US20120080167A1 - Heat dissipating apparatus - Google Patents
Heat dissipating apparatus Download PDFInfo
- Publication number
- US20120080167A1 US20120080167A1 US13/155,540 US201113155540A US2012080167A1 US 20120080167 A1 US20120080167 A1 US 20120080167A1 US 201113155540 A US201113155540 A US 201113155540A US 2012080167 A1 US2012080167 A1 US 2012080167A1
- Authority
- US
- United States
- Prior art keywords
- base
- side plate
- heat dissipating
- fins
- dissipating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipating apparatuses.
- a heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated by electronic components in the electronic device.
- the heat dissipating module comprises a cooler and a fan.
- the cooler is secured to an electronic component and comprises a plurality of fins. An airflow path is defined between each two adjacent fins, and the fan is located in the path of the airflow, to remove heat from the electronic device.
- the cooler fixed directly and entirely on the one electronic component, the cooler itself will block airflow to cool the other electronic components behind the cooler, which is inefficient.
- FIG. 1 is an assembled, isometric view of a heat dissipation apparatus and a computer in accordance with one embodiment.
- FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the computer of FIG. 1 .
- FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1 .
- FIG. 4 is an exploded, isometric view of FIG. 3 .
- FIG. 5 is a cross section view of the heat dissipation apparatus of FIG. 3 .
- a heat dissipation apparatus 100 in accordance with an embodiment is secured to a computer 30 .
- the computer 30 includes a bottom plate 31 and a main board 50 .
- the main board 50 is secured to the bottom plate 31 and defines a plurality of positioning holes 53 .
- An electronic component 51 is secured to the main board 50 .
- the main board 50 may be a motherboard, and the electronic component 51 may be a CPU.
- the heat dissipating apparatus 100 includes a cooler 10 , two heat pipes 19 , a fan 20 , and a base 40 .
- the cooler 10 includes a shell 60 and a plurality of fins 16 .
- the shell 60 includes a top plate 13 , a first side plate 15 , and a second side plate 17 .
- the top plate 13 is substantially perpendicular to the first side plate 15 and the second side plate 17
- the first side plate 15 is substantially parallel to the second side plate 17 .
- the first side plate 15 defines two openings 151 and a notch 153 .
- the notch 153 extends from a bottom edge of the first side plate 15 .
- a plurality of mounting pieces 18 extends from a side edge of each of the first side plate 15 and the second side plate 17 . Each mounting piece 18 defines a mounting hole 181 .
- the fins 16 are received in the shell 60 and enclosed by the top plate 13 , the first side plate 15 , and the second side plate 17 .
- Each fin 16 defines two receiving holes 161 , and the receiving holes 161 correspond to the openings 151 .
- Each fin 16 defines two first receiving slots 163 .
- the two first receiving slots 163 correspond to the notch 153 .
- the cross-section of each first receiving slot 163 is semicircular.
- Each heat pipe 19 includes a first body 191 , a second body 193 , and a third body 195 .
- the heat pipes 19 are generally substantially “U” shaped.
- the second body 193 is connected between the first body 191 and the third body 195 .
- a length of the first body 191 is longer than a distance between the first side plate 15 and the second side plate 17
- a length of the third body 195 is substantially equal to the distance between the first side plate 15 and the second side plate 17 .
- a first angle is defined between the first body 191 and the second body 193 . In one embodiment, the first angle is acute. In one embodiment, a cross-section of each heat pipe is round.
- the cooling fan 20 defines a plurality of through holes 21 .
- the base 40 defines two second receiving slots 43 and a plurality of locking holes 41 .
- the locking holes 41 correspond to the positioning holes 53 .
- a cross-section of each second receiving slot 43 is semicircular.
- the cooler 10 is secured to the base 40 , and the first receiving slots 163 are aligned with the second receiving slots 43 .
- the first side plate 15 is secured to the base 40 and located between a first edge of the base 40 and a second edge of the base 40 .
- the second end of the base 40 is substantially parallel to the first edge of the base 40 and located between the second side plate 17 and the first side plate 15 .
- the fins 16 are partially overlapping the base 40 .
- the first body 191 is received in the first receiving slot 163 and the second receiving slot 43 and sandwiched between the base 40 and the fins 16 .
- the third body 195 is inserted through the opening 151 and the receiving holes 161 .
- the second body 193 is located in a corner between the base 40 and the first side plate 15 .
- a second angle is defined between the second body 193 and the third body 195 .
- the second angle is obtuse.
- a plurality of locking members (not labeled), such as screws, is inserted into the locking holes 41 and the corresponding positioning holes 53 , so that the base 40 is secured to the main board 50 on the electronic component 51 .
- heat generated by the electronic component 51 is transferred to the first body 191 by the base 40 .
- the first body 191 transfers the heat along a first direction, which is towards the cooler 10 , and to the second body 193 along a second direction.
- the second body 193 transfers the heat to the fins 16 via the third body 195 .
- the cooling fan 20 removes the heat from the cooler 10 , and the electronic component 51 is cooled thereby.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat dissipating apparatuses.
- 2. Description of Related Art
- A heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated by electronic components in the electronic device. Generally, the heat dissipating module comprises a cooler and a fan. The cooler is secured to an electronic component and comprises a plurality of fins. An airflow path is defined between each two adjacent fins, and the fan is located in the path of the airflow, to remove heat from the electronic device. However, with the cooler fixed directly and entirely on the one electronic component, the cooler itself will block airflow to cool the other electronic components behind the cooler, which is inefficient.
- Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipation apparatus and a computer in accordance with one embodiment. -
FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the computer ofFIG. 1 . -
FIG. 3 is an assembled, isometric view of the heat dissipation apparatus ofFIG. 1 . -
FIG. 4 is an exploded, isometric view ofFIG. 3 . -
FIG. 5 is a cross section view of the heat dissipation apparatus ofFIG. 3 . - The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to
FIG. 1 andFIG. 2 , aheat dissipation apparatus 100 in accordance with an embodiment is secured to acomputer 30. - The
computer 30 includes abottom plate 31 and amain board 50. Themain board 50 is secured to thebottom plate 31 and defines a plurality ofpositioning holes 53. Anelectronic component 51 is secured to themain board 50. In one embodiment, themain board 50 may be a motherboard, and theelectronic component 51 may be a CPU. - Referring to
FIG. 3 andFIG. 4 , theheat dissipating apparatus 100 includes acooler 10, twoheat pipes 19, afan 20, and abase 40. - The
cooler 10 includes ashell 60 and a plurality offins 16. Theshell 60 includes atop plate 13, afirst side plate 15, and asecond side plate 17. In one embodiment, thetop plate 13 is substantially perpendicular to thefirst side plate 15 and thesecond side plate 17, and thefirst side plate 15 is substantially parallel to thesecond side plate 17. Thefirst side plate 15 defines twoopenings 151 and anotch 153. Thenotch 153 extends from a bottom edge of thefirst side plate 15. A plurality ofmounting pieces 18 extends from a side edge of each of thefirst side plate 15 and thesecond side plate 17. Eachmounting piece 18 defines amounting hole 181. Thefins 16 are received in theshell 60 and enclosed by thetop plate 13, thefirst side plate 15, and thesecond side plate 17. Eachfin 16 defines tworeceiving holes 161, and thereceiving holes 161 correspond to theopenings 151. Eachfin 16 defines twofirst receiving slots 163. The twofirst receiving slots 163 correspond to thenotch 153. In one embodiment, the cross-section of each first receivingslot 163 is semicircular. - Each
heat pipe 19 includes afirst body 191, asecond body 193, and athird body 195. In one embodiment, theheat pipes 19 are generally substantially “U” shaped. Thesecond body 193 is connected between thefirst body 191 and thethird body 195. A length of thefirst body 191 is longer than a distance between thefirst side plate 15 and thesecond side plate 17, and a length of thethird body 195 is substantially equal to the distance between thefirst side plate 15 and thesecond side plate 17. A first angle is defined between thefirst body 191 and thesecond body 193. In one embodiment, the first angle is acute. In one embodiment, a cross-section of each heat pipe is round. Thecooling fan 20 defines a plurality of throughholes 21. - The
base 40 defines twosecond receiving slots 43 and a plurality oflocking holes 41. Thelocking holes 41 correspond to thepositioning holes 53. In one embodiment, a cross-section of each second receivingslot 43 is semicircular. - In assembly, the
cooler 10 is secured to thebase 40, and thefirst receiving slots 163 are aligned with thesecond receiving slots 43. Thefirst side plate 15 is secured to thebase 40 and located between a first edge of thebase 40 and a second edge of thebase 40. The second end of thebase 40 is substantially parallel to the first edge of thebase 40 and located between thesecond side plate 17 and thefirst side plate 15. Thefins 16 are partially overlapping thebase 40. Thefirst body 191 is received in thefirst receiving slot 163 and the second receivingslot 43 and sandwiched between thebase 40 and thefins 16. Thethird body 195 is inserted through the opening 151 and the receivingholes 161. Thesecond body 193 is located in a corner between thebase 40 and thefirst side plate 15. A second angle is defined between thesecond body 193 and thethird body 195. In one embodiment, the second angle is obtuse. A plurality of locking members (not labeled), such as screws, is inserted into thelocking holes 41 and thecorresponding positioning holes 53, so that thebase 40 is secured to themain board 50 on theelectronic component 51. - In use, heat generated by the
electronic component 51 is transferred to thefirst body 191 by thebase 40. Thefirst body 191 transfers the heat along a first direction, which is towards the cooler 10, and to thesecond body 193 along a second direction. Thesecond body 193 transfers the heat to thefins 16 via thethird body 195. The coolingfan 20 removes the heat from the cooler 10, and theelectronic component 51 is cooled thereby. - It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102981687A CN102446871A (en) | 2010-09-30 | 2010-09-30 | Heat radiating device |
CN201010298168.7 | 2010-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120080167A1 true US20120080167A1 (en) | 2012-04-05 |
Family
ID=45888785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/155,540 Abandoned US20120080167A1 (en) | 2010-09-30 | 2011-06-08 | Heat dissipating apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120080167A1 (en) |
CN (1) | CN102446871A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021071760A1 (en) * | 2019-10-07 | 2021-04-15 | Nvidia Corporation | Shroud for an integrated circuit heat exchanger |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110459514A (en) * | 2019-09-16 | 2019-11-15 | 刘康 | A kind of single column formula cpu heat |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5978219A (en) * | 1998-03-09 | 1999-11-02 | Lin; Liken | Heat dissipating device |
US20060028798A1 (en) * | 2004-08-06 | 2006-02-09 | Jun-Qian Wang | Heat-radiating device assembly |
US7100681B1 (en) * | 2005-10-31 | 2006-09-05 | Foxconn Technology Co., Ltd. | Heat dissipation device having heat pipe |
US7286353B2 (en) * | 2004-12-04 | 2007-10-23 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating apparatus |
US7363963B2 (en) * | 2004-12-24 | 2008-04-29 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US20080105409A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
-
2010
- 2010-09-30 CN CN2010102981687A patent/CN102446871A/en active Pending
-
2011
- 2011-06-08 US US13/155,540 patent/US20120080167A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5978219A (en) * | 1998-03-09 | 1999-11-02 | Lin; Liken | Heat dissipating device |
US20060028798A1 (en) * | 2004-08-06 | 2006-02-09 | Jun-Qian Wang | Heat-radiating device assembly |
US7286353B2 (en) * | 2004-12-04 | 2007-10-23 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating apparatus |
US7363963B2 (en) * | 2004-12-24 | 2008-04-29 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US7100681B1 (en) * | 2005-10-31 | 2006-09-05 | Foxconn Technology Co., Ltd. | Heat dissipation device having heat pipe |
US20080105409A1 (en) * | 2006-11-03 | 2008-05-08 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021071760A1 (en) * | 2019-10-07 | 2021-04-15 | Nvidia Corporation | Shroud for an integrated circuit heat exchanger |
CN114556040A (en) * | 2019-10-07 | 2022-05-27 | 辉达公司 | Shroud for integrated circuit heat exchanger |
US11523539B2 (en) * | 2019-10-07 | 2022-12-06 | Nvidia Corporation | Shroud for an integrated circuit heat exchanger |
Also Published As
Publication number | Publication date |
---|---|
CN102446871A (en) | 2012-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GAO, WEN-CHANG;FU, JIAN;YAO, ZHI-JIANG;AND OTHERS;REEL/FRAME:026407/0870 Effective date: 20110607 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GAO, WEN-CHANG;FU, JIAN;YAO, ZHI-JIANG;AND OTHERS;REEL/FRAME:026407/0870 Effective date: 20110607 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |