US20130075076A1 - Apparatus - Google Patents

Apparatus Download PDF

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Publication number
US20130075076A1
US20130075076A1 US13/601,080 US201213601080A US2013075076A1 US 20130075076 A1 US20130075076 A1 US 20130075076A1 US 201213601080 A US201213601080 A US 201213601080A US 2013075076 A1 US2013075076 A1 US 2013075076A1
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United States
Prior art keywords
temperature
channels
phase change
transfer element
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/601,080
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English (en)
Inventor
Bruno Agostini
Mathieu Habert
Matti Kauranen
Markku Elo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Research Ltd Switzerland
ABB Research Ltd Sweden
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ABB Research Ltd Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ABB Research Ltd Switzerland filed Critical ABB Research Ltd Switzerland
Assigned to ABB RESEARCH LTD reassignment ABB RESEARCH LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGOSTINI, BRUNO, Elo, Markku, HABERT, MATHIEU, KAURANEN, MATTI
Publication of US20130075076A1 publication Critical patent/US20130075076A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20945—Thermal management, e.g. inverter temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D2020/0004—Particular heat storage apparatus
    • F28D2020/0013—Particular heat storage apparatus the heat storage material being enclosed in elements attached to or integral with heat exchange conduits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • This disclosure relates to an apparatus to be cooled, and to a cooling solution for an apparatus including electric components.
  • a known apparatus with a heat exchanger having a first heat transfer element includes a base plate for an electric component, and channels for transferring a heat load from the base plate into fluid in the channels.
  • the fluid can be passed on via the channels to a second heat exchanger where the fluid can be cooled. At least some of the channels protrude from a surface of the base plate.
  • the heat exchanger can have insufficient heat storage capacity especially for handling temporary peaks in the amount of heat generated by electric components.
  • An apparatus comprising a first heat transfer element including a base plate, with a first surface for receiving an electric component and channels for transferring a heat load received via the first surface into a fluid in the channels, at least some of the channels protruding from a second surface of the base plate, a second heat transfer element for receiving fluid from the first heat transfer element and for passing a heat load from the fluid to the surroundings, and a phase change material arranged at the second surface of the base plate between at least two of the channels, the phase change material absorbing heat by changing phase at a phase change temperature during the operation of said electric component.
  • FIGS. 1 to 2 illustrate a first exemplary embodiment of an apparatus according to the disclosure
  • FIG. 3 illustrates an exemplary embodiment of the apparatus of FIGS. 1 and 2 with a phase change material
  • FIG. 4 illustrates a temperature difference obtained with the apparatus of FIGS. 1 and 2 ;
  • FIG. 5 illustrates a second exemplary embodiment of an apparatus according to the disclosure.
  • FIGS. 6 to 8 illustrate an effect of phase change material at different ambient temperatures.
  • phase change material which during a phase change absorbs heat can make it possible to obtain an apparatus with more efficient cooling.
  • phase change material can be arranged in a well-protected space between at least two channels in order to temporarily provide a higher cooling capacity due to a phase change of the material. Once there is no longer a need for a higher cooling capacity and the temperature reaches a level below the phase change temperature, the phase change material can return to the original physical state in order for it to be ready to absorb excess heat during a subsequent peak in the heat generation.
  • a cooling apparatus can be adjusted in order to keep a temperature such that the phase change material will work optimally.
  • FIGS. 1 to 2 illustrate a first exemplary embodiment of an apparatus 1 according to the disclosure.
  • the apparatus includes a first heat transfer element 2 having a base plate 3 with a first surface 4 for receiving one or more electric components that require cooling during their use in order to avoid an excessive temperature rise.
  • the first heat transfer element 2 also includes a plurality of channels 5 for transferring a received heat load into a fluid circulating in the channels. From FIG. 2 it can be seen that in this embodiment the channels 5 can be arranged in pipes 6 , which are spaced apart and have internal walls separating a plurality of channels 5 from each other.
  • the pipes can be MPE (MultiPort Extruded) pipes which have been manufactured by extruding aluminum, for example.
  • FIG. 1 the apparatus 1 is seen from a direction where the base plate 3 is on top of the pipes 6 and FIG. 2 illustrates only some of the parts of the apparatus 1 seen from a direction where the pipes 6 are on top of the base plate 3 .
  • MPE MultiPort Extruded
  • the apparatus includes a second heat transfer element 7 , which receives fluid from the first heat transfer element 2 .
