US20170082378A1 - Vapor chamber structure - Google Patents
Vapor chamber structure Download PDFInfo
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- US20170082378A1 US20170082378A1 US14/858,566 US201514858566A US2017082378A1 US 20170082378 A1 US20170082378 A1 US 20170082378A1 US 201514858566 A US201514858566 A US 201514858566A US 2017082378 A1 US2017082378 A1 US 2017082378A1
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- United States
- Prior art keywords
- vapor chamber
- heat receiving
- receiving plate
- chamber structure
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000002184 metal Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Definitions
- the disclosure relates to a vapor chamber, more particularly to a vapor chamber structure.
- a vapor chamber is a vacuum chamber formed by an upper metal plate and a lower metal plate welded together.
- the inside of the vacuum chamber comprises highly efficient heat transfer components such as a capillary structure or a working fluid. This enables the vapor chamber to quickly transfer heat of a regional heat source to a large plate for cooling, thereby making the vapor chamber a heat dissipation device of high performance.
- the heights and thicknesses of the heat sources are slightly different from each other.
- the higher or thicker heat sources are likely to be against the vapor chamber.
- This problem leads to poor performance regarding the heat dissipation of the vapor chamber.
- the disclosure aims to provide an improved design capable of solving the aforementioned problems.
- One purpose of the disclosure is to provide a vapor chamber structure in which a heating element provides the contact portion a thrust (namely a push force) when the contact portion is in contact with the heating element.
- the wrinkled ring portion is therefore forced to deform for helping the contact portion slightly adjust its position. This in turn ensures a tight and even contact between the contact portion and the heating element, thereby improving the heat dissipation efficiency of the vapor chamber structure.
- a vapor chamber structure which is configured for at least one heating element and comprises a main body having a heat receiving plate.
- the heat receiving plate has at least one wrinkled ring portion.
- An inner portion of the wrinkled ring portion surrounds a contact portion.
- the contact portion is in contact with the heating element.
- the main body has a condensing plate arranged in a way corresponding to the heat receiving plate.
- the condensing plate forms a plurality of stop sticks extending towards the heat receiving plate.
- Each stop stick and the contact portion abuts on each other to press the contact portion to contact the heating element more reliably, thereby improving the capability of heat dissipation of the vapor chamber structure.
- each return spring is accommodated in each stop stick and is sandwiched between the cooling fin and the stop stick.
- the return spring gives the stop stick a return force to press each stop stick to abut on the contact portion. This ensures a more reliable contact between the contact portion and the heating element, thereby improving the heat dissipation function of the vapor chamber structure.
- FIG. 1 is an exploded view of the vapor chamber structure according to the first embodiment structure
- FIG. 2 is a perspective view of the assembly of the vapor chamber structure according to the first embodiment structure
- FIG. 3 is another perspective view of the assembly of the vapor chamber structure according to the first embodiment structure
- FIG. 4 is a sectional view of the vapor chamber structure according to the first embodiment structure
- FIG. 5 is a schematic view of the operation of the vapor chamber structure according to the first embodiment structure
- FIG. 6 is a schematic view of the operation of the vapor chamber structure according to the second embodiment structure
- FIG. 7 is a sectional view of the vapor chamber structure according to the third embodiment structure.
- FIG. 8 is a bottom view of the vapor chamber structure according to the third embodiment structure.
- FIG. 9 is a schematic view of the operation of the vapor chamber structure according to the fourth embodiment structure.
- FIG. 10 is a schematic view of the operation of the vapor chamber structure according to the fifth embodiment structure.
- the disclosure provides a vapor chamber structure of the first embodiment.
- the vapor chamber structure 10 is for one or multiple heating elements and mainly comprises a main body 1 .
- the main body 1 has a heat receiving plate 11 .
- the heat receiving plate 11 has a plurality of wrinkled ring portions 12 .
- An inner portion of each wrinkled ring portion 12 surrounds a contact portion 121 .
- Each wrinkled ring portion 12 comprises a plurality of recessed ring sections 122 recessed on the heat receiving plate 11 .
- the recessed ring sections 122 are in annular arrangement in sequence. The thickness a of each recessed ring section 122 is less than the thickness b of the heat receiving plate 11 .
- the heat receiving plate 11 has a plurality of convex portions 13 protruding therefrom.
- Each wrinkled ring portion 12 is formed on the outer edge of each convex portion 13 while each contact portion 121 is formed on the top of each convex portion 13 .
- the main body 1 has a condensing plate 14 arranged in a way corresponding to the heat receiving plate 11 .
- the condensing plate 14 forms a plurality of stop sticks 141 extending towards each contact portion 121 .
- a gap s is formed between each stop stick 141 and the contact portion 121 .
- each stop stick 141 is formed by stamping in a direction towards the heat receiving plate 11 .
- the inner portion of each stop stick 141 forms a concave 142 corresponding to the condensing plate 14 .
- the main body 1 comprises an upper case 15 and a lower case 16 assembled to each other.
- An accommodating chamber 17 is formed between the upper case 15 and the lower case 16 .
- the heat receiving plate 11 is formed on the lower case 16 while the condensing plate 14 is formed on the upper case 15 .
- the vapor chamber structure 10 of the disclosure further comprises a capillary structure 2 .
- the capillary structure 2 is accommodated in the accommodating chamber 17 and covers the heat receiving plate 11 .
- the capillary structure 2 may be a particle sintered body, metal meshes, a groove or a combination thereof.
- the vapor chamber structure 10 of the disclosure further comprises a plurality of cooling fins 3 .
- Each cooling fin 3 is connected to the condensing plate 14 .
- Multiple cooling fins 3 cover the concave 142 .
- the main body 1 has the heat receiving plate 11 having the wrinkled ring portion 12 .
- the inside of the wrinkled ring portion 12 surrounds and forms the contact portion 121 which is in contact with the heating element 100 .
- the heating element 100 provides the contact portion 121 a thrust which leads to the deformation of the wrinkled ring portion 12 due to the force. This therefore help the contact portion 121 slightly adjust its position to more tightly and evenly contact the heating element 100 , in order to improve the heat dissipation efficiency of the vapor chamber structure 10 .
- each heating element 100 is in thermal contact with each contact portion 121 .
- each wrinkled ring portion 12 surrounds the outer edge of the contact portion 121 ;
- each wrinkled ring portion 12 comprises a plurality of recessed ring sections 122 recessed on the heat receiving plate 11 ;
- the recessed ring sections 122 are in annular arrangement in sequence; the thickness a of each recessed ring section 122 is less than the thickness b of the heat receiving plate 11 .
- the contact portion slightly contract or extend, which slightly adjust the position of each contact portion to match the thickness and height of each heating element 100 . Therefore, the heating elements 100 with different thicknesses and heights may tightly and evenly contact each contact portion 121 , which improves the heat dissipation efficiency of the vapor chamber structure 10 .
- the main body 1 has the condensing plate 14 arranged in a way corresponding to the heat receiving plate 11 .
- the condensing plate 14 forms the plurality of stop sticks 141 extending towards each contact portion 121 .
- the contact portion 121 abuts on each stop stick 141 to push the contact portion 121 for more reliable contact between the heating element 100 and the contact portion 121 . This enhances the capability regarding heat dissipation of the vapor chamber structure 10 .
- FIG. 6 shows the second embodiment of the vapor chamber structure 10 of the disclosure. As seen in FIG. 6 , the second embodiment is similar to the first embodiment but the vapor chamber structure 10 of the second embodiment further comprises a plurality of return springs.
- each stop stick 141 is disposed with a shrunken ring groove 1411 and each stop stick 141 abuts on the contact portion 121 .
- Each return spring 4 is accommodated in each concave 142 and is sandwiched between the cooling fin 3 and the stop stick 141 .
- the shrunken ring groove 1411 deforms, due to the press, to reduce the height of the stop stick 141 .
- the return spring 4 gives the stop stick 141 a return force to enable the shrunken ring groove 1411 to adjust in relation to the return spring 4 , for pressing each stop stick 141 to abut on the contact portion 121 . This ensures the reliable contact between the contact portion 121 and the heating element 100 , thereby improving the heat dissipation capability of the vapor chamber structure 10 .
- FIG. 7 and FIG. 8 show the second embodiment of the vapor chamber structure 10 of the disclosure.
- the third embodiment is similar to the first embodiment but the heat receiving plate 11 is without the convex portion 13 .
- the heat receiving plate 11 has a flat surface which has one or multiple wrinkled ring portions 12 .
- the higher or thicker heating element 100 is in contact with the contact portion 121 while lower or thinner heating element 100 is in contact with the heat receiving plate 11 .
