US20170069581A1 - Foil composite card - Google Patents

Foil composite card Download PDF

Info

Publication number
US20170069581A1
US20170069581A1 US15/356,586 US201615356586A US2017069581A1 US 20170069581 A1 US20170069581 A1 US 20170069581A1 US 201615356586 A US201615356586 A US 201615356586A US 2017069581 A1 US2017069581 A1 US 2017069581A1
Authority
US
United States
Prior art keywords
layer
pattern
clear plastic
layers
embossed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/356,586
Inventor
John Herslow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US15/356,586 priority Critical patent/US20170069581A1/en
Publication of US20170069581A1 publication Critical patent/US20170069581A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/57Protection from inspection, reverse engineering or tampering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/06Embossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/328Diffraction gratings; Holograms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30Identification or security features, e.g. for preventing forgery
    • B42D25/36Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373Metallic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/405Marking
    • B42D25/41Marking using electromagnetic radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/405Marking
    • B42D25/425Marking by deformation, e.g. embossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/405Marking
    • B42D25/43Marking by removal of material
    • B42D25/435Marking by removal of material using electromagnetic radiation, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40Manufacture
    • B42D25/45Associating two or more layers
    • B42D25/465Associating two or more layers using chemicals or adhesives
    • B42D25/47Associating two or more layers using chemicals or adhesives using adhesives
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/06009Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
    • G06K19/06046Constructional details
    • G06K19/06065Constructional details the marking being at least partially represented by holographic means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561Batch processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985Flexible insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B2038/0052Other operations not otherwise provided for
    • B32B2038/0092Metallizing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00Treatment by energy or chemical effects
    • B32B2310/08Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00Cards, e.g. identity cards, credit cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00Carriers for sound or information
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention is directed to the manufacture of a multi-layered (composite) card, or any like instrument or document.
  • card or “cards” as used herein, and in the appended claims, is intended to include a large variety of documents and instruments such as a financial cards, identification (including a National ID or Driver's License) cards, electronic passport pages, gift cards, documents for holding permanent and long lasting records such as medical records or security cards, or other plastic cards used for promotion of a product or organization.
  • FIG. 4 of the '552 Patent shows security elements formed in a top layer 17 and FIG. 6 of the '552 Patent discusses the addition of holographic material and other security indicia after the sheets are cut into standard cards.
  • the holograms may be formed by a hot stamping method at, or near, the top (or bottom) surface (level) of the card.
  • a disadvantage to so placing the holograms is that a counterfeiter may be able to alter the card without the tampering being readily apparent to someone examining or accepting the card.
  • positioning the hologram close to the top or the bottom surface of the card creates an asymmetry in its construction, whereby, when the temperature varies, different portions (layers) of the card may be placed under different degrees of tension and contraction resulting in stresses which tend to distort the card and/or the hologram (e.g., the card fails to remain flat).
  • the hologram when the hologram is placed at, or near, the top or the bottom surfaces it may be easily and inadvertently scratched or marred.
  • composite cards formed in accordance with the invention include a security layer formed at the center, or core layer, of the cards.
  • Cards embodying the invention may include a hologram or diffraction grating formed at, or in, the center, or core layer, of the card with symmetrical layers formed above and below the center or core layer.
  • a hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and vapor depositing a very thin layer of metal or metal compound (e.g., aluminum, zinc sulfide, etc.) on the embossed layer. Then, additional layers are selectively attached to the top and bottom surfaces of the core layer. In accordance with the invention, for each additional layer attached to the top surface of the core layer there is a corresponding like layer attached to the bottom surface of the core layer for producing a highly symmetrical structure (sandwich).
  • metal or metal compound e.g., aluminum, zinc sulfide, etc.
  • all the layers are made of a clear synthetic (e.g., plastic) material, whereby the pattern formed on, or within, the core layer may be seen by looking down at the top of the card or by looking up at the bottom of the card.
  • a clear synthetic (e.g., plastic) material whereby the pattern formed on, or within, the core layer may be seen by looking down at the top of the card or by looking up at the bottom of the card.
  • the layer of metal or metal compound deposited on the core layer may be made very thin to provide a “see-through” effect, under appropriate light conditions. However, where the layer of metal or metal compound deposited on the core layer is of “standard” thickness, the pattern may only be seen from the top or the bottom side of the core.
  • a laser may be used to remove selected portions of the metal formed on the embossed layer to impart a selected pattern or information to the holographic region.
  • this step in making a card or a set of cards may be performed when the card or cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
  • a hologram may be formed in the core portion of a card and if the hologram includes a metal layer, laser equipment may be used to modify and/or alter the metal pattern at selected stages in the process of forming the card.
  • laser equipment may be used to modify and/or alter the metal pattern at selected stages in the process of forming the card.
  • each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image.
  • Embodiments of the invention may include the use of a polyester film, or any other carrier, which includes a metallic or a high refractive index (HRI) transparent holographic foil that is pre-laminated between two sheets of a material (which could be PVC, PET or other thermo-plastic resin) that has a thermo-plastic adhesive (which may have, but not necessarily has, been previously applied).
  • the pre-laminated holographic foil can have an unlimited number of patterns and may also be configured to include one, or several individual, hologram designs repeated in rows and columns across an entire sheet.
  • the holographic design may also have the appearance of full metal, or partial metal and partial white coverage (white reflecting hologram) on each individual card in the matrix. Utilizing this holographic foil pre-laminate in concert with standard plastic card materials, enables a plastic card manufacturer to produce “full-face” foil pattern design cards, or “full-face” registered hologram cards.
  • These cards would include the holographic foil pre-laminate as the center sheet in a standard card composition.
  • the subsequent plastic card could be laser engraved using a standard YAG laser or any other suitable laser, thus removing the metal or material coatings of the holographic layer in one or more of the following: an alpha numeric, barcode or graphic design.
  • the end result is an inexpensive foil composite card that has a unique individualized holographic layer that has been permanently altered.
  • plastic cards formed in accordance with the invention are truly tamper resistant and are more secure foil cards than any of the known commercially available cards.
  • FIG. 1 is a cross sectional diagram of part of a card (instrument) embodying the invention
  • FIG. 2 is a diagram detailing some of the steps in forming a card embodying the invention
  • FIG. 2A is a diagram detailing the application of an embossing layer to a core layer to form a card embodying the invention
  • FIG. 3 is a cross sectional diagram of part of a card embodying the invention where the core layer includes a transparent material having a high refractive index;
  • FIGS. 3 a , 3 b , 3 c , 3 d are cross sectional diagrams of steps in forming a card embodying the invention.
  • FIG. 4 is a diagram of the cross section of part of a card embodying the invention to which a laser beam is applied to form an additional ablated pattern in a metal layer in accordance with the invention
  • FIG. 5 is a diagram of a top view of a card including a holographic portion formed in accordance with the invention.
  • FIG. 6 is a cross sectional diagram of a card shown in FIG. 5 where all layers are made of clear (transparent) materials;
  • FIG. 6A is a cross sectional diagram of a card embodying the invention where one, or more, of the layers block the light;
  • FIG. 7 is a top view of a sheet containing an array of cards illustrating that a laser beam can be applied to all of the cards on the sheet;
  • FIG. 8 is a cross sectional diagram of a card with an integrated circuit (IC) chip and antenna embodying the invention.
  • IC integrated circuit
  • FIG. 9 is a cross sectional diagram of a dual interface card embodying the invention.
  • FIG. 10 is a cross sectional diagram of a card with a lasered window embodying the invention.
  • FIG. 11 is a cross sectional diagram of another card with a lasered window embodying the invention.
  • FIG. 12 is a cross sectional diagram of still another card with a lasered window embodying the invention.
  • a core 20 comprised of a base layer 21 of a plastic material, which may be, for example, oriented polyester terephthalate (OPET) or polypropylene, or polystyrene, or any number of acrylics and/or a combination of these materials.
  • the base layer 21 is shown to have an upper surface 21 a and a lower, or bottom, surface 21 b.
  • a pattern is shown to be formed on, or above, surface 21 a of layer 21 .
  • the pattern could be formed on surface 21 b.
  • Two different methods of forming a pattern are shown in FIGS. 2 and 2A .
  • the surface 21 a of layer 21 in FIG. 2 is embossed with a diffractive or holographic pattern.
  • the surface 21 a of layer 21 is coated with an embossing layer 200 which is then embossed with a diffractive pattern, 200 a.
  • a layer 22 of aluminum may then be vapor deposited on the diffraction pattern to form a hologram.
  • the use of vapor deposition is very significant in that it permits a very thin layer 22 , a few atoms thick, to be formed on surface 21 a and thus complete the formation of the hologram, using small amounts of metal.
  • the thickness of the layer can be made very thin so it is nearly transparent and can provide a “see-through ” effect.
  • the metal layer can be made a little thicker so as to be more opaque.
  • a clear adhesive primer layer 23 a may be coated over the patterned and metalized top surface ( 21 a ) and a similar clear adhesive primer layer 23 b may be coated over the bottom surface ( 21 b ) of the layer 21 .
  • the core 20 is completed by attaching these clear adhering layer ( 23 a, 23 b ) above and below the embossed base layer 21 .
  • the clear layer 23 a, 23 b is a primer coating. It may be polyethylenamine or an acrylic based, or other, organic adhesive compound with solvent or water based carriers.
  • the primer coatings 23 a, 23 b are fairly thin and yet fairly strong/sturdy. They also function to promote adhesion to layers 24 a, 24 b which are attached to the core 20 .
  • clear PE adhesive layers 24 a, 24 b may then be formed/attached to the top (outer) surfaces of their respectively layers 23 a, 23 b.
  • Layers 24 a, 24 b may be of polyethylene (PE) material, or polypropylene (PP), or high density polypropylene (HDPP), or ethylene Vinyl Acetate (EVA), or any of the different forms of PET or any of like materials, or mixtures of these materials.
  • the clear materials used to form layers 24 a, 24 b may contain other clear adhesion promoting compounds (e.g., ethyl acrylates, acrylic acid, etc.).
  • the layers 24 a, 24 b may be fairly thick and function to attach to the thin embossed hologram layer and coatings of core 20 .
  • buffer layers 25 a, 25 b may then be formed/attached to the top (outer) surfaces of layrs 24 a, 24 b to complete what is defined as subassembly 30 .
  • buffer (carrier) layer 25 a, 25 b
  • Subassembly 30 is thick enough to be handled by automatic credit card manufacturing equipment.
  • the base layer 21 was approximately 0.002 inches thick and the adhesive backed layers ( 23 a, 23 b ) were each made to be approximately 0.0001 to 0.0003 inches thick. In other embodiments the layers 23a, 23b could be made either thinner or much thicker.
  • adhesive layers can be coated over the buffer or carrier layer and the two (i.e., the carrier and buffer layers on each side of a holographic layer) can be combined with the holographic layer. That is, adhesive can be applied to either side of the carrier foil interface and then pre-laminated together (3 sheets laminated to become one laminate; i.e., the prelaminate prior to platen lamination. Thus, the carrier sheet can hold the sub-assemblies for transfer to substrates for forming cards.
  • FIG. 2 Examining FIG. 2 in greater detail note some of the steps used in forming the core 20 .
  • the base component may be a sheet 21 of plastic (e.g., PET or OPET or polypropylene, or polystyrene, or polymethyl, methacrylate, etc. . . . ) material whose thickness typically ranges from 0.0005 inches to more than 0.005 inches. In one embodiment layer 21 was made, for example, 0.002 inches thick.
  • plastic e.g., PET or OPET or polypropylene, or polystyrene, or polymethyl, methacrylate, etc. . . .
  • layer 21 was made, for example, 0.002 inches thick.
  • a diffraction pattern may be formed on one side of layer 21 .
  • a diffraction pattern may be formed directly in the plastic layer 21 by embossing (e.g., stamping) pattern(s) therein. Forming the pattern in a sheet of plastic (or in an embossing layer, as discussed below) is easier and less wearing on the embossing (stamping) equipment than forming a like pattern in a metal layer.
  • a hologram is formed on one surface ( 21 a ) of plastic sheet 21 by vapor deposition of a metal layer (e.g., aluminum onto the diffraction patter.
  • a metal layer e.g., aluminum onto the diffraction patter.
  • the hologram may be formed by embossing the top surface 21 a to form a diffraction pattern and then metallizing the pattern.
  • the surface 21 a may be coated by the vapor deposition of aluminum (or similar light reflective materials such as nickel, silver, zinc, or other like materials).
  • a significant advantage of using vapor deposition is that very small amounts of the metal (light reflective material) need to be used to form the hologram resulting in a significant savings in the cost of manufacturing the card (or instrument).
  • very thin layers allow a controllable amount of light to pass through. This enables the manufacture of a card, or document, in which an image (hologram) formed on a card is reflected (i.e., is visible) while also enabling a viewer to “see-through” the image.
  • an image hologram
  • clear adhesive or “primer” coats 23 a, 23 b may be applied to the top and bottom surfaces 21 a, 21 b, respectively, of plastic sheet 21 .
  • the primer coat also functions to fill in the ridges resulting from the formation of the diffraction grating.
  • the clear layers 23 a, 23 b which may be of the type described above, may be attached to the top and bottom surfaces of “embossed” plastic sheet 21 on which the aluminum has been vapor deposited.
  • Primer layers 23 a, 23 b may be attached to base layer 21 by any one of a number of methods, such as, for example, gravure coating, roller coating, flexography or other like methods.
  • the primer secures the bond to both sides of the holographic sheet (the embossed side and the blank side). This completes the formation of what is defined herein as the core assembly 20 .
  • the PE layers 24 a, 24 b, or any other suitable layer, as noted above, which function as an additional buffer between that bond and the outer buffer layers 25 a, 25 b are attached to the core assembly.
  • the PE layers 24 a, 24 b may also include an adhesive which promotes adhesion to the clear primer layers 23 a, 23 b attached to the top and bottom surfaces of layer 21 .
  • Layers 24 a, 24 b, 25 a, 25 b may be attached to each other and to the underlying layers by any one of a number of methods such as, for example, platen lamination, hot roll lamination, liquid adhesive lamination.
  • a clear buffer layer 25 a is attached to the PE layer 24 a and a clear buffer layer 25 b is attached to the PE adhesive layer 24 b. All of layers 24 a and 24 b and layers 25 a, 25 b function as buffers, providing additional strength to the structure and at the same time protecting the hologram from being damaged or tampered with. Adding layers 25 a and 25 b completes the sub-assembly 30 which may then be customized to form cards with additional information.
  • the hologram By forming the hologram at, and within, the core level, the hologram will not be easily, or inadvertently, damaged since several additional layers will be attached to the top and bottom of the holographic layer. It is also not subject to easily being tampered or altered. Forming the hologram at the center of the structure minimizes the possibility of tampering while fully protecting the hologram. Another significant advantage of forming the hologram at the core of the structure is that the top and bottom surfaces stay flat due to equal shrinking and/or expansion of all the layers. Note that the card structure is formed so as to be symmetrical about the core layer.
  • FIG. 2A illustrates another method of forming the hologram.
  • a clear embossing layer 200 may be coated directly over a layer 21 (or 210 ).
  • a primer coating may be formed on layer 21 / 210 and then the embossing layer 200 may attached/formed to the primer coating.
  • the embossing layer may be composed, for example, of siloxane, acrylic, vinyl, linear polyester, urethane or any like materials and may be several (e.g., less than 0.5 to more than 5) microns thick.
  • the embossing layers may also be deposited as liquids and radiation cured, possibly in two steps—first as a soft easily embossable coating which then becomes hard and impervious.
  • a diffraction pattern is embossed (formed) in the embossing layer/coating 200 to form a desired pattern.
  • Forming a pattern in the embossing layer may be desirable since it is even easier and less wearing on the embossing (stamping) equipment than forming a like pattern directly in the PET layer (as per FIG. 2 ).
  • the sheet may be processed as per steps 2 B, 3 and 4 shown in FIG. 2 .
  • a hologram may be formed by, for example, embossing a pattern in a carrier base material (e.g., a hard polyester) or by embossing the pattern in a coating previously applied to the carrier base material, or by embossing the pattern in a metal which was previously deposited onto the base carrier material or by depositing the metal onto a soft coating and then embossing.
  • a carrier base material e.g., a hard polyester
  • the core 20 may be part of a subassembly 30 which includes attaching layers 24 a, 24 b of clear PE and buffer layers 25 a, 25 b to the top and bottom surfaces of the core 20 .
  • Layers 25 a, 25 b may range in thickness from 0.001 to 0.005 inches, or more, and may be composed of PVC like materials.
  • the subassembly 30 may then be used to form a card, or any instrument, by attaching a layer 27 a, 27 b of clear or white PVC material to the top and bottom surfaces of the subassembly 30 .
  • a layer 27 a, 27 b of clear or white PVC material As illustrated in FIG. 1 , information can be printed either on the outer surface (the surface facing away form the core) of layers 27 a, 27 b or on the inner surface or both.
  • the printed information may include, for example, fixed data fields and advertising, and/or any other desired information.
  • the card (or instrument) may be completed by adding clear PVC laminating films 29 a, 29 b to the top and bottom surfaces of the card.
  • FIG. 3 is a cross-sectional diagram (not to scale) of a card embodying the invention.
  • FIG. 3 includes a core comprised of a layer 210 which may be (but not be) of the same material as layer 21 .
  • the top surface 210 a of layer 210 is embossed with a diffraction pattern giving a unique pattern to the structure.
  • a high refractive index (HRI) layer 212 can then be vapor deposited on the embossed layer. Due to the HRI property of layer 212 , there is no need to further metallize the layer.
  • the HRI layer may be formed of zinc sulfide or zinc oxide or any material having like properties.
  • Clear primer layer 23 a is attached to the top of HRI layer 212 overlying layer 210 and primer layer 23 b is attached to the bottom of layer 210 .
  • clear layers 24 a and 24 b which may be of PE or any other suitable materials, are attached to layers 23 a and 23 b, respectively and additional layers ( 25 a, 25 b ) of clear (translucent) material may be attached to the top and bottom layers of layers 24 a, 24 b to form the subassembly 30 .
  • Additional layers 27 a, 27 b may be attached to the top and bottom layers of the sub-assembly.
  • Information may be written or printed in any known manner on, or in, the layers 27 a, 27 b.
  • laminating films 29 a, 29 b may be attached to the top and bottom intermediate layers 27 a, 27 b to produce a card 40 whose core contents can not be altered without essentially destroying the card.
  • FIGS. 3A, 3B, 3C, 3D and 3E illustrate the forming/coating of an embossing layer 200 on stock (e.g., PET) material 210 ( FIG. 3A ), then embossing layer 200 with a diffraction pattern 200 a ( FIG. 3B ), then vapor depositing an HRI layer 212 a on the diffraction pattern ( FIG. 3C ), then coating clear primer layers 23 a, 23 b above layer 212 a and below layer 210 ( FIG. 3D ) to form a core assembly 20 .
  • clear PE adhesive layer 24 a is formed above prime layer 23 a and clear PE adhesive layer 24 b, is formed below layer 23 b ( FIG. 3E ). Note that the steps and thicknesses of the layers to form the basic structures discussed above are summarized in Table I, below.
  • FIG. 4 includes a cross-sectional diagram (not to scale) of a portion of a card embodying the invention, which may be part of a sheet (not shown) on which a large number of cards are formed, and depicts a piece of laser equipment 410 for “lasering” (e.g., engraving or vaporizing) metal layer 22 .
  • the core assembly 20 is shown to have a layer 22 of aluminum deposited and embossed as discussed for FIGS. 1, 2, and 2A , above.
  • Portions of the metal layer may be vaporized (see sections 401 a, 401 b, 401 c ) by the laser equipment 410 such that portions of the metal are selectively removed or “ablated” by “lasering” (e.g., eliminating or vaporizing) the metal to form any number of different patterns (e.g., graphic as well as alpha numeric information may be generated).
  • the clear layers 29 a, 27 a, 25 a and 24 a may be selected to be transparent to the laser wavelength. Consequently, the laser beam can pass through the clear layers of the card to “write” on the holographic layer below the top surface of the card.
  • the laser 410 may be applied at several different stages of the card manufacturing process to form the desired patterns.
  • the laser may be applied to “write” on the metal layer after the core 20 is formed and before the attachment of the carrier layers 24 a, 24 b and 25 a, 25 b.
  • the laser 410 may be applied to form the desired pattern in the metal layer after the layers 24 a, 24 b, and 25 a, 25 b are attached to the core layer, and before layers 27 a and 27 b are attached.
  • the laser may be applied to form the desired pattern in the metal layer after the layers 27 a, 27 b are attached and before the layer 29 a, 29 b, are attached.
  • the laser may be applied to form the desired pattern in the metal layer after the layers 29 a, 29 b are attached, when the cards may be part of a full sheet or in individual card shape.
  • FIG. 5 shows a top view of a card 100 illustrating that the hologram may be located within a designated window or area 101 , shown in portion 601 .
  • the hologram may extend the full length and/or width of the card 100 .
  • alpha numeric information may be produced by lasering within the holographic layer (e.g., layer 22 in FIG. 4 shown in portion 602 ).
  • alpha numeric information may be produced by printing information on, or within, layers 27 a, 27 b, as discussed above.
  • FIG. 6 is a cross-sectional diagram (not to scale) of card 100 of FIG. 5 and is intended to show that the layers above and below the holographic layer, 21 , 22 / 212 , may be transparent or translucent to yield a “see-through” card with the hologram portion 601 and the lasered portion 602 being visible from the top side or from the bottom side of the card. Note that if layers 27 a, 27 b are made of a white material a bright light may be needed to observe the “see-through” effect.
  • FIG. 6A is a cross-sectional diagram (not to scale) intended to show that the layers above the holographic layer 21 , 22 / 212 , may be transparent or translucent so the holographic pattern may be seen from the top.
  • one or more of the layers below the holographic layer e.g., 27 b or 29 b
  • FIG. 7 shows the application of a laser beam generated by laser equipment 410 to a sheet 5 containing a large array of cards 100 in sheet form embodying the invention.
  • the laser may be applied to the entire sheet of cards which may be at the core stage, the sub-assembly stage, or any of the stages thereafter. Being able to apply the laser beam in this manner, at any time before the cards are separated from a sheet, is economically advantageous and saves much in the cost of handling and also adds significant additional security.
  • FIG. 8 illustrates that cards embodying the invention, shown in the various figures, may be modified by the addition of a semiconductor chip containing selected electronic circuits (an integrated circuit, IC) within the body of the card in, or within, a layer 30 dedicated to include an antenna carrier, with the antenna being connected to the chip module.
  • IC integrated circuit
  • a radio frequency identification (RFID) card This enables the manufacture of a radio frequency identification (RFID) card.
  • RFID radio frequency identification
  • the metal layer 22 / 212 can act as a radio frequency shield to reduce reception from that side of the RFID antenna.
  • FIG. 9 illustrates that the chip (IC) and an antenna and carrier may be formed within a layer of the card and that, in addition, the chip may be accessed (read) by providing an external contact 901 along one side of the card.
  • This type of card may be referred to as a dual interface card since it enables information on the card to be read or written via RFID and contact.
  • FIG. 10 illustrates that a window or opening can be formed by lasering through the metal layer within core layer 20 to enable the color or pattern of an underlying layer (e.g., 27 b ) to be seen from the top side of the card. Lasering through the metal layer forms (or opens) a window exposing an underlying layer (e.g., 27 b ) which may be black or white or colored or be of any preset pattern.
  • an underlying layer e.g., 27 b
  • FIG. 11 illustrates that a window or opening can be formed by lasering the metal layer within core layer 20 to enable a preprinted image formed on an underlying layer (e.g., 27 b ) to be seen from the top side of the card.
  • lasering through the metal layer forms a window enabling the seeing or reading of a pre-printed pattern on an underlying layer (e.g., 27 b ).
  • FIG. 12 illustrates that a window or opening can be formed by lasering through the metal layer within core layer 20 to provide a “see-through” condition. That is, lasering through the metal layer forms a window which provides visibility through both sides (top and bottom) of the card. This may be viewed by applying a light source such as a flashlight in direct contact with one side of the card and viewing the light pattern on the other side.
  • a light source such as a flashlight

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)

Abstract

Composite cards embodying the invention include a clear plastic core layer with an embossed metalized pattern formed on top of, or within, the core layer. A selected number N of clear plastic layers are formed on top of the embossed metalized pattern and a like number N of clear plastic buffer layers are formed below the clear plastic core layer. The metalized pattern is centrally located with layers above and below the pattern to protect the pattern and inhibit the unauthorized alteration of the embossed metalized pattern while enabling the embossed metalized pattern to be visible. Selected ones of the N clear plastic layers include selected information and a window is formed within the pattern to enable the selected information to be seen.

Description

  • This application is a continuation application of my co-pending application Ser. No. 12/006,168 filed Dec. 31, 2007 and titled Foil Composite Card, the contents of which are incorporated herein by reference.
  • BACKGROUND OF THE INVENTION
  • The invention is directed to the manufacture of a multi-layered (composite) card, or any like instrument or document.
  • The term “card” or “cards” as used herein, and in the appended claims, is intended to include a large variety of documents and instruments such as a financial cards, identification (including a National ID or Driver's License) cards, electronic passport pages, gift cards, documents for holding permanent and long lasting records such as medical records or security cards, or other plastic cards used for promotion of a product or organization.
  • Various means of producing an improved composite card are disclosed in U.S. Pat. No. 6,644,552, titled Composite Card and issued to John Herslow, the applicant of this application, the teachings of which are incorporated herein by reference. However, there remains a demand for increasing the security of the cards (documents and/or instruments) being formed and used. For example, FIG. 4 of the '552 Patent, shows security elements formed in a top layer 17 and FIG. 6 of the '552 Patent discusses the addition of holographic material and other security indicia after the sheets are cut into standard cards.
  • Thus, to increase the security of a card, it is known to form holograms on the card. Generally, the holograms may be formed by a hot stamping method at, or near, the top (or bottom) surface (level) of the card. A disadvantage to so placing the holograms is that a counterfeiter may be able to alter the card without the tampering being readily apparent to someone examining or accepting the card. Also, positioning the hologram close to the top or the bottom surface of the card creates an asymmetry in its construction, whereby, when the temperature varies, different portions (layers) of the card may be placed under different degrees of tension and contraction resulting in stresses which tend to distort the card and/or the hologram (e.g., the card fails to remain flat). Still further, when the hologram is placed at, or near, the top or the bottom surfaces it may be easily and inadvertently scratched or marred.
  • Due to the highly sensitive nature of the “secure” cards, of interest, it is critical that they be made tamper resistant and sturdy and to last for a long time (e.g., more than 5 years) even where high temperature levels (hot or cold) and a high degree of humidity are encountered. It is also desirable that they be relatively inexpensive to fabricate and, very importantly, that the card be virtually impossible to be altered without destroying the card or the easy detection of the alteration.
  • SUMMARY OF THE INVENTION
  • Accordingly, composite cards formed in accordance with the invention include a security layer formed at the center, or core layer, of the cards. Cards embodying the invention may include a hologram or diffraction grating formed at, or in, the center, or core layer, of the card with symmetrical layers formed above and below the center or core layer.
  • A hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and vapor depositing a very thin layer of metal or metal compound (e.g., aluminum, zinc sulfide, etc.) on the embossed layer. Then, additional layers are selectively attached to the top and bottom surfaces of the core layer. In accordance with the invention, for each additional layer attached to the top surface of the core layer there is a corresponding like layer attached to the bottom surface of the core layer for producing a highly symmetrical structure (sandwich).
  • In accordance with one embodiment of the invention, all the layers are made of a clear synthetic (e.g., plastic) material, whereby the pattern formed on, or within, the core layer may be seen by looking down at the top of the card or by looking up at the bottom of the card.
  • The layer of metal or metal compound deposited on the core layer may be made very thin to provide a “see-through” effect, under appropriate light conditions. However, where the layer of metal or metal compound deposited on the core layer is of “standard” thickness, the pattern may only be seen from the top or the bottom side of the core.
  • After the hologram is formed, a laser may be used to remove selected portions of the metal formed on the embossed layer to impart a selected pattern or information to the holographic region. In accordance with the invention, this step in making a card or a set of cards may be performed when the card or cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
  • In accordance with the invention a hologram may be formed in the core portion of a card and if the hologram includes a metal layer, laser equipment may be used to modify and/or alter the metal pattern at selected stages in the process of forming the card. Alternatively, after the sheets are die-cut into cards, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image.
  • Embodiments of the invention may include the use of a polyester film, or any other carrier, which includes a metallic or a high refractive index (HRI) transparent holographic foil that is pre-laminated between two sheets of a material (which could be PVC, PET or other thermo-plastic resin) that has a thermo-plastic adhesive (which may have, but not necessarily has, been previously applied). The pre-laminated holographic foil can have an unlimited number of patterns and may also be configured to include one, or several individual, hologram designs repeated in rows and columns across an entire sheet. The holographic design may also have the appearance of full metal, or partial metal and partial white coverage (white reflecting hologram) on each individual card in the matrix. Utilizing this holographic foil pre-laminate in concert with standard plastic card materials, enables a plastic card manufacturer to produce “full-face” foil pattern design cards, or “full-face” registered hologram cards.
  • These cards would include the holographic foil pre-laminate as the center sheet in a standard card composition. Utilizing the center sheet composition with a metal layer, the subsequent plastic card could be laser engraved using a standard YAG laser or any other suitable laser, thus removing the metal or material coatings of the holographic layer in one or more of the following: an alpha numeric, barcode or graphic design. The end result is an inexpensive foil composite card that has a unique individualized holographic layer that has been permanently altered.
  • If a potential counterfeiter attempted to disassemble the card in order to compromise the integrity of the information contained on, or in, the card, it would cause a change in the hologram resulting in the hologram being irreparably damaged. Therefore, plastic cards formed in accordance with the invention are truly tamper resistant and are more secure foil cards than any of the known commercially available cards.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • In the accompanying drawings (which are not drawn to scale) like reference characters denote like components, and:
  • FIG. 1 is a cross sectional diagram of part of a card (instrument) embodying the invention;
  • FIG. 2 is a diagram detailing some of the steps in forming a card embodying the invention;
  • FIG. 2A is a diagram detailing the application of an embossing layer to a core layer to form a card embodying the invention;
  • FIG. 3 is a cross sectional diagram of part of a card embodying the invention where the core layer includes a transparent material having a high refractive index;
  • FIGS. 3a, 3b, 3c, 3d , are cross sectional diagrams of steps in forming a card embodying the invention;
  • FIG. 4 is a diagram of the cross section of part of a card embodying the invention to which a laser beam is applied to form an additional ablated pattern in a metal layer in accordance with the invention;
  • FIG. 5 is a diagram of a top view of a card including a holographic portion formed in accordance with the invention;
  • FIG. 6 is a cross sectional diagram of a card shown in FIG. 5 where all layers are made of clear (transparent) materials;
  • FIG. 6A is a cross sectional diagram of a card embodying the invention where one, or more, of the layers block the light;
  • FIG. 7 is a top view of a sheet containing an array of cards illustrating that a laser beam can be applied to all of the cards on the sheet;
  • FIG. 8 is a cross sectional diagram of a card with an integrated circuit (IC) chip and antenna embodying the invention;
  • FIG. 9 is a cross sectional diagram of a dual interface card embodying the invention;
  • FIG. 10 is a cross sectional diagram of a card with a lasered window embodying the invention;
  • FIG. 11 is a cross sectional diagram of another card with a lasered window embodying the invention; and
  • FIG. 12 is a cross sectional diagram of still another card with a lasered window embodying the invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 1, 2 and 2A, there is shown a core 20 comprised of a base layer 21 of a plastic material, which may be, for example, oriented polyester terephthalate (OPET) or polypropylene, or polystyrene, or any number of acrylics and/or a combination of these materials. The base layer 21 is shown to have an upper surface 21 a and a lower, or bottom, surface 21 b. For purpose of illustration, a pattern is shown to be formed on, or above, surface 21 a of layer 21. However it should be understood that, alternatively, the pattern could be formed on surface 21 b. Two different methods of forming a pattern are shown in FIGS. 2 and 2A. The surface 21 a of layer 21 in FIG. 2 is embossed with a diffractive or holographic pattern. In FIG. 2A, the surface 21 a of layer 21 is coated with an embossing layer 200 which is then embossed with a diffractive pattern, 200 a.
  • A layer 22 of aluminum (or any suitable metal or metal compound such as Zinc Sulfide) may then be vapor deposited on the diffraction pattern to form a hologram. The use of vapor deposition is very significant in that it permits a very thin layer 22, a few atoms thick, to be formed on surface 21 a and thus complete the formation of the hologram, using small amounts of metal. Using vapor deposition, the thickness of the layer can be made very thin so it is nearly transparent and can provide a “see-through ” effect. Alternatively, the metal layer can be made a little thicker so as to be more opaque.
  • As detailed in step 3 of FIG. 2, a clear adhesive primer layer 23 a, may be coated over the patterned and metalized top surface (21 a) and a similar clear adhesive primer layer 23 b may be coated over the bottom surface (21 b) of the layer 21. The core 20 is completed by attaching these clear adhering layer (23 a, 23 b) above and below the embossed base layer 21. The clear layer 23 a, 23 b, is a primer coating. It may be polyethylenamine or an acrylic based, or other, organic adhesive compound with solvent or water based carriers. The primer coatings 23 a, 23 b are fairly thin and yet fairly strong/sturdy. They also function to promote adhesion to layers 24 a, 24 b which are attached to the core 20.
  • As detailed in step 4 of FIG. 2 clear PE adhesive layers 24 a, 24 b may then be formed/attached to the top (outer) surfaces of their respectively layers 23 a, 23 b. Layers 24 a, 24 b may be of polyethylene (PE) material, or polypropylene (PP), or high density polypropylene (HDPP), or ethylene Vinyl Acetate (EVA), or any of the different forms of PET or any of like materials, or mixtures of these materials. The clear materials used to form layers 24 a, 24 b may contain other clear adhesion promoting compounds (e.g., ethyl acrylates, acrylic acid, etc.). The layers 24 a, 24 b may be fairly thick and function to attach to the thin embossed hologram layer and coatings of core 20. For handling purposes, buffer layers 25 a, 25 b may then be formed/attached to the top (outer) surfaces of layrs 24 a, 24 b to complete what is defined as subassembly 30. For example, buffer (carrier) layer (25 a, 25 b) may be laminated to the top and bottom of adhesive layers 24 a, 24 b. Subassembly 30, is thick enough to be handled by automatic credit card manufacturing equipment.
  • In one embodiment, the base layer 21 was approximately 0.002 inches thick and the adhesive backed layers (23 a, 23 b) were each made to be approximately 0.0001 to 0.0003 inches thick. In other embodiments the layers 23a, 23b could be made either thinner or much thicker.
  • In still other embodiments, adhesive layers can be coated over the buffer or carrier layer and the two (i.e., the carrier and buffer layers on each side of a holographic layer) can be combined with the holographic layer. That is, adhesive can be applied to either side of the carrier foil interface and then pre-laminated together (3 sheets laminated to become one laminate; i.e., the prelaminate prior to platen lamination. Thus, the carrier sheet can hold the sub-assemblies for transfer to substrates for forming cards.
  • Examining FIG. 2 in greater detail note some of the steps used in forming the core 20.
  • As shown, for example, in step 1, the base component may be a sheet 21 of plastic (e.g., PET or OPET or polypropylene, or polystyrene, or polymethyl, methacrylate, etc. . . . ) material whose thickness typically ranges from 0.0005 inches to more than 0.005 inches. In one embodiment layer 21 was made, for example, 0.002 inches thick.
  • Then, as shown in step 2A, which may be termed an embossing step, a diffraction pattern may be formed on one side of layer 21. A diffraction pattern may be formed directly in the plastic layer 21 by embossing (e.g., stamping) pattern(s) therein. Forming the pattern in a sheet of plastic (or in an embossing layer, as discussed below) is easier and less wearing on the embossing (stamping) equipment than forming a like pattern in a metal layer.
  • Then, as shown in step 2B a hologram is formed on one surface (21 a) of plastic sheet 21 by vapor deposition of a metal layer (e.g., aluminum onto the diffraction patter. Thus, the hologram may be formed by embossing the top surface 21 a to form a diffraction pattern and then metallizing the pattern. The surface 21 a may be coated by the vapor deposition of aluminum (or similar light reflective materials such as nickel, silver, zinc, or other like materials). A significant advantage of using vapor deposition (although many other methods may be used) is that very small amounts of the metal (light reflective material) need to be used to form the hologram resulting in a significant savings in the cost of manufacturing the card (or instrument). Also, very thin layers allow a controllable amount of light to pass through. This enables the manufacture of a card, or document, in which an image (hologram) formed on a card is reflected (i.e., is visible) while also enabling a viewer to “see-through” the image.
  • Then, as shown in step 3 of FIG. 2, clear adhesive or “primer” coats 23 a, 23 b may be applied to the top and bottom surfaces 21 a, 21 b, respectively, of plastic sheet 21. The primer coat also functions to fill in the ridges resulting from the formation of the diffraction grating. The clear layers 23 a, 23 b which may be of the type described above, may be attached to the top and bottom surfaces of “embossed” plastic sheet 21 on which the aluminum has been vapor deposited. Primer layers 23 a, 23 b may be attached to base layer 21 by any one of a number of methods, such as, for example, gravure coating, roller coating, flexography or other like methods. The primer secures the bond to both sides of the holographic sheet (the embossed side and the blank side). This completes the formation of what is defined herein as the core assembly 20.
  • Then, as shown in step 4 of FIG. 2, the PE layers 24 a, 24 b, or any other suitable layer, as noted above, which function as an additional buffer between that bond and the outer buffer layers 25 a, 25 b are attached to the core assembly. The PE layers 24 a, 24 b may also include an adhesive which promotes adhesion to the clear primer layers 23 a, 23 b attached to the top and bottom surfaces of layer 21. Layers 24 a, 24 b, 25 a, 25 b may be attached to each other and to the underlying layers by any one of a number of methods such as, for example, platen lamination, hot roll lamination, liquid adhesive lamination.
  • Thus, as shown in step 4 of FIG. 2, a clear buffer layer 25 a is attached to the PE layer 24 a and a clear buffer layer 25 b is attached to the PE adhesive layer 24 b. All of layers 24 a and 24 b and layers 25 a, 25 b function as buffers, providing additional strength to the structure and at the same time protecting the hologram from being damaged or tampered with. Adding layers 25 a and 25 b completes the sub-assembly 30 which may then be customized to form cards with additional information.
  • By forming the hologram at, and within, the core level, the hologram will not be easily, or inadvertently, damaged since several additional layers will be attached to the top and bottom of the holographic layer. It is also not subject to easily being tampered or altered. Forming the hologram at the center of the structure minimizes the possibility of tampering while fully protecting the hologram. Another significant advantage of forming the hologram at the core of the structure is that the top and bottom surfaces stay flat due to equal shrinking and/or expansion of all the layers. Note that the card structure is formed so as to be symmetrical about the core layer.
  • FIG. 2A illustrates another method of forming the hologram. As shown in Step 1A of FIG. 2A, a clear embossing layer 200 may be coated directly over a layer 21 (or 210). Alternatively, a primer coating may be formed on layer 21/210 and then the embossing layer 200 may attached/formed to the primer coating. The embossing layer may be composed, for example, of siloxane, acrylic, vinyl, linear polyester, urethane or any like materials and may be several (e.g., less than 0.5 to more than 5) microns thick. The embossing layers may also be deposited as liquids and radiation cured, possibly in two steps—first as a soft easily embossable coating which then becomes hard and impervious. As shown in step 2A of FIG. 2A, a diffraction pattern is embossed (formed) in the embossing layer/coating 200 to form a desired pattern. Forming a pattern in the embossing layer may be desirable since it is even easier and less wearing on the embossing (stamping) equipment than forming a like pattern directly in the PET layer (as per FIG. 2). After the pattern is embossed on and within the embossing layer 200, the sheet may be processed as per steps 2B, 3 and 4 shown in FIG. 2.
  • [Note that a hologram may be formed by, for example, embossing a pattern in a carrier base material (e.g., a hard polyester) or by embossing the pattern in a coating previously applied to the carrier base material, or by embossing the pattern in a metal which was previously deposited onto the base carrier material or by depositing the metal onto a soft coating and then embossing.]
  • Referring back to FIG. 1, note that the core 20 may be part of a subassembly 30 which includes attaching layers 24 a, 24 b of clear PE and buffer layers 25 a, 25 b to the top and bottom surfaces of the core 20. Layers 25 a, 25 b, may range in thickness from 0.001 to 0.005 inches, or more, and may be composed of PVC like materials.
  • The subassembly 30 may then be used to form a card, or any instrument, by attaching a layer 27 a, 27 b of clear or white PVC material to the top and bottom surfaces of the subassembly 30. As illustrated in FIG. 1, information can be printed either on the outer surface (the surface facing away form the core) of layers 27 a, 27 b or on the inner surface or both. The printed information may include, for example, fixed data fields and advertising, and/or any other desired information. The card (or instrument) may be completed by adding clear PVC laminating films 29 a, 29 b to the top and bottom surfaces of the card.
  • FIG. 3 is a cross-sectional diagram (not to scale) of a card embodying the invention. FIG. 3 includes a core comprised of a layer 210 which may be (but not be) of the same material as layer 21. In FIG. 3, the top surface 210 a of layer 210 is embossed with a diffraction pattern giving a unique pattern to the structure. A high refractive index (HRI) layer 212 can then be vapor deposited on the embossed layer. Due to the HRI property of layer 212, there is no need to further metallize the layer. The HRI layer may be formed of zinc sulfide or zinc oxide or any material having like properties. Clear primer layer 23 a is attached to the top of HRI layer 212 overlying layer 210 and primer layer 23 b is attached to the bottom of layer 210.
  • Then, as shown in FIG. 1, clear layers 24 a and 24 b, which may be of PE or any other suitable materials, are attached to layers 23 a and 23 b, respectively and additional layers (25 a, 25 b) of clear (translucent) material may be attached to the top and bottom layers of layers 24 a, 24 b to form the subassembly 30. Additional layers 27 a, 27 b may be attached to the top and bottom layers of the sub-assembly. Information may be written or printed in any known manner on, or in, the layers 27 a, 27 b. Subsequently, laminating films 29 a, 29 b, may be attached to the top and bottom intermediate layers 27 a, 27 b to produce a card 40 whose core contents can not be altered without essentially destroying the card.
  • FIGS. 3A, 3B, 3C, 3D and 3E illustrate the forming/coating of an embossing layer 200 on stock (e.g., PET) material 210 (FIG. 3A), then embossing layer 200 with a diffraction pattern 200 a (FIG. 3B), then vapor depositing an HRI layer 212 a on the diffraction pattern (FIG. 3C), then coating clear primer layers 23 a, 23 b above layer 212 a and below layer 210 (FIG. 3D) to form a core assembly 20. Then clear PE adhesive layer 24 a is formed above prime layer 23 a and clear PE adhesive layer 24 b, is formed below layer 23 b (FIG. 3E). Note that the steps and thicknesses of the layers to form the basic structures discussed above are summarized in Table I, below.
  • FIG. 4 includes a cross-sectional diagram (not to scale) of a portion of a card embodying the invention, which may be part of a sheet (not shown) on which a large number of cards are formed, and depicts a piece of laser equipment 410 for “lasering” (e.g., engraving or vaporizing) metal layer 22. The core assembly 20 is shown to have a layer 22 of aluminum deposited and embossed as discussed for FIGS. 1, 2, and 2A, above. Portions of the metal layer may be vaporized (see sections 401 a, 401 b, 401 c) by the laser equipment 410 such that portions of the metal are selectively removed or “ablated” by “lasering” (e.g., eliminating or vaporizing) the metal to form any number of different patterns (e.g., graphic as well as alpha numeric information may be generated). The clear layers 29 a, 27 a, 25 a and 24 a may be selected to be transparent to the laser wavelength. Consequently, the laser beam can pass through the clear layers of the card to “write” on the holographic layer below the top surface of the card. The laser 410 may be applied at several different stages of the card manufacturing process to form the desired patterns. Thus, the laser may be applied to “write” on the metal layer after the core 20 is formed and before the attachment of the carrier layers 24 a, 24 b and 25 a, 25 b. Alternatively, the laser 410 may be applied to form the desired pattern in the metal layer after the layers 24 a, 24 b, and 25 a, 25 b are attached to the core layer, and before layers 27 a and 27 b are attached. Still further, the laser may be applied to form the desired pattern in the metal layer after the layers 27 a, 27 b are attached and before the layer 29 a, 29 b, are attached. Finally, the laser may be applied to form the desired pattern in the metal layer after the layers 29 a, 29 b are attached, when the cards may be part of a full sheet or in individual card shape.
  • FIG. 5 shows a top view of a card 100 illustrating that the hologram may be located within a designated window or area 101, shown in portion 601. Alternatively the hologram may extend the full length and/or width of the card 100. Note that alpha numeric information may be produced by lasering within the holographic layer (e.g., layer 22 in FIG. 4 shown in portion 602). Also, alpha numeric information may be produced by printing information on, or within, layers 27 a, 27 b, as discussed above.
  • FIG. 6 is a cross-sectional diagram (not to scale) of card 100 of FIG. 5 and is intended to show that the layers above and below the holographic layer, 21, 22/212, may be transparent or translucent to yield a “see-through” card with the hologram portion 601 and the lasered portion 602 being visible from the top side or from the bottom side of the card. Note that if layers 27 a, 27 b are made of a white material a bright light may be needed to observe the “see-through” effect.
  • FIG. 6A is a cross-sectional diagram (not to scale) intended to show that the layers above the holographic layer 21, 22/212, may be transparent or translucent so the holographic pattern may be seen from the top. At the same time, one or more of the layers below the holographic layer (e.g., 27 b or 29 b) may be opaque so as to block the hologram from being seen from the bottom. Making the top portion of the card transparent and the bottom portion opaque is by way of illustration and the reverse could be done instead.
  • FIG. 7 shows the application of a laser beam generated by laser equipment 410 to a sheet 5 containing a large array of cards 100 in sheet form embodying the invention. The laser may be applied to the entire sheet of cards which may be at the core stage, the sub-assembly stage, or any of the stages thereafter. Being able to apply the laser beam in this manner, at any time before the cards are separated from a sheet, is economically advantageous and saves much in the cost of handling and also adds significant additional security.
  • FIG. 8 illustrates that cards embodying the invention, shown in the various figures, may be modified by the addition of a semiconductor chip containing selected electronic circuits (an integrated circuit, IC) within the body of the card in, or within, a layer 30 dedicated to include an antenna carrier, with the antenna being connected to the chip module. This enables the manufacture of a radio frequency identification (RFID) card. Note that the metal layer 22/212 can act as a radio frequency shield to reduce reception from that side of the RFID antenna.
  • FIG. 9 illustrates that the chip (IC) and an antenna and carrier may be formed within a layer of the card and that, in addition, the chip may be accessed (read) by providing an external contact 901 along one side of the card. This type of card may be referred to as a dual interface card since it enables information on the card to be read or written via RFID and contact.
  • FIG. 10 illustrates that a window or opening can be formed by lasering through the metal layer within core layer 20 to enable the color or pattern of an underlying layer (e.g., 27 b) to be seen from the top side of the card. Lasering through the metal layer forms (or opens) a window exposing an underlying layer (e.g., 27 b) which may be black or white or colored or be of any preset pattern.
  • FIG. 11 illustrates that a window or opening can be formed by lasering the metal layer within core layer 20 to enable a preprinted image formed on an underlying layer (e.g., 27 b) to be seen from the top side of the card. Here again lasering through the metal layer forms a window enabling the seeing or reading of a pre-printed pattern on an underlying layer (e.g., 27 b).
  • FIG. 12 illustrates that a window or opening can be formed by lasering through the metal layer within core layer 20 to provide a “see-through” condition. That is, lasering through the metal layer forms a window which provides visibility through both sides (top and bottom) of the card. This may be viewed by applying a light source such as a flashlight in direct contact with one side of the card and viewing the light pattern on the other side.
  • TABLE I
    Example of Steps and materials in forming core, sub assembly and card
    step I II III IV
    1 Start with Start with Start with Start with base/central
    base/central layer base/central base/central layer 21/210
    21 of PET/OPET layer 21/210 layer 21 of of PET/OPET material
    material of PET/OPET PET/OPET
    material material
    1A Deposit Deposit embossing layer
    embossing 200 on one surface of
    layer 200 on layer 21/210
    one surface of
    layer 21/210
    2 Emboss one surface Emboss top Emboss one Emboss top surface of
    of base layer 21 with surface of surface of base embossing layer 200
    pattern embossing layer 21 with with pattern 200a
    layer 200 with pattern
    pattern
    200a
    3 Vapor deposition of Vapor Vapor Vapor deposition of HRI
    metal
    22 on pattern deposition of deposition of coating 212 on pattern
    metal
    22 on HRI coating 212
    pattern on pattern
    4 Apply clear primer Apply clear Apply clear Apply primer clear coats
    coats 23a, 23b to primer coats primer coats 23a, 23b to top and
    top and bottom 23a, 23b to top 23a, 23b to top bottom Where primer
    Thickness: and bottom and bottom coat 23a, 23b
    .00002-.0002 Thickness: Thickness: Thickness:
    .00002-.0002 .00002-.0002 .00002-.0002
    5. Form clear PE Form clear PE Form clear PE Form clear PE adhesive
    adhesive layers 24a, adhesive layers adhesive layers layers 24a, 24b fairly
    24b-fairly thick, 24a, 24b fairly 24a, 24b fairly thick, sticky
    sticky thick, sticky thick, sticky Thickness:
    Thickness: Thickness: Thickness: .0005-.005
    .0005-.005 .0005-.005 .0005-.005
    6. Form clear buffer Form clear Form clear Form clear buffer layer
    layer
    25a, 25b of buffer layer buffer layer 25a, 25b of PVC material
    PVC material
    25a, 25b of 25a, 25b of thickness
    thickness PVC material PVC material .0008-.005
    .0008-.005 thickness thickness
    .0008-.005 .0008-.005
    7. Form clear white Form clear Form clear Form clear white PVC
    PVC layer white PVC white PVC layer white PVC layer layer 27a, 27b
    layer
    27a, 27b 27a, 27b 27a, 27b Thickness .004 to .012
    Thickness .004 to Thickness .004 Thickness .004
    .012 to .012 to .012
    8. Form PVC Form PVC Form PVC Form PVC laminating
    laminating film
    29a, laminating film laminating film film 29a, 29b
    29b
    29a, 29b 29a, 29b Thickness .0008 to .005
    Thickness .0008 to Thickness Thickness
    .005 .0008 to .005 .0008 to .005
    All dimensions in inches

