US20120145374A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20120145374A1
US20120145374A1 US12/979,316 US97931610A US2012145374A1 US 20120145374 A1 US20120145374 A1 US 20120145374A1 US 97931610 A US97931610 A US 97931610A US 2012145374 A1 US2012145374 A1 US 2012145374A1
Authority
US
United States
Prior art keywords
base plate
heat sink
fins
protruding member
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/979,316
Other languages
English (en)
Inventor
Chun-Chi Chen
Jian Liu
Jing Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, LIU, JIAN, ZHANG, JING
Publication of US20120145374A1 publication Critical patent/US20120145374A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure generally relates to device cooling, and more particularly to a heat sink including a base plate and a fin unit interferingly fitted together.
  • Heat sinks are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others. Thereby, heat sinks keep electronic components within safe operating limits, and enable the electronic components to operate stably.
  • a typical heat sink comprises a base contacting an electronic component and absorbing heat therefrom, and a plurality of parallel planar fins attached to the base by soldering. The fins dissipate the heat to the ambient environment.
  • soldering flux needs to be added between the fins and the base when the fins are assembled to the base.
  • a prior process of nickel-plating may be required before the fins and the base are soldered together. Such process materials and manufacturing procedures make the assembly of the fins and the base somewhat costly and complicated.
  • Another common kind of heat sink is the one-piece heat sink made of forged aluminum.
  • the one-piece heat sink typically does not attain a very high heat dissipating effect.
  • a short pitch between adjacent heat dissipating fins is desired, because a higher fin density provides a higher overall heat dissipating surface.
  • the desired level of fin density normally cannot be achieved economically.
  • FIG. 1 is an isometric, assembled view of a heat sink according to a first exemplary embodiment of the present disclosure.
  • FIG. 2 is an isometric, exploded view of the heat sink of FIG. 1 .
  • FIG. 3 is an isometric, exploded view of the heat sink of FIG. 1 , shown from a different aspect.
  • FIG. 4 is an isometric, assembled view of a heat sink according to a second exemplary embodiment of the present disclosure.
  • FIG. 5 is an isometric, exploded view of the heat sink of FIG. 4 .
  • FIG. 6 is an isometric, exploded view of the heat sink of FIG. 3 , shown from a different aspect.
  • a heat sink 10 according to a first exemplary embodiment of the present disclosure includes a base plate 12 and a fin unit 14 arranged on the base plate 12 .
  • the base plate 12 is rectangular, and includes a planar bottom surface 120 and a top surface 122 .
  • the bottom surface 120 is configured to contact a heat-generating component to absorb heat generated therefrom.
  • a swallowtail-shaped protruding member 124 extends upwardly from a middle portion of the top surface 122 .
  • the protruding member 124 is made by an extrusion process, and has a substantially trapezoidal cross section.
  • the protruding member 124 includes a rectangular top face 125 spaced from and parallel to the top surface 122 of the base plate 12 , and two lateral faces 127 obliquely depending from two long sides of the top face 125 to connect the top surface 122 of the base plate 12 .
  • An arced chamfer 128 is formed between each of the lateral faces 127 and a corresponding long side of the top face 125 .
  • the protruding member 124 has a length equal to the base plate 12 , and a width increasing gradually from the top surface 122 of the base plate 12 to the top face 125 .
  • the fin unit 14 includes a plurality of fins 141 arranged on the top surface 122 of the base plate 12 .
  • Each of the fins 141 is a substantially rectangular thin metallic plate.
  • the fins 141 are parallel to each other.
  • Each of the fins 141 includes a substantially rectangular main body 140 , and a flange 142 extending from an upper edge of the main body 140 .
  • a cutout 144 corresponding to the protruding member 124 is defined in a middle of a lower end of the main body 140 . Referring also to FIG. 3 , the cutout 144 is formed by extrusion tapping, such that a hem 145 extending along a periphery of the cutout 144 is accordingly formed.
  • a main central portion of the hem 145 is parallel to the flange 142 , and a length of the main central portion of the hem 145 is less than, but similar to, a length of the flange 142 .
  • the cutout 144 has a shape which is the same as the shape of the cross section of the protruding member 124 .
  • a size of the cutout 144 is substantially the same as a size of the cross section of the protruding member 124 .
  • the fins 141 are individually installed onto the base plate 12 .
  • Each fin 141 is firstly placed at one side of the base plate 12 , with the cutout 144 aligned with the protruding member 124 .
  • the fin 141 is horizontally mounted onto the base plate 12 with the protruding member 124 being received in the cutout 144 .
  • the protruding member 124 interferingly fits in the cutout 144 .
  • the hem 145 abuts the top face 125 and lateral faces 127 of the protruding member 124 , to provide a large contact interface between the fin 141 and the base plate 12 .
  • Each of the fins 141 is horizontally moveable along the protruding member 124 , such that positions of the fins 141 on the base plate 12 can be adjusted as needed during assembly.
  • the flanges 142 of each two neighboring fins 141 contact each other, to cooperatively form a planar top surface 146 at an upper side of the fin unit 14 .
  • the hems 145 of the each two neighboring fins 141 contact each other to cooperatively define a groove 147 at a lower end of the fin unit 14 .
  • the groove 147 matches the protruding member 124 .
  • soldering flux and nickel plating are not required during assembly of the fins 141 and the base plate 12 . This greatly reduces a manufacturing cost of the heat sink 10 , and allows assembly of the fins 141 and the base plate 12 to be simple and convenient.
  • FIGS. 4 and 5 show a heat sink 10 a according to a second exemplary embodiment of the present disclosure.
  • the heat sink 10 a differs from the heat sink 10 of the first embodiment only in that a protruding member 124 a is formed at a lower end of a fin unit 14 a, and a groove 144 a is defined at a top surface 122 a of a base plate 12 a.
  • the groove 144 a has the same shape as that of the protruding member 144 of the first embodiment.
  • the fin unit 14 a includes a plurality of fins 141 a arranged on the top surface 122 a of the base plate 12 a. Referring also to FIG.
  • each of the fins 141 a includes a protrusion 126 a depending from a lower edge of the main body 140 , and a hem 127 a extending along a periphery of the protrusion 126 a and being oriented perpendicular to the main body 140 .
  • the protrusion 126 a has the same shape as that of the cutout 144 of the first embodiment.
  • the protrusion 126 a has the same shape as a cross section defined by the groove 144 a of the base plate 12 a, and has substantially the same size as the cross section of the groove 144 a.
  • a main central portion of the hem 127 a is parallel to a flange 142 of the fin 141 a, and a length of the main central portion of the hem 127 a is less than, but similar to, a length of the flange 142 .
  • the fins 141 a are individually assembled onto the base plate 12 a one by one.
  • Each fin 141 a is firstly placed at one side of the base plate 12 a with the protrusion 126 a aligned with the groove 144 a.
  • the fin 141 a is horizontally mounted onto the base plate 12 a, with the protrusion 126 a being received in the groove 144 a.
  • the protrusion 126 a interferingly fits in the groove 144 a.
  • the hem 127 a abuts an inner surface of the base plate 12 a in the groove 144 a.
  • the hems 127 a of each two neighboring fins 141 a contact each other to cooperatively form an outer surface of the protruding member 124 a.
  • the protrusions 126 a cooperatively form the protruding member 124 a at the lower end of the fin unit 14 a.
  • the protruding member 124 a matches the groove 144 a of the base plate 12 a.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/979,316 2010-12-10 2010-12-27 Heat sink Abandoned US20120145374A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010583423.2A CN102543912B (zh) 2010-12-10 2010-12-10 散热器及其制造方法
CN201010583423.2 2010-12-10

Publications (1)

Publication Number Publication Date
US20120145374A1 true US20120145374A1 (en) 2012-06-14

Family

ID=46198137

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/979,316 Abandoned US20120145374A1 (en) 2010-12-10 2010-12-27 Heat sink

Country Status (2)

Country Link
US (1) US20120145374A1 (zh)
CN (1) CN102543912B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130255929A1 (en) * 2012-04-03 2013-10-03 Foxconn Technology Co., Ltd. Heat dissipation device
US11262140B2 (en) * 2018-09-30 2022-03-01 Tyco Electronics (Shanghai) Co. Ltd. Heat sink and housing assembly
US11988468B2 (en) * 2018-09-30 2024-05-21 Tyco Electronics (Shanghai) Co., Ltd. Heat sink and housing assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104661488B (zh) * 2013-11-21 2018-03-09 奇鋐科技股份有限公司 散热模块的制造方法
CN105283033A (zh) * 2014-07-21 2016-01-27 奇鋐科技股份有限公司 散热模块的制造方法
CN105720022B (zh) * 2014-12-04 2019-06-14 国家电网公司 一种特高压直流晶闸管均压回路的散热装置
CN109644554A (zh) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 电路板以及超算设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070169918A1 (en) * 2006-01-20 2007-07-26 Hua-Shou Kuo Combination cooler module
US20090084529A1 (en) * 2007-09-30 2009-04-02 Tsung-Hsien Huang Cooler module
US20090242168A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070169918A1 (en) * 2006-01-20 2007-07-26 Hua-Shou Kuo Combination cooler module
US20090084529A1 (en) * 2007-09-30 2009-04-02 Tsung-Hsien Huang Cooler module
US20090242168A1 (en) * 2008-03-27 2009-10-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130255929A1 (en) * 2012-04-03 2013-10-03 Foxconn Technology Co., Ltd. Heat dissipation device
US11262140B2 (en) * 2018-09-30 2022-03-01 Tyco Electronics (Shanghai) Co. Ltd. Heat sink and housing assembly
US11988468B2 (en) * 2018-09-30 2024-05-21 Tyco Electronics (Shanghai) Co., Ltd. Heat sink and housing assembly

Also Published As

Publication number Publication date
CN102543912A (zh) 2012-07-04
CN102543912B (zh) 2015-10-21

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHUN-CHI;LIU, JIAN;ZHANG, JING;REEL/FRAME:025540/0554

Effective date: 20101224

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHUN-CHI;LIU, JIAN;ZHANG, JING;REEL/FRAME:025540/0554

Effective date: 20101224

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION