US20120104947A1 - Compact fluorescent lamp and led light source with electronic components in base - Google Patents
Compact fluorescent lamp and led light source with electronic components in base Download PDFInfo
- Publication number
- US20120104947A1 US20120104947A1 US12/914,116 US91411610A US2012104947A1 US 20120104947 A1 US20120104947 A1 US 20120104947A1 US 91411610 A US91411610 A US 91411610A US 2012104947 A1 US2012104947 A1 US 2012104947A1
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- United States
- Prior art keywords
- light source
- base structure
- circuit board
- base
- interior
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Definitions
- FIG. 16 shows a conventional light bulb 50 with an Edison base 20 having a conductive metal structure 24 with an upper portion of generally cylindrical shape that tapers to a bottom portion having a contact tip 22 and an insulative intermediate structure 26 .
- a Tungsten filament (not shown) is mounted within a glass bulb 52 that is attached to the Edison base 20 , with first and second wires (not shown) connected from the filament to the threaded structure 24 and to the tip contact 22 , respectively.
- the bulb assembly 50 is screwed into a corresponding socket of a light fixture (not shown) in which the contact 22 is electrically connected with a first power line and the threaded conductor 24 engages with conductive mating threads for electrical connection to a second power line.
- the socket provides AC current to the filament through these connections to cause light emission from the filament.
- Other popular lamp base styles include bayonet bases with two lug contacts extending outwardly from the cylindrical base structure for push and twist connection to a socket with corresponding L-shaped slots, as well as bases having two pin or lug type contacts extending from the bottom of the base or cap.
- Each lamp base or cap type typically comes in a variety of sizes and are commonly designated by a diameter dimension such as 27 mm Edison types (E27), 22 mm Bayonet types (B22), etc.
- FIG. 16 shows a CFL 10 with a fluorescent lamp structure 14 mounted to an Edison base 20 via an intermediate housing 12 which includes power conversion circuitry, such as a rectifier, DC-DC converter, and an inverter to provide high frequency AC power to the lamp 14 .
- power conversion circuitry such as a rectifier, DC-DC converter, and an inverter to provide high frequency AC power to the lamp 14 .
- Replacement of incandescent light bulbs 50 with CFLs or LED light sources in existing fixtures can reduce electrical energy consumption, where the provision of an Edison base 20 in such replacement CFLs 10 allows simple changeout of incandescent bulbs 50 with a CFL 10 without having to install a different fixture socket.
- FIG. 16 shows a typical height difference 16 , with the CFL device 10 being approximately 20% taller than the incandescent bulb 10 . This physical size difference creates compatibility issues with the type and size of fixtures where CFLs and other replacement light sources can be used.
- a light source having one or more light emitting elements, such as LEDs, HID lamps, compact fluorescent lamps, halogen lamps, etc., as well as a base assembly such as an Edison base, bayonet base, or other known lamp base or cap type with a base structure and a ballast or driver.
- the base structure has a generally cylindrical first portion with first and second contacts, such as an Edison type with a threaded outer surface forming a first electrically conductive contact to engage a threaded socket, as well as a second electrically conductive contact separated from the first contact by an insulator.
- the ballast or driver includes a circuit board assembly located wholly or partially within the base structure interior, which has multiple layers with one or more embedded electrical components such as resistors, capacitors, and/or inductors formed between adjacent layers.
- the board assembly is located entirely within the base interior, and the board in certain implementations has a circular outer surface extending to or near the inner surface of the threaded first portion of the base. In other embodiments, the board may extend into the lower tapered portion of the base.
- potting material is formed around at least a portion of the circuit board assembly in the interior of the base structure.
- a mirror is provided in certain embodiments between the light emitting element and the ballast or driver, which includes a reflective surface facing the light emitting element.
- the circuit board assembly includes a thermally conductive core layer to conduct heat toward the inner surface of the first portion of the base structure.
- the board includes thermal via structures extending through one or more board layers to the core layer in order to conduct heat toward the core layer.
- one or more application specific integrated circuits are mounted to an outer layer of the circuit board assembly.
- pot core magnetic components are used in the ballast or driver circuits, and are located at least partially within the Edison based interior.
- the ballast or driver includes a flex board formed into a cylinder shape with an outer surface at or near the inner surface of the first portion of the base structure.
- the flex board in certain embodiments extends through substantially 360 degrees, and in other embodiments a partial cylinder is formed with the flex board extending to an angle less than 360 degrees and more than 180 degrees.
- FIG. 1A is a partial sectional side elevation view illustrating an exemplary compact fluorescent lamp (CFL) including a ballast circuit board located inside an Edison base structure and including embedded electrical components in accordance with one or more aspects of the present disclosure;
- CFL compact fluorescent lamp
- FIG. 1B is a partial sectional side elevation view illustrating an exemplary LED-type light source having a driver circuit board with embedded components inside an Edison base structure;
- FIG. 2A is a partial fragmentary side elevation view in section illustrating exemplary portions of a ballast or driver circuit board assembly in the light sources of FIGS. 1A and 1B including multiple layers with resistors, capacitors, and inductor circuit components formed between layers in a multi-layer board assembly structure;
- FIG. 2B is a schematic diagram illustrating circuitry of an exemplary ballast or LED driver in the light sources of FIGS. 1A and 1B ;
- FIG. 3 is a partial side elevation view in section illustrating another exemplary light source with an Edison base having a mirror to reduce thermal effects of the light emitting lamp or LED on the ballast or driver circuitry;
- FIG. 4 is a partial side elevation view in section illustrating another exemplary light source with the interior of the Edison base substantially filled with potting material around the ballast or driver circuit board assembly;
- FIG. 5 is a partial side elevation view in section illustrating still another exemplary light source with the interior of the Edison base partially filled with potting material and with a mirror above the circuit board assembly;
- FIG. 6 is a partial side elevation view in section illustrating another exemplary light source including pot core magnetic components situated above and below the ballast or driver circuit board inside the Edison base;
- FIG. 7 is a partial side elevation view in section illustrating yet another exemplary light source including a pot core magnetic component below the circuit board assembly and a mirror above the circuit board assembly and potting material inside the Edison base;
- FIG. 8 is a partial side elevation view in section illustrating another exemplary light source with a pot core magnetic component below the circuit board assembly and with one or more ASICs on the top circuit board layer as well as potting material in the Edison base;
- FIG. 9 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board formed around all or a portion of the an inner Edison base surface with a pot core magnetic component in the center:
- FIG. 10 is a partial top plan view in section taken along line 10 - 10 in FIG. 9 showing an embodiment in which the flex board extends through approximately 360 degrees near the inner wall of the Edison base;
- FIG. 11 is a partial top plan view in section taken along line 11 - 11 in FIG. 9 showing another embodiment with a partially cylinder-shaped flex board extending through an angle ⁇ of less than 360 degrees near the inner wall of the Edison base;
- FIG. 12 is a partial top plan view in section taken along line 11 - 11 in FIG. 9 showing another embodiment with a U-shaped flex board extending at least partially near the inner wall of the Edison base;
- FIG. 13 is a partial top plan view in section taken along line 11 - 11 in FIG. 9 showing another embodiment with a V-shaped flex board extending at least partially near the inner wall of the Edison base;
- FIG. 14 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board with a pot core magnetic component and potting material in the Edison base interior;
- FIG. 15 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board with a pot core magnetic component, potting material, and an upwardly facing mirror in the interior of an Edison base; and
- FIG. 16 is a side elevation view illustrating conventional CFL and incandescent bulbs.
- driver and/or ballast circuitry completely or partially into a base of a light source to facilitate the use of CFL, LEDs, halogen and other lighting technology for energy consumption reduction through replacement of existing incandescent light bulbs without fixture modification.
- incorporation of driver/ballast components in a base has been hindered by thermal and packaging issues that impact product lifetime, performance, and reliability.
- lamp ballast or LED driver circuitry is completely or partially located inside an Edison base assembly 120 using integrated boards 200 with components 211 embedded between board layers 212 ( FIGS. 1A-8 ) and/or circular flex boards 200 f ( FIGS. 9-15 ) with pot core magnetic components 500 ( FIGS. 6-15 ) and/or ASICs 220 ( FIGS. 1A-5 and 8 - 15 ) and thermally conductive board core materials 210 with thermal vias ( FIG.
- the disclosure employs integrated boards having embedded capacitors, resistors, and/or inductors 211 integrated in one or more multilayer board assemblies 200 .
- Directly embedding such components 211 C, 211 R, 211 L into the circuit board 200 reduces thermal resistance between key components.
- the board assemblies 200 may be round with surface mount technology (SMT) components on one or both outer (top or bottom) layers 212 t , 212 b ( FIG. 2A ), respectively.
- SMT surface mount technology
- power magnetic and/or EMI inductors of input filter stages, DC-DC converter circuits, and/or inverter circuits can be implemented as pot core magnetic components with a cylindrical package that can be fully inserted in the Edison base 120 .
- the board itself can be made with a thermally conductive core layer 210 ( FIG. 2A ) for improved heat transfer to the screw base 124 with thermal vias TV ( FIG. 2A ) in the board 200 .
- FIGS. 1A and 1B respectively illustrate exemplary compact fluorescent lamp (CFL) and light emitting diode (LED) type light sources 110 in which a light emitting element such as a lamp 114 or LED 602 (or arrays thereof) is supported for illumination with all or a portion of the ballast or driver components and circuitry located in an Edison base assembly 120 .
- a regular incandescent (e.g., A 21 ) lamp e.g., A 21
- the base assembly 120 includes a base structure 124 defining an interior 124 i , with a generally cylindrical first portion 124 a having a threaded outer surface 124 t forming a first electrically conductive contact to engage a threaded socket (socket not shown).
- a second tapered portion 124 b extends down and inward from the cylindrical portion 124 a to an insulator ring structure 126 that surrounds a second electrically conductive contact 122 .
- the devices 110 in FIGS. 1A and 1B include a ballast 130 ( FIG. 1A for CFL 114 ) or a driver 130 (for powering the array of LEDs 602 in FIG. 1B ).
- the ballast or driver 130 selectively converts power received from the threaded socket to provide power to the at least one light emitting element 114 , 602 .
- the ballast/driver 130 includes at least one circuit board assembly 200 located at least partially within the interior 124 i of the base structure 124 .
- the board 200 includes multiple layers 210 , 211 with a top layer 212 t , one or more intermediate layers 212 , a bottom layer 212 b , and a core layer 210 may of a thermally conductive material, such as FR4 to conduct heat laterally outward toward the inner surface of the first portion 124 a of the base structure 124 .
- the board assembly 200 also includes one or more embedded electrical components 211 formed between adjacent layers 210 , 211 of the circuit board assembly 200 . As seen in FIG.
- the embedded components 211 can be one or more of embedded resistors 211 R, embedded capacitors 211 C, and/or embedded inductors 211 L.
- the board assembly 200 includes one or more conductive routing features within a given layer or layer boundary, such as metal (e.g., copper, etc.) features, traces, etc., designated “M” in FIG. 2A .
- the board layers 210 , 212 are otherwise generally electrically insulative, with one or more electrically conductive (e.g., metal) vias V extending through certain layers. As seen in FIG.
- the upper and/or lower layers 212 t , 212 b may include metallic or other conductive contacts for interfacing to surface mount components 214 and/or to ASICs 220 .
- passive ASIC s 220 may be provided for transformers, inductors, capacitors or combinations thereof in the ballast/driver circuitry 130 .
- one or more active ASICs 220 may be used, where the use of such active and/or passive ASICs 220 can advantageously decrease the package size of the ballast/driver 130 .
- the illustrated circuit board assembly 200 moreover, includes thermal via structures TV extending through at least one of the layers 212 to the core layer 210 to conduct heat toward the core layer 210 .
- the circuit board assembly 200 is round to maximize the top and bottom board surface area for thermal efficiency, and includes a circular outer surface proximate or touching an inner surface of the first portion 124 a of the base structure 124 . This advantageously facilitates transfer of heat from the board 200 to the Edison base 124 .
- potting materials 400 FIGS.
- more than one board laterally extending assembly 200 may be provided at any suitable depth (e.g., vertical location) wholly or partially within the interior of the Edison base assembly 120 , which may be within the first and/or second portions 124 a , 124 b , and/or which may extend above the first portion 124 a (e.g., FIG. 1A ). It is noted that embodiments that incorporate the ballast/driver 130 within the Edison base facilitate reduction in the finished product height and thereby make the light source more amenable to replacement of a larger number of incandescent bulbs.
- An embedded resistor 211 R in one embodiment is constructed as a laser trimmed conductive (e.g., metal) feature with a feature width trimmed in a controlled fashion to implement a desired resistance value (and current carrying capacity).
- An embedded capacitor 211 C (two examples shown in FIG. 2A ) is constructed by forming a conductive structure (e.g., lower or first plate) structure (including material deposition, masking, etching, etc.), over which is formed a dielectric material D.
- the dielectric D is then patterned, and an upper or second capacitor plate is formed by deposition and patterning of another conductive material (e.g., metal) above the upper surface of the dielectric D, with metal traces M and/or vias V connecting electrically to the capacitor plates according to the circuit design of the ballast/driver 130 . As further shown in FIG.
- an embedded inductor 211 L in one example is created by forming (e.g., deposition and lithographic patterning) a ferrous core material F on or in one of the interior layers 212 , with traces being formed in a single layer as shown (or in multiple layers) to wholly or at least partially encircle the core F (thereby forming one or more winding turns or partial turns) to form an inductance, with suitable conductive connections (e.g., metal features M and/or vias V) to the winding(s) in one or more layers. While the exemplary inductor 211 L involves winding features formed laterally around the core F, other constructions are possible with metal features M combined with vias V forming vertically encircling windings “wound” around a formed core feature F.
- an exemplary ballast or driver circuit 200 including a power conversion system 250 coupled with the power connections established by the threaded cap and the tip contact of the base 120 , as well as a power conversion controller 260 .
- the device 200 in certain embodiments is a ballast with the power conversion system 250 having a rectifier 254 receiving AC input power through an optional EMI filter 252 and providing an initial DC output to a power factor correcting (PFC) DC to DC converter 256 .
- the converter 256 provides a DC output to an inverter 258 , which converts the DC to provide AC output power to one or more lamps 250 , such as fluorescent or HID lamp devices or halogen lamps.
- the apparatus 200 is an LED driver and the power conversion system 250 need not include the inverter 258 .
- the DC to DC converter 256 provides DC output power to drive one or more LED arrays 250 .
- a controller 260 is provided to regulate the output power by controlling one or both of the DC to DC converter 256 and/or the inverter 258 .
- the connection of the ballast/driver circuitry between multiple boards 200 between the board(s) 200 and the light emitting element(s) 114 , 602 and between the board(s) 200 and the electrical power contacts of the Edison base can be made by any suitable technique and devices, including without limitation edge connectors, board mounted connectors, wires, etc.
- FIG. 3 shows another possible embodiment in which a mirror 300 is located between the light emitting element 114 , 602 and the ballast or driver 130 .
- the mirror 300 includes a reflective surface at least partially facing upward toward the light emitting element 114 , 602 .
- the mirror 300 in certain embodiments can be mounted on the upper layer 212 t of the board assembly 200 .
- the Edison base assembly 120 includes potting material 400 formed around at least a portion of the circuit board assembly 200 in the interior 124 i of the base structure 124 .
- the example of FIG. 4 has the interior 124 i of the Edison base 124 substantially tilled with potting material around the ballast or driver circuit board assembly 200 .
- the example in FIG. 5 has an upwardly facing mirror 300 mounted to the top of the circuit board assembly 200 and provides potting material 400 partially filling the Edison base interior 124 i below the level of the mirror 300 .
- the ballast or driver 130 in certain embodiments includes one or more pot core magnetic components 500 located in whole or in part within the interior 124 i of the base structure 124 .
- Suitable pot core magnetic components can include without limitation inductors, chokes, transformers or other components of the EMI filter circuit 252 , the DC/DC converter circuit 256 , and/or the inverter 258 of FIG. 2B , which are fabricated with windings would around cores such as VITROPERM 500F Fe-based nanocrystalline soft magnetic high tech material available from VAC Magnetics of Elizabethtown, Ky. or P11/7/I type cores available from Ferroxcube International Holding B.V., Roermond, the Netherlands.
- VITROPERM 500F Fe-based nanocrystalline soft magnetic high tech material available from VAC Magnetics of Elizabethtown, Ky.
- P11/7/I type cores available from Ferroxcube International Holding B.V., Roermond, the Netherlands.
- one such pot core inductor 500 a is situated above the board assembly 200 , and may be mounted to the top layer 212 t thereof in certain embodiments.
- This may be, for example, a filter inductor of the EMI filter stage 252 in FIG. 252 , or may be a power inductor of the DC-DC converter 256 or the inverter 258 in certain embodiments.
- a second pot core magnetic component 500 b is located below the board assembly 200 , and may (but need not) be mounted to the lower layer 212 b of the board 200 .
- FIG. 7 shows another embodiment including a pot core magnetic component 500 b below the circuit board assembly 200 and a mirror 300 above the circuit board 200 .
- potting material 400 is formed inside the Edison base 120 to just below the level of the mirror 300 .
- FIG. 8 Another embodiment in FIG. 8 provides a pot core magnetic component 500 b below the circuit board 200 with one or more ASICs 220 on the top circuit board layer 212 t , along with potting material 400 in the Edison base interior 124 i.
- the ballast or driver 130 in certain embodiments includes a flex board 200 f formed into a full or partial cylinder shape with an outer surface engaging or near the inner surface of the first portion 124 a of the base structure 124 .
- flexible boards situated around all or portions of the Edison base inner wall(s) can be used with the SMT components 214 and/or ASICs 220 on the exterior side, for thermal transfer toward the base structure 124 and to optimize the usage of the interior 1241 , allowing pot cored or other magnetic components mounted inside the cylinder.
- a pot cored component 500 may be a cylindrical shape itself, and is located within the cylinder/partial cylinder flex board 200 f .
- the flex board 200 f may extend to form a substantially complete cylinder.
- the flex board may extend through an angle ⁇ of less than 360 degrees.
- the flex board 200 f is formed in a partial cylindrical shape with the outer surface of the flex board 200 f proximate the inner surface of the first portion 124 a of the base structure 124 through an angle ⁇ that is less than 360 degrees and more than 180 degrees.
- the ballast/driver board assembly 200 may include flex board(s) 200 f as well as non-flex boards 200 .
- a flex board 200 f is shaped to include one or more planar (flat or straight) portions and/or one or more curvilinear portions.
- Such flex board(s) can be populated with SMT components 214 and/or ASICs 220 on one or both sides, and can be combined with rigid boards 200 , mirror structures 300 , potting materials 400 , and/or one or more pot-cored components 500 .
- FIG. 12 illustrates another embodiment in which a generally U-shaped flex board 200 f extends at least partially near the inner surface of the first portion 124 a of the base structure 124 , with two pot-core components 500 disposed between flat portions of the board 200 f ; where the board 200 f includes components 214 on both inner and outer sides and an ASIC 220 on one outer side (in a flat portion) of the U-shape.
- FIG. 13 Yet another embodiment is shown in FIG. 13 using a V-shaped flex board 200 f with a bend portion extending near the inner surface or inner wall of the first portion 1214 a in an Edison base, where each of two flat portions include components 214 and ASICs 220 .
- FIG. 14 shows another example in which a cylindrical flex board 200 f is used with a pot core magnetic component 500 in the center and potting material 400 substantially filling the Edison base interior 124 i.
- FIG. 15 Yet another exemplary embodiment is shown in FIG. 15 , in which a cylindrical flex board 200 f is provided with a centrally located pot core magnetic component 500 , along with partially filling potting material 400 and an upwardly facing mirror 300 in the interior 124 i of the Edison base 120 .
- the disclosure thus provides solutions to the challenge of packaging of electronics in the Edison base 120 , and can be advantageously employed in low wattage devices, for example light sources rated for about 30 watts or less.
- the techniques can be employed to facilitate electronic component cooling through optimized use of circuit board volume through thermal vias and conductive core layers 210 , as well as by directly embedding devices into the circuit board laminate.
- the mirror techniques 300 can reduce the impact of the hot light source 114 , 602 on the electronics by incorporating a hot mirror reflector directly on the unpopulated surface of the PCBA (SMT devices are embedded).
- the disclosure also provides advantages for mounting components in an Edison screw base for very high wattage lighting products, where the integrated combination of two or more of these techniques facilitate heat transfer out through the Edison base itself.
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Abstract
Description
- Many conventional incandescent light bulbs utilize a so-called Edison base or cap.
FIG. 16 shows aconventional light bulb 50 with an Edisonbase 20 having aconductive metal structure 24 with an upper portion of generally cylindrical shape that tapers to a bottom portion having acontact tip 22 and an insulativeintermediate structure 26. A Tungsten filament (not shown) is mounted within aglass bulb 52 that is attached to the Edisonbase 20, with first and second wires (not shown) connected from the filament to the threadedstructure 24 and to thetip contact 22, respectively. In use, thebulb assembly 50 is screwed into a corresponding socket of a light fixture (not shown) in which thecontact 22 is electrically connected with a first power line and the threadedconductor 24 engages with conductive mating threads for electrical connection to a second power line. The socket provides AC current to the filament through these connections to cause light emission from the filament. Other popular lamp base styles include bayonet bases with two lug contacts extending outwardly from the cylindrical base structure for push and twist connection to a socket with corresponding L-shaped slots, as well as bases having two pin or lug type contacts extending from the bottom of the base or cap. Each lamp base or cap type typically comes in a variety of sizes and are commonly designated by a diameter dimension such as 27 mm Edison types (E27), 22 mm Bayonet types (B22), etc. - In recent years, the inefficiencies of conventional
incandescent bulbs 50 has lead to development of compact fluorescent lamps (CFLs), halogen lamps, LED array lighting devices, and other more efficient forms of light sources.FIG. 16 shows aCFL 10 with afluorescent lamp structure 14 mounted to an Edisonbase 20 via anintermediate housing 12 which includes power conversion circuitry, such as a rectifier, DC-DC converter, and an inverter to provide high frequency AC power to thelamp 14. Replacement ofincandescent light bulbs 50 with CFLs or LED light sources in existing fixtures can reduce electrical energy consumption, where the provision of an Edisonbase 20 insuch replacement CFLs 10 allows simple changeout ofincandescent bulbs 50 with aCFL 10 without having to install a different fixture socket. However, thereplacement CFL 10 is typically taller than thebulb 50 it is replacing. For example,FIG. 16 shows atypical height difference 16, with theCFL device 10 being approximately 20% taller than theincandescent bulb 10. This physical size difference creates compatibility issues with the type and size of fixtures where CFLs and other replacement light sources can be used. - A light source is provided having one or more light emitting elements, such as LEDs, HID lamps, compact fluorescent lamps, halogen lamps, etc., as well as a base assembly such as an Edison base, bayonet base, or other known lamp base or cap type with a base structure and a ballast or driver. The base structure has a generally cylindrical first portion with first and second contacts, such as an Edison type with a threaded outer surface forming a first electrically conductive contact to engage a threaded socket, as well as a second electrically conductive contact separated from the first contact by an insulator. The ballast or driver includes a circuit board assembly located wholly or partially within the base structure interior, which has multiple layers with one or more embedded electrical components such as resistors, capacitors, and/or inductors formed between adjacent layers.
- In certain embodiments, the board assembly is located entirely within the base interior, and the board in certain implementations has a circular outer surface extending to or near the inner surface of the threaded first portion of the base. In other embodiments, the board may extend into the lower tapered portion of the base.
- In certain embodiments, potting material is formed around at least a portion of the circuit board assembly in the interior of the base structure.
- A mirror is provided in certain embodiments between the light emitting element and the ballast or driver, which includes a reflective surface facing the light emitting element.
- In certain embodiments, the circuit board assembly includes a thermally conductive core layer to conduct heat toward the inner surface of the first portion of the base structure. In some embodiments, the board includes thermal via structures extending through one or more board layers to the core layer in order to conduct heat toward the core layer.
- In certain embodiments, one or more application specific integrated circuits (ASICs) are mounted to an outer layer of the circuit board assembly.
- In certain embodiments, moreover, pot core magnetic components are used in the ballast or driver circuits, and are located at least partially within the Edison based interior.
- In certain embodiments, the ballast or driver includes a flex board formed into a cylinder shape with an outer surface at or near the inner surface of the first portion of the base structure. The flex board in certain embodiments extends through substantially 360 degrees, and in other embodiments a partial cylinder is formed with the flex board extending to an angle less than 360 degrees and more than 180 degrees.
- One or more exemplary embodiments are set forth in the following detailed description and the drawings, in which:
-
FIG. 1A is a partial sectional side elevation view illustrating an exemplary compact fluorescent lamp (CFL) including a ballast circuit board located inside an Edison base structure and including embedded electrical components in accordance with one or more aspects of the present disclosure; -
FIG. 1B is a partial sectional side elevation view illustrating an exemplary LED-type light source having a driver circuit board with embedded components inside an Edison base structure; -
FIG. 2A is a partial fragmentary side elevation view in section illustrating exemplary portions of a ballast or driver circuit board assembly in the light sources ofFIGS. 1A and 1B including multiple layers with resistors, capacitors, and inductor circuit components formed between layers in a multi-layer board assembly structure; -
FIG. 2B is a schematic diagram illustrating circuitry of an exemplary ballast or LED driver in the light sources ofFIGS. 1A and 1B ; -
FIG. 3 is a partial side elevation view in section illustrating another exemplary light source with an Edison base having a mirror to reduce thermal effects of the light emitting lamp or LED on the ballast or driver circuitry; -
FIG. 4 is a partial side elevation view in section illustrating another exemplary light source with the interior of the Edison base substantially filled with potting material around the ballast or driver circuit board assembly; -
FIG. 5 is a partial side elevation view in section illustrating still another exemplary light source with the interior of the Edison base partially filled with potting material and with a mirror above the circuit board assembly; -
FIG. 6 is a partial side elevation view in section illustrating another exemplary light source including pot core magnetic components situated above and below the ballast or driver circuit board inside the Edison base; -
FIG. 7 is a partial side elevation view in section illustrating yet another exemplary light source including a pot core magnetic component below the circuit board assembly and a mirror above the circuit board assembly and potting material inside the Edison base; -
FIG. 8 is a partial side elevation view in section illustrating another exemplary light source with a pot core magnetic component below the circuit board assembly and with one or more ASICs on the top circuit board layer as well as potting material in the Edison base; -
FIG. 9 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board formed around all or a portion of the an inner Edison base surface with a pot core magnetic component in the center: -
FIG. 10 is a partial top plan view in section taken along line 10-10 inFIG. 9 showing an embodiment in which the flex board extends through approximately 360 degrees near the inner wall of the Edison base; -
FIG. 11 is a partial top plan view in section taken along line 11-11 inFIG. 9 showing another embodiment with a partially cylinder-shaped flex board extending through an angle θ of less than 360 degrees near the inner wall of the Edison base; -
FIG. 12 is a partial top plan view in section taken along line 11-11 inFIG. 9 showing another embodiment with a U-shaped flex board extending at least partially near the inner wall of the Edison base; -
FIG. 13 is a partial top plan view in section taken along line 11-11 inFIG. 9 showing another embodiment with a V-shaped flex board extending at least partially near the inner wall of the Edison base; -
FIG. 14 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board with a pot core magnetic component and potting material in the Edison base interior; -
FIG. 15 is partial side elevation view in section illustrating an exemplary light source including a cylindrical flex board with a pot core magnetic component, potting material, and an upwardly facing mirror in the interior of an Edison base; and -
FIG. 16 is a side elevation view illustrating conventional CFL and incandescent bulbs. - Referring now to the drawings, where like reference numerals are used to refer to like elements throughout, and wherein the various features are not necessarily drawn to scale, the present disclosure facilitates incorporation of driver and/or ballast circuitry completely or partially into a base of a light source to facilitate the use of CFL, LEDs, halogen and other lighting technology for energy consumption reduction through replacement of existing incandescent light bulbs without fixture modification. Thusfar, incorporation of driver/ballast components in a base has been hindered by thermal and packaging issues that impact product lifetime, performance, and reliability.
- The disclosure may be advantageously employed to reduce component temperature by increasing thermal transfer away from the electronics to mitigate the impact of the heat generated by the light source. Although illustrated and described below in the context of Edison base lamps, the disclosure is also applicable to other lamp base types and styles. As shown generally in
FIGS. 1A-15 , lamp ballast or LED driver circuitry is completely or partially located inside an Edisonbase assembly 120 using integratedboards 200 withcomponents 211 embedded between board layers 212 (FIGS. 1A-8 ) and/orcircular flex boards 200 f (FIGS. 9-15 ) with pot core magnetic components 500 (FIGS. 6-15 ) and/or ASICs 220 (FIGS. 1A-5 and 8-15) and thermally conductiveboard core materials 210 with thermal vias (FIG. 2A ), reflective mirrors 300 (FIGS. 3 , 5, 7, and 15), and/or potting materials 400 (FIGS. 4 , 5, 7, 8, 14, and 15) to conduct heat out through the Edisonbase 124 to facilitate reduced form factors for lamps and/or LED light sources. Alone or in combination, these techniques and features improve the capability to use hot light emitting devices without adversely impacting the reliability, lifetime, and performance of the associated driver/ballast circuits. These techniques, moreover, can be used in combination with or independent of other possible approaches such as heat spreading using the surface area of a circuit board assembly, attaching heat sinks to heat generating components, and the use of heat shields to separate hot and cold elements of a ballast or driver. - As exemplified in the illustrated embodiments, the disclosure employs integrated boards having embedded capacitors, resistors, and/or
inductors 211 integrated in one or moremultilayer board assemblies 200. Directly embeddingsuch components circuit board 200 reduces thermal resistance between key components. Theboard assemblies 200 may be round with surface mount technology (SMT) components on one or both outer (top or bottom) layers 212 t, 212 b (FIG. 2A ), respectively. In some embodiments, power magnetic and/or EMI inductors of input filter stages, DC-DC converter circuits, and/or inverter circuits can be implemented as pot core magnetic components with a cylindrical package that can be fully inserted in theEdison base 120. The board itself can be made with a thermally conductive core layer 210 (FIG. 2A ) for improved heat transfer to thescrew base 124 with thermal vias TV (FIG. 2A ) in theboard 200. - The disclosed techniques can be used in connection with CFLs, LEDs, Halogen lamps, and other light source types to facilitate replacement for improved energy efficiency while adapting the need for driver or ballast circuitry to size and/or shape restrictions associated with existing lighting fixtures having female threaded lamp sockets adapted for standard Edison base interfacing.
FIGS. 1A and 1B respectively illustrate exemplary compact fluorescent lamp (CFL) and light emitting diode (LED)type light sources 110 in which a light emitting element such as alamp 114 or LED 602 (or arrays thereof) is supported for illumination with all or a portion of the ballast or driver components and circuitry located in anEdison base assembly 120. As seen inFIG. 1A , the height of the disclosedCFL device 110 is roughly equivalent to that of a regular incandescent (e.g., A21) lamp. - The
base assembly 120 includes abase structure 124 defining an interior 124 i, with a generally cylindricalfirst portion 124 a having a threadedouter surface 124 t forming a first electrically conductive contact to engage a threaded socket (socket not shown). A second taperedportion 124 b extends down and inward from thecylindrical portion 124 a to aninsulator ring structure 126 that surrounds a second electricallyconductive contact 122. Thedevices 110 inFIGS. 1A and 1B include a ballast 130 (FIG. 1A for CFL 114) or a driver 130 (for powering the array ofLEDs 602 inFIG. 1B ). The ballast ordriver 130 selectively converts power received from the threaded socket to provide power to the at least onelight emitting element - Referring to
FIGS. 1A and 2A , the ballast/driver 130 includes at least onecircuit board assembly 200 located at least partially within the interior 124 i of thebase structure 124. Theboard 200 includesmultiple layers top layer 212 t, one or moreintermediate layers 212, abottom layer 212 b, and acore layer 210 may of a thermally conductive material, such as FR4 to conduct heat laterally outward toward the inner surface of thefirst portion 124 a of thebase structure 124. Theboard assembly 200 also includes one or more embeddedelectrical components 211 formed betweenadjacent layers circuit board assembly 200. As seen inFIG. 2A , the embeddedcomponents 211 can be one or more of embeddedresistors 211R, embeddedcapacitors 211C, and/or embeddedinductors 211L. In the illustrated example, theboard assembly 200 includes one or more conductive routing features within a given layer or layer boundary, such as metal (e.g., copper, etc.) features, traces, etc., designated “M” inFIG. 2A . The board layers 210, 212 are otherwise generally electrically insulative, with one or more electrically conductive (e.g., metal) vias V extending through certain layers. As seen inFIG. 2A , moreover, the upper and/orlower layers mount components 214 and/or to ASICs 220. For example, passive ASIC s 220 may be provided for transformers, inductors, capacitors or combinations thereof in the ballast/driver circuitry 130. In certain embodiments, moreover, one or moreactive ASICs 220 may be used, where the use of such active and/orpassive ASICs 220 can advantageously decrease the package size of the ballast/driver 130. - The illustrated
circuit board assembly 200, moreover, includes thermal via structures TV extending through at least one of thelayers 212 to thecore layer 210 to conduct heat toward thecore layer 210. In certain embodiments, such as those ofFIGS. 1A and 1B , thecircuit board assembly 200 is round to maximize the top and bottom board surface area for thermal efficiency, and includes a circular outer surface proximate or touching an inner surface of thefirst portion 124 a of thebase structure 124. This advantageously facilitates transfer of heat from theboard 200 to theEdison base 124. In certain embodiments, potting materials 400 (FIGS. 4 , 5, 7, 8, 14, and 15) are provided around all or portions of theboard 200, where thepotting material 400 can be thermally conductive to help conduct heat out through theEdison base 124. As seen inFIGS. 1A and 1B , moreover, more than one board laterally extendingassembly 200 may be provided at any suitable depth (e.g., vertical location) wholly or partially within the interior of theEdison base assembly 120, which may be within the first and/orsecond portions first portion 124 a (e.g.,FIG. 1A ). It is noted that embodiments that incorporate the ballast/driver 130 within the Edison base facilitate reduction in the finished product height and thereby make the light source more amenable to replacement of a larger number of incandescent bulbs. - An embedded
resistor 211R in one embodiment is constructed as a laser trimmed conductive (e.g., metal) feature with a feature width trimmed in a controlled fashion to implement a desired resistance value (and current carrying capacity). An embeddedcapacitor 211C (two examples shown inFIG. 2A ) is constructed by forming a conductive structure (e.g., lower or first plate) structure (including material deposition, masking, etching, etc.), over which is formed a dielectric material D. The dielectric D is then patterned, and an upper or second capacitor plate is formed by deposition and patterning of another conductive material (e.g., metal) above the upper surface of the dielectric D, with metal traces M and/or vias V connecting electrically to the capacitor plates according to the circuit design of the ballast/driver 130. As further shown inFIG. 2A , an embeddedinductor 211L in one example is created by forming (e.g., deposition and lithographic patterning) a ferrous core material F on or in one of theinterior layers 212, with traces being formed in a single layer as shown (or in multiple layers) to wholly or at least partially encircle the core F (thereby forming one or more winding turns or partial turns) to form an inductance, with suitable conductive connections (e.g., metal features M and/or vias V) to the winding(s) in one or more layers. While theexemplary inductor 211L involves winding features formed laterally around the core F, other constructions are possible with metal features M combined with vias V forming vertically encircling windings “wound” around a formed core feature F. - Referring also to
FIG. 2B , an exemplary ballast ordriver circuit 200 is shown including apower conversion system 250 coupled with the power connections established by the threaded cap and the tip contact of thebase 120, as well as apower conversion controller 260. Thedevice 200 in certain embodiments is a ballast with thepower conversion system 250 having arectifier 254 receiving AC input power through anoptional EMI filter 252 and providing an initial DC output to a power factor correcting (PFC) DC toDC converter 256. Theconverter 256 provides a DC output to aninverter 258, which converts the DC to provide AC output power to one ormore lamps 250, such as fluorescent or HID lamp devices or halogen lamps. In other embodiments, theapparatus 200 is an LED driver and thepower conversion system 250 need not include theinverter 258. In this case, the DC toDC converter 256 provides DC output power to drive one ormore LED arrays 250. In both situations, acontroller 260 is provided to regulate the output power by controlling one or both of the DC toDC converter 256 and/or theinverter 258. The connection of the ballast/driver circuitry betweenmultiple boards 200 between the board(s) 200 and the light emitting element(s) 114, 602 and between the board(s) 200 and the electrical power contacts of the Edison base can be made by any suitable technique and devices, including without limitation edge connectors, board mounted connectors, wires, etc. -
FIG. 3 shows another possible embodiment in which amirror 300 is located between the light emittingelement driver 130. Themirror 300 includes a reflective surface at least partially facing upward toward thelight emitting element mirror 300 in certain embodiments can be mounted on theupper layer 212 t of theboard assembly 200. - Referring also to
FIGS. 4 and 5 , in certain embodiments, the Edison base assembly 120) includespotting material 400 formed around at least a portion of thecircuit board assembly 200 in the interior 124 i of thebase structure 124. The example ofFIG. 4 has the interior 124 i of theEdison base 124 substantially tilled with potting material around the ballast or drivercircuit board assembly 200. The example inFIG. 5 has an upwardly facingmirror 300 mounted to the top of thecircuit board assembly 200 and providespotting material 400 partially filling theEdison base interior 124 i below the level of themirror 300. - As shown in
FIGS. 6-15 , the ballast ordriver 130 in certain embodiments includes one or more pot coremagnetic components 500 located in whole or in part within the interior 124 i of thebase structure 124. Suitable pot core magnetic components can include without limitation inductors, chokes, transformers or other components of theEMI filter circuit 252, the DC/DC converter circuit 256, and/or theinverter 258 ofFIG. 2B , which are fabricated with windings would around cores such as VITROPERM 500F Fe-based nanocrystalline soft magnetic high tech material available from VAC Magnetics of Elizabethtown, Ky. or P11/7/I type cores available from Ferroxcube International Holding B.V., Roermond, the Netherlands. In the example ofFIG. 6 , one suchpot core inductor 500 a is situated above theboard assembly 200, and may be mounted to thetop layer 212 t thereof in certain embodiments. This may be, for example, a filter inductor of theEMI filter stage 252 inFIG. 252 , or may be a power inductor of the DC-DC converter 256 or theinverter 258 in certain embodiments. In the example ofFIG. 6 , a second pot coremagnetic component 500 b is located below theboard assembly 200, and may (but need not) be mounted to thelower layer 212 b of theboard 200. -
FIG. 7 shows another embodiment including a pot coremagnetic component 500 b below thecircuit board assembly 200 and amirror 300 above thecircuit board 200. In this example, pottingmaterial 400 is formed inside theEdison base 120 to just below the level of themirror 300. - Another embodiment in
FIG. 8 provides a pot coremagnetic component 500 b below thecircuit board 200 with one ormore ASICs 220 on the topcircuit board layer 212 t, along withpotting material 400 in theEdison base interior 124 i. - Referring to
FIGS. 9-15 , the ballast ordriver 130 in certain embodiments includes aflex board 200 f formed into a full or partial cylinder shape with an outer surface engaging or near the inner surface of thefirst portion 124 a of thebase structure 124. In this regard, flexible boards situated around all or portions of the Edison base inner wall(s) can be used with theSMT components 214 and/or ASICs 220 on the exterior side, for thermal transfer toward thebase structure 124 and to optimize the usage of the interior 1241, allowing pot cored or other magnetic components mounted inside the cylinder. In the example ofFIGS. 9-11 , for instance, a pot coredcomponent 500 may be a cylindrical shape itself, and is located within the cylinder/partialcylinder flex board 200 f. As shown in the top view ofFIG. 10 , theflex board 200 f may extend to form a substantially complete cylinder. Alternatively, the flex board may extend through an angle θ of less than 360 degrees. In certain embodiments, as shown inFIG. 11 , theflex board 200 f is formed in a partial cylindrical shape with the outer surface of theflex board 200 f proximate the inner surface of thefirst portion 124 a of thebase structure 124 through an angle θ that is less than 360 degrees and more than 180 degrees. As further shown inFIG. 9 , the ballast/driver board assembly 200 may include flex board(s) 200 f as well asnon-flex boards 200. - Referring also to
FIGS. 12 and 13 , various single or multiple-flex board architectures can be used, in which aflex board 200 f is shaped to include one or more planar (flat or straight) portions and/or one or more curvilinear portions. Such flex board(s) can be populated withSMT components 214 and/or ASICs 220 on one or both sides, and can be combined withrigid boards 200,mirror structures 300,potting materials 400, and/or one or more pot-coredcomponents 500. -
FIG. 12 illustrates another embodiment in which a generallyU-shaped flex board 200 f extends at least partially near the inner surface of thefirst portion 124 a of thebase structure 124, with two pot-core components 500 disposed between flat portions of theboard 200 f; where theboard 200 f includescomponents 214 on both inner and outer sides and anASIC 220 on one outer side (in a flat portion) of the U-shape. - Yet another embodiment is shown in
FIG. 13 using a V-shapedflex board 200 f with a bend portion extending near the inner surface or inner wall of the first portion 1214 a in an Edison base, where each of two flat portions includecomponents 214 andASICs 220. -
FIG. 14 shows another example in which acylindrical flex board 200 f is used with a pot coremagnetic component 500 in the center andpotting material 400 substantially filling theEdison base interior 124 i. - Yet another exemplary embodiment is shown in
FIG. 15 , in which acylindrical flex board 200 f is provided with a centrally located pot coremagnetic component 500, along with partially fillingpotting material 400 and an upwardly facingmirror 300 in the interior 124 i of theEdison base 120. - The disclosure thus provides solutions to the challenge of packaging of electronics in the
Edison base 120, and can be advantageously employed in low wattage devices, for example light sources rated for about 30 watts or less. The techniques can be employed to facilitate electronic component cooling through optimized use of circuit board volume through thermal vias and conductive core layers 210, as well as by directly embedding devices into the circuit board laminate. In addition, themirror techniques 300 can reduce the impact of the hotlight source - The above examples are merely illustrative of several possible embodiments of various aspects of the present disclosure, wherein equivalent alterations and/or modifications will occur to others skilled in the art upon reading and understanding this specification and the annexed drawings. In particular regard to the various functions performed by the above described components (assemblies, devices, systems, circuits, and the like), the terms (including a reference to a “means”) used to describe such components are intended to correspond, unless otherwise indicated, to any component, such as hardware, processor-executed software, or combinations thereof, which performs the specified function of the described component (i.e., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the illustrated implementations of the disclosure. In addition, although a particular feature of the disclosure may have been illustrated and/or described with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Furthermore, references to singular components or items are intended, unless otherwise specified, to encompass two or more such components or items. Also, to the extent that the terms “including”, “includes”, “having”, “has”, “with”, or variants thereof are used in the detailed description and/or in the claims, such terms are intended to be inclusive in a manner similar to the term “comprising”. The invention has been described with reference to the preferred embodiments. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations.
Claims (39)
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