Claims (16)

What is claimed is:
1. An assembly for forming a document comprising:
a clear plastic core layer having first and second, spaced apart, surfaces, extending generally parallel to each other;
a pattern embossed on, or in, said first surface of the dear plastic core layer;
a metal or a metal compound vapor deposited on the embossed pattern to form an embossed metalized pattern whereby light incident on the embossed metalized pattern produces a reflected light pattern corresponding to the embossed metalized pattern and wherein the vapor deposited metal, or metal compound, forms a layer which is thin enough to allow see-through; and
a selected number N of clear plastic layers formed on top of the embossed metalized pattern and a like number N of clear plastic buffer layers formed below the second surface of the clear plastic core layer; where N is an integer equal to, or greater than, one; said selected layers for forming a document having an embossed metalized pattern located along said first surface of the clear plastic core layer so as to be centrally located relative to a direction perpendicular to said first and second surfaces of the clear plastic core layer and protected and also for inhibiting the unauthorized alteration of the embossed metalized pattern while enabling the embossed metalized pattern to be visible; and
wherein selected ones of said N clear plastic layers include selected information; and wherein a window is formed within the pattern to enable the selected information to be seen.
2. An assembly for forming a document as claimed in claim 1, wherein the embossed metalized pattern is a customized pattern and wherein said selected number N of clear plastic layers includes a first clear plastic buffer layer attached to the top surface of the embossed metalized pattern via a first clear adhesive layer; where the top surface of the embossed metalized pattern is defined as the portion of the embossed metalized pattern away from the first surface of the clear plastic core layer; and a corresponding second clear plastic buffer layer attached to the second surface of the clear plastic core layer via a second clear adhesive layer; wherein the first and second clear plastic buffer layers have a predetermined thickness and wherein the first and second clear plastic buffer layers are of similar predetermined thickness; and wherein the first and second clear adhesive layers each have a certain thickness and wherein the first and second clear adhesive layers are of approximately the same certain thickness; and
a third clear plastic layer on which information may be selectively written attached to the first clear plastic layer and a fourth clear plastic layer on which information may be selectively written attached to the second clear plastic layer.
3. An assembly for forming a document as claimed in claim 1 wherein the embossed metalized pattern is customized by application of a laser beam.
4. An assembly for forming a document as claimed in claim 1, wherein the embossed metalized pattern is formed on, or in, said first surface of the clear plastic core layer.
5. An assembly for forming a document as claimed in claim 4, wherein the embossed metalized pattern formed on, or in, the first surface of the clear plastic core layer includes a layer of metal vapor deposited on the embossed layered pattern to form a hologram viewable when light is incident on said first surface of the clear plastic core layer; and the layer of the vapor deposited metal is thin enough to enable light to be seen when viewed through the second surface of the clear plastic core layer.
6. An assembly for forming a document as claimed in claim 4, wherein the embossed metalized pattern formed on the surface of the core clear plastic layer includes a metal compound having a high refraction index vapor deposited on the pattern to refract the light incident on the embossed metalized pattern.
7. An assembly for forming a document as claimed in claim 1, wherein the pattern is formed on said first surface of the clear plastic core layer by first depositing an embossing layer on the first surface of the clear plastic core layer and then embossing a desired pattern within the embossing layer.
8. An assembly for forming a document as claimed in claim 7, wherein a layer of metal is vapor deposited on the desired pattern embossed within the embossing layer for forming a hologram viewable when light is incident on said first surface of the clear plastic core layer; and the layer of metal is thin enough to enable light to be seen when viewed through the second surface of the clear plastic core layer.
9. An assembly for forming a document as claimed in claim 7, wherein a metal compound having a high refractive index is vapor deposited on the desired pattern.
10. An assembly for forming a document as claimed in claim 1, wherein said vapor deposited metal, or metal compound, is a few atoms thick so as to be sufficiently thin to allow light to pass through all the layers for enabling see-through while at the same time enabling a visible image to be reflected.
11. An assembly for forming a document as claimed in claim 2, further including a fifth layer attached to the third layer and a sixth layer attached to the fourth layer, and wherein portions of the fifth or sixth layers include printed information.
12. An assembly for forming a document as claimed in claim 2, further including additional layers attached to the third and fourth layers, and wherein portions of selected ones of said additional layers include printed information.
13. An assembly for forming a document as claimed in claim 2, further including additional layers attached to the third and fourth layers, and wherein a selected one of said additional layers includes an integrated circuit (IC) and an antenna for enabling information to be stored in the IC and to be received and transmitted.
14. An assembly for forming a document as claimed in claim 2, further including additional layers attached to the third and fourth layers, and wherein a selected one of said additional layers includes an integrated circuit (IC) and an antenna for enabling information to be stored in the IC and to be received and transmitted; and further including an opening on one side of the assembly for accessing the IC.
15. An assembly for forming a document as claimed in claim 2, further including additional layers attached to the third and fourth layers, and wherein selected ones of said additional layers include at least one of selected information and patterns; and wherein portions of the metal or metal compound vapor deposited on the embossed metalized pattern are removed to enable the selected information and patterns to be seen.
16. An assembly for forming a document as claimed in claim 1, wherein said pattern is customized by applying a laser beam to the pattern.
US15/356,586 2007-12-31 2016-11-19 Foil composite card Abandoned US20170069581A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/356,586 US20170069581A1 (en) 2007-12-31 2016-11-19 Foil composite card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/006,168 US9542635B2 (en) 2007-12-31 2007-12-31 Foil composite card
US15/356,586 US20170069581A1 (en) 2007-12-31 2016-11-19 Foil composite card

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/006,168 Continuation US9542635B2 (en) 2007-12-31 2007-12-31 Foil composite card

Publications (1)

Publication Number Publication Date
US20170069581A1 true US20170069581A1 (en) 2017-03-09

Family

ID=40798798

Family Applications (5)

Application Number Title Priority Date Filing Date
US12/006,168 Active 2035-08-07 US9542635B2 (en) 2007-12-31 2007-12-31 Foil composite card
US14/183,868 Active 2028-10-16 US10373920B2 (en) 2007-12-31 2014-02-19 Foil composite card
US15/355,018 Active 2028-10-11 US10332846B2 (en) 2007-12-31 2016-11-17 Foil composite card
US15/356,586 Abandoned US20170069581A1 (en) 2007-12-31 2016-11-19 Foil composite card
US16/452,740 Active US11367693B2 (en) 2007-12-31 2019-06-26 Foil composite card

Family Applications Before (3)

Application Number Title Priority Date Filing Date
US12/006,168 Active 2035-08-07 US9542635B2 (en) 2007-12-31 2007-12-31 Foil composite card
US14/183,868 Active 2028-10-16 US10373920B2 (en) 2007-12-31 2014-02-19 Foil composite card
US15/355,018 Active 2028-10-11 US10332846B2 (en) 2007-12-31 2016-11-17 Foil composite card

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/452,740 Active US11367693B2 (en) 2007-12-31 2019-06-26 Foil composite card

Country Status (1)

