US20160381823A1 - Assembly structure and electronic device having the same - Google Patents

Assembly structure and electronic device having the same Download PDF

Info

Publication number
US20160381823A1
US20160381823A1 US15/164,214 US201615164214A US2016381823A1 US 20160381823 A1 US20160381823 A1 US 20160381823A1 US 201615164214 A US201615164214 A US 201615164214A US 2016381823 A1 US2016381823 A1 US 2016381823A1
Authority
US
United States
Prior art keywords
converting module
power converting
chip
circuit board
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/164,214
Other languages
English (en)
Inventor
Haoyi Ye
Jianhong Zeng
Yu Zhang
Peiqing Hu
Ziying Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS,INC. reassignment DELTA ELECTRONICS,INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HU, PEIQING, YE, HAOYI, ZENG, JIANHONG, ZHANG, YU, ZHOU, ZIYING
Publication of US20160381823A1 publication Critical patent/US20160381823A1/en
Priority to US17/004,194 priority Critical patent/US11503731B2/en
Priority to US18/045,180 priority patent/US20230059607A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • One aspect of the present disclosure provides an electronic device, including the assembly structure described above.
  • FIG. 2A is a schematic diagram of an assembly structure for providing power for a chip in which a power converting module is partly buried in a socket and directly contacts a circuit board, according to an embodiment of the present disclosure
  • FIGS. 2F-2G are schematic diagrams of an assembly structure for providing power for a chip in which a power converting module is entirely buried in a socket, according to a further embodiment of the present disclosure
  • FIGS. 12A-12G are schematic diagrams of functions and mutual connection relationships between power converting modules.
  • the power input pins 631 of the socket 65 are denoted by dashed circles, which may be distributed in different regions of surfaces of the socket 65 . Power received by respective regions may be different, which is denoted by current values in FIG. 7B .
  • the power output pins 632 (denoted by dashed boxes in FIG. 7B ) of the power converting module 63 may be arranged according to positions of the power input pins 631 of the socket, distributed on surfaces of the power converting module 63 . Pins with different shapes, sizes, and/or materials may be used according to power demand of the regions they are located, to achieve an aim of reducing power transmission losses.
  • the respective regions of surfaces of the power converting module 63 may have one or more pins.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Dc-Dc Converters (AREA)
  • Rectifiers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
US15/164,214 2015-06-26 2016-05-25 Assembly structure and electronic device having the same Abandoned US20160381823A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/004,194 US11503731B2 (en) 2015-06-26 2020-08-27 Assembly structure and electronic device having the same
US18/045,180 US20230059607A1 (en) 2015-06-26 2022-10-10 Assembly structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510362342.2 2015-06-26
CN201510362342.2A CN106332499A (zh) 2015-06-26 2015-06-26 一种用于芯片供电的组装结构、电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/004,194 Continuation US11503731B2 (en) 2015-06-26 2020-08-27 Assembly structure and electronic device having the same

Publications (1)

Publication Number Publication Date
US20160381823A1 true US20160381823A1 (en) 2016-12-29

Family

ID=56235613

Family Applications (3)

Application Number Title Priority Date Filing Date
US15/164,214 Abandoned US20160381823A1 (en) 2015-06-26 2016-05-25 Assembly structure and electronic device having the same
US17/004,194 Active 2036-10-20 US11503731B2 (en) 2015-06-26 2020-08-27 Assembly structure and electronic device having the same
US18/045,180 Pending US20230059607A1 (en) 2015-06-26 2022-10-10 Assembly structure

Family Applications After (2)

Application Number Title Priority Date Filing Date
US17/004,194 Active 2036-10-20 US11503731B2 (en) 2015-06-26 2020-08-27 Assembly structure and electronic device having the same
US18/045,180 Pending US20230059607A1 (en) 2015-06-26 2022-10-10 Assembly structure

Country Status (4)

Country Link
US (3) US20160381823A1 (zh)
EP (3) EP4221470A3 (zh)
CN (2) CN106332499A (zh)
TW (1) TWI563376B (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109412390A (zh) * 2017-08-15 2019-03-01 泰达电子股份有限公司 电源转换装置
US20190166715A1 (en) * 2017-11-29 2019-05-30 Beijing Baidu Netcom Science And Technology Co., Ltd. Cooling system for a data center
US10394291B2 (en) * 2017-11-29 2019-08-27 Facebook, Inc. Apparatus, system, and method for dissipating heat from expansion components
US10806061B2 (en) * 2017-11-20 2020-10-13 Gree Electric Appliances (Wuhan) Co., Ltd Control method and apparatus for smart power component, storage medium and processor
CN112684858A (zh) * 2019-10-17 2021-04-20 英飞凌科技奥地利有限公司 具有嵌入式功率设备模块的电子系统和处理器基板
US20210120676A1 (en) * 2019-10-17 2021-04-22 Infineon Technologies Austria Ag Electronic System and Interposer Having an Embedded Power Device Module
US11019756B2 (en) * 2017-04-20 2021-05-25 Mitsubishi Electric Corporation Power conversion device
US11183934B2 (en) 2019-10-17 2021-11-23 Infineon Technologies Americas Corp. Embedded substrate voltage regulators
US20230078561A1 (en) * 2021-09-16 2023-03-16 International Business Machines Corporation Vertical power delivery packaging structure

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109412389B (zh) * 2017-08-15 2020-11-06 泰达电子股份有限公司 电源转换装置
CN113556916B (zh) * 2020-04-26 2023-02-28 台达电子企业管理（上海）有限公司 数据处理装置
CN114079371A (zh) * 2020-08-18 2022-02-22 华为技术有限公司 电子设备
CN112148081B (zh) * 2020-09-11 2022-06-03 北京比特大陆科技有限公司 多相交错降压电源和电子设备
CN115411956A (zh) * 2021-05-28 2022-11-29 华为技术有限公司 一种电流传输板、芯片系统及电子设备
US20230198177A1 (en) * 2021-12-17 2023-06-22 International Business Machines Corporation Separable interface cable structure for high voltage under-module power input

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060055432A1 (en) * 2004-08-31 2006-03-16 Kabushiki Kaisha Toshiba Semiconductor module
US20060109623A1 (en) * 2004-11-24 2006-05-25 Harris Shaun L Apparatus and method for multiprocessor circuit board
US20060126297A1 (en) * 2004-12-13 2006-06-15 Belady Christian L Processor module with thermal dissipation device
US20060181857A1 (en) * 2005-02-16 2006-08-17 Belady Christian L Redundant power beneath circuit board
US20060187646A1 (en) * 2005-02-18 2006-08-24 Belson Steven A Multi-processor module with redundant power
US20070013080A1 (en) * 2005-06-29 2007-01-18 Intel Corporation Voltage regulators and systems containing same
US20090296360A1 (en) * 2008-06-02 2009-12-03 Doblar Drew G Voltage regulator attach for high current chip applications
US20100102327A1 (en) * 2008-02-26 2010-04-29 International Rectifier Corporation (El Segundo, Ca) Semiconductor device and passive component integration in a semiconductor package
US20120025298A1 (en) * 2010-07-29 2012-02-02 Alpha And Omega Semiconductor Incorporated Wafer level chip scale package
US8379400B2 (en) * 2009-10-06 2013-02-19 Shinko Electric Industries Co., Ltd. Interposer mounted wiring board and electronic component device
US20130221537A1 (en) * 2012-02-28 2013-08-29 Huawei Technologies Co., Ltd. Semiconductor device and electronic apparatus
US8982563B2 (en) * 2011-06-28 2015-03-17 Oracle International Corporation Chip package to support high-frequency processors
US20150223320A1 (en) * 2014-01-31 2015-08-06 Hs Elektronik Systeme Gmbh Pcb embedded power module

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636918A (en) * 1982-07-30 1987-01-13 Rogers Corporation Decoupled integrated circuit package
WO2001065344A2 (en) * 2000-02-18 2001-09-07 Incep Technologies, Inc. Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
US7952194B2 (en) * 2001-10-26 2011-05-31 Intel Corporation Silicon interposer-based hybrid voltage regulator system for VLSI devices
KR100596776B1 (ko) * 2004-01-08 2006-07-04 주식회사 하이닉스반도체 멀티 칩 어셈블리 및 이의 구동 방법
US7402912B2 (en) * 2005-12-15 2008-07-22 International Business Machines Corporation Method and power control structure for managing plurality of voltage islands
US7778041B2 (en) * 2006-06-28 2010-08-17 Hon Hai Precision Ind. Co., Ltd. Interconnection system between CPU and voltage regulator
US8498117B2 (en) * 2006-11-16 2013-07-30 Advanced Micro Devices, Inc. Variable mount voltage regulator
US8582333B2 (en) * 2008-06-30 2013-11-12 Intel Corporation Integration of switched capacitor networks for power delivery
TW201306685A (zh) * 2011-07-28 2013-02-01 Nichepac Technology Inc 電路板模組之堆疊
TWM474236U (zh) * 2013-07-31 2014-03-11 Delta Electronics Inc 變壓器結構

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060055432A1 (en) * 2004-08-31 2006-03-16 Kabushiki Kaisha Toshiba Semiconductor module
US20060109623A1 (en) * 2004-11-24 2006-05-25 Harris Shaun L Apparatus and method for multiprocessor circuit board
US20060126297A1 (en) * 2004-12-13 2006-06-15 Belady Christian L Processor module with thermal dissipation device
US20060181857A1 (en) * 2005-02-16 2006-08-17 Belady Christian L Redundant power beneath circuit board
US20060187646A1 (en) * 2005-02-18 2006-08-24 Belson Steven A Multi-processor module with redundant power
US20070013080A1 (en) * 2005-06-29 2007-01-18 Intel Corporation Voltage regulators and systems containing same
US20100102327A1 (en) * 2008-02-26 2010-04-29 International Rectifier Corporation (El Segundo, Ca) Semiconductor device and passive component integration in a semiconductor package
US20090296360A1 (en) * 2008-06-02 2009-12-03 Doblar Drew G Voltage regulator attach for high current chip applications
US8379400B2 (en) * 2009-10-06 2013-02-19 Shinko Electric Industries Co., Ltd. Interposer mounted wiring board and electronic component device
US20120025298A1 (en) * 2010-07-29 2012-02-02 Alpha And Omega Semiconductor Incorporated Wafer level chip scale package
US8982563B2 (en) * 2011-06-28 2015-03-17 Oracle International Corporation Chip package to support high-frequency processors
US20130221537A1 (en) * 2012-02-28 2013-08-29 Huawei Technologies Co., Ltd. Semiconductor device and electronic apparatus
US20150223320A1 (en) * 2014-01-31 2015-08-06 Hs Elektronik Systeme Gmbh Pcb embedded power module

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11019756B2 (en) * 2017-04-20 2021-05-25 Mitsubishi Electric Corporation Power conversion device
CN109412390A (zh) * 2017-08-15 2019-03-01 泰达电子股份有限公司 电源转换装置
US10806061B2 (en) * 2017-11-20 2020-10-13 Gree Electric Appliances (Wuhan) Co., Ltd Control method and apparatus for smart power component, storage medium and processor
US10888033B2 (en) * 2017-11-29 2021-01-05 Beijing Baidu Netcom Science And Technology Co., Ltd. Cooling system for a data center
US20190166715A1 (en) * 2017-11-29 2019-05-30 Beijing Baidu Netcom Science And Technology Co., Ltd. Cooling system for a data center
US10394291B2 (en) * 2017-11-29 2019-08-27 Facebook, Inc. Apparatus, system, and method for dissipating heat from expansion components
US11147165B2 (en) * 2019-10-17 2021-10-12 Infineon Technologies Austria Ag Electronic system and interposer having an embedded power device module
US20210120675A1 (en) * 2019-10-17 2021-04-22 Infineon Technologies Austria Ag Electronic System and Processor Substrate Having an Embedded Power Device Module
US20210120676A1 (en) * 2019-10-17 2021-04-22 Infineon Technologies Austria Ag Electronic System and Interposer Having an Embedded Power Device Module
US11071206B2 (en) * 2019-10-17 2021-07-20 Infineon Technologies Austria Ag Electronic system and processor substrate having an embedded power device module
CN112684858A (zh) * 2019-10-17 2021-04-20 英飞凌科技奥地利有限公司 具有嵌入式功率设备模块的电子系统和处理器基板
US11183934B2 (en) 2019-10-17 2021-11-23 Infineon Technologies Americas Corp. Embedded substrate voltage regulators
US11552049B2 (en) 2019-10-17 2023-01-10 Infineon Technologies Austria Ag Embedded power device module, processor substrate and electronic system
US11683889B2 (en) 2019-10-17 2023-06-20 Infineon Technologies Austria Ag Processor interposer and electronic system including the processor interposer
US11817786B2 (en) 2019-10-17 2023-11-14 Infineon Technologies Ag Embedded substrate voltage converter module
US20230078561A1 (en) * 2021-09-16 2023-03-16 International Business Machines Corporation Vertical power delivery packaging structure
US11799374B2 (en) * 2021-09-16 2023-10-24 International Business Machines Corporation Vertical power delivery packaging structure

Also Published As

Publication number Publication date
US20200396855A1 (en) 2020-12-17
TWI563376B (en) 2016-12-21
US11503731B2 (en) 2022-11-15
CN106332499A (zh) 2017-01-11
EP3110238A2 (en) 2016-12-28
TW201701115A (zh) 2017-01-01
EP4221470A3 (en) 2023-09-13
EP3110238A3 (en) 2017-04-26
CN111315112A (zh) 2020-06-19
EP4221470A2 (en) 2023-08-02
US20230059607A1 (en) 2023-02-23
EP3986094A2 (en) 2022-04-20
EP3986094A3 (en) 2022-07-20
EP3110238B1 (en) 2021-11-03

Similar Documents

Publication Publication Date Title
US11503731B2 (en) Assembly structure and electronic device having the same
US10651744B1 (en) Method and apparatus for delivering power to semiconductors
US10681829B2 (en) Electrical junction box with removable sealing cover
US11942260B2 (en) Power module
US9977476B2 (en) Power supply apparatus
US11876520B1 (en) Method and apparatus for delivering power to semiconductors
EP3107120B1 (en) Power semiconductor module
US10811958B2 (en) Water-cooling power supply module
EP3104412B1 (en) Power semiconductor module
US20170196118A1 (en) Power Supply And Method
US20200260586A1 (en) Power module and manufacturing method thereof
US11320879B2 (en) Power supply module and electronic device
US20220078916A1 (en) Voltage regulator module
CN111711358A (zh) 电压调节模块
CN111952293A (zh) 功率模块及其制造方法
EP3407478B1 (en) Power conversion device
CN218004845U (zh) 具有汇流排线和陶瓷导热层的功率模块
CN116825732A (zh) 一种功率模组和功率转换装置
CN116488477A (zh) 一种逆变器设备

Legal Events

Date Code Title Description
AS Assignment

Owner name: DELTA ELECTRONICS,INC., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YE, HAOYI;ZENG, JIANHONG;ZHANG, YU;AND OTHERS;REEL/FRAME:038717/0728

Effective date: 20150715

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION