US20160223230A1 - Evaporator with heat dissipating fins and refrigerant heat dissipating apparatus using the same - Google Patents

Evaporator with heat dissipating fins and refrigerant heat dissipating apparatus using the same Download PDF

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Publication number
US20160223230A1
US20160223230A1 US15/011,917 US201615011917A US2016223230A1 US 20160223230 A1 US20160223230 A1 US 20160223230A1 US 201615011917 A US201615011917 A US 201615011917A US 2016223230 A1 US2016223230 A1 US 2016223230A1
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United States
Prior art keywords
refrigerant
heat dissipating
evaporator
evaporator body
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/011,917
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English (en)
Inventor
Cheng-Chien WAN
Cheng-Feng Wan
Hao-Hui Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Man Zai Industrial Co Ltd
Original Assignee
Man Zai Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Man Zai Industrial Co Ltd filed Critical Man Zai Industrial Co Ltd
Assigned to MAN ZAI INDUSTRIAL CO., LTD. reassignment MAN ZAI INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, Hao-hui, WAN, CHENG-CHIEN, WAN, CHENG-FENG
Publication of US20160223230A1 publication Critical patent/US20160223230A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Definitions

  • the present invention relates to a heat dissipating apparatus, and more particularly to a refrigerant heat dissipating apparatus and an evaporator with heat dissipating fins thereof.
  • a heat dissipating apparatus When a conventional electronic device is working, the electronic device usually generates heat. In order to avoid malfunction or damage of the electronic device when the temperature of the electronic device is too high, a heat dissipating apparatus is installed at a heat generative source of the electronic device. The heat dissipating apparatus absorbs heat generated from the heat generative source and quickly conducts the heat to the outside.
  • the structure of the conventional refrigerant heat dissipating apparatus in the electronic device includes a plurality of conductive tubes connected between two condensing tubes.
  • a plurality of heat dissipating fins is connected to the conductive tubes to form a condenser.
  • the refrigerant heat dissipating apparatus also includes a heat dissipating element contacting the heat source, and two opposite sides of the heat dissipating element respectively have one of the conductive tubes connected with the two condensing tubes so as to form a closed recurring cycle.
  • a refrigerant is filled into the closed recurring cycle, and the refrigerant absorbs heat within the heat dissipating element and flows from the refrigerant tubes of the condenser to each of the conductive tubes.
  • the heat dissipating fins contact the conductive tube to conduct heat, and the refrigerant within the conductive tube is cooled down and passes through the refrigerant tube to flow back to the heat dissipating tube. Therefore, the heat dissipating apparatus with heat cycling function provides a cooling mechanism for the heat generative source of the electronic device.
  • a conventional refrigerant heat dissipating apparatus implements a first refrigerant tube.
  • the first refrigerant tube tilts and extends from a top of an evaporator.
  • the first refrigerant tube is connected with a top section of the condensing tube at one side of the condenser.
  • the conventional refrigerant heat dissipating apparatus also implements a second refrigerant tube.
  • the second refrigerant tube is connected with a bottom section of the condensing tube at another side of the condenser, which is laterally connected with an evaporating side. Therefore, when the refrigerant within the evaporator absorbs heat and is converted to the gaseous state, the refrigerant can flow along the first refrigerant tube and evaporate within the condenser.
  • the refrigerant within the evaporator dissipates heat and is converted to the liquid state, the refrigerant smoothly flows along the lateral second refrigerant tube into the evaporator.
  • the condenser is a flat assembled structure to reduce a height of the apparatus, so the refrigerant can smoothly flow within the closed refrigerant recurring cycle to achieve a high efficiency heat dissipating effect.
  • the heat dissipating efficiency of the aforementioned refrigerant heat dissipating apparatus is better than the conventional heat dissipating apparatus.
  • the heat dissipating efficiency by implementing the conversion of the refrigerant between the gaseous and liquid states and the flowing mechanism of the refrigerant between the evaporator and the condenser is limited.
  • An objective of the present invention is to provide an evaporator with heat dissipating fins and a refrigerant heat dissipating apparatus using the same to enhance a heat dissipating effect in the conventional refrigerant heat dissipating apparatus.
  • the evaporator with heat dissipating fins is provided in the present invention and comprises:
  • an evaporator body having:
  • a refrigerant heat dissipating apparatus comprises:
  • an evaporator with heat dissipating fins including:
  • a condenser including:
  • first refrigerant tube a first refrigerant tube, and one end of the first refrigerant tube connected with the refrigerant outlet at the top of the evaporator body and another end of the first refrigerant tube obliquely extended upward and connected with a top section of one of the two condensing tubes at one side of the condenser;
  • a second refrigerant tube and one end of the second refrigerant tube connected with the refrigerant inlet at the lateral side of the evaporator body and another end of the second refrigerant tube laterally extended and connected with a bottom section of the other one of the two condensing tubes at another side of the condenser so as to form a closed refrigerant recurring cycle by the evaporator, the condenser, the first refrigerant tube and the second refrigerant tube;
  • the development of the evaporator with the heat dissipating fins and the refrigerant heat dissipating apparatus using the same are to install multiple heat dissipating fins in the evaporator body, which includes an evaporating chamber.
  • the refrigerant heat dissipating apparatus is to have the first refrigerant tube and the second refrigerant tube connected between the evaporator and the condenser to form a closed recurring cycle and fill the refrigerant into the closed recurring cycle.
  • the refrigerant in the gaseous state is flowing upward to conduct heat to the top of the evaporator body with the heat dissipating fins.
  • the heat dissipating fins quickly conduct heat and most of the refrigerant in the gaseous state is condensed to the liquid state.
  • the refrigerant in the liquid state flows downward and absorbs heat generated by the heat generative source again. Therefore, most of the heat generated by the heat generative source vanishes quickly via the evaporator.
  • the rest of the refrigerant in the gaseous state which is not condensed, passes through the first refrigerant tube into the condenser.
  • the refrigerant in the gaseous state releases heat by the condenser and is converted to the liquid state.
  • the refrigerant in the liquid state flows back to the evaporator body via the second refrigerant tube to absorb heat again. Therefore, the refrigerant heat dissipating apparatus can achieve a high efficient heat dissipating effect
  • FIG. 1 is a perspective view of an evaporator in a preferred embodiment of the present invention
  • FIG. 2 is a perspective view of a refrigerant heat dissipating apparatus in the preferred embodiment of the present invention
  • FIG. 3 is a perspective view of the refrigerant heat dissipating apparatus in another preferred embodiment of the present invention.
  • FIG. 4 is a side schematic view of the refrigerant heat dissipating apparatus in the preferred embodiment shown in FIG. 2 ;
  • FIG. 5 is an operating view of the refrigerant heat dissipating apparatus in the preferred embodiment shown in FIG. 2 ;
  • FIG. 6 is a partially enlarged view of FIG. 5 .
  • the present invention relates to an evaporator 1 with heat dissipating fins and a refrigerant heat dissipating apparatus.
  • the refrigerant heat dissipating apparatus includes the evaporator 1 , a condenser 2 , a first refrigerant tube 3 , a second refrigerant tube 4 , and an appropriate amount of refrigerant 5 .
  • the evaporator 1 includes an evaporator body 10 and multiple heat dissipating fins 14 .
  • the evaporator body 10 is a hollow body made of a heat dissipating material and the evaporator body has an evaporating chamber 100 .
  • the evaporator body 10 includes a heat dissipating plate 11 , a refrigerant outlet 12 and a refrigerant inlet 13 .
  • the evaporating chamber 100 is disposed within the evaporator body 10 .
  • the heat dissipating plate 11 is disposed at a bottom of the evaporator body 10 .
  • the refrigerant outlet 12 is disposed at a top of the evaporator body 10 and communicates with the evaporating chamber 100 .
  • the refrigerant inlet 13 is disposed at a lateral side of the evaporator body 10 and communicates with the evaporating chamber 100 .
  • the heat dissipating fins 14 are sheet-like and made of heat conductive materials. The heat dissipating fins 14 are arranged at a peripheral surface of the evaporator body 10 and are heat conductively connected to each other. An air flow channel is formed between every two adjacent heat conduction fins 14 .
  • the condenser 2 includes two condensing tubes 2 A, 2 B, a plurality of heat dissipating tubes 20 , and a plurality of heat dissipating elements 21 .
  • Interiors of the condensing tubes 2 A, 2 B each respectively include a closed chamber.
  • the two condensing tubes 2 A, 2 B are laterally arranged and spaced at an interval.
  • the heat dissipating tubes 20 are tubes with heat conductive capabilities.
  • the heat dissipating tubes 20 are disposed from top to bottom between the two condensing tubes 2 A, 2 B and are parallel to each other.
  • the heat dissipating elements 21 are discretely disposed and thermally contacted with outer surfaces of the heat dissipating tubes 20 .
  • the heat dissipating elements 21 may be heat dissipating sheets, wavy sheets or any other structures with larger heat dissipating surface. As shown in the preferred embodiment in FIG. 2 or FIG. 3 , the heat dissipating element 21 is a wavy sheet.
  • the heat dissipating tube 20 of the condenser 2 is parallel to a longitudinal direction of arrangement of the heat dissipating fins 14 in the evaporator 1 .
  • FIG. 1 the preferred embodiment in FIG.
  • the heat dissipating tube 20 of the condenser 2 is perpendicular to the longitudinal direction of arrangement of the heat dissipating fins 14 in the evaporator 1 .
  • the direction of the air flow channel between the adjacent heat dissipating fins 14 is the same as the direction of the air flowing through the heat dissipating element 21 .
  • one end of the first refrigerant tube 3 is bent downward and connected with the refrigerant outlet 12 at the top of the evaporator body 10 .
  • the first refrigerant tube 3 is laterally extended and another end of the first refrigerant tube 3 is connected with a top section of one of the two condensing tube 2 A, which communicates with one side of the condenser 2 .
  • One end of the second refrigerant tube 4 is connected with the refrigerant inlet 13 at the lateral side of the evaporator body 10 , and the second refrigerant tube 4 is laterally extended and another end of the second refrigerant tube 4 is connected with a bottom section of the condensing tube 2 B, which communicates with another side of the condenser 2 so as to form a closed refrigerant recurring cycle by the evaporator body 10 , the condenser 2 , the first refrigerant tube 3 and the second refrigerant tube 4 .
  • the refrigerant 5 is filled into the closed recurring cycle and the refrigerant 5 may have liquid and gaseous state conversion and flows in the refrigerant recurring cycle.
  • the heat dissipating plate 11 at the bottom of the evaporator body 10 of the evaporator 1 in the refrigerant heat dissipating apparatus is heat conductively contacted with the heat generative source 6 of the electronic device.
  • the heat dissipating plate 11 is used to conduct the heat generated by the heat generative source 6 via the evaporator body 10 to the refrigerant 5 within the evaporator body 10 .
  • the refrigerant 5 within the evaporator body 10 absorbs heat and is converted to the gaseous state.
  • the refrigerant 5 in the gaseous state flows upward to conduct heat to the top of the evaporator body 10 with the heat dissipating fins 14 .
  • the heat dissipating fins 14 quickly conduct heat and most of the refrigerant 5 in the gaseous state is condensed to liquid state.
  • the refrigerant 5 in the liquid state flows downward and absorbs heat generated by the heat generative source 6 again. Therefore, most of the heat generated by the heat generative source 6 is dissipated quickly via the evaporator 1 .
  • the rest of the refrigerant 5 in the gaseous state which is not condensed, passes through the first refrigerant tube 3 into the condenser 2 .
  • the refrigerant 5 in the gaseous state firstly flows to the condensing tube 2 A at one side of the condenser 2 and disperses from the condensing tube 2 A to the condensing tube 2 B at another side of the condenser 2 via the heat dissipating tube 20 .
  • the heat is conducted and contacted with the heat dissipating elements 21 of the heat dissipating tubes 20 and an enlarged heat dissipating surface of the heat dissipating elements 21 is used to dissipate heat quickly and cool down the refrigerant 5 in the gaseous state within the heat dissipating tube 20 to condense to liquid state.
  • the refrigerant heat dissipating apparatus can achieve a high efficient heat dissipating effect.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US15/011,917 2015-02-04 2016-02-01 Evaporator with heat dissipating fins and refrigerant heat dissipating apparatus using the same Abandoned US20160223230A1 (en)

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TW104201792 2015-02-04
TW104201792U TWM505162U (zh) 2015-02-04 2015-02-04 冷媒式散熱裝置及其具有散熱鰭片的蒸發器

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108874105A (zh) * 2018-09-06 2018-11-23 郑州云海信息技术有限公司 一种用于高密服务器的cpu散热装置
US10264706B2 (en) * 2017-08-31 2019-04-16 Man Zai Industrial Co., Ltd. Phase change evaporator with heat-dissipating fins and phase change cooling device using the same
US10443960B2 (en) * 2017-08-02 2019-10-15 Man Zai Industrial Co., Ltd. Phase change material evaporator and heat dissipating apparatus using the same
CN112018059A (zh) * 2019-05-31 2020-12-01 华为技术有限公司 一种散热装置及电气设备
CN113784599A (zh) * 2016-08-24 2021-12-10 台达电子工业股份有限公司 散热组件

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107086471B (zh) * 2017-06-27 2023-10-27 青岛特来电新能源科技有限公司 用于箱式变电站的冷却设备和箱式变电站
TWI719675B (zh) * 2019-10-17 2021-02-21 萬在工業股份有限公司 液氣分離式熱交換裝置

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US20050063158A1 (en) * 2003-09-16 2005-03-24 Sgl Carbon Ag Cooling device for electronic and electrical components
US20050081534A1 (en) * 2003-10-17 2005-04-21 Osamu Suzuki Cooling device and electronic apparatus building in the same
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US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
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US7958935B2 (en) * 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US8130497B2 (en) * 2008-11-19 2012-03-06 Hitachi, Ltd. Blade server
US8345425B2 (en) * 2009-08-28 2013-01-01 Hitachi, Ltd. Cooling system and electronic apparatus applying the same therein
US20150184949A1 (en) * 2013-12-27 2015-07-02 Fujitsu Limited Cooling device and electronic equipment

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US5209078A (en) * 1991-08-16 1993-05-11 Conrad Wayne E Vacuum fluid cooling apparatus
US20050205239A1 (en) * 2001-12-27 2005-09-22 Showa Denko K.K. Ebullition cooling device for heat generating component
US20050063158A1 (en) * 2003-09-16 2005-03-24 Sgl Carbon Ag Cooling device for electronic and electrical components
US20050081534A1 (en) * 2003-10-17 2005-04-21 Osamu Suzuki Cooling device and electronic apparatus building in the same
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7958935B2 (en) * 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113784599A (zh) * 2016-08-24 2021-12-10 台达电子工业股份有限公司 散热组件
US10443960B2 (en) * 2017-08-02 2019-10-15 Man Zai Industrial Co., Ltd. Phase change material evaporator and heat dissipating apparatus using the same
US10264706B2 (en) * 2017-08-31 2019-04-16 Man Zai Industrial Co., Ltd. Phase change evaporator with heat-dissipating fins and phase change cooling device using the same
CN108874105A (zh) * 2018-09-06 2018-11-23 郑州云海信息技术有限公司 一种用于高密服务器的cpu散热装置
CN112018059A (zh) * 2019-05-31 2020-12-01 华为技术有限公司 一种散热装置及电气设备

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