US20120291990A1 - Heat dissipation apparatus and outdoor communication device - Google Patents

Heat dissipation apparatus and outdoor communication device Download PDF

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Publication number
US20120291990A1
US20120291990A1 US13/472,974 US201213472974A US2012291990A1 US 20120291990 A1 US20120291990 A1 US 20120291990A1 US 201213472974 A US201213472974 A US 201213472974A US 2012291990 A1 US2012291990 A1 US 2012291990A1
Authority
US
United States
Prior art keywords
heat exchange
lattices
thermosiphon
heat dissipation
units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/472,974
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English (en)
Inventor
Hui Lin
Taqing Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Assigned to HUAWEI TECHNOLOGIES CO., LTD. reassignment HUAWEI TECHNOLOGIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, TAQING, LIN, HUI
Publication of US20120291990A1 publication Critical patent/US20120291990A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Definitions

  • the present application relates to heat exchange techniques, and more specifically, to a heat dissipation apparatus and an outdoor communication device.
  • FIG. 1 is a schematic structure diagram of a heat dissipation apparatus in the prior art.
  • the heat dissipation apparatus comprises: an internal circulation heat exchange unit, an external circulation heat exchange unit, a vapor rising pipe, a liquid dropping pipe, an internal circulation fan, an external circulation fan, and air passage partitions.
  • the internal circulation heat exchange unit, the external circulation heat exchange unit, the vapor rising pipe, and the liquid dropping pipe are communicated internally and accommodate refrigerant therein.
  • the heat dissipation apparatus if the probability of sequential updates of an outdoor communication device is considered, the heat dissipation apparatus has to be designed according to the working power when a maximum number of service boards are provided for the outdoor communication device, thereby, manufacturing cost may increase, and there may be a waste in cost if the outdoor communication device is not provided with a maximum number of service boards.
  • a heat dissipation apparatus is provided only according to the working power of an outdoor communication device specified in the original communication network construction, if a update is needed for the outdoor communication device later, the outdoor communication device must be replaced as a whole, leading to a larger waste in cost.
  • the existing heat dissipation apparatus can not be updated synchronization with outdoor communication devices, leading to waste in production cost of outdoor communication devices.
  • a heat dissipation apparatus is provided in one embodiment for addressing defects in the prior art and lowering manufacturing cost.
  • An outdoor communication device is provided in one embodiment for addressing defects in the prior art and lowering manufacturing cost.
  • a heat dissipation device is further provided in one embodiment and comprises: one or more thermosiphon heat exchange units, one or more first partitions, and a frame having at least two lattices; wherein
  • thermosiphon heat exchange units is embedded in one lattice of the at least two lattices
  • each lattice of the at least two lattices having no thermosiphon heat exchange unit embedded is disposed with the first partition to partition the lattice into an upper portion and a lower portion, wherein the first partition is detachable.
  • An outdoor communication device comprising the above heat dissipation apparatus is further provided in one embodiment and the outdoor communication device comprises: one or more service boards; wherein,
  • thermosiphon heat exchange units is determined according to the number of the service boards.
  • the frame of a heat dissipation apparatus may have a plurality of lattices in each of which a thermosiphon heat exchange unit can be embedded, the number of the embedded thermosiphon heat exchange units can be increased or decreased at any time depending on heat dissipation performance that is required, the synchronized update of the heat dissipation apparatus with the device where the heat dissipation apparatus is disposed can be implemented, a waste in cost caused when the heat dissipation apparatus is designed according to its maximum required heat dissipation performance can be avoided, and manufacturing cost can be saved.
  • the heat dissipation apparatus is plug-and-play, which may facilitate mount and maintenance, and the update requirement of devices can be met.
  • FIG. 1 is a schematic structural diagram of an existing heat dissipation apparatus
  • FIG. 2 is a schematic structural diagram of an unassembled heat dissipation apparatus according to Embodiment 1;
  • FIG. 3 is a schematic structural diagram of a thermosiphon heat exchange unit according to Embodiment 2;
  • FIG. 4 is a schematic structural diagram of an assembled heat dissipation apparatus according to Embodiment 3.
  • FIG. 2 is a schematic structural diagram of an unassembled heat dissipation apparatus according to Embodiment 1.
  • the heat dissipation apparatus at least comprises: one or more thermosiphon heat exchange units 1 , one or more first partitions 2 , and a frame 3 having at least two lattices.
  • each of the one or more thermosiphon heat exchange units 1 is embedded in one lattice of the at least two lattices.
  • Each lattice of the at least two lattices having no thermosiphon heat exchange unit 1 embedded is disposed with the first partition 2 to partition the lattice into an upper portion and a lower portion, where the first partition 2 is detachable.
  • the heat dissipation apparatus may further comprise: at least a fan unit 4 .
  • each fan unit 4 is embedded in a half lattice constructed by the frame 3 and a first partition 2 .
  • thermosiphon heat exchange unit 1 of the above technical solution.
  • FIG. 3 is a schematic structural diagram of a thermosiphon heat exchange unit according to Embodiment 2.
  • the thermosiphon heat exchange unit 1 is an enhanced heat exchange fin type thermosiphon tube.
  • each of the one or more thermosiphon heat exchange units 1 comprises: a condensation end collection pipe 11 in the upper portion of the thermosiphon heat exchange unit, a vapor end collection pipe 12 in the lower portion of the thermosiphon heat exchange unit, at least two cooling tubules 13 which are connected to the vapor end collection pipe 12 and the condensation end collection pipe 11 , cooling fins 14 evenly distributed between every two cooling tubules 13 , and a second partition 15 partitioning the thermosiphon heat exchange unit 1 into an upper portion and a lower portion.
  • the cooling fins 14 described above may have various shapes, preferably, the cooling fins 14 described above are ripple-shaped cooling fins.
  • Refrigerant is accommodated in the vapor end collection pipe 12 , condensation end collection pipe 11 , and cooling tubules 13 .
  • the refrigerant may be, but not limit to, any one of the following materials: ammonia, acetone, or R134A type refrigerant.
  • thermosiphon heat exchange unit 1 is portioned by the second partition 15 .
  • the lower portion of the partitioned thermosiphon heat exchange unit 1 comprises the vapor end collection pipe 12 and the lower portion of each cooling tubule 13 , which is arranged in an internal circulation air passage to contact with the heat air produced by a device where the heat dissipation apparatus is provided.
  • liquid refrigerant makes heat exchange with heat air, the refrigerant absorbing heat and then turning into vapor through vaporization.
  • the vapor rises into the upper portion of the thermosiphon heat exchange unit 1 that is portioned along the cooling tubules 13 .
  • the portioned upper portion of the thermosiphon heat exchange unit 1 comprises the condensation end collection pipe 11 and the upper portion of each cooling tubule 13 , which is arranged in an external circulation air passage to contact with the cool air outside of the heat dissipation apparatus.
  • refrigerant vapor makes heat exchange with the cool air to disperse heat, and then returns into liquid state through condensation.
  • Liquid refrigerant flows downward along the cooling tubules 13 due to gravity, returning to the lower portion of the thermosiphon heat exchange unit 1 that is portioned.
  • heat in the interior of the heat dissipation apparatus can be transmitted to the outside to realize heat dissipation.
  • FIG. 4 is a schematic structural diagram of an assembled heat dissipation apparatus according to Embodiment 3.
  • the heat dissipation apparatus comprises: a frame 3 having 8 lattices, 2 thermosiphon heat exchange units 1 and 6 first partitions 2 .
  • the 2 thermosiphon heat exchange units 1 are embedded in a second and a third lattices respectively.
  • a first partition 2 is disposed therein to partition the lattice where the partition is disposed into upper and lower portions. Furthermore, those first partitions 2 are detachable.
  • a plurality of lattices each are partitioned into upper and lower portions with a plurality of first partitions 2 .
  • the lower portion of all of the lattices is arranged in an internal circulation air passage to contact with heat air produced by a device where the heat dissipation apparatus is located.
  • the upper portion of all of the lattices is arranged in an external circulation air passage to contact cool air outside the heat dissipation apparatus.
  • the internal circulation air passage is isolated from the external circulation air passage by a plurality of first partitions 2 .
  • the number of the thermosiphon heat exchange units 1 is determined according to required heat dissipation performance. W hen the outdoor communication device where the heat dissipation apparatus is located is updated, first partitions 2 in lattices having no thermosiphon heat exchange units 1 embedded currently can be removed to embed new thermosiphon heat exchange units 1 , so that heat dissipation performance of the heat dissipation apparatus can be improved. In Embodiment 3, only 2 thermosiphon heat exchange units 1 are provided as an example.
  • the number of fan units 4 also can be determined according to required heat dissipation performance. When it is required to improve heat dissipation performance, newly added fan units 4 can be embedded in half lattices constructed by the frame 3 and first partitions 2 . Also, according to the strength of air flow in the internal circulation air passage and the external circulation air passage, the same number or different numbers of fan units 4 can be disposed in the internal circulation air passage and the external circulation air passage. When adding new fan units 4 , it is possible to add new fan units 4 in merely one of the internal circulation air passage and the external circulation air passage if necessary. In Embodiment 3, only one fan unit 4 is disposed in each of the internal circulation air passage and the external circulation air passage as an example.
  • the lattice, the thermosiphon heat exchange unit 1 and the fan unit 4 are all rectangular. Particularly, the lattice and the thermosiphon heat exchange unit may have the same shape.
  • the width of the fan unit 4 is equal to the width of the lattice and the thermosiphon heat exchange unit 1 , the height of the fan unit 4 is half of the height of the lattice and the thermosiphon heat exchange unit 1 .
  • the lattice, the thermosiphon heat exchange unit 1 , and the fan unit 4 may have other shapes.
  • the heat dissipation apparatus of any one of Embodiment 1 to Embodiment 3 can be applied to an outdoor communication device.
  • the outdoor communication device comprises the heat dissipation apparatus and one or more service boards, the heat dissipation apparatus being one mentioned in any one of Embodiment 1 to Embodiment 3.
  • the number of the thermosiphon heat exchange units in the heat dissipation apparatus can be determined according to the number of the service boards. When the outdoor communication device is updated, the number of the service boards may increase, and additional heat dissipation apparatus may be added in the heat dissipation apparatus correspondingly. Further, the number of the fan units in the heat dissipation apparatus also can be determined based on the number of the service boards. When the outdoor communication device is updated, the number of the service boards may increase, fan units may be added in the heat dissipation apparatus correspondingly.
  • the frame of the heat dissipation apparatus has a plurality of lattices in which a plurality of thermosiphon heat exchange units can be embedded, the number of the embedded thermosiphon heat exchange units can be increased or decreased at any time depending on heat dissipation performance that is required currently, the synchronized update of the heat dissipation apparatus with the device where the heat dissipation apparatus is disposed can be implemented, a waste in cost caused when the heat dissipation apparatus is designed according to its maximum required heat dissipation performance can be avoided, and manufacturing cost can be saved.
  • the heat dissipation apparatus is plug-and-play, which may facilitate mount and maintenance, and the update requirement of devices can be met.
  • the storage medium described above may comprise: ROM, RAM, magnetic disks, optical disks and various mediums capable of storing program codes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Other Air-Conditioning Systems (AREA)
US13/472,974 2011-05-16 2012-05-16 Heat dissipation apparatus and outdoor communication device Abandoned US20120291990A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/074103 WO2011124186A2 (fr) 2011-05-16 2011-05-16 Dissipateur de chaleur et dispositif de communication extérieur

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/074103 Continuation WO2011124186A2 (fr) 2011-05-16 2011-05-16 Dissipateur de chaleur et dispositif de communication extérieur

Publications (1)

Publication Number Publication Date
US20120291990A1 true US20120291990A1 (en) 2012-11-22

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US13/472,974 Abandoned US20120291990A1 (en) 2011-05-16 2012-05-16 Heat dissipation apparatus and outdoor communication device

Country Status (4)

Country Link
US (1) US20120291990A1 (fr)
EP (1) EP2557908B1 (fr)
CN (1) CN102204425B (fr)
WO (1) WO2011124186A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120147562A1 (en) * 2009-06-15 2012-06-14 Taqing Feng Heat exchanger, heat dissipation method of the same and communication apparatus
CN103281880A (zh) * 2013-05-21 2013-09-04 永济新时速电机电器有限责任公司 动车牵引辅助变流器箱体排水排气装置
CN104519724A (zh) * 2014-12-26 2015-04-15 宁波市令通电信设备有限公司 一种可散热通信机柜
US11035620B1 (en) * 2020-11-19 2021-06-15 Richard W. Trent Loop heat pipe transfer system with manifold

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103826423B (zh) * 2011-05-16 2017-06-20 华为技术有限公司 散热装置和户外通讯设备
CN102566605A (zh) * 2012-01-17 2012-07-11 华为技术有限公司 单板冷却装置

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JPS62297697A (ja) * 1986-06-17 1987-12-24 Akutoronikusu Kk モジユラ−熱交換器
US5372182A (en) * 1993-05-24 1994-12-13 Gore; Thomas L. Modular regenerator pre-conditioner air system
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US6026891A (en) * 1996-06-12 2000-02-22 Denso Corporation Cooling device boiling and condensing refrigerant
US6039111A (en) * 1997-02-14 2000-03-21 Denso Corporation Cooling device boiling and condensing refrigerant
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
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US4333520A (en) * 1979-06-04 1982-06-08 Hitachi, Ltd. Heating and cooling ventilating system with heat recovery
JPS62297697A (ja) * 1986-06-17 1987-12-24 Akutoronikusu Kk モジユラ−熱交換器
US5372182A (en) * 1993-05-24 1994-12-13 Gore; Thomas L. Modular regenerator pre-conditioner air system
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6575230B1 (en) * 1996-01-29 2003-06-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
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US6761212B2 (en) * 2000-05-25 2004-07-13 Liebert Corporation Spiral copper tube and aluminum fin thermosyphon heat exchanger
US6579168B1 (en) * 2002-01-03 2003-06-17 Marconi Communications, Inc. Back-up DC vent system for equipment enclosure
US7448439B2 (en) * 2002-07-09 2008-11-11 Fujitsu Limited Heat exchanger
US20050092544A1 (en) * 2003-11-05 2005-05-05 Zong Tang Lee Fan unit air flow control
US7489509B2 (en) * 2004-04-15 2009-02-10 Telect, Inc. Thermally insulated cabinet and method for inhibiting heat transfer
US20080055849A1 (en) * 2004-06-29 2008-03-06 Lee Lin H Intelligent Outdoor Cabinet
US20060172685A1 (en) * 2004-08-26 2006-08-03 O'brien Paul Internal environmental control system and uses thereof
US20090296321A1 (en) * 2006-05-19 2009-12-03 Michael Wantschik Electrical cabinet with two cooling channels

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120147562A1 (en) * 2009-06-15 2012-06-14 Taqing Feng Heat exchanger, heat dissipation method of the same and communication apparatus
CN103281880A (zh) * 2013-05-21 2013-09-04 永济新时速电机电器有限责任公司 动车牵引辅助变流器箱体排水排气装置
CN104519724A (zh) * 2014-12-26 2015-04-15 宁波市令通电信设备有限公司 一种可散热通信机柜
US11035620B1 (en) * 2020-11-19 2021-06-15 Richard W. Trent Loop heat pipe transfer system with manifold

Also Published As

Publication number Publication date
CN102204425B (zh) 2014-03-12
EP2557908A2 (fr) 2013-02-13
CN102204425A (zh) 2011-09-28
WO2011124186A3 (fr) 2012-04-12
WO2011124186A2 (fr) 2011-10-13
EP2557908B1 (fr) 2018-07-18
EP2557908A4 (fr) 2014-04-30

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Date Code Title Description
AS Assignment

Owner name: HUAWEI TECHNOLOGIES CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, HUI;FENG, TAQING;REEL/FRAME:028220/0129

Effective date: 20120509

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION