US20110188206A1 - Thermal interface - Google Patents
Thermal interface Download PDFInfo
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- US20110188206A1 US20110188206A1 US13/031,038 US201113031038A US2011188206A1 US 20110188206 A1 US20110188206 A1 US 20110188206A1 US 201113031038 A US201113031038 A US 201113031038A US 2011188206 A1 US2011188206 A1 US 2011188206A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the embodiments of the invention generally relate to cooling electronic apparatuses and systems, including thermal interface material.
- an electronic device may include an integrated circuit (IC) die.
- IC integrated circuit
- a thermal management device may be thermally coupled to the IC die to facilitate dissipation of heat from the IC die.
- the thermal management device may be in the form of a heat sink type device. Accordingly, heat may be transferred from the IC die to the thermal management device, and in turn, the thermal management device facilitates transfer of the heat to the surrounding environment.
- FIG. 1 illustrates an apparatus having an interface comprising a number of nanostructures, in accordance with various embodiments of the invention
- FIG. 2 illustrates an interface having a number of nanostructures, in accordance with one embodiment of the invention
- FIG. 3 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention.
- FIG. 4 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention.
- FIG. 5 illustrates an apparatus having an interface having a number of nanostructures, in accordance with various embodiments of the invention.
- FIG. 6 illustrates one of many possible systems in which embodiments of the present invention may be utilized.
- an apparatus having an interface comprising a number of nanostructures disposed between a thermal management device and a heat source is described.
- various embodiments will be described. However, one skilled in the relevant art will recognize that the various embodiments may be practiced without one or more of the specific details, or with other methods, materials, components, etc.
- well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention.
- specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. Nevertheless, the embodiments of the invention may be practiced without the specific details. In other instances, well-known features are omitted or simplified in order not to obscure the embodiments of the invention.
- the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.
- FIG. 1 illustrates an apparatus having an interface comprising a number of nanostructures, in accordance with various embodiments of the invention. Illustrated in FIG. 1 is cross sectional side like view of an apparatus 100 .
- the apparatus 100 includes a thermal management device 102 , a heat source 104 , and an interface 106 disposed between the thermal management device 102 and the heat source 104 .
- the interface 106 has a number of nanostructures. As will be described in further detail, the interface 106 facilitates at least improved adhesion and thermal conductivity between the thermal management device 102 and the heat source 104 .
- the thermal management device 102 may be part of a passive cooling device such as, but not limited to, a heat sink, a heat spreader, heat pipes, a heat slug, and the like, and any combination thereof.
- the thermal management device 102 may be part of an active cooling device such as, but not limited to, an air jet impingement device, a dielectric liquid device, and any combination thereof.
- the heat source 104 may include an integrated circuit (IC), which may be in the form of a rectangular piece of semiconductor material commonly known as a chip or a die.
- IC integrated circuit
- semiconductor material may include, but are not limited to, silicon, silicon on sapphire, silicon on insulator, gallium arsenide, and any combination thereof.
- FIG. 2 illustrates an interface having a number of nanostructures, in accordance with one embodiment of the invention.
- a detailed view of an interface 206 between a heat source 204 and a thermal management device 202 is shown.
- the interface 206 includes a number of nanostructures 208 .
- the nanostructures 208 may be formed on the heat source 204 , while the thermal management device 202 does not necessarily have nanostructures 208 . Further, the nanostructures 208 are shown extending away from the heat source 204 .
- the nanostructures 208 may comprise of carbon nanotubes. That is, each of the nanostructures 208 may have an approximate diameter of 0.6 to 1.8 nanometers, and a length of approximately 1-100 microns.
- the carbon nanotubes may be single walled, multi-walled, of various shapes, and may be coated with various coatings such as, but not limited to, metals.
- each of the nanostructures 208 may have relatively high heat transmission abilities such as, but not limited to, as high as 6000 Watts per meter Kelvin, thereby facilitating improved heat transfer between the heat source 204 and the thermal management device 202 .
- the nanostructures 208 may be formed from a variety of manners such as, but not limited to, utilizing an arc fullerene generator, chemical vapor deposition (CVD), and laser blasting.
- the nanostructures 208 may facilitate adhesion between the heat source 204 and the thermal management device 202 due to various interactions between the nanostructures 208 and the thermal management device 202 .
- the nanostructures 208 may be attracted to thermal management device 202 , in particular, to the surface of the thermal management device 202 , due to Van der Waals' type forces.
- the nanostructures 208 may have molecules that helps to facilitate adhesion.
- the nanostructures 208 may have molecules in the form of flexible polymers such as, but not limited to, single stranded deoxyribonucleic acid (DNA) molecules.
- the molecules facilitate covalent type bonding between the nanostructures 208 and the thermal management device 202 . Utilization of molecules with various nanostructures such as carbon nanostructures is known, and accordingly, will not be described in further detail.
- the nanostructures 208 may be formed on the heat source 204 .
- the nanostructures 208 may be formed on the heat management device 202 .
- the nanostructures 208 may be formed on both the thermal management device 202 and the heat source 204 .
- the nanostructures 202 are shown substantially extending away from a surface. However, it should be appreciated that the nanostructures 202 may be formed in a variety of directions and manners including, but not limited to, various angles relative to a surface.
- the interface 206 having the nanostructures facilitates improved heat transfer and adhesion between the heat source 204 and the thermal management device 202 .
- FIG. 3 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention.
- an interface 306 between a thermal management device 302 and a heat source 304 , includes a number of nanostructures 308 & 310 .
- the nanostructures 308 & 310 may be formed on both the thermal management device 302 and the heat source 304 .
- the nanostructures 308 & 310 extend away from their respective surfaces (i.e., nanostructures 308 formed on the thermal management device 302 extend toward the nanostructures 310 formed on the heat source 302 .
- the nanostructures 308 formed on the thermal management device 302 may interleave with the nanostructures 310 formed on the heat source 304 .
- the interleaved nanostructures 308 & 310 may be carbon nanotubes like structures, and accordingly, the interleaved nanostructures 308 & 310 may adhere to each other due to various attraction forces such as, but not limited to, Van der Waals' forces as previously described. Additionally, heat transfer between the thermal management device 302 and the heat source 304 may be improved due to the nanostructures 308 & 310 being made of nanostructures having relatively high thermal conductivity.
- the nanostructures 308 & 310 may have molecules that facilitate adhesion, as previously described.
- the nanostructure 308 formed on the thermal management device 302 and/or the nanostructure 310 formed on the heat source 304 may have molecules that facilitate adhesion. That is, the nanostructures 308 & 310 may have molecules in the form of flexible polymers on either or both of the nanostructures 310 formed on the heat source 304 and the nanostructures 308 formed on the thermal management device 302 .
- the molecules facilitate covalent type bonding between the nanostructures 308 & 310 .
- FIG. 4 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention.
- an interface 406 between a thermal management device 402 and a heat source 404 is shown in detail.
- the heat source 404 may have a number of nanostructures 410 that may be disposed in a predetermined manner to further facilitate coupling of a number of nanostructures 408 that may be disposed on the thermal management device 402 . That is, in the embodiment illustrated in FIG.
- the nanostructures 410 on the heat source 404 may be disposed in a pattern to receive the nanostructures 408 on the thermal management device 402 , which may also be in a pattern to be received by the nanostructures 410 on the heat source 404 (e.g., male/female type pattern). Accordingly, the nanostructures 410 on the heat source 404 may be disposed to have recesses 412 while the nanostructures 408 on the thermal management device 402 may be disposed to have protrusions 414 that may be received into the recesses 412 .
- the nanostructures 408 and 410 may be carbon nanotubes like structures, and may also have molecules to facilitate adhesion of the nanostructures 408 and 410 to each other, which in turn, facilitate adhesion of the thermal management device 402 and the heat source 404 .
- FIG. 5 illustrates an apparatus having an interface having a number of nanostructures, in accordance with various embodiments of the invention.
- apparatus 500 may include a heat source 504 thermally coupled to an interface 506 .
- a thermal management device 502 is shown thermally coupled to the interface 506 .
- the thermal management device 502 is shown being thermally coupled to a heat dissipation device 510 .
- Disposed between the heat management device 502 and the heat dissipation device 510 may be a second interface 508 .
- the interface 506 and/or the second interface 508 may be of the type previously described with respect to FIGS. 1-4 or any combination thereof.
- the heat source 504 may be in the form of an IC die, which may include integrated electrical devices and may be fabricated utilizing any suitable material and fabrication methods.
- the heat source may comprise a microprocessor type chip having a silicon type substrate, as previously alluded to.
- the heat source 504 may be electrically coupled to a substrate 520 via a number of solder bumps 522 .
- the substrate 520 may be electrically coupled to a wiring board 524 via solder balls 526 .
- the heat source 504 having the solder bumps 522 , the interface 506 , and the thermal management device 502 may be referred to as a semiconductor package. Accordingly, interfaces 506 and 508 may facilitate heat transfer and adhesion of various components of a semiconductor package.
- the thermal management device 502 may be thermally coupled to the heat dissipation device 510 .
- the heat source 504 may be thermally coupled directly to the heat dissipation device 510 . That is, as previously alluded to, the thermal management device 502 may be a heat dissipations device as well.
- FIG. 6 illustrates one of many possible systems in which embodiments of the present invention may be utilized.
- a system 600 may include apparatus 610 which may be similar to the apparatus 500 shown in FIG. 5 having a heat source, a thermal management device, and an interface between the thermal management device and the heat source, where the interface has a number of nanostructures. Further, the apparatus 610 may be electrically coupled to a wiring board, which in turn, may be electrically coupled to various components.
- a system 600 may include a memory device 612 , a graphic processor 614 , a mass storage device 616 , and an input/output module 618 coupled to each other by way of a bus 620 , as shown.
- memory device 612 include flash type memory, static random access (SRAM) memory, and dynamic random access memory (DRAM).
- mass storage device 616 include, but are not limited to, a hard disk drive, a compact disk drive (CD), a digital versatile drive (DVD), and so forth.
- the input/output modules 618 include, but not limited to, a keyboard, cursor control devices, a display, a network interface, and so forth.
- bus 620 examples include, but not limited to, a peripheral control interface (PCI) bus, and Industry Standard Architecture (ISA) bus, and so forth.
- PCI peripheral control interface
- ISA Industry Standard Architecture
- the system 600 may be a wireless mobile phone, a personal digital assistant, a pocket PC, a tablet PC, a notebook PC, a desktop computer, a set-top box, an entertainment unit, a DVD player, a server, and so forth.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.
Description
- This application is a divisional of U.S. application Ser. No. 12/211,666, filed Sep. 16, 2008, which is a divisional of U.S. application Ser. No. 10/750,488, filed Dec. 31, 2003, now issued as U.S. Pat. No. 7,612,370, which is incorporated herein its entirety by reference.
- The embodiments of the invention generally relate to cooling electronic apparatuses and systems, including thermal interface material.
- As electronic devices become more powerful and smaller (i.e., more densely packed), the power consumed by these electronic devices can result in a large amount of generated heat. The heat generated by these electronic devices may be detrimental to the operation of the electronic devices. Accordingly, a common concern associated with electronic components is heat removal.
- For example, an electronic device may include an integrated circuit (IC) die. A thermal management device may be thermally coupled to the IC die to facilitate dissipation of heat from the IC die. Commonly, the thermal management device may be in the form of a heat sink type device. Accordingly, heat may be transferred from the IC die to the thermal management device, and in turn, the thermal management device facilitates transfer of the heat to the surrounding environment.
- The various embodiments of the invention is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which the like references indicate similar elements and in which:
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FIG. 1 illustrates an apparatus having an interface comprising a number of nanostructures, in accordance with various embodiments of the invention; -
FIG. 2 illustrates an interface having a number of nanostructures, in accordance with one embodiment of the invention; -
FIG. 3 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention; -
FIG. 4 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention; -
FIG. 5 illustrates an apparatus having an interface having a number of nanostructures, in accordance with various embodiments of the invention; and -
FIG. 6 illustrates one of many possible systems in which embodiments of the present invention may be utilized. - In various embodiments, an apparatus having an interface comprising a number of nanostructures disposed between a thermal management device and a heat source is described. In the following description, various embodiments will be described. However, one skilled in the relevant art will recognize that the various embodiments may be practiced without one or more of the specific details, or with other methods, materials, components, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention. Similarly, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. Nevertheless, the embodiments of the invention may be practiced without the specific details. In other instances, well-known features are omitted or simplified in order not to obscure the embodiments of the invention. Furthermore, it is understood that the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.
- Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment or invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.
- Various operations will be described as multiple discrete operations in turn, in a manner that is most helpful in understanding the embodiments of the invention. However, the order of description should not be construed as to imply that these operations are necessarily order dependent. In particular, these operations need not be performed in the order of presentation.
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FIG. 1 illustrates an apparatus having an interface comprising a number of nanostructures, in accordance with various embodiments of the invention. Illustrated inFIG. 1 is cross sectional side like view of anapparatus 100. InFIG. 1 , theapparatus 100 includes athermal management device 102, aheat source 104, and aninterface 106 disposed between thethermal management device 102 and theheat source 104. In accordance with various embodiments, theinterface 106 has a number of nanostructures. As will be described in further detail, theinterface 106 facilitates at least improved adhesion and thermal conductivity between thethermal management device 102 and theheat source 104. - In various embodiments, the
thermal management device 102 may be part of a passive cooling device such as, but not limited to, a heat sink, a heat spreader, heat pipes, a heat slug, and the like, and any combination thereof. Alternatively, in various embodiments, thethermal management device 102 may be part of an active cooling device such as, but not limited to, an air jet impingement device, a dielectric liquid device, and any combination thereof. - In various embodiments, the
heat source 104 may include an integrated circuit (IC), which may be in the form of a rectangular piece of semiconductor material commonly known as a chip or a die. Some examples of semiconductor material may include, but are not limited to, silicon, silicon on sapphire, silicon on insulator, gallium arsenide, and any combination thereof. -
FIG. 2 illustrates an interface having a number of nanostructures, in accordance with one embodiment of the invention. InFIG. 2 , a detailed view of aninterface 206 between aheat source 204 and athermal management device 202 is shown. Theinterface 206 includes a number ofnanostructures 208. In the embodiment illustrated, thenanostructures 208 may be formed on theheat source 204, while thethermal management device 202 does not necessarily havenanostructures 208. Further, thenanostructures 208 are shown extending away from theheat source 204. - In various embodiments, the
nanostructures 208 may comprise of carbon nanotubes. That is, each of thenanostructures 208 may have an approximate diameter of 0.6 to 1.8 nanometers, and a length of approximately 1-100 microns. The carbon nanotubes may be single walled, multi-walled, of various shapes, and may be coated with various coatings such as, but not limited to, metals. Accordingly, each of thenanostructures 208 may have relatively high heat transmission abilities such as, but not limited to, as high as 6000 Watts per meter Kelvin, thereby facilitating improved heat transfer between theheat source 204 and thethermal management device 202. Further, thenanostructures 208 may be formed from a variety of manners such as, but not limited to, utilizing an arc fullerene generator, chemical vapor deposition (CVD), and laser blasting. - Continuing to refer to
FIG. 2 , in the illustrated embodiment, thenanostructures 208 may facilitate adhesion between theheat source 204 and thethermal management device 202 due to various interactions between thenanostructures 208 and thethermal management device 202. For example, thenanostructures 208 may be attracted tothermal management device 202, in particular, to the surface of thethermal management device 202, due to Van der Waals' type forces. - In various embodiments, the
nanostructures 208 may have molecules that helps to facilitate adhesion. For example, in one embodiment, thenanostructures 208 may have molecules in the form of flexible polymers such as, but not limited to, single stranded deoxyribonucleic acid (DNA) molecules. The molecules facilitate covalent type bonding between thenanostructures 208 and thethermal management device 202. Utilization of molecules with various nanostructures such as carbon nanostructures is known, and accordingly, will not be described in further detail. - In the embodiment illustrated in
FIG. 2 , thenanostructures 208 may be formed on theheat source 204. However, in alternate embodiments, thenanostructures 208 may be formed on theheat management device 202. Further, as will be described in detail, thenanostructures 208 may be formed on both thethermal management device 202 and theheat source 204. Additionally, thenanostructures 202 are shown substantially extending away from a surface. However, it should be appreciated that thenanostructures 202 may be formed in a variety of directions and manners including, but not limited to, various angles relative to a surface. - As a result, the
interface 206 having the nanostructures facilitates improved heat transfer and adhesion between theheat source 204 and thethermal management device 202. -
FIG. 3 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention. As shown inFIG. 3 , aninterface 306, between athermal management device 302 and aheat source 304, includes a number ofnanostructures 308 & 310. In the illustrated embodiment, thenanostructures 308 & 310 may be formed on both thethermal management device 302 and theheat source 304. Further, thenanostructures 308 & 310 extend away from their respective surfaces (i.e.,nanostructures 308 formed on thethermal management device 302 extend toward thenanostructures 310 formed on theheat source 302. As shown, thenanostructures 308 formed on thethermal management device 302 may interleave with thenanostructures 310 formed on theheat source 304. - The interleaved
nanostructures 308 & 310 may be carbon nanotubes like structures, and accordingly, the interleavednanostructures 308 & 310 may adhere to each other due to various attraction forces such as, but not limited to, Van der Waals' forces as previously described. Additionally, heat transfer between thethermal management device 302 and theheat source 304 may be improved due to thenanostructures 308 & 310 being made of nanostructures having relatively high thermal conductivity. - In various embodiments, the
nanostructures 308 & 310 may have molecules that facilitate adhesion, as previously described. For example, thenanostructure 308 formed on thethermal management device 302 and/or thenanostructure 310 formed on theheat source 304 may have molecules that facilitate adhesion. That is, thenanostructures 308 & 310 may have molecules in the form of flexible polymers on either or both of thenanostructures 310 formed on theheat source 304 and thenanostructures 308 formed on thethermal management device 302. As previously described, the molecules facilitate covalent type bonding between thenanostructures 308 & 310. -
FIG. 4 illustrates an interface having a number of nanostructures, in accordance with another embodiment of the invention. InFIG. 4 , aninterface 406 between athermal management device 402 and aheat source 404 is shown in detail. As shown inFIG. 4 , theheat source 404 may have a number ofnanostructures 410 that may be disposed in a predetermined manner to further facilitate coupling of a number ofnanostructures 408 that may be disposed on thethermal management device 402. That is, in the embodiment illustrated inFIG. 4 , thenanostructures 410 on theheat source 404 may be disposed in a pattern to receive thenanostructures 408 on thethermal management device 402, which may also be in a pattern to be received by thenanostructures 410 on the heat source 404 (e.g., male/female type pattern). Accordingly, thenanostructures 410 on theheat source 404 may be disposed to haverecesses 412 while thenanostructures 408 on thethermal management device 402 may be disposed to haveprotrusions 414 that may be received into therecesses 412. - The
nanostructures nanostructures thermal management device 402 and theheat source 404. -
FIG. 5 illustrates an apparatus having an interface having a number of nanostructures, in accordance with various embodiments of the invention. InFIG. 5 ,apparatus 500 may include aheat source 504 thermally coupled to aninterface 506. Additionally, athermal management device 502 is shown thermally coupled to theinterface 506. In turn, thethermal management device 502 is shown being thermally coupled to aheat dissipation device 510. Disposed between theheat management device 502 and theheat dissipation device 510 may be asecond interface 508. Theinterface 506 and/or thesecond interface 508 may be of the type previously described with respect toFIGS. 1-4 or any combination thereof. In the illustrated embodiment, theheat source 504 may be in the form of an IC die, which may include integrated electrical devices and may be fabricated utilizing any suitable material and fabrication methods. In various embodiments, the heat source may comprise a microprocessor type chip having a silicon type substrate, as previously alluded to. - The
heat source 504 may be electrically coupled to asubstrate 520 via a number of solder bumps 522. Thesubstrate 520 may be electrically coupled to awiring board 524 viasolder balls 526. In the illustrated embodiment ofFIG. 5 , theheat source 504 having the solder bumps 522, theinterface 506, and thethermal management device 502 may be referred to as a semiconductor package. Accordingly, interfaces 506 and 508 may facilitate heat transfer and adhesion of various components of a semiconductor package. - Illustrated in
FIG. 5 , thethermal management device 502 may be thermally coupled to theheat dissipation device 510. However, it should be appreciated by those skilled in the relevant art that theheat source 504 may be thermally coupled directly to theheat dissipation device 510. That is, as previously alluded to, thethermal management device 502 may be a heat dissipations device as well. -
FIG. 6 illustrates one of many possible systems in which embodiments of the present invention may be utilized. InFIG. 6 , asystem 600 may includeapparatus 610 which may be similar to theapparatus 500 shown inFIG. 5 having a heat source, a thermal management device, and an interface between the thermal management device and the heat source, where the interface has a number of nanostructures. Further, theapparatus 610 may be electrically coupled to a wiring board, which in turn, may be electrically coupled to various components. - In the illustrated embodiment of
FIG. 6 , asystem 600 may include amemory device 612, agraphic processor 614, amass storage device 616, and an input/output module 618 coupled to each other by way of abus 620, as shown. Examples ofmemory device 612 include flash type memory, static random access (SRAM) memory, and dynamic random access memory (DRAM). Examples ifmass storage device 616 include, but are not limited to, a hard disk drive, a compact disk drive (CD), a digital versatile drive (DVD), and so forth. Examples of the input/output modules 618 include, but not limited to, a keyboard, cursor control devices, a display, a network interface, and so forth. Examples ofbus 620 include, but not limited to, a peripheral control interface (PCI) bus, and Industry Standard Architecture (ISA) bus, and so forth. In various embodiments, thesystem 600 may be a wireless mobile phone, a personal digital assistant, a pocket PC, a tablet PC, a notebook PC, a desktop computer, a set-top box, an entertainment unit, a DVD player, a server, and so forth. - Having described and illustrated the principles of the embodiments of the invention with reference to illustrated embodiments, it will be recognized that the illustrated embodiments can be modified in arrangement and detail without departing from such principles. And, though the foregoing discussion has focused on particular embodiments, other configurations are contemplated. In particular, even though expressions such as “in one embodiment,” “in another embodiment,” or the like are used herein, these phrases are meant to generally reference embodiment possibilities, and are not intended to limit the embodiments of the invention to particular embodiment configurations. As used herein, these terms may reference the same or different embodiments that are combinable into other embodiments.
- Thus, it can be seen from the above descriptions, a novel apparatus including an interface between a heat source and a thermal management device having a number of nanostructures has been described.
- The above description of illustrated embodiments of the invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the embodiments of the invention to the precise forms disclosed. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize. Thus, the description is to be regarded as illustrative instead of restrictive on the embodiments of the invention.
- Consequently, in view of the wide variety of permutations to the embodiments described herein, this detailed description is intended to be illustrative only, and should not be taken as limiting the scope of the invention. What is claimed as the embodiments of the invention, therefore, is all such modifications as may come within the scope and spirit of the following claims and equivalents thereto.
Claims (16)
1. An apparatus comprising:
a thermal management device;
a heat source; and
first nanostructures and second nanostructures disposed between the thermal management device and the heat source, the first nanostructures including protrusions, and the second nanostructures including recesses to receive the protrusions.
2. The apparatus of claim 1 , wherein at least one of the first and second nanostructures include carbon nanotubes.
3. The apparatus of claim 1 , at least one of the first and second nanostructures include deoxyribonucleic acid (DNA) molecules.
4. The apparatus of claim 1 , wherein at least one nanostructure of the first nanostructures has a diameter of 0.6 to 1.8 nanometers.
5. The apparatus of claim 1 , wherein at least one of the first and second nanostructures include molecules covalently coupling the first nanostructures and second nanostructures.
6. The apparatus of claim 4 , wherein the molecules include a flexible polymer molecule.
7. The apparatus of claim 1 , wherein the heat source includes an integrated circuit die.
8. The apparatus of claim 7 , further comprising a heat dissipation device coupled to the thermal management device.
9. The apparatus of claim 8 , further comprising:
a board; and
solder coupled between the board and the substrate.
10. The apparatus of claim 9 , wherein the thermal management device forms an enclosure over the substrate to enclose the heat source.
11. A method comprising:
forming a thermal management device;
forming a heat source; and
forming first nanostructures and second nanostructures disposed between the thermal management device and the heat source, the first nanostructures including protrusions, and the second nanostructures including recesses to receive the protrusions.
12. The method of claim 11 , wherein forming one of the first and second nanostructures includes forming carbon nanotubes.
13. The method of claim 11 , wherein forming at least one of the first and second nanostructures includes forming deoxyribonucleic acid (DNA) molecules in at least one of the first and second nanostructures.
14. The method of claim 11 , wherein at least one of the first and second nanostructures is formed by using an arc fullerene generator.
15. The method of claim 11 , wherein at least one of the first and second nanostructures is forming by using chemical vapor deposition.
16. The method of claim 11 , wherein at least one of the first and second nanostructures is forming by using laser blasting.
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US13/031,038 US20110188206A1 (en) | 2003-12-31 | 2011-02-18 | Thermal interface |
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US13/031,038 Abandoned US20110188206A1 (en) | 2003-12-31 | 2011-02-18 | Thermal interface |
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US7893432B2 (en) | 2011-02-22 |
US7612370B2 (en) | 2009-11-03 |
US20050145367A1 (en) | 2005-07-07 |
US20090065176A1 (en) | 2009-03-12 |
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