US20130055727A1

US20130055727A1 - Cooling unit

Info

Publication number: US20130055727A1
Application number: US13/601,926
Authority: US
Inventors: Joon Choi
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2011-09-02
Filing date: 2012-08-31
Publication date: 2013-03-07
Also published as: KR20130025635A; CN102984919A; JP2013054722A

Abstract

Disclosed herein is a cooling unit including a case, a magnet which is mounted on a lower portion of the case, a magnetic fluid which is provided on a lower portion of the magnet to absorb heat, and a bracket which supports a lower portion of the magnetic fluid.

Description

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No. 10-2011-0089064, filed on Sep. 2, 2011, entitled “Cooling Unit”, which is hereby incorporated by reference in its entirety into this application.

BACKGROUND OF THE INVENTION

1. Technical Field
The present invention relates to a cooling unit.
2. Description of the Related Art
Mobile electronic devices such as mobile phones, game consoles, mobile information terminals, and tablet PCs, have become miniaturized and advanced, and in particular, a heat problem is increasingly emerging in response to the competitive market for increased speed of the central processing unit (CPU) with improved performance. In order to solve this problem, various solutions have been suggested.
In general, most of the electric, electronic, and mechanical systems generate heat due to inner overload of the system and employ a cooling unit to remove the heat.
In particular, there is no particular movement in the prior art, and a laptop computer or a desktop computer, which is a large size information technology (IT) device, mainly uses a fan motor. The fan motor cools ambient air around a CPU using a blade that generates wind by means of rotation of a motor.
A central processing unit (PCU), which is a main part of the electronic system, generates much heat due to a high clock frequency, and, a cooling unit (or a radiating unit) has been essentially installed in order to remove the heat.
However, in the case of a mobile electronic device, it is difficult to use such a cooling unit because of a limited size and auditory noise caused by the motor (in the case of a mobile phone, voice quality may deteriorate due to a motor operating sound).
Accordingly, the present invention aims at suggesting a method for cooling a CPU by applying a magnetic fluid rather than a cooling method using rotation of a motor.

SUMMARY OF THE INVENTION

The present invention has been made in an effort to provide a cooling unit which can cool a CPU by applying a magnetic fluid rather than a cooling method using rotation of a motor.
According to a preferred embodiment of the present invention, there is provided a cooling unit including: a case; a magnet which is mounted on a lower portion of the case; a magnetic fluid which is provided on a lower portion of the magnet; and a bracket which supports a lower portion of the magnetic fluid.
The magnetic fluid may be a fluid that is formed by stabilizing and dispersing magnetic powder in a liquid having a colloidal shape and then adding a surfactant so as not to cause precipitation and cohesion, and may absorb heat transmitted from the bracket.
The case may be rectangular and contain the magnet and the magnetic fluid therein, and may include a hole formed on a top surface thereof.
The magnet may be rectangular and may be a permanent magnet.
The bracket may be made of copper.
A CPU may be mounted on a lower portion of the bracket and a PCB may be mounted on a lower portion of the CPU.
The bracket may include a thermal conduction element formed on a lower portion thereof, and the thermal conduction element may be connected to an upper portion of the CPU disposed on a side portion of the cooling unit.
A PCB may be mounted on a lower portion of the CPU and the thermal conduction element may be extended to a side in a stepwise shape.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view illustrating a whole cooling unit according to a preferred embodiment of the present invention;

FIG. 2 is a cross sectional view illustrating a whole cooling unit according to another preferred embodiment of the present invention; and

FIG. 3 is a cross sectional view illustrating a whole cooling unit according to still another preferred embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Various features and advantages of the present invention will be more obvious from the following description with reference to the accompanying drawings.
The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.
Various objects, advantages and features of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numerals designate like components even though components are shown in different drawings. Further, when it is determined that the detailed description of the known art related to the present invention may obscure the gist of the present invention, the detailed description thereof will be omitted.
Hereinafter, preferred embodiments will be described in greater detail with reference to the accompanying drawings.
FIG. 1 is a cross sectional view illustrating a whole cooling unit according to a preferred embodiment of the present invention, FIG. 2 is a cross sectional view illustrating a whole cooling unit according to another preferred embodiment of the present invention, and FIG. 3 is a cross sectional view illustrating a whole cooling unit according to still another preferred embodiment of the present invention.
As shown in FIG. 1, the present invention relates to a cooling unit including a magnetic fluid. A cooling unit 100 according to a preferred embodiment of the present invention includes a case 110 which encloses the cooling unit 100 overall and protects the cooling unit 100, a magnet 120 which is disposed in the case 110, a magnetic fluid 130 which is disposed on a lower portion of the magnet 120 and a motion of which is controlled by magnetic force, and a bracket 140 which supports a lower portion of the magnetic fluid 130.
The case 110, which encloses the cooling unit 100 overall and protects the cooling unit 100, contains the magnet 120 and the magnetic fluid 130 therein. The present invention is to cool a CPU from which heat is generated and the case 110 recited herein generally refers to a case of the CPU.
The case 110 protects inner parts such as the magnet 120 and the magnetic fluid 130 contained therein, and includes a hole 111 to discharge heat absorbed into the magnetic fluid 130 to the outside. The hole 111 is not limited to a specific location and a specific shape, but it is preferable that one or two holes are formed on a top surface of the case 110.
The magnet 120 is mounted on a lower portion of the case 110 so as to allow the magnetic fluid to be concentrated thereon. The magnet 120 is not limited to a specific type and a specific shape, but it is preferable that the magnet is formed in a rectangular shape so as to be mounted on the lower portion of the case 110 easily.
The magnetic fluid 130 is disposed on the lower portion of the magnet 120 and concentrated onto the magnet 120, and cools the bracket 140 which has high thermal conductivity.
The magnetic fluid 130 is a fluid that is formed by stabilizing and dispersing magnetic powder in a liquid having a colloidal shape and then adding a surfactant so as not to cause precipitation and cohesion. Since the magnetic powder is ultrafine powder and incurs the Brownian motion of the ultrafine powder, the magnetic fluid 130 constantly maintains concentration of magnetic particles in the fluid and maintains characteristics of the magnetic fluid, even if a magnetic field, gravity, or a centrifugal force is applied from the outside.
That is, a magnetic field is generated from the outside and is controlled, and according to a change in the magnetic field, the magnetic fluid flows in the cooling unit. The magnetic field may be generated using a permanent magnet or may be generated using an electromagnet in order to electrically control the magnetic fluid 130. Preferably, the magnetic field may be generated using a pattern of a printed circuit board (PCB), satisfying electric control and minimization of a volume.
Forming the magnetic field using the pattern of the PCB is a well-known technique, can be modified variously according to an ordinary skilled person's demand, and is not limited to a specific pattern.
The bracket 140 is made of a material with high thermal conductivity, for example, copper, to absorb heat from the CPU.
FIG. 2 illustrates a cooling unit, which is mounted on an upper portion of a CPU 150, according to another preferred embodiment of the present invention.
The CPU 150, which is a main part of an electronic system, generates much heat due to a high clock frequency, and thus a cooling unit is essential to remove the heat.
A PCB 160 is mounted on a lower portion of the CPU 150, and is provided to satisfy electric control and minimization of a volume simultaneously and a magnetic field may be generated using a pattern of the PCB 160.
A magnetic fluid 130 is disposed on a lower portion of a magnet 120 and on an upper portion of a bracket 140, and concentrated onto the magnet 120. The magnetic fluid 130 cools heat generated from the CPU 150 and transmitted to the bracket 140 with high thermal conductivity.
The bracket 140 is made of a material with high thermal conductivity such as copper.
FIG. 3 illustrates a cooling unit, which is mounted on a side portion of a CPU 150, according to still another preferred embodiment.
As shown in FIG. 3, the cooling unit is disposed on a side of the CPU 150 and is the same as those of FIGS. 1 and 2 in its configuration and characteristics.
That is, a magnet 120 is disposed on a lower portion of a case 110, and a magnetic fluid 130 is disposed on a lower portion of the magnet 120.
The magnet 120 allows the magnetic fluid 130 to be concentrated thereon, and is not limited to a specific type and a specific shape. In general, it is preferable that the magnet 120 is formed in a rectangular shape so as to be mounted on the lower portion of the case 110 easily.
The magnetic fluid 130 is a fluid that is formed by stabilizing and dispersing magnetic powder in a liquid in a colloid shape and then adding a surfactant so as not to cause precipitation and cohesion, and is disposed on the lower portion of the magnet 120 and concentrated onto the magnet 120 to cool a bracket 140 with high thermal conductivity.
The bracket 140 is disposed on a lower portion of the magnetic fluid 130 and a thermal conduction element 141 is disposed on a lower portion of the bracket 140.
The thermal conduction element 141 supports the lower portion of the bracket 140, and simultaneously, is extended to the side portion in a stepwise pattern and is integrally formed with an upper portion of the CPU 150.
The thermal conduction element 141 is provided to transmit heat to the bracket 140, and is made of a material with high thermal conductivity such as copper and is not limited to a specific shape. However, it is preferable that the thermal conduction element 140 is extended to the side so that the heat generated from the CPU 150 is transmitted to the bracket 140 and the magnetic fluid 130.
The magnetic fluid 130 serves to absorb the heat transmitted from the bracket 140.
The CPU 150 is a main part of an electronic system and generates much heat.
A PCB 160 supports a lower portion of the thermal conduction element 141 and a lower portion of the CPU 150 simultaneously and is provided to satisfy electric control and minimization of a volume simultaneously, and generates a magnetic field using a pattern.
According to the preferred embodiments described above, the cooling unit 100 includes the magnet 120 disposed on the lower portion of the case 110, the magnetic fluid 130 disposed on the lower portion of the magnet 120, and the bracket 140 disposed on the lower portion of the magnetic fluid 130, and is mounted on an electronic device to absorb heat or cool the electronic device.
The cooling unit 100 may be variously shaped and the magnetic fluid 130 embedded in the cooling unit 100 absorbs the heat of the electronic device.
The heat absorbed by the magnetic fluid 130 is discharged through the hole 111 formed on the top of the case 110.
The cooling unit 100 may be directly mounted on the CPU 150 and may be connected to the thermal conduction element 141.
The cooling unit 100 may be manufactured to have a slim structure since the cooling unit 100 does not have a rotational structure such as a motor.
In particular, in the case of a mobile phone which is in contact with user's skin when used, the rotational structure such as the motor may causes noise and vibration when the motor is rotated, thereby deteriorating sensory quality of a consumer. However, the cooling unit 100 is not a rotational structure and can absorb or remove the heat of the CPU 150.
Although the embodiment of the present invention has been disclosed for illustrative purposes, it will be appreciated that a cooling unit according to the invention is not limited thereto, and those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention.
Accordingly, any and all modifications, variations or equivalent arrangements should be considered to be within the scope of the invention, and the detailed scope of the invention will be disclosed by the accompanying claims.

Claims

1. A cooling unit comprising:

a case;

a magnet which is mounted on a lower portion of the case;

a magnetic fluid which is concentrated onto the magnet and absorbs heat; and

a bracket which supports a lower portion of the magnetic fluid.

2. The cooling unit as set forth in claim 1, wherein the magnetic fluid is a fluid that is formed by stabilizing and dispersing magnetic powder in a liquid having a colloidal shape and then adding a surfactant so as not to cause precipitation and cohesion, and absorbs heat transmitted from the bracket.

3. The cooling unit as set forth in claim 1, wherein the case is rectangular and contains the magnet and the magnetic fluid therein, and includes a hole formed on a top surface thereof.

4. The cooling unit as set forth in claim 1, wherein the magnet is rectangular and is a permanent magnet.

5. The cooling unit as set forth in claim 1, wherein the bracket is made of copper.

6. The cooling unit as set forth in claim 1, wherein a CPU is mounted on a lower portion of the bracket and a PCB is mounted on a lower portion of the CPU.

7. The cooling unit as set forth in claim 1, wherein the bracket includes a thermal conduction element formed on a lower portion thereof, and the thermal conduction element is connected to an upper portion of the CPU disposed on a side portion of the cooling unit.

8. The cooling unit as set forth in claim 7, wherein a PCB is mounted on a lower portion of the CPU and the thermal conduction element is extended to a side in a stepwise shape.