US20110184099A1 - Partially aromatic moulding compositions and their uses - Google Patents
Partially aromatic moulding compositions and their uses Download PDFInfo
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- US20110184099A1 US20110184099A1 US13/014,303 US201113014303A US2011184099A1 US 20110184099 A1 US20110184099 A1 US 20110184099A1 US 201113014303 A US201113014303 A US 201113014303A US 2011184099 A1 US2011184099 A1 US 2011184099A1
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- United States
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- weight
- composition according
- moulding composition
- component
- polyamide moulding
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 109
- 238000000465 moulding Methods 0.000 title claims abstract description 84
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 19
- 239000004952 Polyamide Substances 0.000 claims abstract description 82
- 229920002647 polyamide Polymers 0.000 claims abstract description 82
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims abstract description 81
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 40
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims abstract description 40
- 150000004985 diamines Chemical class 0.000 claims abstract description 33
- 239000003063 flame retardant Substances 0.000 claims abstract description 27
- 239000000945 filler Substances 0.000 claims abstract description 25
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims abstract description 19
- 239000012779 reinforcing material Substances 0.000 claims abstract description 16
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 239000003365 glass fiber Substances 0.000 claims description 25
- 238000010521 absorption reaction Methods 0.000 claims description 19
- 229920000877 Melamine resin Polymers 0.000 claims description 15
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 15
- -1 amorphous silicas Substances 0.000 claims description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 13
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 10
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 10
- 230000004927 fusion Effects 0.000 claims description 8
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 239000007859 condensation product Substances 0.000 claims description 6
- 229910052615 phyllosilicate Inorganic materials 0.000 claims description 6
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 claims description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 claims description 3
- 241000219112 Cucumis Species 0.000 claims description 3
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 claims description 3
- 239000004609 Impact Modifier Substances 0.000 claims description 3
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 3
- 239000001095 magnesium carbonate Substances 0.000 claims description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 239000010433 feldspar Substances 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004571 lime Substances 0.000 claims description 2
- 239000000314 lubricant Substances 0.000 claims description 2
- 239000012764 mineral filler Substances 0.000 claims description 2
- 239000002667 nucleating agent Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000010456 wollastonite Substances 0.000 claims description 2
- 229910052882 wollastonite Inorganic materials 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 21
- 230000009102 absorption Effects 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 11
- 239000005357 flat glass Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 6
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920000388 Polyphosphate Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 150000004679 hydroxides Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 239000001205 polyphosphate Substances 0.000 description 3
- 235000011176 polyphosphates Nutrition 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- GLBHAWAMATUOBB-UHFFFAOYSA-N 6,6-dimethylheptane-1,1-diamine Chemical group CC(C)(C)CCCCC(N)N GLBHAWAMATUOBB-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 101000889450 Homo sapiens Trefoil factor 2 Proteins 0.000 description 2
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 102100039172 Trefoil factor 2 Human genes 0.000 description 2
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 2
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011667 zinc carbonate Substances 0.000 description 2
- 229910000010 zinc carbonate Inorganic materials 0.000 description 2
- 235000004416 zinc carbonate Nutrition 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 description 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- QUBNFZFTFXTLKH-UHFFFAOYSA-N 2-aminododecanoic acid Chemical compound CCCCCCCCCCC(N)C(O)=O QUBNFZFTFXTLKH-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 0 C.C.[1*]P(=O)(O)[3*]P([2*])(=O)O.[1*]P([2*])(=O)O Chemical compound C.C.[1*]P(=O)(O)[3*]P([2*])(=O)O.[1*]P([2*])(=O)O 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 1
- XTUVJUMINZSXGF-UHFFFAOYSA-N N-methylcyclohexylamine Chemical compound CNC1CCCCC1 XTUVJUMINZSXGF-UHFFFAOYSA-N 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- PLZVEHJLHYMBBY-UHFFFAOYSA-N Tetradecylamine Chemical compound CCCCCCCCCCCCCCN PLZVEHJLHYMBBY-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid group Chemical group C(CCCCC(=O)O)(=O)O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229920006020 amorphous polyamide Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- JYYOBHFYCIDXHH-UHFFFAOYSA-N carbonic acid;hydrate Chemical class O.OC(O)=O JYYOBHFYCIDXHH-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- ZIWYFFIJXBGVMZ-UHFFFAOYSA-N dioxotin hydrate Chemical compound O.O=[Sn]=O ZIWYFFIJXBGVMZ-UHFFFAOYSA-N 0.000 description 1
- ZOIVSVWBENBHNT-UHFFFAOYSA-N dizinc;silicate Chemical compound [Zn+2].[Zn+2].[O-][Si]([O-])([O-])[O-] ZOIVSVWBENBHNT-UHFFFAOYSA-N 0.000 description 1
- HCMLYDUDDKQQQA-UHFFFAOYSA-N dodec-1-ene-1,12-diamine Chemical compound NCCCCCCCCCCC=CN HCMLYDUDDKQQQA-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- XTBMQKZEIICCCS-UHFFFAOYSA-N hexane-1,5-diamine Chemical compound CC(N)CCCCN XTBMQKZEIICCCS-UHFFFAOYSA-N 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- OBQVOBQZMOXRAL-UHFFFAOYSA-L magnesium;docosanoate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O OBQVOBQZMOXRAL-UHFFFAOYSA-L 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000004682 monohydrates Chemical class 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- ITZPOSYADVYECJ-UHFFFAOYSA-N n'-cyclohexylpropane-1,3-diamine Chemical compound NCCCNC1CCCCC1 ITZPOSYADVYECJ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920006119 nylon 10T Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- MLCHBQKMVKNBOV-UHFFFAOYSA-N phenylphosphinic acid Chemical compound OP(=O)C1=CC=CC=C1 MLCHBQKMVKNBOV-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- MQOCIYICOGDBSG-UHFFFAOYSA-M potassium;hexadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCC([O-])=O MQOCIYICOGDBSG-UHFFFAOYSA-M 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Definitions
- the present invention relates to polyamide moulding compositions based on a terephthalic acid copolyamide and processes for preparing them and uses thereof.
- Partially aromatic polyamides of the PA6T/6I type as are described in U.S. Pat. No. 4,607,073, have a reduced water absorption and high melting points compared to the aliphatic polyamides PA6, PA66 and PA46. Even as raw polymer, they can be readily soldered. However, the content of halogen-free flame retardants is problematical because of the limited thermal stability of the flame retardant. Low pressures and long flow lengths in injection moulding are possible only at very high melt temperatures at which degradation of the polyamide begins to occur. Processing is extremely problematical because of the narrow processing window.
- Partially aromatic polyamides of the PA6T/66 type as described in JP-B-2928325 have high melting points but excessively high water absorptions. They can be soldered only in the dry state and achieve a maximum moisture sensitivity level (SML in accordance with Joint Industry Standard IPC/JEDEC J-STD-020D.1) of 2. They can be conditioned at 85° C. and 60% relative humidity for a maximum of 168 hours before soldering. This generally means that the electronic components made of these materials do not have an unlimited storage life and have to be packed in a moisture-tight manner until they are soldered.
- SML moisture sensitivity level
- IPC/JEDEC J-STD-020D.1 Joint Industry Standard
- EP 1 988 113 describes polyamides which have from 40 to 95 mol % of 10T units formed by the monomers 1,10-decanediamine and terephthalic acid and from 5 to 60 mol % of 6T units formed by the monomers 1,6-hexanediamine and terephthalic acid. These polyamides have high heat distortion resistances, good processability, low water absorption, unchanged mechanical properties after water absorption, good surface quality of the glass fibre-reinforced products and high dimensional stability. The solderability at 260° C. after absorption is significantly better than that of partially aromatic polyamides of the PA6T/66 type, but the solderability of the electrical and electronic components made of PA10T/6T is marginal, i.e.
- U.S. Pat. No. 4,617,342 discloses crystalline polyamides which are obtained on the basis of terephthalic acid and isophthalic acid in a ratio of 80:20-99:1 and hexamethylenediamine (HMDA) and trimethylhexamethylenediamine (THMDA) in a molar ratio in the range from 98:2-60:40.
- Applications proposed for such polyamides are components having a high heat resistance, for example in the engine region of automobiles.
- This document speaks exclusively of a combination of HMDA and THMDA, and in the examples the proportion of THMDA present alongside hexamethylenediamine is low, in the region of 5-7 mol %.
- the object here is to provide polyphthalamides which have an increased strength.
- the TPA content is set to at least 80 mol %.
- this measure leads to these materials being very difficult to produce and process.
- part of the HMDA is replaced by TMHMDA.
- This branched C9-diamine increases the concentration of amorphous domains, so that the moulding compositions become manageable again as a result of the lower crystallinity.
- these systems are not suitable for soldering applications.
- GB 1228761 discloses completely amorphous polyamides based on terephthalic acid and isophthalic acid in which the proportion of isophthalic acid is high.
- the diamine isophoronediamine, a C9-diamine, which must be used in this document can be compared in terms of its effect with TMHMDA.
- the concentration of IPA is at least 50 mol % in all examples. Such moulding compositions cannot be soldered and clearly do not have the required mechanical properties.
- EP 1795632 discloses a polyamide which can be obtained on the basis of a variety of starting materials.
- Diamines mentioned are, inter alia, C9-diamines including 1,9-nonanediamine and 1,8-methyloctanediamine.
- these diamines are reacted in combination with HMDA with TPA and IPA.
- polyamide moulding compositions should:
- polyamide moulding compositions containing copolyamides comprising terephthalic acid (TPA), isophthalic acid (IPA), 1,6-hexanediamine (HMDA) and a further aliphatic diamine having from 9 to 12 carbon atoms (C9-C12-diamine), with a defined content of C9-C12-diamine, particularly preferably of aliphatic, unbranched C9-C12 diamine, and isophthalic acid being adhered to.
- TPA terephthalic acid
- IPA isophthalic acid
- HMDA 1,6-hexanediamine
- C9-C12-diamine further aliphatic diamine having from 9 to 12 carbon atoms
- These copolyamides preferably have a melting point in the range from 300 to 330° C., a high crystallinity, a glass transition temperature which is preferably in the range from 110 to 140° C.
- solderability for definition see below
- the solderability is defined as relative proportion of the positively tested rods of three different thicknesses without blisters under 6 different test conditions after conditioning for 168 hours at 85° C. and 85% relative humidity in accordance with Joint Industry Standard IPC/JEDEC J-STD-020D.1.
- the compounds preferably contain, in addition to the polyamide matrix, fillers and/or reinforcing materials and/or flame retardants and also additives.
- polyamide moulding composition having the following composition is provided by the present invention:
- the C9-C12-diamine is a diamine selected from the group consisting of: 1,9-nonanediamine, methyl-1,8-cctanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, or a mixture of such diamines, with 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine or a mixture of such diamines being preferred, 1,10-decanediamine and 1,12-dodecanediamine being particularly preferred and 1,10-decanediamine alone being especially preferred.
- the diamine fraction of component (A) is preferably composed of
- HMDA 1,6-hexanediamine
- C9-C12-diamine in particular aliphatic, unbranched C9-C12-diamine.
- the diamine fraction of component (A) is more preferably composed of 55.0-70.0% by weight of 1,6-hexanediamine(HMDA) and 30.0-45.0% by weight of C9-C12-diamine, in particular aliphatic, unbranched C9-C12-diamine.
- the proportion of C9-C12-diamines and the proportion of isophthalic acid are present in a particular ratio to one another. Specifically, this means that in this preferred embodiment, the diacid fraction of the component (A) is composed of
- terephthalic acid TPA
- IPA isophthalic acid
- content of isophthalic acid is always at least 1.7% by weight.
- the content of isophthalic acid is in the range 20-30% by weight.
- the content of isophthalic acid is in the range 9.5-19.5% by weight.
- the content of isophthalic acid is in the range 1.7-9.7% by weight.
- the range is +/ ⁇ 3% by weight, particularly preferably +/ ⁇ 2% by weight.
- polyamides having a C9-C12-diamine content in particular an aliphatic, unbranched C9-C12-diamine content, of from 20 to 49% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 5% by weight based on the sum of the diacids, with the content of IPA always being at least 1.7% by weight.
- copolyamides polyamide matrix
- polyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 5% by weight based on the sum of the diacids.
- a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 5% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 3% by weight based on the sum of the diacids.
- a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 3% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 2% by weight based on the sum of the diacids.
- a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 2% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 3% by weight based on the sum of the diacids.
- a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 3% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 2% by weight based on the sum of the diacids.
- a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39 ⁇ 0.7*C9-C12-diamine) ⁇ 2% by weight based on the sum of the diacids.
- the proportion of component (B) is in the range 20-65% by weight.
- the partially aromatic, partially crystalline copolyamide (component (A)) has a solution viscosity ⁇ rel , measured in m-cresol (0.5% by weight, 20° C.), of not more than 2.0, preferably not more than 1.9, in particular not more than 1.8. Preference is given to copolyamides having a solution viscosity ⁇ rel in the range from 1.45 to 2.0, in particular in the range from 1.5 to 1.9 or from 1.5 to 1.8.
- the copolyamides (component A) preferably have a glass transition temperature in the range from 110 to 140° C., preferably in the range from 115 to 135° C. and in particular in the range from 120 to 130° C.
- the melting point is preferably in the range from 300 to 330° C., more preferably in the range from 305 to 325° C. and in particular in the range from 310 to 325° C.
- the enthalpy of fusion of the copolyamides is preferably in the range from 30 to 60 J/g, more preferably in the range from 35 to 60 J/g and particularly preferably in the range from 40 to 60 J/g.
- compositions are preferably formulated so that the component (A) and/or the entire polyamide moulding composition has a water absorption of less than 5% by weight, preferably less than 4% by weight, e.g. after 336 hours in water at 95° C.
- aromatic dicarboxylic acids in the component (A) can be replaced by aliphatic dicarboxylic acids having from 10 to 36 carbon atoms.
- Preferred aliphatic diacids are sebacic acid and dodecanedioic acid.
- diamines up to 8% by weight, preferably up to 5% by weight and particularly preferably up to 3% by weight, of the diamines can be replaced by 1,4-butanediamine, 1,5-pentanediamine, methyl-1,5-pentanediamine, bis(aminomethyl)cyclohexane, bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), m-xylylenediamine (MXDA) or p-xylylenediamine (PXDA).
- 1,4-butanediamine 1,5-pentanediamine, methyl-1,5-pentanediamine, bis(aminomethyl)cyclohexane, bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), m-xylylenediamine
- component (A) Based on the sum of diamines and diacids, up to 5% by weight of lactams or aminocarboxylic acids, in particular laurolactam or aminolauric acid, can be present in component (A).
- component (A) is formed exclusively by the aromatic diacids TPA and IPA and the diamines 1,6-hexanediamine and at least one C9-C12-diamine, in particular 1,10-decanediamine.
- the fillers and reinforcing materials of the component (B) are fibres, in particular glass fibres and/or carbon fibres, with particular preference being given to using short fibres, preferably having a length in the range 2-50 mm and a diameter of from 5 to 40 ⁇ m, and/or continuous fibres and in particular fibres having a circular and/or noncircular cross-sectional area, with in the latter case the length ratio of the main cross-sectional axis to the secondary cross-sectional axis preferably being >2, preferably in the range 2-8, particularly preferably in the range 2-5.
- glass fibres having a noncircular cross-sectional area and a length ratio of the main cross-sectional axis to the secondary cross-sectional axis of more than 2, preferably from 2 to 8, in particular from 2 to 5.
- These glass fibres known as flat glass fibres, have an oval, elliptical, elliptical provided with constriction(s) (known as cocoon fibres), rectangular or virtually rectangular cross-sectional area.
- the flat glass fibres having a noncircular cross-sectional area which are used according to the invention are preferably used as short glass fibres (cut glass having a length of from 0.2 to 20 mm, preferably 2-12 mm).
- a further characterizing feature of the flat glass fibres used is that the length of the main cross-sectional axis is preferably in the range from 6 to 40 ⁇ m, in particular in the range from 15 to 30 ⁇ m, and the length of the secondary cross-sectional axis is in the range from 3 to 20 ⁇ m, in particular in the range from 4 to 10 ⁇ m.
- the reinforcing fibres preferably comprise predominantly (i.e., for example, to an extent of 80% by weight or even more than 90% by weight) flat glass fibres or even exclusively flat glass fibres.
- the glass fibres which are used according to the invention as rovings (filler component B) have a diameter of from 10 to 20 ⁇ m, preferably from 12 to 18 ⁇ m, with the cross section of the glass fibres being able to be round, oval, elliptical, virtually rectangular or rectangular. Particular preference is given to flat glass fibres having a ratio of the cross-sectional axes of from 2 to 5.
- E-glass fibres are used according to the invention.
- the polyamide moulding compositions of the invention can be produced by the known methods for producing long fibre-reinforced rod-shaped pellets, in particular by pultrusion processes in which the continuous fibre roving is completely impregnated with the polymer melt and is subsequently cooled and cut.
- the long fibre-reinforced rod-shaped pellets obtained in this way which preferably have a pellet length of from 3 to 25 mm, in particular from 4 to 12 mm, can be processed further to produce mouldings by the customary processing methods (e.g. injection moulding, pressing).
- the continuous carbon fibres used in the pultrusion process have a diameter of from 5 to 10 ⁇ m (microns), preferably from 6 to 8 ⁇ m.
- the fibres can be coated with chemically different layers which are known for glass fibres and carbon fibres in the prior art.
- the glass fibre itself can, depending on the shape of the cross-sectional area and length of the fibre, be selected from the group consisting of E-glass fibres, A-glass fibres, C-glass fibres, D-glass fibres, M-glass fibres, S-glass fibres and R-glass fibres, with preference being given to E-glass fibres.
- the fillers and reinforcing materials of the component (B) can also be particulate fillers or a mixture of fibres and particulate fillers.
- the fillers can also have been surface-treated.
- the polyamide moulding composition is characterized in that the proportion of component (C) is in the range 8-25% by weight, preferably in the range 10-22% by weight, particularly preferably in the range 10-18% by weight.
- the component (C) is preferably composed of 60-100% by weight, preferably 70-98% by weight, particularly preferably 80-96% by weight, of a phosphinic acid salt and/or diphosphinic acid salt and 0-40% by weight, or 2-30% by weight, or 4-20% by weight, of a nitrogen-containing synergist and/or a nitrogen- and/or phosphorus-containing flame retardant, with the latter preferably being selected from among melamine and condensation products of melamine, in particular melem, melam, melon, and reaction products of melamine with polyphosphoric acid and reaction products of condensation products of melamine with polyphosphoric acid and mixtures thereof, in particular melamine polyphosphate.
- the moulding composition of the invention thus additionally contains, in a further embodiment, 8-25% by weight, preferably 10-22% by weight and in particular 10-18% by weight, of a flame retardant, (as part of the component (C) or forming the entire component (C)).
- the flame retardant is preferably halogen-free.
- the flame retardant in the component (C) or forming the entire component (C) preferably comprises 60-100% by weight, more preferably 70-98% by weight, in particular 80-96% by weight, of a phosphinic acid salt and/or diphosphinic acid salt (component (C1)) and 0-40% by weight, preferably 2-30% by weight, in particular 4-20% by weight, of a nitrogen-containing synergist and/or a nitrogen- and phosphorus-containing flame retardant (component (C2)).
- Component (C2) is preferably melamine or condensation products of melamine, e.g. melem, melam, melon, or reaction products of melamine with polyphosphoric acid or reaction products of condensation products of melamine with polyphosphoric acid or mixtures thereof.
- component (C2) particular preference is given to melamine polyphosphate.
- Such flame retardants are known from the prior art.
- component (C1) preference is given to using a phosphinic acid salt of the general formula I and/or formula (II) and/or polymers thereof
- metal ion M preference is given to using Al, Ca, Ba and Zn.
- Suitable compounds are selected from the group consisting of the oxides, hydroxides, carbonates, silicates, borates, phosphates, stannates and combinations or mixtures of these compounds, e.g. oxide hydroxides or oxide hydroxide carbonates.
- Examples are magnesium oxide, calcium oxide, aluminium oxide, zinc oxide, magnesium hydroxide, aluminium hydroxide, boehmite, dihydrotalcite, hydrocalumite, calcium hydroxide, tin oxide hydrate, zinc hydroxide, zinc borate, zinc sulphide, zinc phosphate, zinc carbonate, calcium carbonate, calcium phosphate, magnesium carbonate, basic zinc silicate, zinc stannate, calcium stearate, zinc stearate, magnesium stearate, barium stearate, potassium palmitate, magnesium behenate.
- the moulding composition is given an UL classification of V0 for 0.8 mm thick test specimens (UL-94, test in accordance with the standards of Underwriters Laboratories (U.L.), cf. www.ulstandards.com).
- copolyamides of the invention achieve the fire protection classification “V0” even without addition of synergist (C2).
- the flame retardant added is therefore preferably made up exclusively of the components C1 and C3 together.
- the moulding compositions can contain stabilizers, processing aids and impact modifiers and also further additives.
- the moulding compositions of the invention can also contain further additives (D) such as additives from the group consisting of inorganic stabilizers, organic stabilizers, lubricants, dyes, nucleating agents, metallic pigments, metal flakes, metal-coated particles, impact modifiers, antistatics, conductivity additives, mould release agents, optical brighteners, natural sheet silicates, synthetic sheet silicates or mixtures of the additives mentioned.
- additives from the group consisting of inorganic stabilizers, organic stabilizers, lubricants, dyes, nucleating agents, metallic pigments, metal flakes, metal-coated particles, impact modifiers, antistatics, conductivity additives, mould release agents, optical brighteners, natural sheet silicates, synthetic sheet silicates or mixtures of the additives mentioned.
- antistatics it is possible to use, for example, carbon black and/or carbon nanotubes in the moulding compositions of the invention. However, the use of carbon black can also serve to improve the black coloration of the moulding composition.
- sheet silicates it is possible to use, for example, kaolins, serpentines, talc, mica, vermiculites, illites, smectites, montmorillonite, hectorite, double hydroxides or mixtures thereof in the moulding compositions of the invention.
- the sheet silicates can have been surface-treated or can also be untreated.
- antioxidants for example, antioxidants, light stabilizers, UV stabilizers, UV absorbers or UV blockers in the moulding compositions of the invention.
- the polyamides of the invention can be produced on conventional polycondensation plants by the process sequence precondensate and after-condensation.
- Chain regulators are preferably used for the polycondensation in order to regulate the viscosity. Suitable chain regulators are monoamines or monoacids such as acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, lauric acid, stearic acid, 2-ethylhexanoic acid, cyclohexanoic acid, benzoic acid, butylamine, pentylamine, hexylamine, 2-ethylhexylamine, n-octylamine, n-dodecylamine, n-tetradecylamine, n-hexadecylamine, stearylamine, cyclohexylamine, 3-(cyclohexylamino)propylamine, methylcyclohexylamine,
- an antifoam is preferably added to the mixtures.
- Suitable antifoams are aqueous silicone emulsions, polydimethylsiloxane on a solid support, e.g. zeolite, water-free, high molecular weight polysiloxane or siloxanes in organic, water-soluble solvents in an amount of from 0.01 to 0.5% by weight.
- phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and/or salts thereof with 1- to 3-valent cations such as Na, K, Mg, Ca, Zn or Al and/or esters thereof, e.g. triphenyl phosphate, triphenyl phosphite or tris(nonylphenyl)phosphite, are preferably added to the monomer mixtures.
- the present invention also provides processes for producing such polyamide moulding compositions.
- it also provides mouldings produced using such polyamide moulding compositions.
- blisters can be formed during soldering in the case of, for example, connectors having a critical thickness and metal inserts which conduct heat inwards. Thicknesses in the range from 1 to 2 mm are frequently particularly critical and start forming blisters at comparatively low temperatures. Relatively thin wall thicknesses form blisters to a lesser degree because in this case no critical amount of water which is capable of forming a blister can accumulate and because water can vaporize readily on heating due to the short diffusion paths. Greater wall thicknesses are likewise less critical because thicker test bars cannot heat up completely during the short heating time.
- the proposed material is preferably employed in mouldings having a wall thickness in the range 0.5-3 mm, in particular 1-2 mm, with this wall thickness being present at least in the regions which are affected by heat transmission during soldering and in which blisters tend to form.
- the invention provides for uses of mouldings which consist at least partly of such polyamide moulding compositions.
- Such uses are, for example, parts of printed circuit boards, housings, films, conduits, switches, distributors, relays, resistances, capacitors, coils, lamps, diodes, LEDs, transistors, connectors, regulators, storages and sensors. Further embodiments are indicated in the dependent claims.
- FIG. 1 shows the surface temperature of a 1.6 mm thick UL94 burning bar under the conditions of test 2 (cf. Table 4).
- the polyamides are produced via a precondensate and subsequent after-condensation.
- the formulation components as shown in Tables 1 and 2 are placed together with catalyst, regulator and water in a 20 l autoclave, heated to a product temperature of 260° C. over a period of from 50 to 80 minutes, maintained at a pressure of 32 bar for one hour and subsequently discharged via a nozzle.
- the precondensate is dried at 120° C. under a reduced pressure of 30 mbar for 24 hours.
- the polyamide precondensate obtained in this way is after-condensed in a twin-screw extruder from Werner and Pfleiderer having a screw diameter of 25 mm at prescribed process parameters (barrel temperature: 340° C., speed of rotation of the screw: 150 rpm, throughput: 6 kg/h).
- the melt is degassed by means of a stream of nitrogen in zone 10.
- the product is taken off as extrudate from a nozzle having a diameter of 3 mm and pelletized.
- the pellets are dried at 100° C. under a reduced pressure of 30 mbar for 24 hours.
- the polyamides are injection moulded using an Arburg Allrounder 320-210-750 injection moulding machine at defined barrel temperatures of the zones 1 to 4 and a defined tool temperature to produce ISO test specimens.
- Comparative Examples C1-C3 and C7 are pure copolyamide, i.e. without fillers and reinforcing materials, flame retardants and essentially without additives; Comparative Examples C4-C6 and C8 use the copolyamides of Comparative Examples C1-C3 and C7, but with the amounts of fillers and reinforcing materials, flame retardants and additives indicated in Table 3 now added.
- the production of the polyamides according to the invention is carried out in a manner analogous to the production of the polyamides of Comparative Example C3.
- the formulation components as per Table 2 are used together with catalyst, regulator and water.
- Examples E1-E8 and E14 are the pure copolyamide of the component (A), i.e. without fillers and reinforcing materials, flame retardants and essentially without additives in the proportions shown in Table 2; the Examples E9-E13 and E15 use the copolyamides of Examples E1, E5 and E14, respectively, as indicated in Table 3, but with the amounts of fillers and reinforcing materials, flame retardants and additives indicated in Table 3 being added.
- DSC Differential Scanning Calorimetry
- Tg glass transition temperature
- ISO tensile bar standard: ISO/CD 3167, type A1, 170 ⁇ 20/10 ⁇ 4 mm, temperature 23° C.
- ISO test bar standard: ISO/CD 3167, type B1, 80 ⁇ 10 ⁇ 4 mm, temperature 23° C.
- ISO test bar standard: ISO/CD 3167, type B1, 80 ⁇ 10 ⁇ 4 mm, temperature 23° C.
- UL94 burning bars having thicknesses of 0.8, 1.6 and 3.2 mm are injection moulded. These bars are stored at 85° C. and 85% relative humidity for 168 hours in an Allen 600 controlled atmosphere cabinet from Angelantoni Industrie s.p.a. (IT) as described in the Joint Industry Standard IPC/JEDEC J-STD-020D.1 for moisture sensitivity level 1 (SML 1). 5 test bars of each of the three different thicknesses are then placed on a plate (one-sided heating) and transported at a belt speed of 200 mm/min through a Reflow soldering system RO300FC from Essemtec AG (CH). The heating zones are set to the temperatures shown in Table 4.
- Test 2 (one-sided) gives the prescribed soldering profile with a peak temperature of 260° C. for a 1.6 mm thick UL94 burning bar.
- the surface temperature of a 1.6 mm thick UL94 burning bar is above 255° C. for 54 sec and above 260° C. for 22 sec, as shown in FIG. 1 .
- Zone 1 [° C.] Zone 2 [° C.] Zone 3 [° C.] Test 1 (one-sided) 155 235 280 Test 2 (one-sided) 155 235 285 Test 3 (one-sided) 155 235 295 Test 4 (two-sided) 140 230 265 Test 5 (two-sided) 140 230 275 Test 6 (two-sided) 140 230 285
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Abstract
- (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of
- 100% by weight of diacid fraction composed of:
- 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid;
- 28.0-1.7% by weight of isophthalic acid (IPA)
- and 100% by weight of diamine fraction composed of:
- 51.0-80.0% by weight of 1,6-hexanediamine (HMDA);
- 20.0-49.0% by weight of aliphatic, unbranched C9-C12-diamine;
- 100% by weight of diacid fraction composed of:
- (B) 0-70% by weight of fillers and reinforcing materials;
- (C) 0-25% by weight of flame retardants;
- (D) 0-5% by weight of additives;
where the components (A)-(D) add up to 100% by weight.
Description
- The present invention relates to polyamide moulding compositions based on a terephthalic acid copolyamide and processes for preparing them and uses thereof.
- In the electrical and electronics sector, polymeric materials
-
- which can be soldered without blisters, even after having absorbed water, by means of lead-free solder at a surface temperature of 260° C.,
- which are made flame resistant without use of halogen-containing flame retardants,
- which can be readily processed at low pressures and high flow lengths,
- which have little distortion and
- which are dimensionally stable,
- are required
- Partially aromatic polyamides of the PA6T/6I type, as are described in U.S. Pat. No. 4,607,073, have a reduced water absorption and high melting points compared to the aliphatic polyamides PA6, PA66 and PA46. Even as raw polymer, they can be readily soldered. However, the content of halogen-free flame retardants is problematical because of the limited thermal stability of the flame retardant. Low pressures and long flow lengths in injection moulding are possible only at very high melt temperatures at which degradation of the polyamide begins to occur. Processing is extremely problematical because of the narrow processing window.
- Partially aromatic polyamides of the PA6T/66 type as described in JP-B-2928325 (first publication as JP-A-308846) have high melting points but excessively high water absorptions. They can be soldered only in the dry state and achieve a maximum moisture sensitivity level (SML in accordance with Joint Industry Standard IPC/JEDEC J-STD-020D.1) of 2. They can be conditioned at 85° C. and 60% relative humidity for a maximum of 168 hours before soldering. This generally means that the electronic components made of these materials do not have an unlimited storage life and have to be packed in a moisture-tight manner until they are soldered.
- EP 1 988 113 describes polyamides which have from 40 to 95 mol % of 10T units formed by the monomers 1,10-decanediamine and terephthalic acid and from 5 to 60 mol % of 6T units formed by the monomers 1,6-hexanediamine and terephthalic acid. These polyamides have high heat distortion resistances, good processability, low water absorption, unchanged mechanical properties after water absorption, good surface quality of the glass fibre-reinforced products and high dimensional stability. The solderability at 260° C. after absorption is significantly better than that of partially aromatic polyamides of the PA6T/66 type, but the solderability of the electrical and electronic components made of PA10T/6T is marginal, i.e. they can achieve the maximum moisture sensitivity level (SML in accordance with Joint Industry Standard IPC/JEDEC J-STD-020D.1) of 1 only when suitably designed. In the case of connectors having the critical thickness and metal inserts which conduct heat inwards, blisters can be formed on soldering.
- U.S. Pat. No. 4,617,342 discloses crystalline polyamides which are obtained on the basis of terephthalic acid and isophthalic acid in a ratio of 80:20-99:1 and hexamethylenediamine (HMDA) and trimethylhexamethylenediamine (THMDA) in a molar ratio in the range from 98:2-60:40. Applications proposed for such polyamides are components having a high heat resistance, for example in the engine region of automobiles. This document speaks exclusively of a combination of HMDA and THMDA, and in the examples the proportion of THMDA present alongside hexamethylenediamine is low, in the region of 5-7 mol %. The object here is to provide polyphthalamides which have an increased strength. For this purpose, the TPA content is set to at least 80 mol %. However, this measure leads to these materials being very difficult to produce and process. For this reason, part of the HMDA is replaced by TMHMDA. This branched C9-diamine increases the concentration of amorphous domains, so that the moulding compositions become manageable again as a result of the lower crystallinity. However, these systems are not suitable for soldering applications.
- GB 1228761 discloses completely amorphous polyamides based on terephthalic acid and isophthalic acid in which the proportion of isophthalic acid is high. The diamine isophoronediamine, a C9-diamine, which must be used in this document can be compared in terms of its effect with TMHMDA. In addition, the concentration of IPA is at least 50 mol % in all examples. Such moulding compositions cannot be soldered and clearly do not have the required mechanical properties.
- U.S. Pat. No. 4,831,108 discloses a process for preparing polyamides which appears to be suitable for a range of completely different polyamides. Thus, this document describes not only the preparation of polyphthalamides but also the preparation of PA66 (Ex. 4) using the same process. Insofar as any reference is made to THMDA in this document, this diamine is always used in a small proportion.
- EP 1795632 discloses a polyamide which can be obtained on the basis of a variety of starting materials. Diamines mentioned are, inter alia, C9-diamines including 1,9-nonanediamine and 1,8-methyloctanediamine. Inter alia, these diamines are reacted in combination with HMDA with TPA and IPA. The reaction is carried out using a very low HMDA concentration (HMDA:C9-diamine=20:80) or the hexamethylenediamine is even replaced by THMDA, which makes the resulting materials relatively unsuitable or even completely unsuitable for soldering applications.
- It is an object of the invention to provide polyamide moulding compositions from which it is possible to produce electric and/or electronic components and which can be reliably soldered, i.e. in particular without blisters being formed in the soldering process, in particular at 260° C. and possibly higher temperatures after water absorption and in the case of critical designs of the components.
- In addition, further requirements of the electrical and electronics industry have to be met. The polyamide moulding compositions should:
-
- be able to be made flame resistant without use of halogen-containing flame retardants,
- be able to be processed readily at low pressures and high flow lengths,
- have little distortion and
- be dimensionally stable.
- The object is achieved by polyamide moulding compositions containing copolyamides comprising terephthalic acid (TPA), isophthalic acid (IPA), 1,6-hexanediamine (HMDA) and a further aliphatic diamine having from 9 to 12 carbon atoms (C9-C12-diamine), with a defined content of C9-C12-diamine, particularly preferably of aliphatic, unbranched C9-C12 diamine, and isophthalic acid being adhered to. These copolyamides preferably have a melting point in the range from 300 to 330° C., a high crystallinity, a glass transition temperature which is preferably in the range from 110 to 140° C. and preferably a solderability (for definition see below) of the raw polymer (polyamide) of greater than 85% and of the compounds of greater than 75%. The solderability is defined as relative proportion of the positively tested rods of three different thicknesses without blisters under 6 different test conditions after conditioning for 168 hours at 85° C. and 85% relative humidity in accordance with Joint Industry Standard IPC/JEDEC J-STD-020D.1. The compounds preferably contain, in addition to the polyamide matrix, fillers and/or reinforcing materials and/or flame retardants and also additives.
- Specifically, a polyamide moulding composition having the following composition is provided by the present invention:
- (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of
-
- 100% by weight of diacid fraction composed of:
- 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalene-dicarboxylic acid;
- 28.0-1.7% by weight of isophthalic acid (IPA)
- and 100% by weight of diamine fraction composed of:
- 51.0-80.0% by weight of 1,6-hexanediamine (HMDA);
- 20.0-49.0% by weight of C9-C12-diamine, in particular aliphatic, unbranched C9-C12-diamine;
- 100% by weight of diacid fraction composed of:
- (B) 0-70% by weight of fillers and reinforcing materials;
- (C) 0-25% by weight of flame retardants;
- (D) 0-5% by weight of additives;
- where the components (A)-(D) add up to 100% by weight.
- TPA can therefore be entirely or partly replaced by naphthalenedicarboxylic acid. According to a first preferred embodiment, the C9-C12-diamine is a diamine selected from the group consisting of: 1,9-nonanediamine, methyl-1,8-cctanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, or a mixture of such diamines, with 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine or a mixture of such diamines being preferred, 1,10-decanediamine and 1,12-dodecanediamine being particularly preferred and 1,10-decanediamine alone being especially preferred. It has surprisingly been found, in particular, that the use of branched aliphatic diamines such as TMHMDA leads to moulding compositions which simply cannot be soldered. The preferred use of a specific aliphatic, unbranched C9-C12-diamine in the abovementioned proportions thus unexpectedly leads to moulding compositions which are particularly suitable for soldering processes.
- The diamine fraction of component (A) is preferably composed of
- 55.0-75.0% by weight of 1,6-hexanediamine (HMDA);
- 25.0-45.0% by weight of C9-C12-diamine, in particular aliphatic, unbranched C9-C12-diamine.
- The diamine fraction of component (A) is more preferably composed of 55.0-70.0% by weight of 1,6-hexanediamine(HMDA) and 30.0-45.0% by weight of C9-C12-diamine, in particular aliphatic, unbranched C9-C12-diamine.
- In a particular embodiment of the invention, the proportion of C9-C12-diamines and the proportion of isophthalic acid are present in a particular ratio to one another. Specifically, this means that in this preferred embodiment, the diacid fraction of the component (A) is composed of
- 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid and an isophthalic acid (IPA) content in a % by weight range determined as a function of the content of C9-C12-diamine, in particular aliphatic, unbranched C9-C12-diamine, in per cent of the diamine fraction. The content of isophthalic acid in percent by weight determined according to the formula
-
IPA (% by weight)=(39−0.7*C9-C12-diamine) - is in a range of +/−5% by weight. Naturally, with the proviso that the content of isophthalic acid is always at least 1.7% by weight.
- This means that, for example at a content of C9-C12-diamines, in particular aliphatic, unbranched C9-C12-diamines, of 20% by weight, the content of isophthalic acid is in the range 20-30% by weight. At a content of C9-C12-diamines of 35% by weight, the content of isophthalic acid is in the range 9.5-19.5% by weight. At a content of C9-C12-diamines of 49% by weight, the content of isophthalic acid is in the range 1.7-9.7% by weight.
- In a further preferred embodiment, the range is +/−3% by weight, particularly preferably +/−2% by weight.
- Preference is thus given to polyamides having a C9-C12-diamine content, in particular an aliphatic, unbranched C9-C12-diamine content, of from 20 to 49% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±5% by weight based on the sum of the diacids, with the content of IPA always being at least 1.7% by weight.
- In further particular embodiments, the following compositions are preferred for the copolyamides (polyamide matrix):
- copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 20 to 49% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±3% by weight based on the sum of the diacids. Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 20 to 49% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±2% by weight based on the sum of the diacids.
- Preference is given to polyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±5% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±3% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 25 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±2% by weight based on the sum of the diacids.
- Preference is given to polyamides having a C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±5% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±3% by weight based on the sum of the diacids.
- Copolyamides having a (preferably aliphatic, unbranched) C9-C12-diamine content of from 30 to 45% by weight based on the sum of the diamines and an IPA content of (39−0.7*C9-C12-diamine)±2% by weight based on the sum of the diacids.
- Among the further aliphatic diamines (C9-C12-diamine) preference is given to 1,10-decanediamine and 1,12-dodecaendiamine, with particular preference being given to using 1,10-decanediamine.
- In a further preferred embodiment, the proportion of component (B) is in the range 20-65% by weight.
- The partially aromatic, partially crystalline copolyamide (component (A)) has a solution viscosity ηrel, measured in m-cresol (0.5% by weight, 20° C.), of not more than 2.0, preferably not more than 1.9, in particular not more than 1.8. Preference is given to copolyamides having a solution viscosity ηrel in the range from 1.45 to 2.0, in particular in the range from 1.5 to 1.9 or from 1.5 to 1.8.
- The copolyamides (component A) preferably have a glass transition temperature in the range from 110 to 140° C., preferably in the range from 115 to 135° C. and in particular in the range from 120 to 130° C.
- The melting point is preferably in the range from 300 to 330° C., more preferably in the range from 305 to 325° C. and in particular in the range from 310 to 325° C.
- The enthalpy of fusion of the copolyamides is preferably in the range from 30 to 60 J/g, more preferably in the range from 35 to 60 J/g and particularly preferably in the range from 40 to 60 J/g.
- Furthermore, the compositions are preferably formulated so that the component (A) and/or the entire polyamide moulding composition has a water absorption of less than 5% by weight, preferably less than 4% by weight, e.g. after 336 hours in water at 95° C.
- As long as the properties just described are achieved, up to 8% by weight, preferably up to 5% by weight and particularly preferably up to 3% by weight, of the aromatic dicarboxylic acids in the component (A) can be replaced by aliphatic dicarboxylic acids having from 10 to 36 carbon atoms. Preferred aliphatic diacids are sebacic acid and dodecanedioic acid. Furthermore, up to 8% by weight, preferably up to 5% by weight and particularly preferably up to 3% by weight, of the diamines can be replaced by 1,4-butanediamine, 1,5-pentanediamine, methyl-1,5-pentanediamine, bis(aminomethyl)cyclohexane, bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), m-xylylenediamine (MXDA) or p-xylylenediamine (PXDA). Based on the sum of diamines and diacids, up to 5% by weight of lactams or aminocarboxylic acids, in particular laurolactam or aminolauric acid, can be present in component (A). However, particular preference is given to the embodiment in which component (A) is formed exclusively by the aromatic diacids TPA and IPA and the diamines 1,6-hexanediamine and at least one C9-C12-diamine, in particular 1,10-decanediamine.
- In a further preferred embodiment of the proposed polyamide moulding composition, the fillers and reinforcing materials of the component (B) are fibres, in particular glass fibres and/or carbon fibres, with particular preference being given to using short fibres, preferably having a length in the range 2-50 mm and a diameter of from 5 to 40 μm, and/or continuous fibres and in particular fibres having a circular and/or noncircular cross-sectional area, with in the latter case the length ratio of the main cross-sectional axis to the secondary cross-sectional axis preferably being >2, preferably in the range 2-8, particularly preferably in the range 2-5.
- Preference is given to using glass fibres having a noncircular cross-sectional area and a length ratio of the main cross-sectional axis to the secondary cross-sectional axis of more than 2, preferably from 2 to 8, in particular from 2 to 5. These glass fibres, known as flat glass fibres, have an oval, elliptical, elliptical provided with constriction(s) (known as cocoon fibres), rectangular or virtually rectangular cross-sectional area.
- The flat glass fibres having a noncircular cross-sectional area which are used according to the invention are preferably used as short glass fibres (cut glass having a length of from 0.2 to 20 mm, preferably 2-12 mm).
- A further characterizing feature of the flat glass fibres used is that the length of the main cross-sectional axis is preferably in the range from 6 to 40 μm, in particular in the range from 15 to 30 μm, and the length of the secondary cross-sectional axis is in the range from 3 to 20 μm, in particular in the range from 4 to 10 μm.
- It is also possible to use mixtures of glass fibres having circular and noncircular cross sections for reinforcing the moulding compositions of the invention, with the proportion of flat glass fibres as defined above preferably predominating, i.e. making up more than 50% by weight of the total mass of the fibres.
- When reinforced moulding compositions having good flowability and good surface quality are sought, in particular in combination with flame retardants, then the reinforcing fibres preferably comprise predominantly (i.e., for example, to an extent of 80% by weight or even more than 90% by weight) flat glass fibres or even exclusively flat glass fibres.
- The glass fibres which are used according to the invention as rovings (filler component B) have a diameter of from 10 to 20 μm, preferably from 12 to 18 μm, with the cross section of the glass fibres being able to be round, oval, elliptical, virtually rectangular or rectangular. Particular preference is given to flat glass fibres having a ratio of the cross-sectional axes of from 2 to 5. In particular, E-glass fibres are used according to the invention. However, it is also possible to use all other types of glass fibres, e.g. A-, C-, D-, M-, S-, R-glass fibres or any mixtures thereof or mixtures with E-glass fibres.
- In the case of moulding compositions reinforced with long fibres, higher toughnesses and thus more metal-like properties are obtained when continuous glass fibres having a diameter of from 10 to 14 μm, in particular a diameter of from 10 to 12 μm, are used instead of the customary continuous glass fibres having a diameter of from 15 to 19 μm.
- The polyamide moulding compositions of the invention can be produced by the known methods for producing long fibre-reinforced rod-shaped pellets, in particular by pultrusion processes in which the continuous fibre roving is completely impregnated with the polymer melt and is subsequently cooled and cut.
- The long fibre-reinforced rod-shaped pellets obtained in this way, which preferably have a pellet length of from 3 to 25 mm, in particular from 4 to 12 mm, can be processed further to produce mouldings by the customary processing methods (e.g. injection moulding, pressing).
- The continuous carbon fibres used in the pultrusion process have a diameter of from 5 to 10 μm (microns), preferably from 6 to 8 μm. To improve the bonding of the matrix and the fibre handling, the fibres can be coated with chemically different layers which are known for glass fibres and carbon fibres in the prior art.
- The glass fibre itself can, depending on the shape of the cross-sectional area and length of the fibre, be selected from the group consisting of E-glass fibres, A-glass fibres, C-glass fibres, D-glass fibres, M-glass fibres, S-glass fibres and R-glass fibres, with preference being given to E-glass fibres.
- The fillers and reinforcing materials of the component (B) can also be particulate fillers or a mixture of fibres and particulate fillers. As particulate fillers, preference is given to using mineral fillers based on talc, mica, silicate, quartz, titanium dioxide, wollastonite, kaolin, amorphous silicas, magnesium carbonate, magnesium hydroxide, chalk, lime, feldspar, barium sulphate, solid or hollow glass spheres or milled glass, permanently magnetic or magnetizable metal compounds and/or alloys or mixtures. The fillers can also have been surface-treated.
- In a further preferred embodiment, the polyamide moulding composition is characterized in that the proportion of component (C) is in the range 8-25% by weight, preferably in the range 10-22% by weight, particularly preferably in the range 10-18% by weight. The component (C) is preferably composed of 60-100% by weight, preferably 70-98% by weight, particularly preferably 80-96% by weight, of a phosphinic acid salt and/or diphosphinic acid salt and 0-40% by weight, or 2-30% by weight, or 4-20% by weight, of a nitrogen-containing synergist and/or a nitrogen- and/or phosphorus-containing flame retardant, with the latter preferably being selected from among melamine and condensation products of melamine, in particular melem, melam, melon, and reaction products of melamine with polyphosphoric acid and reaction products of condensation products of melamine with polyphosphoric acid and mixtures thereof, in particular melamine polyphosphate.
- The moulding composition of the invention thus additionally contains, in a further embodiment, 8-25% by weight, preferably 10-22% by weight and in particular 10-18% by weight, of a flame retardant, (as part of the component (C) or forming the entire component (C)). The flame retardant is preferably halogen-free.
- The flame retardant in the component (C) or forming the entire component (C) preferably comprises 60-100% by weight, more preferably 70-98% by weight, in particular 80-96% by weight, of a phosphinic acid salt and/or diphosphinic acid salt (component (C1)) and 0-40% by weight, preferably 2-30% by weight, in particular 4-20% by weight, of a nitrogen-containing synergist and/or a nitrogen- and phosphorus-containing flame retardant (component (C2)).
- Component (C2) is preferably melamine or condensation products of melamine, e.g. melem, melam, melon, or reaction products of melamine with polyphosphoric acid or reaction products of condensation products of melamine with polyphosphoric acid or mixtures thereof.
- As component (C2), particular preference is given to melamine polyphosphate. Such flame retardants are known from the prior art. In this respect, reference may be made to DE 103 46 326, which is hereby expressly incorporated by reference into the present text.
- As component (C1), preference is given to using a phosphinic acid salt of the general formula I and/or formula (II) and/or polymers thereof
- where
-
- R1, R2 are identical or different and are each preferably C1-C8-alkyl, linear or branched, or aryl;
- R3 is C1-C10-alkylene, linear or branched, C6-C10-arylene, -alkylarylene or arylalkylene;
- M is a metal ion from main or transition group 2 or 3 of the Periodic Table; and
- m is 2 or 3;
- n is 1 or 3;
- x is 1 or 2.
- As metal ion M, preference is given to using Al, Ca, Ba and Zn.
- In combination with the flame retardant components (C1) and (C2), it is optionally possible to add an additional from 0.5 to 5% by weight, based on the sum of (C1) and (C2), of oxygen-, nitrogen- or sulphur-containing metal compounds as stabilizers (component (C3)). Preferred metals here are aluminium, calcium, magnesium and zinc. Suitable compounds are selected from the group consisting of the oxides, hydroxides, carbonates, silicates, borates, phosphates, stannates and combinations or mixtures of these compounds, e.g. oxide hydroxides or oxide hydroxide carbonates. Examples are magnesium oxide, calcium oxide, aluminium oxide, zinc oxide, magnesium hydroxide, aluminium hydroxide, boehmite, dihydrotalcite, hydrocalumite, calcium hydroxide, tin oxide hydrate, zinc hydroxide, zinc borate, zinc sulphide, zinc phosphate, zinc carbonate, calcium carbonate, calcium phosphate, magnesium carbonate, basic zinc silicate, zinc stannate, calcium stearate, zinc stearate, magnesium stearate, barium stearate, potassium palmitate, magnesium behenate.
- Furthermore, it should be emphasized in the context of the polyamide moulding compositions of the invention or the mouldings produced therefrom that excellent flame resistance is achieved in combination with the above-described excellent properties. The moulding composition is given an UL classification of V0 for 0.8 mm thick test specimens (UL-94, test in accordance with the standards of Underwriters Laboratories (U.L.), cf. www.ulstandards.com).
- The copolyamides of the invention achieve the fire protection classification “V0” even without addition of synergist (C2). The flame retardant added is therefore preferably made up exclusively of the components C1 and C3 together.
- The moulding compositions can contain stabilizers, processing aids and impact modifiers and also further additives.
- The moulding compositions of the invention can also contain further additives (D) such as additives from the group consisting of inorganic stabilizers, organic stabilizers, lubricants, dyes, nucleating agents, metallic pigments, metal flakes, metal-coated particles, impact modifiers, antistatics, conductivity additives, mould release agents, optical brighteners, natural sheet silicates, synthetic sheet silicates or mixtures of the additives mentioned. As antistatics, it is possible to use, for example, carbon black and/or carbon nanotubes in the moulding compositions of the invention. However, the use of carbon black can also serve to improve the black coloration of the moulding composition.
- As sheet silicates, it is possible to use, for example, kaolins, serpentines, talc, mica, vermiculites, illites, smectites, montmorillonite, hectorite, double hydroxides or mixtures thereof in the moulding compositions of the invention. The sheet silicates can have been surface-treated or can also be untreated.
- As stabilizers or aging inhibitors, it is possible to use, for example, antioxidants, light stabilizers, UV stabilizers, UV absorbers or UV blockers in the moulding compositions of the invention.
- The polyamides of the invention can be produced on conventional polycondensation plants by the process sequence precondensate and after-condensation. Chain regulators are preferably used for the polycondensation in order to regulate the viscosity. Suitable chain regulators are monoamines or monoacids such as acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, lauric acid, stearic acid, 2-ethylhexanoic acid, cyclohexanoic acid, benzoic acid, butylamine, pentylamine, hexylamine, 2-ethylhexylamine, n-octylamine, n-dodecylamine, n-tetradecylamine, n-hexadecylamine, stearylamine, cyclohexylamine, 3-(cyclohexylamino)propylamine, methylcyclohexylamine, dimethylcyclohexylamine, benzylamine, 2-phenylethylamine, etc. In addition, the viscosity can be adjusted by use of an excess of diamine or diacid.
- For the salt solutions to be homogeneous and clear at solution temperatures of from 180 to 230° C., from 20 to 30% of water is usually added to the monomers. To prevent excessive foaming during depressurization and degassing or during after-condensation of the melt in an extruder, an antifoam is preferably added to the mixtures. Suitable antifoams are aqueous silicone emulsions, polydimethylsiloxane on a solid support, e.g. zeolite, water-free, high molecular weight polysiloxane or siloxanes in organic, water-soluble solvents in an amount of from 0.01 to 0.5% by weight.
- As polycondensation catalysts, from 0.005 to 1.5% by weight of phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and/or salts thereof with 1- to 3-valent cations such as Na, K, Mg, Ca, Zn or Al and/or esters thereof, e.g. triphenyl phosphate, triphenyl phosphite or tris(nonylphenyl)phosphite, are preferably added to the monomer mixtures. Preference is given to hypophosphorous acid and sodium hydrogenyphosphate monohydrate in an amount of from 100 to 500 ppm of phosphorous, based on the copolyamide.
- Furthermore, the present invention also provides processes for producing such polyamide moulding compositions. In addition, it also provides mouldings produced using such polyamide moulding compositions. As mentioned above, blisters can be formed during soldering in the case of, for example, connectors having a critical thickness and metal inserts which conduct heat inwards. Thicknesses in the range from 1 to 2 mm are frequently particularly critical and start forming blisters at comparatively low temperatures. Relatively thin wall thicknesses form blisters to a lesser degree because in this case no critical amount of water which is capable of forming a blister can accumulate and because water can vaporize readily on heating due to the short diffusion paths. Greater wall thicknesses are likewise less critical because thicker test bars cannot heat up completely during the short heating time. The proposed material is preferably employed in mouldings having a wall thickness in the range 0.5-3 mm, in particular 1-2 mm, with this wall thickness being present at least in the regions which are affected by heat transmission during soldering and in which blisters tend to form.
- In addition, the invention provides for uses of mouldings which consist at least partly of such polyamide moulding compositions. Such uses are, for example, parts of printed circuit boards, housings, films, conduits, switches, distributors, relays, resistances, capacitors, coils, lamps, diodes, LEDs, transistors, connectors, regulators, storages and sensors. Further embodiments are indicated in the dependent claims.
- Preferred embodiments of the invention are described below, partly with the aid of the drawing which merely serves for the purposes of illustration and is not to be interpreted as constituting a limitation. In the drawing,
FIG. 1 shows the surface temperature of a 1.6 mm thick UL94 burning bar under the conditions of test 2 (cf. Table 4). - The invention is illustrated below by means of specific examples and compared with the poorer performance systems according to the prior art. The examples indicated below serve to support the invention and to demonstrate the differences from the prior art, but are not to be interpreted as restricting the general subject matter of the invention as defined in the claims.
- The polyamides are produced via a precondensate and subsequent after-condensation. The formulation components as shown in Tables 1 and 2 are placed together with catalyst, regulator and water in a 20 l autoclave, heated to a product temperature of 260° C. over a period of from 50 to 80 minutes, maintained at a pressure of 32 bar for one hour and subsequently discharged via a nozzle. The precondensate is dried at 120° C. under a reduced pressure of 30 mbar for 24 hours.
- The polyamide precondensate obtained in this way is after-condensed in a twin-screw extruder from Werner and Pfleiderer having a screw diameter of 25 mm at prescribed process parameters (barrel temperature: 340° C., speed of rotation of the screw: 150 rpm, throughput: 6 kg/h). The melt is degassed by means of a stream of nitrogen in zone 10. The product is taken off as extrudate from a nozzle having a diameter of 3 mm and pelletized. The pellets are dried at 100° C. under a reduced pressure of 30 mbar for 24 hours.
- The polyamides are injection moulded using an Arburg Allrounder 320-210-750 injection moulding machine at defined barrel temperatures of the zones 1 to 4 and a defined tool temperature to produce ISO test specimens.
- Comparative Examples C1-C3 and C7 are pure copolyamide, i.e. without fillers and reinforcing materials, flame retardants and essentially without additives; Comparative Examples C4-C6 and C8 use the copolyamides of Comparative Examples C1-C3 and C7, but with the amounts of fillers and reinforcing materials, flame retardants and additives indicated in Table 3 now added.
-
TABLE 1 Comparative Examples C1 in accordance with U.S. Pat. No. 4,607,073, C2 in accordance with JP 2928325 and C3 in accordance with EP 1 988 113. Unit C1 C2 C3 Composition 1,6-Hexanediamine parts by weight 41.64 43.00 6.49 1,10-Decanediamine parts by weight 44.38 Terephthalic acid parts by weight 40.86 33.15 49.13 Isophthalic acid parts by weight 17.51 Adipic acid parts by weight 23.85 Injection-moulding conditions Barrel temperature zone 1 ° C. 325 315 315 Barrel temperature zone 2 ° C. 330 320 320 Barrel temperature zone 3 ° C. 335 325 325 Barrel temperature zone 4 ° C. 340 330 330 Tool temperature ° C. 130 120 130 Properties Solution viscosity 1.58 1.67 1.62 Melting point ° C. 325 310 295 Enthalpy of fusion J/g 45 60 50 Glass transition temp. ° C. 135 94 115 Water absorption % 5.2 6.2 2.6 Solderability % 78 67 83 JEDEC SML 1 yes no yes - The production of the polyamides according to the invention is carried out in a manner analogous to the production of the polyamides of Comparative Example C3. The formulation components as per Table 2 are used together with catalyst, regulator and water.
- Examples E1-E8 and E14 are the pure copolyamide of the component (A), i.e. without fillers and reinforcing materials, flame retardants and essentially without additives in the proportions shown in Table 2; the Examples E9-E13 and E15 use the copolyamides of Examples E1, E5 and E14, respectively, as indicated in Table 3, but with the amounts of fillers and reinforcing materials, flame retardants and additives indicated in Table 3 being added.
-
TABLE 2 Composition and properties of the raw polyamides of Examples E1 to E8 and E14 and of Comparative Example C7. Injection moulding conditions as in Comparative Example C3. Unit C7 E1 E2 E3 E4 E5 E6 E7 E8 E14 1,6-Hexanediamine parts by 31.03 31.99 31.57 30.31 29.50 29.66 29.50 27.42 25.34 31.06 weight 1,10-Decanediamine parts by 12.20 12.71 14.26 15.27 15.35 15.27 17.83 20.40 13.90 weight Trimethylhexanediamine parts by 13.36 weight Terephthalic acid parts by 42.26 44.37 46.19 46.83 47.11 47.25 48.11 47.58 49.49 42.30 weight Isophthalic acid parts by 13.35 11.44 9.53 8.59 8.12 7.48 7.13 7.17 4.78 12.74 weight Proportion of % by weight 0 27.6 28.7 32.0 34.1 34.1 34.1 39.4 44.6 30.9 decanediamine Proportion of % by weight 30.1 trimethylhexanediamine Proportion of IPA % by weight 24.0 20.5 17.1 15.5 14.7 13.6 12.9 13.1 8.8 23.2 Solution viscosity 1.51 1.61 1.51 1.69 1.71 1.56 1.53 1.70 1.73 1.62 Melting point ° C. 301 311 322 315 313 318 321 309 309 303 Enthalpy of fusion J/g 38 47 57 51 51 56 58 47 49 42 Glass transition ° C. 137 129 128 130 129 128 128 129 127 129 temperature Water absorption % by weight 5.2 4.2 3.8 3.7 3.6 3.6 3.6 3.6 3.5 4.6 Solderability % 6 85 88 90 97 99 97 94 97 85 JEDEC SML1 no yes yes yes yes yes yes yes yes yes -
TABLE 3 Composition and properties of the compounds from Comparative Examples C4-C6 and C8 and from Examples E9 to E13 and E15; injection moulding conditions for Comparative Examples C4 to C6 as in C1 to C3 and for Examples E9 to E13, E15 and C8 as in C3. Unit C4 C5 C6 E9 E10 E11 E12 E13 E15 C8 Polyamide type — C1 C2 C3 E1 E5 E5 E5 E5 E14 C7 from Polyamide % by 55.2 57.2 55.2 55.75 55.75 67.8 86.9 83.9 55.75 55.75 weight Alugel 34TH % by 0.3 0.5 0.3 0.15 0.15 0.15 0.15 weight Barium stearate % by 0.6 0.6 0.5 0.5 0.5 0.6 0.6 weight Irganox 1098 % by 0.5 0.3 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 weight Melapur 200/70 % by 0.5 0.5 weight Zinc carbonate % by 0.5 0.5 weight Zinc oxide AC 0.1 0.1 Exolit OP1230 % by 12.0 12.0 12.0 12.0 12.0 12.0 15.0 12.0 12.0 weight Black masterbatch % by 1.0 1.0 1.0 1.0 1.2 1.0 1.0 weight GF Vetrotex 995 % by 30.0 30.0 30.0 30.0 30 30 30.0 30 EC10-4.5 weight Solution viscosity 1.558 1.562 1.520 1.495 1.497 1.480 1.589 1.554 1.495 1.497 Melting point ° C. 325 310 295 309 318 318 318 318 303 300 Enthalpy of fusion J/g 26 30 30 28 27 36 48 46 20 24 Glass transition ° C. 132 98 115 124 125 127 125 125 125 134 temperature Water absorption % by 2.5 3.5 1.9 2.3 2.3 — — — 2.4 2.9 weight Solderability % 50 10 59 82 84 78 77 84 83 0 JEDEC SML1 no no yes yes yes yes yes yes yes no Tensile E modulus MPa 10800 10900 9600 11500 11600 10900 4000 4100 10900 11000 Tensile strength MPa 121 124 128 150 152 143 79 72 140 130 Elongation at break % 1.6 1.5 1.9 2.0 1.9 1.8 3.0 2.6 2.1 1.7 Impact toughness kJ/m2 43 28 47 50 50 35 48 42 60 30 Notched impact kJ/m2 5.3 7.1 7.6 6.6 9.6 8.5 4.6 4.2 9.6 5.5 toughness UL94 V0 V0 V0 V0 V0 HB V2 V0 V0 V0 Melapur ® 200/70: Melamine polyphosphate (Ciba Spez. GmbH), flame retardant, CAS No: 218768-84-4 Exolit ® GP1230: Organophosphorus salt (Clariant Produkte GmbH), flame retardant. Alugel 34TH: Aluminium stearate additive from Baerlocher Irganox 1098: Sterically hindered phenolic antioxidant from Ciba Spez. GmbH Vetrotex 995: Cut glass fibres having a length of 4.5 mm and a diameter of 10 μm (circular cross section) from Owens Corning Fiberglas - It can be seen from Tables 1-2 above that when component (A) alone is examined, the comparative systems C1 and C2 are far inferior to the proposed systems both in respect of water absorption and in respect of solderability. The water absorption is significantly higher in these systems of the prior art and the solderability is significantly lower. Although the water absorption is low in the comparative system C3, the solderability is unsatisfactory for many practical applications, as indicated at the outset.
- In the case of the polyamide moulding compositions as per Table 3 containing fillers and reinforcing materials, flame retardants and additives, too, it is found that the systems according to the invention in each case represent a better compromise between low water absorption and high solderability when compared with Comparative Examples C4-C6.
- Comparison of C7 with E14 and C8 with E15 clearly and impressively shows that, surprisingly, no solderable moulding compositions are obtained on the basis of branched diamines C9-C12, in contrast to the straight-chain (unbranched), aliphatic diamines C9-C12 (E14, E15) used according to the invention.
- The measurements were carried out in accordance with the following standards and on the following test specimens.
- Thermal Behaviour:
- Melting point, enthalpy of fusion and glass transition temperature (Tg):
- ISO standard 11357-11-2
- Pellets
- Differential Scanning Calorimetry (DSC) was carried out at a heating rate of 20° C./min.
- For the glass transition temperature (Tg), the onset temperature is reported.
- Relative Viscosity:
- DIN EN ISO 307, in 0.5% strength by weight m-cresol solution, temperature 20° C.,
- Pellets
- Tensile E Modulus, Tensile Strength and Tear Strength:
- ISO 527 using an elongation rate of 50 mm/min (unreinforced variants) or an elongation rate of 5 mm/min (reinforced variants)
- ISO tensile bar, standard: ISO/CD 3167, type A1, 170×20/10×4 mm, temperature 23° C.
- Charpy Impact Toughness:
- ISO 179/*eU
- ISO test bar, standard: ISO/CD 3167, type B1, 80×10×4 mm, temperature 23° C.
- *1=not instrumented, 2=instrumented
- Charpy Notched Impact Toughness:
- ISO 179/*eA
- ISO test bar, standard: ISO/CD 3167, type B1, 80×10×4 mm, temperature 23° C.
- *1=not instrumented, 2=instrumented
- Water Absorption:
- Weight change of tensile bars in accordance with ISO 527 in water at 95° C. for a time of 336 hours
- Solderability:
- UL94 burning bars having thicknesses of 0.8, 1.6 and 3.2 mm are injection moulded. These bars are stored at 85° C. and 85% relative humidity for 168 hours in an
Allen 600 controlled atmosphere cabinet from Angelantoni Industrie s.p.a. (IT) as described in the Joint Industry Standard IPC/JEDEC J-STD-020D.1 for moisture sensitivity level 1 (SML 1). 5 test bars of each of the three different thicknesses are then placed on a plate (one-sided heating) and transported at a belt speed of 200 mm/min through a Reflow soldering system RO300FC from Essemtec AG (CH). The heating zones are set to the temperatures shown in Table 4. Test 2 (one-sided) gives the prescribed soldering profile with a peak temperature of 260° C. for a 1.6 mm thick UL94 burning bar. The surface temperature of a 1.6 mm thick UL94 burning bar is above 255° C. for 54 sec and above 260° C. for 22 sec, as shown inFIG. 1 . 5 test bars of each of the three different thicknesses are subsequently placed directly on the wire mesh without a plate and thus subjected to two-sided heating. To calculate the solderability, the number of test bars without blisters is divided by the total number of test bars tested (=90) and multiplied by 100%. -
TABLE 4 Temperature settings of the heating zones of the Reflow soldering system. Zone 1 [° C.] Zone 2 [° C.] Zone 3 [° C.] Test 1 (one-sided) 155 235 280 Test 2 (one-sided) 155 235 285 Test 3 (one-sided) 155 235 295 Test 4 (two-sided) 140 230 265 Test 5 (two-sided) 140 230 275 Test 6 (two-sided) 140 230 285 - JEDEC SML 1:
- 1.6 mm thick UL94 burning bars achieve moisture sensitivity level 1 (SML 1). This means that no blisters can be observed under the conditions of test 2 (one-sided) as per Table 4 and the temperature profile shown in
FIG. 1 after conditioning at 85° C. and 85% relative humidity for 168 hours.
Claims (41)
IPA (% by weight)=(39−0.7*C9-C12-diamine)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP10151933 | 2010-01-28 | ||
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EP10151933.8A EP2354176B1 (en) | 2010-01-28 | 2010-01-28 | Partially aromatic moulding masses and their applications |
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Cited By (8)
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CN103946272A (en) * | 2011-12-23 | 2014-07-23 | 埃姆斯·帕特恩特股份有限公司 | Polyamide moulding compound, use thereof and moulded parts produced therefrom |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607073A (en) * | 1984-01-27 | 1986-08-19 | Mitsui Petrochemical Industries, Ltd. | Molding polyamide composition |
US4617343A (en) * | 1984-04-23 | 1986-10-14 | National Starch And Chemical Corporation | Laminating adhesives containing polymerized surfactant |
US4831108A (en) * | 1983-02-16 | 1989-05-16 | Amoco Corporation | Polycondensation process with mean dispersion residence time |
US20050038171A1 (en) * | 2003-08-16 | 2005-02-17 | Elkovitch Mark D. | Reinforced poly(arylene ether)/polyamide composition |
US20090098325A1 (en) * | 2005-03-18 | 2009-04-16 | Kuraray Co. Ltd. | Semi-aromatic polyamide resin |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1228761A (en) * | 1967-05-18 | 1971-04-21 | ||
US4617342A (en) * | 1983-02-16 | 1986-10-14 | Amoco Corporation | Crystalline copolyamide from terephthalic acid, isophthalic acid and C.sub.6 |
JP2928325B2 (en) | 1989-05-01 | 1999-08-03 | 三井化学株式会社 | Composition for infrared reflow and electronic component |
JPH05320503A (en) * | 1992-05-19 | 1993-12-03 | Toray Ind Inc | Flame-retardant polyamide resin composition |
TW339343B (en) * | 1994-08-17 | 1998-09-01 | Toray Industries | Copolymerized polyamide and a production process/thereof |
JP3458545B2 (en) * | 1994-08-17 | 2003-10-20 | 東レ株式会社 | Method for producing polyamide and twin-screw extruder for polyamide polymerization |
JP4162455B2 (en) * | 2002-09-11 | 2008-10-08 | 株式会社クラレ | Alkaline battery separator and battery using the same |
DE10346326A1 (en) | 2003-10-06 | 2005-05-04 | Ems Chemie Ag | Flame-retardant polyamide molding compounds and their use |
EP1795632A4 (en) * | 2004-09-27 | 2008-11-05 | Kuraray Co | Binder fiber and separator for alkaline cell using same |
EP1988113B1 (en) * | 2007-05-03 | 2009-10-14 | Ems-Patent Ag | Partially aromatic polyamide moulding masses and their applications |
ES2358132T3 (en) * | 2007-08-24 | 2011-05-05 | Ems-Patent Ag | MOLDED MASSES OF HIGH TEMPERATURE POLYAMIDE REINFORCED WITH FLAT GLASS FIBERS. |
-
2010
- 2010-01-28 EP EP10151933.8A patent/EP2354176B1/en active Active
-
2011
- 2011-01-14 KR KR1020110004018A patent/KR101546018B1/en active IP Right Grant
- 2011-01-26 US US13/014,303 patent/US8324297B2/en active Active
- 2011-01-26 CN CN201110031420.2A patent/CN102140247B/en active Active
- 2011-01-27 JP JP2011015234A patent/JP5796824B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4831108A (en) * | 1983-02-16 | 1989-05-16 | Amoco Corporation | Polycondensation process with mean dispersion residence time |
US4607073A (en) * | 1984-01-27 | 1986-08-19 | Mitsui Petrochemical Industries, Ltd. | Molding polyamide composition |
US4617343A (en) * | 1984-04-23 | 1986-10-14 | National Starch And Chemical Corporation | Laminating adhesives containing polymerized surfactant |
US20050038171A1 (en) * | 2003-08-16 | 2005-02-17 | Elkovitch Mark D. | Reinforced poly(arylene ether)/polyamide composition |
US20090098325A1 (en) * | 2005-03-18 | 2009-04-16 | Kuraray Co. Ltd. | Semi-aromatic polyamide resin |
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---|---|---|---|---|
US9657199B2 (en) | 2011-09-06 | 2017-05-23 | Flint Trading, Inc. | Anti-foaming agents for hot-melt adhesives |
WO2013036623A3 (en) * | 2011-09-06 | 2015-06-11 | Flint Trading, Inc. | Anti-foaming agents for hot-melt adhesives |
CN103946272A (en) * | 2011-12-23 | 2014-07-23 | 埃姆斯·帕特恩特股份有限公司 | Polyamide moulding compound, use thereof and moulded parts produced therefrom |
US9845389B2 (en) | 2011-12-23 | 2017-12-19 | Ems-Patent Ag | Polyamide molding material, the use thereof, and molded parts produced therefrom |
US20140179849A1 (en) * | 2012-12-21 | 2014-06-26 | Ems-Patent Ag | Stain-resistant article and use thereof |
US9346952B2 (en) * | 2012-12-21 | 2016-05-24 | Ems-Patent Ag | Stain-resistant article and use thereof |
US20140179850A1 (en) * | 2012-12-21 | 2014-06-26 | Ems-Patent Ag | Stain-resistant article and use thereof |
US9546272B2 (en) * | 2012-12-21 | 2017-01-17 | Ems-Patent Ag | Stain-resistant article and use thereof |
US20160272779A1 (en) * | 2013-11-06 | 2016-09-22 | Solvay Specialty Polymers Usa, Llc | Flame retardant led for indoor lighting |
WO2015067563A1 (en) * | 2013-11-06 | 2015-05-14 | Solvay Specialty Polymers Usa, Llc | Flame retardant led for indoor lighting |
US20170130049A1 (en) * | 2014-06-20 | 2017-05-11 | Rhodia Operations | Polyamide molding compositions, molded parts obtained therefrom, and use thereof |
US10544286B2 (en) | 2015-02-13 | 2020-01-28 | Ems-Patent Ag | Polyamide moulding composition and moulded article made from this moulding composition |
US20170058123A1 (en) * | 2015-08-31 | 2017-03-02 | Ems-Patent Ag | Polyamide moulding compound and moulded articles producible therefrom |
US11186716B2 (en) * | 2015-08-31 | 2021-11-30 | Ems-Patent Ag | Polyamide moulding compound and moulded articles producible therefrom |
WO2019204370A1 (en) * | 2018-04-18 | 2019-10-24 | Invista North America S.A R.L. | Flame-retardant polyamide composition |
Also Published As
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KR20110088387A (en) | 2011-08-03 |
US8324297B2 (en) | 2012-12-04 |
JP5796824B2 (en) | 2015-10-21 |
CN102140247A (en) | 2011-08-03 |
EP2354176A1 (en) | 2011-08-10 |
CN102140247B (en) | 2014-12-10 |
KR101546018B1 (en) | 2015-08-27 |
EP2354176B1 (en) | 2017-11-15 |
JP2011157548A (en) | 2011-08-18 |
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