US20130178001A1 - Method for Making LED LAMP - Google Patents

Method for Making LED LAMP Download PDF

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Publication number
US20130178001A1
US20130178001A1 US13/344,678 US201213344678A US2013178001A1 US 20130178001 A1 US20130178001 A1 US 20130178001A1 US 201213344678 A US201213344678 A US 201213344678A US 2013178001 A1 US2013178001 A1 US 2013178001A1
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Prior art keywords
base plate
housing
great heat
led
injection molding
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Abandoned
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US13/344,678
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Wen-Lung Chin
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Individual
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Individual
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Priority to US13/344,678 priority Critical patent/US20130178001A1/en
Publication of US20130178001A1 publication Critical patent/US20130178001A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a method for making a lighting appliance and, more particularly, to a method for making an LED (light emitting diode) lamp.
  • a conventional LED (light emitting diode) lamp comprises a housing, and a base plate combined with the housing.
  • the base plate is combined with an LED module (which is a modularized product) so that the base plate and the LED module are packed to function as an LED light source.
  • the base plate is combined with at least one LED crystal so that the base plate and the LED crystal are packed to function as an LED light source.
  • the base plate and the housing are made of two different materials.
  • the base plate has a plurality of screw holes
  • the housing has a plurality of screw bores which are connected with the screw holes of the base plate by a plurality of screw members (such as screws and the like) so that the base plate is combined with the housing by screwing.
  • the base plate is not combined with the housing closely and tightly by screwing, thereby decreasing the structural strength of the LED lamp.
  • the base plate is combined with the housing by a bonding agent, such as a gel and the like.
  • the bonding agent is located between the base plate and the housing, thereby decreasing the heat conducting effect of the LED lamp.
  • a method for making an LED lamp comprising a first step of working a base plate, a second step of placing the base plate in a die cavity of an injection molding machine, and a third step of forming a housing in the die cavity of the injection molding machine by injection molding to combine the housing with the base plate integrally.
  • the first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source.
  • the first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source.
  • the housing surrounds the base plate so that the base plate is received in the housing.
  • the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • the base plate is made of a metal having great heat conductivity and great heat dissipation.
  • the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the housing is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source.
  • the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source.
  • the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • the base plate is made of a metal having great heat conductivity and great heat dissipation.
  • the first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source.
  • the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • the base plate is made of a metal having great heat conductivity and great heat dissipation.
  • the first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source.
  • the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • the base plate is made of a porous nonmetallic material with great heat conduction
  • the housing is made of a porous nonmetallic material with great dissipation
  • the method for making the LED lamp further comprises a fourth step of treating the base plate and the housing by a sintering process.
  • the primary objective of the present invention is to provide a method for making an LED lamp which has an enhanced structural strength.
  • the base plate is integrally combined with the housing completely by injection molding so that the base plate and the housing are combined closely and solidly and will not detach from each other so as to enhance the structural strength of the LED lamp.
  • the base plate and the housing are combined closely so as to enhance the heat conducting effect of the LED lamp.
  • FIG. 1 is a front cross-sectional assembly view of an LED lamp made by a method in accordance with the preferred embodiment of the present invention.
  • an LED (light emitting diode) lamp in accordance with the preferred embodiment of the present invention comprises a housing 2 , and a base plate 1 combined with the housing 2 .
  • the base plate 1 is integrally combined with the housing 2 by plastic injection molding.
  • the base plate 1 is combined with an LED module (which is a modularized product) so that the base plate 1 and the LED module are packed to function as an LED light source.
  • the base plate 1 is combined with at least one LED crystal 3 so that the base plate 1 and the LED crystal 3 are packed to function as an LED light source.
  • a method for making the LED lamp in accordance with the preferred embodiment of the present invention comprises a first step of working a base plate 1 , a second step of placing the base plate 1 in a die cavity of an injection molding machine, and a third step of forming a housing 2 in the die cavity of the injection molding machine by injection molding to combine the housing 2 with the base plate 1 integrally.
  • the first step of the method further includes providing at least one LED crystal 3 on the base plate 1 , and packing the base plate 1 and the LED crystal 3 to construct an LED light source.
  • the first step of the method further includes providing an LED module on the base plate 1 , and combining the base plate 1 and the LED module to construct an LED light source.
  • the base plate 1 is flattened and drilled by working.
  • the housing 2 surrounds the base plate 1 so that the base plate 1 is received in the housing 2 .
  • the housing 2 is made of a plastic material and is combined with the base plate 1 integrally by plastic injection molding.
  • the base plate 1 is made of a metal having great heat conductivity and great heat dissipation, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the base plate 1 is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the porous nonmetallic material of the base plate 1 is made of a nonmetallic powder having a great heat conductivity, such as Al 2 O 3 , Zr 2 O, AlN, SiN, BN, WC, SiC, C, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the nonmetallic powder of the base plate 1 is selected by AlN and SiC.
  • the housing 2 is made of a plastic material.
  • the housing 2 is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • the porous nonmetallic material of the housing 2 is made of a nonmetallic powder having a great heat conductivity, such as Al 2 O 3 , Zr 2 O, AlN, SiN, BN, WC, SiC, C, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the nonmetallic powder of the base plate 1 is selected by AlN and SiC.
  • the housing 2 has an end portion provided with a threaded stud for mounting a metallic screw base, an insulating gasket and a power contact plate.
  • a metallic screw base for mounting a metallic screw base, an insulating gasket and a power contact plate.
  • each of the metallic screw base, the insulating gasket and the power contact plate has an international specification of E-27, E-14 and the like so that the housing 2 is available for a conventional electric bulb.
  • the housing 2 is provided with two connecting pins (with an international specification of MR16 and the like) so that the housing 2 is available for a conventional projection lamp.
  • the base plate 1 is made of a porous nonmetallic material with great heat conduction
  • the housing 2 is made of a porous nonmetallic material with great dissipation
  • the method for making the LED lamp further comprises a fourth step of treating the base plate 1 and the housing 2 by a sintering process.
  • the base plate 1 is integrally combined with the housing 2 completely by injection molding so that the base plate 1 and the housing 2 are combined closely and solidly and will not detach from each other so as to enhance the structural strength of the LED lamp.
  • the base plate 1 and the housing 2 are combined closely so as to enhance the heat conducting effect of the LED lamp.

Abstract

A method for making an LED lamp includes a first step of working a base plate, a second step of placing the base plate in a die cavity of an injection molding machine, and a third step of forming a housing in the die cavity of the injection molding machine to combine the housing with the base plate. The base plate is integrally combined with the housing completely by injection molding so that the base plate and the housing are combined closely and solidly and will not detach from each other.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a method for making a lighting appliance and, more particularly, to a method for making an LED (light emitting diode) lamp.
  • 2. Description of the Related Art
  • A conventional LED (light emitting diode) lamp comprises a housing, and a base plate combined with the housing. The base plate is combined with an LED module (which is a modularized product) so that the base plate and the LED module are packed to function as an LED light source. Alternatively, the base plate is combined with at least one LED crystal so that the base plate and the LED crystal are packed to function as an LED light source. The base plate and the housing are made of two different materials. The base plate has a plurality of screw holes, and the housing has a plurality of screw bores which are connected with the screw holes of the base plate by a plurality of screw members (such as screws and the like) so that the base plate is combined with the housing by screwing. However, the base plate is not combined with the housing closely and tightly by screwing, thereby decreasing the structural strength of the LED lamp. Alternatively, the base plate is combined with the housing by a bonding agent, such as a gel and the like. However, the bonding agent is located between the base plate and the housing, thereby decreasing the heat conducting effect of the LED lamp.
    • BRIEF SUMMARY OF THE INVENTION
  • In accordance with the present invention, there is provided a method for making an LED lamp, comprising a first step of working a base plate, a second step of placing the base plate in a die cavity of an injection molding machine, and a third step of forming a housing in the die cavity of the injection molding machine by injection molding to combine the housing with the base plate integrally.
  • Preferably, the first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source.
  • Preferably, the first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source.
  • Preferably, in the third step of the method, the housing surrounds the base plate so that the base plate is received in the housing.
  • Preferably, in the third step of the method, the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • Preferably, the base plate is made of a metal having great heat conductivity and great heat dissipation.
  • Preferably, the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • Preferably, the housing is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
  • Preferably, the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation. The first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source. The housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • Preferably, the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation. The first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source. The housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • Preferably, the base plate is made of a metal having great heat conductivity and great heat dissipation. The first step of the method further includes providing an LED module on the base plate, and combining the base plate and the LED module to construct an LED light source. The housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • Preferably, the base plate is made of a metal having great heat conductivity and great heat dissipation. The first step of the method further includes providing at least one LED crystal on the base plate, and packing the base plate and the LED crystal to construct an LED light source. The housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
  • Preferably, the base plate is made of a porous nonmetallic material with great heat conduction, the housing is made of a porous nonmetallic material with great dissipation, and the method for making the LED lamp further comprises a fourth step of treating the base plate and the housing by a sintering process.
  • The primary objective of the present invention is to provide a method for making an LED lamp which has an enhanced structural strength.
  • According to the primary advantage of the present invention, the base plate is integrally combined with the housing completely by injection molding so that the base plate and the housing are combined closely and solidly and will not detach from each other so as to enhance the structural strength of the LED lamp.
  • According to another advantage of the present invention, the base plate and the housing are combined closely so as to enhance the heat conducting effect of the LED lamp.
  • Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
  • FIG. 1 is a front cross-sectional assembly view of an LED lamp made by a method in accordance with the preferred embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, an LED (light emitting diode) lamp in accordance with the preferred embodiment of the present invention comprises a housing 2, and a base plate 1 combined with the housing 2. The base plate 1 is integrally combined with the housing 2 by plastic injection molding. The base plate 1 is combined with an LED module (which is a modularized product) so that the base plate 1 and the LED module are packed to function as an LED light source. Alternatively, the base plate 1 is combined with at least one LED crystal 3 so that the base plate 1 and the LED crystal 3 are packed to function as an LED light source.
  • A method for making the LED lamp in accordance with the preferred embodiment of the present invention comprises a first step of working a base plate 1, a second step of placing the base plate 1 in a die cavity of an injection molding machine, and a third step of forming a housing 2 in the die cavity of the injection molding machine by injection molding to combine the housing 2 with the base plate 1 integrally.
  • The first step of the method further includes providing at least one LED crystal 3 on the base plate 1, and packing the base plate 1 and the LED crystal 3 to construct an LED light source. Alternatively, the first step of the method further includes providing an LED module on the base plate 1, and combining the base plate 1 and the LED module to construct an LED light source. In the first step of the method, the base plate 1 is flattened and drilled by working.
  • In the third step of the method, the housing 2 surrounds the base plate 1 so that the base plate 1 is received in the housing 2. In the third step of the method, the housing 2 is made of a plastic material and is combined with the base plate 1 integrally by plastic injection molding.
  • In the preferred embodiment of the present invention, the base plate 1 is made of a metal having great heat conductivity and great heat dissipation, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like. Alternatively, the base plate 1 is made of a porous nonmetallic material with great heat conduction and great heat dissipation. The porous nonmetallic material of the base plate 1 is made of a nonmetallic powder having a great heat conductivity, such as Al2O3, Zr2O, AlN, SiN, BN, WC, SiC, C, crystalline SiC, Recrystalline SiC (ReSiC) and the like. Preferably, the nonmetallic powder of the base plate 1 is selected by AlN and SiC.
  • In the preferred embodiment of the present invention, the housing 2 is made of a plastic material. Alternatively, the housing 2 is made of a porous nonmetallic material with great heat conduction and great heat dissipation. The porous nonmetallic material of the housing 2 is made of a nonmetallic powder having a great heat conductivity, such as Al2O3, Zr2O, AlN, SiN, BN, WC, SiC, C, crystalline SiC, Recrystalline SiC (ReSiC) and the like. Preferably, the nonmetallic powder of the base plate 1 is selected by AlN and SiC.
  • In the preferred embodiment of the present invention, the housing 2 has an end portion provided with a threaded stud for mounting a metallic screw base, an insulating gasket and a power contact plate. Preferably, each of the metallic screw base, the insulating gasket and the power contact plate has an international specification of E-27, E-14 and the like so that the housing 2 is available for a conventional electric bulb.
  • Alternatively, the housing 2 is provided with two connecting pins (with an international specification of MR16 and the like) so that the housing 2 is available for a conventional projection lamp.
  • In the preferred embodiment of the present invention, the base plate 1 is made of a porous nonmetallic material with great heat conduction, the housing 2 is made of a porous nonmetallic material with great dissipation, and the method for making the LED lamp further comprises a fourth step of treating the base plate 1 and the housing 2 by a sintering process.
  • Accordingly, the base plate 1 is integrally combined with the housing 2 completely by injection molding so that the base plate 1 and the housing 2 are combined closely and solidly and will not detach from each other so as to enhance the structural strength of the LED lamp. In addition, the base plate 1 and the housing 2 are combined closely so as to enhance the heat conducting effect of the LED lamp.
  • Although the invention has been explained in relation to its preferred embodiment(s) as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the present invention. It is, therefore, contemplated that the appended claim or claims will cover such modifications and variations that fall within the true scope of the invention.

Claims (13)

1. A method for making an LED lamp, comprising:
a first step of working a base plate;
a second step of placing the base plate in a die cavity of an injection molding machine; and
a third step of forming a housing in the die cavity of the injection molding machine by injection molding to combine the housing with the base plate integrally.
2. The method of claim 1, wherein the first step of the method further includes:
providing at least one LED crystal on the base plate; and
packing the base plate and the LED crystal to construct an LED light source.
3. The method of claim 1, wherein the first step of the method further includes:
providing an LED module on the base plate; and
combining the base plate and the LED module to construct an LED light source.
4. The method of claim 1, wherein in the third step of the method, the housing surrounds the base plate so that the base plate is received in the housing.
5. The method of claim 1, wherein in the third step of the method, the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
6. The method of claim 1, wherein the base plate is made of a metal having great heat conductivity and great heat dissipation.
7. The method of claim 1, wherein the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
8. The method of claim 1, wherein the housing is made of a porous nonmetallic material with great heat conduction and great heat dissipation.
9. The method of claim 1, wherein
the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation;
the first step of the method further includes:
providing an LED module on the base plate; and
combining the base plate and the LED module to construct an LED light source;
the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
10. The method of claim 1, wherein
the base plate is made of a porous nonmetallic material with great heat conduction and great heat dissipation;
the first step of the method further includes:
providing at least one LED crystal on the base plate; and
packing the base plate and the LED crystal to construct an LED light source;
the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
11. The method of claim 1, wherein
the base plate is made of a metal having great heat conductivity and great heat dissipation;
the first step of the method further includes:
providing an LED module on the base plate; and
combining the base plate and the LED module to construct an LED light source;
the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
12. The method of claim 1, wherein
the base plate is made of a metal having great heat conductivity and great heat dissipation;
the first step of the method further includes:
providing at least one LED crystal on the base plate; and
packing the base plate and the LED crystal to construct an LED light source;
the housing is made of a plastic material and is combined with the base plate integrally by plastic injection molding.
13. The method of claim 1, wherein
the base plate is made of a porous nonmetallic material with great heat conduction;
the housing is made of a porous nonmetallic material with great dissipation;
the method for making the LED lamp further comprises a fourth step of treating the base plate and the housing by a sintering process.
US13/344,678 2012-01-06 2012-01-06 Method for Making LED LAMP Abandoned US20130178001A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
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