US20140133942A1 - Substrate transfer system and substrate processing system - Google Patents
Substrate transfer system and substrate processing system Download PDFInfo
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- US20140133942A1 US20140133942A1 US14/073,871 US201314073871A US2014133942A1 US 20140133942 A1 US20140133942 A1 US 20140133942A1 US 201314073871 A US201314073871 A US 201314073871A US 2014133942 A1 US2014133942 A1 US 2014133942A1
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- substrate transfer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Definitions
- the present invention relates to a substrate transfer system and a substrate processing system.
- Japanese Unexamined Patent Application Publication No. 2009-136981 discloses a substrate transfer system including a substrate transfer robot that transfers a substrate to a different position.
- the substrate transfer system disclosed in Japanese Unexamined Patent Application Publication No. 2009-136981 includes a robot (substrate transfer robot) that includes a lower arm, an upper arm, and a hand.
- the lower arm is rotatable on a horizontal surface relative to a base.
- the upper arm is rotatable on the horizontal surface relative to the lower arm.
- the hand is rotatable on the horizontal surface relative to the upper arm.
- the robot of the substrate transfer system is disposed in a robot installment area defined between a cassette apparatus (first apparatus) and a processing apparatus (second apparatus).
- the cassette apparatus accommodates substrates, and the processing apparatus processes a substrate.
- a substrate transfer system includes a substrate transfer robot disposed in a robot installment area defined between a first apparatus and a second apparatus including an opening.
- the substrate transfer robot includes a hand and an arm.
- the hand is configured to support a substrate.
- the arm is configured to move the hand.
- the arm and the hand supporting the substrate are configured to rotate on a horizontal surface within a minimal rotation area of the substrate transfer robot such that an outer periphery of the minimal rotation area overlaps an inside of the second apparatus through the opening so as to transfer the substrate from a first position in the first apparatus to a second position in the second apparatus through the opening.
- a substrate processing system includes a first apparatus, a second apparatus including an opening, and a substrate transfer robot.
- the substrate transfer robot is disposed in a robot installment area defined between the first apparatus and the second apparatus.
- the substrate transfer robot includes a hand and an arm.
- the hand is configured to support a substrate.
- the arm is configured to move the hand.
- the arm and the hand supporting the substrate are configured to rotate on a horizontal surface within a minimal rotation area of the substrate transfer robot such that an outer periphery of the minimal rotation area overlaps an inside of the second apparatus through the opening so as to transfer the substrate from a first position in the first apparatus to a second position in the second apparatus through the opening.
- FIG. 1 is a plan view of a substrate processing system according to a first embodiment, illustrating a general arrangement of the substrate processing system;
- FIG. 2 is a schematic side view of the substrate processing system according to the first embodiment, illustrating a general arrangement of the substrate processing system;
- FIG. 3 is a perspective view of a substrate transfer robot of the substrate processing system according to the first embodiment
- FIG. 4 is a plan view of the substrate processing system according to the first embodiment, illustrating a minimal rotation area of the substrate transfer robot;
- FIG. 5 illustrates a procedure of an operation by the substrate processing system according to the first embodiment in transferring a substrate placed at a position far from the substrate transfer robot;
- FIG. 6 illustrates a procedure of an operation by the substrate processing system according to the first embodiment in transferring a substrate placed at a position close to the substrate transfer robot;
- FIG. 7 is a schematic side view of a substrate processing system according to a second embodiment, illustrating a general arrangement of the substrate processing system
- FIG. 8 is a schematic side view of a substrate processing system according to a third embodiment, illustrating a general arrangement of the substrate processing system
- FIG. 9 is a schematic side view of a substrate processing system according to a fourth embodiment, illustrating a general arrangement of the substrate processing system.
- FIG. 10 is a perspective view of a modification of the substrate transfer robot of the substrate processing system according to any of the first to fourth embodiments.
- FIGS. 1 to 6 a configuration of a substrate processing system 100 according to the first embodiment will be described.
- the substrate processing system 100 includes a substrate transfer system 10 and a processing apparatus 20 .
- the substrate transfer system 10 transfers a substrate 110 .
- the substrate transfer system 10 transfers the substrate 110 to the processing apparatus 20 .
- the processing apparatus 20 processes the transferred substrate 110 in a manufacturing process of a semiconductor device.
- the substrate transfer system 10 includes a substrate storage apparatus 11 and a substrate transfer robot 12 .
- the substrate storage apparatus 11 accommodates substrates 110 , and the substrate transfer robot 12 transfers the substrate 110 between the substrate storage apparatus 11 and the processing apparatus 20 .
- the outer shape of the substrate transfer system 10 is a combination (indicated by the broken line in FIG. 1 ) of an installment area of the substrate storage apparatus 11 and a robot installment area 13 , which is where the substrate transfer robot 12 is disposed, as described later.
- the robot installment area 13 is defined between a front wall 111 , described later, of the substrate storage apparatus 11 and a rear wall 201 of the processing apparatus 20 .
- the substrate transfer system 10 also includes an FFU (Fan Filter Unit), not shown, to keep the air inside the robot installment area 13 clean.
- the substrate storage apparatus 11 is an example of the “first apparatus”
- the processing apparatus 20 is an example of the “second apparatus”.
- the substrate storage apparatus 11 corresponds to the FOUP (Front Open Unified Pod) of the SEMI (Semiconductor Equipment and Materials International) standard. As shown in FIGS. 1 and 2 , the front wall 111 of the substrate storage apparatus 11 is disposed at the side (the X1 direction side) of the substrate transfer robot 12 and the processing apparatus 20 . The front wall 111 has a perpendicular surface.
- the substrate storage apparatus 11 includes four cassettes 11 a to 11 d disposed at different positions in plan view. The four cassettes 11 a to 11 d are aligned next to each other in the Y direction. As shown in FIG. 2 , the four cassettes 11 a to 11 d are disposed on a cassette support 112 .
- the four cassettes 11 a to 11 d are each capable of accommodating a plurality of substrates 110 at different height positions. Specifically, each of the four cassettes 11 a to 11 d has 25 levels of positions in the vertical direction, accommodating a stack of up to 25 substrates 110 .
- the front wall 111 is an example of the “first wall”, and each of the positions in the four cassettes 11 a to 11 d is an example of the “first position”.
- the substrate transfer robot 12 is a multi-articular robot.
- the substrate transfer robot 12 includes a base 121 , a support shaft 122 , a first arm 123 , a second arm 124 , a hand 125 , and a controller 126 .
- the controller 126 controls these elements of the substrate transfer robot 12 .
- the first arm 123 and the second arm 124 are examples of the “arm”.
- the support shaft 122 is supported by the base 121 and is elongate in the direction perpendicular to the upper surface of the base 121 . At an upper end, the support shaft 122 is coupled to one end of the first arm 123 .
- the first arm 123 is rotatable on a horizontal surface about the support shaft 122 as the center of rotation. At another end, the first arm 123 is coupled to one end of the second arm 124 .
- the second arm 124 is rotatable on the horizontal surface about, as the center of rotation, the one end of the second arm 124 coupled to the first arm 123 . At another end, the second arm 124 is coupled to the hand 125 .
- the hand 125 is rotatable on the horizontal surface about, as the center of rotation, the portion of the hand 125 coupled to the second arm 124 . Also the hand 125 is capable of supporting the substrate 110 from below the substrate 110 .
- the first arm 123 and the second arm 124 have link lengths approximately equal to one another. Specifically, as shown in FIG. 1 , the first arm 123 has a link length R1 from a center C1 of rotation of the first arm 123 to a center C2 of rotation of the second arm 124 , while the second arm 124 has a link length R2 from the center C2 of rotation of the second arm 124 to a center C3 of rotation of the hand 125 .
- the link length R1 and the link length R2 are approximately equal to one another. This eliminates or minimizes complexity of the operation control of the elements involved in transfer of the substrate 110 , as compared with the case where the link lengths of the first arm 123 and the second arm 124 are different from one another.
- the substrate transfer robot 12 moves the support shaft 122 up and down to integrally move the first arm 123 , the second arm 124 , and the hand 125 up and down. This enables the substrate transfer robot 12 to feed and take the substrate 110 to and from all the different height positions in the cassettes 11 a to 11 d.
- the controller 126 is taught in advance operations of the elements for transfer of the substrate 110 on the hand 125 . Specifically, the controller 126 is taught in advance operations of the elements associated with the feeding and taking operations of the substrate 110 to and from the four cassettes 11 a to 11 d . This ensures that the substrate transfer robot 12 performs a transfer operation with respect to the substrate 110 according to an operation procedure, described later.
- the rear wall 201 of the processing apparatus 20 is disposed at the side (the X2 direction side) of the substrate transfer robot 12 and the substrate storage apparatus 11 .
- the rear wall 201 has a perpendicular surface, and is approximately parallel to and opposed to the front wall 111 .
- an approximately rectangular opening 202 is disposed on the rear wall 201 .
- the opening 202 has an opening width B in the horizontal direction (Y direction).
- the opening width B is large enough to allow the substrate 110 to be inserted through the opening 202 .
- the opening 202 has an opening length H1.
- the opening length H1 is larger in the height direction (Z direction) than the movable range in the height direction of the first arm 123 , the second arm 124 , and the hand 125 of the substrate transfer robot 12 .
- the opening 202 is open from a first height position through to a second height position.
- the first height position corresponds to a position at which the substrate transfer robot 12 has access to a lowest position among the 25 levels of positions in the cassettes 11 a to 11 d .
- the second height position corresponds to another position at which the substrate transfer robot 12 has access to a highest position among the 25 levels of positions in the cassettes 11 a to 11 d .
- the rear wall 201 is an example of the “second wall”.
- the substrate transfer robot 12 is capable of transferring a substrate 110 in the substrate storage apparatus 11 to the placement position in the processing apparatus 20 through the opening 202 , while at the same time being capable of transferring a substrate 110 in the processing apparatus 20 to a predetermined position in the substrate storage apparatus 11 .
- the substrate transfer robot 12 has a minimal rotation area having an outer periphery that overlaps the inside of the processing apparatus 20 through the opening 202 .
- the substrate transfer robot 12 has a minimal rotation radius R, and the minimal rotation radius R is larger than the distance between the center C1 of rotation of the first arm 123 and the rear wall 201 of the processing apparatus 20 . As shown in FIG.
- the minimal rotation area of the substrate transfer robot 12 is an area necessary when the substrate transfer robot 12 takes a normal posture in which the first arm 123 , the second arm 124 , and the hand 125 supporting the substrate 110 are superimposed over each other and when the substrate transfer robot 12 in the normal posture rotates the first arm 123 on the horizontal surface.
- the placement position in the processing apparatus 20 is an example of the “second position”.
- a first distance between the center C1 of rotation of the first arm 123 and the distal end of the first arm 123 , a second distance between the center C1 of rotation of the first arm 123 and the distal end of the second arm 124 , and a third distance between the center C1 of rotation of the first arm 123 and the distal end of the substrate 110 supported by the hand 125 are approximately equal to each other.
- Each of the first to third distances is equal to the minimal rotation radius R of the substrate transfer robot 12 and larger than the distance between the center C1 of rotation of the first arm 123 and the rear wall 201 .
- the center C1 of rotation of the first arm 123 is disposed at a position that faces the opening 202 .
- the center C1 of rotation of the first arm 123 is disposed on a line L1 extending from the center of the substrate 110 placed at the placement position in the processing apparatus 20 to an approximate center of the opening 202 .
- the center C1 of rotation of the first arm 123 is disposed at a position that faces the front wall 111 of the substrate storage apparatus 11 .
- the center C1 of rotation of the first arm 123 is disposed at a position that faces an approximate center in the Y direction of the four cassettes 11 a to 11 d of the substrate storage apparatus 11 .
- the center C1 of rotation of the first arm 123 is closer to the front wall 111 of the substrate storage apparatus 11 than to the rear wall 201 of the processing apparatus 20 .
- a predetermined regulation width is included between the substrate transfer robot 12 and the substrate storage apparatus 11 .
- the predetermined regulation width is determined depending on an opener (opening and closing mechanism), not shown, that opens and closes the doors of the cassettes 11 a to 11 d .
- a distance D (see FIG. 1 ) between the substrate storage apparatus 11 and the processing apparatus 20 is larger than a combination of the regulation width of the opener and the distance between the base end of the hand 125 and the distal end of the substrate 110 supported by the hand 125 .
- the substrate transfer robot 12 moves the hand 125 to a position under a substrate 110 in the cassette 11 a so as to support the substrate 110 . Then, the substrate transfer robot 12 linearly moves the hand 125 toward the processing apparatus 20 (in the X1 direction), thereby pulling the substrate 110 out of the cassette 11 a , and takes a stand-by posture.
- the substrate transfer robot 12 rotates the hand 125 alone to put a center 110 a of the substrate 110 onto an imaginary line L2, thus taking a first intermediate posture.
- the imaginary line L2 extends in a direction (Y direction) approximately parallel to the rear wall 201 of the processing apparatus 20 in plan view, and is at an approximately equal distance from the front wall 111 and the rear wall 201 .
- the substrate transfer robot 12 does not protrude into the processing apparatus 20 .
- the substrate transfer robot 12 changes from the first intermediate posture into a second intermediate posture. Specifically, the substrate transfer robot 12 transfers the substrate 110 with the center 110 a of the substrate 110 moving along the imaginary line L2, thereby folding the first arm 123 and the second arm 124 together and changing into the second intermediate posture.
- the substrate transfer robot 12 makes the ends of the first arm 123 and the second arm 124 protrude into the processing apparatus 20 through the opening 202 .
- the substrate transfer robot 12 rotates the hand 125 so as to fold the first arm 123 , the second arm 124 , and the hand 125 together, thereby changing from the second intermediate posture into the normal posture.
- the first arm 123 , the second arm 124 , and the hand 125 are disposed with their lengths oriented in a direction (X direction) orthogonal to the rear wall 201 . Also the ends of the first arm 123 and the second arm 124 and a part of the substrate 110 supported by the hand 125 protrude into the processing apparatus 20 through the opening 202 .
- the substrate transfer robot 12 changes from the normal posture into a third intermediate posture. Specifically, the substrate transfer robot 12 rotates the first arm 123 and the second arm 124 with the first arm 123 and the second arm 124 folded together, thereby making the first arm 123 and the second arm 124 extend in the Y1 direction from the center C1 of rotation of the first arm 123 side and changing into the third intermediate posture. That is, the first arm 123 and the second arm 124 are oriented in one direction (the Y1 direction) among the directions (Y directions) that are orthogonal to the direction (X direction) that is from the center C1 of rotation of the first arm 123 to the placement position in the processing apparatus 20 .
- the substrate transfer robot 12 changes from the third intermediate posture by linearly moving the hand 125 in the direction (X1 direction) of the placement position in the processing apparatus 20 , thereby transferring the substrate 110 to the placement position in the processing apparatus 20 .
- the substrate transfer robot 12 may follow the above-described operation procedure in reverse order, so as to ensure transfer without the substrate transfer robot 12 contacting the substrate storage apparatus 11 and the processing apparatus 20 .
- the substrate transfer robot 12 may follow the above-described operation procedure similarly to the cassette 11 a , so as to ensure transfer.
- the first arm 123 and the second arm 124 extend in the Y1 direction from the center C1 of rotation of the first arm 123 in both cases of the cassettes 11 a and 11 d.
- the substrate transfer robot 12 moves the hand 125 to a position under a substrate 110 in the cassette 11 b so as to support the substrate 110 . Then, the substrate transfer robot 12 linearly moves the hand 125 toward the processing apparatus 20 (in the X1 direction), thereby pulling the substrate 110 out of the cassette 11 b , and takes the stand-by posture.
- the substrate transfer robot 12 In this state of the substrate transfer robot 12 , the ends of the first arm 123 and the second arm 124 protrude into the processing apparatus 20 through the opening 202 . Then, the substrate transfer robot 12 rotates the hand 125 alone to put the center 110 a of the substrate 110 onto the imaginary line L2, thus taking the first intermediate posture.
- the substrate transfer robot 12 changes from the first intermediate posture into the second intermediate posture. Specifically, the substrate transfer robot 12 transfers the substrate 110 with the center 110 a of the substrate 110 moving along the imaginary line L2, thereby folding the first arm 123 and the second arm 124 together and changing into the second intermediate posture.
- the substrate transfer robot 12 makes the ends of the first arm 123 and the second arm 124 protrude into the processing apparatus 20 through the opening 202 . That is, throughout the stand-by posture, the first intermediate posture, and the second intermediate posture of the substrate transfer robot 12 , the ends of the first arm 123 and the second arm 124 protrude into the processing apparatus 20 .
- the substrate transfer robot 12 rotates the hand 125 so as to fold the first arm 123 , the second arm 124 , and the hand 125 together, thereby changing from the second intermediate posture into the normal posture.
- the first arm 123 , the second arm 124 , and the hand 125 are disposed with their lengths oriented in the direction (X direction) orthogonal to the rear wall 201 . Also the ends of the first arm 123 and the second arm 124 and a part of the substrate 110 supported by the hand 125 protrude into the processing apparatus 20 through the opening 202 .
- the substrate transfer robot 12 takes the third intermediate posture, in which the first arm 123 and the second arm 124 extend in the Y1 direction from the center C1 of rotation of the first arm 123 . Then, the substrate transfer robot 12 changes from the third intermediate posture by linearly moving the hand 125 in the direction (X1 direction) of the placement position in the processing apparatus 20 , thereby transferring the substrate 110 to the placement position in the processing apparatus 20 .
- the substrate transfer robot 12 may follow the above-described operation procedure in reverse order, so as to ensure transfer without the substrate transfer robot 12 contacting the substrate storage apparatus 11 and the processing apparatus 20 .
- the substrate transfer robot 12 may follow the above-described operation procedure similarly to the cassette 11 b , so as to ensure transfer.
- the first arm 123 and the second arm 124 extend in the Y1 direction from the center C1 of rotation of the first arm 123 in both cases of the cassettes 11 b and 11 c . That is, in all of the cases of the cassettes 11 a to 11 d , in the third intermediate posture of the substrate transfer robot 12 , the first arm 123 and the second arm 124 are oriented in the same direction (the Y1 direction) as viewed from the center C1 of rotation of the first arm 123 .
- the substrate transfer robot 12 transfers the substrate 110 from a position in the substrate storage apparatus 11 to the placement position in the processing apparatus 20 through the opening 202 , which is disposed on the processing apparatus 20 .
- the outer periphery of the minimal rotation area of the substrate transfer robot 12 overlaps the inside of the processing apparatus 20 through the opening 202 .
- the opening 202 which is for transfer of the substrate 110 into the processing apparatus 20 , is utilized in the rotation of the substrate transfer robot 12 . This minimizes the distance between the substrate transfer robot 12 and the processing apparatus 20 , as compared with the processing apparatus 20 being disposed to avoid overlapping with the minimal rotation area of the substrate transfer robot 12 .
- the diminished robot installment area 13 also ensures a diminished FFU (fan filter unit). This is particularly effective in applications where the robot installment area 13 needs to be kept clean by the FFU, as in the first embodiment.
- the miniaturization is effective in applications where the substrate processing system 100 accommodates a plurality of apparatuses and is liable to increase in size, as in the first embodiment.
- the center C1 of rotation of the first arm 123 is at a position that faces the opening 202 in plan view, and the minimal rotation radius R of the substrate transfer robot 12 is larger than the distance between the center C1 of rotation of the first arm 123 and the processing apparatus 20 .
- This configuration ensures that the outer periphery of the minimal rotation area of the substrate transfer robot 12 easily overlaps the inside of the processing apparatus 20 through the opening 202 . This, in turn, easily diminishes the robot installment area 13 and ensures miniaturization.
- the center C1 of rotation of the first arm 123 is closer to the front wall 111 than to the rear wall 201 in plan view, and the minimal rotation radius R of the substrate transfer robot 12 is larger than the distance between the center C1 of rotation of the first arm 123 and the rear wall 201 .
- This configuration reduces the distance between the substrate transfer robot 12 and the front wall 111 as well as reducing the distance between the substrate transfer robot 12 and the rear wall 201 . This, in turn, further diminishes the robot installment area 13 and results in further miniaturization.
- the substrate transfer robot 12 takes the normal posture in which the first arm 123 , the second arm 124 , and the hand 125 supporting the substrate 110 are superimposed over each other in plan view.
- the substrate transfer robot 12 in the normal posture rotates within the minimal rotation area when the first arm 123 rotates on the horizontal surface about the one end of the first arm 123 as the center C1 of rotation.
- This configuration eliminates or minimizes enlargement of the minimal rotation area even when the substrate transfer robot 12 is provided with two arms (the first arm 123 and the second arm 124 ) and the hand 125 .
- This, in turn, eliminates or minimizes enlargement of the robot installment area 13 .
- the first distance between the center C1 of rotation of the first arm 123 and the distal end of the first arm 123 , the second distance between the center C1 of rotation of the first arm 123 and the distal end of the second arm 124 , and the third distance between the center C1 of rotation of the first arm 123 and the distal end of the substrate 110 supported by the hand 125 are approximately equal to each other.
- This configuration increases the maximum length of the first arm 123 , the second arm 124 , and the hand 125 in unfolded state while eliminating or minimizing enlargement of the minimal rotation area of the substrate transfer robot 12 . This, in turn, ensures a wide transferable range of the substrate 110 while eliminating or minimizing enlargement of the robot installment area 13 .
- the substrate transfer robot 12 when the substrate transfer robot 12 transfers the substrate 110 from a position in the substrate storage apparatus 11 to the placement position in the processing apparatus 20 , the substrate transfer robot 12 folds the first arm 123 and the second arm 124 together and protrudes the arm (the first arm 123 and the second arm 124 ) into the processing apparatus 20 through the opening 202 .
- This configuration facilitates the folding of the first arm 123 and the second arm 124 without the arm of the substrate transfer robot 12 contacting the processing apparatus 20 even though the folding involves overlapping of the arm with the area of the processing apparatus.
- the substrate transfer robot 12 moves the substrate 110 while keeping the center of the substrate 110 along the imaginary line L2, which is approximately parallel to the rear wall 201 of the processing apparatus 20 in plan view, so as to fold the first arm 123 and the second arm 124 together and protrude the arm (the first arm 123 and the second arm 124 ) into the processing apparatus 20 through the opening 202 .
- This configuration ensures that the substrate 110 is moved with a uniform distance secured from the processing apparatus 20 . This, in turn, facilitates the folding of the first arm 123 and the second arm 124 without the substrate 110 contacting the processing apparatus 20 .
- the substrate transfer robot 12 rotates the hand 125 supporting the substrate 110 relative to the second arm 124 so as to take the first intermediate posture, in which the center of the substrate 110 is on the imaginary line L2.
- the substrate transfer robot 12 moves from the first intermediate posture while keeping the center of the substrate 110 along the imaginary line L2 so as to change into the second intermediate posture, in which the first arm 123 and the second arm 124 are folded together.
- the substrate transfer robot 12 moves from the second intermediate posture so as to transfer the substrate 110 to the placement position in the processing apparatus 20 .
- This configuration easily keeps the center of the substrate 110 on the imaginary line L2 merely by rotating the hand 125 , and facilitates the folding of the first arm 123 and the second arm 124 by moving the center of the substrate 110 along the imaginary line L2.
- the imaginary line L2 is at an approximately equal distance from the front wall 111 and the rear wall 201 . This configuration ensures that the substrate 110 is moved with a uniform distance secured both from the front wall 111 and the rear wall 201 . This, in turn, facilitates the folding of the first arm 123 and the second arm 124 without the substrate 110 contacting the front wall 111 and the rear wall 201 .
- the substrate transfer robot 12 when the substrate transfer robot 12 transfers any one substrate 110 in the cassettes 11 a to 11 d to the placement position in the processing apparatus 20 , the substrate transfer robot 12 takes the third intermediate posture, in which with the substrate 110 partially beyond the opening 202 , the first arm 123 and the second arm 124 are folded together and oriented in one direction (the Y1 direction) that is approximately orthogonal to the direction (X direction) that is from the center C1 of rotation of the first arm 123 to the placement position in the processing apparatus 20 .
- This configuration ensures that the first arm 123 and the second arm 124 are oriented in the same direction no matter which substrate 110 is transferred. This, in turn, eliminates or minimizes variations of accuracy of substrate transfer caused by a backlash that can occur when, for example, a gear is used to rotate the first arm 123 and the second arm 124 .
- the opening 202 is open from a first height position through to a second height position.
- the first height position corresponds to a position at which the hand 125 and the arm (the first arm 123 and the second arm 124 ) have access to a substrate 110 placed at a lowest position in the cassettes 11 a to 11 d of the substrate storage apparatus 11 .
- the second height position corresponds to another position at which the hand 125 and the arm have access to a substrate 110 placed at a highest position in the cassettes 11 a to 11 d of the substrate storage apparatus 11 .
- This configuration ensures that the substrate transfer robot 12 easily rotates itself by utilizing the opening 202 , no matter which height position in the cassettes 11 a to 11 d the substrate 110 to be transferred by the substrate transfer robot 12 is placed at. This, in turn, ensures that even when the substrates 110 are stacked in the cassettes 11 a to 11 d , the substrate transfer robot 12 easily transfers the substrate 110 without contacting the processing apparatus 20 , while at the same time ensuring a reduction in size of the substrate processing system 100 .
- the second embodiment is different from the first embodiment in that an opening 202 a according to the second embodiment has an opening length, H2, that is smaller in height (in the Z direction) than the opening length H1 of the opening 202 according to the first embodiment.
- the same reference numerals designate identical or corresponding elements throughout the first and second embodiments, and these elements will not be elaborated here.
- a substrate processing system 200 includes a processing apparatus 220 .
- the opening 202 a of the processing apparatus 220 has the opening length 112 .
- the opening length H2 is smaller than the movable range in the height direction of the first arm 123 , the second arm 124 , and the hand 125 of the substrate transfer robot 12 .
- the opening 202 a is open through to a height corresponding to a height position at which the substrate transfer robot 12 has access to the lowest position among the 25 levels of positions in the cassettes 11 b and 11 c , which are closer to the substrate transfer robot 12 .
- the processing apparatus 220 is an example of the “second apparatus”.
- the substrate transfer robot 12 is capable of feeding and taking the substrate 110 to and from all the 25 levels of positions in the cassettes 11 a and 11 d , which are farther from the substrate transfer robot 12 among the four cassettes 11 a to 11 d of the substrate storage apparatus 11 .
- the substrate transfer robot 12 is capable of feeding and taking the substrate 110 to and from a lowest position among the 25 levels of positions.
- the position in each of the cassettes 11 b and 11 c is an example of the “first position”
- the position in each of the cassettes 11 a and 11 d is an example of the “third position”.
- the substrate transfer robot 12 moves the hand 125 to a position under a substrate 110 in the cassette 11 a so as to support the substrate 110 . Then, the substrate transfer robot 12 linearly moves the hand 125 toward the processing apparatus 220 (in the X1 direction), thereby pulling the substrate 110 out of the cassette 11 a , and takes the stand-by posture.
- the substrate transfer robot 12 does not protrude into the processing apparatus 220 .
- the substrate transfer robot 12 in the stand-by posture moves the support shaft 122 up and down to move the first arm 123 , the second arm 124 , and the hand 125 to a height position corresponding to the opening 202 a .
- the movements following the stand-by posture are similar to the movements in the first embodiment and will not be elaborated here.
- the movements of the substrate transfer robot 12 according to the second embodiment involved in the transfer of a substrate 110 placed at a lowest position in the cassettes 11 b and 11 c , which are closer to the substrate transfer robot 12 , to the placement position in the processing apparatus 220 are similar to the movements in the first embodiment and will not be elaborated here.
- the substrate transfer robot 12 according to the second embodiment it is not possible to transfer substrates 110 other than the substrate 110 at the lowest position in the cassettes 11 b and 11 c , which are closer to the substrate transfer robot 12 ; otherwise, the substrate transfer robot 12 would come into contact with the processing apparatus 220 .
- the second embodiment is otherwise similar to the first embodiment.
- the opening 202 a is open through to a height corresponding to a substrate 110 placed at the cassettes 11 b and 11 c , which are closer to the substrate transfer robot 12 .
- the substrate transfer robot 12 seeks access to a position in the cassettes 11 a and 11 d , which are farther from the substrate transfer robot 12 , the substrate transfer robot 12 pulls the substrate 110 out of the cassette 11 a or 11 d , and then moves the hand 125 and the arm (the first arm 123 and the second arm 124 ) in the height direction so as to protrude the arm into the processing apparatus 220 through the opening 202 a .
- This configuration diminishes the robot installment area 13 and ensures miniaturization while inhibiting an excessive increase in size of the opening 202 a . Inhibiting an excessive increase in size of the opening 202 a eliminates or minimizes contamination of the robot installment area 13 , in which the air needs to be kept clean, by foreign matter through the opening 202 a.
- a robot installment area 313 is defined between two processing apparatuses 20 and 320 , as opposed to the robot installment area 13 according to the first embodiment, which is defined between the substrate storage apparatus 11 and the processing apparatus 20 .
- the same reference numerals designate identical or corresponding elements throughout the first and third embodiments, and these elements will not be elaborated here.
- the two processing apparatuses 20 and 320 are aligned in the X direction and face one another.
- the processing apparatus 320 has a configuration similar to the configuration of the processing apparatus 20 according to the first embodiment, and is symmetrical relative to the processing apparatus 20 about a center line between the two processing apparatuses 20 and 320 .
- the processing apparatus 320 includes a front wall 301 and an opening 302 , which respectively correspond to the rear wall 201 and the opening 202 of the processing apparatus 20 .
- the processing apparatus 320 is an example of the “first apparatus”, and the front wall 301 is an example of the “first wall”.
- the robot installment area 313 is defined between the rear wall 201 of the processing apparatus 20 and the front wall 301 of the processing apparatus 320 .
- the substrate transfer robot 12 is disposed.
- the substrate transfer robot 12 is capable of transferring a substrate 110 between the two processing apparatuses 20 and 320 .
- the substrate transfer robot 12 is disposed at such a position that the outer periphery of the minimal rotation area overlaps the inside of the processing apparatus 20 through the opening 202 of the processing apparatus 20 .
- the position of the substrate transfer robot 12 is where the outer periphery of the minimal rotation area overlaps the inside of the processing apparatus 320 through the opening 302 of the processing apparatus 320 .
- the minimal rotation radius R of the substrate transfer robot 12 is larger than the distance between the center C1 of rotation of the first arm 123 and the rear wall 201 of the processing apparatus 20 , and is larger than the distance between the center C1 of rotation of the first arm 123 and the front wall 301 of the processing apparatus 320 .
- the substrate transfer robot 12 is capable of 360-degree rotation when in the normal posture, in which the first arm 123 , the second arm 124 , and the hand 125 are superimposed over each other.
- the center C1 of rotation of the first arm 123 is disposed at a position that faces both the openings 202 and 302 .
- the center C1 of rotation of the first arm 123 is disposed on a line L1 extending from the center of the substrate 110 placed at the placement position in the processing apparatus 20 to an approximate center of the opening 202 .
- the two processing apparatuses 20 and 320 and the substrate transfer robot 12 are disposed such that the line L1 passes through the center of the substrate 110 at the placement position in the processing apparatus 320 and through an approximate center of the opening 302 of the processing apparatus 320 .
- the center C1 of rotation of the first arm 123 is at an approximately equal distance from the two processing apparatuses 20 and 320 .
- the placement position in the processing apparatus 320 is an example of the “first position”.
- the third embodiment is otherwise similar to the first embodiment.
- the substrate transfer robot 12 is disposed in the robot installment area 313 defined between the two opposing processing apparatuses 20 and 320 .
- the outer periphery of the minimal rotation area of the substrate transfer robot 12 overlaps the insides of the processing apparatuses 20 and 320 respectively through the openings 202 and 302 . This reduces the distance between the substrate transfer robot 12 and the one processing apparatus 20 and the distance between the substrate transfer robot 12 and the other processing apparatus 320 at the same time. This diminishes the robot installment area 313 and ensures miniaturization of the substrate processing system 300 even when the substrate transfer robot 12 is disposed in the robot installment area 313 defined between the two processing apparatuses 20 and 320 .
- the fourth embodiment is different from the first embodiment in that a processing apparatus 420 has two placement positions located in directions approximately orthogonal to one another from the center C1 of rotation of the first arm 123 .
- the same reference numerals designate identical or corresponding elements throughout the first and fourth embodiments, and these elements will not be elaborated here.
- the processing apparatus 420 includes an approximately L-shaped wall 401 .
- the wall 401 includes a rear wall 401 a and a side wall 401 b .
- the rear wall 401 a is approximately parallel to the front wall 111 of the substrate storage apparatus 11
- the side wall 401 b is approximately perpendicular to the front wall 111 .
- the rear wall 401 a has an approximately rectangular opening 402 .
- the side wall 401 b has an approximately rectangular opening 403 .
- the processing apparatus 420 is an example of the “second apparatus”, and the rear wall 401 a is an example of the “second wall”.
- a robot installment area 413 is defined between the front wall 111 of the substrate storage apparatus 11 and the approximately L-shaped wall 401 of the processing apparatus 420 .
- the substrate transfer robot 12 is disposed.
- the substrate transfer robot 12 is capable of transferring a substrate 110 among the substrate storage apparatus 11 and two placement positions in the processing apparatus 420 .
- the substrate transfer robot 12 is disposed at such a position that the outer periphery of the minimal rotation area overlaps the inside of the processing apparatus 420 through the opening 402 of the rear wall 401 a and the opening 403 of the side wall 401 b .
- the minimal rotation radius R of the substrate transfer robot 12 is larger than the distance between the center C1 of rotation of the first arm 123 and the rear wall 401 a , and larger than the distance between the center C1 of rotation of the first arm 123 and the side wall 401 b .
- the two placement positions in the processing apparatus 420 are examples of the “second position”.
- the center C1 of rotation of the first arm 123 is disposed at a position that faces both the openings 402 and 403 .
- the center C1 of rotation of the first arm 123 is disposed on a line L3 extending from the center of a substrate 110 placed at one placement position in the processing apparatus 420 to an approximate center of the opening 402 of the rear wall 401 a .
- the center C1 of rotation of the first arm 123 is disposed on a line L4 extending from the center of a substrate 110 placed at the other placement position in the processing apparatus 420 to an approximate center of the opening 403 of the side wall 401 b .
- the line L3 and the line L4 are approximately orthogonal to one another.
- the substrate transfer robot 12 is disposed such that the distance between the center C1 of rotation of the first arm 123 and the front wall 111 of the substrate storage apparatus 11 is larger than the minimal rotation radius R.
- the substrate transfer robot 12 is capable of 360-degree rotation when in the normal posture, in which the first arm 123 , the second arm 124 , and the hand 125 are superimposed over each other.
- the fourth embodiment is otherwise similar to the first embodiment.
- the processing apparatus 420 has two placement positions located in directions approximately orthogonal to one another from the center C1 of rotation of the first arm 123 .
- the outer periphery of the minimal rotation area of the substrate transfer robot 12 overlaps the inside of the processing apparatus 420 through the opening 402 of the rear wall 401 a and the opening 403 of the side wall 401 b . This reduces both the distance between the substrate transfer robot 12 and the rear wall 401 a and the distance between the substrate transfer robot 12 and the side wall 401 b .
- the substrate transfer robot has been exemplified as including two arms (the first arm and the second arm). This, however, should not be construed in a limiting sense.
- the substrate transfer robot may include a single arm or three or more arms.
- the substrate transfer robot has been exemplified as including a single hand. This, however, should not be construed in a limiting sense. As shown in FIG. 10 , a substrate transfer robot 512 including two hands is also possible. A substrate transfer robot including three or more hands is also possible.
- the imaginary line has been exemplified as being at an approximately equal distance from the first wall and the second wall. This, however, should not be construed in a limiting sense.
- the imaginary line may be closer to either the first wall or the second wall insofar as no interference occurs between the substrate transfer robot and the first and second walls when the substrate transfer robot changes from the first intermediate posture to the second intermediate posture.
- the robot installment area has been exemplified as being defined between the front wall (first wall) and the rear wall (second wall) that are approximately parallel to one another. This, however, should not be construed in a limiting sense.
- the robot installment area may be defined between a first wall and a second wall that are orthogonal to one another.
- the second apparatus has been exemplified as a processing apparatus in a manufacturing process of a semiconductor device. This, however, should not be construed in a limiting sense.
- the second apparatus may be other than the processing apparatus in a manufacturing process of a semiconductor device.
- Other examples include a temporary substrate stand apparatus to forward a substrate to a next step.
- the center of rotation of the first arm has been exemplified as being on a line extending from the center of the substrate placed at the placement position in the processing apparatus (second apparatus) to an approximate center of the opening. This, however, should not be construed in a limiting sense.
- the center of rotation of the first arm may be off the line extending from the center of the substrate placed at the placement position in the second apparatus to an approximate center of the opening, insofar as the center of rotation of the first arm is disposed at a position that faces the opening.
- the first distance between the center of rotation of the first arm and the distal end of the first arm, the second distance between the center of rotation of the first arm and the distal end of the second arm, and the third distance between the center of rotation of the first arm and the distal end of the substrate supported by the hand are approximately equal to each other, and the first to third distances are larger than the distance between the center of rotation of the first arm and the rear wall (second wall).
- At least one distance among the first to third distances may be larger than the distance between the center of rotation of the first arm and the second wall.
- the opening has been exemplified as being provided on the rear wall (second wall) of the processing apparatus serving as the second apparatus.
- second wall the rear wall of the processing apparatus serving as the second apparatus.
- the first apparatus it is possible to provide the first apparatus with both a first wall and a second wall provided with an opening. It is also possible to provide a second wall separate from the first apparatus and the second apparatus, and provide an opening on the second wall.
- the first arm and the second arm when the substrate is transferred from any of the cassettes, the first arm and the second arm have been exemplified as being oriented in one direction (in the Y1 direction) from the center of rotation of the first arm in the third intermediate posture. This, however, should not be construed in a limiting sense. To minimize the time spent in transferring the substrate, it is possible in the third intermediate posture to change the orientation of the first arm and the second arm conveniently depending on the position of the cassette.
- the cassettes 11 b and 11 c which are closer to the substrate transfer robot, have been exemplified as accommodating substrates only at the lowest positions in the cassettes 11 b and 11 c , with the opening length H2 of the opening being set at a height corresponding to a position at which the substrate transfer robot has access to the lowest positions in the cassettes 11 b and 11 c , which are closer to the substrate transfer robot.
- This should not be construed in a limiting sense.
Abstract
Description
- The present application claims priority under 35 U.S.C. §119 to the U.S. Provisional Application No. 61/724,435, filed Nov. 9, 2012. The contents of this application are incorporated herein by reference in their entirety.
- 1. Field of the Invention
- The present invention relates to a substrate transfer system and a substrate processing system.
- 2. Discussion of the Background
- Japanese Unexamined Patent Application Publication No. 2009-136981 discloses a substrate transfer system including a substrate transfer robot that transfers a substrate to a different position.
- The substrate transfer system disclosed in Japanese Unexamined Patent Application Publication No. 2009-136981 includes a robot (substrate transfer robot) that includes a lower arm, an upper arm, and a hand. The lower arm is rotatable on a horizontal surface relative to a base. The upper arm is rotatable on the horizontal surface relative to the lower arm. The hand is rotatable on the horizontal surface relative to the upper arm. The robot of the substrate transfer system is disposed in a robot installment area defined between a cassette apparatus (first apparatus) and a processing apparatus (second apparatus). The cassette apparatus accommodates substrates, and the processing apparatus processes a substrate.
- According to one aspect of the present disclosure, a substrate transfer system includes a substrate transfer robot disposed in a robot installment area defined between a first apparatus and a second apparatus including an opening. The substrate transfer robot includes a hand and an arm. The hand is configured to support a substrate. The arm is configured to move the hand. The arm and the hand supporting the substrate are configured to rotate on a horizontal surface within a minimal rotation area of the substrate transfer robot such that an outer periphery of the minimal rotation area overlaps an inside of the second apparatus through the opening so as to transfer the substrate from a first position in the first apparatus to a second position in the second apparatus through the opening.
- According to another aspect of the present disclosure, a substrate processing system includes a first apparatus, a second apparatus including an opening, and a substrate transfer robot. The substrate transfer robot is disposed in a robot installment area defined between the first apparatus and the second apparatus. The substrate transfer robot includes a hand and an arm. The hand is configured to support a substrate. The arm is configured to move the hand. The arm and the hand supporting the substrate are configured to rotate on a horizontal surface within a minimal rotation area of the substrate transfer robot such that an outer periphery of the minimal rotation area overlaps an inside of the second apparatus through the opening so as to transfer the substrate from a first position in the first apparatus to a second position in the second apparatus through the opening.
- A more complete appreciation of the present disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
-
FIG. 1 is a plan view of a substrate processing system according to a first embodiment, illustrating a general arrangement of the substrate processing system; -
FIG. 2 is a schematic side view of the substrate processing system according to the first embodiment, illustrating a general arrangement of the substrate processing system; -
FIG. 3 is a perspective view of a substrate transfer robot of the substrate processing system according to the first embodiment; -
FIG. 4 is a plan view of the substrate processing system according to the first embodiment, illustrating a minimal rotation area of the substrate transfer robot; -
FIG. 5 illustrates a procedure of an operation by the substrate processing system according to the first embodiment in transferring a substrate placed at a position far from the substrate transfer robot; -
FIG. 6 illustrates a procedure of an operation by the substrate processing system according to the first embodiment in transferring a substrate placed at a position close to the substrate transfer robot; -
FIG. 7 is a schematic side view of a substrate processing system according to a second embodiment, illustrating a general arrangement of the substrate processing system; -
FIG. 8 is a schematic side view of a substrate processing system according to a third embodiment, illustrating a general arrangement of the substrate processing system; -
FIG. 9 is a schematic side view of a substrate processing system according to a fourth embodiment, illustrating a general arrangement of the substrate processing system; and -
FIG. 10 is a perspective view of a modification of the substrate transfer robot of the substrate processing system according to any of the first to fourth embodiments. - The embodiments will now be described with reference to the accompanying drawings, wherein like reference numerals designate corresponding or identical elements throughout the various drawings.
- First, by referring to
FIGS. 1 to 6 , a configuration of asubstrate processing system 100 according to the first embodiment will be described. - As shown in
FIGS. 1 and 2 , thesubstrate processing system 100 includes asubstrate transfer system 10 and aprocessing apparatus 20. Thesubstrate transfer system 10 transfers asubstrate 110. In thesubstrate processing system 100, thesubstrate transfer system 10 transfers thesubstrate 110 to theprocessing apparatus 20. Theprocessing apparatus 20 processes the transferredsubstrate 110 in a manufacturing process of a semiconductor device. - The
substrate transfer system 10 includes asubstrate storage apparatus 11 and asubstrate transfer robot 12. Thesubstrate storage apparatus 11 accommodatessubstrates 110, and thesubstrate transfer robot 12 transfers thesubstrate 110 between thesubstrate storage apparatus 11 and theprocessing apparatus 20. In plan view (when viewed from above), the outer shape of thesubstrate transfer system 10 is a combination (indicated by the broken line inFIG. 1 ) of an installment area of thesubstrate storage apparatus 11 and arobot installment area 13, which is where thesubstrate transfer robot 12 is disposed, as described later. Therobot installment area 13 is defined between afront wall 111, described later, of thesubstrate storage apparatus 11 and arear wall 201 of theprocessing apparatus 20. Thesubstrate transfer system 10 also includes an FFU (Fan Filter Unit), not shown, to keep the air inside therobot installment area 13 clean. Thesubstrate storage apparatus 11 is an example of the “first apparatus”, and theprocessing apparatus 20 is an example of the “second apparatus”. - The
substrate storage apparatus 11 corresponds to the FOUP (Front Open Unified Pod) of the SEMI (Semiconductor Equipment and Materials International) standard. As shown inFIGS. 1 and 2 , thefront wall 111 of thesubstrate storage apparatus 11 is disposed at the side (the X1 direction side) of thesubstrate transfer robot 12 and theprocessing apparatus 20. Thefront wall 111 has a perpendicular surface. Thesubstrate storage apparatus 11 includes fourcassettes 11 a to 11 d disposed at different positions in plan view. The fourcassettes 11 a to 11 d are aligned next to each other in the Y direction. As shown inFIG. 2 , the fourcassettes 11 a to 11 d are disposed on acassette support 112. Also the fourcassettes 11 a to 11 d are each capable of accommodating a plurality ofsubstrates 110 at different height positions. Specifically, each of the fourcassettes 11 a to 11 d has 25 levels of positions in the vertical direction, accommodating a stack of up to 25substrates 110. Thefront wall 111 is an example of the “first wall”, and each of the positions in the fourcassettes 11 a to 11 d is an example of the “first position”. - As shown in
FIGS. 1 to 3 , thesubstrate transfer robot 12 is a multi-articular robot. Specifically, thesubstrate transfer robot 12 includes abase 121, asupport shaft 122, afirst arm 123, asecond arm 124, ahand 125, and acontroller 126. Thecontroller 126 controls these elements of thesubstrate transfer robot 12. Thefirst arm 123 and thesecond arm 124 are examples of the “arm”. - The
support shaft 122 is supported by thebase 121 and is elongate in the direction perpendicular to the upper surface of thebase 121. At an upper end, thesupport shaft 122 is coupled to one end of thefirst arm 123. Thefirst arm 123 is rotatable on a horizontal surface about thesupport shaft 122 as the center of rotation. At another end, thefirst arm 123 is coupled to one end of thesecond arm 124. Thesecond arm 124 is rotatable on the horizontal surface about, as the center of rotation, the one end of thesecond arm 124 coupled to thefirst arm 123. At another end, thesecond arm 124 is coupled to thehand 125. Thehand 125 is rotatable on the horizontal surface about, as the center of rotation, the portion of thehand 125 coupled to thesecond arm 124. Also thehand 125 is capable of supporting thesubstrate 110 from below thesubstrate 110. Thefirst arm 123 and thesecond arm 124 have link lengths approximately equal to one another. Specifically, as shown inFIG. 1 , thefirst arm 123 has a link length R1 from a center C1 of rotation of thefirst arm 123 to a center C2 of rotation of thesecond arm 124, while thesecond arm 124 has a link length R2 from the center C2 of rotation of thesecond arm 124 to a center C3 of rotation of thehand 125. The link length R1 and the link length R2 are approximately equal to one another. This eliminates or minimizes complexity of the operation control of the elements involved in transfer of thesubstrate 110, as compared with the case where the link lengths of thefirst arm 123 and thesecond arm 124 are different from one another. - The
substrate transfer robot 12 moves thesupport shaft 122 up and down to integrally move thefirst arm 123, thesecond arm 124, and thehand 125 up and down. This enables thesubstrate transfer robot 12 to feed and take thesubstrate 110 to and from all the different height positions in thecassettes 11 a to 11 d. - The
controller 126 is taught in advance operations of the elements for transfer of thesubstrate 110 on thehand 125. Specifically, thecontroller 126 is taught in advance operations of the elements associated with the feeding and taking operations of thesubstrate 110 to and from the fourcassettes 11 a to 11 d. This ensures that thesubstrate transfer robot 12 performs a transfer operation with respect to thesubstrate 110 according to an operation procedure, described later. - As shown in
FIGS. 1 and 2 , therear wall 201 of theprocessing apparatus 20 is disposed at the side (the X2 direction side) of thesubstrate transfer robot 12 and thesubstrate storage apparatus 11. Therear wall 201 has a perpendicular surface, and is approximately parallel to and opposed to thefront wall 111. On therear wall 201, an approximatelyrectangular opening 202 is disposed. As shown inFIG. 1 , theopening 202 has an opening width B in the horizontal direction (Y direction). The opening width B is large enough to allow thesubstrate 110 to be inserted through theopening 202. As shown inFIG. 2 , theopening 202 has an opening length H1. The opening length H1 is larger in the height direction (Z direction) than the movable range in the height direction of thefirst arm 123, thesecond arm 124, and thehand 125 of thesubstrate transfer robot 12. Specifically, theopening 202 is open from a first height position through to a second height position. The first height position corresponds to a position at which thesubstrate transfer robot 12 has access to a lowest position among the 25 levels of positions in thecassettes 11 a to 11 d. The second height position corresponds to another position at which thesubstrate transfer robot 12 has access to a highest position among the 25 levels of positions in thecassettes 11 a to 11 d. Therear wall 201 is an example of the “second wall”. - Here, in the first embodiment, the
substrate transfer robot 12 is capable of transferring asubstrate 110 in thesubstrate storage apparatus 11 to the placement position in theprocessing apparatus 20 through theopening 202, while at the same time being capable of transferring asubstrate 110 in theprocessing apparatus 20 to a predetermined position in thesubstrate storage apparatus 11. Thesubstrate transfer robot 12 has a minimal rotation area having an outer periphery that overlaps the inside of theprocessing apparatus 20 through theopening 202. Specifically, thesubstrate transfer robot 12 has a minimal rotation radius R, and the minimal rotation radius R is larger than the distance between the center C1 of rotation of thefirst arm 123 and therear wall 201 of theprocessing apparatus 20. As shown inFIG. 4 , the minimal rotation area of thesubstrate transfer robot 12 is an area necessary when thesubstrate transfer robot 12 takes a normal posture in which thefirst arm 123, thesecond arm 124, and thehand 125 supporting thesubstrate 110 are superimposed over each other and when thesubstrate transfer robot 12 in the normal posture rotates thefirst arm 123 on the horizontal surface. The placement position in theprocessing apparatus 20 is an example of the “second position”. - When the
substrate transfer robot 12 is in the normal posture, a first distance between the center C1 of rotation of thefirst arm 123 and the distal end of thefirst arm 123, a second distance between the center C1 of rotation of thefirst arm 123 and the distal end of thesecond arm 124, and a third distance between the center C1 of rotation of thefirst arm 123 and the distal end of thesubstrate 110 supported by thehand 125 are approximately equal to each other. Each of the first to third distances is equal to the minimal rotation radius R of thesubstrate transfer robot 12 and larger than the distance between the center C1 of rotation of thefirst arm 123 and therear wall 201. - As shown in
FIG. 4 , in thesubstrate transfer robot 12, the center C1 of rotation of thefirst arm 123 is disposed at a position that faces theopening 202. Specifically, in plan view, the center C1 of rotation of thefirst arm 123 is disposed on a line L1 extending from the center of thesubstrate 110 placed at the placement position in theprocessing apparatus 20 to an approximate center of theopening 202. Also the center C1 of rotation of thefirst arm 123 is disposed at a position that faces thefront wall 111 of thesubstrate storage apparatus 11. Specifically, in plan view, the center C1 of rotation of thefirst arm 123 is disposed at a position that faces an approximate center in the Y direction of the fourcassettes 11 a to 11 d of thesubstrate storage apparatus 11. Also the center C1 of rotation of thefirst arm 123 is closer to thefront wall 111 of thesubstrate storage apparatus 11 than to therear wall 201 of theprocessing apparatus 20. Between thesubstrate transfer robot 12 and thesubstrate storage apparatus 11, a predetermined regulation width is included. The predetermined regulation width is determined depending on an opener (opening and closing mechanism), not shown, that opens and closes the doors of thecassettes 11 a to 11 d. A distance D (seeFIG. 1 ) between thesubstrate storage apparatus 11 and theprocessing apparatus 20 is larger than a combination of the regulation width of the opener and the distance between the base end of thehand 125 and the distal end of thesubstrate 110 supported by thehand 125. - Next, an operation procedure of substrate transfer by the
substrate transfer system 10 according to the first embodiment will be described. - First, by referring to
FIG. 5 , description will be made with regard to an operation of transferring asubstrate 110 in thecassette 11 a, which is farther from thesubstrate transfer robot 12, to the placement position in theprocessing apparatus 20. As shown in the lower right-hand corner ofFIG. 5 , thesubstrate transfer robot 12 moves thehand 125 to a position under asubstrate 110 in thecassette 11 a so as to support thesubstrate 110. Then, thesubstrate transfer robot 12 linearly moves thehand 125 toward the processing apparatus 20 (in the X1 direction), thereby pulling thesubstrate 110 out of thecassette 11 a, and takes a stand-by posture. Then, thesubstrate transfer robot 12 rotates thehand 125 alone to put acenter 110 a of thesubstrate 110 onto an imaginary line L2, thus taking a first intermediate posture. The imaginary line L2 extends in a direction (Y direction) approximately parallel to therear wall 201 of theprocessing apparatus 20 in plan view, and is at an approximately equal distance from thefront wall 111 and therear wall 201. In the first intermediate posture, thesubstrate transfer robot 12 does not protrude into theprocessing apparatus 20. - The
substrate transfer robot 12 changes from the first intermediate posture into a second intermediate posture. Specifically, thesubstrate transfer robot 12 transfers thesubstrate 110 with thecenter 110 a of thesubstrate 110 moving along the imaginary line L2, thereby folding thefirst arm 123 and thesecond arm 124 together and changing into the second intermediate posture. Here, by folding thefirst arm 123 and thesecond arm 124 together, thesubstrate transfer robot 12 makes the ends of thefirst arm 123 and thesecond arm 124 protrude into theprocessing apparatus 20 through theopening 202. - Then, the
substrate transfer robot 12 rotates thehand 125 so as to fold thefirst arm 123, thesecond arm 124, and thehand 125 together, thereby changing from the second intermediate posture into the normal posture. Here, thefirst arm 123, thesecond arm 124, and thehand 125 are disposed with their lengths oriented in a direction (X direction) orthogonal to therear wall 201. Also the ends of thefirst arm 123 and thesecond arm 124 and a part of thesubstrate 110 supported by thehand 125 protrude into theprocessing apparatus 20 through theopening 202. - Then, the
substrate transfer robot 12 changes from the normal posture into a third intermediate posture. Specifically, thesubstrate transfer robot 12 rotates thefirst arm 123 and thesecond arm 124 with thefirst arm 123 and thesecond arm 124 folded together, thereby making thefirst arm 123 and thesecond arm 124 extend in the Y1 direction from the center C1 of rotation of thefirst arm 123 side and changing into the third intermediate posture. That is, thefirst arm 123 and thesecond arm 124 are oriented in one direction (the Y1 direction) among the directions (Y directions) that are orthogonal to the direction (X direction) that is from the center C1 of rotation of thefirst arm 123 to the placement position in theprocessing apparatus 20. Also in the third intermediate posture, thesubstrate 110 supported by thehand 125 is partially beyond theopening 202. Then, thesubstrate transfer robot 12 changes from the third intermediate posture by linearly moving thehand 125 in the direction (X1 direction) of the placement position in theprocessing apparatus 20, thereby transferring thesubstrate 110 to the placement position in theprocessing apparatus 20. - These movements ensure transfer of the
substrate 110 from thecassette 11 a to the placement position in theprocessing apparatus 20 without thesubstrate transfer robot 12 contacting thesubstrate storage apparatus 11 and theprocessing apparatus 20. When transferring thesubstrate 110 from the placement position in theprocessing apparatus 20 to thecassette 11 a, thesubstrate transfer robot 12 may follow the above-described operation procedure in reverse order, so as to ensure transfer without thesubstrate transfer robot 12 contacting thesubstrate storage apparatus 11 and theprocessing apparatus 20. When transferring to the placement position in theprocessing apparatus 20 thesubstrate 110 in thecassette 11 d, which is at the opposite side of thecassette 11 a in the Y directions relative to the center thesubstrate storage apparatus 11, thesubstrate transfer robot 12 may follow the above-described operation procedure similarly to thecassette 11 a, so as to ensure transfer. - In the first embodiment, in the third intermediate posture of the
substrate transfer robot 12, thefirst arm 123 and thesecond arm 124 extend in the Y1 direction from the center C1 of rotation of thefirst arm 123 in both cases of thecassettes - Next, by referring to
FIG. 6 , description will be made with regard to an operation of transferring asubstrate 110 in thecassette 11 b, which is closer to thesubstrate transfer robot 12, to the placement position in theprocessing apparatus 20. As shown in the lower right-hand corner ofFIG. 6 , thesubstrate transfer robot 12 moves thehand 125 to a position under asubstrate 110 in thecassette 11 b so as to support thesubstrate 110. Then, thesubstrate transfer robot 12 linearly moves thehand 125 toward the processing apparatus 20 (in the X1 direction), thereby pulling thesubstrate 110 out of thecassette 11 b, and takes the stand-by posture. In this state of thesubstrate transfer robot 12, the ends of thefirst arm 123 and thesecond arm 124 protrude into theprocessing apparatus 20 through theopening 202. Then, thesubstrate transfer robot 12 rotates thehand 125 alone to put thecenter 110 a of thesubstrate 110 onto the imaginary line L2, thus taking the first intermediate posture. - The
substrate transfer robot 12 changes from the first intermediate posture into the second intermediate posture. Specifically, thesubstrate transfer robot 12 transfers thesubstrate 110 with thecenter 110 a of thesubstrate 110 moving along the imaginary line L2, thereby folding thefirst arm 123 and thesecond arm 124 together and changing into the second intermediate posture. Here, by folding thefirst arm 123 and thesecond arm 124 together, thesubstrate transfer robot 12 makes the ends of thefirst arm 123 and thesecond arm 124 protrude into theprocessing apparatus 20 through theopening 202. That is, throughout the stand-by posture, the first intermediate posture, and the second intermediate posture of thesubstrate transfer robot 12, the ends of thefirst arm 123 and thesecond arm 124 protrude into theprocessing apparatus 20. - Then, the
substrate transfer robot 12 rotates thehand 125 so as to fold thefirst arm 123, thesecond arm 124, and thehand 125 together, thereby changing from the second intermediate posture into the normal posture. Here, thefirst arm 123, thesecond arm 124, and thehand 125 are disposed with their lengths oriented in the direction (X direction) orthogonal to therear wall 201. Also the ends of thefirst arm 123 and thesecond arm 124 and a part of thesubstrate 110 supported by thehand 125 protrude into theprocessing apparatus 20 through theopening 202. - Then, similarly to the case of the
cassette 11 a, thesubstrate transfer robot 12 takes the third intermediate posture, in which thefirst arm 123 and thesecond arm 124 extend in the Y1 direction from the center C1 of rotation of thefirst arm 123. Then, thesubstrate transfer robot 12 changes from the third intermediate posture by linearly moving thehand 125 in the direction (X1 direction) of the placement position in theprocessing apparatus 20, thereby transferring thesubstrate 110 to the placement position in theprocessing apparatus 20. - These movements ensure transfer of the
substrate 110 from thecassette 11 b to the placement position in theprocessing apparatus 20 without thesubstrate transfer robot 12 contacting thesubstrate storage apparatus 11 and theprocessing apparatus 20. When transferring thesubstrate 110 from the placement position in theprocessing apparatus 20 to thecassette 11 b, thesubstrate transfer robot 12 may follow the above-described operation procedure in reverse order, so as to ensure transfer without thesubstrate transfer robot 12 contacting thesubstrate storage apparatus 11 and theprocessing apparatus 20. When transferring to the placement position in theprocessing apparatus 20 thesubstrate 110 in thecassette 11 c, which is at the opposite side of thecassette 11 b in the Y directions relative to the center thesubstrate storage apparatus 11, thesubstrate transfer robot 12 may follow the above-described operation procedure similarly to thecassette 11 b, so as to ensure transfer. - In the first embodiment, in the third intermediate posture of the
substrate transfer robot 12, thefirst arm 123 and thesecond arm 124 extend in the Y1 direction from the center C1 of rotation of thefirst arm 123 in both cases of thecassettes cassettes 11 a to 11 d, in the third intermediate posture of thesubstrate transfer robot 12, thefirst arm 123 and thesecond arm 124 are oriented in the same direction (the Y1 direction) as viewed from the center C1 of rotation of thefirst arm 123. - In the first embodiment, the
substrate transfer robot 12 transfers thesubstrate 110 from a position in thesubstrate storage apparatus 11 to the placement position in theprocessing apparatus 20 through theopening 202, which is disposed on theprocessing apparatus 20. Here, with thehand 125 supporting thesubstrate 110, the outer periphery of the minimal rotation area of thesubstrate transfer robot 12 overlaps the inside of theprocessing apparatus 20 through theopening 202. Thus, theopening 202, which is for transfer of thesubstrate 110 into theprocessing apparatus 20, is utilized in the rotation of thesubstrate transfer robot 12. This minimizes the distance between thesubstrate transfer robot 12 and theprocessing apparatus 20, as compared with theprocessing apparatus 20 being disposed to avoid overlapping with the minimal rotation area of thesubstrate transfer robot 12. This, as a result, diminishes therobot installment area 13 and ensures miniaturization. The diminishedrobot installment area 13 also ensures a diminished FFU (fan filter unit). This is particularly effective in applications where therobot installment area 13 needs to be kept clean by the FFU, as in the first embodiment. The miniaturization is effective in applications where thesubstrate processing system 100 accommodates a plurality of apparatuses and is liable to increase in size, as in the first embodiment. - Also in the first embodiment, in the
substrate transfer robot 12, the center C1 of rotation of thefirst arm 123 is at a position that faces theopening 202 in plan view, and the minimal rotation radius R of thesubstrate transfer robot 12 is larger than the distance between the center C1 of rotation of thefirst arm 123 and theprocessing apparatus 20. This configuration ensures that the outer periphery of the minimal rotation area of thesubstrate transfer robot 12 easily overlaps the inside of theprocessing apparatus 20 through theopening 202. This, in turn, easily diminishes therobot installment area 13 and ensures miniaturization. - Also in the first embodiment, in the
substrate transfer robot 12, the center C1 of rotation of thefirst arm 123 is closer to thefront wall 111 than to therear wall 201 in plan view, and the minimal rotation radius R of thesubstrate transfer robot 12 is larger than the distance between the center C1 of rotation of thefirst arm 123 and therear wall 201. This configuration reduces the distance between thesubstrate transfer robot 12 and thefront wall 111 as well as reducing the distance between thesubstrate transfer robot 12 and therear wall 201. This, in turn, further diminishes therobot installment area 13 and results in further miniaturization. - Also in the first embodiment, the
substrate transfer robot 12 takes the normal posture in which thefirst arm 123, thesecond arm 124, and thehand 125 supporting thesubstrate 110 are superimposed over each other in plan view. Thesubstrate transfer robot 12 in the normal posture rotates within the minimal rotation area when thefirst arm 123 rotates on the horizontal surface about the one end of thefirst arm 123 as the center C1 of rotation. This configuration eliminates or minimizes enlargement of the minimal rotation area even when thesubstrate transfer robot 12 is provided with two arms (thefirst arm 123 and the second arm 124) and thehand 125. This, in turn, eliminates or minimizes enlargement of therobot installment area 13. - Also in the first embodiment, in the normal posture of the
substrate transfer robot 12, the first distance between the center C1 of rotation of thefirst arm 123 and the distal end of thefirst arm 123, the second distance between the center C1 of rotation of thefirst arm 123 and the distal end of thesecond arm 124, and the third distance between the center C1 of rotation of thefirst arm 123 and the distal end of thesubstrate 110 supported by thehand 125 are approximately equal to each other. This configuration increases the maximum length of thefirst arm 123, thesecond arm 124, and thehand 125 in unfolded state while eliminating or minimizing enlargement of the minimal rotation area of thesubstrate transfer robot 12. This, in turn, ensures a wide transferable range of thesubstrate 110 while eliminating or minimizing enlargement of therobot installment area 13. - Also in the first embodiment, when the
substrate transfer robot 12 transfers thesubstrate 110 from a position in thesubstrate storage apparatus 11 to the placement position in theprocessing apparatus 20, thesubstrate transfer robot 12 folds thefirst arm 123 and thesecond arm 124 together and protrudes the arm (thefirst arm 123 and the second arm 124) into theprocessing apparatus 20 through theopening 202. This configuration facilitates the folding of thefirst arm 123 and thesecond arm 124 without the arm of thesubstrate transfer robot 12 contacting theprocessing apparatus 20 even though the folding involves overlapping of the arm with the area of the processing apparatus. - Also in the first embodiment, the
substrate transfer robot 12 moves thesubstrate 110 while keeping the center of thesubstrate 110 along the imaginary line L2, which is approximately parallel to therear wall 201 of theprocessing apparatus 20 in plan view, so as to fold thefirst arm 123 and thesecond arm 124 together and protrude the arm (thefirst arm 123 and the second arm 124) into theprocessing apparatus 20 through theopening 202. This configuration ensures that thesubstrate 110 is moved with a uniform distance secured from theprocessing apparatus 20. This, in turn, facilitates the folding of thefirst arm 123 and thesecond arm 124 without thesubstrate 110 contacting theprocessing apparatus 20. - Also in the first embodiment, the
substrate transfer robot 12 rotates thehand 125 supporting thesubstrate 110 relative to thesecond arm 124 so as to take the first intermediate posture, in which the center of thesubstrate 110 is on the imaginary line L2. Thesubstrate transfer robot 12 moves from the first intermediate posture while keeping the center of thesubstrate 110 along the imaginary line L2 so as to change into the second intermediate posture, in which thefirst arm 123 and thesecond arm 124 are folded together. Thesubstrate transfer robot 12 moves from the second intermediate posture so as to transfer thesubstrate 110 to the placement position in theprocessing apparatus 20. This configuration easily keeps the center of thesubstrate 110 on the imaginary line L2 merely by rotating thehand 125, and facilitates the folding of thefirst arm 123 and thesecond arm 124 by moving the center of thesubstrate 110 along the imaginary line L2. - Also in the first embodiment, the imaginary line L2 is at an approximately equal distance from the
front wall 111 and therear wall 201. This configuration ensures that thesubstrate 110 is moved with a uniform distance secured both from thefront wall 111 and therear wall 201. This, in turn, facilitates the folding of thefirst arm 123 and thesecond arm 124 without thesubstrate 110 contacting thefront wall 111 and therear wall 201. - Also in the first embodiment, when the
substrate transfer robot 12 transfers any onesubstrate 110 in thecassettes 11 a to 11 d to the placement position in theprocessing apparatus 20, thesubstrate transfer robot 12 takes the third intermediate posture, in which with thesubstrate 110 partially beyond theopening 202, thefirst arm 123 and thesecond arm 124 are folded together and oriented in one direction (the Y1 direction) that is approximately orthogonal to the direction (X direction) that is from the center C1 of rotation of thefirst arm 123 to the placement position in theprocessing apparatus 20. This configuration ensures that thefirst arm 123 and thesecond arm 124 are oriented in the same direction no matter whichsubstrate 110 is transferred. This, in turn, eliminates or minimizes variations of accuracy of substrate transfer caused by a backlash that can occur when, for example, a gear is used to rotate thefirst arm 123 and thesecond arm 124. - Also in the first embodiment, the
opening 202 is open from a first height position through to a second height position. The first height position corresponds to a position at which thehand 125 and the arm (thefirst arm 123 and the second arm 124) have access to asubstrate 110 placed at a lowest position in thecassettes 11 a to 11 d of thesubstrate storage apparatus 11. The second height position corresponds to another position at which thehand 125 and the arm have access to asubstrate 110 placed at a highest position in thecassettes 11 a to 11 d of thesubstrate storage apparatus 11. This configuration ensures that thesubstrate transfer robot 12 easily rotates itself by utilizing theopening 202, no matter which height position in thecassettes 11 a to 11 d thesubstrate 110 to be transferred by thesubstrate transfer robot 12 is placed at. This, in turn, ensures that even when thesubstrates 110 are stacked in thecassettes 11 a to 11 d, thesubstrate transfer robot 12 easily transfers thesubstrate 110 without contacting theprocessing apparatus 20, while at the same time ensuring a reduction in size of thesubstrate processing system 100. - Next, a second embodiment will be described by referring to
FIG. 7 . The second embodiment is different from the first embodiment in that anopening 202 a according to the second embodiment has an opening length, H2, that is smaller in height (in the Z direction) than the opening length H1 of theopening 202 according to the first embodiment. The same reference numerals designate identical or corresponding elements throughout the first and second embodiments, and these elements will not be elaborated here. - As shown in
FIG. 7 , asubstrate processing system 200 according to the second embodiment includes aprocessing apparatus 220. The opening 202 a of theprocessing apparatus 220 has theopening length 112. The opening length H2 is smaller than the movable range in the height direction of thefirst arm 123, thesecond arm 124, and thehand 125 of thesubstrate transfer robot 12. Specifically, the opening 202 a is open through to a height corresponding to a height position at which thesubstrate transfer robot 12 has access to the lowest position among the 25 levels of positions in thecassettes substrate transfer robot 12. Theprocessing apparatus 220 is an example of the “second apparatus”. - Also in the second embodiment, the
substrate transfer robot 12 is capable of feeding and taking thesubstrate 110 to and from all the 25 levels of positions in thecassettes substrate transfer robot 12 among the fourcassettes 11 a to 11 d of thesubstrate storage apparatus 11. For thecassettes substrate transfer robot 12 among the fourcassettes 11 a to 11 d of thesubstrate storage apparatus 11, thesubstrate transfer robot 12 is capable of feeding and taking thesubstrate 110 to and from a lowest position among the 25 levels of positions. The position in each of thecassettes cassettes - Next, an operation procedure of substrate transfer by the
substrate transfer system 10 according to the second embodiment will be described. - First, by referring to
FIG. 5 , description will be made with regard to an operation of transferring asubstrate 110 in thecassette 11 a, which is farther from thesubstrate transfer robot 12, to the placement position in theprocessing apparatus 220. Similarly to the first embodiment, thesubstrate transfer robot 12 moves thehand 125 to a position under asubstrate 110 in thecassette 11 a so as to support thesubstrate 110. Then, thesubstrate transfer robot 12 linearly moves thehand 125 toward the processing apparatus 220 (in the X1 direction), thereby pulling thesubstrate 110 out of thecassette 11 a, and takes the stand-by posture. Here, thesubstrate transfer robot 12 does not protrude into theprocessing apparatus 220. - Here, in the second embodiment, the
substrate transfer robot 12 in the stand-by posture moves thesupport shaft 122 up and down to move thefirst arm 123, thesecond arm 124, and thehand 125 to a height position corresponding to theopening 202 a. This ensures that thesubstrate transfer robot 12 is able to, in its later movements, protrude thefirst arm 123, thesecond arm 124, and thehand 125 into theprocessing apparatus 220 through the opening 202 a. The movements following the stand-by posture are similar to the movements in the first embodiment and will not be elaborated here. - The movements of the
substrate transfer robot 12 according to the second embodiment involved in the transfer of asubstrate 110 placed at a lowest position in thecassettes substrate transfer robot 12, to the placement position in theprocessing apparatus 220 are similar to the movements in the first embodiment and will not be elaborated here. In thesubstrate transfer robot 12 according to the second embodiment, it is not possible to transfersubstrates 110 other than thesubstrate 110 at the lowest position in thecassettes substrate transfer robot 12; otherwise, thesubstrate transfer robot 12 would come into contact with theprocessing apparatus 220. - The second embodiment is otherwise similar to the first embodiment.
- In the second embodiment, the opening 202 a is open through to a height corresponding to a
substrate 110 placed at thecassettes substrate transfer robot 12. When thesubstrate transfer robot 12 seeks access to a position in thecassettes substrate transfer robot 12, thesubstrate transfer robot 12 pulls thesubstrate 110 out of thecassette hand 125 and the arm (thefirst arm 123 and the second arm 124) in the height direction so as to protrude the arm into theprocessing apparatus 220 through the opening 202 a. This configuration diminishes therobot installment area 13 and ensures miniaturization while inhibiting an excessive increase in size of the opening 202 a. Inhibiting an excessive increase in size of the opening 202 a eliminates or minimizes contamination of therobot installment area 13, in which the air needs to be kept clean, by foreign matter through the opening 202 a. - The advantageous effects of the second embodiment are otherwise similar to the advantageous effects of the first embodiment.
- Next, a third embodiment will be described by referring to
FIG. 8 . In the third embodiment, arobot installment area 313 is defined between two processingapparatuses robot installment area 13 according to the first embodiment, which is defined between thesubstrate storage apparatus 11 and theprocessing apparatus 20. The same reference numerals designate identical or corresponding elements throughout the first and third embodiments, and these elements will not be elaborated here. - As shown in
FIG. 8 , in asubstrate processing system 300 according to the third embodiment, the twoprocessing apparatuses processing apparatus 320 has a configuration similar to the configuration of theprocessing apparatus 20 according to the first embodiment, and is symmetrical relative to theprocessing apparatus 20 about a center line between the twoprocessing apparatuses processing apparatus 320 includes afront wall 301 and anopening 302, which respectively correspond to therear wall 201 and theopening 202 of theprocessing apparatus 20. Theprocessing apparatus 320 is an example of the “first apparatus”, and thefront wall 301 is an example of the “first wall”. - The
robot installment area 313 according to the third embodiment is defined between therear wall 201 of theprocessing apparatus 20 and thefront wall 301 of theprocessing apparatus 320. In therobot installment area 313, thesubstrate transfer robot 12 is disposed. Thesubstrate transfer robot 12 is capable of transferring asubstrate 110 between the twoprocessing apparatuses substrate transfer robot 12 is disposed at such a position that the outer periphery of the minimal rotation area overlaps the inside of theprocessing apparatus 20 through theopening 202 of theprocessing apparatus 20. Also the position of thesubstrate transfer robot 12 is where the outer periphery of the minimal rotation area overlaps the inside of theprocessing apparatus 320 through theopening 302 of theprocessing apparatus 320. That is, the minimal rotation radius R of thesubstrate transfer robot 12 is larger than the distance between the center C1 of rotation of thefirst arm 123 and therear wall 201 of theprocessing apparatus 20, and is larger than the distance between the center C1 of rotation of thefirst arm 123 and thefront wall 301 of theprocessing apparatus 320. Thesubstrate transfer robot 12 is capable of 360-degree rotation when in the normal posture, in which thefirst arm 123, thesecond arm 124, and thehand 125 are superimposed over each other. - Also in the
substrate transfer robot 12, the center C1 of rotation of thefirst arm 123 is disposed at a position that faces both theopenings first arm 123 is disposed on a line L1 extending from the center of thesubstrate 110 placed at the placement position in theprocessing apparatus 20 to an approximate center of theopening 202. Also in the third embodiment, the twoprocessing apparatuses substrate transfer robot 12 are disposed such that the line L1 passes through the center of thesubstrate 110 at the placement position in theprocessing apparatus 320 and through an approximate center of theopening 302 of theprocessing apparatus 320. The center C1 of rotation of thefirst arm 123 is at an approximately equal distance from the twoprocessing apparatuses processing apparatus 320 is an example of the “first position”. - The third embodiment is otherwise similar to the first embodiment.
- In the third embodiment, the
substrate transfer robot 12 is disposed in therobot installment area 313 defined between the two opposingprocessing apparatuses substrate transfer robot 12 overlaps the insides of theprocessing apparatuses openings substrate transfer robot 12 and the oneprocessing apparatus 20 and the distance between thesubstrate transfer robot 12 and theother processing apparatus 320 at the same time. This diminishes therobot installment area 313 and ensures miniaturization of thesubstrate processing system 300 even when thesubstrate transfer robot 12 is disposed in therobot installment area 313 defined between the twoprocessing apparatuses - The advantageous effects of the third embodiment are otherwise similar to the advantageous effects of the first embodiment.
- Next, a fourth embodiment will be described by referring to
FIG. 9 . The fourth embodiment is different from the first embodiment in that aprocessing apparatus 420 has two placement positions located in directions approximately orthogonal to one another from the center C1 of rotation of thefirst arm 123. The same reference numerals designate identical or corresponding elements throughout the first and fourth embodiments, and these elements will not be elaborated here. - As shown in
FIG. 9 , in asubstrate processing system 400 according to the fourth embodiment, theprocessing apparatus 420 includes an approximately L-shapedwall 401. Thewall 401 includes arear wall 401 a and aside wall 401 b. Therear wall 401 a is approximately parallel to thefront wall 111 of thesubstrate storage apparatus 11, and theside wall 401 b is approximately perpendicular to thefront wall 111. Therear wall 401 a has an approximatelyrectangular opening 402. Theside wall 401 b has an approximatelyrectangular opening 403. Theprocessing apparatus 420 is an example of the “second apparatus”, and therear wall 401 a is an example of the “second wall”. - In the fourth embodiment, a
robot installment area 413 is defined between thefront wall 111 of thesubstrate storage apparatus 11 and the approximately L-shapedwall 401 of theprocessing apparatus 420. In therobot installment area 413, thesubstrate transfer robot 12 is disposed. Thesubstrate transfer robot 12 is capable of transferring asubstrate 110 among thesubstrate storage apparatus 11 and two placement positions in theprocessing apparatus 420. Also thesubstrate transfer robot 12 is disposed at such a position that the outer periphery of the minimal rotation area overlaps the inside of theprocessing apparatus 420 through theopening 402 of therear wall 401 a and theopening 403 of theside wall 401 b. That is, the minimal rotation radius R of thesubstrate transfer robot 12 is larger than the distance between the center C1 of rotation of thefirst arm 123 and therear wall 401 a, and larger than the distance between the center C1 of rotation of thefirst arm 123 and theside wall 401 b. The two placement positions in theprocessing apparatus 420 are examples of the “second position”. - In the
substrate transfer robot 12, the center C1 of rotation of thefirst arm 123 is disposed at a position that faces both theopenings first arm 123 is disposed on a line L3 extending from the center of asubstrate 110 placed at one placement position in theprocessing apparatus 420 to an approximate center of theopening 402 of therear wall 401 a. Also in plan view, the center C1 of rotation of thefirst arm 123 is disposed on a line L4 extending from the center of asubstrate 110 placed at the other placement position in theprocessing apparatus 420 to an approximate center of theopening 403 of theside wall 401 b. The line L3 and the line L4 are approximately orthogonal to one another. Thesubstrate transfer robot 12 is disposed such that the distance between the center C1 of rotation of thefirst arm 123 and thefront wall 111 of thesubstrate storage apparatus 11 is larger than the minimal rotation radius R. Thesubstrate transfer robot 12 is capable of 360-degree rotation when in the normal posture, in which thefirst arm 123, thesecond arm 124, and thehand 125 are superimposed over each other. - The fourth embodiment is otherwise similar to the first embodiment.
- In the fourth embodiment, the
processing apparatus 420 has two placement positions located in directions approximately orthogonal to one another from the center C1 of rotation of thefirst arm 123. In this configuration, the outer periphery of the minimal rotation area of thesubstrate transfer robot 12 overlaps the inside of theprocessing apparatus 420 through theopening 402 of therear wall 401 a and theopening 403 of theside wall 401 b. This reduces both the distance between thesubstrate transfer robot 12 and therear wall 401 a and the distance between thesubstrate transfer robot 12 and theside wall 401 b. This, in turn, diminishes therobot installment area 413 in two orthogonal directions (X direction and Y direction), therobot installment area 413 being defined by thefront wall 111 of thesubstrate storage apparatus 11, therear wall 401 a, and theside wall 401 b, which is approximately orthogonal to therear wall 401 a. - The advantageous effects of the fourth embodiment are otherwise similar to the advantageous effects of the first embodiment.
- In the first to fourth embodiments, the substrate transfer robot has been exemplified as including two arms (the first arm and the second arm). This, however, should not be construed in a limiting sense. The substrate transfer robot may include a single arm or three or more arms.
- Also in the first to fourth embodiments, the substrate transfer robot has been exemplified as including a single hand. This, however, should not be construed in a limiting sense. As shown in
FIG. 10 , asubstrate transfer robot 512 including two hands is also possible. A substrate transfer robot including three or more hands is also possible. - In the first embodiment, the imaginary line has been exemplified as being at an approximately equal distance from the first wall and the second wall. This, however, should not be construed in a limiting sense. The imaginary line may be closer to either the first wall or the second wall insofar as no interference occurs between the substrate transfer robot and the first and second walls when the substrate transfer robot changes from the first intermediate posture to the second intermediate posture.
- Also in the first to fourth embodiments, the robot installment area has been exemplified as being defined between the front wall (first wall) and the rear wall (second wall) that are approximately parallel to one another. This, however, should not be construed in a limiting sense. The robot installment area may be defined between a first wall and a second wall that are orthogonal to one another.
- Also in the first to fourth embodiments, the second apparatus has been exemplified as a processing apparatus in a manufacturing process of a semiconductor device. This, however, should not be construed in a limiting sense. The second apparatus may be other than the processing apparatus in a manufacturing process of a semiconductor device. Other examples include a temporary substrate stand apparatus to forward a substrate to a next step.
- Also in the first to fourth embodiments, the center of rotation of the first arm has been exemplified as being on a line extending from the center of the substrate placed at the placement position in the processing apparatus (second apparatus) to an approximate center of the opening. This, however, should not be construed in a limiting sense. The center of rotation of the first arm may be off the line extending from the center of the substrate placed at the placement position in the second apparatus to an approximate center of the opening, insofar as the center of rotation of the first arm is disposed at a position that faces the opening.
- Also in the first to fourth embodiments, the first distance between the center of rotation of the first arm and the distal end of the first arm, the second distance between the center of rotation of the first arm and the distal end of the second arm, and the third distance between the center of rotation of the first arm and the distal end of the substrate supported by the hand are approximately equal to each other, and the first to third distances are larger than the distance between the center of rotation of the first arm and the rear wall (second wall). This, however, should not be construed in a limiting sense. At least one distance among the first to third distances may be larger than the distance between the center of rotation of the first arm and the second wall.
- Also in the first to fourth embodiments, the opening has been exemplified as being provided on the rear wall (second wall) of the processing apparatus serving as the second apparatus. This, however, should not be construed in a limiting sense. For example, it is possible to provide the first apparatus with both a first wall and a second wall provided with an opening. It is also possible to provide a second wall separate from the first apparatus and the second apparatus, and provide an opening on the second wall.
- In the first and second embodiments, when the substrate is transferred from any of the cassettes, the first arm and the second arm have been exemplified as being oriented in one direction (in the Y1 direction) from the center of rotation of the first arm in the third intermediate posture. This, however, should not be construed in a limiting sense. To minimize the time spent in transferring the substrate, it is possible in the third intermediate posture to change the orientation of the first arm and the second arm conveniently depending on the position of the cassette.
- In the second embodiment, the
cassettes cassettes cassettes cassettes cassettes - Obviously, numerous modifications and variations of the present disclosure are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the present disclosure may be practiced otherwise than as specifically described herein.
Claims (20)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/073,871 US9293355B2 (en) | 2012-11-09 | 2013-11-07 | Substrate transfer system and substrate processing system |
US14/810,408 US9620405B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,406 US9252035B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,409 US9252036B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US15/016,272 US9570336B2 (en) | 2012-11-09 | 2016-02-05 | Substrate transfer system and substrate processing system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261724435P | 2012-11-09 | 2012-11-09 | |
US14/073,871 US9293355B2 (en) | 2012-11-09 | 2013-11-07 | Substrate transfer system and substrate processing system |
Related Child Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/810,406 Division US9252035B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,409 Division US9252036B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,408 Division US9620405B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US15/016,272 Continuation US9570336B2 (en) | 2012-11-09 | 2016-02-05 | Substrate transfer system and substrate processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140133942A1 true US20140133942A1 (en) | 2014-05-15 |
US9293355B2 US9293355B2 (en) | 2016-03-22 |
Family
ID=50681842
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/073,871 Active US9293355B2 (en) | 2012-11-09 | 2013-11-07 | Substrate transfer system and substrate processing system |
US14/810,408 Active 2034-02-06 US9620405B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,406 Active US9252035B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,409 Active US9252036B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US15/016,272 Active US9570336B2 (en) | 2012-11-09 | 2016-02-05 | Substrate transfer system and substrate processing system |
Family Applications After (4)
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US14/810,408 Active 2034-02-06 US9620405B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,406 Active US9252035B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US14/810,409 Active US9252036B2 (en) | 2012-11-09 | 2015-07-27 | Substrate transfer system, substrate processing system, and substrate transfer robot |
US15/016,272 Active US9570336B2 (en) | 2012-11-09 | 2016-02-05 | Substrate transfer system and substrate processing system |
Country Status (1)
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US (5) | US9293355B2 (en) |
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US9570336B2 (en) | 2012-11-09 | 2017-02-14 | Kabushiki Kaisha Yaskawa Denki | Substrate transfer system and substrate processing system |
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KR101527901B1 (en) * | 2013-10-10 | 2015-06-10 | 피에스케이 주식회사 | Apparatus for treating substrate and method for transfering substrate |
JP6468159B2 (en) * | 2015-10-15 | 2019-02-13 | 株式会社安川電機 | Transport system and transport method |
JP7033078B2 (en) * | 2016-12-13 | 2022-03-09 | 川崎重工業株式会社 | Robot teaching method |
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Also Published As
Publication number | Publication date |
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US9252036B2 (en) | 2016-02-02 |
US9252035B2 (en) | 2016-02-02 |
US20150332946A1 (en) | 2015-11-19 |
US9293355B2 (en) | 2016-03-22 |
US9570336B2 (en) | 2017-02-14 |
US20150332945A1 (en) | 2015-11-19 |
US20150332947A1 (en) | 2015-11-19 |
US9620405B2 (en) | 2017-04-11 |
US20160148830A1 (en) | 2016-05-26 |
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