- the higher or thicker heating element 100 pushes the contact portion 121 to make it shrink, it does not affect the contact between the lower or thinner heating element 100 and the heat receiving plate 11 .
- the heating elements 100 with different thicknesses and heights may tightly and evenly contact the contact portion 121 or the heat receiving plate 11 . Consequently, the third embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment.
- FIG. 9 shows the fourth embodiment of the vapor chamber structure 10 of the disclosure.
- the fourth embodiment is similar to the first embodiment but the heat receiving plate 11 of the fourth embodiment further has one or multiple convex portions 13 and one or multiple block portions 131 protruding thereform.
- the heat receiving plate 11 has one or multiple convex portions 13 and one or multiple block portions 131 protruding thereform.
- the heat receiving plate 11 has a convex section 111 protruding therefrom.
- the convex section 111 is disposed with one or multiple recessed ring grooves 112 .
- the convex portion 13 is formed on the inside of the region surrounded by the recessed ring groove 112 while the block portion 131 is formed on the outside of the region surrounded by the recessed ring groove 112 .
- the heating element 100 is in contact with the contact portion 121 while the other part of the heating element 100 is in contact with the block portion 131 .
- the part of the heating element 100 presses the contact portion 121 to make it shrink, it does not affect the contact between the other part of the heating element 100 and the block portion 131 .
- the heating elements 100 with different thicknesses and heights may tightly and evenly contact the contact portion 121 and the block portion 131 respectively. Consequently, the fourth embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment.
- FIG. 10 shows the fifth embodiment of the vapor chamber structure 10 of the disclosure.
- the fourth embodiment is similar to the first embodiment while the difference between them lies in that the numbers of the wrinkled ring portions 12 and convex portion 13 may be one or plural.
- the lower or thinner heating element 100 is in contact with the contact portion 121 while the higher or thicker heating element 100 is in contact with the heat receiving plate 11 .
- the higher or thicker heating element 100 is aligned to the heat receiving plate 11 for contact, the lower or thinner heating element 100 is able to press the contact portion 121 to make it shrink.
- the heating elements 100 with different thicknesses and heights may tightly and evenly contact the contact portion 121 and the heat receiving plate 11 respectively. Consequently, the fifth embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A vapor chamber structure for at least one heating element includes a main body having a heat receiving plate. The heat receiving plate has at least one wrinkled ring portion. An inner portion of the wrinkled ring portion surrounds a contact portion. The contact portion is in contact with the heating element. Thereby, one heating element provides the contact portion a thrust when the contact portion is in contact with the heating element. The wrinkled ring portion is therefore forced to deform for helping the contact portion slightly adjust its position. This ensures a tight and even contact between the contact portion and the heating element, thereby improving the heat dissipation efficiency of the vapor chamber structure.
Description
- The disclosure relates to a vapor chamber, more particularly to a vapor chamber structure.
- Traditionally a vapor chamber is a vacuum chamber formed by an upper metal plate and a lower metal plate welded together. The inside of the vacuum chamber comprises highly efficient heat transfer components such as a capillary structure or a working fluid. This enables the vapor chamber to quickly transfer heat of a regional heat source to a large plate for cooling, thereby making the vapor chamber a heat dissipation device of high performance.
- However, the heights and thicknesses of the heat sources are slightly different from each other. Thus, when the vapor chamber is in thermal contact with multiple heat sources, the higher or thicker heat sources are likely to be against the vapor chamber. This makes the vapor chamber unable to be in contact with lower or thinner heat sources; or, when the vapor chamber is in thermal contact with multiple heat sources, the higher or thicker heat sources are likely to depress the vapor chamber, thereby resulting in an uneven surface thereof. This problem leads to poor performance regarding the heat dissipation of the vapor chamber.
- Consequently, the disclosure aims to provide an improved design capable of solving the aforementioned problems.
- One purpose of the disclosure is to provide a vapor chamber structure in which a heating element provides the contact portion a thrust (namely a push force) when the contact portion is in contact with the heating element. The wrinkled ring portion is therefore forced to deform for helping the contact portion slightly adjust its position. This in turn ensures a tight and even contact between the contact portion and the heating element, thereby improving the heat dissipation efficiency of the vapor chamber structure.
- To fulfill the purpose, the disclosure provides a vapor chamber structure which is configured for at least one heating element and comprises a main body having a heat receiving plate. The heat receiving plate has at least one wrinkled ring portion. An inner portion of the wrinkled ring portion surrounds a contact portion. The contact portion is in contact with the heating element.
- The disclosure further provides the following effects:
- Firstly, the main body has a condensing plate arranged in a way corresponding to the heat receiving plate. The condensing plate forms a plurality of stop sticks extending towards the heat receiving plate. Each stop stick and the contact portion abuts on each other to press the contact portion to contact the heating element more reliably, thereby improving the capability of heat dissipation of the vapor chamber structure.
- Secondly, each return spring is accommodated in each stop stick and is sandwiched between the cooling fin and the stop stick. When the stop stick is pressed, the return spring gives the stop stick a return force to press each stop stick to abut on the contact portion. This ensures a more reliable contact between the contact portion and the heating element, thereby improving the heat dissipation function of the vapor chamber structure.
- The disclosure will become more fully understood from the detailed description and the drawings given herein below for illustration only, and thus does not limit the disclosure, wherein:
-
FIG. 1 is an exploded view of the vapor chamber structure according to the first embodiment structure; -
FIG. 2 is a perspective view of the assembly of the vapor chamber structure according to the first embodiment structure; -
FIG. 3 is another perspective view of the assembly of the vapor chamber structure according to the first embodiment structure; -
FIG. 4 is a sectional view of the vapor chamber structure according to the first embodiment structure; -
FIG. 5 is a schematic view of the operation of the vapor chamber structure according to the first embodiment structure; -
FIG. 6 is a schematic view of the operation of the vapor chamber structure according to the second embodiment structure; -
FIG. 7 is a sectional view of the vapor chamber structure according to the third embodiment structure; -
FIG. 8 is a bottom view of the vapor chamber structure according to the third embodiment structure; -
FIG. 9 is a schematic view of the operation of the vapor chamber structure according to the fourth embodiment structure; and -
FIG. 10 is a schematic view of the operation of the vapor chamber structure according to the fifth embodiment structure. - In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
- Referring to
FIG. 1 toFIG. 5 , the disclosure provides a vapor chamber structure of the first embodiment. Thevapor chamber structure 10 is for one or multiple heating elements and mainly comprises amain body 1. - As seen in
FIG. 1 toFIG. 4 , themain body 1 has aheat receiving plate 11. Theheat receiving plate 11 has a plurality of wrinkledring portions 12. An inner portion of each wrinkledring portion 12 surrounds acontact portion 121. Each wrinkledring portion 12 comprises a plurality ofrecessed ring sections 122 recessed on theheat receiving plate 11. Therecessed ring sections 122 are in annular arrangement in sequence. The thickness a of eachrecessed ring section 122 is less than the thickness b of theheat receiving plate 11. - Specifically, the
heat receiving plate 11 has a plurality ofconvex portions 13 protruding therefrom. Each wrinkledring portion 12 is formed on the outer edge of eachconvex portion 13 while eachcontact portion 121 is formed on the top of eachconvex portion 13. - Moreover, the
main body 1 has acondensing plate 14 arranged in a way corresponding to theheat receiving plate 11. Thecondensing plate 14 forms a plurality ofstop sticks 141 extending towards eachcontact portion 121. A gap s is formed between eachstop stick 141 and thecontact portion 121. From thecondensing plate 14, eachstop stick 141 is formed by stamping in a direction towards theheat receiving plate 11. The inner portion of eachstop stick 141 forms a concave 142 corresponding to thecondensing plate 14. - Furthermore, the
main body 1 comprises anupper case 15 and alower case 16 assembled to each other. Anaccommodating chamber 17 is formed between theupper case 15 and thelower case 16. Theheat receiving plate 11 is formed on thelower case 16 while thecondensing plate 14 is formed on theupper case 15. - As seen in
FIG. 1 ,FIG. 4 andFIG. 5 , thevapor chamber structure 10 of the disclosure further comprises acapillary structure 2. Thecapillary structure 2 is accommodated in theaccommodating chamber 17 and covers theheat receiving plate 11. Thecapillary structure 2 may be a particle sintered body, metal meshes, a groove or a combination thereof. - As seen in
FIG. 5 , thevapor chamber structure 10 of the disclosure further comprises a plurality ofcooling fins 3. Eachcooling fin 3 is connected to thecondensing plate 14.Multiple cooling fins 3 cover the concave 142. - As seen in
FIG. 4 toFIG. 5 , the assembly of thevapor chamber structure 10 of the disclosure is illustrated. Themain body 1 has theheat receiving plate 11 having the wrinkledring portion 12. The inside of thewrinkled ring portion 12 surrounds and forms thecontact portion 121 which is in contact with theheating element 100. Thereby, when thecontact portion 121 is in contact with the heating element, theheating element 100 provides the contact portion 121 a thrust which leads to the deformation of thewrinkled ring portion 12 due to the force. This therefore help thecontact portion 121 slightly adjust its position to more tightly and evenly contact theheating element 100, in order to improve the heat dissipation efficiency of thevapor chamber structure 10. - As shown in
FIG. 5 , in the operation of thevapor chamber structure 10 of the disclosure, eachheating element 100 is in thermal contact with eachcontact portion 121. Moreover, eachwrinkled ring portion 12 surrounds the outer edge of thecontact portion 121; eachwrinkled ring portion 12 comprises a plurality of recessedring sections 122 recessed on theheat receiving plate 11; the recessedring sections 122 are in annular arrangement in sequence; the thickness a of each recessedring section 122 is less than the thickness b of theheat receiving plate 11. Hence, when eachcontact portion 121 receives the thrust of eachheating element 100, thewrinkled ring portion 12 contracts or extends through the recessedring sections 122. This then makes the contact portion slightly contract or extend, which slightly adjust the position of each contact portion to match the thickness and height of eachheating element 100. Therefore, theheating elements 100 with different thicknesses and heights may tightly and evenly contact eachcontact portion 121, which improves the heat dissipation efficiency of thevapor chamber structure 10. - Additionally, the
main body 1 has the condensingplate 14 arranged in a way corresponding to theheat receiving plate 11. The condensingplate 14 forms the plurality of stop sticks 141 extending towards eachcontact portion 121. When the distance of the contraction of thecontact portion 121 exceeds the gap s, thecontact portion 121 abuts on eachstop stick 141 to push thecontact portion 121 for more reliable contact between theheating element 100 and thecontact portion 121. This enhances the capability regarding heat dissipation of thevapor chamber structure 10. -
FIG. 6 shows the second embodiment of thevapor chamber structure 10 of the disclosure. As seen inFIG. 6 , the second embodiment is similar to the first embodiment but thevapor chamber structure 10 of the second embodiment further comprises a plurality of return springs. - Specifically, the outer edge of each
stop stick 141 is disposed with ashrunken ring groove 1411 and eachstop stick 141 abuts on thecontact portion 121. Eachreturn spring 4 is accommodated in each concave 142 and is sandwiched between the coolingfin 3 and thestop stick 141. When thestop stick 141 is pressed, theshrunken ring groove 1411 deforms, due to the press, to reduce the height of thestop stick 141. Thereturn spring 4, at this point, gives the stop stick 141 a return force to enable theshrunken ring groove 1411 to adjust in relation to thereturn spring 4, for pressing eachstop stick 141 to abut on thecontact portion 121. This ensures the reliable contact between thecontact portion 121 and theheating element 100, thereby improving the heat dissipation capability of thevapor chamber structure 10. -
FIG. 7 andFIG. 8 show the second embodiment of thevapor chamber structure 10 of the disclosure. The third embodiment is similar to the first embodiment but theheat receiving plate 11 is without theconvex portion 13. Theheat receiving plate 11 has a flat surface which has one or multiplewrinkled ring portions 12. - Specifically, the higher or
thicker heating element 100 is in contact with thecontact portion 121 while lower orthinner heating element 100 is in contact with theheat receiving plate 11. When the higher orthicker heating element 100 pushes thecontact portion 121 to make it shrink, it does not affect the contact between the lower orthinner heating element 100 and theheat receiving plate 11. This way, theheating elements 100 with different thicknesses and heights may tightly and evenly contact thecontact portion 121 or theheat receiving plate 11. Consequently, the third embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment. -
FIG. 9 shows the fourth embodiment of thevapor chamber structure 10 of the disclosure. The fourth embodiment is similar to the first embodiment but theheat receiving plate 11 of the fourth embodiment further has one or multipleconvex portions 13 and one ormultiple block portions 131 protruding thereform. - Specifically, the
heat receiving plate 11 has one or multipleconvex portions 13 and one ormultiple block portions 131 protruding thereform. Theheat receiving plate 11 has aconvex section 111 protruding therefrom. Theconvex section 111 is disposed with one or multiple recessedring grooves 112. Theconvex portion 13 is formed on the inside of the region surrounded by the recessedring groove 112 while theblock portion 131 is formed on the outside of the region surrounded by the recessedring groove 112. - Thereby, a part of the
heating element 100 is in contact with thecontact portion 121 while the other part of theheating element 100 is in contact with theblock portion 131. When the part of theheating element 100 presses thecontact portion 121 to make it shrink, it does not affect the contact between the other part of theheating element 100 and theblock portion 131. This way, theheating elements 100 with different thicknesses and heights may tightly and evenly contact thecontact portion 121 and theblock portion 131 respectively. Consequently, the fourth embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment. -
FIG. 10 shows the fifth embodiment of thevapor chamber structure 10 of the disclosure. The fourth embodiment is similar to the first embodiment while the difference between them lies in that the numbers of thewrinkled ring portions 12 andconvex portion 13 may be one or plural. - Specifically, the lower or
thinner heating element 100 is in contact with thecontact portion 121 while the higher orthicker heating element 100 is in contact with theheat receiving plate 11. When the higher orthicker heating element 100 is aligned to theheat receiving plate 11 for contact, the lower orthinner heating element 100 is able to press thecontact portion 121 to make it shrink. This way, theheating elements 100 with different thicknesses and heights may tightly and evenly contact thecontact portion 121 and theheat receiving plate 11 respectively. Consequently, the fifth embodiment is capable of performing the same functions and yielding the same results as those of the first embodiment.
Claims (13)
1. A vapor chamber structure, configured for at least one heating element, comprising:
a main body having a heat receiving plate, the heat receiving plate having at least one wrinkled ring portion, an inner portion of the wrinkled ring portion surrounding a contact portion, and the contact portion being in contact with the heating element.
2. The vapor chamber structure according to claim 1 , wherein the heat receiving plate has at least one convex portion protruding therefrom, the wrinkled ring portion is formed on an outer edge of the convex portion while the contact portion is formed on a top of the convex portion.
3. The vapor chamber structure according to claim 1 , wherein the heat receiving plate has at least one convex portion and at least one block portion protruding therefrom, the wrinkled ring portion is formed on an outer edge of the convex portion while the contact portion is formed on a top of the convex portion.
4. The vapor chamber structure according to claim 3 , wherein the heat receiving plate has a convex section protruding therefrom, the convex section is disposed with at least one recessed ring groove, the convex portion is formed inside a region surrounded by the recessed ring groove while the block portion is formed outside the region surrounded by the recessed ring groove.
5. The vapor chamber structure according to claim 1 , wherein the wrinkled ring portion comprises a plurality of recessed ring sections recessed on the heat receiving plate, and the recessed ring sections are in annular arrangement in sequence.
6. The vapor chamber structure according to claim 1 , wherein the thickness of each recessed ring section is less than the thickness of the heat receiving plate.
7. The vapor chamber structure according to claim 1 , wherein the main body has a condensing plate arranged in a way corresponding to the heat receiving plate, the condensing plate forms a plurality of stop sticks extending towards the heat receiving plate, and a gap s is formed between each stop stick and the contact portion.
8. The vapor chamber structure according to claim 1 , wherein the main body has a condensing plate arranged in a way corresponding to the heat receiving plate, the condensing plate forms a plurality of stop sticks extending towards the heat receiving plate, an outer edge of each stop stick is disposed with a shrunken ring groove, and each stop stick abuts on the contact portion.
9. The vapor chamber structure according to claim 8 , further comprising a plurality of cooling fins and a plurality of return springs, the inner portion of each stop stick forms a concave corresponding to the condensing plate, the cooling fins are connected to the condensing plate and cover the concave, each return spring is accommodated in each concave, and each return spring is sandwiched between the cooling fin and the stop stick.
10. The vapor chamber structure according to claim 7 , wherein each stop stick is formed by stamping in a direction towards the heat receiving plate from the condensing plate, and the inner portion of each stop stick forms a concave corresponding to the condensing plate.
11. The vapor chamber structure according to claim 7 , further comprising a plurality of cooling fins, wherein the cooling fins are connected to the condensing plate and cover the concave.
12. The vapor chamber structure according to claim 7 , wherein the main body comprises an upper case and a lower case assembled to each other, an accommodating chamber is formed between the upper case and the lower case, the heat receiving plate is formed on the lower case while the condensing plate is formed on the upper case.
13. The vapor chamber structure according to claim 12 , further comprising a capillary structure, wherein the capillary structure is accommodated in the accommodating chamber and covers the heat receiving plate.
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US14/858,566 US20170082378A1 (en) | 2015-09-18 | 2015-09-18 | Vapor chamber structure |
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US14/858,566 US20170082378A1 (en) | 2015-09-18 | 2015-09-18 | Vapor chamber structure |
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Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170010048A1 (en) * | 2015-07-09 | 2017-01-12 | Chaun-Choung Technology Corp. | Thin vapor chamber and manufacturing method thereof |
US20180288901A1 (en) * | 2017-03-28 | 2018-10-04 | Dynatron Corporation | Heat dissipation device having compact vapor chamber |
CN110953906A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Method for manufacturing lower heat conducting assembly of temperature-equalizing plate and temperature-equalizing plate |
JP2020136611A (en) * | 2019-02-25 | 2020-08-31 | Necプラットフォームズ株式会社 | Vapor chamber, heat radiation structure, and manufacturing method of heat radiation structure |
CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
CN114543569A (en) * | 2020-11-24 | 2022-05-27 | 亚浩电子五金塑胶(惠州)有限公司 | Three-dimensional heat transfer device |
US20220214115A1 (en) * | 2021-01-04 | 2022-07-07 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Vapor chamber |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
JP2023024066A (en) * | 2021-08-06 | 2023-02-16 | 古河電気工業株式会社 | Heat transport body |
US11635263B2 (en) * | 2019-05-10 | 2023-04-25 | Cooler Master Co., Ltd. | Vapor chamber and manufacturing method of the same |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
US11933543B2 (en) * | 2021-03-09 | 2024-03-19 | Furukawa Electric Co., Ltd. | Heat sink |
US20240200879A1 (en) * | 2022-12-16 | 2024-06-20 | Taiwan Microloops Corp. | Separate capillary vapor chamber structure for dual heat sources |
JP7575359B2 (ja) | 2021-08-06 | 2024-10-29 | 古河電気工業株式会社 | 熱輸送体 |
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Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170010048A1 (en) * | 2015-07-09 | 2017-01-12 | Chaun-Choung Technology Corp. | Thin vapor chamber and manufacturing method thereof |
US20180288901A1 (en) * | 2017-03-28 | 2018-10-04 | Dynatron Corporation | Heat dissipation device having compact vapor chamber |
US11680752B2 (en) | 2018-05-29 | 2023-06-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
CN110953906A (en) * | 2018-09-27 | 2020-04-03 | 高力热处理工业股份有限公司 | Method for manufacturing lower heat conducting assembly of temperature-equalizing plate and temperature-equalizing plate |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
JP2020136611A (en) * | 2019-02-25 | 2020-08-31 | Necプラットフォームズ株式会社 | Vapor chamber, heat radiation structure, and manufacturing method of heat radiation structure |
US11635263B2 (en) * | 2019-05-10 | 2023-04-25 | Cooler Master Co., Ltd. | Vapor chamber and manufacturing method of the same |
US12117244B2 (en) | 2019-05-10 | 2024-10-15 | Cooler Master Co., Ltd. | Vapor chamber and manufacturing method of the same |
US11747089B2 (en) * | 2020-11-24 | 2023-09-05 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Three-dimensional heat exchanger |
CN114543569A (en) * | 2020-11-24 | 2022-05-27 | 亚浩电子五金塑胶(惠州)有限公司 | Three-dimensional heat transfer device |
US11421940B2 (en) * | 2021-01-04 | 2022-08-23 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Vapor chamber |
US20220214115A1 (en) * | 2021-01-04 | 2022-07-07 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Vapor chamber |
CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
US11933543B2 (en) * | 2021-03-09 | 2024-03-19 | Furukawa Electric Co., Ltd. | Heat sink |
JP2023024066A (en) * | 2021-08-06 | 2023-02-16 | 古河電気工業株式会社 | Heat transport body |
JP7575359B2 (ja) | 2021-08-06 | 2024-10-29 | 古河電気工業株式会社 | 熱輸送体 |
US20240200879A1 (en) * | 2022-12-16 | 2024-06-20 | Taiwan Microloops Corp. | Separate capillary vapor chamber structure for dual heat sources |
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Legal Events
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AS | Assignment |
Owner name: CHAUN-CHOUNG TECHNOLOGY CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, SHIH-MING;LIN, CHIA-HSUN;REEL/FRAME:036602/0419 Effective date: 20150915 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |