JP2005144586A - Method of manufacturing structure, droplet delivery head and droplet delivery device - Google Patents

Method of manufacturing structure, droplet delivery head and droplet delivery device Download PDF

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JP2005144586A
JP2005144586A JP2003383629A JP2003383629A JP2005144586A JP 2005144586 A JP2005144586 A JP 2005144586A JP 2003383629 A JP2003383629 A JP 2003383629A JP 2003383629 A JP2003383629 A JP 2003383629A JP 2005144586 A JP2005144586 A JP 2005144586A
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glass substrate
region
recess
forming
formed
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富美男 ▲高▼城
Ryuichi Kurosawa
Fumio Takagi
龍一 黒沢
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Seiko Epson Corp
セイコーエプソン株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of shortening the manufacturing time and reducing the manufacturing cost when forming concave portions having different depths on a glass substrate.
A method of manufacturing a structure in which a plurality of recesses having different depths are formed on a glass substrate, wherein a laser beam (12) is applied to a region where a first recess of the glass substrate (10) is to be formed. A first step of forming an altered region (14) extending in the thickness direction of the glass substrate by irradiating and scanning the focal point of the laser beam in the thickness direction of the glass substrate; And / or a second step of forming an etching mask (16) having an opening (18) for exposing a region where the second concave portion having a depth smaller than the first concave portion is to be formed on the other surface; And a third step of forming a first recess (22) in a region along the altered region and forming a second recess (24) in a region corresponding to the opening of the etching mask. .
[Selection] Figure 1

Description

  The present invention relates to a manufacturing technique of a structure including a glass substrate, and more particularly to a manufacturing technique suitable for manufacturing a fluid device such as a droplet discharge head.

  2. Description of the Related Art In recent years, device development using MEMS (micro electro mechanical systems) technology has been actively performed and applied to the manufacture of various fluid devices such as a droplet discharge head, a biochip, a micropump, and the like. Various studies have been conducted on the structures of these devices. For example, a structure using a bonded body of a silicon substrate and a glass substrate is employed. In such a fluid device, a silicon substrate is used to form a flow path for allowing some solution to pass through the device, or to configure an actuator (movable part) or other functional part for realizing a predetermined operation. In addition, grooves, holes (dents), through holes, etc. are formed in the glass substrate.

  The process of forming a flow path and other functional parts on a glass substrate or the like mainly involves processing on the surface side of the glass substrate or the like, and the processing is often performed by combining photolithography technology and etching technology. . On the other hand, the process of forming a through-hole or the like in a glass substrate or the like is processing in the thickness direction of the glass substrate or the like, and the processing is often performed by mechanical processing using a cutting tool such as a drill. Recently, as one of the techniques for performing microfabrication on a glass substrate, a difference in etching rate is caused between the light irradiation region and the non-irradiation region by irradiating light on a desired position of the glass substrate. A processing technique for removing the film by etching is known. Such a technique is described in, for example, JP-A-9-309744 (Patent Document 1).

Japanese Patent Laid-Open No. 9-309744

  By the way, in the conventional processing technique, when forming a deep hole or a through hole and a relatively shallow groove with respect to the glass substrate, in other words, when forming recesses having different depths, the following is performed. There was an inconvenience. For example, when a deep recess such as a through hole is formed by mechanical processing, the processing time becomes long, which hinders the reduction of the entire manufacturing time and the manufacturing cost. In particular, when it is desired to form a large number of through holes or the like, this inconvenience becomes remarkable. In addition, as described above, since the shallow concave portion and the deep concave portion use different processing techniques, it is difficult to form these concave portions at the same time. From this point, it is difficult to shorten the manufacturing time and the manufacturing cost. It was. Patent Document 1 described above does not disclose detailed technical contents to such an extent that it can cope with such a specific problem, and therefore a technique for solving such a problem is desired.

  Then, an object of this invention is to provide the technique which shortens the manufacturing time at the time of forming the recessed part from which a depth mutually differs with respect to a glass substrate, and can aim at reduction of manufacturing cost.

  The first aspect of the present invention is a method of manufacturing a structure formed by forming a plurality of recesses having different depths on a glass substrate, and irradiating a region where the first recesses of the glass substrate are to be formed with laser light The first step of forming an altered region extending in the thickness direction of the glass substrate by scanning the focal point of the laser beam in the thickness direction of the glass substrate, and one side and / or the other side of the glass substrate And a second step of forming an etching mask having an opening exposing a region where the second concave portion having a shallower depth than the first concave portion is to be formed, and etching the glass substrate along the altered region. And a third step of forming a second recess in a region corresponding to the opening of the etching mask.

  According to this manufacturing method, the subsequent etching process is performed in a lump by making a difference in the etching rate of the part according to the depth desired as the recess depending on the presence / absence of the altered region, and the first different in depth It becomes possible to form the recess and the second recess at a stroke. This advantage is similarly obtained when a large number of first recesses such as holes are formed. Therefore, it is possible to shorten the manufacturing time when forming concave portions having different depths from each other on the glass substrate, and to reduce the manufacturing cost.

  Here, in this specification, the “glass substrate” includes substrates made of various glasses such as soda glass, quartz glass, borosilicate glass and the like. In addition, the “recessed portion” may have any shape that is recessed from the surroundings, and includes grooves, holes, and through holes. In addition, the “modified region” means that the density, refractive index, mechanical strength, and other physical characteristics are different from those of the surroundings, and it is easier to etch than the region other than the modified region (the state where the etching rate is high). This includes areas that have become small and cause microcracks.

  Preferably, the first recess described above is a through hole or a deep hole similar thereto. Here, the “deep hole” refers to a hole formed several times as deep as the second recess, for example.

  In the prior art, it was difficult to collectively form recesses having a large depth ratio from the substrate surface, such as shallow grooves and through-holes, with respect to the glass substrate, but this is facilitated by the present invention.

  It is desirable that the etching mask in the second step described above further includes an opening that exposes a region corresponding to the formation position of the altered region of the glass substrate.

  Thereby, since the etching with respect to the altered region proceeds from both surfaces of the glass substrate, the first recess can be formed in a shorter time. In addition, since the etching time is shortened, the formation of through holes and the like is completed before the etching in the direction other than the direction along the altered region proceeds so much, and the through holes and the like are made finer (smaller diameter). Can be achieved.

  The laser beam irradiated in the first step described above is preferably a pulsed laser beam.

  By using pulsed laser light, it is possible to minimize unnecessary energy application to a portion other than the region where the altered region of the glass substrate is to be formed.

  More preferably, femtosecond laser light having a pulse width on the order of femtoseconds (for example, several tens to several hundreds femtoseconds) is used as the above-described pulse laser light.

  By using the femtosecond laser beam, the altered region can be locally formed, and the first recess can be further miniaturized.

  In the first aspect of the present invention described above, the step of forming an altered region by irradiating the glass substrate with laser light (first step) and the step of forming an etching mask on the glass substrate (second step) It is possible to change the order.

  That is, the second aspect of the present invention is a method for manufacturing a structure in which a plurality of recesses having different depths are formed on a glass substrate, wherein the first surface and / or the other surface of the glass substrate are A first step of forming an etching mask having an opening for exposing a region where a recess is to be formed, and a region where a second recess deeper than the first recess is to be formed from one side or the other side of the glass substrate A second step of forming a denatured region extending in the thickness direction of the glass substrate by irradiating a laser beam on the glass substrate and scanning the focal point of the laser beam in the thickness direction of the glass substrate; And a third step of forming a first recess in a region corresponding to the opening of the etching mask and forming a second recess in a region along the altered region.

  Also in the second aspect of the present invention, the same technical effect as in the first aspect of the present invention can be obtained. The step of irradiating the laser beam and the step of forming the etching mask can be interchanged in a desired order according to other manufacturing conveniences, and variations in the manufacturing process can be widened.

  The third aspect of the present invention is a device using the structure manufactured by the manufacturing method described above. Here, the “device” includes a droplet discharge head (inkjet head), a microfluidic chip (electrophoresis chip, microreactor, etc.), a biosensor, an electroosmotic flow pump, and the like.

  The fourth aspect of the present invention is a liquid droplet ejection apparatus (inkjet apparatus) including the liquid droplet ejection head as the device according to the third aspect of the present invention.

  Embodiments of the present invention will be described in detail with reference to the drawings. Hereinafter, a manufacturing method thereof will be described by taking a structure used as a component of a droplet discharge head as an example.

  Drawing 1 is a figure (process drawing) explaining the manufacturing method of the structure of one embodiment. FIG. 1 illustrates a process for forming a through hole as a first recess and a groove as a second recess having a shallower depth than the first recess on the glass substrate.

  First, as shown in FIG. 1A, the laser beam 12 is irradiated from one side (or the other side) of the glass substrate 10 to scan the focal point of the laser beam 12 in the thickness direction of the glass substrate 10. As a result, an altered region 14 (indicated by a dotted line in the figure) extending in the thickness direction of the glass substrate 10 is formed. The irradiation with the laser beam 12 is performed corresponding to a position in the glass substrate 10 where a through hole (first recess) is to be formed. In this example, the altered region 14 is formed from one surface of the glass substrate 10 to the other surface. In the example shown in the figure, the laser beam irradiation is shown only at one point, but in this step, a plurality of points can be irradiated with the laser beam. Thereby, a plurality of through holes can be formed at a time.

  As the glass substrate 10, substrates made of various glasses such as soda glass, quartz glass, and borosilicate glass can be employed. In the case where a glass substrate made of an alkali ion such as sodium or lithium, for example, a glass substrate made of silicate glass, borosilicate glass, aluminosilicate glass, phosphate glass or the like is used as the glass substrate 10, this glass substrate 10 is later used. An anodic bonding method can be used conveniently when bonding to a semiconductor substrate, a metal substrate, or the like.

  The “altered region” refers to a region where the density, refractive index, mechanical strength, and other physical characteristics are different from the surroundings, and includes those in which minute cracks are generated. As long as such an altered region 14 can be formed on the glass substrate 10, various types of laser light 12 can be adopted. Furthermore, any means other than the laser beam can be adopted as long as it is possible to apply energy to the desired position of the glass substrate 10 by electron beam irradiation or the like. In the present embodiment, a femtosecond laser beam having a pulse width of femtosecond order (for example, several tens to several hundreds femtoseconds) is used as a preferable example of the laser beam 12. For example, femtosecond laser light having a wavelength of 800 nm, a pulse width of 100 fs (femtosecond), and a repetition frequency of 1 kHz is used.

When femtosecond laser light is irradiated, the energy density is extremely high in the vicinity of the condensing point, and large energy can be injected locally instantaneously. In the portion irradiated with the femtosecond laser beam, various microscopic structural changes are caused by various nonlinear interactions (for example, multiphoton absorption, multiphoton ionization, etc.) between the laser beam and the substance constituting the glass substrate 10. Induced. The induced structural change depends on the intensity of the laser beam, and (a) coloring by oxidation-reduction of active ions (rare earth, transition metal, etc.), (b) refractive index change by generation and densification of defects, (c) melting And void formation by laser shock waves, and (d) formation of micro cracks by optical breakdown. In many cases, the induced structural changes are complex and have a certain spatial distribution. Of these structural changes, the present embodiment mainly uses the microcracks described in (d) above. This microcrack is induced by a phenomenon (breakdown) in which stress distortion occurs in the vicinity of the focal point. When femtosecond laser light is used, the pulse width is shorter than the coupling time between electrons and phonons (on the order of 10-12 seconds), so the energy of the laser light is irradiated sufficiently faster than the thermal diffusion rate of the material. The plasma is generated by being injected in a concentrated manner. Cracks are induced by shock waves generated when the plasma diffuses. Therefore, the irradiation conditions (intensity, pulse width, mode, wavelength, etc.) of the laser light 12 are appropriately set according to the material of the glass substrate 10 and other conditions so that microcracks are mainly generated in the glass substrate 10. As a result, the altered region 14 can be formed only in a very fine region, and fine processing can be achieved.

  Next, as shown in FIG. 1B, an etching mask 16 having an opening 18 for exposing a region where a groove as a second recess is to be formed is formed on one surface of the glass substrate 10. The etching mask 16 is formed using a mask material such as gold (Au), chromium (Cr), polysilicon (Si), or the like.

  When it is desired to form the second recess on the other surface side of the glass substrate 10, the etching mask 16 is formed on the other surface of the glass substrate 10. Furthermore, when it is desired to form the second recesses on both surfaces of the glass substrate 10, the etching mask 16 is formed on both surfaces of the glass substrate 10.

  When the etching mask 16 is formed on the glass substrate 10, next, as shown in FIG. 1C, the glass substrate 10 is etched to remove a portion along the altered region 14 and the through hole 22. And a groove 24 is formed in a region corresponding to the opening 18 of the etching mask 16. In this example, since the etching with respect to the altered region 14 proceeds only from the other surface side of the glass substrate 10, the shape of the through hole 22 is tapered (substantially V-shaped) as shown. Thereafter, by removing the etching mask 16, the structure according to the present embodiment is completed as shown in FIG.

  Here, as the etching in this step, wet etching using a hydrofluoric acid solution or dry etching using a fluorine compound gas can be employed. In the portion of the altered region 14 of the glass substrate 10, the etching rate is higher than in the other portions, and the region along the altered region 14 is preferentially removed. By continuing the etching, the through hole 22 is obtained. Is formed. In addition, since the etching rate is slower in the region corresponding to the opening 18 of the etching mask 16 than in the altered region 14, a groove 24 having a relatively shallow depth is formed. That is, in this embodiment, the etching rate varies depending on whether or not the altered region is provided, thereby enabling the simultaneous formation of recesses having different depths.

  Further, as described above, the altered region 14 is mainly composed of microcracks, whereby the etching solution or the etching gas can easily permeate along the thickness direction of the glass substrate 10 in this step. Thereby, it is possible to achieve a high etching selectivity and obtain a through hole 22 with a smaller hole diameter.

  FIG. 2 is a cross-sectional view illustrating a structure of an example of a droplet discharge head including a structure manufactured using the manufacturing method of the present embodiment. A droplet discharge head 100 shown in FIG. 2 is a device for discharging a desired liquid to a minute amount by using an electrostatic actuator, and includes a structure manufactured by the manufacturing method described above. The

  The droplet discharge head in the example shown in FIG. 2 has a three-layer structure in which two substrates 26 and 28 are bonded to the glass substrate 10 described above. As these substrates 26 and 28, for example, processed semiconductor substrates are used. The through hole 22 provided in the glass substrate 10, the groove provided in the substrate 26, and the groove provided in the substrate 28 communicate with each other to form a flow path, and a discharge injected from the through hole 22 side. The target liquid (ink) 40 is supplied to the nozzle (ejection port) 30 through the flow path. An electrode 32 made of an ITO film or the like is formed in the groove 24 of the glass substrate 10. A vibration plate 34 is formed on the substrate 26 at a position facing the electrode 32. When a voltage is applied to the electrode 32 via the two terminals 36 and 38, the diaphragm 34 is attracted to the electrode 32 and elastically deforms. Thereafter, by releasing the voltage, a droplet composed of a small amount of ink 40 is ejected from the nozzle 30 by the restoring force when the diaphragm 34 tries to return to the original position.

  FIG. 3 is a diagram (perspective view) for explaining an example of a droplet discharge apparatus configured using the above-described droplet discharge head. A droplet discharge device 200 shown in FIG. 3 includes a table 201, a Y-direction drive shaft 202, a droplet discharge unit 203, an X-direction drive shaft 204, a drive unit 205, and a control computer 206. This droplet discharge device is used, for example, for manufacturing a microarray (biochip) used for biotechnology-related inspections and experiments.

  The table 201 is for placing a substrate constituting the microarray. The table 201 can mount a plurality of substrates, and is configured to be able to fix each substrate, for example, by vacuum suction.

  The Y-direction drive shaft 202 is for freely moving the table 201 along the Y direction shown in the figure. The Y-direction drive shaft 202 is connected to a drive motor (not shown) included in the drive unit 205, and moves the table 201 by obtaining a drive force from the drive motor. The X direction drive shaft 204 is for freely moving the droplet discharge unit 203 along the X direction shown in the figure. The X-direction drive shaft 204 is connected to a drive motor (not shown) included in the drive unit 205, and moves the droplet discharge unit 203 by obtaining a drive force from the drive motor.

  The droplet discharge unit 203 discharges the biomolecule solution toward the substrate based on the drive signal supplied from the control computer 206, and the nozzle surface that discharges the solution faces the table 201. The directional drive shaft 204 is assembled. The droplet discharge unit 203 uses the droplet discharge head 100 driven by the electrostatic driving method described above as a head for discharging a solution. The electrostatic drive type inkjet head has a relatively simple structure, stable solution discharge, and does not use heat, so it can avoid deterioration of biomolecules in the solution and maintain its activity. It becomes. In addition, the apparatus can be reduced in size and power consumption.

  The drive unit 205 includes a motor and other drive mechanisms that drive the Y-direction drive shaft 202 and the X-direction drive shaft 204, respectively. By operating these motors and the like based on the drive signal supplied from the control computer 206, the relative position between the table 201 on which the substrate is placed and the droplet discharge unit 203 is controlled. The control computer 206 is installed in the housing of the drive unit 205 and controls the operation (e.g., solution discharge timing, number of discharges) of the droplet discharge unit 203.

  As described above, according to the manufacturing method of the present embodiment, the subsequent etching process is performed collectively by making a difference in the etching rate of the part depending on the depth desired as the recess depending on the presence or absence of the altered region 14. Through holes 22 and grooves 24 (that is, first recesses and second recesses having different depths) can be formed all at once. This advantage is also obtained when a large number of through holes 22 are formed. Therefore, it is possible to shorten the manufacturing time when forming concave portions having different depths from each other on the glass substrate, and to reduce the manufacturing cost.

  Next, another embodiment will be described. In the following description, contents common to the above-described embodiment will be omitted as appropriate.

  FIG. 4 is a diagram (process diagram) for explaining a manufacturing method according to another embodiment. In FIG. 4, the manufacturing process in the case of forming the hole which is only depressed rather than the periphery as a 1st recessed part but does not penetrate is shown with respect to the glass substrate.

  First, in the same manner as in the above-described embodiment (see FIG. 1A), the glass substrate 10 is irradiated with the laser beam 12 and the focal point of the laser beam 12 is scanned in the thickness direction of the glass substrate 10. A denatured region extending in the thickness direction of the glass substrate 10 is formed. At this time, the altered region may be formed from one surface of the glass substrate 10 to the other surface as in the above-described embodiment, but more preferably, as shown in FIG. The condensing position of the laser beam 12 is scanned so that the altered region 14a is formed in a certain depth range from the direction side. Thereafter, an etching mask 16 is formed on one surface of the glass substrate 10 (see FIG. 1B).

  Next, the glass substrate 10 is etched from both sides thereof through the etching mask 16 to remove portions along the altered region 14a. At this time, the site along the altered region 14a is removed in a substantially V shape as shown in FIG. By stopping the etching at an appropriate timing, a substantially V-shaped hole 22a as shown in FIG. 4B is obtained. Further, when the etching is continued, the etching proceeds isotropically after the removal of the portion along the altered region 14a is completed, so that a hole 22b having a hemispherical shape on the bottom side can be obtained.

  Thus, in the embodiment of the present example, by adjusting the length of the etching time and the depth (range) of the altered region, holes and grooves other than the through holes can be formed, and the bottom shape of these holes and the like can be formed. Can also be changed.

  Drawing 5 is a figure (process drawing) explaining the manufacturing method of other embodiments. FIG. 5 shows a manufacturing process in the case where an opening that exposes a region corresponding to the formation position of the altered region is further provided on the etching mask.

  First, in the same manner as in the above-described embodiment, the glass substrate 10 is irradiated with the laser beam 12 and the focal point of the laser beam 12 is scanned in the thickness direction of the glass substrate 10. An extended altered region 14 is formed (FIG. 5A).

  Next, as shown in FIG. 5B, the opening 18 exposing the region where the groove as the second recess is to be formed on one surface of the glass substrate 10 and the formation position of the altered region 14 are corresponded. An etching mask 16a having an opening 20 exposing a region (that is, a region where a through hole or the like as a first recess is to be formed) is formed.

  Next, as shown in FIG. 5C, the glass substrate 10 is etched from both sides thereof, and the portion along the altered region 14 is removed. At this time, the etching with respect to the site along the altered region 14 proceeds from both the one side and the other side of the glass substrate 10 as shown in FIG. The portions along these altered regions 14 are both removed in a substantially V shape, and the portions removed as shown in FIG. 5D are connected by further etching, and a substantially X shape as shown in the figure. The through hole 22c is obtained. A groove 24 is formed in a region corresponding to the opening 18 of the etching mask 16.

  As described above, in the embodiment of this example, the etching for forming the through hole 22c proceeds from both surfaces of the glass substrate 10. Therefore, the through hole 22c can be formed in a shorter etching time. Moreover, since the substantially X-shaped thing different from the substantially V shape in embodiment mentioned above about the shape of the through-hole 22c is obtained, the choice of the shape of a through-hole is increased, and a through-hole is according to various uses etc. It is possible to use different shapes.

  FIG. 6 is a diagram (process diagram) for explaining a manufacturing method according to another embodiment. In FIG. 6, the manufacturing process in the case of processing with respect to both surfaces of a glass substrate is shown.

  First, in the same manner as in the above-described embodiment, the glass substrate 10 is irradiated with the laser beam 12 and the focal point of the laser beam 12 is scanned in the thickness direction of the glass substrate 10. An extended altered region 14b is formed (FIG. 6A).

  Next, as shown in FIG. 6B, an opening that exposes a region where a groove as a second recess is to be formed on both surfaces of the glass substrate 10 and a region corresponding to the formation position of the altered region 14b (that is, An etching mask 16b having an opening 18a that also serves as an opening exposing a region where a through hole or the like as a first recess is to be formed is formed.

  Next, as shown in FIG. 6C, etching is performed on both sides of the glass substrate 10 to remove portions along the altered region 14b to form through holes 22d and to form grooves 24a. At this time, the etching with respect to the site along the altered region 14b proceeds from both the one side and the other side of the glass substrate 10 as shown in FIG. The portions along the altered region 14b are both removed in a substantially V shape, and the removed portions are connected as shown in FIG. 6D by further etching, and the substantially X-shaped portion as shown in FIG. A through hole 22d is obtained.

  As described above, according to the embodiment of the present example, it is possible to collectively form the grooves on the both surfaces of the glass substrate 10 and the through holes, thereby significantly reducing the manufacturing time. In addition, manufacturing costs are greatly reduced.

  In addition, this invention is not limited to the content of embodiment mentioned above, A various deformation | transformation implementation is possible within the range of the summary of this invention. For example, in the above-described embodiment, the step of forming the altered region on the glass substrate (see FIG. 1A and the like) and the step of forming an etching mask on the glass substrate (see FIG. 1B and the like) are in order. Can also be replaced. Thus, it is possible to change each process in a desired order according to the manufacturing convenience. In either case, the effects according to the present invention can be obtained, and variations in the manufacturing process can be expanded.

  In the above-described embodiment, a liquid droplet ejection head (inkjet head) has been described as an example of a device using the structure according to the present invention. In addition, a microfluidic chip (electrophoresis chip, The present invention can be applied to the production of various devices such as microreactors and the like, biosensors, electroosmotic flow pumps and the like.

It is a figure (process drawing) explaining the manufacturing method of the structure of one Embodiment. It is sectional drawing explaining the structure of an example of a droplet discharge head. It is a figure (perspective view) explaining an example of the droplet discharge apparatus comprised using a droplet discharge head. It is a figure (process drawing) explaining the manufacturing method of other embodiment. It is a figure (process drawing) explaining the manufacturing method of other embodiment. It is a figure (process drawing) explaining the manufacturing method of other embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Glass substrate, 12 ... Laser beam, 14 ... Alteration area | region, 16 ... Etching mask, 18, 20 ... Opening, 22 ... Through-hole (1st recessed part), 24 ... Groove (2nd recessed part), 100 ... Liquid Drop ejection head

Claims (7)

  1. A manufacturing method of a structure formed by forming a plurality of recesses having different depths on a glass substrate,
    Deterioration extending in the thickness direction of the glass substrate by irradiating the region where the first recess of the glass substrate is to be formed with laser light and scanning the focus of the laser light in the thickness direction of the glass substrate A first step of forming a region;
    A second step of forming an etching mask having an opening for exposing a region where a second recess having a depth smaller than that of the first recess is to be formed on one surface and / or the other surface of the glass substrate;
    Etching the glass substrate, forming the first recess in a region along the altered region and forming the second recess in a region corresponding to the opening of the etching mask; and
    A method for manufacturing a structure including:
  2.   The structure manufacturing method according to claim 1, wherein the first recess is a through hole.
  3.   2. The method of manufacturing a structure according to claim 1, wherein the etching mask in the second step further includes an opening exposing a region corresponding to a formation position of the altered region of the glass substrate.
  4.   The structure manufacturing method according to claim 1, wherein the laser beam irradiated in the first step is a pulsed laser beam.
  5.   The structure manufacturing method according to claim 4, wherein the pulse laser beam is a femtosecond laser beam.
  6.   A droplet discharge head using a structure manufactured by the manufacturing method according to claim 1.
  7. A droplet discharge apparatus comprising the droplet discharge head according to claim 6.

JP2003383629A 2003-11-13 2003-11-13 Method of manufacturing structure, droplet delivery head and droplet delivery device Pending JP2005144586A (en)

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US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
JP2014005172A (en) * 2012-06-25 2014-01-16 Ulvac Seimaku Kk Forming method of through hole and glass substrate with through hole
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
US8685269B2 (en) 2010-07-26 2014-04-01 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
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JP2011051253A (en) * 2009-09-02 2011-03-17 Canon Inc Method of manufacturing substrate for liquid ejection head
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
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US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8541319B2 (en) 2010-07-26 2013-09-24 Hamamatsu Photonics K.K. Laser processing method
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US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
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JP2014005172A (en) * 2012-06-25 2014-01-16 Ulvac Seimaku Kk Forming method of through hole and glass substrate with through hole

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