US20130099116A1 - Integrated Backscattered Electron Detector with Cathodoluminescence Collection Optics - Google Patents
Integrated Backscattered Electron Detector with Cathodoluminescence Collection Optics Download PDFInfo
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- US20130099116A1 US20130099116A1 US13/280,952 US201113280952A US2013099116A1 US 20130099116 A1 US20130099116 A1 US 20130099116A1 US 201113280952 A US201113280952 A US 201113280952A US 2013099116 A1 US2013099116 A1 US 2013099116A1
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- Prior art keywords
- detector
- backscattered electron
- electron detector
- photons
- backscattered
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- 238000005136 cathodoluminescence Methods 0.000 title description 4
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2441—Semiconductor detectors, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24475—Scattered electron detectors
Definitions
- This invention relates to image detectors for electron microscopy.
- the invention relates to simultaneous detection of backscattered electrons and cathodoluminescence emitted by a sample.
- photons When a high energy electron or ion beam strikes a sample, photons can be emitted. These emitted photons are also known as cathodoluminescence. The collection and detection of these photons in the wavelength range from UV through visible to IR, can provide a wealth of information about the sample under investigation. However, the signal to be detected can be small and in order to obtain the highest signal to noise ratio, minimize acquisition times and reduce the excitation energy required it is desirable to collect the largest proportion of emitted photons as possible.
- the most efficient manner of collecting photons emitted from a sample in an electron microscope is by using an optical element which subtends a large solid angle and which detects the photons directly or directs the photons towards a light sensitive element where the photons can be detected and measured; typically, the optical element contains an aperture through which the incident primary electron beam may pass.
- optical element used to direct the emitted photons covers such a large solid angle
- the use of other detectors simultaneously is compromised unless line of sight is provided by sacrificing the solid angle subtended by the optical element.
- a large solid angle is often required as the photon signal levels is typically many orders of magnitude lower than other signals in the SEM. For many signals in the SEM this is acceptable however, this is not the case for backscattered electrons for several reasons:
- Backscattered electron detectors are typically mounted to the bottom of the pole piece or inserted immediately below, and the optical element used to direct photons is typically situated between the sample and the backscattered detector, thus obscuring the signal to the back scattered electron detector.
- the invention comprises an apparatus for simultaneous detection of backscattered electrons and photons from a sample.
- the device includes a direct detection backscattered electron detector and a photon detector.
- the backscattered electron detector has a reflective surface that reflects photons emitted by the sample onto the photon detector.
- the reflective surface is convex.
- the reflective surface is planar.
- the reflective surface of the backscattered electron detector is convex.
- the reflective surface of the backscattered electron detector is a three dimensional concave surface.
- Exemplary reflective surfaces include aluminum and gold
- the apparatus includes a direct detection backscattered electron detector, a photon detector; and an optical element.
- the backscattered electron detector is embedded in the optical element and is angled to reflect photons toward the photon detector.
- FIG. 1 is a diagram of a prior art electron microscope to detect backscattered electrons
- FIG. 2 is a diagram of a prior art electron microscope to detect backscattered electrons and photons
- FIG. 3 is a diagram of an electron microscope to simultaneously detect backscattered electrons and photons, wherein the backscattered electron detector has a convex mirrored surface to reflect photons;
- FIG. 4 is a diagram of an electron microscope to simultaneously detect backscattered electrons and cathodoluminesence, wherein the backscattered electron detector has a concave mirrored surface to reflect photons;
- FIG. 5 is a diagram of a further embodiment of an electron microscope to simultaneously detect backscattered electrons and cathodoluminesence wherein a small backscattered electron detector is mounted in a photon directing element.
- FIG. 1 shows a standard electron microscope with a direct detection backscattered electron detector 30 .
- the electron beam 10 is directed through the pole piece 20 and the detector 30 to the sample 40 .
- Backscattered electrons 11 leave the surface of the sample 20 and are detected by the detector 30 .
- the detector is a direct electron detector as opposed to a detector comprising a scintillator that converts electrons to photons.
- FIG. 2 shows a prior art system for detecting cathodoluminescence photons 14 produced in the sample 40 .
- a photon collection mirror 50 is placed between the backscattered electron detector 30 and the sample 40 .
- Photons 12 produced by the sample 40 are directed by the mirror 50 to a photon detector 52 .
- This configuration has the disadvantage that the mirror blocks a significant portion of the backscattered electrons from reaching the detector 30 .
- a semiconductor diode 60 for sensing backscattered electrons 11 e.g. a silicon photodiode/avalanche diode
- a reflective coating applied to the diode 60 increases the reflectivity of the diode. Reflective coatings include aluminum and gold.
- the diode 60 has a three dimensional concave surface 61 , such as an ellipsoidal or paraboloidal surface. This type of surface collimates or focuses the photons 12 onto other optical instrumentation, which can also include a conduit of the light to an external photon detector, (e.g. PMT or photodiode, or it can be the actual detector itself).
- an external photon detector e.g. PMT or photodiode, or it can be the actual detector itself.
- a miniature backscattered electron detector 70 is mounted within a photon directing element 80 .
- Mounting the detector 70 close to the reflective plane of the optical element 80 means that the detector functions at a short working distance, compensating for the reduction in size by maintaining a large solid angle for the detector 70 .
- Use of a miniature backscattered electron detector minimizes solid angle loss of the photon collection optical element 80 . If a concave optical element (e.g. paraboloidal or ellipsoidal) is used, angling of the backscattered electron detector to reflect photons towards the photon detector minimizes optical losses as a result of the sacrificed solid angle of the optical element.
- a concave optical element e.g. paraboloidal or ellipsoidal
- the optical element 80 is made from conductive but highly reflective material e.g. diamond-turned aluminum.
- the backscattered electron detector is a silicon diode supported on a carrier for physical support.
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Description
- This invention relates to image detectors for electron microscopy. In particular the invention relates to simultaneous detection of backscattered electrons and cathodoluminescence emitted by a sample.
- When a high energy electron or ion beam strikes a sample, photons can be emitted. These emitted photons are also known as cathodoluminescence. The collection and detection of these photons in the wavelength range from UV through visible to IR, can provide a wealth of information about the sample under investigation. However, the signal to be detected can be small and in order to obtain the highest signal to noise ratio, minimize acquisition times and reduce the excitation energy required it is desirable to collect the largest proportion of emitted photons as possible. The most efficient manner of collecting photons emitted from a sample in an electron microscope is by using an optical element which subtends a large solid angle and which detects the photons directly or directs the photons towards a light sensitive element where the photons can be detected and measured; typically, the optical element contains an aperture through which the incident primary electron beam may pass.
- Where the optical element used to direct the emitted photons covers such a large solid angle the use of other detectors simultaneously is compromised unless line of sight is provided by sacrificing the solid angle subtended by the optical element. A large solid angle is often required as the photon signal levels is typically many orders of magnitude lower than other signals in the SEM. For many signals in the SEM this is acceptable however, this is not the case for backscattered electrons for several reasons:
- 1) The emission direction of backscattered electrons and photons is similar and therefore collectors/detectors are required to occupy the same space. Therefore, a large sacrifice in both signals is required so that they may be sensed simultaneously. Backscattered electron detectors are typically mounted to the bottom of the pole piece or inserted immediately below, and the optical element used to direct photons is typically situated between the sample and the backscattered detector, thus obscuring the signal to the back scattered electron detector.
- 2) Sacrificing part of the optical element's solid angle allows the backscattered detector line of sight to the sample, however the optical element is typically thick (4-20 mm) and the distance between the sample and the backscattered detector large therefore further compromising the solid angle subtended by the backscattered detector in comparison to normal operation.
- Detection of photons and backscattered electrons simultaneously is not novel; however, this has only been achieved through large sacrifices in efficiency—typically greater than or equal to 50% reduction in comparison to optimum operation of either detector. This is often unacceptable for many applications. Furthermore, this has only been achieved by the use of two separate instruments.
- Publications in the general field include U.S. Pat. Nos. 7,462,839 and 7,707,041 and Japanese Patent Abstract publication no. 11,096,956 by Hiromasa. All references are incorporated herein by reference.
- In an exemplary embodiment, the invention comprises an apparatus for simultaneous detection of backscattered electrons and photons from a sample. The device includes a direct detection backscattered electron detector and a photon detector. The backscattered electron detector has a reflective surface that reflects photons emitted by the sample onto the photon detector. In an embodiment, the reflective surface is convex. In a further embodiment, the reflective surface is planar. In a further embodiment, the reflective surface of the backscattered electron detector is convex. In a further embodiment, the reflective surface of the backscattered electron detector is a three dimensional concave surface. Exemplary reflective surfaces include aluminum and gold
- In a further embodiment the apparatus includes a direct detection backscattered electron detector, a photon detector; and an optical element. In this embodiment, the backscattered electron detector is embedded in the optical element and is angled to reflect photons toward the photon detector.
- Other advantages and novel features of the invention will become apparent to those skilled in the art upon examination of the following detailed description of a preferred embodiment of the invention and the accompanying drawings.
- DESCRIPTION OF THE DRAWINGS
-
FIG. 1 . is a diagram of a prior art electron microscope to detect backscattered electrons; -
FIG. 2 is a diagram of a prior art electron microscope to detect backscattered electrons and photons -
FIG. 3 is a diagram of an electron microscope to simultaneously detect backscattered electrons and photons, wherein the backscattered electron detector has a convex mirrored surface to reflect photons; -
FIG. 4 is a diagram of an electron microscope to simultaneously detect backscattered electrons and cathodoluminesence, wherein the backscattered electron detector has a concave mirrored surface to reflect photons; and -
FIG. 5 is a diagram of a further embodiment of an electron microscope to simultaneously detect backscattered electrons and cathodoluminesence wherein a small backscattered electron detector is mounted in a photon directing element. -
FIG. 1 shows a standard electron microscope with a direct detectionbackscattered electron detector 30. Theelectron beam 10 is directed through thepole piece 20 and thedetector 30 to thesample 40.Backscattered electrons 11 leave the surface of thesample 20 and are detected by thedetector 30. The detector is a direct electron detector as opposed to a detector comprising a scintillator that converts electrons to photons. -
FIG. 2 shows a prior art system for detecting cathodoluminescence photons 14 produced in thesample 40. Aphoton collection mirror 50 is placed between thebackscattered electron detector 30 and thesample 40.Photons 12 produced by thesample 40 are directed by themirror 50 to aphoton detector 52. This configuration has the disadvantage that the mirror blocks a significant portion of the backscattered electrons from reaching thedetector 30. - In an embodiment of the invention shown in
FIG. 3 , asemiconductor diode 60 for sensing backscattered electrons 11 (e.g. a silicon photodiode/avalanche diode) is shaped to directphotons 12 to anoptical detector 62. A reflective coating applied to thediode 60 increases the reflectivity of the diode. Reflective coatings include aluminum and gold. - In an alternate embodiment, shown in
FIG. 4 , thediode 60 has a three dimensionalconcave surface 61, such as an ellipsoidal or paraboloidal surface. This type of surface collimates or focuses thephotons 12 onto other optical instrumentation, which can also include a conduit of the light to an external photon detector, (e.g. PMT or photodiode, or it can be the actual detector itself). - In a further embodiment, shown in
FIG. 5 , a miniaturebackscattered electron detector 70 is mounted within aphoton directing element 80. Mounting thedetector 70 close to the reflective plane of theoptical element 80 means that the detector functions at a short working distance, compensating for the reduction in size by maintaining a large solid angle for thedetector 70. Use of a miniature backscattered electron detector minimizes solid angle loss of the photon collectionoptical element 80. If a concave optical element (e.g. paraboloidal or ellipsoidal) is used, angling of the backscattered electron detector to reflect photons towards the photon detector minimizes optical losses as a result of the sacrificed solid angle of the optical element. - In a further embodiment, the
optical element 80 is made from conductive but highly reflective material e.g. diamond-turned aluminum. - In a further embodiment, the backscattered electron detector is a silicon diode supported on a carrier for physical support.
- While the invention has been described in detail and with reference to specific examples thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof.
Claims (12)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/280,952 US8410443B1 (en) | 2011-10-25 | 2011-10-25 | Integrated backscattered electron detector with cathodoluminescence collection optics |
| JP2014538894A JP6223985B2 (en) | 2011-10-25 | 2012-10-24 | Integrated backscattered electron detector with optical system for collecting cathodoluminescence |
| PCT/US2012/061538 WO2013063005A1 (en) | 2011-10-25 | 2012-10-24 | Integrated backscattered electron detector with cathodoluminescence collection optics |
| EP12798051.4A EP2771900B1 (en) | 2011-10-25 | 2012-10-24 | Integrated backscattered electron detector with cathodoluminescence collection optics |
| JP2017091118A JP6363253B2 (en) | 2011-10-25 | 2017-05-01 | Integrated backscattered electron detector with optical system for collecting cathodoluminescence |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/280,952 US8410443B1 (en) | 2011-10-25 | 2011-10-25 | Integrated backscattered electron detector with cathodoluminescence collection optics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US8410443B1 US8410443B1 (en) | 2013-04-02 |
| US20130099116A1 true US20130099116A1 (en) | 2013-04-25 |
Family
ID=47297408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/280,952 Active 2031-11-29 US8410443B1 (en) | 2011-10-25 | 2011-10-25 | Integrated backscattered electron detector with cathodoluminescence collection optics |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8410443B1 (en) |
| EP (1) | EP2771900B1 (en) |
| JP (2) | JP6223985B2 (en) |
| WO (1) | WO2013063005A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10055413B2 (en) | 2015-05-19 | 2018-08-21 | Spotify Ab | Identifying media content |
| US10401374B2 (en) * | 2014-11-30 | 2019-09-03 | Tichauer Technical Laboratories, Llc | Device and method of detecting and generating combined modulated particle wave-fronts |
| CN112509897A (en) * | 2019-09-16 | 2021-03-16 | Fei 公司 | Light guide assembly for electron microscope |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015093465A1 (en) * | 2013-12-17 | 2015-06-25 | 株式会社堀場製作所 | Collector mirror, light/charged particle detection device, and sample analysis device |
| US20180217059A1 (en) * | 2015-07-31 | 2018-08-02 | Fei Company | Segmented detector for a charged particle beam device |
| CN113675060A (en) * | 2020-05-13 | 2021-11-19 | 聚束科技(北京)有限公司 | Scanning electron microscope |
| CN113675061B (en) * | 2020-05-13 | 2024-09-06 | 聚束科技(北京)有限公司 | Scanning electron microscope |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS517072B1 (en) * | 1970-10-23 | 1976-03-04 | ||
| IT1223998B (en) * | 1988-12-16 | 1990-09-29 | Sip | DETECTION SYSTEM FOR CATODOLUMINESCENCE ANALYSIS |
| JP3476482B2 (en) * | 1992-05-22 | 2003-12-10 | 株式会社トプコン | Morphological observation device |
| US5569920A (en) * | 1995-06-14 | 1996-10-29 | National University Of Singapore | Retractable cathodoluminescence detector with high ellipticity and high backscattered electron rejection performance for large area specimens |
| GB2314926B (en) * | 1996-07-01 | 1999-08-25 | K E Developments Ltd | Detector devices |
| JPH1196956A (en) | 1997-09-22 | 1999-04-09 | Hitachi Ltd | Scanning electron microscope |
| US7462839B2 (en) | 2000-07-07 | 2008-12-09 | Carl Zeiss Nts Gmbh | Detector for variable pressure areas and an electron microscope comprising a corresponding detector |
| US7707041B2 (en) | 2004-07-28 | 2010-04-27 | Conocophillips Company | Surface ownership data management system |
| EP1956633A3 (en) * | 2007-02-06 | 2009-12-16 | FEI Company | Particle-optical apparatus for simultaneous observing a sample with particles and photons |
| EP1956632A1 (en) * | 2007-02-14 | 2008-08-13 | FEI Company | Particle-optical apparatus for simultaneous observing a sample with particles and photons |
| JP2009170150A (en) * | 2008-01-11 | 2009-07-30 | Hitachi High-Technologies Corp | Inspection measurement device and inspection measurement method |
| US20100123077A1 (en) * | 2008-11-18 | 2010-05-20 | Gatan, Inc. | Passive pixel direct detection sensor |
| WO2010095392A1 (en) * | 2009-02-20 | 2010-08-26 | 株式会社日立ハイテクノロジーズ | Sample observing method and scanning electron microscope |
| JP5047318B2 (en) * | 2010-03-05 | 2012-10-10 | 株式会社日立ハイテクノロジーズ | Method for displaying an electron microscope image and an optical image in an overlapping manner |
-
2011
- 2011-10-25 US US13/280,952 patent/US8410443B1/en active Active
-
2012
- 2012-10-24 WO PCT/US2012/061538 patent/WO2013063005A1/en not_active Ceased
- 2012-10-24 EP EP12798051.4A patent/EP2771900B1/en active Active
- 2012-10-24 JP JP2014538894A patent/JP6223985B2/en active Active
-
2017
- 2017-05-01 JP JP2017091118A patent/JP6363253B2/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10401374B2 (en) * | 2014-11-30 | 2019-09-03 | Tichauer Technical Laboratories, Llc | Device and method of detecting and generating combined modulated particle wave-fronts |
| US10598679B2 (en) * | 2014-11-30 | 2020-03-24 | Tichauer Technical Laboratories, Llc | Device and method of detecting and generating combined modulated particle wave-fronts |
| US10055413B2 (en) | 2015-05-19 | 2018-08-21 | Spotify Ab | Identifying media content |
| CN112509897A (en) * | 2019-09-16 | 2021-03-16 | Fei 公司 | Light guide assembly for electron microscope |
| EP3792952A1 (en) * | 2019-09-16 | 2021-03-17 | FEI Company | Light guide assembly for an electron microscope |
| US11335536B2 (en) * | 2019-09-16 | 2022-05-17 | Fei Company | Light guide assembly for an electron microscope |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6223985B2 (en) | 2017-11-01 |
| EP2771900B1 (en) | 2017-04-19 |
| JP2017188462A (en) | 2017-10-12 |
| JP2014531129A (en) | 2014-11-20 |
| EP2771900A1 (en) | 2014-09-03 |
| US8410443B1 (en) | 2013-04-02 |
| JP6363253B2 (en) | 2018-07-25 |
| WO2013063005A1 (en) | 2013-05-02 |
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