US20170089648A1

US20170089648A1 - Adhesive-thermal gasket

Info

Publication number: US20170089648A1
Application number: US14/864,535
Authority: US
Inventors: Xiaoning Wu
Original assignee: Jones Tech (usa) Inc
Current assignee: Jones Tech (usa) Inc
Priority date: 2015-09-24
Filing date: 2015-09-24
Publication date: 2017-03-30

Abstract

An adhesive-thermal gasket, including: a body of thermally conductive material having a set of openings formed through the body; and an adhesive disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.

Description

BACKGROUND

A thermal gasket can be used to attach a heat-generating component in an electronic device to a heat-dissipating structure, e.g., a heat sink, of the electronic device. A thermal gasket can include an interface surface for coupling to a heat-generating component and an interface surface for coupling a heat-dissipating structure. An adhesive can be applied to the interface surfaces of a thermal gasket to bond together a heat-generating component, the intervening thermal gasket, and a heat-dissipating structure.
An adhesive applied to the interface surfaces of a thermal gasket can have a relatively low thermal conductivity, which can reduce the heat transfer performance of the thermal gasket. An adhesive can be impregnated with a material that increases its heat transfer capacity. A material that increases the heat transfer capacity of an adhesive can reduce the bonding strength and reliability of the thermal gasket structure.

SUMMARY

In general, in one aspect, the invention relates to an adhesive-thermal gasket. The adhesive-thermal gasket can include: a body of thermally conductive material having a set of openings formed through the body; and an adhesive disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.
In general, in another aspect, the invention relates to a method for forming an adhesive-thermal gasket. The method can include: forming a body of thermally conductive material; forming a set of openings through the body; and disposing an adhesive into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.
Other aspects of the invention will be apparent from the following description and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements.

FIGS. 1A-1B illustrate an adhesive-thermal gasket in one or more embodiments.

FIG. 2 is a table illustrating the effect of a set of adhesive-filled open areas in a body of an adhesive thermal gasket on the total thermal conductivity of the adhesive-thermal gasket in one or more embodiments.

FIGS. 3A-3B illustrate an adhesive-thermal gasket in one or more alternative embodiments.

FIG. 4 is a side view showing an adhesive-thermal gasket coupling together a heat-generating component and a heat-dissipating structure.

FIG. 5 illustrates a method for forming an adhesive-thermal gasket in one or more embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the various embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Like elements in the various figures are denoted by like reference numerals for consistency. While described in conjunction with these embodiments, it will be understood that they are not intended to limit the disclosure to these embodiments. On the contrary, the disclosure is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the disclosure as defined by the appended claims. Furthermore, in the following detailed description of the present disclosure, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, procedures, components, have not been described in detail so as not to unnecessarily obscure aspects of the present disclosure.
FIG. 1A is a perspective view of an adhesive-thermal gasket 10 in one or more embodiments. The adhesive-thermal gasket 10 includes a body 16 of a thermally conductive material. In this example embodiment, the body 16 has a substantially circular shape. The body 16 can be formed from a thermal pad, a thermal phase-change material, a graphite thermal interface material, etc.
The body 16 of the adhesive-thermal gasket 10 includes a set of open areas 12 a-12 d formed through the body 16. In one or more embodiments, the open areas 12 a-12 d are formed through a periphery of the body 16 from a top surface 16 a of the body 16 through to a bottom surface 16 b of the body 16. In this example embodiment, the open areas 12 a-12 d each have a substantially semicircular shape.
The adhesive-thermal gasket 10 includes a respective adhesive 13 a-13 d disposed within each respective open area 12 a-12 d for holding together a heat-generating component and a heat-dissipating structure as the body 16 thermally couples the heat-generating component to the heat-dissipating structure. The adhesives 13 a-13 d disposed in the open areas 12 a-12 d can have a lower height, i.e., a lower profile, than the body 16 of thermally conductive material in a dimension between the top and bottom surfaces 16 a and 16 b. The adhesives 13 a-13 d disposed in the open areas 12 a-12 d can be pressure sensitive adhesives, e.g. a pressure sensitive adhesive tape cut to the shapes of the open areas 12 a-12 d.
FIG. 1B is a projection showing how the body 16 and the adhesives 13 a-13 d contained in the open areas 12 a-12 d of the adhesive-thermal gasket 10 interface to a surface, e.g. a surface of a heat-generating component or a heat-dissipating structure, at the bottom surface 16 b.
FIG. 2 is a table illustrating the effects of the adhesives 13 a-13 d contained in the open areas 12 a-12 d on the total thermal conductivity of the adhesive-thermal gasket 10 in one or more embodiments. The total area A of an interface surface, e.g., the bottom surface 16 b, of the adhesive-thermal gasket 10 is given by—A=A_p+A_t, where A_pis the area taken up by the adhesives 13 a-13 d in the open areas 12 a-12 d and A_tis the area taken up by the thermally conductive body 16.
The total thermal conductivity, K, at an interface surface of the adhesive-thermal gasket 10 is given by—K=K_t×(A_t/A)+K_p×(A_p/A), where is K_tis the thermal conductivity of the body 16 and K_pis the thermal conductivity of the adhesives 13 a-13 d. FIG. 3 shows the value of the total thermal conductivity, K, for 5 percent, 10 percent, 15 percent, and 20 percent ratios of A_pto A_tfor K_tvalues of 3 W/m-K and 6 W/m-K and a K_pvalue of 0.3 W/m-K. Also shown in FIG. 3 is the drop off in total thermal conductivity K for each of the ratios of A_pto A_t.
For example, for a K_tvalue of 3 W/m-K, the drop off in total thermal conductivity K for a ratio of A_pto A_tof 5 percent is 4.30 percent down to 2.87 W/m-K. In another example, for a K_tvalue of 6 W/m-K, the drop off in total thermal conductivity K for a ratio of A_pto A_tof 20 percent is 15.80 percent down to 5.05 W/m-K.
FIG. 3A is a perspective view of an adhesive-thermal gasket 20 in one or more alternative embodiments. The adhesive-thermal gasket 20 includes a body 26 of a thermally conductive material. In this alternative example embodiment, the body 26 has a substantially rectangular shape. The body 26 can be formed from a thermal pad, a thermal phase-change material, a graphite thermal interface material, etc.
The body 26 of the adhesive-thermal gasket 10 includes a set of open areas 22 a-22 d formed through the body 26 through a periphery of the body 26 from a top surface 26 a of the body 26 through to a bottom surface 26 b of the body 26. In this example embodiment, the open areas 22 a-22 d each have a substantially rectangular shape.
The adhesive-thermal gasket 20 includes a respective adhesive 23 a-23 d disposed within each respective open area 22 a-22 d for holding together a heat-generating component and a heat-dissipating structure as the body 26 thermally couples the heat-generating component to the heat-dissipating structure. The adhesives 23 a-23 d contained in the open areas 22 a-22 d can have a lower height, i.e., a lower profile, than the body 26 of thermally conductive material in a dimension between the top and bottom surfaces 26 a and 26 b. The adhesives 23 a-23 d disposed in the open areas 22 a-22 d can be pressure sensitive adhesives.
FIG. 3B is a projection showing how the body 26 and the adhesives 23 a-23 d contained in the open areas 22 a-22 d of the adhesive-thermal gasket 20 interface to a surface, e.g. a surface of a heat-generating component or a heat-dissipating structure, at the bottom surface 26 b.
FIG. 4 is a side view showing the adhesive-thermal gasket 10 coupling together a heat-generating component 40, e.g., an LED assembly, to a heat-dissipating structure 42, e.g., a heat sink. This side view shows the adhesive 13 d in the open area 12 d bonding an interface surface 41 of the heat-generating component 40 to an interface surface 43 of the heat-dissipating structure 42.
FIG. 5 illustrates a method for forming an adhesive-thermal gasket in one or more embodiments. While the various steps in this flowchart are presented and described sequentially, one of ordinary skill will appreciate that some or all of the steps can be executed in different orders and some or all of the steps can be executed in parallel. Further, in one or more embodiments, one or more of the steps described below can be omitted, repeated, and/or performed in a different order. Accordingly, the specific arrangement of steps shown in FIG. 5 should not be construed as limiting the scope of the invention.
At step 550, a body of thermally conductive material is formed. The body can be, e.g., circular, rectangular, or any shape, and can have a height, i.e., thickness, adapted to couple a heat-generating component to a heat-dissipating structure.
At step 560, a set of openings are formed through the body. There can be any number and shape of the openings. The openings can be, e.g., rectangular, semicircular, etc. The openings can be positioned for optimal adhesion of a heat-generating component to a heat-dissipating structure.
At step 570, an adhesive is disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure. The adhesive disposed in the openings can have a lower profile than the body so that the adhesives couple together the heat-generating component and the heat-dissipating structure when the body is compressed.
While the foregoing disclosure sets forth various embodiments using specific diagrams, flowcharts, and examples, each diagram component, flowchart step, operation, and/or component described and/or illustrated herein may be implemented, individually and/or collectively, using a range of processes and components.
The process parameters and sequence of steps described and/or illustrated herein are given by way of example only. For example, while the steps illustrated and/or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various example methods described and/or illustrated herein may also omit one or more of the steps described or illustrated herein or include additional steps in addition to those disclosed.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments may be devised which do not depart from the scope of the invention as disclosed herein.

Claims

What is claimed is:

1. An adhesive-thermal gasket, comprising:

a body of thermally conductive material having a set of openings formed through the body; and

an adhesive disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.

2. The adhesive-thermal gasket of claim 1, wherein the openings are formed through a periphery of the body.

3. The adhesive-thermal gasket of claim 1, wherein a height of the body is greater than a height of the adhesives in the openings.

4. The adhesive-thermal gasket of claim 1, wherein the thermally conductive material is a thermal pad.

5. The adhesive-thermal gasket of claim 1, wherein the thermally conductive material is a thermal phase-change material.

6. The adhesive-thermal gasket of claim 1, wherein the thermally conductive material is a graphite thermal interface material.

7. The adhesive-thermal gasket of claim 1, wherein the adhesive in each opening is a pressure sensitive adhesive.

8. The adhesive-thermal gasket of claim 1, wherein at least one of the openings has a substantially rectangular shape.

9. The adhesive-thermal gasket of claim 1, wherein at least one of the openings has a substantially semicircular shape.

10. A method for forming an adhesive-thermal gasket, comprising:

forming a body of thermally conductive material;

forming a set of openings through the body; and

disposing an adhesive into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.

11. The method of claim 10, wherein forming a set of openings comprises forming a set of openings through a periphery of the body.

12. The method of claim 10, wherein disposing an adhesive comprises disposing such that a height of the body is greater than a height of the adhesives in the openings.

13. The method of claim 10, wherein forming a body comprises forming using a thermal pad.

14. The method of claim 10, wherein forming a body comprises forming using a thermal phase-change material.

15. The method of claim 10, wherein forming a body comprises forming using a graphite thermal interface material.

16. The method of claim 10, wherein disposing an adhesive comprises disposing a pressure sensitive adhesive.

17. The method of claim 10, wherein forming a set of openings comprises forming such that at least one of the openings has a substantially rectangular shape.

18. The method of claim 10, wherein forming a set of openings comprises forming such that at least one of the openings has a substantially semicircular shape.