US20160028203A1 - Shielded sockets for microprocessors and fabrication thereof by overmolding and plating - Google Patents
Shielded sockets for microprocessors and fabrication thereof by overmolding and plating Download PDFInfo
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- US20160028203A1 US20160028203A1 US14/874,275 US201514874275A US2016028203A1 US 20160028203 A1 US20160028203 A1 US 20160028203A1 US 201514874275 A US201514874275 A US 201514874275A US 2016028203 A1 US2016028203 A1 US 2016028203A1
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- contact strips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm
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- H01L2021/60—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
- H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
Definitions
- FIG. 2B illustrates a top-down plan view of contact strips with carrier arms from a carrier, as stamped from metal sheets, in accordance with an embodiment of the present invention.
- FIG. 9 includes a plot showing far end cross talk (FEXT) as a function of frequency for a set of four contacts or pins in a shielded socket, in accordance with an embodiment of the present invention.
- FEXT far end cross talk
- One or more embodiments of the present invention are directed to shielded socket fabrication as enabled by innovative overmolding and plating processing.
- Embodiments may pertain to one or more of shielded sockets, high speed input/output (HSIO), overmolding, plating, server products, and/or high performance computing (HPC) products.
- HSIO high speed input/output
- HPC high performance computing
- FIGS. 2A and 2B illustrate an angled top-down plan view and a top-down plan view, respectively, of contact strips 202 with carrier arms 204 from a carrier 206 , as stamped from metal sheets, in accordance with an embodiment of the present invention.
- Each of the contact strips 202 includes a contact tip region 208 and a J-lead region 210 .
- Each of the carrier arms 204 includes a break-off point 212 .
- fabrication of a shielded socket begins with a metal sheet and stamp out of a base geometry (e.g., before inserting bends) of contacts.
- FIG. 4 illustrates a top-down plan view of a plastic housing 400 having wall features for inserting structures with contact strips within a cavity 404 of the plastic housing 400 , in accordance with an embodiment of the present invention.
- the electronic system 1000 also includes a display device 1050 , an audio output 1060 .
- the electronic system 1000 includes an input device such as a controller 1070 that may be a keyboard, mouse, trackball, game controller, microphone, voice-recognition device, or any other input device that inputs information into the electronic system 1000 .
- an input device 1070 is a camera.
- an input device 1070 is a digital sound recorder.
- an input device 1070 is a camera and a digital sound recorder.
- the metal coated on the plastic is copper.
- the plurality of contact strips forms a hexagonal array within the plastic housing, and each of the plurality of contact strips is in contact with an adjacent contact strip through the metal layer of the respective contact strip.
- inserting the one or more contact strips in a plastic housing involves supporting the one or more contact strips by wall features of the plastic housing.
- the method further involves, subsequent to inserting the one or more contact strips in the plastic housing, electrically grounding one or more contacts of one or more of the contact strips.
- the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
- LCP liquid crystal polymer
Abstract
Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.
Description
- This application is a divisional of U.S. patent application Ser. No. 13/930,090, filed on Jun. 28, 2013, the entire contents of which are hereby incorporated by reference herein.
- Embodiments of the invention are in the field of integrated circuits and, in particular, shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques.
- A central processing unit (CPU) socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
- Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. The surface plate may be referred to as an integrated loading mechanism (ILM). The designs provide superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.
- CPU sockets are used in desktop and server computers. As they allow easy swapping of components, they are also used for prototyping new circuits. Laptops typically use surface mount CPUs, which need less space than a socketed part.
- A conventional CPU socket is made of plastic, a lever or latch, and metal contacts for each of the pins or lands on the CPU. Many packages are keyed to ensure the proper insertion of the CPU. CPUs with a pin grid array (PGA) package are inserted into the socket and the latch is closed. CPUs with an LGA package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
- However, improvements are needed in the field of integrated circuit (IC) socket technology, particular for high end microprocessor applications.
-
FIG. 1 is a flowchart representing operations in a method of manufacturing a shielded socked, in accordance with an embodiment of the present invention. -
FIG. 2A illustrates an angled top-down plan view of contact strips with carrier arms from a carrier, as stamped from metal sheets, in accordance with an embodiment of the present invention. -
FIG. 2B illustrates a top-down plan view of contact strips with carrier arms from a carrier, as stamped from metal sheets, in accordance with an embodiment of the present invention. -
FIG. 3A illustrates an angled top-down plan view of contact strips overmolded with a plastic coating in a vertical region of the contacts strips, with metal plated on the plastic coating, in accordance with an embodiment of the present invention. -
FIG. 3B illustrates an end-on (from a contact perspective) view of contact strips overmolded with a plastic coating in a vertical region of the contacts strips, with metal plated on the plastic coating, in accordance with an embodiment of the present invention. -
FIG. 4 illustrates a top-down plan view of a plastic housing having wall features for inserting structures with contact strips within a cavity of the plastic housing, in accordance with an embodiment of the present invention. -
FIG. 5 illustrates an end-on (from a contact overlying J-leads perspective) view of a plurality contact strips overmolded with a plastic coating, with metal plated on the plastic coating, in accordance with an embodiment of the present invention. -
FIG. 6 illustrates an angled top-down view of a socket housing having a plurality of contact strips disposed therein, in accordance with an embodiment of the present invention. -
FIG. 7 includes a plot showing insertion loss as a function of frequency for a single contact or pin in a shielded socket, in accordance with an embodiment of the present invention. -
FIG. 8 includes a plot showing near end cross talk (NEXT) as a function of frequency for a set of four contacts or pins in a shielded socket, in accordance with an embodiment of the present invention. -
FIG. 9 includes a plot showing far end cross talk (FEXT) as a function of frequency for a set of four contacts or pins in a shielded socket, in accordance with an embodiment of the present invention. -
FIG. 10 is a schematic of a computer system, in accordance with an embodiment of the present invention. - Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In the following description, numerous specific details are set forth, such as ordering of process operations used to fabricate a shielding socket, in order to provide a thorough understanding of embodiments of the present invention. It will be apparent to one skilled in the art that embodiments of the present invention may be practiced without these specific details. In other instances, well-known features, such as specific semiconductor packaging processes, are not described in detail in order to not unnecessarily obscure embodiments of the present invention. Furthermore, it is to be understood that the various embodiments shown in the Figures are illustrative representations and are not necessarily drawn to scale.
- One or more embodiments of the present invention are directed to shielded socket fabrication as enabled by innovative overmolding and plating processing. Embodiments may pertain to one or more of shielded sockets, high speed input/output (HSIO), overmolding, plating, server products, and/or high performance computing (HPC) products.
- To provide context, socket pin count demand is increasing as a result of higher bandwidth requirements, leading to larger form factor (FF) and higher cost. A shielded socket is one solution to enable higher density of I/O contacts and improved HSIO performance. If all sockets could be shielded, then speeds may be increased without risk of lossy signals. However, although such shielding may be desirable, it can be very difficult to manufacture such a socket. Past approaches evaluated thus far that provide the target mechanical and electrical performance have suffered from manufacturing and common grounding challenges. Many past solutions have proven complex and costly.
- Generally, embodiments described herein are directed to fabricating a socket body by assembling repeating plastic structures, as over-molded on strips of contacts, into socket housing. In one embodiment, the repeating plastic structures have a metal coating on the outer walls, and contact one another at multiple locations at intervals of half the contact pitch value, in order to enable common grounding. It is, however, to be understood that the design is not limited to being one half pitch off. One half pitch is shown and described herein to illustrate a hexagonal pattern, as described in greater detail herein. In one embodiment, the contact strips have carrier arms attached to thereto, which facilitate assembling of the plastic structures in the housing. In one embodiment, shielding is maintained for maximum stack height and at a full 360 degrees.
- More specifically, in an embodiment, shielding is built into a structure that is to be inserted into a socket housing. Shielding may be provided approximately 360 degrees around the contact closely approximating a coaxial cable. In an embodiment, an easier manufacturing approach is described for providing a socket body. In an embodiment, the same contact design is used for signal and ground. The difference is that the ground contacts are connected to a conductive coating. In an embodiment, designs described herein take advantage of existing cantilever contacts and accommodates the contacts in a shielded space, simplifying the manufacturability. In an embodiment, fabrication involves use of overmolding to reduce the tooling cost and time by reducing the large tooling otherwise required to fabricate a full socket body to tooling required to fabricate a strip of contacts. In a specific embodiment, in cases where requirements of a shielded socket dictate such, the contacts are laid out in a 39 mil Hex pattern.
- As an example,
FIG. 1 is aflowchart 100 representing operations in a method of manufacturing a shielded socked, in accordance with an embodiment of the present invention. - Referring to
operation 102 offlowchart 100, contact strips with carrier arms are stamped from metal sheets. As an example,FIGS. 2A and 2B illustrate an angled top-down plan view and a top-down plan view, respectively, of contact strips 202 withcarrier arms 204 from acarrier 206, as stamped from metal sheets, in accordance with an embodiment of the present invention. Each of the contact strips 202 includes acontact tip region 208 and a J-lead region 210. Each of thecarrier arms 204 includes a break-offpoint 212. In an embodiment, fabrication of a shielded socket begins with a metal sheet and stamp out of a base geometry (e.g., before inserting bends) of contacts. The base geometry can be a strip carrying multiple contacts and carrier arms, as shown inFIGS. 2A and 2B . In one embodiment, the number of contacts on the strip will be such that it covers the socket housing from one end across to the other, as described in greater detail below. It is to be understood that, generally, the bottom of the J-lead ultimately receives a solder ball during a socket process and is attached to the mother board. Corresponding cantilever beams are in contact with the package. - Referring to
operation 104 offlowchart 100, the contact strips ofoperation 102 are overmolded with plastic in a vertical region of the contacts. As an example,FIGS. 3A and 3B illustrate an angled top-down plan view and an end-on (from a contact perspective) view, respectively, of contact strips 202 overmolded with aplastic coating 320 in a vertical region of the contacts strips, with metal plated on the plastic coating, in accordance with an embodiment of the present invention. In one embodiment, as depicted inFIGS. 3A and 3B , theplastic coating 320 has an undulating shape. It is to be understood that, in an embodiment, an undulating geometry may be applicable for hexagonal pitches. Additionally, squares, triangles, polygons, etc. may be used for square or other patterns. In a particular embodiment, theplastic molding 320 is composed of a liquid crystal polymer (LCP) material. It is to be understood that other similar plastic molding materials may be equally applicable. - Referring to
operation 106 offlowchart 100, the outer walls of the plastic are coated with a metal layer. Referring again toFIGS. 3A and 3B , ametal coating 322 is formed on the exposed surfaces of theplastic coating 320. In an embodiment, then, a plastic structure is overmolded onto the contact strips, and metal is coated on the outer walls of the plastic structure. The approach of depositing metal on the exterior of the plastic enables, in an embodiment, cost effective methods of plating and allows better uniformity as the plating is not occurring in high aspect ratio cavities with poor line of sight. As discussed in greater detail below, in one embodiment, multiple plastic structures with contact strips can then be inserted in a socket housing adjacent to each other to populate the socket core depending on the required number of contacts. In a particular embodiment,metal coating 322 is a plated copper layer. It is to be understood that other like conductive layers, such as gold or silver layers may be equally applicable. - Referring to
operation 108 offlowchart 100, bends are inserted in the stamped metal to create the contact geometry (e.g., contact tips 208) and J-leads 210. It is noted that the bends are shown as formed prior to overmolding (FIGS. 2A/2B and FIGS. 3A/3B), in accordance with one embodiment. However, in another embodiment, the bends (e.g., contacttips 208 and J-leads 210) are formed subsequent to plastic coating overmolding or subsequent to plastic coating overmolding and metal coating plating. - Referring to
operation 110 offlowchart 100, a plastic housing is provided with wall features for inserting structures with contact strips. As an example,FIG. 4 illustrates a top-down plan view of aplastic housing 400 having wall features for inserting structures with contact strips within acavity 404 of theplastic housing 400, in accordance with an embodiment of the present invention. - Referring to
operation 112 offlowchart 100, one or more rows of contact strip structures are inserted in the housing. Referring again toFIG. 4 , one row of contact strips 202, havingplastic coating 320 andmetal coating 322 thereon is inserted into thecavity 404 ofplastic housing 400 and supported by wall features (as seen more readily in the angled view ofFIG. 6 ). Additionally, as is also shown inFIG. 4 , thecarrier 206 andcarrier arms 204 are removed from the contact strips 202 by releasing thecarrier 206 andcarrier arms 204 at the break-offpoints 212. The remaining contact strips 202 include thecontact tip regions 208 and the J-lead regions 210, as depicted inFIG. 4 . Although, in one embodiment, thecarrier 206 andcarrier arms 204 are removed subsequent to inserting the contact strips into thehousing 400, in another embodiment, thecarrier 206 andcarrier arms 204 are removed prior to inserting the contact strips into thehousing 400. In a particular embodiment, thehousing 400 has locking features on the base periphery to hold the contact strip structures in place. - In an embodiment, a purpose of the metal-coated plastic structure described above is two-fold: (1) to provide a robust casing around the contact strips 202 that can be aligned and inserted into the insertion features on the
housing 400, as depicted inFIG. 4 ; and (2) the dimensions are selected such that the metal-coated walls touch the walls of the adjacent contact strip structure, enabling common ground throughout the a resulting socket structure. As an example,FIG. 5 illustrates an end-on (from acontact 202 overlying J-leads 210 perspective) view of aplurality 500contact strips 202 overmolded with aplastic coating 320, withmetal 322 plated on the plastic coating, in accordance with an embodiment of the present invention. Referring toFIG. 5 , the contacting outer walls of adjacentcontact strips structures 202 provides common grounding). - In an embodiment, the dimension of the socket to which the contact strips are aligned is selected based on a target to achieve maximum distance between two contacts in a hexagonal layout. Such an arrangement minimizes the risk of shorting the contacts when they are in a deflected state. As can be viewed in
FIG. 5 , if the contacts were to be rotated by 90 degrees, the distance between adjacent contacts in the direction of wipe will be smaller than the shown configuration. In an embodiment, thecontact strip structures 202 are aligned with the alignment features on the housing and press fit into the housing, e.g.,housing 400. - An arrangement such as the arrangement shown in
FIG. 5 may be used for a plurality of strips in a housing such ashousing 400. As a partially completed example,FIG. 6 illustrates an angled top-down view of asocket housing 400 having a plurality of contact strips 202 disposed therein, in accordance with an embodiment of the present invention. Referring toFIG. 6 , the plurality of contact strips 202 has a hexagonal arrangement, as described in association withFIG. 5 . It is to be understood that the structure ofFIG. 6 is an incomplete socket structure. A complete socket structure includes, in one embodiment, an entirely packed plurality of contact strips 202 inhousing 400. In any case, referring again toFIG. 6 , separate ground contacts are not required since all contacts are the same at fabrication. Subsequent to completing fabrication of the socket structure, a determination can be made as to which contacts will be grounded. - In accordance with one or more embodiments of the present invention, advantages of the above described shielded socket designs include one or more of: (1) feasibility for manufacturing with conventional resources; (2) utilization of a cantilever contact design; (3) housing fabricated without conventional stiff housing, and due to the design of the contact strip structures, additional compliance on the solder joint side (potentially reducing risk of shock failure; (4) for the ground contacts, top surfaces of the plastic structures can be plated as well, providing connection to other conducting surfaces; (5) improved control over plating uniformity; (6) scalable solutions; (7) the contact strips can readily be slid in to larger/smaller housings of a same width; and/or (8) reduced tooling costs (e.g., full socket tooling is reduced to tooling for contact strips which are then molded multiple times to populate a socket body).
- One or more, embodiments of the present invention have been evaluated using computer assisted design (CAD) tools. Additionally HSIO modeling has been completed on one or more of the designs described herein. More specifically, insertion loss, near end cross talk and far end cross talk are plotted in
FIGS. 7 , 8, and 9, respectively.FIG. 7 includes aplot 700 showing insertion loss as a function of frequency for a single contact or pin (one unit within a strip) in a shielded socket, in accordance with an embodiment of the present invention.FIG. 8 includes aplot 800 showing near end cross talk (NEXT) as a function of frequency for a set of four contacts or pins in a shielded socket, in accordance with an embodiment of the present invention.FIG. 9 includes aplot 900 showing far end cross talk (FEXT) as a function of frequency for a set of four contacts or pins in a shielded socket, in accordance with an embodiment of the present invention. Overall, electrical results show improved performance over conventional socket designs. - Embodiments described herein may have far reaching implementations for, e.g., shielding improvement and/or signal speed increases for an integrated circuit housed in a shielded socket. Applications for a shielded socket described herein may include, but need not be limited to, socket applications for CPUs/processors, multi-chip/3D packaging including CPU in combination with other devices, memory (e.g., flash/DRAM/SRAM), graphics, etc. Overall, one or more embodiments provide one or more of an increased number of I/O contacts in a same form factor, scalability for various products, improved high speed input/out (HSIO) performance in socketed packages, and/or reduced package size due to reduction of ground pins necessary for shielding signal pins (e.g., signal to ground ratio increase).
- It is to be understood that a variety of package types (e.g., packaging arrangements for a semiconductor die) may be accommodated by one or more of the shielded sockets described herein. In an embodiment, conductive features from a package substrate of a semiconductor package are used to physically couple the semiconductor package and, hence, electrically couple the packaged die or dies, to the J-leads of the shielded socket. Typically, sockets are used with land grid array (LGA) or pin grid array (PGA) packages. In the case of LGA, the package can have gold plated lands (e.g., where lands are regions where the contact can touch down upon). It is also to be understood that, as used throughout, J-leads are typically on the side of the contact that touches the board. The side of the contact that touches the packages is most commonly referred to as the cantilever or even contact.
- In a first example, in accordance with an embodiment of the present invention, a die is coupled to a flexible substrate or a rigid substrate, depending upon the specific application. The substrate has a plurality of electrical traces disposed therein. In an embodiment, an external contact layer is also formed. In an embodiment, the external contact layer includes an array such as, but not limited to, a land grid array (LGA) or an array of pins (PGA). In any case, the external array is coupled to the J-leads of the shielded socket.
- In a second example, in accordance with another embodiment of the present invention, a semiconductor die with C4 solder ball connections is packaged in a Bumpless Build-Up Layer or BBUL processor packaging technology. Such a process is bumpless since it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build-up layers since it is grown or built-up around the silicon die. Additionally, some semiconductor packages now use a coreless substrate, which does not include the thick resin core layer commonly found in conventional substrates. In an embodiment, as part of the BBUL process, electrically conductive vias and routing layers are formed above the active side of a semiconductor die using a semi-additive process (SAP) to complete remaining layers. In an embodiment, an external contact layer is formed. In an embodiment, the array of external conductive contacts is an array such as, but not limited to, a land grid array (LGA) or an array of pins (PGA). In any case, the external array is coupled to the J-leads of the shielded socket.
-
FIG. 10 is a schematic of acomputer system 1000, in accordance with an embodiment of the present invention. The computer system 1000 (also referred to as the electronic system 1000) as depicted can embody a shielded socket housing a packaged semiconductor die according to any of the several disclosed embodiments and their equivalents as set forth in this disclosure. Thecomputer system 1000 may be a mobile device such as a netbook computer. Thecomputer system 1000 may be a mobile device such as a wireless smart phone. Thecomputer system 1000 may be a desktop computer. Thecomputer system 1000 may be a hand-held reader. Thecomputer system 1000 may be a server system. Thecomputer system 1000 may be a supercomputer or high-performance computing system. - In an embodiment, the
electronic system 1000 is a computer system that includes asystem bus 1020 to electrically couple the various components of theelectronic system 1000. Thesystem bus 1020 is a single bus or any combination of busses according to various embodiments. Theelectronic system 1000 includes avoltage source 1030 that provides power to anintegrated circuit 1010. In some embodiments, thevoltage source 1030 supplies current to theintegrated circuit 1010 through thesystem bus 1020. - The
integrated circuit 1010 is electrically coupled to thesystem bus 1020 and includes any circuit, or combination of circuits according to an embodiment. In an embodiment, theintegrated circuit 1010 includes aprocessor 1012 that can be of any type. As used herein, theprocessor 1012 may mean any type of circuit such as, but not limited to, a microprocessor, a microcontroller, a graphics processor, a digital signal processor, or another processor. In an embodiment, theprocessor 1012 is a packaged die housed in a shielded socket, as disclosed herein. In an embodiment, SRAM cells are found in memory caches of the processor. Other types of circuits that can be included in theintegrated circuit 1010 are a custom circuit or an application-specific integrated circuit (ASIC), such as acommunications circuit 1014 for use in wireless devices such as cellular telephones, smart phones, pagers, portable computers, two-way radios, and similar electronic systems, or a communications circuit for servers. In an embodiment, theintegrated circuit 1010 includes on-die memory 1016 such as static random-access memory (SRAM). In an embodiment, theintegrated circuit 1010 includes embedded on-die memory 1016 such as embedded dynamic random-access memory (eDRAM). - In an embodiment, the
integrated circuit 1010 is complemented with a subsequentintegrated circuit 1011. Useful embodiments include adual processor 1013 and adual communications circuit 1015 and dual on-die memory 1017 such as SRAM. In an embodiment, the dualintegrated circuit 1010 includes embedded on-die memory 1017 such as eDRAM. - In an embodiment, the
electronic system 1000 also includes anexternal memory 1040 that in turn may include one or more memory elements suitable to the particular application, such as amain memory 1042 in the form of RAM, one or morehard drives 1044, and/or one or more drives that handleremovable media 1046, such as diskettes, compact disks (CDs), digital variable disks (DVDs), flash memory drives, and other removable media known in the art. Theexternal memory 1040 may also be embeddedmemory 1048 such as the first die in a die stack, according to an embodiment. - In an embodiment, the
electronic system 1000 also includes adisplay device 1050, anaudio output 1060. In an embodiment, theelectronic system 1000 includes an input device such as acontroller 1070 that may be a keyboard, mouse, trackball, game controller, microphone, voice-recognition device, or any other input device that inputs information into theelectronic system 1000. In an embodiment, aninput device 1070 is a camera. In an embodiment, aninput device 1070 is a digital sound recorder. In an embodiment, aninput device 1070 is a camera and a digital sound recorder. - As shown herein, the
integrated circuit 1010 can be implemented in a number of different embodiments, including in a shielded socket housing a packaged semiconductor die, according to any of the several disclosed embodiments and their equivalents, an electronic system, a computer system, one or more methods of fabricating an integrated circuit, and one or more methods of fabricating an electronic assembly that includes a shielded socket housing a packaged semiconductor die according to any of the several disclosed embodiments as set forth herein in the various embodiments and their art-recognized equivalents. The elements, materials, geometries, dimensions, and sequence of operations can all be varied to suit particular I/O coupling requirements including array contact count, array contact configuration for a microelectronic die embedded in a semiconductor package and housed in a shielded socket embodiments and their equivalents. A foundation substrate may be included, as represented by the dashed line ofFIG. 10 . Passive devices may also be included, as is also depicted inFIG. 10 . - Embodiments of the present invention include shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques.
- In an embodiment, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.
- In one embodiment, the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
- In one embodiment, the metal coated on the plastic is copper.
- In one embodiment, the plurality of contact strips forms a hexagonal array within the plastic housing, and each of the plurality of contact strips is in contact with an adjacent contact strip through the metal layer of the respective contact strip.
- In one embodiment, each of the plurality of contact strips is supported the by wall features of the plastic housing.
- In an embodiment, a method of fabricating a shielded socket for a packaged semiconductor device involves stamping one or more contact strips from a metal sheet, each contact strip including a plurality of contacts attached to a carrier by carrier arms. The method also involves overmolding, with plastic, a vertical region of each of the plurality of contacts of each of the one or more contact strips. The method also involves coating the plastic with a metal layer. The method also involves forming bends in each of the plurality of contacts of each of the one or more contact strips to provide a contact tip and a J-lead in each of the plurality of contacts of each of the one or more contact strips. The method also involves removing the carrier and carrier arms from each of the one or more contact strips. The method also involves inserting the one or more contact strips in a plastic housing.
- In one embodiment, overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips involves overmolding using a liquid crystal polymer (LCP).
- In one embodiment, coating the plastic with the metal layer involves plating copper on the plastic.
- In one embodiment, inserting the one or more contact strips in the plastic housing involves forming a hexagonal array of contact strips within the plastic housing, each contact strip of the hexagonal array of contact strips in contact with an adjacent contact strip through the metal layer of the respective contact strip.
- In one embodiment, forming bends in each of the plurality of contacts of each of the one or more contact strips is performed subsequent to the overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips.
- In one embodiment, forming bends in each of the plurality of contacts of each of the one or more contact strips is performed prior to the overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips.
- In one embodiment, removing the carrier and carrier arms from each of the one or more contact strips is performed subsequent to inserting the one or more contact strips in the plastic housing.
- In one embodiment, inserting the one or more contact strips in a plastic housing involves supporting the one or more contact strips by wall features of the plastic housing.
- In one embodiment, the method further involves, subsequent to inserting the one or more contact strips in the plastic housing, electrically grounding one or more contacts of one or more of the contact strips.
- In one embodiment, inserting the one or more contact strips in the plastic housing provides a shielded socket, and the method further involves coupling a packaged semiconductor device to the shielded socket by attaching metal lands of the packaged semiconductor device to the contact tips.
- In an embodiment, a contact strip for a shielded socket includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, the plastic coated with a metal layer. Each of the plurality of contacts also includes a contact portion and a J-lead portion. The plurality of contacts is unified by the plastic of each of the plurality of contacts.
- In one embodiment, the plastic of each of the plurality of contacts of the contact strip has a unified undulating geometry.
- In one embodiment, the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
- In one embodiment, the metal coated on the plastic is copper.
- In an embodiment, an electronics apparatus includes a socket. The socket includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer. The electronics apparatus also includes a packaged semiconductor device coupled to, and housed in, the socket by metal contacts of the packaged semiconductor device attached to the J-leads of the socket.
- In one embodiment, the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
- In one embodiment, the metal coated on the plastic is copper.
- In one embodiment, the plurality of contact strips forms a hexagonal array within the plastic housing, and each of the plurality of contact strips is in contact with an adjacent contact strip through the metal layer of the respective contact strip.
- In one embodiment, each of the plurality of contact strips is supported the by wall features of the plastic housing.
- In one embodiment, the socket is a shielding socket for the packaged semiconductor device.
Claims (10)
1. A method of fabricating a shielded socket for a packaged semiconductor device, the method comprising:
stamping one or more contact strips from a metal sheet, each contact strip comprising a plurality of contacts attached to a carrier by carrier arms;
overmolding, with plastic, a vertical region of each of the plurality of contacts of each of the one or more contact strips;
coating the plastic with a metal layer;
forming bends in each of the plurality of contacts of each of the one or more contact strips to provide a contact tip and a J-lead in each of the plurality of contacts of each of the one or more contact strips;
removing the carrier and carrier arms from each of the one or more contact strips; and
inserting the one or more contact strips in a plastic housing.
2. The method of claim 1 , wherein overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips comprises overmolding using a liquid crystal polymer (LCP).
3. The method of claim 1 , wherein coating the plastic with the metal layer comprises plating copper on the plastic.
4. The method of claim 1 , inserting the one or more contact strips in the plastic housing comprises forming a hexagonal array of contact strips within the plastic housing, each contact strip of the hexagonal array of contact strips in contact with an adjacent contact strip through the metal layer of the respective contact strip.
5. The method of claim 1 , wherein forming bends in each of the plurality of contacts of each of the one or more contact strips is performed subsequent to the overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips.
6. The method of claim 1 , wherein forming bends in each of the plurality of contacts of each of the one or more contact strips is performed prior to the overmolding, with plastic, the vertical region of each of the plurality of contacts of each of the one or more contact strips.
7. The method of claim 1 , wherein the removing the carrier and carrier arms from each of the one or more contact strips is performed subsequent to the inserting the one or more contact strips in the plastic housing.
8. The method of claim 1 , wherein inserting the one or more contact strips in a plastic housing comprises supporting the one or more contact strips by wall features of the plastic housing.
9. The method of claim 1 , further comprising:
subsequent to inserting the one or more contact strips in the plastic housing, electrically grounding one or more contacts of one or more of the contact strips.
10. The method of claim 1 , wherein inserting the one or more contact strips in the plastic housing provides a shielded socket, the method further comprising:
coupling a packaged semiconductor device to the shielded socket by attaching metal lands of the packaged semiconductor device to the contact tips.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/874,275 US20160028203A1 (en) | 2013-06-28 | 2015-10-02 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/930,090 US9178328B2 (en) | 2013-06-28 | 2013-06-28 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
US14/874,275 US20160028203A1 (en) | 2013-06-28 | 2015-10-02 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/930,090 Division US9178328B2 (en) | 2013-06-28 | 2013-06-28 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
Publications (1)
Publication Number | Publication Date |
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US20160028203A1 true US20160028203A1 (en) | 2016-01-28 |
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ID=52116009
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US13/930,090 Active 2033-09-05 US9178328B2 (en) | 2013-06-28 | 2013-06-28 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
US14/874,275 Abandoned US20160028203A1 (en) | 2013-06-28 | 2015-10-02 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
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US13/930,090 Active 2033-09-05 US9178328B2 (en) | 2013-06-28 | 2013-06-28 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating |
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US (2) | US9178328B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180135909A1 (en) * | 2016-11-11 | 2018-05-17 | Lg Electronics Inc. | Refrigerator |
US11289836B2 (en) * | 2020-07-23 | 2022-03-29 | International Business Machines Corporation | Land grid array electrical contact coating |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012105508B4 (en) * | 2012-06-25 | 2016-11-10 | Wago Verwaltungsgesellschaft Mbh | Pin contact element and electronics housing |
DE102015221801A1 (en) * | 2015-11-06 | 2017-05-11 | Robert Bosch Gmbh | Plug connector for a sensor element |
EP4156421A1 (en) * | 2015-12-14 | 2023-03-29 | Molex, LLC | Backplane connector omitting ground shields and system using same |
US10008474B2 (en) | 2016-07-11 | 2018-06-26 | International Business Machines Corporation | Dense assembly of laterally soldered, overmolded chip packages |
US10664642B1 (en) | 2018-11-30 | 2020-05-26 | International Business Machines Corporation | Constructing via meshes for high performance routing on silicon chips |
EP4075610A1 (en) * | 2021-04-13 | 2022-10-19 | Aptiv Technologies Limited | Male or female connector for automotive applications and method of assembling thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5060372A (en) * | 1990-11-20 | 1991-10-29 | Capp Randolph E | Connector assembly and contacts with severed webs |
US7695288B2 (en) * | 2008-06-25 | 2010-04-13 | Intel Corporation | Land grid array (LGA) socket with cells and method of fabrication and assembly |
US20110076894A1 (en) * | 2009-09-30 | 2011-03-31 | Hon Hai Precision Industry Co., Ltd. | Lower profile electrical socket configured with wafers |
US8025531B1 (en) * | 2010-12-16 | 2011-09-27 | Intel Corporation | Shielded socket housing |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
KR100202326B1 (en) * | 1995-11-08 | 1999-06-15 | 오우라 히로시 | Ic socket |
US6264476B1 (en) * | 1999-12-09 | 2001-07-24 | High Connection Density, Inc. | Wire segment based interposer for high frequency electrical connection |
US7503768B2 (en) * | 2003-11-05 | 2009-03-17 | Tensolite Company | High frequency connector assembly |
US8821188B2 (en) * | 2012-03-07 | 2014-09-02 | Hon Hai Precision Industry Co., Ltd. | Electrical connector assembly used for shielding |
TWI583068B (en) * | 2012-08-02 | 2017-05-11 | 鴻海精密工業股份有限公司 | Electrical connector |
-
2013
- 2013-06-28 US US13/930,090 patent/US9178328B2/en active Active
-
2015
- 2015-10-02 US US14/874,275 patent/US20160028203A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5060372A (en) * | 1990-11-20 | 1991-10-29 | Capp Randolph E | Connector assembly and contacts with severed webs |
US7695288B2 (en) * | 2008-06-25 | 2010-04-13 | Intel Corporation | Land grid array (LGA) socket with cells and method of fabrication and assembly |
US20110076894A1 (en) * | 2009-09-30 | 2011-03-31 | Hon Hai Precision Industry Co., Ltd. | Lower profile electrical socket configured with wafers |
US8025531B1 (en) * | 2010-12-16 | 2011-09-27 | Intel Corporation | Shielded socket housing |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180135909A1 (en) * | 2016-11-11 | 2018-05-17 | Lg Electronics Inc. | Refrigerator |
US11289836B2 (en) * | 2020-07-23 | 2022-03-29 | International Business Machines Corporation | Land grid array electrical contact coating |
Also Published As
Publication number | Publication date |
---|---|
US20150004813A1 (en) | 2015-01-01 |
US9178328B2 (en) | 2015-11-03 |
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