US20160146545A1 - Mechanical fastener - Google Patents
Mechanical fastener Download PDFInfo
- Publication number
- US20160146545A1 US20160146545A1 US14/551,105 US201414551105A US2016146545A1 US 20160146545 A1 US20160146545 A1 US 20160146545A1 US 201414551105 A US201414551105 A US 201414551105A US 2016146545 A1 US2016146545 A1 US 2016146545A1
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- US
- United States
- Prior art keywords
- mechanical fastener
- heat
- heat pipe
- phase change
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/20—Fastening; Joining with threaded elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A mechanical fastener includes an elongated body having an outer surface, and inner surface, a first closed end, and a second closed end, and a mechanical fastener interface provided on the outer surface, such that the mechanical fastener transfers heat away from at least one of the first or second ends.
Description
- This application is a continuation-in-part of U.S. patent application Ser. No. 14/460,655, filed Aug. 15, 2014, and is incorporated herein by reference.
- Heat producing devices, such as printed circuit boards, often contain heat producing components, such as processors or voltage regulators, which generate heat in sufficient amounts that may impact the performance of the device, unless the heat is removed. A thermal plane may be provided in combination with the heat producing devices to form an assembly to aid in the removal of heat, typically by providing additional conductive pathways to disperse the heat.
- In one aspect, a mechanical fastener includes an elongated body having an outer surface, an inner surface defining a fluid reservoir, a first closed end, and a second closed end, a mechanical fastener interface provided on the outer surface, and a phase change material provided within the fluid reservoir. The phase change material provided within the elongated body functions to transfer heat away from at least one of the first or second ends.
- In the drawings:
-
FIG. 1 is a schematic cross-sectional view of a heat producing device in the form of a printed circuit board assembly in conductive contact with the heat dissipating assembly according to one embodiment of the invention. -
FIG. 2 is an exploded cross-sectional view of the heat dissipating assembly according to one embodiment of the invention. -
FIG. 3 is a top-down view of a heat pipe, taken along line III-III ofFIG. 2 , according to one embodiment of the invention. -
FIG. 4 is a cross-sectional view of the heat pipe illustrating the operation of the heat transfer. -
FIG. 5 is a perspective view of the heat dissipating assembly and piezo cooler device, according to a second embodiment of the invention. -
FIG. 6 is a top-down view of the heat pipe, taken along line VI-VI ofFIG. 5 , according to a second embodiment of the invention. -
FIG. 7 is a schematic cross-sectional view of a heat producing device in conductive contact with the heat pipe according to a third embodiment of the invention. - The embodiments of the present invention are related to a heat dissipating assembly configured to provide cooling to a heat producing component. In the embodiment of
FIG. 1 , a printed circuit board (PCB)assembly 10 is shown comprising aPCB 12 having at least oneheat producing component 14, such as a microprocessor, or silicon carbine metal-oxide semiconductor field effect transistor (MOSFET). - The
PCB assembly 10 is shown proximate to aheat dissipating assembly 16 having a thermallyconductive substrate 18, at least one thermallyconductive cooling fin 20, and a thermally conductive mechanical fastener having aheat pipe 22. Each of thesubstrate 18, coolingfin 20, andheat pipe 22 may be machined or manufactured from a same or dissimilar material having a high thermal conductivity. Non-limiting examples of materials having a high thermal conductivity may include aluminum, copper, or various alloys. For purposes of the invention, the type of material is not limiting. All things being equal, the higher the thermal conductivity the better. Lesser thermal conductive will merely reduce the heat transfer performance. - At least a portion of the
substrate 18 may be in thermally conductive relationship with theheat producing component 14 such that heat generated by theheat producing component 14 may be conducted to thesubstrate 18. For example, as shown, thesubstrate 18 may support and/or abut theheat producing component 14. Additionally, embodiments of the invention may include, for example, a layer of thermally conductive material, such as a thermal epoxy, between thesubstrate 18 and theheat producing component 14, to provide for increased thermal conductivity between theheat producing component 14 and theheat dissipating assembly 16. - The
