US20140256130A1 - Front side wafer id processing - Google Patents
Front side wafer id processing Download PDFInfo
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- US20140256130A1 US20140256130A1 US13/785,816 US201313785816A US2014256130A1 US 20140256130 A1 US20140256130 A1 US 20140256130A1 US 201313785816 A US201313785816 A US 201313785816A US 2014256130 A1 US2014256130 A1 US 2014256130A1
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Images
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
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- H—ELECTRICITY
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Definitions
- the present invention relates generally to manufacture of semiconductors, and more particularly to enabling tracking of wafer components through processing of 3D chips.
- Wafers are generally used as a foundation for building semiconductor devices.
- an identifier referred to herein as a wafer ID
- the devices and interconnect metallization are formed on one side of a wafer, e.g., the “front side.” It is conventional to form the wafer ID on the opposite side, e.g., the “back side.”
- processing the back sides of wafers is often needed, for example in three dimensional integrated (3Di) chips. Processing back sides of wafers, e.g., thinning, grinding, polishing, etc., however, can cause the wafer IDs to be removed.
- 3Di three dimensional integrated
- One embodiment of the present invention provides a method for placing a wafer ID of a back side on a front side of a wafer.
- the method comprises reading from the back side of the wafer the wafer ID; patterning the wafer ID in an etch mask on the front side of the wafer, wherein each character of the wafer ID patterned into the etch mask includes a plurality of openings substantially matching feature sizes of fabricated chip features on the wafer; etching the front side of the wafer through the plurality of openings in the etch mask to produce a plurality of recesses in the wafer that collectively depict the wafer ID; and filling the plurality of recesses in the wafer with a metal.
- Another embodiment of the present invention provides a method for printing a wafer ID on a wafer.
- the method comprises identifying a wafer ID for a wafer; patterning a mirror image of the wafer ID into an etch mask over a front side of the wafer; patterning one or more TSV designs into the etch mask in addition to the mirror image of the wafer ID; etching the mirror image of the wafer ID and the one or more TSV designs into the wafer to a given depth; filling the etched mirror image of the wafer ID and one or more TSV designs with a metal; and thinning a back side of the wafer to expose the metal within the etched mirror image of the wafer ID and one or more TSV designs, such that the metal within the etched mirror image of the wafer ID presents as a non-mirrored depiction of the wafer ID when viewed from the back side of the wafer.
- FIG. 1 illustrates a wafer processing sequence, in accordance with an embodiment of the present invention.
- FIG. 2 illustrates a wafer ID on a back side of a wafer, in accordance with an embodiment of the present invention.
- FIG. 3 illustrates a front side of a wafer, in accordance with an embodiment of the present invention.
- FIG. 4A illustrates printing the wafer ID of the back side shown in FIG. 2 , into an etch mask on the front side shown in FIG. 3 , in accordance with an embodiment of the present invention.
- FIG. 4B illustrates a sectional view of the wafer, which is a view of 4 B- 4 B section shown in FIG. 4A , in accordance with an embodiment of the present invention.
- FIGS. 5A and 5B illustrates a printing system used in printing a wafer ID in the etch mask on the front side shown in FIG. 3 , in accordance with an embodiment of the present invention.
- FIG. 5C depicts a character of the wafer ID patterned into the etch mask as a plurality of openings according to an embodiment of the present invention.
- FIG. 6 illustrates a sectional view of a wafer with a printed wafer ID on a front side of a wafer after a photolithography process, in accordance with an embodiment of the present invention.
- FIG. 7 illustrates a sectional view of a wafer with an etched wafer ID on a front side of a wafer after a reactive ion etching process, in accordance with an embodiment of the present invention.
- FIG. 8 illustrates a sectional view of a wafer with a metal-filled wafer ID on a front side of a wafer after a metallization process, in accordance with an embodiment of the present invention.
- FIG. 9 illustrates a sectional view of a through-silicon-via (TSV) wafer with a metal-filled wafer ID, in accordance with an embodiment of the present invention.
- TSV through-silicon-via
- the present invention discloses a method for placing a wafer ID of a back side on a front side of a wafer.
- the method of the present invention is described in detail in the following exemplary embodiments with reference to the figures.
- the foregoing description of various exemplary embodiments of the present invention has been presented for purposes of illustration and description. It is neither intended to be exhaustive nor to limit the invention to the precise form disclosed. Many modifications and variations are possible. Such modifications and variations that may be apparent to a person skilled in the art of the invention are intended to be included within the scope of the invention as defined by the accompanying claims.
- FIG. 1 illustrates a wafer processing sequence.
- the exemplary process can be implemented by one or more tools that are conventional in the art of wafer manufacture.
- wafers are semiconductor wafers of conventional materials used in the art.
- Step 110 of the exemplary process is insulator deposition.
- the insulator such as SiO 2 , SiN, SiC, and etc, is deposited on the wafers through chemical vapor deposition (CVD), such as plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), or sub-atmospheric pressure chemical vapor deposition (SACVD).
- CVD chemical vapor deposition
- PECVD plasma-enhanced chemical vapor deposition
- ALD atomic layer deposition
- SACVD sub-atmospheric pressure chemical vapor deposition
- Step 120 of the exemplary process is photolithography.
- Photolithography is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical “photoresist” on the substrate, thereby exposing the underlying substrate or insulation layer in the shape of the geometric pattern. The remaining photoresist protects the unexposed portions of the underlying layer in subsequent etching processes, e.g. reactive-ion etching (RIE), allowing the geometric pattern to be removed from the underlying layer.
- Step 130 of the exemplary process is reactive ion etching. RIE uses chemically reactive plasma to remove material deposited on wafers.
- Step 140 of the exemplary process is metallization.
- Metallization is the process that connects individual devices together by means of microscopic wires to form circuits on the wafers. For example, trenches patterned in step 120 and etched in step 130 can be filled with a metal or other conductive material to form a wire.
- Step 160 of the exemplary process is chemical mechanical polishing.
- Step 180 of the exemplary process is insulator cap deposit.
- the insulator caps typically SiN or NBlok, are deposited on the wafer through chemical vapor deposition (CVD).
- the insulator caps are materials that not only insulate against electrical passage but also prevent copper or other metals from defusing through them.
- a method for placing a wafer ID of a back side on a front side of a wafer is incorporated in the exemplary process shown in FIG. 1 , and the method is discussed in detail in later paragraphs with reference to FIGS. 2-9 .
- FIG. 2 is a diagram illustrating wafer ID 230 on back side 210 of wafer 200 , in accordance with an exemplary embodiment of the present invention.
- Wafer 200 is a semiconductor wafer of a conventional material used in the art of the semiconductor industry.
- wafer 200 may include orientation notch 220 .
- wafer ID 230 is placed on back side 210 and is readily identified throughout processes of manufacturing the semiconductor devices. However, due to the processes of grinding and polishing back side 210 of wafer 200 , wafer ID 230 thereon is removed. For example, in 3D chip technology, electrical connections may pass from one side of a wafer or chip, through the substrate, to the opposite side of the wafer or chip.
- FIG. 3 is a diagram illustrating a front side of wafer 200 , in accordance with an exemplary embodiment of the present invention.
- Photoresist 310 which is a light-sensitive material, is on the front side of wafer 200 .
- the peripheral part of the front side of wafer 200 is edge 320 where the light sensitive material (photoresist) is chemically and/or lithographically removed.
- FIG. 4A is a diagram illustrating that wafer ID 230 of back side 210 of wafer 200 shown in FIG. 2 is printed in photoresist 310 on the front side of wafer 200 shown in FIG. 3 , in accordance with an exemplary embodiment of the present invention.
- FIG. 4B is a diagram illustrating a sectional view of wafer 200 , which is a view of 4 B- 4 B section shown in FIG. 4A .
- FIGS. 4A and 4B shows wafer ID 410 printed in photoresist 310 on the front side of wafer 200 .
- Wafer ID 410 on the front side carries the information of wafer ID 230 of back side 210 of wafer 200 .
- FIG. 4A is a diagram illustrating that wafer ID 230 of back side 210 of wafer 200 shown in FIG. 2 is printed in photoresist 310 on the front side of wafer 200 shown in FIG. 3 , in accordance with an exemplary embodiment of the present invention.
- FIG. 4B is a
- the printing system prints wafer ID 230 in photoresist 310 on the front side of wafer 200 .
- wafer ID 230 of back side 210 of wafer 200 is copied onto the front side of wafer 200 , and wafer 200 has wafer ID 410 printed in photoresist 310 on the front side.
- the printing system uses an attenuated beam of light, for example, ultraviolet (UV) or laser; the printing system may also use an electron beam.
- UV ultraviolet
- wafer ID 410 an image of wafer ID 230 of back side 210 of wafer 200 is printed as wafer ID 410 on the front side of wafer 200 .
- wafer ID 410 can be read optically from the front side of wafer 200 during processes of manufacturing the semiconductor devices, for the purpose of tracking wafer 200 .
- the process of printing wafer ID 410 may be incorporated into standard processing steps as described with regard to FIG. 1 .
- photolithography described with respect to step 120 may pattern the wafer ID in addition to one or more other features.
- photoresist 310 has been exposed to reveal edge 320 .
- the same exposure can be used to remove the pattern of wafer ID 410 in photoresist 310 .
- a Wafer Edge Expose (WEE) process is used to track a wafer edge and, accordingly, to expose the edge.
- the WEE process may, in one embodiment, be adjusted to expose the wafer ID into the photoresist just inside the exposed edge.
- printing wafer ID 410 may be incorporated in the patterning and etching of a wiring layer or metal layer, e.g., the final metal layer. Patterning a photoresist with both the wafer ID and wiring features would allow both to be etched, and subsequently filled, concurrently, thereby avoiding additional processing steps.
- wafer 200 may be moved to a specially made piece of equipment, and reading wafer ID 230 and printing wafer ID 410 are completed in a stand alone process.
- printing wafer ID 410 in photoresist 310 on a front side of wafer 200 is implemented using reticle 510 shown in FIG. 5A and blocking plate 520 shown in FIG. 5B .
- the term “reticle” is commonly used in the case of projection printing in the semiconductor industry.
- a reticle is a square quartz plate with a pattern delineated in thin chrome layer on one side, and it is functionally the same as a mask.
- Reticle 510 comprises alphanumerical and/or barcode characters.
- Blocking plate 520 comprises hole 530 that allows a light beam to pass through.
- wafer ID 410 is printed in photoresist 310 on the front side of wafer 200 .
- wafer ID 410 may, in one embodiment, be patterned into photoresist 310 in addition to features such as trench and/or via patterns.
- the wafer ID can be segmented into parts that will mimic the feature sizes of the chip printing. For example, if the feature size in the chip is 6 ⁇ , then the wafer ID characters could be made of a plurality 6 ⁇ vias or bars (comparable to dot-matrix printing). Thereby, matching the sizes to avert the RIE differential depths while preserving the quality of the wafer ID without compromising the integrity of the chip features.
- RIE lag the differential in etch depths due to the difference of the resist size opening
- reticles used to pattern wafer ID characters into photoresist 310 may be comprised of a plurality of openings substantially matching feature sizes of the chip.
- FIG. 5C depicts a character ( 540 ) of wafer ID 410 patterned into photoresist 310 according to such a technique.
- a mirrored image of wafer ID 230 of back side 210 of wafer 200 is printed on the front side of wafer 200 .
- Wafer ID 410 on the front side is a mirrored image of wafer ID 230 .
- wafer ID 410 can be viewed and read from the opposite side of the chip using infrared.
- the wafer ID may be etched to varying depths.
- wafer ID 410 is etched to a depth at least equaling the depth of TSVs in the wafer. Subsequent thinning processes to expose the TSVs would thereby simultaneously expose wafer ID 410 on the back side of wafer 200 .
- a mirrored image etched and deposited on the front side would thereby produce a correct image as exposed from the back side.
- TSVs typically range anywhere from 5 to 25 microns in diameter and can be etched into a chip or wafer as deep as 100 microns depending on the ultimate desired thickness of the chip or wafer.
- Characters of wafer ID 410 may be etched through a mask to match the depth of the TSVs. In one embodiment, this may be done simultaneously with the etching of the TSV openings. Both the TSV openings and the characters of wafer ID 410 are filled, preferably with the same material during the same deposition step to prevent additional processing steps.
- FIG. 6 is a diagram illustrating a sectional view of wafer 200 with wafer ID 410 on a front side of wafer 200 after the step of photolithography 120 shown in FIG. 1 , in accordance with an exemplary embodiment of the present invention.
- wafer 200 has exposure patterns including wafer ID 410 and chip feature 620 on the front side.
- FIG. 6 also shows remaining photoresist 630 on the front side of wafer 200 .
- wafer ID 410 and chip features 620 may be patterned into the same photoresist.
- any etch mask may be used, including a hard mask such as titanium nitride, silicon nitride, silicon dioxide, silicon carbide, silicon carbide nitride and/or combinations of the preceding.
- FIG. 7 is a diagram illustrating a sectional view of wafer 200 with etched wafer ID 710 on a front side after the step of reactive ion etching 130 shown in FIG. 1 , in accordance with an exemplary embodiment of the present invention.
- wafer ID 410 and chip feature 620 are etched into wafer 200 , preferably at the same time.
- Wafer ID 410 is engraved as etched wafer ID 710 on the front side of wafer 200 .
- the etch process is preferably an anisotropic RIE, in other embodiments, other anisotropic etching methods (ion beam etching, plasma etching, laser ablation, etc.), or isotropic etching methods (wet chemical etch, etc.) may be used.
- anisotropic etching methods ion beam etching, plasma etching, laser ablation, etc.
- isotropic etching methods wet chemical etch, etc.
- FIG. 8 is a diagram illustrating a sectional view of wafer 200 with metal-filled wafer ID 810 on a front side after the step of metallization 140 shown in FIG. 1 , in accordance with an exemplary embodiment of the present invention.
- etched wafer ID 710 shown in FIG. 7 is filled with a metal
- metal-filled wafer ID 810 is formed on the front side of wafer 200
- chip feature 620 on the front side shown in FIG. 6 is filled with a metal
- metal-filled chip feature 820 is formed on the front side of wafer 200 .
- placing a back side wafer ID on a front side of a wafer can also be performed at the last metal level which is commonly aluminum.
- the aluminum may not be initially embedded in the insulator when formed. This process is well known and may be apparent to a person skilled in the art.
- FIG. 9 is a diagram illustrating a sectional view of through-silicon-via (TSV) wafer 900 with metal-filled wafer ID 910 , in accordance with an exemplary embodiment of the present invention.
- FIG. 9 shows metal-filled through-silicon-vias 940 on through-silicon-via (TSV) wafer 900 which has front side 920 and back side 930 .
- the sectional view in FIG. 9 shows that metal-filled wafer ID 910 is visible from both front side 920 and back side 930 .
- An image of a back-side wafer ID of TSV wafer 900 is placed on front side 920 , so that metal-filled wafer ID 910 can be read optically from front side 920 , for tracking wafer 900 during processes of manufacturing the semiconductor devices.
- a mirrored image of a back-side wafer ID of TSV wafer 900 is placed on front side 920 , so that metal-filled wafer ID 910 can be read from back side 930 .
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Abstract
Description
- The present invention relates generally to manufacture of semiconductors, and more particularly to enabling tracking of wafer components through processing of 3D chips.
- Wafers are generally used as a foundation for building semiconductor devices. During manufacturing of semiconductor devices, an identifier, referred to herein as a wafer ID, is usually formed on a semiconductor wafer. In conventional wafers, the devices and interconnect metallization are formed on one side of a wafer, e.g., the “front side.” It is conventional to form the wafer ID on the opposite side, e.g., the “back side.” As scaling becomes more challenging, processing the back sides of wafers is often needed, for example in three dimensional integrated (3Di) chips. Processing back sides of wafers, e.g., thinning, grinding, polishing, etc., however, can cause the wafer IDs to be removed.
- One embodiment of the present invention provides a method for placing a wafer ID of a back side on a front side of a wafer. The method comprises reading from the back side of the wafer the wafer ID; patterning the wafer ID in an etch mask on the front side of the wafer, wherein each character of the wafer ID patterned into the etch mask includes a plurality of openings substantially matching feature sizes of fabricated chip features on the wafer; etching the front side of the wafer through the plurality of openings in the etch mask to produce a plurality of recesses in the wafer that collectively depict the wafer ID; and filling the plurality of recesses in the wafer with a metal.
- Another embodiment of the present invention provides a method for printing a wafer ID on a wafer. The method comprises identifying a wafer ID for a wafer; patterning a mirror image of the wafer ID into an etch mask over a front side of the wafer; patterning one or more TSV designs into the etch mask in addition to the mirror image of the wafer ID; etching the mirror image of the wafer ID and the one or more TSV designs into the wafer to a given depth; filling the etched mirror image of the wafer ID and one or more TSV designs with a metal; and thinning a back side of the wafer to expose the metal within the etched mirror image of the wafer ID and one or more TSV designs, such that the metal within the etched mirror image of the wafer ID presents as a non-mirrored depiction of the wafer ID when viewed from the back side of the wafer.
-
FIG. 1 illustrates a wafer processing sequence, in accordance with an embodiment of the present invention. -
FIG. 2 illustrates a wafer ID on a back side of a wafer, in accordance with an embodiment of the present invention. -
FIG. 3 illustrates a front side of a wafer, in accordance with an embodiment of the present invention. -
FIG. 4A illustrates printing the wafer ID of the back side shown inFIG. 2 , into an etch mask on the front side shown inFIG. 3 , in accordance with an embodiment of the present invention. -
FIG. 4B illustrates a sectional view of the wafer, which is a view of 4B-4B section shown inFIG. 4A , in accordance with an embodiment of the present invention. -
FIGS. 5A and 5B illustrates a printing system used in printing a wafer ID in the etch mask on the front side shown inFIG. 3 , in accordance with an embodiment of the present invention. -
FIG. 5C depicts a character of the wafer ID patterned into the etch mask as a plurality of openings according to an embodiment of the present invention. -
FIG. 6 illustrates a sectional view of a wafer with a printed wafer ID on a front side of a wafer after a photolithography process, in accordance with an embodiment of the present invention. -
FIG. 7 illustrates a sectional view of a wafer with an etched wafer ID on a front side of a wafer after a reactive ion etching process, in accordance with an embodiment of the present invention. -
FIG. 8 illustrates a sectional view of a wafer with a metal-filled wafer ID on a front side of a wafer after a metallization process, in accordance with an embodiment of the present invention. -
FIG. 9 illustrates a sectional view of a through-silicon-via (TSV) wafer with a metal-filled wafer ID, in accordance with an embodiment of the present invention. - The present invention discloses a method for placing a wafer ID of a back side on a front side of a wafer. The method of the present invention is described in detail in the following exemplary embodiments with reference to the figures. The foregoing description of various exemplary embodiments of the present invention has been presented for purposes of illustration and description. It is neither intended to be exhaustive nor to limit the invention to the precise form disclosed. Many modifications and variations are possible. Such modifications and variations that may be apparent to a person skilled in the art of the invention are intended to be included within the scope of the invention as defined by the accompanying claims.
- It is to be understood that the disclosed embodiments are merely illustrative of the claimed structures and methods that may be embodied in various forms. In addition, each of the examples given in connection with the various embodiments is intended to be illustrative, and not restrictive. Further, the figures are not necessarily to scale, some features may be exaggerated to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the methods and structures of the present disclosure.
- To facilitate description of a method for placing a wafer ID of a back side on a front side of a wafer,
FIG. 1 illustrates a wafer processing sequence. The exemplary process can be implemented by one or more tools that are conventional in the art of wafer manufacture. And, wafers are semiconductor wafers of conventional materials used in the art.Step 110 of the exemplary process is insulator deposition. Atstep 110, the insulator, such as SiO2, SiN, SiC, and etc, is deposited on the wafers through chemical vapor deposition (CVD), such as plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), or sub-atmospheric pressure chemical vapor deposition (SACVD).Step 120 of the exemplary process is photolithography. Photolithography is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical “photoresist” on the substrate, thereby exposing the underlying substrate or insulation layer in the shape of the geometric pattern. The remaining photoresist protects the unexposed portions of the underlying layer in subsequent etching processes, e.g. reactive-ion etching (RIE), allowing the geometric pattern to be removed from the underlying layer.Step 130 of the exemplary process is reactive ion etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface (where exposed) and react with it. It should be noted that when etching features that are of different sizes, as determined by the openings through the photoresist, RIE “lag” can happen. This is generally characterized as a differential in etch depths due to the difference of the resist size opening.Step 140 of the exemplary process is metallization. Metallization is the process that connects individual devices together by means of microscopic wires to form circuits on the wafers. For example, trenches patterned instep 120 and etched instep 130 can be filled with a metal or other conductive material to form a wire.Step 160 of the exemplary process is chemical mechanical polishing. Chemical mechanical polishing (CMP) is a process of smoothing surfaces of the wafers with the combination of chemical and mechanical forces. Often metal-filled trenches are overfilled and excess metal is removed using a CMP process.Steps 110 through 160 can be repeated to form a plurality of stacked layers with various chip design features.Step 180 of the exemplary process is insulator cap deposit. The insulator caps, typically SiN or NBlok, are deposited on the wafer through chemical vapor deposition (CVD). The insulator caps are materials that not only insulate against electrical passage but also prevent copper or other metals from defusing through them. A method for placing a wafer ID of a back side on a front side of a wafer is incorporated in the exemplary process shown inFIG. 1 , and the method is discussed in detail in later paragraphs with reference toFIGS. 2-9 . -
FIG. 2 is a diagram illustratingwafer ID 230 onback side 210 ofwafer 200, in accordance with an exemplary embodiment of the present invention.Wafer 200 is a semiconductor wafer of a conventional material used in the art of the semiconductor industry. In one embodiment,wafer 200 may includeorientation notch 220. Generally,wafer ID 230 is placed onback side 210 and is readily identified throughout processes of manufacturing the semiconductor devices. However, due to the processes of grinding and polishing backside 210 ofwafer 200,wafer ID 230 thereon is removed. For example, in 3D chip technology, electrical connections may pass from one side of a wafer or chip, through the substrate, to the opposite side of the wafer or chip. These connections are generally referred to as through-silicon vias (TSVs), though in various instances may pass through substrate material other than silicon. The process of creating a TSV typically involves etching an opening into the substrate that does not reach the other side of the substrate, depositing a conductive material into the opening, e.g., copper, and “thinning” the other side of the substrate to expose the conductive material such that it passes completely through the substrate. Thinning can include grinding, polishing, etc., and will typically remove the wafer ID. Therefore, placingwafer ID 230 somewhere else onwafer 200 other than backside 210 may be beneficial when excessive backside processing occurs.FIG. 3 is a diagram illustrating a front side ofwafer 200, in accordance with an exemplary embodiment of the present invention.Photoresist 310, which is a light-sensitive material, is on the front side ofwafer 200. The peripheral part of the front side ofwafer 200 isedge 320 where the light sensitive material (photoresist) is chemically and/or lithographically removed. -
FIG. 4A is a diagram illustrating thatwafer ID 230 ofback side 210 ofwafer 200 shown inFIG. 2 is printed inphotoresist 310 on the front side ofwafer 200 shown inFIG. 3 , in accordance with an exemplary embodiment of the present invention.FIG. 4B is a diagram illustrating a sectional view ofwafer 200, which is a view of 4B-4B section shown inFIG. 4A .FIGS. 4A and 4B showswafer ID 410 printed inphotoresist 310 on the front side ofwafer 200.Wafer ID 410 on the front side carries the information ofwafer ID 230 ofback side 210 ofwafer 200. In the exemplary process (shown inFIG. 1 ) of manufacturing wafers, when the earlier mentioned one or more tools readwafer ID 230 ofback side 210 ofwafer 200, the information is transferred to a printing system of the one or more tools. Then, the printing system printswafer ID 230 inphotoresist 310 on the front side ofwafer 200. Thus,wafer ID 230 ofback side 210 ofwafer 200 is copied onto the front side ofwafer 200, andwafer 200 haswafer ID 410 printed inphotoresist 310 on the front side. Toprint wafer ID 410 inphotoresist 310, the printing system uses an attenuated beam of light, for example, ultraviolet (UV) or laser; the printing system may also use an electron beam. In FIG. 4A, an image ofwafer ID 230 ofback side 210 ofwafer 200 is printed aswafer ID 410 on the front side ofwafer 200. Thus,wafer ID 410 can be read optically from the front side ofwafer 200 during processes of manufacturing the semiconductor devices, for the purpose of trackingwafer 200. - In the exemplary embodiment, the process of
printing wafer ID 410 may be incorporated into standard processing steps as described with regard toFIG. 1 . For example, photolithography described with respect to step 120, may pattern the wafer ID in addition to one or more other features. As depicted,photoresist 310 has been exposed to revealedge 320. In one embodiment, the same exposure can be used to remove the pattern ofwafer ID 410 inphotoresist 310. Often, a Wafer Edge Expose (WEE) process is used to track a wafer edge and, accordingly, to expose the edge. The WEE process may, in one embodiment, be adjusted to expose the wafer ID into the photoresist just inside the exposed edge. In another embodiment,printing wafer ID 410 may be incorporated in the patterning and etching of a wiring layer or metal layer, e.g., the final metal layer. Patterning a photoresist with both the wafer ID and wiring features would allow both to be etched, and subsequently filled, concurrently, thereby avoiding additional processing steps. Alternatively,wafer 200 may be moved to a specially made piece of equipment, and readingwafer ID 230 andprinting wafer ID 410 are completed in a stand alone process. - In an embodiment shown in
FIGS. 5A and 5B ,printing wafer ID 410 inphotoresist 310 on a front side ofwafer 200 is implemented usingreticle 510 shown inFIG. 5A and blockingplate 520 shown inFIG. 5B . The term “reticle” is commonly used in the case of projection printing in the semiconductor industry. A reticle is a square quartz plate with a pattern delineated in thin chrome layer on one side, and it is functionally the same as a mask.Reticle 510 comprises alphanumerical and/or barcode characters. Blockingplate 520 compriseshole 530 that allows a light beam to pass through. Toprint wafer ID 410 inphotoresist 310 on the front side ofwafer 200, respective characters selected from alphanumerical and/or barcode characters onreticle 510 are aimed at wherewafer ID 410 is to be printed, blockingplate 520 is so adjusted thathole 530 is pointed at the respective characters. For example, inFIG. 5B ,hole 530 is aimed at number 9 onreticle 510. When the light beam is passed throughhole 530, the respective characters are exposed inphotoresist 310 on the front side ofwafer 200. Thus,wafer ID 410 is printed inphotoresist 310 on the front side ofwafer 200. Again,wafer ID 410 may, in one embodiment, be patterned intophotoresist 310 in addition to features such as trench and/or via patterns. - In another embodiment, to account for RIE lag (the differential in etch depths due to the difference of the resist size opening), the wafer ID can be segmented into parts that will mimic the feature sizes of the chip printing. For example, if the feature size in the chip is 6μ, then the wafer ID characters could be made of a plurality 6μ vias or bars (comparable to dot-matrix printing). Thereby, matching the sizes to avert the RIE differential depths while preserving the quality of the wafer ID without compromising the integrity of the chip features. A person of ordinary skill in the art will recognize that an exact match of feature size, e.g. 6μ to 6μ, though preferred, is not necessary, and that a substantial match (i.e. within a twenty percent range of feature size) may also provide similar benefits. In one implementation of such an embodiment, reticles used to pattern wafer ID characters into
photoresist 310 may be comprised of a plurality of openings substantially matching feature sizes of the chip.FIG. 5C depicts a character (540) ofwafer ID 410 patterned intophotoresist 310 according to such a technique. - In another exemplary embodiment, a mirrored image of
wafer ID 230 ofback side 210 ofwafer 200 is printed on the front side ofwafer 200.Wafer ID 410 on the front side is a mirrored image ofwafer ID 230. Depending on the material used to fill the etched mirrored wafer ID, for example copper,wafer ID 410 can be viewed and read from the opposite side of the chip using infrared. Thus, printing a mirrored image of the wafer ID allows the wafer ID to be read correctly from the backside. Additionally, prior to metal deposition of a wafer ID, the wafer ID may be etched to varying depths. In one embodiment,wafer ID 410 is etched to a depth at least equaling the depth of TSVs in the wafer. Subsequent thinning processes to expose the TSVs would thereby simultaneously exposewafer ID 410 on the back side ofwafer 200. A mirrored image etched and deposited on the front side would thereby produce a correct image as exposed from the back side. - Current TSVs typically range anywhere from 5 to 25 microns in diameter and can be etched into a chip or wafer as deep as 100 microns depending on the ultimate desired thickness of the chip or wafer. One preferred thickness, and therefore a standard TSV etch depth, is 55 microns. Characters of
wafer ID 410, or in one embodiment the plurality of holes or openings making up characters ofwafer ID 410, may be etched through a mask to match the depth of the TSVs. In one embodiment, this may be done simultaneously with the etching of the TSV openings. Both the TSV openings and the characters ofwafer ID 410 are filled, preferably with the same material during the same deposition step to prevent additional processing steps. -
FIG. 6 is a diagram illustrating a sectional view ofwafer 200 withwafer ID 410 on a front side ofwafer 200 after the step ofphotolithography 120 shown inFIG. 1 , in accordance with an exemplary embodiment of the present invention. After the step ofphotolithography 120,wafer 200 has exposure patterns includingwafer ID 410 and chip feature 620 on the front side.FIG. 6 also shows remainingphotoresist 630 on the front side ofwafer 200. As depicted,wafer ID 410 and chip features 620 may be patterned into the same photoresist. Though the process is discussed herein with reference to patterning a photoresist for subsequent etching steps, a person of ordinary skill in the art will recognize that any etch mask may be used, including a hard mask such as titanium nitride, silicon nitride, silicon dioxide, silicon carbide, silicon carbide nitride and/or combinations of the preceding. -
FIG. 7 is a diagram illustrating a sectional view ofwafer 200 with etchedwafer ID 710 on a front side after the step ofreactive ion etching 130 shown inFIG. 1 , in accordance with an exemplary embodiment of the present invention. Through the step ofreactive ion etching 130,wafer ID 410 andchip feature 620 are etched intowafer 200, preferably at the same time.Wafer ID 410 is engraved as etchedwafer ID 710 on the front side ofwafer 200. Though the etch process is preferably an anisotropic RIE, in other embodiments, other anisotropic etching methods (ion beam etching, plasma etching, laser ablation, etc.), or isotropic etching methods (wet chemical etch, etc.) may be used. -
FIG. 8 is a diagram illustrating a sectional view ofwafer 200 with metal-filledwafer ID 810 on a front side after the step ofmetallization 140 shown inFIG. 1 , in accordance with an exemplary embodiment of the present invention. Through the step ofmetallization 140, etchedwafer ID 710 shown inFIG. 7 is filled with a metal, and metal-filledwafer ID 810 is formed on the front side ofwafer 200;chip feature 620 on the front side shown inFIG. 6 is filled with a metal, and metal-filledchip feature 820 is formed on the front side ofwafer 200. It should be noted that placing a back side wafer ID on a front side of a wafer can also be performed at the last metal level which is commonly aluminum. This would form the wafer ID at the upper portion of the wafer structure. Since aluminum feature fabrication uses a subtractive etch instead of a damascene process, in such an embodiment, the aluminum may not be initially embedded in the insulator when formed. This process is well known and may be apparent to a person skilled in the art. -
FIG. 9 is a diagram illustrating a sectional view of through-silicon-via (TSV)wafer 900 with metal-filledwafer ID 910, in accordance with an exemplary embodiment of the present invention.FIG. 9 shows metal-filled through-silicon-vias 940 on through-silicon-via (TSV)wafer 900 which hasfront side 920 and backside 930. The sectional view inFIG. 9 shows that metal-filledwafer ID 910 is visible from bothfront side 920 and backside 930. - An image of a back-side wafer ID of
TSV wafer 900 is placed onfront side 920, so that metal-filledwafer ID 910 can be read optically fromfront side 920, for trackingwafer 900 during processes of manufacturing the semiconductor devices. Alternatively, a mirrored image of a back-side wafer ID ofTSV wafer 900 is placed onfront side 920, so that metal-filledwafer ID 910 can be read fromback side 930. - Based on the foregoing, a method has been disclosed for placing a wafer ID of a back side on a front side of a wafer. However, numerous modifications and substitutions can be made without deviating from the sprit and scope of the present invention. Therefore, the present invention has been disclosed by way of examples and not limitation.
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US10020264B2 (en) | 2015-04-28 | 2018-07-10 | Infineon Technologies Ag | Integrated circuit substrate and method for manufacturing the same |
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KR900008384B1 (en) | 1986-05-20 | 1990-11-17 | 후지쓰 가부시끼가이샤 | Method for identifying semiconductor wafer with bar code pattern and method for manufacturing seniconductor device |
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US5877064A (en) | 1997-07-15 | 1999-03-02 | Taiwan Semiconductor Manufacturing Co.Ltd | Method for marking a wafer |
US6268641B1 (en) | 1998-03-30 | 2001-07-31 | Kabushiki Kaisha Toshiba | Semiconductor wafer having identification indication and method of manufacturing the same |
US6312876B1 (en) * | 1999-07-08 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Method for placing identifying mark on semiconductor wafer |
US6420792B1 (en) | 1999-09-24 | 2002-07-16 | Texas Instruments Incorporated | Semiconductor wafer edge marking |
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