US20140206124A1 - Pressure sensor and method of packaging same - Google Patents
Pressure sensor and method of packaging same Download PDFInfo
- Publication number
- US20140206124A1 US20140206124A1 US14/219,011 US201414219011A US2014206124A1 US 20140206124 A1 US20140206124 A1 US 20140206124A1 US 201414219011 A US201414219011 A US 201414219011A US 2014206124 A1 US2014206124 A1 US 2014206124A1
- Authority
- US
- United States
- Prior art keywords
- die
- pressure sensor
- lead frame
- lead
- sensor die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
-
- H01L41/25—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- Another way of electrically connecting the pressure sensor die 18 and the second die 20 to the lead frame 12 is to connect bond pads of the pressure sensor die 18 and the second die 20 to the lead fingers 16 with flip-chip bumps (not shown) attached to an underside of each of the pressure sensor die 18 and the second die 20 .
- the flip-chip bumps may include solder bumps, gold balls, molded studs, or combinations thereof.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
- The present invention relates generally to pressure sensor packaging, and more particularly to a method of assembling quad flat no-lead (QFN) pressure sensor packages.
- Pressure sensors and pressure sensor packages are well known and come in a variety of sizes and configurations. Pressure sensor dies typically have a thin differential pressure-sensing membrane that is susceptible to mechanical damage during handling and packaging. For this reason, these sensor dies are typically mounted in pre-molded packages and then sealed in the packages using a separate cover or lid.
- One way of packaging the pressure sensor dies is mounting the dies to a premolded lead frame and encapsulating the die with a mold compound. However, dies such as piezo resistive transducer (PRT), parameterized layout cell (Pcell) and Gyro do not allow full encapsulation because that would impede their functionality. As a result, a metal lid or cap must be placed on a mold wall to protect the dies from the outside environment. In addition, pre-molded lead frames are relatively expensive, making the overall packaging costs unattractive.
- Accordingly, it would be advantageous to be able to efficiently package pressure sensor dies in which the risk of environmental damage to the pressure sensor die is reduced or eliminated while reducing the overall packaging costs.
- The present invention is illustrated by way of example and is not limited by the accompanying figures, in which like references indicate similar elements. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the thicknesses of layers and regions may be exaggerated for clarity.
-
FIG. 1A is a cross-sectional view of a pressure sensor package in accordance with one embodiment of the present invention; -
FIG. 1B is a top view of a quad flat no-lead (QFN) pressure sensor package in accordance with one embodiment of the present invention; -
FIG. 2 is a side cross-sectional view showing a lead frame with an adhesive tape attached to the lead frame; -
FIG. 3 illustrates a step of attaching a pressure sensor die and a second die to the lead frame; -
FIG. 4 illustrates a step of electrically connecting the pressure sensor die and the second die to the lead frame; -
FIG. 5 illustrates a step of dispensing an encapsulating material onto the lead frame; -
FIG. 6 illustrates a step of dispensing a gel on respective top surfaces of the pressure sensor die and the second die; -
FIG. 7 is a side cross-sectional view showing a lid attached to the lead frame; -
FIG. 8 illustrates a step of curing the encapsulating material and the gel dispensed on the lead frame; and -
FIG. 9 illustrates a step of separating an array of packaged pressure sensor dies into individual packaged pressure sensor dies; and -
FIG. 10 is a perspective view of an exemplary configuration of the lid employed in the pressure sensor package ofFIG. 9 . - Detailed illustrative embodiments of the present invention are disclosed herein. However, specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments of the present invention. The present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein. Further, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. As used herein, the singular forms “a,” “an,” and “the,” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
- It further will be understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” specify the presence of stated features, steps, or components, but do not preclude the presence or addition of one or more other features, steps, or components. It also should be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
- In one embodiment, the present invention provides a method of packaging a pressure sensor die. The method includes providing a lead frame having at least one die pad and a plurality of lead fingers. A tape is attached to a first side of the lead frame and a pressure sensor die is attached to the at least one die pad on a second side of the lead frame and bond pads of the pressure sensor die are electrically connected to the lead fingers of the lead frame. An encapsulating material is dispensed onto the second side of the lead frame. The encapsulating material covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the pressure sensor die such that gel covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame such that the lid covers the pressure sensor die and the gel thereon. The encapsulating material and the gel are then cured.
- In another embodiment, the present invention is a packaged pressure sensor die formed in accordance with the above-described method.
- Referring now to
FIG. 1A , a cross-sectional view of a packaged pressure sensor die 10 is shown. The packaged pressure sensor die 10 includes alead frame 12 with at least onedie pad 14 and a plurality oflead fingers 16 that surround the at least onedie pad 14. Thelead frame 12 may be formed of copper, an alloy of copper, a copper plated iron/nickel alloy, plated aluminum, or the like. - A pressure sensor die 18 is attached to the
die pad 14 and is electrically coupled to thelead fingers 16. In this exemplary embodiment of the invention, the pressure sensor die 18 includes a piezo resistive transducer (PRT) die. The pressure sensor die 18 may be attached to thelead frame 12 using a die attach adhesive. The pressure sensor die 18 and thelead frame 12 are well known components of pressure sensors and thus detailed descriptions and possible alternative embodiments thereof are not necessary for a complete understanding of the present invention. - In the illustrated embodiment of the invention, a
second die 20 is attached to thedie pad 14 and is electrically coupled to thelead fingers 16. Alternately, thesecond die 20 may be attached to a separate die pad (not shown) of the lead frame. In one exemplary embodiment of the invention, thesecond die 20 includes an integration circuit such as a controller. - In this exemplary embodiment of the invention, the pressure sensor die 18 and the
second die 20 are attached and electrically coupled to thelead fingers 16 of thelead frame 12 withwires 22. Thewires 22 are bonded to pads on respectiveactive surfaces second die 20 and to corresponding contact pads on thelead frame 12 using a well known wire bonding process and known wire bonding equipment. - Another way of electrically connecting the pressure sensor die 18 and the
second die 20 to thelead frame 12 is to connect bond pads of the pressure sensor die 18 and thesecond die 20 to thelead fingers 16 with flip-chip bumps (not shown) attached to an underside of each of the pressure sensor die 18 and thesecond die 20. The flip-chip bumps may include solder bumps, gold balls, molded studs, or combinations thereof. - A glob
top encapsulating material 28 is deposited onto a top surface of thelead frame 12 and withingaps 30 between thedie pad 14 and thelead fingers 16. The globtop encapsulating material 28 covers thelead fingers 16 and theelectrical connections 22 thereto, i.e., the wire bonds. - In this exemplary embodiment, the glob top encapsulating
material 28 includes epoxy. A measured volume of the globtop encapsulating material 28 is dispensed over the top surface of thelead frame 12 using known dispensing equipment such as a dispensing nozzle or needle connected to a reservoir of the encapsulatingmaterial 28. - A
gel 32 such as a silicon-based gel is dispensed onto thetop surfaces second die 20. Thegel 32 covers the die bond pads and theelectrical connections 22 thereto. - The packaged pressure sensor die 10 includes a
lid 34 that covers the two dies 18, 20, thegel 32, and the sides of thelid 34 and penetrates the globtop encapsulating material 28 and contacts thelead frame 12. Thelid 34 may include a footed metal lid. In this exemplary embodiment of the invention, thelead frame 12 includes tie bars 36 (FIG. 1B ) that extend outwardly from thedie pad 14. Thelid 34 contacts the tie bars 36, but is electrically isolated from thelead fingers 16. Thelid 34 may be attached to thelead frame 12 with a lid attach adhesive like non-conductive epoxy, other suitable attaching mechanisms, or simply held in place by the encapsulatingmaterial 28. Although the outer sides of thelid 34 as shown inFIG. 1A are not flush with the outer sides of thelead frame 12, it should be understood by those of skill in the art that they could be. However, if the encapsulatingmaterial 28 is used to maintain thelid 34 in place then it is preferred to that thelid 34 is aligned as shown inFIG. 1A . The example configuration of thepressure sensor package 10 ofFIG. 1A may be assembled in a flat no-lead package. - Referring now to
FIG. 1B , a top view of a quad flat no-lead (QFN)sensor package 40 is shown. As illustrated, the encapsulatingmaterial 28 covers thelead fingers 16 and theelectrical connections 22 thereto. Thegel 32 covers the dies 18 and 20 along with the corresponding die bond pads and the electrical connections thereto. - As will be appreciated by one skilled in the art, the pressure sensor die 18 and the
second die 20 and the electrical connections are protected from being damaged due to environmental influences in the illustratedpackage 40 by theencapsulation material 28 and thegel 32. This design does not require a premolded QFN leadframe. -
FIG. 2 is a side cross-sectional view showing alead frame 12 with anadhesive tape 50 attached to afirst side 52 of thelead frame 12. As illustrated, thelead frame 12 includes adie pad 14 and leadfingers 16. Thelead frame 12 may be formed of copper, an alloy of copper, a copper plated iron/nickel alloy, plated aluminum, or the like. - A wafer may be processed to form the
lead frame 12 with thedie pad 14 and thelead fingers 16 by wafer mounting and wafer sawing processes, as are known in the art. -
FIG. 3 is an illustration of a step of attaching the pressure sensor die 18 and thesecond die 20 to asecond side 54 of thelead frame 12. In this exemplary embodiment of the present invention, the pressure sensor die 18 and thesecond die 20 are attached to thedie pad 14. Alternately, the pressure sensor die 18 and thesecond die 20 may be attached to separate die pads adjacent to each other on thelead frame 12. The pressure sensor die 18 and thesecond die 20 are attached to respective diepads 14 of thelead frame 12 with a die attach adhesive such as die-bonding epoxy. -
FIG. 4 shows the step of electrically connecting the pressure sensor dies 18 and thesecond die 20 to thelead frame 12. In this exemplary embodiment of the invention, bond pads of the pressure sensor die 18 and thesecond die 20 are electrically connected to thelead fingers 16 of thelead frame 12 with thewires 22 using a well known wire bonding process and known wire bonding equipment. - Another way of connecting the pressure sensor die 18 and the
second die 20 to thelead frame 12 is through flip-chip bumps (not shown) attached to an underside of the pressure sensor die 18 and thesecond die 20. The flip-chip bumps may include solder bumps, gold balls, molded studs, or combinations thereof. The bumps may be formed or placed on the pressure sensor die 18 and thesecond die 20 using known techniques such as evaporation, electroplating, printing, jetting, stud bumping and direct placement. The pressure sensor die 18 and thesecond die 20 are flipped and the bumps are aligned with contact pads (not shown) of thelead fingers 16. -
FIG. 5 shows the step of dispensing an encapsulatingmaterial 28 such as epoxy onto thesecond side 54 of thelead frame 12. The encapsulatingmaterial 28 covers thelead fingers 16 and parts of thewires 22 proximate thelead fingers 16. In one embodiment of the present invention, the encapsulatingmaterial 28 is deposited on thelead frame 12 with a well known glob top dispensing process using known dispensing equipment. The deposition of the encapsulatingmaterial 28 is performed such that the encapsulatingmaterial 28 substantially covers thelead fingers 16 andgaps 30 between the die pad and thelead fingers 16. -
FIG. 6 shows the step of dispensing agel 32 ontop surfaces second die 20. Thegel 32 such as a silicon-based gel may be dispensed on the pressure sensor die 18 and thesecond die 20 to cover the die bond pads and parts of thewires 22 proximate to the die bond pads. Thegel 32 may be dispensed with a nozzle of a conventional dispensing machine, as is known in the art. -
FIG. 7 is a side cross-sectional view showing alid 34 attached to thelead frame 12. Thelid 34 covers the pressure sensor die 18 and thesecond die 20 and thegel 32 thereon. In this exemplary embodiment of the present invention, edges of thelid 34 penetrate and are embedded within the encapsulatingmaterial 28. In one embodiment of the present invention, thelead frame 12 includes tie bars that extend outwardly from corners of thedie pad 14 and thelid 34 includes legs that contact the tie bars and side edges that are isolated from thelead fingers 16. - The
lid 34 facilitates grounding to the die flag and allows more encapsulating material to hold the wire leads 22 together. The encapsulatingmaterial 28 and thegel 30 are subsequently cured in a conventional oven, as illustrated inFIG. 8 to form an array of packaged pressure sensor dies. - At this point in the process, the
tape 50 is removed from thelead frame 12, as shown inFIG. 9 .FIG. 9 shows individual sensor packages 10 being separated from each other by a singulation process. Singulation processes are well known and may include cutting with a saw or a laser. -
FIG. 10 is a perspective view of an exemplary configuration of alid 60 that may be employed in thepressure sensor package 10 ofFIG. 9 . Thelid 60 includeslegs 62 that are embedded within the encapsulatingmaterial 28 and contact the tie bars 36 (seeFIG. 1B ) of thedie pad 14. In this exemplary embodiment, thelid 60 includes cut-outs 64 along thesides 66 such that thesides 66 of thelid 60 penetrate the encapsulatingmaterial 28 without contacting thelead fingers 16. As will be appreciated by those skilled in the art, a variety of other configurations for thelid 34 may be envisaged. - The present invention, as described above, allows for packaging a pressure sensor die without requiring premolded lead frames to package the die. A simple deposition technique such as glob top dispensing process is employed to dispense an encapsulating material to cover the lead fingers of the lead frame with the electrical connections thereto. A gel is dispensed to cover the die bond pads and the electrical connections thereto. Subsequently, the lid is attached to the package to cover the die, bond wires and the gel without the need of a premolded lead frame, which requires a metal lid to be placed on a mold wall to protect the pressure sensor dies.
- Thus, the present invention provides a method of packaging a pressure sensor die such as high density QFN packages for automotive applications that does not require a premolded lead frame for facilitating lid attachment thereby reducing manufacturing costs for such packages.
- By now it should be appreciated that there has been provided an improved pressure sensor package and a method of forming the improved pressure sensor package. Circuit details are not disclosed because knowledge thereof is not required for a complete understanding of the invention. Although the invention has been described using relative terms such as “front,” “back,” “top,” “bottom,” “over,” “under” and the like in the description and in the claims, such terms are used for descriptive purposes and not necessarily for describing permanent relative positions. It is understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein.
- Unless stated otherwise, terms such as “first” and “second” are used to arbitrarily distinguish between the elements such terms describe. Thus, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. Further, the use of introductory phrases such as “at least one” and “one or more” in the claims should not be construed to imply that the introduction of another claim element by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim element to inventions containing only one such element, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an.” The same holds true for the use of definite articles.
- Although the invention is described herein with reference to specific embodiments, various modifications and changes can be made without departing from the scope of the present invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present invention. Any benefits, advantages, or solutions to problems that are described herein with regard to specific embodiments are not intended to be construed as a critical, required, or essential feature or element of any or all the claims.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/219,011 US8802474B1 (en) | 2011-01-05 | 2014-03-19 | Pressure sensor and method of packaging same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110000656.XA CN102589753B (en) | 2011-01-05 | 2011-01-05 | Pressure sensor and method for packing thereof |
US13/293,119 US8716846B2 (en) | 2011-01-05 | 2011-11-10 | Pressure sensor and method of packaging same |
US14/219,011 US8802474B1 (en) | 2011-01-05 | 2014-03-19 | Pressure sensor and method of packaging same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/293,119 Division US8716846B2 (en) | 2011-01-05 | 2011-11-10 | Pressure sensor and method of packaging same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140206124A1 true US20140206124A1 (en) | 2014-07-24 |
US8802474B1 US8802474B1 (en) | 2014-08-12 |
Family
ID=46380017
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/293,119 Active 2031-11-13 US8716846B2 (en) | 2011-01-05 | 2011-11-10 | Pressure sensor and method of packaging same |
US14/219,011 Active US8802474B1 (en) | 2011-01-05 | 2014-03-19 | Pressure sensor and method of packaging same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/293,119 Active 2031-11-13 US8716846B2 (en) | 2011-01-05 | 2011-11-10 | Pressure sensor and method of packaging same |
Country Status (2)
Country | Link |
---|---|
US (2) | US8716846B2 (en) |
CN (1) | CN102589753B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9142502B2 (en) | 2011-08-31 | 2015-09-22 | Zhiwei Gong | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits |
US8916421B2 (en) * | 2011-08-31 | 2014-12-23 | Freescale Semiconductor, Inc. | Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits |
US8597983B2 (en) | 2011-11-18 | 2013-12-03 | Freescale Semiconductor, Inc. | Semiconductor device packaging having substrate with pre-encapsulation through via formation |
JP5956783B2 (en) * | 2012-03-02 | 2016-07-27 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
TW201503334A (en) * | 2013-07-08 | 2015-01-16 | Kingpaktechnology Inc | Two-stage packaging method of image sensors |
JP6317956B2 (en) * | 2014-03-05 | 2018-04-25 | 株式会社フジクラ | Pressure sensor and method of manufacturing pressure sensor |
US9297713B2 (en) | 2014-03-19 | 2016-03-29 | Freescale Semiconductor,Inc. | Pressure sensor device with through silicon via |
DE102014105861B4 (en) * | 2014-04-25 | 2015-11-05 | Infineon Technologies Ag | Sensor device and method for producing a sensor device |
US9362479B2 (en) | 2014-07-22 | 2016-06-07 | Freescale Semiconductor, Inc. | Package-in-package semiconductor sensor device |
CN105300593B (en) * | 2014-07-28 | 2018-12-28 | 恩智浦美国有限公司 | The semiconductor sensor arrangement of encapsulation with lid |
DE102014218702A1 (en) * | 2014-09-17 | 2016-03-17 | Continental Teves Ag & Co. Ohg | Sensor with heat dissipation surfaces on the leadframe |
WO2017033113A1 (en) | 2015-08-21 | 2017-03-02 | Acerta Pharma B.V. | Therapeutic combinations of a mek inhibitor and a btk inhibitor |
CN107290096A (en) | 2016-04-11 | 2017-10-24 | 飞思卡尔半导体公司 | Have chaffy pressure-sensing IC-components |
DE102016210940A1 (en) * | 2016-06-20 | 2017-12-21 | Robert Bosch Gmbh | Arrangement with a carrier and a housing body, and method for producing a device with a component |
US10190925B2 (en) * | 2016-07-18 | 2019-01-29 | Honeywell International Inc. | Low cost overmolded leadframe force sensor with multiple mounting positions |
JP6907585B2 (en) * | 2017-02-22 | 2021-07-21 | 富士電機株式会社 | Pressure sensor |
DE102018222781A1 (en) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Pressure sensor arrangement |
US11118990B2 (en) * | 2019-06-21 | 2021-09-14 | Honeywell International Inc. | Micro-molded fluid pressure sensor housing |
US11147978B2 (en) | 2019-10-30 | 2021-10-19 | Wyss Center For Bio And Neuro Engineering | Feedthrough protective cover |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010028072A1 (en) * | 1999-09-17 | 2001-10-11 | Takashi Aoki | Semiconductor pressure sensor device having sensor chip covered with protective member |
US6559379B2 (en) * | 1995-02-24 | 2003-05-06 | Novasensor, Inc. | Pressure sensor with transducer mounted on a metal base |
US20030154796A1 (en) * | 2002-02-21 | 2003-08-21 | Seiichiro Ishio | Pressure sensor |
US6696753B2 (en) * | 2002-05-17 | 2004-02-24 | Denso Corporation | Enhancement of wire bondability in semiconductor device package |
US20040238943A1 (en) * | 2002-11-07 | 2004-12-02 | Tetsuo Fujii | Dynamic quantity sensor |
US20050236644A1 (en) * | 2004-04-27 | 2005-10-27 | Greg Getten | Sensor packages and methods of making the same |
US20050279166A1 (en) * | 2004-06-18 | 2005-12-22 | Oki Electric Industry Co., Ltd. | Semiconductor acceleration sensor device and method for manufacturing the same |
US20070023873A1 (en) * | 2005-08-01 | 2007-02-01 | Park Sang B | Package structure having recession portion on the surface thereof and method of making the same |
US7273767B2 (en) * | 2004-12-31 | 2007-09-25 | Carsem (M) Sdn. Bhd. | Method of manufacturing a cavity package |
US20080128838A1 (en) * | 2006-08-25 | 2008-06-05 | Horst Theuss | Sensor module and method of manufacturing same |
US20100078796A1 (en) * | 2008-09-26 | 2010-04-01 | Stefan Paulus | Semiconductor Device |
US20100199777A1 (en) * | 2009-02-10 | 2010-08-12 | Hooper Stephen R | Exposed Pad Backside Pressure Sensor Package |
US20110260266A1 (en) * | 2010-04-27 | 2011-10-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and package process |
US20120139067A1 (en) * | 2010-12-06 | 2012-06-07 | Freescale Semiconductor, Inc | Pressure sensor and method of packaging same |
US20120306031A1 (en) * | 2011-05-31 | 2012-12-06 | Freescale Semiconductor, Inc. | Semiconductor sensor device and method of packaging same |
US8618620B2 (en) * | 2010-07-13 | 2013-12-31 | Infineon Technologies Ag | Pressure sensor package systems and methods |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5524423A (en) | 1978-08-10 | 1980-02-21 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
JPH0875580A (en) | 1994-09-06 | 1996-03-22 | Mitsubishi Electric Corp | Semiconductor pressure sensor |
EP0702221A3 (en) | 1994-09-14 | 1997-05-21 | Delco Electronics Corp | One-chip integrated sensor |
US5581226A (en) | 1994-11-02 | 1996-12-03 | Motorola, Inc. | High pressure sensor structure and method |
US5877093A (en) | 1995-10-27 | 1999-03-02 | Honeywell Inc. | Process for coating an integrated circuit device with a molten spray |
DE69706213T2 (en) | 1996-04-04 | 2002-05-16 | Ssi Technologies Inc | Pressure measuring device and method for its production |
US5831170A (en) | 1996-04-04 | 1998-11-03 | Ssi Technologies, Inc. | Pressure sensor package and method of making the same |
US5874679A (en) | 1996-04-04 | 1999-02-23 | Ssi Technologies, Inc. | Pressure sensor package and method of making the same |
US5692637A (en) | 1996-05-10 | 1997-12-02 | Delco Electronics Corporation | Vent cap for electronic package |
JPH10335374A (en) | 1997-06-04 | 1998-12-18 | Fujitsu Ltd | Semiconductor device and semiconductor device module |
US6238223B1 (en) | 1997-08-20 | 2001-05-29 | Micro Technology, Inc. | Method of depositing a thermoplastic polymer in semiconductor fabrication |
US6351996B1 (en) | 1998-11-12 | 2002-03-05 | Maxim Integrated Products, Inc. | Hermetic packaging for semiconductor pressure sensors |
US6266197B1 (en) | 1999-12-08 | 2001-07-24 | Amkor Technology, Inc. | Molded window array for image sensor packages |
US6401545B1 (en) | 2000-01-25 | 2002-06-11 | Motorola, Inc. | Micro electro-mechanical system sensor with selective encapsulation and method therefor |
KR100347706B1 (en) | 2000-08-09 | 2002-08-09 | 주식회사 코스타트반도체 | New molded package having a implantable circuits and manufacturing method thereof |
KR100717667B1 (en) | 2000-09-18 | 2007-05-11 | 신닛뽄세이테쯔 카부시키카이샤 | Bonding wire for semiconductor and method of manufacturing the bonding wire |
JP3948203B2 (en) | 2000-10-13 | 2007-07-25 | 日立電線株式会社 | Copper alloy wire, copper alloy stranded wire conductor, coaxial cable, and method for producing copper alloy wire |
DE10054013B4 (en) * | 2000-11-01 | 2007-06-21 | Robert Bosch Gmbh | Pressure sensor module |
JP3400427B2 (en) | 2000-11-28 | 2003-04-28 | 株式会社東芝 | Electronic component unit and printed wiring board device mounted with electronic component unit |
US6707168B1 (en) | 2001-05-04 | 2004-03-16 | Amkor Technology, Inc. | Shielded semiconductor package with single-sided substrate and method for making the same |
US20040245320A1 (en) | 2001-10-23 | 2004-12-09 | Mesato Fukagaya | Bonding wire |
US20050189621A1 (en) | 2002-12-02 | 2005-09-01 | Cheung Kin P. | Processes for hermetically packaging wafer level microscopic structures |
US6900531B2 (en) | 2002-10-25 | 2005-05-31 | Freescale Semiconductor, Inc. | Image sensor device |
US7014888B2 (en) | 2002-12-23 | 2006-03-21 | Freescale Semiconductor, Inc. | Method and structure for fabricating sensors with a sacrificial gel dome |
US6927482B1 (en) * | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
DE10352002A1 (en) * | 2003-11-07 | 2005-06-09 | Robert Bosch Gmbh | sensor module |
US7315077B2 (en) | 2003-11-13 | 2008-01-01 | Fairchild Korea Semiconductor, Ltd. | Molded leadless package having a partially exposed lead frame pad |
US20080050267A1 (en) | 2004-09-30 | 2008-02-28 | Hiroshi Murai | Au Alloy Bonding Wire |
CN100501956C (en) | 2004-11-26 | 2009-06-17 | 田中电子工业株式会社 | Au bonding wire for semiconductor device |
CN1865882A (en) * | 2005-05-20 | 2006-11-22 | 上海飞恩微电子有限公司 | Micromechanical pressure sensor and wafer-lever packaging method therefor |
DE102006001600B3 (en) | 2006-01-11 | 2007-08-02 | Infineon Technologies Ag | Semiconductor component with flip-chip contacts, has flip-chip contacts arranged on contact surfaces of upper metallization layer |
EP1975587A1 (en) | 2006-01-19 | 2008-10-01 | Fujikura Ltd. | Pressure sensor package and electronic part |
US7632698B2 (en) | 2006-05-16 | 2009-12-15 | Freescale Semiconductor, Inc. | Integrated circuit encapsulation and method therefor |
JP2008101917A (en) | 2006-10-17 | 2008-05-01 | Alps Electric Co Ltd | Package for pressure sensor |
US7705242B2 (en) | 2007-02-15 | 2010-04-27 | Advanced Technology Holdings Ltd. | Electrical conductor and core for an electrical conductor |
US7607355B2 (en) | 2007-02-16 | 2009-10-27 | Yamaha Corporation | Semiconductor device |
JP5116101B2 (en) | 2007-06-28 | 2013-01-09 | 新日鉄住金マテリアルズ株式会社 | Bonding wire for semiconductor mounting and manufacturing method thereof |
US8148808B2 (en) * | 2007-08-13 | 2012-04-03 | Lv Sensors, Inc. | Partitioning of electronic packages |
EP2096645B1 (en) | 2008-02-26 | 2010-09-29 | Nexans | Electrical conductor |
CN100587430C (en) * | 2008-05-13 | 2010-02-03 | 上海芯敏微系统技术有限公司 | Silicon piezoresistance type pressure transducer encapsulation structure based on substrates |
US7673519B1 (en) | 2008-08-29 | 2010-03-09 | Freescale Semiconductor, Inc. | Pressure sensor featuring offset cancellation and method of making |
US7886609B2 (en) | 2009-05-06 | 2011-02-15 | Freescale Semiconductor, Inc. | Pressure sensor package |
US8359927B2 (en) | 2009-08-12 | 2013-01-29 | Freescale Semiconductor, Inc. | Molded differential PRT pressure sensor |
-
2011
- 2011-01-05 CN CN201110000656.XA patent/CN102589753B/en active Active
- 2011-11-10 US US13/293,119 patent/US8716846B2/en active Active
-
2014
- 2014-03-19 US US14/219,011 patent/US8802474B1/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6559379B2 (en) * | 1995-02-24 | 2003-05-06 | Novasensor, Inc. | Pressure sensor with transducer mounted on a metal base |
US20010028072A1 (en) * | 1999-09-17 | 2001-10-11 | Takashi Aoki | Semiconductor pressure sensor device having sensor chip covered with protective member |
US20030154796A1 (en) * | 2002-02-21 | 2003-08-21 | Seiichiro Ishio | Pressure sensor |
US6696753B2 (en) * | 2002-05-17 | 2004-02-24 | Denso Corporation | Enhancement of wire bondability in semiconductor device package |
US20040238943A1 (en) * | 2002-11-07 | 2004-12-02 | Tetsuo Fujii | Dynamic quantity sensor |
US20050236644A1 (en) * | 2004-04-27 | 2005-10-27 | Greg Getten | Sensor packages and methods of making the same |
US20050279166A1 (en) * | 2004-06-18 | 2005-12-22 | Oki Electric Industry Co., Ltd. | Semiconductor acceleration sensor device and method for manufacturing the same |
US7273767B2 (en) * | 2004-12-31 | 2007-09-25 | Carsem (M) Sdn. Bhd. | Method of manufacturing a cavity package |
US20070023873A1 (en) * | 2005-08-01 | 2007-02-01 | Park Sang B | Package structure having recession portion on the surface thereof and method of making the same |
US20080128838A1 (en) * | 2006-08-25 | 2008-06-05 | Horst Theuss | Sensor module and method of manufacturing same |
US20100078796A1 (en) * | 2008-09-26 | 2010-04-01 | Stefan Paulus | Semiconductor Device |
US20100199777A1 (en) * | 2009-02-10 | 2010-08-12 | Hooper Stephen R | Exposed Pad Backside Pressure Sensor Package |
US20110260266A1 (en) * | 2010-04-27 | 2011-10-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and package process |
US8618620B2 (en) * | 2010-07-13 | 2013-12-31 | Infineon Technologies Ag | Pressure sensor package systems and methods |
US20120139067A1 (en) * | 2010-12-06 | 2012-06-07 | Freescale Semiconductor, Inc | Pressure sensor and method of packaging same |
US20120306031A1 (en) * | 2011-05-31 | 2012-12-06 | Freescale Semiconductor, Inc. | Semiconductor sensor device and method of packaging same |
Also Published As
Publication number | Publication date |
---|---|
US20120168884A1 (en) | 2012-07-05 |
US8802474B1 (en) | 2014-08-12 |
US8716846B2 (en) | 2014-05-06 |
CN102589753B (en) | 2016-05-04 |
CN102589753A (en) | 2012-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8802474B1 (en) | Pressure sensor and method of packaging same | |
US20120306031A1 (en) | Semiconductor sensor device and method of packaging same | |
US20120139067A1 (en) | Pressure sensor and method of packaging same | |
US8378435B2 (en) | Pressure sensor and method of assembling same | |
US8836101B2 (en) | Multi-chip semiconductor packages and assembly thereof | |
US10043721B2 (en) | Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame | |
US9029999B2 (en) | Semiconductor sensor device with footed lid | |
US20140374848A1 (en) | Semiconductor sensor device with metal lid | |
US20150069537A1 (en) | Package-on-package semiconductor sensor device | |
US8501517B1 (en) | Method of assembling pressure sensor device | |
US10109561B2 (en) | Semiconductor device having plated outer leads exposed from encapsulating resin | |
US8643158B2 (en) | Semiconductor package and lead frame therefor | |
US9297713B2 (en) | Pressure sensor device with through silicon via | |
US9362479B2 (en) | Package-in-package semiconductor sensor device | |
US9890034B2 (en) | Cavity type pressure sensor device | |
US10217698B2 (en) | Die attachment for packaged semiconductor device | |
US7642638B2 (en) | Inverted lead frame in substrate | |
US20150054099A1 (en) | Pressure sensor device and assembly method | |
US20150014793A1 (en) | Pressure sensor having down-set flag | |
EP3647755A1 (en) | Sensor device with flip-chip die and interposer | |
US20170081178A1 (en) | Semiconductor device package with seal structure | |
US20150014834A1 (en) | Hybrid lead frame and ball grid array package | |
US20130020689A1 (en) | Semiconductor device and method of packaging same | |
US9638596B2 (en) | Cavity-down pressure sensor device | |
CN111384044A (en) | Chip 3D packaging combination stacking structure and packaging method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YAO, JINZHONG;LO, WAI YEW;TAN, LAN CHU;AND OTHERS;SIGNING DATES FROM 20110906 TO 20110914;REEL/FRAME:032479/0477 |
|
AS | Assignment |
Owner name: CITIBANK, N.A., AS NOTES COLLATERAL AGENT, NEW YORK Free format text: SUPPLEMENT TO SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:032845/0442 Effective date: 20140502 Owner name: CITIBANK, N.A., AS NOTES COLLATERAL AGENT, NEW YORK Free format text: SUPPLEMENT TO SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:032845/0522 Effective date: 20140502 Owner name: CITIBANK, N.A., AS COLLATERAL AGENT, NEW YORK Free format text: SUPPLEMENT TO SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:032845/0497 Effective date: 20140502 Owner name: CITIBANK, N.A., AS NOTES COLLATERAL AGENT, NEW YOR Free format text: SUPPLEMENT TO SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:032845/0442 Effective date: 20140502 Owner name: CITIBANK, N.A., AS NOTES COLLATERAL AGENT, NEW YOR Free format text: SUPPLEMENT TO SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:032845/0522 Effective date: 20140502 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: FREESCALE SEMICONDUCTOR, INC., TEXAS Free format text: PATENT RELEASE;ASSIGNOR:CITIBANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:037357/0763 Effective date: 20151207 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS;ASSIGNOR:CITIBANK, N.A.;REEL/FRAME:037458/0479 Effective date: 20151207 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS;ASSIGNOR:CITIBANK, N.A.;REEL/FRAME:037458/0438 Effective date: 20151207 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:038017/0058 Effective date: 20160218 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPLICATION NUMBERS 12222918, 14185362, 14147598, 14185868 & 14196276 PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0479. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS;ASSIGNOR:CITIBANK, NA;REEL/FRAME:038665/0498 Effective date: 20151207 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBERS PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0438. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS;ASSIGNOR:CITIBANK, NA;REEL/FRAME:038665/0136 Effective date: 20151207 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: SUPPLEMENT TO THE SECURITY AGREEMENT;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:039138/0001 Effective date: 20160525 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:039361/0212 Effective date: 20160218 |
|
AS | Assignment |
Owner name: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC., NETHERLANDS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:040925/0001 Effective date: 20160912 Owner name: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC., NE Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:040925/0001 Effective date: 20160912 |
|
AS | Assignment |
Owner name: NXP B.V., NETHERLANDS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:040928/0001 Effective date: 20160622 |
|
AS | Assignment |
Owner name: NXP USA, INC., TEXAS Free format text: CHANGE OF NAME;ASSIGNOR:FREESCALE SEMICONDUCTOR, INC.;REEL/FRAME:040632/0001 Effective date: 20161107 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:042762/0145 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:042985/0001 Effective date: 20160218 |
|
AS | Assignment |
Owner name: NXP USA, INC., TEXAS Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME;ASSIGNOR:FREESCALE SEMICONDUCTOR INC.;REEL/FRAME:044209/0047 Effective date: 20161107 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551) Year of fee payment: 4 |
|
AS | Assignment |
Owner name: NXP B.V., NETHERLANDS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:050745/0001 Effective date: 20190903 Owner name: NXP B.V., NETHERLANDS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:050744/0097 Effective date: 20190903 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051145/0184 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051029/0387 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051029/0001 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051030/0001 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051029/0001 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051029/0387 Effective date: 20160218 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., MARYLAND Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT;ASSIGNOR:NXP B.V.;REEL/FRAME:051145/0184 Effective date: 20160218 |
|
AS | Assignment |
Owner name: NXP B.V., NETHERLANDS Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVEAPPLICATION 11759915 AND REPLACE IT WITH APPLICATION11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITYINTEREST;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:052915/0001 Effective date: 20160622 |
|
AS | Assignment |
Owner name: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC., NETHERLANDS Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVEAPPLICATION 11759915 AND REPLACE IT WITH APPLICATION11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITYINTEREST;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC.;REEL/FRAME:052917/0001 Effective date: 20160912 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 8 |