive components 102 , current flows through thermal cooling interface 104 . Alternatively, thermal cooling interface 104 may have any dimensions and/or composition, and/or be formed using any manufacturing techniques that enable thermal cooling interface 104 to function as described herein.
- thermal cooling interface 104 may have any dimensions and/or composition, and/or be formed using any manufacturing techniques that enable thermal cooling interface 104 to function as described herein.
- FIG. 6 is a perspective view of an alternative thermal cooling interface 604 formed using additive manufacturing techniques (e.g., three-dimensional printing).
- Thermal cooling interface 604 is substantially similar to thermal cooling interface 104 .
- thermal cooling interface 604 includes two base plates 602 (as opposed to a single base plate 202 ), with walls 606 extending between base plates 602 .
- Base plates 602 may be plated with suitable metals (e.g., silver, gold, etc.). Base plates in other embodiments may also be plated with suitable metals.
- thermal cooling interface 604 includes arcuate interfaces 620 at both the top and bottom of each wall 606 , further increasing cooling flow through cooling channels 608 defined by walls 606 .
- the thermal cooling interface is a separate component from conductive components 102 .
- the thermal cooling interface may be integrated with conductive components 102 .
- FIG. 7 is a perspective view of a conductive component 702 that includes an integrated thermal cooling interface portion 704 .
- Thermal cooling interface portion 704 may be formed, for example, by milling material of conductive component 702 .
- Thermal cooling interface portion 704 includes a base plate 710 and a plurality of walls Similar to thermal cooling interface 104 , thermal cooling interface portion 704 includes a base plate 710 and a plurality of walls 712 . However, thermal cooling interface portion 704 has a depth, D′, that is approximately one-half the depth D of thermal cooling interface 104 . For example, thermal cooling interface portion 704 may have a depth D′ of approximately 0.25 inches.
- thermal cooling interface portion 704 is integral with conductive component 702 , thermal cooling interface portion 704 only includes a single side wall 714 having apertures 716 . Further, because of the limited depth, each aperture 716 is approximately half the size of apertures 226 .
- two conductive components 702 are coupled to one another.
- two thermal cooling interface portions 704 i.e., one from each conductive component 102
- complete thermal cooling interface 706 functions substantially similar to thermal cooling interface 104 and thermal cooling interface 604 .
- the systems and methods described herein provide an electrical joint including a thermal cooling interface positioned between first and second electrical components.
- the thermal cooling interface includes a plurality of walls that define a plurality of cooling channels.
- the cooling channels channel air therethrough to facilitate cooling the first and second conductive components
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Abstract
Description
- The field of the invention relates generally to electrical joints, and, more particularly, to a thermal cooling interface for electrical joints.
- Electrical joints joining two or more conductive components are used in a variety of industries. For example, in electrical power distribution systems, elongated rectangular flat conductive busbar members may be arranged within electrical bus sections for transporting multi-phase high current electric power through industrial, commercial, and/or residential establishments. Successive elongated bus sections are electrically connected or interlocked together to provide electrical continuity between a power source and a power consuming load.
- When bus sections are electrically interconnected in a conventional installation, a self-contained bus joint is typically employed. The bus joint is one example of an electrical joint. In at least some scenarios, the bus sections and the bus joint generate enough heat when transporting power that the amount of heat generated can damage or otherwise reduce the performance of the bus system. Accordingly, bus joints should satisfy UL/IEC specifications to prevent such damage. The connection point between the bus sections and the bus joint is generally the hottest portion of bus systems. Even with the use of thermally conductive materials throughout the bus sections and the bus joint, the generated heat may be sufficient to cause component damage. Further, similar thermal issues may be encountered in other types of electrical joints.
- In one aspect, an electrical joint is provided. The electrical joint includes a first conductive component, a second conductive component, and a thermal cooling interface positioned between the first and second conductive components, the thermal cooling interface including a base plate coupled to the first conductive component, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- In another aspect, a thermal cooling interface for electrically coupling a first conductive component to a second conductive component is provided. The thermal cooling interface is positionable between the first and second conductive components and includes a base plate coupled to the first conductive component when the thermal cooling interface is positioned between the first and second conductive components, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, the plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- In yet another aspect, a method of assembling an electrical joint is provided. The method includes positioning first and second conductive components proximate one another, positioning a thermal cooling interface between the first and second conductive components, the thermal cooling interface including a base plate coupled to the first conductive component, and a plurality of walls extending orthogonally from the base plate towards the second conductive component, the plurality of walls defining a plurality of cooling channels that channel air therethrough to facilitate cooling the first and second conductive components, and coupling the first conductive component to the second conductive component using at least one of a fastener and a clamp, wherein the first conductive component, the thermal cooling interface, and the second conductive component are electrically coupled in series.
- In yet another aspect, an electrical joint is provided. The electrical joint includes a first conductive component including a first thermal cooling interface portion having a first plurality of walls, and a second conductive component including a second thermal cooling interface portion having a second plurality of walls, wherein the first plurality of walls contact the second plurality of walls to define a plurality of cooling channels that channel air therethrough to facilitate cooling said first and second conductive components, and wherein the first and second thermal cooling interface portions define a current path between the first and second conductive components.
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FIG. 1 is a perspective view an exemplary electrical joint including two conductive components electrically coupled to one another using a thermal cooling interface. -
FIG. 2 is a top perspective view of the electrical joint shown inFIG. 1 . -
FIG. 3 is a perspective view of an exemplary thermal cooling interface that may be used with the electrical joint shown inFIG. 1 . -
FIG. 4 is a perspective view of an enlarged portion of the thermal cooling interface shown inFIG. 3 . -
FIG. 5 is a diagram showing air flow though the thermal cooling interface shown inFIG. 3 . -
FIG. 6 is a perspective view of an alternative exemplary thermal cooling interface. -
FIG. 7 is a perspective view of an exemplary conductive component with an integrated thermal cooling interface portion. -
FIG. 8 is a perspective view of an exemplary electrical joint formed using two of the conductive components shown inFIG. 7 . - Various embodiments disclosed herein provide electrical joints with thermal cooling interfaces for electrically coupling conductive components. As used herein, an “electrical joint” refers to any joint electrically coupling two or more conductive components. The electrical joint may be, for example, a bus joint in a bus system. As used herein, a “bus joint” refers to a portion of a bus system (e.g., a joint, section, fitting, etc.) that joins two or more busbars.
- In the embodiments described herein, the thermal cooling interface includes a plurality of walls extending from a base plate. The plurality of walls define a plurality of cooling channels to facilitate passive cooling between two connected conductive components. For example, the thermal cooling interface may be coupled between two busbars.
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FIG. 1 is a perspective view of an exemplaryelectrical joint 100.FIG. 2 is a top perspective view ofelectrical joint 100.Electrical joint 100 includes twoconductive components 102 electrical coupled to each other using athermal cooling interface 104. Specifically,thermal cooling interface 104 is positioned betweenconductive components 102. In the exemplary embodiment,conductive components 102 are busbars. For example,conductive components 102 may be busbars in a single-phase system or three-phase system, and may include a protective coating outer layer (not shown) to prevent arcing between busbars of different phases. In one embodiment, the busbars are both approximately 0.25 inches thick and 4.0 inches wide. In other embodiments, the busbars may have any dimensions that enableelectrical joint 100 to function as described herein. Alternatively,conductive components 102 may be any conductive components capable of being electrically coupled to one another usingthermal cooling interface 104. - As shown in
FIG. 1 , in the exemplary embodiment, one ormore fasteners 106 are used to coupleconductive components 102 andthermal cooling interface 104.Fasteners 106 include, but are not limited to, screws, bolts, and/or clamps. Further,fasteners 106 may be thermally and/or electrically conductive. In some embodiments, one or more clamps (not shown) are used to coupleconductive components 102 andthermal cooling interface 104 -
Thermal cooling interface 104 defines a plurality ofcooling channels 108 betweenconductive components 102. Notably, at least some known temperature control elements use heat sinks, cooling fins, etc. to radiate heat. In contrast,thermal cooling interface 104 passively causes air to flow throughcooling channels 108, as described herein. As shown inFIGS. 1 and 2 ,cooling channels 108 are vertically oriented in the exemplary embodiment. Specifically, eachcooling channel 108 has alongitudinal axis 109 that makes an angle, a, of approximately 90° with ahorizontal plane 110.Horizontal plane 110 may be, for example, generally parallel to the surface of the Earth (i.e., the ground). Because of the vertical orientation, air is pulled into abottom 112 of electrical joint and flows upwards (i.e., away frombottom 112 ofelectrical joint 100 towards atop 114 of electrical joint 100) throughthermal cooling interface 104. This flow of air frombottom 112 totop 114 facilitates substantially coolingconductive components 102. For example, it was experimentally demonstrated that ifconductive components 102 are busbars having a thickness of 0.5 inches and a width of 4.0 inches and are electrically coupled to one another withoutthermal cooling interface 104, the temperature ofelectrical joint 100 increases approximately 65° Fahrenheit (F) with approximately 1425 Amps (A) of current flowing throughconductive components 102. In contrast, withthermal cooling interface 104 positioned betweenconductive components 102 that are busbars having a thickness of 0.5 inches and a width of 4.0 inches, the temperature ofelectrical joint 100 does not increase by 65° F. until approximately 1550 A of current flows throughconductive components 102. - In other embodiments, the angle α is less than 90°. For example, the angle α may be any angle between and including approximately 45° and approximately 90°. Notably, if the angle α is less than approximately 45°,
cooling channels 108 are substantially horizontally oriented, and little air flow occurs throughcooling channels 108, substantially reducing the passive cooling benefits ofthermal cooling interface 104. -
FIG. 3 is a perspective view ofthermal cooling interface 104.FIG. 4 is an enlarged view of a portion ofthermal cooling interface 104.FIG. 5 is a diagram showing air flow thoughthermal cooling interface 104. As shown inFIG. 3 ,thermal cooling interface 104 includes abase plate 202 and a plurality ofwalls 204 extending substantially orthogonally frombase plate 202. During operation,base plate 202 contacts one ofconductive components 102, andtop surfaces 205 ofwalls 204 contact the other ofconductive components 102 to enclose coolingchannels 108. - In the exemplary embodiment, each
wall 204 extends from aleading edge 206 to a trailingedge 208. Notably, as best shown inFIG. 4 , in the exemplary embodiment, leading and trailingedges wall 204 have anaerodynamic profile 207 to facilitate maximum air flow through coolingchannels 108. That is, leading and trailingedges channels 108. Further, in the exemplary embodiment,thermal cooling interface 104 is symmetrical about afirst symmetry axis 209 and asecond symmetry axis 211. Accordingly,thermal cooling interface 104 functions identically, whether positioned as shown inFIGS. 1 and 2 , or rotated 180° aboutfirst symmetry axis 209. - As best shown in
FIG. 4 , in the exemplary embodiment, interfaces 220 betweenwalls 204 andbase plate 202 are substantially arcuate. Accordingly, aninlet 222 for each coolingchannel 108 has a substantially U-shaped profile, further improving air flow through coolingchannels 108. Thearcuate interfaces 220 also increase the structural strength ofthermal cooling interface 104 to prevent buckling. The various aerodynamic features ofthermal cooling interface 104 facilitate eliminating any eddy currents that would otherwise reduce efficiency. -
Walls 204 ofthermal cooling interface 104 include twoside walls 224, eachside wall 224 having a plurality ofapertures 226 defined therethrough. In the exemplary embodiment, eachside wall 224 includes sevencircular apertures 226. Alternatively, eachside wall 224 may include any number ofapertures 226 having any shape that enablesthermal cooling interface 104 to function as described herein. As shown inFIG. 5 ,apertures 226 also facilitate improving air flow throughthermal cooling interface 104. Specifically, for eachside wall 224, during operation, cool air flows into three ofapertures 226 and hot air flows out of four ofapertures 226. Cool air is entrained into the threeapertures 226 by the air flow through coolingchannels 108. - In the exemplary embodiment,
thermal cooling interface 104 includes a plurality offastener apertures 230 defined therethrough.Fastener apertures 230 are sized and oriented to receive fasteners 106 (shown inFIGS. 1 and 2 ) such thatfasteners 106 extend throughthermal cooling interface 104. Each fastener aperture is defined by acompression limiting feature 232 extending frombase plate 202.Compression limiting feature 232 is relatively thick to facilitate preventing damage tothermal cooling interface 104 whenthermal cooling interface 104 is clamped between conductive components 102 (e.g., by tightening or clamping fasteners 106). - Notably,
compression limiting features 232 obstruct and modify the air flow through at least some of the plurality of coolingchannels 108. Specifically,high pressure zones 234 are formed on either side of eachcompression limiting features 232, as shown inFIG. 5 . Accordingly, in the exemplary embodiment, at least some ofwalls 204 includepressure relief apertures 236 defined therethrough proximatehigh pressures zones 234.Pressure relief apertures 236 facilitate directing air flow out ofhigh pressures zones 234 intoadjacent cooling channels 108, as shown inFIG. 5 . Further, in the exemplary embodiment, at least some ofapertures 226 are positioned proximatepressure relief apertures 236. This facilitates minimizing an impactcompression limiting features 232 have on air flow throughthermal cooling interface 104. In the exemplary embodiment,pressure relief apertures 236 are substantially U-shaped. Alternatively,pressure relief apertures 236 may have any shape that enablesthermal cooling interface 104 to function as described herein. - Notably,
thermal cooling interface 104 facilitates passively coolingelectrical joint 100. That is, to realize the cooling benefits ofthermal cooling interface 104, no active devices (e.g., fans) need to be used to stimulate air flow through coolingchannels 108. Rather, the shape and orientation ofthermal cooling interface 104 passively causes air to flow through coolingchannels 108. In some embodiments, a fan may be used to further enhance performance ofthermal cooling interface 104. Accordingly, the combination of various features ofthermal cooling interface 104, as described herein, provide significant cooling benefits over at least some known temperature control devices (e.g., heat sinks, cooling fins, etc.). -
Thermal cooling interface 104 may be formed, for example, using machining techniques. Further,thermal cooling interface 104 has a depth, D, of approximately 0.5 inches in the exemplary embodiment. Additionally, to facilitate electrically couplingconductive components 102 to one another,thermal cooling interface 104 is formed of an electrically and thermally conductive material (e.g., copper). Accordingly, oneconductive component 102,thermal cooling interface 104, and the otherconductive component 102 are electrically coupled in series, andthermal cooling interface 104 defines a current path 250 (shown inFIG. 2 ) betweenconductive components 102. That is, when current flows betweenconductive components 102, current flows throughthermal cooling interface 104. Alternatively,thermal cooling interface 104 may have any dimensions and/or composition, and/or be formed using any manufacturing techniques that enablethermal cooling interface 104 to function as described herein. - For example,
FIG. 6 is a perspective view of an alternativethermal cooling interface 604 formed using additive manufacturing techniques (e.g., three-dimensional printing).Thermal cooling interface 604 is substantially similar tothermal cooling interface 104. However, because additive manufacturing techniques generally produce objects with closed surfaces,thermal cooling interface 604 includes two base plates 602 (as opposed to a single base plate 202), withwalls 606 extending betweenbase plates 602.Base plates 602 may be plated with suitable metals (e.g., silver, gold, etc.). Base plates in other embodiments may also be plated with suitable metals. Notably,thermal cooling interface 604 includesarcuate interfaces 620 at both the top and bottom of eachwall 606, further increasing cooling flow through coolingchannels 608 defined bywalls 606. - In the embodiments, shown in
FIGS. 1-6 , the thermal cooling interface is a separate component fromconductive components 102. However, in some embodiments, the thermal cooling interface may be integrated withconductive components 102. For example,FIG. 7 is a perspective view of aconductive component 702 that includes an integrated thermalcooling interface portion 704. Thermalcooling interface portion 704 may be formed, for example, by milling material ofconductive component 702. - Thermal
cooling interface portion 704 includes abase plate 710 and a plurality of walls Similar tothermal cooling interface 104, thermalcooling interface portion 704 includes abase plate 710 and a plurality ofwalls 712. However, thermalcooling interface portion 704 has a depth, D′, that is approximately one-half the depth D ofthermal cooling interface 104. For example, thermalcooling interface portion 704 may have a depth D′ of approximately 0.25 inches. - Further, because thermal
cooling interface portion 704 is integral withconductive component 702, thermalcooling interface portion 704 only includes asingle side wall 714 havingapertures 716. Further, because of the limited depth, eachaperture 716 is approximately half the size ofapertures 226. - As shown in
FIG. 8 , to form a conductive joint 800, twoconductive components 702 are coupled to one another. Specifically, two thermal cooling interface portions 704 (i.e., one from each conductive component 102) abut one another to form a completethermal cooling interface 706. Notably, completethermal cooling interface 706 functions substantially similar tothermal cooling interface 104 andthermal cooling interface 604. - The systems and methods described herein provide an electrical joint including a thermal cooling interface positioned between first and second electrical components. The thermal cooling interface includes a plurality of walls that define a plurality of cooling channels. The cooling channels channel air therethrough to facilitate cooling the first and second conductive components
- This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
Claims (20)
Priority Applications (5)
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US15/216,393 US10153629B2 (en) | 2016-07-21 | 2016-07-21 | Thermal cooling interface for electrical joints |
MX2017009502A MX2017009502A (en) | 2016-07-21 | 2017-07-20 | Thermal cooling interface for electrical joints. |
PL17182275T PL3273557T3 (en) | 2016-07-21 | 2017-07-20 | Thermal cooling interface for electrical joints |
EP17182275.2A EP3273557B1 (en) | 2016-07-21 | 2017-07-20 | Thermal cooling interface for electrical joints |
CN201710601582.2A CN107645074B (en) | 2016-07-21 | 2017-07-21 | Thermal cooling interface for electrical connectors |
Applications Claiming Priority (1)
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US15/216,393 US10153629B2 (en) | 2016-07-21 | 2016-07-21 | Thermal cooling interface for electrical joints |
Publications (3)
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US20180027693A1 US20180027693A1 (en) | 2018-01-25 |
US20180220547A9 true US20180220547A9 (en) | 2018-08-02 |
US10153629B2 US10153629B2 (en) | 2018-12-11 |
Family
ID=59579376
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US15/216,393 Active US10153629B2 (en) | 2016-07-21 | 2016-07-21 | Thermal cooling interface for electrical joints |
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US (1) | US10153629B2 (en) |
EP (1) | EP3273557B1 (en) |
CN (1) | CN107645074B (en) |
MX (1) | MX2017009502A (en) |
PL (1) | PL3273557T3 (en) |
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EP3595105B1 (en) * | 2018-07-13 | 2024-01-24 | ABB Schweiz AG | A heat sink for a high voltage switchgear |
US11881664B2 (en) | 2020-12-18 | 2024-01-23 | Hamilton Sundstrand Corporation | Power feeder connector devices |
EP4369542A1 (en) * | 2022-11-10 | 2024-05-15 | Abb Schweiz Ag | Busbar for a low voltage, medium voltage, or high voltage switchgear |
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-
2016
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-
2017
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- 2017-07-20 MX MX2017009502A patent/MX2017009502A/en active IP Right Grant
- 2017-07-20 EP EP17182275.2A patent/EP3273557B1/en active Active
- 2017-07-21 CN CN201710601582.2A patent/CN107645074B/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10153629B2 (en) | 2018-12-11 |
EP3273557A1 (en) | 2018-01-24 |
US20180027693A1 (en) | 2018-01-25 |
CN107645074B (en) | 2021-08-03 |
PL3273557T3 (en) | 2021-05-31 |
MX2017009502A (en) | 2018-09-10 |
EP3273557B1 (en) | 2020-11-18 |
CN107645074A (en) | 2018-01-30 |
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