  • the pipes 6 extend all the way from a first manifold 8 arranged in the proximity of the first heat transfer element 2 to a second manifold 9 arranged in the proximity of the second heat transfer element 7 .
  • the second heat transfer element 7 includes the pipes 6 and fins 10 which extend between the channels 5 , in this case the walls of the pipes 6 containing the channels. An airstream passing through the second heat transfer element 7 can therefore transfer heat away from the fluid in the pipes 6 .
  • the apparatus 1 can work as a thermosyphon.
  • the pipes 6 partly penetrate into the base plate 3 (working as an evaporator) such that some of the channels 5 located in the pipes can be evaporator channels containing fluid that is heated when the first heat transfer element 2 receives heat from an electric component.
  • the heated fluid (or possibly vapor at this stage) flows towards the second heat transfer element 7 (working as a condenser), where air passing between the channels 5 (located inside the pipes 6 ) cools the fluid.
  • the second manifold 9 can be implemented as a tank, for example, a closed space with a fluid connection to all channels 5 of the pipes 6 .
  • the fluid can therefore exit the evaporator channels into the manifold and return downwards towards the first manifold 8 via those channels 5 of the pipes 6 that are located outside the base plate 3 and function as condenser channels.
  • the first manifold 8 can be implemented similarly to the second manifold 9 , for example, as a tank with a fluid connection to each channel 5 of the pipes. Therefore, the fluid entering the first manifold 8 via the condenser channels can proceed via the evaporator channels to a new flow cycle.
  • Such a thermosyphon is advantageous as it can be utilized for cooling an electric apparatus without a need for a pump to obtain the desired fluid circulation.
  • An alternative to the illustrated embodiment can be to separate the first and second heat transfer element 2 and 7 from each other.
  • the parallel channels 5 do not extend all the way between the first and second heat transfer element 2 and 7 .
  • an additional manifold can be arranged in the upper part of the first heat transfer element 2 to receive fluid from all of the channels 5 in the first heat transfer element 2 .
  • a second additional manifold can be arranged in the lower part of the second heat transfer element 7 to pass fluid to all channels 5 of the second heat transfer element 7 .
  • These additional manifolds can be connected to each other with one or more pipes for passing fluid from the first heat transfer element 2 (evaporator) to the second heat transfer element 7 (condenser), and the second manifold 9 can be connected to the first manifold 8 via one or more additional pipes for returning the fluid from the second heat transfer element 7 (condenser) to the first heat transfer element 2 (evaporator).
  • the first heat transfer element 2 can be provided with a phase change material 11 which during operation of the apparatus enters a phase change to absorb heat in order to cool the base plate 2 and one or more electric components attached to the base plate.
  • a phase change material 11 can be arranged against a second surface 12 of the base plate 3 , for example, substantially over the entire surface area of the base plate 3 .
  • the second surface 12 of the base plate 3 in the illustrated embodiment is provided with channels 5 contained in pipes 6 and with fins 10 extending between these channels.
  • phase change material can be efficiently protected. Heat can be conducted directly from the base plate 3 to the pipes 6 containing channels 5 and fluid, and in addition, from the base plate 3 via the fins 10 to the pipes 6 .
  • the phase change material should be located thermally closer to heat source than the “main” cooling system is. In this way the phase change material reacts faster than the main cooling system to temperature changes.
  • a Phase Change Material can be a substance, which by changing phase at a certain constant temperature, called phase change temperature, is capable of storing and releasing large amounts of energy at constant temperature. Phase change can occur as melting and solidifying or as changes in the crystal structure of materials where the phase change takes place from solid to solid. Heat can be absorbed or released when the material changes from one phase to another. Initially the temperature of a phase change material 11 rises as the phase change material absorbs heat. However, when a phase change material reaches a phase change temperature at which it changes phase, it can absorb large amounts of heat at a constant temperature until all material is transformed to the new phase. When the ambient temperature around the material subsequently falls, the phase change material can return to its previous physical state, and release its stored latent heat.
  • phase change materials are available on the market in any required temperature range, for example, from 114° C. up to 1010° C.
  • a common type of phase change materials is the solid-liquid.
  • phase change materials There are, however, other types of phase change materials and some materials exhibit solid-solid phase changes, in which the crystalline structure is altered at a certain temperature.
  • a material should ideally meet several criteria, release and absorb large amounts of energy when freezing and melting, have a fixed and clearly determined phase change temperature, remain stable and unchanged over many freeze/melt cycles, be non-Hazardous, be economical, and should not cause corrosion problems to other materials.
  • the apparatus 1 can be used in an upright position, due to which a phase change material 11 with a solid-solid phase change is desirable.
  • a phase change material 11 can be inserted directly between the channels 5 and the fins 10 as illustrated in FIG. 2 .
  • suitable materials are salt hydrates, fatty acids, esters, and various paraffins (such as octadecane).
  • FIG. 3 illustrates an alternative for providing the apparatus of FIGS. 1 and 2 with a phase change material.
  • a container 13 is used for encapsulating the phase change material 11 before it is arranged in its place on the second surface 12 of the base plate.
  • Solid-liquid phase change materials for example, can be used as the phase change material and can be hermetically sealed.
  • a suitable material to be used in the embodiment of FIG. 3 can be, for example, salt hydrate, such as PlusICE X80, available from Phase Change Material Products Limited, for instance.
  • the “container” can be implemented to include the baseplate 3 , the pipes 6 and a lid which create a container or tank for the phase change material.
  • no fins 10 are arranged at the location of the second surface 12 reserved for the container 13 .
  • the fins 10 can be arranged inside the container 13 together with the phase change material 11 .
  • a container 13 ′ containing both phase change material 11 and fins 10 is also illustrated in FIG. 3 .
  • the fins 10 should be (thermally) attached to the base plate 4 via the second surface 12 , so that the heat from the heat source can come via baseplate 4 to fins 10 and further to the phase change material.
  • the fins 10 provide a good and even contact to the phase change material, so that the heat distribution to the phase change material is as even as possible.
  • the structure described above utilizing fins to conduct heat from the base plate into the phase change material is good from this point of view.
  • FIG. 4 illustrates the temperature difference obtained with the apparatus of FIGS. 1 and 2 .
  • FIG. 4 illustrates the temperature T (the temperature probe is located on the surface 4 just below the heat source) at different moments of time t (seconds) when the apparatus of FIG. 1 is used for removing heat from electronic components of a frequency converter (can be used other electric devices too), for example, a drive used for controlling the speed of an electric motor, for instance.
  • the ambient temperature has been selected to be optimal for the phase change material in question, in this case 40° C.
  • Curve B illustrates the temperature behavior when no phase change material is in use
  • the curve A illustrates the temperature behavior when the spaces between the channels 5 , the fins 10 and the second surface 12 of the base plate are filled with a phase change material.
  • the temperature peak is reduced ( ⁇ T) by about 6.4° C.
  • a reduction of the temperature change can have a significant impact on the expected lifetime of the component in question.
  • Practical tests have shown that when temperature peaks occur cyclically, a reduction of the temperature change during the peak from 30° C. to 25° C. increases the number of cycles without malfunctions by about 4 to 5 times.
  • the peak temperature will be lower (in this example from 77-71° C.), which also makes the lifetime longer.
  • FIG. 5 illustrates a second exemplary embodiment of an apparatus 1 ′.
  • the apparatus 1 ′ is very similar to the one explained in connection with FIGS. 1 and 2 . Therefore the embodiment of FIG. 5 will mainly be explained by pointing out the differences between these embodiments.
  • thermosyphon with a base plate 3 , a second heat transfer element 7 , channels 5 and manifolds 8 and 9 is used as in FIG. 1 .
  • the second surface of the base plate (not shown in FIG. 5 ) can also be provided with a phase change material.
  • Phase change materials can be efficiently utilized at an ambient temperature which is dependent on the selected material in question.
  • Each phase change material has a different phase change temperature and can be selected depending on the application. Properties and the amount of phase change material is always dependent on the design (system), heat load, allowed temperatures and cooling conditions (ambient temperature or cooling temperature). To achieve the best results, the phase change temperature of the phase change material should be selected accordingly.
  • FIG. 5 illustrates two alternatives that can be used simultaneously or independently of each other for ensuring that the ambient temperature is optimal.
  • a temperature sensor 14 can be utilized for measuring the ambient temperature and information about the ambient temperature is provided to a controller 15 , which may be implemented with circuitry or as a combination of circuitry and a computer program.
  • the controller is integrated to circuitry of electric device, so that it does not require any extra components and/or printed circuit boards. In these cases the functionality is done with software.
  • the controller can also be implemented by at least one processor (e.g., general purpose or application specific) or a computer processing device which is configured to execute a computer program tangibly recorded on a non-transitory computer-readable recording medium, such as a hard disk drive, flash memory, optical memory or any other type of non-volatile memory.
  • the at least one processor Upon executing the program, the at least one processor is configured to perform the operative functions of the above-described exemplary embodiments.
  • the temperature sensor 14 can be attached to an electric component 16 , the base plate 3 , the phase change material or the second heat transfer element 7 .
  • the temperature sensor should desirably be placed as close to the actual heat source as possible in order to detect changes as fast as possible.
  • the controller receives information about the measured temperature, which is used by the controller 15 to determine if the measured temperature is above or below a reference temperature (the optimal ambient temperature for the selected phase change material in question).
  • the first alternative is that the controller 15 adjusts the cooling efficiency in order to try to maintain the ambient temperature at the optimal level.
  • an adjustable fan 17 may be utilized, for instance, in order to increase or decrease the amount of air flowing through the second heat transfer element 7 . If the measured temperature is too high, the speed of the fan 17 is increased, and if the measured temperature is too low, the speed of the fan 17 is reduced.
  • other types of adjustable cooling may be employed, in which case the adjustment can affect the speed of a pump or the position of a valve regulating a flow, for instance. If a pump is utilized the cooling media flowing between the channels of the second heat transfer element may be a suitable liquid such as water, for instance.
  • the second alternative is that the controller 15 adjusts the amount of heat produced by the electric component 16 .
  • the controller 15 controls the electric component or components to operate in a mode (at a lower efficiency level, for example) where they produce less heat during periods when the measured temperature is too high.
  • a mode at a lower efficiency level, for example
  • this might lead to a situation where the entire potential of the frequency converter cannot be utilized during such periods but permanent damage to the components of the frequency converter can in any case be avoided.
  • the use of the phase change material can make it possible to allow a bigger heat peak than in solutions without the phase change material.
  • FIGS. 6 to 8 illustrate the effect of phase change material at different temperatures.
  • FIGS. 6 to 8 are similar to FIG. 4 . Thus they illustrate the temperature T at different moments of time t (seconds) when the apparatus of FIG. 1 is used for removing heat from electronic components.
  • Curve B illustrates the temperature behavior when no phase change material is in use
  • the curve A illustrates the temperature behavior when the spaces between channels 5 , the fins 10 and the second surface 12 of the base plate are filled with a phase change material.
  • the used phase change material is the same in FIGS. 4 and 6 to 8 .
  • the exemplary ambient temperature was selected to be optimal for the phase change material, for example 40° C. In that case, the temperature peak was reduced ( ⁇ T) by about 6.4° C. when phase change material was in use.
  • the exemplary ambient temperature is no longer optimal, but instead 30° C. In that case, the temperature peak was reduced ( ⁇ T) by about 1.2° C. when phase change material was in use.
  • the exemplary ambient temperature is 35° C.
  • the temperature peak was reduced ( ⁇ T) by about 3.9° C. when phase change material was in use.
  • the exemplary ambient temperature is 45° C.
  • the phase change material changes phase early at this temperature, and after about 75 seconds the phase change has already taken place.
  • phase change material desirably should be used at an ambient temperature optimal for the material in question, otherwise there is not much sense in utilizing phase change material at all.
  • the “main” cooling system is adjusted in order to keep the temperature at a suitable level for the phase change material, as explained in connection with FIG. 5 , can be advantageous, because then once a peak occurs in the heat generation, the phase change material can work efficiently and quickly to reduce the negative impact such a peak can have on the apparatus in question. If the pump (and liquid) is used instead of the fan (and air), there is analogue from ambient temperature to coolant (e.g. water) temperature.
  • coolant e.g. water

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/601,080 2011-09-06 2012-08-31 Apparatus Abandoned US20130075076A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11180187.4 2011-09-06
EP11180187.4A EP2568790B1 (de) 2011-09-06 2011-09-06 Vorrichtung und Verfahren

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US20130075076A1 true US20130075076A1 (en) 2013-03-28

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EP (2) EP2568792A1 (de)
CN (1) CN102984920B (de)
FI (1) FI10635U1 (de)

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US11346583B2 (en) 2018-06-27 2022-05-31 Emerson Climate Technologies, Inc. Climate-control system having vapor-injection compressors
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