US20180194616A1 - Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure - Google Patents

Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure Download PDF

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Publication number
US20180194616A1
US20180194616A1 US15/743,326 US201615743326A US2018194616A1 US 20180194616 A1 US20180194616 A1 US 20180194616A1 US 201615743326 A US201615743326 A US 201615743326A US 2018194616 A1 US2018194616 A1 US 2018194616A1
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United States
Prior art keywords
coating
recess
undercoating
front side
recited
Prior art date
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Abandoned
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US15/743,326
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English (en)
Inventor
Joerg Muchow
Rainer Straub
Stefan Pinter
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Robert Bosch GmbH
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Robert Bosch GmbH
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Assigned to ROBERT BOSCH GMBH reassignment ROBERT BOSCH GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MUCHOW, JOERG, Straub, Rainer, PINTER, STEFAN
Publication of US20180194616A1 publication Critical patent/US20180194616A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00103—Structures having a predefined profile, e.g. sloped or rounded grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0369—Static structures characterized by their profile
    • B81B2203/0384—Static structures characterized by their profile sloped profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0133—Wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/0154—Film patterning other processes for film patterning not provided for in B81C2201/0149 - B81C2201/015
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD

Definitions

  • the present invention relates to a manufacturing method for a micromechanical window structure and to a corresponding micromechanical window structure.
  • a protective wafer is applied on the wafer including MEMS components, for example by anodic bonding.
  • MEMS components for example by anodic bonding.
  • protective wafers including windows are provided for this purpose. The windows are coated with optically transparent layers.
  • a window plate 12 is inserted into a recess 11 of a substrate 1 with the aid of sealants and/or adhesives, recess 11 including edges 11 a inclined with respect to a front side 4 and a rear side 5 of substrate 1 .
  • a first substrate including micromirror devices is described in European Patent No. EP 1 748 029 A2, on which a second substrate including light-transmitting window elements is attached.
  • a method for manufacturing an optical window device is described in German Patent Application No. DE 10 2012 206 858 A1.
  • a transparent layer is applied onto a substrate including a recess and subsequently deformed.
  • Ultrashort pulse lasers are suitable for deliberately structuring or stripping surfaces; for example, the German Future Prize was awarded for ultrashort pulse lasers (communication retrievable from the page http://www.vditz.de/meldung/yerr-zuashssch-fuer-ukp-laser/).
  • the present invention provides a method for manufacturing a micromechanical window structure, including the steps: providing a substrate, the substrate having a front side and a rear side; forming a first recess on the front side; forming a coating on the front side and on the first recess; and forming a second recess on the rear side, so that the coating is at least partially exposed, whereby a window is formed by the exposed area of the coating.
  • the present invention provides a micromechanical window structure including: a substrate, the substrate having a front side and a rear side, the substrate having a recess area extending from the front side to the rear side; and a window spanning inside the recess area, which is formed of a coating and has the shape of a plane inclined with respect to the front side.
  • the present invention provides a cost-effective method for manufacturing micromechanical window structures on a substrate.
  • a hermetically sealed window is formed, such as may be needed in particular for applications in combination with MEMS components, such as micromirrors.
  • micromechanical window structures manufactured using the method according to the present invention ensure a protection of optical elements, such as micromirrors.
  • the window itself By recessing the window in the substrate, the window itself is also protected against damage.
  • the formation of the first recess is carried out in such a way that a recess surface of the first recess has the shape of a plane inclined with respect to the front side.
  • the optical window is well-suited for allowing light to pass through, for example for the use with micromirrors.
  • the inclination of the window may prevent a first order diffraction reflex from appearing in the center of a micromirror.
  • the formation of the second recess is carried out in such a way that the coating is precisely exposed on the recess surface that has the shape of a plane inclined with respect to the front side. In this way, it may be ensured that the entire window surface is available for allowing light to pass through, for example for the use with micromirrors.
  • the formation of the first recess is carried out with the aid of ultrashort pulse lasers. This ensures a high evenness of the surface of the recess since the removed material does not melt, but directly evaporates and thus no poorly controllable molten mass occurs.
  • the coating is a nitride coating.
  • the coating includes a first undercoating and a second undercoating, the first undercoating being a nitride coating and the second undercoating being an oxide coating.
  • a moth eye structure is formed on the coating. In this way, it is possible to decrease the reflection of the window and to increase the transparency of the window.
  • At least one additional anti-reflection layer is formed on the exposed window area of the coating.
  • the formation of the second recess is carried out by trench etching, KOH etching and/or by milling.
  • the coating is a nitride coating.
  • the coating includes a first undercoating and a second undercoating, the first undercoating being a nitride coating and the second undercoating being an oxide coating.
  • FIG. 1 a through 1 c show schematic cross-sectional views to explain a manufacturing method for a micromechanical window structure according to a first specific embodiment of the present invention.
  • FIGS. 2 a and 2 b show schematic cross-sectional views to explain a manufacturing method for a micromechanical window structure according to a second specific embodiment of the present invention.
  • FIG. 3 shows a schematic cross-sectional view of a micromechanical window structure according to a third specific embodiment of the invention.
  • FIG. 4 shows a schematic top view of a micromechanical window structure according to one specific embodiment of the related art.
  • FIG. 1 a through 1 c show schematic cross-sectional views to illustrate a manufacturing method for a micromechanical window structure according to a first specific embodiment of the present invention.
  • a substrate 1 for example a semiconductor substrate, such as a silicon substrate, having a front side 4 and a rear side 5 is provided.
  • a first recess 6 is formed in substrate 1 on front side 4 , for example by KOH etching, trench etching, sand blasting or grinding.
  • first recess 6 may also be formed with the aid of an ultrashort pulse laser.
  • first recess 6 is wedge-shaped, a first recess surface 2 being perpendicular to front side 4 , and a second recess surface 3 being inclined with respect to front side 4 at an angle ⁇ , which is formed between second recess surface 3 and front side 4 .
  • Angle ⁇ is greater than zero, for example between 10° and 60°, in particular between 15° and 45°, and particularly preferably between 20° and 40°. If, as described above, an ultrashort pulse laser is used, it may be ensured in particular that first recess surface 2 and second recess surface 3 have great evenness.
  • first recess surface 2 does not have to be perpendicular to front side 4 .
  • first recess surface 2 may be inclined at an angle ⁇ , which is formed between first recess surface 2 and front side 4 .
  • An inclination of first recess surface 2 may be formed, for example, in that a crystallographic direction of substrate 1 , for example of a silicon substrate, is selected in such a way that a ⁇ 111> crystallographic direction of substrate 1 has an angle of inclination with respect to front side 4 .
  • first recess 6 is not limited to the wedge shape; in particular, first recess 6 may be cuboid, trapezoidal or curved.
  • first recess surface 2 and of second recess surface 3 may be improved by an annealing step using forming gas, such as H 2 , at temperatures above 1000° C.
  • forming gas such as H 2
  • a volume formed between second recess surface 3 and rear side 5 corresponds to a second recess 7 recessed in a method step following later.
  • a coating 8 is formed on front side 4 , first recess surface 2 and second recess surface 3 .
  • the formation of coating 8 may take place, for example, by chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma-enhanced chemical vapor deposition (PECVD), plasma impulse chemical vapor deposition (PICVD), low-pressure chemical vapor deposition (LPCVD) or thermal chemical vapor deposition (TCVD) methods or by thermal oxidation.
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PICVD plasma impulse chemical vapor deposition
  • LPCVD low-pressure chemical vapor deposition
  • TCVD thermal chemical vapor deposition
  • the formation of coating 8 does not have to be limited to these methods and may also take place by other methods or by a combination of multiple methods.
  • Coating 8 is preferably made up of a transparent or translucent material, for example glass or plastic.
  • coating 8 may be a nitride coating, such as a low-pressure (LP) nitride coating.
  • LP low-pressure
  • the material of coating 8 does not have to be limited thereto.
  • a mask 9 is additionally applied, for example in the same process step, and subsequently structured, so that the portion of rear side 5 belonging to second recess 7 is left exposed. If mask 9 is made up of the same material as coating 8 , i.e., coating 8 and mask 9 may be applied in a single work step, time and costs may be saved. However, mask 9 may also be made up of a different material than coating 8 and applied separately.
  • second recess 7 is formed, as shown in FIG. 1 c , in such a way that a material of substrate 1 is removed from coating 8 on second recess surfaces 3 from rear side 5 .
  • a window F which is able to allow light to pass through, is created by coating 8 between first recess 6 and second recess 7 .
  • coating 8 on second recess surface 3 covers the full cross-sectional surface of first recess 6 and of second recess 7 , which is thereby available for the window.
  • recess 7 may take place by trench etching and/or by KOH etching.
  • the formation of recess 7 is not limited to these methods; in particular, the formation of recess 7 may take place by milling, with the aid of a laser, for example an ultrashort pulse laser, or by a combination of these methods. In these cases, the method step of attaching a mask 9 may be dispensed with.
  • a micromechanical window structure according to a first specific embodiment of the present invention is formed, manufactured as recited in Claim 1 .
  • a substrate 1 has a front side 4 and a rear side 5 , substrate 1 including a recess area 6 , 7 extending from front side 4 to rear side 5 .
  • a window F which is made up of a coating 8 and has the shape of a plane inclined with respect to the front side, spans inside recess area 6 , 7 .
  • recess area 6 , 7 is cuboid, the lateral surfaces being perpendicular to front side 4 and rear side 5 .
  • Recess 6 , 7 does not have to be cuboid and may in particular have a trapezoidal cross section, a general polygonal cross section or a curved cross section.
  • the coating also extends across first recess surface 2 and across front side 4 .
  • the present invention is not limited to this case; in particular, the coating may be absent on front side 4 .
  • FIGS. 2 a , 2 b show a schematic cross-sectional view to illustrate a manufacturing method for a micromechanical window structure according to a second specific embodiment of the present invention.
  • coating 8 is divided into a first undercoating 8 ′ and a second undercoating 8 ′′, first undercoating 8 ′ first being formed on front side 4 , first recess surface 2 and second recess surface 3 , and thereafter second undercoating 8 ′′ being formed on first undercoating 8 ′.
  • First undercoating 8 ′ and second undercoating 8 ′′ are preferably made up of a transparent or translucent material, for example glass or plastic.
  • first undercoating 8 ′ may be an oxide coating
  • second undercoating 8 ′′ may be a nitride coating, for example an LP nitride coating; however, the material of first undercoating 8 ′ and of second undercoating 8 ′′ does not have to be limited thereto.
  • mask 9 may also be divided into a first sub-mask 9 ′ and a second sub-mask 9 ′′, first sub-mask 9 ′ first being formed on rear side 5 and subsequently second sub-mask 9 ′′ being formed on first sub-mask 9 ′, and subsequently first sub-mask 9 ′ and second sub-mask 9 ′′ being structured in such a way that the portion of rear side 5 belonging to second recess 7 is left exposed.
  • first sub-mask 9 ′ may be made of the same material as first undercoating 8 ′
  • second sub-mask 9 ′′ may be made of the same material as second undercoating 8 ′′, so that first sub-mask 9 ′ may be formed simultaneously with first undercoating 8 ′, and second sub-mask 9 ′′ may be formed simultaneously with second undercoating 8 ′′, whereby time and costs may be saved.
  • first sub-mask 9 ′ and the material of second sub-mask 9 ′′ may differ from the materials of first undercoating 8 ′ and of second undercoating 8 ′′.
  • coating 8 may be made up of a first undercoating 8 ′ and a second undercoating 8 ′′; however, mask 9 may be made up of only one sub-mask.
  • coating 8 may be made up of more than two undercoatings, and mask 9 may be made up of more than two sub-masks, and the number of undercoatings of coating 8 and the number of sub-masks of mask 9 do not have to be the same.
  • second recess 7 is formed in such a way that a material of substrate 1 is stripped from coating 8 on second recess surface 3 from rear side 5 .
  • a window F which is able to allow light to pass through, is created by coating 8 between first recess 6 and second recess 7 .
  • the formation of second recess 7 may take place according to one of the above-mentioned methods.
  • the second specific embodiment includes a first undercoating 8 ′ and a second undercoating 8 ′′, it being possible in particular for first undercoating 8 ′ to be a nitride coating and for second undercoating 8 ′′ to be an oxide coating.
  • FIG. 3 shows a schematic cross-sectional view to illustrate a manufacturing method for a micromechanical window structure according to a third specific embodiment of the present invention.
  • coating 8 in particular a portion of coating 8 formed on second recess surface 3 , is at least sectionally provided with a nanostructured surface.
  • the nanostructured surface may in particular be a moth eye structure 10 .
  • Moth eye structure 10 is made up of small elevations, whose distance may be selected in the order of magnitude of the wavelength range of the light used, whereby it may be achieved that a reflection property of coating 8 is reduced, and light may be better transmitted.
  • At least one further anti-reflection coating may be formed on window F.
  • the at least one anti-reflection coating may be a metal coating, for example, which may have a thickness in the range of several nanometers, a plastic coating, a silicon coating or a similar coating.
  • the formation of the coating may be carried out by sputtering, with the aid of a CVD method or with the aid of a dipping method.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
US15/743,326 2015-07-17 2016-05-24 Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure Abandoned US20180194616A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015213473.3 2015-07-17
DE102015213473.3A DE102015213473A1 (de) 2015-07-17 2015-07-17 Herstellungsverfahren für eine mikromechanische Fensterstruktur und entsprechende mikromechanische Fensterstruktur
PCT/EP2016/061706 WO2017012746A1 (fr) 2015-07-17 2016-05-24 Procédé de fabrication d'une structure à fenêtre micromécanique et structure à fenêtre micromécanique correspondante

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/061706 A-371-Of-International WO2017012746A1 (fr) 2015-07-17 2016-05-24 Procédé de fabrication d'une structure à fenêtre micromécanique et structure à fenêtre micromécanique correspondante

Related Child Applications (1)

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US16/789,503 Division US11124412B2 (en) 2015-07-17 2020-02-13 Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure

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US20180194616A1 true US20180194616A1 (en) 2018-07-12

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US15/743,326 Abandoned US20180194616A1 (en) 2015-07-17 2016-05-24 Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure
US16/789,503 Active US11124412B2 (en) 2015-07-17 2020-02-13 Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure

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US16/789,503 Active US11124412B2 (en) 2015-07-17 2020-02-13 Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure

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US (2) US20180194616A1 (fr)
JP (1) JP6609032B2 (fr)
CN (1) CN107835788B (fr)
DE (1) DE102015213473A1 (fr)
WO (1) WO2017012746A1 (fr)

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DE102010062118B4 (de) * 2010-11-29 2018-09-27 Robert Bosch Gmbh Herstellungsverfahren für eine Abdeckvorrichtung für ein mikro-opto-mechanisches Bauteil
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Publication number Priority date Publication date Assignee Title
US20090116675A1 (en) * 2005-12-14 2009-05-07 Yuichi Miyoshi Mems diaphragm structure and method for forming the same
US8830557B2 (en) * 2007-05-11 2014-09-09 Qualcomm Mems Technologies, Inc. Methods of fabricating MEMS with spacers between plates and devices formed by same
US20110031655A1 (en) * 2009-08-10 2011-02-10 Fei Company Gas-assisted laser ablation
US20110188140A1 (en) * 2010-01-14 2011-08-04 Reinhold Fiess Micromechanical component, optical device, manufacturing method for a micromechanical component, and manufacturing method for an optical device
US20150200105A1 (en) * 2012-09-28 2015-07-16 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Production method

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Publication number Publication date
DE102015213473A1 (de) 2017-01-19
US20200231433A1 (en) 2020-07-23
JP6609032B2 (ja) 2019-11-20
CN107835788A (zh) 2018-03-23
JP2018526232A (ja) 2018-09-13
CN107835788B (zh) 2023-05-16
US11124412B2 (en) 2021-09-21
WO2017012746A1 (fr) 2017-01-26

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