US20160147258A1 - Method for assembling an electronic device - Google Patents
Method for assembling an electronic device Download PDFInfo
- Publication number
- US20160147258A1 US20160147258A1 US15/009,283 US201615009283A US2016147258A1 US 20160147258 A1 US20160147258 A1 US 20160147258A1 US 201615009283 A US201615009283 A US 201615009283A US 2016147258 A1 US2016147258 A1 US 2016147258A1
- Authority
- US
- United States
- Prior art keywords
- electronic device
- frame
- circuit board
- coupled
- input mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/0013—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by resilient members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
- H04M1/0252—Details of the mechanical connection between the housing parts or relating to the method of assembly by means of a snap-on mechanism
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49947—Assembling or joining by applying separate fastener
Definitions
- This invention is directed to mechanical features of an electronic device.
- the electronic device may include a frame, a bezel mounted to the frame, and a screen that includes a window and a display module mounted to the frame.
- the screen may not be supported in its entirety by the frame.
- a plate may be coupled to the frame such that the screen (e.g., the display module) rests on the plate. The plate may be selected to increase the rigidity of the bezel.
- the electronic device may include an input mechanism.
- button of the input mechanism may be metallic and need to be grounded. Because the input mechanism circuit board may be positioned between the button and the frame, the path for grounding the button may need to pass through the circuit board.
- the button may be grounded using at least one exposed screw that passes through the circuit board, where the screw is operative to couple the circuit board to the frame.
- the button may be grounded using a spring coupled to the circuit board and extending to reach at least one of the bezel and the frame. The spring may be electrically coupled to the button using a copper path.
- FIG. 1 is an exploded view of an electronic device in accordance with one embodiment of the invention
- FIGS. 2A and 2B are cross-sectional views of an a electronic device in which a window has been mounted in accordance with one embodiment of the invention
- FIG. 3 is an exploded view of an electronic device that includes an input mechanism in accordance with one embodiment of the invention.
- FIG. 4 is a top view of a circuit board in accordance with one embodiment of the invention.
- FIG. 1 is an exploded view of an electronic device in accordance with one embodiment of the invention.
- Electronic device 100 may include any suitable type of electronic device, including for example a media player such as an iPod® available by Apple Inc., of Cupertino, Calif., a cellular telephone (e.g., an iPhone® available from Apple Inc.), a personal digital assistant, a desktop computer, a laptop computer, gaming console, set-top box, television system or television system component (e.g., a recording device), or any other suitable electronic device.
- a media player such as an iPod® available by Apple Inc., of Cupertino, Calif.
- a cellular telephone e.g., an iPhone® available from Apple Inc.
- a personal digital assistant e.g., a personal digital assistant, a desktop computer, a laptop computer, gaming console, set-top box, television system or television system component (e.g., a recording device), or any other suitable electronic device.
- television system or television system component e.g.,
- Electronic device 100 may include a case formed from a bezel and a frame, a screen constructed from a window and a display module (e.g., as distinct elements or as a combined component) for displaying information to a user, and a user interface (e.g., a button) for providing inputs to the device.
- Frame 102 may provide the structure of electronic device 100 , and may be operative to support some or all of the components of the electronic device (e.g., a circuit board, an input mechanism, a screen, a hard drive, or a battery).
- a housing may be placed over the bottom of frame 102 (not shown), and bezel 130 may be placed over the top of frame 102 .
- frame 102 may instead include an aesthetically pleasing outer surface that may form part of the exterior of electronic device 100 .
- the housing and bezel 130 may be coupled to frame 102 using any suitable approach, including for example an adhesive, tape, a mechanical fastener (e.g., a screw), a mechanical element (e.g., snap), or any other suitable approach.
- Frame 102 may be manufactured using any suitable approach and from any suitable material.
- frame 102 may be manufactured using one or more of forging, machining, forming, stamping, molding, casting, tumbling, polishing, or any other suitable process.
- Frame 102 may be manufactured any suitable material, including for example plastic, a composite material, metal, polymers, or any other suitable material.
- frame 102 may be constructed from an electrically conductive material to serve as a ground for the electronic device.
- Bezel 130 may be manufactured from any suitable material and using any suitable approach.
- bezel 130 may be manufactured from plastic, a composite material, metal, polymers, or any other suitable material.
- bezel 130 may be manufactured from a metal (e.g., aluminum or stainless steel) and polished to provide an aesthetically pleasing finish.
- bezel 130 may be constructed using a Liquidmetal® alloy (available from Liquidmetal Technologies of Lake Forest, Calif.).
- Electronic device 100 may include display module 120 for providing displays to a user.
- Display module 120 may include any suitable display module, including for example an LCD or plasma screen.
- electronic device 100 may include window 122 operative to be placed in aperture 132 of bezel 130 such that that window 122 extends through bezel 130 .
- the outer surface of window 122 may be flush with outer surface 131 of bezel 131 to provide a uniform appearance, while bezel 130 may be placed against the bottom surface of window 122 .
- Window 122 may be coupled to the electronic device using any suitable approach.
- window 122 may be inserted into bezel 130 from either the inside or outside of bezel 130 , and coupled to the periphery of opening 103 using an adhesive, tape (e.g., double sided tape), mechanical fasteners, a gasket (e.g., gasket 124 ), or any other coupling mechanism.
- window 122 may include a glass outer member and a plastic inner member that includes a flange for coupling display module 120 to the electronic device.
- a more detailed description of an approach for coupling a glass outer surface to a plastic inner surface may be found in commonly owned U.S.
- Display module 120 may be retained in electronic device 120 using any suitable approach.
- frame 102 may include opening 103 substantially under display module 120 (e.g. for receiving an electronic device component, such as a battery) against which display module 120 may rest. Because the component may not have a uniform surface, or not be placed directly in contact with display module 120 , the display module may be susceptible to bending during drop events or during bend and squeeze events. If the loads applied to window 122 or display module 120 exceed a maximum, cracks in display module 120 may propagate and distort the display of content on display module 120 .
- electronic device 100 may include support plate 110 between display module 120 and the other components of electronic device 100 .
- Support plate 110 may be coupled to frame 102 such that support plate 110 is placed under substantially all of display module 120 .
- Plate 110 may be constructed from any material that has a suitable stiffness, including for example plastic, a composite material, a polymer, a metal, or any other suitable material.
- plate 110 may be constructed from stainless steel (e.g., 301 series stainless steel).
- display module 120 may be coupled to plate 110 (e.g., using an adhesive, tape, a mechanical fastener, or a mechanical element).
- Plate 110 may be coupled to frame 102 using any suitable approach.
- frame 102 may be constructed such that only three edges of plate 110 may rest on frame 102 .
- plate 110 may be operative to rest only on beams 104 , 105 and 106 of frame 102 , which may partially define the periphery of opening 103 .
- the remaining edge of plate 110 may include rib 112 .
- plate 110 may be retained between display module 120 and frame 102 by positioning features of frame 102 into steps or other features of frame 102 (e.g., and retaining the plate using gravity).
- plate 110 may include several tabs 114 , each tab 114 having a hole 116 operative to align with holes in bezel 130 and frame 102 used to couple bezel 130 to frame 102 .
- plate 110 may include four tabs 114 , each aligned with previously existing screw holes in bezel 130 and frame 102 . By aligning tabs 114 where previously existing screws were inserted into frame 102 , plate 110 may be coupled to frame 102 without significantly changing frame 102 or adding a new component to what may already be a small area.
- FIGS. 2A and 2B are cross-sectional views of an electronic device in which a window has been mounted in accordance with one embodiment of the invention.
- Electronic device 200 may include frame 202 , plate 210 , window 220 and bezel 230 , which may include some or all of the features described above in connection with frame 102 , plate 110 , display module 120 and bezel 130 ( FIG. 1 ).
- Window 220 may include chamfered edge 222 , which may be chamfered at any suitable angle (e.g., 35 degrees in FIG. 2A, 45 degrees in FIG. 2B ).
- Chamfered edge 222 may be operative to abut counterpart recessed edge 232 of bezel 230 .
- the angle of recessed edge 232 may be complimentary with the angle of chamfered edge 222 (e.g., 35 and 55 degrees in FIG. 2A , 45 and 45 degrees in FIG. 2B ).
- Chamfered edge 222 may extend around any suitable portion of the periphery of window 220 .
- chamfered edge 222 may extend along some or all of particular sides of window 220 (e.g., only along opposing sides of window 220 ), around the entire periphery of window 220 , or at discrete portions of the periphery of window 220 .
- recessed edge 232 may be chamfered inwardly from an outer surface to an inner surface of bezel 230 , and chamfered edge 222 may be chamfered outwardly from an outer portion to an inner portion of window 220 .
- Window 220 may thus be inserted into the back surface of bezel 230 and retained underneath bezel 230 .
- plate 210 may be coupled to bezel 230 (directly or via frame 202 ). Window 220 may then be trapped between bezel 230 and plate 210 .
- window 220 may in addition be coupled to bezel 230 or plate 210 (e.g., using an adhesive or tape).
- bezel 230 or plate 210 e.g., using an adhesive or tape.
- Other approaches for mounting a window to a device using a chamfer are described in commonly assigned U.S. patent application Ser. No. 12/172,073 filed Jul. 11, 2008, which is incorporated by reference herein in its entirety.
- the electronic device may include an input mechanism.
- the input mechanism may include several buttons that extend through the surface of the bezel (e.g., a click-wheel).
- FIG. 3 is an exploded view of an electronic device that includes an input mechanism in accordance with one embodiment of the invention.
- Electronic device 300 may include frame 302 and bezel 330 , which may include some or all of the features of frame 102 and bezel 130 ( FIG. 1 ).
- Bezel 330 may include aperture 332 operative to receive wheel 360 and button 362 , which may serve as the input mechanisms for the electronic device (e.g., the components of a click-wheel).
- Wheel 360 and button 362 may be electrically coupled to input mechanism circuit board 350 .
- Circuit board 350 may include several switches 352 (e.g., five dome switches), wherein each switch 352 is operative to align with one of the buttons of wheel 360 and button 362 . In response to an input on a button of wheel 360 or button 362 , the status of the switch associated with the selected button may be changed to indicate the input to the circuit board.
- switches 352 e.g., five dome switches
- button 362 may be formed from a metal or other conductive material. In such embodiments, it may be necessary to ground button 362 (e.g., electrically connect button 362 to frame 302 ) to avoid electrostatic discharge (ESD) Because board 350 may be positioned between button 362 and frame 302 (e.g., the ground), the path for grounding button 362 may be required to pass through board 350 .
- Electronic device 300 may include any suitable approach for creating a path to a ground through circuit board 350 .
- circuit board 350 may include exposed copper that may be placed in contact with frame 302 or bezel 330 to ground the circuit board. This approach, however, may not be sufficient to ground portions of wheel 360 and button 362 that are not in contact with circuit board 350 .
- board 350 may be coupled to frame 302 using screws 356 or another mechanical fastener.
- board 350 may include holes 354 which may be aligned with screw taps in frame 302 .
- Board 350 may then be coupled to frame 302 by screws 356 , which may pass through holes 354 and into frame 302 .
- screws 356 may remain exposed in board 350 once the board is coupled to frame 302 (e.g., solder resist may be removed from the vicinity of screws 356 ).
- button 362 when a charge has built up in button 362 and needs to be released, the charge may jump from button 362 to screws 356 and move down to frame 302 (e.g., because screws 356 may be metallic and provide a conductive path to the ground).
- board 350 may include one or more resistors for further directing charges from button 362 to move to screws 356 and away from other components of circuit board 350 .
- board 350 may instead or in addition include a specific component operative to ground button 362 .
- FIG. 4 is a top view of a circuit board in accordance with one embodiment of the invention.
- Board 450 may include several switches 452 (e.g., dome switches) operative to align with the buttons of the wheel and button of the input mechanism (e.g., wheel 360 and button 362 , FIG. 3 ).
- switches 452 e.g., dome switches
- board 450 may include another component for grounding the metallic button of the input mechanism (e.g., button 362 ).
- Board 450 may include one or more conductive springs 456 soldered to board 450 and operative to extend from board 450 and contact a ground surface (e.g., the bezel, which may be coupled to the frame, or the frame).
- a copper trace (not shown) may provide an electrical connection between exposed metal corners of switches 452 located underneath the center button (e.g., button 362 ) and springs 456 .
- charges may jump from the center button to the exposed metal corners of switches 452 , follow the copper path to springs 456 (e.g., because springs 456 may be constructed from a conductive material), and pass to the frame (or the bezel).
- board 450 may include one or more resistors on other paths accessible from the center button to act as a shield preventing charges accumulated in the button from jumping from the exposed metal corners of switches 452 into the traces of the board.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Telephone Set Structure (AREA)
- Liquid Crystal (AREA)
Abstract
An electronic device is provided. The device may include a plate placed behind a screen formed from a window and a display module to provide the screen with additional stiffness (e.g., to resist dropping events). The window may be maintained in the electronic device by trapping the window between a bezel and the display module. In some embodiments, the window may include a chamfered edge operative to be received by a recessed edge in the bezel. In some embodiments, the input mechanism of the electronic device may be metallic and need to be grounded, but may be surrounded by components or other non-grounding components. The device may include screws operative to pass through a circuit board to reach a frame, which may serve as a ground, where the screws are located in proximity of the button. In some embodiments, the circuit board may include an additional component for grounding the button
Description
- This application is a continuation patent application of U.S. patent application Ser. No. 14/258,589, filed Apr. 22, 2014 and titled “Method for Assembling an Electronic Device,” which is a continuation patent application of U.S. patent application Ser. No. 13/218,692, filed Aug. 26, 2011 and titled “Method for Assembling an Electronic Device,” now U.S. Pat. No. 8,701,279, which is a continuation patent application of U.S. patent application Ser. No. 12/204,497, filed September 4, 2008 and titled “Assembly of an Electronic Device,” now U.S. Pat. No. 8,023,260, which claims the benefit of U.S. Provisional Patent Application No. 60/967,505, filed Sep. 4, 2007 and titled “Assembly of an Electronic Device,” the disclosures of which are hereby incorporated by reference herein in their entireties.
- This invention is directed to mechanical features of an electronic device.
- An electronic device is provided. The electronic device may include a frame, a bezel mounted to the frame, and a screen that includes a window and a display module mounted to the frame. In some embodiments, the screen may not be supported in its entirety by the frame. To ensure that the screen does not crack or propagate cracks, a plate may be coupled to the frame such that the screen (e.g., the display module) rests on the plate. The plate may be selected to increase the rigidity of the bezel.
- In some embodiments, the electronic device may include an input mechanism. In some embodiments, button of the input mechanism may be metallic and need to be grounded. Because the input mechanism circuit board may be positioned between the button and the frame, the path for grounding the button may need to pass through the circuit board. In some embodiments, the button may be grounded using at least one exposed screw that passes through the circuit board, where the screw is operative to couple the circuit board to the frame. In some embodiments, the button may be grounded using a spring coupled to the circuit board and extending to reach at least one of the bezel and the frame. The spring may be electrically coupled to the button using a copper path.
- The above and other features of the present invention, its nature and various advantages will be more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, and in which:
-
FIG. 1 is an exploded view of an electronic device in accordance with one embodiment of the invention; -
FIGS. 2A and 2B are cross-sectional views of an a electronic device in which a window has been mounted in accordance with one embodiment of the invention; -
FIG. 3 is an exploded view of an electronic device that includes an input mechanism in accordance with one embodiment of the invention; and -
FIG. 4 is a top view of a circuit board in accordance with one embodiment of the invention. -
FIG. 1 is an exploded view of an electronic device in accordance with one embodiment of the invention.Electronic device 100 may include any suitable type of electronic device, including for example a media player such as an iPod® available by Apple Inc., of Cupertino, Calif., a cellular telephone (e.g., an iPhone® available from Apple Inc.), a personal digital assistant, a desktop computer, a laptop computer, gaming console, set-top box, television system or television system component (e.g., a recording device), or any other suitable electronic device.Electronic device 100 may include a case formed from a bezel and a frame, a screen constructed from a window and a display module (e.g., as distinct elements or as a combined component) for displaying information to a user, and a user interface (e.g., a button) for providing inputs to the device.Frame 102 may provide the structure ofelectronic device 100, and may be operative to support some or all of the components of the electronic device (e.g., a circuit board, an input mechanism, a screen, a hard drive, or a battery). To form the outer surface ofelectronic device 100, a housing may be placed over the bottom of frame 102 (not shown), andbezel 130 may be placed over the top offrame 102. In some embodiments,frame 102 may instead include an aesthetically pleasing outer surface that may form part of the exterior ofelectronic device 100. The housing andbezel 130 may be coupled toframe 102 using any suitable approach, including for example an adhesive, tape, a mechanical fastener (e.g., a screw), a mechanical element (e.g., snap), or any other suitable approach. -
Frame 102 may be manufactured using any suitable approach and from any suitable material. For example,frame 102 may be manufactured using one or more of forging, machining, forming, stamping, molding, casting, tumbling, polishing, or any other suitable process.Frame 102 may be manufactured any suitable material, including for example plastic, a composite material, metal, polymers, or any other suitable material. In some embodiments,frame 102 may be constructed from an electrically conductive material to serve as a ground for the electronic device. - Bezel 130 may be manufactured from any suitable material and using any suitable approach. For example,
bezel 130 may be manufactured from plastic, a composite material, metal, polymers, or any other suitable material. In some embodiments,bezel 130 may be manufactured from a metal (e.g., aluminum or stainless steel) and polished to provide an aesthetically pleasing finish. In some embodiments,bezel 130 may be constructed using a Liquidmetal® alloy (available from Liquidmetal Technologies of Lake Forest, Calif.). -
Electronic device 100 may includedisplay module 120 for providing displays to a user.Display module 120 may include any suitable display module, including for example an LCD or plasma screen. To protectdisplay module 120 from damage,electronic device 100 may includewindow 122 operative to be placed inaperture 132 ofbezel 130 such that thatwindow 122 extends throughbezel 130. The outer surface ofwindow 122 may be flush with outer surface 131 of bezel 131 to provide a uniform appearance, whilebezel 130 may be placed against the bottom surface ofwindow 122. -
Window 122 may be coupled to the electronic device using any suitable approach. In some embodiments,window 122 may be inserted intobezel 130 from either the inside or outside ofbezel 130, and coupled to the periphery of opening 103 using an adhesive, tape (e.g., double sided tape), mechanical fasteners, a gasket (e.g., gasket 124), or any other coupling mechanism. In some embodiments,window 122 may include a glass outer member and a plastic inner member that includes a flange forcoupling display module 120 to the electronic device. A more detailed description of an approach for coupling a glass outer surface to a plastic inner surface may be found in commonly owned U.S. patent application Ser. No. 11/843,205, filed Aug. 22, 2007, incorporated herein in its entirety. -
Display module 120 may be retained inelectronic device 120 using any suitable approach. In some embodiments,frame 102 may include opening 103 substantially under display module 120 (e.g. for receiving an electronic device component, such as a battery) against whichdisplay module 120 may rest. Because the component may not have a uniform surface, or not be placed directly in contact withdisplay module 120, the display module may be susceptible to bending during drop events or during bend and squeeze events. If the loads applied towindow 122 ordisplay module 120 exceed a maximum, cracks indisplay module 120 may propagate and distort the display of content ondisplay module 120. To provide additional stiffness to displaymodule 120,electronic device 100 may includesupport plate 110 betweendisplay module 120 and the other components ofelectronic device 100. -
Support plate 110 may be coupled toframe 102 such thatsupport plate 110 is placed under substantially all ofdisplay module 120.Plate 110 may be constructed from any material that has a suitable stiffness, including for example plastic, a composite material, a polymer, a metal, or any other suitable material. In some embodiments,plate 110 may be constructed from stainless steel (e.g., 301 series stainless steel). In some embodiments,display module 120 may be coupled to plate 110 (e.g., using an adhesive, tape, a mechanical fastener, or a mechanical element). -
Plate 110 may be coupled toframe 102 using any suitable approach. In some embodiments,frame 102 may be constructed such that only three edges ofplate 110 may rest onframe 102. For example,plate 110 may be operative to rest only onbeams frame 102, which may partially define the periphery ofopening 103. To ensure that the remaining edge ofplate 110 is sufficiently stiff to uniformly supportdisplay module 120, the remaining edge ofplate 110 may includerib 112. - In some embodiments,
plate 110 may be retained betweendisplay module 120 andframe 102 by positioning features offrame 102 into steps or other features of frame 102 (e.g., and retaining the plate using gravity). For example,plate 110 may includeseveral tabs 114, eachtab 114 having ahole 116 operative to align with holes inbezel 130 andframe 102 used to couplebezel 130 to frame 102. For example,plate 110 may include fourtabs 114, each aligned with previously existing screw holes inbezel 130 andframe 102. By aligningtabs 114 where previously existing screws were inserted intoframe 102,plate 110 may be coupled to frame 102 without significantly changingframe 102 or adding a new component to what may already be a small area. - In some embodiments, the window may include a chamfered edge by which the window may be retained in the bezel.
FIGS. 2A and 2B are cross-sectional views of an electronic device in which a window has been mounted in accordance with one embodiment of the invention.Electronic device 200 may includeframe 202,plate 210,window 220 andbezel 230, which may include some or all of the features described above in connection withframe 102,plate 110,display module 120 and bezel 130 (FIG. 1 ).Window 220 may include chamferededge 222, which may be chamfered at any suitable angle (e.g., 35 degrees inFIG. 2A, 45 degrees inFIG. 2B ).Chamfered edge 222 may be operative to abut counterpart recessededge 232 ofbezel 230. In some embodiments, the angle of recessededge 232 may be complimentary with the angle of chamfered edge 222 (e.g., 35 and 55 degrees inFIG. 2A , 45 and 45 degrees inFIG. 2B ).Chamfered edge 222 may extend around any suitable portion of the periphery ofwindow 220. For example, chamferededge 222 may extend along some or all of particular sides of window 220 (e.g., only along opposing sides of window 220), around the entire periphery ofwindow 220, or at discrete portions of the periphery ofwindow 220. - To retain
window 220 withinbezel 230, recessededge 232 may be chamfered inwardly from an outer surface to an inner surface ofbezel 230, and chamferededge 222 may be chamfered outwardly from an outer portion to an inner portion ofwindow 220.Window 220 may thus be inserted into the back surface ofbezel 230 and retained underneathbezel 230. Oncewindow 220 has been properly positioned in opening 103 (FIG. 1 ), and eachchamfered edge 222 ofwindow 220 equally abuts recessededges 232 ofbezel 230,plate 210 may be coupled to bezel 230 (directly or via frame 202).Window 220 may then be trapped betweenbezel 230 andplate 210. In some embodiments,window 220 may in addition be coupled tobezel 230 or plate 210 (e.g., using an adhesive or tape). Other approaches for mounting a window to a device using a chamfer are described in commonly assigned U.S. patent application Ser. No. 12/172,073 filed Jul. 11, 2008, which is incorporated by reference herein in its entirety. - In some embodiments, the electronic device may include an input mechanism. For example, the input mechanism may include several buttons that extend through the surface of the bezel (e.g., a click-wheel).
FIG. 3 is an exploded view of an electronic device that includes an input mechanism in accordance with one embodiment of the invention.Electronic device 300 may includeframe 302 andbezel 330, which may include some or all of the features offrame 102 and bezel 130 (FIG. 1 ).Bezel 330 may includeaperture 332 operative to receivewheel 360 andbutton 362, which may serve as the input mechanisms for the electronic device (e.g., the components of a click-wheel).Wheel 360 andbutton 362 may be electrically coupled to input mechanism circuit board 350. Circuit board 350 may include several switches 352 (e.g., five dome switches), wherein eachswitch 352 is operative to align with one of the buttons ofwheel 360 andbutton 362. In response to an input on a button ofwheel 360 orbutton 362, the status of the switch associated with the selected button may be changed to indicate the input to the circuit board. - In some embodiments,
button 362 may be formed from a metal or other conductive material. In such embodiments, it may be necessary to ground button 362 (e.g., electrically connectbutton 362 to frame 302) to avoid electrostatic discharge (ESD) Because board 350 may be positioned betweenbutton 362 and frame 302 (e.g., the ground), the path forgrounding button 362 may be required to pass through board 350.Electronic device 300 may include any suitable approach for creating a path to a ground through circuit board 350. In some embodiments, circuit board 350 may include exposed copper that may be placed in contact withframe 302 orbezel 330 to ground the circuit board. This approach, however, may not be sufficient to ground portions ofwheel 360 andbutton 362 that are not in contact with circuit board 350. - In some embodiments, board 350 may be coupled to frame 302 using
screws 356 or another mechanical fastener. For example, board 350 may includeholes 354 which may be aligned with screw taps inframe 302. Board 350 may then be coupled to frame 302 byscrews 356, which may pass throughholes 354 and intoframe 302. To usescrews 356 as a path to the ground, screws 356 may remain exposed in board 350 once the board is coupled to frame 302 (e.g., solder resist may be removed from the vicinity of screws 356). Then, when a charge has built up inbutton 362 and needs to be released, the charge may jump frombutton 362 toscrews 356 and move down to frame 302 (e.g., becausescrews 356 may be metallic and provide a conductive path to the ground). In some embodiments board 350 may include one or more resistors for further directing charges frombutton 362 to move toscrews 356 and away from other components of circuit board 350. - In some embodiments, board 350 may instead or in addition include a specific component operative to
ground button 362.FIG. 4 is a top view of a circuit board in accordance with one embodiment of the invention.Board 450 may include several switches 452 (e.g., dome switches) operative to align with the buttons of the wheel and button of the input mechanism (e.g.,wheel 360 andbutton 362,FIG. 3 ). Instead of or in addition to screws (e.g., screws 356,FIG. 3 ) forcoupling board 450 to the electronic device frame,board 450 may include another component for grounding the metallic button of the input mechanism (e.g., button 362).Board 450 may include one or moreconductive springs 456 soldered to board 450 and operative to extend fromboard 450 and contact a ground surface (e.g., the bezel, which may be coupled to the frame, or the frame). A copper trace (not shown) may provide an electrical connection between exposed metal corners ofswitches 452 located underneath the center button (e.g., button 362) and springs 456. To ground the center button, charges may jump from the center button to the exposed metal corners ofswitches 452, follow the copper path to springs 456 (e.g., becausesprings 456 may be constructed from a conductive material), and pass to the frame (or the bezel). In some embodiments,board 450 may include one or more resistors on other paths accessible from the center button to act as a shield preventing charges accumulated in the button from jumping from the exposed metal corners ofswitches 452 into the traces of the board. - The above described embodiments of the invention are presented for purposes of illustration and not of limitation, and the present invention is limited only by the claims which follow.
Claims (21)
1-18. (canceled)
19. An electronic device, comprising:
a structure having wall;
a frame coupled to the wall and serving as a circuit ground;
an input mechanism retained at least partially within one of the structure and the frame;
a circuit board positioned between the input mechanism and the frame; and
a display retained at least partially within one of the structure and the frame; wherein the input mechanism is grounded to the frame through the circuit board.
20. The electronic device of claim 19 , wherein the input mechanism is grounded using screw that passes through the circuit board.
21. The electronic device of claim 19 , further comprising a switch positioned on the circuit board below the input mechanism.
22. The electronic device of claim 21 , wherein the switch is electrically coupled to the frame.
23. The electronic device of claim 19 , further comprising a conductive spring electrically coupling the circuit board to the frame.
24. The electronic device of claim 21 , wherein the structure comprises:
a housing positioned below and coupled to the frame; and
a bezel positioned above and coupled to the frame.
25. The electronic device of claim 24 , wherein the bezel comprises:
a first aperture formed through a planar surface configured to receive the input mechanism; and
a second aperture formed through the planar surface configured to receive a window.
26. The electronic device of claim 25 , wherein the input mechanism is positioned in the first aperture of the bezel.
27. The electronic device of claim 25 , wherein further comprising the window physically coupled to the bezel and positioned within the second aperture wherein an outer surface of the window is flush with the planar surface.
28. The electronic device of claim 27 , further comprising:
a display module positioned adjacent the window within the second aperture of the bezel; and
a support plate physically coupled between the display module and the frame.
29. The electronic device of claim 28 , wherein the support plate is coupled to the frame.
30. The electronic device of claim 28 , wherein the support plate is formed from at least one of:
a composite material;
a polymer; or
a metal.
31. The electronic device of claim 28 , wherein further comprising at least one of an adhesive or a tape that physically couples the display module to the support plate.
32. An electronic device, comprising:
an electrically conductive frame;
a wall coupled to the electrically conductive frame;
a circuit board electrically grounded to the electrically conductive frame;
a screw electrically and physically coupling the circuit board to the electrically conductive frame; and
an input mechanism coupled to the circuit board.
33. The electronic device of claim 32 , wherein the input mechanism comprises one of a button or a click wheel.
34. The electronic device of claim 32 , further comprising a conductive spring that grounds the circuit board to the electrically conductive frame.
35. The electronic device of claim 32 , wherein the circuit board includes:
a trace; and
a resistor positioned between the input mechanism and the trace that shields the trace from charge accumulated by the input mechanism.
36. An electronic device, comprising:
a structure;
a display positioned within the structure;
a gasket coupling the display to the structure;
a frame coupled to the structure;
a circuit board electrically coupled to the frame; and
an input mechanism coupled to the circuit board.
37. The electronic device of claim 36 , wherein the display is coupled to the frame by a support plate.
38. The electronic device of claim 36 , further comprising a conductive fastener that electrically and physically couples the circuit board to the frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/009,283 US20160147258A1 (en) | 2007-09-04 | 2016-01-28 | Method for assembling an electronic device |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96750507P | 2007-09-04 | 2007-09-04 | |
US12/204,497 US8023260B2 (en) | 2007-09-04 | 2008-09-04 | Assembly of an electronic device |
US13/218,692 US8701279B2 (en) | 2007-09-04 | 2011-08-26 | Method for assembling an electronic device |
US14/258,589 US9263842B2 (en) | 2007-09-04 | 2014-04-22 | Method for assembling an electronic device |
US15/009,283 US20160147258A1 (en) | 2007-09-04 | 2016-01-28 | Method for assembling an electronic device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/258,589 Continuation US9263842B2 (en) | 2007-09-04 | 2014-04-22 | Method for assembling an electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20160147258A1 true US20160147258A1 (en) | 2016-05-26 |
Family
ID=40407115
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/204,497 Active 2029-06-20 US8023260B2 (en) | 2007-09-04 | 2008-09-04 | Assembly of an electronic device |
US13/218,692 Active 2029-01-17 US8701279B2 (en) | 2007-09-04 | 2011-08-26 | Method for assembling an electronic device |
US14/258,589 Active 2028-12-26 US9263842B2 (en) | 2007-09-04 | 2014-04-22 | Method for assembling an electronic device |
US15/009,283 Abandoned US20160147258A1 (en) | 2007-09-04 | 2016-01-28 | Method for assembling an electronic device |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/204,497 Active 2029-06-20 US8023260B2 (en) | 2007-09-04 | 2008-09-04 | Assembly of an electronic device |
US13/218,692 Active 2029-01-17 US8701279B2 (en) | 2007-09-04 | 2011-08-26 | Method for assembling an electronic device |
US14/258,589 Active 2028-12-26 US9263842B2 (en) | 2007-09-04 | 2014-04-22 | Method for assembling an electronic device |
Country Status (1)
Country | Link |
---|---|
US (4) | US8023260B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112423469A (en) * | 2021-01-04 | 2021-02-26 | 四川赛狄信息技术股份公司 | Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7889139B2 (en) * | 2007-06-21 | 2011-02-15 | Apple Inc. | Handheld electronic device with cable grounding |
WO2009072148A1 (en) * | 2007-12-03 | 2009-06-11 | Osram Gesellschaft mit beschränkter Haftung | A housing for electrical components |
US8023261B2 (en) | 2008-09-05 | 2011-09-20 | Apple Inc. | Electronic device assembly |
US9664808B2 (en) * | 2009-03-06 | 2017-05-30 | Milwaukee Electric Tool Corporation | Wall scanner |
TWI366754B (en) * | 2009-08-25 | 2012-06-21 | Wistron Corp | Device housing for an electronic device |
CN102006747B (en) * | 2009-09-03 | 2015-07-29 | 鸿富锦精密工业(深圳)有限公司 | Housing |
CN102006738A (en) * | 2009-09-03 | 2011-04-06 | 鸿富锦精密工业(深圳)有限公司 | Shell |
CN102006739A (en) * | 2009-09-03 | 2011-04-06 | 鸿富锦精密工业(深圳)有限公司 | Shell |
US9723730B2 (en) * | 2009-09-30 | 2017-08-01 | Apple Inc. | Beam bar snap in an electronic device |
US8576561B2 (en) | 2010-02-02 | 2013-11-05 | Apple Inc. | Handheld device enclosure |
US8551283B2 (en) | 2010-02-02 | 2013-10-08 | Apple Inc. | Offset control for assembling an electronic device housing |
WO2011106082A1 (en) | 2010-02-25 | 2011-09-01 | Thomson Licensing | Miniature multilayer radiative cooling case with hidden quick release snaps |
US8607444B2 (en) * | 2010-03-06 | 2013-12-17 | Apple Inc. | Method for forming a housing of an electronic device |
JP2013527059A (en) * | 2010-05-18 | 2013-06-27 | 宝徳強科技(北京)有限公司 | PDA case and molding method |
JP2013527615A (en) | 2010-05-19 | 2013-06-27 | トムソン ライセンシング | Set-top box with distributed heat load |
US8372495B2 (en) | 2010-05-26 | 2013-02-12 | Apple Inc. | Electronic device enclosure using sandwich construction |
USD666202S1 (en) * | 2010-06-05 | 2012-08-28 | Apple Inc. | Housing plate |
US9120272B2 (en) | 2010-07-22 | 2015-09-01 | Apple Inc. | Smooth composite structure |
USD642563S1 (en) | 2010-08-16 | 2011-08-02 | Apple Inc. | Electronic device |
US8415570B2 (en) | 2010-08-27 | 2013-04-09 | Apple Inc. | Inhibiting moisture intrusion in a very small form factor consumer electronic product |
US8492661B2 (en) | 2010-08-27 | 2013-07-23 | Apple Inc. | Inhibiting moisture intrusion in a very small form factor consumer electronic product |
US8634178B2 (en) * | 2010-08-27 | 2014-01-21 | Apple Inc. | ESD protection in a very small form factor consumer electronic product |
US8368643B2 (en) | 2010-08-27 | 2013-02-05 | Apple Inc. | Very small form factor consumer electronic product |
WO2012027300A2 (en) * | 2010-08-27 | 2012-03-01 | Apple Inc. | Very small form factor consumer electronic product |
US8353137B2 (en) | 2010-09-02 | 2013-01-15 | Rosemount Aerospace Inc. | Compression mounted window assembly |
CN102823338B (en) * | 2010-09-03 | 2015-04-29 | 阿尔卑斯电气株式会社 | Glass composite, electronic device using glass composite, and input device |
US9235240B2 (en) | 2010-11-11 | 2016-01-12 | Apple Inc. | Insert molding around glass members for portable electronic devices |
USD920334S1 (en) * | 2011-02-04 | 2021-05-25 | Apple Inc. | Front cover of an electronic device |
USD1001134S1 (en) * | 2011-02-18 | 2023-10-10 | Apple Inc. | Display for a portable display device |
US20120210580A1 (en) * | 2011-02-23 | 2012-08-23 | Dietl Steven J | Method of assembling an inkjet printhead |
US9182789B2 (en) | 2011-03-01 | 2015-11-10 | Apple Inc. | Transparent electronic device components with opaque edge coverings |
US9011623B2 (en) * | 2011-03-03 | 2015-04-21 | Apple Inc. | Composite enclosure |
WO2012122230A2 (en) * | 2011-03-09 | 2012-09-13 | Thompson Licensing | Set top box or server having snap-in heat sink and smart card reader |
US20120244343A1 (en) * | 2011-03-25 | 2012-09-27 | Kurt Stiehl | Bonding structural components for portable electronic devices using thermally activated adhesive |
KR200471325Y1 (en) * | 2011-07-13 | 2014-02-19 | 모토로라 모빌리티 엘엘씨 | Mobile electronic device with enhanced tolerance accumulator |
BR202012004687U8 (en) | 2011-07-13 | 2016-11-22 | Motorola Mobility Inc | MOBILE ELECTRONIC DEVICE WITH IMPROVED CHASSIS |
BR202012004685Y1 (en) | 2011-07-13 | 2019-04-02 | Google Technology Holdings LLC | MOBILE ELECTRONIC DEVICE WITH IMPROVED LAMINATED CONSTRUCTION |
BR202012004686Y1 (en) | 2011-07-13 | 2019-05-14 | Google Technology Holdings LLC | MOBILE ELECTRONIC DEVICE WITH ENHANCED IMPACT REDUCTION. |
CN103703875B (en) | 2011-07-14 | 2016-10-12 | 汤姆逊许可公司 | There is buckle type radiator and smart card reader, Set Top Box with the fixed component for keeping radiator |
KR101281974B1 (en) * | 2011-09-07 | 2013-07-05 | 주식회사 팬택 | Portable terminal havign a cooling structure |
EP2570885B1 (en) * | 2011-09-19 | 2017-08-23 | Samsung Electronics Co., Ltd. | Slim-Type Display Module Fixing Apparatus for Portable Terminal |
JP5737121B2 (en) * | 2011-10-07 | 2015-06-17 | 富士通株式会社 | Case and electronic device |
KR20130042158A (en) * | 2011-10-18 | 2013-04-26 | 삼성전자주식회사 | Decorator mounting device for mobile phone |
JP5996217B2 (en) * | 2012-03-02 | 2016-09-21 | アルプス電気株式会社 | Glass composite, input device using glass composite, and electronic device |
USD732539S1 (en) | 2012-05-29 | 2015-06-23 | Apple Inc. | Enclosure for communications device |
USD718753S1 (en) * | 2012-09-10 | 2014-12-02 | Apple Inc. | Component for an electronic device |
TWD166901S (en) | 2012-09-07 | 2015-04-01 | 蘋果公司 | Housing of an electronic device |
TWD163335S (en) | 2012-09-11 | 2014-10-01 | 蘋果公司 | Display for an electronic device |
KR101966256B1 (en) * | 2012-09-14 | 2019-04-05 | 삼성전자주식회사 | Assembling structure of housing for portable terminal |
KR20140095851A (en) * | 2013-01-25 | 2014-08-04 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
US9871898B2 (en) | 2013-05-08 | 2018-01-16 | Apple Inc. | Ceramic cover for electronic device housing |
JP6191338B2 (en) * | 2013-09-04 | 2017-09-06 | ソニー株式会社 | Housing and housing parts |
USD765084S1 (en) | 2013-09-10 | 2016-08-30 | Apple Inc. | Input for an electronic device |
JP2015082638A (en) * | 2013-10-24 | 2015-04-27 | 富士通株式会社 | Electronic apparatus |
CN104661470A (en) * | 2013-11-22 | 2015-05-27 | 富泰华工业(深圳)有限公司 | Mobile terminal housing |
US11518138B2 (en) | 2013-12-20 | 2022-12-06 | Apple Inc. | Using woven fibers to increase tensile strength and for securing attachment mechanisms |
CN104754903B (en) * | 2013-12-25 | 2017-12-19 | 富泰华精密电子(郑州)有限公司 | Electronic installation |
US9807919B2 (en) * | 2014-01-29 | 2017-10-31 | Apple Inc. | Electronic devices having electrostatic discharge paths |
JPWO2015140857A1 (en) * | 2014-03-18 | 2017-04-06 | パナソニックIpマネジメント株式会社 | Electronics |
KR101596316B1 (en) * | 2015-02-03 | 2016-02-22 | 몰렉스 엘엘씨 | Card tray for electronic device and tray carrier assembly using the same |
CN104614881B (en) * | 2015-02-04 | 2017-10-24 | 深圳市华星光电技术有限公司 | Liquid crystal display device |
CN106155194A (en) * | 2015-04-21 | 2016-11-23 | 小米科技有限责任公司 | Mobile device |
US10303417B2 (en) * | 2017-04-03 | 2019-05-28 | Youspace, Inc. | Interactive systems for depth-based input |
EP3346355B1 (en) | 2017-01-09 | 2020-06-10 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Display screen assembly, assembling method thereof and electronic device |
CN106790823A (en) * | 2017-01-09 | 2017-05-31 | 广东欧珀移动通信有限公司 | Display screen component and its assemble method and electronic installation |
CN106817449A (en) * | 2017-01-18 | 2017-06-09 | 上海与德信息技术有限公司 | Mobile terminal |
USD848999S1 (en) | 2017-08-04 | 2019-05-21 | Apple Inc. | Housing module for an electronic device |
USD856337S1 (en) | 2017-08-04 | 2019-08-13 | Apple Inc. | Backplate for an electronic device |
USD831025S1 (en) | 2017-08-10 | 2018-10-16 | Apple Inc. | Housing module for an electronic device |
US10864686B2 (en) | 2017-09-25 | 2020-12-15 | Apple Inc. | Continuous carbon fiber winding for thin structural ribs |
KR102407746B1 (en) * | 2017-12-01 | 2022-06-13 | 삼성전자주식회사 | Electronic device with full-display |
US10470321B1 (en) * | 2017-12-22 | 2019-11-05 | Rockwell Collins, Inc. | Reinforced emissive display assembly |
CN208113175U (en) * | 2018-05-03 | 2018-11-16 | 中磊电子(苏州)有限公司 | Convenient for assembling/disassembly snap-in structure |
KR102509085B1 (en) * | 2018-08-08 | 2023-03-13 | 삼성전자주식회사 | An electronic device comprising a metal material |
CN111810775B (en) * | 2019-04-12 | 2022-07-19 | 上海聚广光电科技有限公司 | Make things convenient for two-sided display screen of maintaining of dismouting |
USD905065S1 (en) | 2019-05-15 | 2020-12-15 | Apple Inc. | Backplate for an electronic device |
USD905696S1 (en) | 2019-05-15 | 2020-12-22 | Apple Inc. | Backplate for an electronic device |
US11640185B2 (en) * | 2020-09-14 | 2023-05-02 | Zebra Technologies Corporation | Mobile device and assembly process |
CN114554734B (en) * | 2020-11-11 | 2023-02-17 | 荣耀终端有限公司 | Lid structure, back of body lid and electronic equipment |
US11775031B2 (en) * | 2021-01-04 | 2023-10-03 | Apple Inc. | Electronic device display |
JP2023008539A (en) * | 2021-07-06 | 2023-01-19 | オムロン株式会社 | Information display |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5340340A (en) * | 1992-09-24 | 1994-08-23 | Compaq Computer Corporation | Apparatus for removably supporting a plurality of hot plug-connected hard disk drives |
US20010034242A1 (en) * | 2000-04-19 | 2001-10-25 | Hisamitsu Takagi | Folding-type mobile terminal having a metal hinge, metal chassis and synthetic-resin cases |
US20030198023A1 (en) * | 1992-05-20 | 2003-10-23 | Kenichi Wakabayashi | Cartridge for electronic devices |
US20040053649A1 (en) * | 2002-09-18 | 2004-03-18 | Hsueh-Wen Sun | Housing assembly of a portable electronic device |
US20050261019A1 (en) * | 2004-04-30 | 2005-11-24 | Lg. Electronics Inc. | Mobile terminal for preventing static and method thereof |
US20060040520A1 (en) * | 2004-08-19 | 2006-02-23 | Samsung Electronics Co., Ltd. | Flat panel display device including a conductive compressible body |
US20060158840A1 (en) * | 1999-02-04 | 2006-07-20 | Canova Francis J Jr | Handheld computer |
US7515431B1 (en) * | 2004-07-02 | 2009-04-07 | Apple Inc. | Handheld computing device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4621373A (en) * | 1984-03-13 | 1986-11-04 | General Electric Company | Control surface for a trunking personal radio |
US5613237A (en) * | 1994-10-17 | 1997-03-18 | Motorola, Inc. | Housing latch system utilizing an elastomeric interlocking band |
US5596487A (en) * | 1995-07-31 | 1997-01-21 | Motorola, Inc. | Apparatus for RF shielding radio circuitry |
US6111760A (en) * | 1998-12-30 | 2000-08-29 | Ericsson, Inc. | Simple enclosure for electronic components |
EP1764860A1 (en) * | 2001-04-11 | 2007-03-21 | LG Electronics Inc. | Internal display-mounted antenna for mobile electronic equipment and mobile electronic equipment incorporating same |
JP4147839B2 (en) * | 2002-06-26 | 2008-09-10 | ポリマテック株式会社 | Sliding multi-directional input key |
US7109976B2 (en) * | 2003-04-01 | 2006-09-19 | 3M Innovative Properties Company | Display screen seal |
US7580255B2 (en) * | 2005-08-24 | 2009-08-25 | Apple Inc. | Docking station for hand held electronic devices |
KR100849844B1 (en) | 2006-12-22 | 2008-08-01 | 삼성전자주식회사 | Apparatus and method for composing album automatically and managing cover image of album |
WO2009009764A1 (en) | 2007-07-12 | 2009-01-15 | Apple Inc. | Methods for integrally trapping a glass insert in a metal bezel and produced electronic device |
-
2008
- 2008-09-04 US US12/204,497 patent/US8023260B2/en active Active
-
2011
- 2011-08-26 US US13/218,692 patent/US8701279B2/en active Active
-
2014
- 2014-04-22 US US14/258,589 patent/US9263842B2/en active Active
-
2016
- 2016-01-28 US US15/009,283 patent/US20160147258A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030198023A1 (en) * | 1992-05-20 | 2003-10-23 | Kenichi Wakabayashi | Cartridge for electronic devices |
US5340340A (en) * | 1992-09-24 | 1994-08-23 | Compaq Computer Corporation | Apparatus for removably supporting a plurality of hot plug-connected hard disk drives |
US20060158840A1 (en) * | 1999-02-04 | 2006-07-20 | Canova Francis J Jr | Handheld computer |
US20010034242A1 (en) * | 2000-04-19 | 2001-10-25 | Hisamitsu Takagi | Folding-type mobile terminal having a metal hinge, metal chassis and synthetic-resin cases |
US20040053649A1 (en) * | 2002-09-18 | 2004-03-18 | Hsueh-Wen Sun | Housing assembly of a portable electronic device |
US20050261019A1 (en) * | 2004-04-30 | 2005-11-24 | Lg. Electronics Inc. | Mobile terminal for preventing static and method thereof |
US7515431B1 (en) * | 2004-07-02 | 2009-04-07 | Apple Inc. | Handheld computing device |
US20060040520A1 (en) * | 2004-08-19 | 2006-02-23 | Samsung Electronics Co., Ltd. | Flat panel display device including a conductive compressible body |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112423469A (en) * | 2021-01-04 | 2021-02-26 | 四川赛狄信息技术股份公司 | Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board |
Also Published As
Publication number | Publication date |
---|---|
US9263842B2 (en) | 2016-02-16 |
US20140223731A1 (en) | 2014-08-14 |
US20120073115A1 (en) | 2012-03-29 |
US8701279B2 (en) | 2014-04-22 |
US20090059502A1 (en) | 2009-03-05 |
US8023260B2 (en) | 2011-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9263842B2 (en) | Method for assembling an electronic device | |
US9223345B2 (en) | Assembly of a handheld electronic device | |
US6194653B1 (en) | Enclosure design having an integrated system of retention, electromagnetic interference containment and structural load distribution | |
US8384604B2 (en) | Integrated antenna and EMI shielding support member for portable communications terminals | |
US8630100B2 (en) | Support tabs for protecting a circuit board from applied forces | |
US7744172B2 (en) | Computer enclosure with interchangeable I/O plate | |
EP1798967A2 (en) | Display device | |
US20140111926A1 (en) | Printed circuit board features of a portable computer | |
US8009260B2 (en) | Flexible printed circuit and liquid crystal module using the same | |
US8837128B2 (en) | Electrical component for portable computing device | |
US8811005B2 (en) | Clutch features of a portable computing device | |
US20150085435A1 (en) | Portable type electronic device, portable type electronic device group, and method of manufacturing portable type electronic device | |
US7363637B2 (en) | Optical disk drive capable of discharging electrostatic charges of a user | |
US20170168637A1 (en) | Handheld electronic touch screen device | |
KR102670150B1 (en) | Electronic device | |
US8897007B2 (en) | Grounding features of a portable computing device | |
CN101601261B (en) | Portable terminal | |
US20110187921A1 (en) | Camera module and electronic device utilizing the same | |
US20060285288A1 (en) | Electric device | |
EP2351361B1 (en) | Display device | |
KR20070016329A (en) | Fixing structure of lcd module for electrostatic discharge in portable terminal | |
JP2003283176A (en) | Portable terminal device | |
JP2007165101A (en) | Electronic equipment equipped with antistatic function | |
US20140015764A1 (en) | Display | |
US20140321078A1 (en) | Display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION |