US20150265027A1

US20150265027A1 - Nail lamp device

Info

Publication number: US20150265027A1
Application number: US14/222,268
Authority: US
Inventors: Kevin Wan
Original assignee: LUMITECH INT'L Inc
Current assignee: LUMITECH INT'L Inc
Priority date: 2014-03-21
Filing date: 2014-03-21
Publication date: 2015-09-24

Abstract

A nail lamp device includes an inner housing having an inner housing substrate and an inner chamber surrounded by the inner housing substrate, at least one chip on board (COB) light emitting diode (LED) module disposed on an inner surface of the inner housing substrate by pasting-fitted and emitting light toward the inner chamber, a control module disposed on an outer surface of the inner housing substrate and electrically connected to the COB LED module, and an outer housing covering the inner housing and retaining a front opening of the inner chamber exposed. The COB LED module used by the nail lamp device is directly disposed on the inner surface of the inner housing substrate by pasting-fitted and has a plurality of LED elements arranged in array to accelerate the time required for the curing reaction of the resin coatings or glues coated on fingers. Moreover, the wavelength ranges of light can be selected with high elasticity, so as to enhance utility.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a nail lamp device, and particularly to a nail lamp device using a chip on board (COB) light emitting diode (LED) module as a light source.
2. Description of the Prior Art
Beauty is human nature. As people pay more attention on appearance, people usually put resin coatings with different colors on nails to increase the gloss and color of nails, or use various decorative pieces adhered on nails to enhance the richness of Manicure design. To let resin coatings or glues coated on nails be cured fast, a nail lamp device is used to irradiate the resin coatings or glues, so as to accelerate the curing reaction of the resin coatings or glues.
FIG. 1 shows a partial structural schematic view of a conventional nail lamp device. As shown in FIG. 1, a plurality of openings 12 are formed in an inner housing 10 of a conventional nail lamp device, and a plurality sets of light source modules 14 are disposed on an outer top 101 and an outer side 102 of the inner housing 10. Light produced by light sources 141 of the light source modules 14 is projected into an inner chamber 16 of the inner housing 10 via the openings 12. To let heat produced by the light sources 141 of the light source modules 14 be able to be dissipated efficiently, there is a need to dispose heat-dissipating pieces 18 or heat-dissipating fins. Such a design, which is needed to dispose heat-dissipating pieces or heat-dissipating fins additionally, tends to result in a heavy and inconvenient nail lamp device. Besides, the light source 141 used conventionally is a single lamp. A single lamp produces light with a narrow angle and low power, which usually extends the time required for the curing reaction of the resin coatings or glues, so that time is wasted.

SUMMARY OF THE INVENTION

To solve the above-mentioned problems, one objective of the present invention is to provide a nail lamp device, which has a chip on board (COB) light emitting diode (LED) module directly disposed on an inner surface of an inner housing substrate by pasting-fitted, such that a plurality of LED elements emit light toward an inner chamber. Heat produced by the LED elements may be directly dissipated to outside via a heat-conductive substrate structure and the inner housing substrate. Thus, the present invention has the advantage of lightness and convenience.
One objective of the present invention is to provide a nail lamp device, which uses a COB LED module having a plurality of LED elements arranged in array to emit light with high power, so that a nail lamp device of the present invention can accelerate the time required for the curing reaction of the resin coatings or glues coated on fingers, thus meeting requirements of consumers.
One objective of the present invention is to provide a nail lamp device, which uses a COB LED module having LED elements with different wavelength ranges of light. Based on a sort of the resin coatings coated by a user, the LED elements with the needed wavelength ranges of light are driven to emit light by a control module, thereby irradiating the resin coatings and curing the resin coatings quickly. The present invention has the advantage that wavelength ranges of light can be selected with high elasticity, so as to enhance utility.
To achieve the above-mentioned objectives, a nail lamp device of one embodiment of the present invention comprises: an inner housing comprising an inner housing substrate and an inner chamber surrounded by the inner housing substrate, the inner chamber comprising at least one front opening, the inner housing substrate comprising an inner surface and an opposed outer surface, and the inner surface facing the inner chamber; at least one COB LED module, each of the COB LED modules comprising: a heat-conductive substrate structure having a front side and a back side, the back side being disposed on the inner surface of the inner housing substrate by pasting-fitted; and a plurality of LED elements electrically connected to the front side of the heat-conductive substrate structure and emitting light toward the inner chamber; a control module disposed on the outer surface of the inner housing substrate and electrically connected to the COB LED module, so as to control the COB LED module; and an outer housing covering the inner housing and retaining the front opening of the inner chamber exposed.
Other advantages of the present invention will become apparent from the following descriptions taken in conjunction with the accompanying drawings wherein certain embodiments of the present invention are set forth by way of illustration and examples.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the accompanying advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed descriptions, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1 shows a partial structural schematic view of a conventional nail lamp device.

FIG. 2 shows an exploded structural schematic view of a nail lamp device according to one embodiment of the present invention.

FIG. 3 shows a partial structural schematic view of a nail lamp device according to one embodiment of the present in vent on.

FIG. 4 shows a partial structural schematic view of the COB LED module according to one embodiment of the present invention.

FIG. 5 shows an assembled structural schematic view of a nail lamp device according to one embodiment of the present invention.

FIG. 6 shows an application schematic view of a nail lamp device according to one embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Detail descriptions are as follows, and the described preferred embodiments are only illustrating and not a limitation of the present invention.
Referring to FIG. 2, FIG. 2 shows an exploded structural schematic view of a nail lamp device according to one embodiment of the present invention. As shown in FIG. 2, the nail lamp device includes an inner housing 22, at least one COB LED module 24, a control module 26 and an outer housing 28. In one embodiment, the nail lamp device 20 includes a plurality sets of COB LED modules 24.
The inner housing 22 includes an inner housing substrate 30 and an inner chamber 32 surrounded by the inner housing substrate 30. The inner chamber 32 includes a front opening 321. The inner housing substrate 30 includes an inner surface 301 and an opposed outer surface 302, and the inner surface 301 faces the inner chamber 32. In one embodiment, referring to FIG. 3 in conjunction, the inner housing substrate 30 has a planar region 30 a, two first bending regions 30 b which extend downward obliquely from two opposed edges of the planar region 30 a respectively, two second bending regions 30 c which extend downward obliquely from an edge of a first bending region 30 b respectively, and two securing portions 30 d disposed at an edge of a second bending region 30 c respectively, but is not limited to this. A number of the bending regions is not limited. Moreover, the overall inner housing substrate may be designed as an arc shape. Besides, a back plate 34 is extended downward from a back edge of the inner housing substrate 30 and is opposed to the front opening 321 (as shown in FIG. 2). A plurality of through holes 36 for wires are formed on the planar region 30 a and the two first bending regions 30 b respectively. In one embodiment, a material of the inner housing substrate 30 is a plastic or a metal, and the inner surface 301 of the inner housing substrate 30 is an inner wall with a reflective property.
As shown in FIG. 2 and FIG. 3, a plurality sets of the COB LED modules 24 are disposed on the inner surface 301 of the inner housing substrate 30 and are distributed on the planar region 30 a and the first bending regions 30 b. The COB LED module 24 includes a heat-conductive substrate structure 38 and a plurality of LED elements 40. The heat-conductive substrate structure 38 includes a front side 381 and a back side 382. Referring to FIG. 4 in conjunction, the plurality of LED elements 40 are disposed on the front side 381 of the heat-conductive substrate structure 38, and the COB LED module 24 is disposed on the inner surface 301 of the inner housing substrate 30 with the back side 382 of the heat-conductive substrate structure 38 thereof pasting-fitted to the inner surface 301, such that the plurality of LED elements 40 emit light toward the inner chamber 32. In one embodiment, the COB LED module 24 is secured on the inner surface 302 of the inner housing substrate 30 by locking elements 42, such as a plurality of screws. Moreover, each set of the COB LED module 24 includes two circuit terminals 44 (as shown in FIG. 4).
Continuing to refer to FIG. 2 and FIG. 3, the control module 26 is disposed on the outer surface 302 of the inner housing substrate 30. The two circuit terminals 44 (as shown in FIG. 4) of each set of the COB LED module 24 are electrically connected to the control module 26 with a wire 46 passing through the through hole 36 for wires respectively, and light emitting of the COB LED module 24 is controlled by the control module 26.
Continuing with the foregoing descriptions, in one embodiment, as shown in FIG. 4, the heat-conductive substrate structure 38 includes a metal board 52 and a circuit board 54. The metal board 52 has a first surface 521 and an opposed second surface 522. A plurality of projections 523 are formed on the first surface 521. Moreover, the circuit board 54 has a plurality of openings 541, which positions correspond to the positions of the projections 523. In addition, the circuit board 54 is disposed on the first surface 521 of the metal board 52, and surfaces of the projections 523 are exposed via the openings 541. A second surface 522 of the metal board 52 serves as the back side 382 of the overall heat-conductive substrate structure 38, so as to be disposed on the inner surface 301 (as shown in FIG. 3) of the inner housing substrate 30 (as shown in FIG. 3) by pasting-fitted. In one embodiment, the exposed surfaces of the projections 523 are in plane with the surface of the circuit board 54, so as to commonly serve as the front side 381 of the heat-conductive substrate structure 38. The plurality of LED elements 40 are disposed on the exposed surfaces of the projections 523, and are electrically connected to the circuit board 54 with a plurality of wires 56. In one embodiment, the metal board 52 is a copper substrate.
FIG. 5 shows an assembled structural schematic view of a nail lamp device according to one embodiment of the present invention. Referring to FIG. 2 and FIG. 5 in conjunction, a shape of the outer housing 28 corresponds to the geometry of the inner housing 22, and the outer housing 28 covers the inner housing 22 and retains the front opening 321 exposed. After resin coatings or glues are coated on nails 48 by a user, as shown in FIG. 6, the user only needs to put fingers 50 into the inner chamber 32 through the front opening 321, and drive the COB LED modules 24 to emit light by an exposed control switch (not shown) of the control module 26 (as shown in FIG. 5), and the resin coatings or glues on the fingers 50 may be cured quickly.
Moreover, in the present invention, the plurality of LED elements 40 of each of the COB LED modules 24 may be selected to have a same wavelength range of light, or have many different′ wavelength ranges of light. A selection of the wavelength ranges of light may depend on a sort of a resin coating or a glue selected to be used on nails. In one embodiment, the plurality of LED elements 40 of a single COB LED module 24 may be selected to have two wavelength ranges of light. One wavelength range is between 390 nanometer and 410 nanometer, and the other wavelength range is between 320 nanometer and 390 nanometer.
On the other hand, if the plurality of LED elements 40 of a single COB LED module 24 all use a same wavelength range of light, a plurality sets of the COB LED modules 24 having different wavelength ranges of light may be selected to be distributed on the inner surface 301 (as shown in FIG. 3) of the inner housing substrate 30 (as shown in FIG. 3). In one embodiment, a plurality sets of single COB LED module 24 may be selected to have two wavelength ranges of light. One wavelength range is between 390 nanometer and 410 nanometer, and the other wavelength range is between 320 nanometer and 390 nanometer.
In yet one embodiment, each of the COB LED modules may further includes a reflective cup secured on the heat-conductive substrate structure and facing the inner chamber, and the reflective cup is disposed around the LED elements to enhance a strength of the light of the LED elements in a front direction.
In the present invention, each of the COB LED modules is directly disposed on the inner surface of the inner housing substrate by pasting-fitted, such that a plurality of LED elements emit light toward the inner chamber. Heat produced by the LED elements may be directly dissipated to outside via the heat-conductive substrate structure and the inner housing substrate. Such a design uses the inner housing substrate to provide a reflective property and a heat-dissipating function, eliminating a need of a conventional nail lamp device to dispose heat-dissipating pieces or heat-dissipating fins, so that the present invention has the advantage of lightness and convenience. Furthermore, since each set of the COB LED modules has a plurality of LED elements arranged in array to emit light with high power, a nail lamp device of the present invention can accelerate the time required for the curing reaction of the resin coatings or glues coated on fingers, thus meeting requirements of consumers. Besides, in the present invention, since the COB LED module has LED elements with different wavelength ranges of light, based on a sort of the resin coating coated by a user, the LED elements with the needed wavelength ranges of light are driven to emit light by a control module, thereby irradiating the resin coating and curing the resin coating quickly. Thus, the present invention also has the advantage that the wavelength ranges of light can be selected with high elasticity, so as to enhance utility.
While the invention can be subject to various modifications and alternative forms, a specific example thereof has been shown in the drawings and is herein described in detail. It should be understood, however, that the invention is not to be limited to the particular form disclosed, but on the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the appended claims.
Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that other modifications and variation can be made without departing from the spirit and scope of the invention as hereafter claimed.

Claims

What is claimed is:

1. A nail lamp device, comprising:

an inner housing comprising an inner housing substrate and an inner chamber surrounded by the inner housing substrate, the inner chamber comprising at least one front opening, the inner housing substrate comprising an inner surface and an opposed outer surface, and the inner surface facing the inner chamber;

at least one chip on board (COB) light emitting diode (LED) module, each of the COB LED modules comprising:

a heat-conductive substrate structure comprising a front side and a back side, the back side being disposed on the inner surface of the inner housing substrate by pasting-fitted; and

a plurality of LED elements electrically connected to the front side of the heat-conductive substrate structure and emitting light toward the inner chamber;

a control module disposed on the outer surface of the inner housing substrate and electrically connected to the COB LED module, so as to control the COB LED module; and

an outer housing covering the inner housing and retaining the front opening of the inner chamber exposed.

2. The nail lamp device according to claim 1, wherein a plurality of through holes for wires are formed on the inner housing substrate, and each of the COB LED modules comprises at least two circuit terminals, such that the circuit terminals and the control module are electrically connected with a plurality of wires passing through the through holes for wires.

3. The nail lamp device according to claim 1, wherein the heat-conductive substrate structure at least comprises:

a metal board having a first surface and an opposed second surface, a plurality of projections being formed on the first surface, and the second surface serving as the back side of the heat-conductive substrate structure; and

a circuit board having a plurality of openings, the circuit board being disposed on the first surface of the metal board, and surfaces of the projections being exposed via the openings to serve as a portion of the front side of the heat-conductive substrate structure, and the LED elements being disposed on the surfaces of the projections and being electrically connected to the circuit board with a plurality of wires.

4. The nail lamp device according to claim 3, wherein the metal board is a copper substrate.

5. The nail lamp device according to claim 1, wherein the COB LED module is secured on the inner surface of the inner housing substrate by a locking element.

6. The nail lamp device according to claim 1, wherein a material of the inner housing substrate is a plastic or a metal.

7. The nail lamp device according to claim 1, wherein a back edge of the inner housing substrate extends downwards to form a back plate opposed to the front opening.

8. The nail lamp device according to claim 1, wherein the LED elements of each of the COB LED modules emit light having a plurality of wavelength ranges.

9. The nail lamp device according to claim 8, wherein the wavelength ranges of light correspond to a sort of a resin coating or a glue coated on nails.

10. The nail lamp device according to claim 8, wherein one wavelength range of light is between 390 nanometer and 410 nanometer, and the other wavelength range of light is between 320 nanometer and 390 nanometer.

11. The nail lamp device according to claim 1, comprising a plurality sets of the COB LED modules, and wherein the COB LED modules have same or different wavelength ranges of light, and the LED elements of a same COB LED module have the same wavelength range of light.

12. The nail lamp device according to claim 11, wherein the wavelength range of light corresponds to a sort of a resin coating or a glue coated on nails.

13. The nail lamp device according to claim 11, wherein one wavelength range of light is between 390 nanometer and 410 nanometer, and the other wavelength range of light is between 320 nanometer and 390 nanometer.

14. The nail lamp device according to claim 1, wherein each of the COB LED modules further comprises a reflective cup secured on the heat-conductive substrate structure and facing the inner chamber, and the reflective cup is disposed around the LED elements.