US20150218710A1 - Composite and method for making the same - Google Patents
Composite and method for making the same Download PDFInfo
- Publication number
- US20150218710A1 US20150218710A1 US14/687,536 US201514687536A US2015218710A1 US 20150218710 A1 US20150218710 A1 US 20150218710A1 US 201514687536 A US201514687536 A US 201514687536A US 2015218710 A1 US2015218710 A1 US 2015218710A1
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- US
- United States
- Prior art keywords
- substrate
- pores
- micro
- composite
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
- C23F4/02—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 by evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2305/00—Use of metals, their alloys or their compounds, as reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2305/00—Use of metals, their alloys or their compounds, as reinforcement
- B29K2305/02—Aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
Definitions
- the subject matter herein generally relates to composites, particularly to a composite having high bonding strength and a method for making the composite.
- Adhesives for combining heterogeneous materials in the form of a metal and a synthetic resin are in demand in a wide variety of technical fields and industries, such as the automotive and household appliance fields.
- the bonding strength of the metal and resin is weak.
- adhesives are generally only effective in a narrow temperature range of about ⁇ 50° C. to about 100° C., which means they are not suitable in applications where operating or environmental temperatures may fall outside of the range. Due to the above reason, other bonding methods have been applied that do not involve the use of an adhesive.
- One example of such methods is by forming bonds through injection molding or other similar process.
- the bonding strength of the metal and resin can be further improved.
- FIGures Many aspects of the disclosure can be better understood with reference to the following FIGures.
- the components in the FIGures are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure.
- like reference numerals designate corresponding parts throughout the several views.
- FIG. 1 is a cross-sectional view of an exemplary embodiment of a composite.
- FIG. 2 is a scanning electron microscopy view of an exemplary embodiment of a substrate being laser etched.
- FIG. 3 is a scanning electron microscopy view of a cross-section at the combine of the substrate and the resin composition.
- FIG. 4 is a scanning electron microscopy view of a surface of the substrate combining to the resin composition.
- FIG. 5 is a cross-sectional view of a mold of the composite shown in FIG. 1 .
- FIG. 6 is a flow chart of making the composite.
- FIG. 1 shows a composite 100 according to an exemplary embodiment.
- the composite 100 includes a substrate 11 , and at least a resin composition 13 formed on the substrate 11 .
- the substrate 11 can be made of metal, glass, or ceramic.
- the metal can be stainless steel, magnesium alloy, or copper alloy.
- a plurality of micro-pores 111 are defined in a surface of the substrate 11 .
- the pore diameter of the micro-pores 111 can be in a range of about 1 micrometer ( ⁇ m) to about 100 ⁇ m, and the pore depth of the micro-pores 111 can be in a range of about 1 ⁇ m-about 200 ⁇ mm.
- Each two adjacent micro-pores 111 have a space between them of about 10 ⁇ m-about 200 ⁇ m.
- the pore diameter and the pore depth of the micro-pores 111 , and the space of each two micro-pores 111 can be adjusted.
- the micro-pores 111 are regularly distributed in an array in the surface of the substrate 11 .
- the micro-pores 111 can be irregularly distributed in the surface of the substrate 11 .
- the resin composition 13 is coupled to the surface of the substrate 11 having the micro-pores 111 and fills the micro-pores 111 . That is, a portion of the resin composition 13 insert in the micro-pores 111 , which causes a locking/catching effect and strongly bonding the resin composition 13 to the substrate 11 .
- the resin composition 13 can be coupled to the substrate 11 by molding.
- the resin composition 13 can be made up of crystalline thermoplastic synthetic resins having high fluidity.
- polyphenylene sulfide (PPS), polyamide (PA), polybutylene terephthalate (PBT), or polyethylene terephthalate (PET) can be selected as the molding materials for the resin composition 13 .
- the resin composition 13 can bond firmly with the substrate 11 .
- the molding materials can be added with some fiberglass to improve the property for molding.
- FIG. 6 a flow chart is presented in accordance with an example embodiment of a method 30 for making the composite 100 which may include the following steps.
- the example method 30 is provided by way of example, as there are a variety of ways to carry out the method.
- the method 30 described below can be carried out using the configurations illustrated in FIG. 6 , for example, and various elements of the figure are referenced in explaining example method 30 .
- Each block shown in FIG. 6 represents one or more processes, methods or subroutines, carried out in the example method 30 .
- a substrate 11 is provided.
- the substrate 11 is cleaned.
- the cleaning process can be carried out by dipping the substrate 11 in a water solution containing Na + .
- the water solution can contain sodium carbonate, sodium phosphate, and sodium silicate.
- the sodium carbonate may have a mass concentration of about 30 g/L-about 50 g/L.
- the sodium phosphate may have a mass concentration of about 30 g/L-about 50 g/L.
- the sodium silicate may have a mass concentration of about 3 g/L-about 5 g/L.
- the water solution may keep at about 50° C.-about 60° C.
- the dipping process may last about 5 min-about 15 min. After that, the substrate 11 is rinsed.
- the substrate 11 is laser etched to form the micro-pores 111 in a surface of the substrate 11 .
- the laser etching process can be carried out using a laser machine having the parameters of, power: about 10 W-about 30 W, frequency: about 20 KHZ-about 60 KHZ, and step length: about 0.005 ⁇ m-about 0.1 ⁇ m.
- the injection mold 20 includes a core insert 23 and a cavity insert 21 .
- the core insert 23 defines several gates 231 , and a first cavity 233 .
- the cavity insert 21 defines a second cavity 211 for receiving the substrate 11 .
- the substrate 11 having the micro-pores 111 is located in the second cavity 211 , and molten resin is injected through the gates 231 to coat the surface of the substrate 11 and fill the micro-pores 111 , and finally fill the first cavity 233 to form the resin composition 13 , as such, the composite 100 is formed.
- the molten resin can be crystalline thermoplastic synthetic resins having high fluidity, such as PPS, PA, PBT, or PET.
- the injection mold 20 keeps a temperature of about 120° C.-about 140° C.
- Tensile strength and shear strength of the composite 100 have been tested. The tests indicated that the shear strength of the composite 100 was about 20 MPa-about 30 MPa, and the tensile strength of the composite 100 was about 8 MPa-about 16 MPa. Furthermore, the composite 100 has been subjected to a temperature humidity bias test (72 hours, 85° C., relative humidity: 85%) and a thermal shock test (48 hours, ⁇ 40° C.-85° C., 4 hours/cycle, 12 cycles total), such testing did not result in decreased the shear strength and the tensile strength of the composite 100 .
- a temperature humidity bias test 72 hours, 85° C., relative humidity: 85%
- a thermal shock test 48 hours, ⁇ 40° C.-85° C., 4 hours/cycle, 12 cycles total
- the exemplary method of forming the micro-pores 111 is very effectively comparing to the conventional chemical etching, electrochemical etching or anodizing treating, and simultaneously fit for multiple materials.
Abstract
Description
- This application is a divisional application of U.S. Ser. No. 13/403,528, filed Feb. 23, 2012, the contents of which are hereby incorporated by reference. The patent application Ser. No. 13/403,528 in turn claims the benefit of priority under 35 USC 119 from Chinese Patent Application 201110420534.6, filed on Aug. 4, 2010.
- The subject matter herein generally relates to composites, particularly to a composite having high bonding strength and a method for making the composite.
- Adhesives, for combining heterogeneous materials in the form of a metal and a synthetic resin are in demand in a wide variety of technical fields and industries, such as the automotive and household appliance fields. However, the bonding strength of the metal and resin is weak. Furthermore, adhesives are generally only effective in a narrow temperature range of about −50° C. to about 100° C., which means they are not suitable in applications where operating or environmental temperatures may fall outside of the range. Due to the above reason, other bonding methods have been applied that do not involve the use of an adhesive. One example of such methods is by forming bonds through injection molding or other similar process. However, the bonding strength of the metal and resin can be further improved.
- Many aspects of the disclosure can be better understood with reference to the following FIGures. The components in the FIGures are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is a cross-sectional view of an exemplary embodiment of a composite. -
FIG. 2 is a scanning electron microscopy view of an exemplary embodiment of a substrate being laser etched. -
FIG. 3 is a scanning electron microscopy view of a cross-section at the combine of the substrate and the resin composition. -
FIG. 4 is a scanning electron microscopy view of a surface of the substrate combining to the resin composition. -
FIG. 5 is a cross-sectional view of a mold of the composite shown inFIG. 1 . -
FIG. 6 is a flow chart of making the composite. -
FIG. 1 shows a composite 100 according to an exemplary embodiment. Thecomposite 100 includes asubstrate 11, and at least aresin composition 13 formed on thesubstrate 11. - The
substrate 11 can be made of metal, glass, or ceramic. The metal can be stainless steel, magnesium alloy, or copper alloy. - Referring to
FIG. 2 , a plurality of micro-pores 111 are defined in a surface of thesubstrate 11. The pore diameter of the micro-pores 111 can be in a range of about 1 micrometer (μm) to about 100 μm, and the pore depth of the micro-pores 111 can be in a range of about 1 μm-about 200 μmm. Each two adjacent micro-pores 111 have a space between them of about 10 μm-about 200 μm. - The pore diameter and the pore depth of the micro-pores 111, and the space of each two micro-pores 111 can be adjusted.
- In the embodiment, the micro-pores 111 are regularly distributed in an array in the surface of the
substrate 11. Alternately, the micro-pores 111 can be irregularly distributed in the surface of thesubstrate 11. - Referring to
FIGS. 3 and 4 , theresin composition 13 is coupled to the surface of thesubstrate 11 having the micro-pores 111 and fills the micro-pores 111. That is, a portion of theresin composition 13 insert in the micro-pores 111, which causes a locking/catching effect and strongly bonding theresin composition 13 to thesubstrate 11. - The
resin composition 13 can be coupled to thesubstrate 11 by molding. Theresin composition 13 can be made up of crystalline thermoplastic synthetic resins having high fluidity. In the exemplary embodiment, polyphenylene sulfide (PPS), polyamide (PA), polybutylene terephthalate (PBT), or polyethylene terephthalate (PET) can be selected as the molding materials for theresin composition 13. Theresin composition 13 can bond firmly with thesubstrate 11. The molding materials can be added with some fiberglass to improve the property for molding. - Referring to
FIG. 6 , a flow chart is presented in accordance with an example embodiment of amethod 30 for making thecomposite 100 which may include the following steps. Theexample method 30 is provided by way of example, as there are a variety of ways to carry out the method. Themethod 30 described below can be carried out using the configurations illustrated inFIG. 6 , for example, and various elements of the figure are referenced in explainingexample method 30. Each block shown inFIG. 6 represents one or more processes, methods or subroutines, carried out in theexample method 30. - At
block 31, asubstrate 11 is provided. - At
block 32, thesubstrate 11 is cleaned. The cleaning process can be carried out by dipping thesubstrate 11 in a water solution containing Na+. The water solution can contain sodium carbonate, sodium phosphate, and sodium silicate. The sodium carbonate may have a mass concentration of about 30 g/L-about 50 g/L. The sodium phosphate may have a mass concentration of about 30 g/L-about 50 g/L. The sodium silicate may have a mass concentration of about 3 g/L-about 5 g/L. During the dipping process, the water solution may keep at about 50° C.-about 60° C. The dipping process may last about 5 min-about 15 min. After that, thesubstrate 11 is rinsed. - At
block 33, thesubstrate 11 is laser etched to form the micro-pores 111 in a surface of thesubstrate 11. The laser etching process can be carried out using a laser machine having the parameters of, power: about 10 W-about 30 W, frequency: about 20 KHZ-about 60 KHZ, and step length: about 0.005 μm-about 0.1 μm. - At
block 34, aninjection mold 20 as is shown inFIG. 5 is provided. Theinjection mold 20 includes acore insert 23 and acavity insert 21. Thecore insert 23 definesseveral gates 231, and afirst cavity 233. Thecavity insert 21 defines asecond cavity 211 for receiving thesubstrate 11. Thesubstrate 11 having the micro-pores 111 is located in thesecond cavity 211, and molten resin is injected through thegates 231 to coat the surface of thesubstrate 11 and fill themicro-pores 111, and finally fill thefirst cavity 233 to form theresin composition 13, as such, thecomposite 100 is formed. The molten resin can be crystalline thermoplastic synthetic resins having high fluidity, such as PPS, PA, PBT, or PET. During the molding process, theinjection mold 20 keeps a temperature of about 120° C.-about 140° C. - Tensile strength and shear strength of the
composite 100 have been tested. The tests indicated that the shear strength of thecomposite 100 was about 20 MPa-about 30 MPa, and the tensile strength of thecomposite 100 was about 8 MPa-about 16 MPa. Furthermore, thecomposite 100 has been subjected to a temperature humidity bias test (72 hours, 85° C., relative humidity: 85%) and a thermal shock test (48 hours, −40° C.-85° C., 4 hours/cycle, 12 cycles total), such testing did not result in decreased the shear strength and the tensile strength of thecomposite 100. - The exemplary method of forming the micro-pores 111 is very effectively comparing to the conventional chemical etching, electrochemical etching or anodizing treating, and simultaneously fit for multiple materials.
- It is believed that the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/687,536 US20150218710A1 (en) | 2011-12-15 | 2015-04-15 | Composite and method for making the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110420534.6 | 2011-12-15 | ||
CN201110420534.6A CN103158227B (en) | 2011-12-15 | 2011-12-15 | Complex and preparation method thereof |
US13/403,528 US20130157038A1 (en) | 2011-12-15 | 2012-02-23 | Composite and method for making the same |
US14/687,536 US20150218710A1 (en) | 2011-12-15 | 2015-04-15 | Composite and method for making the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/403,528 Division US20130157038A1 (en) | 2011-12-15 | 2012-02-23 | Composite and method for making the same |
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US20150218710A1 true US20150218710A1 (en) | 2015-08-06 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US13/403,528 Abandoned US20130157038A1 (en) | 2011-12-15 | 2012-02-23 | Composite and method for making the same |
US14/687,536 Abandoned US20150218710A1 (en) | 2011-12-15 | 2015-04-15 | Composite and method for making the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US13/403,528 Abandoned US20130157038A1 (en) | 2011-12-15 | 2012-02-23 | Composite and method for making the same |
Country Status (3)
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US (2) | US20130157038A1 (en) |
CN (1) | CN103158227B (en) |
TW (1) | TW201323173A (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104589775B (en) * | 2013-10-30 | 2019-08-02 | 深圳光启创新技术有限公司 | Meta Materials and its processing method |
JP6276080B2 (en) * | 2014-03-25 | 2018-02-07 | ダイセルポリマー株式会社 | Fiber reinforced thermoplastic resin composition, composite molded body using the same, and method for producing the same |
CN104494040B (en) * | 2014-11-28 | 2016-08-24 | 湖北工业大学 | The PRODUCT FORM DESIGN synthetic method of frosting alumina ceramic layer |
CN105479659B (en) * | 2015-04-30 | 2018-01-09 | 硕尼姆通信技术(深圳)有限公司 | The complex and its manufacture method of metal and plastic cement |
CN105538596B (en) * | 2016-01-28 | 2018-08-24 | 深圳市纳明特科技发展有限公司 | A kind of complex plastic material and preparation method thereof |
CN105729719A (en) * | 2016-02-17 | 2016-07-06 | 北京航空航天大学 | Metal-plastic mixed thin-wall structure based on mechanical lock-up interface |
US9901002B2 (en) | 2016-02-24 | 2018-02-20 | Microsoft Technology Licensing, Llc | Structures having a molded liner attached to a substrate |
CN107263939A (en) * | 2016-04-08 | 2017-10-20 | 优尔材料工业(深圳)有限公司 | complex and preparation method thereof |
CN108202440B (en) * | 2016-12-16 | 2021-03-30 | 北京小米移动软件有限公司 | Ceramic member, molding process thereof, and electronic device |
CN106957183B (en) * | 2017-01-19 | 2020-05-29 | 瑞声科技(新加坡)有限公司 | Housing and method for manufacturing the same |
CN108340537A (en) * | 2017-01-22 | 2018-07-31 | 北京小米移动软件有限公司 | Ceramic component and its moulding process, electronic equipment |
CN107650326A (en) * | 2017-09-11 | 2018-02-02 | 歌尔股份有限公司 | Engaging member of base material and plastics and preparation method thereof |
CN108235628B (en) * | 2018-03-13 | 2020-08-04 | Oppo广东移动通信有限公司 | Middle frame manufacturing method, middle frame and electronic equipment |
CN110405204B (en) * | 2018-04-28 | 2021-09-10 | 深圳市裕展精密科技有限公司 | Preparation method of heterogeneous metal piece |
CN110653993A (en) * | 2018-06-29 | 2020-01-07 | 富智康精密电子(廊坊)有限公司 | Shell and preparation method thereof |
CN110653143A (en) * | 2019-10-15 | 2020-01-07 | 中国民用航空飞行学院 | Spraying method after laser etching of aluminum alloy surface texture |
Family Cites Families (5)
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JP3467471B2 (en) * | 1999-12-08 | 2003-11-17 | ポリプラスチックス株式会社 | Manufacturing method of metal insert resin composite molding |
JP4541153B2 (en) * | 2002-12-16 | 2010-09-08 | コロナインターナショナル株式会社 | Manufacturing method of composite material of aluminum material and synthetic resin molding and composite product thereof |
JP2004216425A (en) * | 2003-01-15 | 2004-08-05 | Taisei Plas Co Ltd | Connecting joint for aluminum alloy pipe and its manufacturing method |
EP2082859B1 (en) * | 2006-10-16 | 2015-08-19 | Taisei Plas Co., Ltd. | Composite of metal with resin and process for producing the same |
KR20110049777A (en) * | 2008-06-30 | 2011-05-12 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Method of forming a microstructure |
-
2011
- 2011-12-15 CN CN201110420534.6A patent/CN103158227B/en active Active
- 2011-12-20 TW TW100147233A patent/TW201323173A/en unknown
-
2012
- 2012-02-23 US US13/403,528 patent/US20130157038A1/en not_active Abandoned
-
2015
- 2015-04-15 US US14/687,536 patent/US20150218710A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20130157038A1 (en) | 2013-06-20 |
TW201323173A (en) | 2013-06-16 |
CN103158227B (en) | 2016-02-03 |
CN103158227A (en) | 2013-06-19 |
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