US20140070307A1 - Multi-layer work function metal replacement gate - Google Patents
Multi-layer work function metal replacement gate Download PDFInfo
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- US20140070307A1 US20140070307A1 US13/615,343 US201213615343A US2014070307A1 US 20140070307 A1 US20140070307 A1 US 20140070307A1 US 201213615343 A US201213615343 A US 201213615343A US 2014070307 A1 US2014070307 A1 US 2014070307A1
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 75
- 239000002184 metal Substances 0.000 title claims abstract description 75
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 150000004767 nitrides Chemical class 0.000 claims abstract description 15
- 230000005669 field effect Effects 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 37
- 239000010936 titanium Substances 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 185
- 238000000034 method Methods 0.000 description 24
- 238000000231 atomic layer deposition Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
Definitions
- the present disclosure relates to a multi-layer work function metal replacement gate, and in particular to layers of work function metals that conform to a shape of a trench structure and which are variable to adjust work function levels of a replacement gate structure.
- Field-effect transistors generate an electric field, by a gate structure, to control the conductivity of a channel between source and drain structures in a semiconductor substrate.
- the source and drain structures may be formed by doping the semiconductor substrate, and the gate may be formed on the semiconductor substrate between the source and drain regions.
- a source and drain structure may be formed on the substrate, and a channel may extend between the source and the drain on the semiconductor substrate.
- the gate structure may be formed on the channel.
- the gate of a finFET may be formed by a replacement gate process, or a process in which material, such as dummy material, is removed to form a trench, and the gate materials replace the removed material in the trench.
- the trench may be defined by a plurality of channels and the source and drain structures.
- the trench may be formed by insulating separators, for example.
- the gate may be formed by depositing a work function metal in the trench and forming a metal gap fill on the work function metal.
- Titanium aluminum (TiAl) has been used as a replacement gate work function metal, but TiAl has been limited to non-conformal methods of application, such as physical vapor deposition (PVD), in which an upper surface of the deposited material does not conform to a shape of the surface on which the material is deposited, making TiAl less-than-ideal as a replacement gate work function metal.
- PVD physical vapor deposition
- use of Al-based metal electrodes causes gate leakage current degradation due to a strong oxygen gettering effect.
- Exemplary embodiments include a field-effect transistor (FET) replacement gate apparatus.
- the apparatus includes a channel structure including a base and side walls defining a trench.
- a high-dielectric constant (high-k) layer is formed on the base and side walls of the trench.
- the high-k layer has an upper surface conforming to a shape of the trench.
- a first layer is formed on the high-k layer.
- the first layer conforms to the shape of the trench.
- the first layer includes an aluminum-free metal nitride.
- a second layer is formed on the first layer and conforms to the shape of the trench.
- the second layer includes aluminum and at least one other metal.
- a third layer is formed on the second layer and conforms to the shape of the trench.
- the third layer includes an aluminum-free metal nitride.
- Additional exemplary embodiments include a field-effect transistor replacement gate apparatus.
- the apparatus includes a substrate and side walls extending from the substrate to form a trench.
- a high dielectric constant (high-k) layer is formed on at least the substrate.
- a first layer is formed on the high-k layer.
- the first layer includes an aluminum-free metal nitride.
- a second layer is formed on the first layer.
- the second layer includes aluminum and at least one other metal.
- the ratio of the aluminum to the at least one other metal is a gradient with a peak located in a center region of the second layer and troughs located at ends of the second layer.
- the third layer is formed on the second layer.
- the third layer includes an aluminum-free metal nitride.
- FIG. 1 illustrates a replacement gate structure according to one embodiment of the present disclosure
- FIG. 2A illustrates a ratio of aluminum to another metal in a layer of a group of work function metals according to one embodiment
- FIG. 2B illustrates a ratio of aluminum to another metal in a layer of a group of work function metals according to another embodiment
- FIGS. 3A-3E illustrate a method of forming the replacement gate structure according to one embodiment, in which:
- FIG. 3A illustrates forming a high-dielectric-constant material on a substrate
- FIG. 3B illustrates forming a first layer of a group of work function metal layers
- FIG. 3C illustrates forming a second layer of a group of work function metal layers
- FIG. 3D illustrates forming a third layer of a group of work function metal layers
- FIG. 3E illustrates forming a gap fill metal layer
- FIG. 4 illustrates a flowchart of a method for forming the replacement gate structure according to one embodiment.
- Disclosed embodiments relate to work function metal layers that conform to a shape of a replacement gate trench, reduce gate leakage current, and may have an adjustable work function value.
- FIG. 1 illustrates a replacement gate field-effect transistor (FET) structure 100 according to one embodiment of the present disclosure.
- the structure 100 includes a substrate 101 , which may be a semiconductor substrate, such as a silicon substrate for example.
- the structure 100 includes side walls 102 extending from the substrate 101 .
- the substrate is a doped semiconductor substrate 101 having been doped to include source and drain regions (not shown).
- the side walls 102 may be insulators.
- the structure 100 is a finFET structure, and the side walls 102 comprise channels or fins 102 extending between a source and a drain structure formed on the substrate 101 .
- the side walls 102 may be the source and drain structures formed on the substrate 101 .
- the substrate 101 and side walls 102 define a trench 103 .
- the structure 100 further includes a high-dielectric constant (high-k) layer 104 formed on the side walls 102 and on the substrate 101 .
- the high-k layer 104 may be formed directly on the substrate, for example.
- the high-k layer 104 includes hafnium (Hf), such as hafnium dioxide (HfO 2 ).
- the high-k layer 104 is formed to conform to the shape of the trench 103 .
- the high-k layer 104 may be formed by an atomic layer deposition (ALD) process which results in a conforming layer.
- ALD atomic layer deposition
- the structure illustrated in FIG. 1 may correspond, for example, to a finFET in which the side walls 102 are channels extending between a source structure and a drain structure, or the side walls 102 may be the source structure and the drain structure.
- embodiments of the present disclosure also encompass planar FET embodiments in which the side walls 102 are insulation layers.
- the high-k layer 104 may be formed either to conform to the side walls 102 or may be formed only at the base of the trench 104 .
- the structure 100 further includes a work function metal layer group 105 .
- the work function metal layer group 105 includes a first layer 106 formed on the high-k layer 104 , a second layer 107 formed on the first layer 106 , and a third layer 108 formed on the second layer 107 .
- the first layer 106 is formed directly on the high-k layer 104
- the second layer 107 is formed directly on the first layer 106
- the third layer 108 is formed directly on the second layer 107 .
- the first and third layers comprise an aluminum-free metal nitride layer.
- the first and third layers 106 and 108 may be titanium nitride (TiN) or tantalum nitride (TaN).
- the first layer 106 does not include oxygen.
- the second layer 107 is a metal layer including aluminum and at least one other metal.
- the second layer 107 may be made up of titanium and aluminum (TiAl) without nitrogen, or the second layer may be made up of titanium, aluminum and nitrogen (TiAlN).
- the second layer 107 may be formed to have varying ratios of aluminum (Al) to another metal. Titanium (Ti) will be described in the following example for purposes of clarity. However, embodiments of the present disclosure encompass any appropriate metal in combination with aluminum.
- the ratio of Al:(Al+Ti) may be adjusted to adjust a work function of the structure 100 . In one embodiment, a ratio of Al:(Al+Ti) is substantially constant throughout the entire second layer 107 .
- the second layer 107 may be formed by ALD, and the ratio may be maintained constant by depositing layers of Al and Ti in a particular sequence. In one embodiment, the ratio of Al:(Al+Ti) in the second layer is a gradient having a peak at a center portion of the layer.
- the center portion may correspond, for example, to about +/ ⁇ 10% of the height of the second layer 107 from a center plane of the second layer 107 .
- layers of Al may be deposited in an ALD process with a greater frequency when forming the center portion of the second layer 107 than when forming the end portions.
- FIGS. 2A and 2B illustrate the ratio of Al to Al+Ti according to embodiments of the present disclosure.
- a ratio of Al to Al+Ti is zero in regions corresponding to the first and third layers 106 and 108 , since these layers include no Al.
- the ratio of Al to Al+Ti is constant.
- a sequence of deposition of Al and Ti layers may be maintained constant throughout the formation of the second layer 107 .
- a ratio of Al to Al+Ti is still zero in regions corresponding to the first and third layers 106 and 108 , since these layers include no Al.
- the ratio of Al to Al+Ti is a gradient that increases from the edges of the second layer 107 and reaches a peak at a center region of the second layer 107 .
- a sequence of deposition of Al and Ti layers may be maintained altered so that layers of Al are deposited with increased frequency relative to layers of Ti in the center region of the second layer 107 .
- embodiments of the present disclosure further encompass controlling the work function of the structure 100 based on a thickness of the first layer 106 .
- the thickness of the first layer 106 is formed or designed such that the work function of the work function metal layers 105 corresponds to a quarter-gap work function.
- Embodiments of the present disclosure further encompass controlling gate leakage current levels by controlling the thickness of the first layer 106 and the ratio of Al:(Al+Ti) in the second layer 107 .
- the first layer 106 has a thickness between about 10 angstroms ( ⁇ ) and about 30 ⁇
- the second layer 107 has a thickness between about 10 A and about 60 A
- the third layer 108 has a thickness between about 10 ⁇ and 30 ⁇ .
- the structure 100 further includes a gap fill metal 109 formed on the third layer 108 .
- the gap fill metal 109 is formed directly on the third layer 108 .
- the gap fill metal 109 may be a non-conforming metal, or may be formed by a non-conforming process, such as PVD.
- the gap fill metal 109 may also be formed by a conforming process, such as ALD or chemical vapor deposition (CVD).
- the gap fill metal 109 is aluminum.
- embodiments of the present disclosure encompass any conductive metal.
- FIGS. 3A to 3E illustrate a process for forming a replacement gate structure 100 according to an embodiment of the disclosure.
- FIGS. 3A to 3E illustrate a portion of the replacement gate structure 100 around one replacement gate structure 100 .
- the described layers may be of any length and width dimensions, and multiple replacement gate structures 100 may be formed.
- FIG. 4 is a flow diagram of a method of forming a replacement gate structure according to an embodiment of the present disclosure. The formation of the structure 100 will be described below with reference to FIGS. 3A to 3E and 4 .
- a substrate 100 is formed and side walls 102 are formed.
- the substrate 101 may be a semiconductor substrate or a silicon substrate.
- the substrate may be a doped semiconductor substrate 101 having been doped to include source and drain regions (not shown).
- the side walls 102 may be insulators.
- the structure 100 is a finFET structure, and the side walls 102 comprise channels or fins 102 extending between a source and a drain structure formed on the substrate 101 .
- the side walls 102 may be the source and drain structures formed on the substrate 101 .
- the substrate 101 and side walls 102 define a trench 103 .
- a high-dielectric constant (high-k) layer 104 is formed on the substrate 101 and side walls 102 .
- the high-k layer 104 may be formed directly on the substrate 101 , for example.
- the high-k layer 104 includes hafnium (Hf), such as hafnium dioxide (HfO 2 ).
- the high-k layer 104 is formed to conform to the shape of the trench 103 .
- the high-k layer 104 may be formed by an atomic layer deposition (ALD) process which results in a conforming layer.
- ALD atomic layer deposition
- a first layer 106 is formed on the high-k layer 104 .
- the first layer 106 may be formed directly on the high-k layer 104 .
- the first layer 106 may be formed by a conforming process.
- the first layer 106 is formed by ALD.
- the first layer may be an aluminum-free metal nitride layer.
- the first layer 106 may be titanium nitride (TiN) or tantalum nitride (TaN).
- the first layer 106 does not include oxygen and is not modified during fabrication of the structure 100 to include oxygen.
- a height of the first layer 106 is adjusted to adjust a work function of the work function metal group 105 (see FIGS.
- the thickness of the first layer 106 is formed such that the work function of the work function metal group 105 corresponds to a quarter-gap work function. In one embodiment, the first layer 106 has a thickness between about 10 ⁇ and about 30 ⁇ .
- a second layer 107 is formed on the first layer 106 .
- the second layer 107 may be formed directly on the first layer 106 .
- the second layer 107 may be formed by a conforming process.
- the second layer 107 is formed by ALD.
- the second layer 107 is a metal layer including aluminum and at least one other metal.
- the second layer 107 may be made up of titanium and aluminum (TiAl) without nitrogen.
- the second layer may be made up of titanium, aluminum and nitrogen (TiAlN).
- the second layer 107 may be formed by applying layers of Al and one or more additional metals in sequential atomic layers in an ALD process.
- layers of Ti and Al may be deposited in sequence in predetermined ratios.
- the ratio of Al:(Al+Ti) may be adjusted to adjust a work function of the structure 100 .
- a ratio of Al:(Al+Ti) is substantially constant throughout the entire second layer 107 .
- layers of Al and Ti are deposited by an ALD process in constant ratios.
- the ratio of Al:(Al+Ti) in the second layer is a gradient having a peak at a center portion of the layer. The center portion may correspond, for example, to about +/ ⁇ 10% of the height of the second layer 107 from a center plane of the second layer 107 .
- layers of Al may be deposited in an ALD process with a greater frequency when forming the center portion of the second layer 107 than when forming the end portions, relative to a frequency with which the Ti layers are deposited.
- the percentage of Al relative to Al+Ti in the second layer 107 is between about 10% and about 90%.
- the second layer 107 is formed by depositing layers of titanium nitride (TiN) and titanium aluminum nitride (TiAlN) in a particular sequence to obtain a layer of TiAlN having a predetermined ratio of Al:Ti, or a predetermined gradient of ratios of Al:Ti throughout the second layer 107 .
- the second layer 107 may be formed to have a thickness between 10 ⁇ and 60 ⁇ .
- a third layer 108 is formed on the second layer 107 .
- the third layer 108 may be formed directly on the second layer 107 .
- the third layer 108 may be formed by a conforming process.
- the third layer 108 is formed by ALD.
- the third layer may be an aluminum-free metal nitride layer.
- the third layer 108 may be titanium nitride (TiN) or tantalum nitride (TaN).
- the third layer 108 has a thickness between about 10 A and about 30 A. The formation of the third layer 108 may prevent undesired oxidation of the second layer 107 by air exposure.
- the first, second and third layers 106 , 107 and 108 are formed in situ, or in a same chamber in sequential order, without exposing the chamber to external air between the deposition processes of the respective layers.
- the first, second and third layers 106 , 107 and 108 may all be formed by ALD, they may all be performed in the same chamber without exposing the layers to air, and undesired oxidation of the layers 106 , 107 and 108 may be avoided.
- a gap fill metal 109 is formed on the third layer 108 .
- the gap fill metal 109 may be formed directly on the third layer 108 .
- the gap fill metal 109 may be any conductive metal, such as aluminum or tungsten.
- the gap fill metal 109 may be formed in a conforming process, such as ALD, or a non-conforming process, such as PVD.
- a final replacement gate structure 100 may be formed by removing, or polishing off, the top surface layers down to the top surface of the side walls 102 by chemical mechanical polish, for example. The final replacement gate structure 100 is illustrated in FIG. 1 .
- Embodiments of the present disclosure encompass a multi-layered work function metal group of a replacement gate structure.
- the work function metal group includes a layer of aluminum and at least one other metal between two layers of a metal nitride that does not contain aluminum.
- the layers are formed on a high-k layer, and all of the layers are formed by an ALD process to conform to a shape of a substrate and side walls on which the layers are formed.
- the layer including aluminum and at least one other metal may have a higher concentration of aluminum towards a center of the layer relative to the edges of the layer.
- the concentration of aluminum may be adjusted according to predetermined designs to achieve a particular work function, and to reduce gate leakage current.
- the top-most aluminum-free metal nitride layer prevents undesired oxidation of the aluminum-containing layer by air exposure.
- the entire metal group, and the high-k layer may be formed by ALD to be compatible with replacement gates, such as finFET structures.
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Abstract
Description
- The present disclosure relates to a multi-layer work function metal replacement gate, and in particular to layers of work function metals that conform to a shape of a trench structure and which are variable to adjust work function levels of a replacement gate structure.
- Field-effect transistors (FETs) generate an electric field, by a gate structure, to control the conductivity of a channel between source and drain structures in a semiconductor substrate. The source and drain structures may be formed by doping the semiconductor substrate, and the gate may be formed on the semiconductor substrate between the source and drain regions. Alternatively, a source and drain structure may be formed on the substrate, and a channel may extend between the source and the drain on the semiconductor substrate. In such a structure, referred to as a finFET due to the fin-like shape of the channel, the gate structure may be formed on the channel.
- The gate of a finFET, and in some non-finFETs, may be formed by a replacement gate process, or a process in which material, such as dummy material, is removed to form a trench, and the gate materials replace the removed material in the trench. In a finFET, the trench may be defined by a plurality of channels and the source and drain structures. In other FETs, as well as in finFETs, the trench may be formed by insulating separators, for example. The gate may be formed by depositing a work function metal in the trench and forming a metal gap fill on the work function metal. Titanium aluminum (TiAl) has been used as a replacement gate work function metal, but TiAl has been limited to non-conformal methods of application, such as physical vapor deposition (PVD), in which an upper surface of the deposited material does not conform to a shape of the surface on which the material is deposited, making TiAl less-than-ideal as a replacement gate work function metal. In addition, use of Al-based metal electrodes causes gate leakage current degradation due to a strong oxygen gettering effect.
- Exemplary embodiments include a field-effect transistor (FET) replacement gate apparatus. The apparatus includes a channel structure including a base and side walls defining a trench. A high-dielectric constant (high-k) layer is formed on the base and side walls of the trench. The high-k layer has an upper surface conforming to a shape of the trench. A first layer is formed on the high-k layer. The first layer conforms to the shape of the trench. The first layer includes an aluminum-free metal nitride. A second layer is formed on the first layer and conforms to the shape of the trench. The second layer includes aluminum and at least one other metal. A third layer is formed on the second layer and conforms to the shape of the trench. The third layer includes an aluminum-free metal nitride.
- Additional exemplary embodiments include a field-effect transistor replacement gate apparatus. The apparatus includes a substrate and side walls extending from the substrate to form a trench. A high dielectric constant (high-k) layer is formed on at least the substrate. A first layer is formed on the high-k layer. The first layer includes an aluminum-free metal nitride. A second layer is formed on the first layer. The second layer includes aluminum and at least one other metal. The ratio of the aluminum to the at least one other metal is a gradient with a peak located in a center region of the second layer and troughs located at ends of the second layer. The third layer is formed on the second layer. The third layer includes an aluminum-free metal nitride.
- Additional features and advantages are realized through the techniques of the present disclosure. Other embodiments and aspects of the present disclosure are described in detail herein and are considered a part of the claimed disclosure. For a better understanding of the disclosure with the advantages and the features, refer to the description and to the drawings.
- The subject matter of the disclosure is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The forgoing and other features, and advantages of the disclosure are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
-
FIG. 1 illustrates a replacement gate structure according to one embodiment of the present disclosure; -
FIG. 2A illustrates a ratio of aluminum to another metal in a layer of a group of work function metals according to one embodiment; -
FIG. 2B illustrates a ratio of aluminum to another metal in a layer of a group of work function metals according to another embodiment; -
FIGS. 3A-3E illustrate a method of forming the replacement gate structure according to one embodiment, in which: -
FIG. 3A illustrates forming a high-dielectric-constant material on a substrate; -
FIG. 3B illustrates forming a first layer of a group of work function metal layers; -
FIG. 3C illustrates forming a second layer of a group of work function metal layers; -
FIG. 3D illustrates forming a third layer of a group of work function metal layers; -
FIG. 3E illustrates forming a gap fill metal layer; and -
FIG. 4 illustrates a flowchart of a method for forming the replacement gate structure according to one embodiment. - Conventional replacement gate work function metals suffer from gate leakage current degradation due to material types and processes for applying the materials. Disclosed embodiments relate to work function metal layers that conform to a shape of a replacement gate trench, reduce gate leakage current, and may have an adjustable work function value.
-
FIG. 1 illustrates a replacement gate field-effect transistor (FET)structure 100 according to one embodiment of the present disclosure. Thestructure 100 includes asubstrate 101, which may be a semiconductor substrate, such as a silicon substrate for example. Thestructure 100 includesside walls 102 extending from thesubstrate 101. In one embodiment, the substrate is a dopedsemiconductor substrate 101 having been doped to include source and drain regions (not shown). In such an embodiment, theside walls 102 may be insulators. In another embodiment, thestructure 100 is a finFET structure, and theside walls 102 comprise channels orfins 102 extending between a source and a drain structure formed on thesubstrate 101. Alternatively, theside walls 102 may be the source and drain structures formed on thesubstrate 101. Thesubstrate 101 andside walls 102 define atrench 103. - The
structure 100 further includes a high-dielectric constant (high-k)layer 104 formed on theside walls 102 and on thesubstrate 101. The high-k layer 104 may be formed directly on the substrate, for example. In one embodiment, the high-k layer 104 includes hafnium (Hf), such as hafnium dioxide (HfO2). In one embodiment, the high-k layer 104 is formed to conform to the shape of thetrench 103. For example, the high-k layer 104 may be formed by an atomic layer deposition (ALD) process which results in a conforming layer. - The structure illustrated in
FIG. 1 may correspond, for example, to a finFET in which theside walls 102 are channels extending between a source structure and a drain structure, or theside walls 102 may be the source structure and the drain structure. However, embodiments of the present disclosure also encompass planar FET embodiments in which theside walls 102 are insulation layers. In such a case, the high-k layer 104 may be formed either to conform to theside walls 102 or may be formed only at the base of thetrench 104. - The
structure 100 further includes a work functionmetal layer group 105. The work functionmetal layer group 105 includes afirst layer 106 formed on the high-k layer 104, asecond layer 107 formed on thefirst layer 106, and athird layer 108 formed on thesecond layer 107. In one embodiment, thefirst layer 106 is formed directly on the high-k layer 104, thesecond layer 107 is formed directly on thefirst layer 106, and thethird layer 108 is formed directly on thesecond layer 107. In one embodiment, the first and third layers comprise an aluminum-free metal nitride layer. For example, the first andthird layers first layer 106 does not include oxygen. In one embodiment, thesecond layer 107 is a metal layer including aluminum and at least one other metal. For example, thesecond layer 107 may be made up of titanium and aluminum (TiAl) without nitrogen, or the second layer may be made up of titanium, aluminum and nitrogen (TiAlN). - The
second layer 107 may be formed to have varying ratios of aluminum (Al) to another metal. Titanium (Ti) will be described in the following example for purposes of clarity. However, embodiments of the present disclosure encompass any appropriate metal in combination with aluminum. The ratio of Al:(Al+Ti) may be adjusted to adjust a work function of thestructure 100. In one embodiment, a ratio of Al:(Al+Ti) is substantially constant throughout the entiresecond layer 107. Thesecond layer 107 may be formed by ALD, and the ratio may be maintained constant by depositing layers of Al and Ti in a particular sequence. In one embodiment, the ratio of Al:(Al+Ti) in the second layer is a gradient having a peak at a center portion of the layer. The center portion may correspond, for example, to about +/−10% of the height of thesecond layer 107 from a center plane of thesecond layer 107. In such an embodiment, layers of Al may be deposited in an ALD process with a greater frequency when forming the center portion of thesecond layer 107 than when forming the end portions. -
FIGS. 2A and 2B illustrate the ratio of Al to Al+Ti according to embodiments of the present disclosure. As illustrated inFIG. 2A , in one embodiment a ratio of Al to Al+Ti is zero in regions corresponding to the first andthird layers second layer 107, the ratio of Al to Al+Ti is constant. In other words, when forming thesecond layer 107 by ALD, a sequence of deposition of Al and Ti layers may be maintained constant throughout the formation of thesecond layer 107. - As illustrated in
FIG. 2B , in another embodiment, a ratio of Al to Al+Ti is still zero in regions corresponding to the first andthird layers second layer 107, the ratio of Al to Al+Ti is a gradient that increases from the edges of thesecond layer 107 and reaches a peak at a center region of thesecond layer 107. In other words, when forming thesecond layer 107 by ALD, a sequence of deposition of Al and Ti layers may be maintained altered so that layers of Al are deposited with increased frequency relative to layers of Ti in the center region of thesecond layer 107. - Referring again to
FIG. 1 , in addition to controlling the work function of thestructure 100 based on the ratio of Al:(Al+Ti) in thesecond layer 107, embodiments of the present disclosure further encompass controlling the work function of thestructure 100 based on a thickness of thefirst layer 106. In one embodiment, the thickness of thefirst layer 106 is formed or designed such that the work function of the work function metal layers 105 corresponds to a quarter-gap work function. Embodiments of the present disclosure further encompass controlling gate leakage current levels by controlling the thickness of thefirst layer 106 and the ratio of Al:(Al+Ti) in thesecond layer 107. - In one embodiment, the
first layer 106 has a thickness between about 10 angstroms (Å) and about 30 Å, thesecond layer 107 has a thickness between about 10 A and about 60 A, and thethird layer 108 has a thickness between about 10 Å and 30 Å. - The
structure 100 further includes agap fill metal 109 formed on thethird layer 108. In one embodiment, the gap fillmetal 109 is formed directly on thethird layer 108. The gap fillmetal 109 may be a non-conforming metal, or may be formed by a non-conforming process, such as PVD. Alternatively, the gap fillmetal 109 may also be formed by a conforming process, such as ALD or chemical vapor deposition (CVD). In one embodiment, the gap fillmetal 109 is aluminum. However, embodiments of the present disclosure encompass any conductive metal. -
FIGS. 3A to 3E illustrate a process for forming areplacement gate structure 100 according to an embodiment of the disclosure.FIGS. 3A to 3E illustrate a portion of thereplacement gate structure 100 around onereplacement gate structure 100. However, it is understood that the described layers may be of any length and width dimensions, and multiplereplacement gate structures 100 may be formed.FIG. 4 is a flow diagram of a method of forming a replacement gate structure according to an embodiment of the present disclosure. The formation of thestructure 100 will be described below with reference toFIGS. 3A to 3E and 4. - In
block 401 ofFIG. 4 , asubstrate 100 is formed andside walls 102 are formed. Thesubstrate 101 may be a semiconductor substrate or a silicon substrate. The substrate may be a dopedsemiconductor substrate 101 having been doped to include source and drain regions (not shown). In such an embodiment, theside walls 102 may be insulators. In another embodiment, thestructure 100 is a finFET structure, and theside walls 102 comprise channels orfins 102 extending between a source and a drain structure formed on thesubstrate 101. Alternatively, theside walls 102 may be the source and drain structures formed on thesubstrate 101. Thesubstrate 101 andside walls 102 define atrench 103. - In
block 402 and inFIG. 3A , a high-dielectric constant (high-k)layer 104 is formed on thesubstrate 101 andside walls 102. The high-k layer 104 may be formed directly on thesubstrate 101, for example. In one embodiment, the high-k layer 104 includes hafnium (Hf), such as hafnium dioxide (HfO2). In one embodiment, the high-k layer 104 is formed to conform to the shape of thetrench 103. For example, the high-k layer 104 may be formed by an atomic layer deposition (ALD) process which results in a conforming layer. The ALD process is represented by arrows inFIGS. 3A to 3D . - In
block 403 and inFIG. 3B , afirst layer 106 is formed on the high-k layer 104. Thefirst layer 106 may be formed directly on the high-k layer 104. Thefirst layer 106 may be formed by a conforming process. In one embodiment, thefirst layer 106 is formed by ALD. The first layer may be an aluminum-free metal nitride layer. For example, thefirst layer 106 may be titanium nitride (TiN) or tantalum nitride (TaN). In one embodiment, thefirst layer 106 does not include oxygen and is not modified during fabrication of thestructure 100 to include oxygen. In one embodiment, a height of thefirst layer 106 is adjusted to adjust a work function of the work function metal group 105 (seeFIGS. 1 and 3E ). In one embodiment, the thickness of thefirst layer 106 is formed such that the work function of the workfunction metal group 105 corresponds to a quarter-gap work function. In one embodiment, thefirst layer 106 has a thickness between about 10 Å and about 30 Å. - In
block 404 and inFIG. 3C , asecond layer 107 is formed on thefirst layer 106. Thesecond layer 107 may be formed directly on thefirst layer 106. Thesecond layer 107 may be formed by a conforming process. In one embodiment, thesecond layer 107 is formed by ALD. In one embodiment, thesecond layer 107 is a metal layer including aluminum and at least one other metal. For example, thesecond layer 107 may be made up of titanium and aluminum (TiAl) without nitrogen. Alternatively, the second layer may be made up of titanium, aluminum and nitrogen (TiAlN). Thesecond layer 107 may be formed by applying layers of Al and one or more additional metals in sequential atomic layers in an ALD process. In an embodiment in which thesecond layer 107 comprises TiAl, layers of Ti and Al may be deposited in sequence in predetermined ratios. - In the embodiment in which the second layer includes TiAl, the ratio of Al:(Al+Ti) may be adjusted to adjust a work function of the
structure 100. In one embodiment, a ratio of Al:(Al+Ti) is substantially constant throughout the entiresecond layer 107. In other words, layers of Al and Ti are deposited by an ALD process in constant ratios. In one embodiment, the ratio of Al:(Al+Ti) in the second layer is a gradient having a peak at a center portion of the layer. The center portion may correspond, for example, to about +/−10% of the height of thesecond layer 107 from a center plane of thesecond layer 107. In such an embodiment, layers of Al may be deposited in an ALD process with a greater frequency when forming the center portion of thesecond layer 107 than when forming the end portions, relative to a frequency with which the Ti layers are deposited. - In one embodiment, the percentage of Al relative to Al+Ti in the
second layer 107 is between about 10% and about 90%. In one embodiment, thesecond layer 107 is formed by depositing layers of titanium nitride (TiN) and titanium aluminum nitride (TiAlN) in a particular sequence to obtain a layer of TiAlN having a predetermined ratio of Al:Ti, or a predetermined gradient of ratios of Al:Ti throughout thesecond layer 107. Thesecond layer 107 may be formed to have a thickness between 10 Å and 60 Å. - In
block 405 and inFIG. 3D , athird layer 108 is formed on thesecond layer 107. Thethird layer 108 may be formed directly on thesecond layer 107. Thethird layer 108 may be formed by a conforming process. In one embodiment, thethird layer 108 is formed by ALD. The third layer may be an aluminum-free metal nitride layer. For example, thethird layer 108 may be titanium nitride (TiN) or tantalum nitride (TaN). In one embodiment, thethird layer 108 has a thickness between about 10 A and about 30 A. The formation of thethird layer 108 may prevent undesired oxidation of thesecond layer 107 by air exposure. - In one embodiment, the first, second and
third layers third layers layers - In
block 406 and inFIG. 3E agap fill metal 109 is formed on thethird layer 108. The gap fillmetal 109 may be formed directly on thethird layer 108. The gap fillmetal 109 may be any conductive metal, such as aluminum or tungsten. The gap fillmetal 109 may be formed in a conforming process, such as ALD, or a non-conforming process, such as PVD. In addition, a finalreplacement gate structure 100 may be formed by removing, or polishing off, the top surface layers down to the top surface of theside walls 102 by chemical mechanical polish, for example. The finalreplacement gate structure 100 is illustrated inFIG. 1 . - Embodiments of the present disclosure encompass a multi-layered work function metal group of a replacement gate structure. The work function metal group includes a layer of aluminum and at least one other metal between two layers of a metal nitride that does not contain aluminum. The layers are formed on a high-k layer, and all of the layers are formed by an ALD process to conform to a shape of a substrate and side walls on which the layers are formed. The layer including aluminum and at least one other metal may have a higher concentration of aluminum towards a center of the layer relative to the edges of the layer. The concentration of aluminum may be adjusted according to predetermined designs to achieve a particular work function, and to reduce gate leakage current. In addition, the top-most aluminum-free metal nitride layer prevents undesired oxidation of the aluminum-containing layer by air exposure. In addition, the entire metal group, and the high-k layer, may be formed by ALD to be compatible with replacement gates, such as finFET structures.
- The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of embodiments of the present disclosure. It is understood that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one more other features, integers, steps, operations, element components, and/or groups thereof.
- The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the disclosure in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosure. The embodiment was chosen and described in order to best explain the principles of the disclosure and the practical application, and to enable others of ordinary skill in the art to understand the disclosure for various embodiments with various modifications as are suited to the particular use contemplated.
- While exemplary embodiments of the disclosure have been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the disclosure first described.
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