US20170063024A1 - Laser system - Google Patents

Laser system Download PDF

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Publication number
US20170063024A1
US20170063024A1 US15/350,277 US201615350277A US2017063024A1 US 20170063024 A1 US20170063024 A1 US 20170063024A1 US 201615350277 A US201615350277 A US 201615350277A US 2017063024 A1 US2017063024 A1 US 2017063024A1
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Prior art keywords
pulse
laser beam
pulse laser
timing
laser
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US15/350,277
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Inventor
Kouji Kakizaki
Takashi Matsunaga
Masaki Arakawa
Osamu Wakabayashi
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Gigaphoton Inc
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Gigaphoton Inc
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Assigned to GIGAPHOTON INC. reassignment GIGAPHOTON INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUNAGA, TAKASHI, KAKIZAKI, KOUJI, WAKABAYASHI, OSAMU, ARAKAWA, MASAKI
Publication of US20170063024A1 publication Critical patent/US20170063024A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305—Feedback control systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
    • H01S3/09702—Details of the driver electronics and electric discharge circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686—Pulsed laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/139—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • H01S3/1394—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length by using an active reference, e.g. second laser, klystron or other standard frequency source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/104—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/22—Gases
    • H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
    • H01S3/225—Gases the active gas being polyatomic, i.e. containing two or more atoms comprising an excimer or exciplex
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2308—Amplifier arrangements, e.g. MOPA

Definitions

  • the present disclosure relates to a laser system.
  • a laser annealing apparatus may apply a pulse laser beam on an amorphous silicon film formed on a substrate.
  • the pulse laser beam may be emitted from a laser system such as an excimer laser system.
  • the pulse laser beam may have a wavelength of ultraviolet light region.
  • Such pulse laser beam may reform the amorphous silicon film to a poly silicon film.
  • the poly-silicon film can be used to form thin film transistors (TFTs).
  • TFTs may be used in large-sized liquid crystal displays.
  • a laser system may include: a first laser apparatus configured to emit a first pulse laser beam; a second laser apparatus configured to emit a second pulse laser beam; a timing detector; and a controller.
  • the timing detector may be configured to detect a first passage timing at which the first pulse laser beam passes a first position and a second passage timing at which the second pulse laser beam passes a second position.
  • the controller may be configured to control a first trigger timing for the first laser apparatus to emit the first pulse laser beam and a second trigger timing for the second laser apparatus to emit the second pulse laser beam based on the first passage timing and the second passage timing.
  • a laser system may include: a first discharge-pumped laser apparatus configured to emit a first pulse laser beam; a second discharge-pumped laser apparatus configured to emit a second pulse laser beam; a timing detector; and a controller.
  • the timing detector may be configured to detect a first timing of electric discharge occurred for emitting the first pulse laser beam from the first laser apparatus, and detect a second timing of electric discharge occurred for emitting the second pulse laser beam from the second laser apparatus.
  • the controller may be configured to control a first trigger timing for the first laser apparatus to emit the first pulse laser beam and a second trigger timing for the second laser apparatus to emit the second pulse laser beam based on the first timing of electric discharge and the second timing of electric discharge.
  • a laser system may include: a first laser apparatus configured to emit a first pulse laser beam; a second laser apparatus configured to emit a second pulse laser beam; a timing detector; a first optical path length adjuster; a second optical path length adjuster; and a controller.
  • the timing detector may be configured to detect a first passage timing at which the first pulse laser beam passes a first position and a second passage timing at which the second pulse laser beam passes a second position.
  • the first optical path length adjuster may be provided between the first laser apparatus and the timing detector in an optical path of the first pulse laser beam.
  • the second optical path length adjuster may be provided between the second laser apparatus and the timing detector in an optical path of the second pulse laser beam.
  • the controller may be configured to control the first optical path length adjuster and the second optical path length adjuster based on the first passage timing and the second passage timing.
  • a laser system may include: a first discharge-pumped laser apparatus configured to emit a first pulse laser beam; a second discharge-pumped laser apparatus configured to emit a second pulse laser beam; a timing detector; a first optical path length adjuster; a second optical path length adjuster; and a controller.
  • the timing detector may be configured to detect a first timing of electric discharge occurred for emitting the first pulse laser beam from the first laser apparatus, and detect a second timing of electric discharge occurred for emitting the second pulse laser beam from the second laser apparatus.
  • the first optical path length adjuster may be provided in an optical path of the first pulse laser beam.
  • the second optical path length adjuster may be provided in an optical path of the second pulse laser beam.
  • the controller may be configured to control the first optical path length adjuster and the second optical path length adjuster based on the first timing of electric discharge and the second timing of electric discharge.
  • a laser system may include: a first laser apparatus configured to emit a first pulse laser beam; a second laser apparatus configured to emit a second pulse laser beam; and a controller.
  • the controller may be configured to control a first trigger timing for the first laser apparatus to emit the first pulse laser beam and a second trigger timing for the second laser apparatus to emit the second pulse laser beam, such that a difference between a first emitting timing at which the first pulse laser beam is emitted from the laser system and a second emitting timing at which the second pulse laser beam is emitted from the laser system approaches a predetermined value.
  • a laser system may include: a first laser apparatus configured to emit a first pulse laser beam; a second laser apparatus configured to emit a second pulse laser beam; a first optical path length adjuster; a second optical path length adjuster; and a controller.
  • the first optical path length adjuster may be provided in an optical path of the first pulse laser beam.
  • the second optical path length adjuster may be provided in an optical path of the second pulse laser beam.
  • the controller may be configured to control the first optical path length adjuster and the second optical path length adjuster, such that a difference between a first emitting timing at which the first pulse laser beam is emitted from the laser system and a second emitting timing at which the second pulse laser beam is emitted from the laser system approaches a predetermined value.
  • FIG. 1 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a first embodiment of the present disclosure.
  • FIG. 2 is a block diagram of a laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 1 .
  • FIG. 3 is a timing chart illustrating a principle of feedback control on first to fifth trigger timings TR 1 to TR 5 in the laser annealing apparatus 1 shown in FIG. 1 .
  • FIG. 4 is a flowchart illustrating an operation of a processor 20 b in the laser system controller 20 shown in FIG. 1 .
  • FIG. 5 is a flowchart illustrating detailed processing to calculate differences T 12 to T 15 shown in FIG. 4 .
  • FIG. 5 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a second embodiment of the present disclosure.
  • FIG. 7 is a block diagram for a laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 6 .
  • FIG. 8 is a timing chart illustrating a principle of feedback control on first to fifth trigger timings TR 1 to TR 5 in the laser annealing apparatus 1 shown in FIG. 6 .
  • FIG. 9 is a flowchart illustrating an operation of a processor 20 b in the laser system controller 20 shown in FIG. 6 .
  • FIG. 10 is a flowchart illustrating detailed processing to calculate differences T 12 to T 15 shown in FIG. 9 .
  • FIG. 11 is a flowchart illustrating detailed processing to correct a shift amount ⁇ T shown in FIG. 9 .
  • FIG. 12 is a block diagram for a laser system controller 20 included in a laser annealing apparatus 1 according to a third embodiment of the present disclosure.
  • FIG. 13 is a flowchart illustrating an operation of a processor 20 b in the laser system controller 20 shown in FIG. 12 .
  • FIG. 14 is a flowchart illustrating detailed processing to calculate differences T 12 to T 15 shown in FIG. 13 .
  • FIGS. 15A to 15D are graphs each showing a pulse waveform of a combined beam in relation to each variation of first to fifth emitting timings and pulse energy values.
  • FIG. 16 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a fourth embodiment of the present disclosure.
  • FIG. 17 schematically shows a configuration of a first optical path length adjuster 7 a.
  • FIG. 18 is a block diagram of a laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 16 .
  • FIG. 19 is a flowchart illustrating an operation of a processor 20 b in the laser system controller 20 shown in FIG. 16 .
  • FIG. 20 shows an exemplary configuration of a laser apparatus that can be used in each of the above-mentioned embodiments.
  • FIG. 21 shows a configuration of a pulse power module 13 shown in FIG. 20 and an internal configuration of the laser chamber 10 viewed from a direction substantially parallel to a travelling direction of the laser beam.
  • FIG. 22 shows another example of the beam combiner.
  • FIG. 23 shows a still other example of the beam combiner.
  • FIG. 24 is a block diagram schematically illustrating a configuration of a controller.
  • Embodiments of the present disclosure will be described below in detail with reference to the drawings.
  • the embodiments described below may represent several examples of the present disclosure, and may not intend to limit the content of the present disclosure. Not all of the configurations and operations described in the embodiments are indispensable in the present disclosure. Identical reference symbols may be assigned to identical elements and redundant descriptions may be omitted.
  • a laser annealing apparatus may perform laser annealing by irradiating an amorphous silicon film on a glass substrate with a pulse laser beam.
  • the pulse laser beam may be demanded to increase its energy per one pulse for decreasing lead time to manufacture larger and larger liquid crystal displays as in recent years.
  • Increasing energy per one pulse may be achieved by combining pulse laser beams emitted from respective laser apparatuses to form a combined laser beam, which may be applied to the amorphous silicon film.
  • the pulse laser beams emitted from the respective laser apparatuses may lose stable synchronization in their emitting timings. This may change waveform of the combined pulse laser beams. Such change in the waveform of the combined pulse laser beam may affect electric characteristics of materials to be made by the laser annealing.
  • a first passage timing and a second passage timing may be detected.
  • the first passage timing may be the timing when a pulse laser beam emitted from a first laser apparatus passes a first position.
  • the second passage timing may be the timing when another pulse laser beam emitted from a second laser apparatus passes a second position.
  • the first passage timing and the second passage timing may be used for controlling a first trigger timing and a second trigger timing.
  • the first trigger timing may be used for emitting the pulse laser beam from the first laser apparatus.
  • the second trigger timing may be used for emitting the pulse laser beam from the second laser apparatus.
  • An “optical path axis” of a pulse laser beam may be a central axis of an optical path of the pulse laser beam.
  • FIG. 1 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a first embodiment of the present disclosure.
  • the laser annealing apparatus 1 may include a laser system 5 and an exposure apparatus 4 .
  • the laser system 5 may include a plurality of laser apparatuses 2 a to 2 e , a plurality of high-reflective mirrors 30 a to 30 e and 31 a to 31 e , a plurality of timing detectors 32 a to 32 e , a beam combiner system 3 , and a laser system controller 20 .
  • the plurality of laser apparatuses 2 a to 2 e may include a first laser apparatus 2 a , a second laser apparatus 2 b , a third laser apparatus 2 c , a fourth laser apparatus 2 d , and a fifth laser apparatus 2 e .
  • FIG. 1 shows the five laser apparatuses 2 a to 2 e ; however, the number of the laser apparatuses may not be limited but may be an integer equal to or more than two.
  • Each of the first to fifth laser apparatuses 2 a to 2 e may be an excimer laser apparatus using laser medium such as XeF, XeCl, KrF, or MT.
  • the first to fifth laser apparatuses 2 a to 2 e may have substantially the same configurations with each other.
  • the first to fifth laser apparatuses 2 a to 2 e may receive first to fifth trigger signals, respectively, and emit first to fifth pulse laser beams 21 to 25 , respectively.
  • Each of the first to fifth pulse laser beams 21 to 25 may have a wavelength of an ultraviolet region.
  • the number of the high-reflective mirrors 30 a to 30 e may correspond to the number of the laser apparatuses 2 a to 2 e .
  • the number of the high-reflective mirrors 31 a to 31 e may correspond to the number of the laser apparatuses 2 a to 2 e.
  • the high-reflective mirrors 30 a and 31 a may be provided such that the first pulse laser beam 21 emitted from the first laser apparatus 2 a may enter a first concave lens 3311 described later in incident optics 33 .
  • the high-reflective mirrors 30 b and 31 b may be provided such that the second pulse laser beam 22 emitted from the second laser apparatus 2 b may enter a second concave lens 3312 described later in the incident optics 33 .
  • the high-reflective mirrors 30 c and 31 c may be provided such that the third pulse laser beam 23 emitted from the third laser apparatus 2 c may enter a third concave lens 3313 described later in the incident optics 33 .
  • the high-reflective mirrors 30 d and 31 d may be provided such that the fourth pulse laser beam 24 emitted from the fourth laser apparatus 2 d may enter a fourth concave lens 3314 described later in the incident optics 33 .
  • the high-reflective mirrors 30 e and 31 e may be provided such that the fifth pulse laser beam 25 emitted from the fifth laser apparatus 2 e may enter a fifth concave lens 3315 described later in the incident optics 33 .
  • the number of the timing detectors 32 a to 32 e may correspond to the number of the laser apparatuses 2 a to 2 e.
  • the timing detector 32 a may include a beam splitter 35 a and an optical sensor 36 a .
  • the beam splitter 35 a may be provided in an optical path of the first pulse laser beam 21 from the first laser apparatus 2 a to the incident optics 33 or a beam combiner 34 .
  • the beam splitter 35 a may transmit the first pulse laser beam 21 at high transmittance to a first direction, and reflect a part of the first pulse laser beam 21 to a second direction.
  • the optical sensor 36 a may include a photodiode or a photoelectric tube.
  • the optical sensor 36 a may be provided in an optical path of the first pulse laser beam 21 reflected by the beam splitter 35 a to the above-mentioned second direction.
  • the optical sensor 36 a may be provided at a position where an optical path length from the beam splitter 35 a to a light-receiving surface of the optical sensor 36 a along the second direction is L.
  • the optical path length may be a sum of at least one product of a refractive index of medium transmitting the light and a travelling distance of the light in the medium.
  • the optical sensor 36 a may receive a part of the first pulse laser beam 21 .
  • the timing detector 32 a may output a signal indicating a first passage timing at which the first pulse laser beam 21 passes a first position 21 a .
  • the first position 21 a may correspond to, in the optical path of the first pulse laser beam 21 emitted from the beam splitter 35 a to the first direction, a position where an optical path length from the beam splitter 35 a is the above-mentioned L.
  • the incident optics 33 or the beam combiner 34 may be positioned in the optical path of the first pulse laser beam 21 emitted from the beam splitter 35 a to the first direction.
  • the timing detectors 32 a to 32 e may have substantially the same configurations with each other.
  • the timing detector 32 b may output a signal indicating a second passage timing at which the second pulse laser beam 22 passes a second position 22 a.
  • the timing detector 32 c may output a signal indicating a third passage timing at which the third pulse laser beam 23 passes a third position 23 a.
  • the timing detector 32 d may output a signal indicating a fourth passage timing at which the fourth pulse laser beam 24 passes a fourth position 24 a.
  • the timing detector 32 e may output a signal indicating a fifth passage timing at which the fifth pulse laser beam 25 passes a fifth position 25 a.
  • the first to fifth pulse laser beams 21 to 25 may be emitted from the laser system 5 at an emitting position 26 a .
  • Optical path lengths from the first to fifth positions to the emitting position 26 a may be L 1 to L 5 , respectively.
  • the emitting position 26 a where the first to fifth pulse laser beams 21 to 25 are emitted from the laser system 5 , may be located between the beam combiner system 3 and the exposure apparatus 4 .
  • the beam combiner system 3 may include the incident optics 33 and the beam combiner 34 .
  • the incident optics 33 may include secondary light source optics 331 and condenser optics 332 , being designed to constitute a Koehler illumination.
  • the secondary light source optics 331 may include first to fifth concave lenses 3311 to 3315 .
  • the first concave lens 3311 may be provided between the timing detector 32 a and the condenser optics 332 in the optical path of the first pulse laser beam 21 emitted from the first laser apparatus 2 a .
  • the first concave lens 3311 may transmit the first pulse laser beam 21 , which has been emitted from the first laser apparatus 2 a , toward the condenser optics 332 .
  • the first concave lens 3311 may expand beam width of the first pulse laser beam 21 .
  • the first to fifth concave lenses 3311 to 3315 may have substantially the same configurations with each other.
  • the second concave lens 3312 may be provided in the optical path of the second pulse laser beam 22 emitted from the second laser apparatus 2 b.
  • the third concave lens 3313 may be provided in the optical path of the third pulse laser beam 23 emitted from the third laser apparatus 2 c.
  • the fourth concave lens 3314 may be provided in the optical path of the fourth pulse laser beam 24 emitted from the fourth laser apparatus 2 d.
  • the fifth concave lens 3315 may be provided in the optical path of the fifth pulse laser beam 25 emitted from the fifth laser apparatus 2 e.
  • the first to fifth pulse laser beams 21 to 25 entering the first to fifth concave lenses 3311 to 3315 may have substantially the same beam sizes and substantially the same beam divergences with each other.
  • Optical path axes of the first to fifth pulse laser beams 21 to 25 transmitted by the first to fifth concave lenses 3311 to 3315 may be substantially parallel to each other.
  • the condenser optics 332 may be provided such that, as explained below, the first to fifth pulse laser beams 21 to 25 may be made incident on substantially the same portion of a light-receiving surface of the beam combiner 34 at respective predetermined incident angles.
  • the condenser optics 332 may extend over the cross sections of the optical paths of the first to fifth pulse laser beams 21 to 25 , at a position between the secondary light source optics 331 and the beam combiner 34 .
  • the condenser optics 332 may transmit the first to fifth pulse laser beams 21 to 25 toward the beam combiner 34 .
  • the condenser optics 332 may change respective directions of the optical path axes of the first to fifth pulse laser beams 21 to 25 to respective predetermined directions.
  • the condenser optics 332 may be provided such that a front-side focal plane of the condenser optics 332 substantially coincides with respective focal positions of the first to fifth concave lenses 3311 to 3315 .
  • the condenser optics 332 may thus collimate each of the first to fifth pulse laser beams 21 to 25 transmitted by the respective concave lenses 3311 to 3315 , such that each of the beams has substantially parallel rays.
  • the condenser optics 332 may be provided such that a rear-side focal plane of the condenser optics 332 substantially coincides with the light-receiving surface of the beam combiner 34 .
  • the condenser optics 332 may make the first to fifth pulse laser beams 21 to 25 be incident on substantially the same portion of the beam combiner 34 at respective predetermined incident angles.
  • FIG. 1 shows that the condenser optics 332 may include a single convex lens. However, the condenser optics 332 may include a combination of the convex lens and another convex or concave lens (not shown), or include a concave mirror (not shown).
  • the beam combiner 34 may include a diffractive optical element (DOE).
  • DOE diffractive optical element
  • the diffractive optical element may be constituted by an ultraviolet-transmitting substrate, such as a synthetic quartz substrate or a calcium fluoride substrate, on which multiple grooves each having a predetermined shape are formed at a predetermined interval.
  • the first to fifth pulse laser beams 21 to 25 having been changed their directions of the optical path axes by the condenser optics 332 to the respective predetermined directions, may enter the beam combiner 34 .
  • the first to fifth pulse laser beams 21 to 25 which entered the beam combiner 34 , may be emitted from the beam combiner 34 to directions substantially the same with each other.
  • the above-mentioned respective predetermined directions may be designed such that the first to fifth pulse laser beams 21 to 25 are combined by the beam combiner 34 .
  • Such beam combiner 34 may be a diffractive optical element, for example, disclosed in U.S. Patent Application Publication No. 2009/0285076.
  • the first to fifth pulse laser beams 21 to 25 emitted from the beam combiner 34 may travel through substantially the same optical paths to enter the exposure apparatus 4 .
  • the first to fifth pulse laser beams 21 to 25 may thus be combined by the beam combiner system 3 and emitted from the laser system 5 .
  • a pulse laser beam formed by combining the first to fifth pulse laser beams 21 to 25 may be referred to as a “combined laser beam”.
  • the combined laser beam may include the first to fifth pulse laser beams 21 to 25 .
  • the pulse energy of the combined laser beam may be approximately five times of the pulse energy of the pulse laser beam emitted from a single laser apparatus.
  • “Combining” pulse laser beams may include emitting both a first pulse laser beam incident in a first direction and a second pulse laser beam incident in a second direction different from the first direction, to a third direction.
  • the third direction may be substantially the same as one of the first and second directions or different from any one of the first and second directions.
  • the first and second pulse laser beams emitted to the third direction may overlap with or be close to each other.
  • the laser system controller 20 may output the first to fifth trigger signals.
  • the first to fifth trigger signals may be inputted to the first to fifth laser apparatuses 2 a to 2 e , respectively.
  • the laser system controller 20 may receive the signals indicating the first to fifth passage timings outputted from the timing detectors 32 a to 32 e , respectively.
  • the exposure apparatus 4 may include an exposure apparatus controller 40 , a high-reflective mirror 41 , illumination optics 42 , a mask 43 , and transfer optics 44 .
  • the exposure apparatus 4 may apply the pulse laser beam, which is emitted from the laser system 5 , to the irradiation object P according to a predetermined mask pattern.
  • the exposure apparatus controller 40 may perform control of moving a stage (not shown), which holds the irradiation object P, changing the irradiation objects P, or changing the masks 43 .
  • the exposure apparatus controller 40 may output the oscillation trigger signal to the laser system controller 20 .
  • the high-reflective mirror 41 may be provided in an optical path of the pulse laser beam emitted from the laser system 5 .
  • the high-reflective mirror 41 may reflect the pulse laser beam emitted from the laser system 5 to make the pulse laser beam enter the illumination optics 42 .
  • the pulse laser beam entering the illumination optics 42 may have substantially parallel rays.
  • the illumination optics 42 may be provided between the high-reflective mirror 41 and the mask 43 in the optical path of the pulse laser beam emitted from the laser system 5 .
  • the illumination optics 42 may include a fly eye lens 421 and condenser optics 422 , being designed to constitute a Koehler illumination.
  • the fly eye lens 421 may be provided between the high-reflective mirror 41 and the condenser optics 422 in the optical path of the pulse laser beam emitted from the laser system 5 .
  • the fly eye lens 421 may include a plurality of lenses arranged in a cross section of the pulse laser beam. The lenses may transmit respective parts of the pulse laser beam toward the condenser optics 422 to expand beam widths of the respective parts.
  • the condenser optics 422 may be provided between the fly eye lens 421 and the mask 43 in the optical path of the pulse laser beam emitted from the laser system 5 .
  • the condenser optics 422 may irradiate the mask 43 with the pulse laser beam emitted from the fly eye lens 421 .
  • the condenser optics 422 may be provided such that a rear-side focal plane of the condenser optics 422 substantially coincides with a position of the mask 43 .
  • the condenser optics 422 may thus irradiate substantially the same portion of the mask 43 with the respective parts of the pulse laser beam transmitted by the respective lenses of the fly eye lens 421 .
  • FIG. 1 shows that the condenser optics 422 may include a single convex lens. However, the condenser optics 422 may include a combination of the convex lens and another convex or concave lens (not shown), or include a concave mirror (not shown).
  • the illumination optics 42 may reduce variation in light intensity distribution in a cross section of the pulse laser beam, with which the mask 43 is irradiated.
  • the mask 43 may have a rectangular slit.
  • the shape of the slit may constitute the mask pattern of the mask 43 .
  • the mask pattern of the mask 43 may not be limited to have the rectangular shape.
  • the mask pattern may have any desired shape.
  • the transfer optics 44 may be provided between the mask 43 and the irradiation object P in the optical path of the pulse laser beam emitted from the laser system 5 .
  • the transfer optics 44 may be provided such that an image of the mask 43 is transferred by the transfer optics 44 at a position substantially coinciding with a position where the irradiation object P shall be irradiated with the pulse laser beam.
  • the transfer optics 44 may thus transfer the image of the mask pattern of the mask 43 , irradiated with the pulse laser beam, to the irradiation object P.
  • the transfer optics 44 may include at least one convex lens.
  • the transfer optics 44 may include a combination of a convex lens and a concave lens, or include a concave mirror.
  • the transfer optics 44 may include a cylindrical lens that transfers a lateral component of the image of the rectangular mask pattern to the irradiation object P.
  • the laser system 5 may thus emit the pulse laser beam having higher pulse energy than the pulse energy of the pulse laser beam emitted from the single laser apparatus. Consequently, the laser annealing apparatus 1 may efficiently give pulse energy to a large-sized irradiation object P. Thus, large-sized liquid crystal displays may be efficiently manufactured.
  • FIG. 2 is a block diagram of the laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 1 .
  • the laser system controller 20 may include a timer unit 20 a , a processor 20 b , and a delay circuit unit 20 c .
  • the laser system controller 20 may perform feedback control on trigger timings for the first to fifth trigger signals in the following configuration.
  • the laser system controller 20 may correspond to a controller in the present disclosure.
  • the timer unit 20 a and the delay circuit unit 20 c may receive the oscillation trigger signal outputted from the exposure apparatus controller 40 .
  • the delay circuit unit 20 c may output the first to fifth trigger signals.
  • the first to fifth trigger signals may be outputted at first to fifth trigger timings TR 1 to TR 5 , delaying by respective predetermined delay times from the timing at which the delay circuit unit 20 c received the oscillation trigger signal.
  • the first to fifth laser apparatuses 2 a to 2 e may receive the first to fifth trigger signals, and emit the first to fifth pulse laser beams 21 to 25 , respectively.
  • the timer unit 20 a may receive signals indicating the first to fifth passage timings outputted from the timing detectors 32 a to 32 e .
  • the signals indicating the first to fifth passage timings may indicate timings at which the first to fifth pulse laser beams 21 to 25 pass the first to fifth positions, respectively.
  • the timer unit 20 a may count clock signal after receiving the oscillation trigger signal until receiving each of the signals indicating the first to fifth passage timings.
  • Count data obtained by counting the clock signal may be sent from the timer unit 20 a to the processor 20 b as the first to fifth passage timings TD 1 to TD 5 .
  • the processor 20 b may be configured to set the first to fifth trigger timings TR 1 to TR 5 based on the first to fifth passage timings TD 1 to TD 5 , respectively. These trigger timings may be set such that differences between the emitting timings of the first to fifth pulse laser beams 21 to 25 from the laser system 5 approaches a predetermined value.
  • the predetermined value may be substantially equal to 0.
  • FIG. 3 is a timing chart illustrating a principle of feedback control on the first to fifth trigger timings TR 1 to TR 5 in the laser annealing apparatus 1 shown in FIG. 1 .
  • delay times from the timing at which the delay circuit unit 20 c receives the oscillation trigger signal until the respective timings at which the delay circuit unit 20 c outputs the first to fifth trigger signals may be set as the first to fifth trigger timings TR 1 to TR 5 , respectively.
  • the first to fifth laser apparatuses 2 a to 2 e may emit the first to fifth pulse laser beams, respectively.
  • the timer unit 20 a may receive the signals indicating the first to fifth passage timings to measure the first to fifth passage timings TD 1 to TD 5 , respectively.
  • the first to fifth passage timings TD 1 to TD 5 may be the timings at which the first to fifth pulse laser beams 21 to 25 pass the first to fifth positions, respectively.
  • the first to fifth emitting timings T 1 out to T 5 out at which the first to fifth pulse laser beams 21 to 25 are emitted from the laser system 5 may be calculated as follows:
  • T 1out TD 1+ L 1/ c
  • T 2out TD 2+ L 2/ c
  • T 3out TD 3+ L 3/ c
  • T 4out TD 4+ L 4/ c
  • T 5out TD 5+ L 5/ c
  • L 1 to L 5 may correspond to the optical path lengths from the first to fifth positions 21 a to 25 a , respectively, to the position 26 a where the laser beams are emitted from the laser system 5 .
  • c may be the velocity of light in vacuum.
  • the processor 20 b may update the first to fifth trigger timings TR 1 to TR 5 such that respective differences between the first to fifth emitting timings T 1 out to T 5 out approach a predetermined value.
  • the predetermined value may be equal to 0.
  • the first to fifth pulse laser beams 21 to 25 may be emitted from the laser system 5 in synchronization with each other.
  • the number of the laser apparatuses in the laser system 5 may not be limited to five. It may be an integer equal to or more than two.
  • the oscillation trigger signal is not limited to be generated by the exposure apparatus controller 40 , but may be generated by the laser system controller 20 at a predetermined repetition frequency.
  • FIG. 4 is a flowchart illustrating an operation of the processor 20 b in the laser system controller 20 shown in FIG. 1 .
  • the processor 20 b may perform feedback control on the first to fifth trigger timings TR 1 to TR 5 in the following processing.
  • the first to fifth trigger timings TR 1 to TR 5 may correspond to the delay times in the delay circuit unit 20 c from the timing of receiving the oscillation trigger signal until the respective timings of outputting the first to fifth trigger signals.
  • the processor 20 b may set the first to fifth trigger timings TR 1 to TR 5 to initial values TR 1 in to TR 5 in, respectively.
  • the processor 20 b may calculate the second to fifth emitting timings T 2 out to T 5 out at which the second to fifth pulse laser beams 22 to 25 are emitted from the laser system 5 .
  • the processor 20 b may then calculate differences T 12 to T 15 between the second to fifth emitting timings T 2 out to T 5 out and respective target values of them. Details of this process will be described below with reference to FIG. 5 .
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may be calculated based on the first emitting timing T 1 out at which the first pulse laser beam 21 is emitted from the laser system 5 .
  • the processor 20 b may update the first to fifth trigger timings TR 1 to TR 5 .
  • the trigger timings TR 1 to TR 5 may be calculated as follows using the differences T 12 to T 15 :
  • TR 1 to TR 5 in the right sides of the above-mentioned formulas may correspond to the trigger timings having been set, and TR 1 to TR 5 in the left sides of the above-mentioned formulas may correspond to the updated trigger timings.
  • the processor 20 b may determine whether the control on the trigger timings should be stopped. If the control should not be stopped (S 90 : NO), the processor 20 b may return to the above-mentioned S 50 , and repeat the processes of S 50 to S 90 . If the control should be stopped (S 90 : YES), the processor 20 b may terminate the processing of this flowchart.
  • FIG. 5 is a flowchart illustrating detailed processing to calculate the differences T 12 to T 15 shown in FIG. 4 .
  • the processing shown in FIG. 5 may be performed by the processor 20 b as a subroutine of S 50 shown in FIG. 4 .
  • the processor 20 b may set initial values for performing the processing of this flowchart as follows:
  • N may be a value of a counter.
  • TD 1 sum to TD 5 sum may be accumulated values of TD 1 to TD 5 for calculating average values of TD 1 to TD 5 , respectively.
  • the processor 20 b may determine whether the signals indicating the first to fifth passage timings have been inputted. This may be performed by determining whether the processor 20 b has received the count data from the timer unit 20 a . If the signals indicating the first to fifth passage timings have not been inputted (S 52 : NO), the processor 20 b may standby until the signals are inputted. If the signals indicating the first to fifth passage timings have been inputted (S 52 : YES), the processor 20 b may proceed to S 53 .
  • the processor 20 b may read the first to fifth passage timings TD 1 to TD 5 .
  • the first to fifth passage timings TD 1 to TD 5 may correspond to the time periods from the timing at which the timer unit 20 a receives the oscillation trigger signal until the respective timings at which the timer unit 20 a receives the signals indicating the first to fifth passage timings.
  • the processor 20 b may update accumulated values TD 1 sum to TD 5 sum as follows:
  • TD 1 sum to TD 5 sum in the right sides of the above-mentioned formulas may correspond to the current accumulated values
  • TD 1 sum to TD 5 sum in the left sides of the above-mentioned formulas may correspond to the updated accumulated values
  • the processor 20 b may determine whether a value of the counter N is equal to or more than a predetermined value Nmax.
  • the Nmax may be an integer determined in a range of 10 to 1000.
  • the processor 20 b may proceed to S 56 .
  • the processor 20 b may add 1 to the value of the counter N. The processor 20 b may then return to the above-mentioned S 52 .
  • the processor 20 b may proceed to S 57 .
  • the processor 20 b may calculate average values TD 1 av to TD 5 av of the first to fifth passage timings TD 1 to TD 5 , respectively, as follows:
  • the processor 20 b may calculate the first to fifth emitting timings T 1 out to T 5 out at which the first to fifth pulse laser beams 21 to 25 , respectively, are emitted from the laser system 5 .
  • T 1out TD 1 av+L 1/ c
  • T 2out TD 2 av+L 2/ c
  • T 3out TD 3 av+L 3/ c
  • T 4out TD 4 av+L 4/ c
  • T 5out TD 5 av+L 5/ c
  • the processor 20 b may calculate differences T 12 to T 15 between the second to fifth emitting timings T 2 out to T 5 out and the respective target values of them as follows:
  • T 12 T 2out ⁇ T 1out
  • T 13 T 3out ⁇ T 1out
  • T 14 T 4out ⁇ T 1out
  • T 15 T 5out ⁇ T 1out
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may be set to the same value with the first emitting timing T 1 out.
  • the differences between the first to fifth emitting timings T 1 out to T 5 out may thus approach 0.
  • the processor 20 b may terminate the processing of this flowchart and proceed to S 60 of FIG. 4 .
  • the first to fifth pulse laser beams 21 to 25 may be emitted at substantially the same time at the emitting position of the laser system 5 .
  • the emitting timings of the first to fifth pulse laser beams 21 to 25 may thus coincide with each other, improving light intensity of the combined laser beam emitted from the laser system 5 .
  • a value of the light intensity may be obtained by dividing pulse energy with pulse width.
  • the timing detectors 32 a to 32 e are provided in the optical paths of the first to fifth pulse laser beams 21 to 25 , respectively.
  • a memory may store required time periods from timings at which the first to fifth trigger signals are outputted by the laser system controller 20 until timings at which the first to fifth pulse laser beams 21 to 25 , respectively, are emitted from the laser system 5 . Based on the required time periods, the trigger timings may be controlled such that the differences between the emitting timings of the first to fifth pulse laser beams 21 to 25 from the laser system 5 approach a predetermined value.
  • the timing detectors 32 a to 32 e may be provided in the first to fifth laser apparatuses 2 a to 2 e , respectively.
  • the first to fifth positions 21 a to 25 a may be set to the light-emitting positions of the pulse laser beams from the first to fifth laser apparatuses 2 a to 2 e , respectively.
  • FIG. 6 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a second embodiment of the present disclosure.
  • the laser system 5 included in the laser annealing apparatus 1 may further comprise a pulse waveform measuring device 6 .
  • the other configurations may be substantially the same as those in the first embodiment.
  • the pulse waveform measuring device 6 may include a beam splitter 61 , focusing optics 62 , and an optical sensor 63 .
  • the beam splitter 61 may be provided between the beam combiner system 3 and the exposure apparatus 4 in the optical path of the pulse laser beam.
  • the beam splitter 61 may transmit the pulse laser beam at high transmittance to a first direction, and reflect a part of the pulse laser beam to a second direction.
  • the focusing optics 62 may concentrate the pulse laser beam reflected by the beam splitter 61 to the second direction on a light-receiving surface of the optical sensor 63 .
  • the optical sensor 63 may include a photodiode or a photoelectric tube.
  • the optical sensor 63 may preferably include a biplanar photo tube.
  • the optical sensor 63 may receive the pulse laser beam concentrated by the focusing optics 62 .
  • the optical sensor 63 may output data on a pulse waveform of the received pulse laser beam to the laser system controller 20 .
  • FIG. 7 is a block diagram for the laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 6 .
  • the data on the pulse waveform outputted from the pulse waveform measuring device 6 may be inputted to the processor 20 b of the laser system controller 20 .
  • the exposure apparatus controller 40 may output data on a target pulse width Dt.
  • the data on the target pulse width Dt may be inputted to the processor 20 b.
  • FIG. 8 is a timing chart illustrating a principle of feedback control on the first to fifth trigger timings TR 1 to TR 5 in the laser annealing apparatus 1 shown in FIG. 6 .
  • the first to fifth emitting timings T 1 out to T 5 out, at which the first to fifth pulse laser beams 21 to 25 are emitted from the laser system 5 may sequentially shift by ⁇ T.
  • ⁇ T the first to fifth pulse laser beams 21 to 25 sequentially shifting by ⁇ T from the laser system 5 .
  • a combined laser beam having a long pulse width may be generated.
  • the pulse width of the combined laser beam may be changed.
  • FIG. 9 is a flowchart illustrating an operation of the processor 20 b in the laser system controller 20 shown in FIG. 6 .
  • the processor 20 b may perform feedback control on the first to fifth trigger timings TR 1 to TR 5 in the following processing.
  • the processor 20 b may set the first to fifth trigger timings TR 1 to TR 5 to respective initial values TR 1 in to TR 5 in.
  • the process at S 20 may be substantially the same as the process at S 20 described above with reference to FIG. 4 .
  • the processor 20 b may set a shift amount ⁇ T of the emitting timings T 1 out to T 5 out of the first to fifth pulse laser beams 21 to 25 from the laser system 5 to an initial value ⁇ Tin.
  • the processor 20 b may read the target pulse width Dt.
  • the target pulse width Dt may have been outputted from the exposure apparatus controller 40 .
  • the processor 20 b may calculate differences T 12 to T 15 between the second to fifth emitting timings T 2 out to T 5 out, at which the second to fifth pulse laser beams 22 to 25 are emitted from the laser system 5 , and respective target values of them. Details of this process will be described below with reference to FIG. 10 .
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may be calculated based on the first emitting timing T 1 out at which the first pulse laser beam 21 is emitted from the laser system 5 .
  • the processor 20 b may update the first to fifth trigger timings TR 1 to TR 5 .
  • the process at S 60 may be substantially the same as the process at S 60 described above with reference to FIG. 4 .
  • the processor 20 b may correct the shift amount ⁇ T of the emitting timings of the first to fifth pulse laser beams 21 to 25 from the laser system 5 . Details of this process will be described below with reference to FIG. 11 .
  • the correction of the shift amount ⁇ T may be performed based on a difference ⁇ D between the pulse width of the combined laser beam, in which the first to fifth pulse laser beams 21 to 25 are combined, and the target pulse width Dt.
  • the pulse width of the combined laser beam may be a full width at half maximum. Alternatively, the pulse width of the combined laser beam may be a pulse width at a threshold other than half maximum.
  • the pulse width of the combined laser beam may be a value of TIS expressed by the following formula.
  • TIS ([ ⁇ I ( t ) dt] 2 )/( ⁇ I ( t ) 2 dt )
  • t may represent time.
  • I(t) may represent light intensity at the time t.
  • ⁇ may represent integral.
  • the processor 20 b may determine whether the control on the trigger timings should be stopped. If the control should not be stopped (S 90 : NO), the processor 20 b may return to the above-mentioned S 50 a , and repeat the processes of S 50 a to S 90 . If the control should be stopped (S 90 : YES), the processor 20 b may terminate the processing of this flowchart.
  • FIG. 10 is a flowchart illustrating detailed processing to calculate the differences T 12 to T 15 shown in FIG. 9 .
  • the processing shown in FIG. 10 may be performed by the processor 20 b as a subroutine of S 50 a shown in FIG. 9 .
  • Target values to be set for calculating the differences T 12 to T 15 in S 59 a of FIG. 10 may be different from those in S 59 of FIG. 5 .
  • the processing in FIG. 10 may be substantially the same as that in FIG. 5 in other aspects.
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may sequentially shift by ⁇ T from the first emitting timing T 1 out.
  • the pulse width of the combined laser beam may thus be controlled.
  • the processing shown in FIG. 10 may be applied to the first embodiment.
  • the first embodiment may omit the pulse waveform measuring device 6 and may omit the measurement of the pulse width of the combined laser beam and the correction of the shift amount ⁇ T.
  • a predetermined value of ⁇ T may be set. For example, if a pulse width of a single pulse laser beam is 15 ns and ⁇ T is 10 ns, a pulse width of the combined laser beam may be approximately 55 ns. Further, by changing the value of ⁇ T, the pulse width of the combined laser beam may be changed.
  • FIG. 11 is a flowchart illustrating detailed processing to correct the shift amount ⁇ T shown in FIG. 9 .
  • the processing shown in FIG. 11 may be performed by the processor 20 b as a subroutine of S 70 shown in FIG. 9 .
  • the processor 20 b may set initial values for performing the processing of this flowchart as follows:
  • N may be a value of a counter.
  • Dsum may be an accumulated value of pulse width D of the combined laser beam for calculating an average value of D.
  • the processor 20 b may determine whether the processor 20 b has received data on the pulse waveform of the combined laser beam, in which the first to fifth pulse laser beams 21 to 25 are combined.
  • the processor 20 b may standby until receiving the data on the pulse waveform. If the processor 20 b has received the data on the pulse waveform from the pulse waveform measuring device 6 (S 72 : YES), the processor 20 b may proceed to S 73 .
  • the processor 20 b may calculate the pulse width D of the combined laser beam.
  • the processor 20 b may update the accumulated value Dsum as follows.
  • Dsum in the right side of the above-mentioned formula may correspond to the accumulated value having been calculated, and Dsum in the left side of the above-mentioned formula may correspond to the updated accumulated value.
  • the processor 20 b may determine whether a value of the counter N is equal to or more than a predetermined value Nmax.
  • Nmax may be an integer determined in a range of 10 to 1000.
  • the processor 20 b may proceed to S 76 .
  • the processor 20 b may add 1 to the value of the counter N. The processor 20 b may then return to the above-mentioned S 72 .
  • the processor 20 b may proceed to S 77 .
  • the processor 20 b may calculate an average value Dav of the pulse width D of the combined laser beam as follows.
  • the processor 20 b may calculate difference ⁇ D between the average value Dav of the pulse width D of the combined laser beam and the target pulse width Dt as follows.
  • the processor 20 b may correct the shift amount ⁇ T of the first to fifth emitting timings T 1 out to T 5 out of the first to fifth pulse laser beams 21 to 25 from the laser system 5 as follows.
  • k may be an inverse of a value obtained by subtracting 1 from the number of the laser apparatuses. For example, in a case where five laser apparatuses 2 a to 2 e are used, k may equal to 1 ⁇ 4.
  • the pulse width of the combined laser beam may approach the target pulse width Dt.
  • the processor 20 b may terminate the processing of this flowchart and proceed to S 90 of FIG. 9 .
  • the first to fifth pulse laser beams 21 to 25 may be emitted at timings sequentially shifting by ⁇ T at the emitting position of the laser system 5 .
  • Such shift in the emitting timings of the first to fifth pulse laser beams 21 to 25 may enable the pulse width of the combined laser beam from the laser system 5 to be changed. Further, by performing feedback control on ⁇ T based on the target pulse width the pulse width of the combined laser beam may be stabilized.
  • FIG. 12 is a block diagram for a laser system controller 20 included in a laser annealing apparatus 1 according to a third embodiment of the present disclosure.
  • the laser system controller 20 included in the laser annealing apparatus 1 may be configured to output a pulse-energy control signal to each of the first to fifth laser apparatuses 2 a to 2 e .
  • the pulse-energy control signal may be generated based on data on a target pulse waveform WT received from the exposure apparatus controller 40 .
  • the other configurations may be substantially the same as those in the second embodiment.
  • the laser annealing apparatus 1 shown in FIG. 6 may be used as the laser annealing apparatus of the third embodiment.
  • FIG. 13 is a flowchart illustrating an operation of the processor 20 b in the laser system controller 20 shown in FIG. 12 .
  • the processor 20 b may perform feedback control on the first to fifth trigger timings and pulse energy values of the first to fifth pulse laser beams in the following processing.
  • the processor 20 b may read data on the target pulse waveform WT.
  • the data on the target pulse waveform WT may have been received from the exposure apparatus controller 40 .
  • the processor 20 b may calculate several target parameters based on the target pulse waveform WT.
  • the target parameters to be calculated may be as follows: (1) Respective target values P 1 t to P 5 t of the pulse energy values of the first to fifth pulse laser beams; and (2) Respective target values ⁇ T 12 t to ⁇ T 15 t of the shift amounts of the emitting timings of the second to fifth pulse laser beams after the first pulse laser beam emitted from the laser system 5 .
  • these target parameters may be calculated such that the pulse waveform WS of the combined laser beam based on the target parameters approaches the target pulse waveform WT.
  • the pulse waveform WS of the combined laser beam calculated by mutually superposing the pulse waveforms W 1 to W 5 of the pulse laser beams may be simulated based on the target values P 1 t to P 5 t of the pulse energy values of the first to fifth pulse laser beams 21 to 25 and the target values ⁇ T 12 t to ⁇ T 15 t of the shift amounts.
  • An absolute value of difference between the pulse waveform WS and the target pulse waveform WT may then be integrated and the parameters may be calculated such that the integrated value ⁇ S 1 may become minimum.
  • the processor 20 b may set the first to fifth trigger timings TR 1 to TR 5 to initial values TR 1 in to TR 5 in, respectively.
  • the process at S 20 may be substantially the same as the process at S 20 described above with reference to FIG. 4 .
  • the processor 20 b may calculate the differences T 12 to T 15 between the second to fifth emitting timings T 2 out to T 5 out, at which the second to fifth pulse laser beams 22 to 25 are emitted from the laser system 5 , and respective target values of them. Details of this process will be described below with reference to FIG. 14 .
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may be calculated based on the first emitting timing T 1 out of the first pulse laser beam 21 from the laser system 5 .
  • the processor 20 b may update the first to fifth trigger timings TR 1 to TR 5 .
  • the process at S 60 may be substantially the same as the process at S 60 described above with reference to FIG. 4 .
  • the processor 20 b may compare the pulse waveform WM of the combined laser beam, in which the first to fifth pulse laser beams 21 to 25 are combined, and the target pulse waveform WT to update the target parameters.
  • the updated target parameters may preferably be calculated such that the pulse waveform WM of the combined laser beam measured by the pulse waveform measuring device 6 approaches the target pulse waveform WT.
  • an absolute value of difference between the measured pulse waveform WM and the target pulse waveform WT may be integrated and the parameters may be updated such that the integrated value ⁇ S 2 may decrease.
  • the pulse waveforms W 1 to W 5 of the respective pulse laser beams may be corrected such that the simulated pulse waveform WS and the measured pulse waveform WM are close to each other.
  • the processor 20 b may determine whether the control of the trigger timings and the pulse energy values should be stopped. If the control should not be stopped (S 90 : NO), the processor 20 b may return to the above-mentioned S 50 b , and repeat the processes of S 50 b to S 90 . If the control should be stopped (S 90 : YES), the processor 20 b may terminate the processing of this flowchart.
  • FIG. 14 is a flowchart illustrating detailed processing to calculate the differences T 12 to T 15 shown in FIG. 13 .
  • the processing shown in FIG. 14 may be performed by the processor 20 b as a subroutine of S 50 b shown in FIG. 13 .
  • Target values to be set for calculating the differences T 12 to T 15 in S 59 b of FIG. 14 may be different from those in S 59 of FIG. 5 .
  • the processing in FIG. 14 may be substantially the same as that in FIG. 5 in other aspects.
  • the target values of the second to fifth emitting timings T 2 out to T 5 out may shift by ⁇ T 12 t to ⁇ T 15 t , respectively, from the first emitting timing T 1 out.
  • FIGS. 15A to 15D are graphs each showing a pulse waveform of the combined beam in relation to each variation of the first to fifth emitting timings and the pulse energy values.
  • the first to fifth emitting timings may sequentially shift by ⁇ T, and the first to fifth pulse energy values may be set separately.
  • the pulse waveform of the combined beam illustrated by a solid line in FIG. 15A may be obtained.
  • the first and second emitting timings may be substantially the same, the second to fifth emitting timings may sequentially shift by ⁇ T, and the first to fifth pulse energy values may be substantially the same.
  • the pulse waveform of the combined beam illustrated by a solid line in FIG. 15B may be obtained.
  • the first and second emitting timings may be substantially the same, the third and fourth emitting timings may be substantially the same, the second, fourth, and fifth emitting timings may sequentially shift by ⁇ T, and the first to fifth pulse energy values may be substantially the same.
  • the pulse waveform of the combined beam illustrated by a solid line in FIG. 15C may be obtained.
  • the first to third emitting timings may be substantially the same, the fourth and fifth emitting timings may be substantially the same, and the first to fifth pulse energy values may be substantially the same.
  • the pulse waveform of the combined beam illustrated by a solid line in FIG. 15D may be obtained.
  • a combined laser beam having a desired pulse waveform may be generated.
  • FIG. 16 schematically shows a configuration of a laser annealing apparatus 1 including a laser system 5 according to a fourth embodiment of the present disclosure.
  • the laser system 5 included in the laser annealing apparatus 1 may further include a plurality of optical path length adjusters 7 a to 7 e .
  • the other configurations may be substantially the same as those in the second embodiment.
  • the number of the optical path length adjusters 7 a to 7 e may correspond to the number of the laser apparatuses 2 a to 2 e .
  • the plurality of optical path length adjusters 7 a to 7 e may include first to fifth optical path length adjusters 7 a to 7 e.
  • the first optical path length adjuster 7 a may be provided between the first laser apparatus 2 a and the timing detector 32 a in the optical path of the first pulse laser beam 21 .
  • the first optical path length adjuster 7 a may make the first pulse laser beam 21 detour to change the optical path length of the first pulse laser beam 21 .
  • the first optical path length adjuster 7 a may change the optical path length of the first pulse laser beam. 21 under control by the laser system controller 20 .
  • FIG. 17 schematically shows a configuration of the first optical path length adjuster 7 a .
  • the first optical path length adjuster 7 a may include a right-angle prism 71 , two high-reflective mirrors 72 and 73 , plates 74 and 75 , and a uniaxial stage 76 .
  • the right-angle prism 71 may have a first surface 77 a and a second surface 77 b perpendicular to each other, each of which may be coated with a high-reflective film.
  • the right-angle prism 71 may be held by a holder 77 .
  • the holder 77 may be fixed to the plate 74 .
  • the right-angle prism 71 may be provided in the optical path of the first pulse laser beam 21 .
  • the two high-reflective mirrors 72 and 73 may be held by a holder 78 such that their reflective surfaces are perpendicular to each other.
  • the holder 78 may be fixed to the plate 75 .
  • the plate 75 may be fixed to the uniaxial stage 76 .
  • the uniaxial stage 76 may be configured to move the two high-reflective mirrors 72 and 73 in a direction substantially parallel to the optical path axis of the first pulse laser beam 21 reflected by the first surface 77 a of the right-angle prism 71 .
  • the first pulse laser beam 21 reflected by the first surface 77 a of the right-angle prism 71 may be reflected by the two high-reflective mirrors 72 and 73 and then be made incident on the second surface 77 b of the right-angle prism 71 .
  • the first pulse laser beam 21 being incident on the second surface 77 b of the right-angle prism 71 may emit from the second surface 77 b of the right-angle prism 71 along an extension line of the optical path axis of the first pulse laser beam 21 incident on the first surface 77 a of the right-angle prism 71 .
  • the laser system controller 20 may drive a motor 79 of the uniaxial stage 76 to move the two high-reflective mirrors 72 and 73 .
  • Moving the two high-reflective mirrors 72 and 73 by a distance X may cause the optical path length of the first pulse laser beam 21 to be changed by 2 ⁇ .
  • emitting timing of the first pulse laser beam 21 from the laser system 5 may be controlled.
  • the first to fifth optical path length adjusters 7 a to 7 e may have substantially the same configurations with each other.
  • the second optical path length adjuster 7 b may change the optical path length of the second pulse laser beam 22 between the second laser apparatus 2 b and the timing detector 32 b.
  • the third optical path length adjuster 7 c may change the optical path length of the third pulse laser beam 23 between the third laser apparatus 2 c and the timing detector 32 c.
  • the fourth optical path length adjuster 7 d may change the optical path length of the fourth pulse laser beam 24 between the fourth laser apparatus 2 d and the timing detector 32 d.
  • the fifth optical path length adjuster 7 e may change the optical path length of the fifth pulse laser beam 25 between the fifth laser apparatus 2 e and the timing detector 32 e.
  • FIG. 18 is a block diagram of the laser system controller 20 included in the laser annealing apparatus 1 shown in FIG. 16 .
  • the processor 20 b may send first to fifth signals for setting optical path lengths to the first to fifth optical path length adjusters 7 a to 7 e , respectively.
  • the processing in FIG. 18 may be substantially the same as that in FIG. 7 in other aspects.
  • FIG. 19 is a flowchart illustrating an operation of the processor 20 b in the laser system controller 20 shown in FIG. 16 .
  • the processor 20 b may perform feedback control on the first to fifth optical path length adjusters 7 a to 7 e in the following processing.
  • the processor 20 b may set the optical path lengths AL 1 to AL 5 adjusted by the first to fifth optical path length adjusters 7 a to 7 e to initial values AL 1 in to AL 5 in, respectively.
  • the processes at S 30 to S 50 a may be substantially the same as those described with reference to FIG. 9 and FIG. 10 .
  • the processor 20 b may update the optical path lengths AL 1 to AL 5 adjusted by the first to fifth optical path length adjusters 7 a to 7 e .
  • the optical path lengths AL 1 to AL 5 may be calculated as follows using the differences T 12 to T 15 between the second to fifth emitting timings T 2 out to T 5 out and the respective target values of them:
  • AL 1 to AL 5 in the right sides of the above-mentioned formulas may correspond to the optical path lengths having been set, and AL 1 to AL 5 in the left sides of the above-mentioned formulas may correspond to the updated optical path lengths.
  • the processes at S 70 and S 90 may be substantially the same as those described with reference to FIG. 9 and FIG. 11 .
  • the pulse width of the combined laser beam may be controlled.
  • the first to fifth pulse laser beams 21 to 25 may be emitted at substantially the same time at the emitting position of the laser system 5 .
  • the first embodiment, in which the timings of the first to fifth trigger signals are controlled may be modified to the configuration where the optical path lengths AL 1 to AL 5 are controlled so that the emitting timings from the laser system 5 coincide with each other.
  • the pulse energy values of the first to fifth pulse laser beams 21 to 25 may be controlled.
  • the pulse waveform of the combined laser beam emitted from the laser system 5 may become closer to the target pulse waveform.
  • the fourth embodiment includes the plurality of timing detectors 32 a to 32 e .
  • Emitting timings of the first to fifth pulse laser beams from the laser system 5 in which the optical path lengths AL 1 to AL 5 are set to respective predetermined values, may be stored in a memory. Based on the emitting timings, the optical path lengths AL 1 to AL 5 may be controlled so that the differences between the emitting timings of the first to fifth pulse laser beams from the laser system 5 approach predetermined values.
  • the optical path length adjusters 7 a to 7 e are provided in the optical paths between the first to fifth laser apparatuses and the corresponding timing detectors 32 a to 32 e .
  • the present disclosure is not limited to this.
  • the optical path length adjusters 7 a to 7 e may be provided between the respective timing detectors 32 a to 32 e and the beam combiner system 3 .
  • the optical path lengths L 1 to L 5 from the first to fifth positions 21 a to 25 a to the emitting position 26 a of the laser system may include the optical path lengths of the optical path length adjusters 7 a to 7 e , respectively.
  • FIG. 20 shows an exemplary configuration of the laser apparatus that can be used in each of the above-mentioned embodiments.
  • the first laser apparatus 2 a may include a master oscillator MO, a power amplifier PA, a pulse stretcher 16 , a pulse energy measuring unit 17 , a shutter 18 , and a laser controller 19 .
  • Configuration of each of the second to fifth laser apparatuses 2 b to 2 e may be substantially the same as that of the first laser apparatus 2 a.
  • the master oscillator MO may include a laser chamber 10 , a pair of electrodes 11 a and 11 b , a charger 12 , and a pulse power module (PPM) 13 .
  • the master oscillator MO may further include a high-reflective mirror 14 and an output coupling mirror 15 .
  • FIG. 21 shows an internal configuration of the laser chamber 10 viewed in a direction substantially perpendicular to the travelling direction of the laser beam.
  • the laser chamber 10 may store laser gases constituting a laser medium, including a rare gas such as argon, krypton or xenon, a buffer gas such as neon or helium, and a halogen gas such as chlorine or fluorine.
  • the pair of electrodes 11 a and 11 b may be provided in the laser chamber 10 as electrodes for exciting the laser medium by electric discharge.
  • the laser chamber 10 may have an opening, sealed by an insulating member 29 .
  • the electrode 11 a may be supported by the insulating member 29 and the electrode 11 b may be supported by a return plate 10 d .
  • the return plate 10 d may be electrically connected to an inner surface of the laser chamber 10 through electric wirings 10 e and 10 f described later.
  • conductive members 29 a may be molded.
  • the conductive members 29 a may apply high-voltage, which is supplied by the pulse power module 13 , to the electrode 11 a.
  • the charger 12 may be a direct-current power source for charging a charge capacitor C 0 of the pulse power module 13 at a predetermined voltage.
  • the pulse power module 13 may include a switch 13 a controlled by the laser controller 19 . When the switch 13 a turns ON, the pulse power module 13 may generate the pulsed high-voltage using electric energy in the charger 12 . The high-voltage may be applied to the pair of electrodes 11 a and 11 b.
  • the high-voltage applied to the pair of electrodes 11 a and 11 b may cause dielectric breakdown and cause the electric discharge between the pair of electrodes 11 a and 11 b .
  • Energy of the electric discharge may excite the laser medium in the laser chamber 10 to a high energy level.
  • the excited laser medium may then change to a low energy level, where the laser medium generates light according to the difference of the energy levels.
  • the laser chamber 10 may have windows 10 a and 10 b at respective ends of the laser chamber 10 .
  • the light generated in the laser chamber 10 may be emitted from the laser chamber 10 through the windows 10 a and 10 b.
  • the high-reflective mirror 14 may reflect the light emitted from the window 10 a of the laser chamber 10 at high reflectance to return the light to the laser chamber 10 .
  • the output coupling mirror 15 may transmit to output a part of the light emitted from the window 10 b of the laser chamber 10 and reflect to return another part of the light to the laser chamber 10 .
  • the high-reflective mirror 14 and the output coupling mirror 15 may thus constitute an optical resonator.
  • the light emitted from the laser chamber 10 may travel back and forth between the high-reflective mirror 14 and the output coupling mirror 15 .
  • the light may be amplified at every time to pass a laser gain region between the electrode 11 a and the electrode 11 b .
  • the pulse laser beam of the amplified light may be emitted through the output coupling mirror 15 .
  • the power amplifier PA may be provided in the optical path of the pulse laser beam emitted from the output coupling mirror 15 of the master oscillator MO.
  • the power amplifier PA may include, as in the master oscillator MO, a laser chamber 10 , a pair of electrodes 11 a and 11 b , a charger 12 , and a pulse power module (PPM) 13 . Configurations of these elements may be substantially the same as those in the master oscillator MO.
  • the power amplifier PA does not have to include the high-reflective mirror 14 or the output coupling mirror 15 .
  • the pulse laser beam, which entered the power amplifier PA through the window 10 a may once pass the laser gain region between the electrode 11 a and the electrode 11 b , and then be emitted through the window 10 b.
  • the pulse stretcher 16 may be provided in the optical path of the pulse laser beam emitted from the window 10 b of the power amplifier PA.
  • the pulse stretcher 16 may include a beam splitter 16 a , and first to fourth concave mirrors 16 b to 16 e.
  • the pulse laser beam emitted from the power amplifier PA may be made incident on a first surface of the beam splitter 16 a .
  • the beam splitter 16 a may transmit a part of the pulse laser beam incident on the first surface and reflect another part.
  • the first to fourth concave mirrors 16 b to 16 e may sequentially reflect the pulse laser beam reflected by the beam splitter 16 a .
  • the concave mirrors 16 b to 16 e may cause the pulse laser beam to be incident on a second surface of the beam splitter 16 a opposite to the first surface.
  • the first to fourth concave mirrors 16 b to 16 e may be arranged such that an image of the pulse laser beam reflected by the first surface of the beam splitter 16 a is transferred by the first to fourth concave mirrors 16 b to 16 e to the second surface of the beam splitter 16 a at a magnification of 1 to 1.
  • the beam splitter 16 a may reflect at least a part of the pulse laser beam incident on the second surface.
  • the pulse laser beam incident on the first surface and transmitted by the beam splitter 16 a and the pulse laser beam incident on the second surface and reflected by the beam splitter 16 a may be mutually superposed at substantially the same beam size and the same beam divergence.
  • the pulse stretcher 16 may thus stretch the pulse width of the pulse laser beam.
  • the pulse energy measuring unit 17 may be provided in the optical path of the pulse laser beam emitted from the pulse stretcher 16 .
  • the pulse energy measuring unit 17 may include a beam splitter 17 a , focusing optics 17 b , and an optical sensor 17 c.
  • the beam splitter 17 a may transmit a part of the pulse laser beam, emitted from the pulse stretcher 16 , at high transmittance toward the shutter 18 .
  • the beam splitter 17 a may reflect another part of the pulse laser beam toward the focusing optics 17 b .
  • the focusing optics 17 b may concentrate the light reflected by the beam splitter 17 a on a light-receiving surface of the optical sensor 17 c .
  • the optical sensor 17 c may detect the pulse energy of the pulse laser beam concentrated on the light-receiving surface and output data on the pulse energy to the laser controller 19 .
  • the laser controller 19 may send and receive various signals to and from the laser system controller 20 .
  • the laser controller 19 may receive, for example, the first trigger signal or data on the target pulse energy from the laser system controller 20 .
  • the laser controller 19 may send a setting signal of the charging voltage to the charger 12 or an instruction signal of turning ON or OFF the switch to the pulse power module 13 .
  • the laser controller 19 may receive data on the pulse energy from the pulse energy measuring unit 17 and control the charging voltage of the charger 12 according to the data on the pulse energy. By controlling the charging voltage of the charger 12 , the pulse energy of the laser beam may be controlled.
  • the laser controller 19 may further correct the timing of the trigger signal according to the charging voltage having been set, such that the electric discharge occurs at a predetermined constant timing from the oscillation trigger signal.
  • the shutter 18 may be provided in the optical path of the pulse laser beam transmitted by the beam splitter 17 a of the pulse energy measuring unit 17 .
  • the laser controller 19 may control the shutter 18 to close in a period from the timing of starting laser oscillation until the timing when the difference between the pulse energy received from the pulse energy measuring unit 17 and the target pulse energy comes within an acceptable range.
  • the laser controller 19 may control the shutter 18 to open when the difference between the pulse energy received from the pulse energy measuring unit 17 and the target pulse energy comes within the acceptable range.
  • the signal outputted from the timing detector 32 a in FIG. 1 may be substituted by the signal outputted from the optical sensor 17 c of the pulse energy measuring unit 17 .
  • the signal outputted from the optical sensor 17 c may be sent to the laser system controller 20 to show the emitting timing of the pulse laser beam 21 .
  • FIG. 20 shows that the laser apparatus includes the power amplifier PA and the pulse stretcher 16 .
  • the power amplifier PA or the pulse stretcher 16 may be omitted.
  • the laser apparatus may not be limited to the excimer laser apparatus.
  • a solid laser apparatus may be used. Such solid laser apparatus may emit third harmonic light having a wavelength of 355 nm or fourth harmonic light having a wavelength of 266 nm generated by a YAG laser.
  • FIG. 21 shows a configuration of the pulse power module 13 shown in FIG. 20 and an internal configuration of the laser chamber 10 viewed from a direction substantially parallel to a travelling direction of the laser beam.
  • Conductive members including the wall of the laser chamber 10 may be electrically connected to the ground potential.
  • the electrode 11 b may be electrically connected to the return plate 10 d , the electric wirings 10 e and 10 f , and the wall of the laser chamber 10 and then connected to the ground potential.
  • the first laser apparatus 2 a may include a timing detector 38 , instead of the timing detector 32 a shown in FIG. 1 .
  • the timing detector 38 may include a window 10 c attached to the laser chamber 10 of the master oscillator MO, focusing optics 38 a , and an optical sensor 38 b.
  • the window 10 c may transmit the light generated by the electric discharge between the pair of electrodes 11 a and 11 b .
  • the focusing optics 38 a may concentrate the light transmitted by the window 10 c on a light-receiving surface of the optical sensor 38 b .
  • the optical sensor 38 b may include a photodiode or a photoelectric tube.
  • the optical sensor 38 b may detect the light generated by the electric discharge between the pair of electrodes 11 a and 11 b and then send a signal indicating the timing of the electric discharge to the laser system controller 20 . Consequently, the timing of the electric discharge in the laser chamber and the timing when the pulse laser beam passes the first position may substantially synchronize with each other.
  • the pulse power module 13 may include the charge capacitor C 0 , the switch 13 a , a boosting transformer TC 1 , a plurality of magnetic switches Sr 1 to Sr 3 , and a plurality of capacitors C 1 to C 3 .
  • Each of the magnetic switches Sr 1 to Sr 3 may include a saturable reactor. Each of the magnetic switches Sr 1 to Sr 3 may be switched to a low impedance state when a time integral of the voltage across the magnetic switch becomes a predetermined value that depends on the characteristics of the magnetic switch.
  • a charging voltage V may be set by the laser controller 19 .
  • the charger 12 may charge the charge capacitor C 0 according to the charging voltage V having been set.
  • the switch 13 a in the pulse power module 13 may receive the trigger signal from the laser controller 19 . Upon receiving the trigger signal, the switch 13 a may turn ON. When the switch 13 a turns ON, electric current may flow from the charge capacitor C 0 to a primary side of the transformer TC 1 .
  • the electric current through the primary side of the transformer TC 1 in a first direction may cause induced current through a secondary side of the transformer TC 1 in a second direction opposite to the first direction.
  • the electric current through the secondary side of the transformer TC 1 may allow the time integral of the voltage across the magnetic switch Sr 1 to reach a threshold value.
  • the magnetic switch Sr 1 When the time integral of the voltage across the magnetic switch Sr 1 reaches the threshold value, the magnetic switch Sr 1 may be closed due to magnetic saturation.
  • Closing the magnetic switch Sr 1 may allow electric current to flow from the secondary side of the transformer TC 1 to the capacitor C 1 and to charge the capacitor C 1 .
  • the magnetic switch Sr 2 may be closed due to magnetic saturation.
  • Closing the magnetic switch Sr 2 may allow electric current to flow from the capacitor C 1 to the capacitor C 2 and to charge the capacitor C 2 .
  • the electric current to charge the capacitor C 2 may have a shorter pulse width than the electric current to charge the capacitor C 1 .
  • the magnetic switch Sr 3 may be closed due to magnetic saturation.
  • Closing the magnetic switch Sr 3 may allow electric current to flow from the capacitor C 2 to the capacitor C 3 and to charge the capacitor C 3 .
  • the electric current to charge the capacitor C 3 may have a shorter pulse width than the electric current to charge the capacitor C 2 .
  • the pulse width of the electric current may thus be compressed while the electric current flows from the capacitor C 1 to the capacitor C 2 and from the capacitor C 2 to the capacitor C 3 , sequentially.
  • a current meter 39 which detects electric discharge current, may be used as the timing detector.
  • the current meter 39 may be an electric current probe to detect the timing of electric discharge. The timing when the electric discharge occurs in the laser chamber and the timing when the pulse laser beam passes the first position may thus substantially synchronize with each other.
  • the pulse energy measuring unit 17 or the timing detector 38 to detect the timing of the electric discharge may be used instead of the timing detector 32 a shown in FIG. 1 .
  • the first to fifth positions 21 a to 25 a may be the positions of each outlet of the pulse laser beam of the laser apparatus or the positions of each output coupling mirror 15 of the master oscillator, assuming that the first to fifth laser apparatuses have substantially the same configurations with each other.
  • FIG. 22 shows another example of the beam combiner.
  • a beam combiner 342 may include a fly eye lens 342 a and condenser optics 342 b.
  • the fly eye lens 342 a may be constituted by an ultraviolet-transmitting substrate, such as a synthetic quartz substrate or a calcium fluoride substrate, on which multiple concave or convex lenses are formed.
  • the fly eye lens 342 a may be provided at the position where the first to fifth pulse laser beams 21 to 25 emitted from the incident optics 33 overlap with each other.
  • the lenses included in the fly eye lens 342 a may be arranged in the cross section of a plurality of pulse laser beams including the first to fifth pulse laser beams 21 to 25 .
  • the lenses may transmit respective parts of the plurality of pulse laser beams toward the condenser optics 342 b and expand beam widths of the respective parts.
  • the fly eye lens 342 a may thus form multiple point light sources as secondary light sources using the pulse laser beams.
  • the fly eye lens 342 a may include a set of cylindrical concave or convex lenses arranged in one direction and another set of cylindrical concave or convex lenses arranged in another direction perpendicular to the one direction.
  • the condenser optics 342 b may include at least one convex lens.
  • the condenser optics 342 b may extend over the optical paths of the respective parts of the plurality of pulse laser beams expanded by the respective lenses of the fly eye lens 342 a.
  • the fly eye lens 342 a may be provided such that a front-side focal plane of the condenser optics 342 b substantially coincides with respective focal positions of the fly eye lens 342 a .
  • the condenser optics 342 b may thus collimate each of the parts of the plurality of pulse laser beams expanded by the respective lenses of the fly eye lens 342 a , such that each of the parts has substantially parallel rays.
  • the condenser optics 342 b may be provided such that a rear-side focal plane of the condenser optics 342 b substantially coincides with a light-receiving surface of the fly eye lens 421 of the exposure apparatus 4 .
  • the condenser optics 342 b may thus make the respective parts, expanded by the respective lenses of the fly eye lens 342 a , enter substantially the same portion of the fly eye lens 421 .
  • the pulse laser beam in which the parts are overlapping with each other at the light-receiving surface of the fly eye lens 421 of the exposure apparatus 4 may have small variation in light intensity distribution in a cross section of the pulse laser beam.
  • FIG. 23 shows a still other example of the beam combiner.
  • a beam combiner 337 may include a first right-angle prism 3371 , a second right-angle prism 3372 , and a trapezoidal prism 3373 .
  • the pulse waveform measuring device 6 may further be provided in the optical path between the beam combiner 337 and the fly eye lens 421 of the exposure apparatus 4 .
  • the first right-angle prism 3371 may have a triangular prism shape whose base surface parallel to the paper surface has a right-angled triangular shape.
  • the first right-angle prism 3371 may have two side-surfaces perpendicular to each other, each of which may be coated with a high-reflective film.
  • the respective two side-surfaces of the first right-angle prism 3371 may constitute a first reflective surface 3371 a and a second reflective surface 3371 b.
  • the first right-angle prism 3371 may be arranged such that the first reflective surface 3371 a of the first right-angle prism 3371 is parallel to a below-mentioned first reflective surface 3373 a of the trapezoidal prism 3373 .
  • the first right-angle prism 3371 may be arranged such that the first reflective surface 3371 a of the first right-angle prism 3371 intersects the optical path axis of the first pulse laser beam 21 at an angle of 45 degrees.
  • the first right-angle prism 3371 may be arranged such that the second reflective surface 3371 b of the first right-angle prism 3371 intersects the optical path axis of the second pulse laser beam 22 at an angle of 45 degrees.
  • the second right-angle prism 3372 may have a triangular prism shape whose base surface parallel to the paper surface has a right-angled triangular shape.
  • the second right-angle prism 3372 may have two side-surfaces perpendicular to each other, each of which may be coated with a high-reflective film.
  • the respective two side-surfaces of the second right-angle prism 3372 may constitute a first reflective surface 3372 a and a second reflective surface 3372 b.
  • the second right-angle prism 3372 may be arranged such that the first reflective surface 3372 a of the second right-angle prism 3372 is substantially parallel to a below-mentioned second reflective surface 3373 b of the trapezoidal prism 3373 .
  • the second right-angle prism 3372 may be arranged such that the first reflective surface 3372 a of the second right-angle prism 3372 intersects the optical path axis of the fourth pulse laser beam 24 at an angle of 45 degrees.
  • the second right-angle prism 3372 may be arranged such that the second reflective surface 3372 b of the second right-angle prism 3372 intersects the optical path axis of the fifth pulse laser beam 25 at an angle of 45 degrees.
  • the trapezoidal prism 3373 may be made by an ultraviolet-transmitting material, such as synthetic quartz or calcium fluoride.
  • the trapezoidal prism 3373 may have a quadrangular prism shape whose base surface parallel to the paper surface has a quadrangular shape.
  • the base surface of the trapezoidal prism 3373 has a shape of isosceles trapezoid whose non-parallel and opposite sides are perpendicular to each other.
  • the trapezoidal prism 3373 may have two opposite side-surfaces which are non-parallel to each other, each of which may be coated with a high-reflective film.
  • the respective two opposite side-surfaces which are non-parallel to each other may constitute the first reflective surface 3373 a and the second reflective surface 3373 b.
  • the trapezoidal prism 3373 may have the other two opposite side-surfaces which are parallel to each other, each of which may be coated with an anti-reflective film.
  • the respective two opposite side-surfaces which are parallel to each other may constitute a first transmitting surface 3373 c and a second transmitting surface 3373 d.
  • the trapezoidal prism 3373 may be arranged such that the second transmitting surface 3373 d of the trapezoidal prism 3373 is perpendicular to the optical path axis of the third pulse laser beam 23 .
  • the first pulse laser beam 21 emitted from the first laser apparatus 2 a may be reflected by the first reflective surface 3371 a of the first right-angle prism 3371 .
  • the first pulse laser beam 21 may be reflected by the first reflective surface 3373 a of the trapezoidal prism 3373 and then enter the light-receiving surface of the fly eye lens 421 at a right angle.
  • the second pulse laser beam 22 emitted from the second laser apparatus 2 b may be reflected by the second reflective surface 3371 b of the first right-angle prism 3371 .
  • the second pulse laser beam 22 may be reflected by the first reflective surface 3373 a of the trapezoidal prism 3373 and then enter the light-receiving surface of the fly eye lens 421 at a right angle.
  • the third pulse laser beam 23 emitted from the third laser apparatus 2 c may enter the second transmitting surface 3373 d of the trapezoidal prism 3373 to travel inside the prism.
  • the third pulse laser beam 23 incident on the trapezoidal prism 3373 may emit from the first transmitting surface 3373 c and then enter the light-receiving surface of the fly eye lens 421 at a right angle.
  • the fourth pulse laser beam 24 emitted from the fourth laser apparatus 2 d may be reflected by the first reflective surface 3372 a of the second right-angle prism 3372 .
  • the fourth pulse laser beam 24 may be reflected by the second reflective surface 3373 b of the trapezoidal prism 3373 and then enter the light-receiving surface of the fly eye lens 421 at a right angle.
  • the fifth pulse laser beam 25 emitted from the fifth laser apparatus 2 e may be reflected by the second reflective surface 3372 b of the second right-angle prism 3372 .
  • the fifth pulse laser beam 25 may be reflected by the second reflective surface 3373 b of the trapezoidal prism 3373 and then enter the light-receiving surface of the fly eye lens 421 at a right angle.
  • the beam combiner 337 may thus align the first to fifth pulse laser beams 21 to 25 such that the optical path axes of them are substantially parallel to each other, before entering the pulse waveform measuring device 6 .
  • These pulse laser beams 21 to 25 may be partially reflected by the beam splitter 61 , transmitted by the focusing optics 62 , and then be made incident on the light-receiving surface of the optical sensor 63 provided at the focal position of the focusing optics 62 .
  • the pulse waveform measuring device 6 of this arrangement may measure the pulse waveform of the combined laser beam, even if the pulse laser beams of the combined laser beam are spaced apart from each other.
  • the pulse laser beams 21 to 25 transmitted by the beam splitter 61 may enter the fly eye lens 421 .
  • the beam combiner 337 does not need to make the first to fifth pulse laser beams 21 to 25 overlap with each other.
  • the pulse waveform measuring device 6 may be omitted.
  • FIG. 24 is a block diagram schematically illustrating a configuration of a controller.
  • a controller such as the laser system controller 20
  • the laser system controller 20 in the above-mentioned embodiments may be constituted by a general-purpose control device, such as a computer or a programmable controller.
  • the controller may be constituted as described below.
  • the controller may include a processor 1000 and other elements connected to the processor 1000 .
  • Such elements may include a storage memory 1005 , a user interface 1010 , a parallel input/output (I/O) controller 1020 , a serial I/O controller 1030 , and an analog-to-digital (A/D) and digital-to-analog (D/A) converter 1040 .
  • the processor 1000 may include a central processing unit (CPU) 1001 and other elements connected to the CPU 1001 including a memory 1002 , a timer 1003 , and a graphics processing unit (GPU) 1004 .
  • CPU central processing unit
  • GPU graphics processing unit
  • the processor 1000 may read out programs stored in the storage memory 1005 .
  • the processor 1000 may execute the read-out programs, read out data from the storage memory 1005 in accordance with the execution of the programs, or store data in the storage memory 1005 .
  • the parallel I/O controller 1020 may be connected to devices 1021 to 102 x communicable through parallel I/O ports.
  • the parallel I/O controller 1020 may control communication using digital signals through the parallel I/O ports that is performed in the process where the processor 1000 executes programs.
  • the serial I/O controller 1030 may be connected to devices 1031 to 103 x communicable through serial I/O ports.
  • the serial I/O controller 1030 may control communication using digital signals through the serial I/O ports that is performed in the process where the processor 1000 executes programs.
  • the A/D and D/A converter 1040 may be connected to devices 1041 to 104 x communicable through analog ports.
  • the A/D and D/A converter 1040 may control communication using analog signals through the analog ports that is performed in the process where the processor 1000 executes programs.
  • the user interface 1010 may be configured to display progress of executing programs by the processor 1000 to an operator or to receive instructions by the operator to the processor 1000 to stop execution of the programs or to execute interruption processing.
  • the CPU 1001 of the processor 1000 may perform arithmetic processing of programs.
  • the memory 1002 may temporally store programs or temporally store data in the arithmetic process.
  • the timer 1003 may measure time or elapsed time.
  • the timer 1003 may output the time or the elapsed time to the CPU 1001 in accordance with the execution of the programs.
  • the GPU 1004 may process the image data in accordance with the execution of the programs and output the results to the CPU 1001 .
  • the devices 1021 to 102 x communicable through the parallel I/O ports, which are connected to the parallel I/O controller 1020 , may be the first to fifth laser apparatuses 2 a to 2 e , the exposure apparatus controller 40 , another controller, or the like, and may be used for sending or receiving the oscillation trigger signal or the signal indicating the passage timing.
  • the devices 1031 to 103 x communicable through the serial I/O ports, which are connected to the serial I/O controller 1030 , may be the first to fifth laser apparatuses 2 a to 2 e , the exposure apparatus controller 40 , another controller, or the like, and may be used for sending or receiving data.
  • the devices 1041 to 104 x communicable through the analog ports, which are connected to the A/D and D/A converter 1040 , may be various sensors, such as the pulse waveform measuring device 6 , or the like.
  • the controller may be capable of achieving the operation illustrated in each of the embodiments.

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JP6436989B2 (ja) 2018-12-12
KR20170017883A (ko) 2017-02-15
KR102164410B1 (ko) 2020-10-12
JPWO2015190012A1 (ja) 2017-04-20
US9806490B2 (en) 2017-10-31
WO2015189895A1 (ja) 2015-12-17
JPWO2015189895A1 (ja) 2017-04-20
US9991665B2 (en) 2018-06-05
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US20180013258A1 (en) 2018-01-11
US20170070023A1 (en) 2017-03-09

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