US20130014917A1 - Heat pipe-attached heat sink with bottom radiation fins - Google Patents

Heat pipe-attached heat sink with bottom radiation fins Download PDF

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Publication number
US20130014917A1
US20130014917A1 US13/182,638 US201113182638A US2013014917A1 US 20130014917 A1 US20130014917 A1 US 20130014917A1 US 201113182638 A US201113182638 A US 201113182638A US 2013014917 A1 US2013014917 A1 US 2013014917A1
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Prior art keywords
heat
radiation fin
radiation
radiation fins
heat pipe
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US13/182,638
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Tsung-Hsien Huang
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/06—Reinforcing means for fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat sink technology and more particularly, to a heat pipe-attached heat sink with bottom radiation fins, which uses a bonding agent to bond heat pipes to locating grooves of radiation fins and to keep the heat-absorbing face of each heat pipe in flush with a flat abutment edge of an extension abutment strip of each radiation fin for direct contact with the heat source.
  • a conventional heat pipe attached heat sink comprising: a radiation fin module, one or a number of heat pipes and a metal bottom block.
  • the bottom block is kept in direct contact with the heat source, enabling waste heat to be transferred by the bottom block to the radiation fins of the radiation fin module through the heat pipe(s) for quick dissipation.
  • This design of heat sink utilizes the bottom block, the heat pipe(s) and the radiation fin module to transfer heat in proper order.
  • this heat transfer method has a low heat dissipation speed and performance.
  • Another prior art heat sink design which eliminates the use of a metal bottom block and has the heat-absorbing end of each heat pipe be directly press-fitted into a respective mounting groove on each of a number of radiation fins.
  • heat pipes After connection between heat pipes and radiation fins, heat pipes are kept flattened and kept in parallel for direct contact with the heat source for quick transfer of waste heat from the heat source to the radiation fins for quick dissipation.
  • the radiation fins are not directly kept in contact with the surface of the heat source for direct dissipation of waste heat.
  • the present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat pipe-attached heat sink, which eliminates the drawbacks of the aforesaid various prior art designs.
  • a heat pipe-attached heat sink comprises a radiation fin module, which comprises a plurality of radiation fins arranged in parallel, each radiation fin comprising an extension abutment strip having a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on the flat abutment edge, the flat abutment edge of one radiation fin being stopped against the flat abutment edge of another said the radiation fin in a flush manner, a plurality of heat pipes respectively press-fitted into the locating grooves of the extension abutment strips of the radiation fins each having a flat heat-absorbing face kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, and a bonding agent applied to the locating grooves of the radiation fins to bond the heat pipes to the radiation fins.
  • the heat pipes are peripherally and tightly abutted against one another. As the flat heat-absorbing faces of the heat pipes are kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, the heat pipes and the radiation fins can be directly attached to the heat source for quick dissipation of waste heat from the heat source.
  • the bonding agent can be tin solder or any suitable material having high heat transfer coefficient.
  • stop blocks may be fastened to the radiation fins and stopped against at least one of two opposite lateral sides of the flat abutment edges of the radiation fins of the radiation fin module to reinforce the structural strength.
  • each stop block comprises a plurality of retaining grooves and retaining ribs located on the bottom side thereof and forced into engagement with the radiation fins. Further, each stop block has a top end edge kept in flush with the flat heat-absorbing faces of the heat pipes and the flat abutment edges of the radiation fins of the radiation fin module for direct contact with the heat source.
  • FIG. 1 is an oblique elevational view of a heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 2 is a schematic top view of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 3 is a sectional view taken, in an enlarged scale, along line B-B of FIG. 2 .
  • FIG. 4 is a sectional view taken, in an enlarged scale, along line A-A of FIG. 2 .
  • FIG. 5 is a schematic exploded view of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 6 corresponds to FIG. 5 , illustrating a rectangular form of the locating grooves.
  • FIG. 7 is an assembly view of FIG. 6 .
  • FIG. 8 corresponds to FIG. 4 illustrating another alternate form of the locating grooves of the radiation fins.
  • FIG. 9 corresponds to FIG. 4 illustrating still another alternate form of the locating grooves of the radiation fins.
  • FIG. 10 is an oblique elevation of an alternate form of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 11 is a top view of FIG. 10 .
  • FIG. 12 is an oblique elevation of another alternate form of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 13 is a top view of FIG. 12 .
  • FIG. 14 is an oblique elevation of still another alternate form of the heat pipe-attached heat sink in accordance with the present invention.
  • a heat pipe-attached heat sink with bottom radiation fins in accordance with a first embodiment of the present invention is shown comprising at least one radiation fin module 10 , at least one, for example, a number of heat pipes 20 , and a bonding agent 30 .
  • the radiation fin module 10 consists of a plurality of radiation fins 1 arranged in parallel.
  • Each radiation fin 1 comprises an extension abutment strip 11 , as shown in FIG. 4 .
  • the extension abutment strip 11 comprises a flat abutment edge 12 perpendicularly disposed at one or each of opposing top and bottom sides and a plurality of locating grooves 13 located on the flat abutment edge 12 for accommodating heat pipes 20 .
  • the flat abutment edge 12 of one radiation fin 1 is abutted against that of another radiation fin 1 .
  • the heat pipes 20 are accommodated in the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 and tightly abutted against one another side by side without leaving any gap between each two adjacent heat pipes 20 , each having a flat heat-absorbing face 201 kept in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10 .
  • the bonding agent 30 is applied to the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 , and then the heat pipes 20 are attached to the locating grooves 13 and abutted against one another side by side keeping the flat heat-absorbing face 201 of each heat pipe 20 in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10 for direct contact with the heat source to facilitate quick dissipation of waste heat from the heat source.
  • stop blocks 4 may be bonded to the radiation fins 1 of the radiation fin module 10 and stopped against the flat abutment edges 12 of the radiation fins 1 at one or each of two opposite lateral sides to reinforce the structural strength. As illustrated in FIG. 3 , each stop block 4 has a plurality of retaining grooves 41 and a plurality of retaining ribs 42 located on the bottom side thereof for engagement with the radiation fins 1 , enhancing connection stability.
  • This stop block mounting design is simply an example but not a limitation.
  • the number of the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 is determined subject to the number of the heat pipes 20 .
  • the locating grooves 13 of the radiation fins 1 may be variously configured.
  • the locating grooves 13 can be made having a smoothly arched bottom wall (see FIG. 4 ).
  • a bottom notch 131 may be located on the bottom side of the locating groove 13 of each radiation fin 1 for the filling of the bonding agent 30 into the locating groove 13 rapidly.
  • FIGS. 6 and 7 illustrate another alternate form of the locating grooves 13 of the radiation fins 1 .
  • the locating grooves 13 have a rectangular cross section for accommodating flat rectangular heat pipes 20 .
  • the aforesaid bottom notch 131 is not requisite and can be omitted. As illustrated in FIGS. 8 and 9 , the bonding agent (tin solder) 30 can be directly applied to the inner wall of the locating groove 13 of each of the radiation fins 1 for the bonding of the heat pipes 20 .
  • the design of the aforesaid bottom notch 131 is for the filling of the bonding agent 30 that is selected from a material having high heat transfer coefficient.
  • FIGS. 10 and 11 illustrate the use of a different form of heat pipes 20 a.
  • the heat-discharging end 202 of each heat pipe 20 a is curved and turned back and then inserted into the radiation fin module 10 a again.
  • FIG. 14 illustrates still another alternate form of the present invention.
  • the heat-discharging ends 202 of the heat pipes 20 a extend out of the radiation fin module 10 c in two reversed directions and then inserted into the radiation fin module 10 c again.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat pipe-attached heat sink includes a radiation fin module having a plurality of radiation fins arranged in parallel, each radiation fin having an extension abutment strip, each extension abutment strip having a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on the flat abutment edge, heat pipes respectively press-fitted into the locating grooves of the extension abutment strips each having a flat heat-absorbing face kept in flush with the flat abutment edges of the radiation fins, a bonding agent applied to the locating grooves of the radiation fins to bond the heat pipes to the radiation fins, and stop blocks fastened to the radiation fins and stopped against the flat abutment edges of the radiation fins at one side to reinforce the structural strength.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The present invention relates to heat sink technology and more particularly, to a heat pipe-attached heat sink with bottom radiation fins, which uses a bonding agent to bond heat pipes to locating grooves of radiation fins and to keep the heat-absorbing face of each heat pipe in flush with a flat abutment edge of an extension abutment strip of each radiation fin for direct contact with the heat source.
  • (b) Description of the Prior Art
  • A conventional heat pipe attached heat sink is known comprising: a radiation fin module, one or a number of heat pipes and a metal bottom block. During application, the bottom block is kept in direct contact with the heat source, enabling waste heat to be transferred by the bottom block to the radiation fins of the radiation fin module through the heat pipe(s) for quick dissipation. This design of heat sink utilizes the bottom block, the heat pipe(s) and the radiation fin module to transfer heat in proper order. However, this heat transfer method has a low heat dissipation speed and performance. There is known another prior art heat sink design, which eliminates the use of a metal bottom block and has the heat-absorbing end of each heat pipe be directly press-fitted into a respective mounting groove on each of a number of radiation fins. After connection between heat pipes and radiation fins, heat pipes are kept flattened and kept in parallel for direct contact with the heat source for quick transfer of waste heat from the heat source to the radiation fins for quick dissipation. According to this design, the radiation fins are not directly kept in contact with the surface of the heat source for direct dissipation of waste heat.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat pipe-attached heat sink, which eliminates the drawbacks of the aforesaid various prior art designs.
  • To achieve this and other objects of the present invention, a heat pipe-attached heat sink comprises a radiation fin module, which comprises a plurality of radiation fins arranged in parallel, each radiation fin comprising an extension abutment strip having a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on the flat abutment edge, the flat abutment edge of one radiation fin being stopped against the flat abutment edge of another said the radiation fin in a flush manner, a plurality of heat pipes respectively press-fitted into the locating grooves of the extension abutment strips of the radiation fins each having a flat heat-absorbing face kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, and a bonding agent applied to the locating grooves of the radiation fins to bond the heat pipes to the radiation fins. Further, the heat pipes are peripherally and tightly abutted against one another. As the flat heat-absorbing faces of the heat pipes are kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, the heat pipes and the radiation fins can be directly attached to the heat source for quick dissipation of waste heat from the heat source.
  • Further, the bonding agent can be tin solder or any suitable material having high heat transfer coefficient.
  • Further, stop blocks may be fastened to the radiation fins and stopped against at least one of two opposite lateral sides of the flat abutment edges of the radiation fins of the radiation fin module to reinforce the structural strength.
  • Further, the stop block comprises a plurality of retaining grooves and retaining ribs located on the bottom side thereof and forced into engagement with the radiation fins. Further, each stop block has a top end edge kept in flush with the flat heat-absorbing faces of the heat pipes and the flat abutment edges of the radiation fins of the radiation fin module for direct contact with the heat source.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an oblique elevational view of a heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 2 is a schematic top view of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 3 is a sectional view taken, in an enlarged scale, along line B-B of FIG. 2.
  • FIG. 4 is a sectional view taken, in an enlarged scale, along line A-A of FIG. 2.
  • FIG. 5 is a schematic exploded view of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 6 corresponds to FIG. 5, illustrating a rectangular form of the locating grooves.
  • FIG. 7 is an assembly view of FIG. 6.
  • FIG. 8 corresponds to FIG. 4 illustrating another alternate form of the locating grooves of the radiation fins.
  • FIG. 9 corresponds to FIG. 4 illustrating still another alternate form of the locating grooves of the radiation fins.
  • FIG. 10 is an oblique elevation of an alternate form of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 11 is a top view of FIG. 10.
  • FIG. 12 is an oblique elevation of another alternate form of the heat pipe-attached heat sink in accordance with the present invention.
  • FIG. 13 is a top view of FIG. 12.
  • FIG. 14 is an oblique elevation of still another alternate form of the heat pipe-attached heat sink in accordance with the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 1-5, a heat pipe-attached heat sink with bottom radiation fins in accordance with a first embodiment of the present invention is shown comprising at least one radiation fin module 10, at least one, for example, a number of heat pipes 20, and a bonding agent 30.
  • The radiation fin module 10 consists of a plurality of radiation fins 1 arranged in parallel. Each radiation fin 1 comprises an extension abutment strip 11, as shown in FIG. 4. The extension abutment strip 11 comprises a flat abutment edge 12 perpendicularly disposed at one or each of opposing top and bottom sides and a plurality of locating grooves 13 located on the flat abutment edge 12 for accommodating heat pipes 20. When the radiation fins 1 are arranged together, the flat abutment edge 12 of one radiation fin 1 is abutted against that of another radiation fin 1.
  • The heat pipes 20 are accommodated in the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 and tightly abutted against one another side by side without leaving any gap between each two adjacent heat pipes 20, each having a flat heat-absorbing face 201 kept in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10.
  • The bonding agent 30 is applied to the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 to bond the heat pipes 20 to the radiation fins 1. The adhesive 30 can be tin solder or thermal adhesive.
  • During installation, the bonding agent 30 is applied to the locating grooves 13 of the radiation fins 1 of the radiation fin module 10, and then the heat pipes 20 are attached to the locating grooves 13 and abutted against one another side by side keeping the flat heat-absorbing face 201 of each heat pipe 20 in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10 for direct contact with the heat source to facilitate quick dissipation of waste heat from the heat source.
  • Further, stop blocks 4 may be bonded to the radiation fins 1 of the radiation fin module 10 and stopped against the flat abutment edges 12 of the radiation fins 1 at one or each of two opposite lateral sides to reinforce the structural strength. As illustrated in FIG. 3, each stop block 4 has a plurality of retaining grooves 41 and a plurality of retaining ribs 42 located on the bottom side thereof for engagement with the radiation fins 1, enhancing connection stability. This stop block mounting design is simply an example but not a limitation.
  • Referring to FIG. 5, the aforesaid stop blocks 4 are stopped against the flat abutment edges 12 of the radiation fins 1 at one or each of two opposite lateral sides to reinforce the structural strength, each having an end edge 43 kept in flush with the flat heat-absorbing faces 201 of the heat pipes 20 and the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10 for direct contact with the heat source to facilitate quick dissipation of waste heat from the heat source. When desired, the elevation of the end edge 43 of each stop block 4 can be set lower than the elevation of the flat heat-absorbing faces 201 of the heat pipes 20 and the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10.
  • The number of the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 is determined subject to the number of the heat pipes 20. Further, the locating grooves 13 of the radiation fins 1 may be variously configured. For example, the locating grooves 13 can be made having a smoothly arched bottom wall (see FIG. 4). Further, a bottom notch 131 may be located on the bottom side of the locating groove 13 of each radiation fin 1 for the filling of the bonding agent 30 into the locating groove 13 rapidly. FIGS. 6 and 7 illustrate another alternate form of the locating grooves 13 of the radiation fins 1. According to this alternate form, the locating grooves 13 have a rectangular cross section for accommodating flat rectangular heat pipes 20.
  • The aforesaid bottom notch 131 is not requisite and can be omitted. As illustrated in FIGS. 8 and 9, the bonding agent (tin solder) 30 can be directly applied to the inner wall of the locating groove 13 of each of the radiation fins 1 for the bonding of the heat pipes 20. The design of the aforesaid bottom notch 131 is for the filling of the bonding agent 30 that is selected from a material having high heat transfer coefficient.
  • FIGS. 10 and 11 illustrate the use of a different form of heat pipes 20 a. According to this application example, the heat-discharging end 202 of each heat pipe 20 a is curved and turned back and then inserted into the radiation fin module 10 a again.
  • FIGS. 12 and 13 illustrate still another alternate form of the present invention. According to this embodiment, the heat-discharging ends 202 of the heat pipes 20 a extend out of the radiation fin module 10 and then inserted into a second radiation fin module 10 b, constituting a dual fin module heat sink combination.
  • FIG. 14 illustrates still another alternate form of the present invention. According to this embodiment, the heat-discharging ends 202 of the heat pipes 20 a extend out of the radiation fin module 10 c in two reversed directions and then inserted into the radiation fin module 10 c again.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (10)

1. A heat pipe-attached heat sink, comprising:
a radiation fin module, said radiation fin module comprising a plurality of radiation fins arranged in parallel, each said radiation fin comprising an extension abutment strip, said extension abutment strip comprising a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on said flat abutment edge, the flat abutment edge of one said radiation fin being stopped against the flat abutment edge of another said radiation fin in a flush manner;
a plurality of heat pipes respectively press-fitted into the locating grooves of said extension abutment strips of said radiation fins of said radiation fin module, each said heat pipe comprising a flat heat-absorbing face kept in flush with the flat abutment edges of said radiation fins of said radiation fin module; and
a bonding agent applied to said locating grooves of said radiation fins to bond said heat pipes to said radiation fins.
2. The heat pipe-attached heat sink as claimed in claim 1, wherein said heat pipes are peripherally and tightly abutted against one another.
3. The heat pipe-attached heat sink as claimed in claim 1, wherein said bonding agent is selected from tin solder or a material having high heat transfer coefficient.
4. The heat pipe-attached heat sink as claimed in claim 1, further comprising a plurality of stop blocks fastened to said radiation fins and stopped against at least one of two opposite lateral sides of said flat abutment edges of said radiation fins of said radiation fin module.
5. The heat pipe-attached heat sink as claimed in claim 4, wherein each said stop block comprises a plurality of retaining grooves and retaining ribs located on a bottom side thereof and forced into engagement with said radiation fins.
6. The heat pipe-attached heat sink as claimed in claim 4, wherein each said stop block has a top end edge kept in flush with the flat heat-absorbing faces of said heat pipes and the flat abutment edges of said radiation fins of said radiation fin module.
7. The heat pipe-attached heat sink as claimed in claim 1, wherein each said radiation fin further comprises a bottom notch located on a bottom side of each locating groove thereof for the filling of said bonding agent into the associating locating groove.
8. The heat pipe-attached heat sink as claimed in claim 1, wherein each said heat pipe has a heat discharging end extending out of said radiation fin module and then turned back and inserted into said radiation fin module again.
9. The heat pipe-attached heat sink as claimed in claim 1, wherein each said heat pipe has a heat discharging end extending out of said radiation fin module and then inserted into an external radiation fin module.
10. The heat pipe-attached heat sink as claimed in claim 1, wherein said heat pipes each have a heat discharging end extending out of said radiation fin module in one of two reversed directions and then turned back and inserted into said radiation fin module again.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3031804A1 (en) * 2015-01-19 2016-07-22 Valeo Systemes Thermiques IMPROVED HEAT EXCHANGER WITH TUBES AND FINS AND METHOD OF MANUFACTURING SUCH A HEAT EXCHANGER
US20170231116A1 (en) * 2016-02-05 2017-08-10 Auras Technology Co., Ltd. Heat dissipating device
EP3739285A1 (en) * 2019-05-15 2020-11-18 Cambricon Technologies Corporation Limited Heat dissipation device and board card
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US11953268B2 (en) * 2022-01-21 2024-04-09 Dongguan Hanxu Hardware Plastic Technology Co., Ltd. Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method

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