US20140334084A1 - Server system with interlocking cells - Google Patents
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- US20140334084A1 US20140334084A1 US13/888,724 US201313888724A US2014334084A1 US 20140334084 A1 US20140334084 A1 US 20140334084A1 US 201313888724 A US201313888724 A US 201313888724A US 2014334084 A1 US2014334084 A1 US 2014334084A1
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K7/00—Constructional details common to different types of electric apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H—ELECTRICITY
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Definitions
- the present disclosure relates generally to processing systems and more particularly to server systems.
- Multiple-processor, or multiple-node, server systems conventionally are implemented in a blade server or rack server configuration whereby multiple server blades or server sleds are interconnected via a backplane or midplane. While enabling inter-node connectivity, the use of a midplane or backplane can interrupt airflow, thereby putting the server components in jeopardy of overheating. Moreover, because the backplane or midplane serves as the inter-node connection system for all nodes, the number of nodes supported in such systems is limited by the connectivity available from the particular midplane or backplane implemented in the system. Such systems also are difficult to scale as their expandability typically is limited to expansion in only one dimension, as well as being limited to the dimensions of the rack due to their reliance on the rack for structural support.
- FIG. 1 is a perspective view of a cell-based server system comprising a two-dimensional array of server cells in accordance with some embodiments.
- FIG. 2 is a perspective view of a server cell of the server system of FIG. 1 in accordance with some embodiments.
- FIG. 3 is a cross-section view of compatible slide-fit coupling assemblies of facing mating surfaces of adjacent server cells in accordance with some embodiments.
- FIG. 4 is a cross-section view of compatible press-fit coupling assemblies of facing mating surfaces of adjacent server cells in accordance with some embodiments.
- FIG. 5 is a block diagram illustrating a compute system of a server cell in accordance with some embodiments.
- FIG. 6 is a top view and a bottom view of a printed circuit board (PCB) assembly that forms at least some of the panels of an enclosure of a server cell in accordance with some embodiments.
- PCB printed circuit board
- FIG. 7 is a cross-section view of a portion of the PCB assembly of FIG. 6 in accordance with some embodiments.
- FIG. 8 is a perspective view of a cell-based server system comprising a three-dimensional array of server cells in accordance with some embodiments.
- FIG. 9 is a top view of a PCB assembly that forms five side panels of an open-front cuboid server cell in accordance with some embodiments.
- FIG. 10 is a top view of a PCB assembly that forms six side panels of a fully-enclosed cuboid server cell in accordance with some embodiments.
- FIG. 11 is a perspective view of a server system comprising a two-dimensional array of server cells with triangular prism enclosures in accordance with some embodiments.
- FIG. 12 is a front view of a server system comprising a hybrid two-dimensional array of server cells with triangular prism enclosures and server cells with hexagonal prism enclosures in accordance with some embodiments.
- FIG. 13 is a flow diagram illustrating a method for fabricating and operating a cell-based server system in accordance with some embodiments.
- FIGS. 1-13 illustrate techniques pertaining to a cell-based server system.
- the server system comprises an array of interlocking server cells that may be structurally self-supporting.
- Each server cell operates as a separate node in the system and has a cell enclosure containing the electronic components of the node, such as one or more processors, memory, an interconnect controller, and the like.
- the cell enclosure is formed of a plurality of side panels.
- the exterior surfaces of two or more side panels of the cell body include mechanical coupling assemblies to facilitate their mechanical coupling with adjacent server cells.
- Some or all of the exterior mating surfaces of the cell enclosure also can include electrical connectors for providing or receiving supply voltages or for conducting signaling with adjacent server cells.
- the signaling connectors are implemented as contact connectors, whereas in other embodiments, the signaling connectors are implemented as contactless connectors.
- Some or all of the server cells further can include jumper interfaces to receive jumper cabling so as to facilitate connectivity between non-adjacent server cells (that is, server cells that are separated by one or more intervening server cells).
- the cell enclosure in some embodiments, is open at one side or open at two opposing sides, thereby facilitating air flow.
- the server cell is formed from printed circuit board (PCB) sections that are connected or otherwise arranged into one of a variety of shapes, such as a cell enclosure with side panels forming a cuboid shape, a triangular prism shape, a pentagonal prism shape, a hexagonal prism shape, a heptagonal prism shape, an octagonal prism shape, and the like.
- PCB printed circuit board
- a server system may be formed from such server cells by interlocking the server cells in a specified arrangement so as to form an array of server cells attached via their side panels in a manner similar to the cells, or alveoli, of a honeycomb.
- the distribution of power among the server cells thus may be conducted via side panels of adjacent server cells.
- Interconnectivity of the server cells likewise may be achieved via signaling conducted between the side panels of adjacent server cells. As such, signaling and power may be routed through the server cell array without the need for a midplane or backplane.
- the server cells are removably coupleable so as to be reconfigurable into a new arrangement or so that a server cell may be swapped in place, or “field swappable.” Two server cells thus may be joined through a slide-fit coupling process or a press-fit coupling process.
- the side panels of the cell enclosure may be fabricated, connected, or internally braced so that the interlocked server cells are structurally self-supporting, thereby facilitating modification of the server system to include more or fewer server cells as appropriate.
- server cells may be configured so as to permit server cells to be interconnected in a one-dimensional array (e.g., a row or column of server cells), a two-dimensional array (e.g., a wall or rank of server cells), or a three-dimensional array (e.g., a cube of server cells).
- a one-dimensional array e.g., a row or column of server cells
- a two-dimensional array e.g., a wall or rank of server cells
- a three-dimensional array e.g., a cube of server cells
- FIG. 1 illustrates a cell-based server system 100 in accordance with some embodiments.
- the server system 100 may be implemented to provide any of a variety of server functions, such as a database services, simulation or modeling services, web hosting or video hosting services, and the like.
- the server system 100 supports the provision of such services through the use of an array 102 of interlocked server cells.
- the server system 100 comprises a two-dimensional (2D) array of server cells having nine server cells arranged in 3 columns and 3 rows, including server cells 111 , 112 , 113 , 114 , 115 , 116 , and 117 .
- the array 102 can include more or fewer server cells, as well as different dimensions, such as a one-dimensional array of server cells arranged in either a row or a column, or, as illustrated in greater detail with reference to FIG. 8 , a three-dimensional array of server cells arranged in multiple ranks, each rank comprising multiple rows and columns of server cells.
- Each server cell comprises computing componentry 120 to perform computing operations in support of the services provided by the server system 100 .
- this computing componentry 120 comprises one or more processor cores to perform computing operations.
- the one or more processor cores can include, for example, central processing units (CPUs), graphics processing units (CPUs), accelerated processing units (AR), a digital signal processor, and the like.
- some of the computing componentry of a subset of the server cells instead may include peripheral support components, hard drive controllers, basic input/output system (BIOS) controllers, network interface controllers (NICs), and other input/output (I/O) controllers.
- BIOS basic input/output system
- NICs network interface controllers
- I/O input/output
- the server cells further can include other support circuitry, such as data storage devices (e.g., disc drives and solid state drives), voltage regulators, AC-DC power supplies, DC-DC power supplies, input/output interfaces, discrete active or passive components (e.g., resistors, capacitors, and inductors), switches, buttons, and the like.
- data storage devices e.g., disc drives and solid state drives
- voltage regulators e.g., AC-DC power supplies
- DC-DC power supplies DC-DC power supplies
- input/output interfaces e.g., discrete active or passive components (e.g., resistors, capacitors, and inductors), switches, buttons, and the like.
- each server cell comprises an enclosure formed from at least three side panels.
- the exterior surface of each of some or all of the side panels of this enclosure includes a mechanical coupling assembly that is compatible with the mechanical coupling assemblies of other server cells such that two server cells joined together in the proper orientation may be mechanically connected via the compatible mechanical coupling assemblies of their opposing mating exterior surfaces. Any of a variety of mechanical coupling assemblies may be implemented.
- the mechanical coupling assemblies can interlock via a slide-fit relationship, such as through using a dovetail coupling assembly, interlock via a press-fit relationship, such as through using a pin-and-hole coupling assembly, or interlock through the use of adhesives, straps, hook-and-loop fasteners, clamps, magnets, bolts, and the like.
- the mechanical coupling provided between server cells can be engaged, disengaged, and then re-engaged, thereby allowing the server cells to be removably interlocked and thus allowing reconfiguration of the assembly of the server cells and expansion of the array 102 .
- the mechanical coupling is substantially permanent, such as through the use of an adhesive.
- the server cells interact with each other to implement the services provided by the server system 100 .
- the server system 100 may be used to implement a distributed compute operation whereby some or all of the server cells perform separate discrete compute operations in parallel in furtherance of the distributed compute operation.
- the server cells may be considered as analogous to processors in a multiple-processor blade server or rack server.
- some or all of the server cells operate independently; that is, they execute separate operating systems (OS), execute separate and independent programs, and/or operate on separate and independent data sets.
- OS operating systems
- each server cell may be considered as analogous to a separate rack server or blade server.
- server cells may operate as processing cells to perform compute operations and other server cells operate as input/output (I/O) cells to facilitate the communication of data and other signaling to and from storage devices, BIOS, and other peripheral devices on behalf of the processing cells, or to facilitate network communications with one or more external devices on behalf of the processing cells.
- I/O input/output
- the server cells are connected in a network topology, such as a ring network, a hub-and-spoke network, a torus network, a mesh network, and the like, or in a combination of network topologies.
- the links between the server cells in the intended network topology are implemented via electrical connectors disposed at the opposing mating surfaces of the side panels of the server cells.
- the electrical connectors can be implemented as contact-based connectors or contactless connectors. Contact-based connectors rely on physical contact to render an electrically conductive path between the signal connector on the mating surface of one server cell and the corresponding signal connector on the opposing mating surface of the adjacent server cell.
- contact-based connectors include metal pads, pins, metalized holes, spring-loaded metal connectors, and the like.
- Contactless connectors do not rely on physical contact to render a conductive path, but instead provide electrical conductivity via induction or capacitive coupling.
- An example contactless connector that may be employed is described in detail in U.S. patent application Ser. No. 13/495,325, entitled “Contactless Interconnect” and filed on Jun. 13, 2012, the entirety of which is incorporated by reference herein.
- supply voltages may be distributed to the server cells of the array 102 via connectors coupled between opposing mating surfaces of the server cells.
- some or all of the server cells can implement a jumper interface 122 that mechanically and electrically couples to a jumper cable, thereby allowing two non-adjacent server cells (that is, two server cells with one or more other server cells in-between) to be directly connected via a jumper cable.
- Such jumper cables can be used to implement a particular network topology that is not easily achieved given the physical arrangement of the server cells. For example, as illustrated in FIG.
- a jumper cable 124 connects the jumper interface 122 of the server cell 111 to the jumper interface 122 of the server cell 116 , thereby allowing the server cells 111 and 116 to directly communicate without using the server cell 117 or another server cell as an intermediary.
- the server cells 111 , 116 , and 117 can be connected in a ring topology, with communications between server cells 111 and 117 occurring between the mating surfaces coupling the server cells 111 and 117 , with communications between server cells 116 and 117 occurring between the mating surfaces coupling the server cells 116 and 117 , and communications between the server cells 111 and 116 occurring via the jumper cable 124 .
- the server system 100 further can include a chassis 130 to support the operation of the array 102 of server cells.
- the chassis 130 can include, for example, one or more voltage supplies to provide the voltages used to power the server cells.
- the chassis 130 also can implement various peripheral components that may be used by the server cells, such as storage devices or network interfaces.
- the chassis 130 is disposed at the bottom of the server cell array 102 .
- the chassis 130 can include mechanical coupling assemblies compatible with the mechanical coupling assemblies of the server cells, thereby allowing the server cells in the bottom row to removably attach to the chassis 130 , and thus helping to prevent the server cell array 102 from toppling over.
- the chassis 130 can include electrical connectors on its top surface that electrically couple with corresponding connectors on the facing mating surfaces of the server cells of the bottom row so as to enable the chassis 130 to supply voltages to the server cell array 102 , as well as to send or receive signaling from the server cell array 102 .
- the chassis 130 may be disposed at one of the left, right, or top sides of the server cell array 102 . Further, the chassis 130 may have separate components at multiple sides of the server cell array 102 .
- the server cells are sufficiently rigid and the mechanical couplings between the server cells are sufficiently strong such that the server cell array 102 is self-supporting (that is, does not collapse, disconnect, or substantially deform under its own weight).
- the chassis 130 can include one or more support structures (not shown), such as rods or beams, which may be attached to one or more of the top, bottom, left, or right sides of the server cell array 102 to provide some measure of structural support.
- the server cells have a cuboid shape.
- the server cells are not limited to this shape, but instead may include any of a variety of 3D shapes that provide exterior mating surfaces for interlocking with the mating surfaces of other server cells.
- Such shapes can include cuboids, cylinders, prisms (triangular, pentagonal, hexagonal, heptagonal, octagonal, etc.), and the like.
- the server system 100 also can employ combinations of different-shaped server cells.
- the server system 100 can employ cuboid-shaped server cells interspersed among an array of octagonal-prism-shaped server cells, or triangular-prism-shaped server cells interspersed among an array of hexagonal-prism-shaped server cells.
- the server cells are fully enclosed; that is, there is a substantially complete panel at each side of the enclosure of the server cell.
- each side of the server cell can include mechanical and electrical coupling assemblies to facilitate the interlocking of that side to a corresponding adjacent server cell.
- the enclosures of the server cells may be substantially open at one or at two opposing sides.
- the enclosures of the server cells are cuboids that are open at the front and rear sides (“front” and “rear” being relative to the orientation shown in FIG. 1 ). In this configuration, the top, bottom, left, and right side panels form a server cell enclosure to which up to four other server cells may be attached.
- the front and rear of the server cell enclosures open, air can flow through the server cells relatively unimpeded, and thus the temperature of the server cells can be more readily regulated. Moreover, as the front of the server cell is open, the components of the server cell may be more readily accessed for test, repair, or replacement. In other configurations, the front side may be open while the rear side is closed, thereby allowing interlocking with another server cell via the rear side while still providing both ready access and some air flow into the server cell via the open front side.
- FIG. 2 illustrates a server cell 200 in accordance with some embodiments.
- the server cell 200 represents, for example, an example configuration of one or more of the server cells of the server system 100 of FIG. 1 .
- the server cell 200 has an enclosure 250 with an open cuboid shape that is formed by a right side panel 201 , a top side panel 202 , a left side panel 203 , and a bottom side panel 204 .
- the front and rear sides of the enclosure 250 are open in the example of FIG. 2 .
- the side panels of the server cell 200 may be formed from a PCB assembly comprising a set of rigid PCB sections electrically and mechanically attached via intervening flexible PCB sections.
- the server cell 200 includes compute components disposed on one or more of the interior-facing surfaces of the enclosure 250 .
- a processor integrated circuit (IC) device 210 comprising one or more processor cores may be disposed at the interior surface 212 of the side panel 204 and an application specific integrated circuit (ASIC) 214 providing an interconnect controller for the server cell 200 may be disposed at the interior surface 213 of the side panel 203 .
- the different compute components of the server cell 200 can be interconnected via metal traces, vias, and through holes embedded in the side panels 201 - 204 , via insulated wiring (e.g., jumper wires) extending between pins of different components, and the like.
- the exterior surfaces of one or more of the side panels 201 - 204 includes one or more mechanical coupling assemblies to permit the exterior surface to mechanically couple to a facing exterior surface of another server cell (or to a complementary mechanical coupling assembly on, for example, the chassis 130 of FIG. 1 ).
- the server cell 200 employs a slide-fit coupling assemblies with a male slide-fit coupling assembly 221 disposed at the exterior surface 231 of the right side panel 201 , a male slide-fit coupling assembly 222 disposed at the exterior surface 232 of the top side panel 202 , a female slide-fit coupling assembly 223 disposed at the exterior surface 233 of the left side panel 203 , and a female slide-fit coupling assembly 224 disposed at the exterior surface 234 of the bottom side panel 204 .
- a male slide-fit connector on the mating surface of one server cell 200 and a corresponding female slide-fit connector on the facing mating surface of another server cell 200 together form a dovetail joint that extends from front to back (i.e., along the illustrated Y-axis), whereby the male slide-fit connectors comprise a “pin” connector dimensioned so as to be compatible with the “tail” grooves formed as the female slide-fit connectors.
- two server cells 200 may be mechanically interlocked by inserting the rear end of a male slide-fit connector of one server cell 200 into the front end of a female slide-fit connector of the other server cell 200 (or by inserting the front end of a male slide-fit connector of one server cell 200 into the rear end of a female slide-fit connector of the other server cell 200 ) and then sliding the server cells 200 together along the illustrated Y axis.
- two server cells 200 can be interlocked vertically by sliding the male slide-fit coupling assembly 222 at the top side panel 202 of one server cell 200 into the female slide-fit coupling assembly 224 at the bottom side panel 204 of the other server cell.
- two server cells 200 can be interlocked horizontally by sliding the male slide-fit assembly 221 at the right side panel 201 of one server cell 200 into the female slide-fit assembly 223 at the left side panel 203 of the other server cell 200 .
- each exterior surface of the enclosure 250 is depicted as including a single male or female slide-fit coupling assembly, on other embodiments, some or all of the surfaces may include both male and female slide-fit coupling assemblies, or more than one type of slide-fit coupling assembly (e.g., two male assemblies). While a dovetail implementation is illustrated, other slide-fit coupling assemblies may be implemented, such as slide-fit coupling assemblies with circular, rectangular, or “T” shaped cross-sections.
- the slide-fit mechanical coupling of two adjacent server cells 200 is illustrated in greater detail below with reference to FIG. 3 .
- the mechanical coupling assemblies employed at the exterior surfaces of the server cells 200 in order to mechanically interlock two server cells 200 can include press-fit coupling assemblies, magnetic elements embedded at the side panels, hook-and-loop tape elements, clamp elements at the front or rear edges of the side panels 201 - 204 , permanent or temporary adhesive, bolt elements and corresponding threaded bolt hole elements, and the like.
- press-fit mechanical coupling configuration is described in greater detail below with reference to FIG. 4 .
- the illustrated server cell 200 includes a set 241 of electrical connectors 244 disposed in rows at the exterior surface 231 on both sides of the male slide-fit coupling assembly 221 and a set 246 of electrical connectors 244 disposed in rows at the exterior surface 232 on both sides of the female slide-fit coupling assembly 222 .
- the other side panels 203 and 204 likewise can include sets of electrical connectors compatibly positioned.
- the electrical connectors at a mating surface are electrically coupled to the compute componentry of the server cell 200 or to the electrical connectors at another mating surface of the server cell 200 (for through routing of signaling or supply voltages) via, for example, metal vias and trace interconnects routed through the side panels of the server cell to the corresponding compute components, or via insulated metal wiring coupled to the metal connectors via holes extending from the interior surfaces of the side panels.
- the electrical connectors disposed at the mating exterior surface of one of the server cells 200 electrically couple to corresponding electrical connectors disposed at the facing mating exterior surface of the other server cell.
- the electrical connectors can include contact connectors that provide electrical coupling through their physical contact with connectors on the opposing mating surface of another server cell, or contactless connectors that provide electrical coupling through induction or capacitive coupling when sufficiently close to corresponding contactless connectors on the opposing mating surface of another cell.
- the contact connectors can include, for example, metallized pads, spring-loaded connectors (e.g., pogo pins), pins, balls, metallized holes, and the like.
- the contact connector on one server cell and its compatible contact connector on another server cell are both male connectors, such as both being spring-loaded connectors or a pin or ball that is brought into contact with a metalized pad when the two server cells are interlocked.
- the contact connector on one server cell is a male connector (e.g., a pin) and its compatible contact connector on the other server cell is a female contact connector (e.g., a metalized hole).
- the electrical connectors disposed at the exterior surface of the server cell 200 can include a combination of contact connectors and contactless connectors.
- some or all of the electrical connectors at an exterior surface of the enclosure 250 may be implemented as part of the mechanical coupling assembly at that exterior surface.
- some or all of the electrical connectors 244 instead may be implemented on one or more surfaces of the male slide-fit coupling assembly 221 , and the corresponding electrical connectors on the opposing surface of an adjacent server cell may be implemented at corresponding locations on the exterior surfaces of the female slide-fit coupling assembly 223 of the other server cell such that electrical connections are formed via the slide-fit coupling of the slide-fit coupling assembly 221 of one server cell with the slide-fit coupling assembly 223 of another server cell.
- the server cell 200 can provide signaling or power connections with distant server cells (that is, server cells separated by one or more intervening server cells) through the use of the jumper interface 122 , which may be coupled to the corresponding jumper interface of a distant server cell via a jumper cable 124 (see FIG. 1 ).
- This jumper configuration can be used to distribute either or both of supply voltages and signaling.
- the jumper interface 122 and the jumper cable 124 can implement one or more wires or optic fibers and implement any of a variety of standard or proprietary interface configurations, such as a universal serial bus (USB) standard, I2C standard, an Ethernet standard, and the like.
- USB universal serial bus
- FIG. 3 illustrates cross-section views of a process of interlocking two server cells employing slide-fit mechanical coupling in accordance with some embodiments.
- the top side panel 202 of one server cell 200 ( FIG. 2 ) is interlocked with the bottom side panel 204 of another server cell 200 via the male slide-fit connector assembly 222 of the top side panel 202 and the female slide-fit connector assembly 224 of the bottom side panel 204 .
- the cross-section view illustrates a cross-section of these side panels 202 and 204 along the X-Z plane of FIG. 2 .
- the top side panel 202 includes metal pad connectors 301 and 302 (one implementation of the electrical connectors) disposed at the exterior surface 232 and the bottom side panel 204 includes metal pad connectors 303 and 304 compatibly positioned at the exterior surface 234 .
- the male slide-fit coupling assembly 222 and the female slide-fit coupling assembly 224 mechanically attach through friction forces, thereby removably mechanically coupling the two server cells together.
- this coupling process aligns the metal pad connectors 301 , 302 , 303 , and 304 such that the metal pad connectors 301 and 303 are brought into physical contact and the metal pad connectors 302 and 304 are brought into physical contact, and thus providing two electrical pathways between the compute components of one server cell and the compute components of the other server cell.
- FIG. 4 illustrates cross-section views of a process of interlocking two server cells employing press-fit mechanical coupling in accordance with some embodiments.
- the top side panel 202 of one server cell 200 ( FIG. 2 ) is interlocked with the bottom side panel of another server cell 200 via a female press-fit connector assembly 422 at the exterior surface 232 of the top side panel 202 and a male press-fit connector assembly 424 at the exterior surface 234 of the bottom side panel 204 .
- the female press-fit connector assembly 422 includes a row or array of metalized holes 412 and the male press-fit connector assembly 424 includes a corresponding row or array of metal pins 414 which are compatibly dimensioned with the metalized holes 412 such that when the top side panel 202 and the bottom side panel 204 are mated together, the pins 414 are inserted into the corresponding metalized holes 412 and form a friction bond that removably mechanically couples the mated sections together, and thus mechanically attaches the two server cells together.
- the pins 414 and holes 412 also operate as electrical connectors through which signaling or supply voltages may be conducted between the two server cells.
- FIG. 5 is a block diagram illustrating an example compute system 500 implemented by the server cell 200 of FIG. 2 in accordance with some embodiments.
- the compute system 500 includes various compute componentry (e.g., compute componentry 120 of FIG. 1 ), such as a processor 502 , system memory 504 , an I/O controller 510 , an interconnect controller 512 , and one or more I/O devices 514 .
- the processor 502 includes one or more processor cores 506 and a northbridge 508 .
- the one or more processor cores 506 can include any of a variety of types of processor cores, or combination thereof, such as a central processing unit (CPU) core, a graphics processing unit (GPU) core, a digital signal processing unit (DSP) core, and the like, and may implement any of a variety of instruction set architectures, such as an x86 instruction set architecture or an Advanced RISC Machine (ARM) architecture.
- the system memory 504 can include one or more memory modules, such as DRAM modules, SRAM modules, flash memory, or a combination thereof.
- the northbridge 508 interconnects the one or more cores 506 , the system memory 504 , and the I/O controller 510 .
- the I/O controller 510 in turn operates to manage the I/O devices 514 , which can include, for example, flash memory, disc drives, bus interfaces, display controllers, BIOS, or other peripheral devices.
- the compute system 500 operates to execute an operating system (OS) and one or more software applications that perform compute tasks or other compute operations.
- the compute system 500 may utilize a virtual machine manager (VMM) that virtualizes the hardware of the compute system 500 so as to allow multiple guest OS's and corresponding software applications to be executed by the compute system 500 .
- VMM virtual machine manager
- some or all of the server cells of the server system 100 each may perform discrete computing tasks in furtherance of an overall compute operation performed by the server system 100 .
- the server cells of the server system 100 may operate independently. In either mode of operation, the server cells may communicate data, commands, and other signaling via their respective interconnect controllers 512 and electrical connectors disposed on their mating exterior surfaces.
- the interconnect controller 512 operates to manage inter-cell signaling conducted via the side panels of the enclosure 250 of the server cell 200 .
- the interconnect controller 512 can operate in a manner similar to a router or a switch whereby the interconnect controller 512 routes signaling between the compute componentry of the compute system 500 and the electrical connectors of the side panels (illustrated as ports 521 - 524 in FIG. 5 ), as well as routing signaling between the electrical connectors of different side panels of the server cell 200 .
- the interconnect controller 512 operates to route signaling received via a side panel and intended for the compute componentry of the server cell 200 by routing the received signaling from the side panel to the I/O controller 510 , which then may forward the signaling on to other components as appropriate.
- the interconnect controller 512 can route the signaling from the I/O controller 510 to the electrical connectors at the side panel that is mated to the intended adjacent server cell. Further, the interconnect controller 512 can operate as a forwarding mechanism whereby it forwards signaling received from one adjacent server cell to another adjacent server cell, or as a reflection mechanism whereby it receives signaling received from an adjacent server cell via one set of electrical connectors and then reflects that signaling back to the same adjacent server cell via another set of electrical connectors.
- the supply voltages used to power the compute componentry of the server cells can be distributed among the server cells via the inter-cell connectors.
- the server cell 200 can include fixed or programmable wiring (not shown) that routes supply voltages received via inbound power connectors at one side panel to outbound power connectors at one or more other side panels, and thus forwarding the supply voltages on to other adjacent server cells.
- This intra-cell power distribution wiring can be provides as metal vias, metal traces, and other conductive features of PCB segments that can form the side panels of the server cell 200 , as cabling spanning between the interior surfaces of the side panels of the server cell 200 , or combinations thereof
- FIGS. 6 and 7 illustrate a rigid-flex PCB assembly 600 used to fabricate a server cell in accordance with some embodiments.
- the rigid-flex PCB assembly 600 includes four rigid PCB sections 611 , 612 , 613 , and 614 connected via intervening flexible PCB sections 615 , 616 , and 617 .
- the rigid PCB sections 611 - 614 are fabricated so as to be relatively rigid and thus not substantially flex or otherwise deform under normal loading.
- the flexible PCB sections 615 - 617 are fabricated so as to be relatively flexible and thus allow the rigid-flex PCB assembly 600 to be folded into the hollow cuboid shape of the enclosure 250 illustrated in FIG. 2 . So folded, the rigid PCB sections 611 - 614 form the side panels 201 - 204 ( FIG. 2 ) of the server cell 200 , and the flexible PCB sections 615 - 617 form the three corners that join, for example, the side panels 201 , 202 , and 203 .
- the top edge 621 and the bottom edge 622 of the rigid-flex PCB assembly 600 may be joined together via adhesive, thermal bonding, right-angle bracing, and the like, so as to form the fourth corner that joins, for example, the side panels 201 and 204 .
- the rigid-flex PCB assembly 600 With the rigid-flex PCB assembly 600 thus folded and the edges 621 and 622 joined, the rigid-flex PCB assembly 600 forms the enclosure 250 of the server cell 200 .
- the rigidity of the folded rigid-flex PCB assembly 600 can be augmented through the use of for example, L-braces or corner braces at one or more corners, struts or other support rods that extend from the interior surface of one side panel to the interior surface of another side panel, and the like.
- Top view 601 illustrates a plan view of the interior side of the rigid-flex PCB assembly 600 ; that is, the side of the rigid-flex PCB assembly 600 that forms the interior of the server cell 200 when folded.
- various compute componentry may be disposed at the interior side of one or more of the rigid PCB segments 611 - 614 , and connected via metal traces, vias, through holes, and other conductive structures formed in the rigid-flex PCB assembly 600 .
- this compute componentry includes: a jumper interface 632 (one example of the jumper interface 122 of FIG.
- IC device 631 disposed at the rigid PCB segment 611 ; an IC device 633 disposed at the rigid PCB segment 612 ; IC devices 634 and 635 disposed at the rigid PCB segment 613 ; and an IC device 636 disposed at the rigid PCB segment 614 .
- IC devices 634 and 635 disposed at the rigid PCB segment 613 ; and an IC device 636 disposed at the rigid PCB segment 614 .
- metal traces e.g., metal traces 637 , 638 , and 639
- vias, metal through holes, and other metal features of the rigid-flex PCB assembly 600 With respect to the illustrated configuration of the compute system 500 of FIG.
- the IC device 631 can implement, for example, the interconnect controller 512
- the IC device 633 can implement, for example, the one or more processor cores 506 and the northbridge 508
- the IC device 634 can implement, for example, the memory 504
- the IC device 633 can implement, for example, the I/O controller 510
- the IC device 636 can implement, for example, a voltage regulator, a peripheral device, and the like.
- Bottom view 602 of FIG. 6 illustrates a plan view of the exterior side of the rigid-flex PCB assembly 600 ; that is, the side of the rigid-flex PCB assembly that forms the exterior mating surfaces of the enclosure 250 of the server cell 200 when folded.
- female slide-fit coupling assemblies 641 and 642 are formed at the exterior mating surfaces of the rigid PCB sections 611 and 612 , respectively, and male slide-fit coupling assemblies 643 and 644 are formed at the exterior mating surfaces of the rigid PCB sections 613 and 614 , respectively.
- the female slide-fit coupling assemblies 641 and 642 can correspond to, for example, the female slide-fit coupling assemblies 223 and 224 of FIG.
- each exterior surface of the perimeter formed by the folded rigid-flex PCB assembly 600 provides a mating surface that can mechanically and electrically couple with a compatible mating surface of an adjacent server cell.
- Cross-section view 700 of FIG. 7 illustrates a cross-section view of the rigid PCB sections 612 and 613 and the flexible PCB section 616 of the rigid-flex PCB assembly 600 along line A-A in FIG. 6 .
- the rigid-flex PCB assembly 600 comprises one or more metal layers and one or more dielectric layers (e.g., metal layer 702 and dielectric layer 704 ) that extend the length of the rigid-flex PCB assembly 600 (from edge 621 to edge 622 ), and thus providing electrical and mechanical continuity between all of the rigid PCB segments 611 - 614 .
- the rigid PCB segments 611 - 614 further include one or more additional metal layers and one or more additional dielectric layers (e.g., metal layer 706 and dielectric layer 708 ) to provide intra-segment connectivity and to provide structural support to the corresponding rigid PCB segment in its role as a side panel or “wall” of the server cell 200 ( FIG. 2 ).
- additional metal layers and one or more additional dielectric layers e.g., metal layer 706 and dielectric layer 708
- the metal and dielectric layers present in the flexible PCB section 616 should be relatively flexible so as to permit this folding.
- the layer materials and thicknesses of the layers in the flexible PCB section 616 are selected to provide this flexibility.
- the flexible PCB section 616 can comprise interleaved layers of 1 ⁇ 2 ounce copper foil for the metal layers and thin layers of flexible adhesives and thin polyimide films (e.g., DuPontTM KaptonTM film) for the dielectric layers.
- thin polyimide films e.g., DuPontTM KaptonTM film
- the rigid PCB sections 612 and 613 may build on the base metal and dielectric layers forming the flexible PCB section 616 with more rigid layer of dielectric material that are made relatively rigid based on the material type or their thicknesses.
- the additional dielectric layers found in the rigid PCB sections 612 and 613 can include one or more layers of core or prepreg FR4 glass-reinforced epoxy laminate, as well as layers of adhesives, polyimides, and other suitable dielectric materials.
- the flexible PCB section 616 may be formed by fabricating all of the various metal and dielectric layers for the PCB assembly 600 to as to extend fully from the edge 621 to the edge 622 ( FIG.
- the other flexible PCB sections 615 and 617 may be similarly formed.
- the male slide-fit connector assembly 641 is formed by molding or extruding its shape at the top dielectric layer 708 or by preforming the male slide-fit connector assembly 641 and then adhering the male slide-fit connector assembly 641 to the top dielectric layer 708 .
- the female slide-fit connector assembly 643 can be formed as an intrusion at a top layer 710 of the rigid PCB section 613 via an etch, ablation, or abrasive process.
- the electrical connectors of the sets 652 and 654 are illustrated as metalized pads 712 intended to physically contact corresponding metal pads on an opposing mating surface of another server cell so as to form electrical pathways between the two adjacent server cells.
- FIG. 8 illustrates a server system 800 employing a three-dimensional (3D) array 802 of server cells in accordance with some embodiments.
- the server cells of the server system 800 include a back side panel 803 with compatible mating surfaces, thereby enabling the server system 800 to interconnect server cells in two ranks, ranks 804 and 806 , each rank comprising a 2D array of server cells.
- the server cell in one rank may be interconnected with the corresponding server cell in another rank via, for example, compatible press-fit coupling assemblies on the exterior mating surfaces of the back side panels 803 of the adjacent server cells.
- the server cells also may include front side panels (not shown) so as to provide a total of six orthogonal mating surfaces for the cuboid shape illustrated.
- a server system can be expanded to include more than two ranks of 1D or 2D server cell arrays.
- FIGS. 9 and 10 illustrate example rigid-flex PCB assembly configurations that may be used to form server cells with five or six orthogonal mating surfaces.
- FIG. 9 illustrates a bottom view 902 of a rigid-flex PCB assembly 900 having four rigid PCB sections 911 , 912 , 913 , and 914 joined via flexible PCB sections 915 , 916 , and 917 so as to form a perimeter of side panels of a cuboid server cell when folded along the creases formed by the flexible PCB sections 915 - 917 .
- the rigid-flex PCB assembly 900 has a fifth rigid PCB section 918 connected to an edge of the rigid PCB section 913 (or another one of the rigid PCB sections) via a flexible PCB section 919 such that when the rigid PCB section 918 is folded along the flexible PCB section 919 and joined to the adjacent edges of the other rigid PCB sections, the rigid PCB section 918 forms a back side panel of the resulting server cell.
- FIG. 9 is a fifth rigid PCB section 918 connected to an edge of the rigid PCB section 913 (or another one of the rigid PCB sections) via a flexible PCB section 919 such that when the rigid PCB section 918 is folded along the flexible PCB section 919 and joined to the adjacent edges of the other rigid PCB sections, the rigid PCB section 918 forms a back side panel of the resulting server cell.
- FIG. 10 illustrates a bottom view 1002 of a rigid-flex PCB assembly 1000 having four rigid PCB sections 1011 , 1012 , 1013 , and 1014 joined via flexible PCB sections 1015 , 1016 , and 1017 so as to form a perimeter of side panels of a cuboid server cell when folded along the creases formed by the flexible PCB sections 1015 - 1017 .
- the rigid-flex PCB assembly 1000 has a fifth rigid PCB section 1018 connected to an edge of the rigid PCB section 1014 (or another one of the rigid PCB sections) via a flexible PCB section 1019 and a sixth rigid PCB section 1020 connected to an edge of the rigid PCB section 1011 (or another one of the rigid PCB sections) via a flexible PCB section 1021 such that when the rigid-flex PCB assembly 1000 is folded along the flexible PCB sections, the rigid PCB sections 1018 and 1020 form a back side panel and a front side panel, respectively, of the resulting server cell.
- FIGS. 1-10 illustrate example implementations of server cells with cuboid shapes
- the server cells can have any of a variety of 3D shapes capable of supporting expandable multiple-cell configurations.
- FIG. 11 illustrates a perspective view of a server system 1100 employing a 2D array of server cells 1104 having an enclosure with a triangular prism shape.
- a server system may incorporate a combination of server cells of different shapes or types.
- FIG. 12 illustrates a front view of a server system 1200 employing a 2D hybrid array of server cells 1204 with enclosures having a hexagonal prism shape and server cells 1206 having a triangular prism shape.
- the server cells may be formed with an octagonal prism shape.
- the server cells 1104 , 1204 , and 1206 may be formed so as to be open at one or both of the front or back sides to as to facilitate air flow and, in the case of an open front side, to enable front-side access to the interior of the server cells.
- the server cells 1104 , 1204 , and 1206 may be formed using a folded flex-rigid PCB assembly fabricated in a manner similar to that described above with respect to FIGS. 6 , 7 , and 10 .
- FIG. 13 illustrates a method 1300 for assembling and operating a cell-based server system in accordance with some embodiments.
- the method 1300 is described below in an example context of the server system 100 of FIG. 1 utilizing open-ended cuboid-shaped server cells 200 as illustrated in FIG. 2 .
- a rigid-flex PCB assembly is fabricated for each of a plurality of server cells.
- This fabrication process can include fabrication of a PCB substrate with the appropriate metal and dielectric layers, etching, ablating or otherwise removing material to form the flexible PCB sections, attaching the compute components at the resulting rigid PCB sections, attaching the electrical connectors to the exterior mating surfaces of the rigid PCB sections, and forming or attaching the compatible mechanical coupling assemblies to the exterior mating surfaces.
- the rigid-flex PCB assembly is folded to form a corresponding server cell. As part of this folding process, adjacent unattached edges of the rigid PCB sections may be attached via adhesive, thermobonding, brackets, screws, clamps, etc.
- the process of blocks 1302 and 1304 is repeated to generate a plurality of server cells.
- the plurality of server cells are interlocked to form a 1D, 2D, or 3D server cell array.
- This interlocking process includes joining facing mating surfaces of the server cells either by sliding the server cells together or pressing the server cells together, depending on the mechanical coupling mechanism employed.
- the interlocking process also can include connecting a base of the server cell array to a chassis, which may serve as both a stabilizing base for the server cell array as well as an ingress point for one or more supply voltages and an ingress or egress point for one or more signals.
- the server system With the server system assembled, at block 1308 the server system is operated to perform one or more compute operations.
- the compute operations can include discrete sub-operations performed in parallel in furtherance of an overall compute operation (e.g., scientific modeling operations, graphics rendering, etc.).
- the compute operations can include independent compute operations performed by separate sets of one or more of the server cells (e.g., each set of server cells operating as a separate virtual server in support of a separate client).
- supply voltages are distributed among the server cells via the paired electrical connectors at the mating surfaces of the server cells.
- signaling of data, commands, and other information is distributed among the server cells via the paired electrical connectors at the mating surfaces of the server cells.
- jumper cable interfaces may be implemented to provide direct signal connections or voltage supply connections between server cells that are not immediately adjacent to each other.
- At least some of the functionality described above may be implemented by one or more processors executing one or more software programs tangibly stored at a computer readable medium, and whereby the one or more software programs comprise instructions that, when executed, manipulate the one or more processors to perform one or more functions described above.
- the components and techniques described above are implemented in a system comprising one or more electronic devices.
- Electronic design automation (EDA) and computer aided design (CAD) software tools may be used in the design and fabrication of these electronic devices. These design tools typically are represented as one or more software programs.
- the one or more software programs comprise code executable by a computer system to manipulate the computer system to operate on code representative of circuitry of one or more IC devices so as to perform at least a portion of a process to design or adapt a manufacturing system to fabricate the circuitry.
- This code can include instructions, data, or a combination of instructions and data.
- the software instructions representing a design tool or fabrication tool typically are stored in a computer readable storage medium accessible to the computing system.
- the code representative of one or more phases of the design or fabrication of an electronic device may be stored in and accessed from the same computer readable storage medium or a different computer readable storage medium.
- a computer readable storage medium may include any storage medium, or combination of storage media, accessible by a computer system during use to provide instructions and/or data to the computer system.
- Such storage media can include, but is not limited to, optical media (e.g., compact disc (CD), digital versatile disc (DVD), Blu-Ray disc), magnetic media (e.g., floppy disc, magnetic tape, or magnetic hard drive), volatile memory (e.g., random access memory (RAM) or cache), non-volatile memory (e.g., read-only memory (ROM) or Flash memory), or microelectromechanical systems (MEMS)-based storage media.
- optical media e.g., compact disc (CD), digital versatile disc (DVD), Blu-Ray disc
- magnetic media e.g., floppy disc, magnetic tape, or magnetic hard drive
- volatile memory e.g., random access memory (RAM) or cache
- non-volatile memory e.g., read-only memory (ROM) or Flash memory
- MEMS microelectro
- the computer readable storage medium may be embedded in the computing system (e.g., system RAM or ROM), fixedly attached to the computing system (e.g., a magnetic hard drive), removably attached to the computing system (e.g., an optical disc or Universal Serial Bus (USB)-based Flash memory), or coupled to the computer sys em via a wired or wireless network (e.g., network accessible storage (NAS)).
- system RAM or ROM fixedly attached to the computing system
- removably attached to the computing system e.g., an optical disc or Universal Serial Bus (USB)-based Flash memory
- USB Universal Serial Bus
- NAS network accessible storage
Abstract
Description
- 1. Field of the Disclosure
- The present disclosure relates generally to processing systems and more particularly to server systems.
- 2. Description of the Related Art
- Multiple-processor, or multiple-node, server systems conventionally are implemented in a blade server or rack server configuration whereby multiple server blades or server sleds are interconnected via a backplane or midplane. While enabling inter-node connectivity, the use of a midplane or backplane can interrupt airflow, thereby putting the server components in jeopardy of overheating. Moreover, because the backplane or midplane serves as the inter-node connection system for all nodes, the number of nodes supported in such systems is limited by the connectivity available from the particular midplane or backplane implemented in the system. Such systems also are difficult to scale as their expandability typically is limited to expansion in only one dimension, as well as being limited to the dimensions of the rack due to their reliance on the rack for structural support.
- The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings. The use of the same reference symbols in different drawings indicates similar or identical items. Orientation-related or positioning terms, such as “left,” “right”, “top,” “bottom”, “front”, “back”, are relative to the orientation in the corresponding drawing and are used merely for ease of reference.
-
FIG. 1 is a perspective view of a cell-based server system comprising a two-dimensional array of server cells in accordance with some embodiments. -
FIG. 2 is a perspective view of a server cell of the server system ofFIG. 1 in accordance with some embodiments. -
FIG. 3 is a cross-section view of compatible slide-fit coupling assemblies of facing mating surfaces of adjacent server cells in accordance with some embodiments. -
FIG. 4 is a cross-section view of compatible press-fit coupling assemblies of facing mating surfaces of adjacent server cells in accordance with some embodiments. -
FIG. 5 is a block diagram illustrating a compute system of a server cell in accordance with some embodiments. -
FIG. 6 is a top view and a bottom view of a printed circuit board (PCB) assembly that forms at least some of the panels of an enclosure of a server cell in accordance with some embodiments. -
FIG. 7 is a cross-section view of a portion of the PCB assembly ofFIG. 6 in accordance with some embodiments. -
FIG. 8 is a perspective view of a cell-based server system comprising a three-dimensional array of server cells in accordance with some embodiments. -
FIG. 9 is a top view of a PCB assembly that forms five side panels of an open-front cuboid server cell in accordance with some embodiments. -
FIG. 10 is a top view of a PCB assembly that forms six side panels of a fully-enclosed cuboid server cell in accordance with some embodiments. -
FIG. 11 is a perspective view of a server system comprising a two-dimensional array of server cells with triangular prism enclosures in accordance with some embodiments. -
FIG. 12 is a front view of a server system comprising a hybrid two-dimensional array of server cells with triangular prism enclosures and server cells with hexagonal prism enclosures in accordance with some embodiments. -
FIG. 13 is a flow diagram illustrating a method for fabricating and operating a cell-based server system in accordance with some embodiments. -
FIGS. 1-13 illustrate techniques pertaining to a cell-based server system. In some embodiments, the server system comprises an array of interlocking server cells that may be structurally self-supporting. Each server cell operates as a separate node in the system and has a cell enclosure containing the electronic components of the node, such as one or more processors, memory, an interconnect controller, and the like. The cell enclosure is formed of a plurality of side panels. The exterior surfaces of two or more side panels of the cell body include mechanical coupling assemblies to facilitate their mechanical coupling with adjacent server cells. Some or all of the exterior mating surfaces of the cell enclosure also can include electrical connectors for providing or receiving supply voltages or for conducting signaling with adjacent server cells. In some embodiments, the signaling connectors are implemented as contact connectors, whereas in other embodiments, the signaling connectors are implemented as contactless connectors. Some or all of the server cells further can include jumper interfaces to receive jumper cabling so as to facilitate connectivity between non-adjacent server cells (that is, server cells that are separated by one or more intervening server cells). The cell enclosure, in some embodiments, is open at one side or open at two opposing sides, thereby facilitating air flow. In some embodiments, the server cell is formed from printed circuit board (PCB) sections that are connected or otherwise arranged into one of a variety of shapes, such as a cell enclosure with side panels forming a cuboid shape, a triangular prism shape, a pentagonal prism shape, a hexagonal prism shape, a heptagonal prism shape, an octagonal prism shape, and the like. - A server system may be formed from such server cells by interlocking the server cells in a specified arrangement so as to form an array of server cells attached via their side panels in a manner similar to the cells, or alveoli, of a honeycomb. The distribution of power among the server cells thus may be conducted via side panels of adjacent server cells. Interconnectivity of the server cells likewise may be achieved via signaling conducted between the side panels of adjacent server cells. As such, signaling and power may be routed through the server cell array without the need for a midplane or backplane. In some embodiments, the server cells are removably coupleable so as to be reconfigurable into a new arrangement or so that a server cell may be swapped in place, or “field swappable.” Two server cells thus may be joined through a slide-fit coupling process or a press-fit coupling process. The side panels of the cell enclosure may be fabricated, connected, or internally braced so that the interlocked server cells are structurally self-supporting, thereby facilitating modification of the server system to include more or fewer server cells as appropriate. Further, the server cells may be configured so as to permit server cells to be interconnected in a one-dimensional array (e.g., a row or column of server cells), a two-dimensional array (e.g., a wall or rank of server cells), or a three-dimensional array (e.g., a cube of server cells).
-
FIG. 1 illustrates a cell-basedserver system 100 in accordance with some embodiments. Theserver system 100 may be implemented to provide any of a variety of server functions, such as a database services, simulation or modeling services, web hosting or video hosting services, and the like. Theserver system 100 supports the provision of such services through the use of anarray 102 of interlocked server cells. In the depicted example, theserver system 100 comprises a two-dimensional (2D) array of server cells having nine server cells arranged in 3 columns and 3 rows, includingserver cells array 102 can include more or fewer server cells, as well as different dimensions, such as a one-dimensional array of server cells arranged in either a row or a column, or, as illustrated in greater detail with reference toFIG. 8 , a three-dimensional array of server cells arranged in multiple ranks, each rank comprising multiple rows and columns of server cells. - Each server cell comprises
computing componentry 120 to perform computing operations in support of the services provided by theserver system 100. For at least some of the server cells, thiscomputing componentry 120 comprises one or more processor cores to perform computing operations. The one or more processor cores can include, for example, central processing units (CPUs), graphics processing units (CPUs), accelerated processing units (AR), a digital signal processor, and the like. In some instances, some of the computing componentry of a subset of the server cells instead may include peripheral support components, hard drive controllers, basic input/output system (BIOS) controllers, network interface controllers (NICs), and other input/output (I/O) controllers. The server cells further can include other support circuitry, such as data storage devices (e.g., disc drives and solid state drives), voltage regulators, AC-DC power supplies, DC-DC power supplies, input/output interfaces, discrete active or passive components (e.g., resistors, capacitors, and inductors), switches, buttons, and the like. - The server cells are interlocked together to form a substantially rigid structure that may be self-supporting in some implementations. To this end, each server cell comprises an enclosure formed from at least three side panels. The exterior surface of each of some or all of the side panels of this enclosure includes a mechanical coupling assembly that is compatible with the mechanical coupling assemblies of other server cells such that two server cells joined together in the proper orientation may be mechanically connected via the compatible mechanical coupling assemblies of their opposing mating exterior surfaces. Any of a variety of mechanical coupling assemblies may be implemented. For example, the mechanical coupling assemblies can interlock via a slide-fit relationship, such as through using a dovetail coupling assembly, interlock via a press-fit relationship, such as through using a pin-and-hole coupling assembly, or interlock through the use of adhesives, straps, hook-and-loop fasteners, clamps, magnets, bolts, and the like. In some embodiments, the mechanical coupling provided between server cells can be engaged, disengaged, and then re-engaged, thereby allowing the server cells to be removably interlocked and thus allowing reconfiguration of the assembly of the server cells and expansion of the
array 102. In other embodiments, the mechanical coupling is substantially permanent, such as through the use of an adhesive. - In some embodiments, the server cells interact with each other to implement the services provided by the
server system 100. To illustrate, theserver system 100 may be used to implement a distributed compute operation whereby some or all of the server cells perform separate discrete compute operations in parallel in furtherance of the distributed compute operation. In such instances, the server cells may be considered as analogous to processors in a multiple-processor blade server or rack server. In other embodiments, some or all of the server cells operate independently; that is, they execute separate operating systems (OS), execute separate and independent programs, and/or operate on separate and independent data sets. In such instances, each server cell may be considered as analogous to a separate rack server or blade server. Further, in some instances, some of the server cells may operate as processing cells to perform compute operations and other server cells operate as input/output (I/O) cells to facilitate the communication of data and other signaling to and from storage devices, BIOS, and other peripheral devices on behalf of the processing cells, or to facilitate network communications with one or more external devices on behalf of the processing cells. - To facilitate data, command, and other signaling between server cells, the server cells are connected in a network topology, such as a ring network, a hub-and-spoke network, a torus network, a mesh network, and the like, or in a combination of network topologies. The links between the server cells in the intended network topology are implemented via electrical connectors disposed at the opposing mating surfaces of the side panels of the server cells. The electrical connectors can be implemented as contact-based connectors or contactless connectors. Contact-based connectors rely on physical contact to render an electrically conductive path between the signal connector on the mating surface of one server cell and the corresponding signal connector on the opposing mating surface of the adjacent server cell. Examples of contact-based connectors include metal pads, pins, metalized holes, spring-loaded metal connectors, and the like. Contactless connectors do not rely on physical contact to render a conductive path, but instead provide electrical conductivity via induction or capacitive coupling. An example contactless connector that may be employed is described in detail in U.S. patent application Ser. No. 13/495,325, entitled “Contactless Interconnect” and filed on Jun. 13, 2012, the entirety of which is incorporated by reference herein. As with inter-cell signaling, supply voltages may be distributed to the server cells of the
array 102 via connectors coupled between opposing mating surfaces of the server cells. - In addition to providing interconnectivity via opposing mating surfaces of the enclosures of adjacent server cells, some or all of the server cells can implement a
jumper interface 122 that mechanically and electrically couples to a jumper cable, thereby allowing two non-adjacent server cells (that is, two server cells with one or more other server cells in-between) to be directly connected via a jumper cable. Such jumper cables can be used to implement a particular network topology that is not easily achieved given the physical arrangement of the server cells. For example, as illustrated inFIG. 1 ajumper cable 124 connects thejumper interface 122 of theserver cell 111 to thejumper interface 122 of theserver cell 116, thereby allowing theserver cells server cell 117 or another server cell as an intermediary. With thejumper cable 124, theserver cells server cells server cells server cells server cells server cells jumper cable 124. - The
server system 100 further can include achassis 130 to support the operation of thearray 102 of server cells. Thechassis 130 can include, for example, one or more voltage supplies to provide the voltages used to power the server cells. Thechassis 130 also can implement various peripheral components that may be used by the server cells, such as storage devices or network interfaces. In the depicted implementation, thechassis 130 is disposed at the bottom of theserver cell array 102. In this configuration, thechassis 130 can include mechanical coupling assemblies compatible with the mechanical coupling assemblies of the server cells, thereby allowing the server cells in the bottom row to removably attach to thechassis 130, and thus helping to prevent theserver cell array 102 from toppling over. Moreover, thechassis 130 can include electrical connectors on its top surface that electrically couple with corresponding connectors on the facing mating surfaces of the server cells of the bottom row so as to enable thechassis 130 to supply voltages to theserver cell array 102, as well as to send or receive signaling from theserver cell array 102. In other embodiments, thechassis 130 may be disposed at one of the left, right, or top sides of theserver cell array 102. Further, thechassis 130 may have separate components at multiple sides of theserver cell array 102. In some embodiments, the server cells are sufficiently rigid and the mechanical couplings between the server cells are sufficiently strong such that theserver cell array 102 is self-supporting (that is, does not collapse, disconnect, or substantially deform under its own weight). In other embodiments, thechassis 130 can include one or more support structures (not shown), such as rods or beams, which may be attached to one or more of the top, bottom, left, or right sides of theserver cell array 102 to provide some measure of structural support. - In the example of
FIG. 1 , the server cells have a cuboid shape. However, the server cells are not limited to this shape, but instead may include any of a variety of 3D shapes that provide exterior mating surfaces for interlocking with the mating surfaces of other server cells. Such shapes can include cuboids, cylinders, prisms (triangular, pentagonal, hexagonal, heptagonal, octagonal, etc.), and the like. Theserver system 100 also can employ combinations of different-shaped server cells. For example, theserver system 100 can employ cuboid-shaped server cells interspersed among an array of octagonal-prism-shaped server cells, or triangular-prism-shaped server cells interspersed among an array of hexagonal-prism-shaped server cells. - In some embodiments, the server cells are fully enclosed; that is, there is a substantially complete panel at each side of the enclosure of the server cell. In such instances, each side of the server cell can include mechanical and electrical coupling assemblies to facilitate the interlocking of that side to a corresponding adjacent server cell. In other embodiments, the enclosures of the server cells may be substantially open at one or at two opposing sides. In the depicted example, the enclosures of the server cells are cuboids that are open at the front and rear sides (“front” and “rear” being relative to the orientation shown in
FIG. 1 ). In this configuration, the top, bottom, left, and right side panels form a server cell enclosure to which up to four other server cells may be attached. With the front and rear of the server cell enclosures open, air can flow through the server cells relatively unimpeded, and thus the temperature of the server cells can be more readily regulated. Moreover, as the front of the server cell is open, the components of the server cell may be more readily accessed for test, repair, or replacement. In other configurations, the front side may be open while the rear side is closed, thereby allowing interlocking with another server cell via the rear side while still providing both ready access and some air flow into the server cell via the open front side. -
FIG. 2 illustrates aserver cell 200 in accordance with some embodiments. Theserver cell 200 represents, for example, an example configuration of one or more of the server cells of theserver system 100 ofFIG. 1 . In the depicted example, theserver cell 200 has anenclosure 250 with an open cuboid shape that is formed by aright side panel 201, atop side panel 202, aleft side panel 203, and abottom side panel 204. The front and rear sides of theenclosure 250 are open in the example ofFIG. 2 . As described in greater detail below, the side panels of theserver cell 200 may be formed from a PCB assembly comprising a set of rigid PCB sections electrically and mechanically attached via intervening flexible PCB sections. - The
server cell 200 includes compute components disposed on one or more of the interior-facing surfaces of theenclosure 250. For example, a processor integrated circuit (IC)device 210 comprising one or more processor cores may be disposed at theinterior surface 212 of theside panel 204 and an application specific integrated circuit (ASIC) 214 providing an interconnect controller for theserver cell 200 may be disposed at theinterior surface 213 of theside panel 203. The different compute components of theserver cell 200 can be interconnected via metal traces, vias, and through holes embedded in the side panels 201-204, via insulated wiring (e.g., jumper wires) extending between pins of different components, and the like. - The exterior surfaces of one or more of the side panels 201-204 includes one or more mechanical coupling assemblies to permit the exterior surface to mechanically couple to a facing exterior surface of another server cell (or to a complementary mechanical coupling assembly on, for example, the
chassis 130 ofFIG. 1 ). In the depicted example, theserver cell 200 employs a slide-fit coupling assemblies with a male slide-fit coupling assembly 221 disposed at theexterior surface 231 of theright side panel 201, a male slide-fit coupling assembly 222 disposed at theexterior surface 232 of thetop side panel 202, a female slide-fit coupling assembly 223 disposed at theexterior surface 233 of theleft side panel 203, and a female slide-fit coupling assembly 224 disposed at theexterior surface 234 of thebottom side panel 204. - In this example, a male slide-fit connector on the mating surface of one
server cell 200 and a corresponding female slide-fit connector on the facing mating surface of anotherserver cell 200 together form a dovetail joint that extends from front to back (i.e., along the illustrated Y-axis), whereby the male slide-fit connectors comprise a “pin” connector dimensioned so as to be compatible with the “tail” grooves formed as the female slide-fit connectors. In this configuration, twoserver cells 200 may be mechanically interlocked by inserting the rear end of a male slide-fit connector of oneserver cell 200 into the front end of a female slide-fit connector of the other server cell 200 (or by inserting the front end of a male slide-fit connector of oneserver cell 200 into the rear end of a female slide-fit connector of the other server cell 200) and then sliding theserver cells 200 together along the illustrated Y axis. To illustrate, twoserver cells 200 can be interlocked vertically by sliding the male slide-fit coupling assembly 222 at thetop side panel 202 of oneserver cell 200 into the female slide-fit coupling assembly 224 at thebottom side panel 204 of the other server cell. Similarly, twoserver cells 200 can be interlocked horizontally by sliding the male slide-fit assembly 221 at theright side panel 201 of oneserver cell 200 into the female slide-fit assembly 223 at theleft side panel 203 of theother server cell 200. Although each exterior surface of theenclosure 250 is depicted as including a single male or female slide-fit coupling assembly, on other embodiments, some or all of the surfaces may include both male and female slide-fit coupling assemblies, or more than one type of slide-fit coupling assembly (e.g., two male assemblies). While a dovetail implementation is illustrated, other slide-fit coupling assemblies may be implemented, such as slide-fit coupling assemblies with circular, rectangular, or “T” shaped cross-sections. The slide-fit mechanical coupling of twoadjacent server cells 200 is illustrated in greater detail below with reference toFIG. 3 . - In other implementations, the mechanical coupling assemblies employed at the exterior surfaces of the
server cells 200 in order to mechanically interlock twoserver cells 200 can include press-fit coupling assemblies, magnetic elements embedded at the side panels, hook-and-loop tape elements, clamp elements at the front or rear edges of the side panels 201-204, permanent or temporary adhesive, bolt elements and corresponding threaded bolt hole elements, and the like. An example press-fit mechanical coupling configuration is described in greater detail below with reference toFIG. 4 . - Electrical coupling between
server cells 200 for distribution of supply voltages or signaling is facilitated through the use of electrical connectors disposed at exterior surfaces of theserver cells 200. For example, the illustratedserver cell 200 includes aset 241 ofelectrical connectors 244 disposed in rows at theexterior surface 231 on both sides of the male slide-fit coupling assembly 221 and aset 246 ofelectrical connectors 244 disposed in rows at theexterior surface 232 on both sides of the female slide-fit coupling assembly 222. Theother side panels server cell 200 or to the electrical connectors at another mating surface of the server cell 200 (for through routing of signaling or supply voltages) via, for example, metal vias and trace interconnects routed through the side panels of the server cell to the corresponding compute components, or via insulated metal wiring coupled to the metal connectors via holes extending from the interior surfaces of the side panels. - When two
server cells 200 are interlocked together through their respective compatible mechanical coupling assemblies, electrical connectors disposed at the mating exterior surface of one of theserver cells 200 electrically couple to corresponding electrical connectors disposed at the facing mating exterior surface of the other server cell. In some instances, the electrical connectors can include contact connectors that provide electrical coupling through their physical contact with connectors on the opposing mating surface of another server cell, or contactless connectors that provide electrical coupling through induction or capacitive coupling when sufficiently close to corresponding contactless connectors on the opposing mating surface of another cell. The contact connectors can include, for example, metallized pads, spring-loaded connectors (e.g., pogo pins), pins, balls, metallized holes, and the like. In some embodiments, the contact connector on one server cell and its compatible contact connector on another server cell are both male connectors, such as both being spring-loaded connectors or a pin or ball that is brought into contact with a metalized pad when the two server cells are interlocked. In other embodiments, the contact connector on one server cell is a male connector (e.g., a pin) and its compatible contact connector on the other server cell is a female contact connector (e.g., a metalized hole). The electrical connectors disposed at the exterior surface of theserver cell 200 can include a combination of contact connectors and contactless connectors. Moreover, in some embodiments, some or all of the electrical connectors at an exterior surface of theenclosure 250 may be implemented as part of the mechanical coupling assembly at that exterior surface. To illustrate, instead of disposing theelectrical connectors 244 to the side of the male slide-fit coupling assembly 221, some or all of theelectrical connectors 244 instead may be implemented on one or more surfaces of the male slide-fit coupling assembly 221, and the corresponding electrical connectors on the opposing surface of an adjacent server cell may be implemented at corresponding locations on the exterior surfaces of the female slide-fit coupling assembly 223 of the other server cell such that electrical connections are formed via the slide-fit coupling of the slide-fit coupling assembly 221 of one server cell with the slide-fit coupling assembly 223 of another server cell. - In addition to enabling signaling and power connections with adjacent server cells through the electrical connectors at the sides of the
server cell 200, theserver cell 200 can provide signaling or power connections with distant server cells (that is, server cells separated by one or more intervening server cells) through the use of thejumper interface 122, which may be coupled to the corresponding jumper interface of a distant server cell via a jumper cable 124 (seeFIG. 1 ). This jumper configuration can be used to distribute either or both of supply voltages and signaling. Thejumper interface 122 and thejumper cable 124 can implement one or more wires or optic fibers and implement any of a variety of standard or proprietary interface configurations, such as a universal serial bus (USB) standard, I2C standard, an Ethernet standard, and the like. -
FIG. 3 illustrates cross-section views of a process of interlocking two server cells employing slide-fit mechanical coupling in accordance with some embodiments. As depicted, thetop side panel 202 of one server cell 200 (FIG. 2 ) is interlocked with thebottom side panel 204 of anotherserver cell 200 via the male slide-fit connector assembly 222 of thetop side panel 202 and the female slide-fit connector assembly 224 of thebottom side panel 204. The cross-section view illustrates a cross-section of theseside panels FIG. 2 . In this example, thetop side panel 202 includesmetal pad connectors 301 and 302 (one implementation of the electrical connectors) disposed at theexterior surface 232 and thebottom side panel 204 includesmetal pad connectors exterior surface 234. When the twoserver cells 200 are mated together (e.g., slid together), the male slide-fit coupling assembly 222 and the female slide-fit coupling assembly 224 mechanically attach through friction forces, thereby removably mechanically coupling the two server cells together. Further, this coupling process aligns themetal pad connectors metal pad connectors metal pad connectors -
FIG. 4 illustrates cross-section views of a process of interlocking two server cells employing press-fit mechanical coupling in accordance with some embodiments. In this depiction, thetop side panel 202 of one server cell 200 (FIG. 2 ) is interlocked with the bottom side panel of anotherserver cell 200 via a female press-fit connector assembly 422 at theexterior surface 232 of thetop side panel 202 and a male press-fit connector assembly 424 at theexterior surface 234 of thebottom side panel 204. The female press-fit connector assembly 422 includes a row or array of metalizedholes 412 and the male press-fit connector assembly 424 includes a corresponding row or array ofmetal pins 414 which are compatibly dimensioned with the metalizedholes 412 such that when thetop side panel 202 and thebottom side panel 204 are mated together, thepins 414 are inserted into the corresponding metalizedholes 412 and form a friction bond that removably mechanically couples the mated sections together, and thus mechanically attaches the two server cells together. Moreover, in this example thepins 414 andholes 412 also operate as electrical connectors through which signaling or supply voltages may be conducted between the two server cells. -
FIG. 5 is a block diagram illustrating anexample compute system 500 implemented by theserver cell 200 ofFIG. 2 in accordance with some embodiments. In the depicted example, thecompute system 500 includes various compute componentry (e.g.,compute componentry 120 ofFIG. 1 ), such as aprocessor 502,system memory 504, an I/O controller 510, aninterconnect controller 512, and one or more I/O devices 514. Theprocessor 502 includes one ormore processor cores 506 and anorthbridge 508. The one ormore processor cores 506 can include any of a variety of types of processor cores, or combination thereof, such as a central processing unit (CPU) core, a graphics processing unit (GPU) core, a digital signal processing unit (DSP) core, and the like, and may implement any of a variety of instruction set architectures, such as an x86 instruction set architecture or an Advanced RISC Machine (ARM) architecture. Thesystem memory 504 can include one or more memory modules, such as DRAM modules, SRAM modules, flash memory, or a combination thereof. Thenorthbridge 508 interconnects the one ormore cores 506, thesystem memory 504, and the I/O controller 510. The I/O controller 510 in turn operates to manage the I/O devices 514, which can include, for example, flash memory, disc drives, bus interfaces, display controllers, BIOS, or other peripheral devices. - The
compute system 500 operates to execute an operating system (OS) and one or more software applications that perform compute tasks or other compute operations. In some embodiments, thecompute system 500 may utilize a virtual machine manager (VMM) that virtualizes the hardware of thecompute system 500 so as to allow multiple guest OS's and corresponding software applications to be executed by thecompute system 500. In some instances, some or all of the server cells of theserver system 100 each may perform discrete computing tasks in furtherance of an overall compute operation performed by theserver system 100. In other instances, the server cells of theserver system 100 may operate independently. In either mode of operation, the server cells may communicate data, commands, and other signaling via theirrespective interconnect controllers 512 and electrical connectors disposed on their mating exterior surfaces. - The
interconnect controller 512 operates to manage inter-cell signaling conducted via the side panels of theenclosure 250 of theserver cell 200. In this role, theinterconnect controller 512 can operate in a manner similar to a router or a switch whereby theinterconnect controller 512 routes signaling between the compute componentry of thecompute system 500 and the electrical connectors of the side panels (illustrated as ports 521-524 inFIG. 5 ), as well as routing signaling between the electrical connectors of different side panels of theserver cell 200. To illustrate, theinterconnect controller 512 operates to route signaling received via a side panel and intended for the compute componentry of theserver cell 200 by routing the received signaling from the side panel to the I/O controller 510, which then may forward the signaling on to other components as appropriate. Likewise, for signaling received from the I/O controller 510 and intended for an adjacent server cell (as either the next hop in the path or the final destination), theinterconnect controller 512 can route the signaling from the I/O controller 510 to the electrical connectors at the side panel that is mated to the intended adjacent server cell. Further, theinterconnect controller 512 can operate as a forwarding mechanism whereby it forwards signaling received from one adjacent server cell to another adjacent server cell, or as a reflection mechanism whereby it receives signaling received from an adjacent server cell via one set of electrical connectors and then reflects that signaling back to the same adjacent server cell via another set of electrical connectors. - As noted above, the supply voltages (e.g., voltages VDD and VSS) used to power the compute componentry of the server cells can be distributed among the server cells via the inter-cell connectors. In such instances, the
server cell 200 can include fixed or programmable wiring (not shown) that routes supply voltages received via inbound power connectors at one side panel to outbound power connectors at one or more other side panels, and thus forwarding the supply voltages on to other adjacent server cells. This intra-cell power distribution wiring can be provides as metal vias, metal traces, and other conductive features of PCB segments that can form the side panels of theserver cell 200, as cabling spanning between the interior surfaces of the side panels of theserver cell 200, or combinations thereof -
FIGS. 6 and 7 illustrate a rigid-flex PCB assembly 600 used to fabricate a server cell in accordance with some embodiments. As illustrated by thetop view 601 andbottom view 602 of the rigid-flex PCB assembly 600 presented inFIG. 6 , the rigid-flex PCB assembly 600 includes fourrigid PCB sections flexible PCB sections flex PCB assembly 600 to be folded into the hollow cuboid shape of theenclosure 250 illustrated inFIG. 2 . So folded, the rigid PCB sections 611-614 form the side panels 201-204 (FIG. 2 ) of theserver cell 200, and the flexible PCB sections 615-617 form the three corners that join, for example, theside panels top edge 621 and thebottom edge 622 of the rigid-flex PCB assembly 600 may be joined together via adhesive, thermal bonding, right-angle bracing, and the like, so as to form the fourth corner that joins, for example, theside panels flex PCB assembly 600 thus folded and theedges flex PCB assembly 600 forms theenclosure 250 of theserver cell 200. The rigidity of the folded rigid-flex PCB assembly 600 can be augmented through the use of for example, L-braces or corner braces at one or more corners, struts or other support rods that extend from the interior surface of one side panel to the interior surface of another side panel, and the like. -
Top view 601 illustrates a plan view of the interior side of the rigid-flex PCB assembly 600; that is, the side of the rigid-flex PCB assembly 600 that forms the interior of theserver cell 200 when folded. As illustrated bytop view 601, various compute componentry may be disposed at the interior side of one or more of the rigid PCB segments 611-614, and connected via metal traces, vias, through holes, and other conductive structures formed in the rigid-flex PCB assembly 600. In the depicted example, this compute componentry includes: a jumper interface 632 (one example of thejumper interface 122 ofFIG. 2 ) and an integrated circuit (IC)device 631 disposed at therigid PCB segment 611; anIC device 633 disposed at therigid PCB segment 612;IC devices rigid PCB segment 613; and anIC device 636 disposed at therigid PCB segment 614. These components are interconnected via metal traces (e.g., metal traces 637, 638, and 639), vias, metal through holes, and other metal features of the rigid-flex PCB assembly 600. With respect to the illustrated configuration of thecompute system 500 ofFIG. 5 , theIC device 631 can implement, for example, theinterconnect controller 512, theIC device 633 can implement, for example, the one ormore processor cores 506 and thenorthbridge 508, theIC device 634 can implement, for example, thememory 504, theIC device 633 can implement, for example, the I/O controller 510, and theIC device 636 can implement, for example, a voltage regulator, a peripheral device, and the like. -
Bottom view 602 ofFIG. 6 illustrates a plan view of the exterior side of the rigid-flex PCB assembly 600; that is, the side of the rigid-flex PCB assembly that forms the exterior mating surfaces of theenclosure 250 of theserver cell 200 when folded. In this example, female slide-fit coupling assemblies rigid PCB sections fit coupling assemblies rigid PCB sections fit coupling assemblies fit coupling assemblies FIG. 2 , and the male slide-fit coupling assemblies fit coupling assemblies FIG. 2 . Also disposed at the exterior mating surfaces of the rigid PCB sections 611-614 aresets server cell 200 ofFIG. 2 , each exterior surface of the perimeter formed by the folded rigid-flex PCB assembly 600 provides a mating surface that can mechanically and electrically couple with a compatible mating surface of an adjacent server cell. - Cross-section view 700 of
FIG. 7 illustrates a cross-section view of therigid PCB sections flexible PCB section 616 of the rigid-flex PCB assembly 600 along line A-A inFIG. 6 . As shown, the rigid-flex PCB assembly 600 comprises one or more metal layers and one or more dielectric layers (e.g.,metal layer 702 and dielectric layer 704) that extend the length of the rigid-flex PCB assembly 600 (fromedge 621 to edge 622), and thus providing electrical and mechanical continuity between all of the rigid PCB segments 611-614. The rigid PCB segments 611-614 further include one or more additional metal layers and one or more additional dielectric layers (e.g.,metal layer 706 and dielectric layer 708) to provide intra-segment connectivity and to provide structural support to the corresponding rigid PCB segment in its role as a side panel or “wall” of the server cell 200 (FIG. 2 ). - For the
flexible PCB section 616 to fulfill its role as the folding crease that allows therigid PCB sections flexible PCB section 616 should be relatively flexible so as to permit this folding. To this end, the layer materials and thicknesses of the layers in theflexible PCB section 616 are selected to provide this flexibility. To illustrate, theflexible PCB section 616 can comprise interleaved layers of ½ ounce copper foil for the metal layers and thin layers of flexible adhesives and thin polyimide films (e.g., DuPont™ Kapton™ film) for the dielectric layers. For the rigid.PCB sections server cell 200, therigid PCB sections flexible PCB section 616 with more rigid layer of dielectric material that are made relatively rigid based on the material type or their thicknesses. For example, the additional dielectric layers found in therigid PCB sections flexible PCB section 616 may be formed by fabricating all of the various metal and dielectric layers for thePCB assembly 600 to as to extend fully from theedge 621 to the edge 622 (FIG. 6 ) and then remove portions of the appropriate layers in the region corresponding to theflexible PCB section 616 through an etch, ablation, or abrasive process so that only the intended layers remain in theflexible PCB section 616. The otherflexible PCB sections - In the example of
FIG. 7 , the male slide-fit connector assembly 641 is formed by molding or extruding its shape at thetop dielectric layer 708 or by preforming the male slide-fit connector assembly 641 and then adhering the male slide-fit connector assembly 641 to thetop dielectric layer 708. The female slide-fit connector assembly 643 can be formed as an intrusion at atop layer 710 of therigid PCB section 613 via an etch, ablation, or abrasive process. Further, in the depicted example, the electrical connectors of thesets 652 and 654 (FIG. 6 ) are illustrated as metalizedpads 712 intended to physically contact corresponding metal pads on an opposing mating surface of another server cell so as to form electrical pathways between the two adjacent server cells. -
FIG. 8 illustrates aserver system 800 employing a three-dimensional (3D)array 802 of server cells in accordance with some embodiments. In the depicted implementation, in addition to employing four mating surfaces that form a perimeter in the X-Y plane as shown by theserver system 100 ofFIG. 1 , the server cells of theserver system 800 include aback side panel 803 with compatible mating surfaces, thereby enabling theserver system 800 to interconnect server cells in two ranks, ranks 804 and 806, each rank comprising a 2D array of server cells. The server cell in one rank may be interconnected with the corresponding server cell in another rank via, for example, compatible press-fit coupling assemblies on the exterior mating surfaces of theback side panels 803 of the adjacent server cells. In other embodiments, the server cells also may include front side panels (not shown) so as to provide a total of six orthogonal mating surfaces for the cuboid shape illustrated. In such configurations, a server system can be expanded to include more than two ranks of 1D or 2D server cell arrays. -
FIGS. 9 and 10 illustrate example rigid-flex PCB assembly configurations that may be used to form server cells with five or six orthogonal mating surfaces.FIG. 9 illustrates abottom view 902 of a rigid-flex PCB assembly 900 having fourrigid PCB sections flexible PCB sections flex PCB assembly 900 has a fifthrigid PCB section 918 connected to an edge of the rigid PCB section 913 (or another one of the rigid PCB sections) via aflexible PCB section 919 such that when therigid PCB section 918 is folded along theflexible PCB section 919 and joined to the adjacent edges of the other rigid PCB sections, therigid PCB section 918 forms a back side panel of the resulting server cell.FIG. 10 illustrates abottom view 1002 of a rigid-flex PCB assembly 1000 having fourrigid PCB sections flexible PCB sections flex PCB assembly 1000 has a fifthrigid PCB section 1018 connected to an edge of the rigid PCB section 1014 (or another one of the rigid PCB sections) via aflexible PCB section 1019 and a sixthrigid PCB section 1020 connected to an edge of the rigid PCB section 1011 (or another one of the rigid PCB sections) via aflexible PCB section 1021 such that when the rigid-flex PCB assembly 1000 is folded along the flexible PCB sections, therigid PCB sections - Although
FIGS. 1-10 illustrate example implementations of server cells with cuboid shapes, the server cells can have any of a variety of 3D shapes capable of supporting expandable multiple-cell configurations. To illustrate,FIG. 11 illustrates a perspective view of aserver system 1100 employing a 2D array ofserver cells 1104 having an enclosure with a triangular prism shape. Moreover, a server system may incorporate a combination of server cells of different shapes or types. As an example,FIG. 12 illustrates a front view of aserver system 1200 employing a 2D hybrid array ofserver cells 1204 with enclosures having a hexagonal prism shape andserver cells 1206 having a triangular prism shape. As another example, the server cells may be formed with an octagonal prism shape. As with thecuboid server cell 200 ofFIG. 2 , theserver cells server cells FIGS. 6 , 7, and 10. -
FIG. 13 illustrates amethod 1300 for assembling and operating a cell-based server system in accordance with some embodiments. For ease of illustration, themethod 1300 is described below in an example context of theserver system 100 ofFIG. 1 utilizing open-ended cuboid-shapedserver cells 200 as illustrated inFIG. 2 . Atblock 1302, a rigid-flex PCB assembly is fabricated for each of a plurality of server cells. This fabrication process can include fabrication of a PCB substrate with the appropriate metal and dielectric layers, etching, ablating or otherwise removing material to form the flexible PCB sections, attaching the compute components at the resulting rigid PCB sections, attaching the electrical connectors to the exterior mating surfaces of the rigid PCB sections, and forming or attaching the compatible mechanical coupling assemblies to the exterior mating surfaces. Atblock 1304, the rigid-flex PCB assembly is folded to form a corresponding server cell. As part of this folding process, adjacent unattached edges of the rigid PCB sections may be attached via adhesive, thermobonding, brackets, screws, clamps, etc. The process ofblocks - At
block 1306, the plurality of server cells are interlocked to form a 1D, 2D, or 3D server cell array. This interlocking process includes joining facing mating surfaces of the server cells either by sliding the server cells together or pressing the server cells together, depending on the mechanical coupling mechanism employed. The interlocking process also can include connecting a base of the server cell array to a chassis, which may serve as both a stabilizing base for the server cell array as well as an ingress point for one or more supply voltages and an ingress or egress point for one or more signals. With the server system assembled, atblock 1308 the server system is operated to perform one or more compute operations. In some embodiments, the compute operations can include discrete sub-operations performed in parallel in furtherance of an overall compute operation (e.g., scientific modeling operations, graphics rendering, etc.). Alternatively, the compute operations can include independent compute operations performed by separate sets of one or more of the server cells (e.g., each set of server cells operating as a separate virtual server in support of a separate client). As part of this operation, supply voltages are distributed among the server cells via the paired electrical connectors at the mating surfaces of the server cells. Likewise, signaling of data, commands, and other information is distributed among the server cells via the paired electrical connectors at the mating surfaces of the server cells. Additionally, jumper cable interfaces may be implemented to provide direct signal connections or voltage supply connections between server cells that are not immediately adjacent to each other. - In some embodiments, at least some of the functionality described above may be implemented by one or more processors executing one or more software programs tangibly stored at a computer readable medium, and whereby the one or more software programs comprise instructions that, when executed, manipulate the one or more processors to perform one or more functions described above. In some embodiments, the components and techniques described above are implemented in a system comprising one or more electronic devices. Electronic design automation (EDA) and computer aided design (CAD) software tools may be used in the design and fabrication of these electronic devices. These design tools typically are represented as one or more software programs. The one or more software programs comprise code executable by a computer system to manipulate the computer system to operate on code representative of circuitry of one or more IC devices so as to perform at least a portion of a process to design or adapt a manufacturing system to fabricate the circuitry. This code can include instructions, data, or a combination of instructions and data. The software instructions representing a design tool or fabrication tool typically are stored in a computer readable storage medium accessible to the computing system. Likewise, the code representative of one or more phases of the design or fabrication of an electronic device may be stored in and accessed from the same computer readable storage medium or a different computer readable storage medium.
- A computer readable storage medium may include any storage medium, or combination of storage media, accessible by a computer system during use to provide instructions and/or data to the computer system. Such storage media can include, but is not limited to, optical media (e.g., compact disc (CD), digital versatile disc (DVD), Blu-Ray disc), magnetic media (e.g., floppy disc, magnetic tape, or magnetic hard drive), volatile memory (e.g., random access memory (RAM) or cache), non-volatile memory (e.g., read-only memory (ROM) or Flash memory), or microelectromechanical systems (MEMS)-based storage media. The computer readable storage medium may be embedded in the computing system (e.g., system RAM or ROM), fixedly attached to the computing system (e.g., a magnetic hard drive), removably attached to the computing system (e.g., an optical disc or Universal Serial Bus (USB)-based Flash memory), or coupled to the computer sys em via a wired or wireless network (e.g., network accessible storage (NAS)).
- Note that not all of the activities or elements described above in the general description are required, that a portion of a specific activity or device may not be required, and that one or more further activities may be performed, or elements included, in addition to those described. Still further, the order in which activities are listed are not necessarily the order in which they are performed.
- Also, the concepts have been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present disclosure as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present disclosure.
- Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims.
Claims (26)
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