US20170092802A1 - Panel, method for producing panel, solar cell module, printing apparatus, and printing method - Google Patents
Panel, method for producing panel, solar cell module, printing apparatus, and printing method Download PDFInfo
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- US20170092802A1 US20170092802A1 US15/372,647 US201615372647A US2017092802A1 US 20170092802 A1 US20170092802 A1 US 20170092802A1 US 201615372647 A US201615372647 A US 201615372647A US 2017092802 A1 US2017092802 A1 US 2017092802A1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Definitions
- the present invention relates to panels, methods for producing a panel, solar cell modules, printing apparatuses, and printing methods.
- Solar panels can convert clean and inexhaustibly-supplied solar energy directly to electric energy and therefore are expected as novel energy sources.
- Silicon substrates are used for current mainstream solar panels.
- a collector electrode containing silver is provided on the surface of a silicon substrate. With the use of silver as a material for the collector electrode, it has been attempted to reduce the contact resistance between the silicon substrate and the collector electrode and to suppress the resistance of the collector electrode itself (for example, see Japanese Unexamined Patent Application Publication No. 2009-194013).
- a wide width of the collector electrode provided on a light receiving side of a solar panel reduces the opening area of the silicon substrate to achieve inefficient energy conversion. Accordingly, it has been proposed to form an electrode in which a conductive layer containing silver is layered to reduce the reduction in the opening area and reduce the resistances (for example, see Japanese Unexamined Patent Application Publication No. 2010-090211). JP No. 2010-090211 discloses that a conductive layer containing silver is layered by printing to reduce the specific resistance and suppress oxidation.
- the present invention has been made in view of the foregoing problems and has its object of providing a panel, a method for producing a panel, a solar cell module including a panel, a printing apparatus, and a printing method, in which the degree of freedom of electrode design is increased.
- a printing apparatus is a printing apparatus including a printing section configured to print ink on a surface of a substrate.
- the printing section prints first conductive ink containing a first conductive material by offset printing, and prints second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing.
- the printing apparatus further includes a conveyor configured to convey the substrate.
- the printing section includes a first printing machine configured to print the first conductive ink and a second printing machine configured to print the second conductive ink.
- the first conductive material contains silver.
- the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- the printing section prints anti-oxidation ink to cover at least part of the first conductive ink and the second conductive ink.
- the anti-oxidation ink contains a transparent material. In one embodiment, the anti-oxidation ink contains a conductive material.
- the first conductive ink has a width larger than the second conductive ink as viewed in a normal direction of the surface of the substrate.
- the first conductive ink has a length larger than the second conductive ink.
- a printing method is a printing method for printing ink on a surface of a substrate, including: printing first conductive ink containing a first conductive material by offset printing; and printing second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing.
- a panel according to the present invention is a panel including a substrate having a surface and an electrode having a layered structure provided on the surface of the substrate.
- the layered structure includes a first conductive layer containing a first conductive material and a second conductive layer containing a second conductive material different from the first conductive material.
- the first conductive layer contains silver.
- the second conductive layer contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- the first conductive layer and the second conductive layer are individually printed by offset printing.
- a solar cell module according to the present invention includes a plurality of the above panels.
- a method for producing a panel according to the present invention includes: preparing a substrate having a surface; and forming an electrode on the surface of the substrate.
- the forming an electrode includes: printing first conductive ink containing a first conductive material on the surface of the substrate by offset printing; printing second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing; and heating the first conductive ink and the second conductive ink.
- a panel according to the present invention includes a substrate having a surface and an electrode having a layered structure provided on the surface of the substrate.
- the electrode includes a first linear electrode and a second linear electrode extending from the first electrode.
- the second linear electrode includes a sectional area decreasing part of which sectional area in a section orthogonal to a longitudinal direction of the second linear electrode decreases in a direction away from the first linear electrode.
- the number of layers of the layered structure at a part of the sectional area decreasing part which has the smallest sectional area is smaller than the number of layers of the layered structure at a part of the sectional area decreasing part which has the largest sectional area.
- the sectional area of the second linear electrode continuously varies along a direction away from the first linear electrode.
- the width of the second linear electrode continuously decreases in a direction away from the first linear electrode when the electrode is viewed in the normal direction of the surface of the substrate.
- the layered structure includes a first conductive layer and a second conductive layer partially layered on the first conductive layer.
- the width of the first conductive layer is larger than the width of the second conductive layer when the electrode is viewed in the normal direction of the surface of the substrate.
- the length of the first conductive layer in a direction away from the first linear electrode is larger than the length of the second conductive layer in the direction away from the first linear electrode.
- the first conductive layer contains a first conductive material
- the second conductive layer contains a second conductive material different from the first conducive material
- the first conductive material contains silver.
- the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- the panel further includes an anti-oxidation layer to prevent oxidation of at least part of the electrode.
- the anti-oxidation layer contains a transparent material.
- the anti-oxidation layer contains a conductive material.
- the first linear electrode includes a first parallel electrode and a second parallel electrode which extend in parallel to each other in a direction away from the first linear electrode.
- the second linear electrode includes a crossed electrode electrically connected to the first parallel electrode and the second parallel electrode.
- the crossed electrode includes a first sectional area decreasing part in contact with the first parallel electrode and a second sectional are decreasing part in contact with the second parallel electrode.
- the sectional area of a central part of the crossed electrode between the first parallel electrode and the second parallel electrode is smaller than the sectional area of a part of the crossed electrode which is near the first parallel electrode and the sectional area of a part of the crossed electrode which is near the second parallel electrode.
- the width of a central part of the crossed electrode between the first parallel electrode and the second parallel electrode is smaller than the width of a part of the crossed electrode which is near the first parallel electrode and the width of a part of the crossed electrode which is near the second parallel electrode.
- a solar cell module according to the present invention includes a plurality of the above panels.
- a printing apparatus includes a printing section configured to print ink on a surface of a substrate.
- the printing section is configured to print conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to the longitudinal direction of the second linear part in a direction away from the first linear part.
- the printing apparatus further includes a conveyor configured to convey the substrate.
- the printing section includes a first printing machine configured to pint first conductive ink and a second printing machine configured to print second conductive ink on the first conductive ink.
- a printing method is a printing method for printing ink on a surface of a substrate.
- the printing method includes printing conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to a longitudinal direction of the second linear part in a direction away from the first linear part.
- the printing includes printing first conductive ink on the surface of the substrate, and printing on the first conductive ink second conductive ink having a width and a length at least one of which is smaller than that of the first conducive ink.
- a method for producing a panel according to the present invention is a method for producing a panel including preparing a substrate having a surface, and forming an electrode on the surface of the substrate.
- the forming the electrode includes printing conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to a longitudinal direction of the second linear part in a direction away from the first linear part, and heating the conductive ink.
- the printing includes printing first conductive ink and printing on the first conductive ink second conductive ink having a width and a length at least one of which is smaller than that of the first conductive ink.
- a panel according to the present invention includes a substrate having a surface, an electrode provided on the surface of the substrate, and an anti-oxidation layer to prevent oxidization of at least part of the electrode.
- the anti-oxidation layer contains a transparent material.
- the anti-oxidation layer contains a conductive material.
- the substrate includes a photoelectric conversion layer.
- the electrode has a layered structure.
- the layered structure includes a first conductive layer and a second conductive layer provided on the first conductive layer.
- the length of the first conductive layer in a predetermined direction is larger than the length of the second conductive layer in the predetermined direction.
- the width of the first conducive layer is larger than the width of the second conductive layer when the electrode is viewed in the normal direction of the surface of the substrate.
- the first conductive material contains a first conductive material
- the second conductive layer contains a second conductive material different from the first conductive material
- the first conductive material contains silver.
- the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- the electrode includes a plurality of parallel electrodes extending in parallel to each other, and the anti-oxidation layer is separated to individually cover the plurality of parallel electrodes.
- the width of the anti-oxidation layer is twice or more the width of the electrode.
- a solar cell module according to the present invention includes a plurality of the above panels.
- a printing apparatus includes a printing section configured to print ink on a surface of a substrate.
- the printing section includes a conductive ink printing machine configured to print conductive ink and an anti-oxidation ink printing machine configured to print anti-oxidation ink.
- the printing apparatus further includes a conveyor configured to convey the substrate.
- the conductive ink printing machine includes a first printing machine configured to print first conductive ink and a second printing machine configured to print second conductive ink on the first conductive ink.
- a printing method according to the present invention is a printing method for printing ink on a surface of a substrate, including printing conductive ink on the surface of the substrate and printing anti-oxidation ink to cover the conductive ink.
- a method for producing a panel according to the present invention includes preparing a substrate having a surface, printing conductive ink on the surface of the substrate, printing anti-oxidation ink to cover the conductive ink, and heating the conductive ink and the anti-oxidation ink.
- a panel a method for producing a panel, a solar cell module including a panel, a printing apparatus, and a printing method can be provided in which the degree of freedom of electrode design is increased.
- FIG. 1 is a schematic cross sectional view of a first embodiment of a panel according to the present invention.
- FIG. 2 is a top view of the panel shown in FIG. 1 .
- FIG. 3 is a schematic cross sectional view showing the entirety of the panel shown in FIG. 1 .
- FIG. 4A and FIG. 4B are schematic diagrams for explaining a method for producing the panel shown in FIG. 1 .
- FIGS. 5A-5C are schematic diagrams for explaining a printing method used for forming an electrode of the panel shown in FIG. 1 .
- FIG. 6 is a schematic diagram showing the first embodiment of a printing apparatus according to the present invention.
- FIG. 7 is a schematic diagram showing one example of a printing machine of the printing apparatus shown in FIG. 6 .
- FIG. 8 is a schematic cross sectional view showing a second embodiment of a panel according to the present invention.
- FIG. 9A is a schematic cross sectional view of the panel shown in FIG. 1
- FIG. 9B is a schematic cross sectional view of the panel shown in FIG. 8
- FIG. 10 is a schematic diagram showing a second embodiment of a printing apparatus according to the present invention.
- FIG. 11 is a schematic cross sectional view showing a modified example of the second embodiment of a panel according to the present invention.
- FIG. 12A is a schematic top view showing a third embodiment of a panel according to the present invention.
- FIG. 12B is a partially enlarged view of FIG. 12A .
- FIG. 12C is a schematic cross sectional view thereof.
- FIG. 13A is a schematic view showing a modified example of the third embodiment of a panel according to the present invention
- FIG. 13B is a schematic cross sectional view thereof.
- FIG. 14A is a schematic diagram showing another modified example of the third embodiment of a panel according to the present invention
- FIG. 14B is a schematic cross sectional view thereof.
- FIG. 15A is a schematic diagram showing still another modified example of the third embodiment of a panel according to the present invention
- FIG. 15B is a schematic cross sectional view thereof.
- FIG. 16 is a schematic diagram of one embodiment of a solar cell module including the panels according to the present invention.
- a panel a method for producing a panel, a solar cell module, a printing apparatus, and a printing method according to the present invention will be described below.
- a solar panel is described as an example in the embodiments of the present invention, it is understood that the present invention is not limited the embodiments.
- FIG. 1 is a schematic cross sectional view of a panel 100 .
- the panel 100 is a solar panel.
- the vicinity of one of the principal planes of the panel 100 is shown in FIG. 1 on an enlarged scale.
- the panel 100 includes a substrate 10 and an electrode 20 provided on a surface 12 of the substrate 10 .
- the electrode 20 shown in FIG. 1 is separated, the separated electrodes 20 may be electrically connected together through another point to have almost the same potential.
- the substrate 10 includes a photoelectric conversion layer.
- the substrate 10 is a silicon substrate.
- the substrate 10 includes a p-type silicon layer and an n-type silicon layer.
- the photoelectric conversion layer may contain amorphous silicon or crystalline silicon.
- the photoelectric conversion layer may contain single crystalline silicon, polycrystalline silicon, or microcrystalline silicon.
- the electrode 20 extends in a predetermined direction.
- the electrode 20 of the panel 100 has a layered structure 20 D.
- the electrode 20 has a two-layer structure and includes a conductive layer 20 a in contact with the surface 12 of the substrate 10 and a conductive layer 20 b provided on the conductive layer 20 a .
- the conductive layer 20 a contains a conductive material Da
- the conductive layer 20 b contains a conductive material Db different from the conductive material Da.
- the conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc., for example.
- the conductive material Db different from the conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc., for example. It is appreciated that the conductive materials Da, Db are not exactly the same. If either one of the conductive materials Da, Db is a mixture, one conductive material of the mixture may be or may not be contained in the other conductive material. Further, when both the conductive materials Da, Db are mixtures, a given conductive material in either one of the conductive materials may be or may not be contained in the other conductive material.
- the conductive material Da is silver
- the conductive material Db is any one of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or a mixture containing at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- the conductive layer 20 a and the conductive layer 20 b contain a single conductive material Da and a single conductive material Db, respectively.
- the conductive material Da is silver, while the conductive material Db is copper.
- the conductive material Da is suitably selected according to the material forming the surface 12 of the substrate 10 .
- the use of silver as the conductive material Da can reduce the contact resistance.
- metal materials having low resistivity are used as the conductive materials Da, Db.
- the conductive materials Da, Db may be referred to as a first conductive material Da and a second conductive material Db, respectively.
- the conductive layers 20 a , 20 b may be referred to as a first conductive layer 20 a and a second conductive layer 20 b , respectively.
- the width of the conductive layer 20 a is almost equal to the width of the conductive layer 20 b.
- the electrode 20 has the layered structure 20 D as described above, the sectional area can be increased even with a comparatively small width of the electrode 20 , thereby achieving low resistance.
- the conductive layer 20 b contains the conductive material Db different from the conductive material Da of the conductive layer 20 a . This permits selection of the conductive material Db of the conductive layer 20 b substantially regardless of what the material of the surface 12 of the substrate 10 is, thereby increasing the degree of freedom of designing the electrode 20 .
- the conductive layer 20 a containing silver and the conductive layer 20 b containing copper are layered, thereby suppressing an increase in resistance of the electrode 20 itself and reducing the used amount of expensive silver.
- FIG. 2 is a schematic diagram showing a light receiving plane of the panel 100 .
- the electrode 20 includes bus bar electrodes 22 and finger electrodes 24 .
- the electrode 20 may be called a collector electrode.
- the finger electrodes 24 extend from each bus bar electrode 22 .
- the finger electrodes 24 are arrayed at regular intervals.
- the width of the bus bar electrodes 22 is larger than the width of the finger electrodes 24 .
- FIG. 1 is a cross sectional view taken along the line 1 - 1 ′ in FIG. 2 .
- the panel 100 is in a rectangular shape having a principal plane with a length of 170 mm and a width of 170 mm.
- the bus bar electrodes 22 have a width of 2 mm or larger and 3 mm or smaller, while the finger electrodes 24 have a width of 15 ⁇ m or larger and 70 ⁇ m or smaller.
- Each interval of the finger electrodes 24 that is, the distance between the center of a given finger electrode 24 and the center of an adjacent finger electrode 24 is 2 mm
- the number of the finger electrodes 24 increases to reduce the opening area.
- FIG. 3 is a schematic diagram of the panel 100 .
- the panel 100 includes not only the electrode 20 provided on the surface 12 of the substrate 10 but also an electrode 110 provided on an opposite surface 14 of the substrate 10 .
- the electrode 110 is provided so as to cover the entirety of the opposite surface 14 of the substrate 10 .
- the electrode 110 is made of aluminum.
- the substrate 10 having the surface 12 is prepared.
- the substrate 10 is a silicon substrate, for example.
- the electrode 20 is formed on the surface 12 of the substrate 10 .
- the electrode 20 is formed by printing, for example.
- conductive ink Ka containing the conductive material Da is printed on the substrate 10 .
- the conductive ink Ka contains the conductive material Da in particulate form and a vehicle.
- the vehicle contains resin and a solvent.
- the conductive ink Ka has appropriate thixotropy.
- the conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc.
- the resin may be called binder resin.
- the resin include thermosetting resin, such as polyester/melamine resin, UV curable resin, such as acrylic resin, thermoplastic resin, such as polyester resin, and the like.
- the solvent is a low-temperature-volatile solvent that volatilizes at room temperature, for example.
- the solvent is a glycol ether solvent.
- conductive ink Kb containing the conductive material Db different from the conductive material Da is printed on the conductive ink Ka.
- the conductive material Db different from the conductive material Da is a single substance of silver, copper, gold, carbon cobalt, titanium, nickel, aluminum, etc., or a mixture containing at least two selected from the group of them.
- the conductive ink Kb contains the conductive material Db in particulate form and a vehicle.
- the vehicle contains resin and a solvent.
- the vehicle of the conductive ink Kb may be the same as that of the conductive ink Ka, or the vehicle of the conductive ink Kb may be similar to that of the conductive ink Ka.
- the conductive ink is printed on the substrate 10 .
- the conductive ink Ka, Kb may be referred to as first conductive ink Ka and second conductive ink Kb, respectively.
- the first conductive ink Ka and the second conductive ink Kb are heated.
- the heating temperature is 500° C. or higher and 850° C. or lower, for example.
- the first conductive layer 20 a is formed according to the shape of the conductive ink Ka
- the second conductive layer 20 b is formed according to the shape of the conductive ink Kb.
- the production method and the printing method described with reference to FIGS. 4 and 5 are performed suitably using a printing apparatus as described below.
- a printing apparatus 200 of the present embodiment includes a conveyor 210 configured to convey the substrate 10 , a printing section 220 , and a heater 230 .
- the printing section 220 includes a plurality of printing machines. The number of the printing machines corresponds to the number of layers of the layered structure of the electrode 20 .
- the printing section 220 includes a printing machine 220 a configured to print the conductive ink Ka containing the conductive material Da and a printing machine 220 b configured to print the conductive ink Kb containing the conductive material Db different from the conductive material Da.
- the substrate 10 is place on the conveyor 210 , which is rotating.
- the conveyor 210 conveys the substrate 10 .
- the printing machine 220 a prints the conductive ink Ka on the substrate 10 .
- the printing machine 220 b prints the conductive ink Kb on the substrate 10 .
- the conveying speed of the conveyor 210 and the printing of the printing machines 220 a , 220 b are set so that the conductive ink Kb is layered on the conductive ink Ka.
- the conveyor 210 conveys the substrate 10 , on which the conductive ink Ka, Kbe are layered, to the heater 230 .
- the substrate 10 is heated in the heater 230 , thereby baking the conductive ink Ka, Kb.
- This forms the conductive layer 20 a containing the conductive material Da from the conductive ink Ka and forms the conductive layer 20 b containing the conductive material Db from the conductive ink Kb.
- the electrode 20 including the conductive layers 20 a , 20 b containing the different conductive materials is formed.
- FIG. 7 is a schematic diagram showing one example of the printing machine 220 a .
- the printing machine 220 a includes an ink tray 302 , an ink supply roll 304 , an intaglio printing roll 306 , a transfer roll 308 , a scraper 310 , and a cleaning roll 312 .
- the conductive ink Ka in the ink tray 302 is moved from the ink supply roll 304 to the peripheral surface of the intaglio printing roll 306 , is moved further to the peripheral surface of the transfer roll 308 , and then is transferred to the surface of the substrate 10 , which is continuously passing below the transfer roll 308 .
- Such printing may be called offset printing or gravure offset printing.
- the conductive ink Ka to be printed on the substrate 10 is filled in the ink tray 302 .
- the conductive ink Ka in the ink tray 302 decreases, the conductive ink Ka is filled into the ink tray 302 from a pump (not shown) below.
- the ink tray 302 is located at the lower part of the printing machine 220 a.
- the lower part of the ink supply roll 304 is dipped in the conductive ink Ka in the ink tray 302 .
- the ink supply roll 304 rotates while being dipped in the conductive ink Ka in the ink tray 302 .
- the conductive ink Ka attached to the ink supply roll 304 is transferred to the intaglio printing roll 306 .
- the scraper 310 is provided in the vicinity of the intaglio printing roll 306 . Before the intaglio printing roll 306 gets out from the conductive ink Ka in the ink tray 302 and comes into contact with the transfer roll 308 , the scraper 310 removes surplus conductive ink Ka attached to the intaglio printing roll 306 .
- Recesses are formed in the surface portion of the intaglio printing roll 306 .
- the recesses correspond to the lines, figures, patterns, etc., which are to be printed on the substrate 10 .
- the intaglio printing roll 306 has an outer diameter of 100 mm and a width of 145 mm. It is appreciated that the conductive ink Ka is transferred correspondingly to the recesses of the intaglio printing roll 306 .
- the corresponding width of the recesses of the intaglio printing roll 306 is 30 ⁇ m.
- the conductive ink Ka attached to the recesses of the intaglio printing roll 306 is attached to the transfer roll 308 .
- the transfer roll 308 rotates while coming in contact with the peripheral surface of the intaglio printing roll 306 and presses the surface of the substrate 10 passing therebelow to transfer the conductive ink Ka to the substrate 10 .
- the transfer roll 308 is made of a material excellent in detachability so that the conductive ink Ka can be smoothly and reliably transferred to the surface of the substrate 10 from the transfer roll 308 .
- the transfer roll 308 is made of a given type of silicone rubber.
- the transfer roll 308 has an outer diameter of 200 mm and a width of 135 mm.
- the cleaning roll 312 is provided in the vicinity of the transfer roll 308 . The cleaning roll 312 removes surplus conductive ink Ka attached to the transfer roll 308 .
- the printing machine 220 b has a configuration similar to that of the aforementioned printing machine 220 a , except that the conductive ink in the ink tray 302 is different.
- the printing apparatus 200 prints the conductive ink Ka, Kb by offset printing. Such offset printing can reduce each width of the conductive ink Ka, Kb, thereby enabling formation of an electrode 20 with a small width.
- the electrode 20 has the two-layer structure, and the printing apparatus 200 includes the two printing machines 220 a , 220 b in the above description, it is appreciated that the present invention is not limited to the description.
- the electrode 20 may have a three- or more-layer structure, and the printing section 220 may include three or more printing machines.
- the number of layer types of the layered structure 20 D is equal to the number of the printing machines of the printing section 220 in the above description, it is appreciated that the present invention is not limited to the description.
- the number of layer types of the layered structure 20 D may be smaller than the number of the printing machines in the printing section 220 .
- each of two printing machines may print a layer of conductive ink containing silver as a conductive material to form two-layer conducive ink, and then another printing machine may print a layer of conductive ink containing another conductive material (e.g., copper) on the two-layer conductive ink.
- another conductive material e.g., copper
- the intaglio printing roll 306 in each printing machine 220 a , 220 b corresponds to both the bus bar electrodes 22 and the finger electrodes 24 , and the printing section 220 prints the conductive ink corresponding to the electrode 20 including the bus bar electrodes 22 and the finger electrodes 24 at one time.
- the printing section 220 may form one of the bus bar electrodes 22 and the finger electrodes 24 first, and then form the other thereafter.
- the intaglio printing roll 306 of each printing machine 220 a , 220 b can correspond to the finger electrodes 24 .
- the printing sections 220 a , 220 b may print conductive ink corresponding to the finger electrodes 24 , and then, another printing machine (not shown) prints conductive ink corresponding to the bus bar electrodes 22 .
- the conveyor 210 of the printing apparatus 200 shown in FIG. 6 conveys the substrate 10 linearly, it is appreciated that the present invention is not limited to the drawing.
- the conveyor 210 may convey the substrate 10 windingly.
- the conveyor 210 may convey the substrate 10 in a loop manner.
- Such a loop conveyor 210 may be called a turntable.
- the conveyor 210 of the printing apparatus 200 shown in FIG. 6 conveys the substrate 10 in one direction
- the present invention is not limited to the drawing.
- the conveyor 210 may convey the substrate 10 in a bidirectional manner.
- the printing section 220 can include only one printing machine 220 a .
- the conveyor 210 may convey the substrate 10 in one direction while the printing machine 220 a is set printable to perform printing.
- the conveyor 210 can convey the substrate 10 in the opposite direction while the printing machine 220 a is set unprintable.
- the conductive ink is exchanged, and the conveyor 210 can convey the substrate 10 again in the one direction while the printing machine 220 a is set printable to perform printing again.
- the layered structure 20 D is obtained.
- a panel 100 A of the present embodiment has a configuration similar to that of the panel 100 as described above with reference to FIGS. 1-3 except additional inclusion of an anti-oxidation layer. In order to avoid redundancy, duplicated description is omitted.
- the electrode 20 also includes the conductive layer 20 a and the conductive layer 20 b , which have almost the same width.
- the panel 100 A further includes an anti-oxidation layer 30 .
- the width of the anti-oxidation layer 30 is larger than that of the conductive layers 20 a , 20 b .
- the anti-oxidation layer 30 can prevent oxidation of at least part of the electrode 20 .
- the conductive layer 20 a contains silver
- the conductive layer 20 b contains copper
- copper tends to be oxidized.
- the oxidation may accompany an increase in specific resistance.
- provision of the anti-oxidation layer 30 can reduce the oxidation to suppress the increase in specific resistance.
- silver is comparatively hard to be oxidized, strictly speaking, even the conductive layer 20 a of which main component is silver may be degraded with time. Provision of the anti-oxidation layer 30 can reduce the degradation.
- the panel 100 A including the anti-oxidation layer 30 can prevent oxidation of at least part of the conductive layers 20 a , 20 b to reduce degradation of the characteristics of the panel 100 A.
- the anti-oxidation layer 30 can be suitably made of a transparent conductive material.
- the transparent conductive material include indium tin oxide (ITO).
- the transparent conductive material may be zinc oxide or tin oxide.
- the anti-oxidation layer 30 may contain a non-conductive transparent material.
- the anti-oxidation layer 30 may contain an opaque conductive material.
- it is preferable that the anti-oxidation layer 30 contains a transparent conductive material. This can increase the intervals of the finger electrodes 24 .
- the electrode 20 is separated so as to be provided in parallel to each other, and the anti-oxidation layer 30 herein is separate to cover the electrode 20 .
- FIG. 9A is a schematic cross sectional view of the panel 100 as described above with reference to FIGS. 1-3 .
- FIG. 9A is similar to FIG. 1 , except that the electrode 20 provided on the surface 12 of the substrate 10 is separated into four. As described above, the intervals of the finger electrodes 24 are set according to efficiency of extracting carriers generated in the substrate 10 .
- FIG. 9B is a schematic cross sectional view of the panel 100 A.
- the anti-oxidation layer 30 convers the electrode 20 in the panel 100 A.
- the carriers generated in the substrate 10 may reach not only the finger electrodes 24 but also the anti-oxidation layer 30 , thereby enabling extraction of the generated carries as an electric current.
- the intervals of the finger electrodes of the panel 100 are set at 2 mm
- the intervals of the finger electrodes of the panel 100 A can be set at 3 mm.
- the number of the finger electrodes is 85 in the panel 100
- the number of the finger electrodes is 56 in the panel 100 A.
- the width of the anti-oxidation layer 30 is, for example, twice or more the width of the electrode 20 .
- the panel 100 A can be suitably produced using a printing apparatus.
- the printing apparatus 200 A has a configuration similar to that of the printing apparatus 200 as described above with reference to FIG. 6 , except that the printing section 220 includes an additional printing machine. In order to avoid redundancy, duplicated description is omitted.
- the printing section 220 of the printing apparatus 200 A further includes a printing machine 220 c between the printing machine 220 b configured to print the conductive ink Kb and the heater 230 .
- the printing machine 220 c has a configuration similar to that of the printing machine 220 a as described above with reference to FIG. 7 , except that the ink in the ink tray 302 and the shape of the recesses formed in the intaglio printing roll 306 are different. In order to avoid redundancy, duplicated description is omitted.
- Ink Kc is filled in the ink tray 302 of the printing machine 220 c .
- the ink Kc contains particulate ITO and a vehicle.
- the vehicle contains resin and a solvent.
- the ink Kc may be referred to as anti-oxidation ink.
- the printing machines 220 a , 220 b that print respectively the conductive ink Ka, Kb may be referred to as conductive ink printing machines, and the printing machine 220 c that prints the anti-oxidation ink Kc may be referred to as an anti-oxidation ink printing machine in the present specification.
- the vehicle of the anti-oxidation ink Kc may be the same as that of the conductive ink Ka or Kb. Alternatively, the vehicle of the conductive ink Kc may be similar to that of the conductive ink Ka or Kb.
- the ink Kc is transferred correspondingly to the recesses of the intaglio printing roll 306 .
- the width of the corresponding recesses of the intaglio printing roll 306 is set at, for example, 150 ⁇ m.
- the width of the corresponding recesses of the intaglio printing roll 306 is set at 170 ⁇ m (e.g., 150 ⁇ m plus 10 ⁇ m plus 10 ⁇ m).
- the ink Kc is printed on the conductive ink Ka, Kb on the substrate 10 .
- the conductive ink Ka, Kb and the anti-oxidation ink Kc are heated by the heater 230 ( FIG. 10 ).
- the electrode 20 covered with the anti-oxidation layer 30 has different conductive layers 20 a , 20 b in the panel 100 A in the above description, it is understood that the present invention is not limited to the description.
- the electrode 20 may be formed of a single conductive layer in a panel 100 B of the present embodiment.
- the surface 12 of the substrate 10 may be made of silicon, and the electrode 20 may be formed of a conductive layer of which main component is silver.
- a panel 100 C according to the present embodiment has a configuration similar to that of the panel 100 as described above with reference to FIGS. 1-3 , except that the sectional area of each electrode 24 extending in the predetermined direction (x-direction herein) varies according to its position. In order to avoid redundancy, duplicated description is omitted.
- FIG. 12A is a schematic top view of the panel 100 C.
- the electrode 20 of the panel 100 C includes linear electrodes 22 , 24 .
- the linear electrodes 22 extend in the Y-direction, while the linear electrodes 24 extend in the X-direction from the linear electrodes 22 .
- the linear electrodes 22 , 24 may be referred to as first linear electrodes 22 and second linear electrodes 24 , respectively.
- both the linear electrodes 22 , 24 have linear shape and orthogonal to each other.
- at least one of the linear electrodes 22 , 24 may be bent or curved.
- first linear electrodes 22 adjacent to each other and extending in parallel in the predetermined direction may be referred to as first and second parallel electrodes 22 a , 22 b
- second linear electrodes 24 intersecting the first and second parallel electrodes 22 a , 22 b may be referred to as crossed electrodes.
- the linear electrodes 22 may be called bus bar electrodes, while the linear electrodes 24 may be called finger electrodes.
- the plural bus bar electrodes 22 extend in parallel to each other in the Y-direction, and the finger electrodes 24 intersect the bus bar electrodes 22 .
- the finger electrodes 24 extend in parallel to each other in the X-direction, and the bus bar electrodes 22 are arranged so as to be orthogonal to the finger electrodes 24 .
- FIG. 12B is a partially enlarged view of the panel 100 C.
- FIG. 12C is a schematic cross sectional view of the panel 100 C.
- FIG. 12C shows a cross section taken along the line 12 c - 12 c ′ in FIG. 12B .
- each linear electrode 24 of the panel 100 C includes sectional area decreasing parts 24 x of which the area in section (sectional area) orthogonal to the longitudinal direction of the linear electrode 24 decreases in a direction away from the linear electrodes 22 .
- each linear electrode 24 includes two sectional area decreasing parts 24 x in FIG. 12B , it is appreciated that each linear electrode 24 may include only one sectional area decreasing part 24 x .
- the number of layers at the part having the smallest sectional area in each of the two sectional area decreasing parts 24 x is one, while the number of layers at the part having the largest sectional area therein is two. As such, the number of layers at the part having the smallest sectional area may be smaller than that of the layers at the part having the largest sectional area.
- the electrode 20 has the layered structure 20 D including the first conductive layer 20 a and the second conductive layer 20 b .
- the first conductive layer 20 a contains silver
- the second conductive layer 20 b contains copper.
- the first conductive layer 20 a is provided in both of the bus bar electrodes 22 and the finger electrodes 24 .
- the second conductive layer 20 b is selectively provided in at least one of the bus bar electrodes 22 and the finger electrodes 24 .
- the second conductive layer 20 b is provided at a part of each finger electrode 24 which is near a bus bar electrode 22 and is not provided at the central part of each finger electrode 24 .
- each finger electrode 24 the sectional area of a part A near a bus bar electrode 22 is larger than the sectional area of a part B apart from the bus bar electrode 22 .
- the carriers formed in the substrate 10 are extracted through the electrode 20 therearound, thereby increasing the electric current at the part A of each finger electrode 24 which is near a bus bar electrode 22 .
- the sectional area of a part near a bus bar electrode 22 is larger than the sectional area of the central part of the finger electrode 24 . This can reduce the cost of the material for the finger electrodes 24 without reducing the current extracting efficiency.
- each finger electrode 24 of the panel 100 C the second conductive layer 20 b is shorter than the first conductive layer 20 a , and the width of the second conductive layer 20 b is smaller than the width of the first conductive layer 20 a .
- each length of the first and second conductive layers 20 a , 20 b means the distance in the direction where the electric current flows from the finger electrodes 24 to the bus bar electrodes 22
- each width of the first and second conductive layers 20 a , 20 b means the distance in the direction orthogonal to the direction where the electric current flows from the finger electrodes 24 to the bus bar electrodes 22 as viewed in the normal direction of the surface 12 of the substrate 10 .
- the second conductive layer 20 b shorter than the first conductive layer 20 a means that in the panel 100 C, the second conductive layer 20 b is provided in the form of islands on the first conductive layer 20 a , and adjacent islands of the second conductive layer 20 b are electrically connected together through the first conductive layer 20 a.
- the sectional area around the central part of each crossed electrode 24 is smaller than the sectional area of a part of each crossed electrode 24 which is near the first parallel electrode 22 a and the sectional area of a part of each crossed electrode 24 which is near the second parallel electrode 22 b .
- the width around the central part of each crossed electrode 24 is smaller than the width of a part of each crossed electrode 24 which is near the first parallel electrode 22 a and the width of a part of each crossed electrode 24 which is near the second parallel electrode 22 b.
- the second conductive layer 20 b is shorter than the first conductive layer 20 a , and the width of the second conductive layer 20 b is smaller than the width of the first conductive layer 20 a in the above description.
- the present invention is not limited to the description.
- the width of the second conductive layer 20 b is smaller than the width of the first conductive layer 20 a
- the length of the second conductive layer 20 b may be equal to that of the first conductive layer 20 a
- adjacent bus bar electrodes 22 may be electrically connected together through not only the first conductive layer 20 a but also the second conductive layer 20 b .
- the width of the first conductive layer 20 a may be equal to the width of the second conductive layer 20 b .
- the electrode 20 of the panel 100 C can be produced using, for example, the printing apparatus 200 as described above with reference to FIG. 6 .
- the shape and size of the first conductive layer 20 a shown in FIG. 12B correspond to those of the first conductive ink Ka
- the shape and size of the second conductive layer 20 b shown in FIG. 12C correspond to those of the second conductive ink Kb.
- the width of the finger electrodes 24 is constant in the panel 100 C as described with reference to FIG. 12 .
- the present invention is not limited to the above description.
- FIG. 13A is a partially enlarged view of a panel 100 C 1 .
- FIG. 13B is a schematic cross sectional view of the panel 100 C 1 .
- FIG. 13B shows a cross section taken along the line 13 b - 13 b ′ in FIG. 13A .
- the width of the respective two sectional area decreasing parts 24 x in the electrode 20 continuously decreases in the direction away from the first linear electrodes 22 as viewed in the normal direction of the surface 12 of the substrate 10 .
- the sectional area of each second linear electrode 24 continuously decreases in the direction away from the first linear electrodes 22 . This can increase the opening area of the surface 12 of the substrate 10 .
- the width around the central part D of each finger electrode 24 which is between adjacent bus bar electrodes 22 is smaller than the width of parts C thereof which are near the bus bar electrodes 22 as viewed in the normal direction of the surface 12 of the substrate 10 .
- the width around the central part between adjacent bus bar electrodes 22 is smaller than the width of the parts near the bus bar electrodes 22 .
- the second conductive layer 20 b forming the finger electrodes 24 is provided at parts C near the bus bar electrodes 22 , but is not provided around the central part D between the adjacent bus bar electrodes 22 .
- the resistance of the parts of finger electrodes 24 which are near the bus bar electrodes 22 can be reduced in the panel 100 C 1 .
- the sectional area of the parts C of the finger electrodes 24 which are near the bus bar electrodes 22 larger than that around the central parts D thereof can lead to reduction in material cost without reducing the current extracting efficiency.
- the opening area of the solar panel can be increased, thereby effectively generating the electric current.
- the conductive layers 20 a , 20 b of the electrode 20 in the panels 100 C and 100 C 1 are made of the different conductive materials in the above description. However, it is appreciated that the present invention is not limited to the description.
- the conductive layers 20 a , 20 b may be made of the same conductive material.
- FIG. 14A is a partially enlarged view of the panel 100 C 2 .
- FIG. 14B is a schematic cross sectional view of the panel 100 C 2 .
- FIG. 14B shows a cross section taken along the line 14 b - 14 b ′ in FIG. 14A .
- the panel 100 C 2 has a configuration similar to that of the panel 100 C as described above with reference to FIG. 12 , except that the conductive layers 20 a , 20 b are made of the same conductive material. Accordingly, in order to avoid redundancy, duplicated description is omitted. For example, both of the conductive layers 20 a , 20 b contain silver. It is appreciated that the width of the finger electrodes 24 of the panel 100 C 2 , which is constant in FIG. 14 , may vary like the panel 100 C 1 shown in FIG. 13 .
- the electrode 20 includes a plurality of conductive layers 20 a , 20 b in the panel 100 C 1 .
- the present invention is not limited to the above description.
- FIG. 15A is a partially enlarged view of a panel 100 C 3 .
- FIG. 15B is a schematic cross sectional view of the panel 100 C 3 .
- FIG. 15B shows a cross section taken along the line 15 b - 15 b ′ in FIG. 15B .
- the width around the central parts E between adjacent bus bar electrodes 22 is smaller than the width of the parts F near the bus bar electrodes 22 . Accordingly, the resistance of the parts of the finger electrodes 24 which are near the bus bar electrodes 22 can be reduced in the panel 100 C 3 . It is preferable that the sectional area of the parts of the finger electrodes 24 which are near the bus bar electrodes 22 is larger than the sectional area of the parts thereof which are away from the bus bar electrodes 22 .
- the sectional area of the vicinities of the bus bar electrodes 22 larger than the sectional area around the central parts of the finger electrodes 24 can reduce the material cost without reducing the current extracting efficiency. Further, the opening area of the solar panel can be increased to generate the electric current effectively.
- the panels 100 C- 100 C 3 can also be suitably produced using the above described printing apparatus 200 .
- the printing machines of the printing section 220 have a configuration similar to that of the aforementioned printing machines, except that the ink in the ink tray 302 and the shape of the recesses formed in the intaglio printing roll 306 are different. In order to avoid redundancy, duplicated description is omitted.
- the photoelectric conversion layer of the substrate 10 in each of the panels 100 , 100 A, 100 B, 100 C, 100 C 1 , 100 C 2 and 100 C 3 contains silicon in the above description. However, it is appreciated that the present invention is not limited to the description.
- the photoelectric conversion layer may contain an inorganic compound material.
- the photoelectric conversion layer may contain InGaAS, GaAs, chalcopyrite, Cu 2 ZnSnS 4 , or CdTe-CdS.
- the photoelectric conversion layer may contain an organic compound.
- the electrode 20 is provided on the silicon layer present at the surface 12 of the substrate 10 in each panel 100 - 100 C 3 in the above description, the present invention is not limited to the description.
- the electrodes 20 may be provided on a transparent conductive layer, which is provided on the silicon layer of the substrate 10 .
- an anti-reflection film may be provided in the region of the surface 12 of the substrate 10 where the electrode 20 is not provided.
- an anti-reflection film may be provided over the entire surface of the substrate 10 , and the electrodes 20 may be provided on the anti-reflection film.
- any of the panels 100 - 100 C 3 is used as a solar panel, a plurality of any of the panels 100 - 100 C 3 are arrayed in groups.
- FIG. 16 shows a solar cell module 300 in which the panels 100 , 100 A, 100 B, 100 C, 100 C 1 , 100 C 2 or 100 C 3 are arrayed.
- the panels 100 - 100 C 3 are arrayed in matrix of a plurality of rows and a plurality of columns.
- the panels 100 - 100 C 3 are connected together in series or in parallel.
- the first conductive layer 20 a is in contact with the surface 12 of the substrate 10 in the above description, it is appreciated that the present invention is not limited to the above description.
- the first conductive layer 20 a may be layered on the substrate 10 with another layer interposed. In this case, it is possible that after a predetermined layer is printed on the substrate 10 , the first conductive ink may be printed thereon.
- the panels 100 - 100 C 3 are solar panels in the above description, it is appreciated that the present invention is not limited to the description.
- the panels 100 - 100 C 3 may be touch panels, electromagnetic wave shielding panels, etc.
- the present invention can increase the degree of freedom of designing an electrode provided on a panel.
- the present invention can increase the sectional area of the electrode even with a comparatively small width thereof.
- the present invention is suitably applicable to panels for solar cells, touch panels, electromagnetic wave shielding panels, solar cell modules, etc.
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Abstract
A printing apparatus according to the present invention includes a printing section configured to print ink on a surface of a substrate. The printing section prints conductive ink containing a conductive material by offset printing and prints conductive ink containing a conductive material different from the conductive material on the conductive ink by offset printing. Preferably, the printing apparatus further includes a conveyor configured to convey the substrate. Further, the printing section preferably includes a first printing machine configured to print first conductive ink and a second printing machine configured to print second conductive ink.
Description
- The present application is a Continuation application of U.S. patent application Ser. No. 13/733,766 filed Jan. 3, 2013, which is a Continuation application of International Application No. PCT/JP2011/065754, filed Jul. 11, 2011, which claims priority to Japanese Patent Application No. 2010-157344, filed Jul. 9, 2010. The contents of these applications are incorporated herein by reference in their entirety.
- The present invention relates to panels, methods for producing a panel, solar cell modules, printing apparatuses, and printing methods.
- Solar panels can convert clean and inexhaustibly-supplied solar energy directly to electric energy and therefore are expected as novel energy sources. Silicon substrates are used for current mainstream solar panels. A collector electrode containing silver is provided on the surface of a silicon substrate. With the use of silver as a material for the collector electrode, it has been attempted to reduce the contact resistance between the silicon substrate and the collector electrode and to suppress the resistance of the collector electrode itself (for example, see Japanese Unexamined Patent Application Publication No. 2009-194013).
- Further, a wide width of the collector electrode provided on a light receiving side of a solar panel reduces the opening area of the silicon substrate to achieve inefficient energy conversion. Accordingly, it has been proposed to form an electrode in which a conductive layer containing silver is layered to reduce the reduction in the opening area and reduce the resistances (for example, see Japanese Unexamined Patent Application Publication No. 2010-090211). JP No. 2010-090211 discloses that a conductive layer containing silver is layered by printing to reduce the specific resistance and suppress oxidation.
- When a conductive layer is layered by printing as disclosed in JP No. 2010-090211, wasted conductive material can be reduced. However, further cost reduction is desired recently. For example, when a conductive layer containing a conductive material other than silver (e.g., comparatively inexpensive copper) is layered, although the resistance of the electrode itself can be reduced, the contact resistance to the silicon substrate increases, thereby obtaining insufficient features. As such, the printing method disclosed in Patent Literature 2 may not lead to formation of a desired electrode. Further, mere formation of an electrode may not achieve reduction in cost of the electrode material. In addition, oxidation of the electrode formed on the substrate may increase the resistivity.
- The present invention has been made in view of the foregoing problems and has its object of providing a panel, a method for producing a panel, a solar cell module including a panel, a printing apparatus, and a printing method, in which the degree of freedom of electrode design is increased.
- A printing apparatus according to the present invention is a printing apparatus including a printing section configured to print ink on a surface of a substrate. The printing section prints first conductive ink containing a first conductive material by offset printing, and prints second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing.
- In one embodiment, the printing apparatus further includes a conveyor configured to convey the substrate.
- In one embodiment, the printing section includes a first printing machine configured to print the first conductive ink and a second printing machine configured to print the second conductive ink.
- In one embodiment, the first conductive material contains silver.
- In one embodiment, the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- In one embodiment, the printing section prints anti-oxidation ink to cover at least part of the first conductive ink and the second conductive ink.
- In one embodiment, the anti-oxidation ink contains a transparent material. In one embodiment, the anti-oxidation ink contains a conductive material.
- In one embodiment, the first conductive ink has a width larger than the second conductive ink as viewed in a normal direction of the surface of the substrate.
- In one embodiment, the first conductive ink has a length larger than the second conductive ink.
- A printing method according to the present invention is a printing method for printing ink on a surface of a substrate, including: printing first conductive ink containing a first conductive material by offset printing; and printing second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing.
- A panel according to the present invention is a panel including a substrate having a surface and an electrode having a layered structure provided on the surface of the substrate. The layered structure includes a first conductive layer containing a first conductive material and a second conductive layer containing a second conductive material different from the first conductive material.
- In one embodiment, the first conductive layer contains silver.
- In one embodiment, the second conductive layer contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- In one embodiment, the first conductive layer and the second conductive layer are individually printed by offset printing.
- A solar cell module according to the present invention includes a plurality of the above panels.
- A method for producing a panel according to the present invention includes: preparing a substrate having a surface; and forming an electrode on the surface of the substrate. The forming an electrode includes: printing first conductive ink containing a first conductive material on the surface of the substrate by offset printing; printing second conductive ink containing a second conductive material different from the first conductive material on the first conductive ink by offset printing; and heating the first conductive ink and the second conductive ink.
- A panel according to the present invention includes a substrate having a surface and an electrode having a layered structure provided on the surface of the substrate. The electrode includes a first linear electrode and a second linear electrode extending from the first electrode. The second linear electrode includes a sectional area decreasing part of which sectional area in a section orthogonal to a longitudinal direction of the second linear electrode decreases in a direction away from the first linear electrode.
- In one embodiment, the number of layers of the layered structure at a part of the sectional area decreasing part which has the smallest sectional area is smaller than the number of layers of the layered structure at a part of the sectional area decreasing part which has the largest sectional area.
- In one embodiment, in the sectional area decreasing part, the sectional area of the second linear electrode continuously varies along a direction away from the first linear electrode.
- In one embodiment, in the sectional area decreasing part, the width of the second linear electrode continuously decreases in a direction away from the first linear electrode when the electrode is viewed in the normal direction of the surface of the substrate.
- In one embodiment, the layered structure includes a first conductive layer and a second conductive layer partially layered on the first conductive layer.
- In one embodiment, the width of the first conductive layer is larger than the width of the second conductive layer when the electrode is viewed in the normal direction of the surface of the substrate.
- In one embodiment, the length of the first conductive layer in a direction away from the first linear electrode is larger than the length of the second conductive layer in the direction away from the first linear electrode.
- In one embodiment, the first conductive layer contains a first conductive material, while the second conductive layer contains a second conductive material different from the first conducive material.
- In one embodiment, the first conductive material contains silver.
- In one embodiment, the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- In one embodiment, the panel further includes an anti-oxidation layer to prevent oxidation of at least part of the electrode.
- In one embodiment, the anti-oxidation layer contains a transparent material.
- In one embodiment, the anti-oxidation layer contains a conductive material.
- In one embodiment, the first linear electrode includes a first parallel electrode and a second parallel electrode which extend in parallel to each other in a direction away from the first linear electrode. The second linear electrode includes a crossed electrode electrically connected to the first parallel electrode and the second parallel electrode. The crossed electrode includes a first sectional area decreasing part in contact with the first parallel electrode and a second sectional are decreasing part in contact with the second parallel electrode.
- In one embodiment, when the electrode is viewed in the normal direction of the surface of the substrate, the sectional area of a central part of the crossed electrode between the first parallel electrode and the second parallel electrode is smaller than the sectional area of a part of the crossed electrode which is near the first parallel electrode and the sectional area of a part of the crossed electrode which is near the second parallel electrode.
- In one embodiment, when the electrode is viewed in the normal direction of the surface of the substrate, the width of a central part of the crossed electrode between the first parallel electrode and the second parallel electrode is smaller than the width of a part of the crossed electrode which is near the first parallel electrode and the width of a part of the crossed electrode which is near the second parallel electrode.
- A solar cell module according to the present invention includes a plurality of the above panels.
- A printing apparatus according to the present invention includes a printing section configured to print ink on a surface of a substrate. The printing section is configured to print conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to the longitudinal direction of the second linear part in a direction away from the first linear part.
- In one embodiment, the printing apparatus further includes a conveyor configured to convey the substrate.
- In one embodiment, the printing section includes a first printing machine configured to pint first conductive ink and a second printing machine configured to print second conductive ink on the first conductive ink.
- A printing method according to the present invention is a printing method for printing ink on a surface of a substrate. The printing method includes printing conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to a longitudinal direction of the second linear part in a direction away from the first linear part.
- In one embodiment, the printing includes printing first conductive ink on the surface of the substrate, and printing on the first conductive ink second conductive ink having a width and a length at least one of which is smaller than that of the first conducive ink.
- A method for producing a panel according to the present invention is a method for producing a panel including preparing a substrate having a surface, and forming an electrode on the surface of the substrate. The forming the electrode includes printing conductive ink including a first linear part having a layered structure linearly extending in a predetermined direction and a second linear part extending in a direction different from that of the first linear part so as to decrease a sectional area of a section orthogonal to a longitudinal direction of the second linear part in a direction away from the first linear part, and heating the conductive ink.
- In one embodiment, the printing includes printing first conductive ink and printing on the first conductive ink second conductive ink having a width and a length at least one of which is smaller than that of the first conductive ink.
- A panel according to the present invention includes a substrate having a surface, an electrode provided on the surface of the substrate, and an anti-oxidation layer to prevent oxidization of at least part of the electrode.
- In one embodiment, the anti-oxidation layer contains a transparent material.
- In one embodiment, the anti-oxidation layer contains a conductive material.
- In one embodiment, the substrate includes a photoelectric conversion layer.
- In one embodiment, the electrode has a layered structure.
- In one embodiment, the layered structure includes a first conductive layer and a second conductive layer provided on the first conductive layer.
- In one embodiment, the length of the first conductive layer in a predetermined direction is larger than the length of the second conductive layer in the predetermined direction.
- In one embodiment, the width of the first conducive layer is larger than the width of the second conductive layer when the electrode is viewed in the normal direction of the surface of the substrate.
- In one embodiment, the first conductive material contains a first conductive material, while the second conductive layer contains a second conductive material different from the first conductive material.
- In one embodiment, the first conductive material contains silver.
- In one embodiment, the second conductive material contains any of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- In one embodiment, the electrode includes a plurality of parallel electrodes extending in parallel to each other, and the anti-oxidation layer is separated to individually cover the plurality of parallel electrodes.
- In one embodiment, the width of the anti-oxidation layer is twice or more the width of the electrode.
- A solar cell module according to the present invention includes a plurality of the above panels.
- A printing apparatus according to the present invention includes a printing section configured to print ink on a surface of a substrate. The printing section includes a conductive ink printing machine configured to print conductive ink and an anti-oxidation ink printing machine configured to print anti-oxidation ink.
- In one embodiment, the printing apparatus further includes a conveyor configured to convey the substrate.
- In one embodiment, the conductive ink printing machine includes a first printing machine configured to print first conductive ink and a second printing machine configured to print second conductive ink on the first conductive ink.
- A printing method according to the present invention is a printing method for printing ink on a surface of a substrate, including printing conductive ink on the surface of the substrate and printing anti-oxidation ink to cover the conductive ink.
- A method for producing a panel according to the present invention includes preparing a substrate having a surface, printing conductive ink on the surface of the substrate, printing anti-oxidation ink to cover the conductive ink, and heating the conductive ink and the anti-oxidation ink.
- According to the present invention, a panel, a method for producing a panel, a solar cell module including a panel, a printing apparatus, and a printing method can be provided in which the degree of freedom of electrode design is increased.
-
FIG. 1 is a schematic cross sectional view of a first embodiment of a panel according to the present invention. -
FIG. 2 is a top view of the panel shown inFIG. 1 . -
FIG. 3 is a schematic cross sectional view showing the entirety of the panel shown inFIG. 1 . -
FIG. 4A andFIG. 4B are schematic diagrams for explaining a method for producing the panel shown inFIG. 1 . -
FIGS. 5A-5C are schematic diagrams for explaining a printing method used for forming an electrode of the panel shown inFIG. 1 . -
FIG. 6 is a schematic diagram showing the first embodiment of a printing apparatus according to the present invention. -
FIG. 7 is a schematic diagram showing one example of a printing machine of the printing apparatus shown inFIG. 6 . -
FIG. 8 is a schematic cross sectional view showing a second embodiment of a panel according to the present invention. -
FIG. 9A is a schematic cross sectional view of the panel shown inFIG. 1 , andFIG. 9B is a schematic cross sectional view of the panel shown inFIG. 8 -
FIG. 10 is a schematic diagram showing a second embodiment of a printing apparatus according to the present invention. -
FIG. 11 is a schematic cross sectional view showing a modified example of the second embodiment of a panel according to the present invention. -
FIG. 12A is a schematic top view showing a third embodiment of a panel according to the present invention.FIG. 12B is a partially enlarged view ofFIG. 12A .FIG. 12C is a schematic cross sectional view thereof. -
FIG. 13A is a schematic view showing a modified example of the third embodiment of a panel according to the present invention, andFIG. 13B is a schematic cross sectional view thereof. -
FIG. 14A is a schematic diagram showing another modified example of the third embodiment of a panel according to the present invention, andFIG. 14B is a schematic cross sectional view thereof. -
FIG. 15A is a schematic diagram showing still another modified example of the third embodiment of a panel according to the present invention, andFIG. 15B is a schematic cross sectional view thereof. -
FIG. 16 is a schematic diagram of one embodiment of a solar cell module including the panels according to the present invention. - With reference to the accompanying drawings, a panel, a method for producing a panel, a solar cell module, a printing apparatus, and a printing method according to the present invention will be described below. Although a solar panel is described as an example in the embodiments of the present invention, it is understood that the present invention is not limited the embodiments.
- The first embodiment of a panel according to the present invention will be described below with referent to the accompanying drawings.
FIG. 1 is a schematic cross sectional view of apanel 100. Here, thepanel 100 is a solar panel. The vicinity of one of the principal planes of thepanel 100 is shown inFIG. 1 on an enlarged scale. Thepanel 100 includes asubstrate 10 and anelectrode 20 provided on asurface 12 of thesubstrate 10. Although theelectrode 20 shown inFIG. 1 is separated, the separatedelectrodes 20 may be electrically connected together through another point to have almost the same potential. - Although not shown, the
substrate 10 includes a photoelectric conversion layer. For example, thesubstrate 10 is a silicon substrate. Thesubstrate 10 includes a p-type silicon layer and an n-type silicon layer. Specifically, the photoelectric conversion layer may contain amorphous silicon or crystalline silicon. For example, the photoelectric conversion layer may contain single crystalline silicon, polycrystalline silicon, or microcrystalline silicon. - Referring to
FIG. 1 showing the cross section, theelectrode 20 extends in a predetermined direction. Theelectrode 20 of thepanel 100 has a layeredstructure 20D. Here, theelectrode 20 has a two-layer structure and includes aconductive layer 20 a in contact with thesurface 12 of thesubstrate 10 and aconductive layer 20 b provided on theconductive layer 20 a. Theconductive layer 20 a contains a conductive material Da, while theconductive layer 20 b contains a conductive material Db different from the conductive material Da. - The conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc., for example. Also, the conductive material Db different from the conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc., for example. It is appreciated that the conductive materials Da, Db are not exactly the same. If either one of the conductive materials Da, Db is a mixture, one conductive material of the mixture may be or may not be contained in the other conductive material. Further, when both the conductive materials Da, Db are mixtures, a given conductive material in either one of the conductive materials may be or may not be contained in the other conductive material. Preferably, the conductive material Da is silver, while the conductive material Db is any one of copper, gold, carbon, cobalt, titanium, nickel, and aluminum, or a mixture containing at least two selected from the group consisting of silver, copper, gold, carbon, cobalt, titanium, nickel, and aluminum.
- Here, the
conductive layer 20 a and theconductive layer 20 b contain a single conductive material Da and a single conductive material Db, respectively. For example, the conductive material Da is silver, while the conductive material Db is copper. It is appreciated that the conductive material Da is suitably selected according to the material forming thesurface 12 of thesubstrate 10. For example, when thesurface 12 is made of silicon, the use of silver as the conductive material Da can reduce the contact resistance. Typically, metal materials having low resistivity are used as the conductive materials Da, Db. In the present specification, the conductive materials Da, Db may be referred to as a first conductive material Da and a second conductive material Db, respectively. Also, theconductive layers conductive layer 20 a and a secondconductive layer 20 b, respectively. The width of theconductive layer 20 a is almost equal to the width of theconductive layer 20 b. - Since the
electrode 20 has the layeredstructure 20D as described above, the sectional area can be increased even with a comparatively small width of theelectrode 20, thereby achieving low resistance. Further, theconductive layer 20 b contains the conductive material Db different from the conductive material Da of theconductive layer 20 a. This permits selection of the conductive material Db of theconductive layer 20 b substantially regardless of what the material of thesurface 12 of thesubstrate 10 is, thereby increasing the degree of freedom of designing theelectrode 20. In addition, in thepanel 100, theconductive layer 20 a containing silver and theconductive layer 20 b containing copper are layered, thereby suppressing an increase in resistance of theelectrode 20 itself and reducing the used amount of expensive silver. -
FIG. 2 is a schematic diagram showing a light receiving plane of thepanel 100. Theelectrode 20 includesbus bar electrodes 22 andfinger electrodes 24. Theelectrode 20 may be called a collector electrode. Thefinger electrodes 24 extend from eachbus bar electrode 22. Typically, thefinger electrodes 24 are arrayed at regular intervals. In general, the width of thebus bar electrodes 22 is larger than the width of thefinger electrodes 24. It should be noted thatFIG. 1 is a cross sectional view taken along the line 1-1′ inFIG. 2 . - For example, the
panel 100 is in a rectangular shape having a principal plane with a length of 170 mm and a width of 170 mm. Further, for example, thebus bar electrodes 22 have a width of 2 mm or larger and 3 mm or smaller, while thefinger electrodes 24 have a width of 15 μm or larger and 70 μm or smaller. Each interval of thefinger electrodes 24, that is, the distance between the center of a givenfinger electrode 24 and the center of anadjacent finger electrode 24 is 2 mm With too large intervals of thefinger electrodes 24, an insufficient amount of carriers generated in thesubstrate 10 reach thefinger electrodes 24, thereby achieving inefficient current extraction. By contrast, with too small intervals of thefinger electrodes 24, the number of thefinger electrodes 24 increases to reduce the opening area. -
FIG. 3 is a schematic diagram of thepanel 100. Thepanel 100 includes not only theelectrode 20 provided on thesurface 12 of thesubstrate 10 but also anelectrode 110 provided on anopposite surface 14 of thesubstrate 10. Typically, theelectrode 110 is provided so as to cover the entirety of theopposite surface 14 of thesubstrate 10. For example, theelectrode 110 is made of aluminum. - A method for suitably producing the
panel 100 will be described below with reference toFIG. 4 . As shown inFIG. 4A , thesubstrate 10 having thesurface 12 is prepared. As described above, thesubstrate 10 is a silicon substrate, for example. Next, as shown inFIG. 4B , theelectrode 20 is formed on thesurface 12 of thesubstrate 10. Theelectrode 20 is formed by printing, for example. - A method for forming the
electrode 20 will be described below with reference toFIG. 5 . As shown inFIG. 5A , conductive ink Ka containing the conductive material Da is printed on thesubstrate 10. For example, the conductive ink Ka contains the conductive material Da in particulate form and a vehicle. The vehicle contains resin and a solvent. The conductive ink Ka has appropriate thixotropy. - As described above, the conductive material Da is a single substance or a mixture of silver, copper, gold, carbon, cobalt, titanium, nickel, aluminum, etc. The resin may be called binder resin. Examples of the resin include thermosetting resin, such as polyester/melamine resin, UV curable resin, such as acrylic resin, thermoplastic resin, such as polyester resin, and the like. Further, the solvent is a low-temperature-volatile solvent that volatilizes at room temperature, for example. Specifically, the solvent is a glycol ether solvent.
- Subsequently, as shown in
FIG. 5B , conductive ink Kb containing the conductive material Db different from the conductive material Da is printed on the conductive ink Ka. As described above, the conductive material Db different from the conductive material Da is a single substance of silver, copper, gold, carbon cobalt, titanium, nickel, aluminum, etc., or a mixture containing at least two selected from the group of them. For example, the conductive ink Kb contains the conductive material Db in particulate form and a vehicle. The vehicle contains resin and a solvent. The vehicle of the conductive ink Kb may be the same as that of the conductive ink Ka, or the vehicle of the conductive ink Kb may be similar to that of the conductive ink Ka. Thus, the conductive ink is printed on thesubstrate 10. It should be noted that in the present specification, the conductive ink Ka, Kb may be referred to as first conductive ink Ka and second conductive ink Kb, respectively. - Thereafter, as shown in
FIG. 5C , the first conductive ink Ka and the second conductive ink Kb are heated. The heating temperature is 500° C. or higher and 850° C. or lower, for example. This bakes the conductive material Da to form the firstconductive layer 20 a containing the conductive material Da and bakes the conductive material Db to form the secondconductive layer 20 b containing the conductive material Db. It is appreciated that the firstconductive layer 20 a is formed according to the shape of the conductive ink Ka, while the secondconductive layer 20 b is formed according to the shape of the conductive ink Kb. - The production method and the printing method described with reference to
FIGS. 4 and 5 are performed suitably using a printing apparatus as described below. - One embodiment of a printing apparatus according to the present invention will be described with reference to
FIG. 6 . Aprinting apparatus 200 of the present embodiment includes aconveyor 210 configured to convey thesubstrate 10, aprinting section 220, and aheater 230. Theprinting section 220 includes a plurality of printing machines. The number of the printing machines corresponds to the number of layers of the layered structure of theelectrode 20. Here, theprinting section 220 includes aprinting machine 220 a configured to print the conductive ink Ka containing the conductive material Da and aprinting machine 220 b configured to print the conductive ink Kb containing the conductive material Db different from the conductive material Da. - First, the
substrate 10 is place on theconveyor 210, which is rotating. Theconveyor 210 conveys thesubstrate 10. When thesubstrate 10 conveyed by theconveyor 210 reaches below theprinting machine 220 a, theprinting machine 220 a prints the conductive ink Ka on thesubstrate 10. - Next, when the
substrate 10 conveyed by theconveyor 210 reaches below theprinting machine 220 b, theprinting machine 220 b prints the conductive ink Kb on thesubstrate 10. It should be noted that the conveying speed of theconveyor 210 and the printing of theprinting machines - Subsequently, the
conveyor 210 conveys thesubstrate 10, on which the conductive ink Ka, Kbe are layered, to theheater 230. Thesubstrate 10 is heated in theheater 230, thereby baking the conductive ink Ka, Kb. This forms theconductive layer 20 a containing the conductive material Da from the conductive ink Ka and forms theconductive layer 20 b containing the conductive material Db from the conductive ink Kb. Thus, theelectrode 20 including theconductive layers -
FIG. 7 is a schematic diagram showing one example of theprinting machine 220 a. Theprinting machine 220 a includes anink tray 302, an ink supply roll 304, anintaglio printing roll 306, atransfer roll 308, ascraper 310, and acleaning roll 312. In theprinting machine 220 a, the conductive ink Ka in theink tray 302 is moved from the ink supply roll 304 to the peripheral surface of theintaglio printing roll 306, is moved further to the peripheral surface of thetransfer roll 308, and then is transferred to the surface of thesubstrate 10, which is continuously passing below thetransfer roll 308. Such printing may be called offset printing or gravure offset printing. - Detailed description will be provided below. The conductive ink Ka to be printed on the
substrate 10 is filled in theink tray 302. When the conductive ink Ka in theink tray 302 decreases, the conductive ink Ka is filled into theink tray 302 from a pump (not shown) below. Theink tray 302 is located at the lower part of theprinting machine 220 a. - The lower part of the ink supply roll 304 is dipped in the conductive ink Ka in the
ink tray 302. The ink supply roll 304 rotates while being dipped in the conductive ink Ka in theink tray 302. The conductive ink Ka attached to the ink supply roll 304 is transferred to theintaglio printing roll 306. It should be noted that thescraper 310 is provided in the vicinity of theintaglio printing roll 306. Before theintaglio printing roll 306 gets out from the conductive ink Ka in theink tray 302 and comes into contact with thetransfer roll 308, thescraper 310 removes surplus conductive ink Ka attached to theintaglio printing roll 306. - Recesses are formed in the surface portion of the
intaglio printing roll 306. The recesses correspond to the lines, figures, patterns, etc., which are to be printed on thesubstrate 10. For example, theintaglio printing roll 306 has an outer diameter of 100 mm and a width of 145 mm. It is appreciated that the conductive ink Ka is transferred correspondingly to the recesses of theintaglio printing roll 306. For example, in order to form the finger electrodes 24 (FIG. 2 ) having a width of 30 μm, the corresponding width of the recesses of theintaglio printing roll 306 is 30 μm. - The conductive ink Ka attached to the recesses of the
intaglio printing roll 306 is attached to thetransfer roll 308. Thetransfer roll 308 rotates while coming in contact with the peripheral surface of theintaglio printing roll 306 and presses the surface of thesubstrate 10 passing therebelow to transfer the conductive ink Ka to thesubstrate 10. Thetransfer roll 308 is made of a material excellent in detachability so that the conductive ink Ka can be smoothly and reliably transferred to the surface of thesubstrate 10 from thetransfer roll 308. For example, thetransfer roll 308 is made of a given type of silicone rubber. Thetransfer roll 308 has an outer diameter of 200 mm and a width of 135 mm. It should be noted that the cleaningroll 312 is provided in the vicinity of thetransfer roll 308. The cleaningroll 312 removes surplus conductive ink Ka attached to thetransfer roll 308. - It is noted that though not shown, the
printing machine 220 b has a configuration similar to that of theaforementioned printing machine 220 a, except that the conductive ink in theink tray 302 is different. As described above, theprinting apparatus 200 prints the conductive ink Ka, Kb by offset printing. Such offset printing can reduce each width of the conductive ink Ka, Kb, thereby enabling formation of anelectrode 20 with a small width. - Although the
electrode 20 has the two-layer structure, and theprinting apparatus 200 includes the twoprinting machines electrode 20 may have a three- or more-layer structure, and theprinting section 220 may include three or more printing machines. - Further, although the number of layer types of the layered
structure 20D is equal to the number of the printing machines of theprinting section 220 in the above description, it is appreciated that the present invention is not limited to the description. The number of layer types of the layeredstructure 20D may be smaller than the number of the printing machines in theprinting section 220. For example, in theprinting section 220, each of two printing machines may print a layer of conductive ink containing silver as a conductive material to form two-layer conducive ink, and then another printing machine may print a layer of conductive ink containing another conductive material (e.g., copper) on the two-layer conductive ink. - Further, in the above description, the
intaglio printing roll 306 in eachprinting machine bus bar electrodes 22 and thefinger electrodes 24, and theprinting section 220 prints the conductive ink corresponding to theelectrode 20 including thebus bar electrodes 22 and thefinger electrodes 24 at one time. However, the present invention is not limited the description. Theprinting section 220 may form one of thebus bar electrodes 22 and thefinger electrodes 24 first, and then form the other thereafter. For example, theintaglio printing roll 306 of eachprinting machine finger electrodes 24. Theprinting sections finger electrodes 24, and then, another printing machine (not shown) prints conductive ink corresponding to thebus bar electrodes 22. - Although the
conveyor 210 of theprinting apparatus 200 shown inFIG. 6 conveys thesubstrate 10 linearly, it is appreciated that the present invention is not limited to the drawing. Theconveyor 210 may convey thesubstrate 10 windingly. For example, theconveyor 210 may convey thesubstrate 10 in a loop manner. Such aloop conveyor 210 may be called a turntable. - Furthermore, although the
conveyor 210 of theprinting apparatus 200 shown inFIG. 6 conveys thesubstrate 10 in one direction, the present invention is not limited to the drawing. Theconveyor 210 may convey thesubstrate 10 in a bidirectional manner. For example, theprinting section 220 can include only oneprinting machine 220 a. In this case, theconveyor 210 may convey thesubstrate 10 in one direction while theprinting machine 220 a is set printable to perform printing. Then, theconveyor 210 can convey thesubstrate 10 in the opposite direction while theprinting machine 220 a is set unprintable. Then, the conductive ink is exchanged, and theconveyor 210 can convey thesubstrate 10 again in the one direction while theprinting machine 220 a is set printable to perform printing again. Thus, thelayered structure 20D is obtained. - The second embodiment of a panel according to the present invention will be described below with reference to
FIG. 8 . Apanel 100A of the present embodiment has a configuration similar to that of thepanel 100 as described above with reference toFIGS. 1-3 except additional inclusion of an anti-oxidation layer. In order to avoid redundancy, duplicated description is omitted. Here, theelectrode 20 also includes theconductive layer 20 a and theconductive layer 20 b, which have almost the same width. - In addition to the
substrate 10 and theelectrode 20, thepanel 100A further includes ananti-oxidation layer 30. The width of theanti-oxidation layer 30 is larger than that of theconductive layers anti-oxidation layer 30 can prevent oxidation of at least part of theelectrode 20. For example, as described above, where theconductive layer 20 a contains silver, while theconductive layer 20 b contains copper, copper tends to be oxidized. The oxidation may accompany an increase in specific resistance. However, provision of theanti-oxidation layer 30 can reduce the oxidation to suppress the increase in specific resistance. Further, although silver is comparatively hard to be oxidized, strictly speaking, even theconductive layer 20 a of which main component is silver may be degraded with time. Provision of theanti-oxidation layer 30 can reduce the degradation. As such, thepanel 100A including theanti-oxidation layer 30 can prevent oxidation of at least part of theconductive layers panel 100A. - For example, the
anti-oxidation layer 30 can be suitably made of a transparent conductive material. Specific examples of the transparent conductive material include indium tin oxide (ITO). Alternatively, the transparent conductive material may be zinc oxide or tin oxide. It is appreciated that theanti-oxidation layer 30 may contain a non-conductive transparent material. Or, theanti-oxidation layer 30 may contain an opaque conductive material. However, it is preferable that theanti-oxidation layer 30 contains a transparent conductive material. This can increase the intervals of thefinger electrodes 24. Further, as described above, theelectrode 20 is separated so as to be provided in parallel to each other, and theanti-oxidation layer 30 herein is separate to cover theelectrode 20. - The advantages of the
anti-oxidation layer 30 being made of a transparent conductive material will be described below with reference toFIG. 9 .FIG. 9A is a schematic cross sectional view of thepanel 100 as described above with reference toFIGS. 1-3 .FIG. 9A is similar toFIG. 1 , except that theelectrode 20 provided on thesurface 12 of thesubstrate 10 is separated into four. As described above, the intervals of thefinger electrodes 24 are set according to efficiency of extracting carriers generated in thesubstrate 10. -
FIG. 9B is a schematic cross sectional view of thepanel 100A. As described above, theanti-oxidation layer 30 convers theelectrode 20 in thepanel 100A. When theanti-oxidation layer 30 is conductive, the carriers generated in thesubstrate 10 may reach not only thefinger electrodes 24 but also theanti-oxidation layer 30, thereby enabling extraction of the generated carries as an electric current. - In the case that the intervals of the finger electrodes of the
panel 100 are set at 2 mm, the intervals of the finger electrodes of thepanel 100A can be set at 3 mm. For example, in the case that the principal planes of thepanels panel 100, and the number of the finger electrodes is 56 in thepanel 100A. Thus, with thispanel 100A, the number of theelectrodes 20 can be reduced to reduce the cost and increase the opening area for light. Preferably, the width of theanti-oxidation layer 30 is, for example, twice or more the width of theelectrode 20. - The
panel 100A can be suitably produced using a printing apparatus. - A
printing apparatus 200A will be described below with reference toFIG. 10 . Theprinting apparatus 200 A has a configuration similar to that of theprinting apparatus 200 as described above with reference toFIG. 6 , except that theprinting section 220 includes an additional printing machine. In order to avoid redundancy, duplicated description is omitted. Theprinting section 220 of theprinting apparatus 200A further includes aprinting machine 220 c between theprinting machine 220 b configured to print the conductive ink Kb and theheater 230. Theprinting machine 220 c has a configuration similar to that of theprinting machine 220 a as described above with reference toFIG. 7 , except that the ink in theink tray 302 and the shape of the recesses formed in theintaglio printing roll 306 are different. In order to avoid redundancy, duplicated description is omitted. - Next, the
printing machine 220 c will be described with reference toFIG. 7 . Ink Kc is filled in theink tray 302 of theprinting machine 220 c. Here, the ink Kc contains particulate ITO and a vehicle. The vehicle contains resin and a solvent. In the present specification, the ink Kc may be referred to as anti-oxidation ink. Further, theprinting machines printing machine 220 c that prints the anti-oxidation ink Kc may be referred to as an anti-oxidation ink printing machine in the present specification. - The vehicle of the anti-oxidation ink Kc may be the same as that of the conductive ink Ka or Kb. Alternatively, the vehicle of the conductive ink Kc may be similar to that of the conductive ink Ka or Kb. To the
substrate 10, the ink Kc is transferred correspondingly to the recesses of theintaglio printing roll 306. For example, in order to form theanti-oxidation layer 30 with a width of 50 μm to cover thefinger electrodes 24 with a width of 30 μm and a height of 50 μm, the width of the corresponding recesses of theintaglio printing roll 306 is set at, for example, 150 μm. Where parts of theanti-oxidation layer 30 which directly cover thesubstrate 10 on the opposite sides of eachfinger electrode 24 extend 10 μm, the width of the corresponding recesses of theintaglio printing roll 306 is set at 170 μm (e.g., 150 μm plus 10 μm plus 10 μm). Thus, the ink Kc is printed on the conductive ink Ka, Kb on thesubstrate 10. Thereafter, the conductive ink Ka, Kb and the anti-oxidation ink Kc are heated by the heater 230 (FIG. 10 ). - Although the
electrode 20 covered with theanti-oxidation layer 30 has differentconductive layers panel 100A in the above description, it is understood that the present invention is not limited to the description. As shown inFIG. 11 , theelectrode 20 may be formed of a single conductive layer in apanel 100B of the present embodiment. For example, thesurface 12 of thesubstrate 10 may be made of silicon, and theelectrode 20 may be formed of a conductive layer of which main component is silver. - The third embodiment of a panel according to the present invention will be described below with reference to
FIG. 12 . A panel 100C according to the present embodiment has a configuration similar to that of thepanel 100 as described above with reference toFIGS. 1-3 , except that the sectional area of eachelectrode 24 extending in the predetermined direction (x-direction herein) varies according to its position. In order to avoid redundancy, duplicated description is omitted. -
FIG. 12A is a schematic top view of the panel 100C. Theelectrode 20 of the panel 100C includeslinear electrodes linear electrodes 22 extend in the Y-direction, while thelinear electrodes 24 extend in the X-direction from thelinear electrodes 22. In the following description of the present specification, thelinear electrodes linear electrodes 22 and secondlinear electrodes 24, respectively. Here, both thelinear electrodes linear electrodes linear electrodes 22 adjacent to each other and extending in parallel in the predetermined direction may be referred to as first and secondparallel electrodes linear electrodes 24 intersecting the first and secondparallel electrodes - For example, where the panel 100C is a solar panel, the
linear electrodes 22 may be called bus bar electrodes, while thelinear electrodes 24 may be called finger electrodes. As shown inFIG. 12A , the pluralbus bar electrodes 22 extend in parallel to each other in the Y-direction, and thefinger electrodes 24 intersect thebus bar electrodes 22. Here, thefinger electrodes 24 extend in parallel to each other in the X-direction, and thebus bar electrodes 22 are arranged so as to be orthogonal to thefinger electrodes 24. -
FIG. 12B is a partially enlarged view of the panel 100C.FIG. 12C is a schematic cross sectional view of the panel 100C.FIG. 12C shows a cross section taken along theline 12 c-12 c′ inFIG. 12B . - As described above, the
linear electrodes 24 extend from thelinear electrodes 22. Eachlinear electrode 24 of the panel 100C includes sectionalarea decreasing parts 24 x of which the area in section (sectional area) orthogonal to the longitudinal direction of thelinear electrode 24 decreases in a direction away from thelinear electrodes 22. Although eachlinear electrode 24 includes two sectionalarea decreasing parts 24 x inFIG. 12B , it is appreciated that eachlinear electrode 24 may include only one sectionalarea decreasing part 24 x. Further, here, the number of layers at the part having the smallest sectional area in each of the two sectionalarea decreasing parts 24 x is one, while the number of layers at the part having the largest sectional area therein is two. As such, the number of layers at the part having the smallest sectional area may be smaller than that of the layers at the part having the largest sectional area. - Here, the
electrode 20 has the layeredstructure 20D including the firstconductive layer 20 a and the secondconductive layer 20 b. For example, the firstconductive layer 20 a contains silver, while the secondconductive layer 20 b contains copper. In the panel 100C, the firstconductive layer 20 a is provided in both of thebus bar electrodes 22 and thefinger electrodes 24. By contrast, the secondconductive layer 20 b is selectively provided in at least one of thebus bar electrodes 22 and thefinger electrodes 24. Here, the secondconductive layer 20 b is provided at a part of eachfinger electrode 24 which is near abus bar electrode 22 and is not provided at the central part of eachfinger electrode 24. Accordingly, in eachfinger electrode 24, the sectional area of a part A near abus bar electrode 22 is larger than the sectional area of a part B apart from thebus bar electrode 22. The carriers formed in thesubstrate 10 are extracted through theelectrode 20 therearound, thereby increasing the electric current at the part A of eachfinger electrode 24 which is near abus bar electrode 22. In eachfinger electrode 24 electrically connected to two adjacentbus bar electrodes 22, the sectional area of a part near abus bar electrode 22 is larger than the sectional area of the central part of thefinger electrode 24. This can reduce the cost of the material for thefinger electrodes 24 without reducing the current extracting efficiency. - Moreover, in each
finger electrode 24 of the panel 100C, the secondconductive layer 20 b is shorter than the firstconductive layer 20 a, and the width of the secondconductive layer 20 b is smaller than the width of the firstconductive layer 20 a. Here, each length of the first and secondconductive layers finger electrodes 24 to thebus bar electrodes 22, and each width of the first and secondconductive layers finger electrodes 24 to thebus bar electrodes 22 as viewed in the normal direction of thesurface 12 of thesubstrate 10. The secondconductive layer 20 b shorter than the firstconductive layer 20 a means that in the panel 100C, the secondconductive layer 20 b is provided in the form of islands on the firstconductive layer 20 a, and adjacent islands of the secondconductive layer 20 b are electrically connected together through the firstconductive layer 20 a. - In the panel 100 c, when the
electrode 20 is viewed in the normal direction of thesurface 12 of thesubstrate 10, the sectional area around the central part of each crossedelectrode 24 is smaller than the sectional area of a part of each crossedelectrode 24 which is near the firstparallel electrode 22 a and the sectional area of a part of each crossedelectrode 24 which is near the secondparallel electrode 22 b. Also, when theelectrode 20 is viewed in the normal direction of thesurface 12 of thesubstrate 10, the width around the central part of each crossedelectrode 24 is smaller than the width of a part of each crossedelectrode 24 which is near the firstparallel electrode 22 a and the width of a part of each crossedelectrode 24 which is near the secondparallel electrode 22 b. - The second
conductive layer 20 b is shorter than the firstconductive layer 20 a, and the width of the secondconductive layer 20 b is smaller than the width of the firstconductive layer 20 a in the above description. However, it is appreciated that the present invention is not limited to the description. Where the width of the secondconductive layer 20 b is smaller than the width of the firstconductive layer 20 a, the length of the secondconductive layer 20 b may be equal to that of the firstconductive layer 20 a, and adjacentbus bar electrodes 22 may be electrically connected together through not only the firstconductive layer 20 a but also the secondconductive layer 20 b. Alternatively, where the secondconductive layer 20 b is shorter than the firstconductive layer 20 a, the width of the firstconductive layer 20 a may be equal to the width of the secondconductive layer 20 b. As such, it is preferable that at least one of the width and the length of the secondconductive layer 20 b is smaller than that of the firstconductive layer 20 a. - It should be noted that the
electrode 20 of the panel 100C can be produced using, for example, theprinting apparatus 200 as described above with reference toFIG. 6 . In this case, the shape and size of the firstconductive layer 20 a shown inFIG. 12B correspond to those of the first conductive ink Ka, and the shape and size of the secondconductive layer 20 b shown inFIG. 12C correspond to those of the second conductive ink Kb. - The width of the
finger electrodes 24 is constant in the panel 100C as described with reference toFIG. 12 . However, it is appreciated that the present invention is not limited to the above description. -
FIG. 13A is a partially enlarged view of a panel 100C1.FIG. 13B is a schematic cross sectional view of the panel 100C1.FIG. 13B shows a cross section taken along theline 13 b-13 b′ inFIG. 13A . - Referring to the panel 100C1, the width of the respective two sectional
area decreasing parts 24 x in theelectrode 20 continuously decreases in the direction away from the firstlinear electrodes 22 as viewed in the normal direction of thesurface 12 of thesubstrate 10. As such, the sectional area of each secondlinear electrode 24 continuously decreases in the direction away from the firstlinear electrodes 22. This can increase the opening area of thesurface 12 of thesubstrate 10. - For example, in the case that the panel 100C1 is used as a solar panel, the width around the central part D of each
finger electrode 24 which is between adjacentbus bar electrodes 22 is smaller than the width of parts C thereof which are near thebus bar electrodes 22 as viewed in the normal direction of thesurface 12 of thesubstrate 10. Specifically, of the firstconductive layer 20 a forming thefinger electrodes 24, the width around the central part between adjacentbus bar electrodes 22 is smaller than the width of the parts near thebus bar electrodes 22. Further, the secondconductive layer 20 b forming thefinger electrodes 24 is provided at parts C near thebus bar electrodes 22, but is not provided around the central part D between the adjacentbus bar electrodes 22. Accordingly, the resistance of the parts offinger electrodes 24 which are near thebus bar electrodes 22 can be reduced in the panel 100C1. In this manner, the sectional area of the parts C of thefinger electrodes 24 which are near thebus bar electrodes 22 larger than that around the central parts D thereof can lead to reduction in material cost without reducing the current extracting efficiency. In addition, the opening area of the solar panel can be increased, thereby effectively generating the electric current. - The
conductive layers electrode 20 in the panels 100C and 100C1 are made of the different conductive materials in the above description. However, it is appreciated that the present invention is not limited to the description. Theconductive layers - A panel 100C2 will be described with reference to
FIG. 14 .FIG. 14A is a partially enlarged view of the panel 100C2.FIG. 14B is a schematic cross sectional view of the panel 100C2.FIG. 14B shows a cross section taken along theline 14 b-14 b′ inFIG. 14A . - The panel 100C2 has a configuration similar to that of the panel 100C as described above with reference to
FIG. 12 , except that theconductive layers conductive layers finger electrodes 24 of the panel 100C2, which is constant inFIG. 14 , may vary like the panel 100C1 shown inFIG. 13 . - Furthermore, in the above description, the
electrode 20 includes a plurality ofconductive layers -
FIG. 15A is a partially enlarged view of a panel 100C3.FIG. 15B is a schematic cross sectional view of the panel 100C3.FIG. 15B shows a cross section taken along theline 15 b-15 b′ inFIG. 15B . - Referring to the panel 100C3, of the
finger electrodes 24, the width around the central parts E between adjacentbus bar electrodes 22 is smaller than the width of the parts F near thebus bar electrodes 22. Accordingly, the resistance of the parts of thefinger electrodes 24 which are near thebus bar electrodes 22 can be reduced in the panel 100C3. It is preferable that the sectional area of the parts of thefinger electrodes 24 which are near thebus bar electrodes 22 is larger than the sectional area of the parts thereof which are away from thebus bar electrodes 22. Accordingly, of thefinger electrodes 24 located between thebus bar electrodes 22, the sectional area of the vicinities of thebus bar electrodes 22 larger than the sectional area around the central parts of thefinger electrodes 24 can reduce the material cost without reducing the current extracting efficiency. Further, the opening area of the solar panel can be increased to generate the electric current effectively. - The panels 100C-100C3 can also be suitably produced using the above described
printing apparatus 200. The printing machines of theprinting section 220 have a configuration similar to that of the aforementioned printing machines, except that the ink in theink tray 302 and the shape of the recesses formed in theintaglio printing roll 306 are different. In order to avoid redundancy, duplicated description is omitted. - The photoelectric conversion layer of the
substrate 10 in each of thepanels - Further, although the
electrode 20 is provided on the silicon layer present at thesurface 12 of thesubstrate 10 in each panel 100-100C3 in the above description, the present invention is not limited to the description. Theelectrodes 20 may be provided on a transparent conductive layer, which is provided on the silicon layer of thesubstrate 10. - Furthermore, in the above description, nothing is provided in the region of the
surface 12 of thesubstrate 10 where theelectrode 20 is not provided, except that theanti-oxidation layer 30 is provided as needed at a part of the region. However, the present invention is not limited to the above description. An anti-reflection film may be provided in the region of thesurface 12 of thesubstrate 10 where theelectrode 20 is not provided. Alternatively, an anti-reflection film may be provided over the entire surface of thesubstrate 10, and theelectrodes 20 may be provided on the anti-reflection film. - It should be appreciated that in the case that any of the panels 100-100C3 is used as a solar panel, a plurality of any of the panels 100-100C3 are arrayed in groups.
-
FIG. 16 shows asolar cell module 300 in which thepanels solar cell module 300, the panels 100-100C3 are arrayed in matrix of a plurality of rows and a plurality of columns. The panels 100-100C3 are connected together in series or in parallel. - Although the first
conductive layer 20 a is in contact with thesurface 12 of thesubstrate 10 in the above description, it is appreciated that the present invention is not limited to the above description. The firstconductive layer 20 a may be layered on thesubstrate 10 with another layer interposed. In this case, it is possible that after a predetermined layer is printed on thesubstrate 10, the first conductive ink may be printed thereon. - Although the panels 100-100C3 are solar panels in the above description, it is appreciated that the present invention is not limited to the description. The panels 100-100C3 may be touch panels, electromagnetic wave shielding panels, etc.
- Moreover, in the above description, the
electrode 20 is a collector electrode. However, the present invention is not limited to the description. Theelectrode 20 may be part of a wire. Theelectrode 20 may be suitably used as a conductive layered structure. - The present invention can increase the degree of freedom of designing an electrode provided on a panel. For example, the present invention can increase the sectional area of the electrode even with a comparatively small width thereof. Further, the present invention is suitably applicable to panels for solar cells, touch panels, electromagnetic wave shielding panels, solar cell modules, etc.
Claims (18)
1. A printing apparatus comprising a printing section configured to form a first electrode by performing printing, the first electrode having a layered structure including a first conductive layer and a second conductive layer, wherein
the printing section
forms the first conductive layer by performing printing using a first conductive ink, and
form the second conductive layer on the first conductive ink by performing printing using a second conductive ink so that the second conductive ink is in contact with the first conductive ink and a side surface of the first conductive ink is exposed, and
in forming the first and second conductive layers, the printing section performs printing using the first and second conductive inks so that the first electrode has a section orthogonal to a longitudinal direction of the first electrode, a sectional area of the section decreasing in the longitudinal direction.
2. The printing apparatus of claim 1 , wherein
the printing section includes:
a first printing machine configured to perform printing using the first conductive ink; and
a second printing machine configured to perform printing using the second conductive ink,
the first printing machine includes:
a first transfer section configured to print using the first conductive ink, and
a first intaglio printing section having a recess and configured to attach the first conductive ink to the first transfer section, and
the second printing machine includes:
a second transfer section configured to print using the second conducive ink; and
a second intaglio printing section having a recess and configured to attach the second conductive ink to the second transfer section.
3. The printing apparatus of claim 1 , wherein
in forming the first and second conductive layers, the printing section performs printing using the first and second conductive inks so that the number of layers at a first portion of the first electrode is smaller than the number of layers at a second portion of the first electrode, the first portion having a smallest sectional area in the first electrode, the second portion having a largest sectional area in the first electrode.
4. The printing apparatus of claim 1 , wherein
the printing section performs printing using the first and second conductive inks so that the first conductive layer has a wider width than the second conducive layer when the first electrode is viewed in a normal direction of a surface of a substrate on which the first electrode is formed.
5. The printing apparatus of claim 1 , wherein
the printing section performs printing using the first and second conductive inks so that the first conductive layer has a length in the longitudinal direction that is longer than a length of the second conductive layer in the longitudinal direction.
6. The printing apparatus of claim 1 , wherein
the printing section performs printing using the first and second conductive inks so that the first electrode has a width that continuously decreases in the longitudinal direction when the first electrode is viewed in a normal direction of a surface of a substrate on which the first electrode is formed.
7. The printing apparatus of claim 1 , wherein
the printing machine forms a second electrode by performing printing and forms the first electrode by performing printing so that the first electrode extends from the second electrode, and
in forming the first electrode, the printing section performs printing using the first and second conductive inks so that the sectional area of the first electrode decreases in a direction away from the second electrode.
8. The printing apparatus of claim 1 , wherein
the first conductive ink contains a first conductive material,
the second conductive ink contains a second conductive material, and
the first conductive material is different from the second conductive material.
9. The printing apparatus of claim 1 , wherein
the first conductive ink contains a first conductive material,
the second conductive ink contains a second conductive material, and
the first conductive material is the same as the second conductive material.
10. A printing method comprising performing printing to form a first electrode having a layered structure including a first conducive layer and a second conductive layer, wherein
the performing printing includes:
forming the first conductive layer by performing printing using a first conductive ink; and
forming the second conductive layer on the first conductive ink by performing printing using a second conductive ink so that the second conductive ink is in contact with the first conducive ink and a side surface of the first conductive ink is exposed, and
in the performing printing, the printing is performed using the first and second conductive ink so that the first electrode has a section orthogonal to a longitudinal direction of the first electrode, a sectional area of the section decreasing in the longitudinal direction.
11. The printing method of claim 10 , wherein
in the forming the first conductive layer, a first printing machine performs printing using the first conductive ink,
in the forming the second conductive layer, a second printing machine performs printing using the second conductive ink,
the first printing machine includes:
a first transfer section configured to print using the first conductive ink, and
a first intaglio printing section having a recess and configured to attach the first conductive ink to the first transfer section, and
the second printing machine includes:
a second transfer section configured to print using the second conducive ink; and
a second printing intaglio section having a recess and configured to attach the second conductive ink to the second transfer section.
12. The printing method of claim 10 , wherein
in the performing printing, the printing is performed using the first and second conductive inks so that the number of layers at a first portion of the first electrode is smaller than the number of layers at a second portion of the first electrode, the first portion having a smallest sectional area in the first electrode, the second portion having a largest sectional area in the first electrode.
13. The printing method of claim 10 , wherein
in the performing printing, the printing is performed using the first and second conductive inks so that the first conductive layer has a wider width than the second conducive layer when the first electrode is viewed in a normal direction of a surface of a substrate on which the first electrode is formed.
14. The printing method of claim 10 , wherein
in the performing printing, the printing is performed using the first and second conductive inks so that the first conductive layer has a length in the longitudinal direction that is longer than a length of the second conductive layer in the longitudinal direction.
15. The printing method of claim 10 , wherein
in the performing printing, the printing is performed using the first and second conductive inks so that the first electrode has a width that continuously decreases in the longitudinal direction when the first electrode is viewed in a normal direction of a surface of a substrate on which the first electrode is formed.
16. The printing method of claim 10 , wherein
the performing printing includes performing printing to form a second electrode and performing printing to form the first electrode so that the first electrode extends from the second electrode, and
in the performing printing to form the first electrode, the printing is performed using the first and second conductive inks so that the sectional area of the first electrode decreases in a direction away from the second electrode.
17. The printing method of claim 10 , wherein
the first conductive ink contains a first conductive material,
the second conductive ink contains a second conductive material, and
the first conductive material is different from the second conductive material.
18. The printing method of claim 10 , wherein
the first conductive ink contains a first conductive material,
the second conductive ink contains a second conductive material, and
the first conductive material is the same as the second conductive material.
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US15/372,647 US20170092802A1 (en) | 2010-07-09 | 2016-12-08 | Panel, method for producing panel, solar cell module, printing apparatus, and printing method |
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US13/733,766 US9559241B2 (en) | 2010-07-09 | 2013-01-03 | Panel, method for producing panel, solar cell module, printing apparatus, and printing method |
US15/372,647 US20170092802A1 (en) | 2010-07-09 | 2016-12-08 | Panel, method for producing panel, solar cell module, printing apparatus, and printing method |
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2011
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- 2011-07-08 TW TW100124309A patent/TWI495121B/en not_active IP Right Cessation
- 2011-07-08 TW TW100124311A patent/TWI475702B/en active
- 2011-07-11 WO PCT/JP2011/065754 patent/WO2012005374A1/en active Application Filing
- 2011-07-11 CN CN201510319557.6A patent/CN104900732B/en active Active
- 2011-07-11 CN CN201510319246.XA patent/CN105047741B/en active Active
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- 2011-07-11 JP JP2012523547A patent/JP5372253B2/en active Active
- 2011-07-11 MX MX2013000108A patent/MX2013000108A/en active IP Right Grant
- 2011-07-11 EP EP20140178319 patent/EP2804205A1/en not_active Withdrawn
- 2011-07-11 EP EP11803705.0A patent/EP2592658B1/en not_active Not-in-force
- 2011-07-11 EP EP14178316.7A patent/EP2804204B1/en not_active Not-in-force
- 2011-07-11 KR KR1020147034149A patent/KR101757968B1/en active IP Right Grant
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2013
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- 2013-09-17 JP JP2013192437A patent/JP5922072B2/en active Active
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JP5372253B2 (en) | 2013-12-18 |
JP2014042035A (en) | 2014-03-06 |
US20130122645A1 (en) | 2013-05-16 |
TW201212256A (en) | 2012-03-16 |
CN105047741B (en) | 2018-01-12 |
US9559241B2 (en) | 2017-01-31 |
TWI495121B (en) | 2015-08-01 |
EP2804204A1 (en) | 2014-11-19 |
MX2013000108A (en) | 2013-06-13 |
CN103098227A (en) | 2013-05-08 |
CN105047741A (en) | 2015-11-11 |
TW201205842A (en) | 2012-02-01 |
EP2804205A1 (en) | 2014-11-19 |
KR20130031930A (en) | 2013-03-29 |
TW201205841A (en) | 2012-02-01 |
KR20150003916A (en) | 2015-01-09 |
MX338776B (en) | 2016-05-02 |
KR101757968B1 (en) | 2017-07-14 |
EP2804204B1 (en) | 2017-11-29 |
TWI463683B (en) | 2014-12-01 |
EP2592658B1 (en) | 2016-01-13 |
WO2012005374A1 (en) | 2012-01-12 |
EP2592658A4 (en) | 2014-06-11 |
JP5922072B2 (en) | 2016-05-24 |
KR101528409B1 (en) | 2015-06-11 |
CN104900732A (en) | 2015-09-09 |
EP2592658A1 (en) | 2013-05-15 |
TWI475702B (en) | 2015-03-01 |
JP2016066826A (en) | 2016-04-28 |
CN103098227B (en) | 2016-04-20 |
JPWO2012005374A1 (en) | 2013-09-05 |
CN104900732B (en) | 2017-07-28 |
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