Country Link
US (5) US9542635B2 (en)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090033495A1 (en) * 2007-08-03 2009-02-05 Akash Abraham Moldable radio frequency identification device
US9542635B2 (en) 2007-12-31 2017-01-10 Composecure, Llc Foil composite card
DE102009009263A1 (en) * 2009-02-17 2010-08-19 Giesecke & Devrient Gmbh A method of making a window-containing final layer for a portable data carrier and final layer
US10479130B2 (en) 2009-07-24 2019-11-19 Composecure, L.L.C. Card with embedded image
DE102010034039A1 (en) * 2010-08-11 2012-02-16 Bundesdruckerei Gmbh Method for producing a film for a security and / or value document
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US10457018B2 (en) * 2010-11-15 2019-10-29 Illinois Tool Works Inc. Decorative and/or secure element for homogeneous card construction
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9697459B2 (en) 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US9251458B2 (en) 2011-09-11 2016-02-02 Féinics Amatech Teoranta Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10867235B2 (en) 2011-08-08 2020-12-15 Féinics Amatech Teoranta Metallized smartcard constructions and methods
US9836684B2 (en) 2014-08-10 2017-12-05 Féinics Amatech Teoranta Smart cards, payment objects and methods
KR20140117614A (en) 2012-01-23 2014-10-07 페이닉스 아마테크 테오란타 Offsetting shielding and enhancing coupling in metallized smart cards
US8857722B2 (en) 2012-07-20 2014-10-14 CPI Card Group—Colorado, Inc. Weighted transaction card
US10032099B2 (en) 2012-07-20 2018-07-24 CPI Card Group—Colorado, Inc. Weighted transaction card
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10783426B2 (en) 2012-08-30 2020-09-22 David Finn Dual-interface metal hybrid smartcard
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
EP2722191B1 (en) * 2012-10-18 2015-05-06 Bundesdruckerei GmbH Identity card with physical unclonable function
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
ES2750216T3 (en) * 2013-02-13 2020-03-25 Composecure Llc Durable card
EP2784724A3 (en) 2013-03-27 2015-04-22 Féinics AmaTech Teoranta Selective deposition of magnetic particles, and using magnetic material as a carrier medium to deposit other particles
WO2014200515A1 (en) * 2013-06-12 2014-12-18 Composecure, Llc Plastic cards with high density particles
US9070053B2 (en) 2013-10-25 2015-06-30 CPI Card Group—Colorado, Inc. Multi-metal layered card
WO2015071017A1 (en) 2013-11-13 2015-05-21 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
CN105793872B (en) 2013-11-18 2019-01-01 安全创造有限责任公司 Card with metal layer and antenna
JP6680767B2 (en) 2014-05-22 2020-04-15 コンポーズキュア,リミティド ライアビリティ カンパニー Transaction and ID card with selected texture and color
US20160271460A1 (en) * 2014-08-08 2016-09-22 Dunlop Sports Co., Ltd. Patterned weighted tape for use on golf club
US10783422B2 (en) 2014-11-03 2020-09-22 Composecure, Llc Ceramic-containing and ceramic composite transaction cards
CN105740165A (en) 2014-12-10 2016-07-06 国际商业机器公司 Method and apparatus for managing file system of unified storage system
WO2016106251A2 (en) 2014-12-23 2016-06-30 Composecure, Llc Smart metal card with radio frequency (rf) transmission capability
US10127488B2 (en) * 2014-12-30 2018-11-13 Qvivr, Inc. Systems and methods for creating dynamic programmable magnetic stripes
US9390363B1 (en) 2015-03-05 2016-07-12 Composecure, Llc Cards with special texture and color
WO2017210305A1 (en) 2016-06-01 2017-12-07 Cpi Card Group - Colorado, Inc. Ic chip card with integrated biometric sensor pads
DE102016009440A1 (en) * 2016-08-03 2018-02-08 Giesecke+Devrient Currency Technology Gmbh Method for producing a security element
CN108023013B (en) * 2016-11-01 2021-02-26 苏州贝骨新材料科技有限公司 Preparation method of piezoelectric film sensor
US10163050B2 (en) * 2016-11-29 2018-12-25 Capital One Services, Llc Wood inlay card and method for making the same
US10583683B1 (en) 2017-02-03 2020-03-10 Federal Card Services, LLC Embedded metal card and related methods
EP3582973B1 (en) 2017-02-14 2023-06-28 CPI Card Group - Colorado, Inc. Edge-to-edge metal card and production method
EP3602680B1 (en) 2017-03-29 2024-01-17 Féinics AmaTech Teoranta Smartcard with coupling frame antenna
EP3762871B1 (en) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metal card
US20220055394A1 (en) * 2018-12-17 2022-02-24 Linxens Holding A pre-laminate for a datapage of a security document and method of forming the same
US11347993B2 (en) 2019-08-12 2022-05-31 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US11416728B2 (en) 2019-08-15 2022-08-16 Federal Card Services, LLC Durable dual interface metal transaction cards
US20210049431A1 (en) 2019-08-14 2021-02-18 Federal Card Services, LLC Metal-containing dual interface smartcards
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US11106961B2 (en) * 2019-10-09 2021-08-31 Beauiiful Card Corporation Mini smart card and method of manufacturing the same
US11455507B2 (en) 2019-10-13 2022-09-27 Federal Card Services, LLC Metal transaction cards containing ceramic having selected coloring and texture
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
CN110956247B (en) * 2019-11-29 2024-02-23 金邦达有限公司 Manufacturing method of electric aluminum PVC smart card with three-dimensional pattern
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
EP3939803B1 (en) * 2020-09-29 2024-05-08 Hueck Folien Gesellschaft m.b.H. Polymer substrate for producing polymer valuable documents or polymer security documents

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492370A (en) * 1991-03-22 1996-02-20 De La Rue Holographics Ltd. Decorative article
US5895909A (en) * 1995-10-19 1999-04-20 Kabushiki Kaisha Nippon Conlux Card and device for processing of same
US6644552B1 (en) * 2002-07-09 2003-11-11 John Herslow Composite card
US20040003185A1 (en) * 2002-01-24 2004-01-01 Efland Gregory H. Method and system for synchronizing processor and DMA using ownership flags

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354851A (en) 1977-02-17 1982-10-19 United States Gypsum Company Method for making a decorated, water-resistant, rigid panel and the product made thereby: transfer dye process onto rigid panel
US4202811A (en) 1978-06-21 1980-05-13 Dow Corning Corporation Siloxane-epoxy molding compound with improved crack resistance
DE3151407C1 (en) 1981-12-24 1983-10-13 GAO Gesellschaft für Automation und Organisation mbH, 8000 München ID card and process for its manufacture
US4469725A (en) 1982-09-14 1984-09-04 Fis Organisation Ag Identification card
KR860009325A (en) 1985-05-07 1986-12-22 기다지마 요시도시 Transparent Hologram
EP0339763A3 (en) 1988-04-28 1990-04-25 Citizen Watch Co. Ltd. Ic card
AU615582B2 (en) 1988-11-10 1991-10-03 Kyodo Printing Co., Ltd. Optical card
US6938825B1 (en) 1989-04-24 2005-09-06 Ultracard, Inc. Data system
JP2802520B2 (en) 1989-10-20 1998-09-24 共同印刷株式会社 Sealed optical card
US5316791A (en) 1993-01-21 1994-05-31 Sdc Coatings Inc. Process for improving impact resistance of coated plastic substrates
US6254951B1 (en) 1994-09-27 2001-07-03 Thomas A. Marmalich Flexible wood fabric and method of manufacture
DE19642040C1 (en) 1996-10-11 1998-01-15 Schreiner Etiketten Label with hologram, written by laser beam passing through clear, protective upper film
CN1172141A (en) 1997-07-21 1998-02-04 天津博苑高新材料有限公司 Water-base laminated oil for making PVC card
US6296188B1 (en) 1999-10-01 2001-10-02 Perfect Plastic Printing Corporation Transparent/translucent financial transaction card including an infrared light filter
US8397998B1 (en) 1999-10-23 2013-03-19 Ultracard, Inc. Data storage device, apparatus and method for using same
WO2001045939A1 (en) * 1999-12-20 2001-06-28 Applied Extrusion Technologies Holographic films
US7101644B2 (en) 2000-06-23 2006-09-05 Dai Nippon Printing Co., Ltd. Hologram transfer foil
WO2002004207A1 (en) 2000-07-11 2002-01-17 Pergo Ab A process for the manufacturing of an improved decorative laminate and a decorative laminate obtained by the process
GB0025886D0 (en) 2000-10-23 2000-12-06 Murray Nicholas J Method and apparatus for producing a transfer image and method and apparatus for transfering a coating
US6923378B2 (en) 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
JP2002260290A (en) 2001-03-02 2002-09-13 Tokyo Magnetic Printing Co Ltd Optical card and its manufacturing method
ATE403912T1 (en) * 2001-06-19 2008-08-15 Nippon Carbide Kogyo Kk RETROREFLECTIVE PRODUCT IN WHICH AN INTEGRATED CIRCUIT IS SEALED
US6586078B2 (en) 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
US6821592B2 (en) 2001-07-31 2004-11-23 Avery Dennison Corporation Conformable holographic labels
US6589642B1 (en) * 2001-12-21 2003-07-08 Kloeckner Pentaplast Of America, Inc. Three part high moisture barrier for packages
CN1316421C (en) 2001-12-24 2007-05-16 数字Id系统有限公司 Laser engraving methods and compositions, and articles having laser engraving thereon
CN100507092C (en) 2002-03-25 2009-07-01 株式会社荏原制作所 Electrolytic processing apparatus and electrolytic processing method
JP4062728B2 (en) * 2002-07-02 2008-03-19 コニカミノルタホールディングス株式会社 IC card
US7116420B2 (en) 2002-11-21 2006-10-03 The Sherwin-Williams Company Method of color matching wood stains
US7063924B2 (en) * 2002-12-20 2006-06-20 Eastman Kodak Company Security device with patterned metallic reflection
JP4365326B2 (en) 2003-01-03 2009-11-18 アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー, インコーポレイテッド Transaction card including metal and method of making the same
US7566001B2 (en) * 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US7364085B2 (en) 2003-09-30 2008-04-29 Digimarc Corporation Identification document with printing that creates moving and three dimensional image effects with pulsed illumination
WO2005045770A2 (en) 2003-10-27 2005-05-19 Veritec, Inc. Licensing and identification devices having coded marks and methods of making and authenticating such licensing and identification devices
US20050196604A1 (en) 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
US7503503B2 (en) 2004-05-06 2009-03-17 Giesecke & Devrient Gmbh Card laminate
JP4666575B2 (en) 2004-11-08 2011-04-06 東京エレクトロン株式会社 Manufacturing method of ceramic sprayed member, program for executing the method, storage medium, and ceramic sprayed member
KR20040111317A (en) 2004-12-11 2004-12-31 주식회사 필톤 Electronic card and the manufacturing method having antibiotic function
US20060172136A1 (en) 2005-02-01 2006-08-03 Takashi Komori Coated member
ITRM20050074A1 (en) 2005-02-18 2006-08-19 Shock Line Di Coppola M & C S MIXTURE TO BE USED FOR THE PRODUCTION OF TRANSFERABLE TO DECALCOMANIA, A TRANSFERABLE PRODUCT FOR DECAL SCALE AND ITS PROCESS OF PRODUCTION, AND PROCEDURE OF DECALING USER SUCH A TRANSFERABLE PRODUCT.
US7287704B2 (en) 2005-05-03 2007-10-30 Composecure, Llc Laser markable secure documents
US20060292946A1 (en) 2005-06-22 2006-12-28 Perfect Plastic Printing Corporation Financial Transaction Card With Embedded Fabric
CN101258010B (en) 2005-09-29 2011-03-30 奥林巴斯株式会社 Method of processing wood and compressed wood product
US20070089831A1 (en) 2005-10-17 2007-04-26 Celerino Florentino Card with hologram formed over magnetic strip
EP2016539A4 (en) 2006-05-11 2010-06-09 Singular Id Pte Ltd Method of identifying an object, an identification tag, an object adapted to be identified, and related device and system
DE102006034854A1 (en) 2006-07-25 2008-01-31 Ovd Kinegram Ag A method for generating a laser mark in a security document and such a security document
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US20080164307A1 (en) 2007-01-05 2008-07-10 Microsoft Corporation Performing transactions with universal transaction card
US8283577B2 (en) 2007-06-08 2012-10-09 Dai Nippon Printing Co., Ltd. Printed matter and its manufacturing method, and electromagnetic shielding material and its manufacturing method
US9542635B2 (en) 2007-12-31 2017-01-10 Composecure, Llc Foil composite card
US8917302B2 (en) 2008-02-25 2014-12-23 International Business Machines Corporation Apparatus and method to display information using an information layer laminate
KR101004843B1 (en) 2008-09-05 2010-12-28 삼성전기주식회사 Ceramic multi-layer circuit substrate and manufacturing method thereof
US10479130B2 (en) 2009-07-24 2019-11-19 Composecure, L.L.C. Card with embedded image
US8725589B1 (en) 2009-07-30 2014-05-13 Jpmorgan Chase Bank, N.A. Methods for personalizing multi-layer transaction cards
US8393547B2 (en) 2009-08-05 2013-03-12 Perfect Plastic Printing Corporation RF proximity financial transaction card having metallic foil layer(s)
US20110079344A1 (en) 2009-10-03 2011-04-07 Victor Shi-Yueh Sheu Method for making a thin film having a metallic pattern layer
GB0919014D0 (en) 2009-10-30 2009-12-16 3M Innovative Properties Co Soll and stain resistant coating composition for finished leather substrates
PT2338940T (en) 2009-12-23 2016-11-21 Silicalia S L Composition for coating
US8944810B2 (en) 2010-02-02 2015-02-03 Composecure, Llc Metal card
BE1019331A5 (en) 2010-05-10 2012-06-05 Flooring Ind Ltd Sarl FLOOR PANEL AND METHODS FOR MANUFACTURING FLOOR PANELS.
EP2585875B1 (en) 2010-06-28 2016-06-29 Toray, Plastics (America), Inc. Releasable metalized embossed transfer film
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8469281B2 (en) 2010-09-07 2013-06-25 Identive Group, Inc. RFID label with shielding element
KR102012526B1 (en) 2011-01-28 2019-08-20 크레인 앤 코, 인크 A laser marked device
DE102011018342A1 (en) 2011-04-20 2012-10-25 Heraeus Materials Technology Gmbh & Co. Kg Process for the preparation of a partially coated support structure
US8672232B2 (en) 2011-06-27 2014-03-18 Composecure, Llc Combination card of metal and plastic
US9836684B2 (en) 2014-08-10 2017-12-05 Féinics Amatech Teoranta Smart cards, payment objects and methods
ITMI20120706A1 (en) 2012-04-27 2013-10-28 St Microelectronics Srl AN INTEGRATED CIRCUIT CARD FOR AUTHENTICATION AND A METHOD FOR THE AUTHENTICATION OF THE INTEGRATED CIRCUIT CARD
US9269032B2 (en) 2012-10-28 2016-02-23 Zlotech Llc Glass-containing transaction card and method of making the same
US9422435B2 (en) 2013-01-25 2016-08-23 Ppg Industries Ohio, Inc. Scratch and stain resistant coatings
US11087316B2 (en) 2013-02-08 2021-08-10 Taiwan Development & Construction Co. Electronic tag and system and method for securing electronic tag
ES2750216T3 (en) 2013-02-13 2020-03-25 Composecure Llc Durable card
US9016591B2 (en) 2013-08-08 2015-04-28 Composecure, Llc Plastic cards with high density particles
US9070053B2 (en) 2013-10-25 2015-06-30 CPI Card Group—Colorado, Inc. Multi-metal layered card
CN105793872B (en) 2013-11-18 2019-01-01 安全创造有限责任公司 Card with metal layer and antenna
US9569718B2 (en) 2013-12-19 2017-02-14 Composecure, Llc Card with metal layer and electrostatic protection
US20150206047A1 (en) 2014-01-20 2015-07-23 John Herslow Metal card with radio frequency (rf) transmission capability
US9634224B2 (en) 2014-02-14 2017-04-25 D-Wave Systems Inc. Systems and methods for fabrication of superconducting circuits
US9844922B2 (en) 2014-04-21 2017-12-19 Travel Tags, Inc. Bamboo laminate transaction card
JP6680767B2 (en) 2014-05-22 2020-04-15 コンポーズキュア,リミティド ライアビリティ カンパニー Transaction and ID card with selected texture and color
SG11201703216RA (en) 2014-11-03 2017-05-30 Composecure Llc Ceramic-containing and ceramic composite transaction cards
CN104360505A (en) 2014-11-14 2015-02-18 京东方科技集团股份有限公司 Display device and display system
WO2016106251A2 (en) 2014-12-23 2016-06-30 Composecure, Llc Smart metal card with radio frequency (rf) transmission capability
US9390363B1 (en) 2015-03-05 2016-07-12 Composecure, Llc Cards with special texture and color
US9390366B1 (en) 2015-07-08 2016-07-12 Composecure, Llc Metal smart card with dual interface capability
WO2018069075A1 (en) 2016-10-13 2018-04-19 Basf Se Radiation-curable compounds containing polyester acrylate
CN107068811B (en) 2017-03-15 2019-06-18 京东方科技集团股份有限公司 The production method and light-emitting diode assembly of light-emitting diode assembly
US10725595B2 (en) 2018-04-24 2020-07-28 Apple Inc. Electronic devices with covers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492370A (en) * 1991-03-22 1996-02-20 De La Rue Holographics Ltd. Decorative article
US5895909A (en) * 1995-10-19 1999-04-20 Kabushiki Kaisha Nippon Conlux Card and device for processing of same
US20040003185A1 (en) * 2002-01-24 2004-01-01 Efland Gregory H. Method and system for synchronizing processor and DMA using ownership flags
US6644552B1 (en) * 2002-07-09 2003-11-11 John Herslow Composite card

Also Published As

Publication number Publication date
US10332846B2 (en) 2019-06-25
US20170069580A1 (en) 2017-03-09
US20190378805A1 (en) 2019-12-12
US20090169776A1 (en) 2009-07-02
US9542635B2 (en) 2017-01-10
US20140166762A1 (en) 2014-06-19
US10373920B2 (en) 2019-08-06
US11367693B2 (en) 2022-06-21

Similar Documents

Publication Publication Date Title
US11367693B2 (en) Foil composite card
US5513019A (en) Semi-transparent reflective layer for a phase hologram
US7503503B2 (en) Card laminate
US5310222A (en) Optical device
ES2269304T3 (en) DECORATIVE FILM.
KR100706077B1 (en) Laminate, in particular in the form of cards and a method for producing the same
US8006908B2 (en) Data support with identifications written thereon by means of a laser beam and method for production thereof
JP4405915B2 (en) Strip type security element
KR20070110201A (en) A security device formed by a hologram and a color shifting ink
BRPI0818567B1 (en) SAFETY DOCUMENT AND PROCESS FOR YOUR PRODUCTION
JP2023113602A (en) Laminate, certificate, and method for manufacturing laminate
KR20110119786A (en) Micro-relief structures
BG986U1 (en) Document security strip and secured document
JP2021157079A (en) Security label
KR200353146Y1 (en) Hologram Ultra violet curing system label
EP4353487A1 (en) 3d display, authenticator, and formation method
KR20010070741A (en) Method of making a card having a gold plate
JPH096219A (en) Hologram transfer foil
MXPA01009392A (en) Decorative foil

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION