US20160037685A1 - Adaptable container mounted cooling solution - Google Patents
Adaptable container mounted cooling solution Download PDFInfo
- Publication number
- US20160037685A1 US20160037685A1 US14/447,540 US201414447540A US2016037685A1 US 20160037685 A1 US20160037685 A1 US 20160037685A1 US 201414447540 A US201414447540 A US 201414447540A US 2016037685 A1 US2016037685 A1 US 2016037685A1
- Authority
- US
- United States
- Prior art keywords
- container
- housing
- air
- mode
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28C—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
- F28C3/00—Other direct-contact heat-exchange apparatus
- F28C3/06—Other direct-contact heat-exchange apparatus the heat-exchange media being a liquid and a gas or vapour
- F28C3/08—Other direct-contact heat-exchange apparatus the heat-exchange media being a liquid and a gas or vapour with change of state, e.g. absorption, evaporation, condensation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Definitions
- Container-based data centers present difficult environmental management challenges. As the containers are intended to be movable, they have relatively fixed dimensions and cannot be expanded in size. Customers continue to demand more computing power from each container-based data center, so planned products specify only minimal spacing between servers and related equipment and the surrounding container. As a result of increasing the number, capacity and/or computing power of the servers, the heat load generated during their operation increases. This heat load must be managed to promote high performance and long life of the servers.
- the cooling system for a container-based data center should be adaptable to suit a range of different requirements.
- the cooling system should be adaptable to provide sufficient cooling in different geographical areas, as well as over different seasons and different times of day.
- the container may be fitted with a fewer number or greater number of servers, which may affect the heat load.
- Other types of equipment changes or technology advances may also affect the heat load and consequently, the required cooling capacity.
- FIG. 1 is a schematic perspective view of a cooling apparatus for a container-based data center showing its ability to be adapted among at least the three illustrated operating modes.
- FIG. 2 is an end view of a container-based data center showing an implementation of the cooling apparatus adapted for a closed loop operating mode.
- FIG. 3 is an end view of a container-based data center showing an implementation of the cooling apparatus adapted for an open loop operating mode.
- FIG. 4 is an end view of a container-based data center showing an implementation of the cooling apparatus adapted for use in an auxiliary cooling mode with an auxiliary heat exchanger.
- FIG. 5A is a perspective view of an embodiment of the cooling apparatus housing.
- FIG. 5B is a side section view in elevation of the cooling apparatus housing of FIG. 5A , but showing the louver in an opened position and the air flow path down through a filter and laterally through the fan and out an outlet.
- FIG. 5C is a perspective view similar to 5 A, except showing the filter being removed for servicing or replacement.
- FIG. 6A is an end elevation view of a cooling apparatus according to another implementation with the housing material removed to reveal the internal components and their configuration.
- FIG. 6B is a top plan view of the cooling apparatus of FIG. 6A .
- FIG. 6C is a right side elevation view of the cooling apparatus of FIGS. 6A and 6B .
- a cooling system for a container-based data center that is adaptable to operate in different modes and has a ceiling-mounted housing configured to fit in a space above existing server racks and other equipment.
- a fan or other type of air mover draws air through a cooling unit, which generally includes a heat exchanger.
- this heat exchanger is configured to be part of a self-contained chilled water cooling circuit within the container.
- the cooling system can be operated in a closed loop mode using this heat exchanger to cool the air within the container.
- the cooling system can also be adapted between the closed loop mode and other operating modes, such as an open loop mode that draws in outside air and an auxiliary cooling mode that uses an auxiliary heat exchanger having its cold side heat exchanger portion mounted outside the container.
- FIG. 1 is a perspective view showing a schematic depiction of a container-based data center 100 with a multi-mode cooling system 102 adaptable to operate in at least the three illustrated modes 104 , 106 , 108 .
- a representative container or container structure 112 defines a footprint and serves to house multiple server racks 114 and other equipment. As shown, the server racks 114 in this implementation are generally vertically oriented and arranged approximately along a center longitudinal axis of the container 112 , although many other configurations are possible.
- a housing 116 for the cooling system or apparatus 102 is configured to occupy a space above the server racks 114 and below a ceiling 118 of the container.
- the housing 116 is mounted to or suspended from the ceiling 118 . In this way, the housing 116 does not consume valuable floor space or footprint, which is reserved for servers, other equipment and ensuring that personnel can gain access to and maintain servers and equipment.
- the container 112 has side walls 120 , 122 , end walls 124 , 126 and a floor 128 that together define an interior 130 as shown.
- the container 112 has dimensions consistent with a shipping container, such as, e.g., an ISO C container, although the cooling system 102 could of course be used with container-based or similar systems of different sizes.
- FIG. 1 and FIGS. 2-4 are separate end elevation views of the data center 100 with the end wall 124 removed to show the three different operating modes.
- the housing 116 which is shown in solid lines in FIG. 1 , generally extends along a majority of the length of the container 112 .
- An inlet opening 132 is defined in the housing 116 at or near a first end 134 (see, e.g., FIG. 2 ).
- the inlet opening 132 is formed in an angled surface of the housing 116 (see also, e.g., FIGS. 5A-5C ).
- the cooling unit 136 includes a heat exchanger 137 having an air “hot side” for receiving hot air drawn in through the inlet opening 132 and cooling it, and a cooling fluid “cold side” for receiving heat from the hot air and dissipating it.
- the cooling fluid is chilled water
- the heat exchanger also referred to herein as “a chilled water cooler”
- the chilled water system is described as a stand-alone 60-ton chilled water system.
- the heat exchanger 137 could be a refrigerant-based heat exchanger that uses R-134a or a similar refrigerant. Other types of heat exchangers can also be used.
- a fan 138 or other type or air mover for moving air through the housing 116 and throughout the rest of the various air flow circuits as shown by the arrows.
- the fan 138 draws air into the housing 116 and conveys it out through an outlet opening 146 positioned at or near a second end 148 of the housing 116 into the interior 130 of the container 112 .
- a louver 140 or other air directing device is positioned between the fan 138 and the outlet opening 146 on one side, and the inlet opening 132 and the cooling unit 136 on the other side, to selectively adapt the flow path according to the desired operating mode. Referring to FIGS.
- the louver 140 in some implementations has blades two 142 , 144 , although it would be possible to use a single blade or more than two blades.
- the louver in FIG. 1 , has three blades. Further details about the flow path are described below.
- the outlet opening 146 can be designed as a specific opening, or it can includes spaces in and around the fan 138 and its mounting and enclosure. For example, as shown in FIG. 5A , there can be a grille or grate 147 positioned in the area of the outlet opening.
- the multi-mode cooling apparatus 102 and housing 116 can be designed to have a vertical dimension V designed to closely fit the space between an upper surface of a tallest server rack (or other piece of equipment) and the ceiling 118 of the container.
- a bottom surface 150 of the housing 112 is fitted very close to the server racks 114 such that only a small gap G between the two exists.
- the gap can be filled with a seal S to promote flow in the direction of the arrows as shown, which includes flow into and through the server racks 114 , e.g., from right to left as shown in the figures without substantial air flow “short circuiting” through the gap G.
- the airflow in the area of the racks 114 may be supplemented by specific rack or server cooling systems (not shown).
- the multi-mode cooling apparatus is shown configured for a closed loop operating mode 104 .
- hot air from the interior 130 is drawn through the inlet opening 132 and cooling unit 136 and through the louver 140 (in an open position as shown) under the action of the fan 138 .
- the cooling unit 136 cools the hot air, such as by heat transfer to chilled water circulating in the heat exchanger 137 of the cooling unit.
- the cooled air is then exhausted from the housing through the outlet opening 146 and back into the interior 130 .
- the air flow cycle is completed by the air flowing through the server racks 114 from right to left as shown by the arrows.
- cooling the hot air in the interior 130 includes adding other air, e.g., air at a lower temperature.
- the air that is added is outside air, such as when outside air temperatures are favorable or other circumstances warrant using outside air.
- the housing 116 and/or roof of the container 162 there can be at least one opening 164 ( FIG. 3 ) formed in the housing 116 and/or roof of the container 162 .
- filtration which as used herein broadly means preventing airborne matter (particles, precipitation, objects, etc.), as well as preventing other undesired objects (animals, trespassers, etc.) from entering the container through the opening 164 .
- one or more filtering elements shown schematically at 174
- the filtering element 174 can be provided in a separate housing called an outside air module 160 .
- the outside air module 160 is designed to be installed on the roof of the container 112 . Referring to FIG. 3 , the outside air module 160 can include a duct 169 or other air directing member, such as to guide air from a side opening to an opening 172 (as is described below in greater detail).
- first and second openings 166 , 168 formed in the housing 116 /roof 162 and aligned first and second openings 170 , 172 formed in the outside air module 160 .
- the louver 140 is changed to the closed position for the open loop operating mode, which causes hot air to be drawn from the interior 130 , through the cooling unit 136 , through the openings 166 , 170 and into the outside air module 160 , through the module 160 to mix with cooler outside air, and back through the openings 172 , 168 into the housing 112 and out through the outlet opening 146 as cooler air.
