US20180081410A1 - Chassis structure capable of sensing temperature of media storage device - Google Patents
Chassis structure capable of sensing temperature of media storage device Download PDFInfo
- Publication number
- US20180081410A1 US20180081410A1 US15/271,230 US201615271230A US2018081410A1 US 20180081410 A1 US20180081410 A1 US 20180081410A1 US 201615271230 A US201615271230 A US 201615271230A US 2018081410 A1 US2018081410 A1 US 2018081410A1
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- US
- United States
- Prior art keywords
- storage device
- temperature sensor
- media storage
- disposed
- chassis structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
- G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
- G11B33/123—Mounting arrangements of constructional parts onto a chassis
- G11B33/124—Mounting arrangements of constructional parts onto a chassis of the single recording/reproducing device, e.g. disk drive, onto a chassis
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/144—Reducing the influence of the temperature by detection, control, regulation of the temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
Definitions
- the present invention relates to a chassis structure and, in particular, to a chassis structure capable of sensing temperature of a media storage device, wherein a working temperature can be measured by a temperature sensor directly attached to an outer housing of the media storage device, thereby avoiding influences such as air flow and undesired heat conduction of the chassis structure.
- a central processing unit (CPU) or a disk array in the server has increased processing speed, leading to greater heat accumulation in the server chassis. If the accumulated heat cannot be expelled out from the server chassis, temperature of elements or components in a system will increase continuously to cause malfunction. Even worse, the elements or components may be damaged.
- a heat dissipation fan is utilized to generate air flow and to thereby achieve heat exchange, so as to quickly expel the heat out from the server chassis.
- the key of efficient heat dissipation is to control operation of the heat dissipation fan.
- the temperature sensor is also disposed in a proper position in the server chassis for measuring a temperature variation or difference between the heat source and the server, so that a rotation speed of the heat dissipation fan can be properly controlled, and heat dissipation efficiency of the server chassis is improved.
- the temperature sensor in the server tends to be affected by air flow, heat conduction, or other factors, leading to an inaccurate temperature measurement.
- the temperature measurement is influenced by ambient temperature variations. Therefore, it is the aim of the present invention to accurately measure the temperature of the server chassis to thereby effectively control the heat dissipation efficiency.
- the present invention provides a chassis structure capable of sensing temperature of a media storage device.
- the chassis structure comprises a tray.
- the tray includes a body, an accommodating space formed in the body, a connector disposed on the body, and a temperature sensor juxtaposed with the connector, wherein the media storage device is electrically coupled to the connector and is in contact with the temperature sensor.
- a fixed base is disposed on the body, and the temperature sensor is disposed on the fixed base.
- the body includes a fastening holder disposed in the accommodating space, the fixed base is disposed on the fastening holder and is arranged over the connector, and the connector is disposed below the fastening holder.
- the chassis structure further comprises a buffer block disposed on the body, and the temperature sensor is attached onto a surface of the buffer block.
- the chassis structure further comprises a hard pad attached onto the surface of the buffer block.
- the hard pad is arranged side by side with the temperature sensor.
- the temperature sensor has a height greater than a height of the hard pad, and a first level difference is formed between the hard pad and the temperature sensor.
- the hard pad has rigidity greater than rigidity of the temperature sensor.
- the fixed base includes a horizontal section connected to the tray and includes a vertical section vertically connected to the horizontal section, and the temperature sensor is disposed on the vertical section.
- a resilient member is disposed on the body, and the temperature sensor is disposed on the resilient member.
- the resilient member further includes a fixed portion fixed to the body and a flexible arm extending from the fixed portion.
- the resilient member further includes a sliding portion, the fixed portion and the sliding portion are disposed at two ends of the flexible arm respectively, the sliding portion further includes a groove, a guiding pillar is protrudingly disposed in the body, and the groove moves along the guiding pillar.
- the resilient member further includes at least one block plate perpendicularly connected to the flexible arm.
- the sliding portion is a hook portion, and the hook portion is bent toward the fixed portion.
- the temperature sensor has a height greater than a height of the block plate, and a second level difference is formed between the block plate and the temperature sensor.
- the present invention utilizes a buffer block for providing a buffering and restoring force, so that the temperature sensor can keep in contact with the outer housing of the media storage device. Moreover, by utilizing the hard pad arranged side by side with the temperature sensor, the temperature sensor is prevented from being damaged when it is pressed.
- a resilient member is disposed on the fixed base.
- the resilient member with rigidity resiliently rebounds to contact the media storage device, and thereby the temperature sensor keeps in contact with the outer housing of the media storage device for an accurate temperature measurement.
- the chassis structure has a low cost, simple structure which allows a central processing unit (CPU) or other suitable control devices to obtain accurate temperature data and further control a rotation speed of a heat dissipation fan or other heat dissipation devices, thereby enhancing heat dissipation efficiency for the server.
- CPU central processing unit
- FIG. 1 is a perspective view illustrating a chassis structure of the present invention
- FIG. 2 is an enlarged view of FIG. 1 ;
- FIG. 3 is an exploded view illustrating a fixed base and a temperature sensor
- FIG. 4 is a schematic view of the present invention, illustrating that a media storage device is to be disposed on a fastening holder;
- FIG. 5 is a schematic view illustrating a resilient member of the fixed base according to another embodiment of the present invention.
- FIG. 6 is a schematic view of the present invention, illustrating the media storage device is disposed on the fastening holder.
- FIG. 7 is another schematic view illustrating the resilient member according to still another embodiment of the present invention.
- the present invention provides a chassis structure 100 capable of sensing temperature of a media storage device 10 .
- the chassis structure 100 comprises a tray 110 and a temperature sensor 200 .
- the chassis structure 100 of the present invention is preferably used in a server cabinet (not illustrated).
- the media storage device 10 can be, but not limited to, various hard disk drives (HDD).
- the tray 110 includes a body 112 , an accommodating space 120 formed in the body 112 , a fastening holder 130 disposed in the accommodating space 120 , a connector 140 assembled to the fastening holder 130 , and a fixed base 150 arranged side by side with the connector 140 .
- the fastening holder 130 and the fixed base 150 are disposed in the accommodating space 120 of the body 112 .
- the fixed base 150 is assembled onto the fastening holder 130 , and the connector 140 is disposed below the fastening holder 130 , wherein the fixed base 150 is arranged over the connector 140 .
- the fixed base 150 and the connector 140 are arranged juxtaposed with each other on the fastening holder 130 .
- the fastening holder 130 is fixed in the middle of the body 112 .
- a plurality of the media storage devices 10 are inserted and connected to the connectors 140 of the fixed bases 150 in a direction parallel to the body 112 .
- the temperature sensor 200 is disposed on the fixed base 150 .
- the media storage device 10 is electrically coupled to the connector 140 and can contact the temperature sensor 200 for a temperature measurement of an outer housing of the media storage device 10 .
- Each of the media storage devices 10 is electrically coupled to the corresponding connector 140 and the corresponding temperature sensor 200 .
- the temperature sensor 200 and the connector 140 can also be directly disposed on any side wall of the body 112 .
- the embodiment of FIG. 4 includes a buffer block 210 disposed on the fixed base 150 and includes a hard pad 220 attached onto a surface of the buffer block 210 .
- the hard pad 220 is preferably arranged side by side with the temperature sensor 200 .
- the temperature sensor 200 has a height greater than a height of the hard pad 220 , and a first level difference D 1 is formed between the hard pad 220 and the temperature sensor 200 .
- the buffer block 210 preferably consists of rubber, silicone, or other suitable heat and electrical insulating material; however, the present invention is not limited in this regard.
- the hard pad 220 can consist of hard plastic, glass or other suitable material, and the present invention is not limited in this regard.
- the hard pad 220 has rigidity greater than rigidity of the temperature sensor 200 . Therefore, even if the media storage device 10 excessively presses the temperature sensor 200 , it causes no damage to the temperature sensor 200 . In other words, protected by the hard pad 20 , the temperature sensor 200 is not excessively pressed by the media storage device 10 .
- the fixed base 150 includes a horizontal section 152 connected to the body 112 , a vertical section 154 vertically connected to the horizontal section 152 , and a resilient member 170 disposed on the vertical section 154 , wherein the horizontal section 152 is fixed to the fastening holder 130 , and the temperature sensor 200 is disposed on the resilient member 170 .
- the resilient member 170 made of metal further includes a fixed portion 172 , a flexible arm 174 and a sliding portion 176 .
- the fixed portion 172 and the sliding portion 176 are disposed at two ends of the flexible arm 174 , respectively.
- the fixed portion 172 is preferably threadedly fastened onto the vertical section 154 by fastening elements 160 like screws.
- the sliding portion 176 is movable with respect to the vertical section 154 .
- the flexible arm 174 protrudes in a direction away from the vertical section 154 , so that the flexible arm 174 can move back and forth with respect to the fixed base 150 .
- the temperature sensor 200 is preferably disposed on the buffer block 210 and is arranged over the resilient member 170 , so that the temperature sensor 200 can be protected properly and can keep in contact with the media storage device 10 .
- the temperature sensor 200 can be disposed on the buffer block 210 or on the resilient member 170 ; configuration may vary as required.
- the sliding portion 176 includes a groove 182 , a guiding pillar 156 is protrudingly disposed on the vertical section 154 , and the groove 182 of the sliding portion 176 moves back and forth along the guiding pillar 156 , so that the resilient member 170 can move more stably and smoothly.
- the sliding portion 176 can be a hook portion 180 , and the hook portion 180 is bent toward the fixed portion 172 , thereby increasing flexibility of the resilient member 170 .
- the resilient member 170 further includes at least one block plate 178 perpendicularly connected to the flexible arm 174 .
- the temperature sensor 200 is directly attached onto the flexible arm 174 and is in contact against one side of the block plate 178 .
- the temperature sensor 200 preferably has a height greater than a height of the block plate 178 , and a second level difference D 2 is formed between the block plate 178 and the temperature sensor 200 . As shown in FIG.
- the block plate 178 can protect the temperature sensor 200 , and in addition to that, the resilient member 170 serves as a buffer for protecting the temperature sensor 200 from being damaged when the resilient member 170 is pressed to move toward the fixed base 150 .
- the resilient member 170 with rigidity resiliently rebounds to contact the media storage device 10 , so the temperature sensor 200 keeps in contact with the outer housing of the media storage device 10 for an accurate temperature measurement.
- the chassis structure 100 of the present invention is constructed to allow the temperature sensor 200 to be directly attached to the outer housing of the media storage device 10 for an accurate temperature measurement, thus avoiding undesired influences such as air flow and heat conduction. Accordingly, a central processing unit (CPU, not illustrated) or other suitable control device can obtain the accurate temperature data to further control a rotation speed of a heat dissipation fan (not illustrated) or other heat sink devices, thereby efficiently enhancing heat dissipation efficiency of a server (not illustrated).
- CPU central processing unit
Abstract
Description
- The present invention relates to a chassis structure and, in particular, to a chassis structure capable of sensing temperature of a media storage device, wherein a working temperature can be measured by a temperature sensor directly attached to an outer housing of the media storage device, thereby avoiding influences such as air flow and undesired heat conduction of the chassis structure.
- With development of technology and the Internet, servers or other equipment having large scale integrated circuits are provided with high integration density. A central processing unit (CPU) or a disk array in the server has increased processing speed, leading to greater heat accumulation in the server chassis. If the accumulated heat cannot be expelled out from the server chassis, temperature of elements or components in a system will increase continuously to cause malfunction. Even worse, the elements or components may be damaged. In order to ensure the server to operate normally, a heat dissipation fan is utilized to generate air flow and to thereby achieve heat exchange, so as to quickly expel the heat out from the server chassis. However, the key of efficient heat dissipation is to control operation of the heat dissipation fan.
- In order to improve heat dissipation of the server chassis, besides having a temperature sensor in a heat source, the temperature sensor is also disposed in a proper position in the server chassis for measuring a temperature variation or difference between the heat source and the server, so that a rotation speed of the heat dissipation fan can be properly controlled, and heat dissipation efficiency of the server chassis is improved.
- However, the temperature sensor in the server tends to be affected by air flow, heat conduction, or other factors, leading to an inaccurate temperature measurement. In other words, the temperature measurement is influenced by ambient temperature variations. Therefore, it is the aim of the present invention to accurately measure the temperature of the server chassis to thereby effectively control the heat dissipation efficiency.
- It is an object of the present invention to provide a chassis structure capable of sensing temperature of a media storage device, wherein a working temperature can be measured by a temperature sensor directly attached to an outer housing of the media storage device, thereby avoiding influences such as air flow and undesired heat conduction of the chassis structure.
- Accordingly, the present invention provides a chassis structure capable of sensing temperature of a media storage device. The chassis structure comprises a tray. The tray includes a body, an accommodating space formed in the body, a connector disposed on the body, and a temperature sensor juxtaposed with the connector, wherein the media storage device is electrically coupled to the connector and is in contact with the temperature sensor.
- According to one embodiment of the present invention, a fixed base is disposed on the body, and the temperature sensor is disposed on the fixed base.
- According to one embodiment of the present invention, the body includes a fastening holder disposed in the accommodating space, the fixed base is disposed on the fastening holder and is arranged over the connector, and the connector is disposed below the fastening holder.
- According to one embodiment of the present invention, the chassis structure further comprises a buffer block disposed on the body, and the temperature sensor is attached onto a surface of the buffer block.
- According to one embodiment of the present invention, the chassis structure further comprises a hard pad attached onto the surface of the buffer block.
- According to one embodiment of the present invention, the hard pad is arranged side by side with the temperature sensor.
- According to one embodiment of the present invention, the temperature sensor has a height greater than a height of the hard pad, and a first level difference is formed between the hard pad and the temperature sensor.
- According to one embodiment of the present invention, the hard pad has rigidity greater than rigidity of the temperature sensor.
- According to one embodiment of the present invention, the fixed base includes a horizontal section connected to the tray and includes a vertical section vertically connected to the horizontal section, and the temperature sensor is disposed on the vertical section.
- According to one embodiment of the present invention, a resilient member is disposed on the body, and the temperature sensor is disposed on the resilient member.
- According to one embodiment of the present invention, the resilient member further includes a fixed portion fixed to the body and a flexible arm extending from the fixed portion.
- According to one embodiment of the present invention, the resilient member further includes a sliding portion, the fixed portion and the sliding portion are disposed at two ends of the flexible arm respectively, the sliding portion further includes a groove, a guiding pillar is protrudingly disposed in the body, and the groove moves along the guiding pillar.
- According to one embodiment of the present invention, the resilient member further includes at least one block plate perpendicularly connected to the flexible arm.
- According to one embodiment of the present invention, the sliding portion is a hook portion, and the hook portion is bent toward the fixed portion.
- According to one embodiment of the present invention, the temperature sensor has a height greater than a height of the block plate, and a second level difference is formed between the block plate and the temperature sensor.
- In order to prevent the temperature sensor from being excessively pressed and damaged by the media storage device, and to ensure an accurate temperature measurement, the present invention utilizes a buffer block for providing a buffering and restoring force, so that the temperature sensor can keep in contact with the outer housing of the media storage device. Moreover, by utilizing the hard pad arranged side by side with the temperature sensor, the temperature sensor is prevented from being damaged when it is pressed.
- According to another preferable embodiment, a resilient member is disposed on the fixed base. The resilient member with rigidity resiliently rebounds to contact the media storage device, and thereby the temperature sensor keeps in contact with the outer housing of the media storage device for an accurate temperature measurement. As a result, the chassis structure has a low cost, simple structure which allows a central processing unit (CPU) or other suitable control devices to obtain accurate temperature data and further control a rotation speed of a heat dissipation fan or other heat dissipation devices, thereby enhancing heat dissipation efficiency for the server.
- The disclosure will become more fully understood from the detailed description and the drawings given herein below for illustration only, and thus does not limit the disclosure, wherein:
-
FIG. 1 is a perspective view illustrating a chassis structure of the present invention; -
FIG. 2 is an enlarged view ofFIG. 1 ; -
FIG. 3 is an exploded view illustrating a fixed base and a temperature sensor; -
FIG. 4 is a schematic view of the present invention, illustrating that a media storage device is to be disposed on a fastening holder; -
FIG. 5 is a schematic view illustrating a resilient member of the fixed base according to another embodiment of the present invention; -
FIG. 6 is a schematic view of the present invention, illustrating the media storage device is disposed on the fastening holder; and -
FIG. 7 is another schematic view illustrating the resilient member according to still another embodiment of the present invention. - Detailed descriptions and technical contents of the present invention are illustrated below in conjunction with the accompany drawings. However, it is to be understood that the descriptions and the accompany drawings disclosed herein are merely illustrative and exemplary and not intended to limit the scope of the present invention.
- Referring to
FIGS. 1 to 4 , the present invention provides achassis structure 100 capable of sensing temperature of amedia storage device 10. Thechassis structure 100 comprises atray 110 and atemperature sensor 200. As shown in drawings, thechassis structure 100 of the present invention is preferably used in a server cabinet (not illustrated). Further, themedia storage device 10 can be, but not limited to, various hard disk drives (HDD). - The
tray 110 includes abody 112, anaccommodating space 120 formed in thebody 112, afastening holder 130 disposed in theaccommodating space 120, aconnector 140 assembled to thefastening holder 130, and afixed base 150 arranged side by side with theconnector 140. In other words, thefastening holder 130 and thefixed base 150 are disposed in theaccommodating space 120 of thebody 112. - Referring to
FIGS. 2 and 4 , thefixed base 150 is assembled onto thefastening holder 130, and theconnector 140 is disposed below thefastening holder 130, wherein thefixed base 150 is arranged over theconnector 140. Thefixed base 150 and theconnector 140 are arranged juxtaposed with each other on thefastening holder 130. Thefastening holder 130 is fixed in the middle of thebody 112. A plurality of themedia storage devices 10 are inserted and connected to theconnectors 140 of thefixed bases 150 in a direction parallel to thebody 112. - The
temperature sensor 200 is disposed on thefixed base 150. Themedia storage device 10 is electrically coupled to theconnector 140 and can contact thetemperature sensor 200 for a temperature measurement of an outer housing of themedia storage device 10. Each of themedia storage devices 10 is electrically coupled to thecorresponding connector 140 and thecorresponding temperature sensor 200. Thetemperature sensor 200 and theconnector 140 can also be directly disposed on any side wall of thebody 112. - Since improper or excessive stress will cause damage to the
temperature sensor 200, in order to prevent damage to thetemperature sensor 200 resulting from being pressed when themedia storage device 10 is inserted and connected to theconnector 140, the embodiment ofFIG. 4 includes abuffer block 210 disposed on thefixed base 150 and includes ahard pad 220 attached onto a surface of thebuffer block 210. Thehard pad 220 is preferably arranged side by side with thetemperature sensor 200. Thetemperature sensor 200 has a height greater than a height of thehard pad 220, and a first level difference D1 is formed between thehard pad 220 and thetemperature sensor 200. - According to the present embodiment, the
buffer block 210 preferably consists of rubber, silicone, or other suitable heat and electrical insulating material; however, the present invention is not limited in this regard. Thehard pad 220 can consist of hard plastic, glass or other suitable material, and the present invention is not limited in this regard. - Referring to
FIG. 6 , thehard pad 220 has rigidity greater than rigidity of thetemperature sensor 200. Therefore, even if themedia storage device 10 excessively presses thetemperature sensor 200, it causes no damage to thetemperature sensor 200. In other words, protected by the hard pad 20, thetemperature sensor 200 is not excessively pressed by themedia storage device 10. - Moreover, the fixed
base 150 includes ahorizontal section 152 connected to thebody 112, avertical section 154 vertically connected to thehorizontal section 152, and aresilient member 170 disposed on thevertical section 154, wherein thehorizontal section 152 is fixed to thefastening holder 130, and thetemperature sensor 200 is disposed on theresilient member 170. - Referring to
FIGS. 3, 4, and 6 , theresilient member 170 made of metal further includes a fixedportion 172, aflexible arm 174 and a slidingportion 176. The fixedportion 172 and the slidingportion 176 are disposed at two ends of theflexible arm 174, respectively. The fixedportion 172 is preferably threadedly fastened onto thevertical section 154 by fasteningelements 160 like screws. The slidingportion 176 is movable with respect to thevertical section 154. Theflexible arm 174 protrudes in a direction away from thevertical section 154, so that theflexible arm 174 can move back and forth with respect to the fixedbase 150. - According to the present embodiment, the
temperature sensor 200 is preferably disposed on thebuffer block 210 and is arranged over theresilient member 170, so that thetemperature sensor 200 can be protected properly and can keep in contact with themedia storage device 10. However, in different embodiments, thetemperature sensor 200 can be disposed on thebuffer block 210 or on theresilient member 170; configuration may vary as required. - The sliding
portion 176 includes agroove 182, a guidingpillar 156 is protrudingly disposed on thevertical section 154, and thegroove 182 of the slidingportion 176 moves back and forth along the guidingpillar 156, so that theresilient member 170 can move more stably and smoothly. However, in the embodiment ofFIG. 7 , the slidingportion 176 can be ahook portion 180, and thehook portion 180 is bent toward the fixedportion 172, thereby increasing flexibility of theresilient member 170. - Please refer to
FIG. 5 , illustrating the resilient member according to another embodiment of the present invention. Theresilient member 170 further includes at least oneblock plate 178 perpendicularly connected to theflexible arm 174. Thetemperature sensor 200 is directly attached onto theflexible arm 174 and is in contact against one side of theblock plate 178. Thetemperature sensor 200 preferably has a height greater than a height of theblock plate 178, and a second level difference D2 is formed between theblock plate 178 and thetemperature sensor 200. As shown inFIG. 5 , when themedia storage device 10 presses thetemperature sensor 200, theblock plate 178 can protect thetemperature sensor 200, and in addition to that, theresilient member 170 serves as a buffer for protecting thetemperature sensor 200 from being damaged when theresilient member 170 is pressed to move toward the fixedbase 150. After themedia storage device 10 is connected to theconnector 140, theresilient member 170 with rigidity resiliently rebounds to contact themedia storage device 10, so thetemperature sensor 200 keeps in contact with the outer housing of themedia storage device 10 for an accurate temperature measurement. - The
chassis structure 100 of the present invention is constructed to allow thetemperature sensor 200 to be directly attached to the outer housing of themedia storage device 10 for an accurate temperature measurement, thus avoiding undesired influences such as air flow and heat conduction. Accordingly, a central processing unit (CPU, not illustrated) or other suitable control device can obtain the accurate temperature data to further control a rotation speed of a heat dissipation fan (not illustrated) or other heat sink devices, thereby efficiently enhancing heat dissipation efficiency of a server (not illustrated). - It is to be understood that the above descriptions are merely the preferable embodiment of the present invention and are not intended to limit the scope of the present invention. Equivalent changes and modifications made in the spirit of the present invention are regarded as falling within the scope of the present invention.
Claims (14)
Priority Applications (1)
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US15/271,230 US9921625B1 (en) | 2016-09-21 | 2016-09-21 | Chassis structure capable of sensing temperature of media storage device |
Applications Claiming Priority (1)
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US15/271,230 US9921625B1 (en) | 2016-09-21 | 2016-09-21 | Chassis structure capable of sensing temperature of media storage device |
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US9921625B1 US9921625B1 (en) | 2018-03-20 |
US20180081410A1 true US20180081410A1 (en) | 2018-03-22 |
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US15/271,230 Expired - Fee Related US9921625B1 (en) | 2016-09-21 | 2016-09-21 | Chassis structure capable of sensing temperature of media storage device |
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CN109830250A (en) * | 2019-01-16 | 2019-05-31 | 南昌科悦企业管理咨询有限公司 | A kind of computer disk array box of high stability |
CN113257292B (en) * | 2021-07-02 | 2021-11-23 | 江苏华存电子科技有限公司 | Three-dimensional flash memory module for writing data and data writing method thereof |
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US5149200A (en) * | 1988-08-25 | 1992-09-22 | Terumo Kabushiki Kaisha | Temperature measuring probe and electronic clinical thermometer equipped with same |
CN101023490A (en) * | 2004-09-17 | 2007-08-22 | 齐拉泰克斯技术有限公司 | Housings and devices for disk drives |
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