US20160118323A1 - Package structure and fabrication method thereof - Google Patents
Package structure and fabrication method thereof Download PDFInfo
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- US20160118323A1 US20160118323A1 US14/833,103 US201514833103A US2016118323A1 US 20160118323 A1 US20160118323 A1 US 20160118323A1 US 201514833103 A US201514833103 A US 201514833103A US 2016118323 A1 US2016118323 A1 US 2016118323A1
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- insulating layer
- dielectric body
- layer
- package structure
- circuit
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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Abstract
A method for fabricating a package structure is provided, which includes the steps of: forming a first insulating layer on a carrier; forming a dielectric body on the first insulating layer, wherein the dielectric body has a first surface formed on the first insulating layer and a second surface opposite to the first surface, and a circuit layer and a plurality of conductive posts formed on the circuit layer are embedded in the dielectric body; forming a second insulating layer on the second surface of the dielectric body, wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.; and removing the carrier. Since the glass transition temperature of the first or second insulating layer is greater than that of the dielectric body, the package structure has a preferred strength to avoid warping, thereby dispensing with a support member.
Description
- 1. Field of the Invention
- The present invention relates to package structures and fabrication methods thereof, and more particularly, to a carrier-free package structure and a fabrication method thereof.
- 2. Description of Related Art
- Along with the rapid development of electronic industries, many high-end electronic products are developed toward the trend of high integration. Accordingly, various chip packaging technologies are developed and chip packaging sizes are continuously reduced to meet the miniaturization requirement of semiconductor packages.
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FIGS. 1A to 1F are schematic cross-sectional views showing a method for fabricating a package structure according to the prior art. - Referring to
FIG. 1A , acircuit layer 11 is formed on acarrier 10. - Then, referring to
FIG. 1B , a plurality ofconductive posts 13 are formed on a portion of thecircuit layer 11. - Thereafter, referring to
FIG. 1C , adielectric body 12 is formed on thecarrier 10 to embed theconductive posts 13 and thecircuit layer 11 therein. Thedielectric body 12 has afirst surface 12 a formed on thecarrier 10 and asecond surface 12 b opposite to thefirst surface 12 a. - Referring to
FIG. 1D , thecarrier 10 is partially removed. As such, the remaining portion of thecarrier 10 forms acarrier 10′. Further, asemiconductor element 40 is disposed on thefirst surface 12 a of thedielectric body 12. - Referring to
FIGS. 1E and 1F , amold 90 is disposed on thecarrier 10′ and thus areceiving space 900 is formed between thefirst surface 12 a of thedielectric body 12 and themold 90. Then, an encapsulant 42 is injected into thereceiving space 900. As such, a package structure 1 is formed, as shown inFIG. 1E - In the above-described method, the
carrier 10′ supports the overall structure so as to prevent warping of the package structure during high temperature processes. However, limited by current processing methods, thecarrier 10′, such as a steel board, has a minimum thickness of 200 um. As such, even if the mold cavity of themold 90 is flush with thecarrier 10′, as shown inFIG. 1E ′, the thickness h1 of theencapsulant 42 is still limited by the minimum thickness of thecarrier 10′ of 200 um. Therefore, the thickness of the overall package structure is difficult to be reduced and consequently the package structure cannot meet the miniaturization requirement of electronic products. - Therefore, there is a need to provide a package structure and a fabrication method thereof so as to overcome the above-described drawbacks.
- In view of the above-described drawbacks, the present invention provides a method for fabricating a package structure, which comprises the steps of: forming a first insulating layer on a carrier; forming a dielectric body on the first insulating layer, wherein the dielectric body has a first surface coupled to the first insulating layer and a second surface opposite to the first surface, and a circuit layer and a plurality of conductive posts formed on the circuit layer are embedded in the dielectric body; forming a second insulating layer on the second surface of the dielectric body, wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.; and removing the carrier.
- The present invention further provides a package structure, which comprises: a dielectric body having opposite first and second surfaces; a circuit layer embedded in the dielectric body; a plurality of conductive posts formed on the circuit layer and embedded in the dielectric body; a first insulating layer formed on the first surface of the dielectric body; and a second insulating layer formed on the second surface of the dielectric body, wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.
- In the above-described structure and method, the conductive posts can be exposed from the second surface of the dielectric body. Further, the first insulating layer can have a plurality of first openings for exposing the circuit layer, and the second insulating layer can have a plurality of second openings for exposing the conductive posts. Furthermore, a plurality of conductive bumps can be formed on the circuit layer exposed from the first openings of the first insulating layer. In an embodiment, the conductive bumps have a height of 50 um.
- The above-described structure and method can further comprise disposing a semiconductor element on the first insulating layer, wherein the semiconductor element is electrically connected to the circuit layer. Further, an encapsulant can be formed on the first insulating layer to encapsulate the semiconductor element.
- In the above-described structure and method, the encapsulant can have a thickness between 20 and 180 um.
- In the above-described structure and method, the thickness of the first insulating layer or the second insulating layer can be between 1 and 20 um.
- In the above-described structure and method, the glass transition temperature of the first insulating layer and/or the second insulating layer can be greater than 400° C.
- In the above-described structure and method, the first insulating layer and/or the second insulating layer can be made of polyimide, (PI), polyamide-imide (PAI) or polybenzimidazole (PBI).
- Since the first insulating layer and/or the second insulating layer have a high glass transition temperature, the package structure has a preferred strength to avoid warping. Therefore, the final package structure does not need the carrier for support.
- Further, the first insulating layer and the second insulating layer can be used for circuit protection without increasing the thickness of the overall package structure. As such, after the semiconductor element is disposed on the first insulating layer, the encapsulant encapsulating the semiconductor element has a thickness less than 200 um. Therefore, the package structure has a reduced thickness and is applicable in thin electronic products.
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FIGS. 1A to 1F are schematic cross-sectional views showing a method for fabricating a package structure according to the prior art, whereinFIG. 1E ′ shows another embodiment ofFIG. 1E ; and -
FIGS. 2A to 2E ″ are schematic cross-sectional views showing a method for fabricating a package structure according to the present invention, whereinFIG. 2A ′ shows another embodiment ofFIGS. 2A ,FIG. 2B ′ shows another embodiment ofFIG. 2B ,FIG. 2D ′ shows another embodiment ofFIG. 2D , andFIGS. 2E ′ and 2E″ show other embodiments ofFIG. 2E . - The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparent to those in the art after reading this specification.
- It should be noted that all the drawings are not intended to limit the present invention. Various modifications and variations can be made without departing from the spirit of the present invention. Further, terms such as “first”, “second”, “on”, “a” etc. are merely for illustrative purposes and should not be construed to limit the scope of the present invention.
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FIGS. 2A to 2E are schematic cross-sectional views showing a method for fabricating a package structure according to the present invention. - Referring to
FIG. 2A , a first insulatinglayer 30 is formed on acarrier 20. - In the present embodiment, the
carrier 20 is, for example, a steel board, a silicon board or a glass board and has a metal layer, such as copper, thereon. - The glass transition temperature of the first insulating
layer 30 is greater than 250° C., preferably greater than 400° C. - Further, the first insulating
layer 30 is made of polyimide (PI), polyamide-imide (PAI) or polybenzimidazole (PBI). - In an embodiment, referring to
FIG. 2A ′, aseed layer 21 is further formed on the first insulatinglayer 30 for a subsequent electroplating process. Theseed layer 21 can be made of any metal material that can be patterned through etching. - Referring to
FIG. 2B , adielectric body 32 is formed on the first insulatinglayer 30. Thedielectric body 32 has afirst surface 32 a coupled to the first insulatinglayer 30 and asecond surface 32 b opposite to thefirst surface 32 a. Acircuit layer 31 and a plurality ofconductive posts 33 formed on thecircuit layer 31 are embedded in thedielectric body 32. Theconductive posts 33 haveend surfaces 33 a exposed from thesecond surface 32 b of thedielectric body 32. - In the present embodiment, the
circuit layer 31 is formed on the first insulatinglayer 30 and theconductive posts 33 are formed on a portion of thecircuit layer 31. Then, a dielectric material is formed on the first insulatinglayer 30 to form thedielectric body 32 encapsulating thecircuit layer 31 and the conductive posts 33. But it should be noted that there is no special limitation on the order of formation of thedielectric body 32, thecircuit layer 31 and the conductive posts 33. - The
dielectric body 32 can be made of, but not limited to, a molding compound material, a prepreg material or a photo-dielectric material. In another embodiment, thedielectric body 32 is made of the same material as the first insulatinglayer 30. - The
conductive posts 33 can have a circular cylindrical shape, an elliptical cylindrical shape or a polygonal cylindrical shape. - In another embodiment, referring to
FIG. 2B ′, which is continued fromFIG. 2A ′, thecircuit layer 31 is formed on theseed layer 21. - Referring to
FIG. 2C , a second insulatinglayer 34 is formed on thesecond surface 32 b of thedielectric body 32. - In the present embodiment, the glass transition temperature of the second insulating
layer 34 is greater than 250° C., preferably greater than 400° C. - The second insulating
layer 34 can be made of polyimide (PI), polyamide-imide (PAI) or polybenzimidazole (PBI). - Referring to
FIG. 2D , which is continued fromFIG. 2C , thecarrier 20 is removed, thereby exposing the first insulatinglayer 30. Then, a plurality offirst openings 30 a are formed in the first insulatinglayer 30, for exposing thecircuit layer 31. A plurality ofsecond openings 34 a are formed in the second insulatinglayer 34, for exposing the conductive posts 33. Thereafter, a singulation process is performed. As such, apackage structure 3 is formed. - In the present embodiment, a
surface processing layer 37 is formed on thecircuit layer 31 and asurface processing layer 37′ is formed on the conductive posts 33. Thesurface processing layer - In another embodiment, referring to
FIG. 2D ′, which is continued fromFIG. 2B ′, thesurface processing layer 37 is formed on theseed layer 21. As such, apackage structure 3′ is formed. - According to the present invention, since the glass transition temperature of the first insulating
layer 30 and/or the second insulatinglayer 34 is greater than 250° C., the first insulatinglayer 30 and/or the second insulatinglayer 34 cause thepackage structure 3 to have a preferred strength to avoid cracking or warping during high temperature processes. Therefore, thecarrier 20 is removed and not used for support in subsequent processes. - Thereafter, referring to
FIG. 2E , asemiconductor element 40 is disposed on the first insulatinglayer 30 and electrically connected to thecircuit layer 31. Then, anencapsulant 42 is formed on the first insulatinglayer 30 to encapsulate thesemiconductor element 40. In particular, a plurality ofconductive bumps 41, made of such as a solder material, are formed on thecircuit layer 31 exposed from thefirst openings 30 a of the first insulatinglayer 30, and thesemiconductor element 40 is electrically connected to thecircuit layer 31 through the conductive bumps 41. As such, apackage structure 4 is formed. - In the present embodiment, the glass transition temperature of the
encapsulant 42 is less than the glass transition temperature of the first insulatinglayer 30 or the second insulatinglayer 34. -
FIG. 2E ′ is continued fromFIG. 2D ′. Referring toFIG. 2E ′, apackage structure 4′ is formed. - In an embodiment, referring to
FIG. 2E ″, each of theconductive bumps 41′ has copper pillar and a solder material formed on the copper pillar, and apackage structure 4″ is formed. - Further, the thickness h2 of the
encapsulant 42 is between 20 and 180 um, and the height t of theconductive bumps 41 is 50 um. - In the
package structure layer 30 and/or the second insulatinglayer 34 is greater than 250° C., thecarrier 20 can be removed. Therefore, the thickness h2 of theencapsulant 42 is between 20 and 180 um. - The present invention provides a
package structure dielectric body 32 having opposite first andsecond surfaces circuit layer 31 embedded in thedielectric body 32; a plurality ofconductive posts 33 formed on thecircuit layer 31 and embedded in thedielectric body 32; a first insulatinglayer 30 formed on thefirst surface 32 a of thedielectric body 32; and a second insulatinglayer 34 formed on thesecond surface 32 b of thedielectric body 32, wherein the glass transition temperature of the first insulatinglayer 30 and/or the second insulatinglayer 34 is greater than 250° C. The thickness of the first insulatinglayer 30 and/or the second insulatinglayer 34 can be between 1 and 20 um. - In an embodiment, the
conductive posts 33 are exposed from thesecond surface 32 b of thedielectric body 32. The first insulatinglayer 30 can have a plurality offirst openings 30 a for exposing thecircuit layer 31, and the second insulatinglayer 34 can have a plurality ofsecond openings 34 a for exposing the conductive posts 33. The package structure can further have a plurality ofconductive bumps circuit layer 31 exposed from thefirst openings 30 a of the first insulatinglayer 30. The height t of theconductive bumps - In an embodiment, the package structure further has a
semiconductor element 40 disposed on the first insulatinglayer 30 and electrically connected to thecircuit layer 31, and anencapsulant 42 formed on the first insulatinglayer 30 for encapsulating thesemiconductor element 40. The thickness h2 of the encapsulant is between 20 and 180 um. - In an embodiment, the glass transition temperature of the first insulating
layer 30 and/or the second insulatinglayer 34 is greater than 400° C. - In an embodiment, the first insulating
layer 30 and/or the second insulatinglayer 34 are made of polyimide, (PI), polyamide-imide (PAI) or polybenzimidazole (PBI). - According to the present invention, since the first insulating layer and/or the second insulating layer have a high glass transition temperature, the package structure has a preferred strength to avoid warping. Therefore, the final package structure does not need the carrier for support.
- Further, during a high-temperature and long-time reflow process, for example, an infrared (IR) reflow process, the first insulating layer and/or the second insulating layer are not easy to soften or displace and has little deformation. Therefore, compared with the prior art, the package structure of the present invention achieves a higher alignment accuracy.
- Furthermore, the first insulating layer and the second insulating layer can be used for circuit protection without increasing the thickness of the overall package structure. As such, after the semiconductor element is disposed on the first insulating layer, the encapsulant encapsulating the semiconductor element has a thickness less than 200 um. Therefore, the package structure has a reduced thickness and is applicable in thin electronic products.
- The above-described descriptions of the detailed embodiments are only to illustrate the preferred implementation according to the present invention, and it is not to limit the scope of the present invention. Accordingly, all modifications and variations completed by those with ordinary skill in the art should fall within the scope of present invention defined by the appended claims.
Claims (22)
1. A method for fabricating a package structure, comprising the steps of:
forming a first insulating layer on a carrier;
forming a dielectric body on the first insulating layer, wherein the dielectric body has a first surface coupled to the first insulating layer and a second surface opposite to the first surface, and a circuit layer and a plurality of conductive posts formed on the circuit layer are embedded in the dielectric body;
forming a second insulating layer on the second surface of the dielectric body, wherein a glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.; and
removing the carrier.
2. The method of claim 1 , wherein the conductive posts are exposed from the second surface of the dielectric body.
3. The method of claim 2 , further comprising forming in the first insulating layer a plurality of first openings for exposing the circuit layer, and forming in the second insulating layer a plurality of second openings for exposing the conductive posts.
4. The method of claim 3 , further comprising forming a plurality of conductive bumps on the circuit layer exposed from the first openings of the first insulating layer.
5. The method of claim 4 , wherein the conductive bumps is 50 um in height.
6. The method of claim 1 , further comprising disposing a semiconductor element on the first insulating layer, wherein the semiconductor element is electrically connected to the circuit layer.
7. The method of claim 6 , further comprising forming an encapsulant on the first insulating layer to encapsulate the semiconductor element.
8. The method of claim 7 , wherein the encapsulant has a thickness between 20 and 180 um.
9. The method of claim 1 , wherein a thickness of the first insulating layer or the second insulating layer is between 1 and 20 um.
10. The method of claim 1 , wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 400° C.
11. The method of claim 1 , wherein the first insulating layer and/or the second insulating layer are made of polyimide, (PI), polyamide-imide (PAI) or polybenzimidazole (PBI).
12. A package structure, comprising:
a dielectric body having opposite first and second surfaces;
a circuit layer embedded in the dielectric body;
a plurality of conductive posts formed on the circuit layer and embedded in the dielectric body;
a first insulating layer formed on the first surface of the dielectric body; and
a second insulating layer formed on the second surface of the dielectric body,
wherein a glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.
13. The structure of claim 12 , wherein the conductive posts are exposed from the second surface of the dielectric body.
14. The structure of claim 13 , wherein the first insulating layer has a plurality of first openings for exposing the circuit layer, and the second insulating layer has a plurality of second openings for exposing the conductive posts.
15. The structure of claim 14 , further comprising a plurality of conductive bumps formed on the circuit layer exposed from the first openings of the first insulating layer.
16. The structure of claim 15 , wherein the conductive bumps is 50 um in height.
17. The structure of claim 12 , further comprising a semiconductor element disposed on the first insulating layer and electrically connected to the circuit layer.
18. The structure of claim 17 , further comprising an encapsulant formed on the first insulating layer for encapsulating the semiconductor element.
19. The structure of claim 18 , wherein the encapsulant has a thickness between 20 and 180 um.
20. The structure of claim 12 , wherein a thickness of the first insulating layer or the second insulating layer is between 1 and 20 um.
21. The structure of claim 12 , wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 400° C.
22. The structure of claim 12 , wherein the first insulating layer and/or the second insulating layer are made of polyimide, (PI), polyamide-imide (PAI) or polybenzimidazole (PBI).
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US15/440,390 US10147615B2 (en) | 2014-10-22 | 2017-02-23 | Fabrication method of package structure |
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TW103136417A TWI559829B (en) | 2014-10-22 | 2014-10-22 | Package structure and method of fabricating the same |
TW103136417 | 2014-10-22 |
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US20160118323A1 true US20160118323A1 (en) | 2016-04-28 |
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US14/833,103 Abandoned US20160118323A1 (en) | 2014-10-22 | 2015-08-23 | Package structure and fabrication method thereof |
US15/440,390 Active US10147615B2 (en) | 2014-10-22 | 2017-02-23 | Fabrication method of package structure |
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CN206584922U (en) * | 2017-03-16 | 2017-10-24 | 江阴芯智联电子科技有限公司 | It is pre-packaged without wire electrodepositable lead-frame packages structure |
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Also Published As
Publication number | Publication date |
---|---|
CN105633052B (en) | 2018-11-27 |
CN105633052A (en) | 2016-06-01 |
TWI559829B (en) | 2016-11-21 |
US10147615B2 (en) | 2018-12-04 |
US20170229319A1 (en) | 2017-08-10 |
TW201616933A (en) | 2016-05-01 |
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