- the cooling unit 136 can be operated normally during the open loop mode, in which case the addition of cooler outside air serves as redundant cooling to supplement the cooling it normally provides. Alternatively, the cooling unit 136 need not be operated, such that only outside air is used, e.g., when conditions permit or in an emergency (e.g., if the cooling unit 136 has failed). It would also be possible in some implementations to include a heat exchanger in the outside air module 160 .
- the multi-mode cooling apparatus is shown configured in an auxiliary cooling mode 108 .
- the system is configured as in the closed loop operating mode described above, but additional cooling is provided by an auxiliary cooling unit 190 .
- the auxiliary cooling unit 190 has an auxiliary heat exchanger 192 with at least a cold side heat exchange portion 194 positioned outside the container 112 .
- a hot side heat exchange portion 196 of the heat exchanger 192 is positioned within the housing.
- connections 198 link the functions of cold side heat exchange portion 194 and the hot side heat exchange portion 196 together.
- Air that has been cooled by the cooling unit 136 is further cooled by the heat exchanger 192 before flowing through the louver 140 under the action of the fan and exiting out into the interior 130 as cooler air.
- the auxiliary heat exchanger 192 may be a thermal siphon (e.g., a heat pipe), a chilled water cooler, a direct expansion cooler and/or another form of refrigerant-based heat exchanger.
- a direct expansion cooler/system uses a conventional refrigerant vapor expansion/compression cycle.
- the auxiliary heat exchanger 192 can be operated without operating the cooling unit 136 , such as when conditions allow for it and/or if the cooling unit 136 has failed.
- FIGS. 5A , 5 B and 5 C are various views of the multi-mode cooling apparatus 102 /housing 112 and internal components and features.
- the housing 116 can be made of sheet metal or another suitable material.
- One or more internal air directing surfaces 152 as shown in the sectioned elevation view of FIG. 5B can be added to improve flow through the housing 112 .
- the louver 140 is shown in the closed position.
- the louver 140 is shown in the open position.
- the filter 141 can be positioned approximately horizontally, and the air flow path within the housing can be configured to cause flow to travel downwardly through the filter 141 before traveling laterally to the fan 138 and the outlet opening 146 .
- the housing 116 can have a hinged portion covering the fan 138 that allows servicing of the fan and other components without disassembling the entire cooling apparatus 102 .
- the filter 141 By orienting the filter 141 approximately horizontally, it can be removed from the housing (such as for cleaning or replacement) by moving the hinged portion out of the way (or detaching it), as is shown in FIG. 5C .
- required filtering capacity can be provided without requiring the vertical dimension of the housing 116 to be enlarged.
- FIGS. 6A , 6 B and 6 C are sectioned end elevation, top plan and right side elevation views, respectively, of a multi-mode cooling apparatus 202 according to another implementation.
- reference numerals in FIGS. 6A-6C have the same numeral plus 100 as corresponding elements described above.
- the housing 216 can include a horizontal drip tray beneath the cooling unit 236 and aligned with the bottom surface 250 .
- the liquid side connections for the heat exchanger 237 can be seen in FIG. 6A .
- the cooling apparatus includes four fans 238 .
- the heat exchanger 137 of the cooling unit 136 is a chilled water cooler or a direct expansion cooler, but other cooling technologies are of course possible.
- the heat exchanger 192 is a thermal siphon, a chilled water cooler, a direct expansion cooler or another type of refrigerant-based heat exchanger. It is also possible to implement so-called conductive cooling technologies, such as the conductive cooling system marketed by Inertech that uses “standard refrigerant” instead of water and purportedly saves greatly on energy costs.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/447,540 US20160037685A1 (en) | 2014-07-30 | 2014-07-30 | Adaptable container mounted cooling solution |
EP15750205.5A EP3175687B1 (en) | 2014-07-30 | 2015-07-29 | Adaptable container mounted cooling solution |
PCT/US2015/042626 WO2016018996A1 (en) | 2014-07-30 | 2015-07-29 | Adaptable container mounted cooling solution |
JP2017501311A JP6293355B2 (ja) | 2014-07-30 | 2015-07-29 | 冷却液体を実装する適応可能コンテナ |
CN201580041248.5A CN106576436B (zh) | 2014-07-30 | 2015-07-29 | 多模式冷却设备 |
US15/874,845 US10772238B1 (en) | 2014-07-30 | 2018-01-18 | Adaptable container mounted cooling solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/447,540 US20160037685A1 (en) | 2014-07-30 | 2014-07-30 | Adaptable container mounted cooling solution |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/874,845 Continuation US10772238B1 (en) | 2014-07-30 | 2018-01-18 | Adaptable container mounted cooling solution |
Publications (1)
Publication Number | Publication Date |
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US20160037685A1 true US20160037685A1 (en) | 2016-02-04 |
Family
ID=53836238
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/447,540 Abandoned US20160037685A1 (en) | 2014-07-30 | 2014-07-30 | Adaptable container mounted cooling solution |
US15/874,845 Active 2035-01-21 US10772238B1 (en) | 2014-07-30 | 2018-01-18 | Adaptable container mounted cooling solution |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/874,845 Active 2035-01-21 US10772238B1 (en) | 2014-07-30 | 2018-01-18 | Adaptable container mounted cooling solution |
Country Status (5)
Country | Link |
---|---|
US (2) | US20160037685A1 (ja) |
EP (1) | EP3175687B1 (ja) |
JP (1) | JP6293355B2 (ja) |
CN (1) | CN106576436B (ja) |
WO (1) | WO2016018996A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160324036A1 (en) * | 2015-05-01 | 2016-11-03 | Baselayer Technology, Llc | Side-cooled modular data center |
US9629285B1 (en) * | 2015-06-22 | 2017-04-18 | Amazon Technologies, Inc. | Datacenter in-row cooling units |
US10010014B1 (en) | 2015-06-22 | 2018-06-26 | Amazon Technologies, Inc. | Interconnecting cooling units |
CN109358734A (zh) * | 2018-11-26 | 2019-02-19 | 华研科技(大连)有限公司 | 一种用于计算机水冷系统的过滤器及方法 |
US10356956B1 (en) | 2015-06-22 | 2019-07-16 | Amazon Technologies, Inc. | Datacenter cooling unit with subfloor components |
US10485136B2 (en) | 2017-12-07 | 2019-11-19 | Seagate Technology Llc | Low profile fan assemblies |
US10999954B2 (en) * | 2019-04-23 | 2021-05-04 | Vertiv Corporation | Modular roof mounted cooling system and method for data center |
US11019748B2 (en) | 2017-12-22 | 2021-05-25 | Seagate Technology Llc | Suspended fan modules |
US20210378151A1 (en) * | 2020-05-29 | 2021-12-02 | Baidu Usa Llc | Backup cooling for a data center and servers |
US11202394B1 (en) * | 2018-10-26 | 2021-12-14 | United Sendees Automobile Association (USAA) | Data center cooling system |
US20220141993A1 (en) * | 2020-10-29 | 2022-05-05 | Nec Corporation | Cooling apparatus, cooling system, and cooling method |
US11737238B1 (en) * | 2018-10-26 | 2023-08-22 | United Services Automobile Association (Usaa) | Data center cooling system |
US11758695B2 (en) | 2020-11-25 | 2023-09-12 | Digital Porpoise, Llc | Cooling system for a data center that includes an offset cooling technology |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9769953B2 (en) * | 2016-02-04 | 2017-09-19 | Google Inc. | Cooling a data center |
JP2022032788A (ja) * | 2020-08-14 | 2022-02-25 | 日本電気株式会社 | 冷却装置、冷却システム、および冷却方法 |
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-
2014
- 2014-07-30 US US14/447,540 patent/US20160037685A1/en not_active Abandoned
-
2015
- 2015-07-29 JP JP2017501311A patent/JP6293355B2/ja active Active
- 2015-07-29 WO PCT/US2015/042626 patent/WO2016018996A1/en active Application Filing
- 2015-07-29 EP EP15750205.5A patent/EP3175687B1/en active Active
- 2015-07-29 CN CN201580041248.5A patent/CN106576436B/zh active Active
-
2018
- 2018-01-18 US US15/874,845 patent/US10772238B1/en active Active
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US4495545A (en) * | 1983-03-21 | 1985-01-22 | Northern Telecom Limited | Enclosure for electrical and electronic equipment with temperature equalization and control |
US6131647A (en) * | 1997-09-04 | 2000-10-17 | Denso Corporation | Cooling system for cooling hot object in container |
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US11785748B2 (en) * | 2020-05-29 | 2023-10-10 | Baidu Usa Llc | Backup cooling for a data center and servers |
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US20220141993A1 (en) * | 2020-10-29 | 2022-05-05 | Nec Corporation | Cooling apparatus, cooling system, and cooling method |
US11758695B2 (en) | 2020-11-25 | 2023-09-12 | Digital Porpoise, Llc | Cooling system for a data center that includes an offset cooling technology |
Also Published As
Publication number | Publication date |
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JP2017528792A (ja) | 2017-09-28 |
EP3175687A1 (en) | 2017-06-07 |
JP6293355B2 (ja) | 2018-03-14 |
EP3175687B1 (en) | 2021-09-01 |
CN106576436B (zh) | 2019-05-03 |
CN106576436A (zh) | 2017-04-19 |
WO2016018996A1 (en) | 2016-02-04 |
US10772238B1 (en) | 2020-09-08 |
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