US20160263714A1 - Adjustable heat pipe thermal unit - Google Patents
Adjustable heat pipe thermal unit Download PDFInfo
- Publication number
- US20160263714A1 US20160263714A1 US15/162,513 US201615162513A US2016263714A1 US 20160263714 A1 US20160263714 A1 US 20160263714A1 US 201615162513 A US201615162513 A US 201615162513A US 2016263714 A1 US2016263714 A1 US 2016263714A1
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- plate
- die
- providing
- heat pipe
- adjustable heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/08—Tolerance compensating means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Definitions
- FIG. 1 illustrate a thermal unit positioned on die structures on a warped substrate, in accordance with certain embodiments.
- FIG. 2 illustrates a thermal unit positioned on die structures having different heights, in accordance with certain embodiments.
- FIG. 3 illustrates a thermal unit positioned on die structures using contact plates, in accordance with certain embodiments.
- FIG. 3 illustrates a heat pipe, in accordance with certain embodiments
- FIG. 4 illustrates a contact plate including a plurality of springs and heat pipes thereon, in accordance with certain embodiments.
- FIG. 5 illustrates a flow chart of process operations for forming an assembly, in accordance with certain embodiments.
- drawings included herein include a representation of various electronic and/or mechanical devices.
- the actual appearance of the fabricated structures may appear different while still incorporating the claimed structures of the illustrated embodiments.
- the drawings may show only the structures necessary to understand the illustrated embodiments. Additional structures known in the art have not been included to maintain the clarity of the drawings.
- Certain embodiments relate to a system for thermal control including a thermal unit comprising a main plate and one or more contact plates coupled to the main plate through springs, and adjustable heat pipes positioned between the contact plates and the main plate to facilitate heat transfer therebetween.
- FIG. 1 illustrates an assembly used to regulate the temperature of one or more die structures 2 positioned on a substrate 4 through solder connections 6 .
- a thermal unit assembly 8 is thermally coupled to the die structures 2 .
- the thermal unit 8 is used to transfer heat away from the die structures 2 .
- the thermal unit 8 as illustrated in FIG. 1 includes a main plate 10 and a plurality of contact plates 12 .
- the contact plates 12 are brought into thermal contact with the die structures 2 .
- a thermal interface material 14 may be positioned between the contact plates 12 and the die structures 2 , if desired. Any suitable thermal interface material, including, but not limited to, metals, polymers, composites, and greases, may be utilized.
- the springs 16 may act to absorb and apply force to position the contact plates 12 into satisfactory thermal contact with the die structures 2 .
- the heat pipes 18 may act to transfer heat from the contact plates 12 to the main plate 10 and vice-versa, so that the temperature of the die structures 2 may be controlled.
- the heat pipes 18 may also act to accommodate the movement of the contact plate and springs when they adjust to different die heights.
- the heat pipes 18 are be configured to be adjustable so that a good thermal contact can be maintained despite variations in the vertical position of a surface or of adjacent surfaces. Both the heat pipes 18 and springs 16 provide sufficient compliance to accommodate die height (vertical position) variations. Such variations may occur for a number of reasons, including, but not limited to, manufacturing variations, warpage or deformations arising during testing. Such variations may result, for example, in die structures having a curved surface or multiple die structures having different heights.
- the substrate 4 and die structures 2 are somewhat warped.
- the contact plates 12 are able to achieve satisfactory thermal contact with the surface of the die structure 2 (through the thermal interface material 14 ) despite the warped die surface.
- a force may be applied through the contact plate to the die structures 2 . The application of such force may act to at least partially flatten out the die structures 2 (and the substrate 4 ) and enable a better thermal contact to be made between the contact plates 12 and the die structures 2 .
- FIG. 2 illustrates the thermal unit of FIG. 1 positioned on die structures 20 , 22 on substrate 24 .
- Any suitable connection between the die structures 20 , 22 and substrate 24 may be utilized.
- the die structure 20 has a shorter height than the die structure 22 .
- Good thermal contact is made by the contact plates 12 due to the ability of the springs 16 and heat pipe 18 to flex and adjust to the height of the particular die structure 20 , 22 .
- the springs 16 and the heat pipe 18 on the contact plate 12 on the die structure 22 on the right side of FIG. 2 are more compressed than the springs 16 and heat pipe 18 on the contact plate 12 on the die structure 20 on the left side of FIG. 2 , to account for the higher vertical position of the die structure 22 .
- a thermal interface material such as the thermal interface material 14 illustrated in FIG. 1 may be used between the contact plates 12 and the die structures 20 , 22 , if desired.
- FIG. 3 illustrates a thermal unit in which different configurations of contact plates are used.
- Contact plate 12 includes an adjustable heat pipe and spring structure.
- Contact plate 12 ′ does not utilize a heat pipe to thermally couple to the main plate 10 .
- the contact plate 12 ′ itself is thermally coupled to the main plate using any suitable coupling mechanism including, but not limited to, bolting it to the main plate 10 or using an adhesive to connect it to the main plate 10 .
- a thermal interface material such as the thermal interface material 14 of FIG. 1 may be positioned between the contact plate 12 ′ and the main plate 10 , if desired.
- Such a configuration may find application in situations such as testing operations in which one die is under different conditions from another die and as a result, different heat transfer mechanisms are used. For example, one die may be subjected to higher power during testing operations and may generate a temperature condition in which a more direct heat transfer method (such as that illustrated in FIG. 3 ) may be used.
- a more direct heat transfer method such as that illustrated in FIG. 3
- variations in die structure height may be accounted for.
- Embodiments may include varying numbers of contact plates 12 , springs 16 , and heat pipes 18 .
- effective temperature regulation of die structures at different heights for example, in a package such as a multi-chip electronic package (MCP)
- MCP multi-chip electronic package
- the main plate 10 may comprise any suitable structure for transferring heat and may in certain embodiments be formed from a block of material such as a nickel (Ni) coated copper (Cu) plate.
- the main plate 10 may have pathways positioned therein for fluid flow and may also include various components for controlling the temperature therein.
- the contact plates 12 , 12 ′ may comprise any suitable structure for transferring heat and may in certain embodiments also be formed from a block of material such as Ni coated Cu.
- the springs 16 may be formed from any suitable material, including, but not limited to, metals.
- the heat pipes 18 may comprise any suitable structure for transferring heat and may in certain embodiments be formed from a Cu tube having a heat transfer mechanism therein.
- a heat transfer mechanism is a fluid (for example, water) positioned within the tube that can boil, travel up the tube towards the main plate, then cool and condense near the main plate and drip back down the tube towards the contact plate.
- Certain embodiments may also include a wicking structure within the tube.
- Other configurations for the heat pipes 18 are also possible, and the structure does not necessarily have to be tubular.
- the heat pipes 18 may be substantially C-shaped. This shape enables the heat pipes 18 to be adjustable and flex in response to a force applied thereto.
- the flexibility allows the heat pipes 18 to adjust their vertical position in response to a change in the vertical position of one of the die structures 20 , 22 .
- die 22 may reach a higher temperature than die 20 .
- the thermal expansion of the die 22 itself, or the thermal expansion mismatch with the underlying package may cause the upper surface of substrate 22 may be at a higher vertical position than the upper surface of substrate 20 .
- the heat pipe 18 operates within the assembly over a range of distances of up to about 1 mm.
- a change in the distance between the main plates 10 and the contact plates 12 of up to 1 mm may occur, which means that the vertical position of either of the illustrates contact plates 12 can change up to 1 mm to allow adjustment for differences in the vertical position of either of the die structures 2 .
- the structure of the heat pipe itself permits it to compress (flex) over a range of distances up to 1 mm and greater.
- a force may be applied to hold the contact plate on the device.
- most or all of a mechanical force is applied through the springs 16 .
- Such force may vary and in certain embodiments may be up to 100 pounds or more. As noted above in connection with FIG. 1 , such forces may also counteract warpage and act to flatten out the device.
- FIG. 5 illustrates a contact plate 12 having a plurality of springs 16 and a plurality of heat pipes 18 positioned thereon, in accordance with certain embodiments.
- Any number of springs 16 may be used in various embodiments, and the springs may take any suitable shape.
- the springs 16 may in certain embodiments be positioned at the corner regions of the contact plate 12 . Other positions are also possible.
- the springs may in certain embodiments be attached to one or both of the contact plate 12 and the main plate 10 (as seen in FIGS. 1-2 ) using any suitable attachment mechanism. Alternatively, in certain embodiments the springs may be positioned on but not physically attached to the contact plate 12 or the main plate 10 .
- the springs 16 are configured to be able to apply substantial mechanical force and to provide compliance for achieving a good thermal contact between the contact plate 12 and the underlying devices.
- a heat pipe 18 may be used alone (no springs 16 ) between the main plate 10 and the contact plate 12 . Such an embodiment may be used, for example, if a relatively small amount of force is needed.
- FIG. 6 illustrates a flowchart of operations for performing a test procedure using a thermal unit in accordance with certain embodiments.
- Box 30 is positioning the device or devices to be tested (known as device under test or DUT) in a test unit.
- Box 32 is aligning the contact plates in the thermal unit with individual surfaces of the devices to be tested. For example, the individual surfaces may be die surfaces such as illustrated in FIGS. 1-2 .
- Box 34 is bringing individual contact plates into thermal contact with the individual surfaces.
- Box 36 is conducting testing and using the thermal unit to regulate the temperature by, for example, conducting excess heat away from the DUT's through the heat pipes. It should be appreciated that various additions, subtraction, and/or modifications may be made to the above operations described in connection with FIG. 5 , within the scope of various embodiments.
- a Cu heat pipe approximately 9 mm long and 4 mm in diameter was used. Water was used as a working fluid in the Cu heat pipe.
- the Cu heat pipe was attached to both the main plate and the contact plate, with approximately 4 mm of the heat pipe on each end being used for the attachment to the main plate and to the contact plate. Under an operating temperature of 60° C., the maximum heat removal capability was approximately 150 watts.
- heat may be supplied to a DUT from the thermal unit.
- die refers to a workpiece that is transformed by various process operations into a desired electronic device.
- a die is usually singulated from a wafer, and may be made of semiconducting, non-semiconducting, or combinations of semiconducting and non-semiconducting materials.
- Terms such as “first”, “second”, and the like, if used herein, do not necessarily denote any particular order, quantity, or importance, but are used to distinguish one element from another.
- top”, bottom”, “upper”, “lower”, “over”, “under”, “vertical” and the like are used for descriptive purposes and to provide a relative position and are not to be construed as limiting. Embodiments may be manufactured, used, and contained in a variety of positions and orientations.
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.
Description
- As electronic devices become smaller and more complex, heat dissipation becomes a significant issue in a variety of situations, such as testing.
- Embodiments are described by way of example, with reference to the accompanying drawings, which are not necessarily drawn to scale.
-
FIG. 1 illustrate a thermal unit positioned on die structures on a warped substrate, in accordance with certain embodiments. -
FIG. 2 illustrates a thermal unit positioned on die structures having different heights, in accordance with certain embodiments. -
FIG. 3 illustrates a thermal unit positioned on die structures using contact plates, in accordance with certain embodiments. -
FIG. 3 illustrates a heat pipe, in accordance with certain embodiments; -
FIG. 4 illustrates a contact plate including a plurality of springs and heat pipes thereon, in accordance with certain embodiments. -
FIG. 5 illustrates a flow chart of process operations for forming an assembly, in accordance with certain embodiments. - In order to show features of various embodiments most clearly, the drawings included herein include a representation of various electronic and/or mechanical devices. The actual appearance of the fabricated structures may appear different while still incorporating the claimed structures of the illustrated embodiments. Moreover, the drawings may show only the structures necessary to understand the illustrated embodiments. Additional structures known in the art have not been included to maintain the clarity of the drawings.
- Certain embodiments relate to a system for thermal control including a thermal unit comprising a main plate and one or more contact plates coupled to the main plate through springs, and adjustable heat pipes positioned between the contact plates and the main plate to facilitate heat transfer therebetween.
-
FIG. 1 illustrates an assembly used to regulate the temperature of one or more diestructures 2 positioned on asubstrate 4 throughsolder connections 6. In order to control the temperature of the diestructures 2, athermal unit assembly 8 is thermally coupled to the diestructures 2. Typically thethermal unit 8 is used to transfer heat away from the diestructures 2. Thethermal unit 8 as illustrated inFIG. 1 includes amain plate 10 and a plurality ofcontact plates 12. Thecontact plates 12 are brought into thermal contact with thedie structures 2. In certain embodiments athermal interface material 14 may be positioned between thecontact plates 12 and the diestructures 2, if desired. Any suitable thermal interface material, including, but not limited to, metals, polymers, composites, and greases, may be utilized. Between thecontact plates 12 and themain plate 10 are positionedsprings 16 andheat pipes 18. Thesprings 16 may act to absorb and apply force to position thecontact plates 12 into satisfactory thermal contact with thedie structures 2. Theheat pipes 18 may act to transfer heat from thecontact plates 12 to themain plate 10 and vice-versa, so that the temperature of thedie structures 2 may be controlled. Theheat pipes 18 may also act to accommodate the movement of the contact plate and springs when they adjust to different die heights. - The
heat pipes 18 are be configured to be adjustable so that a good thermal contact can be maintained despite variations in the vertical position of a surface or of adjacent surfaces. Both theheat pipes 18 andsprings 16 provide sufficient compliance to accommodate die height (vertical position) variations. Such variations may occur for a number of reasons, including, but not limited to, manufacturing variations, warpage or deformations arising during testing. Such variations may result, for example, in die structures having a curved surface or multiple die structures having different heights. - As illustrated in
FIG. 1 , thesubstrate 4 and diestructures 2 are somewhat warped. By use of thesprings 16 andheat pipe 18, thecontact plates 12 are able to achieve satisfactory thermal contact with the surface of the die structure 2 (through the thermal interface material 14) despite the warped die surface. To establish good thermal communication with the devices to be tested, and to counteract warpage, a force may be applied through the contact plate to thedie structures 2. The application of such force may act to at least partially flatten out the die structures 2 (and the substrate 4) and enable a better thermal contact to be made between thecontact plates 12 and thedie structures 2. -
FIG. 2 illustrates the thermal unit ofFIG. 1 positioned on diestructures substrate 24. Any suitable connection between the diestructures substrate 24 may be utilized. The diestructure 20 has a shorter height than the diestructure 22. Good thermal contact is made by thecontact plates 12 due to the ability of thesprings 16 andheat pipe 18 to flex and adjust to the height of theparticular die structure FIG. 2 , thesprings 16 and theheat pipe 18 on thecontact plate 12 on thedie structure 22 on the right side ofFIG. 2 are more compressed than thesprings 16 andheat pipe 18 on thecontact plate 12 on thedie structure 20 on the left side ofFIG. 2 , to account for the higher vertical position of thedie structure 22. Though not illustrated inFIG. 2 , in certain embodiments a thermal interface material such as thethermal interface material 14 illustrated inFIG. 1 may be used between thecontact plates 12 and the diestructures -
FIG. 3 illustrates a thermal unit in which different configurations of contact plates are used.Contact plate 12 includes an adjustable heat pipe and spring structure. Contactplate 12′ does not utilize a heat pipe to thermally couple to themain plate 10. Instead, thecontact plate 12′ itself is thermally coupled to the main plate using any suitable coupling mechanism including, but not limited to, bolting it to themain plate 10 or using an adhesive to connect it to themain plate 10. In certain embodiments, a thermal interface material such as thethermal interface material 14 ofFIG. 1 may be positioned between thecontact plate 12′ and themain plate 10, if desired. Such a configuration, with somecontact plates 12 utilizing aheat pipe 18, andother contact plates 12′ not using aheat pipe 18 and instead being directly coupled to the main plate, may find application in situations such as testing operations in which one die is under different conditions from another die and as a result, different heat transfer mechanisms are used. For example, one die may be subjected to higher power during testing operations and may generate a temperature condition in which a more direct heat transfer method (such as that illustrated inFIG. 3 ) may be used. By having adjacent die structures utilize the adjustable heat pipe and spring configuration (as inFIG. 3 ), variations in die structure height may be accounted for. - Embodiments may include varying numbers of
contact plates 12,springs 16, andheat pipes 18. By havingindividual contact plates 12 that are independently actuated and can adjust to changes in die height, effective temperature regulation of die structures at different heights, for example, in a package such as a multi-chip electronic package (MCP), can be carried out simultaneously because each contact plate can make a stable mechanical and thermal contact with the die, regardless of differences in die height (vertical position) or changes in the die height. This enables testing of such MCP packages to be efficiently carried out. - The
main plate 10 may comprise any suitable structure for transferring heat and may in certain embodiments be formed from a block of material such as a nickel (Ni) coated copper (Cu) plate. Themain plate 10 may have pathways positioned therein for fluid flow and may also include various components for controlling the temperature therein. - The
contact plates springs 16 may be formed from any suitable material, including, but not limited to, metals. Theheat pipes 18 may comprise any suitable structure for transferring heat and may in certain embodiments be formed from a Cu tube having a heat transfer mechanism therein. One example of such a heat transfer mechanism is a fluid (for example, water) positioned within the tube that can boil, travel up the tube towards the main plate, then cool and condense near the main plate and drip back down the tube towards the contact plate. Certain embodiments may also include a wicking structure within the tube. Other configurations for theheat pipes 18 are also possible, and the structure does not necessarily have to be tubular. - As illustrated in
FIGS. 1-2 , for example, theheat pipes 18 may be substantially C-shaped. This shape enables theheat pipes 18 to be adjustable and flex in response to a force applied thereto. UsingFIG. 2 as an example, the flexibility allows theheat pipes 18 to adjust their vertical position in response to a change in the vertical position of one of thedie structures die 22 itself, or the thermal expansion mismatch with the underlying package may cause the upper surface ofsubstrate 22 may be at a higher vertical position than the upper surface ofsubstrate 20. The flexibility of the heat pipes 18 (and springs 16 inFIG. 2 ) permits theplate 12 to adjust vertically and maintain a good thermal connection even with the change in vertical position of the upper surface of thesubstrate 22. This self-adjusting feature permitsadjacent plates 12 to move independently of one another to account for differences in the vertical position of the underlying surface. Thus, in adjacent die structures, if one has a different vertical position due to manufacturing variations, or has a changing vertical position during a testing procedure, such differences can be accounted for using the assembly including theadjustable heat pipes 18 positioned between themain plate 10 andcontact plates 12 as described above. - In certain embodiments, the
heat pipe 18 operates within the assembly over a range of distances of up to about 1 mm. Using the structure illustrated inFIGS. 1-2 as an example, in certain embodiments a change in the distance between themain plates 10 and thecontact plates 12 of up to 1 mm may occur, which means that the vertical position of either of the illustratescontact plates 12 can change up to 1 mm to allow adjustment for differences in the vertical position of either of thedie structures 2. In certain embodiments, the structure of the heat pipe itself permits it to compress (flex) over a range of distances up to 1 mm and greater. - While certain embodiments utilize a substantially C-shaped
heat pipe 18, other shapes for the heat pipe are also possible, including, but not limited to, a helical orspring shape 18′ as illustrated inFIG. 4 . To ensure good thermal communication with a device, a force may be applied to hold the contact plate on the device. In certain embodiments, most or all of a mechanical force is applied through thesprings 16. Such force may vary and in certain embodiments may be up to 100 pounds or more. As noted above in connection withFIG. 1 , such forces may also counteract warpage and act to flatten out the device. -
FIG. 5 illustrates acontact plate 12 having a plurality ofsprings 16 and a plurality ofheat pipes 18 positioned thereon, in accordance with certain embodiments. Any number ofsprings 16 may be used in various embodiments, and the springs may take any suitable shape. As illustrated inFIG. 5 , thesprings 16 may in certain embodiments be positioned at the corner regions of thecontact plate 12. Other positions are also possible. - The springs may in certain embodiments be attached to one or both of the
contact plate 12 and the main plate 10 (as seen inFIGS. 1-2 ) using any suitable attachment mechanism. Alternatively, in certain embodiments the springs may be positioned on but not physically attached to thecontact plate 12 or themain plate 10. Thesprings 16 are configured to be able to apply substantial mechanical force and to provide compliance for achieving a good thermal contact between thecontact plate 12 and the underlying devices. In certain embodiments, aheat pipe 18 may be used alone (no springs 16) between themain plate 10 and thecontact plate 12. Such an embodiment may be used, for example, if a relatively small amount of force is needed. - Thermal unit assemblies such as described above may be useful in a variety of applications, including device testing. Embodiments as described herein enable efficient testing of thin electronic packages including, for example, sub-200 micron thick core packages and coreless packages that include multiple die structures.
FIG. 6 illustrates a flowchart of operations for performing a test procedure using a thermal unit in accordance with certain embodiments.Box 30 is positioning the device or devices to be tested (known as device under test or DUT) in a test unit.Box 32 is aligning the contact plates in the thermal unit with individual surfaces of the devices to be tested. For example, the individual surfaces may be die surfaces such as illustrated inFIGS. 1-2 .Box 34 is bringing individual contact plates into thermal contact with the individual surfaces. A mechanical force may be applied to ensure a good thermal contact is made and to counteract any curvature such as that due to warpage.Box 36 is conducting testing and using the thermal unit to regulate the temperature by, for example, conducting excess heat away from the DUT's through the heat pipes. It should be appreciated that various additions, subtraction, and/or modifications may be made to the above operations described in connection withFIG. 5 , within the scope of various embodiments. - In one example thermal unit assembly, a Cu heat pipe approximately 9 mm long and 4 mm in diameter was used. Water was used as a working fluid in the Cu heat pipe. The Cu heat pipe was attached to both the main plate and the contact plate, with approximately 4 mm of the heat pipe on each end being used for the attachment to the main plate and to the contact plate. Under an operating temperature of 60° C., the maximum heat removal capability was approximately 150 watts.
- It should be appreciated that many changes may be made within the scope of the embodiments described herein. For example, in certain embodiments heat may be supplied to a DUT from the thermal unit. The term die as used herein refers to a workpiece that is transformed by various process operations into a desired electronic device. A die is usually singulated from a wafer, and may be made of semiconducting, non-semiconducting, or combinations of semiconducting and non-semiconducting materials. Terms such as “first”, “second”, and the like, if used herein, do not necessarily denote any particular order, quantity, or importance, but are used to distinguish one element from another. Terms such as “top”, bottom”, “upper”, “lower”, “over”, “under”, “vertical” and the like, if used herein, are used for descriptive purposes and to provide a relative position and are not to be construed as limiting. Embodiments may be manufactured, used, and contained in a variety of positions and orientations.
- In the foregoing Detailed Description, various features are grouped together for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the invention require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter may lie in less than all features of a single disclosed embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate preferred embodiment.
- While certain exemplary embodiments have been described above and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive, and that embodiments are not restricted to the specific constructions and arrangements shown and described since modifications may occur to those having ordinary skill in the art.
Claims (21)
1-16. (canceled)
17. A method comprising:
providing a first plate and a second plate coupled to the first plate through an adjustable heat pipe;
positioning a surface of an electronic device into thermal contact with the second plate;
generating heat on the surface of the electronic device; and
transferring an amount of the heat through the second plate and through the adjustable heat pipe to the first plate.
18. The method of claim 17 , wherein the providing further comprises providing a plurality of springs between the first plate and the second plate.
19. The method of claim 17 , further comprising applying a mechanical force to thermally couple the second plate and the electronic device.
20. The method of claim 17 , wherein the providing further comprises providing a third plate coupled to the first plate through an additional adjustable heat pipe, and further comprising:
positioning an additional electronic device into contact with the third plate;
generating heat on the surface of the additional electronic device; and
transferring an amount of the heat through the third plate and through the additional adjustable heat pipe to the first plate.
21. A method comprising:
providing a first plate;
providing a second plate spaced apart from the first plate;
providing an adjustable heat pipe between the first plate and the second plate, the second plate thermally coupled to the first plate through the adjustable heat pipe;
providing a third plate spaced apart from the first plate and the second plate, the third plate thermally coupled to the first plate;
thermally coupling a first die to the second plate, wherein the second plate is positioned between the first plate and the first die; and
thermally coupling a second die to third plate, wherein the third plate is positioned between the first plate and the second die.
22. The method of claim 21 , further comprising providing an additional adjustable heat pipe between the first plate and the third plate, the third plate thermally coupled to the first plate through the additional adjustable heat pipe.
23. The method of claim 21 , further comprising providing the third plate with a greater thickness than that of the second plate.
24. The method of claim 21 , further comprising configuring the adjustable heat pipe to be substantially C-shaped.
25. The method of claim 21 , further comprising positioning the first die and the second die in a test rig, applying a current to the first die and the second die, transferring heat from the first die to the first plate through the second plate and the adjustable heat pipe, and transferring heat from the second die to the first plate through the third plate.
26. The method of claim 21 , further comprising providing a plurality of springs between the first plate and the second plate.
27. The method of claim 21 , further comprising providing the adjustable heat pipe with a tubular structure.
28. The method of claim 21 , further comprising configuring the adjustable heat pipe to be adjustable in a range of up to 1 mm.
29. The method of claim 21 , further comprising a plurality of additional adjustable heat pipes positioned between the first plate and the second plate.
30. The method of claim 21 , wherein there are no adjustable heat pipes positioned between the first plate and the third plate.
31. The method of claim 21 , further comprising providing a thermal interface material between the first die and the second plate.
32. The method of claim 31 , further comprising providing a thermal interface material between the second die and the second plate, and between the second plate and the first plate.
33. A method comprising:
providing a first plate;
providing a second plate spaced apart from the first plate;
providing an adjustable heat pipe between the first plate and the second plate, the second plate thermally coupled to the first plate through the adjustable heat pipe;
providing a third plate spaced apart from the first plate and the second plate, the third plate thermally coupled to the first plate;
providing a first die and a second die positioned on a substrate so that the first die extends outward from the substrate a different distance than that of the second die; and
positioning the first die and the second die so that the first die is thermally coupled to the second plate, the second plate is positioned between the first plate and the first die, the second die is thermally coupled to the third plate, the third plate is positioned between the first plate and the second die, the first die is spaced apart from the first plate a first distance, the second die is spaced apart from the first plate a second distance, and the first distance is different than the second distance.
34. The method of claim 33 , further comprising providing the third plate with a different thickness than that of the second plate.
35. The method of claim 33 , further comprising providing a first plurality of additional adjustable heat pipes between the first plate and the second plate, and a second plurality of additional heat pipes positioned between the first plate and the third plate.
36. The method of claim 33 , wherein there are no adjustable heat pipes positioned between the first plate and the third plate.
Priority Applications (1)
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US15/162,513 US20160263714A1 (en) | 2012-09-29 | 2016-05-23 | Adjustable heat pipe thermal unit |
Applications Claiming Priority (2)
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US13/631,957 US9366482B2 (en) | 2012-09-29 | 2012-09-29 | Adjustable heat pipe thermal unit |
US15/162,513 US20160263714A1 (en) | 2012-09-29 | 2016-05-23 | Adjustable heat pipe thermal unit |
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US13/631,957 Division US9366482B2 (en) | 2012-09-29 | 2012-09-29 | Adjustable heat pipe thermal unit |
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US20160263714A1 true US20160263714A1 (en) | 2016-09-15 |
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US15/162,513 Abandoned US20160263714A1 (en) | 2012-09-29 | 2016-05-23 | Adjustable heat pipe thermal unit |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190045663A1 (en) * | 2018-06-25 | 2019-02-07 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US20200045850A1 (en) * | 2018-07-31 | 2020-02-06 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9743558B2 (en) * | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
GB2543549B (en) * | 2015-10-21 | 2020-04-15 | Andor Tech Limited | Thermoelectric Heat pump system |
US10730645B2 (en) * | 2017-04-21 | 2020-08-04 | The Boeing Company | System and method for shape memory alloy thermal interface |
CN110413079B (en) * | 2018-04-28 | 2022-09-09 | 伊姆西Ip控股有限责任公司 | Heat sink for an expansion card, expansion card comprising a heat sink and associated manufacturing method |
EP3966939A1 (en) * | 2019-12-02 | 2022-03-16 | Huawei Technologies Co., Ltd. | A device for transferring heat between a first module and a second module |
EP4367986A1 (en) * | 2021-07-07 | 2024-05-15 | Tesla, Inc. | Electronic assemblies and methods of manufacturing the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6343643B1 (en) * | 1999-12-15 | 2002-02-05 | Sun Microsystems, Inc. | Cabinet assisted heat sink |
US6385044B1 (en) * | 2001-07-27 | 2002-05-07 | International Business Machines Corporation | Heat pipe heat sink assembly for cooling semiconductor chips |
US20020185728A1 (en) * | 1999-12-06 | 2002-12-12 | Leonard Turner | Thermal transfer plate |
US20040052052A1 (en) * | 2002-09-18 | 2004-03-18 | Rivera Rudy A. | Circuit cooling apparatus |
US7547582B2 (en) * | 2006-09-26 | 2009-06-16 | International Business Machines Corporation | Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
US20110114294A1 (en) * | 2009-11-17 | 2011-05-19 | Apple Inc. | Heat removal in compact computing systems |
US8109321B2 (en) * | 2008-03-05 | 2012-02-07 | Alcatel Lucent | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7589962B1 (en) | 1997-07-29 | 2009-09-15 | Intel Corporation | Apparatus for cooling a heat dissipating device located within a portable computer |
US5944093A (en) * | 1997-12-30 | 1999-08-31 | Intel Corporation | Pickup chuck with an integral heat pipe |
US6189601B1 (en) | 1999-05-05 | 2001-02-20 | Intel Corporation | Heat sink with a heat pipe for spreading of heat |
US6639799B2 (en) | 2000-12-22 | 2003-10-28 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6542367B2 (en) | 2001-05-31 | 2003-04-01 | Intel Corporation | Securing heat sinks |
US6519153B1 (en) | 2001-08-08 | 2003-02-11 | Intel Corporation | Heat sink retention frame |
US6926955B2 (en) | 2002-02-08 | 2005-08-09 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
US7846778B2 (en) | 2002-02-08 | 2010-12-07 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
JP4391366B2 (en) * | 2003-09-12 | 2009-12-24 | 古河電気工業株式会社 | Heat sink with heat pipe and method of manufacturing the same |
US7042727B2 (en) | 2003-09-26 | 2006-05-09 | Intel Corporation | Heat sink mounting and interface mechanism and method of assembling same |
US20050117305A1 (en) | 2003-12-01 | 2005-06-02 | Ulen Neal E. | Integrated heat sink assembly |
US20060087816A1 (en) * | 2004-09-21 | 2006-04-27 | Ingo Ewes | Heat-transfer devices |
US7805955B2 (en) | 2006-12-30 | 2010-10-05 | Intel Corporation | Using refrigeration and heat pipe for electronics cooling applications |
US7766691B2 (en) | 2007-06-27 | 2010-08-03 | Intel Corporation | Land grid array (LGA) socket loading mechanism for mobile platforms |
US8069907B2 (en) * | 2007-09-13 | 2011-12-06 | 3M Innovative Properties Company | Flexible heat pipe |
JP4908610B2 (en) * | 2010-04-09 | 2012-04-04 | 株式会社東芝 | Electronics |
US8891235B2 (en) | 2012-06-29 | 2014-11-18 | Intel Corporation | Thermal interface for multi-chip packages |
-
2012
- 2012-09-29 US US13/631,957 patent/US9366482B2/en active Active
-
2016
- 2016-05-23 US US15/162,513 patent/US20160263714A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020185728A1 (en) * | 1999-12-06 | 2002-12-12 | Leonard Turner | Thermal transfer plate |
US6343643B1 (en) * | 1999-12-15 | 2002-02-05 | Sun Microsystems, Inc. | Cabinet assisted heat sink |
US6385044B1 (en) * | 2001-07-27 | 2002-05-07 | International Business Machines Corporation | Heat pipe heat sink assembly for cooling semiconductor chips |
US20040052052A1 (en) * | 2002-09-18 | 2004-03-18 | Rivera Rudy A. | Circuit cooling apparatus |
US7547582B2 (en) * | 2006-09-26 | 2009-06-16 | International Business Machines Corporation | Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
US8109321B2 (en) * | 2008-03-05 | 2012-02-07 | Alcatel Lucent | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
US20110114294A1 (en) * | 2009-11-17 | 2011-05-19 | Apple Inc. | Heat removal in compact computing systems |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190045663A1 (en) * | 2018-06-25 | 2019-02-07 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US10595439B2 (en) * | 2018-06-25 | 2020-03-17 | Intel Corporation | Movable heatsink utilizing flexible heat pipes |
US20200045850A1 (en) * | 2018-07-31 | 2020-02-06 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
US10980151B2 (en) * | 2018-07-31 | 2021-04-13 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
Also Published As
Publication number | Publication date |
---|---|
US9366482B2 (en) | 2016-06-14 |
US20140090816A1 (en) | 2014-04-03 |
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