US20120097637A1 - Method of manufacturing substrate for liquid discharge head - Google Patents
Method of manufacturing substrate for liquid discharge head Download PDFInfo
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- US20120097637A1 US20120097637A1 US13/379,192 US201013379192A US2012097637A1 US 20120097637 A1 US20120097637 A1 US 20120097637A1 US 201013379192 A US201013379192 A US 201013379192A US 2012097637 A1 US2012097637 A1 US 2012097637A1
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- recesses
- substrate
- discharge head
- liquid discharge
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/055—Devices for absorbing or preventing back-pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
Definitions
- the present invention relates to a method of manufacturing a substrate for a liquid discharge head used for a liquid discharge head. Specifically, the present invention relates to a method of manufacturing a substrate used for an ink-jet recording head which injects a liquid, such as ink, toward a recording medium.
- a liquid discharge head (hereinafter referred to a side shooter type head) of a type in which a liquid is discharged from an upper portion of a liquid discharge pressure generating element has been known.
- a system is adopted which provides through ports (liquid supply ports) in a substrate in which discharge energy generating portions are formed, and of supplying the liquid from the rear face of the face where the discharge energy generating portions are formed.
- a method of performing drilling using a laser on an Si material (silicon substrate) having plane orientation ⁇ 100> to form recesses, and then performing anisotropic etching is disclosed in US Patent Application Laid-Open No. 2007/0212890.
- This Si anisotropic etching method performs hole drilling on the Si material in advance to shorten the etching time until formation of liquid supply ports, and performs the control of the opening width depending on the positions of the recesses.
- U.S. Pat. No. 6,979,797 discloses a method of manufacturing a liquid discharge head by performing cutting work on the surface of the Si material with a laser, and penetrating the material by wet etching or laser processing from the rear face.
- the invention aims at providing a method of manufacturing a substrate for a liquid discharge head capable of stably manufacturing a substrate for a liquid discharge head with high production efficiency. Specifically, the invention aims at manufacturing a substrate for a liquid discharge head having supply ports with a smaller opening width than in the past with high precision in a short time.
- a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements.
- the method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports.
- FIG. 1 is a perspective view illustrating a portion of a liquid discharge head of an embodiment of the invention.
- FIGS. 2A , 2 B, 2 C, 2 D, and 2 E are sectional views of a substrate for a liquid discharge head to which a manufacturing method of a first embodiment of the invention is applied.
- FIGS. 3A , 3 B, 3 C, 3 D, 3 E, 3 F, 3 G, and 3 H are views illustrating a method of manufacturing the substrate for a liquid discharge head related to the first embodiment of the invention.
- FIG. 4 is a sectional view of the substrate for a liquid discharge head in the case when over etching is performed in the first embodiment of the invention.
- FIGS. 5A and 5B are sectional views of the substrate for a liquid discharge head when an arrangement pattern of leading holes is replaced in the first embodiment of the invention.
- FIG. 6 is a sectional view of a substrate for a liquid discharge head in a case where leading holes do not communicate with each other.
- FIGS. 7A and 78 are views illustrating a formation pattern of liquid supply ports of the invention.
- FIGS. 8A , 8 B, 8 C, 8 D, 8 E, 8 F, 8 G, and 8 H are views illustrating a method of manufacturing a substrate for a liquid discharge head related to a second embodiment of the invention.
- the feature of a method of manufacturing a substrate for a liquid discharge head of the invention is that anisotropic etching is carried out after recesses (hereinafter also described as “leading holes”) are formed in both faces of a silicon substrate, for example, by laser processing.
- Both the faces of the silicon substrate which form the recesses indicate two faces including a face (hereinafter referred to as a first face) which forms an etching mask layer, as a face in which the anisotropic etching for forming the liquid supply ports is started, and a face (hereinafter referred to as a second face) opposite to this face.
- FIG. 1 A portion of the liquid discharge head of one embodiment of the invention is shown in FIG. 1 .
- This liquid discharge head has a silicon substrate 1 in which two rows of liquid discharge energy generating elements (hereinafter referred to as energy generating elements) 3 are aligned and formed at predetermined pitches.
- energy generating elements liquid discharge energy generating elements
- liquid discharge ports 4 which are opened above a flow passage side wall 2 and the energy generating elements 3 , are formed from a coating photosensitive resin which forms a flow passage forming member.
- Upper portions of flow passages 6 which communicate with the liquid discharge ports 4 through the flow passages 6 from the liquid supply ports 5 are formed by this flow passage forming member.
- the liquid supply ports 5 formed by the anisotropic etching of silicon are opened between two rows of the liquid discharge energy generating elements 3 .
- This liquid discharge head applies the energy generated by an energy generating element 3 to a liquid which has been filled into a flow passage 6 via an ink supply port 5 , thereby making liquid droplets be discharged from a liquid discharge port 4 and adhere to a recording medium, thereby performing recording.
- this liquid discharge head It is possible to load this liquid discharge head on apparatuses, such as a printer, a copying machine, a facsimile having a communication system, and a word processor having a printer unit, and industrial recording apparatuses complexly combined with various processing apparatuses. Then, it is possible to perform recording on various recording mediums, such as paper, threads, fibers, leather, metal, plastic, glass, timber, and ceramic by using this liquid discharge head.
- the “recording” refers to not only transferring images with meaning, such as characters or figures to a recording medium, but also transferring images with no meaning, such as patterns. (Feature of anisotropic etching using leading holes)
- FIG. 2A A section in the manufacturing process of a substrate for a liquid discharge head to which a manufacturing method of this embodiment is applied is shown in FIG. 2A
- FIGS. 2B to 2C top views in the manufacturing process of a substrate for a liquid discharge head to which the manufacturing method of this embodiment is applied are shown in FIGS. 2B to 2C .
- FIG. 2A shows a section when a liquid discharge head substrate is cut by a plane vertical to the substrate through the line A-A′ in FIG. 1 .
- An etching mask layer 10 which has an opening corresponding to a portion where the liquid supply ports are to be formed is formed on the rear face (first face) of the silicon substrate 1 .
- crystal anisotropic etching is performed from the opening of the first face to form the liquid supply ports in the silicon substrate, in a state where recesses are formed in the portion on the second face where the liquid supply ports to be formed, and the recesses are formed on the opening of the first face.
- two rows of leading holes 11 are formed in a desired pattern with a desired depth on the rear face of the silicon substrate 1 in the longitudinal direction of the opening by laser processing in a state where a sacrificial layer 7 is provided on the silicon substrate 1 .
- one row of leading holes 9 are formed in a desired pattern with a desired depth in a longitudinal direction of the opening in the face opposite to the rear face of the silicon substrate 1 .
- the direction of the rows when expressed by two rows (one row) of leading holes being formed in the longitudinal direction of the opening indicates the orientation in which each row is arrayed along the longitudinal direction of the opening, and leading holes equivalent to the number of rows are included in a section in a lateral direction of the opening which has the leading holes.
- the two or more rows of leading holes 11 and the one row of leading holes 9 are arranged at predetermined pitches, as shown in FIGS. 2B to 2D . Thereafter, it is possible to form an etching stop layer (passivation layer) 8 , and to carry out the anisotropic etching, thereby easily and stably forming the liquid supply ports 5 which have a face vertical to the face of the silicon substrate 1 .
- the sacrificial layer 7 is provided in a region where the liquid supply ports 5 in the front face of the silicon substrate 1 after etching are to be formed.
- the sacrificial layer 7 is effective but is not indispensable to the invention when attempting to mark out a formation area of the liquid supply ports with high precision.
- the sacrificial layer is formed from a material whose etching rate is faster than silicon. For example, in a case where etching is made by an alkali solution, it is possible to use aluminum, aluminum silicone, aluminum bronze, aluminum silicone copper, etc.
- the leading holes 9 of the front face of the silicon substrate 1 are formed in at least one row in the longitudinal direction of the liquid supply ports 5 in the region at the front face of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- the leading holes 9 are formed on the centerline (this line passes through the center in the lateral direction) of the liquid supply ports 5 , as seen in the longitudinal direction of the liquid supply ports 5 , in the region of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- the leading holes 9 are arrayed and formed in one row, and may be formed in two or more rows. In a case where the leading holes are formed in two or more rows, it is preferable to provide the leading holes so that they are symmetrically arranged with respect to the centerline of the liquid supply ports. For example, if the leading holes are formed in three rows, it is possible to arrange one row of leading holes on the centerline of the liquid supply ports, and it is possible to arrange the two remaining rows of leading holes symmetrically with respect to the centerline.
- the etching stop layer 8 is formed from a material with resistance against a material used for the anisotropic etching.
- As the etching stop layer it is possible to use an inorganic film of oxidation silicon, silicon nitride, or the like capable of being removed by dry etching or the like. Additionally, it is also possible to use an organic film capable of being removed by chemical processing or the like. Since formation of the opening is performed by starting the anisotropic etching from the first face, and making the etching reach the second face, it is possible to arrange the etching stop layer 8 on the leading holes 9 (on the recesses) formed in the second face.
- the sacrificial layer 7 and the etching stop layer 8 just have to be formed on the silicon substrate 1 in cases where the sacrificial layer and the etching stop layer are used independently or used together at a stage before etching is performed. At a stage before etching, formation timing or order is arbitrary, and the method just has to be based on well-known methods. Additionally, a passivation layer which has etching resistance may be formed so as to cover the sacrificial layer.
- the leading holes 11 of the rear face of the silicon substrate 1 are formed in at least two rows in the longitudinal direction of the liquid supply ports 5 in the region at the rear face of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- the leading holes 11 are formed while making rows symmetrical with respect to the centerline of the liquid supply ports, as seen in the longitudinal direction of the liquid supply ports 5 , in the region of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- the leading holes 11 are arrayed and formed in two rows, and may be formed in three or more rows.
- leading holes 11 of the rear face (first face) of the silicon substrate 1 may be formed in one row as another aspect in the case the leading holes 9 and the leading holes 11 overlap each other in the thickness direction of the silicon substrate 1 .
- the leading holes 9 of the front face (second face) of the silicon substrate 1 are formed in at least one row in the longitudinal direction of the liquid supply ports 5 in the region of the front face of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- leading holes 9 and the leading holes 11 it is preferable to form the leading holes 9 and the leading holes 11 so as to satisfy the relationship of X+Y ⁇ T, where T is defined as the thickness ( ⁇ m) of the silicon substrate 1 , X is defined as the depth ( ⁇ m) of the leading holes 9 , and Y is defined as the depth ( ⁇ m) of the leading holes 11 .
- leading holes 9 and the leading holes 11 be formed on the same section in a lateral section of the silicon substrate.
- FIG. 3 The process of etching when the crystal anisotropic etching has been performed on the silicon substrate 1 in which the leading holes 9 at the front face of the silicon substrate 1 shown in FIGS. 2A to 2E and the leading holes 11 at the rear face of the silicon substrate 1 are formed is schematically shown in FIG. 3 .
- the sacrificial layer 7 and the etching stop layer 8 are used is shown.
- the energy generating elements 3 and the sacrificial layer 7 are formed on the silicon substrate 1 , and the etching mask 10 is formed on the face opposite to the front face of the silicon substrate 1 .
- the etching mask 10 is formed on the face opposite to the front face of the silicon substrate 1 .
- one row of the leading holes 9 and two rows of the leading holes 11 are formed, and the etching stop layer 8 of an organic film may be formed.
- the etching stop layer of an inorganic film may be formed.
- FIG. 3C the etching stop layer of an inorganic film may be formed.
- the etching stop inorganic film in a state where the etching stop inorganic film is formed on the sacrificial layer 7 and the energy generating elements 3 , one row of the leading holes 9 and two rows of the leading holes 11 may be formed, and the organic film etching stop layer 8 may be formed. Additionally, after the sacrificial layer 7 is formed, it is possible to form the leading holes 9 with a laser so as to pass through the sacrificial layer 7 . Additionally, the inorganic film etching stop layer 8 of an may be formed somewhat thinly on the sacrificial layer 7 , and the leading holes 11 may be formed with a laser so as to pass through the sacrificial layer 7 and the etching stop layer 8 .
- ⁇ 111> planes 20 a and 20 b are formed so as to become narrower in the direction toward the front face of the silicon substrate 1 from the tip of each of the leading holes 11 at the rear face of the silicon substrate 1 by the anisotropic etching. Simultaneously, etching proceeds in the direction (horizontal direction of the drawing) perpendicular to the thickness direction of the silicon substrate 1 from the insides of the leading holes 11 . Additionally, in the opening at the face which forms the etching mask 10 of the silicon substrate 1 , ⁇ 111> planes 21 are formed so as to become wider in the direction toward the front face of the silicon substrate 1 ( FIG. 3E ).
- etching proceeds further, the ⁇ 111> planes 20 b formed between two leading holes 11 from the respective leading holes 11 touch each other. Then, etching proceeds further toward the front face of the silicon substrate 1 from an apex formed by these ⁇ 111> planes 20 b ( FIG. 3F ).
- etching proceeds further from FIG. 3F , the apex formed by the ⁇ 111> planes 20 b communicate with the leading holes 9 of the face with the energy generating elements 3 , and the sacrificial layer 7 comes into contact with an etching solution and is etched ( FIG. 3G ). Then, the sacrificial layer 7 is completely etched, and becomes as is shown in FIG. 3H . In addition, it is also possible to perform etching in a state where there is no sacrificial layer 7 .
- an opening surface at the sacrificial layer 7 of the liquid supply ports 5 may become larger than a region where the liquid supply ports 5 are to be formed or a region where the sacrificial layer 7 is provided. It may be considered that this results from over etching or the like. However, this does not have a significant influence on supply characteristics.
- the formation positions of the ⁇ 111> planes 20 a which are formed so that processing width becomes narrow in the direction toward the front face of the silicon substrate 1 are determined depending on the positions of the leading holes 9 of the front face of the silicon substrate 1 , and the leading holes 11 of the rear face of the silicon substrate 1 . Additionally, the formation positions of the ⁇ 111> planes 21 formed from the opening at the rear face of the silicon substrate 1 are determined by the opening position of the etching mask 10 arranged at the rear face of the silicon substrate 1 .
- the leading holes 9 in the front face of the silicon substrate 1 and the leading holes 11 in the rear face of the silicon substrate 1 may be arranged in reverse.
- the leading holes 9 of the front face of the silicon substrate 1 are formed in at least two rows in the longitudinal direction of the liquid supply ports 5 in the region of the front face of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- the leading holes 9 are formed while making rows symmetrical with respect to the centerline of the liquid supply ports, as seen in the longitudinal direction of the liquid supply ports 5 , in the region of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- leading holes 9 may be formed.
- the leading holes 11 of the rear face of the silicon substrate 1 are formed in at least one row in the longitudinal direction of the liquid supply ports 5 in the region (opening) of the rear face of the substrate for a liquid discharge head where the liquid supply ports 5 are formed.
- the leading holes 11 are formed on the centerline (this line passes through the center in the lateral direction) of the liquid supply ports 5 , as seen in the longitudinal direction of the liquid supply ports 5 , in the region of the substrate for a liquid discharge head where the liquid supply ports 5 are to be formed.
- two or more rows of the leading holes 11 may be formed.
- leading holes are formed in two or more rows, it is preferable to provide the leading holes so that they are symmetrically arranged with respect to the centerline of the liquid supply ports. Additionally, it is preferable to form the leading holes 9 and the leading holes 11 so as to satisfy the relationship of
- T is defined as the thickness ( ⁇ m) of the silicon substrate 1
- X is defined as the depth ( ⁇ m) of the leading holes 9
- Y is defined as the depth ( ⁇ m) of the leading holes 11 .
- leading holes 9 and the leading holes 11 be formed so as to exist on the same section in a lateral section of the silicon substrate.
- the leading holes 9 and the leading holes 11 do not overlap each other in the thickness direction of the silicon substrate 1 , in the aspect where at least one row of the leading holes 9 are provided, and at least two rows of the leading holes 11 are provided.
- the depth of the leading holes 11 and the leading holes 9 is able to have the relationship below.
- T is defined as the thickness of the silicon substrate 1
- X is defined as the depth of the leading holes 11 formed in two rows
- Y is defined as the depth of the leading holes 9 formed in one row
- Z is defined as the distance between the rows of the leading holes 11 formed in two rows. Then, it is preferable that the depth X of the leading holes 11 formed in two rows and the depth Y of the leading holes 9 formed in one row fall within the following range in order to make the anisotropic etching proceed from the rear face of the silicon substrate 1 and make a region to be etched reach the sacrificial layer 7 .
- FIG. 6 a sectional view in a case where the above expression is not satisfied when the leading holes 11 are formed in the longitudinal direction of the liquid supply ports 5 is shown in FIG. 6 .
- the anisotropic etching does not appear to proceed at the apex of two ⁇ 111> planes 23 a and 23 b formed at the tips of the leading holes 11 , and it may be difficult to expose the sacrificial layer 7 .
- the liquid supply ports 5 are formed in a state where the liquid supply ports communicate with each other in the longitudinal direction of the silicon substrate 1 ( FIG. 7A ).
- the energy generating elements 3 , the sacrificial layer 7 , and the etching stop layer 8 are omitted.
- THG third harmonic wave
- laser beams capable of being used for processing are not limited to this if the laser beam has a wavelength capable of performing hole drilling on silicon which is a material for the silicon substrate 1 .
- a second harmonic wave (SHG: wavelength of 532 nm) of a YAG laser as well as THG has a high absorption factor with regard to silicon, and hole drilling may be performed using this.
- the method of manufacturing the substrate for a liquid discharge head of the invention is able to process the liquid supply ports easily and independently ( FIG. 7B ) compared with FIG. 7A since it is possible to make the opening width narrower than in the past.
- a substrate for a liquid discharge head manufactured using this processing has high rigidity and has a merit that the flatness of wafers is maintained.
- FIGS. 8A to 8H the process of etching in the case the leading holes 9 of the front face of the silicon substrate 1 and the leading holes 11 of the rear face of the silicon substrate 1 do not overlap each other in the thickness direction of the silicon substrate 1 is shown in FIGS. 8A to 8H .
- the steps of forming flow passages and discharge ports on a substrate are illustrated together.
- the energy generating elements 8 and the sacrificial layer 7 are formed on the silicon substrate 1 , and the etching mask 10 is formed on the face opposite to the front face of the silicon substrate 1 .
- the etching mask 10 is formed on the face opposite to the front face of the silicon substrate 1 .
- one row of the leading holes 9 are formed at pitches of 100 ⁇ m in the longitudinal direction of the opening of the front face, and the etching stop layer 12 of an organic film is patterned.
- polymethylisopropenylketone ODUR-1010 made by Tokyo Ohka Kogyo Co., Ltd.
- a nozzle material 13 which forms a flow passage side wall is formed and patterned on the etching stop layer 12 of an organic film.
- a composition A composed of the following is exemplified as a specific example of the material.
- composition A Composition A
- leading holes 11 are formed at a pitch of 100 ⁇ m between two rows, and at pitches of 100 ⁇ m in the longitudinal direction of the opening of the rear face, in the rear face of the silicon substrate 1 .
- the one row of leading holes 9 and the two rows of leading holes 11 are laser-processed with a depth of 390 ⁇ m.
- ⁇ 111> planes 20 a and 20 b are formed so that width becomes narrow in the direction toward the front face of the silicon substrate 1 from the tip of each of the leading holes 11 at the rear face of the silicon substrate. Simultaneously, etching proceeds in the direction (horizontal direction of the drawing) perpendicular to the thickness direction of the silicon substrate 1 from the insides of the leading holes 11 . Additionally, in the opening at the rear face of the silicon substrate 1 , ⁇ 111> planes 21 are formed so as to grow wider in the direction toward the front face of the silicon substrate 1 ( FIG. 8D ).
- TMAH tetramethylammonium hydroxide
- etching further proceeds, the ⁇ 111> planes 20 b formed between two leading holes 11 from the respective leading holes 11 touch each other. Then, etching further proceeds toward the front face of the silicon substrate 1 from an apex formed by these ⁇ 111> planes 20 b ( FIG. 8E ).
- a ⁇ 100> plane 22 is formed between two leading holes 11 .
- This ⁇ 100> plane 22 communicates with the leading holes 9 of the front face of the silicon substrate 1 toward the front face of the silicon substrate 1 , as etching progresses.
- the sacrificial layer 7 comes into contact with an etching solution and is etched, and then the sacrificial layer 7 is completely etched as shown in FIG. 8G .
- the time for the anisotropic etching is about 5 hours. Additionally, it is possible to form the maximum opening width of the liquid supply ports 5 additionally shown in FIG. 8H with 300 ⁇ m.
- the method of manufacturing a substrate for a liquid discharge head in the present embodiment it is possible to reduce occurrence of defects having a size corresponding to opening width in the front face of the silicon substrate 1 caused by the influence of depth variation in the leading holes, and it is possible to provide a substrate for a liquid discharge head with a narrow liquid supply port width.
- etching solution enters the insides of the leading holes, it is possible to form the supply ports with etching time which is shorter compared to a case where there are no leading holes, or a case where the leading holes are provided on one side.
- the leading holes 10 for obtaining the shape of the liquid supply ports 5 shown in FIG. 3 are formed by hole drilling with a laser. It is possible to precisely perform the laser processing to arbitrary positions and at high speed, and this does not require preceding steps for formation of a pattern (such as formation of a mask). For this reason, it is possible to obtain the liquid supply ports 5 with fewer steps.
- a configuration in which, the leading holes 9 at the front face are not provided in the second embodiment, but others are performed similarly to Embodiment 2 is referred to as a comparative configuration.
- the step of the anisotropic etching is 16 hours, and the opening width is 1000 ⁇ m.
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Abstract
Description
- The present invention relates to a method of manufacturing a substrate for a liquid discharge head used for a liquid discharge head. Specifically, the present invention relates to a method of manufacturing a substrate used for an ink-jet recording head which injects a liquid, such as ink, toward a recording medium.
- Conventionally, a liquid discharge head (hereinafter referred to a side shooter type head) of a type in which a liquid is discharged from an upper portion of a liquid discharge pressure generating element has been known. In this type of liquid discharge head, a system is adopted which provides through ports (liquid supply ports) in a substrate in which discharge energy generating portions are formed, and of supplying the liquid from the rear face of the face where the discharge energy generating portions are formed.
- A method of performing drilling using a laser on an Si material (silicon substrate) having plane orientation <100> to form recesses, and then performing anisotropic etching is disclosed in US Patent Application Laid-Open No. 2007/0212890. This Si anisotropic etching method performs hole drilling on the Si material in advance to shorten the etching time until formation of liquid supply ports, and performs the control of the opening width depending on the positions of the recesses.
- Additionally, U.S. Pat. No. 6,979,797 discloses a method of manufacturing a liquid discharge head by performing cutting work on the surface of the Si material with a laser, and penetrating the material by wet etching or laser processing from the rear face.
- In a manufacturing method of forming these processing sections, there is an advantage that it is possible to further miniaturize an element substrate of a liquid discharge head. That is, there is an advantage that it is possible to make the width of the element substrate narrow. Particularly, in a head in which a plurality of liquid supply ports is provided in one element substrate, such as a recording head for color ink discharge, further miniaturization of such an element substrate is required.
- However, in the method disclosed in US Patent Application Laid-Open No. 2007/0212890, when the recesses are formed with a laser, there are concerns that tip bending may occur due to lack of output or variation of depth may occur. Therefore, the depth of the recesses is limited, and prolonged etching time is needed.
- On the other hand, in the method disclosed in U.S. Pat. No. 6,979,797, processing area is large, and therefore, a long processing time is required. For this reason, there is a problem in that production efficiency is bad. Additionally, since an area where cutting work is required, there are concerns that it is difficult to cope with further miniaturization of an element substrate.
- PTL 1: US Patent Application Laid-Open No. 2007/0212890
- PTL 2: U.S. Pat. No. 6,979,797
- Thus, the invention aims at providing a method of manufacturing a substrate for a liquid discharge head capable of stably manufacturing a substrate for a liquid discharge head with high production efficiency. Specifically, the invention aims at manufacturing a substrate for a liquid discharge head having supply ports with a smaller opening width than in the past with high precision in a short time.
- In order to attain the above-mentioned object, provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports.
- According to one example of the invention, it is possible to manufacturing a substrate for a liquid discharge head having supply ports with a reduced opening width with high productive efficiency stably.
-
FIG. 1 is a perspective view illustrating a portion of a liquid discharge head of an embodiment of the invention. -
FIGS. 2A , 2B, 2C, 2D, and 2E are sectional views of a substrate for a liquid discharge head to which a manufacturing method of a first embodiment of the invention is applied. -
FIGS. 3A , 3B, 3C, 3D, 3E, 3F, 3G, and 3H are views illustrating a method of manufacturing the substrate for a liquid discharge head related to the first embodiment of the invention. -
FIG. 4 is a sectional view of the substrate for a liquid discharge head in the case when over etching is performed in the first embodiment of the invention. -
FIGS. 5A and 5B are sectional views of the substrate for a liquid discharge head when an arrangement pattern of leading holes is replaced in the first embodiment of the invention. -
FIG. 6 is a sectional view of a substrate for a liquid discharge head in a case where leading holes do not communicate with each other. -
FIGS. 7A and 78 are views illustrating a formation pattern of liquid supply ports of the invention. -
FIGS. 8A , 8B, 8C, 8D, 8E, 8F, 8G, and 8H are views illustrating a method of manufacturing a substrate for a liquid discharge head related to a second embodiment of the invention. - Hereinafter, exemplary embodiments of the invention will be described with reference to the drawings.
- The feature of a method of manufacturing a substrate for a liquid discharge head of the invention is that anisotropic etching is carried out after recesses (hereinafter also described as “leading holes”) are formed in both faces of a silicon substrate, for example, by laser processing. Both the faces of the silicon substrate which form the recesses indicate two faces including a face (hereinafter referred to as a first face) which forms an etching mask layer, as a face in which the anisotropic etching for forming the liquid supply ports is started, and a face (hereinafter referred to as a second face) opposite to this face. In a case where etching is performed toward the front face of the silicon substrate on which liquid discharge energy generating elements are to be arranged from the rear face of the silicon substrate and the liquid supply ports are formed, the rear face of the silicon substrate becomes the first face, and the front face of the silicon substrate becomes the second face. In the following respective embodiments, this will be described in detail.
- A portion of the liquid discharge head of one embodiment of the invention is shown in
FIG. 1 . - This liquid discharge head has a
silicon substrate 1 in which two rows of liquid discharge energy generating elements (hereinafter referred to as energy generating elements) 3 are aligned and formed at predetermined pitches. On thesilicon substrate 1, liquid discharge ports 4, which are opened above a flow passage side wall 2 and theenergy generating elements 3, are formed from a coating photosensitive resin which forms a flow passage forming member. Upper portions offlow passages 6 which communicate with the liquid discharge ports 4 through theflow passages 6 from theliquid supply ports 5 are formed by this flow passage forming member. Additionally, theliquid supply ports 5 formed by the anisotropic etching of silicon are opened between two rows of the liquid dischargeenergy generating elements 3. This liquid discharge head applies the energy generated by an energy generatingelement 3 to a liquid which has been filled into aflow passage 6 via anink supply port 5, thereby making liquid droplets be discharged from a liquid discharge port 4 and adhere to a recording medium, thereby performing recording. - It is possible to load this liquid discharge head on apparatuses, such as a printer, a copying machine, a facsimile having a communication system, and a word processor having a printer unit, and industrial recording apparatuses complexly combined with various processing apparatuses. Then, it is possible to perform recording on various recording mediums, such as paper, threads, fibers, leather, metal, plastic, glass, timber, and ceramic by using this liquid discharge head. In addition, in the invention, the “recording” refers to not only transferring images with meaning, such as characters or figures to a recording medium, but also transferring images with no meaning, such as patterns. (Feature of anisotropic etching using leading holes)
- A section in the manufacturing process of a substrate for a liquid discharge head to which a manufacturing method of this embodiment is applied is shown in
FIG. 2A , and top views in the manufacturing process of a substrate for a liquid discharge head to which the manufacturing method of this embodiment is applied are shown inFIGS. 2B to 2C . In addition,FIG. 2A shows a section when a liquid discharge head substrate is cut by a plane vertical to the substrate through the line A-A′ inFIG. 1 . Anetching mask layer 10 which has an opening corresponding to a portion where the liquid supply ports are to be formed is formed on the rear face (first face) of thesilicon substrate 1. - According to the manufacturing method of this embodiment, crystal anisotropic etching is performed from the opening of the first face to form the liquid supply ports in the silicon substrate, in a state where recesses are formed in the portion on the second face where the liquid supply ports to be formed, and the recesses are formed on the opening of the first face. In one aspect of such an embodiment, two rows of leading
holes 11 are formed in a desired pattern with a desired depth on the rear face of thesilicon substrate 1 in the longitudinal direction of the opening by laser processing in a state where asacrificial layer 7 is provided on thesilicon substrate 1. Additionally, one row of leadingholes 9 are formed in a desired pattern with a desired depth in a longitudinal direction of the opening in the face opposite to the rear face of thesilicon substrate 1. Here, the direction of the rows when expressed by two rows (one row) of leading holes being formed in the longitudinal direction of the opening indicates the orientation in which each row is arrayed along the longitudinal direction of the opening, and leading holes equivalent to the number of rows are included in a section in a lateral direction of the opening which has the leading holes. The two or more rows of leadingholes 11 and the one row of leadingholes 9 are arranged at predetermined pitches, as shown inFIGS. 2B to 2D . Thereafter, it is possible to form an etching stop layer (passivation layer) 8, and to carry out the anisotropic etching, thereby easily and stably forming theliquid supply ports 5 which have a face vertical to the face of thesilicon substrate 1. - The
sacrificial layer 7 is provided in a region where theliquid supply ports 5 in the front face of thesilicon substrate 1 after etching are to be formed. Thesacrificial layer 7 is effective but is not indispensable to the invention when attempting to mark out a formation area of the liquid supply ports with high precision. The sacrificial layer is formed from a material whose etching rate is faster than silicon. For example, in a case where etching is made by an alkali solution, it is possible to use aluminum, aluminum silicone, aluminum bronze, aluminum silicone copper, etc. - In the present embodiment, it is possible to take the aspect shown in
FIG. 2A as a case where the leadingholes 9 and the leadingholes 11 overlap each other in the thickness direction of thesilicon substrate 1. In this aspect, the leadingholes 9 of the front face of thesilicon substrate 1 are formed in at least one row in the longitudinal direction of theliquid supply ports 5 in the region at the front face of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. Preferably, the leadingholes 9 are formed on the centerline (this line passes through the center in the lateral direction) of theliquid supply ports 5, as seen in the longitudinal direction of theliquid supply ports 5, in the region of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. In addition, in the disclosed embodiment, the leadingholes 9 are arrayed and formed in one row, and may be formed in two or more rows. In a case where the leading holes are formed in two or more rows, it is preferable to provide the leading holes so that they are symmetrically arranged with respect to the centerline of the liquid supply ports. For example, if the leading holes are formed in three rows, it is possible to arrange one row of leading holes on the centerline of the liquid supply ports, and it is possible to arrange the two remaining rows of leading holes symmetrically with respect to the centerline. - The
etching stop layer 8 is formed from a material with resistance against a material used for the anisotropic etching. As the etching stop layer, it is possible to use an inorganic film of oxidation silicon, silicon nitride, or the like capable of being removed by dry etching or the like. Additionally, it is also possible to use an organic film capable of being removed by chemical processing or the like. Since formation of the opening is performed by starting the anisotropic etching from the first face, and making the etching reach the second face, it is possible to arrange theetching stop layer 8 on the leading holes 9 (on the recesses) formed in the second face. Thesacrificial layer 7 and theetching stop layer 8 just have to be formed on thesilicon substrate 1 in cases where the sacrificial layer and the etching stop layer are used independently or used together at a stage before etching is performed. At a stage before etching, formation timing or order is arbitrary, and the method just has to be based on well-known methods. Additionally, a passivation layer which has etching resistance may be formed so as to cover the sacrificial layer. - Next, as one aspect in the case the leading
holes 9 and the leadingholes 11 overlap each other in the thickness direction of thesilicon substrate 1, the leadingholes 11 of the rear face of thesilicon substrate 1 are formed in at least two rows in the longitudinal direction of theliquid supply ports 5 in the region at the rear face of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. Preferably, the leadingholes 11 are formed while making rows symmetrical with respect to the centerline of the liquid supply ports, as seen in the longitudinal direction of theliquid supply ports 5, in the region of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. In addition, in the disclosed embodiment, the leadingholes 11 are arrayed and formed in two rows, and may be formed in three or more rows. - Additionally, the leading
holes 11 of the rear face (first face) of thesilicon substrate 1 may be formed in one row as another aspect in the case the leadingholes 9 and the leadingholes 11 overlap each other in the thickness direction of thesilicon substrate 1. In this case, the leadingholes 9 of the front face (second face) of thesilicon substrate 1 are formed in at least one row in the longitudinal direction of theliquid supply ports 5 in the region of the front face of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. In this aspect, it is preferable to form the leadingholes 9 and the leadingholes 11 so as to satisfy the relationship of X+Y≧T, where T is defined as the thickness (μm) of thesilicon substrate 1, X is defined as the depth (μm) of the leadingholes 9, and Y is defined as the depth (μm) of the leading holes 11. - More preferably, X+Y>T is satisfied.
- Additionally, it is preferable that the leading
holes 9 and the leadingholes 11 be formed on the same section in a lateral section of the silicon substrate. - The process of etching when the crystal anisotropic etching has been performed on the
silicon substrate 1 in which the leadingholes 9 at the front face of thesilicon substrate 1 shown inFIGS. 2A to 2E and the leadingholes 11 at the rear face of thesilicon substrate 1 are formed is schematically shown inFIG. 3 . In the following example, an example in which thesacrificial layer 7 and theetching stop layer 8 are used is shown. - As shown in
FIG. 3A , theenergy generating elements 3 and thesacrificial layer 7 are formed on thesilicon substrate 1, and theetching mask 10 is formed on the face opposite to the front face of thesilicon substrate 1. Thereafter, as shown inFIG. 3B , one row of the leadingholes 9 and two rows of the leadingholes 11 are formed, and theetching stop layer 8 of an organic film may be formed. At this time, as shown inFIG. 3C , the etching stop layer of an inorganic film may be formed. Additionally, as shown inFIG. 3D , in a state where the etching stop inorganic film is formed on thesacrificial layer 7 and theenergy generating elements 3, one row of the leadingholes 9 and two rows of the leadingholes 11 may be formed, and the organic filmetching stop layer 8 may be formed. Additionally, after thesacrificial layer 7 is formed, it is possible to form the leadingholes 9 with a laser so as to pass through thesacrificial layer 7. Additionally, the inorganic filmetching stop layer 8 of an may be formed somewhat thinly on thesacrificial layer 7, and the leadingholes 11 may be formed with a laser so as to pass through thesacrificial layer 7 and theetching stop layer 8. - Then, <111>
planes silicon substrate 1 from the tip of each of the leadingholes 11 at the rear face of thesilicon substrate 1 by the anisotropic etching. Simultaneously, etching proceeds in the direction (horizontal direction of the drawing) perpendicular to the thickness direction of thesilicon substrate 1 from the insides of the leading holes 11. Additionally, in the opening at the face which forms theetching mask 10 of thesilicon substrate 1, <111>planes 21 are formed so as to become wider in the direction toward the front face of the silicon substrate 1 (FIG. 3E ). When etching proceeds further, the <111>planes 20 b formed between two leadingholes 11 from the respective leadingholes 11 touch each other. Then, etching proceeds further toward the front face of thesilicon substrate 1 from an apex formed by these <111>planes 20 b (FIG. 3F ). - When etching proceeds further from
FIG. 3F , the apex formed by the <111>planes 20 b communicate with the leadingholes 9 of the face with theenergy generating elements 3, and thesacrificial layer 7 comes into contact with an etching solution and is etched (FIG. 3G ). Then, thesacrificial layer 7 is completely etched, and becomes as is shown inFIG. 3H . In addition, it is also possible to perform etching in a state where there is nosacrificial layer 7. - As shown in
FIG. 4 , an opening surface at thesacrificial layer 7 of theliquid supply ports 5 may become larger than a region where theliquid supply ports 5 are to be formed or a region where thesacrificial layer 7 is provided. It may be considered that this results from over etching or the like. However, this does not have a significant influence on supply characteristics. - In the forming method of
liquid supply ports 5 as described above, the formation positions of the <111>planes 20 a which are formed so that processing width becomes narrow in the direction toward the front face of thesilicon substrate 1 are determined depending on the positions of the leadingholes 9 of the front face of thesilicon substrate 1, and the leadingholes 11 of the rear face of thesilicon substrate 1. Additionally, the formation positions of the <111> planes 21 formed from the opening at the rear face of thesilicon substrate 1 are determined by the opening position of theetching mask 10 arranged at the rear face of thesilicon substrate 1. - Additionally, as shown in
FIG. 5B , the leadingholes 9 in the front face of thesilicon substrate 1 and the leadingholes 11 in the rear face of thesilicon substrate 1, which are shown inFIG. 5A , may be arranged in reverse. In the case ofFIG. 5B , the leadingholes 9 of the front face of thesilicon substrate 1 are formed in at least two rows in the longitudinal direction of theliquid supply ports 5 in the region of the front face of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. Preferably, the leadingholes 9 are formed while making rows symmetrical with respect to the centerline of the liquid supply ports, as seen in the longitudinal direction of theliquid supply ports 5, in the region of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. In addition, three or more rows of the leadingholes 9 may be formed. On the other hand, the leadingholes 11 of the rear face of thesilicon substrate 1 are formed in at least one row in the longitudinal direction of theliquid supply ports 5 in the region (opening) of the rear face of the substrate for a liquid discharge head where theliquid supply ports 5 are formed. Preferably, the leadingholes 11 are formed on the centerline (this line passes through the center in the lateral direction) of theliquid supply ports 5, as seen in the longitudinal direction of theliquid supply ports 5, in the region of the substrate for a liquid discharge head where theliquid supply ports 5 are to be formed. In addition, two or more rows of the leadingholes 11 may be formed. In a case where the leading holes are formed in two or more rows, it is preferable to provide the leading holes so that they are symmetrically arranged with respect to the centerline of the liquid supply ports. Additionally, it is preferable to form the leadingholes 9 and the leadingholes 11 so as to satisfy the relationship of -
X+Y≧T - where T is defined as the thickness (μm) of the
silicon substrate 1, X is defined as the depth (μm) of the leadingholes 9, and Y is defined as the depth (μm) of the leading holes 11. - Additionally, it is preferable that the leading
holes 9 and the leadingholes 11 be formed so as to exist on the same section in a lateral section of the silicon substrate. In the progression of the etching as described above, it is also possible to adopt a second embodiment (which will be described later) in which the leadingholes 9 and the leadingholes 11 do not overlap each other in the thickness direction of thesilicon substrate 1, in the aspect where at least one row of the leadingholes 9 are provided, and at least two rows of the leadingholes 11 are provided. In this aspect, the depth of the leadingholes 11 and the leadingholes 9 is able to have the relationship below. T is defined as the thickness of thesilicon substrate 1, X is defined as the depth of the leadingholes 11 formed in two rows, Y is defined as the depth of the leadingholes 9 formed in one row, and Z is defined as the distance between the rows of the leadingholes 11 formed in two rows. Then, it is preferable that the depth X of the leadingholes 11 formed in two rows and the depth Y of the leadingholes 9 formed in one row fall within the following range in order to make the anisotropic etching proceed from the rear face of thesilicon substrate 1 and make a region to be etched reach thesacrificial layer 7. -
X+Y+Z/2 tan 54.7°≧T - Here, a sectional view in a case where the above expression is not satisfied when the leading
holes 11 are formed in the longitudinal direction of theliquid supply ports 5 is shown inFIG. 6 . In this case, the anisotropic etching does not appear to proceed at the apex of two <111>planes holes 11, and it may be difficult to expose thesacrificial layer 7. - Additionally, in the method of manufacturing a substrate for a liquid discharge head described above, the
liquid supply ports 5 are formed in a state where the liquid supply ports communicate with each other in the longitudinal direction of the silicon substrate 1 (FIG. 7A ). In addition, in the disclosed embodiment, theenergy generating elements 3, thesacrificial layer 7, and theetching stop layer 8 are omitted. In the present embodiment, although processing has been performed using a laser beam of a third harmonic wave (THG: wavelength of 355 nm) of a YAG laser, laser beams capable of being used for processing are not limited to this if the laser beam has a wavelength capable of performing hole drilling on silicon which is a material for thesilicon substrate 1. For example, a second harmonic wave (SHG: wavelength of 532 nm) of a YAG laser as well as THG has a high absorption factor with regard to silicon, and hole drilling may be performed using this. - Additionally, the method of manufacturing the substrate for a liquid discharge head of the invention is able to process the liquid supply ports easily and independently (
FIG. 7B ) compared withFIG. 7A since it is possible to make the opening width narrower than in the past. A substrate for a liquid discharge head manufactured using this processing has high rigidity and has a merit that the flatness of wafers is maintained. - Next, the process of etching in the case the leading
holes 9 of the front face of thesilicon substrate 1 and the leadingholes 11 of the rear face of thesilicon substrate 1 do not overlap each other in the thickness direction of thesilicon substrate 1 is shown inFIGS. 8A to 8H . In addition, in the following description, the steps of forming flow passages and discharge ports on a substrate are illustrated together. - As shown in
FIG. 8A , theenergy generating elements 8 and thesacrificial layer 7 are formed on thesilicon substrate 1, and theetching mask 10 is formed on the face opposite to the front face of thesilicon substrate 1. Thereafter, as shown inFIG. 8B , one row of the leadingholes 9 are formed at pitches of 100 μm in the longitudinal direction of the opening of the front face, and theetching stop layer 12 of an organic film is patterned. As a specific example of the material, polymethylisopropenylketone (ODUR-1010 made by Tokyo Ohka Kogyo Co., Ltd.) is exemplified. As also shown inFIG. 8C , anozzle material 13 which forms a flow passage side wall is formed and patterned on theetching stop layer 12 of an organic film. A composition A composed of the following is exemplified as a specific example of the material. - Composition A
-
- Epoxy resin; EHPE3150 (made by Daicel Chemical Industries Ltd.); 94 parts by weight
- Silane coupling agent; A-187 (made by Nippon Unicar Company Limited); 4 parts by weight
- Photo-acid-generating agent; SP-172 (made by Adeka Corporation); 2 parts by weight
- Thereafter, two rows of the leading
holes 11 are formed at a pitch of 100 μm between two rows, and at pitches of 100 μm in the longitudinal direction of the opening of the rear face, in the rear face of thesilicon substrate 1. At this time, the one row of leadingholes 9 and the two rows of leadingholes 11 are laser-processed with a depth of 390 μm. - Next, anisotropic etching is performed. Etching is performed where the etching conditions are such that the concentration of tetramethylammonium hydroxide (TMAH) is 22% and liquid temperature is 80° C. In addition, as for the etching solution, the concentration, and the liquid temperature, even conditions other than those shown above are possible. Then, <111>
planes silicon substrate 1 from the tip of each of the leadingholes 11 at the rear face of the silicon substrate. Simultaneously, etching proceeds in the direction (horizontal direction of the drawing) perpendicular to the thickness direction of thesilicon substrate 1 from the insides of the leading holes 11. Additionally, in the opening at the rear face of thesilicon substrate 1, <111>planes 21 are formed so as to grow wider in the direction toward the front face of the silicon substrate 1 (FIG. 8D ). - When etching further proceeds, the <111>
planes 20 b formed between two leadingholes 11 from the respective leadingholes 11 touch each other. Then, etching further proceeds toward the front face of thesilicon substrate 1 from an apex formed by these <111>planes 20 b (FIG. 8E ). - When etching further proceeds from
FIG. 8E , a <100>plane 22 is formed between two leadingholes 11. This <100>plane 22 communicates with the leadingholes 9 of the front face of thesilicon substrate 1 toward the front face of thesilicon substrate 1, as etching progresses. Then, thesacrificial layer 7 comes into contact with an etching solution and is etched, and then thesacrificial layer 7 is completely etched as shown inFIG. 8G . The time for the anisotropic etching is about 5 hours. Additionally, it is possible to form the maximum opening width of theliquid supply ports 5 additionally shown inFIG. 8H with 300 μm. In addition, it is also possible to perform etching in a state where there is no etchingsacrificial layer 7. Thereafter, the substrate for a liquid discharge head is completed by removing theetching stop layer 12 and the organicfilm etching mask 10. - As described above, according to the method of manufacturing a substrate for a liquid discharge head in the present embodiment, it is possible to reduce occurrence of defects having a size corresponding to opening width in the front face of the
silicon substrate 1 caused by the influence of depth variation in the leading holes, and it is possible to provide a substrate for a liquid discharge head with a narrow liquid supply port width. - Additionally, since an etching solution enters the insides of the leading holes, it is possible to form the supply ports with etching time which is shorter compared to a case where there are no leading holes, or a case where the leading holes are provided on one side.
- Moreover, in the method of manufacturing a substrate for a liquid discharge head in the present embodiment, the leading
holes 10 for obtaining the shape of theliquid supply ports 5 shown inFIG. 3 are formed by hole drilling with a laser. It is possible to precisely perform the laser processing to arbitrary positions and at high speed, and this does not require preceding steps for formation of a pattern (such as formation of a mask). For this reason, it is possible to obtain theliquid supply ports 5 with fewer steps. - A configuration in which, the leading
holes 9 at the front face are not provided in the second embodiment, but others are performed similarly to Embodiment 2 is referred to as a comparative configuration. In a substrate for a liquid discharge head according to the comparative configuration, the step of the anisotropic etching is 16 hours, and the opening width is 1000 μm. - While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
- This application claims the benefit of Japanese Patent Application No. 2009-202735, filed Sep. 2, 2009, which is hereby incorporated by reference herein in its entirety.
Claims (16)
X+Y+Z/2 tan 54.7°≧T.
X+Y+Z/2 tan 54.7°≧T.
X+Y≧T,
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009202735A JP4659898B2 (en) | 2009-09-02 | 2009-09-02 | Manufacturing method of substrate for liquid discharge head |
JP2009-202735 | 2009-09-02 | ||
PCT/JP2010/063234 WO2011027645A1 (en) | 2009-09-02 | 2010-07-29 | Method of manufacturing substrate for liquid discharge head |
Publications (2)
Publication Number | Publication Date |
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US20120097637A1 true US20120097637A1 (en) | 2012-04-26 |
US8808555B2 US8808555B2 (en) | 2014-08-19 |
Family
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Application Number | Title | Priority Date | Filing Date |
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US13/379,192 Expired - Fee Related US8808555B2 (en) | 2009-09-02 | 2010-07-29 | Method of manufacturing substrate for liquid discharge head |
Country Status (6)
Country | Link |
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US (1) | US8808555B2 (en) |
EP (1) | EP2473354B1 (en) |
JP (1) | JP4659898B2 (en) |
KR (1) | KR101426176B1 (en) |
CN (1) | CN102470674B (en) |
WO (1) | WO2011027645A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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USRE44945E1 (en) * | 2006-03-07 | 2014-06-17 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manfuacturing method for ink jet recording head |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013028155A (en) | 2011-06-21 | 2013-02-07 | Canon Inc | Method for producing liquid-discharge-head substrate |
JP5921186B2 (en) * | 2011-12-26 | 2016-05-24 | キヤノン株式会社 | Inkjet head substrate processing method |
JP2015168143A (en) * | 2014-03-06 | 2015-09-28 | セイコーエプソン株式会社 | Formation method of through-hole, member, inkjet head, inkjet head unit and inkjet type recording apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6677237B2 (en) * | 1998-12-16 | 2004-01-13 | Seiko Epson Corporation | Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1095119A (en) * | 1996-09-25 | 1998-04-14 | Canon Inc | Liquid discharge head and manufacture thereof |
JP2000015820A (en) | 1998-06-30 | 2000-01-18 | Canon Inc | Manufacture of orifice plate and liquid discharge head |
US6979797B2 (en) | 2002-01-31 | 2005-12-27 | Hewlett-Packard Development Company, L.P. | Slotted substrates and methods and systems for forming same |
CN100355573C (en) | 2002-12-27 | 2007-12-19 | 佳能株式会社 | Ink-jet recording head and mfg. method, and substrate for mfg. ink-jet recording head |
JP4261904B2 (en) * | 2002-12-27 | 2009-05-13 | キヤノン株式会社 | Method for manufacturing substrate for ink jet recording head, and method for manufacturing ink jet recording head |
JP2005144586A (en) * | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | Method of manufacturing structure, droplet delivery head and droplet delivery device |
US7824560B2 (en) | 2006-03-07 | 2010-11-02 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head |
JP4854336B2 (en) | 2006-03-07 | 2012-01-18 | キヤノン株式会社 | Manufacturing method of substrate for inkjet head |
US8197705B2 (en) * | 2007-09-06 | 2012-06-12 | Canon Kabushiki Kaisha | Method of processing silicon substrate and method of manufacturing liquid discharge head |
JP4480182B2 (en) | 2007-09-06 | 2010-06-16 | キヤノン株式会社 | Inkjet recording head substrate and method of manufacturing inkjet recording head |
JP2009061667A (en) * | 2007-09-06 | 2009-03-26 | Canon Inc | Silicon substrate processing method and liquid jet head manufacturing method |
JP5566130B2 (en) | 2009-02-26 | 2014-08-06 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
US8435805B2 (en) | 2010-09-06 | 2013-05-07 | Canon Kabushiki Kaisha | Method of manufacturing a substrate for liquid ejection head |
-
2009
- 2009-09-02 JP JP2009202735A patent/JP4659898B2/en not_active Expired - Fee Related
-
2010
- 2010-07-29 EP EP10813596.3A patent/EP2473354B1/en not_active Not-in-force
- 2010-07-29 US US13/379,192 patent/US8808555B2/en not_active Expired - Fee Related
- 2010-07-29 WO PCT/JP2010/063234 patent/WO2011027645A1/en active Application Filing
- 2010-07-29 CN CN201080034835.9A patent/CN102470674B/en not_active Expired - Fee Related
- 2010-07-29 KR KR1020127007555A patent/KR101426176B1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6677237B2 (en) * | 1998-12-16 | 2004-01-13 | Seiko Epson Corporation | Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE44945E1 (en) * | 2006-03-07 | 2014-06-17 | Canon Kabushiki Kaisha | Manufacturing method for ink jet recording head chip, and manfuacturing method for ink jet recording head |
Also Published As
Publication number | Publication date |
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KR20120043139A (en) | 2012-05-03 |
JP4659898B2 (en) | 2011-03-30 |
EP2473354A1 (en) | 2012-07-11 |
US8808555B2 (en) | 2014-08-19 |
EP2473354B1 (en) | 2018-09-12 |
JP2011051253A (en) | 2011-03-17 |
EP2473354A4 (en) | 2014-03-26 |
CN102470674A (en) | 2012-05-23 |
WO2011027645A1 (en) | 2011-03-10 |
KR101426176B1 (en) | 2014-08-01 |
CN102470674B (en) | 2015-01-21 |
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