cooling fins 20 are thermally coupled with, and extend away from, thesubstrate 18, opposite thePCB assembly 10. Thecooling fin 20 may be configured to provide for removing heat, for example, by convection, when exposed to a fluid, such as air, gas coolant, or liquid coolant. Example configurations for removing heat by convection may include designing thecooling fin 20 having a geometric cross-sectional shape, such as a square, circle, triangle, ellipse, etc., to increase surface area for convection to take place. Additional embodiments of the invention may further include, for example, a patterned outer surface. As shown, embodiments of the invention may include a plurality ofcooling fins 20, which may be arranged in an arrayed-type pattern, and positioned proximate to theheat producing component 14. - Each
cooling fin 20 may further include a conductively coupledheat pipe 22, configured in an elongated shape, such as a cylinder, located within thefin 20, and extending along at least a portion of thefin 20. In this sense, theelongated heat pipe 22 includes a first closedend 24 proximate to, and conductively coupled, including direct and indirect abutment, to, thesubstrate 18 and an opposing second closedend 26 being distal from thesubstrate 18, along the extended portion of thefin 20. Theheat pipe 22 may further include aninner surface 28 and anouter surface 29, wherein theinner surface 28 defines afluid reservoir 30 containing aphase change fluid 32 or material, which may, for example, change phases from a liquid to a gas. - The
phase change fluid 32 may be selected or configured to provide for a particular heat of vaporization, or enthalpy of vaporization, which is the combined internal energy and enthalpy change required to transform a given quality of a fluid from a liquid into a gas, at a given pressure. In this sense, the heat of vaporization of thephase change fluid 32 defines the amount of heat absorbed by thefluid 32 to change the phase of thefluid 32 from a liquid to a gas, and conversely, how much heat is released from thefluid 32 when the gas condenses back to a liquid. Furthermore, embodiments of the invention may include a sealedheat pipe 22 configuration such that the pressure within thefluid reservoir 30 may be modified to provide a selected heat of vaporization. - The particular
phase change fluid 32 or pressure within thereservoir 30 may be selected based on the expected temperatures to be encountered during the operation of the heat dissipating assembly to ensure the phase change will occur. For example, a non-limiting example of pressure within the reservoir may include a pressure below one standard atmosphere (1 atm). Non-limiting examples ofphase change fluids 32 that may be utilized include water, ammonia, methanol, acetone, Freon, or any combination thereof.Phase change fluids 32 may further be selected based on their compatibilities or incompatibilities with theheat pipe 22 materials or construction. - While the illustrated example shows the
phase change fluid 32 pooled near thesecond end 26 of theheat pipe 22, embodiments of the invention may include aheat pipe 22 configuration with a relatively small cross-sectional area or diameter, such that circulation of thefluid 32 occurs without the assistance of, and sometimes in opposition to or negating, external forces such as gravity. This type of circulation is known as capillary action, and may provide for aheat pipe 22 configuration where gravitational effects on thephase change fluid 32 is negligible. Stated another way, embodiments of the invention may include aheat pipe 22 configuration wherein thephase change fluid 32 is dispersed over theentire fluid reservoir 30, as opposed to pooled at oneend reservoir 30. Another effect of the above-described capillary action embodiment may include aheat pipe 22 configuration where, due to the dispersing of thephase change fluid 32, may be configured in any orientation. -
FIG. 2 illustrates an exploded cross-sectional view of theheat dissipating assembly 16 ofFIG. 1 . As shown, theheat pipe 22 may be independently constructed and/or configured, and assembled into thecooling fin 20, for example, through anopening 33 of thesubstrate 18, coolingfin 20, and/orheat dissipating assembly 16, at a later time. In this example, at least a portion of theheat pipe 22 may include, for example, a mechanical fastener interface provided on theouter surface 29 of theheat pipe 22, illustrated as ascrew 34 having a threadedexterior surface 36. Thecooling fin 20 may complimentary configured to receive the mechanical fastener, such as a corresponding threadedinner surface 38, as shown. In this configuration, themechanical fastener screw 34 may be fixedly or removably received within thecooling fin 20, through theopening 33, during assembly. Non-limiting alternative configurations of the mechanical fastener interface may include additional threaded configurations, such as a bolt. - Embodiments of the
heat dissipating assembly 16 may further include asecond substrate portion 40 which may fixedly or removably provide or restrict access to theheat pipe 22 and/or theopening 33. Thesecond substrate portion 40 may comprise the same as, or a different material than, thesubstrate 18. For example, in a configuration where thesecond substrate portion 40 may directly abut theheat producing component 14, it may be desirable to configure thesecond substrate portion 40 as a different material that better matches the coefficient of thermal expansion of theheat producing component 14 to ensure a reliable thermal contact between thecomponent 14 andsubstrate 18 occurs. -
FIG. 3 illustrates a cross section of theinner surface 28 of theheat pipe 22, according to one embodiment of the invention. In this example, theinner surface 28 may comprise a patternedsidewall 42 or capillary wall, shown as semi-circular ridges radially arranged about thesurface 28 that may be sized to provide for the capillary action of thephase change fluid 32. As explained above, the interaction of thephase change fluid 32 with the patternedsidewall 42 creates a capillary action which draws and stores thefluid 32 along the elongated shape of theheat pipe 22, ensuring a reliable thermal conductivity between thefluid 32 and theheat pipe 22. - Embodiments of the
heat pipe 22 may include, for example, machining thepatterned sidewall 42 into theinner surface 28, or forming thesidewall 42 during casing of thepipe 22. Additional manufacturing or assembly embodiments of theheat pipe 22 may be included. While theheat pipe 22 is illustrated having a circular cross section, embodiments of the invention may include alternativecross-sectional pipe 22 shapes, such as a square, triangle, ellipse, etc. Furthermore, additional patternedsidewalls 42 may be included in embodiments of the invention. The pattern of thesidewalls 42 may be configured based on thephase change fluid 32 to provide for optimized capillary action, as explained above. - Alternatively, embodiments of the invention may include, for example, a screw casing, wherein the
heat pipe 22 may be fixed, such as by adhesive, into the screw casing, which may then be received by the threadedinner surface 38 of the coolingfin 20. In another alternative embodiment of the invention, theheat pipe 22 may be integrated or machined directly into the coolingfin 20. In yet another alternative embodiment of the invention, at least one of the threadedexterior surface 36 of theheat pipe 22 or threadedinner surface 38 of the coolingfin 20 may include a thermally conductive later, such as tape, a coating, or an epoxy, to provide for increased thermal conductivity or a more reliable thermal contact. -
FIGS. 2, 3, and 4 illustrate the heat transfer cycle of theheat pipe 22 and phase changefluid 32. Thesubstrate 18, coolingfin 20, andheat pipe 22 are each configured in a thermally conductive relationship with each other such that a heat conduction path may exist, tri-directionally, between thecomponents heat producing component 14 is conductively transferred to thesubstrate 18, which may be further conductively transferred to the heat pipe 22 (InFIG. 4 , illustrated as arrows 44), for example, via thefirst end 24 of thepipe 22, and/or via thesubstrate 18 to the coolingfin 20, and from the coolingfin 20 to thepipe 22. The heat conducted to theheat pipe 22 may then be conductively transferred to, or absorbed into, thephase change fluid 32, which, in response to the heat conducted from thesubstrate 18 and/or coolingfin 20, changes phases from a liquid to a gas (illustrated as dotted line 46), absorbing at least a portion of the heat. - In
FIG. 4 , the phase changefluid gas 46, may traverse along at least a portion of theheat pipe 22 and condense (i.e. change phase back to a liquid) along the inner patterned sidewalls 42 of theheat pipe 22, releasing the stored portion of the heat (illustrated as arrows 48) into awall 42 of theheat pipe 22, or to the coolingfin 20. The heat may then, for example, be released to the local ambient air surrounding the coolingfin 20. In this example, a portion of theelongated heat pipe 22 spaced from thesubstrate 18 andheat producing component 14, and/or the extension of the coolingfin 20 corresponding to, and in a thermal relationship with, thepipe 22, may be cooler, or at a lower temperature, than another portion of thepipe 22 andfin 20 proximate to thesubstrate 18 andcomponent 14. The phase change fluid liquid, in turn, disperses back toward theheat producing component 14, along the patterned sidewalls 42 of theinner surface 28, by capillary action (illustrated by arrow 54), ready to absorb heat. - In this sense, the
substrate 18,heat pipe 22, and coolingfin 20 are configured such that heat generated by theheat producing component 14 is absorbed by at least theheat pipe 22, and consequently, thephase change fluid 32 when vaporizing, and is carried away, or removed from theheat producing component 14 and/orsubstrate 18 by thephase change fluid 32 gas, to another portion of theheat pipe 22, spaced away from theheat producing component 14. At the another, cooler, portion of theheat pipe 22, thephase change fluid 32 gas condenses along the patternedsidewall 42 along theinner surface 28 of thepipe 22, releasing the heat back into thepipe 22 and consequently, the coolingfin 20 relative to the another portion of thepipe 22. The coolingfin 20 may then further dissipate the heat to the local environment, via convection, as explained above. -
FIG. 5 illustrates an alternativeheat dissipating assembly 116 according to a second embodiment of the invention. The second embodiment is similar to the first embodiment; therefore, like parts will be identified with like numerals increased by 100, with it being understood that the description of the like parts of the first embodiment applies to the second embodiment, unless otherwise noted. A difference between the first embodiment and the second embodiment is thatheat pipe 122 of the second embodiment may be configured having a fixed or removablefirst end 124, and may be received directly into theopening 133 of thesubstrate 118 such that thefirst end 124 may abut a heat producing component 14 (not shown) directly. - Another difference between the first embodiment and the second embodiment is that
heat dissipating assembly 116 of the second embodiment may further include a component configured to generate a fluid movement across the coolingfins 20 to provide increased convection cooling of thefins 20. In the illustrated example, apiezo cooler 150 may produce a jet of air (shown as arrows 152) across the coolingfins 20. -
FIG. 6 illustrates a cross section of theinner surface 128 of theheat pipe 122, according to the second embodiment of the invention. In this example, theinner surface 128 may comprise an alternatively patternedsidewall 142, shown having inverse semi-circular ridges, compared to the patternedsidewall 42 of the first embodiment, radially arranged about thesurface 128. -
FIG. 7 illustrates an alternativeheat dissipating assembly 216 according to a third embodiment of the invention. The third embodiment is similar to the first and second embodiments; therefore, like parts will be identified with like numerals increased by 200, with it being understood that the description of the like parts of the first embodiment applies to the second embodiment, unless otherwise noted. A difference between the first two embodiments and the third embodiment is that theheat pipe 222 may be utilized to physically separate the printedcircuit board 12 and/or heat producingcomponent 14 from asecond portion 254, which may include a second substrate or a cooling portion, such a cooling fin. In this sense, theheat pipe 222 may connect a “hot” assembly (e.g. the printedcircuit board 12 and/or heat producing component 14) to a “cool” assembly (e.g. the second portion 254) to hold components in place, while still providing for heat transfer from the “hot” assembly to the “cool” assembly, as explained above. - Additionally,
FIG. 7 illustrates a combining form, or layer, of thermally conductive material, shown asthermal epoxy 256, between theheat pipe 222 and thesecond portion 254, as well as between thesecond end 26 of theheat pipe 222 and theheat producing component 14. Thethermal epoxy 256 may provide for increased thermal conductivity or a more reliable thermal contact between the respective thermal connections. Embodiments of the invention may further include a component configured to generate a fluid movement across theheat pipe 222, similar to the fluid movement across the cooling fins inFIG. 5 , to provide increased convection cooling of thepipe 222. - Many other possible embodiments and configurations in addition to that shown in the above figures are contemplated by the present disclosure. For example, while the above-described examples of
heat producing components 14 may primarily described as types of electrical components (e.g. resistors, inductors, capacitors, power regulators, pulse laser control boards, etc.), embodiments of the invention may be applicable to alternative heat dissipating or cooling configurations, for example, in dissipating heat from coolant or oil in a generator, or in dissipating heat from a line replaceable unit, for example, in an aircraft. Furthermore, while only a singleheat producing component 14 is illustrated, embodiments of the invention may include pluralities ofheat pipes 22 and/or coolingfins 20 to account for additionalheat producing components 14 associated with a singleheat dissipation assembly 16. The pluralities ofheat pipes 22 and/or coolingfins 20 may be grouped proximate to the respectiveheat producing components 14, or distributed across at least a portion of thesubstrate 18. - Furthermore, embodiments of the
heat pipe 22 may include additional configurations wherein the fastener includes or is integrated with an interface for the fastening of the fastener, such as a screw head. Additional fastening interfaces may be included. Additionally, the configuration of theheat dissipating assembly 16, including, for example, coolingfin 20 size, length, and height, orheat pipe 22 length and phase changefluid 32 composition, may be selected based on the heat dissipation needs of a particular application, or to ensure a desired cooling temperature. For instance, a high heat flux, or transient durationheat producing component 14 may have different heat dissipating needs than aheat producing component 14 that generates a steady state heat flux, and thus may need additional heat dissipating means. Likewise, aheat producing component 14 of a line-replaceable unit on an aircraft may have size or height restrictions for theheat pipe 22 and/or coolingfins 20. In yet another example, aheat dissipating assembly 16 exposed to liquid coolant may be configured with a smaller, orshorter heat pipe 22 and/or coolingfins 20, due to improved heat dissipation from thefins 20 to the liquid coolant. - In yet another embodiment of the
heat dissipating assembly 16, more than oneheat pipe 22 may be coupled with asingle cooling fin 20, for example, in a stacked configuration along the extending direction of thefin 20, to provide for increased heat dissipation. In even yet another embodiment of theheat dissipating assembly 16, the coolingfins 20 and/or theheat pipe 22 may further comprise a coating, such as a lusterless black coating including a mixture of carbon black particles, configured to remove and/or dissipate additional heat from at least one of theheat pipe 22 orsubstrate 18 by radiation. Additionally, the design and placement of the various components may be rearranged such that a number of different configurations could be realized. - The embodiments disclosed herein provide a mechanical fastener having a heat pipe. One advantage that may be realized in the above embodiments is that the above described embodiments have superior weight and size advantages over the conventional type heat dissipating assemblies having air cooling fins, or assemblies including, for instance, fans or liquid cooling components, to provide for cooling capabilities. Furthermore, the heat pipe provides for reduced weight, compared with a solid pin fin assembly, and provides for approximately eight times greater thermal conductivity. The thermal management system of coupling radiation, convection, and conduction provides for a heat dissipation assembly that competes with actively-cooled heat management systems (e.g. with fans, pumped coolant, etc.)
- With the proposed mechanical fastener, a high heat dissipation can be achieved during transient or steady state heat conditions without additional heat dissipation elements, thus increasing the reliability of such heat dissipation assemblies by reducing the need for additional componentry. In addition to increased reliability, reducing components directly relates to reducing weight and volume of the assembly, and is especially beneficial in space and weight-limiting applications, such as airborne platforms. Moreover, higher heat producing component reliability can be achieved even when components do not have high heat conditions.
- When designing mechanical fasteners and heat dissipation assemblies, important factors to address are power, size, weight, and reliability. The above described embodiments have a decreased number of parts compared to an embodiments having active air or liquid cooling, making the complete system inherently more reliable. This results in a lower electrical power, lower weight, smaller sized, increased performance, and increased reliability system. The lower number of parts and reduced maintenance will lead to a lower product costs and lower operating costs. Reduced weight and size correlate to competitive advantages.
- This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
Claims (15)
1. A mechanical fastener, comprising
an elongated body having an outer surface, an inner surface defining a fluid reservoir, a first closed end, and a second closed end;
a mechanical fastener interface provided on the outer surface; and
a phase change material provided within the fluid reservoir;
wherein the phase change material provided within the elongated body functions to transfer heat away from at least one of the first or second ends.
2. The mechanical fastener of claim 1 wherein the mechanical fastener interface is threaded.
3. The mechanical fastener of claim 2 wherein the mechanical fastener is at least one of a bolt or screw.
4. The mechanical fastener of claim 2 wherein the threaded screw is configured to be receivably coupled with a corresponding threaded opening.
5. The mechanical fastener of claim 4 wherein the threaded opening is complementary to the threaded mechanical fastener interface.
6. The mechanical fastener of claim 2 further comprising a thermally conductive material on the outer surface of the threaded mechanical fastener interface.
7. The mechanical fastener of claim 1 further comprising a thermally conductive material on the outer surface.
8. The mechanical fastener of claim 1 wherein at least a portion of the inner surface comprises capillary walls to provide for capillary action along the elongated shape.
9. The mechanical fastener of claim 8 wherein the elongated body defines a body axis and the capillary walls extend along the body axis.
10. The mechanical fastener of claim 8 wherein the capillary walls of the inner surface negate gravitational effects on the phase change material so that elongated body functions to transfer heat away from at least one end in any orientation.
11. The mechanical fastener of claim 8 wherein the capillary walls comprise at least a portion of sidewall pattern comprising at least one of a semi-circular, a circular, a square, a triangular, or an elliptical cross section.
12. The mechanical fastener of claim 1 wherein the pressure within the body is less than the standard atmosphere (1 atm).
13. The mechanical fastener of claim 1 wherein the mechanical fastener interface is configured to be removably coupled with a corresponding mechanical interface.
14. The mechanical fastener of claim 1 wherein the cross section of the elongated body is at least one of circular, square, or elliptical.
15. The mechanical fastener of claim 1 further comprising a heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/551,105 US20160146545A1 (en) | 2014-08-15 | 2014-11-24 | Mechanical fastener |
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Application Number | Priority Date | Filing Date | Title |
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US14/460,655 US20160047604A1 (en) | 2014-08-15 | 2014-08-15 | Heat dissipating assembly |
US14/551,105 US20160146545A1 (en) | 2014-08-15 | 2014-11-24 | Mechanical fastener |
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US20160146545A1 true US20160146545A1 (en) | 2016-05-26 |
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US14/460,655 Abandoned US20160047604A1 (en) | 2014-08-15 | 2014-08-15 | Heat dissipating assembly |
US14/551,105 Abandoned US20160146545A1 (en) | 2014-08-15 | 2014-11-24 | Mechanical fastener |
US16/416,343 Abandoned US20190277573A1 (en) | 2014-08-15 | 2019-05-20 | Heat dissipating assembly |
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US14/460,655 Abandoned US20160047604A1 (en) | 2014-08-15 | 2014-08-15 | Heat dissipating assembly |
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US16/416,343 Abandoned US20190277573A1 (en) | 2014-08-15 | 2019-05-20 | Heat dissipating assembly |
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US20170099725A1 (en) * | 2015-10-02 | 2017-04-06 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
CN107771003A (en) * | 2016-08-17 | 2018-03-06 | 奇鋐科技股份有限公司 | Radiating subassembly |
US11470713B2 (en) * | 2020-09-21 | 2022-10-11 | Avary Holding (Shenzhen) Co., Limited. | Circuit board with heat dissipation structure and method for manufacturing same |
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TWI747076B (en) * | 2019-11-08 | 2021-11-21 | 研能科技股份有限公司 | Heat dissipating component for mobile device |
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Cited By (4)
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---|---|---|---|---|
US20170099725A1 (en) * | 2015-10-02 | 2017-04-06 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
US10237967B2 (en) * | 2015-10-02 | 2019-03-19 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
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US11470713B2 (en) * | 2020-09-21 | 2022-10-11 | Avary Holding (Shenzhen) Co., Limited. | Circuit board with heat dissipation structure and method for manufacturing same |
Also Published As
Publication number | Publication date |
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US20160047604A1 (en) | 2016-02-18 |
US20190277573A1 (en) | 2019-09-12 |
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Legal Events
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AS | Assignment |
Owner name: GE AVIATION SYSTEMS LLC, MICHIGAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ENGELHARDT, MICHEL;REEL/FRAME:034243/0984 Effective date: 20140929 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |